WO2015117494A1 - 一种模块装配单元及方法、射频拉远单元 - Google Patents

一种模块装配单元及方法、射频拉远单元 Download PDF

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Publication number
WO2015117494A1
WO2015117494A1 PCT/CN2014/093507 CN2014093507W WO2015117494A1 WO 2015117494 A1 WO2015117494 A1 WO 2015117494A1 CN 2014093507 W CN2014093507 W CN 2014093507W WO 2015117494 A1 WO2015117494 A1 WO 2015117494A1
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Prior art keywords
module
unit
modules
cover
cavity
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PCT/CN2014/093507
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English (en)
French (fr)
Inventor
樊宁
缴炜
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中兴通讯股份有限公司
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Publication of WO2015117494A1 publication Critical patent/WO2015117494A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0037—Housings with compartments containing a PCB, e.g. partitioning walls

Definitions

  • the present invention relates to the field of communications technologies, and in particular, to a module assembly unit and method, and a radio remote unit.
  • green energy saving is an important indicator of the product.
  • the Radio Remote Unit (RRU) device the most important embodiment of the indicator is the volume power ratio of the RRU.
  • the installation and maintenance bring great convenience and greatly reduce the operation and maintenance cost of the product; therefore, for the RRU, the smaller the volume, the better.
  • the RRU volume can also be reduced by the internal layout design, for example, the original small modules are designed as one large module, which can effectively reduce the total volume of the RRU.
  • the RRU internal large-board module design diagram we can see the RRU internal large-board module design diagram. This technology designs several small modules into one large module, which significantly improves the integration of the module and reduces the overall volume. However, this increases the complexity of the module in design and production, and the plane area is large, and some modules are not suitable for design together, so this technology has its limitations.
  • the method for reducing the volume of the RRU unit in addition to the above reasonable internal layout design, the efficiency performance improvement of the active module, there is also a main method, that is, the assembly method of the RRU internal module, some more compact and reasonable
  • the assembly method can effectively reduce the volume of the entire RRU unit.
  • the existing assembly methods are a few of the existing assembly methods:
  • FIG. 4 it is a plan view of the docking assembly of the module in the current RRU unit.
  • the bottom plate 1 of the module M1 (labeled 2) and the cover 3 of the module M1 are separately assembled, and the bottom plate of the module M2 (labeled 5) 7 is assembled separately from the cover 6 of the module M2, and then the module M1 and the module M2 are butt-joined through the interface A (label 4) and the interface B (label 8).
  • the height H of the assembly contact area of the two modules includes the height D1 of the cover surface of the module M1, and the module M2
  • the height of the cover surface d2 and the height h of the gap between the two modules (h is the avoidance height of interface A and interface B, must be retained in the design).
  • the main technical problem to be solved by the embodiments of the present invention is to provide a module assembly unit and method, and a radio remote unit, which solves the problem of assembling the RRU internal module by using the module docking assembly scheme, and the compactness and firmness between the modules are low.
  • an embodiment of the present invention provides a module assembly unit, including: a first module unit, a bottom plate for mounting the first module unit, and a cover plate for covering the first module unit;
  • the first module unit is composed of at least two modules that are connected through an interface, and the module is a module in the radio remote unit;
  • the cover is a common cover of each module in the first module unit, and is used for Closing each module in the first module unit; after the capping, the interface between the two modules that are butted together is located in the cover plate.
  • the common cover plate is provided with at least two cavities for covering the modules in the first module unit, one of the cavities covers one of the modules, and the cavities are separated by at least one sub-segment The cavity is composed.
  • the first module unit comprises two modules that are butt-joined; the cover plate is provided with upper and lower cavities having a common bottom, and the upper cavity is used to cover the module above the cover, The lower cavity is used to cover the module below the cover; after the cover, the interface between the two modules is located in the bottom.
  • the first module unit comprises at least two modules that are sequentially butted in the right and left; the cover plate is provided with at least two cavities, and the adjacent two cavities share one side wall; after the cover, the adjacent two modules are The intervening interface is located in a side wall that is shared by the adjacent two cavities of the adjacent two modules.
  • the module assembly unit further includes a second module unit and a bottom plate for mounting the second module unit; the second module unit is vertically connected to the first module unit through an interface, the second module The unit is composed of at least one module in the remote radio unit; the first module unit and the second module unit share the cover plate, and the cover plate is further provided for covering a module in the second module unit The cavity is closed, and the interface between the second module unit and the first module unit is located in the cover.
  • the second module unit comprises at least two modules that are butted to each other through the interface; the cover plate is further provided with at least two cavities for respectively covering the modules in the second module unit;
  • the cavities of the modules in the second module unit cover a side wall, and after the capping, the interface between two adjacent modules in the second module unit is located in the side wall.
  • the first module unit is composed of a first module and a second module
  • the second module unit is composed of a third module
  • the third module is respectively connected to the first module and the second module.
  • the cover plate is provided with a first cavity for covering the first module, a second cavity for covering the second module, and a third cavity for covering the third module;
  • the first cavity is connected to the second cavity and shares a sidewall, the first cavity, the second cavity and the third cavity share a bottom; after the cover, the first An interface between the module and the second module is located in the sidewall, and an interface between the third module and the first module and the second module is located in the bottom.
  • the embodiment of the present invention further provides a radio frequency remote unit, specifically, assembled by at least one module assembly unit as described above.
  • the embodiment of the present invention further provides a module assembly method, including the following steps:
  • the first module unit is composed of at least two modules that are connected through the interface, and the module is a module in the radio frequency remote unit;
  • the modules in the first module unit are covered by a common cover; after the cover, the interfaces between the two modules that are butted together are located in the cover.
  • the step of covering each module in the first module unit by using a common cover plate comprises:
  • At least two cavities are provided on the disclosed cover for capping the modules, one of the cavities enclosing one of the modules.
  • the embodiment of the present invention provides a module assembly unit and method, and a radio frequency remote unit, which can make the RRU internal module assembly more compact and firm; specifically, the module assembly unit of the present invention includes: a first module unit, and is used for installing a bottom plate of the first module unit and a cover plate for covering the first module unit; the first module unit is composed of at least two modules that are connected by an interface, and the module is a module in the radio remote unit
  • the cover plate is a common cover plate of each module in the first module unit, and is used for covering each module in the first module unit; after the cover, the interface between the two modules that are mutually butted is located at the In the cover plate; on the basis of the existing module docking assembly scheme, the common cover plate of each assembly module is designed and the interface between the assembled modules is placed in the cover plate, thereby reducing the assembly gap between the modules.
  • the module assembly is more compact and robust; in addition, the use of a common cover for each docking module saves a cover compared to the prior art, saving costs and simplifying assembly and production.
  • Ligand, from the volume, the reduced height of a cover plate can be further reduced volume of the RRU.
  • FIG. 1 is a schematic diagram of assembly of an early module in an RRU unit in the prior art
  • FIG. 2 is a schematic diagram of a design of a large board module in an RRU unit in the prior art
  • FIG. 3 is a schematic perspective view of a docking assembly of a module in an RRU unit in the prior art
  • FIG. 4 is a schematic plan view of a docking assembly of a module in an RRU unit in the prior art
  • FIG. 5 is a schematic perspective view showing the assembly of a common cover of a module in an RRU unit according to Embodiment 1 of the present invention.
  • FIG. 6 is a schematic plan view showing the assembly of a common cover (upper and lower sub-chamber) of a module in an RRU unit according to Embodiment 1 of the present invention
  • FIG. 7 is a schematic perspective view showing the assembly of a common cover (left and right sub-chamber) of a module in an RRU unit according to Embodiment 1 of the present invention.
  • FIG. 8 is a schematic perspective view showing another assembly of a module (left and right sub-chamber) in an RRU unit according to an embodiment of the present invention.
  • FIG. 9 is a schematic plan view showing the assembly of a common cover (left and right sub-chamber) of a module in an RRU unit according to Embodiment 1 of the present invention.
  • FIG. 10 is a perspective view showing the assembly of a common cover (multi-module sub-cavity) of a module in an RRU unit according to Embodiment 1 of the present invention.
  • FIG. 11 is a schematic plan view showing the assembly of a common cover (multi-module sub-cavity) of a module in an RRU unit according to Embodiment 1 of the present invention
  • FIG. 12 is a schematic flowchart diagram of a module assembly method according to Embodiment 2 of the present invention.
  • Embodiment 1 is a diagrammatic representation of Embodiment 1:
  • the present embodiment provides a module assembly unit, which solves the current problem by designing a common cover plate of each docking module.
  • the common cover plate can make the seamless connection between the mating modules to enhance the compactness between the modules.
  • the common cover of each module can also enhance the robustness of the assembly between the modules.
  • the module assembly unit of the embodiment includes: a first module unit, a bottom plate for mounting the first module unit, and a cover plate for covering the first module unit;
  • the first module unit is configured by Forming at least two modules that are connected by an interface, the module is a module in the radio remote unit;
  • the cover is a common cover of each module in the first module unit, and is used for covering the first module Each module in the unit; after the cover, the interface between the two modules that are butted together is located in the cover.
  • a unit is provided after assembling an RRU internal module by designing a common cover plate, wherein the first module unit is composed of at least two docking modules, each module is disposed on a corresponding bottom plate thereof, and adopts a common
  • the cover is covered, and the interface between the mating modules is located in the cover after assembly, which eliminates the gap between the original docking modules due to the avoidance height of the interface, enhances the compactness between the modules, and is enhanced by an integrated cover.
  • the mating module is firmly assembled; the cover is used to cover each module, reducing the original cover height and further reducing the RRU volume.
  • the bottom plate of the first module unit may be a large bottom plate.
  • the first module unit when the first module unit is composed of modules arranged in a lateral direction and connected to each other, all the modules may be installed by using one large base plate;
  • the bottom plate may also be a plurality of bottom plates, that is, one module corresponds to one bottom plate.
  • the first module unit when the first module unit is composed of two modules of the upstream object, the two modules are respectively disposed on the various bottom plates.
  • the common cover plate is provided with at least two cavities for covering the modules in the first module unit, and one of the cavities covers one of the modules, and the cavity is composed of at least one
  • the sub-cavity is configured; that is, a cavity equal to the number of modules is disposed on the common cover plate to cover each module, and each cavity is composed of a plurality of sub-chambers, for example, when the first module unit When two RF modules are connected, they can be in the common cover Two large cavities are disposed to cover the two RF modules respectively, and a plurality of sub-divided cavities can be disposed inside the two large cavities.
  • the chambers in the following embodiments are all cavities of the module with a complete cover.
  • the sub-chambers inside the cavity are not limited, and may depend on the structure of the module.
  • the first module unit in the embodiment comprises two modules that are butt-joined; the cover plate is provided with upper and lower cavities having a common bottom, and the upper cavity is used for The module above the cover, the lower cavity is used to cover the module under the cover; after the cover, the interface between the two modules is located in the bottom.
  • FIG. 5 is a schematic diagram of a common cover assembly of an RRU internal module.
  • the cover plates of the two modules 101 and 102 are designed as a common cover structure 103 for upper and lower sub-chambers, and the common cover 103 is provided. It can be used as a cover for the two modules 101, 102 at the same time, so that the two modules are designed according to the cover and then assembled according to the cover.
  • the cover plate having the upper and lower cavities is mainly designed to cover the modules 101 and 102, and the structure in the cavity is not limited, and the design may be based on the structure of the surfaces of the modules 101 and 102, in FIG.
  • the common cover plate 103 has two upper and lower two large cavities for sealing the complete modules 101, 102, and a plurality of sub-divided cavities are provided inside the upper or lower cavity.
  • FIG. 6 is a plan view showing the assembly of a common cover (upper and lower sub-chamber) of a module in an RRU unit.
  • the module M1 (labeled 202) is mounted on the bottom plate 201, and the module M2 (labeled 205) is mounted on the bottom plate.
  • module M1 (label 202) and module M2 (label 205) are mounted together through a common cover 204, the electrical relationship between the two modules is connected through interface A (label 203) and interface B (label 207);
  • the cover plate 204 is provided with two upper and lower cavities for covering the modules M1 and M2. The figure is not exemplified by the fact that the sub-chamber is not provided inside the lower cavity.
  • the height of the assembly contact areas of the two modules is only The height d of a common cover face, and the connection between the modules is more secure, and the assembly avoidance height of the interface A and the interface B is designed inside the module M1 and the module M2, no longer occupying a useful height.
  • the first module unit includes at least two modules that are sequentially butted in the right and left; the cover plate is provided with at least two cavities, and the adjacent two cavities share one side wall; After the cover, the interface between the adjacent two modules is located in a side wall shared by the adjacent two cavities of the adjacent two modules.
  • the first unit comprises modules arranged laterally and butted to each other
  • a cavity equal to the number of modules is disposed on the cover plate to respectively cover the modules, and the cavities can be connected to the cavities, ie adjacent cavities.
  • a side wall is shared between the bodies, and the interfaces between the modules are located in the common side wall after assembly, so that the assembly avoidance height of the interface between the modules is designed in the module.
  • the adjacent two modules are in contact with each other.
  • the thickness of the area is only shared The thickness of the side wall, there is no gap between the two adjacent modules, so that the modules are more compact after assembly, thereby reducing the volume of the RRU.
  • the assembly unit of the embodiment is introduced with the first module unit including two left and right docking modules.
  • FIG. 7 a schematic diagram of the module assembly (left and right sub-chamber) of the RRU unit is assembled, and the module 301 and the module 302 are The modules 301, 302 are covered by a common cover 303 in FIG. 7 by two modules that are butted to the left and right through the interface; the common cover 303 is provided with two adjacent left and right cavities for respectively covering the modules 301, 302, and Inside the two chambers is divided into a plurality of sub-divided bodies. After assembly, the interface between the module 301 and the module 302 is located in a side wall shared by the two cavities. As can be seen from the assembly diagram shown in FIG. 7, there is no gap between the modules 301, 302, which increases the compactness and robustness between the modules, thereby reducing the volume of the RRU.
  • the module M1 (label 401) and the module M2 (label 402) are connected by the interface A (label 404), and the modules M1, M2 are assembled on the bottom plate 405; the common cover 403 is used for sealing in FIG.
  • the cover module M1 and the module M2; the cover plate 403 is provided with two left and right connected cavities (the common cover plate 403 in FIG. 8 is similar to the common cover plate 303 in FIG. 7 except that the left and right cavities of the common cover plate in FIG. 8)
  • the internal sub-cavity is not provided to cover the module M1 and the module M2 respectively, and the two cavities share one side wall.
  • the interface A is located in the common side wall, that is, the avoidance height of the interface A It is set inside module M1 and module M2. As can be seen from the assembly diagram shown in FIG. 9, there is no gap between the module M1 and the module M2, which increases the compactness and robustness between the modules, thereby reducing the volume of the RRU.
  • the present embodiment may further include a second module unit and a bottom plate for mounting the second module unit, where the second module unit passes the interface and the first
  • the module unit is vertically connected, and the second module unit is composed of at least one module in the radio remote unit; the first module unit and the second module unit share the cover, and the cover is further provided.
  • a cavity for covering a module in the second module unit the cavity being constituted by at least one sub-divided cavity; after the capping, an interface between the second module unit and the first modular unit is located In the cover plate.
  • a cavity for covering the module in the second module unit may be disposed on the cover plate, and the cavity is formed by at least one sub-divided cavity, so that the first A module unit and a second module unit can share a single cover.
  • the module may be connected to one or more of the first module units, and may be respectively connected to each other through the interface in the first module unit, or only One or several modules are docked up and down through the interface; when the second module unit includes multiple modules, one or more of the plurality of modules may be connected to the corresponding modules in the first module unit.
  • the second module unit in the embodiment may include at least two modules that are butted through the interface in sequence; the cover plate is further provided with at least two cavities for respectively covering the modules in the second module unit;
  • the cavities of the modules in the adjacent two capping second module units share a side wall, and after the capping, the interface between two adjacent modules in the second module unit is located in the side wall.
  • the second module unit may be configured by a plurality of modules arranged laterally and butted to each other.
  • an interconnected cavity equal to the number of modules in the second module unit may be disposed on the common cover plate.
  • the modules in the second module unit are capped, and the cavities share a side wall with each other, similar to the assembled structure shown in FIG. 7-9.
  • a cover plate can be used to cover the first module unit and the second module unit, and the gap between the first module unit and the second module unit and the gap between the right and left docking modules can be reduced, and the gap between the modules can be reduced.
  • the gap between the module in the first module unit and the module in the second module unit is vertically aligned, which improves the compactness and firmness between the docking modules.
  • the first module unit is composed of a first module and a second module, and the second module unit is configured by a third module, and the third module is respectively connected to the first module and the second module.
  • the cover plate is provided with a first cavity for covering the first module, a second cavity for covering the second module, and a third cavity for covering the third module;
  • the first cavity is connected to the second cavity and shares a sidewall, the first cavity, the second cavity and the third cavity share a bottom; after the cover, the first An interface between the module and the second module is located in the sidewall, and an interface between the third module and the first module and the second module is located in the bottom.
  • the two figures illustrate a module common cover (multi-module sub-cavity) assembly in an RRU unit.
  • modules M1, M2, M3 (labeled 501, respectively) 502, 503) share a cover 504
  • the modules M1, M3 are mounted on the bottom plate 508
  • the module M2 is mounted on the bottom plate 509
  • the modules M1 and M3 are electrically connected through the interface C (labeled 505)
  • the module M3 is connected through the interface A (labeled 506) and interface B (labeled 507) are electrically connected to the modules M1 and M2, respectively.
  • the upper and lower sides of the common cover 504 are provided with two left and right cavities for covering the modules M1 and M3, and the left and right cavities share one.
  • the side wall, the assembled interface C is located in the side wall; a cavity is provided on the lower side of the common cover 504 for the cover module M2, and the cavity shares a bottom with the upper left and right cavity, and after assembly, the interface A and B is located in the bottom.
  • the assembly unit of the embodiment has the following advantages: (1) For the large-plate design of the multi-module synthesis single module, the three-dimensional assembly mode adopted by the embodiment can reduce the planar area of the module. (2) For the assembly scheme of module docking, the assembly method of the embodiment is more compact, and the gap between the modules and one is reduced. The height of the cover surface can also make the connection of the module interface stronger. (3) The assembly method of the embodiment is simple in implementation and has no cost burden.
  • This embodiment can also be used to assemble the RRU using the above-described assembly unit, that is, to assemble the RRU using the assembly method described above.
  • Embodiment 2 is a diagrammatic representation of Embodiment 1:
  • the embodiment further provides a module assembly method, including the following steps:
  • Step 601 The first module unit is mounted on the bottom plate, and the first module unit is composed of at least two modules that are connected through the interface, and the module is a module in the radio remote unit.
  • Step 602 Covering each module in the first module unit with a common cover plate; after the cover, the interface between the two modules that are butted together is located in the cover plate.
  • the assembly method of the embodiment is based on the existing module docking assembly scheme, and the common cover plate of each assembly module is designed and the interface between the assembled modules is placed in the cover plate, thereby reducing the assembly gap between the modules and making the module assembly. More compact and robust; in addition, the use of a common cover for each docking module saves a cover compared to the prior art, which saves cost and simplifies assembly and assembly, and reduces the size of the cover. The height can further reduce the RRU volume.
  • the process of covering each module in the first module unit by using a common cover plate in the above step 601 includes: providing at least two cavities on the disclosure cover plate for covering each module, one The cavity encloses one of the modules, the cavity being formed by at least one sub-divided cavity.
  • the method of the embodiment uses the sub-cavity design of the common cover to assemble the module, which reduces the gap between the modules and the height of a cover surface, and at the same time makes the connection of the module interface stronger.
  • the RRU internal module assembly can be made more compact and firm; on the basis of the existing module docking assembly scheme, the common cover plate of each assembly module is designed and assembled.
  • the interface between the rear modules is arranged in the cover plate, which reduces the assembly gap between the modules, so that the module assembly is more compact and firm;
  • the common cover plate of each docking module saves a cover plate compared with the prior art, from assembly and In terms of production, the cost is saved and the assembly is simplified. In terms of volume, reducing the height of one cover can further reduce the RRU volume.

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Abstract

本发明公开了一种模块装配单元及方法、射频拉远单元。本发明的模块装配单元包括：第一模块单元、用于安装所述第一模块单元的底板和用于封盖所述第一模块单元的盖板；所述第一模块单元由至少两个通过接口对接的模块构成，所述模块为射频拉远单元内的模块；所述盖板为所述第一模块单元中各模块的公共盖板，用于封盖所述第一模块单元中的各模块；封盖后，相互对接的两模块之间的接口位于所述盖板中；本发明的模块装配单元可以使得RRU内部模块装配更加紧凑和牢固，进一步减小RRU体积。

Description

一种模块装配单元及方法、射频拉远单元 技术领域
本发明涉及通信技术领域，尤其涉及一种模块装配单元及方法、射频拉远单元。
背景技术
在当前的无线通信系统中，绿色节能是产品的一个重要指标，对于射频拉远单元(Radio Remote Unit，以下简称RRU)设备来说，该指标最主要的体现的是RRU的体积功率比。
对于输出相同功率的RRU设备，其产品的节能效率越高，意味着热耗越小，那么需要配备的散热模块也就越小，减小了设备体积，而更小的设备体积，会为设备的安装、维护带来极大的方便，大大降低了产品的运维费用；所以对于RRU来说，体积越小越好。
另外，在本领域中还可以通过内部布局设计来减小RRU体积，例如将原来的几个小模块设计为一个大的模块，这样也能有效的减少RRU的总体积。如图1所示，我们可以看到RRU内部大板模块设计示意图，这种技术将几块小的模块，设计为一个大的模块，这样显著提高了模块的集成程度，减少了整个体积。但是这样增加了模块在设计、生产中的复杂程度，并且平面面积较大，同时一些模块也不适合设计在一起，所以这种技术存在其局限性。
在本领域中，减小RRU单元体积的方法，除了上述合理的内部布局设计，有源模块的效率性能提升之外，还有一个主要方法，就是RRU内部模块的装配方法，一些更为紧凑合理的装配方法，可以有效的降低整个RRU单元的体积。下面介绍几种现有的装配方法：
在最早的RRU设计中，并未充分考虑到这个问题，都是将内部模块固定在散热底板上，通过一系列线缆连接各个模块之间的接口。如图2所示，我们可以看到早期的RRU单元内的模块装配示意图，模块被固定在RRU的散热底板上，然后模块之间通过相关线缆连接其电气关系。这种装配技术，模块的散热良好，但是会导致整个RRU的体积很大，很多内部空间没有被利用起来。
随着RRU设备的体积要求越来越严，各种更加紧凑的装配方法也随之出现，现在最主要的方法一个是合理设计模块之间的接口位置，在装配时直接将两个模块进行对接安装。如图3所示，我们可以看到RRU内部模块对接装配示意图，这种技术通过特殊的接口设计，使得模块可以通过接口直接对接安装，充分节省了RRU内部空间，是目前常用的一种RRU内部模块装配方法。但是这种装配方法，模块之间还是会存在空隙，模块间的紧凑程度还不能够达到用户需求，并且模块间连接的牢固性不强。如图4所示，为目前RRU单元内模块对接装配平面示意图，在图4中，模块M1(标注2)的底板1与模块M1的盖板3单独进行装配，模块M2(标注5)的底板7与模块M2的盖板6单独进行装配，然后将模块M1与模块M2通过接口A(标注4)和接口B(标注8)进行对接装配。这两个模块装配后以后，我们可以看到在除去这两个模块的腔体高度与底板厚度后，这两个模块装配接触区域的高度H包括模块M1的盖板面高度d1，模块M2的盖板面高度d2，以及两个模块之间的缝隙高度h(h为接口A和接口B的避让高度，在设计中必须保留)。
发明内容
本发明实施例要解决的主要技术问题是，提供一种模块装配单元及方法、射频拉远单元，解决了目前采用模块对接装配方案装配RRU内部模块，模块间紧凑程度和牢固性低的问题。
为解决上述技术问题，本发明实施例提供一种模块装配单元,包括：第一模块单元、用于安装所述第一模块单元的底板和用于封盖所述第一模块单元的盖板；所述第一模块单元由至少两个通过接口对接的模块构成，所述模块为射频拉远单元内的模块；所述盖板为所述第一模块单元中各模块的公共盖板，用于封盖所述第一模块单元中的各模块；封盖后，相互对接的两模块之间的接口位于所述盖板中。
优选地，所述公共盖板设有至少两个用于封盖所述第一模块单元中模块的腔体，一个所述腔体封盖一个所述模块，所述腔体由至少一个子分腔体构成。
优选地，所述第一模块单元包括两个上下对接的模块；所述盖板设有具有公共底部的上、下腔体，所述上腔体用于封盖上方的所述模块，所述下腔体用于封盖下方的所述模块；封盖后，两模块之间的接口位于所述底部中。
优选地，所述第一模块单元包括至少两个依次左右对接的模块；所述盖板设有至少两个腔体，相邻两腔体共用一个侧壁；封盖后，相邻两模块之间的接口位于封盖该相邻两模块的相邻两腔体共用的侧壁中。
优选地，所述模块装配单元还包括第二模块单元和用于安装所述第二模块单元的底板；所述第二模块单元通过接口与所述第一模块单元上下对接，所述第二模块单元由至少一个所述射频拉远单元内的模块构成；所述第一模块单元与所述第二模块单元共用所述盖板，所述盖板还设有用于封盖第二模块单元中模块的腔体，封盖后，所述第二模块单元与所述第一模块单元之间的接口位于所述盖板中。
优选地，所述第二模块单元包括至少两个依次通过接口左右对接的模块；所述盖板还设有至少两个分别用于封盖第二模块单元中各模块的腔体；相邻两个封盖第二模块单元中模块的腔体共用一侧壁，封盖后，第二模块单元中相邻两个模块之间的接口位于所述侧壁中。
优选地，所述第一模块单元由第一模块和第二模块构成，所述第二模块单元由第三模块构成，所述第三模块分别与所述第一模块、第二模块上下对接；所述盖板设有用于封盖所述第一模块的第一腔体、用于封盖所述第二模块的第二腔体和用于封盖所述第三模块的第三腔体；所述第一腔体与第二腔体连接并共用一个侧壁，所述第一腔体、所述第二腔体和所述第三腔体共用一个底部；封盖后，所述第一模块与所述第二模块之间的接口位于所述侧壁中，所述第三模块与所述第一模块、所述第二模块之间的接口位于所述底部中。
同样为了解决上述的技术问题，本发明实施例还提出了一种射频拉远单元，具体地，由至少一个如上所述的模块装配单元装配而成。
同样为了解决上述的技术问题，本发明实施例还提出了一种模块装配方法，包括如下步骤：
将第一模块单元安装在底板上，所述第一模块单元由至少两个通过接口对接的模块构成，所述模块为射频拉远单元内的模块；
利用公共盖板封盖所述第一模块单元中的各模块；封盖后，相互对接的两模块之间的接口位于所述盖板中。
优选地，所述利用公共盖板封盖所述第一模块单元中的各模块的步骤包括：
在所述公开盖板上设置至少两个腔体用于封盖各模块，一个所述腔体封盖一个所述模块。
本发明实施例的有益效果是：
本发明实施例提供了一种模块装配单元及方法、射频拉远单元，可以使得RRU内部模块装配更加紧凑和牢固；具体地，本发明的模块装配单元包括：第一模块单元、用于安装所述第一模块单元的底板和用于封盖所述第一模块单元的盖板；所述第一模块单元由至少两个通过接口对接的模块构成，所述模块为射频拉远单元内的模块；所述盖板为所述第一模块单元中各模块的公共盖板，用于封盖所述第一模块单元中的各模块；封盖后，相互对接的两模块之间的接口位于所述盖板中；本发明在现有模块对接装配方案的基础上，设计了各装配模块的公共盖板并且将装配后模块间的接口设置在盖板中，减小了模块间的装配缝隙使得模块装配更加紧凑和牢固；另外，各对接模块采用公共盖板相比现有技术节省了一个盖板，从装配和生产上来说，节省了成本并简化了装配，从体积上来说，减少了一个盖板的高度可以进一步减小了RRU体积。
附图说明
图1为现有技术中RRU单元内早期模块装配示意图；
图2为现有技术中RRU单元内大板模块设计示意图；
图3为现有技术中RRU单元内模块对接装配立体示意图；
图4为现有技术中RRU单元内模块对接装配平面示意图；
图5为本发明实施例一提供的一种RRU单元内模块共盖板装配立体示意图；
图6为本发明实施例一提供的一种RRU单元内模块共盖板(上下分腔)装配平面示意图；
图7为本发明实施例一提供的一种RRU单元内模块共盖(左右分腔)板装配立体示意图；
图8为本发明实施例一提供的另一种RRU单元内模块共盖(左右分腔)板装配立体示意图；
图9为本发明实施例一提供的一种RRU单元内模块共盖(左右分腔)板装配平面示意图；
图10为本发明实施例一提供的一种RRU单元内模块共盖板(多模块分腔)装配立体示意图
图11为本发明实施例一提供的一种RRU单元内模块共盖板(多模块分腔)装配平面示意图；
图12为本发明实施例二提供的一种模块装配方法的流程示意图。
具体实施方式
下面通过具体实施方式结合附图对本发明作进一步详细说明。
实施例一：
考虑到目前模块对接装配方案存在装配后模块间紧凑性和牢固性不强的问题，本实施例提供了一种模块装配单元，通过设计各对接模块的公共盖板来解决目前的问题，由于采用公共盖板可以使得对接模块间无缝隙对接加强了模块间的紧凑度，另外各模块共用一公共盖板还可以增强各模块间装配的牢固性。
具体地，本实施例的模块装配单元包括：第一模块单元、用于安装所述第一模块单元的底板和用于封盖所述第一模块单元的盖板；所述第一模块单元由至少两个通过接口对接的模块构成，所述模块为射频拉远单元内的模块；所述盖板为所述第一模块单元中各模块的公共盖板，用于封盖所述第一模块单元中的各模块；封盖后，相互对接的两模块之间的接口位于所述盖板中。
本实施例中提供了一种采用设计公共盖板装配RRU内部模块后的单元，其中，第一模块单元由至少两个对接的模块构成，每个模块均设置在其对应的底板上，采用公共盖板封盖，并且装配后对接模块间的接口位于盖板中，消除了原先对接模块间的由于接口的避让高度产生的缝隙，增强了模块间的紧凑度，采用一体式的盖板增强了对接模块间装配牢固性；采用一个盖板封盖各个模块，减少了一个原先的盖板高度，进一步减小RRU体积。
本实施例中第一模块单元的底板可以为一个大的底板，例如第一模块单元由横向排列并且相互对接的模块构成时，可以采用一个大的底板安装所有的模块；当有第一模块单元的底板还可以为多个底板，即一个模块对应一个底板，例如当第一模块单元由两个上行对象的模块构成时，两个模块分别设置在各种的底板上。
优先地，本实施例中公共盖板设有至少两个用于封盖所述第一模块单元中模块的腔体，一个所述腔体封盖一个所述模块，所述腔体由至少一个子分腔体构成；也就是说，在公共盖板上设置与模块数量相等的腔体分别封盖各模块，并且每个腔体由多个子分腔体组合而成，例如当第一模块单元包括两对接的射频模块时，可以在公共盖板 上设置两个大的腔体分别封盖两个射频模块，而对于这个两个大的腔体内部可以设置多个子分腔体。以下本实施例所说的腔体均为封盖完整的模块的腔体，对于该腔体内部的子分腔体不做任何限制，其可以视模块的结构而定。
下面介绍本实施例装配单元的几种具体结构：
1、在上述介绍的装配单元基础上，本实施例中第一模块单元包括两个上下对接的模块；所述盖板设有具有公共底部的上、下腔体，所述上腔体用于封盖上方的所述模块，所述下腔体用于封盖下方的所述模块；封盖后，两模块之间的接口位于所述底部中。
如图5所示为一种RRU内部模块共盖板装配示意图，在图5中两个模块101、102的盖板设计为一种上下分腔的公共盖板结构件103，该公共盖板103可以同时作为两个模块101、102的盖板，这样两个模块依托该盖板进行接口设计，然后依托该盖板进行装配。本实施例中主要是设计具有上下腔体的公开盖板来封盖模块101、102，而对于腔体内的结构不做限制，其可以根据模块101、102表面的结构进行设计，在图5中公共盖板103具有两个上下两个大的腔体，用来封完整的模块101、102，而在上或下腔体内部均设有多个子分腔体。
如图6所示为一种RRU单元内模块共盖板(上下分腔)装配平面示意图，在图6中，模块M1(标注202)安装在底板201上，模块M2(标注205)安装在底板206上；模块M1(标注202)和模块M2(标注205)通过公共盖板204安装在一起，两个模块间的电气关系通过接口A(标注203)和接口B(标注207)进行连接；公共盖板204设有上下两个腔体用于封盖模块M1和M2，该图以上下腔体内部不设有子分腔体为例。这两个模块装配后以后，与图4所示的模块对接装配方案相比，可以看到在除去这两个模块的腔体高度与底板厚度后，这两个模块装配接触区域的高度仅为一个公共盖板面的高度d，并且模块之间的连接更加牢固，而接口A和接口B的装配避让高度被设计在模块M1和模块M2内部，不再占据有用高度。
2、在上述介绍的装配单元基础上，所述第一模块单元包括至少两个依次左右对接的模块；所述盖板设有至少两个腔体，相邻两腔体共用一个侧壁；封盖后，相邻两模块之间的接口位于封盖该相邻两模块的相邻两腔体共用的侧壁中。
例如第一单元包括横向排列并且相互左右对接的模块时，将会在盖板上设置与模块数量相等的腔体来分别封盖各个模块，这些腔体可以依次相连的腔体，即相邻腔体之间共用一侧壁，而模块之间的接口在装配后位于共用侧壁中，这样就模块之间接口的装配避让高度被设计在模块内，此时，相邻两模块之间配接触区域的厚度仅为共用 侧壁的厚度，相邻两模块之间不存在缝隙，所以使得装配后模块间更紧凑，从而减小了RRU的体积。
下面以第一模块单元包括两个左右对接的模块来介绍本实施例的装配单元，如图7所示为RRU单元内模块共盖(左右分腔)板装配立体示意图，模块301和模块302是通过接口左右对接的两模块，在图7中采用公共盖板303来封盖模块301、302；公共盖板303设有左右两个相邻的腔体用来分别封盖模块301、302，并且在这两个腔体内部被分隔成多个子分腔体，装配后，模块301和模块302之间的接口位于两个腔体共用的侧壁中。从图7所述的装配示意图可以看出来，模块301、302之间不存在缝隙，增加了模块间的紧凑性和牢固性，从而减小了RRU的体积。
又例如图8和9所示，模块M1(标注401)和模块M2(标注402)通过接口A(标注404)连接，模块M1、M2装配底板405上；图8中采用公共盖板403来封盖模块M1和模块M2；公开盖板403设有左右两个相连腔体(该图8中公共盖板403与图7中公共盖板303类似，区别在于图8中公共盖板的左右腔体内部不设置子分腔体)用来分别封盖模块M1和模块M2，并且这两个腔体共用一个侧壁，装配后，接口A位于共用的侧壁中，也就是说接口A的避让高度设置在模块M1和模块M2内部。从图9所示的装配示意图可以看出，模块M1和模块M2之间不存在缝隙，增加了模块间的紧凑性和牢固性，从而减小了RRU的体积。
优先地，本实施例在上述第二种装配单元的基础上，还可以包括第二模块单元和用于安装所述第二模块单元的底板；所述第二模块单元通过接口与所述第一模块单元上下对接，所述第二模块单元由至少一个所述射频拉远单元内的模块构成；所述第一模块单元与所述第二模块单元共用所述盖板，所述盖板还设有用于封盖第二模块单元中模块的腔体，所述腔体由至少一个子分腔体构成；封盖后，所述第二模块单元与所述第一模块单元之间的接口位于所述盖板中。
当本实施例装配单元还包括第二模块单元时，还可以在盖板上设置用于封盖第二模块单元中模块的腔体，该腔体由至少一个子分腔体构成，这样使得第一模块单元和第二模块单元可以共用一个盖板。
当本实施例中第二模块单元仅包括一个模块时，该模块可以与第一模块单元中一个或者多个对接，具体地可以分别与第一模块单元中各模块通过接口上下对接，也可以只与其中一个或者几个模块通过接口上下对接；当第二模块单元包括多个模块时，该多个模块中一个或几个可以与第一模块单元中对应的模块上下对接。
优先地，本实施例中第二模块单元可以包括至少两个依次通过接口左右对接的模块；所述盖板还设有至少两个分别用于封盖第二模块单元中各模块的腔体；相邻两个封盖第二模块单元中模块的腔体共用一侧壁，封盖后，第二模块单元中相邻两个模块之间的接口位于所述侧壁中。
本实施例中第二模块单元可以由多个横向排列并且相互左右对接的模块构成，此时，可以在上述公共盖板上设置与第二模块单元中模块数量相等的相互连接的腔体，用来封盖第二模块单元中各模块，并且这些腔体相互之间共用一个侧壁，类似参考如图7-9所示装配示意图装配后的结构。
本实施例中可以利用一个盖板来封盖第一模块单元和第二模块单元，减小第一模块单元和第二模块单元中横向排列并且相互左右对接模块之间缝隙，同时还可以减小第一模块单元中模块与第二模块单元中模块在纵向对接装配的缝隙，提高了对接模块间的紧凑性和牢固性。
优先地，所述第一模块单元由第一模块和第二模块构成，所述第二模块单元由第三模块构成，所述第三模块分别与所述第一模块、第二模块上下对接；所述盖板设有用于封盖所述第一模块的第一腔体、用于封盖所述第二模块的第二腔体和用于封盖所述第三模块的第三腔体；所述第一腔体与第二腔体连接并共用一个侧壁，所述第一腔体、所述第二腔体和所述第三腔体共用一个底部；封盖后，所述第一模块与所述第二模块之间的接口位于所述侧壁中，所述第三模块与所述第一模块、所述第二模块之间的接口位于所述底部中。
如图10和11所示，两个附图示意了一种RRU单元内模块共盖板(多模块分腔)装配，在图9和10中，模块M1，M2，M3(标注分别为501、502、503)共用一个盖板504，模块M1、M3安装在底板508上，模块M2安装在底板509上；模块M1与M3通过接口C(标注为505)电气连接，模块M3通过接口A(标注为506)和接口B(标注为507)分别与模块M1、M2电气连接，公共盖板504上侧设有连接的左右两腔体用于封盖模块M1与M3，并且该左右腔体共用一个侧壁，装配后接口C位于该侧壁中；公共盖板504下侧设有一腔体用于封盖模块M2，并且该腔体与上方左右两腔体共用一个底部，装配后，接口A和B位于该底部中。
本实施例的装配单元与现有技术相比，其显著优点在于：(1)对于多模块合成单模块的大板设计方案，本实施例采取的立体装配方式，可以减小模块的平面面积。(2)对于模块对接的装配方案，本实施例的装配方式更紧凑，减少了模块之间的空隙和一 个盖板面的高度，同时可以使模块接口的连接更牢固。(3)本实施例装配方式实现方式简单，无成本负担。
本实施例还可以利用上述装配单元来装配RRU，即采用上述介绍的装配方式来装配RRU。
实施例二：
如图12所示，本实施例还提供了一种模块装配方法，包括如下步骤：
步骤601：将第一模块单元安装在底板上，所述第一模块单元由至少两个通过接口对接的模块构成，所述模块为射频拉远单元内的模块。
步骤602：利用公共盖板封盖所述第一模块单元中的各模块；封盖后，相互对接的两模块之间的接口位于所述盖板中。
本实施例装配方法在现有模块对接装配方案的基础上，设计了各装配模块的公共盖板并且将装配后模块间的接口设置在盖板中，减小了模块间的装配缝隙使得模块装配更加紧凑和牢固；另外，各对接模块采用公共盖板相比现有技术节省了一个盖板，从装配和生产上来说，节省了成本并简化了装配，从体积上来说，减少了一个盖板的高度可以进一步减小了RRU体积。
优先地，上述步骤601中所述利用公共盖板封盖所述第一模块单元中的各模块的过程包括：在所述公开盖板上设置至少两个腔体用于封盖各模块，一个所述腔体封盖一个所述模块，所述腔体由至少一个子分腔体构成。
本实施例方法利用公共盖板的分腔设计来装配模块，减少了模块之间的空隙和一个盖板面的高度，同时可以使模块接口的连接更牢固。
以上内容是结合具体的实施方式对本发明所作的进一步详细说明，不能认定本发明的具体实施只局限于这些说明。对于本发明所属技术领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干简单推演或替换，都应当视为属于本发明的保护范围。
工业实用性
基于本发明实施例提供的上述技术方案，可以使得RRU内部模块装配更加紧凑和牢固；在现有模块对接装配方案的基础上，设计了各装配模块的公共盖板并且将装配 后模块间的接口设置在盖板中，减小了模块间的装配缝隙使得模块装配更加紧凑和牢固；另外，各对接模块采用公共盖板相比现有技术节省了一个盖板，从装配和生产上来说，节省了成本并简化了装配，从体积上来说，减少了一个盖板的高度可以进一步减小了RRU体积。

Claims (10)

  1. 一种模块装配单元，包括：第一模块单元、用于安装所述第一模块单元的底板和用于封盖所述第一模块单元的盖板；所述第一模块单元由至少两个通过接口对接的模块构成，所述模块为射频拉远单元内的模块；所述盖板为所述第一模块单元中各模块的公共盖板，用于封盖所述第一模块单元中的各模块；封盖后，相互对接的两模块之间的接口位于所述盖板中。
  2. 如权利要求1所述的模块装配单元，其中，所述公共盖板设有至少两个用于封盖所述第一模块单元中模块的腔体，一个所述腔体封盖一个所述模块，所述腔体由至少一个子分腔体构成。
  3. 如权利要求2所述的模块装配单元，其中，所述第一模块单元包括两个上下对接的模块；所述盖板设有具有公共底部的上、下腔体，所述上腔体用于封盖上方的所述模块，所述下腔体用于封盖下方的所述模块；封盖后，两模块之间的接口位于所述底部中。
  4. 如权利要求2所述的模块装配单元，其中，所述第一模块单元包括至少两个依次左右对接的模块；所述盖板设有至少两个腔体，相邻两腔体共用一个侧壁；封盖后，相邻两模块之间的接口位于封盖该相邻两模块的相邻两腔体共用的侧壁中。
  5. 如权利要求4所述的模块装配单元，其中，还包括第二模块单元和用于安装所述第二模块单元的底板；所述第二模块单元通过接口与所述第一模块单元上下对接，所述第二模块单元由至少一个所述射频拉远单元内的模块构成；所述第一模块单元与所述第二模块单元共用所述盖板，所述盖板还设有用于封盖第二模块单元中模块的腔体，所述腔体由至少一个子分腔体构成；封盖后，所述第二模块单元与所述第一模块单元之间的接口位于所述盖板中。
  6. 如权利要求5所述的模块装配单元，其中，所述第二模块单元包括至少两个依次通过接口左右对接的模块；所述盖板还设有至少两个分别用于封盖第二模块单元中各模块的腔体；相邻两个封盖第二模块单元中模块的所述腔体共用一侧壁，封盖后，第二模块单元中相邻两个模块之间的接口位于所述侧壁中。
  7. 如权利要求5所述的模块装配单元，其中，所述第一模块单元由第一模块和第二模块构成，所述第二模块单元由第三模块构成，所述第三模块分别与所述第 一模块、第二模块上下对接；所述盖板设有用于封盖所述第一模块的第一腔体、用于封盖所述第二模块的第二腔体和用于封盖所述第三模块的第三腔体；所述第一腔体与第二腔体连接并共用一个侧壁，所述第一腔体、所述第二腔体和所述第三腔体共用一个底部；封盖后，所述第一模块与所述第二模块之间的接口位于所述侧壁中，所述第三模块与所述第一模块、所述第二模块之间的接口位于所述底部中。
  8. 一种射频拉远单元，所述射频拉远单元由至少一个如权利要求1-7任一项所述的模块装配单元装配而成。
  9. 一种模块装配方法，包括如下步骤：
    将第一模块单元安装在底板上，所述第一模块单元由至少两个通过接口对接的模块构成，所述模块为射频拉远单元内的模块；
    利用公共盖板封盖所述第一模块单元中的各模块；封盖后，相互对接的两模块之间的接口位于所述盖板中。
  10. 如权利要9所述的方法，其中，所述利用公共盖板封盖所述第一模块单元中的各模块的步骤包括：
    在所述公开盖板上设置至少两个腔体用于封盖各模块，一个所述腔体封盖一个所述模块，所述腔体由至少一个子分腔体构成。
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