WO2015120253A1 - Thermally conductive electronic substratesand methods relating thereto - Google Patents

Thermally conductive electronic substratesand methods relating thereto Download PDF

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Publication number
WO2015120253A1
WO2015120253A1 PCT/US2015/014788 US2015014788W WO2015120253A1 WO 2015120253 A1 WO2015120253 A1 WO 2015120253A1 US 2015014788 W US2015014788 W US 2015014788W WO 2015120253 A1 WO2015120253 A1 WO 2015120253A1
Authority
WO
WIPO (PCT)
Prior art keywords
bis
substrate according
thermally
composite substrate
polyimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2015/014788
Other languages
English (en)
French (fr)
Inventor
Kerry John ADAMS
David Andrew Greenhill
Alistair Graeme Prince
John D. Summers
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Priority to DE112015000689.3T priority Critical patent/DE112015000689T5/de
Priority to CN201580007029.5A priority patent/CN105960682B/zh
Priority to JP2016550784A priority patent/JP6542783B2/ja
Publication of WO2015120253A1 publication Critical patent/WO2015120253A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/306—Polyimides or polyesterimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/002—Inhomogeneous material in general
    • H01B3/004—Inhomogeneous material in general with conductive additives or conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/38—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes condensation products of aldehydes with amines or amides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wood Science & Technology (AREA)
  • Dispersion Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
PCT/US2015/014788 2014-02-07 2015-02-06 Thermally conductive electronic substratesand methods relating thereto Ceased WO2015120253A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE112015000689.3T DE112015000689T5 (de) 2014-02-07 2015-02-06 Thermisch leitfähige elektronische Substrate und sich darauf beziehende Verfahren
CN201580007029.5A CN105960682B (zh) 2014-02-07 2015-02-06 导热电子基板及其相关方法
JP2016550784A JP6542783B2 (ja) 2014-02-07 2015-02-06 熱伝導性電子基板およびそれに関連する方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201461937011P 2014-02-07 2014-02-07
US61/937,011 2014-02-07

Publications (1)

Publication Number Publication Date
WO2015120253A1 true WO2015120253A1 (en) 2015-08-13

Family

ID=52474122

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2015/014788 Ceased WO2015120253A1 (en) 2014-02-07 2015-02-06 Thermally conductive electronic substratesand methods relating thereto

Country Status (5)

Country Link
US (1) US20150228374A1 (https=)
JP (1) JP6542783B2 (https=)
CN (1) CN105960682B (https=)
DE (1) DE112015000689T5 (https=)
WO (1) WO2015120253A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019022251A1 (ja) 2017-07-28 2019-01-31 三菱瓦斯化学株式会社 新規な（ポリ）アミン化合物、樹脂、及び硬化物

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT519451B1 (de) * 2017-04-26 2018-07-15 Zkw Group Gmbh Verfahren zur Herstellung zumindest einer elektrisch leitenden Verbindung in einem Schaltungsträger und ein nach diesem Verfahren hergestellter Schaltungsträger
US10767014B2 (en) * 2017-10-18 2020-09-08 Taimide Tech. Inc. Method for manufacturing transparent polyimide film

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4814107A (en) 1988-02-12 1989-03-21 Heraeus Incorporated Cermalloy Division Nitrogen fireable resistor compositions
US5137751A (en) * 1990-03-09 1992-08-11 Amoco Corporation Process for making thick multilayers of polyimide
EP1553142A2 (en) * 2003-12-30 2005-07-13 E.I. Du Pont De Nemours And Company Polyimide based compositions comprising doped polyaniline and methods relating thereto
US20070083016A1 (en) * 2005-10-12 2007-04-12 E. I. Dupont De Nemours And Company Photosensitive polyimide compositions
US7348373B2 (en) 2004-01-09 2008-03-25 E.I. Du Pont De Nemours And Company Polyimide compositions having resistance to water sorption, and methods relating thereto
US20090111948A1 (en) * 2007-10-25 2009-04-30 Thomas Eugene Dueber Compositions comprising polyimide and hydrophobic epoxy and phenolic resins, and methods relating thereto
WO2009101874A1 (ja) * 2008-02-13 2009-08-20 Nippon Steel Chemical Co., Ltd. 回路配線基板の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH066359B2 (ja) * 1985-03-30 1994-01-26 日東電工株式会社 プリント回路用基板
CA2037479A1 (en) * 1990-03-09 1991-09-10 Marvin J. Burgess Process for making thick multilayers of polyimide
JPH0461703A (ja) * 1990-06-27 1992-02-27 Haisoole Kk 印刷用導電性ペースト
US5450290A (en) * 1993-02-01 1995-09-12 International Business Machines Corporation Printed circuit board with aligned connections and method of making same
US5766670A (en) * 1993-11-17 1998-06-16 Ibm Via fill compositions for direct attach of devices and methods for applying same
TWI234885B (en) * 2002-03-26 2005-06-21 Fujikura Ltd Electroconductive glass and photovoltaic cell using the same
US20060127686A1 (en) * 2004-12-15 2006-06-15 Meloni Paul A Thermally conductive polyimide film composites having high thermal conductivity useful in an electronic device
DE102005043242A1 (de) * 2005-09-09 2007-03-15 Basf Ag Dispersion zum Aufbringen einer Metallschicht
JP5118824B2 (ja) * 2006-06-22 2013-01-16 三菱製紙株式会社 導電性発現方法
US7604754B2 (en) * 2006-11-17 2009-10-20 E. I. Du Pont De Nemours And Company Resistor compositions for electronic circuitry applications
US20110209894A1 (en) * 2010-02-26 2011-09-01 United States Of America As Represented By The Administrator Of The National Aeronautics Electrically Conductive Composite Material

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4814107A (en) 1988-02-12 1989-03-21 Heraeus Incorporated Cermalloy Division Nitrogen fireable resistor compositions
US5137751A (en) * 1990-03-09 1992-08-11 Amoco Corporation Process for making thick multilayers of polyimide
EP1553142A2 (en) * 2003-12-30 2005-07-13 E.I. Du Pont De Nemours And Company Polyimide based compositions comprising doped polyaniline and methods relating thereto
US7348373B2 (en) 2004-01-09 2008-03-25 E.I. Du Pont De Nemours And Company Polyimide compositions having resistance to water sorption, and methods relating thereto
US20070083016A1 (en) * 2005-10-12 2007-04-12 E. I. Dupont De Nemours And Company Photosensitive polyimide compositions
US20090111948A1 (en) * 2007-10-25 2009-04-30 Thomas Eugene Dueber Compositions comprising polyimide and hydrophobic epoxy and phenolic resins, and methods relating thereto
WO2009101874A1 (ja) * 2008-02-13 2009-08-20 Nippon Steel Chemical Co., Ltd. 回路配線基板の製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Week 200957, Derwent World Patents Index; AN 2009-M79427, XP002738490 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019022251A1 (ja) 2017-07-28 2019-01-31 三菱瓦斯化学株式会社 新規な（ポリ）アミン化合物、樹脂、及び硬化物
KR20200032104A (ko) 2017-07-28 2020-03-25 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 신규한 (폴리)아민 화합물, 수지, 및 경화물

Also Published As

Publication number Publication date
JP2017510978A (ja) 2017-04-13
CN105960682A (zh) 2016-09-21
DE112015000689T5 (de) 2016-11-17
CN105960682B (zh) 2019-05-28
JP6542783B2 (ja) 2019-07-10
US20150228374A1 (en) 2015-08-13

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