WO2015117693A1 - Sensoreinheit für ein fahrzeug und verfahren zur herstellung einer sensoreinheit für ein fahrzeug - Google Patents
Sensoreinheit für ein fahrzeug und verfahren zur herstellung einer sensoreinheit für ein fahrzeug Download PDFInfo
- Publication number
- WO2015117693A1 WO2015117693A1 PCT/EP2014/076497 EP2014076497W WO2015117693A1 WO 2015117693 A1 WO2015117693 A1 WO 2015117693A1 EP 2014076497 W EP2014076497 W EP 2014076497W WO 2015117693 A1 WO2015117693 A1 WO 2015117693A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- sensor
- contact
- cable
- base body
- module
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/02—Housings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/02—Housings
- G01P1/026—Housings for speed measuring devices, e.g. pulse generator
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
Definitions
- the invention relates to a sensor unit for a vehicle according to the preamble of independent claim 1 and to a method for producing a sensor unit for a vehicle according to the preamble of independent patent claim 14.
- Today's speed sensors are set up by electrically connecting a lead frame-based AS IC package to a two-core connection cable.
- the custom application to the vehicle as well as the insulation of the electrical components is usually realized by a thermoplastic or Duroplast- encapsulation in a simple or modular form.
- the connection cable production with components for application on the vehicle and plug takes place on separate lines. Due to the manufacturing process, this usually requires a line and a complex sensor line as well as transport concepts between the two production lines.
- the ASIC package or the sensor circuit is usually fixed by a holder unit.
- the seal between the holder unit and encapsulation is carried out by small rib geometries which melt by the temperature during the filling process and thus ensure a shape and material connection.
- the sealing between the connection cable and the encapsulation takes place through a mixture of activation of the surface adhesion (low melting) and disappearance of the encapsulation during the cooling process.
- Connection cable is usually made by laser soldering, crimping with the help of a Terminals or crimp connections and direct welding of the individual leads of the connection cable to the leadframe.
- Significant disadvantages of today's structure are the high cycle times due to high plastic shot weights (cooling times) and the high variance of the holder and
- thermoplastic encapsulation of the sensor circuit in various geometries requires a considerable release effort for design and process for each new variant since thermal and mechanical stresses during the injection process on the sensor circuit must be avoided.
- a magnetic field sensor in particular a speed and / or direction of rotation sensor for a vehicle or for the drive train of a vehicle is disclosed.
- the magnetic field sensor has a
- a connection arrangement for the beschriene magnetic field sensor has a connection element which has two connecting pieces in a first contacting area, which are each connected via a crimp electrically and mechanically connected to the stripped ends of a connecting cable. In a second contacting region, the connecting pieces can be electrically and mechanically connected to connection lines of a sensor element.
- connection element is at least partially enveloped by a plastic extrusion coating, which has a window-shaped recess in a transition region between the first contacting region and the second contacting region, which is sealed during the injection process of the plastic extrusion in the injection molding tool.
- These fittings are initially in one piece to facilitate the positioning of the connection element before the injection process and are then electrically isolated from each other by separating the connecting parts.
- a sensor arrangement in particular a sensor arrangement for sensing rotational speed and / or direction of rotation for a vehicle wheel or for the drive train of a vehicle is disclosed.
- the sensor arrangement comprises a holder, at least one sensor element arranged on the holder, which comprises at least one connection, wherein the
- Connection in at least one connection point is electrically contacted via corresponding connection means with at least one line of a connecting cable.
- the stripped ends of the connection cable can, for example, each be electrically connected to the connection means by a crimp connection.
- the end of the at least one line of the connecting cable is at least partially embedded with the connecting means in the holder, so that a preform is formed, wherein the at least one connection point is recessed for connection to the sensor element.
- the holder can be encapsulated with the sensor element with a plastic envelope.
- Producing a sensor unit for a vehicle with the features of independent claim 14 have the advantage that a new process chain is possible, which allows the connection cable connection from the electrical contact of the sensor circuit to final customer application to separate.
- the essential plastic injection process which is preferably a thermoplastic injection process, can be placed on the line side or line and be used in the form of a standard interface regardless of the type of applications or customer applications.
- the electrical connection between the connection cable and the sensor circuit which is preferably designed as an ASIC (application-specific integrated circuit or Application-Specific Integrated Circuit), takes place on a production line that is significantly reduced in number and complexity via a mechanical joining and / or contacting process.
- the customer-specific attachment of the application unit which is required for the connection to the vehicle, takes place by means of a variable connection concept, which is another
- Embodiments of the present invention advantageously allow low cycle times for the overmolding operations by reducing the plastic shot weights and increasing the automation on the sensor side through the sleeve assembly process. Since the sensor circuit or the ASIC no longer needs to be overmolded, a larger process window is possible. In addition, a high standardization and thus a smaller number of tools can be achieved. Furthermore, in cable production, a cable module can be inserted on the connection cable sheath with a plastic sheath for connection to a contacting unit. This always results in the same conditions during encapsulation and sealing of the connection cable and the contacting.
- a customer-specific variance of the applications in the form of geometric requirements and / or additional requirements such as sealing functions or fastening functions can be realized simply by mountable or injection-molded fastening modules, which have no influence on internal components, in line production.
- various ASIC packages such as, for example, BGA (Ball Grid Array) can be realized during the production of a preassembled sensor module, which comprises the sensor circuit and the sleeve as the sensor housing.
- BGA All Grid Array
- Embodiments of the present invention provide a sensor unit for a vehicle with a base body, which carries a sensor circuit with at least one sensor contact and at a first end a senorsungs gleich ist which is electrically connected via at least one sensor gene contact with the at least one sensor contact, and at a second end has a cable contact, which is connected via at least one cable contact electrically connected to a connecting cable.
- the sensor contacting and the cable contacting are arranged on a common contact carrier.
- the sensor circuit is connected to an end region of the Contact carrier arranged so that the sensor circuit is aligned in a desired detection direction.
- the detection direction is predetermined by a bending angle of the end region of the contact carrier to the longitudinal axis of the base body.
- the sensor contact with the sensor circuit is surrounded by a cup-shaped sleeve fixed to the main body, the shape of which is attached to the base body
- Detection direction of the sensor circuit is adjusted.
- a method for producing such a sensor unit which arranges the sensor circuit at an end region of the contact carrier and aligns in a desired detection direction.
- the detection direction is predetermined by bending the end region of the contact carrier by a bending angle to the longitudinal axis of the base body, wherein a sleeve is fixed to the main body, which surrounds the sensor contact with the sensor circuit.
- the sleeve shape is adapted to the detection direction of the sensor circuit.
- a first detection direction of a first sensor circuit can extend axially to the longitudinal axis of the base body, so that a first bending angle of the end portion of a first contact carrier to the longitudinal axis of the base body may have a value in the range between 80 ° and 90 ° and a first sleeve as Pot cylinder can be performed on the end face of the first sensor circuit is applied.
- a second detection direction of a second sensor circuit can run perpendicular to the longitudinal axis of the main body, so that a second bending angle of the end region of a second contact carrier to the longitudinal axis of the main body can have a value in the range of 0 ° to 30 ° and a second sleeve as a pot cylinder with an end face , a first slope and a flattening can be performed, to which the second sensor circuit is applied.
- a third Bending angle of the end region of a third contact carrier to the longitudinal axis of the base body may have a value in the range of 40 ° to 60 ° and a third sleeve may be designed as a pot cylinder with a first slope, a second slope and a third slope, at which the third sensor switch is applied.
- a seal can seal the sleeve against the base body.
- the seal can preferably be embodied as an O-ring seal, which is inserted into a corresponding receiving groove in the base body.
- the base body and the contact carrier form a Kunststoffiermodul, wherein the base body can be designed as a plastic injection molding, which surrounds the contact carrier at least partially. The executed as a plastic injection molded part
- the main body can omit the contact carrier at least at the cable contacting and / or the sensor contact in order to facilitate the cable contacting or the sensor contacting.
- the electrical cable contacting between the connecting cable and the at least one cable contact can be carried out, for example, as a mechanical connection, preferably as a crimp connection and / or insulation displacement connection.
- an end region of the base body with the cable contacting and an end region of the connection cable can be injection-molded in a fluid-tight manner after contacting the connection cable.
- the cable module can guide the connection cable axially or at a predetermined angle to the base body.
- a main body of a fastening module can be designed as a plastic injection molded part, which can be sprayed or pushed on the cable end of the body.
- the fastening module can comprise a fastening lug molded onto the base body with a fastening lug.
- the cable module can be integrated into the mounting module.
- plastic sheath of the cable module and the main body of the fastening module can be formed in a common injection process.
- the bending angle for the end region of the contact carrier can be adjusted as a function of the detection direction of the sensor circuit used.
- the shape of the sleeve can also be selected as a function of the detection direction of the sensor circuit used.
- the base body can be designed as a plastic injection molded part, which is injected around the contact carrier, wherein a recess in the base body is formed at least at the cable contacting and / or the sensor contacting.
- the main body can be formed with the sensor circuit and the sleeve as a pre-assembled sensor module, which can be connected to a cable module and / or a mounting module.
- the electrical cable contacting between the connection cable and the at least one cable contact as a mechanical connection, preferably as a crimp connection and / or insulation displacement connection can be performed.
- an end region of the basic body with the cable contacting and an end region of the connecting cable can be overmolded in a fluid-tight manner to form a cable module.
- a base body of a fastening module can be designed as a plastic injection molded part, which is sprayed or pushed on the cable end of the body.
- the attachment module may comprise a molded to the base attachment tab with a mounting lug.
- Fig. 1 shows a schematic perspective view of a first embodiment of a sensor unit according to the invention for a vehicle.
- FIG. 2 shows a schematic sectional illustration of the sensor unit according to the invention for a vehicle from FIG. 1.
- FIG. 3 shows a schematic perspective illustration of a second exemplary embodiment of a sensor unit according to the invention for a vehicle.
- FIG. 4 shows a schematic perspective sectional view of a first exemplary embodiment of a preassembly assembly designed as a sensor module for the sensor unit according to the invention according to FIG. 1 or FIG. 2.
- FIG. 5 shows a schematic perspective sectional view of a second exemplary embodiment of a preassembly assembly designed as a sensor module for a sensor unit according to the invention.
- FIG. 6 shows a schematic perspective sectional view of a third exemplary embodiment of a preassembly assembly designed as a sensor module for a sensor unit according to the invention.
- FIG. 7 shows a schematic illustration of an exemplary embodiment of a contact carrier for the sensor modules according to FIGS. 1 to 6.
- FIG. 9 shows a schematic perspective illustration of a first exemplary embodiment of a preassembly module designed as a contacting module for a first sensor module according to FIG. 4.
- 10 shows a schematic perspective illustration of an intermediate product during the production of the first sensor module according to FIG. 4.
- FIG. 11 shows a schematic perspective view of a sleeve for the first sensor module according to FIG. 4.
- FIG. 12 shows a schematic perspective view of a second exemplary embodiment of a preassembly module designed as a contacting module for a second sensor module according to FIG. 5.
- FIG. 13 shows a schematic perspective illustration of an intermediate product during the production of the second sensor module according to FIG. 5.
- FIG. 14 shows a schematic perspective illustration of a sleeve for the second sensor module according to FIG.
- FIG. 15 shows a schematic perspective view of a third exemplary embodiment of a preassembly module designed as a contacting module for a third sensor module according to FIG. 6.
- FIG. 16 shows a schematic perspective view of an intermediate product in the production of the third sensor module according to FIG. 6.
- FIG. 17 shows a schematic perspective illustration of a sleeve for the third sensor module according to FIG. 6.
- the exemplary embodiments of a sensor unit 1A, 1B for a vehicle each include a main body 32, which has a sensor circuit 22A, 22B, 22C with at least one sensor contact 26.1A, 26.1B, 26 IC, 26.2A, 26.2B, 26.2C carries and at a first end a sensor contact 38A, 38B, 38C which electrically via at least one sensor contact 38.1A, 38.1B, 38.1C, 38.2A, 38.2B, 38.2C with the at least one sensor contact 26.1A, 26.1B, 26.Ic, 26.2A, 26.2B, 26.2C, and at a second end has a cable contact 36, which is connected via at least one cable contact 36.1, 36.2 electrically connected to a connecting cable 3.
- the sensor contacts 38A, 38B, 38C and the cable contact 36 are disposed on a common contact carrier 34A, 34B, 34C.
- the sensor circuit 22A, 22B, 22C is arranged at an end region of the contact carrier 34A, 34B, 34C such that the sensor circuit 22A, 22B, 22C is aligned in a desired detection direction RA, RB, RC.
- the detection direction RA, RB, RC is predetermined by a bending angle DA, DB, DC of the end region of the contact carrier 34A, 34B, 34C to the longitudinal axis LA of the main body 32.
- 38C with the sensor circuit 22A, 22B, 22C is surrounded by a base body 32 fixed cup-shaped sleeve 24A, 24B, 24C, whose shape is adapted to the detection direction RA, RB, RC of the sensor circuit 22A, 22B, 22C.
- the illustrated sensor units 1A, 1B each comprise a cable module 10A, 10B
- the fastening module 40A, 40B can be designed, for example, as a preassembled subassembly, whose main body 42A, 42B is pushed onto the base body 32 of the contacting module 30B and fastened before the connecting cable 3 is electrically connected to the contacting module 30A, 30B, 30C.
- the base body 42a, 42b of the fastening module 40A, 40B can be sprayed onto the main body 32 of the contacting module 30A, 30B, 30C in an injection molding process, before the connecting cable 3 is connected to the
- Contacting module 30A, 30B, 30C is electrically connected.
- the base body 42A, 42B of the fastening module 40A, 40B can be sprayed onto the base body 32 of the contacting module 30A, 30B, 30C in a common injection process with the plastic sheath of the cable module 10A, 10B.
- FIGS. 1 to 3 an end region of the main body 32 with the cable contact 36 and an end region of the contacted End cable 3 for forming a cable module 10A, 10B encapsulated with a plastic sheath.
- FIGS. 1 to 3 an end region of the main body 32 with the cable contact 36 and an end region of the contacted End cable 3 for forming a cable module 10A, 10B encapsulated with a plastic sheath.
- a first cable module 10A leads the connecting cable 3 axially to the main body 32 in a first exemplary embodiment of the sensor unit 1A according to the invention.
- a second cable module 10B feeds the connecting cable 3 A second embodiment of the sensor unit according to the invention 1B at a predetermined angle, here at an angle of 90 ° to the base body.
- a base body 42A, 42B of the fastening module 40A, 40B is designed as a plastic injection-molded part. On the base body 42A, 42B fixing means are arranged, which are formed in the illustrated embodiments as integrally formed fastening tabs 44A, 44B with eyelets 46A, 46B.
- the fastening eyelets 46A, 46B can be inserted, for example, as an insert part into the injection mold or, after the injection process, can be pressed into a corresponding opening in the fastening tab 44A, 44B.
- a first detection direction RA of a first sensor circuit 22A of a first sensor module 20A extends axially to the longitudinal axis LA of the main body 32, so that a first bending angle DA of the end region of a first contact carrier 34A to the longitudinal axis LA of the main body 32 has a value in the range between 80 ° and 90 °.
- a first sleeve 24A is designed as a pot cylinder which has an end face 24.1A at the closed end, against which the first sensor circuit 22A bears with its reading surface.
- a second detection direction RB of a second sensor circuit 22B of a second sensor module 20B runs perpendicular to the longitudinal axis LA of the base body 32, so that a second bending angle DB of the end region of a second contact carrier 34B with respect to the longitudinal axis LA of the base body 32 has a value in the range of 0 ° to 30 °.
- a second sleeve 24B is designed as a pot cylinder with an end face 24.1B, a first bevel 24.2B and a flattening 24.3B, against which the second sensor circuit 22B bears with its reading surface.
- a third detection direction RC of a third sensor circuit 22C of a third sensor module 20C runs with a forward given angle obliquely to the longitudinal axis LA of the base body 32, so that a third bending angle DC of the end portion of a third contact carrier 34C to the longitudinal axis LA of the base body 32 has a value in the range of 40 ° to 60 °.
- a third sleeve 24C is designed as a pot cylinder with a first bevel 24.2C, a second bevel 24.1C and a third bevel 24.3C, against which the third sensor circuit 22C bears with its reading surface.
- an expansion with an angled edge 29 is provided at the open end 28 of the respective sleeve 24A, 24B, 24C, which rests against a circumferential annular elevation of the base body 32.
- a seal 5 designed as an O-ring is arranged in front of the annular elevation of the base body 32, which seals the sleeve 24A, 24B, 24C against the base body 32.
- the contact carrier 34A, 34B, 34C is designed as a stamped bent part with predetermined separation points 35, via which the common contact carrier 34A, 34B, 34C can be divided into individual current paths, each of which has a cable contact 36.1, 36.2 of the cable contacting 36 electrically connect to a sensor contact 38.1A, 381B, 38.1C, 38.2A, 38.2B, 38.2C of the sensor contact 38A, 38B, 38C.
- the electrical cable contact 36 between the connecting cable 3 and the at least one cable contact 36.1, 36.2 is designed for example as a mechanical connection, preferably as a crimp connection and / or insulation displacement connection.
- the cable contacts 36.1, 36.2 are designed as Crimptaschen, in each of which a stripped end of a single line of the connecting cable 3 is inserted.
- the main body 32 is embodied as a plastic injection-molded part which at least partially surrounds the contact carrier 34A, 34B, 34C.
- the at least one separation point 35 is severed between the current paths.
- the main body 32 and the contact carrier 34 A, 34 B, 34 C can be performed as a preassembly assembly, which to various customer applications or installation environments in the vehicle or various sensor circuits 22A, 22B, 22C can be adjusted.
- the two sensor contact contacts 38.1A, 38.2A of the first sensor module 20A As can also be seen from FIGS. 9 and 10, to produce the first sensor module 20A, the two sensor contact contacts 38.1A, 38.2A of the first sensor module 20A, the two sensor contact contacts 38.1A, 38.2A of the first sensor module 20A, the two sensor contact contacts 38.1A, 38.2A of the first sensor module 20A, the two sensor contact contacts 38.1A, 38.2A of the first
- Sensor contact 38A bent at the end portion of the first contact carrier 34A in the example shown by a first bending angle DA of about 90 ° to the longitudinal axis LA of the base body 32.
- the first sensor circuit 22A is electrically and mechanically connected via the two sensor contacts 26.1A, 26.2A to the two corresponding sensor contact contacts 38.1A, 38.2A of the sensor contact 38A of the first contact carrier 34A.
- the two sensor contacts 26.1A, 26.2A of the first sensor circuit 22A are electrically and mechanically connected, for example by soldering and / or riveting and / or welding, to the corresponding sensor contact contacts 38.1A, 38.2A.
- the two sensor contacts 26.1A, 26.2A can be adapted before being connected by bending to the corresponding sensor contact contacts 38.1A, 38.2A.
- the two sensor contacts 26.1A, 26.2A each have an angle of approximately 90 ° to the first sensor circuit 22A.
- the main body 32 and the first contact carrier 34A, with or without the unprogrammed first sensor circuit 22A, can form a pre-assembly module 30A, which can be adapted to different customer applications or installation environments in the vehicle.
- the first sleeve 24A designed as a pot cylinder shown in FIG. 11 can be pushed onto the sensor-side end of the main body 32 and connected in a fluid-tight manner to it. The first sleeve 24A is pushed so that the first sensor circuit 22A rests with its reading surface on the end face 24.1A.
- the two sensor contact contacts 38.1B, 38.2B of the sensor contact 38B at the end region of the first contact carrier 34B in the example illustrated are at a second bending angle DB of approximately 30 ° to the longitudinal axis LA of the main body 32 bent.
- the second sensor circuit 22B is electrically and mechanically connected via the two sensor contacts 26.1B, 26.2B to the two corresponding sensor contact contacts 38.1B, 38.2B of the sensor contact 38B of the second contact carrier 34B.
- Sensor contacts 26.1B, 26.2B of the second sensor circuit 22B are electrically and mechanically connected, for example, by soldering and / or riveting and / or welding to the corresponding sensor contact contacts 38.1B, 38.2B.
- the two sensor contacts 26.1B, 26.2B are placed without bending on the corresponding sensor counter contacts 38.1B, 38.2B and each have an angle of approximately 0 ° to the second sensor circuit 22B.
- the main body 32 and the second contact carrier 34B, with or without unprogrammed second sensor circuit 22B, can form a contacting module 30B designed as a preassembly module, which can be connected to various customer applications or installation environments in the
- Vehicle can be customized.
- the second sleeve 24B shown in FIG. 14 as a pot cylinder with an end face 24.1B, a first bevel 24.2B and a flattening 24.3B can be pushed onto the sensor-side end of the base body 32 and fluid-tight with it get connected.
- the second sleeve 24B is pushed so that the second sensor circuit 22B rests with its reading surface on the flattening 24.3B.
- the two sensor contact contacts 38. IC, 38.2C of the sensor contact 38C at the end region of the first contact carrier 34C in the illustrated example are at a third bending angle DC of approximately 45 ° bent to the longitudinal axis LA of the body 32. Subsequently, the third sensor circuit 22C via the two sensor contacts 26. IC, 26.2C electrically and mechanically connected to the two corresponding sensor contact contacts 38. IC, 38.2C of the sensor contact 38C of the second contact carrier 34C. The two sensor contacts 26.
- IC, 26.2C of the third sensor circuit 22C are electrically and mechanically connected, for example, by soldering and / or riveting and / or welding with the corresponding sensor contact contacts 38. IC, 38.2C.
- the two sensor contacts 26. IC, 26.2C can be adapted before being connected by bending to the corresponding sensor contact contacts 38. IC, 38.2C.
- the two sensor contacts 26. IC, 26.2C each have an angle of approximately 30 ° to the third sensor circuit 22C.
- the main body 32 and the third contact carrier 34C, with or without the unprogrammed third sensor circuit 22C, can form a contacting module 30C designed as a preassembly module, which can be connected to different customer devices.
- the third sleeve 24C shown in FIG. 17 as a pot cylinder with a first bevel 24.2C, a second bevel 24.1C and a third bevel 24.3C, can be pushed onto the sensor-side end of the base body 32 and fluid-tight with it get connected.
- the third sleeve 24C is pushed so that the third sensor circuit 22C rests with its reading surface on the third slope 24.3C.
- the joints between the modules 10A, 10B, 20A, 20B, 20C, 30A, 30B, 30C, 40A, 40B are designed so that mechanical prefixing and final bonding can be implemented by laser.
- a variance in the length of the sensor unit 1A, 1B may be due to different lengths
- Contacting modules 30A, 30B, 30C are achieved without the connection interfaces, i. the sensor contact 38A, 38B, 38C and / or the Lucascardie- tion 36 to influence.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Transmission And Conversion Of Sensor Element Output (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020167021242A KR20160117460A (ko) | 2014-02-06 | 2014-12-04 | 차량용 센서 유닛, 그리고 차량용 센서 유닛의 제조 방법 |
CN201480074931.4A CN105980814B (zh) | 2014-02-06 | 2014-12-04 | 用于车辆的传感器单元和用于制造用于车辆的传感器单元的方法 |
US15/116,937 US10330695B2 (en) | 2014-02-06 | 2014-12-04 | Sensor unit for a vehicle, and method for producing a sensor unit for a vehicle |
JP2016550252A JP6328256B2 (ja) | 2014-02-06 | 2014-12-04 | 車両用センサユニット及び車両用センサユニットの製造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102014202192.8A DE102014202192A1 (de) | 2014-02-06 | 2014-02-06 | Sensoreinheit für ein Fahrzeug und Verfahren zur Herstellung einer Sensoreinheit für ein Fahrzeug |
DE102014202192.8 | 2014-02-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2015117693A1 true WO2015117693A1 (de) | 2015-08-13 |
Family
ID=52023477
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2014/076497 WO2015117693A1 (de) | 2014-02-06 | 2014-12-04 | Sensoreinheit für ein fahrzeug und verfahren zur herstellung einer sensoreinheit für ein fahrzeug |
Country Status (6)
Country | Link |
---|---|
US (1) | US10330695B2 (de) |
JP (1) | JP6328256B2 (de) |
KR (1) | KR20160117460A (de) |
CN (1) | CN105980814B (de) |
DE (1) | DE102014202192A1 (de) |
WO (1) | WO2015117693A1 (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102017214780A1 (de) * | 2017-08-23 | 2019-02-28 | Conti Temic Microelectronic Gmbh | Sensorbauteil, Vormontageanordnung für ein Sensorbauteil und Verfahren zur Herstellung eines Sensorbauteils |
DE102017216533A1 (de) * | 2017-09-19 | 2019-03-21 | Robert Bosch Gmbh | Halter für eine Sensoreinheit |
US10451645B2 (en) | 2018-03-12 | 2019-10-22 | Veoneer Us Inc. | Remote sensor construction via integrated vacuum manufacture process |
US10673184B2 (en) | 2018-03-27 | 2020-06-02 | Veoneer Us Inc. | Rigid electrical connection to strain sensitive sensing component |
US10524367B2 (en) * | 2018-03-28 | 2019-12-31 | Veoneer Us Inc. | Solderless sensor unit with substrate carrier |
DE102022211328A1 (de) | 2022-10-26 | 2024-05-02 | Robert Bosch Gesellschaft mit beschränkter Haftung | Sensorbaugruppe für ein Fahrzeug |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1619507A2 (de) * | 2004-07-20 | 2006-01-25 | Sumiden Electronics, Ltd. | Rotationssensor |
DE102006029980A1 (de) * | 2006-06-29 | 2008-01-03 | Robert Bosch Gmbh | Sensoranordnung |
DE102007036264A1 (de) * | 2007-08-02 | 2009-02-05 | Robert Bosch Gmbh | Verfahren zur Herstellung eines Bewegungssensors |
DE102009028963A1 (de) * | 2009-08-28 | 2011-03-03 | Robert Bosch Gmbh | Anschlussanordnung für eine Sensoranordnung und Sensoranordnung |
DE102009046439A1 (de) * | 2009-11-05 | 2011-05-12 | Robert Bosch Gmbh | Sensoreinheit mit Kunststoffummantelung und Verfahren zur Herstellung der Kunststoffummantelung |
EP2653839A1 (de) * | 2012-04-19 | 2013-10-23 | Sick Ag | Sensor mit von einem Hotmelt umgebenen Elektronikkomponenten |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1619507A1 (de) * | 1967-02-28 | 1970-09-10 | Fraenkische Pelzindustrie Maer | Verfahren zur Erzielung von Farbschattierungen bei Pelzfellen |
JP3108850B2 (ja) * | 1994-11-04 | 2000-11-13 | 株式会社ユニシアジェックス | 回転センサ |
JPH10253652A (ja) * | 1997-03-14 | 1998-09-25 | Denso Corp | センサ装置及びその製造方法並びにその製造に用いられるリードフレーム |
DE29910305U1 (de) * | 1999-06-12 | 2000-11-16 | Robert Bosch Gmbh, 70469 Stuttgart | Elektrisches Gerät |
DE102004018869B4 (de) * | 2004-04-19 | 2008-05-08 | Siemens Ag | Vorrichtung zur Erfassung der Bewegung eines bewegbaren Bauteils |
DE102005012709A1 (de) * | 2005-03-22 | 2006-09-28 | Robert Bosch Gmbh | Magnetfeldsensor |
DE102011004447A1 (de) * | 2011-02-21 | 2012-08-23 | Robert Bosch Gmbh | Sensoreinheit für ein Fahrzeug |
-
2014
- 2014-02-06 DE DE102014202192.8A patent/DE102014202192A1/de not_active Withdrawn
- 2014-12-04 KR KR1020167021242A patent/KR20160117460A/ko not_active Application Discontinuation
- 2014-12-04 US US15/116,937 patent/US10330695B2/en not_active Expired - Fee Related
- 2014-12-04 CN CN201480074931.4A patent/CN105980814B/zh not_active Expired - Fee Related
- 2014-12-04 WO PCT/EP2014/076497 patent/WO2015117693A1/de active Application Filing
- 2014-12-04 JP JP2016550252A patent/JP6328256B2/ja not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1619507A2 (de) * | 2004-07-20 | 2006-01-25 | Sumiden Electronics, Ltd. | Rotationssensor |
DE102006029980A1 (de) * | 2006-06-29 | 2008-01-03 | Robert Bosch Gmbh | Sensoranordnung |
DE102007036264A1 (de) * | 2007-08-02 | 2009-02-05 | Robert Bosch Gmbh | Verfahren zur Herstellung eines Bewegungssensors |
DE102009028963A1 (de) * | 2009-08-28 | 2011-03-03 | Robert Bosch Gmbh | Anschlussanordnung für eine Sensoranordnung und Sensoranordnung |
DE102009046439A1 (de) * | 2009-11-05 | 2011-05-12 | Robert Bosch Gmbh | Sensoreinheit mit Kunststoffummantelung und Verfahren zur Herstellung der Kunststoffummantelung |
EP2653839A1 (de) * | 2012-04-19 | 2013-10-23 | Sick Ag | Sensor mit von einem Hotmelt umgebenen Elektronikkomponenten |
Also Published As
Publication number | Publication date |
---|---|
JP6328256B2 (ja) | 2018-05-23 |
DE102014202192A1 (de) | 2015-08-06 |
CN105980814B (zh) | 2018-06-01 |
KR20160117460A (ko) | 2016-10-10 |
JP2017506336A (ja) | 2017-03-02 |
CN105980814A (zh) | 2016-09-28 |
US20170176486A1 (en) | 2017-06-22 |
US10330695B2 (en) | 2019-06-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2015117693A1 (de) | Sensoreinheit für ein fahrzeug und verfahren zur herstellung einer sensoreinheit für ein fahrzeug | |
EP2470868B1 (de) | Anschlussanordnung für eine sensoranordnung und sensoranordnung | |
EP2678640A1 (de) | Sensoreinheit für ein fahrzeug | |
EP2211396A2 (de) | Verfahren zur Herstellung eines Sensors | |
EP2122784B1 (de) | Sensoranordnung | |
EP2449581B1 (de) | Verfahren zur herstellung eines elektronischen bauteils | |
WO2013143758A1 (de) | Schaltungsträger für eine sensoreinheit und korrespondierende sensoreinheit | |
WO2015121486A1 (de) | Vormontagebaugruppe für eine sensoreinheit und korrespondierende sensor-einheit | |
EP3685124B1 (de) | Halter für eine sensoreinheit | |
WO2015121484A1 (de) | Anschlussvorrichtung für einen drucksensor, drucksensor und verfahren zur herstellung einer anschlussvorrichtung | |
WO2016096192A1 (de) | Sensoreinrichtung | |
WO2015117717A1 (de) | Verfahren zur herstellung einer sensoreinheit für ein fahrzeug und sensoreinheit für ein fahrzeug | |
EP1170110A1 (de) | Verfahren zum Herstellen einer kunststoffumspritzten Leiterstruktur einer elektrischen Schaltungseinheit sowie eine elektrische Schaltungseinheit mit einer kunststoffumspritzten Leiterstruktur | |
EP2704544B1 (de) | Sensoranordnung | |
WO2016096191A1 (de) | Sensoreinrichtung | |
EP3102915A1 (de) | Sensoreinheit für ein fahrzeug | |
WO2022214373A1 (de) | Sensoreinheit und verfahren zur herstellung einer sensoreinheit | |
DE102021108663A1 (de) | Sensoreinheit und Verfahren zur Herstellung einer Sensoreinheit | |
WO2018224376A1 (de) | Elektronisches bauteil und verfahren zu dessen herstellung | |
WO2010063516A1 (de) | Füllstandssensor und verfahren zur herstellung des füllstandssensors | |
WO2019091628A1 (de) | Umspritzverfahren für eine sensoreinheit | |
WO2022214374A1 (de) | Sensoreinheit und verfahren zur herstellung einer sensoreinheit | |
DE102022202559A1 (de) | Sensoreinheit und Verfahren zur Herstellung einer Sensoreinheit | |
DE102021108661A1 (de) | Redundante Sensoreinheit und Verfahren zur Herstellung einer Sensoreinheit | |
EP3206268B1 (de) | Verfahren zum feuchtigkeitsdichten abdichten eines elektrischen kupplungsteils |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 14811803 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 20167021242 Country of ref document: KR Kind code of ref document: A |
|
ENP | Entry into the national phase |
Ref document number: 2016550252 Country of ref document: JP Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 15116937 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
REG | Reference to national code |
Ref country code: BR Ref legal event code: B01A Ref document number: 112016017411 Country of ref document: BR |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 14811803 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 112016017411 Country of ref document: BR Kind code of ref document: A2 Effective date: 20160727 |