WO2015139580A1 - 一种光棒及使用其的光源 - Google Patents

一种光棒及使用其的光源 Download PDF

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Publication number
WO2015139580A1
WO2015139580A1 PCT/CN2015/074170 CN2015074170W WO2015139580A1 WO 2015139580 A1 WO2015139580 A1 WO 2015139580A1 CN 2015074170 W CN2015074170 W CN 2015074170W WO 2015139580 A1 WO2015139580 A1 WO 2015139580A1
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Prior art keywords
light
led chip
light bar
heat
heat dissipating
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PCT/CN2015/074170
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English (en)
French (fr)
Inventor
林惠忠
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深圳市光之谷新材料科技有限公司
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Publication of WO2015139580A1 publication Critical patent/WO2015139580A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape

Definitions

  • the present invention relates to the field of lighting technology, and more particularly to a light bar and a light source using the same.
  • LEDs Light emitting diodes
  • the existing light bar includes a substrate, an LED chip, and a fluorescent glue, wherein the substrate is used to place the LED chip, and the fluorescent glue covers the entire substrate to seal the LED chip.
  • the fluorescent glue of the existing light bar covers the entire substrate, resulting in poor heat dissipation and affecting the service life of the LED chip, especially when the power of the LED chip is large, which is likely to cause damage of components.
  • the invention provides a light bar comprising at least one LED chip, a substrate and a fluorescent glue.
  • the substrate includes a support portion and a heat dissipation portion for placing the LED chip.
  • the fluorescent glue is used to cover a support portion of the substrate to seal the at least one LED chip.
  • the heat dissipating portion is connected to the supporting portion, and the heat dissipating portion is exposed outside the fluorescent rubber to dissipate heat.
  • the light bar comprises a plurality of LED chips, the plurality of LED chips being connected in series.
  • the support portion includes a base and a plurality of protrusions connected to the heat dissipation portion.
  • the convex portion of the support portion includes a light blocking surface and a bottom surface, and the bottom surface is used for placing the light emitting diode chip.
  • the light blocking surface and the LED chip are located on the same side of the bottom surface to adjust an illumination angle of the LED chip.
  • the base of the support portion is provided with a circular hole.
  • the plurality of LED chips are located on a top surface of the raised portion.
  • the heat dissipating portion includes a first heat dissipating portion and a second heat dissipating portion, and the first heat dissipating portion and the second heat dissipating portion are connected by glue.
  • a tight fit pattern is disposed between the first heat dissipation portion and the second heat dissipation portion.
  • the first heat dissipation portion is provided with a convex grain
  • the second heat dissipation portion is provided with a concave grain.
  • the invention also provides a light source comprising a light bar.
  • the light bar comprises an LED chip, a substrate and a fluorescent glue.
  • the substrate includes a support portion and a heat dissipation portion for placing the LED chip.
  • the fluorescent glue is used to coat a support portion of the substrate to seal the LED chip.
  • the heat dissipating portion is connected to the supporting portion, and the heat dissipating portion is exposed outside the fluorescent rubber to dissipate heat.
  • the heat-dissipating portion of the light rod and the light source of the present invention is connected to the supporting portion, and is exposed outside the fluorescent rubber, and has good heat dissipation, and a high-power LED chip can be used.
  • FIG. 1 is a schematic view showing the structure of a light rod according to a first embodiment of the present invention.
  • FIG. 2 is a schematic structural view of a light rod according to a second embodiment of the present invention.
  • Fig. 3 is a schematic structural view of a light rod according to a third embodiment of the present invention.
  • FIG. 4 is a schematic structural view of a light rod according to a fourth embodiment of the present invention.
  • Fig. 5 is a schematic structural view of a light rod according to a fifth embodiment of the present invention.
  • Fig. 1 is a schematic view showing the structure of a light rod 1 according to a first embodiment of the present invention.
  • the light bar 1 includes at least one light emitting diode (LED) chip 10, a substrate 11 and a fluorescent glue 12.
  • the substrate 11 includes a support portion 111 and a heat dissipation portion 112 for placing at least one LED chip 10.
  • the fluorescent glue 12 is used to cover the support portion 111 of the substrate 11 to seal the LED chip 10.
  • the heat dissipating portion 112 is connected to the supporting portion 111, and the heat dissipating portion 112 is exposed outside the fluorescent rubber 12 to dissipate heat.
  • the support portion 111 and the heat dissipation portion 112 are made of a metal material.
  • the light bar 1 comprises a plurality of LED chips 10 (only 12 are shown), and the plurality of LED chips 10 are connected in series.
  • the support portion 111 includes a base connected to the heat dissipation portion 112 and a plurality of protrusions protruding on the base, wherein the number of the protrusion portions is the same as the number of the LED chips 10.
  • the convex portion is a rectangular column, the length of the convex portion is greater than the width, and the width of the convex portion is greater than the height.
  • the raised portion includes a top surface, a side adjacent to the top surface, opposite to the top surface a bottom surface connected to the heat sink 112. Wherein, the top surface of the convex portion refers to a plane having the smallest area among the convex portions.
  • the LED chip 10 is located on the top surface of the raised portion such that the illumination angle of the LED chip 10 can approach 360 degrees.
  • the LED chip 10 when the LED chip 10 emits light, diffused reflection can occur when the light hits the phosphor and the diffusion powder in the fluorescent glue 12 (the phosphor is used as a new light-emitting point, and the diffusion powder can increase the concentration of the phosphor above the chip).
  • part of the light can be penetrated from the position of the fluorescent glue 12 below the top surface of the convex portion, so that the illumination angle of the LED chip 10 is greater than 180 degrees, in addition, when the fluorescent glue 12 is in the shape
  • the volume is increased, in particular, the thickness of the fluorescent glue 12 covered on the side surface of the convex portion of the support portion 111 is increased, and when the LED chip 10 emits light, the angle at which the light is incident on the phosphor in the fluorescent rubber 12 and the diffusion powder is diffusely reflected. This will increase, so that the light-emitting angle of the light bar 1 is infinitely close to 360 degrees, and the light-emitting angle of the light bar 1 is enlarged.
  • the LED chip 10 and the surface of the bracket 10 are connected by a transparent insulating glue (not shown), and a phosphor or a diffusion powder is added to the insulating rubber. Therefore, when the LED chip is used When the bottom of the 10 emits blue light, the phosphor and the diffusion powder which are struck by the blue light can diffusely reflect, thereby further increasing the light output rate of the bottom of the LED chip 10, thereby further expanding the light-emitting angle of the light rod 1.
  • the base of the support portion 111 is provided with an adhesive hole 20 to improve the adhesion of the fluorescent glue 12.
  • the heat dissipation portion 112 includes a first heat dissipation portion 1121 and a second heat dissipation portion 1122.
  • the first heat dissipation portion 1121 and the second heat dissipation portion 1122 are connected by glue (not shown).
  • a tight fit pattern is provided between the first heat dissipation portion 1121 and the second heat dissipation portion 1122 to improve the adhesion of the glue.
  • the first heat dissipation portion 1121 is provided with a convex grain
  • the heat dissipation portion 1122 is provided with a concave grain.
  • FIG. 2 is a schematic view showing the structure of a light rod 2 according to a second embodiment of the present invention.
  • the light bar 2 shown in FIG. 2 is basically the same as the light bar 1 shown in FIG. 1 except that the convex portion of the support portion 111 includes a plurality of light blocking surfaces 1111 and a plurality of bottom surfaces 1112, and the bottom surface 1112 is used.
  • the LED chip 10 is placed.
  • the light blocking surface 1111 and the LED chip 10 are located on the same side of the bottom surface 1112 to adjust the light emitting angle of the LED chip 10.
  • the light blocking surface 1111 is adjacent to the bottom surface 1112 and perpendicular to each other.
  • the fluorescent glue 12 is composed of a plurality of Mitsubishi columns, and two sides of each of the Mitsubishi columns overlap the light blocking surface 1111 and the bottom surface 1112, respectively.
  • angle of the light blocking surface 1111 and the bottom surface 1112 can be adjusted according to the needs of the LED chip 10 illumination angle.
  • Fig. 3 is a schematic structural view of a light rod according to a third embodiment of the present invention.
  • the susceptor 11 including the support portion 111 and the heat dissipating portion 112 of the optical rod 3 shown in FIG. 3 is a chamfered Mitsubishi column.
  • the support portion 111 can be used not only to support the LED chip 10 but also as a heat sink to quickly conduct heat generated by the LED chip 10 to the heat dissipation portion 112, thereby improving the heat dissipation speed of the LED chip 10.
  • the fluorescent glue 12 is used to wrap the support portion 111 to seal the LED chip 10, and the fluorescent glue 12 is semi-cylindrical, so that the light-emitting angle of the light rod 3 is larger.
  • a metal foot is further disposed on the substrate 11.
  • the metal legs can be exposed outside the fluorescent glue 12 for heat dissipation.
  • FIG. 4 is a schematic structural view of a light rod according to a fourth embodiment of the present invention.
  • the shape of the substrate 11 of the light bar 4 shown in FIG. 4 is approximately a semi-cylindrical shape.
  • the support portion 111 can be used not only to support the LED chip 10 but also as a heat sink to quickly transfer heat generated by the LED chip 10 to the heat dissipation portion 112, thereby improving the heat dissipation rate of the LED chip 10. degree.
  • the fluorescent glue 12 is used to wrap the support portion 111 to seal the LED chip 10, and the fluorescent glue 12 is semi-cylindrical, so that the light-emitting angle of the light rod 3 is larger.
  • a metal foot is further disposed on the substrate 11.
  • the metal legs can be exposed outside the fluorescent glue 12 for heat dissipation.
  • Fig. 5 is a schematic structural view of a light rod according to a fifth embodiment of the present invention.
  • the substrate 11 of the light bar 5 includes a convex portion opposed to the side on which the LED chip 10 is placed.
  • the LED chip 10 emits light
  • diffused reflection can occur when the light hits the phosphor and the diffusion powder in the fluorescent glue 12 (the phosphor is used as a new light-emitting point, and the diffusion powder can increase the concentration of the phosphor above the chip).
  • a reflection source is added, and part of the light can be penetrated from the gap between the convex portions in the fluorescent rubber 12, thereby expanding the light-emitting angle of the light rod 5.
  • the substrate 11 is further provided with a metal leg 1120.
  • a metal leg 1120 can be exposed outside the fluorescent glue 12 for heat dissipation.
  • the present invention also provides a light source comprising a light bar as shown in Figure 1 or Figure 2 or Figure 3 or Figure 4 or Figure 5.
  • the light bar includes at least one light emitting diode (LED) chip 10, a substrate 11 and a fluorescent glue 12.
  • the substrate 11 includes a support portion 111 and a heat dissipation portion 112 for placing at least one LED chip 10.
  • the fluorescent glue 12 is used to cover the support portion 111 of the substrate 11 to seal the LED chip 10.
  • the heat dissipating portion 112 is connected to the supporting portion 111 and exposed outside the fluorescent rubber 12 to dissipate heat.
  • the light rods 1, 2, 3, 4, 5 of the present invention and the heat dissipating portion 112 of the light source using the same are connected to the support portion 111, and the heat dissipating portion 112 is exposed outside the fluorescent rubber 12, and the heat dissipation property is good, and high power can be used.
  • the heat-dissipating portion of the light rod and the light source of the present invention is connected to the supporting portion, and is exposed outside the fluorescent rubber, and has good heat dissipation, and a high-power LED chip can be used.

Abstract

一种光棒及使用光棒的光源。光棒包括至少一个LED芯片（10）、基板（11）及荧光胶（12）。基板包括支撑部（111）及散热部（112），支撑部用于放置至少一个LED芯片。荧光胶用于包覆基板的支撑部，以密封至少一个LED芯片。其中，散热部与支撑部相连，且裸露在荧光胶外，以散热，使得散热性好，可使用大功率的LED芯片。

Description

一种光棒及使用其的光源 技术领域
本发明是关于照明技术领域，且特别是关于一种光棒及使用其的光源。
背景技术
发光二极管(light emitting diode，LED)由于其节能、安全、使用寿命长等特点而被广泛的应用。
现有的光棒包括基板、LED芯片及荧光胶，其中，所述基板用于放置所述LED芯片，所述荧光胶覆盖整个基板，以密封所述LED芯片。
但现有光棒的荧光胶覆盖整个基板，造成散热性差，影响LED芯片的使用寿命，特别是在LED芯片的功率较大时，容易造成元件的损坏。
因此，有必要提供改进的技术方案以克服现有技术中存在的以上技术问题。
发明内容
本发明的目的是提供一种散热性好的光棒。
本发明提出一种光棒，所述光棒包括至少一个LED芯片、基板及荧光胶。所述基板包括支撑部及散热部，所述支撑部用于放置所述LED芯片。所述荧光胶用于包覆所述基板的支撑部，以密封所述至少一个LED芯片。其中，所述散热部与所述支撑部相连，且所述散热部裸露在所述荧光胶外，以散热。
优选地，所述光棒包括多个LED芯片，所述多个LED芯片串联在一起。
优选地，所述支撑部包括与所述散热部相连的底座及多个凸起部。
优选地，所述支撑部的凸起部包括挡光面及底面，所述底面用于放置所述发光二极管芯片。其中，所述挡光面与所述发光二极管芯片位于所述底面的同一侧，以调整所述发光二极管芯片的发光角度。
优选地，所述支撑部的底座上设置有圆孔。
优选地，所述多个LED芯片位于所述凸起部的顶面。
优选地，所述散热部包括第一散热部及第二散热部，所述第一散热部与所述第二散热部通过胶水连接。
优选地，所述第一散热部与所述第二散热部之间设有紧密配合的纹路。
优选地，所述第一散热部上设置有凸形纹路，所述第二散热部上设置有凹形纹路。
本发明还提供一种光源，所述光源包括光棒。所述光棒包括LED芯片、基板及荧光胶。所述基板包括支撑部及散热部，所述支撑部用于放置所述LED芯片。所述荧光胶用于包覆所述基板的支撑部，以密封所述LED芯片。其中，所述散热部与所述支撑部相连，且所述散热部裸露在所述荧光胶外，以散热。
本发明的光棒及光源中的散热部与支撑部相连，且裸露在荧光胶外，散热性好，可使用大功率的LED芯片。
上述说明仅是本发明技术方案的概述，为了能够更清楚了解本发明的技术手端，而可依照说明书的内容予以实施，并且为了让本发明的上述和其它目的、特征和优点能够更明显易懂，以下特举实施例，并配合附图，详细说明如下。
附图概述
图1为本发明第一实施例的光棒的结构示意图。
图2为本发明第二实施例的光棒的结构示意图。
图3为本发明第三实施例的光棒的结构示意图。
图4为本发明第四实施例的光棒的结构示意图。
图5为本发明第五实施例的光棒的结构示意图。
本发明的较佳实施方式
为更进一步阐述本发明为达成预定发明目的所采取的技术手端及功效，以下结合附图及较佳实施例，对依据本发明提出的光棒及使用其的光源的具体实施方式、结构、特征及其功效，详细说明如下：
图1为本发明的第一实施例的光棒1的结构示意图。如图1所示，光棒1包括至少一个发光二极管(light emitting diode，LED)芯片10、基板11及荧光胶12。基板11包括支撑部111及散热部112，支撑部111用于放置至少一个LED芯片10。荧光胶12用于包覆基板11的支撑部111，以密封LED芯片10。其中，散热部112与支撑部111相连，且散热部112裸露在荧光胶12外，以散热。
在本发明一实施方式中，支撑部111及散热部112均为金属材料构成。
在本发明一实施方式中，光棒1包括多个LED芯片10(图中仅仅示出12个)，多个LED芯片10串联在一起。
在本发明一实施方式中，支撑部111包括与散热部112相连的底座及在底座上凸起的多个凸起部，其中，凸起部的数目与LED芯片10的数目相同。
在本发明一实施方式中，凸起部为矩形柱，凸起部的长大于宽，凸起部的宽大于高。凸起部包括顶面、与顶面相邻的侧面、与顶面相对且 与散热部112相连的底面。其中，凸起部的顶面是指凸起部中面积最小的平面。
在本发明一实施方式中，LED芯片10位于凸起部的顶面，以使得LED芯片10的发光角度能接近360度。
具体地，LED芯片10在发光时，光打到荧光胶12内的荧光粉和扩散粉时可以发生漫反射(此时荧光粉作为新的发光点，扩散粉可增加荧光粉在芯片上方的浓度，也增加了反射源)，部分光可以从荧光胶12中低于凸起部的顶面的位置处穿透出来，从而使LED芯片10的发光角度大于180度，此外，当荧光胶12外形体积增加，尤其是支撑部111的凸起部的侧面上覆盖的荧光胶12厚度增加，LED芯片10在发光时，光打到荧光胶12内的荧光粉和扩散粉时发生漫反射的角度也会随之增加，从而使光棒1的发光角度无限接近于360度，扩大了光棒1的发光角度。
在本发明的一实施方式中，LED芯片10与支架10面是通过透明绝缘胶(图中未示出)来连接的，且此绝缘胶中加入了荧光粉或扩散粉，因此，当LED芯片10的底部发射出蓝光时，蓝光打到绝缘胶中的荧光粉和扩散粉可以发生漫反射，从而进一步增加LED芯片10底部出光率，从而进一步扩大了光棒1的发光角度。
在本发明一实施方式中，支撑部111的底座上设置有粘合孔20，以提高荧光胶12的粘合力。
在本发明一实施方式中，散热部112包括第一散热部1121及第二散热部1122，第一散热部1121与第二散热部1122通过胶水(图中未示出)连接。
在本发明一实施方式中，第一散热部1121与第二散热部1122之间设有紧密配合的纹路，以提高胶水的粘合力。
在本发明一实施方式中，第一散热部1121上设置有凸形纹路，第 二散热部1122上设置有凹形纹路。
图2为本发明第二实施例的光棒2的结构示意图。图2所示的光棒2与图1所示的光棒1结构基本相同，不同之处仅仅在于：支撑部111的凸起部包括多个挡光面1111及多个底面1112，底面1112用于放置LED芯片10。其中，挡光面1111与LED芯片10位于底面1112的同一侧，以调整LED芯片10的发光角度。
在本发明的一实施方式中，挡光面1111与底面1112相邻，且互相垂直。荧光胶12由多个三菱柱组成，且每个三菱柱的其中两面分别与挡光面1111及底面1112重叠。
当然本领域的技术人员可以理解的是，挡光面1111与底面1112的角度可以根据LED芯片10发光角度的需要进行调整。
图3为本发明第三实施例的光棒的结构示意图。如图3所示，图3所示的光棒3的包括支撑部111及散热部112的基座11为削边的三菱柱。其中，支撑部111不仅能用于支撑LED芯片10，且能作为热忱(heat sink)，以将LED芯片10产生的热量快速传导至散热部112，从而提高LED芯片10的散热速度。
其中，荧光胶12用于包裹支撑部111，以密封LED芯片10，荧光胶12为半圆柱形，使得光棒3的发光角度更大。
此外，为了增加荧光胶12与基板11的结合力，基板11上还设置有金属脚。当然本领域的技术人员可以理解的是，部分金属脚可以裸露于荧光胶12外，以用于散热。
图4为本发明第四实施例的光棒的结构示意图。如图4所示，图4所示的光棒4的基板11的形状近似为半圆柱体。其中，支撑部111不仅能用于支撑LED芯片10，且能作为热忱(heat sink)，以将LED芯片10产生的热量快速传导至散热部112，从而提高LED芯片10的散热速 度。
其中，荧光胶12用于包裹支撑部111，以密封LED芯片10，荧光胶12为半圆柱形，使得光棒3的发光角度更大。
此外，为了增加荧光胶12与基板11的结合力，基板11上还设置有金属脚。当然本领域的技术人员可以理解的是，部分金属脚可以裸露于荧光胶12外，以用于散热。
图5为本发明第五实施例的光棒的结构示意图。如图5所示，图5所示的光棒5，光棒5的基板11包括与放置LED芯片10的一侧相对的凸起部。具体地，LED芯片10在发光时，光打到荧光胶12内的荧光粉和扩散粉时可以发生漫反射(此时荧光粉作为新的发光点，扩散粉可增加荧光粉在芯片上方的浓度，也增加了反射源)，部分光可以从荧光胶12中凸起部间的空隙处穿透出来，从而扩大了光棒5的发光角度。
此外，为了增加荧光胶12与基板11的结合力，基板11上还设置有金属脚1120。当然本领域的技术人员可以理解的是，部分金属脚1120可以裸露于荧光胶12外，以用于散热。
本发明还提供一种光源，光源包括如图1或如图2或如图3或如图4或如图5所示的光棒。光棒包括至少一个发光二极管(light emitting diode，LED)芯片10、基板11及荧光胶12。基板11包括支撑部111及散热部112，支撑部111用于放置至少一个LED芯片10。荧光胶12用于包覆基板11的支撑部111，以密封LED芯片10。其中，散热部112与支撑部111相连，且裸露在荧光胶12外，以散热。
本发明的光棒1、2、3、4、5及使用其的光源中的散热部112与支撑部111相连，且散热部112裸露在荧光胶12外，散热性好，可使用大功率的LED芯片10。
以上，仅是本发明的实施例而已，并非对本发明作任何形式上的限 制，虽然本发明已以实施例揭露如上，然而并非用以限定本发明，任何熟悉本专业的技术人员，在不脱离本发明技术方案范围内，当可利用上述揭示的技术内容作出些许更动或修饰为等同变化的等效实施例，但凡是未脱离本发明技术方案内容，依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化与修饰，均仍属于本发明技术方案的范围内。
工业实用性
本发明的光棒及光源中的散热部与支撑部相连，且裸露在荧光胶外，散热性好，可使用大功率的LED芯片。

Claims (10)

  1. 一种光棒，其特征在于，所述光棒包括：
    至少一个LED芯片；
    基板，所述基板包括支撑部及散热部，所述支撑部用于放置所述至少一个LED芯片；及
    荧光胶，所述荧光胶用于包覆所述基板的支撑部，以密封所述至少一个LED芯片；
    其中，所述散热部与所述支撑部相连，且所述散热部裸露在所述荧光胶外，以散热。
  2. 如权利要求1所述光棒，其特征在于，所述光棒包括多个LED芯片，所述多个LED芯片串联在一起。
  3. 如权利要求2所述光棒，其特征在于，所述支撑部包括与所述散热部相连的底座及多个凸起部。
  4. 如权利要求3所述的光棒，其特征在于，所述支撑部的凸起部包括：
    挡光面；及
    底面，所述底面用于放置所述发光二极管芯片；
    其中，所述挡光面与所述发光二极管芯片位于所述底面的同一侧，以调整所述发光二极管芯片的发光角度。
  5. 如权利要求3所述光棒，其特征在于，所述支撑部的底座上设置有圆孔。
  6. 如权利要求3所述光棒，其特征在于，所述多个LED芯片位于所述凸起部的顶面。
  7. 如权利要求1所述光棒，其特征在于，所述散热部包括第一散热部及第二散热部，所述第一散热部与所述第二散热部通过胶水连接。
  8. 如权利要求7所述光棒，其特征在于，所述第一散热部与所述第二散 热部之间设有紧密配合的纹路。
  9. 如权利要求8所述光棒，其特征在于，所述第一散热部上设置有凸形纹路，所述第二散热部上设置有凹形纹路。
  10. 一种光源，其特征在于，所述光源包括如权利要求1-9任意一项所述的光棒。
PCT/CN2015/074170 2014-03-18 2015-03-13 一种光棒及使用其的光源 WO2015139580A1 (zh)

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CN104167410A (zh) * 2014-07-25 2014-11-26 深圳市光之谷新材料科技有限公司 一种led显示单元及使用其的显示装置
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