WO2015121486A1 - Module formant sous-ensemble pour unité de détection, et unité de détection correspondante - Google Patents

Module formant sous-ensemble pour unité de détection, et unité de détection correspondante Download PDF

Info

Publication number
WO2015121486A1
WO2015121486A1 PCT/EP2015/053273 EP2015053273W WO2015121486A1 WO 2015121486 A1 WO2015121486 A1 WO 2015121486A1 EP 2015053273 W EP2015053273 W EP 2015053273W WO 2015121486 A1 WO2015121486 A1 WO 2015121486A1
Authority
WO
WIPO (PCT)
Prior art keywords
carrier
measuring element
sensor
circuit
circuit carrier
Prior art date
Application number
PCT/EP2015/053273
Other languages
German (de)
English (en)
Inventor
Michael Schlitzkus
Stefan Lehenberger
Anna WONDRAK
Helmut SEIBAND
Valentin Notemann
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2015121486A1 publication Critical patent/WO2015121486A1/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0069—Electrical connection means from the sensor to its support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/142—Multiple part housings

Definitions

  • Pre-assembly assembly for a sensor unit and corresponding sensor unit
  • the invention relates to a preassembly assembly for a sensor unit according to the preamble of independent claim 1 and of a corresponding sensor unit according to the preamble of independent claim 11.
  • a generic sensor unit with a protective sleeve is known in which at least one measuring cell, which detects in particular a pressure of a hydraulic block, and a circuit substrate are arranged with a perpendicular to the circuit board printed circuit board, which is an electronic circuit with at least an electronic and / or electrical component.
  • the measuring cell has at least one connection point, via which at least one electrical output signal of the measuring cell can be tapped off.
  • the circuit carrier forms an internal interface, which picks up the at least one electrical output signal of the measuring cell and applies it to the electronic circuit. Via an external interface, an output signal of the electronic circuit can be tapped.
  • the internal interface at a first end of the protective sleeve and the external interface are formed at a second end of the protective sleeve.
  • the protective sleeve is joined at the first end to a sensor carrier, which has a mounting flange and a measuring connection, which is designed as a self-clinch connection.
  • the mounting flange has a flange edge on which the protective sleeve is supported and via which the sensor unit can be caulked with a fluid block, not shown.
  • the mounting flange comprises a connection region on which the protective sleeve is pressed.
  • the main body of the circuit substrate is a cylinder with a executed inner joining geometry, which is adapted to an outer contour of the measuring cell and encloses the measuring cell.
  • An outer joining geometry on the main body of the circuit carrier comprises two receiving pockets, which each comprise at least one first contact means for electrically contacting the printed circuit board.
  • the at least one first contact means is connected via an external conductor track on the main body of the circuit carrier with at least one second contact means for making electrical contact with the measuring cell.
  • the first joining geometry of the printed circuit board is designed as a recess in the base carrier, which is limited on two opposite sides in each case by a guide leg.
  • the two guide legs of the first joining geometry of the circuit board are each joined to a receiving pocket of the outer joining geometry of the circuit carrier.
  • connecting openings are made in the flange surface, which receive connection pins arranged on the circuit carrier in order to provide a torsion-proof connection
  • an adhesive layer is applied to the flange surface in the illustrated embodiment.
  • the circuit carrier is aligned with the aid of the pin / hole connection to the sensor carrier.
  • the circuit carrier is replaced by a press fit
  • Pin / bore held so that electrically a bond can be made.
  • the lifelong connection between sensor carrier and circuit carrier is realized by the adhesive layer between the two components.
  • the press fit absorbs all process forces that occur on the circuit carrier until the adhesive has hardened.
  • the pre-assembly according to the invention for a sensor unit according to the features of independent claim 1 and the sensor unit according to the invention with the features of independent claim 11 have the advantage that can be made easier by the clip connection of the sensor carrier, since the off-center pin holes can be omitted.
  • assembly steps such as, for example, aligning the sensor carrier with the measuring cell layout can be dispensed with or executed with greater tolerances, such as, for example, aligning the circuit carrier with the measuring cell. lenlayout. This means that the measuring cell can be welded without alignment to the sensor carrier.
  • the circuit carrier is simply aligned with the outer contour of the measuring element via the inner joint geometry and clipped onto the sensor carrier.
  • the clip connection establishes the life-permanent connection between the sensor carrier and the circuit carrier and can be given an additional anti-rotation protection by two small adhesive dots.
  • the clip connection advantageously allows a direct power dissipation of the contact forces in the external contacting of the sensor unit over the
  • the Garklebung can be omitted as a lifetime bond between the sensor carrier and the circuit carrier.
  • Embodiments of the invention can be made particularly compact, since the circuit carrier forms only the internal interface and is arranged at the first end of the protective sleeve.
  • the circuit board is simultaneously formed as a structural component within the protective sleeve and joined to the circuit carrier at the first end face.
  • the printed circuit board is joined to a support unit, which supports the printed circuit board against the protective sleeve. As a result, the height of the sensor unit can be reduced in an advantageous manner.
  • Embodiments of the present invention provide a preassembly assembly for a sensor unit that includes a sensing element, a rotationally symmetric sensor carrier, and a circuit carrier.
  • the measuring element is mechanically connected to the sensor carrier and the circuit carrier has an internal interface, which picks up at least one electrical output signal of the measuring element.
  • a main body of the circuit carrier is designed as a hollow cylinder with an inner joining geometry, which is adapted to an outer contour of the measuring element and surrounds the measuring element.
  • the main body of the circuit carrier is mechanically connected to the sensor carrier.
  • the sensor carrier has a first clip geometry and the main body of the circuit carrier has a corresponding second clip geometry, which is used to produce a
  • a sensor unit which has a protective sleeve in which a measuring element, a circuit carrier and a connection device are arranged with a printed circuit board perpendicular to the circuit board, which carries an electronic circuit with at least one electronic and / or electrical component, and a support unit, which comprises a base body with an outer contour and closes the protective sleeve.
  • the measuring element is connected to a rotationally symmetrical sensor carrier, which has a mounting flange with a connection region for the protective sleeve.
  • a main body of the circuit carrier is mechanically connected to the sensor carrier and has an internal interface which picks up at least one electrical output signal of the measuring element and applies it to the electronic circuit.
  • the main body of the support unit forms an external interface with at least one electrical contact point, via which at least one output signal of the electronic circuit can be tapped off.
  • the at least one contact point is electrically connected via an electrical connection with a corresponding contact point of the printed circuit board.
  • the measuring element and the sensor carrier and the circuit carrier form a preassembly assembly according to the invention.
  • the first clip geometry can be introduced as a circumferential receiving groove in a mounting flange of the sensor carrier.
  • the second clip geometry may include a plurality of resilient latching arms with locking lugs.
  • the latching lugs can engage with latched circuit carrier in the circumferential receiving groove of the sensor carrier latching.
  • the patch and latched circuit carrier can be secured against rotation by at least two holding adhesive points, which can be applied in each case next to a locking arm on a flange surface of the sensor carrier.
  • the rotationally symmetrical sensor carrier can be used as a turned part with a tubular gene carrier and the measuring element can be designed as a pressure measuring cell, which can be placed on the tubular support and fluid-tightly connected to the sensor carrier.
  • two receiving pockets for receiving corresponding guide limbs of a printed circuit board can be formed on the main body of the circuit carrier as outer joining geometry.
  • the base body may have four electrically conductive regions on a first end face, which each form a first contact point and a second contact point.
  • the first contact points can each be designed as contact surfaces, which extend into the receiving pockets and can be contacted with corresponding contact points of the printed circuit board.
  • the second contact points can each be designed as bonding surfaces, which can be contacted via bonding wires with corresponding contact points of the measuring element.
  • four axially extending elastic latching arms can be formed with latching lugs on a second end face of the base body, which are each arranged below a second contact point designed as a bonding surface.
  • the latching arms can result in an improved frictional connection between the circuit carrier and the sensor carrier, since the latching arms lie directly below the bonding region, which can advantageously lead to a more uniform bonding result.
  • the main body of the circuit substrate can be designed as a plastic injection part, which encloses a stamped grid at least partially, wherein exposed areas of the stamped grid can form the four electrically conductive regions on the first end side of the main body.
  • FIG. 1 and 2 each show a schematic perspective partial sectional view of an embodiment of a sensor unit according to the invention with a preassembly assembly according to the invention.
  • FIG. 3 shows a schematic perspective view of a sensor carrier with a fastening flange and a measuring cell for the sensor unit according to the invention from FIG. 1 or 2 before joining the measuring cell to the sensor carrier.
  • FIG. 4 shows a schematic perspective illustration of the sensor carrier with a fastening flange and a measuring cell for the sensor unit according to the invention from FIG. 1 or 2 after joining the measuring cell to the sensor carrier.
  • FIG. 5 shows a schematic perspective view of a circuit carrier for the sensor unit according to the invention from FIG. 1 or 2.
  • FIG. 6 shows a schematic sectional illustration of the circuit carrier from FIG. 5 along the section line VI-VI.
  • FIG. 7 shows a schematic perspective illustration of the sensor carrier and of a circuit carrier for the sensor unit according to the invention from FIG. 1 or 2 before the joining of the circuit carrier to the sensor carrier.
  • FIG. 8 shows a schematic perspective view of the preassembly assembly according to the invention for the sensor unit according to the invention from FIG. 1 or 2.
  • FIG. 9 shows a schematic perspective illustration of the preassembled subassembly according to the invention for the sensor unit according to the invention from FIG. 1 or 2 after the bonding and before the joining of the protective sleeve.
  • 10 shows a schematic perspective illustration of the exemplary embodiment of the sensor unit according to the invention from FIGS. 1 and 2 during the insertion of a connection device into the protective sleeve.
  • the exemplary embodiment of the sensor unit 1 comprises a protective sleeve 20, in which a measuring element 50, a circuit carrier 60 and a connecting device 3 with a printed circuit board 40 arranged perpendicular to the circuit carrier 60, which electronic circuit 44 with at least one electronic and / or electrical component 44.1, 44.2 carries, and a support unit 30 are arranged, which comprises a base body 32 having an outer contour 37 and the protective sleeve 20 closes.
  • the measuring element 50 is a rotationally symmetrical
  • Sensor carrier 10 mechanically connected, which has a mounting flange 12 with a connecting portion 16 for the protective sleeve 20.
  • a main body 62 of the circuit carrier 60 is mechanically connected to the sensor carrier 10 and has an internal interface 24, which picks off at least one electrical output signal of the measuring element 50 and to the electronic
  • Circuit 44 applies.
  • the main body 32 of the support unit 30 forms an external interface 26 with at least one electrical contact point 34, via which at least one output signal of the electronic circuit 44 can be tapped off.
  • the at least one contact point 34 is electrically connected via an electrical connection to a corresponding contact point 46 of the printed circuit board 40.
  • the illustrated embodiment of the preassembly assembly 9 according to the invention for a sensor unit 1 comprises the measuring element 50, the rotationally symmetrical sensor carrier 10 and the circuit carrier 60.
  • the measuring element 50 is provided with the Sensor carrier 10 is mechanically connected and the circuit carrier 60 has an internal interface 24, which picks up at least one electrical output signal of the measuring element 50.
  • a base body 62 of the circuit carrier 60 is designed as a hollow cylinder with an inner joining geometry 65, which is adapted to an outer contour 58 of the measuring element 50 and encloses the measuring element 50.
  • the main body 62 of the circuit carrier 60 is mechanically connected to the sensor carrier 10.
  • the sensor carrier 10 has a first clip geometry and the base body 62 of the circuit carrier 10 has a corresponding second clip geometry, which is used for producing a clip connection between the sensor carrier 10 and the
  • Circuit carrier 60 cooperate.
  • the printed circuit board 40 can be equipped on both sides and comprises an electronic circuit 44 with at least one electronic and / or electrical component 44.1, 44.2, which, for example, amplifies the signal and / or processes a raw signal of the measuring element 50 performs.
  • the electronic circuit 44 includes an application specific integrated circuit
  • the sensor 1 is designed as a pressure sensor in the illustrated embodiment and the at least one measuring element 50 is designed as a pressure measuring cell, which converts the hydraulic pressure into at least one electrical output signal.
  • the measuring element 50 designed as a pressure measuring cell has a plurality of connecting points 52, via which the at least one electrical output signal of the measuring element 50 can be tapped off.
  • the circuit carrier 60 has an internal interface 24, which taps off the at least one electrical output signal of the measuring element 50 and applies it to the electronic circuit 44.
  • an output signal of the electronic circuit 44 can be tapped off via an external interface 26.
  • the internal interface 24 is formed at a first end 20.1 of the protective sleeve 20, and the external interface 26 is at a second end 20.2 of the protective sleeve 20 is formed.
  • the protective sleeve 20 protects the interior of the sensor 1 from excessive mechanical stress.
  • the support unit 30 for the printed circuit board 40 forms the external interface 26 with at least one electrical contact point 34, via which at least one electrical output signal of the electronic circuit 44 can be tapped off.
  • the at least one contact point 34 is electrically connected via an electrical connection to at least one corresponding contact point 46, 48 of the printed circuit board 40.
  • the support unit 30 comprises at least one spring-elastic contact element 38, which is arranged on the outer contour 37 of the main body 32.
  • the base body 32 of the support unit 30 is supported against an inner contour 22 of the protective sleeve 20 and establishes the acting as a ground path electrically conductive connection between the circuit board 40 and protective sleeve 20 ago.
  • the base body 32 of the support unit 30 has a cylindrical shape and, in the exemplary embodiment shown, comprises two half shells 32.1, 32.2, which each have at least one contact point 34 of the external interface 26.
  • Interface 26 and the at least one corresponding contact point 46, 48 of the printed circuit board 40 is made via at least one formed in the main body 32 via 35, which is electrically connected to at least one associated Gegenkotaktstelle 36 in the base body 32, which in turn about at least one solder joint electrically and is mechanically connected to the at least one contact point 46, 48 of the circuit board 40.
  • the support unit 30 has four contact points 34, wherein on each half-shell 32.1, 32.2 two contact points 34 are arranged.
  • the sensor 1 according to the invention on each half-shell 32.1, 32.2 of the base body 32 of the support unit
  • the support unit 30 arranged a resilient contact element 38, so that in the assembled state on the outer contour 37 of the base body 32, two opposing resilient contact elements 38 are arranged. Furthermore, the main body 32 of the support unit 30 has a protruding edge 33, which closes the protective sleeve 20 in the joined state.
  • the support unit 30 is inserted in a play-movable manner at the second end 20.2 of the protective sleeve 20 and is supported by the two resilient contact elements 38 against the inner contour 22 of the protective sleeve 20, which has an electrically conductive coating 22.1 or is made of an electrically conductive material to form a ground path ,
  • the protective sleeve 20 is designed as a hollow cylinder in the illustrated embodiment.
  • the protective sleeve 20 is joined at the first end 20.1 with the sensor carrier 10, which has the mounting flange 12 and a measuring port 18, which is designed as a self-clinching connection.
  • the mounting flange 12 has a Flanschkante on which the protective sleeve 20 is supported and via which the pressure sensor 1 can be caulked with a fluid block, not shown.
  • the mounting flange 12 includes a stepped flange surface 14, wherein the step 16 between the flange edge and the flange surface 14 is used in the illustrated embodiments as a connecting portion on which the protective sleeve 20 is pressed.
  • the protective sleeve 20 can be welded at the transition of the step 16 to the flange with the mounting flange 12.
  • 64 two receiving pockets for receiving corresponding guide legs 42. 4 of the printed circuit board 40 are formed on the main body 62 of the circuit carrier 60 as outer joining geometry 64.
  • the main body 62 of the circuit carrier 60 has four electrically conductive regions on a first end face, which each form a first contact point 66 and a second contact point 68.
  • the first contact points 66 are each designed as contact surfaces, which extend into the receiving pockets and can be contacted with corresponding contact points 46 of the printed circuit board 40.
  • the second contact points 68 are each designed as bonding surfaces, which can be contacted via bonding wires 54 with corresponding contact points 52 of the measuring element 50.
  • the main body 62 of the circuit carrier 60 is executed in the illustrated embodiment as a plastic injection molded part, which contains a punched grid at least partially encloses.
  • the exposed areas of the stamped grid form the four electrically conductive areas on the first end face of the main body 62.
  • the circuit carrier 60 can be embodied, for example, as a plastic injection-molded part in MID-1 K (MID: Molded Interconnected Device) technology or as a plastic injection molded part in MID-2 K technology.
  • the printed circuit board 40 has on the base support 42 a recess 42.3, which is bounded on two opposite sides in each case by a guide leg 42.4.
  • the two guide legs 42.4 of the printed circuit board 40 are each provided with a receiving pocket of the outer joining geometry 64 of the circuit carrier
  • the two guide legs 42.4 of the circuit board 40 are guided over inner guide edges in the receiving pockets of the circuit substrate 60. Additionally or alternatively, the guide legs 42.4 of the printed circuit board 40 can also be guided over outer guide edges on the inner contour 22 of the protective sleeve 20.
  • the circuit board 40 may have a predetermined small angle of inclination to the vertical vertical axis of the sensor 1 if necessary.
  • the base support 42 of the printed circuit board 40 which is essentially perpendicular to the end face of the circuit carrier 60, has contact surfaces 46 in the region of the guide limbs 42.4, which have corresponding first contact points 66 or contact surfaces in the region of the outer joining geometry 64 on the main body 62 of the circuit substrate 60, the internal electrical interface 24 form.
  • the base support 42 of the printed circuit board 40 has contact points 46, 48 which are contacted by the corresponding mating contact points of the half shells 32. 1, 32.
  • the half-shells 32.1, 32.2 of the main body 32 of the support unit 30 are executed in the illustrated embodiment, each as a plastic injection molded part, in which stamped grid are embedded, which form the contact points 34 of the external interface 26 and the vias and the mating contact points and the connection points 31.
  • the fastening flange 12 can be connected, for example, by means of a self-clinching connection 18 to the not shown Fluid block pressed or tethered.
  • connection region 16 for pressing on or welding the protective sleeve 20 splices are provided on the flange surface 14, to which retaining adhesive 5 can be applied in order to prevent rotation of the base body 62 of the circuit substrate 60.
  • the designed as a pressure measuring cell measuring element 50 is mounted on a tubular support 11 of the mounting flange 12, that depending on the pressure of the fluid in the hydraulic block, a measuring diaphragm 50.1 of the pressure measuring cell is deformed. The deformation of the measuring diaphragm 50.1 is detected by a measuring bridge 56.
  • the measuring bridge 56 is connected to four contact points 52 which are electrically connected in each case via bonding wires 54 with the second contact points 68 of the circuit carrier 60 designed as bonding surfaces.
  • the rotationally symmetric sensor carrier 10 is designed as a rotating part.
  • the measuring element 50 is welded to the sensor carrier 10.
  • the circuit carrier 60 is clipped.
  • the bonding connections between the measuring element 50 and the circuit carrier 60 are produced, and the assembly of the preassembly assembly 9 according to the invention is completed.
  • adhesive is applied to the holding adhesive sites 5 to a
  • the patch and latched circuit substrate 60 is secured by two holding adhesive points 5 against rotation, which are each applied next to a locking arm 62.1 on the flange surface 14 of the sensor carrier 10.
  • a holding adhesive point 5 is applied in the receiving pockets in order to fix the printed circuit board 40. Then the protective sleeve 20 is pressed and possibly fixed with a spot weld.
  • the guide plate 40 is inserted into the receiving pockets of the outer joining geometry 64 on the main body 62 of the circuit carrier 60 and optionally fixed there with holding adhesive 5 and conductive adhesive 7 to form an electrically conductive To ensure connection between the circuit substrate 60 and the circuit board 40 and to fix the circuit board 40.
  • the holding adhesive 5 is introduced, for example, to base surfaces of the receiving pockets of the circuit carrier 60 and the conductive adhesive is, for example, on the contact surfaces 46 of the circuit board 40th applied.
  • the first contact points 66 on the base body 62 of the circuit substrate can be designed as resilient contact elements which exert a force perpendicular to the insertion of the circuit board 40 force on the contact surfaces 46 of the circuit board 40 and at the same time fix the inserted into the receiving pockets of the outer joining geometry 64 printed circuit board 40 so that it can be dispensed with the holding adhesive 5 and the conductive adhesive 7 at this point.
  • connection device according to the invention described is particularly suitable for use in a pressure sensor for braking systems of motor vehicles, but is not limited thereto.
  • the connecting device according to the invention can also be used for optical and / or acoustic measuring cells.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

L'invention concerne un module formant sous-ensemble (9) pour une unité de détection (1), comprenant un élément de mesure (50), un porte-capteur à symétrie de rotation (10) et un porte-circuit (60), l'élément de mesure (50) étant relié au support de détecteur (10) et le porte-circuit (60) présentant une interface interne (24) qui prélève au moins un signal de électrique sortie de l'élément de mesure (50), un corps de base (62) du porte-circuit (60) étant réalisé en tant que cylindre creux dont la géométrie d'assemblage (65) interne est réalisée de manière à être adaptée à un contour externe (58) de l'élément de mesure (50) et à entourer l'élément de mesure (50), et le corps de base (62) du porte-circuit (60) étant relié mécaniquement au support de détecteur (10), et une unité de détection (1) correspondante l'étant à un tel module formant sous-ensemble (9). Selon l'invention, le support de détecteur (10) présente une première géométrie de clipsage et le corps de base (62) du porte-circuit (10) une deuxième géométrie de clipsage correspondante qui coopèrent aux fins de réalisation d'une liaison par clipsage entre le support de détecteur (10) et le porte-circuit (60).
PCT/EP2015/053273 2014-02-17 2015-02-17 Module formant sous-ensemble pour unité de détection, et unité de détection correspondante WO2015121486A1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
DE102014202873.6 2014-02-17
DE102014202873 2014-02-17
DE102014216156 2014-08-14
DE102014216156.8 2014-08-14
DE102014221365.7A DE102014221365A1 (de) 2014-02-17 2014-10-21 Vormontagebaugruppe für eine Sensoreinheit und korrespondierende Sensoreinheit
DE102014221365.7 2014-10-21

Publications (1)

Publication Number Publication Date
WO2015121486A1 true WO2015121486A1 (fr) 2015-08-20

Family

ID=53758960

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2015/053273 WO2015121486A1 (fr) 2014-02-17 2015-02-17 Module formant sous-ensemble pour unité de détection, et unité de détection correspondante

Country Status (2)

Country Link
DE (2) DE102014221365A1 (fr)
WO (1) WO2015121486A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180018414A (ko) * 2016-08-11 2018-02-21 로베르트 보쉬 게엠베하 압력 측정 셀 및 측정 구조물의 제공 방법
CN107727309A (zh) * 2016-08-11 2018-02-23 罗伯特·博世有限公司 压力测量单元和用于涂覆压力测量单元的载体的方法
WO2019005265A1 (fr) * 2017-06-29 2019-01-03 Rosemount Inc. Mise sous boîtier de circuit hybride modulaire
KR20190021177A (ko) * 2017-08-22 2019-03-05 로베르트 보쉬 게엠베하 센서용 접속 장치

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016216974A1 (de) 2016-08-11 2018-02-15 Robert Bosch Gmbh Druckmesszelle und Verfahren zum Beschichten und Kontaktieren eines Trägers einer Druckmesszelle
DE102017205992A1 (de) 2017-04-07 2018-10-11 Robert Bosch Gmbh Sensorträger für eine Druckmesszelle und korrespondierende Drucksensoreinheit und korrespondierende Fluidbaugruppe
DE102019202011A1 (de) 2019-02-14 2020-08-20 Robert Bosch Gmbh Sensoranordnung für ein Bremssystem eines Fahrzeugs und korrespondierendes Bremssystem

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2723202A1 (fr) * 1994-07-28 1996-02-02 Magneti Marelli France Sa Capteur de grandeur physique, notamment un capteurde temperature
DE102007026446A1 (de) * 2007-06-06 2008-12-11 Robert Bosch Gmbh Schnell montierbares Sensorgehäuse für Sensoren mit Luftkontakt
DE102012204911A1 (de) * 2012-03-27 2013-10-02 Robert Bosch Gmbh Stützeinheit für eine Leiterplatte in einer Sensoreinheit und korrespondierende Sensoreinheit
DE102012204904A1 (de) * 2012-03-27 2013-10-02 Robert Bosch Gmbh Sensoreinheit

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2723202A1 (fr) * 1994-07-28 1996-02-02 Magneti Marelli France Sa Capteur de grandeur physique, notamment un capteurde temperature
DE102007026446A1 (de) * 2007-06-06 2008-12-11 Robert Bosch Gmbh Schnell montierbares Sensorgehäuse für Sensoren mit Luftkontakt
DE102012204911A1 (de) * 2012-03-27 2013-10-02 Robert Bosch Gmbh Stützeinheit für eine Leiterplatte in einer Sensoreinheit und korrespondierende Sensoreinheit
DE102012204904A1 (de) * 2012-03-27 2013-10-02 Robert Bosch Gmbh Sensoreinheit

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180018414A (ko) * 2016-08-11 2018-02-21 로베르트 보쉬 게엠베하 압력 측정 셀 및 측정 구조물의 제공 방법
CN107727301A (zh) * 2016-08-11 2018-02-23 罗伯特·博世有限公司 压力测量单元和用于施加测量结构的方法
CN107727309A (zh) * 2016-08-11 2018-02-23 罗伯特·博世有限公司 压力测量单元和用于涂覆压力测量单元的载体的方法
KR102438287B1 (ko) 2016-08-11 2022-08-31 로베르트 보쉬 게엠베하 압력 측정 셀 및 측정 구조물의 제공 방법
WO2019005265A1 (fr) * 2017-06-29 2019-01-03 Rosemount Inc. Mise sous boîtier de circuit hybride modulaire
CN109216210A (zh) * 2017-06-29 2019-01-15 罗斯蒙特公司 模块化混合电路封装
JP2020528213A (ja) * 2017-06-29 2020-09-17 ローズマウント インコーポレイテッド 電子装置パッケージ及びその製造方法
US11153985B2 (en) 2017-06-29 2021-10-19 Rosemount Inc. Modular hybrid circuit packaging
JP6991253B2 (ja) 2017-06-29 2022-01-12 ローズマウント インコーポレイテッド 電子装置パッケージ及びその製造方法
CN109216210B (zh) * 2017-06-29 2023-04-21 罗斯蒙特公司 模块化混合电路封装
KR20190021177A (ko) * 2017-08-22 2019-03-05 로베르트 보쉬 게엠베하 센서용 접속 장치
KR102641573B1 (ko) 2017-08-22 2024-02-29 로베르트 보쉬 게엠베하 센서용 접속 장치

Also Published As

Publication number Publication date
DE102014221365A1 (de) 2015-08-20
DE102014221368A1 (de) 2015-08-20

Similar Documents

Publication Publication Date Title
WO2015121486A1 (fr) Module formant sous-ensemble pour unité de détection, et unité de détection correspondante
DE102012204904A1 (de) Sensoreinheit
EP2167930B1 (fr) Unité de raccordement pour une cellule de mesure de pression
WO2013143758A1 (fr) Support de circuit pour bloc capteur et bloc capteur correspondant
WO2013143931A1 (fr) Bloc support pour une carte de circuit imprimé dans un bloc capteur et bloc capteur correspondant
DE10014992C2 (de) Sensoranordnung
WO2015121484A1 (fr) Dispositif de raccordement pour un capteur de pression, capteur de pression et procédé de production d'un dispositif de raccordement
DE102010041169A1 (de) Drucksensor, insbesondere für Bremsvorrichtung
EP1518099A1 (fr) Boitier de capteur haute pression simplifie par l'intermediaire d'un element de liaison (egalement emv)
WO1998055845A1 (fr) Unite capteur de pression, en particulier pour la technologie automobile
DE102013220091A1 (de) Drucksensor
DE102017214599A1 (de) Anschlussvorrichtung für einen Sensor
EP3384264B1 (fr) Procédé de fabrication d'un dispositif de détection d'au moins une caractéristique d'un milieu fluide dans une chambre de mesure
DE102016216974A1 (de) Druckmesszelle und Verfahren zum Beschichten und Kontaktieren eines Trägers einer Druckmesszelle
DE102019216810A1 (de) Sensoreinheit
DE19717882C2 (de) Schaltungsträger in Form eines spritzgegossenen Kunststoffverbindungsteils (MID)
DE102015213566A1 (de) Anschlussvorrichtung für eine Sensoreinheit und zugehörige Sensoreinheit
DE102018207210A1 (de) Sensoreinheit für ein Fahrzeug
DE102022202777B3 (de) Verfahren zur Herstellung einer Kameravorrichtung und Kameravorrichtung für ein Fahrzeug
DE102013212305A1 (de) Elektrisches Kontaktierverfahren und korrespondierende Drucksensoreinheit
WO2013010836A2 (fr) Module connecteur, notamment pour commandes de lève-vitre, et procédé de fabrication de celui-ci
EP1919037A2 (fr) Boîtier et procédé de jonction des parties de boîtier
DE102022211328A1 (de) Sensorbaugruppe für ein Fahrzeug
DE102015225099A1 (de) Elektronikmodul, insbesondere für Getriebesteuergerät, und Verfahren zum Fertigen eines solchen
DE102022212420A1 (de) Elektronikmodul

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15705294

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15705294

Country of ref document: EP

Kind code of ref document: A1