JP2009231684A - Flexible substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a flexible substrate for reducing the external force load applied to a solid-state imaging apparatus in the flexible substrate that prevents the disturbance of signal waveforms by suppressing the impedance of a flexible substrate, while securing necessary flexibility in the flexible substrate, reduces the radiation from the flexible substrate itself, and is further used for the imaging apparatus. <P>SOLUTION: A flexible substrate that is connected to an electron device, having a signal terminal is provided with a transmission path that is arranged on an insulating layer to transmit signals from the signal terminal; and a conductor layer that is arranged opposite to the transmission path via the insulating layer and including a ground path that is grounded. Along the transmission direction of signals, it is divided into a first region and a second region adjacent to the first region. The width of the conductor layer in the first region is formed smaller than the width of the conductor layer in the second region. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a flexible substrate connected to an electronic device, and more particularly to a flexible substrate used in an imaging apparatus such as a television camera or a video camera.

  Conventionally, for example, a flexible substrate has been widely used to transmit a signal from an electronic device. FIG. 1 is a schematic perspective view of a flexible substrate 11 and an imaging block 10 used in an electronic device (for example, an imaging block 10 in which a solid-state imaging element used in an imaging apparatus and a prism are joined). FIG. 3 is a schematic cross-sectional view of the substrate 11 as viewed from the X direction. FIG.

  As shown in FIG. 2, the conventional flexible substrate 11 includes a transmission path (wiring pattern) 13 for transmitting signals, an insulating layer 14, and a conductor layer 15 (ground pattern) for effectively shielding various radiation noises. Prepare. In FIG. 2, a transmission path 13 is formed on one surface of the insulating layer 14 of the flexible substrate 11, and a conductor layer 15 is formed on the other surface, for example, in a mesh shape. The flexible substrate 11 having such a configuration transmits the signal generated from the imaging block 10 through the transmission path 13 to the connector 12 in FIG.

  Further, when a signal is transmitted in the flexible substrate 11, radiation is generated from the flexible substrate 11, but this radiation is reduced by forming the conductor layer 15 on the other surface of the insulating layer 14. . The effect of reducing radiation using the conductor layer 15 in this way is generally called a shield effect. Such a shielding effect is used in flexible substrates used in various electronic devices.

  In recent years, a three-plate color camera (hereinafter referred to as a three-plate camera) has been developed and widely used as an imaging apparatus using three solid-state imaging devices. In addition, digital cameras and digital video cameras using such a solid-state image sensor have been improved in image quality. In particular, digital video cameras are moving from conventional standard image quality to high-definition image quality due to the high-definition television. As a result, the number of pixels is increased and the color separation capability is improved, and the 3CCD (Charge Coupled Device) method and the 3CMOS (Complementary Metal-Oxide Semiconductor) method, which assign solid-state image sensors for each of the three primary colors of light, are becoming mainstream. . The structure of such a conventional three-panel camera will be described with reference to the drawings.

  FIG. 3 is a schematic cross-sectional view of the imaging block 10 in the conventional three-plate camera. As shown in FIG. 3, the imaging block 10 includes a color separation prism 1 that separates light incident through an imaging lens (not shown) in a three-plate camera into predetermined color components, and a plurality of solid-state imaging devices 2r, 2g. 2b and image pickup device substrates 3r, 3g, 3b on which the respective solid-state image pickup devices are mounted.

  In a conventional three-plate camera having such a configuration, it is necessary to accurately superimpose three color subject images. If the overlay accuracy, that is, the registration accuracy is poor, color misregistration and moire false signals are generated, and the image quality is slightly degraded. Therefore, it is necessary to reduce the external force load applied to each solid-state imaging device 2r, 2g, 2b so that the registration accuracy does not deteriorate.

  Moreover, the flexible substrate 11 as described above is used in an imaging apparatus having such a conventional three-plate camera (see FIG. 1). As shown in FIG. 1, the flexible substrate 11 is connected to each solid-state imaging device 2r, 2g, 2b. As a result, stress or an external force load due to bending of the flexible substrate 11 is applied to the solid-state imaging devices 2r, 2g, and 2b via the flexible substrate 11.

  Therefore, in a conventional imaging device, a flexible substrate that reduces the generation of stress due to bending of the flexible substrate has been proposed (see, for example, Patent Document 1).

In Patent Document 1, the flexible substrate has a mesh-like ground pattern formed on the surface opposite to the surface on which a transmission path (wiring pattern) for transmitting signals is formed. In the structure of such a flexible substrate, since further flexibility can be obtained, generation of stress due to bending of the flexible substrate can be reduced.
Japanese Patent Laid-Open No. 9-298626

  In recent years, positioning of each solid-state imaging device in such a three-plate camera is demanding accuracy of the order of μm. For example, positioning of each solid-state imaging device 2r, 2g, 2b has a depth of focus in the optical axis direction. Therefore, an accuracy of the order of μm is required in the direction of several tens μm and in the subject image plane.

  In the flexible substrate of Patent Document 1, in order to make it more flexible, the width of the ground pattern and the wiring pattern of the conductor layer can be formed as thin as possible to greatly reduce the external force load applied to the flexible substrate. it can. However, in such a flexible substrate, the ratio of receiving the electric field generated in the signal wiring by the ground pattern decreases, the wiring impedance increases, the signal waveform is disturbed and the radiation from the flexible substrate itself increases, and the unnecessary radiation is large. There is a problem that becomes a factor.

  On the other hand, when the conductor layer 15 of the flexible substrate 11 as shown in FIG. 2 has the insulating layer 14 formed on the entire surface, the flexibility of the flexible substrate 11 may be reduced, making it difficult to handle the flexible substrate 11. is there. As a result, since the signal terminal of the solid-state imaging device is fixed to the flexible substrate, the external force load applied to the flexible substrate due to temperature change or stress load and the stress due to bending of the flexible substrate are transmitted to the solid-state imaging device as they are. Therefore, the external force load applied to the solid-state image sensor cannot be reduced sufficiently, and depending on the magnitude of the applied external force, it may affect the positioning accuracy of the image sensor. Is a problem.

  As described above, regarding a flexible substrate used in an imaging device such as an electronic device, particularly a television camera or a video camera equipped with a solid-state imaging device, both flexibility and shielding effect of the flexible substrate are required.

Accordingly, an object of the present invention is to solve the above-described problem, and in the flexible substrate, while ensuring necessary flexibility, the impedance of the flexible substrate is suppressed to prevent signal waveform disturbance, and the flexible substrate An object of the present invention is to provide a flexible substrate that can reduce radiation from itself.
Furthermore, in the flexible substrate used for an imaging device, it is providing the flexible substrate which reduces the external force load added to a solid-state imaging device.

  In order to achieve the above object, the present invention is configured as follows.

  According to the first aspect of the present invention, there is provided a flexible substrate connected to an electronic device having a signal terminal, the transmission path being disposed on the insulating layer and transmitting a signal from the signal terminal, and the insulating layer interposed therebetween. And a conductor layer including a ground path that is disposed opposite to the transmission path and is grounded, and a first area and a second area adjacent to the first area along the signal transmission direction. There is provided a flexible substrate characterized by being divided into regions, wherein the width of the conductor layer in the first region is smaller than the width of the conductor layer in the second region.

  According to the second aspect of the present invention, in the first region, the distance from the end of the transmission path to the end of the conductor layer is formed to be not less than 5 times the width of the transmission path. A flexible substrate according to a first aspect is provided.

  According to the third aspect of the present invention, the direction bent or curved in the direction orthogonal to the signal transmission direction in the first region is another first region adjacent to the second region. The flexible substrate according to the first aspect or the second aspect, wherein the flexible substrate is in a direction opposite to a direction bent or curved.

  According to a fourth aspect of the present invention, there is provided the flexible substrate according to any one of the first aspect to the third aspect, wherein the transmission direction of the signal on the transmission path is a single direction.

  According to the fifth aspect of the present invention, the end of the conductor layer connecting the end of the conductor layer in the first region and the end of the conductor layer in the second region is formed in a linear shape. A flexible substrate according to any one of the first to fourth aspects is provided.

  According to the sixth aspect of the present invention, the end of the conductor layer connecting the end of the conductor layer in the first region and the end of the conductor layer in the second region is formed in a curved shape. A flexible substrate according to any one of the first to fourth aspects is provided.

  According to a seventh aspect of the present invention, there is provided the flexible substrate according to the first aspect, wherein the electronic device is a light receiving element including a prism member.

According to the present invention, a transmission path that is disposed on an insulating layer and transmits a signal from a signal terminal, and a conductor layer that is disposed to face the transmission path via the insulating layer and includes a grounding path that is grounded. The flexible substrate is divided into a first region and a second region adjacent to the first region along the signal transmission direction, and the width of the conductor layer in the first region is a conductor in the second region. Since the structure formed smaller than the width of the layer is employed, the flexible substrate can ensure necessary flexibility in the first region. Accordingly, the flexible substrate can be bent or bent in the first region in parallel with the direction orthogonal to the signal transmission direction (longitudinal direction) of the flexible substrate, and by the bending or bending of the flexible substrate. Stress can be reduced.
Furthermore, since the flexible substrate has a structure with a conductor layer that includes a grounding path that is grounded, the impedance of the flexible substrate is suppressed to prevent signal waveform disturbance and ensure the necessary shielding effect. Thus, radiation from the flexible substrate itself can be reduced.

  Moreover, since the flexible substrate has flexibility, the external force load applied from the flexible substrate connected to the imaging element substrate can be remarkably reduced. As a result, the stress load such as springback applied to the solid-state imaging device can be significantly reduced. Therefore, it is possible to reduce the stress load applied to the solid-state imaging device while suppressing the increase in radiation from the flexible substrate itself while ensuring the necessary flexibility in the flexible substrate with a relatively simple structure. Thus, it is possible to provide a flexible device capable of suppressing a decrease in registration accuracy.

  As described above, the flexible substrate according to the present invention can achieve both reduction of radiation from the flexible substrate itself and reduction of external force load applied to the solid-state imaging device.

  Embodiments according to the present invention will be described below with reference to the drawings.

  FIG. 4 is a schematic cross-sectional view of the imaging block 20 and the flexible substrate 21 having the structure of a three-plate camera which is an example of an imaging device including the flexible substrate 21 according to the embodiment of the present invention. As shown in FIG. 4, in the imaging block 20 of this embodiment, three prism members 1r, 1g, and 1b are joined via an adhesive, and each solid-state imaging device 2r, 2g, and 2b is joined via an adhesive. It has a joined structure. The structure itself of the imaging block 20 shown in FIG. 4 is the same as that of the imaging block 10 shown in FIG. 3, and thus the same reference numerals are assigned to the same components and the description thereof is omitted.

  Here, returning to FIG. 3, the structure and function of the three-plate camera according to the present embodiment will be described. As shown in FIG. 3, the color separation prism 1 is constituted by three prism members 1r, 1g, and 1b being in close contact with each other, and is a three-color separation prism member that separates incident light into three color components. It is. The joining interfaces of the prism members 1r, 1g, and 1b are dichroic mirrors 4 and 5, respectively. In addition, solid imaging elements 2r, 2g, and 2b are individually fixed to the light emission surfaces of the three prism members 1r, 1g, and 1b via an adhesive.

  In FIG. 3, the light beam 7 incident on the three-color separation prism 1 is color-separated into three color components, that is, light beams 6a, 6b, and 6c of the three primary colors of light by the dichroic mirrors 4 and 5, respectively. Light is received by the image sensors 2r, 2g, and 2b. Of the light beams separated and reflected by the dichroic mirrors 4 and 5 into the three primary colors, the light beams 6a and 6b are totally reflected again in the respective prism members 1g and 1b, so that they are not inverted images (mirror images). It is received by the solid-state imaging devices 2g and 2b as a light beam that forms an image. The respective light fluxes received by the respective solid-state image pickup devices 2g, 2b, and 2r are processed as image pickup signals by the respective image pickup device substrates 3r, 3g, and 3b, and are color television signals obtained by combining the image pickup signals. Is obtained.

  Next, returning to FIG. 4, in the imaging block 20 of the present embodiment, as described above, the three prism members 1r, 1g, and 1b are joined via an adhesive, and the respective solid-state imaging devices 2r, 2g, 2b has a structure joined through an adhesive. Furthermore, as shown in FIG. 4, each of the image pickup device substrates 3 r, 3 g, and 3 b and the flexible substrate 21 are connected to each of the solid-state image pickup devices 2 r, 2 g, and 2 b. As such a flexible substrate 21, for example, an FFC (Flexible Flat Cable), an FPC (Flexible Printed Circuit), or the like is used, and an image control substrate (not shown) to which the image pickup device substrates 3 r, 3 g, 3 b and the connector 22 are connected. )).

  Here, a schematic plan view of a part of the flexible substrate 21 of this embodiment viewed from the transmission path 31 is shown in FIG. 6 is a schematic cross-sectional view as seen from the B direction of the flexible substrate 21 in FIG. 5, and FIG. 7 is a schematic cross-sectional view as seen from the C direction of the flexible substrate 21 in FIG. With reference to FIGS. 5 to 7, the structure of the flexible substrate 21 of the present embodiment will be described. In FIG. 5, it is shown through an insulating layer 32 described later.

  As shown in FIG. 5, the flexible substrate 21 is divided into a first region 35 and a second region 36 adjacent to the first region 35 along the signal transmission direction (arrow D direction). . As described above, the flexible substrate 21 has a configuration in which the first region 35 and the second region 36 are connected and connected to each other. Further, the flexible substrate 21 includes a transmission path 31, an insulating layer 32, and a conductor layer 33.

  As described above, the transmission path 31 transmits signals from the image pickup device substrates 3r, 3g, and 3b, and a plurality of transmission paths 31 are formed on the upper surface of the insulating layer 32 as shown in FIG. The insulating layer 32 is formed of an insulating member. The plurality of transmission paths 31 are made of a conductive material, and are fixed to the surface of the insulating layer 32 through, for example, an adhesive. Specifically, the transmission path 31 is formed with a conductor line for transmitting a signal, for example, by foil-like copper.

  As shown in FIG. 6, the conductor layer 33 is formed on substantially the entire lower surface of the insulating layer 32. The conductor layer 33 is formed of a material containing a conductor material. Specifically, the conductor layer 33 is formed of a conductor material such as copper or aluminum so as to include a ground path that is connected to the ground (for example, the ground) on the substantially entire lower surface of the insulating layer 32 in the figure. It is fixed to the surface of the insulating layer 32 via an adhesive, for example. Thereby, the conductor layer 33 can receive an electric field generated in the transmission path 31. As a result, the flexible substrate 21 can reduce radiation from the flexible substrate 21 itself.

  Next, as shown in FIG. 6 or FIG. 7, the conductor layer 33 is formed with a width w3 in the first region 35, and a width w5 (corresponding to the width of the flexible substrate 21) in the second region 36. ). As shown in FIG. 6 or FIG. 7, the width w3 of the conductor layer 33 in the first region 35 is not more than the width w5 of the conductor layer 33 in the second region 36 and is not less than the width w4 of the transmission path 31.

  In the first region 35, the end of the conductor layer 33 that connects the end of the conductor layer 33 in the first region 35 and the end of the conductor layer 33 in the second region 36 is formed in a linear shape. Has been. Here, the end portion according to the present embodiment corresponds to an end portion forming a width in a direction orthogonal to the signal transmission direction (arrow D direction). That is, as shown in FIG. 5, the trapezoidal cutout 34 is formed in the conductor layer 33 in the first region 35. Thereby, since the area | region of the conductor layer 33 is small compared with the 2nd area | region 36, the 1st area | region 35 in the flexible substrate 21 can have a further flexibility. As a result, in the first region 35, the flexible substrate 21 can be bent or curved in parallel with a direction orthogonal to the signal transmission direction.

  In addition, as described above, the width of the conductor layer 33 in the first region 35 is formed to be equal to or larger than the width w4 of the plurality of transmission paths 31 arranged to face each other, preferably in FIG. 5 or FIG. As shown, in the first region 35, the distance w2 from the end of the transmission path 31 to the end of the conductor layer 33 is formed to be 5 times or more the width w1 of the transmission path 31. Thereby, in the first region 35, a larger region of the conductor layer 33 can be ensured than in the case where the width of the conductor layer 33 is the width w <b> 4 of the plurality of transmission paths 31. As a result, the electric field generated in the transmission path 31 can be reliably received, and the radiation from the flexible substrate 21 itself can be further reduced.

  As shown in FIG. 5, the insulating layer 32 is formed with a width w5 (corresponding to the second region 36) in all regions. In the first region 35, the insulating layer 32 may be formed in the same shape as the conductor layer 33. Therefore, the width of the insulating layer 32 in the first region is formed smaller than the width of the insulating layer 32 in the second region. For example, in the first region 35, the insulating layer 32 is formed with a trapezoidal notch 34 similar to the conductor layer 33.

  Here, in the flexible substrate 21 shown in FIG. 4, a schematic enlarged view in which the range A is enlarged is shown in FIG. 8. As shown in FIG. 8, the end M of the flexible substrate 21 is connected to each of the image pickup device substrates 3r, 3g, and 3b, and the connector 22 of the flexible substrate 21 is connected to the image control substrate 23. As a result, signals generated by the image pickup device substrates 3r, 3g, and 3b are transmitted through the transmission path 31 and input to the image control substrate 23.

  Further, as shown in FIG. 8, in the plurality of first regions 35, the flexible substrate 21 is bent or curved in parallel with a direction orthogonal to the signal transmission direction (arrow D direction, see FIG. 5). The In the plurality of first regions 35, for example, the direction in which the first region 35 disposed in one of the second regions 36 is bent or curved is different from the other region disposed in the other of the second regions 36. One region 35 is opposite to the direction in which it is bent or curved. In other words, the flexible substrate 21 has a bellows shape due to the plurality of first regions 35. Thus, by providing a plurality of bent or curved first regions 35, a direction perpendicular to the width direction of the bent or curved portion (direction perpendicular to the width direction of the flexible substrate 21: arrow) D direction) flexibility can be obtained. As a result, when the flexible substrate 21 having the bellows shape constituted by the plurality of first regions 35 is used as shown in FIG. 4, the stress load applied to the solid-state imaging device is relieved.

  Next, a schematic diagram showing a bellows-shaped portion of the flexible substrate 21 as shown in FIG. 8 is shown in FIG. As shown in FIG. 9, the flexible substrate 21 is formed of a bellows-shaped portion in which the second region 36 and another second region 36 arranged via the first region 35 are arranged in parallel. Have

  As shown in FIG. 9, the end M is connected to each of the imaging device substrates 3 r, 3 g, 3 b as described above, and the end N is connected to the connector 22. As shown in FIG. 9, the signal transmitted through the transmission path 31 is transmitted in the direction of arrow D indicated by the alternate long and short dash line. That is, signals generated by the image pickup device substrates 3r, 3g, and 3b are transmitted from the end M to the end N. In such a bellows-shaped portion, each of the second region 36 and another second region 36 has a magnetic field in the directions of arrows 46 and 47 indicated by dotted lines. Since the signal flows (in the direction of the one-dot chain line arrow D) in the second and other second regions 36 are opposite to each other, the directions 46 and 47 of the generated magnetic fields are opposite to each other. . That is, the direction of the magnetic field indicated by the arrow 46 is opposite to the direction of the magnetic field indicated by the arrow 47. Thereby, since each of the 2nd and another 2nd field 36 is arranged in parallel, the generated magnetic field can be canceled mutually. As a result, the flexible substrate 21 can suppress radiation from the flexible substrate 21 itself in the bellows shape formed by the plurality of first regions 35.

  In addition, it has been described that the conductor layer 33 of the flexible substrate 21 according to the present embodiment is formed on substantially the entire bottom surface (solid structure) of the insulating layer 32 as shown in FIG. If the necessary shielding effect is sufficiently obtained, it may be formed in a mesh shape, for example.

  As described above, the conductor layer including the grounding path disposed on the insulating layer 32 and transmitting the signal from the signal terminal and facing the transmission path 31 via the insulating layer 32 and grounded. 33 is divided into a first area and a second area adjacent to the first area along the signal transmission direction, and the conductor layer 33 in the first area 35 Since a structure is employed in which the width is smaller than the width of the conductor layer 33 in the second region, the flexible substrate 21 according to the present embodiment ensures the necessary flexibility in the first region. Can do. Thereby, the flexible substrate 21 can be bent or curved in a plurality of first regions 35 in parallel with a direction orthogonal to the signal transmission direction (longitudinal direction) of the flexible substrate 21. The stress due to the bending or bending of 21 can be reduced.

  Furthermore, since the flexible substrate 21 employs a structure having the conductor layer 33 including a grounding path to be grounded, the impedance of the flexible substrate 21 is suppressed to prevent the signal waveform from being disturbed and the necessary shielding effect. And radiation from the flexible substrate 21 itself can be reduced.

  In addition, since the flexible substrate 21 according to the present embodiment employs a structure in which the width of the conductor layer 33 is reduced in the first region 35, the flexible substrate 21 is bent or curved in the first region 35. In addition, since the tensile stress and expansion / contraction stress applied during bending are alleviated, expansion / contraction of the transmission path 31 can be suppressed. As a result, it is possible to prevent the transmission path 31 from being disconnected. Further, since the flexible substrate 21 is bent or curved in the plurality of first regions 35 and has a bellows-like structure, the flexible substrate 21 has flexibility in a direction perpendicular to the width direction of the bent or curved portion. Obtainable.

  In addition, when the flexible substrate 21 according to the present embodiment is connected to each solid-state imaging device 2r, 2g, 2b as shown in FIG. 4, the flexible substrate 21 is, for example, in the vicinity of the imaging device substrate 3b. The first region 35 described above can be curved. As described above, since the flexible substrate 21 has the necessary flexibility, it is possible to reduce the stress caused by the bending of the flexible substrate 21 and further reduce the stress load applied to the solid-state imaging device.

  Here, FIG. 10 shows a schematic plan view of a part of the flexible substrate 51, which is a modification of the present embodiment, viewed from the transmission path 31. Since the structure itself of the flexible substrate 51 shown in FIG. 10 is the same as that of the flexible substrate 21 shown in FIG. 5, the same reference numerals are given to the same constituent members and the description thereof is omitted. Also in FIG. 10, similarly to FIG. 5, it is shown through the insulating layer 32.

  As shown in FIG. 10, in the first region 55, the end of the conductor layer 53 connecting the end of the conductor layer 53 in the first region 55 and the end of the conductor layer 53 in the second region 36 is It is formed in a curved shape. That is, as shown in FIG. 10, a semi-elliptical cutout portion 54 is formed in the conductor layer 53 in the first region 55. Accordingly, the first region 55 in the flexible substrate 51 can be more flexible than the second region 36. As a result, in the first region 55, the flexible substrate 51 is bent or curved in parallel with the direction orthogonal to the signal transmission direction (arrow D direction), similar to the flexible substrate 21 according to the present embodiment. Can.

  As described above, the flexible substrate according to the present embodiment has a relatively simple structure, and while ensuring necessary flexibility, suppresses the impedance of the flexible substrate and prevents the signal waveform from being disturbed. Radiation from itself can be reduced. In addition, when the flexible substrate according to the present embodiment is used in an imaging apparatus including a solid-state imaging element, the flexible substrate according to the present embodiment has the necessary flexibility as described above, so The stress load applied to the image sensor can be reduced, and a decrease in registration accuracy can be suppressed.

  Thus, in the flexible substrate according to the present embodiment, signal waveform disturbance due to suppression of the impedance of the flexible substrate is prevented, radiation from the flexible substrate itself is reduced, and external force load applied to the solid-state imaging device is reduced. Can be compatible.

  It is to be noted that, by appropriately combining arbitrary embodiments of the various embodiments described above, the effects possessed by them can be produced.

  Although the present invention has been fully described in connection with preferred embodiments with reference to the accompanying drawings, various variations and modifications will be apparent to those skilled in the art. Such changes and modifications are to be understood as included within the scope of the present invention as long as they do not depart from the scope of the present invention.

The flexible substrate according to the present invention has a relatively simple structure, and while ensuring the necessary flexibility in the flexible substrate, suppresses the impedance of the flexible substrate to prevent the signal waveform from being disturbed, and from the flexible substrate itself. It has an effect of reducing radiation, and is useful for a general flexible substrate used for transmitting an electrical signal from an electronic device.
Furthermore, the flexible substrate according to the present invention has an effect of reducing a stress load applied to the solid-state image sensor, and is useful for an imaging device such as a television camera and a video camera including the solid-state image sensor.

Schematic perspective view of imaging block and flexible substrate 1 is a schematic cross-sectional view of the flexible substrate of FIG. 1 viewed from the X direction. Schematic sectional view of an imaging block in a conventional three-plate color camera Schematic sectional view of an imaging block having a structure of a three-plate camera which is an example of an imaging apparatus provided with a flexible substrate according to the present embodiment and a flexible substrate Schematic plan view for explaining the configuration of the flexible substrate of the present embodiment Schematic sectional view seen from direction B of flexible substrate in FIG. Schematic sectional view of the flexible substrate of FIG. In the flexible substrate shown in FIG. 4, a schematic enlarged view in which the area A is enlarged. Schematic diagram showing the bellows-shaped portion of the flexible substrate as shown in FIG. Schematic plan view of a flexible substrate according to a modification of the present embodiment

Explanation of symbols

1 Three-color separation prism 1r Prism member (red)
1g Prism member (green)
1b Prism member (blue)
2r solid-state image sensor (for red)
2g solid-state image sensor (for green)
2b Solid-state image sensor (for blue)
3r Image sensor substrate (for red)
3g Image sensor substrate (for green)
3b Image sensor substrate (for blue)
4, 5 Dichroic mirror 6a Light flux of primary color (for red)
6b Primary color luminous flux (for green)
6c Primary color luminous flux (for blue)
7 Light flux 10, 20 Imaging block 11, 21, 51 Flexible substrate 12, 22 Connector 13, 31 Transmission path 14, 32 Insulating layer 15, 33, 53 Conductor layer 34, 54 Notch 35, 55 First region 36 First region 36 2 areas

Claims (7)

A flexible substrate connected to an electronic device having a signal terminal,
A transmission path disposed on the insulating layer and transmitting a signal from the signal terminal;
A conductor layer including a grounding path disposed opposite to the transmission path via the insulating layer and grounded;
Along the transmission direction of the signal, a first area and a second area adjacent to the first area,
A flexible substrate, wherein a width of the conductor layer in the first region is smaller than a width of the conductor layer in the second region.   2. The flexible substrate according to claim 1, wherein in the first region, a distance from an end of the transmission path to an end of the conductor layer is formed to be not less than 5 times the width of the transmission path.   The direction bent or curved in the direction perpendicular to the signal transmission direction in the first region is different from the direction bent or curved in another first region adjacent to the second region. The flexible substrate according to claim 1, wherein the flexible substrate is in a reverse direction.   The flexible substrate according to any one of claims 1 to 3, wherein a signal transmission direction of the transmission path is a single direction.   The end of the conductor layer that connects the end of the conductor layer in the first region and the end of the conductor layer in the second region is formed in a linear shape. The flexible substrate as described in one.   The end of the conductor layer that connects the end of the conductor layer in the first region and the end of the conductor layer in the second region is formed in a curved shape. The flexible substrate as described in one.   The flexible substrate according to claim 1, wherein the electronic device is a light receiving element including a prism member.

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