WO2015159458A1 - Flexible printed board manufacturing method, board manufacturing jig, and board manufacturing method - Google Patents

Flexible printed board manufacturing method, board manufacturing jig, and board manufacturing method Download PDF

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Publication number
WO2015159458A1
WO2015159458A1 PCT/JP2014/082977 JP2014082977W WO2015159458A1 WO 2015159458 A1 WO2015159458 A1 WO 2015159458A1 JP 2014082977 W JP2014082977 W JP 2014082977W WO 2015159458 A1 WO2015159458 A1 WO 2015159458A1
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WO
WIPO (PCT)
Prior art keywords
flexible printed
printed circuit
circuit board
jig
holding
Prior art date
Application number
PCT/JP2014/082977
Other languages
French (fr)
Japanese (ja)
Inventor
松田 文彦
昭広 中村
Original Assignee
日本メクトロン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本メクトロン株式会社 filed Critical 日本メクトロン株式会社
Priority to CN201480025019.XA priority Critical patent/CN105247970B/en
Publication of WO2015159458A1 publication Critical patent/WO2015159458A1/en

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits

Definitions

  • the present invention relates to a flexible printed circuit board manufacturing method, a board manufacturing jig, and a board manufacturing apparatus.
  • arm robots are often used as industrial robots.
  • this type of arm robot depending on the end effector attached to the tip side of the robot arm (equivalent to a hand in the human body) or the driving method of the joint part of the robot arm, from the base side to the tip side of the robot arm
  • the cables and hoses are wired to the joints, the cables may be bent or disconnected.
  • the cables and hoses are temporarily extended outward at positions closer to the base end than the joints of the robot arms, and the cables are arranged in the outer space of the joints, and again inside the arm at positions closer to the tip than the joints.
  • a wiring method such as introduction into the network is adopted.
  • a space for loosening the cable is required around the joint portion of the robot arm.
  • a support rod is provided at the joint rotation center position in the joint portion of the robot arm, a cable is wound around the support rod, and the support rod on which the cable is wound is stored in the robot arm.
  • a structure that prevents the cable from being bent or disconnected is disclosed.
  • functional deterioration operation speed, accuracy, etc.
  • a high-spec motor or the like is used in order to compensate for the deterioration of the function or the number of necessary members increases. In this case, the manufacturing cost increases.
  • Patent Document 2 and Patent Document 3 disclose techniques that meet the demand for such an electric transmission member.
  • Patent Documents 2 and 3 disclose a flexible printed wiring board that can be stretched and formed into a so-called pleated shape in which curved portions are alternately arranged, and a forming method.
  • the stretchable flexible printed wiring board disclosed in Patent Documents 2 and 3 uses a thermoplastic resin such as LCP (Liquid Crystal Polymer), and is 30 minutes lower than the softening temperature of the resin by several tens of degrees Celsius to 100 degrees Celsius. By heating for about 60 minutes, it is molded in substantially the same shape as the mold.
  • LCP Liquid Crystal Polymer
  • Patent Document 2 a plurality of boards having a desired R formed at the tip inside the mold are arranged at intervals at which the flexible printed wiring board can pass, and the flexible printed wiring is placed inside the mold while applying a certain tension. A method of thermoforming by passing a plate is described.
  • Patent Document 3 a plurality of pins formed with a desired R in a jig are arranged at intervals at which the flexible printed wiring board can pass, and the flexible printed wiring board is passed through the jig while applying a certain tension. And a method of thermoforming is described.
  • Japanese Patent Laid-Open No. 8-57772 JP 2011-134484 A (FIG. 2, paragraph 0044, etc.)
  • Japanese Patent Laying-Open No. 2011-233822 (FIG. 4, paragraph 0049, etc.)
  • the present invention has been made based on the above circumstances, and its purpose is to be able to define the molding start position of the flexible printed wiring board, to stabilize the molding shape, to improve the workability in production,
  • An object of the present invention is to provide a flexible printed board manufacturing method, a board manufacturing jig, and a board manufacturing apparatus capable of achieving at least one of reducing the heat capacity.
  • a flexible printed circuit board having a wiring layer and an insulating layer that covers the wiring layer from both sides and is made of a thermoplastic resin.
  • a flexible printed circuit board manufacturing method for forming a flexible printed circuit board having a bent portion at a location by using a substrate manufacturing jig, wherein the first holding unit holds one side of the flexible printed circuit board among the substrate manufacturing jig.
  • a method for manufacturing a flexible printed circuit board comprising: a thermoforming process for thermoforming the flexible printed circuit board in a state where the holding state of the flexible printed circuit board is partially maintained.
  • the substrate manufacturing jig includes a first jig and a second jig, and the first jig is attached to and detached from the second jig.
  • the first jig is provided with a tip fixing member that constitutes the first holding means, a plurality of support members, and a terminal fixing member that constitutes the second holding means.
  • the first holding step it is preferable to hold one side of the flexible printed circuit board using the tip fixing member, and in the second holding step, the other side of the flexible printed circuit board is held using the terminal fixing member.
  • the tip fixing member includes a tip receiving portion that is in planar contact with one end of the flexible printed circuit board, and a latch pin that protrudes in a direction away from the tip receiving portion.
  • the latch pin is inserted through a hole formed on one end side of the flexible printed circuit board.
  • a tip holding mechanism that clamps one end side of the flexible printed circuit board together with the tip fixing member is provided, and the tip holding mechanism is in contact with and separated from the tip fixing member. It is preferable that the front end clamping member to be moved and a first driving means for moving the front end clamping member.
  • the support member includes a movable pin inserted into an insertion hole penetrating the first jig, the movable pin is inserted into the insertion hole, and the insertion side is provided. It is possible to hang a flexible printed circuit board by projecting a movable pin from the opposite side, and it is preferable that a through hole for guiding insertion of the movable pin is formed in the second jig.
  • the substrate manufacturing jig is slidably provided by a jig slider, and the jig slider is provided with a driving force for the slide.
  • Two drive means are preferably provided.
  • a torque roller including a pair of openable and closable rollers and a pair of rollers that can also be opened and closed are both first holding means than the torque roller.
  • the flexible printed circuit board is sandwiched by the free rollers located on the side, and at least one of the pair of rollers constituting the torque roller is given a driving force by a roller driving mechanism, and the driving force applies tension to the flexible printed circuit board.
  • the substrate manufacturing jig is moved in the transport direction while moving the free roller in the direction intersecting the transport direction of the flexible printed circuit board, Move the board manufacturing jig to the position where it is located on the inner circumference side of the bent section, and Insert the movable pin into the insertion hole after the movement, it is preferable.
  • the side surface pressing member is pressed against the side surface of the flexible printed circuit board after the first holding step and before the winding step. It is preferable to include a skew adjustment process for adjusting the skew direction of the substrate.
  • a flexible printed circuit board having a wiring layer, an insulating layer that covers the wiring layer from both sides and is made of a thermoplastic resin, and has bent portions at a plurality of locations.
  • a substrate manufacturing jig for forming a first holding means for holding one side of a flexible printed circuit board, and a plurality of supports for bending the flexible printed circuit board to form a bent portion There is provided a jig for manufacturing a board, comprising: a member; and a second holding means for holding the other side of the flexible printed board and maintaining a state in which a tension is applied to the flexible printed board.
  • a flexible printed circuit board having a wiring layer, an insulating layer that covers the wiring layer from both sides and is made of a thermoplastic resin, and has bent portions at a plurality of locations.
  • a driving force is applied to at least one of a pair of rollers constituting a torque roller and a free roller contacting / separating mechanism having a free roller composed of a pair of rollers movable in the contact / separation direction of the flexible printed circuit board.
  • a roller drive mechanism that applies tension to the flexible printed circuit board and a substrate manufacturing jig Among the jig slider for moving in the transport direction and the board manufacturing jig for holding the flexible printed circuit board, after holding one side of the flexible printed circuit board on the first holding means, The substrate manufacturing jig is moved by the jig slider while moving in the direction intersecting the conveyance direction of the flexible printed circuit board, and the substrate is further moved to the position where the movable pin is arranged on the inner peripheral side of the bent portion after molding.
  • a substrate manufacturing apparatus comprising a control unit that performs control to move a manufacturing jig.
  • At least one of achieving the molding start position of the flexible printed wiring board, stabilizing the molding shape, improving the workability in manufacturing, and reducing the heat capacity is achieved. It becomes possible.
  • FIG. 1 It is front sectional drawing which shows an example of a structure of the flexible printed circuit board concerning one embodiment of this invention. It is a figure which shows the side shape of a flexible printed circuit board, (A) shows the flexible printed circuit board before shaping
  • the manufacturing method of the flexible printed circuit board FB, the board manufacturing apparatus 100, and the board manufacturing jig 10 according to an embodiment of the present invention will be described below.
  • the board manufacturing jig 10 and the board manufacturing apparatus 100 for performing the method for manufacturing the flexible printed circuit board FB will be described first, and then the method for manufacturing the flexible printed circuit board FB will be described.
  • the X direction is the longitudinal direction of the substrate manufacturing jig 10
  • the X1 side is the right side in FIG. 3
  • the X2 side is the left side.
  • the Z direction is the height direction of the substrate manufacturing jig 10, the Z1 side is the upper side, and the Z2 side is the lower side.
  • the Y direction is a direction perpendicular to the XZ direction and the width direction of the substrate manufacturing jig 10.
  • the Y1 side is the front side, and the Y2 side is the back side.
  • FIG. 1 is a front sectional view showing an example of the configuration of a flexible printed circuit board FA (or a molded flexible printed circuit board FB) before molding.
  • the flexible printed boards FA and FB of the present embodiment have an insulating layer F1, a conductive pattern F2, and an adhesive layer F3.
  • the insulating layer F1 uses a thermoplastic resin such as LCP (Liquid Crystal Polymer: LCP).
  • LCP Liquid Crystal Polymer: LCP
  • the front and back sides of the flexible printed boards FA and FB are covered with an insulating layer F1 of LCP, and a conductive pattern F2 is formed on any one of those insulating layers F1, and further covers the conductive pattern F2.
  • LCP Liquid Crystal Polymer
  • the conductive pattern F2 (conductive layer) is sandwiched between the pair of insulating layers F1.
  • the conductive pattern F2 (conductive layer) is not limited to one layer, and two or more layers may be provided. In that case, an insulating layer for separating the conductive patterns F2 (conductive layer) from each other Is required.
  • the above-described flexible printed circuit board FA When the above-described flexible printed circuit board FA is molded, it is heated approximately 30 to 60 minutes at a temperature several tens to 100 ° C. lower than the softening temperature of the resin constituting the insulating layer F1, so that it is substantially the same as the molding die. Molded into the same shape.
  • FIG. 2 is a diagram showing the side shapes of the flexible printed boards FA and FB, (A) showing the flexible printed board FA before molding, and (B) showing the flexible printed board FB after molding. As shown in FIG. 2A, the flexible printed circuit board FA before molding is in a state where the bent portion FB1 is not formed.
  • the molded flexible printed circuit board FB has a plurality of bent portions FB1.
  • the bent portion FB1 is formed so as to follow the outer periphery of a fixed pin 24 and a movable pin 25 described later. Therefore, the curvature of the bent portion FB 1 also corresponds to the fixed pin 24 and the movable pin 25.
  • a substrate manufacturing jig 10 a substrate manufacturing apparatus 100, and a manufacturing method of the flexible printed circuit board FB for manufacturing the flexible printed circuit board FB after forming from the flexible printed circuit board FA before forming will be described.
  • FIG. 3 to 5 are views showing the configuration of the substrate manufacturing jig 10 before setting the flexible printed circuit board FA
  • FIG. 3 is a side view
  • FIG. 4 is a plan view
  • FIG. 5 is a front view.
  • the movable pin 25 inserted through the insertion hole 211 and the sleeve 33 is shown transparently with hatching.
  • FIG. 6 is a plan view showing the shape of the front end side of the flexible printed circuit board FA.
  • FIG. 7 is a side view showing the shape of the movable pin 25.
  • the substrate manufacturing jig 10 includes a first jig 20 and a second jig 30.
  • the first jig 20 has, for example, a rectangular parallelepiped main body 21.
  • the main body 21 is provided with a positioning recess 22.
  • the positioning recess 22 is a portion into which a positioning protrusion 32 (described later) of the second jig 30 is fitted, and the second jig 30 is positioned with respect to the second jig 30 by the fitting.
  • the positioning recess 22 is provided on one end side (X2 side) and the other end side (X1 side) in the longitudinal direction (X direction) of the main body 21.
  • the position and number of the positioning recesses 22 can be changed as appropriate.
  • other configurations such as a configuration in which a positioning convex portion is provided in the main body portion 21 instead of the positioning concave portion 22 and a positioning concave portion is provided in the main body portion 31 of the second jig 30 are adopted. You may do it.
  • first jig 20 and the second jig 30 can be fixed using a magnet.
  • first jig 20 when the positioning protrusion 32 is fitted to the positioning recess 22, the first jig 20 is fixed to the second jig 30.
  • first jig 20 may be fixed to the second jig 30 by using other fixing means such as mechanical clamping and screwing instead of fixing with a magnet.
  • a tip fixing member 23 is provided on one end side (X2 side) in the longitudinal direction (X direction) of the main body 21.
  • the tip fixing member 23 corresponds to the first holding means.
  • the tip fixing member 23 includes a tip receiving portion 23a and a latch pin 23b.
  • the tip receiving portion 23a is provided in a flat plate shape and contacts the back surface on the tip side of the flexible printed circuit board FA.
  • the latch pin 23b is provided, for example in the shape of a cylindrical pin.
  • a cut-off portion F4 to be cut off later is provided on the front end side of the flexible printed circuit board FA (FIG. 6 also shows a cutting line F6 that is a line to be cut off later).
  • the cut-off portion F4 is provided with a hole F5. For this reason, the front end side of the flexible printed circuit board FA is positioned by inserting the latch pin 23b into the hole F5.
  • the configuration of the tip fixing member 23 is not limited to the configuration shown in FIGS.
  • the latch pin 23b may have a prismatic shape such as a quadrangular prism shape, a cylindrical shape such as an elliptical prism shape, or other protrusion shape.
  • the distal end fixing member 23 can position the distal end side of the flexible printed circuit board FA, other configurations such as a configuration in which the cut-off portion F4 of the flexible printed circuit board FA is clamped or the cut-off portion F4 is sucked and held. It may be.
  • a fixing pin corresponding to the support member is provided at one end side (X2 side) of the main body portion 21 and closer to the other end side (X1 side) than the tip fixing member 23.
  • 24 is provided.
  • the fixed pin 24 is a pin member that is fixed to the main body 21, and is provided so as to be detachable from the main body 21, unlike the movable pin 25 described later.
  • the fixing pin 24 may be detachable from the main body 21.
  • the fixed pin 24 may be configured to be more difficult to be removed (not easily movable) than the movable pin 25.
  • the curvature of the curved outer peripheral surface of the fixing pin 24 is a curvature corresponding to the curvature of the curved portion of the flexible printed circuit board FB to be molded.
  • the upper surface of the fixing pin 24 is provided substantially flush with the tip receiving portion 23 a of the tip fixing member 23. That is, the conveyance line L passing through the upper surface of the tip receiving portion 23a and parallel to the longitudinal direction (X direction) is in contact with the upper surface side of the tip receiving portion 23a.
  • the fixing pin 24 extends in a direction perpendicular to the side surface of the main body 21 and the length of the fixing pin 24 is longer than the length in the width direction (Y direction) of the flexible printed circuit board FA. Is provided.
  • a plurality of movable pins 25 can be arranged on the main body 21.
  • the movable pin 25 is detachably attached to the main body portion 21.
  • the main body portion 21 is provided with an insertion hole 211.
  • the insertion hole 211 is provided so as to penetrate the width direction (Y direction) of the main body portion 21.
  • the insertion hole 211 can be inserted with the movable pin 25, but has a tolerance that the movable pin 25 does not rattle after the insertion of the movable pin 25 into the insertion hole 211. Yes.
  • the movable pin 25 inserted into the insertion hole 211 has a pin portion 251 and a flange portion 252 as shown in FIG.
  • the pin portion 251 is a pin-shaped portion having the same diameter
  • the flange portion 252 is a portion provided with a larger diameter than the pin portion 251. Therefore, when inserting into the insertion hole 211 from the front end side of the pin part 251, the flange part 252 cannot pass through the insertion hole 211, and the movable pin 25 is locked to the first jig 20.
  • the pin part 251 is longer than the width of the flexible printed circuit board FA and protrudes from the main body part 21 in the Y1 direction.
  • the insertion hole 211 is provided so that the hole diameter is the same throughout the width direction (Y direction).
  • at least a part of the insertion hole 211 may be configured such that the hole diameter is not the same, such as a tapered hole.
  • the insertion hole 211 has the same diameter from the front end side (Y2 side) of the insertion of the movable pin 25 to the middle part of the rear end side (Y1 side; second jig 30 side).
  • the straight hole 212 may be a tapered hole 213 whose diameter gradually increases from the midway portion toward the rear end side (Y2 side).
  • the entire insertion hole 211 may be a tapered hole.
  • a total of nine insertion holes 211 as described above are provided.
  • the number of the insertion holes 211 may be any number.
  • the insertion holes 211 are alternately located on the lower side (Z2 side) with the conveyance line L in between and on the upper side (Z1 side).
  • the insertion hole 211 on the most end side (X2 side) is referred to as the insertion hole 211a along the longitudinal direction (X direction), and thereafter the other end side (X1 side). Accordingly, the insertion holes 211b to 211i are sequentially set.
  • the insertion hole 211 (insertion hole 211a) on the most end side (X2 side) in the longitudinal direction (X direction) is more than the transport line L. It is located on the lower side (Z2 side).
  • movable pins 25 that are respectively inserted into the insertion holes 211a to 211i are referred to as movable pins 25a to 25i as necessary.
  • a terminal fixing member 26 corresponding to the second holding means is provided in a portion on the other end side (X1 side) in the longitudinal direction (X direction) from the insertion hole 211i. It has been.
  • the terminal fixing member 26 is a part that sandwiches the flexible printed circuit board FA with a rear end holding member 200 described later and fixes the terminal side (X1 side end) of the flexible printed circuit board FA.
  • the end fixing member 26 is provided in a flat plate shape similar to the tip receiving portion 23a, and contacts the back surface on the end side of the flexible printed circuit board FA.
  • the rear end holding member 200 together with the end fixing member 26 may correspond to the second holding means.
  • the cutout part (however, it is good also as what does not have the hole part F5) similar to the above-mentioned cutout part F4 exists also in the rear-end side of the flexible printed circuit board FA.
  • the configuration of the terminal fixing member 26 is not limited to the configuration shown in FIGS. 3 to 5 as in the tip fixing member 23, and other configurations may be adopted.
  • the second jig 30 is a member attached to the substrate manufacturing apparatus 100 and a member to which the first jig 20 is attached (see FIGS. 4 and 5). That is, the first jig 20 is attached to the substrate manufacturing apparatus 100 via the second jig 30. Therefore, the second jig 30 has a rectangular parallelepiped main body 31 whose shape when viewed from the side is the same size as the main body 21.
  • the main body 31 is provided with a positioning convex portion 32.
  • the positioning convex portion 32 is a portion for positioning the first jig 20 with respect to the second jig 30 by being inserted into the positioning concave portion 22 described above. Therefore, the positioning convex portion 32 is provided at a position corresponding to the positioning concave portion 22.
  • the main body 31 is provided with a sleeve 33 which is a through hole.
  • the sleeve 33 is provided at a position that is coaxial with the insertion hole 211 when the first jig 20 is fixed to the second jig 30. Therefore, the same number of sleeves 33 as the insertion holes 211 are provided.
  • the sleeve 33 is provided with a larger hole diameter than the insertion hole 211.
  • the sleeve 33 is provided with a hole diameter such that the flange portion 252 can be inserted. Therefore, when the sleeve 33 is inserted into the movable pin 25, the pin portion 251 of the movable pin 25 passes through the sleeve 33.
  • the pin portion 251 can be positioned in the insertion hole 211 in a state where the flange portion 252 of the movable pin 25 is positioned on the sleeve 33. Therefore, the sleeve 33 has a function as a guide for guiding the movable pin 25.
  • FIG. 9 is a block diagram illustrating a schematic configuration of the substrate manufacturing apparatus 100.
  • the substrate manufacturing apparatus 100 includes a control unit 110, a jig clamping mechanism 120, a jig slider 130, a pin pushing mechanism 140, a torque roller contact / separation mechanism 150, a free roller contact / separation mechanism 160, and a roller drive.
  • a mechanism 170, a tip holding mechanism 180, and a side surface pressing mechanism 190 are provided.
  • control unit 110 is a part that controls each drive part, and includes a memory such as a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), and a nonvolatile memory.
  • the memory stores data and programs for various controls.
  • the jig clamping mechanism 120 includes, for example, a pair of clamping members 121, and the second jig 30 is clamped by the pair of clamping members 121. By holding the second jig 30 by the jig holding mechanism 120, the second jig 30 is fixed to the substrate manufacturing apparatus 100.
  • the jig clamping mechanism 120 may be configured to be manually clamped, or may be configured to be automatically clamped using a drive source such as a motor.
  • the jig slider 130 includes a slide motor 131 corresponding to the second driving means, and is a part that slides the board manufacturing jig 10 by driving the slide motor 131.
  • the substrate manufacturing jig 10 can be slid with respect to a torque roller 151, a free roller 161, and the like, which will be described later.
  • FIG. 9 illustrates a case where a belt 132 is used as an example of the jig slider 130, and a part such as the clamping member 121 is fixed to a part of the belt 132. Since FIG. 9 is a schematic view, the belt 132 is illustrated in a short state, but the belt 132 is provided with a length that allows the substrate manufacturing jig 10 to be sufficiently slid. In addition, you may use structures other than the belt 132, such as a lead screw, as an element which comprises the jig
  • the pin push-out mechanism 140 includes an air cylinder 141 and is a mechanism that pushes the movable pin 25 toward the insertion hole 211 through the sleeve 33 by the operation of the air cylinder 141.
  • the pin pushing mechanism 140 is also provided with a moving mechanism (not shown) for moving the air cylinder 141, and the movable pin 25 can be sequentially inserted into each insertion hole 211 by the operation of the moving mechanism. It is said.
  • the torque roller contact / separation mechanism 150 includes a torque roller 151, an air cylinder 152, and an urging means (not shown).
  • the torque roller 151 is provided with a driving roller 151a and a driven roller 151b, which are arranged along the vertical direction.
  • the driving roller 151a and the driven roller 151b are separated in the vertical direction by the action of the urging means, but when the air cylinder 152 is operated, the driving roller 151a and the driven roller 151b are Are close to each other and the flexible printed circuit board FA can be sandwiched with a predetermined pressing force.
  • the free roller contact / separation mechanism 160 includes a free roller 161, an air cylinder 162, and an urging means (not shown).
  • the free roller 161 has a pair of driven rollers 161a and 161b, which are arranged along the vertical direction.
  • the driven rollers 161a and 161b are separated from each other in the vertical direction by the action of the urging means.
  • the driven rollers 161a and 161b are closed close to each other.
  • the flexible printed circuit board FA can be sandwiched with a predetermined pressing force.
  • the free roller 161 is located on one end side (X2 side) in the longitudinal direction (X direction) with respect to the torque roller 151.
  • the roller drive mechanism 170 includes a drive motor 171.
  • the drive roller 151 a can be driven by the operation of the drive motor 171. Therefore, the flexible printed circuit board FA can be sent by driving the driving roller 151a with the flexible printed circuit board FA sandwiched between the driving roller 151a and the driven roller 151b, and the other side (X1 side; right side of FIG. 9). ), Tension can be applied to the flexible printed circuit board FA.
  • the tip holding mechanism 180 has a tip clamping member 181 and an air cylinder 182. As shown in FIG. 9, the tip clamping member 181 is provided in a substantially L shape when viewed from the side, and abuts against the tip side of the tip fixing member 23. In order to enable such contact, the distal end side contact portion 181a is provided longer in the vertical direction (Z direction) than the upper surface contact portion 181b. Further, the upper surface contact portion 181b of the tip clamping member 181 contacts the upper surface side of the cut-off portion F4, and sandwiches the cut-off portion F4 with the tip receiving portion 23a.
  • the tip clamping member 181 is movable in the vertical direction (Z direction) by the operation of the air cylinder 182 (corresponding to the first driving means). Thereby, the front end side of the flexible printed circuit board FA is securely fixed.
  • the upper surface contact portion 181b is provided with a concave portion (not shown) so that the latch pin 23b can be inserted.
  • the side surface pressing mechanism 190 has a side surface pressing member 191 and an air cylinder 192.
  • the side pressing member 191 has a side contact portion 191 a that contacts the side surface of the main body portion 21.
  • the side surface contact portion 191a contacts the Y2 side surface of the flexible printed circuit board FA, the skew direction (angular direction) of the flexible printed circuit board FA can be adjusted.
  • the side pressing member 191 is movable in the width direction (Y direction) by the operation of the air cylinder 192.
  • the substrate manufacturing apparatus 100 may be configured to include the rear end holding member 200, but the rear end holding member 200 may be configured differently from the substrate manufacturing apparatus 100.
  • the rear end holding member 200 is, for example, a plate-like member, and abuts on the upper surface side of the rear end side cut-off portion F4. Accordingly, the cut-off portion F4 is sandwiched between the terminal fixing member 26 and the rear end side of the flexible printed circuit board FA is securely fixed.
  • the rear end holding member 200 may be configured to be attached to the terminal fixing member 26 by magnetic force, but is attached to the terminal fixing member 26 by, for example, a clamp or other means. It is good also as a structure.
  • the first jig 20 is attached to the second jig 30 by fitting the positioning convex portion 32 into the positioning concave portion 22 as shown in FIG.
  • the jig slider 130 slides the board manufacturing jig 10 to the opposite side (in FIG. 10 and FIG. 11, the right side relative to the board manufacturing apparatus 100), and the board manufacturing jig.
  • the tool 10 is moved to a position for attaching the flexible printed circuit board FA.
  • the movable pin 25 is inserted into each sleeve 33 before and after the substrate manufacturing jig 10 slides to the right in FIGS. 10 and 11. This insertion is performed from the front side (Y1 side) side of the main body 31 to a position where the pin portion 251 does not protrude.
  • the tip clamping member 181 of the tip holding mechanism 180 is in a state of being retracted upward (Z1 side).
  • the side surface pressing member 191 of the side surface pressing mechanism 190 is also retracted to the front side (Y1 side), and the rear end holding member 200 is also retracted to the upper side (Z1 side).
  • the driving roller 151a and the driven roller 151b of the torque roller 151 are separated from each other in the vertical direction.
  • the driven rollers 161a and 161b of the free roller 161 are also separated from each other in the vertical direction.
  • the first jig 20 is removed from the second jig 30, and another first jig 20 is replaced with the second jig. Attach to 30. That is, there are a large number of first jigs 20 for one second jig 30, and the flexible printed circuit board FA is attached to the first jig 20 sequentially for each first jig 20. Yes.
  • the air cylinder 152 is operated to bring the driving roller 151a and the driven roller 151b of the torque roller 151 close to each other in the vertical direction, thereby sandwiching the flexible printed circuit board FA.
  • the drive motor 171 of the roller drive mechanism 170 is operated to apply tension to the flexible printed circuit board FA in the feed direction (right direction in FIG. 14), and the drive roller 151a is moved to the flexible printed circuit board FA. Drive in the feed direction.
  • the air cylinder 162 is operated to bring the driven rollers 161a and 161b of the free roller 161 close to each other in the vertical direction, and the flexible printed circuit board FA is sandwiched.
  • the sandwiching of the flexible printed circuit board FA by the free roller 161 may be performed before the operation of the drive motor 171 or may be performed before the sandwiching of the flexible printed circuit board FA by the torque roller 151.
  • the pin pushing mechanism 140 is moved to a position coaxial with the insertion hole 211a in the Y direction.
  • the movement of the pin pushing mechanism 140 may be performed before the flexible printed circuit board FA is sandwiched by the free rollers 161, or may be performed in the next fourth step.
  • the air cylinder 162 of the free roller contact / separation mechanism 160 is operated to lower the free roller 161.
  • This lowering is such that when the movable pin 25a is inserted into the insertion hole 211a, the movable pin 25a is positioned closer to the transport line L (upper side) than the flexible printed circuit board FA.
  • the free roller 161 is lowered.
  • the slide motor 131 of the jig slider 130 may be operated to move the board manufacturing jig 10 to the other side in the longitudinal direction (X1 side; right side in FIG. 16).
  • the air cylinder 141 of the pin pushing mechanism 140 is operated, and the movable pin 25a is inserted into the insertion hole 211a until the flange portion 252 contacts the main body portion 21. Thereby, the pin part 251 of the movable pin 25a protrudes to the near side (Y1 side), and the upper surface side of the flexible printed circuit board FA can come into contact with the pin part 251.
  • the air cylinder 141 is actuated, the air cylinder 141 returns so that the air cylinder 141 does not enter the sleeve 33.
  • the pin push-out mechanism 140 is moved to a position coaxial with the insertion hole 211b in the Y direction.
  • the air cylinder 141 of the pin push-out mechanism 140 is operated, and the movable pin 25b is inserted into the insertion hole 211b until the flange portion 252 contacts the main body portion 21.
  • the pin part 251 of the movable pin 25b protrudes to the near side (Y1 side), and the lower surface side of the flexible printed circuit board FA can come into contact with the pin part 251.
  • the air cylinder 141 is actuated, the air cylinder 141 returns so that the air cylinder 141 does not enter the sleeve 33.
  • the heat-molding is performed in a state where the position of the front end side of the flexible printed circuit board FA is determined and the tension is applied to the flexible printed circuit board FA, the product shape of the formed flexible printed circuit board FB is stabilized. be able to.
  • the flexible printed circuit board FB is removed from the first jig 20.
  • a recess 27 may be provided on the back side (Y2 side) of the first jig 20, and the extraction plate 28 may be fitted into the recess 27.
  • the punching plate 28 is provided with a hole portion 28a that is coaxial with the insertion hole 211 and has the same diameter. Thereby, the flange 252 of each movable pin 25 cannot pass through the punching plate 28 and is locked to the side surface of the punching plate 28. Therefore, by removing the extraction plate 28 from the recess 27, the movable pin 25 can be pulled out from the insertion hole 211, and the flexible printed circuit board FB can be easily detached from the first jig 20.
  • the first jig 20 may be divided.
  • the first jig 20 has a first divided part 20A and a second divided part from the divided part 29 in the middle of the vertical direction (Z direction) as a fulcrum on the side surface on the near side (Y1 side) or the vicinity thereof. It is good also as a structure opened and closed so that it may be divided into two parts of 20B.
  • the divided portion 29 is provided at a position between the movable pin 25 located on the lower side (Z2 side) and the movable pin 25 located on the upper side (Z1 side).
  • the jig with blade 300 is a jig with a blade such as a pinnacle or a mold, and a pair of blade portions 301 are provided so that the cut-off portions F4 on both ends of the flexible printed circuit board FB can be cut.
  • the fixing jig 400 includes a jig housing 401 having a recessed shape. A guide pin 402 into which the hole F5 can be inserted is provided around the recess of the jig housing 401 so that the front end side of the flexible printed circuit board FB can be held. Furthermore, the fixing jig 400 includes a rear end holding portion 403 that can be held while positioning the rear end side of the flexible printed circuit board FB. Therefore, by moving the jig with blade 300 downward, it is possible to cut off the cut-off portions F4 on both ends of the flexible printed circuit board FB.
  • the fixing jig 400 can attach a plurality of flexible printed boards FB, and the plurality of flexible printed boards FB can be cut at once using the bladed jig 300. is there.
  • the flexible printed circuit boards FB may be cut one by one.
  • a hole similar to the hole F5 is provided in advance on the rear end side of the flexible printed circuit board FB, and positioning is also performed by inserting the hole into a guide pin similar to the guide pin 401 on the rear end side. May be performed.
  • a method other than the method described above may be used for cutting the cut-off portion F4. Examples of such methods include laser cutting using a laser and router cutting using a router bit.
  • FIG. 30 is a side view illustrating a configuration of a substrate manufacturing jig 10D according to a comparative example, and relates to the above-described Patent Document 3.
  • the substrate manufacturing jig 10 ⁇ / b> D according to the comparative example includes a main body portion 11, and the main body portion 11 is provided with a plurality of fixing pins 24 ⁇ / b> D.
  • the flexible printed circuit board FA is passed between the fixing pins 24D while applying a certain tension. Then, after the flexible printed circuit board FA is passed between the fixing pins 24D, heat molding is performed. In this case, the workability of passing the flexible printed circuit board FA between the fixing pins 24D is poor, and the position on the starting point side (the position on the front end side) of the flexible printed circuit board FA is not stable. In addition, it is difficult to pull at a constant tension due to friction between the flexible printed circuit board FA and the fixing pin 24D. Therefore, it is difficult to stabilize the molded shape. In particular, when the number of fixing pins 24D increases, the friction increases and it is difficult to pull the pin with a constant tension. In addition, as the friction increases, there is a problem that the middle of the flexible printed circuit board FA is loosened even if a certain tension is applied.
  • FIG. 31 is a side view showing an example in which the molding shape of the flexible printed circuit board FB is not stable.
  • FIG. 31A shows the shape of the target flexible printed circuit board FB.
  • FIG. 31B shows a state in which the curvature (R) of the bent portion FB1 varies with respect to the target flexible printed circuit board FB. That is, a portion FB1a having a large curvature (R) and a portion FB1b having a small curvature (R) of the bent portion FB1 are formed, which is an aspect in which the molded shape is not stable.
  • FIG. 31C shows an example in which the position of the starting point side (tip side) of the flexible printed circuit board FA set on the substrate manufacturing jig 10D is shifted by M.
  • Such misalignment of the starting point side (tip side) is also an aspect in which the molding shape is not stable.
  • the flexible printed circuit board FA can be supported around the fixed pin 24 and the movable pin 25, the bent portion FB1 can be reliably formed on the flexible printed circuit board FA. Further, the end fixing member 26 can support the other end side (X1 side; end side) of the flexible printed circuit board FA. Thereby, even when the flexible printed circuit board FA is heat-molded, it is possible to maintain a state in which the flexible printed circuit board FA is tensioned.
  • the substrate manufacturing jig 10 includes a first jig 20 and a second jig 30, and the first jig 20 is detachably provided to the second jig 30. It has been. Therefore, when the flexible printed circuit board FA is thermoformed, the first jig 20 can be removed from the second jig 30, so that it is not necessary to heat the entire board manufacturing jig 10, such as in an oven. The heat capacity can be reduced during the thermoforming.
  • the first jig 20 is provided with a tip fixing member 23, a fixed pin 24, a movable pin 25, and a terminal fixing member 26, and one end side (X2 side) of the flexible printed circuit board FA is fixed to the tip.
  • the other end side (X1 side) of the flexible printed circuit board FA can be supported on the terminal fixing member 26 side while being supported on the member 23 side.
  • the movable pin 25 is detachably attached to the first jig 20. For this reason, when the flexible printed circuit board FA is hung around the movable pin 25, the flexible printed circuit board FA is passed between the movable pins 25 by inserting the necessary movable pins 25 into the insertion holes 211. This eliminates the time-consuming work. Therefore, the work of setting the flexible printed circuit board FA to the board manufacturing jig 10 can be easily performed.
  • the second jig 30 is provided with a sleeve 33 at a position where the movable pin 25 is inserted and is coaxial with the insertion hole 211. Therefore, the movable pin 25 can be easily inserted into the insertion hole 211.
  • the movable pin 25 is inserted into the insertion hole 211 efficiently by inserting the movable pin 25 into the sleeve 33. Can do.
  • the tip fixing member 23 is provided with a tip receiving portion 23a and a latch pin 23b. Therefore, the position of one end side (X2 side; starting point side) of the flexible printed circuit board FA can be easily and reliably determined. Thereby, it is possible to more reliably prevent the displacement from occurring at the starting point side of the flexible printed circuit board FA, and the molded shape of the flexible printed circuit board FA can be further stabilized.
  • the substrate manufacturing apparatus 100 is provided with a tip holding mechanism 180 having a tip clamping member 181 and an air cylinder 182. For this reason, by driving the tip clamping member 181 with the air cylinder 182 with respect to the tip fixing member 23, one end side (X2 side) of the flexible printed circuit board FA can be securely clamped. Thereby, the position of one end side (X2 side; starting point side) can be determined more reliably. Accordingly, it is possible to more reliably prevent the displacement from occurring on the starting point side of the flexible printed circuit board FA, and the molded shape of the flexible printed circuit board FA can be further stabilized.
  • the substrate manufacturing jig 10 is given a driving force for sliding by the slide motor 131 of the jig slider 130. Therefore, when the flexible printed board FA is hung around the fixed pin 24 or the movable pin 25, the board manufacturing jig 10 can be moved to a desired position. Setting to the (first jig 20) can be easily performed.
  • the substrate manufacturing apparatus 100 is provided with a torque roller contact / separation mechanism 150, a free roller contact / separation mechanism 160, and a roller drive mechanism 170. Therefore, the free roller 161 can be raised or lowered by the air cylinder 162 while the torque is applied to the flexible printed circuit board FA by the roller driving mechanism 170 to give the tension. Accordingly, it is possible to automatically perform the operation of hanging the flexible printed circuit board FA around the fixed pin 24 or the movable pin 25. At this time, by moving the substrate manufacturing jig 10 by the jig slider 130, the movable pin 25 can be easily inserted into a position corresponding to the bent portion FB1.
  • the substrate manufacturing apparatus 100 is provided with a side surface pressing mechanism 190 having a side surface pressing member 191. Then, by operating the air cylinder 192 and pressing the side pressing member 191 against the side surface of the flexible printed circuit board FA, the skew direction of the flexible printed circuit board FA can be adjusted easily and reliably.
  • the flexible printed circuit board FA is formed by heating using the fixed pin 24 and the movable pin 25 having a specific diameter.
  • the heat forming of the flexible printed circuit board FA may be performed by combining the fixed pin 24 and the movable pin 25 having different diameters.
  • FIG. 32 is a diagram showing such a state.
  • the portion using the small-diameter fixed pin 24 and the movable pin 25 and the configuration using the large-diameter fixed pin 24 and the movable pin 25 are combined.
  • the pitch of the curved portion of the flexible printed circuit board FA (the pitch of the portion that becomes the bent portion FB1) is narrow, and the large-diameter fixed pin 24 is.
  • the pitch of the curved portion of the flexible printed circuit board FA (the pitch of the portion that becomes the bent portion FB1) is wide.
  • the flexible printed circuit board FB by freely combining the curvature of the bent portion FB1 and the pitch of the portion between the bent portions FB1.
  • a molded part having a small diameter and a narrow pitch in the flexible printed circuit board FB is suitable for a place where expansion and contraction is required in a place where the arrangement space is narrow.
  • a molded part having a large diameter and a wide pitch is suitable for a place having a large installation space and a large amount of expansion and contraction.
  • the flexible printed circuit board FB having various pitches can be handled integrally including a region where there is no part to be thermoformed, a connecting portion for connecting the flexible printed circuit boards FB having different pitches becomes unnecessary.
  • FIG. 33 shows such a substrate manufacturing jig 10B.
  • the cutout portions located on one end side and the other end side of a plurality (three in FIG. 33) of flexible printed circuit boards FA are connected to each other to form one long cutout portion F4B.
  • the flexible printed circuit boards FA may be independent from each other without being connected to each other.
  • a plurality of (three in FIG. 33) hole portions F5 are provided in the cut-off portion F4B on one end side (X2 side).
  • the tip fixing member 23 is provided with a plurality of (three in FIG. 33) latching pins 23b. In this case, it is necessary to increase the lengths of the fixed pin 24 and the movable pin 25, and it is also necessary to increase the strokes of the air cylinder 141 and the widths of the torque roller 151 and the free roller 161.
  • substrate manufacture is good also as what is comprised only from the 1st jig
  • the tip fixing member 23 exists, and only a plurality of fixing pins 24 may exist as support members, and conversely, only a plurality of fixing pins 24 exist. Also good.
  • second jig 31 ... main body portion, 32 ... convex portion, 33 ... sleeve, 100 ... substrate Manufacturing apparatus, 110 ... control unit, 120 ... jig clamping mechanism, 121 ... clamping member, 130 ... jig slider, 131 ... slide motor (corresponding to the second driving means), 132 ... belt, 140 ... pin pushing mechanism, 141 , 152, 162, 192 ... Air 150, torque roller contact / separation mechanism, 151 ... torque roller, 151a ... drive roller, 151b ... driven roller, 160 ... free roller contact / separation mechanism, 161 ... free roller, 161a, 161b ... driven roller, 170 ... roller drive mechanism , 171 ...
  • Driving motor 180 ... Tip holding mechanism, 181 ... Tip clamping member, 181a ... Tip side contact portion, 181b ... Top surface contact portion, 182 ... Air cylinder (corresponding to the first drive means), 190 ... Side push This mechanism, 191 ... side pressing member, 191a ... side contact part, 200 ... rear end holding member, 211 (211a to 211i) ... insertion hole, 212 ... straight hole, 213 ... taper hole, 251 ... pin part, 252 ... Gutter, 300 ... Jig with blade, 301 ... Blade, 400 ... Fixing jig, 401 ... Guide pin, 401 ... Jig housing, 402 ... Guide pin , 403 ...

Abstract

To make it possible to specify a starting position of flexible printed wiring board formation and/or to stabilize a formation shape and/or to have excellent workability in manufacture and/or to reduce thermal capacity. Disclosed is a flexible printed board (FB) manufacturing method for forming a flexible printed board (FA) using a board manufacturing jig (10), said flexible printed board having a curved section (FB1). The method is provided with: a first holding step wherein one side of the flexible printed board (FA) is held by means of a first holding means (23); a hooking around step wherein, after the first holding step, the flexible printed board (FA) is supported by means of a plurality of supporting members (24, 25) in a state wherein the flexible printed board is hooked around the supporting members; a second holding step wherein, after the hooking around step, the other side of the flexible printed board (FA) is held by means of a second holding means (26), and a state wherein tension is applied to the flexible printed board (FA) is maintained; and a thermoforming step wherein the flexible printed board (FA) is thermoformed in a state wherein the holding state is maintained.

Description

フレキシブルプリント基板の製造方法、基板製造用治具および基板製造装置Flexible printed board manufacturing method, board manufacturing jig, and board manufacturing apparatus
 本発明は、フレキシブルプリント基板の製造方法、基板製造用治具および基板製造装置に関する。 The present invention relates to a flexible printed circuit board manufacturing method, a board manufacturing jig, and a board manufacturing apparatus.
 近年、多彩な動きをするロボットが登場する等、ロボットの発展が著しくなっている。また、人体や衣服に装着可能なウエアラブル電子機器も、様々な機器で開発、実用化が進んできている。これらのロボットやウエアラブル電子機器には、電力供給用や電気信号伝送用の電線が多数使用されているが、一般的に電線は銅線を芯とし、その外周を絶縁体で被覆した構造になっているため、電線自体に伸縮性はほとんどない。このため、たとえばロボット等においては、その関節の動き等を妨げないように、電線長に余裕を持たせる必要があり、このことが小型、軽量化等に向けた設計上、実用上の支障となる。 In recent years, the development of robots has become remarkable, such as the appearance of robots with various movements. In addition, wearable electronic devices that can be worn on the human body and clothes have been developed and put into practical use with various devices. These robots and wearable electronic devices use a large number of electric wires for power supply and electric signal transmission. Generally, the electric wires have a structure in which a copper wire is the core and the outer periphery is covered with an insulator. Therefore, there is almost no elasticity in the electric wire itself. For this reason, for example, in a robot or the like, it is necessary to allow a sufficient wire length so as not to hinder the movement of the joints, and this is a practical problem in designing for miniaturization and weight reduction. Become.
 特に、最先端のヒューマノイド型ロボットや、人体に装着して筋力を補助するパワーアシスト装置等の用途においては、多自由度関節を経由して末端のモータを動かすための電線や、末端に配置された各種センサーからの電気信号を伝送するための電線が多数配線されている。そして、多自由度関節におけるこれらの配線の自由度を高めるために、伸縮可能に構成された電線に対する要求が高まっている。 Especially in applications such as state-of-the-art humanoid robots and power assist devices that are attached to the human body to assist muscular strength, electric wires for moving the end motor via a multi-degree-of-freedom joint, Many wires for transmitting electrical signals from various sensors are wired. And in order to raise the freedom degree of these wiring in a multi-degree-of-freedom joint, the request | requirement with respect to the electric wire comprised so that expansion-contraction is possible is increasing.
 一方、近年、産業用ロボットとしてアームロボットが多く使用されている。この種のアームロボットでは、ロボットアームの先端側に取り付けられているエンドエフェクタ(人体で言うところの手に相当)やロボットアームの関節部の駆動方式によっては、ロボットアームの根本側から先端側へかけて、電気ケーブル以外に、空圧印加用のエアホースや油圧ホースを配線する必要が生じることがある。かかるケーブルやホース類を関節部に配線した場合、ケーブルの折れ曲がりや断線を生じるおそれがある。そのため、ケーブルやホース類をロボットアーム類の関節部よりも基端寄りの位置で一旦外側に出し、関節部の外側空間にケーブルを配置し、関節部よりも先端寄りとなる位置で再びアーム内に導入するといった配線手法が採用されている。しかしながら、ロボットアームの外側空間にケーブルを配置する手法では、ロボットアームの関節部周囲にケーブルを弛ませるための空間が必要になる。 On the other hand, in recent years, arm robots are often used as industrial robots. In this type of arm robot, depending on the end effector attached to the tip side of the robot arm (equivalent to a hand in the human body) or the driving method of the joint part of the robot arm, from the base side to the tip side of the robot arm In addition to the electric cable, it may be necessary to wire an air hose or a hydraulic hose for applying air pressure. When such cables and hoses are wired to the joints, the cables may be bent or disconnected. For this reason, the cables and hoses are temporarily extended outward at positions closer to the base end than the joints of the robot arms, and the cables are arranged in the outer space of the joints, and again inside the arm at positions closer to the tip than the joints. A wiring method such as introduction into the network is adopted. However, in the method of arranging the cable in the outer space of the robot arm, a space for loosening the cable is required around the joint portion of the robot arm.
 また、たとえば特許文献1には、ロボットアームの関節部における関節回転中心位置に支持棒を設け、その支持棒にケーブルを巻回し、そのケーブルが予め巻かれた支持棒をロボットアームの内部に収納することで、ケーブルの折れ曲がりや断線を防止する構造が開示されている。しかしながら、支持棒を別途設けることによる重量増加による機能低下(動作速度・精度等)が生じるおそれがある。その機能低下を補うためにスペックの高いモーター等を用いたり、必要部材が増える場合もあるが、その場合には、製造コストが増加してしまう。さらにはケーブルの収納部の構造が複雑になるため、ロボットアーム組み立て時のケーブルの配線、メンテナンス等で分解し、ケーブルを取り出し、交換する際に非常に煩雑になるという問題がある。このことから、ロボットアームにおいても、このような問題を回避できる伸縮可能な電気伝送部材に対する要求が高まっている。 Further, for example, in Patent Document 1, a support rod is provided at the joint rotation center position in the joint portion of the robot arm, a cable is wound around the support rod, and the support rod on which the cable is wound is stored in the robot arm. Thus, a structure that prevents the cable from being bent or disconnected is disclosed. However, there is a possibility that functional deterioration (operation speed, accuracy, etc.) due to weight increase due to the separate provision of the support rod may occur. In some cases, a high-spec motor or the like is used in order to compensate for the deterioration of the function or the number of necessary members increases. In this case, the manufacturing cost increases. Furthermore, since the structure of the cable storage portion becomes complicated, there is a problem that it becomes very complicated when the cable is taken out and replaced when it is disassembled during wiring and maintenance of the robot arm during assembly. For this reason, even in the robot arm, there is an increasing demand for a telescopic electric transmission member that can avoid such a problem.
 そのような電気伝送部材に対する要求に対応するものとしては、たとえば特許文献2および特許文献3に開示の技術がある。かかる特許文献2、3には、湾曲形状部を交互に配置した、いわゆるプリーツ状に成形加工した伸縮可能なフレキシブルプリント配線板および成形方法が開示されている。特許文献2、3に開示の伸縮可能なフレキシブルプリント配線板はLCP(Liquid Crystal Polymer)等の熱可塑性樹脂を用いており、樹脂の軟化温度よりも数十℃~100℃程度低い温度で30分から60分程度加熱することで、成形型と略同形状に成形している。 For example, Patent Document 2 and Patent Document 3 disclose techniques that meet the demand for such an electric transmission member. Patent Documents 2 and 3 disclose a flexible printed wiring board that can be stretched and formed into a so-called pleated shape in which curved portions are alternately arranged, and a forming method. The stretchable flexible printed wiring board disclosed in Patent Documents 2 and 3 uses a thermoplastic resin such as LCP (Liquid Crystal Polymer), and is 30 minutes lower than the softening temperature of the resin by several tens of degrees Celsius to 100 degrees Celsius. By heating for about 60 minutes, it is molded in substantially the same shape as the mold.
 ここで、特許文献2には、金型内部に先端に所望のRが形成された板をフレキシブルプリント配線板が通せる間隔で複数個所配置し、一定テンションを加えながら金型内部にフレキシブルプリント配線板を通すことで、加熱成形する方法が記載されている。 Here, in Patent Document 2, a plurality of boards having a desired R formed at the tip inside the mold are arranged at intervals at which the flexible printed wiring board can pass, and the flexible printed wiring is placed inside the mold while applying a certain tension. A method of thermoforming by passing a plate is described.
 また、特許文献3には、治具に所望のRで形成されたピンをフレキシブルプリント配線板が通せる間隔で複数本配置し、その治具へ一定テンションを加えながらフレキシブルプリント配線板を通すことで、加熱成形する方法が記載されている。 Further, in Patent Document 3, a plurality of pins formed with a desired R in a jig are arranged at intervals at which the flexible printed wiring board can pass, and the flexible printed wiring board is passed through the jig while applying a certain tension. And a method of thermoforming is described.
特開平8-57792号公報Japanese Patent Laid-Open No. 8-57772 特開2011-134884号公報(図2、段落0044等)JP 2011-134484 A (FIG. 2, paragraph 0044, etc.) 特開2011-233822号公報(図4、段落0049等)Japanese Patent Laying-Open No. 2011-233822 (FIG. 4, paragraph 0049, etc.)
 ところで、特許文献2に開示の方法では、金型に接触している面積が大きいので、フレキシブルプリント配線板と金型間での摩擦が大きくなり、一定テンションでの引っ張りは困難となる。そのため、成形形状の安定化が難しい。また、フレキシブルプリント配線板を金型から取り外す際にも、上述の摩擦の大きさが作業性を悪化させてしまう。また、フレキシブルプリント配線板の成形が必要な部位に対し、不要な個所にも金型の板があるため、熱容量が大きくなる。したがって、成形に必要な温度まで上昇させることが困難である。 By the way, in the method disclosed in Patent Document 2, since the area in contact with the mold is large, the friction between the flexible printed wiring board and the mold is increased, and it is difficult to pull at a constant tension. Therefore, it is difficult to stabilize the molded shape. Moreover, when removing a flexible printed wiring board from a metal mold | die, the magnitude | size of the above-mentioned friction will deteriorate workability | operativity. In addition, the heat capacity is increased because there is a mold plate at an unnecessary portion with respect to a portion where the flexible printed wiring board needs to be molded. Therefore, it is difficult to raise the temperature required for molding.
 また、特許文献3に開示の方法では、特許文献2に開示の板状の金型を用いる場合よりは治具をセットする際の作業性は改善され、しかも摩擦の影響は少ない。しかしながら、この方法においても、フレキシブルプリント配線板と治具間での摩擦が大きく、一定テンションでの引っ張りは困難であり、それゆえ成形形状の安定化が難しい。これはピンの数が増えたり、異なるRのピンが配置された場合に、太いピンのほうが相対的に摩擦が大きくなるため、より顕著になる。さらに、固定されたピンの間にフレキシブルプリント配線板を通していくこと自体が煩雑であり、ピン間が狭く、ピン数が多い治具に対しては、非常に作業性が悪い。 Further, in the method disclosed in Patent Document 3, the workability when setting a jig is improved and the influence of friction is less than that in the case of using the plate-shaped mold disclosed in Patent Document 2. However, even in this method, the friction between the flexible printed wiring board and the jig is large, and it is difficult to pull with a constant tension. Therefore, it is difficult to stabilize the molded shape. This is more noticeable when the number of pins increases or when different R pins are arranged, since the thicker pins have relatively higher friction. Furthermore, passing the flexible printed wiring board between the fixed pins is complicated, and the workability is very poor for a jig having a narrow space between pins and a large number of pins.
 また、特許文献2と特許文献3の方法両者に共通する欠点として、上述の作業性が悪いことの他に、フレキシブルプリント配線板の成形開始位置を金型、治具へのセット時に規定できない。そのため、成形箇所の形状はある程度、設計値に近づけることできても、全体の製品としての形状が安定しないという欠点がある。 Moreover, as a defect common to both the methods of Patent Document 2 and Patent Document 3, in addition to the above-described poor workability, the molding start position of the flexible printed wiring board cannot be defined when set to the mold or jig. Therefore, even if the shape of the molding part can be brought close to the design value to some extent, there is a drawback that the shape as a whole product is not stable.
 本発明は上記の事情にもとづきなされたもので、その目的とするところは、フレキシブルプリント配線板の成形開始位置を規定できること、成形形状を安定化させること、製造における作業性を良好にすること、および熱容量を小さくすることのうち、少なくとも1つを達成することが可能なフレキシブルプリント基板の製造方法、基板製造用治具および基板製造装置を提供することを目的とする。 The present invention has been made based on the above circumstances, and its purpose is to be able to define the molding start position of the flexible printed wiring board, to stabilize the molding shape, to improve the workability in production, An object of the present invention is to provide a flexible printed board manufacturing method, a board manufacturing jig, and a board manufacturing apparatus capable of achieving at least one of reducing the heat capacity.
 上記課題を解決するために、本発明の第1の観点によると、配線層と、この配線層を両側から覆うと共に熱可塑性樹脂を材質とする絶縁層とを有するフレキシブルプリント基板であって、複数個所に曲成部を有するフレキシブルプリント基板を基板製造用治具を用いて形成するフレキシブルプリント基板の製造方法であって、基板製造用治具のうちフレキシブルプリント基板の一方側を保持する第1保持手段に当該フレキシブルプリント基板の一方側を保持させる第1保持工程と、第1保持工程の後に、基板製造用治具のうちフレキシブルプリント基板を湾曲させて曲成部を形成するための複数の支持部材に当該フレキシブルプリント基板を掛け回す状態で支持させる掛け回し工程と、掛け回し工程の後に、基板製造用治具のうちフレキシブルプリント基板の他方側を保持する第2保持手段に当該フレキシブルプリント基板の他方側を保持させてフレキシブルプリント基板にテンションを付与した状態を維持する第2保持工程と、基板製造用治具の少なくとも一部にフレキシブルプリント基板の保持状態が維持された状態で、フレキシブルプリント基板を加熱成形する加熱成形工程と、を備えることを特徴とするフレキシブルプリント基板の製造方法が提供される。 In order to solve the above-mentioned problem, according to a first aspect of the present invention, there is provided a flexible printed circuit board having a wiring layer and an insulating layer that covers the wiring layer from both sides and is made of a thermoplastic resin. A flexible printed circuit board manufacturing method for forming a flexible printed circuit board having a bent portion at a location by using a substrate manufacturing jig, wherein the first holding unit holds one side of the flexible printed circuit board among the substrate manufacturing jig. A first holding step for holding means on one side of the flexible printed circuit board, and a plurality of supports for forming the bent portion by bending the flexible printed circuit board in the substrate manufacturing jig after the first holding step. A wrapping process for supporting the flexible printed circuit board on the member in a state of wrapping, and after the wrapping process, A second holding step for holding the other side of the flexible printed circuit board by the second holding means for holding the other side of the printed circuit board and maintaining the tension applied to the flexible printed circuit board, and at least a jig for manufacturing the substrate There is provided a method for manufacturing a flexible printed circuit board, comprising: a thermoforming process for thermoforming the flexible printed circuit board in a state where the holding state of the flexible printed circuit board is partially maintained.
 また、本発明の他の側面は、上述の発明において、基板製造用治具は、第1治具と、第2治具とを有し、第2治具に対して第1治具が着脱可能に設けられていて、第1治具には、第1保持手段を構成する先端固定部材と、複数の支持部材と、第2保持手段を構成する終端固定部材とが設けられていて、第1保持工程では、先端固定部材を用いてフレキシブルプリント基板の一方側を保持させ、第2保持工程では、終端固定部材を用いてフレキシブルプリント基板の他方側を保持させる、ことが好ましい。 According to another aspect of the present invention, in the above-described invention, the substrate manufacturing jig includes a first jig and a second jig, and the first jig is attached to and detached from the second jig. The first jig is provided with a tip fixing member that constitutes the first holding means, a plurality of support members, and a terminal fixing member that constitutes the second holding means. In the first holding step, it is preferable to hold one side of the flexible printed circuit board using the tip fixing member, and in the second holding step, the other side of the flexible printed circuit board is held using the terminal fixing member.
 さらに、本発明の他の側面は、上述の発明において、先端固定部材は、フレキシブルプリント基板の一端側と面状に接触する先端受部と、先端受部から離間する方向に突出する掛止ピンとを備え、第1保持工程では、フレキシブルプリント基板の一端側に形成された孔部に掛止ピンを挿通させる、ことが好ましい。 Further, according to another aspect of the present invention, in the above-described invention, the tip fixing member includes a tip receiving portion that is in planar contact with one end of the flexible printed circuit board, and a latch pin that protrudes in a direction away from the tip receiving portion. In the first holding step, it is preferable that the latch pin is inserted through a hole formed on one end side of the flexible printed circuit board.
 また、本発明の他の側面は、上述の発明において、先端固定部材と共にフレキシブルプリント基板の一端側を挟持する先端保持機構が設けられていて、先端保持機構は、先端固定部材に対して接離する先端挟持部材と、先端挟持部材を移動させる第1駆動手段とを有している、ことが好ましい。 According to another aspect of the present invention, in the above-described invention, a tip holding mechanism that clamps one end side of the flexible printed circuit board together with the tip fixing member is provided, and the tip holding mechanism is in contact with and separated from the tip fixing member. It is preferable that the front end clamping member to be moved and a first driving means for moving the front end clamping member.
 さらに、本発明の他の側面は、上述の発明において、支持部材は、第1治具を貫通する差込孔に差し込まれる可動ピンを備え、差込孔に可動ピンを差し込み、その差し込む側とは反対側から可動ピンを突出させることによりフレキシブルプリント基板を掛け回すことを可能としていると共に、第2治具には、可動ピンの差し込みをガイドする貫通孔が形成されている、ことが好ましい。 Further, according to another aspect of the present invention, in the above-described invention, the support member includes a movable pin inserted into an insertion hole penetrating the first jig, the movable pin is inserted into the insertion hole, and the insertion side is provided. It is possible to hang a flexible printed circuit board by projecting a movable pin from the opposite side, and it is preferable that a through hole for guiding insertion of the movable pin is formed in the second jig.
 また、本発明の他の側面は、上述の発明において、基板製造用治具は、治具スライダによってスライド可能に設けられていて、治具スライダには、当該スライドのための駆動力を与える第2駆動手段が設けられている、ことが好ましい。 According to another aspect of the present invention, in the above-described invention, the substrate manufacturing jig is slidably provided by a jig slider, and the jig slider is provided with a driving force for the slide. Two drive means are preferably provided.
 さらに、本発明の他の側面は、上述の発明において、掛け回し工程では、開閉可能な一対のローラを備えるトルクローラと、同じく開閉可能な一対のローラを備える共にトルクローラよりも第1保持手段側に位置するフリーローラとでフレキシブルプリント基板を挟持すると共に、トルクローラを構成する一対のローラの少なくとも一方には、ローラ駆動機構によって駆動力が与えられ、この駆動力によってフレキシブルプリント基板にテンションが及ぼされると共に、フレキシブルプリント基板の挟持状態において、フレキシブルプリント基板の搬送方向に対して交差する方向にフリーローラを移動させつつ基板製造用治具を搬送方向に移動させて、可動ピンが成形後の曲成部の内周側に配置される位置に基板製造用治具を移動させ、その移動の後に可動ピンを差込孔に差し込む、ことが好ましい。 Furthermore, in another aspect of the present invention, in the above-described invention, in the winding process, a torque roller including a pair of openable and closable rollers and a pair of rollers that can also be opened and closed are both first holding means than the torque roller. The flexible printed circuit board is sandwiched by the free rollers located on the side, and at least one of the pair of rollers constituting the torque roller is given a driving force by a roller driving mechanism, and the driving force applies tension to the flexible printed circuit board. In addition, when the flexible printed circuit board is sandwiched, the substrate manufacturing jig is moved in the transport direction while moving the free roller in the direction intersecting the transport direction of the flexible printed circuit board, Move the board manufacturing jig to the position where it is located on the inner circumference side of the bent section, and Insert the movable pin into the insertion hole after the movement, it is preferable.
 また、本発明の他の側面は、上述の発明において、第1保持工程の後であって掛け回し工程の前に、フレキシブルプリント基板の側面に側面押当部材を押し当てることで、当該フレキシブルプリント基板のスキュー方向の調整を行うスキュー調整工程を備える、ことが好ましい。 According to another aspect of the present invention, in the above-described invention, the side surface pressing member is pressed against the side surface of the flexible printed circuit board after the first holding step and before the winding step. It is preferable to include a skew adjustment process for adjusting the skew direction of the substrate.
 また、本発明の第2の観点によると、配線層と、この配線層を両側から覆うと共に熱可塑性樹脂を材質とする絶縁層とを有すると共に、複数個所に曲成部を有するフレキシブルプリント基板を形成するための基板製造用治具であって、フレキシブルプリント基板の一方側を保持する第1保持手段と、フレキシブルプリント基板を掛け回す状態で湾曲させて曲成部を形成するための複数の支持部材と、フレキシブルプリント基板の他方側を保持してフレキシブルプリント基板にテンションを付与した状態を維持する第2保持手段と、を備えることを特徴とする基板製造用治具が提供される。 According to a second aspect of the present invention, there is provided a flexible printed circuit board having a wiring layer, an insulating layer that covers the wiring layer from both sides and is made of a thermoplastic resin, and has bent portions at a plurality of locations. A substrate manufacturing jig for forming a first holding means for holding one side of a flexible printed circuit board, and a plurality of supports for bending the flexible printed circuit board to form a bent portion There is provided a jig for manufacturing a board, comprising: a member; and a second holding means for holding the other side of the flexible printed board and maintaining a state in which a tension is applied to the flexible printed board.
 また、本発明の第3の観点によると、配線層と、この配線層を両側から覆うと共に熱可塑性樹脂を材質とする絶縁層とを有すると共に、複数個所に曲成部を有するフレキシブルプリント基板を形成するための基板製造装置であって、開閉可能であると共にフレキシブルプリント基板の接離方向に移動可能な一対のローラから構成されるトルクローラを有するトルクローラ接離機構と、開閉可能であると共にフレキシブルプリント基板の接離方向に移動可能な一対のローラから構成されるフリーローラを有するフリーローラ接離機構と、トルクローラを構成する一対のローラの少なくとも一方に駆動力を与え、この駆動力によってフレキシブルプリント基板にテンションを及ぼすローラ駆動機構と、基板製造用治具をフレキシブルプリント基板の搬送方向に移動させる治具スライダと、フレキシブルプリント基板を保持するための基板製造用治具のうち、フレキシブルプリント基板の一方側を第1保持手段に保持させた後に、フリーローラ接離機構をフレキシブルプリント基板の搬送方向に対して交差する方向に移動させつつ治具スライダによって基板製造用治具を移動させ、さらに可動ピンが成形後の曲成部の内周側に配置される位置に基板製造用治具を移動させる制御を行う制御部と、を備えることを特徴とする基板製造装置が提供される。 According to a third aspect of the present invention, there is provided a flexible printed circuit board having a wiring layer, an insulating layer that covers the wiring layer from both sides and is made of a thermoplastic resin, and has bent portions at a plurality of locations. A substrate manufacturing apparatus for forming a torque roller contacting / separating mechanism having a torque roller that is configured to include a pair of rollers that can be opened and closed and moved in the contact and separation direction of the flexible printed circuit board, and can be opened and closed A driving force is applied to at least one of a pair of rollers constituting a torque roller and a free roller contacting / separating mechanism having a free roller composed of a pair of rollers movable in the contact / separation direction of the flexible printed circuit board. A roller drive mechanism that applies tension to the flexible printed circuit board and a substrate manufacturing jig Among the jig slider for moving in the transport direction and the board manufacturing jig for holding the flexible printed circuit board, after holding one side of the flexible printed circuit board on the first holding means, The substrate manufacturing jig is moved by the jig slider while moving in the direction intersecting the conveyance direction of the flexible printed circuit board, and the substrate is further moved to the position where the movable pin is arranged on the inner peripheral side of the bent portion after molding. There is provided a substrate manufacturing apparatus comprising a control unit that performs control to move a manufacturing jig.
 本発明によると、フレキシブルプリント配線板の成形開始位置を規定できること、成形形状を安定化させること、製造における作業性を良好にすること、および熱容量を小さくすることのうち、少なくとも1つを達成することが可能となる。 According to the present invention, at least one of achieving the molding start position of the flexible printed wiring board, stabilizing the molding shape, improving the workability in manufacturing, and reducing the heat capacity is achieved. It becomes possible.
本発明の一実施の形態に係るフレキシブルプリント基板の構成の一例を示す正面断面図である。It is front sectional drawing which shows an example of a structure of the flexible printed circuit board concerning one embodiment of this invention. フレキシブルプリント基板の側面形状を示す図であり、(A)は成形前のフレキシブルプリント基板を示し、(B)は成形後のフレキシブルプリント基板を示す図である。It is a figure which shows the side shape of a flexible printed circuit board, (A) shows the flexible printed circuit board before shaping | molding, (B) is a figure which shows the flexible printed circuit board after shaping | molding. フレキシブルプリント基板をセットする前の基板製造用治具の構成を示す側面図である。It is a side view which shows the structure of the jig | tool for board | substrate manufacture before setting a flexible printed circuit board. フレキシブルプリント基板をセットする前の基板製造用治具の構成を示す平面図である。It is a top view which shows the structure of the jig | tool for board | substrate manufacture before setting a flexible printed circuit board. フレキシブルプリント基板をセットする前の基板製造用治具の構成を示す正面図である。It is a front view which shows the structure of the jig | tool for board | substrate manufacture before setting a flexible printed circuit board. フレキシブルプリント基板の先端側の形状を示す平面図である。It is a top view which shows the shape of the front end side of a flexible printed circuit board. 可動ピンの形状を示す側面図である。It is a side view which shows the shape of a movable pin. 第1治具の差込孔の形状の変形例を示す側断面図である。It is a sectional side view which shows the modification of the shape of the insertion hole of a 1st jig | tool. 基板製造装置の概略構成を示すブロック図である。It is a block diagram which shows schematic structure of a board | substrate manufacturing apparatus. 第1工程に係り、基板製造用治具および基板製造装置においてフレキシブルプリント基板をセットする前の準備を行う様子を示す側面図である。It is a side view which shows a mode that it concerns on a 1st process and prepares before setting a flexible printed circuit board in the jig | tool for board | substrate manufacture, and a board | substrate manufacturing apparatus. 第1工程に係り、基板製造用治具および基板製造装置においてフレキシブルプリント基板をセットする前の準備を行う様子を示す平面図である。It is a top view which shows a mode that it concerns on a 1st process and prepares before setting a flexible printed circuit board in the jig | tool for board | substrate manufacture, and a board | substrate manufacturing apparatus. 第2工程に係り、基板製造用治具および基板製造装置において、フレキシブルプリント基板を第1治具に取り付ける様子を示す側面図である。It is a side view which shows a mode that it concerns on a 2nd process and a flexible printed circuit board is attached to a 1st jig | tool in the jig | tool for board | substrate manufacture, and a board | substrate manufacturing apparatus. 第2工程に係り、基板製造用治具および基板製造装置において、フレキシブルプリント基板を第1治具に取り付ける様子を示す平面図である。It is a top view which shows a mode that it concerns on a 2nd process and a flexible printed circuit board is attached to a 1st jig | tool in the jig | tool for board | substrate manufacture, and a board | substrate manufacturing apparatus. 第3工程に係り、フレキシブルプリント基板をトルクローラおよびフリーローラで挟持してフレキシブルプリント基板の引っ張りを開始した様子を示す側面図である。It is a side view which shows a mode that it was related with the 3rd process and the flexible printed circuit board was clamped with the torque roller and the free roller, and the pulling of the flexible printed circuit board was started. 第3工程に係り、フレキシブルプリント基板をトルクローラおよびフリーローラで挟持してフレキシブルプリント基板の引っ張りを開始した様子を示す平面図である。It is a top view which shows a mode that it was related with the 3rd process and the flexible printed circuit board was clamped with the torque roller and the free roller, and the pulling of the flexible printed circuit board was started. 第4工程に係り、フリーローラを下降させて差込孔に可動ピンを差し込んだ状態を示す側面図である。It is a side view which shows the state which concerns on the 4th process and lowered | hung the free roller and inserted the movable pin in the insertion hole. 第4工程に係り、フリーローラを下降させて差込孔に可動ピンを差し込んだ状態を示す平面図である。It is a top view which shows the state which concerns on the 4th process and lowered | hung the free roller and inserted the movable pin in the insertion hole. 第5工程に係り、フリーローラを上昇させて次の差込孔に可動ピンを差し込んだ状態を示す側面図である。It is a side view which shows the state which concerns on the 5th process and raised the free roller and inserted the movable pin in the following insertion hole. 第5工程に係り、フリーローラを上昇させて次の差込孔に可動ピンを差し込んだ状態を示す平面図である。It is a top view which shows the state which concerns on the 5th process and raised the free roller and inserted the movable pin in the following insertion hole. 第7工程に係り、全ての可動ピンにフレキシブルプリント基板が掛け回された状態とした後にフリーローラを開放した状態を示す側面図である。It is a side view which shows the state which opened the free roller after making it into the state by which the flexible printed circuit board was hung around all the movable pins in connection with the 7th process. 第7工程に係り、全ての可動ピンにフレキシブルプリント基板が掛け回された状態とした後にフリーローラを開放した状態を示す平面図である。It is a top view which shows the state which opened the free roller after making it into the state by which the flexible printed circuit board was wound around all the movable pins in connection with the 7th process. 第8工程に係り、後端保持部材でフレキシブルプリント基板の後端側を保持させた後にトルクローラが開放した状態を示す側面図である。It is a side view which shows the state which concerns on the 8th process and the torque roller open | released after holding the rear-end side of a flexible printed circuit board with a rear-end holding member. 第8工程に係り、後端保持部材でフレキシブルプリント基板の後端側を保持させた後にトルクローラが開放した状態を示す平面図である。It is a top view which concerns on an 8th process and shows the state which the torque roller open | released after holding the rear-end side of a flexible printed circuit board with a rear-end holding member. 第9工程に係り、フレキシブルプリント基板の加熱成形のために第2治具から第1治具を取り外した状態を示す平面図である。It is a top view which concerns on the 9th process and shows the state which removed the 1st jig | tool from the 2nd jig | tool for the thermoforming of a flexible printed circuit board. 第9工程に係り、フレキシブルプリント基板の加熱成形のために第2治具から第1治具を取り外した状態を示す正面図である。It is a front view which concerns on a 9th process and shows the state which removed the 1st jig | tool from the 2nd jig | tool for the thermoforming of a flexible printed circuit board. 変形例に係り、第2治具に凹部および抜き板が設けられている構成を示す平面図である。It is a top view which concerns on a modification and shows the structure by which the recessed part and the punching board are provided in the 2nd jig | tool. 変形例に係り、第2治具が第1分割部位と第2分割部位とに分割可能な構成を示す正面図である。It is a front view which shows the structure which concerns on a modification and can divide | segment a 2nd jig | tool into a 1st division part and a 2nd division part. 第10工程に係り、刃付治具および固定治具に成形後のフレキシブルプリント基板をセットした状態を示す側面図である。It is a side view which shows the state which concerns on the 10th process and set the flexible printed circuit board after shaping | molding to the jig | tool with a blade and a fixing jig. 第10工程に係り、固定治具に成形後のフレキシブルプリント基板をセットした状態を示す平面図である。It is a top view which shows the state which concerns on the 10th process and set the flexible printed circuit board after shaping | molding to the fixing jig. 比較例に係る基板製造用治具の構成を示す側面図である。It is a side view which shows the structure of the jig | tool for board | substrate manufacture which concerns on a comparative example. 比較例に係り、フレキシブルプリント基板の成形形状が安定しない例を示す側面図である。It is a side view which shows the example which concerns on a comparative example and the shaping | molding shape of a flexible printed circuit board is not stabilized. 変形例に係り、異なる直径の固定ピンおよび可動ピンを用いると共に異なるピッチのフレキシブルプリント基板を加熱成形するための基板製造用治具を示す側面図である。It is a side view which shows the jig | tool for board | substrate manufacture concerning the modification and using the fixed pin and movable pin of a different diameter, and heat-molding the flexible printed circuit board of a different pitch. 変形例に係り、一度に複数のフレキシブルプリント基板を取り付け可能な基板製造用治具を示す平面図である。It is a top view which shows the jig | tool for board | substrate manufacture which concerns on a modification and can attach a some flexible printed circuit board at once.
 以下、本発明の一実施の形態に係るフレキシブルプリント基板FBの製造方法、基板製造装置100および基板製造用治具10について、以下に説明する。なお、以下の説明においては、フレキシブルプリント基板FBの製造方法を実施するための基板製造用治具10と基板製造装置100について最初に説明し、その後にフレキシブルプリント基板FBの製造方法について説明する。また、以下の説明においては、XYZ直交座標系を用いて説明することがある。そのうち、X方向は基板製造用治具10の長手方向とし、X1側は図3等の右側、X2側は左側とする。また、Z方向は基板製造用治具10の高さ方向とし、Z1側は上側、Z2側は下側とする。また、Y方向はXZ方向に直交する方向であると共に基板製造用治具10の幅方向とし、Y1側は手前側、Y2側は奥側とする。 Hereinafter, the manufacturing method of the flexible printed circuit board FB, the board manufacturing apparatus 100, and the board manufacturing jig 10 according to an embodiment of the present invention will be described below. In the following description, the board manufacturing jig 10 and the board manufacturing apparatus 100 for performing the method for manufacturing the flexible printed circuit board FB will be described first, and then the method for manufacturing the flexible printed circuit board FB will be described. Moreover, in the following description, it may be described using an XYZ orthogonal coordinate system. Among them, the X direction is the longitudinal direction of the substrate manufacturing jig 10, the X1 side is the right side in FIG. 3 and the X2 side is the left side. The Z direction is the height direction of the substrate manufacturing jig 10, the Z1 side is the upper side, and the Z2 side is the lower side. The Y direction is a direction perpendicular to the XZ direction and the width direction of the substrate manufacturing jig 10. The Y1 side is the front side, and the Y2 side is the back side.
<フレキシブルプリント基板について>
 図1は、成形前のフレキシブルプリント基板FA(または成形後のフレキシブルプリント基板FB)の構成の一例を示す正面断面図である。図1に示すように、本実施の形態のフレキシブルプリント基板FA,FBは、絶縁層F1と導電パターンF2と接着層F3を有している。絶縁層F1はLCP(Liquid Crystal Polymer:LCP)等の熱可塑性樹脂を用いている。具体的には、フレキシブルプリント基板FA,FBの表面側および裏面側をLCPの絶縁層F1が覆い、それらの絶縁層F1のうちのいずれかに導電パターンF2が形成され、さらに導電パターンF2を覆うように接着層F3が存在している。そして接着層F3を介して、他の絶縁層F1が接着されている。すなわち、一対の絶縁層F1の間に導電パターンF2(導電層)が挟まれた構成となっている。しかしながら、導電パターンF2(導電層)は1層に限られるものではなく、2層以上設けられていても良いが、その場合には、導電パターンF2(導電層)同士を離間させるための絶縁層が必要となる。
<About flexible printed circuit boards>
FIG. 1 is a front sectional view showing an example of the configuration of a flexible printed circuit board FA (or a molded flexible printed circuit board FB) before molding. As shown in FIG. 1, the flexible printed boards FA and FB of the present embodiment have an insulating layer F1, a conductive pattern F2, and an adhesive layer F3. The insulating layer F1 uses a thermoplastic resin such as LCP (Liquid Crystal Polymer: LCP). Specifically, the front and back sides of the flexible printed boards FA and FB are covered with an insulating layer F1 of LCP, and a conductive pattern F2 is formed on any one of those insulating layers F1, and further covers the conductive pattern F2. Thus, the adhesive layer F3 is present. Then, another insulating layer F1 is bonded via the adhesive layer F3. That is, the conductive pattern F2 (conductive layer) is sandwiched between the pair of insulating layers F1. However, the conductive pattern F2 (conductive layer) is not limited to one layer, and two or more layers may be provided. In that case, an insulating layer for separating the conductive patterns F2 (conductive layer) from each other Is required.
 上記の成形前のフレキシブルプリント基板FAを成形する場合、絶縁層F1を構成する樹脂の軟化温度よりも数十℃~100℃程度低い温度で30分から60分程度加熱することで、成形型と略同形状に成形される。 When the above-described flexible printed circuit board FA is molded, it is heated approximately 30 to 60 minutes at a temperature several tens to 100 ° C. lower than the softening temperature of the resin constituting the insulating layer F1, so that it is substantially the same as the molding die. Molded into the same shape.
 図2は、フレキシブルプリント基板FA,FBの側面形状を示す図であり、(A)は成形前のフレキシブルプリント基板FAを示し、(B)は成形後のフレキシブルプリント基板FBを示す図である。図2(A)に示すように、成形前のフレキシブルプリント基板FAは、曲成部FB1が形成されていない状態となっている。 FIG. 2 is a diagram showing the side shapes of the flexible printed boards FA and FB, (A) showing the flexible printed board FA before molding, and (B) showing the flexible printed board FB after molding. As shown in FIG. 2A, the flexible printed circuit board FA before molding is in a state where the bent portion FB1 is not formed.
 これに対して、成形後のフレキシブルプリント基板FBは、複数の曲成部FB1を有している。この曲成部FB1は、後述する固定ピン24や可動ピン25の外周に倣うようにして形成されている。そのため、その曲成部FB1の曲率も、固定ピン24や可動ピン25に対応するものとなっている。以下、成形前のフレキシブルプリント基板FAから、成形後のフレキシブルプリント基板FBを製造するための基板製造用治具10、基板製造装置100およびフレキシブルプリント基板FBの製造方法について、以下に説明する。 In contrast, the molded flexible printed circuit board FB has a plurality of bent portions FB1. The bent portion FB1 is formed so as to follow the outer periphery of a fixed pin 24 and a movable pin 25 described later. Therefore, the curvature of the bent portion FB 1 also corresponds to the fixed pin 24 and the movable pin 25. Hereinafter, a substrate manufacturing jig 10, a substrate manufacturing apparatus 100, and a manufacturing method of the flexible printed circuit board FB for manufacturing the flexible printed circuit board FB after forming from the flexible printed circuit board FA before forming will be described.
<基板製造用治具10の構成について>
 図3から図5は、フレキシブルプリント基板FAをセットする前の基板製造用治具10の構成を示す図であり、図3は側面図、図4は平面図、図5は正面図である。なお、理解を容易とするために、差込孔211およびスリーブ33に挿通される可動ピン25はハッチング付きで透過的に示されている。図6は、フレキシブルプリント基板FAの先端側の形状を示す平面図である。また、図7は、可動ピン25の形状を示す側面図である。
<About the structure of the substrate manufacturing jig 10>
3 to 5 are views showing the configuration of the substrate manufacturing jig 10 before setting the flexible printed circuit board FA, FIG. 3 is a side view, FIG. 4 is a plan view, and FIG. 5 is a front view. For ease of understanding, the movable pin 25 inserted through the insertion hole 211 and the sleeve 33 is shown transparently with hatching. FIG. 6 is a plan view showing the shape of the front end side of the flexible printed circuit board FA. FIG. 7 is a side view showing the shape of the movable pin 25.
 図4および図5に示すように、基板製造用治具10は、第1治具20と、第2治具30とを有している。第1治具20は、たとえば直方体形状の本体部21を有している。本体部21には、位置決め凹部22が設けられている。位置決め凹部22は、第2治具30の位置決め凸部32(後述)が嵌め込まれる部分であり、それらの嵌合によって第2治具30に対して第2治具30の位置決めがなされる。本実施の形態では、位置決め凹部22は、本体部21の長手方向(X方向)の一端側(X2側)と他端側(X1側)にそれぞれ設けられている。しかしながら、第2治具30に対する第1治具20の位置決めが確実に行われるものであれば、位置決め凹部22を設ける位置および個数は、適宜変更可能である。また、かかる位置決めを行うものであれば、本体部21には位置決め凹部22に代えて位置決め凸部を設け、第2治具30の本体部31に位置決め凹部を設ける構成等、他の構成を採用しても良い。 4 and 5, the substrate manufacturing jig 10 includes a first jig 20 and a second jig 30. The first jig 20 has, for example, a rectangular parallelepiped main body 21. The main body 21 is provided with a positioning recess 22. The positioning recess 22 is a portion into which a positioning protrusion 32 (described later) of the second jig 30 is fitted, and the second jig 30 is positioned with respect to the second jig 30 by the fitting. In the present embodiment, the positioning recess 22 is provided on one end side (X2 side) and the other end side (X1 side) in the longitudinal direction (X direction) of the main body 21. However, as long as the first jig 20 is reliably positioned with respect to the second jig 30, the position and number of the positioning recesses 22 can be changed as appropriate. In addition, as long as such positioning is performed, other configurations such as a configuration in which a positioning convex portion is provided in the main body portion 21 instead of the positioning concave portion 22 and a positioning concave portion is provided in the main body portion 31 of the second jig 30 are adopted. You may do it.
 なお、第1治具20と第2治具30の間の固定を、マグネットを用いて行う構成とすることも可能である。この場合、位置決め凹部22に対して位置決め凸部32を嵌合させると、第2治具30に対して第1治具20が固定される。しかしながら、マグネットによる固定ではなく、機械的なクランプやねじ止め等、その他の固定手段を用いて、第2治具30に対して第1治具20を固定しても良い。 It should be noted that the first jig 20 and the second jig 30 can be fixed using a magnet. In this case, when the positioning protrusion 32 is fitted to the positioning recess 22, the first jig 20 is fixed to the second jig 30. However, the first jig 20 may be fixed to the second jig 30 by using other fixing means such as mechanical clamping and screwing instead of fixing with a magnet.
 この本体部21の長手方向(X方向)の一端側(X2側)には、先端固定部材23が設けられている。先端固定部材23は、第1保持手段に対応している。また、先端固定部材23は、先端受部23aと、掛止ピン23bとを有している。先端受部23aは、平板状に設けられていて、フレキシブルプリント基板FAの先端側の裏面に接触する。また、掛止ピン23bは、たとえば円柱状のピン形状に設けられている。 A tip fixing member 23 is provided on one end side (X2 side) in the longitudinal direction (X direction) of the main body 21. The tip fixing member 23 corresponds to the first holding means. The tip fixing member 23 includes a tip receiving portion 23a and a latch pin 23b. The tip receiving portion 23a is provided in a flat plate shape and contacts the back surface on the tip side of the flexible printed circuit board FA. Moreover, the latch pin 23b is provided, for example in the shape of a cylindrical pin.
 ここで、図6に示すように、フレキシブルプリント基板FAの先端側には、後に切り落とす切り落とし部F4が設けられていて(図6では、後に切り落とすラインである切断ラインF6も示されている)、その切り落とし部F4には、孔部F5が設けられている。そのため、この孔部F5に掛止ピン23bを差し込むことで、フレキシブルプリント基板FAの先端側の位置決めがなされる構成となっている。 Here, as shown in FIG. 6, a cut-off portion F4 to be cut off later is provided on the front end side of the flexible printed circuit board FA (FIG. 6 also shows a cutting line F6 that is a line to be cut off later). The cut-off portion F4 is provided with a hole F5. For this reason, the front end side of the flexible printed circuit board FA is positioned by inserting the latch pin 23b into the hole F5.
 なお、先端固定部材23の構成は、図3から図5に示す構成に限られるものではない。たとえば、掛止ピン23bは、四角柱状を始めとする角柱形状、楕円柱状を始めとする円柱状であっても良く、その他の突起形状であっても良い。また、先端固定部材23は、フレキシブルプリント基板FAの先端側の位置決めを行えるものであれば、フレキシブルプリント基板FAの切り落とし部F4をクランプしたり、切り落とし部F4を吸引保持する構成等、その他の構成であっても良い。 The configuration of the tip fixing member 23 is not limited to the configuration shown in FIGS. For example, the latch pin 23b may have a prismatic shape such as a quadrangular prism shape, a cylindrical shape such as an elliptical prism shape, or other protrusion shape. Further, as long as the distal end fixing member 23 can position the distal end side of the flexible printed circuit board FA, other configurations such as a configuration in which the cut-off portion F4 of the flexible printed circuit board FA is clamped or the cut-off portion F4 is sucked and held. It may be.
 また、図3から図5に示すように、本体部21の一端側(X2側)であって先端固定部材23よりも他端寄り(X1寄り)の部位には、支持部材に対応する固定ピン24が設けられている。固定ピン24は、本体部21に固定されているピン部材であり、後述する可動ピン25とは異なり、本体部21に対して着脱不能に設けられている。ただし、固定ピン24は、本体部21に対して着脱可能としても良い。また、固定ピン24は、本体部21に対して着脱自在とするものの、可動ピン25よりも抜け難い(簡単には可動しない)構成としても良い。 Further, as shown in FIGS. 3 to 5, a fixing pin corresponding to the support member is provided at one end side (X2 side) of the main body portion 21 and closer to the other end side (X1 side) than the tip fixing member 23. 24 is provided. The fixed pin 24 is a pin member that is fixed to the main body 21, and is provided so as to be detachable from the main body 21, unlike the movable pin 25 described later. However, the fixing pin 24 may be detachable from the main body 21. Further, although the fixed pin 24 is detachable from the main body 21, the fixed pin 24 may be configured to be more difficult to be removed (not easily movable) than the movable pin 25.
 また、固定ピン24の湾曲した外周面の曲率は、成形するフレキシブルプリント基板FBの湾曲部分の曲率に対応した曲率となっている。また、固定ピン24の上面は、先端固定部材23の先端受部23aと略面一に設けられている。すなわち、先端受部23aの上面を通ると共に長手方向(X方向)に平行な搬送ラインLは、先端受部23aの上面側に接触する。また、固定ピン24は、本体部21の側面に対して垂直方向に延伸していて、しかも固定ピン24の長さは、フレキシブルプリント基板FAの幅方向(Y方向)の長さよりも長くなるように設けられている。 Further, the curvature of the curved outer peripheral surface of the fixing pin 24 is a curvature corresponding to the curvature of the curved portion of the flexible printed circuit board FB to be molded. Further, the upper surface of the fixing pin 24 is provided substantially flush with the tip receiving portion 23 a of the tip fixing member 23. That is, the conveyance line L passing through the upper surface of the tip receiving portion 23a and parallel to the longitudinal direction (X direction) is in contact with the upper surface side of the tip receiving portion 23a. The fixing pin 24 extends in a direction perpendicular to the side surface of the main body 21 and the length of the fixing pin 24 is longer than the length in the width direction (Y direction) of the flexible printed circuit board FA. Is provided.
 また、本体部21には、複数本の可動ピン25(支持部材に対応)が配置可能となっている。本実施の形態では、可動ピン25は、本体部21に対して着脱自在に設けられている。そのような着脱を可能とするために、本体部21には、差込孔211が設けられている。差込孔211は、本体部21の幅方向(Y方向)を貫通するように設けられている。また、差込孔211は、可動ピン25を差し込むことができるものの、その可動ピン25の差込孔211への差込後に、可動ピン25がガタ付かない程度の公差を有して形成されている。 Further, a plurality of movable pins 25 (corresponding to support members) can be arranged on the main body 21. In the present embodiment, the movable pin 25 is detachably attached to the main body portion 21. In order to enable such attachment and detachment, the main body portion 21 is provided with an insertion hole 211. The insertion hole 211 is provided so as to penetrate the width direction (Y direction) of the main body portion 21. In addition, the insertion hole 211 can be inserted with the movable pin 25, but has a tolerance that the movable pin 25 does not rattle after the insertion of the movable pin 25 into the insertion hole 211. Yes.
 この差込孔211に差し込まれる可動ピン25は、図7に示すように、ピン部251と鍔部252を有している。ピン部251は、同一径のピン形状部分であり、鍔部252はピン部251よりも大径に設けられている部分である。そのため、差込孔211にピン部251の先端側から差し込む場合、鍔部252は差込孔211を通過できず、可動ピン25が第1治具20に係止される。なお、鍔部252が本体部21に接触する場合、ピン部251はフレキシブルプリント基板FAの幅よりも長く本体部21からY1方向に突出する。 The movable pin 25 inserted into the insertion hole 211 has a pin portion 251 and a flange portion 252 as shown in FIG. The pin portion 251 is a pin-shaped portion having the same diameter, and the flange portion 252 is a portion provided with a larger diameter than the pin portion 251. Therefore, when inserting into the insertion hole 211 from the front end side of the pin part 251, the flange part 252 cannot pass through the insertion hole 211, and the movable pin 25 is locked to the first jig 20. In addition, when the collar part 252 contacts the main body part 21, the pin part 251 is longer than the width of the flexible printed circuit board FA and protrudes from the main body part 21 in the Y1 direction.
 また、図3から図5に示す構成では、差込孔211は、幅方向(Y方向)の全体に亘って孔径が同一となるように設けられている。しかしながら、差込孔211の少なくとも一部がテーパ孔等、孔径が同一ではない構成としても良い。たとえば、図8に示すように、差込孔211のうち可動ピン25の差し込みの先端側(Y2側)から後端側(Y1側;第2治具30側)の途中部位までは同一径のストレート孔212とし、その途中部位から後端側(Y2側)に向かうにつれて徐々に孔径が大きくなるテーパ孔213としても良い。また、差込孔211の全体をテーパ孔としても良い。 Further, in the configuration shown in FIGS. 3 to 5, the insertion hole 211 is provided so that the hole diameter is the same throughout the width direction (Y direction). However, at least a part of the insertion hole 211 may be configured such that the hole diameter is not the same, such as a tapered hole. For example, as shown in FIG. 8, the insertion hole 211 has the same diameter from the front end side (Y2 side) of the insertion of the movable pin 25 to the middle part of the rear end side (Y1 side; second jig 30 side). The straight hole 212 may be a tapered hole 213 whose diameter gradually increases from the midway portion toward the rear end side (Y2 side). Further, the entire insertion hole 211 may be a tapered hole.
 以上のような差込孔211は、図3および図4に示す構成では、合計9個設けられている。しかしながら、この差込孔211の個数は、幾つであっても良い。なお、差込孔211は、搬送ラインLを挟んで下方側(Z2側)に位置するものと、上方側(Z1側)に位置するものとが交互に存在している。以下の説明では、必要に応じて、長手方向(X方向)に沿って、最も一端側(X2側)の差込孔211を差込孔211aとし、以後、他端側(X1側)に向かうにつれて順番に差込孔211b~211iとする。なお、固定ピン24の上面側にフレキシブルプリント基板FAが接触する場合、長手方向(X方向)の最も一端側(X2側)の差込孔211(差込孔211a)は、搬送ラインLよりも下方側(Z2側)に位置している。 In the configuration shown in FIGS. 3 and 4, a total of nine insertion holes 211 as described above are provided. However, the number of the insertion holes 211 may be any number. The insertion holes 211 are alternately located on the lower side (Z2 side) with the conveyance line L in between and on the upper side (Z1 side). In the following description, if necessary, the insertion hole 211 on the most end side (X2 side) is referred to as the insertion hole 211a along the longitudinal direction (X direction), and thereafter the other end side (X1 side). Accordingly, the insertion holes 211b to 211i are sequentially set. When the flexible printed circuit board FA is in contact with the upper surface side of the fixing pin 24, the insertion hole 211 (insertion hole 211a) on the most end side (X2 side) in the longitudinal direction (X direction) is more than the transport line L. It is located on the lower side (Z2 side).
 また、以下の説明では、必要に応じて、差込孔211a~211iにそれぞれ差し込まれる可動ピン25を、可動ピン25a~25iと称呼する。 In the following description, the movable pins 25 that are respectively inserted into the insertion holes 211a to 211i are referred to as movable pins 25a to 25i as necessary.
 また、図3から図5に示すように、差込孔211iよりも長手方向(X方向)の他端側(X1側)の部位には、第2保持手段に対応する終端固定部材26が設けられている。終端固定部材26は、後述する後端保持部材200との間でフレキシブルプリント基板FAを挟み込み、そのフレキシブルプリント基板FAの終端側(X1側の端部)を固定する部分である。この終端固定部材26は、先端受部23aと同様な平板状に設けられていて、フレキシブルプリント基板FAの終端側の裏面に接触する。なお、終端固定部材26と共に後端保持部材200も第2保持手段に対応するものとしても良い。 Further, as shown in FIGS. 3 to 5, a terminal fixing member 26 corresponding to the second holding means is provided in a portion on the other end side (X1 side) in the longitudinal direction (X direction) from the insertion hole 211i. It has been. The terminal fixing member 26 is a part that sandwiches the flexible printed circuit board FA with a rear end holding member 200 described later and fixes the terminal side (X1 side end) of the flexible printed circuit board FA. The end fixing member 26 is provided in a flat plate shape similar to the tip receiving portion 23a, and contacts the back surface on the end side of the flexible printed circuit board FA. The rear end holding member 200 together with the end fixing member 26 may correspond to the second holding means.
 なお、図示は省略するが、フレキシブルプリント基板FAの後端側にも、上述の切り落とし部F4と同様の切り落とし部(ただし孔部F5がないものとしても良い)が存在している。また、終端固定部材26の構成は、先端固定部材23と同様に、図3から図5に示す構成に限られるものではなく、その他の構成を採用しても良い。 In addition, although illustration is abbreviate | omitted, the cutout part (however, it is good also as what does not have the hole part F5) similar to the above-mentioned cutout part F4 exists also in the rear-end side of the flexible printed circuit board FA. Further, the configuration of the terminal fixing member 26 is not limited to the configuration shown in FIGS. 3 to 5 as in the tip fixing member 23, and other configurations may be adopted.
 次に、第2治具30について説明する。第2治具30は、基板製造装置100に取り付けられる部材であると共に、第1治具20が取り付けられる部材である(図4および図5参照)。すなわち、第2治具30を介して、第1治具20が基板製造装置100に取り付けられる。そのため、第2治具30は、側面視したときの形状が本体部21と同等の大きさとなる直方体形状の本体部31を有している。 Next, the second jig 30 will be described. The second jig 30 is a member attached to the substrate manufacturing apparatus 100 and a member to which the first jig 20 is attached (see FIGS. 4 and 5). That is, the first jig 20 is attached to the substrate manufacturing apparatus 100 via the second jig 30. Therefore, the second jig 30 has a rectangular parallelepiped main body 31 whose shape when viewed from the side is the same size as the main body 21.
 図4および図5に示すように、本体部31には、位置決め凸部32が設けられている。位置決め凸部32は、上述した位置決め凹部22に差し込まれることで、第2治具30に対する第1治具20の位置決めを行うための部分である。そのため、位置決め凸部32は、位置決め凹部22に対応する位置に設けられている。 As shown in FIGS. 4 and 5, the main body 31 is provided with a positioning convex portion 32. The positioning convex portion 32 is a portion for positioning the first jig 20 with respect to the second jig 30 by being inserted into the positioning concave portion 22 described above. Therefore, the positioning convex portion 32 is provided at a position corresponding to the positioning concave portion 22.
 また、本体部31には、貫通孔であるスリーブ33が設けられている。スリーブ33は、第2治具30に対して第1治具20が固定された場合に、差込孔211と同軸となる位置に設けられている。そのため、スリーブ33は、差込孔211と同数設けられている。ここで、スリーブ33は、差込孔211よりも孔径が大きく設けられている。具体的には、スリーブ33は、鍔部252が挿通可能な程度の孔径に設けられている。そのため、可動ピン25をスリーブ33を差し込むと、その可動ピン25のピン部251がスリーブ33を通過する。そして、可動ピン25の鍔部252がスリーブ33に位置する状態で、ピン部251を差込孔211に位置させることが可能となる。そのため、スリーブ33は、可動ピン25をガイドするガイドとしての機能を有している。 The main body 31 is provided with a sleeve 33 which is a through hole. The sleeve 33 is provided at a position that is coaxial with the insertion hole 211 when the first jig 20 is fixed to the second jig 30. Therefore, the same number of sleeves 33 as the insertion holes 211 are provided. Here, the sleeve 33 is provided with a larger hole diameter than the insertion hole 211. Specifically, the sleeve 33 is provided with a hole diameter such that the flange portion 252 can be inserted. Therefore, when the sleeve 33 is inserted into the movable pin 25, the pin portion 251 of the movable pin 25 passes through the sleeve 33. In addition, the pin portion 251 can be positioned in the insertion hole 211 in a state where the flange portion 252 of the movable pin 25 is positioned on the sleeve 33. Therefore, the sleeve 33 has a function as a guide for guiding the movable pin 25.
<基板製造装置100の構成について>
 続いて、基板製造装置100の構成について以下に説明する。図9は、基板製造装置100の概略構成を示すブロック図である。この図9に示すように、基板製造装置100は、制御部110、治具挟持機構120、治具スライダ130、ピン押し出し機構140、トルクローラ接離機構150、フリーローラ接離機構160、ローラ駆動機構170、先端保持機構180、側面押当機構190を備えている。
<About Configuration of Substrate Manufacturing Apparatus 100>
Next, the configuration of the substrate manufacturing apparatus 100 will be described below. FIG. 9 is a block diagram illustrating a schematic configuration of the substrate manufacturing apparatus 100. As shown in FIG. 9, the substrate manufacturing apparatus 100 includes a control unit 110, a jig clamping mechanism 120, a jig slider 130, a pin pushing mechanism 140, a torque roller contact / separation mechanism 150, a free roller contact / separation mechanism 160, and a roller drive. A mechanism 170, a tip holding mechanism 180, and a side surface pressing mechanism 190 are provided.
 これらのうち、制御部110は、各駆動部位の制御を司る部分であり、たとえばCPU(Central Processing Unit)、ROM(Read Only Memory)やRAM(Random Access Memory)、不揮発性メモリ等のメモリを備え、メモリには各種制御のためのデータやプログラムが記憶されている。 Of these, the control unit 110 is a part that controls each drive part, and includes a memory such as a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), and a nonvolatile memory. The memory stores data and programs for various controls.
 また、治具挟持機構120は、たとえば一対の挟持部材121を有していて、この一対の挟持部材121によって第2治具30を挟持する。かかる治具挟持機構120での第2治具30の挟持により、第2治具30が基板製造装置100に固定される。なお、治具挟持機構120は、手動により挟持する構成としても良く、モータ等の駆動源を用いて自動的に挟持する構成としても良い。 Further, the jig clamping mechanism 120 includes, for example, a pair of clamping members 121, and the second jig 30 is clamped by the pair of clamping members 121. By holding the second jig 30 by the jig holding mechanism 120, the second jig 30 is fixed to the substrate manufacturing apparatus 100. The jig clamping mechanism 120 may be configured to be manually clamped, or may be configured to be automatically clamped using a drive source such as a motor.
 また、治具スライダ130は、第2駆動手段に対応するスライドモータ131を備え、そのスライドモータ131の駆動によって基板製造用治具10をスライドさせる部分である。かかる治具スライダ130で基板製造用治具10をスライドさせる場合、後述するトルクローラ151やフリーローラ161等に対して、基板製造用治具10をスライドさせることができる。 The jig slider 130 includes a slide motor 131 corresponding to the second driving means, and is a part that slides the board manufacturing jig 10 by driving the slide motor 131. When the substrate manufacturing jig 10 is slid with the jig slider 130, the substrate manufacturing jig 10 can be slid with respect to a torque roller 151, a free roller 161, and the like, which will be described later.
 図9では、治具スライダ130の一例として、ベルト132を用いる場合が例示されており、そのベルト132の一部に挟持部材121等の部位が固定されている。図9は模式図であるためベルト132が短い状態で図示されているが、ベルト132は基板製造用治具10を十分にスライド可能な長さに設けられている。なお、治具スライダ130を構成する要素として、送りねじ等、ベルト132以外の構成を用いても良い。 FIG. 9 illustrates a case where a belt 132 is used as an example of the jig slider 130, and a part such as the clamping member 121 is fixed to a part of the belt 132. Since FIG. 9 is a schematic view, the belt 132 is illustrated in a short state, but the belt 132 is provided with a length that allows the substrate manufacturing jig 10 to be sufficiently slid. In addition, you may use structures other than the belt 132, such as a lead screw, as an element which comprises the jig | tool slider 130. FIG.
 また、ピン押し出し機構140は、エアシリンダ141を備え、このエアシリンダ141の作動によってスリーブ33を介して可動ピン25を差込孔211に向けて押し出す機構である。なお、ピン押し出し機構140には、エアシリンダ141を移動させる移動機構(図示省略)も設けられており、その移動機構の作動により、それぞれの差込孔211に可動ピン25を順次差し込むことを可能としている。 Further, the pin push-out mechanism 140 includes an air cylinder 141 and is a mechanism that pushes the movable pin 25 toward the insertion hole 211 through the sleeve 33 by the operation of the air cylinder 141. The pin pushing mechanism 140 is also provided with a moving mechanism (not shown) for moving the air cylinder 141, and the movable pin 25 can be sequentially inserted into each insertion hole 211 by the operation of the moving mechanism. It is said.
 また、トルクローラ接離機構150は、トルクローラ151と、エアシリンダ152と、不図示の付勢手段を備えている。トルクローラ151には、駆動ローラ151aと従動ローラ151bとが設けられていて、それらが上下方向に沿って配置されている。そして、エアシリンダ152が作動していない状態では、付勢手段の作用によって駆動ローラ151aと従動ローラ151bとが上下方向で離れているが、エアシリンダ152が作動すると駆動ローラ151aと従動ローラ151bとが互いに接近した閉じ状態となり、フレキシブルプリント基板FAを所定の押圧力で挟むことが可能となる。 The torque roller contact / separation mechanism 150 includes a torque roller 151, an air cylinder 152, and an urging means (not shown). The torque roller 151 is provided with a driving roller 151a and a driven roller 151b, which are arranged along the vertical direction. When the air cylinder 152 is not in operation, the driving roller 151a and the driven roller 151b are separated in the vertical direction by the action of the urging means, but when the air cylinder 152 is operated, the driving roller 151a and the driven roller 151b are Are close to each other and the flexible printed circuit board FA can be sandwiched with a predetermined pressing force.
 また、フリーローラ接離機構160は、フリーローラ161と、エアシリンダ162と、不図示の付勢手段を備えている。フリーローラ161は、一対の従動ローラ161a,161bを有していて、それらが上下方向に沿って配置されている。そして、エアシリンダ162が作動していない状態では、付勢手段の作用によって従動ローラ161a,161bが上下方向で互いに離れているが、エアシリンダ162が作動すると従動ローラ161a,161bが互いに接近した閉じ状態となり、フレキシブルプリント基板FAを所定の押圧力で挟むことが可能となる。なお、フリーローラ161は、トルクローラ151よりも長手方向(X方向)の一端側(X2側)に位置している。 The free roller contact / separation mechanism 160 includes a free roller 161, an air cylinder 162, and an urging means (not shown). The free roller 161 has a pair of driven rollers 161a and 161b, which are arranged along the vertical direction. When the air cylinder 162 is not in operation, the driven rollers 161a and 161b are separated from each other in the vertical direction by the action of the urging means. However, when the air cylinder 162 is operated, the driven rollers 161a and 161b are closed close to each other. Thus, the flexible printed circuit board FA can be sandwiched with a predetermined pressing force. The free roller 161 is located on one end side (X2 side) in the longitudinal direction (X direction) with respect to the torque roller 151.
 ローラ駆動機構170は、駆動モータ171を備えている。そして、駆動モータ171の作動により、駆動ローラ151aを駆動させることができる。そのため、駆動ローラ151aと従動ローラ151bとでフレキシブルプリント基板FAを挟み込んだ状態で駆動ローラ151aを駆動させることで、フレキシブルプリント基板FAを送ることができ、他端側(X1側;図9の右側)に送る場合には、フレキシブルプリント基板FAにテンションを付与することができる。 The roller drive mechanism 170 includes a drive motor 171. The drive roller 151 a can be driven by the operation of the drive motor 171. Therefore, the flexible printed circuit board FA can be sent by driving the driving roller 151a with the flexible printed circuit board FA sandwiched between the driving roller 151a and the driven roller 151b, and the other side (X1 side; right side of FIG. 9). ), Tension can be applied to the flexible printed circuit board FA.
 また、先端保持機構180は、先端挟持部材181と、エアシリンダ182を有している。先端挟持部材181は、図9に示すように側面視した形状が略L字形状に設けられていて、先端固定部材23の先端側に当接する。そのような当接を可能とするため、先端側当接部181aは、上面当接部181bよりも上下方向(Z方向)に長く設けられている。また、先端挟持部材181の上面当接部181bは、切り落とし部F4の上面側に当接して、先端受部23aとの間で切り落とし部F4を挟み込む。かかる動作を実現するために、先端挟持部材181は、エアシリンダ182(第1駆動手段に対応)の作動によって上下方向(Z方向)に移動可能としている。それにより、フレキシブルプリント基板FAの先端側が確実に固定される。なお、上面当接部181bには、図示を省略する凹部が設けられていて、掛止ピン23bを入り込ませることを可能としている。 The tip holding mechanism 180 has a tip clamping member 181 and an air cylinder 182. As shown in FIG. 9, the tip clamping member 181 is provided in a substantially L shape when viewed from the side, and abuts against the tip side of the tip fixing member 23. In order to enable such contact, the distal end side contact portion 181a is provided longer in the vertical direction (Z direction) than the upper surface contact portion 181b. Further, the upper surface contact portion 181b of the tip clamping member 181 contacts the upper surface side of the cut-off portion F4, and sandwiches the cut-off portion F4 with the tip receiving portion 23a. In order to realize such an operation, the tip clamping member 181 is movable in the vertical direction (Z direction) by the operation of the air cylinder 182 (corresponding to the first driving means). Thereby, the front end side of the flexible printed circuit board FA is securely fixed. In addition, the upper surface contact portion 181b is provided with a concave portion (not shown) so that the latch pin 23b can be inserted.
 また、側面押当機構190は、側面押当部材191と、エアシリンダ192を有している。側面押当部材191は、本体部21の側面に当接する側面当接部191aを有している。かかる側面当接部191aがフレキシブルプリント基板FAのY2側の側面に当接すると、フレキシブルプリント基板FAのスキュー方向(角度方向)の調整を行うことができる。そのような動作を実現するために、側面押当部材191は、エアシリンダ192の作動によって、幅方向(Y方向)に移動可能としている。 Further, the side surface pressing mechanism 190 has a side surface pressing member 191 and an air cylinder 192. The side pressing member 191 has a side contact portion 191 a that contacts the side surface of the main body portion 21. When the side surface contact portion 191a contacts the Y2 side surface of the flexible printed circuit board FA, the skew direction (angular direction) of the flexible printed circuit board FA can be adjusted. In order to realize such an operation, the side pressing member 191 is movable in the width direction (Y direction) by the operation of the air cylinder 192.
 なお、基板製造装置100は、後端保持部材200を備える構成としても良いが、後端保持部材200は基板製造装置100とは別の構成としても良い。この後端保持部材200は、たとえば板状の部材であり、後端側の切り落とし部F4の上面側に当接する。それにより、終端固定部材26との間で切り落とし部F4を挟み込み、フレキシブルプリント基板FAの後端側を確実に固定する。このようなフレキシブルプリント基板FAの固定を実現するために、後端保持部材200は、磁力によって終端固定部材26に取り付けられる構成としても良いが、たとえばクランプその他の手段によって終端固定部材26に取り付けられる構成としても良い。 The substrate manufacturing apparatus 100 may be configured to include the rear end holding member 200, but the rear end holding member 200 may be configured differently from the substrate manufacturing apparatus 100. The rear end holding member 200 is, for example, a plate-like member, and abuts on the upper surface side of the rear end side cut-off portion F4. Accordingly, the cut-off portion F4 is sandwiched between the terminal fixing member 26 and the rear end side of the flexible printed circuit board FA is securely fixed. In order to realize such fixation of the flexible printed circuit board FA, the rear end holding member 200 may be configured to be attached to the terminal fixing member 26 by magnetic force, but is attached to the terminal fixing member 26 by, for example, a clamp or other means. It is good also as a structure.
<フレキシブルプリント基板FBの製造方法について>
 続いて、フレキシブルプリント基板FBの製造方法について、以下に説明する。なお、以下の説明においては、第1工程から第10工程について順次記載するが、各実施の形態におけるフレキシブルプリント基板FBの製造方法では、これ以外の種々の工程が存在していても良いのは勿論である。
<About manufacturing method of flexible printed circuit board FB>
Then, the manufacturing method of the flexible printed circuit board FB is demonstrated below. In the following description, the first step to the tenth step are sequentially described. However, in the method for manufacturing the flexible printed circuit board FB in each embodiment, various other steps may exist. Of course.
 (1)第1工程:フレキシブルプリント基板FAのセット前(準備)
 まず最初に、図10および図11に示すように、フレキシブルプリント基板FAをセットする前の準備を行う。そのために、治具挟持機構120を用いて第2治具30を基板製造装置100に固定する。その固定を容易に行えるようにするため、治具スライダ130は基板製造用治具10をスライドさせて、基板製造装置100の各部位と干渉しない位置(図10および図11では、基板製造装置100に対して相対的に左側)に配置している。なお、この基板製造用治具10のスライドでは、先端保持機構180もスライドするが、ピン押し出し機構140、トルクローラ接離機構150、フリーローラ接離機構160、側面押当機構190はスライドしない。
(1) First step: Before setting the flexible printed circuit board FA (preparation)
First, as shown in FIGS. 10 and 11, preparations are made before setting the flexible printed circuit board FA. For this purpose, the second jig 30 is fixed to the substrate manufacturing apparatus 100 using the jig clamping mechanism 120. In order to facilitate the fixing, the jig slider 130 slides the board manufacturing jig 10 so as not to interfere with each part of the board manufacturing apparatus 100 (in FIG. 10 and FIG. Relative to the left side). When the substrate manufacturing jig 10 slides, the tip holding mechanism 180 also slides, but the pin push-out mechanism 140, torque roller contact / separation mechanism 150, free roller contact / separation mechanism 160, and side surface pressing mechanism 190 do not slide.
 また、そのスライド後、図11に示すように位置決め凸部32を位置決め凹部22に嵌め込むことで、第2治具30に対して第1治具20を取り付ける。かかる取り付け後、治具スライダ130は基板製造用治具10を、先ほどとは逆側(図10および図11では、基板製造装置100に対して相対的に右側)にスライドさせ、基板製造用治具10を、フレキシブルプリント基板FAの取り付けを行うためのポジションに移動させる。 Further, after the sliding, the first jig 20 is attached to the second jig 30 by fitting the positioning convex portion 32 into the positioning concave portion 22 as shown in FIG. After such attachment, the jig slider 130 slides the board manufacturing jig 10 to the opposite side (in FIG. 10 and FIG. 11, the right side relative to the board manufacturing apparatus 100), and the board manufacturing jig. The tool 10 is moved to a position for attaching the flexible printed circuit board FA.
 なお、この基板製造用治具10の図10および図11における右側へのスライドに前後して、それぞれのスリーブ33に可動ピン25を差し込む。この差し込みは、本体部31の手前側(Y1側)の側面から、ピン部251が突出しない位置まで差し込むようにする。 Note that the movable pin 25 is inserted into each sleeve 33 before and after the substrate manufacturing jig 10 slides to the right in FIGS. 10 and 11. This insertion is performed from the front side (Y1 side) side of the main body 31 to a position where the pin portion 251 does not protrude.
 また、フレキシブルプリント基板FAを第1治具20に取り付ける際に、基板製造装置100の各部位とフレキシブルプリント基板FAとが干渉しないようにしている。そのため、先端保持機構180の先端挟持部材181は、上方側(Z1側)に退避した状態となっている。同様に、側面押当機構190の側面押当部材191も手前側(Y1側)に退避すると共に、後端保持部材200も上方側(Z1側)に退避している。また、トルクローラ151の駆動ローラ151aと従動ローラ151bとは上下方向で互いに離間した状態となっている。また、フリーローラ161の従動ローラ161a,161bも上下方向で互いに離間した状態となっている。 Further, when the flexible printed circuit board FA is attached to the first jig 20, each part of the substrate manufacturing apparatus 100 and the flexible printed circuit board FA are prevented from interfering with each other. Therefore, the tip clamping member 181 of the tip holding mechanism 180 is in a state of being retracted upward (Z1 side). Similarly, the side surface pressing member 191 of the side surface pressing mechanism 190 is also retracted to the front side (Y1 side), and the rear end holding member 200 is also retracted to the upper side (Z1 side). Further, the driving roller 151a and the driven roller 151b of the torque roller 151 are separated from each other in the vertical direction. Further, the driven rollers 161a and 161b of the free roller 161 are also separated from each other in the vertical direction.
 なお、フレキシブルプリント基板FAを次々に成形するために、フレキシブルプリント基板FAのセット終了後は、第2治具30から第1治具20を取り外し、別の第1治具20を第2治具30に取り付ける。すなわち、1つの第2治具30に対して、多数の第1治具20が存在し、フレキシブルプリント基板FAの第1治具20への取り付けを、第1治具20毎に順次行う構成としている。 In order to form the flexible printed circuit boards FA one after another, after the setting of the flexible printed circuit board FA is completed, the first jig 20 is removed from the second jig 30, and another first jig 20 is replaced with the second jig. Attach to 30. That is, there are a large number of first jigs 20 for one second jig 30, and the flexible printed circuit board FA is attached to the first jig 20 sequentially for each first jig 20. Yes.
 (2)第2工程:フレキシブルプリント基板FAの先端側の取り付け
 次に、図12および図13に示すように、フレキシブルプリント基板FAを第1治具20に取り付ける。このとき、先端固定部材23の掛止ピン23bに、フレキシブルプリント基板FAの孔部F5を差し込む(第1保持工程に対応)。それにより、フレキシブルプリント基板FAの先端側の位置が定まる。この先端側の取り付け状態では、固定ピン24の上面側にフレキシブルプリント基板FAの下面が接触する状態とする。
(2) 2nd process: Attachment of the front end side of flexible printed circuit board FA Next, the flexible printed circuit board FA is attached to the 1st jig | tool 20, as shown in FIG. At this time, the hole F5 of the flexible printed circuit board FA is inserted into the latch pin 23b of the tip fixing member 23 (corresponding to the first holding step). Thereby, the position of the front end side of the flexible printed circuit board FA is determined. In the attached state on the distal end side, the lower surface of the flexible printed circuit board FA is in contact with the upper surface side of the fixing pin 24.
 (3)第3工程:フレキシブルプリント基板FAの引っ張り開始
 次に、図14および図15に示すように、フレキシブルプリント基板FAの後端側の側面を、側面押当機構190の側面押当部材191に押し当てる(スキュー調整工程に対応)。それにより、フレキシブルプリント基板FAの回転方向の位置が定まる。そして、フレキシブルプリント基板FAの回転方向の位置が定まるのに前後して、エアシリンダ182を作動させて先端挟持部材181を下方側に移動させて、先端受部23aと上面当接部181bとの間でフレキシブルプリント基板FAを挟持する。
(3) Third Step: Start of Pulling of Flexible Printed Circuit Board FA Next, as shown in FIGS. 14 and 15, the side surface pressing member 191 of the side surface pressing mechanism 190 is connected to the side surface on the rear end side of the flexible printed circuit board FA. (It corresponds to the skew adjustment process). Thereby, the position of the flexible printed circuit board FA in the rotational direction is determined. Then, before and after the position of the flexible printed circuit board FA in the rotational direction is determined, the air cylinder 182 is operated to move the tip clamping member 181 downward, and the tip receiving portion 23a and the upper surface contact portion 181b are moved. The flexible printed circuit board FA is sandwiched between them.
 この挟持の後に、エアシリンダ152を作動させてトルクローラ151の駆動ローラ151aと従動ローラ151bとを上下方向で互いに接近させ、フレキシブルプリント基板FAを挟み込む。そして、この挟み込み後に、フレキシブルプリント基板FAに対して送り方向(図14における右方向)にテンションをかけるべく、ローラ駆動機構170の駆動モータ171を作動させて、駆動ローラ151aをフレキシブルプリント基板FAの送り方向に駆動する。 After this clamping, the air cylinder 152 is operated to bring the driving roller 151a and the driven roller 151b of the torque roller 151 close to each other in the vertical direction, thereby sandwiching the flexible printed circuit board FA. Then, after this clamping, the drive motor 171 of the roller drive mechanism 170 is operated to apply tension to the flexible printed circuit board FA in the feed direction (right direction in FIG. 14), and the drive roller 151a is moved to the flexible printed circuit board FA. Drive in the feed direction.
 また、この後に、エアシリンダ162を作動させてフリーローラ161の従動ローラ161a,161bを互いに上下方向で接近させて、フレキシブルプリント基板FAを挟み込む。このように、フリーローラ161が閉じるよりも前に駆動モータ171を作動させることにより、先端固定部材23とトルクローラ151の間でフレキシブルプリント基板FAの弛みが一層良好に防止される。ただし、フリーローラ161によるフレキシブルプリント基板FAの挟み込みは、駆動モータ171の作動よりも前としても良く、トルクローラ151によるフレキシブルプリント基板FAの挟み込みよりも前としても良い。 After this, the air cylinder 162 is operated to bring the driven rollers 161a and 161b of the free roller 161 close to each other in the vertical direction, and the flexible printed circuit board FA is sandwiched. As described above, by operating the drive motor 171 before the free roller 161 is closed, loosening of the flexible printed circuit board FA between the front end fixing member 23 and the torque roller 151 is further prevented. However, the sandwiching of the flexible printed circuit board FA by the free roller 161 may be performed before the operation of the drive motor 171 or may be performed before the sandwiching of the flexible printed circuit board FA by the torque roller 151.
 なお、フリーローラ161によるフレキシブルプリント基板FAの挟み込みの後に、ピン押し出し機構140を差込孔211aとY方向で同軸となる位置まで移動させる。しかしながら、ピン押し出し機構140の移動は、フリーローラ161によるフレキシブルプリント基板FAの挟み込みの前であっても良く、次の第4工程において行うようにしても良い。 In addition, after pinching the flexible printed circuit board FA by the free roller 161, the pin pushing mechanism 140 is moved to a position coaxial with the insertion hole 211a in the Y direction. However, the movement of the pin pushing mechanism 140 may be performed before the flexible printed circuit board FA is sandwiched by the free rollers 161, or may be performed in the next fourth step.
 (4)第4工程:差込孔211aへの可動ピン25aの差し込み(掛け回し工程の一部に対応)
 続いて、図16および図17に示すように、ローラ駆動機構170の駆動モータ171を作動させて、駆動ローラ151aをフレキシブルプリント基板FAの送出方向とは逆方向(図16における左方向)に駆動する。それにより、フレキシブルプリント基板FAがたるむことが可能となり、フリーローラ161が下降可能な状態となる。ただし、駆動ローラ151aをフレキシブルプリント基板FAの送出方向に駆動するように、駆動モータ171を作動させても良いが、この場合には、駆動トルクを上述の第3工程等に示す場合よりも弱くすることが好ましい。
(4) Fourth step: Inserting the movable pin 25a into the insertion hole 211a (corresponding to a part of the winding step)
Subsequently, as shown in FIGS. 16 and 17, the drive motor 171 of the roller drive mechanism 170 is operated to drive the drive roller 151a in the direction opposite to the delivery direction of the flexible printed circuit board FA (the left direction in FIG. 16). To do. As a result, the flexible printed circuit board FA can sag, and the free roller 161 can be lowered. However, the drive motor 171 may be operated so as to drive the drive roller 151a in the delivery direction of the flexible printed circuit board FA. However, in this case, the drive torque is weaker than in the case of the third step described above. It is preferable to do.
 かかる駆動ローラ151aの駆動状態において、フリーローラ接離機構160のエアシリンダ162を作動させて、フリーローラ161を下降させる。この下降は、差込孔211aに可動ピン25aを差し込んだときに、可動ピン25aがフレキシブルプリント基板FAよりも搬送ラインL側(上方側)に位置させるものであり、そのような位置となるようにフリーローラ161を下降させる。なお、このとき、治具スライダ130のスライドモータ131を作動させて、基板製造用治具10を長手方向の他方側(X1側;図16の右側)に移動させるようにしても良い。 In the driving state of the driving roller 151a, the air cylinder 162 of the free roller contact / separation mechanism 160 is operated to lower the free roller 161. This lowering is such that when the movable pin 25a is inserted into the insertion hole 211a, the movable pin 25a is positioned closer to the transport line L (upper side) than the flexible printed circuit board FA. The free roller 161 is lowered. At this time, the slide motor 131 of the jig slider 130 may be operated to move the board manufacturing jig 10 to the other side in the longitudinal direction (X1 side; right side in FIG. 16).
 その下降の後に、ピン押し出し機構140のエアシリンダ141を作動させて、鍔部252が本体部21に当接するまで可動ピン25aを差込孔211aに差し込む。それにより、可動ピン25aのピン部251が手前側(Y1側)に突出し、そのピン部251にフレキシブルプリント基板FAの上面側が接触可能な状態となる。なお、かかるエアシリンダ141の作動後には、エアシリンダ141が戻り、スリーブ33へエアシリンダ141が入り込まないようにする。 After the lowering, the air cylinder 141 of the pin pushing mechanism 140 is operated, and the movable pin 25a is inserted into the insertion hole 211a until the flange portion 252 contacts the main body portion 21. Thereby, the pin part 251 of the movable pin 25a protrudes to the near side (Y1 side), and the upper surface side of the flexible printed circuit board FA can come into contact with the pin part 251. After the air cylinder 141 is actuated, the air cylinder 141 returns so that the air cylinder 141 does not enter the sleeve 33.
 (5)第5工程:差込孔211bへの可動ピン25bの差し込み(掛け回し工程の一部に対応)
 次に、図18および図19に示すように、差込孔211bへの可動ピン25bの差し込みを行う。そのために、ローラ駆動機構170の駆動モータ171を作動させて、駆動ローラ151aを送出方向(図18における右方向)に駆動させつつ、フリーローラ161が上昇する。その後に、治具スライダ130のスライドモータ131を作動させて、基板製造用治具10を長手方向の一方側(X2側;図18の左側)に移動させ、差込孔211bに可動ピン25bを差し込んだときに、可動ピン25bがフレキシブルプリント基板FAよりも搬送ラインL側(下方側)に位置させるようにする。
(5) Fifth step: Inserting the movable pin 25b into the insertion hole 211b (corresponding to a part of the winding step)
Next, as shown in FIGS. 18 and 19, the movable pin 25b is inserted into the insertion hole 211b. Therefore, the free roller 161 is raised while operating the drive motor 171 of the roller drive mechanism 170 to drive the drive roller 151a in the delivery direction (right direction in FIG. 18). Thereafter, the slide motor 131 of the jig slider 130 is operated to move the board manufacturing jig 10 to one side in the longitudinal direction (X2 side; left side in FIG. 18), and the movable pin 25b is inserted into the insertion hole 211b. When inserted, the movable pin 25b is positioned closer to the transport line L (lower side) than the flexible printed circuit board FA.
 その後に、ピン押し出し機構140を差込孔211bとY方向で同軸となる位置まで移動させる。その移動後に、ピン押し出し機構140のエアシリンダ141を作動させて、鍔部252が本体部21に当接するまで可動ピン25bを差込孔211bに差し込む。それにより、可動ピン25bのピン部251が手前側(Y1側)に突出し、そのピン部251にフレキシブルプリント基板FAの下面側が接触可能な状態となる。なお、かかるエアシリンダ141の作動後には、エアシリンダ141が戻り、スリーブ33へエアシリンダ141が入り込まないようにする。 Thereafter, the pin push-out mechanism 140 is moved to a position coaxial with the insertion hole 211b in the Y direction. After the movement, the air cylinder 141 of the pin push-out mechanism 140 is operated, and the movable pin 25b is inserted into the insertion hole 211b until the flange portion 252 contacts the main body portion 21. Thereby, the pin part 251 of the movable pin 25b protrudes to the near side (Y1 side), and the lower surface side of the flexible printed circuit board FA can come into contact with the pin part 251. After the air cylinder 141 is actuated, the air cylinder 141 returns so that the air cylinder 141 does not enter the sleeve 33.
 (6)第6工程:第4工程と第5工程と同様の動作の繰り返し(掛け回し工程の一部に対応)
 上述の第5工程の後は、第4工程と第5工程と同様の動作を順次繰り返し、差込孔211c~211iまで可動ピン25c~25iを差し込みつつ、それぞれの可動ピン25c~25iにフレキシブルプリント基板FAが掛け回される状態とする。
(6) Sixth step: Repeating the same operation as the fourth and fifth steps (corresponding to a part of the wrapping step)
After the fifth step, the same operations as those in the fourth step and the fifth step are sequentially repeated, and the flexible pins 25c to 25i are inserted into the insertion holes 211c to 211i, and flexible printing is performed on the movable pins 25c to 25i. The state is such that the substrate FA is wound around.
 (7)第7工程:フリーローラ161の開放
 可動ピン25iにフレキシブルプリント基板FAが掛け回された状態とした後に、図20および図21に示すように、駆動モータ171を作動させて駆動ローラ151aを送り方向に駆動させつつ、エアシリンダ162の作動を停止させて、付勢手段の付勢力によってフリーローラ161を開放する。
(7) Seventh step: opening of the free roller 161 After the flexible printed circuit board FA is wound around the movable pin 25i, as shown in FIGS. 20 and 21, the drive motor 171 is operated to drive the drive roller 151a. Is driven in the feed direction, the operation of the air cylinder 162 is stopped, and the free roller 161 is opened by the urging force of the urging means.
 (8)第8工程:トルクローラ151の開放
 続いて、図22および図23に示すように、後端保持部材200と終端固定部材26とでフレキシブルプリント基板FAを挟み込む(第2保持工程に対応)。その後に、エアシリンダ152の作動を停止させて、付勢手段の付勢力によってトルクローラ151を開放する。このようにして、フレキシブルプリント基板FAの基板製造用治具10への取り付けが終了する。
(8) Eighth Step: Release of Torque Roller 151 Subsequently, as shown in FIGS. 22 and 23, the flexible printed circuit board FA is sandwiched between the rear end holding member 200 and the terminal end fixing member 26 (corresponding to the second holding step). ). Thereafter, the operation of the air cylinder 152 is stopped, and the torque roller 151 is opened by the urging force of the urging means. Thus, the attachment of the flexible printed circuit board FA to the board manufacturing jig 10 is completed.
 (9)第9工程:フレキシブルプリント基板FAの加熱成形
 次に、図24および図25に示すように、フレキシブルプリント基板FAが取り付けられた第1治具20を第2治具30から取り外す。そして、フレキシブルプリント基板FAにテンションが掛かった状態で、第1治具20と共にフレキシブルプリント基板FAをオーブン等で加熱する(加熱成形工程に対応)。それにより、フレキシブルプリント基板FBが成形される。かかる加熱温度としては、200℃程度で30分程度加熱するものがある。このように、フレキシブルプリント基板FAの先端側の位置が定まった状態で、かつフレキシブルプリント基板FAにテンションが掛かった状態で加熱成形されるため、成形後のフレキシブルプリント基板FBの製品形状を安定させることができる。
(9) Ninth Step: Thermoforming of Flexible Printed Circuit Board FA Next, as shown in FIGS. 24 and 25, the first jig 20 to which the flexible printed circuit board FA is attached is removed from the second jig 30. Then, the flexible printed circuit board FA is heated together with the first jig 20 in an oven or the like in a state where tension is applied to the flexible printed circuit board FA (corresponding to a thermoforming process). Thereby, the flexible printed circuit board FB is molded. As such a heating temperature, there is one which is heated at about 200 ° C. for about 30 minutes. As described above, since the heat-molding is performed in a state where the position of the front end side of the flexible printed circuit board FA is determined and the tension is applied to the flexible printed circuit board FA, the product shape of the formed flexible printed circuit board FB is stabilized. be able to.
 なお、加熱成形によって成形後のフレキシブルプリント基板FBを得た後には、フレキシブルプリント基板FBを第1治具20から取り外す。この場合、図26に示すように、第1治具20のうち奥側(Y2側)に凹部27を設け、この凹部27に抜き板28が嵌め込まれる構成としても良い。かかる抜き板28には、差込孔211と同軸かつ同等の孔径の孔部28aが設けられている。それにより、それぞれの可動ピン25の鍔部252は抜き板28を通過できず、当該抜き板28の側面に係止される状態となる。そのため、抜き板28を凹部27から外すことで、可動ピン25を差込孔211から引き抜くことができ、フレキシブルプリント基板FBを第1治具20から容易に取り外すことができる。 In addition, after obtaining the molded flexible printed circuit board FB by thermoforming, the flexible printed circuit board FB is removed from the first jig 20. In this case, as shown in FIG. 26, a recess 27 may be provided on the back side (Y2 side) of the first jig 20, and the extraction plate 28 may be fitted into the recess 27. The punching plate 28 is provided with a hole portion 28a that is coaxial with the insertion hole 211 and has the same diameter. Thereby, the flange 252 of each movable pin 25 cannot pass through the punching plate 28 and is locked to the side surface of the punching plate 28. Therefore, by removing the extraction plate 28 from the recess 27, the movable pin 25 can be pulled out from the insertion hole 211, and the flexible printed circuit board FB can be easily detached from the first jig 20.
 また、図27に示すように、第1治具20が分割可能な構成としても良い。たとえば、第1治具20は、その上下方向(Z方向)の中途にある分割部位29から、手前側(Y1側)の側面またはその近傍を支点として、第1分割部位20Aと第2分割部位20Bの2つの部位に分かれるように開閉する構成としても良い。ここで、分割部位29は、下方側(Z2側)に位置する可動ピン25とも上方側(Z1側)に位置する可動ピン25の間の位置に設ける構成とするのが好ましい。 Further, as shown in FIG. 27, the first jig 20 may be divided. For example, the first jig 20 has a first divided part 20A and a second divided part from the divided part 29 in the middle of the vertical direction (Z direction) as a fulcrum on the side surface on the near side (Y1 side) or the vicinity thereof. It is good also as a structure opened and closed so that it may be divided into two parts of 20B. Here, it is preferable that the divided portion 29 is provided at a position between the movable pin 25 located on the lower side (Z2 side) and the movable pin 25 located on the upper side (Z1 side).
 かかる図27に示す構成とする場合、分割部位29を支点として第1治具20を開くようにすると、第1治具20とフレキシブルプリント基板FBとの間のテンションが緩み、フレキシブルプリント基板FBを第1治具20から容易に取り外すことができる。 27, when the first jig 20 is opened with the divided portion 29 as a fulcrum, the tension between the first jig 20 and the flexible printed circuit board FB is loosened, and the flexible printed circuit board FB is removed. It can be easily removed from the first jig 20.
 (10)第10工程:切り落とし部F4のカット
 続いて、図28および図29に示すように、プリーツ状に成形されたフレキシブルプリント基板FBを出荷できる状態とするために、成形されたフレキシブルプリント基板FBの不要部分である切り落とし部F4のカットを行う。それにより、最終製品が完成する。かかる立体的に成形されたフレキシブルプリント基板FBの成形形状を保持したままカットするために、図28および図29に示すような刃付治具300と固定治具400を用いる。
(10) Tenth step: Cut of the cut-off portion F4 Subsequently, as shown in FIGS. 28 and 29, the flexible printed circuit board formed in order to be able to ship the flexible printed circuit board FB formed in a pleat shape. The cut-off portion F4 that is an unnecessary part of the FB is cut. Thereby, the final product is completed. In order to cut the three-dimensionally shaped flexible printed circuit board FB while maintaining the molded shape, a jig 300 with a blade and a fixing jig 400 as shown in FIGS. 28 and 29 are used.
 刃付治具300は、ピナクルや金型等のような刃付の治具であり、フレキシブルプリント基板FBの両端側の切り落とし部F4をカット可能なように刃部301が一対設けられている。また、固定治具400は、窪んだ形状の治具筐体401を備えている。その治具筐体401の窪みの周囲には、孔部F5を差し込み可能なガイドピン402が設けられており、フレキシブルプリント基板FBの先端側を保持可能としている。さらに、固定治具400は、フレキシブルプリント基板FBの後端側を位置決めしつつ保持可能な後端保持部403を備えている。そのため、刃付治具300を下方に移動させることで、フレキシブルプリント基板FBの両端側の切り落とし部F4をカットすることが可能となっている。 The jig with blade 300 is a jig with a blade such as a pinnacle or a mold, and a pair of blade portions 301 are provided so that the cut-off portions F4 on both ends of the flexible printed circuit board FB can be cut. The fixing jig 400 includes a jig housing 401 having a recessed shape. A guide pin 402 into which the hole F5 can be inserted is provided around the recess of the jig housing 401 so that the front end side of the flexible printed circuit board FB can be held. Furthermore, the fixing jig 400 includes a rear end holding portion 403 that can be held while positioning the rear end side of the flexible printed circuit board FB. Therefore, by moving the jig with blade 300 downward, it is possible to cut off the cut-off portions F4 on both ends of the flexible printed circuit board FB.
 なお、図29に示す構成では、固定治具400は、複数のフレキシブルプリント基板FBを取り付け可能としており、刃付治具300を用いて複数のフレキシブルプリント基板FBを一度に切断することが可能である。ただし、フレキシブルプリント基板FBを一つずつ切断するようにしても良い。 In the configuration shown in FIG. 29, the fixing jig 400 can attach a plurality of flexible printed boards FB, and the plurality of flexible printed boards FB can be cut at once using the bladed jig 300. is there. However, the flexible printed circuit boards FB may be cut one by one.
 以上のような刃付治具300および固定治具400を用いて、両端側の切り落とし部F4のカットを行うことにより、最終製品が完成する。 Using the above-mentioned jig 300 with a blade and the fixing jig 400, the cut-off portion F4 on both ends is cut to complete the final product.
 なお、フレキシブルプリント基板FBの後端側には、孔部F5と同様の孔部を予め設けておき、その後端側においても、ガイドピン401と同様のガイドピンに孔部を差し込むことで、位置決めを行うようにしても良い。また、切り落とし部F4のカットは、上述した手法以外の手法を用いても良い。そのような手法としては、たとえばレーザを用いたレーザカットや、ルータビットを用いたルータカット等が挙げられる。 In addition, a hole similar to the hole F5 is provided in advance on the rear end side of the flexible printed circuit board FB, and positioning is also performed by inserting the hole into a guide pin similar to the guide pin 401 on the rear end side. May be performed. In addition, a method other than the method described above may be used for cutting the cut-off portion F4. Examples of such methods include laser cutting using a laser and router cutting using a router bit.
[比較例について]
 続いて、本実施の形態に対する比較例について説明する。図30は、比較例に係る基板製造用治具10Dの構成を示す側面図であり、上述した特許文献3に関するものである。図30に示すように、比較例に係る基板製造用治具10Dは、本体部11を備え、その本体部11には、複数の固定ピン24Dが設けられている。
[Comparative example]
Then, the comparative example with respect to this Embodiment is demonstrated. FIG. 30 is a side view illustrating a configuration of a substrate manufacturing jig 10D according to a comparative example, and relates to the above-described Patent Document 3. As illustrated in FIG. 30, the substrate manufacturing jig 10 </ b> D according to the comparative example includes a main body portion 11, and the main body portion 11 is provided with a plurality of fixing pins 24 </ b> D.
 この場合、一定テンションを加えながら、フレキシブルプリント基板FAを固定ピン24Dの間に通していく。そして、フレキシブルプリント基板FAを固定ピン24Dの間に通した後に、加熱成形を行っている。この場合、固定ピン24Dの間にフレキシブルプリント基板FAを通す作業性は悪く、しかもフレキシブルプリント基板FAの始点側の位置(先端側の位置)が安定しない。また、フレキシブルプリント基板FAと固定ピン24Dとの間での摩擦により、一定テンションでの引っ張りは困難である。したがって、成形形状の安定化が難しい。特に、固定ピン24Dの本数が多くなると摩擦が大きくなり、一定テンションで引っ張ることが困難となる。また、摩擦の増大に伴い、一定のテンションを加えても、フレキシブルプリント基板FAの途中が緩んでしまう、という問題もある。 In this case, the flexible printed circuit board FA is passed between the fixing pins 24D while applying a certain tension. Then, after the flexible printed circuit board FA is passed between the fixing pins 24D, heat molding is performed. In this case, the workability of passing the flexible printed circuit board FA between the fixing pins 24D is poor, and the position on the starting point side (the position on the front end side) of the flexible printed circuit board FA is not stable. In addition, it is difficult to pull at a constant tension due to friction between the flexible printed circuit board FA and the fixing pin 24D. Therefore, it is difficult to stabilize the molded shape. In particular, when the number of fixing pins 24D increases, the friction increases and it is difficult to pull the pin with a constant tension. In addition, as the friction increases, there is a problem that the middle of the flexible printed circuit board FA is loosened even if a certain tension is applied.
 図31は、フレキシブルプリント基板FBの成形形状が安定しない例を示す側面図である。図31(A)は、狙いとするフレキシブルプリント基板FBの形状を示している。しかし、図31(B)では、その狙いとするフレキシブルプリント基板FBに対し、曲成部FB1の曲率(R)がばらついている状態を示している。すなわち、曲成部FB1の曲率(R)が大きい部分FB1aと小さい部分FB1bとが形成されており、成形形状が安定しない一態様となっている。 FIG. 31 is a side view showing an example in which the molding shape of the flexible printed circuit board FB is not stable. FIG. 31A shows the shape of the target flexible printed circuit board FB. However, FIG. 31B shows a state in which the curvature (R) of the bent portion FB1 varies with respect to the target flexible printed circuit board FB. That is, a portion FB1a having a large curvature (R) and a portion FB1b having a small curvature (R) of the bent portion FB1 are formed, which is an aspect in which the molded shape is not stable.
 また、図31(C)では、基板製造用治具10Dにセットしたフレキシブルプリント基板FAの始点側(先端側)の位置がMだけずれた例を示している。このような始点側(先端側)の位置ずれも、成形形状が安定しない一態様となっている。 Further, FIG. 31C shows an example in which the position of the starting point side (tip side) of the flexible printed circuit board FA set on the substrate manufacturing jig 10D is shifted by M. Such misalignment of the starting point side (tip side) is also an aspect in which the molding shape is not stable.
<効果について>
 以上のようなフレキシブルプリント基板FBの製造方法、基板製造用治具10および基板製造装置100によると、次のような効果が生じる。
<About effects>
According to the manufacturing method of the flexible printed circuit board FB, the substrate manufacturing jig 10 and the substrate manufacturing apparatus 100 as described above, the following effects are produced.
 すなわち、先端固定部材23(掛止ピン23b)により、フレキシブルプリント基板FAの一端側(X2側;始点側)の位置を定めることができるので、フレキシブルプリント基板FBの始点側で位置ずれが生じるのを防止可能となる。それにより、フレキシブルプリント基板FBの成形形状を安定化させることができる。 That is, since the position of one end side (X2 side; starting point side) of the flexible printed circuit board FA can be determined by the tip fixing member 23 (the latching pin 23b), a positional deviation occurs on the starting point side of the flexible printed circuit board FB. Can be prevented. Thereby, the shaping | molding shape of the flexible printed circuit board FB can be stabilized.
 また、固定ピン24および可動ピン25にフレキシブルプリント基板FAを掛け回す状態で支持させることができるので、フレキシブルプリント基板FAに曲成部FB1を確実に形成することができる。さらに、終端固定部材26では、フレキシブルプリント基板FAの他端側(X1側;終端側)を支持させることができる。それにより、フレキシブルプリント基板FAを加熱成形する際でも、フレキシブルプリント基板FAにテンションを与えた状態を維持することができる。 Further, since the flexible printed circuit board FA can be supported around the fixed pin 24 and the movable pin 25, the bent portion FB1 can be reliably formed on the flexible printed circuit board FA. Further, the end fixing member 26 can support the other end side (X1 side; end side) of the flexible printed circuit board FA. Thereby, even when the flexible printed circuit board FA is heat-molded, it is possible to maintain a state in which the flexible printed circuit board FA is tensioned.
 また、本実施の形態では、基板製造用治具10は、第1治具20と第2治具30とを有し、第2治具30に対して第1治具20が着脱可能に設けられている。そのため、フレキシブルプリント基板FAを加熱成形する際には、第2治具30から第1治具20を取り外すことができるので、基板製造用治具10の全体を加熱せずに済み、オーブン等での加熱成形に際して熱容量を小さくすることができる。 In the present embodiment, the substrate manufacturing jig 10 includes a first jig 20 and a second jig 30, and the first jig 20 is detachably provided to the second jig 30. It has been. Therefore, when the flexible printed circuit board FA is thermoformed, the first jig 20 can be removed from the second jig 30, so that it is not necessary to heat the entire board manufacturing jig 10, such as in an oven. The heat capacity can be reduced during the thermoforming.
 しかも、第1治具20には、先端固定部材23と、固定ピン24および可動ピン25と、終端固定部材26とが設けられていて、フレキシブルプリント基板FAの一端側(X2側)を先端固定部材23側で支持させつつ、フレキシブルプリント基板FAの他端側(X1側)を終端固定部材26側で支持させることができる。それにより、フレキシブルプリント基板FAを固定ピン24および可動ピン25で湾曲させつつ良好な加熱成形を行わせることができる。 Moreover, the first jig 20 is provided with a tip fixing member 23, a fixed pin 24, a movable pin 25, and a terminal fixing member 26, and one end side (X2 side) of the flexible printed circuit board FA is fixed to the tip. The other end side (X1 side) of the flexible printed circuit board FA can be supported on the terminal fixing member 26 side while being supported on the member 23 side. Thereby, it is possible to perform favorable heat forming while bending the flexible printed circuit board FA with the fixed pins 24 and the movable pins 25.
 また、可動ピン25は、第1治具20に対して着脱自在に設けられている。そのため、可動ピン25にフレキシブルプリント基板FAを掛け回す際には、必要とする可動ピン25を差込孔211に差し込むようにすることで、可動ピン25の間にフレキシブルプリント基板FAを通す等のような手間のかかる作業を行わずに済む。そのため、フレキシブルプリント基板FAを基板製造用治具10にセットする作業が容易に行える。 The movable pin 25 is detachably attached to the first jig 20. For this reason, when the flexible printed circuit board FA is hung around the movable pin 25, the flexible printed circuit board FA is passed between the movable pins 25 by inserting the necessary movable pins 25 into the insertion holes 211. This eliminates the time-consuming work. Therefore, the work of setting the flexible printed circuit board FA to the board manufacturing jig 10 can be easily performed.
 なお、第2治具30には、可動ピン25を入り込ませると共に差込孔211と同軸となる位置にスリーブ33が設けられている。そのため、差込孔211への可動ピン25の差し込みを容易に行える。また、フレキシブルプリント基板FAを第1治具20にセットする前の状態ではスリーブ33に可動ピン25を入り込ませておくことで、可動ピン25の差込孔211への差し込みを効率良く行わせることができる。 The second jig 30 is provided with a sleeve 33 at a position where the movable pin 25 is inserted and is coaxial with the insertion hole 211. Therefore, the movable pin 25 can be easily inserted into the insertion hole 211. In addition, before the flexible printed circuit board FA is set on the first jig 20, the movable pin 25 is inserted into the insertion hole 211 efficiently by inserting the movable pin 25 into the sleeve 33. Can do.
 さらに、本実施の形態では、先端固定部材23には、先端受部23aと掛止ピン23bとが設けられている。そのため、フレキシブルプリント基板FAの一端側(X2側;始点側)の位置を容易かつ確実に定めることが可能となる。それにより、フレキシブルプリント基板FAの始点側で位置ずれが生じるのを一層確実に防止可能となり、フレキシブルプリント基板FAの成形形状を一層安定化させることができる。 Furthermore, in the present embodiment, the tip fixing member 23 is provided with a tip receiving portion 23a and a latch pin 23b. Therefore, the position of one end side (X2 side; starting point side) of the flexible printed circuit board FA can be easily and reliably determined. Thereby, it is possible to more reliably prevent the displacement from occurring at the starting point side of the flexible printed circuit board FA, and the molded shape of the flexible printed circuit board FA can be further stabilized.
 また、本実施の形態では、基板製造装置100には、先端挟持部材181とエアシリンダ182とを有する先端保持機構180が設けられている。このため、先端固定部材23に対してエアシリンダ182で先端挟持部材181を駆動することにより、フレキシブルプリント基板FAの一端側(X2側)を確実に挟持させることができる。それにより、一端側(X2側;始点側)の位置を一層確実に定めることが可能となる。したがって、フレキシブルプリント基板FAの始点側で位置ずれが生じるのを一層確実に防止可能となり、フレキシブルプリント基板FAの成形形状を一層安定化させることができる。 In the present embodiment, the substrate manufacturing apparatus 100 is provided with a tip holding mechanism 180 having a tip clamping member 181 and an air cylinder 182. For this reason, by driving the tip clamping member 181 with the air cylinder 182 with respect to the tip fixing member 23, one end side (X2 side) of the flexible printed circuit board FA can be securely clamped. Thereby, the position of one end side (X2 side; starting point side) can be determined more reliably. Accordingly, it is possible to more reliably prevent the displacement from occurring on the starting point side of the flexible printed circuit board FA, and the molded shape of the flexible printed circuit board FA can be further stabilized.
 また、本実施の形態では、基板製造用治具10には、治具スライダ130のスライドモータ131によってスライドのための駆動力が与えられる。そのため、フレキシブルプリント基板FAを固定ピン24または可動ピン25に掛け回す際には、所望する位置に基板製造用治具10を移動させることが可能となり、フレキシブルプリント基板FAの基板製造用治具10(第1治具20)へのセットを容易に実施可能となる。 In the present embodiment, the substrate manufacturing jig 10 is given a driving force for sliding by the slide motor 131 of the jig slider 130. Therefore, when the flexible printed board FA is hung around the fixed pin 24 or the movable pin 25, the board manufacturing jig 10 can be moved to a desired position. Setting to the (first jig 20) can be easily performed.
 さらに、本実施の形態では、基板製造装置100には、トルクローラ接離機構150、フリーローラ接離機構160およびローラ駆動機構170が設けられている。そのため、フレキシブルプリント基板FAにローラ駆動機構170によってトルクローラ151を駆動させてテンションを与えつつ、エアシリンダ162でフリーローラ161を上昇または下降させることができる。それにより、フレキシブルプリント基板FAを固定ピン24または可動ピン25に掛け回す作業を自動的に実施することが可能となる。この際に、治具スライダ130によって基板製造用治具10を移動させることにより、可動ピン25を曲成部FB1に対応する位置に容易に差し込ませることが可能となる。 Furthermore, in the present embodiment, the substrate manufacturing apparatus 100 is provided with a torque roller contact / separation mechanism 150, a free roller contact / separation mechanism 160, and a roller drive mechanism 170. Therefore, the free roller 161 can be raised or lowered by the air cylinder 162 while the torque is applied to the flexible printed circuit board FA by the roller driving mechanism 170 to give the tension. Accordingly, it is possible to automatically perform the operation of hanging the flexible printed circuit board FA around the fixed pin 24 or the movable pin 25. At this time, by moving the substrate manufacturing jig 10 by the jig slider 130, the movable pin 25 can be easily inserted into a position corresponding to the bent portion FB1.
 また、本実施の形態では、基板製造装置100には、側面押当部材191を有する側面押当機構190が設けられている。そして、エアシリンダ192を作動させてフレキシブルプリント基板FAの側面に側面押当部材191を押し当てることで、フレキシブルプリント基板FAのスキュー方向の調整を容易かつ確実に実施することが可能となる。 In the present embodiment, the substrate manufacturing apparatus 100 is provided with a side surface pressing mechanism 190 having a side surface pressing member 191. Then, by operating the air cylinder 192 and pressing the side pressing member 191 against the side surface of the flexible printed circuit board FA, the skew direction of the flexible printed circuit board FA can be adjusted easily and reliably.
<変形例>
 以上、本発明の一実施の形態について説明したが、本発明はこれ以外にも種々変形可能となっている。以下、それについて述べる。
<Modification>
Although one embodiment of the present invention has been described above, the present invention can be variously modified in addition to this. This will be described below.
 上述の実施の形態においては、ある特定の直径の固定ピン24および可動ピン25を用いてフレキシブルプリント基板FAの加熱成形を行う場合について説明している。しかしながら、フレキシブルプリント基板FAの加熱成形は、異なる直径の固定ピン24および可動ピン25を組み合わせて行うようにしても良い。また、フレキシブルプリント基板FAの湾曲部分のピッチ(曲成部FB1となる部分のピッチ)を変更するようにしても良い。図32は、かかる様子を示す図である。 In the above-described embodiment, the case where the flexible printed circuit board FA is formed by heating using the fixed pin 24 and the movable pin 25 having a specific diameter has been described. However, the heat forming of the flexible printed circuit board FA may be performed by combining the fixed pin 24 and the movable pin 25 having different diameters. Moreover, you may make it change the pitch (pitch of the part used as the bending part FB1) of the curved part of flexible printed circuit board FA. FIG. 32 is a diagram showing such a state.
 図32では、小径の固定ピン24および可動ピン25を用いる部分と、大径の固定ピン24と可動ピン25を用いる構成とが組み合わされている。また、図32では、小径の固定ピン24および可動ピン25が用いられる部分では、フレキシブルプリント基板FAの湾曲部分のピッチ(曲成部FB1となる部分のピッチ)が狭く、大径の固定ピン24および可動ピン25が用いられる部分では、フレキシブルプリント基板FAの湾曲部分のピッチ(曲成部FB1となる部分のピッチ)が広い。 32, the portion using the small-diameter fixed pin 24 and the movable pin 25 and the configuration using the large-diameter fixed pin 24 and the movable pin 25 are combined. In FIG. 32, in the portion where the small-diameter fixed pin 24 and the movable pin 25 are used, the pitch of the curved portion of the flexible printed circuit board FA (the pitch of the portion that becomes the bent portion FB1) is narrow, and the large-diameter fixed pin 24 is. In the portion where the movable pin 25 is used, the pitch of the curved portion of the flexible printed circuit board FA (the pitch of the portion that becomes the bent portion FB1) is wide.
 このように構成することで、曲成部FB1の曲率や曲成部FB1の間の部分のピッチを自由に組み合わせてフレキシブルプリント基板FBを製作することが可能となる。たとえば、フレキシブルプリント基板FBのうち小径でピッチが狭い成形部分は、配置スペースの狭い個所で伸縮が必要な個所に好適である。また、大径でピッチが広い成形部分は、設置スペースが広く、伸縮量が大きい個所に好適である。 With this configuration, it is possible to manufacture the flexible printed circuit board FB by freely combining the curvature of the bent portion FB1 and the pitch of the portion between the bent portions FB1. For example, a molded part having a small diameter and a narrow pitch in the flexible printed circuit board FB is suitable for a place where expansion and contraction is required in a place where the arrangement space is narrow. In addition, a molded part having a large diameter and a wide pitch is suitable for a place having a large installation space and a large amount of expansion and contraction.
 また、図32に示す構成では、ピッチが狭い部分とピッチが広い部分との間に、成形がされない領域も存在しており、かかる成形されない領域の存在によって加熱成形する部位を最小限とすることも可能となり、成形前のフレキシブルプリント基板FAの長さを短くすることも可能となる。それにより、製品コストを低減することも可能となる。 Further, in the configuration shown in FIG. 32, there is a region where molding is not performed between a portion where the pitch is narrow and a portion where the pitch is wide, and the portion to be heat-molded is minimized due to the presence of the region where the pitch is not formed. The length of the flexible printed circuit board FA before molding can be shortened. Thereby, the product cost can be reduced.
 このように、種々のピッチを有するフレキシブルプリント基板FBを、加熱成形する部位がない領域も含めて一体的に扱えるため、異なるピッチのフレキシブルプリント基板FB同士を接続する接続部等も不要となる。 As described above, since the flexible printed circuit board FB having various pitches can be handled integrally including a region where there is no part to be thermoformed, a connecting portion for connecting the flexible printed circuit boards FB having different pitches becomes unnecessary.
 また、上述の実施の形態においては、基板製造用治具10に1つのフレキシブルプリント基板FAをセットする場合について説明している。しかしながら、複数のフレキシブルプリント基板FAを1つの基板製造用治具10に取り付ける構成を採用しても良い。図33は、このような基板製造用治具10Bを示す。 In the above-described embodiment, the case where one flexible printed circuit board FA is set in the board manufacturing jig 10 has been described. However, a configuration in which a plurality of flexible printed boards FA are attached to one board manufacturing jig 10 may be adopted. FIG. 33 shows such a substrate manufacturing jig 10B.
 図33では、複数(図33では3つ)のフレキシブルプリント基板FAの一端側および他端側に位置する切り落とし部が互いに連結されて、長さの長い1つの切り落とし部F4Bとなっている。このような一体的な切り落とし部F4Bを設ける場合には、位置決め等がより正確に行える。ただし、フレキシブルプリント基板FA同士が連結されずに、互いに独立した構成としても良い。 In FIG. 33, the cutout portions located on one end side and the other end side of a plurality (three in FIG. 33) of flexible printed circuit boards FA are connected to each other to form one long cutout portion F4B. When such an integrated cut-off portion F4B is provided, positioning or the like can be performed more accurately. However, the flexible printed circuit boards FA may be independent from each other without being connected to each other.
 また、一端側(X2側)の切り落とし部F4Bには、複数(図33では3つ)の孔部F5が設けられている。そして、先端固定部材23には、複数(図33では3つ)の掛止ピン23bが設けられている。この場合、固定ピン24および可動ピン25の長さを長くする必要があり、またエアシリンダ141のストロークや、トルクローラ151およびフリーローラ161のローラの幅も長くする必要がある。 Moreover, a plurality of (three in FIG. 33) hole portions F5 are provided in the cut-off portion F4B on one end side (X2 side). The tip fixing member 23 is provided with a plurality of (three in FIG. 33) latching pins 23b. In this case, it is necessary to increase the lengths of the fixed pin 24 and the movable pin 25, and it is also necessary to increase the strokes of the air cylinder 141 and the widths of the torque roller 151 and the free roller 161.
 このように構成する場合には、一度に複数のフレキシブルプリント基板FAの加熱成形を行うことが可能となり、生産効率を向上させることが可能となる。 In the case of such a configuration, it becomes possible to perform heat molding of a plurality of flexible printed circuit boards FA at a time, and it is possible to improve production efficiency.
 なお、基板製造用治具10は、たとえば第1治具20のみから構成されるものとしても良い。また、第1治具20においては、先端固定部材23が存在すると共に支持部材として、複数の固定ピン24のみが存在しても良く、またそれとは逆に複数の固定ピン24のみが存在しても良い。 In addition, the jig | tool 10 for board | substrate manufacture is good also as what is comprised only from the 1st jig | tool 20, for example. Further, in the first jig 20, the tip fixing member 23 exists, and only a plurality of fixing pins 24 may exist as support members, and conversely, only a plurality of fixing pins 24 exist. Also good.
 10,10B,10D…基板製造用治具、20…第1治具、20A…第1分割部位、20B…第2分割部位、21…本体部、22…凹部、23…先端固定部材(第1保持手段に対応)、23a…先端受部、23b…掛止ピン、24,24D…固定ピン(支持部材の一例に対応)、25(25a~25b)…可動ピン、26…終端固定部材(第2保持手段に対応)、27…凹部、28…抜き板、28a…孔部、29…分割部位、30…第2治具、31…本体部、32…凸部、33…スリーブ、100…基板製造装置、110…制御部、120…治具挟持機構、121…挟持部材、130…治具スライダ、131…スライドモータ(第2駆動手段に対応)、132…ベルト、140…ピン押し出し機構、141,152,162,192…エアシリンダ、150…トルクローラ接離機構、151…トルクローラ、151a…駆動ローラ、151b…従動ローラ、160…フリーローラ接離機構、161…フリーローラ、161a,161b…従動ローラ、170…ローラ駆動機構、171…駆動モータ、180…先端保持機構、181…先端挟持部材、181a…先端側当接部、181b…上面当接部、182…エアシリンダ(第1駆動手段に対応)、190…側面押当機構、191…側面押当部材、191a…側面当接部、200…後端保持部材、211(211a~211i)…差込孔、212…ストレート孔、213…テーパ孔、251…ピン部、252…鍔部、300…刃付治具、301…刃部、400…固定治具、401…ガイドピン、401…治具筐体、402…ガイドピン、403…後端保持部、FA…成形前のフレキシブルプリント基板、FB…成形後のフレキシブルプリント基板、FB1…曲成部、F1…絶縁層、F2…導電パターン、F3…接着層、F4,F4B…切り落とし部、F5…孔部、F6…切断ライン
 
DESCRIPTION OF SYMBOLS 10, 10B, 10D ... Jig for board | substrate manufacture, 20 ... 1st jig | tool, 20A ... 1st division part, 20B ... 2nd division part, 21 ... Main-body part, 22 ... Recessed part, 23 ... Tip fixing member (1st (Corresponding to holding means), 23a ... tip receiving portion, 23b ... latching pin, 24, 24D ... fixed pin (corresponding to an example of a support member), 25 (25a-25b) ... movable pin, 26 ... end fixing member (first 2 ... corresponding to 2 holding means), 27 ... concave portion, 28 ... punching plate, 28a ... hole portion, 29 ... divided portion, 30 ... second jig, 31 ... main body portion, 32 ... convex portion, 33 ... sleeve, 100 ... substrate Manufacturing apparatus, 110 ... control unit, 120 ... jig clamping mechanism, 121 ... clamping member, 130 ... jig slider, 131 ... slide motor (corresponding to the second driving means), 132 ... belt, 140 ... pin pushing mechanism, 141 , 152, 162, 192 ... Air 150, torque roller contact / separation mechanism, 151 ... torque roller, 151a ... drive roller, 151b ... driven roller, 160 ... free roller contact / separation mechanism, 161 ... free roller, 161a, 161b ... driven roller, 170 ... roller drive mechanism , 171 ... Driving motor, 180 ... Tip holding mechanism, 181 ... Tip clamping member, 181a ... Tip side contact portion, 181b ... Top surface contact portion, 182 ... Air cylinder (corresponding to the first drive means), 190 ... Side push This mechanism, 191 ... side pressing member, 191a ... side contact part, 200 ... rear end holding member, 211 (211a to 211i) ... insertion hole, 212 ... straight hole, 213 ... taper hole, 251 ... pin part, 252 ... Gutter, 300 ... Jig with blade, 301 ... Blade, 400 ... Fixing jig, 401 ... Guide pin, 401 ... Jig housing, 402 ... Guide pin , 403 ... rear end holding part, FA ... flexible printed circuit board before molding, FB ... flexible printed circuit board after molding, FB1 ... bent part, F1 ... insulating layer, F2 ... conductive pattern, F3 ... adhesive layer, F4, F4B ... cut-off part, F5 ... hole, F6 ... cutting line

Claims (10)

  1.  配線層と、この配線層を両側から覆うと共に熱可塑性樹脂を材質とする絶縁層とを有するフレキシブルプリント基板であって、複数個所に曲成部を有するフレキシブルプリント基板を基板製造用治具を用いて形成するフレキシブルプリント基板の製造方法であって、
     前記基板製造用治具のうち前記フレキシブルプリント基板の一方側を保持する第1保持手段に当該フレキシブルプリント基板の一方側を保持させる第1保持工程と、
     前記第1保持工程の後に、前記基板製造用治具のうち前記フレキシブルプリント基板を湾曲させて前記曲成部を形成するための複数の支持部材に当該フレキシブルプリント基板を掛け回す状態で支持させる掛け回し工程と、
     前記掛け回し工程の後に、前記基板製造用治具のうち前記フレキシブルプリント基板の他方側を保持する第2保持手段に当該フレキシブルプリント基板の他方側を保持させて前記フレキシブルプリント基板にテンションを付与した状態を維持する第2保持工程と、
     前記基板製造用治具の少なくとも一部に前記フレキシブルプリント基板の保持状態が維持された状態で、前記フレキシブルプリント基板を加熱成形する加熱成形工程と、
     を備えることを特徴とするフレキシブルプリント基板の製造方法。
    A flexible printed circuit board having a wiring layer and an insulating layer made of a thermoplastic resin while covering the wiring layer from both sides, and using a flexible printed circuit board having bent portions at a plurality of locations, using a jig for substrate production A method for producing a flexible printed circuit board formed by
    A first holding step for holding one side of the flexible printed circuit board in a first holding means for holding one side of the flexible printed circuit board among the jig for manufacturing the board;
    A hook for supporting the flexible printed circuit board in a state of being wound around a plurality of support members for forming the bent portion by bending the flexible printed circuit board in the substrate manufacturing jig after the first holding step. Turning process;
    After the wrapping step, a tension is applied to the flexible printed circuit board by holding the other side of the flexible printed circuit board in the second holding means for holding the other side of the flexible printed circuit board in the substrate manufacturing jig. A second holding step for maintaining the state;
    In a state where the holding state of the flexible printed circuit board is maintained in at least a part of the substrate manufacturing jig, a heat forming step of heat forming the flexible printed circuit board,
    The manufacturing method of the flexible printed circuit board characterized by the above-mentioned.
  2.  請求項1記載のフレキシブルプリント基板の製造方法であって、
     前記基板製造用治具は、第1治具と、第2治具とを有し、前記第2治具に対して前記第1治具が着脱可能に設けられていて、
     前記第1治具には、前記第1保持手段を構成する先端固定部材と、複数の前記支持部材と、前記第2保持手段を構成する終端固定部材とが設けられていて、
     前記第1保持工程では、前記先端固定部材を用いて前記フレキシブルプリント基板の一方側を保持させ、
     前記第2保持工程では、前記終端固定部材を用いて前記フレキシブルプリント基板の他方側を保持させる、
     ことを特徴とするフレキシブルプリント基板の製造方法。
    It is a manufacturing method of the flexible printed circuit board according to claim 1,
    The substrate manufacturing jig includes a first jig and a second jig, and the first jig is detachably attached to the second jig,
    The first jig is provided with a front end fixing member constituting the first holding means, a plurality of the supporting members, and a terminal fixing member constituting the second holding means,
    In the first holding step, the one side of the flexible printed board is held using the tip fixing member,
    In the second holding step, the other end of the flexible printed board is held using the terminal fixing member.
    A method for producing a flexible printed circuit board.
  3.  請求項2記載のフレキシブルプリント基板の製造方法であって、
     前記先端固定部材は、前記フレキシブルプリント基板の一端側と面状に接触する先端受部と、前記先端受部から離間する方向に突出する掛止ピンとを備え、
     前記第1保持工程では、前記フレキシブルプリント基板の一端側に形成された前記孔部に前記掛止ピンを挿通させる、
     ことを特徴とするフレキシブルプリント基板の製造方法。
    It is a manufacturing method of the flexible printed circuit board according to claim 2,
    The tip fixing member includes a tip receiving portion that is in planar contact with one end side of the flexible printed circuit board, and a latch pin that protrudes in a direction away from the tip receiving portion,
    In the first holding step, the latch pin is inserted through the hole formed on one end side of the flexible printed circuit board.
    A method for producing a flexible printed circuit board.
  4.  請求項2または3記載のフレキシブルプリント基板の製造方法であって、
     前記先端固定部材と共に前記フレキシブルプリント基板の一端側を挟持する先端保持機構が設けられていて、
     前記先端保持機構は、前記先端固定部材に対して接離する先端挟持部材と、前記先端挟持部材を移動させる第1駆動手段とを有している、
     ことを特徴とするフレキシブルプリント基板の製造方法。
    It is a manufacturing method of the flexible printed circuit board according to claim 2 or 3,
    A tip holding mechanism for holding one end side of the flexible printed circuit board together with the tip fixing member is provided,
    The tip holding mechanism includes a tip clamping member that contacts and separates from the tip fixing member, and first driving means that moves the tip clamping member.
    A method for producing a flexible printed circuit board.
  5.  請求項1から4のいずれか1項に記載のフレキシブルプリント基板の製造方法であって、
     前記支持部材は、前記第1治具を貫通する差込孔に差し込まれる可動ピンを備え、前記差込孔に可動ピンを差し込み、その差し込む側とは反対側から前記可動ピンを突出させることにより前記フレキシブルプリント基板を掛け回すことを可能としていると共に、
     前記第2治具には、前記可動ピンの差し込みをガイドする貫通孔が形成されている、
     ことを特徴とするフレキシブルプリント基板の製造方法。
    It is a manufacturing method of the flexible printed circuit board according to any one of claims 1 to 4,
    The support member includes a movable pin inserted into an insertion hole penetrating the first jig, and the movable pin is inserted into the insertion hole, and the movable pin protrudes from a side opposite to the insertion side. It is possible to hang the flexible printed circuit board,
    A through hole for guiding insertion of the movable pin is formed in the second jig.
    A method for producing a flexible printed circuit board.
  6.  請求項5記載のフレキシブルプリント基板の製造方法であって、
     前記基板製造用治具は、治具スライダによってスライド可能に設けられていて、
     前記治具スライダには、当該スライドのための駆動力を与える第2駆動手段が設けられている、
     ことを特徴とするフレキシブルプリント基板の製造方法。
    It is a manufacturing method of the flexible printed circuit board according to claim 5,
    The substrate manufacturing jig is slidably provided by a jig slider,
    The jig slider is provided with second driving means for providing a driving force for the slide.
    A method for producing a flexible printed circuit board.
  7.  請求項6記載のフレキシブルプリント基板の製造方法であって、
     前記掛け回し工程では、
     開閉可能な一対のローラを備えるトルクローラと、同じく開閉可能な一対のローラを備える共に前記トルクローラよりも前記第1保持手段側に位置するフリーローラとで前記フレキシブルプリント基板を挟持すると共に、
     前記トルクローラを構成する一対のローラの少なくとも一方には、ローラ駆動機構によって駆動力が与えられ、この駆動力によって前記フレキシブルプリント基板にテンションが及ぼされると共に、
     前記フレキシブルプリント基板の挟持状態において、前記フレキシブルプリント基板の搬送方向に対して交差する方向に前記フリーローラを移動させつつ前記基板製造用治具を前記搬送方向に移動させて、前記可動ピンが成形後の曲成部の内周側に配置される位置に前記基板製造用治具を移動させ、その移動の後に前記可動ピンを前記差込孔に差し込む、
     ことを特徴とするフレキシブルプリント基板の製造方法。
    It is a manufacturing method of the flexible printed circuit board of Claim 6, Comprising:
    In the wrapping step,
    The flexible printed circuit board is sandwiched between a torque roller having a pair of openable and closable rollers and a free roller having a pair of similarly openable and closable rollers and positioned closer to the first holding means than the torque roller,
    A driving force is applied to at least one of the pair of rollers constituting the torque roller by a roller driving mechanism, and a tension is applied to the flexible printed circuit board by the driving force.
    In a state where the flexible printed circuit board is held, the movable pin is formed by moving the substrate manufacturing jig in the transport direction while moving the free roller in a direction intersecting the transport direction of the flexible printed circuit board. Moving the substrate manufacturing jig to a position to be arranged on the inner peripheral side of the later bent portion, and inserting the movable pin into the insertion hole after the movement;
    A method for producing a flexible printed circuit board.
  8.  請求項1から7のいずれか1項に記載のフレキシブルプリント基板の製造方法であって、
     前記第1保持工程の後であって前記掛け回し工程の前に、前記フレキシブルプリント基板の側面に側面押当部材を押し当てることで、当該フレキシブルプリント基板のスキュー方向の調整を行うスキュー調整工程を備える、
     ことを特徴とするフレキシブルプリント基板の製造方法。
    It is a manufacturing method of the flexible printed circuit board according to any one of claims 1 to 7,
    A skew adjustment step of adjusting the skew direction of the flexible printed circuit board by pressing a side pressing member against the side surface of the flexible printed circuit board after the first holding process and before the winding process. Prepare
    A method for producing a flexible printed circuit board.
  9.  配線層と、この配線層を両側から覆うと共に熱可塑性樹脂を材質とする絶縁層とを有すると共に、複数個所に曲成部を有するフレキシブルプリント基板を形成するための基板製造用治具であって、
     前記フレキシブルプリント基板の一方側を保持する第1保持手段と、
     前記フレキシブルプリント基板を掛け回す状態で湾曲させて前記曲成部を形成するための複数の支持部材と、
     前記フレキシブルプリント基板の他方側を保持して前記フレキシブルプリント基板にテンションを付与した状態を維持する第2保持手段と、
     を備えることを特徴とする基板製造用治具。
    A substrate manufacturing jig for forming a flexible printed board having a wiring layer and an insulating layer made of a thermoplastic resin while covering the wiring layer from both sides and having bent portions at a plurality of locations. ,
    First holding means for holding one side of the flexible printed circuit board;
    A plurality of support members for forming the bent portion by bending the flexible printed circuit board;
    Second holding means for holding the other side of the flexible printed circuit board and maintaining a state in which tension is applied to the flexible printed circuit board;
    A jig for manufacturing a substrate, comprising:
  10.  配線層と、この配線層を両側から覆うと共に熱可塑性樹脂を材質とする絶縁層とを有すると共に、複数個所に曲成部を有するフレキシブルプリント基板を形成するための基板製造装置であって、
     開閉可能であると共に前記フレキシブルプリント基板の接離方向に移動可能な一対のローラから構成されるトルクローラを有するトルクローラ接離機構と、
     開閉可能であると共に前記フレキシブルプリント基板の接離方向に移動可能な一対のローラから構成されるフリーローラを有するフリーローラ接離機構と、
     前記トルクローラを構成する一対のローラの少なくとも一方に駆動力を与え、この駆動力によって前記フレキシブルプリント基板にテンションを及ぼすローラ駆動機構と、
     前記基板製造用治具を前記フレキシブルプリント基板の搬送方向に移動させる治具スライダと、
     前記フレキシブルプリント基板を保持するための基板製造用治具のうち、前記フレキシブルプリント基板の一方側を第1保持手段に保持させた後に、前記フリーローラ接離機構を前記フレキシブルプリント基板の搬送方向に対して交差する方向に移動させつつ前記治具スライダによって前記基板製造用治具を移動させ、さらに前記可動ピンが成形後の曲成部の内周側に配置される位置に前記基板製造用治具を移動させる制御を行う制御部と、
     を備えることを特徴とする基板製造装置。
    A board manufacturing apparatus for forming a flexible printed board having a wiring layer and an insulating layer made of a thermoplastic resin and covering the wiring layer from both sides, and having bent portions at a plurality of locations,
    A torque roller contact / separation mechanism having a torque roller that is configured of a pair of rollers that can be opened and closed and moved in the contact / separation direction of the flexible printed circuit board;
    A free roller contact / separation mechanism having a free roller configured to be openable and closable and composed of a pair of rollers movable in the contact / separation direction of the flexible printed circuit board;
    A roller driving mechanism that applies a driving force to at least one of a pair of rollers constituting the torque roller, and exerts a tension on the flexible printed circuit board by the driving force;
    A jig slider for moving the board manufacturing jig in the conveying direction of the flexible printed circuit board;
    Of the substrate manufacturing jig for holding the flexible printed circuit board, after holding one side of the flexible printed circuit board on the first holding means, the free roller contacting / separating mechanism is moved in the conveying direction of the flexible printed circuit board. The substrate manufacturing jig is moved by the jig slider while moving in a direction crossing the substrate, and the movable pin is disposed on the inner peripheral side of the bent portion after molding. A control unit that performs control to move the tool;
    A substrate manufacturing apparatus comprising:
PCT/JP2014/082977 2014-04-17 2014-12-12 Flexible printed board manufacturing method, board manufacturing jig, and board manufacturing method WO2015159458A1 (en)

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KR102464846B1 (en) * 2016-03-14 2022-11-09 삼성디스플레이 주식회사 Method of assembling display device and the display device assembled thereby
JP6703450B2 (en) * 2016-07-12 2020-06-03 日本メクトロン株式会社 Flexible printed wiring board manufacturing method and flexible printed wiring board manufacturing apparatus
KR20200060617A (en) * 2018-11-22 2020-06-01 삼성디스플레이 주식회사 Flexible printed circuit board inserting device, and method thereof
CN112974580B (en) * 2021-05-11 2021-07-30 四川英创力电子科技股份有限公司 Bent circuit board and processing equipment and method thereof
CN113939080A (en) * 2021-11-19 2022-01-14 安捷利电子科技(苏州)有限公司 Circuit board grid and preparation method thereof

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53120669A (en) * 1977-03-31 1978-10-21 Hitachi Ltd Tension controller for stretch bending former
JPS5935300B2 (en) * 1977-12-26 1984-08-28 株式会社日立製作所 Tensile bending method
JPH03220787A (en) * 1990-01-26 1991-09-27 Yazaki Corp Flexible circuit body and manufacture thereof
JP2003031288A (en) * 2001-07-18 2003-01-31 Yazaki Corp Flat circuit body and method for manufacturing the same
JP2008251695A (en) * 2007-03-29 2008-10-16 Optrex Corp Bending equipment of flexible substrate, and bending method of the flexible substrate
JP2011233822A (en) * 2010-04-30 2011-11-17 Nippon Mektron Ltd Flexible circuit board
JP2012160596A (en) * 2011-02-01 2012-08-23 Panasonic Corp Flexible printed circuit board

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2158087A (en) * 1932-07-15 1939-05-16 Paper Service Co Apparatus for imparting stretchability to webs
JPS54148077A (en) * 1978-05-11 1979-11-19 Nippon Sheet Glass Co Ltd Method and apparatus for making corrugated sheet
JPS6051213B2 (en) * 1978-05-30 1985-11-13 株式会社フジクラ Manufacturing equipment for flexible tape electric wire
DE2916248A1 (en) * 1979-04-21 1980-10-30 Phoenix Ag Appts. for mfg. wall members from plastics sheets. - has groups of tubes in parallel vertical planes movable into interlocked position for corrugating sheets
JPS56106310U (en) * 1980-01-18 1981-08-19
JPH0745172B2 (en) * 1986-01-09 1995-05-17 株式会社東芝 Method for manufacturing corrugated insulator
JPS6329817U (en) * 1986-08-12 1988-02-26
JPS643916A (en) * 1987-06-26 1989-01-09 Fujikura Ltd Manufacture of wavy-shaped wire
JP3220787B2 (en) * 1997-10-30 2001-10-22 日精樹脂工業株式会社 Screw head device of injection molding machine
US6843870B1 (en) * 2003-07-22 2005-01-18 Epic Biosonics Inc. Implantable electrical cable and method of making
KR100541958B1 (en) * 2004-04-21 2006-01-10 삼성전자주식회사 Flexible printed circuit board
JP2009231684A (en) * 2008-03-25 2009-10-08 Panasonic Corp Flexible substrate
EP2306794B1 (en) * 2008-06-30 2015-08-05 Nippon Steel & Sumikin Chemical Co., Ltd. Method for producing flexible circuit board
JP5717961B2 (en) * 2009-12-24 2015-05-13 日本メクトロン株式会社 Method for manufacturing flexible circuit board
CN103299448B (en) * 2010-09-29 2016-09-07 Posco公司 Use the manufacture method of flexible electronic device, flexible electronic device and the flexible base board of roll shape mother substrate
JP6029262B2 (en) * 2011-04-26 2016-11-24 日本メクトロン株式会社 Flexible circuit body

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53120669A (en) * 1977-03-31 1978-10-21 Hitachi Ltd Tension controller for stretch bending former
JPS5935300B2 (en) * 1977-12-26 1984-08-28 株式会社日立製作所 Tensile bending method
JPH03220787A (en) * 1990-01-26 1991-09-27 Yazaki Corp Flexible circuit body and manufacture thereof
JP2003031288A (en) * 2001-07-18 2003-01-31 Yazaki Corp Flat circuit body and method for manufacturing the same
JP2008251695A (en) * 2007-03-29 2008-10-16 Optrex Corp Bending equipment of flexible substrate, and bending method of the flexible substrate
JP2011233822A (en) * 2010-04-30 2011-11-17 Nippon Mektron Ltd Flexible circuit board
JP2012160596A (en) * 2011-02-01 2012-08-23 Panasonic Corp Flexible printed circuit board

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JP2015207585A (en) 2015-11-19
TW201603670A (en) 2016-01-16

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