WO2015105122A1 - Composition durcissable - Google Patents

Composition durcissable Download PDF

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Publication number
WO2015105122A1
WO2015105122A1 PCT/JP2015/050251 JP2015050251W WO2015105122A1 WO 2015105122 A1 WO2015105122 A1 WO 2015105122A1 JP 2015050251 W JP2015050251 W JP 2015050251W WO 2015105122 A1 WO2015105122 A1 WO 2015105122A1
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WO
WIPO (PCT)
Prior art keywords
group
reactive silicon
containing polymer
silicon group
polymer
Prior art date
Application number
PCT/JP2015/050251
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English (en)
Japanese (ja)
Inventor
翔大 神谷
のどか 太刀掛
達郎 春増
Original Assignee
株式会社カネカ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社カネカ filed Critical 株式会社カネカ
Publication of WO2015105122A1 publication Critical patent/WO2015105122A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/32—Polymers modified by chemical after-treatment
    • C08G65/329—Polymers modified by chemical after-treatment with organic compounds
    • C08G65/336—Polymers modified by chemical after-treatment with organic compounds containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/26—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds
    • C08G65/2603—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen
    • C08G65/2606—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen containing hydroxyl groups
    • C08G65/2609—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen containing hydroxyl groups containing aliphatic hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/26—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds
    • C08G65/2642—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds characterised by the catalyst used
    • C08G65/2645—Metals or compounds thereof, e.g. salts
    • C08G65/2663—Metal cyanide catalysts, i.e. DMC's
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/32—Polymers modified by chemical after-treatment
    • C08G65/329—Polymers modified by chemical after-treatment with organic compounds
    • C08G65/337—Polymers modified by chemical after-treatment with organic compounds containing other elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C08L101/10—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides

Definitions

  • the present invention relates to a curable composition containing a reactive silicon group-containing polymer having an average of more than 1.0 reactive silicon groups only at one end.
  • the present invention relates to the general formula (1): -Si (R 1 ) 3-a (X) a (1) ⁇
  • R 1 s are the same or different and are each an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, an aralkyl group having 7 to 20 carbon atoms, or (R ′) 3 SiO— ( R 'is a monovalent represents a hydrocarbon group, three R of 1 to 20 carbon atoms' indicates the triorganosiloxy groups may be the same, represented by different may be), R 1 is When two or more are present, they may be the same or different.
  • X is each independently a hydroxyl group or a hydrolyzable group.
  • a represents 1, 2 or 3.
  • the reactive silicon group-containing polymer (A) having an average of more than 1.0 reactive silicon groups represented by only one terminal is included, and the reactive silicon group-containing polymer (A) is 100 weights.
  • the compounding quantity of the compound which has a fluoro alkylene group with respect to a part is related with the curable composition which is 10 weight part or less.
  • the reactive silicon group-containing polymer (C) preferably has an average of 1.7 or more reactive silicon groups in one molecule.
  • Having an average of more than 1.0 reactive silicon group only at one end means having a reactive silicon group only at one end portion of a linear polymer, and having two or more reactions at one end
  • a polymer having a functional silicon group is included, and if the average number of reactive silicon groups is more than 1.0 at only one end, two or more at only one end portion. Both a polymer containing a reactive silicon group and a polymer containing one reactive silicon group only at one terminal site may be contained.
  • the reactive silicon group-containing polymer (A) may have a reactive silicon group in addition to the terminal portion, but a rubber-like cured product having a high elongation and a low elastic modulus only at the terminal portion. Is preferred because it is easy to obtain.
  • the epoxy compound examples include alkylene oxides such as ethylene oxide and propylene oxide, and glycidyl ethers such as methyl glycidyl ether and allyl glycidyl ether. Of these, propylene oxide is preferable.
  • the alkali metal salt is used when the epoxy compound having a carbon-carbon unsaturated bond is reacted with the polymer having a hydroxyl group at one end, but by using the alkali metal salt, all polymer fragments are obtained.
  • An epoxy compound having a carbon-carbon unsaturated bond uniformly only at the terminal site can be reacted.
  • a double metal cyanide complex catalyst is used instead of an alkali metal salt, an epoxy compound having a carbon-carbon unsaturated bond selectively reacts with a polymer having a low molecular weight. This is not preferable because a carbon-carbon unsaturated bond is locally introduced into one terminal portion.
  • the amount of the halogenated hydrocarbon compound having a carbon-carbon unsaturated bond is not particularly limited, but the lower limit of the molar ratio to the hydroxyl group contained in the polyoxyalkylene polymer is 0.7 or more. Preferably, 1.0 or more is more preferable.
  • the upper limit is preferably 5.0 or less, and more preferably 2.0 or less.
  • a hydroxyl group-terminated polyoxyalkylene polymer After obtaining a hydroxyl group-terminated polyoxyalkylene polymer by a method of polymerizing an epoxy compound, (i) after converting the hydroxyl group of the obtained hydroxyl group-terminated polyoxyalkylene polymer to a carbon-carbon unsaturated group, Reactivity by a method of adding a compound by hydrosilylation reaction, (ii) a method of reacting the obtained hydroxyl-terminated polyoxyalkylene polymer with a compound having both a group that reacts with a hydroxyl group and a reactive silicon group It is preferable to obtain a silicon group-containing polymer (B). Of the above two methods, the method (i) is more preferred because the reaction is simple, the adjustment of the amount of reactive silicon groups introduced, and the physical properties of the resulting reactive silicon group-containing polymer are stable.
  • the terminal structure of the reactive silicon group-containing polymer (D) has the general formula (2): (Wherein R 1 , X and a are the same as defined above, R 2 and R 4 are each independently a divalent linking group having 1 to 6 carbon atoms, and the atoms bonded to adjacent carbon atoms are: Any one of carbon, oxygen, and nitrogen, R 3 and R 5 are each independently hydrogen or a hydrocarbon group having 1 to 10 carbon atoms, and n is a number greater than 0 and 10 or less.
  • amine compound examples include methylamine, ethylamine, propylamine, isopropylamine, butylamine, amylamine, hexylamine, octylamine, 2-ethylhexylamine, nonylamine, decylamine, laurylamine, pentadecylamine, cetylamine, stearylamine, Aliphatic primary amines such as cyclohexylamine; dimethylamine, diethylamine, dipropylamine, diisopropylamine, dibutylamine, diamylamine, dihexylamine, dioctylamine, di (2-ethylhexyl) amine, didecylamine, dilaurylamine, dicetylamine Aliphatic secondary amines such as, distearylamine, methylstearylamine, ethylstearylamine, butylstearylamine; Aliphatic tertiary
  • amidines such as 1,2-dimethyl-1,4,5,6-tetrahydropyrimidine, DBU, DBA-DBU and DBN
  • guanidines such as guanidine, phenylguanidine and diphenylguanidine
  • butylbiguanide, 1 Biguanides such as -o-tolyl biguanide and 1-phenyl biguanide are preferable because they exhibit high activity, and aryl group-substituted biguanides such as 1-o-tolyl biguanide and 1-phenyl biguanide can be expected to have high adhesiveness.
  • aryl group-substituted biguanides such as 1-o-tolyl biguanide and 1-phenyl biguanide can be expected to have high adhesiveness.
  • aryl group-substituted biguanides such as 1-o-tolyl biguanide and 1-phenyl biguanide can be expected to have high adhesiveness. preferable.
  • silanol condensation catalysts include organic sulfonic acids such as trifluoromethanesulfonic acid; inorganic acids such as hydrochloric acid, phosphoric acid and boronic acid; boron trifluoride, boron trifluoride diethyl ether complex, boron trifluoride ethylamine complex, etc.
  • Boron trifluoride complex ammonium fluoride, tetrabutylammonium fluoride, potassium fluoride, cesium fluoride, ammonium hydrogen fluoride, 1,1,2,3,3,3-hexafluoro-1-diethylaminopropane (MEC81 , Commonly known as Ishikawa reagent), potassium hexafluorophosphate, Na 2 SiF 6 , K 2 SiF 6 , (NH 4 ) 2 SiF 6 and other fluorine anion-containing compounds.
  • MEC81 1,1,2,3,3,3-hexafluoro-1-diethylaminopropane
  • a photoacid generator or photobase generator that generates an acid or a base by light can also be used as a silanol condensation catalyst.
  • the photoacid generator include triarylsulfonium salts such as p-phenylbenzylmethylsulfonium salt, p-hydroxyphenylbenzylmethylsulfonium salt, triphenylsulfonium salt, diphenyl [4- (phenylthio) phenyl] sulfonium salt, 4,4 -Bis [di ( ⁇ -hydroxyethoxy) phenylsulfonio] phensulfide bishexafluoroantimonate, diphenyliodonium salt, bis (4-tert-butylphenyl) iodonium salt, (4-tert-butoxyphenyl) phenyliodonium salt, Onium salt photoacid generators such as iodonium salts such as (4-methoxyphenyl) pheny
  • Examples of the partially hydrolyzed condensate of tetraalkoxysilane include those obtained by adding water to tetraalkoxysilane and condensing it by partial hydrolysis using a conventional method.
  • a commercially available product can be used as the partially hydrolyzed condensate of the organosilicate compound.
  • Examples of such condensates include methyl silicate 51 and ethyl silicate 40 (both manufactured by Colcoat Co., Ltd.).
  • the amount used is 0.1 to 20 parts by weight, preferably 100 to 20 parts by weight, preferably 100 parts by weight of the total of the reactive silicon group-containing polymer (A) and the reactive silicon group-containing polymer (B). 0.5 to 10 parts by weight.
  • alkyl alkoxysilanes such as phenoxytrimethylsilane, methyltrimethoxysilane, dimethyldimethoxysilane, trimethylmethoxysilane, n-propyltrimethoxysilane; diphenyldimethoxysilane, phenyltrimethoxysilane Arylalkoxysilanes such as; dimethyldiisopropenoxysilane, methyltriisopropenoxysilane, alkylisopropenoxysilane such as ⁇ -glycidoxypropylmethyldiisopropenoxysilane; tris (trimethylsilyl) borate, tris (triethyl) And trialkylsilyl borates such as
  • a tackifying resin can be added for the purpose of enhancing the adhesion and adhesion to the substrate, or as necessary.
  • the tackifying resin is not particularly limited, and those that are usually used can be used.
  • the amount of the oxygen curable substance used is in the range of 0.1 to 20 parts by weight with respect to 100 parts by weight in total of the reactive silicon group-containing polymer (A) and the reactive silicon group-containing polymer (B).
  • the amount is preferably 0.5 to 10 parts by weight. If the amount used is less than 0.1 parts by weight, the improvement of the contamination is not sufficient, and if it exceeds 20 parts by weight, the tensile properties of the cured product tend to be impaired.
  • an oxygen curable substance is preferably used in combination with a photocurable substance.
  • Epoxy resin can be used in combination with the composition of the present invention.
  • a composition to which an epoxy resin is added is particularly preferred as an adhesive, particularly as an adhesive for exterior wall tiles.
  • Epoxy resins include epichlorohydrin-bisphenol A type epoxy resin, epichlorohydrin-bisphenol F type epoxy resin, flame retardant type epoxy resin such as glycidyl ether of tetrabromobisphenol A, novolac type epoxy resin, hydrogenated bisphenol A type epoxy resin, bisphenol A Propylene oxide adduct glycidyl ether type epoxy resin, p-oxybenzoic acid glycidyl ether ester type epoxy resin, m-aminophenol type epoxy resin, diaminodiphenylmethane type epoxy resin, urethane modified epoxy resin, various alicyclic epoxy resins, N , N-diglycidylaniline, N, N-diglycidyl-o-toluidine, triglycidyl isocyanurate
  • ketimines may be used alone or in combination of two or more, and are used in an amount of 1 to 100 parts by weight with respect to 100 parts by weight of the epoxy resin.
  • the amount used is the kind of epoxy resin and ketimine It depends on.
  • the curable composition of the present invention can also be prepared as a one-component type in which all the blended components are pre-blended and sealed and cured by moisture in the air after construction. It is also possible to prepare a two-component type in which components such as a plasticizer and water are blended and the compounding material and the organic polymer composition are mixed before use. From the viewpoint of workability, a one-component type is preferable.
  • the curable composition of the present invention includes an adhesive for interior panels, an adhesive for exterior panels, an adhesive for tiles, an adhesive for stonework, an adhesive for ceiling finishing, an adhesive for floor finishing, and an adhesive for wall finishing.
  • a primer (Yokohama Rubber Co., Ltd., No. 40) is applied twice to an aluminum base, left to stand for 30 minutes to 1 hour, and then an aluminum base according to the method for preparing a tensile adhesion test specimen specified in JIS A 1439.
  • a curable composition obtained by mixing and removing the liquid A and liquid B was filled into a material in which the materials were assembled in an H shape.
  • the curing conditions were 23 ° C., relative humidity 50% ⁇ 4 days + 60 ° C. ⁇ 3 days.
  • This H-type sample was tested at a tensile rate of 50 mm / min in a constant temperature room at 23 ° C. and a relative humidity of 50% in accordance with the tensile adhesion test method of JIS A 1439, and the elongation at break was evaluated. The results are shown in Table 1.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Toxicology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyethers (AREA)

Abstract

La présente invention porte sur une composition durcissable présentant une meilleure stabilité de résistance à la chaleur après durcissement et un produit durci obtenu à partir de ladite composition durcissable. La présente invention parvient à ce but avec une composition durcissable contenant un polymère contenant des groupes silicium réactifs (A) possédant, en moyenne, plus de 1,0 groupe silicium réactif représenté par la formule générale (1), -Si(R1)3-a(X)a(1), à l'une de ses extrémités uniquement. La quantité de composé possédant un groupe fluoroalkylène est de 10 parties en masse ou moins par rapport à 100 parties en masse du polymère contenant des groupes silicium réactifs (A).
PCT/JP2015/050251 2014-01-09 2015-01-07 Composition durcissable WO2015105122A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014002500A JP2017039782A (ja) 2014-01-09 2014-01-09 硬化性組成物
JP2014-002500 2014-01-09

Publications (1)

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WO2015105122A1 true WO2015105122A1 (fr) 2015-07-16

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019044179A (ja) * 2017-09-05 2019-03-22 Ａｇｃ株式会社 化合物、組成物、表面処理剤、物品および化合物の製造方法
JP2019156885A (ja) * 2018-03-07 2019-09-19 Ａｇｃ株式会社 硬化性組成物、及び硬化物
JP2019156884A (ja) * 2018-03-07 2019-09-19 Ａｇｃ株式会社 オキシアルキレン重合体、オキシアルキレン重合体を含む硬化性組成物、シーリング材用のオキシアルキレン重合体を含む硬化性組成物、及び硬化物
JP2019182885A (ja) * 2018-03-30 2019-10-24 株式会社カネカ 硬化性組成物
CN111601854A (zh) * 2018-01-25 2020-08-28 思美定株式会社 形成方法、以及具有耐火性的一液常温湿气固化型反应性热熔组合物
WO2022163562A1 (fr) * 2021-01-29 2022-08-04 株式会社カネカ Mélange de polymères de polyoxyalkylène et composition durcissable
WO2022163563A1 (fr) * 2021-01-29 2022-08-04 株式会社カネカ Polymère à base de polyoxyalkylène et mélange de celui-ci
EP3889206A4 (fr) * 2018-11-27 2022-08-24 Kaneka Corporation Polymère de polyoxyalkylène et composition durcissable

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6652213B2 (ja) * 2018-05-07 2020-02-19 Ａｇｃ株式会社 硬化性組成物及び硬化物
CN115335455A (zh) * 2020-03-31 2022-11-11 株式会社钟化 聚氧化烯系聚合物的混合物及固化性组合物
JPWO2022191084A1 (fr) 2021-03-12 2022-09-15
WO2023127443A1 (fr) * 2021-12-27 2023-07-06 株式会社カネカ Composition durcissable et produit durci de celle-ci

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08134203A (ja) * 1994-11-16 1996-05-28 Asahi Glass Co Ltd ポリアルキレンオキシド誘導体の製造法および組成物
JP2010150381A (ja) * 2008-12-25 2010-07-08 Asahi Glass Co Ltd 硬化性組成物
WO2012020560A1 (fr) * 2010-08-10 2012-02-16 株式会社カネカ Composition polymérisable
WO2012057092A1 (fr) * 2010-10-27 2012-05-03 株式会社カネカ Composition durcissable
WO2013180203A1 (fr) * 2012-05-31 2013-12-05 株式会社カネカ Polymère présentant une structure terminale comprenant une pluralité de groupes réactifs de silicium, son procédé de fabrication et son utilisation

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08134203A (ja) * 1994-11-16 1996-05-28 Asahi Glass Co Ltd ポリアルキレンオキシド誘導体の製造法および組成物
JP2010150381A (ja) * 2008-12-25 2010-07-08 Asahi Glass Co Ltd 硬化性組成物
WO2012020560A1 (fr) * 2010-08-10 2012-02-16 株式会社カネカ Composition polymérisable
WO2012057092A1 (fr) * 2010-10-27 2012-05-03 株式会社カネカ Composition durcissable
WO2013180203A1 (fr) * 2012-05-31 2013-12-05 株式会社カネカ Polymère présentant une structure terminale comprenant une pluralité de groupes réactifs de silicium, son procédé de fabrication et son utilisation

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019044179A (ja) * 2017-09-05 2019-03-22 Ａｇｃ株式会社 化合物、組成物、表面処理剤、物品および化合物の製造方法
CN111601854A (zh) * 2018-01-25 2020-08-28 思美定株式会社 形成方法、以及具有耐火性的一液常温湿气固化型反应性热熔组合物
CN111601854B (zh) * 2018-01-25 2022-12-20 思美定株式会社 形成方法、以及具有耐火性的一液常温湿气固化型反应性热熔组合物
JP2019156885A (ja) * 2018-03-07 2019-09-19 Ａｇｃ株式会社 硬化性組成物、及び硬化物
JP2019156884A (ja) * 2018-03-07 2019-09-19 Ａｇｃ株式会社 オキシアルキレン重合体、オキシアルキレン重合体を含む硬化性組成物、シーリング材用のオキシアルキレン重合体を含む硬化性組成物、及び硬化物
JP7127302B2 (ja) 2018-03-07 2022-08-30 Ａｇｃ株式会社 オキシアルキレン重合体を含む硬化性組成物、シーリング材用のオキシアルキレン重合体を含む硬化性組成物、及び硬化物
JP2019182885A (ja) * 2018-03-30 2019-10-24 株式会社カネカ 硬化性組成物
JP7073167B2 (ja) 2018-03-30 2022-05-23 株式会社カネカ 硬化性組成物
EP3889206A4 (fr) * 2018-11-27 2022-08-24 Kaneka Corporation Polymère de polyoxyalkylène et composition durcissable
JP7394783B2 (ja) 2018-11-27 2023-12-08 株式会社カネカ ポリオキシアルキレン系重合体を含む硬化性組成物
WO2022163562A1 (fr) * 2021-01-29 2022-08-04 株式会社カネカ Mélange de polymères de polyoxyalkylène et composition durcissable
WO2022163563A1 (fr) * 2021-01-29 2022-08-04 株式会社カネカ Polymère à base de polyoxyalkylène et mélange de celui-ci

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