JP7149085B2 - Hole punching method and mold - Google Patents

Description

TECHNICAL FIELD The present invention relates to a punching method for punching holes in a plurality of locations on a plate-shaped work, and a mold used in the method. More specifically, the present invention relates to a punching method and a mold capable of suppressing warping of a workpiece due to punching.

2. Description of the Related Art Conventionally, punching by a punch press or cutting by laser processing is performed when punching holes in a plurality of rows and columns on a plate-shaped work. In addition, it has been proposed to use a laser-punch composite processing machine to perform hole-punching by laser cutting, and then drop the cut pieces that do not fall using a separation mold ( For example, see Patent Document 1). Further, it has been proposed to perform shaving processing on the inner peripheral surface of the small hole with a shaving die after performing small hole processing by laser processing (see, for example, Patent Document 2). Further, a slit is formed around the cut piece, and a part of the cut piece and the workpiece are connected by a joint portion. Then, it has been proposed to cut the joint portion when the cut piece is dropped by the punch (see, for example, Patent Document 3).

JP-A-5-318156 JP-A-9-216021 JP 2004-98097 A

It is known that when punching such as punching is performed on a plurality of portions of a plate-shaped work, warpage occurs due to internal stress of the work. Therefore, in order to suppress the occurrence of warpage, the pressing force of the plate retainer provided in the punching die is increased, or the upper surface of the die and the lower surface of the plate retainer are formed into tapered surfaces in the direction opposite to the direction in which warpage occurs. etc. has been proposed.

By the way, it is conceivable that warping of the workpiece can be suppressed if holes having the same diameter as the holes in the punching process are processed by laser processing with the same arrangement form of the holes in the punching process. However, when laser processing is performed, the width of the cutting groove becomes very narrow, so the thicker the workpiece, the more unstable the cut pieces fall from the hole. That is, the cut piece may become slanted and caught in the hole.

The present invention has been made in view of the above-mentioned problems, and is a method for punching a plate-like work, comprising:
1) A hole drilling method for a plate-shaped work in which a hole is punched in a plate-shaped work using both laser processing and press processing using a punch and a die ,
(a) a step of performing contour processing of a hole in a work by laser processing, and connecting the cut piece to be cut and separated and the work by one or more micro joints;
(b) when projecting the cut piece from the hole, the cut piece is positioned between the projecting upper die of the punch and the projecting lower die of the die ; a step of applying an external force in a direction protruding to the center position of the cut piece by means of a pin having a shape corresponding to the shape of the hole and vertically movable through a plate retainer that presses the work ;
It has

In addition, a hole punching method for punching a plurality of adjacent holes in a plate-like work by using both laser processing and press working with a punch and a die ,
(a) a step of connecting a cut piece to be cut and separated and the work by one or more micro joints when contouring each of the plurality of holes by laser processing the work;
(b) when projecting the cut piece from each of the plurality of holes, the projecting cut piece is positioned between the projecting upper mold of the punch and the projecting lower mold of the die, and is provided under the projecting upper mold; a step of applying an external force in a projecting direction to the center position of the projecting cut piece by means of a pin having a shape corresponding to the shape of the hole of the projecting cut piece, which penetrates through a plate retainer for holding the work and is vertically movable ;
It has

According to the present invention, in the case of punching a plate-shaped work, when the outline of the hole is processed by laser processing, the work and the cut piece to be cut and separated are connected by the micro joint. Then, when projecting the cut piece from the hole, an external force is applied in the projecting direction.

Therefore, when punching holes adjacent to a plurality of locations on the work, warping of the work can be suppressed, and the cut piece can be easily and stably protruded from the hole.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an explanatory diagram showing a schematic configuration of a laser/punch combined processing machine according to an embodiment of the present invention; FIG. 4 is an explanatory diagram of an example of arrangement of multiple rows and multiple columns of perforations in a plate-like work; It is explanatory drawing which shows the manufacturing method of the punching hole by embodiment of this invention. It is a cross-sectional explanatory view of the mold according to the first embodiment. It is a cross-sectional explanatory view of the mold according to the second embodiment.

Embodiments of the present invention will be described below with reference to the drawings. The present invention is carried out using a laser/punch composite processing machine. Therefore, in order to facilitate understanding, first, the overall configuration of the laser/punch composite processing machine will be briefly described.

As conceptually and schematically shown in FIG. 1, the laser/punch multitasking machine 1 includes a frame body 3 having an upper frame 3U and a lower frame 3L. An upper turret 5U is rotatably provided on the lower surface of the upper frame 3U. A lower turret 5L vertically facing the upper turret 5U is rotatably provided on the lower frame 3L. A plurality of punches P are vertically movable on the upper turret 5U. The lower turret 5L is provided with a plurality of dies D that cooperate with the punch P to perform press working such as punching.

On the lower frame 3L, for example, a workpiece movement positioning device 7 for positioning the plate-like workpiece W with respect to the pressing position by the punch P and the die D is provided. As is known, the work movement positioning device 7 has a function of moving and positioning a plate-like work W in the X and Y axis directions, and is provided with a work clamp 7C capable of clamping one end edge of the work W. there is Therefore, it is possible to position the position where the work W should be pressed with respect to the punch P and the die D positioned at the press working position.

In the laser/punch composite processing machine 1, a striker 9 capable of pressing a punch P positioned at a press working position is provided on an upper frame 3U so as to be vertically movable. Therefore, after positioning the working position of the work W between the punch P and the die D at the press working position, the punch P is pressed by the striker 9, whereby the work W is pressed.

Further, the upper frame 3U is provided with a laser processing head 11 for performing laser cutting processing of the work W so as to be movable in the Y-axis direction. Therefore, by controlling the movement of the laser processing head 11 in the Y-axis direction and controlling the movement of the work W in the X-axis direction, laser cutting of the work W can be performed to make holes of various shapes in the work W. The laser cutting can be processed.

By the way, as shown in FIG. 2, a plurality of holes 13 are made close to each other with a dimension smaller than the diameter of each hole 13, and a punch P and a die When the holes 13 are punched in multiple rows and multiple columns by D, the end portion of the work W may be warped, for example, by 6 mm to 7 mm due to internal stress. Therefore, if the spring constant of a stripper spring (not shown) provided in the punch P is increased to increase the pressing force (plate pressing force) against the work W, warping of the work W can be suppressed, which is desirable. be. However, the suppression of warpage is slight, and it is difficult to eliminate warpage.

Hole processing for the work W can also be performed by laser processing without using the punch P and the die D. Then, using the laser processing head 11, the same laser cutting processing as that shown in FIG. However, since the workpiece W is a 6 mm thick plate, the cut piece may not be separated from the hole 13 due to being caught when the hole 13 is processed by fiber laser processing. That is, stable drilling is difficult.

Therefore, when the workpiece W is moved by the workpiece movement positioning device 7 in order to punch holes 13 in a plurality of rows and columns in the workpiece W, cut pieces that are caught during the movement of the workpiece W and do not separate from the holes 13 are removed. may fall. In other words, the position where the cut piece falls is not stable, and the work W may be scratched due to the friction between the work W and the cut piece.

Therefore, in this embodiment, as shown in FIGS. 3(a) and 3(b), when punching a hole 13A having an appropriate shape in the workpiece W, first, the outline of the hole 13A is cut by laser processing. . At this time, the cut piece 13B generated inside the hole 13A and the workpiece W are connected by micro joints J at one or more locations.

As described above, the cut piece 13B produced by laser cutting the hole 13A is in a state of being connected to the work W through the micro joint J. As shown in FIG. Therefore, when the workpiece W is moved by the workpiece movement positioning device 7, the cut piece 13B can be prevented from falling from the workpiece W. Therefore, when performing the laser cutting processing of the holes 13A in a plurality of rows and columns on the work W, the laser cutting processing of the holes 13A can be efficiently performed, and the work W does not warp.

After laser cutting the workpiece W into a plurality of rows and columns of holes 13A, it is necessary to project the cut piece 13B in each hole 13A from each hole 13A. Therefore, the upper turret 5U is provided with a projecting upper die 15 for projecting the cut piece 13B downward (see FIG. 4). The lower turret 5L is provided with a projecting lower die 17 cooperating with the projecting upper die 15 (see FIG. 4).

As shown in FIG. 4, the ejector upper die 15 has a cylindrical punch guide 19 that is vertically movably supported by the upper turret 5U. A spring seat 21 is provided on the upper portion of the punch guide 19 . A small-diameter portion of a punch driver 23, whose large-diameter lower end portion is fitted in the punch guide 19 so as to be vertically movable, penetrates the spring seat 21 so as to be vertically movable. A stripper spring 27 is elastically mounted between the punch head 25 fixed to the upper end of the punch driver 23 and the spring seat 21 .

A punch body 29 is integrally attached to the lower portion of the punch driver 23. The punch body 29 is fitted in the punch guide 19 so as to be vertically movable. A pin 31 having an appropriate cross-sectional shape and thickness is provided at the lower portion of the punch body 29 so as to protrude downward along the axis. The pin 31 passes through a plate retainer 33 provided at the bottom of the punch guide 19 so as to be vertically movable. The plate retainer 33 is detachably attached to the punch guide 19 . The lower end surface of the pin 31 is provided on the same plane as the lower surface of the plate retainer 33 or at a position slightly higher than the lower surface of the plate retainer 33 (when no external force acts).

It is desirable that the pin 31 has a shape corresponding to the shape of the hole 13A and has dimensions slightly smaller than the shape and size of the hole 13A. However, the pin 31 only needs to have the function of projecting the cut piece 13B out of the hole 13A, and may have any shape and size.

The projecting lower mold 17 has a die body 17A. The die body 17A is detachably fitted in the die mounting hole 5H in the lower turret 5L. The die body 17A is formed with a hole 17B having a shape larger than the external shape of the cut piece 13B projecting from the hole 13A.

In the above configuration, the workpiece W is moved and positioned in the X and Y directions by the workpiece movement and positioning device 7 . By laser cutting the hole 13A in the work W with the laser processing head 11, the cut piece 13B protruding from the hole 13A and the work W can be connected to each other by the micro joint J. In other words, the plurality of holes 13A can be arranged in a plurality of rows and a plurality of columns in the work W to be close to each other with a dimension smaller than the diameter of each hole 13A without warping the work W.

As described above, after the holes 13A are laser-cut in a plurality of rows and a plurality of columns in the work W so that they are adjacent to each other with a dimension smaller than the diameter of each hole 13A, the projecting upper molds provided for the upper and lower turrets 5U and 5L are cut. 15, indexing and positioning the ejector lower die 17 to the pressing position below the striker 9; Then, each hole 13A is positioned between the ejector upper die 15 and the ejector lower die 17 by the work movement positioning device 17. As shown in FIG. Each time the punch head 25 of the upper mold 15 is pressed by the striker 9, the pin 31 presses the center position of the cut piece 13 downward. Therefore, the cut piece 13B is projected from each hole 13A.

At this time, the cut piece 13B is in a state of having been previously cut into the hole 13A by laser processing, and is merely connected to the work W by the micro joint J. As shown in FIG. Therefore, when the cut piece 13B is protruded from the hole 13A, internal stress is not applied to the work W, and the work W is not warped. Therefore, even when the work W is punched in a plurality of rows and a plurality of columns, the work W is not warped, and the above problems can be solved.

FIG. 5 shows a second embodiment of the ejector upper die 15, and redundant description is omitted by assigning the same reference numerals to components having the same functions as those of the components described above.

In this embodiment, pins 35 are fitted into a plurality of holes 29H formed in the lower portion of the punch body 29 so as to be vertically movable. Each pin 35 is urged in a direction to escape from the hole 29H by an elastic member 37 such as a spring mounted between each pin 35 and the bottom of the hole 29H. However, the stopper 39 provided on the lower surface of the punch body 29 restricts the withdrawal. The lower end surface of each pin 35 is aligned with the lower surface of the plate retainer 33 . That is, each pin 35 has the same length.

In the second embodiment, when the punch head 25 is pressed by the striker 9 and lowered, the pins 35 come into contact with the upper surface of the work W at the same time. Therefore, the plurality of pins 35 simultaneously act on the cut piece 13B of the hole 13A of the work W, and the cut piece 13B is protruded without being inclined. Here, the pin 35 that contacts the work W outside the hole 13A is inserted into the hole 29H against the biasing force of the elastic member 37. As shown in FIG.

In other words, only the pin 35 corresponding to the cut piece 13B in the hole 13A functions to push out the cut piece 13B. A pin 35 corresponding to the outside of hole 13A is inserted into hole 29H. Therefore, in the ejector upper die 15 according to the second embodiment, the cut piece 13B can be ejected corresponding to the hole 13A having various shapes such as a round hole and a square hole. . That is, the cut piece 13B is protruded without being inclined by a plurality of pins 35 surrounding the central position of the cut piece 13B.

As can be understood from the above description, according to the present embodiment, a plurality of grooves are arranged adjacent to the work W in a plurality of rows and a plurality of columns so as to prevent the plate-like work W from warping. When punching the hole 13, laser processing is first performed while the cut piece 13B is connected to the work W by the micro joint J. As shown in FIG. After that, using the ejection upper die 15 and the ejection lower die 17, the cut piece 13B is ejected from the hole 13A.

Therefore, it is possible to suppress warping of the workpiece W due to internal stress during punching. Further, the cut piece 13B is prevented from falling from the hole 13A machined in the work W during laser processing. Therefore, laser processing of a plurality of holes 13A in a plurality of rows and a plurality of columns can be efficiently performed on the workpiece W. After the laser processing of the holes 13A, the holes 13A machined in the work W are positioned at the press working positions, and the upper and lower molds 15 and 17 are used to project the cut piece 13B. Therefore, it is possible to efficiently project the cut piece 13B.

As already understood, when machining a plurality of holes 13 adjacent to each other in a plurality of columns and a plurality of rows in the work W, warping of the work W due to internal stress in the punching process is suppressed. , a plurality of rows and a plurality of columns of holes 13 can be machined in the workpiece W.

REFERENCE SIGNS LIST 1 laser/punch combined processing machine 5U upper turret 5L lower turret 7 work movement positioning device 7C work clamp 11 laser processing head 13 hole 13A hole 13B cut piece 15 projecting upper die 17 projecting lower die 29 punch body 29H hole 31 pin 33 plate holder 35 pin 37 elastic member 39 stopper

Claims (6)

A hole processing method for a plate-shaped work in which a hole is punched in a plate-shaped work using both laser processing and press processing using a punch and a die ,
(a) a step of performing contour processing of a hole in a work by laser processing, and connecting the cut piece to be cut and separated and the work by one or more micro joints;
(b) when projecting the cut piece from the hole, the cut piece is positioned between the projecting upper die of the punch and the projecting lower die of the die ; a step of applying an external force in a direction protruding to the center position of the cut piece by means of a pin having a shape corresponding to the shape of the hole and vertically movable through a plate retainer that presses the work ;
A punching method, comprising: A hole punching method for punching a plurality of adjacent holes in a plate-like work by using both laser processing and press processing with a punch and a die ,
(a) a step of connecting a cut piece to be cut and separated and the work by one or more micro joints when contouring each of the plurality of holes by laser processing the work;
(b) when projecting the cut piece from each of the plurality of holes, the projecting cut piece is positioned between the projecting upper mold of the punch and the projecting lower mold of the die, and is provided under the projecting upper mold; a step of applying an external force in a projecting direction to the center position of the projecting cut piece by means of a pin having a shape corresponding to the shape of the hole of the projecting cut piece and which is vertically movable through a plate retainer for holding the work ;
A punching method, comprising: 3. A method according to claim 2, wherein said holes are adjacent to each other with a dimension smaller than the diameter of said holes. 4. A hole punching method according to claim 1, 2 or 3, wherein said cut piece is projected into said hole without being inclined. The punching method according to any one of claims 1 to 4, wherein the plate retainer presses the periphery of the hole. A mold used in the hole punching method according to any one of claims 1 to 5,
a lower mold having a hole with a shape larger than the external shape of the cut piece protruding from the hole of the workpiece whose contour is processed by laser processing;
an upper die provided with a vertically movable pin that applies an external force in a direction of protruding to the center position of the cut piece or to a plurality of locations including the center position inside;
a plate retainer provided in the lower part of the upper die to hold the periphery of the hole in the work and through which the pin penetrates;
A mold characterized by comprising

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