WO2015100785A1 - 印制电路板及使用该印制电路板的显示装置 - Google Patents

印制电路板及使用该印制电路板的显示装置 Download PDF

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Publication number
WO2015100785A1
WO2015100785A1 PCT/CN2014/070436 CN2014070436W WO2015100785A1 WO 2015100785 A1 WO2015100785 A1 WO 2015100785A1 CN 2014070436 W CN2014070436 W CN 2014070436W WO 2015100785 A1 WO2015100785 A1 WO 2015100785A1
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WIPO (PCT)
Prior art keywords
printed circuit
circuit board
group
traces
spacing
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Ceased
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PCT/CN2014/070436
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English (en)
French (fr)
Inventor
符俭泳
郭东胜
秦杰辉
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US14/235,094 priority Critical patent/US20150189739A1/en
Publication of WO2015100785A1 publication Critical patent/WO2015100785A1/zh
Anticipated expiration legal-status Critical
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]

Definitions

  • the present invention relates to the field of printed circuit board manufacturing, and more particularly to a printed circuit board and a display device using the same.
  • the substrate 100 of the printed circuit board of the two-layer board structure includes : a first face 110 for the SMT electronic component (SMT region 111 ) and a second face 120 for attaching the conductive foil 121 , during the processing of the printed circuit board, due to the substrate 100 and the conductive foil 121
  • the adhesive is dip soldered or heated, volatile gases are generated, heat is not easily removed, and the conductive foil 121 is expanded and peeled off.
  • the PCB board is warped, resulting in failure to install SMT electronic components, or electronic components and printing. Poor solder joints in the circuit board; When soldering, some parts of the substrate are not in contact with the solder surface and solder is not soldered. Therefore, these problems need to be resolved.
  • the technical problem to be solved by the present invention is to provide a printed circuit board having a good heat dissipation property and a conductive foil which is not easily peeled off, and a display device using the printed circuit board.
  • a printed circuit board comprising: a substrate comprising a first side for packaging electronic components, and a second side;
  • the conductive foil includes a plurality of partitions, and a spacer area is disposed between the partitions, and the interval area between the partitions is provided with a trace for electrical connection.
  • the printed circuit board has a rectangular structure, and the spacing area is disposed perpendicular to a long side of the printed circuit board.
  • the conductive foil on the printed circuit board has a large proportion of expansion in the long direction, and the spacing area is perpendicular to the long side, and the copper foil divided into a plurality of areas can avoid a large proportion of expansion.
  • the expansion causes the detachment, provides an expansion buffer space, and at the same time achieves more uniform heat dissipation, and heat can be dissipated from the space without being accumulated for a long time inside.
  • the traces of the spaced regions are laid in the spaced regions at the same pitch. This facilitates the electrical connection between the lines when making the line layout.
  • the routing of the spacing area is divided into a first group of routing lines and a second group of routing lines, and the first group of routing lines and the second group of routing lines are respectively laid at the same spacing, the first group
  • the traces and the second set of traces are interdigitated to form a mesh structure.
  • the two sets of traces are interlaced to form a mesh structure, which has better shielding performance and can better avoid EMI interference problems.
  • the pitch is 0.13 to 0.5 mm. At this spacing, EMI interference problems can be better avoided, and circuit design and the problem of avoiding warpage of copper foil are more convenient.
  • the width of the trace is 0.13 ⁇ 0.5mm. At this width, it is possible to avoid a large proportion of expansion of the conductive foil while effectively avoiding EMI problems.
  • a liquid crystal display device comprising one or more printed circuit boards, the printed circuit board comprising: a substrate comprising a first side for packaging electronic components, and a second side;
  • the conductive foil includes a plurality of partitions, and a spacer area is disposed between the partitions, and the interval area between the partitions is provided with a trace for electrical connection.
  • the printed circuit board has a rectangular structure, and the spacing area is disposed perpendicular to a long side of the printed circuit board.
  • the routing of the spacing area is divided into a first group of routing lines and a second group of routing lines, and the first group of routing lines and the second group of routing lines are respectively laid at the same spacing, the first group
  • the traces and the second set of traces are interdigitated to form a mesh structure.
  • the pitch is 0.13 ⁇ 0.5mm
  • the width of the trace is 0.13 ⁇ 0.5mm
  • the conductive foil of the printed circuit board is divided into a plurality of blocks, a space is disposed between the plurality of blocks, and the plurality of blocks are electrically connected by a wire, and the space is provided for the thermal expansion of the conductive foil. Buffer space, while making the internal heat between the conductive foil and the substrate faster and more evenly dispersed Going out, effectively preventing the copper foil on the printed circuit board from being exposed to heat and warping the substrate, improves the yield of the product, and also improves the life of the product.
  • 1 is a first side structure of a conventional printed circuit board
  • FIG. 3 is a view showing the structure of a printed circuit board according to Embodiment 1 of the present invention.
  • Fig. 4 is a view showing an improved structure of a printed circuit board according to a first embodiment of the present invention.
  • FIG. 3 is a schematic diagram of a printed circuit board according to the present invention.
  • the printed circuit board includes: a substrate 100 and a conductive foil 121 attached to the substrate 100.
  • the conductive foil 121 may be conductive copper.
  • the foil may also be a conductive material such as a conductive silver foil or a gold foil;
  • the substrate 100 includes a first surface 110 (refer to FIG. 1 ) for SMT package electronic components and a conductive foil 121 for attaching
  • the conductive foil 121 includes a plurality of partitions, and the partitions 122 are disposed between the partitions.
  • the spacers 122 between the partitions are provided with traces 123 for electrical connection. .
  • the spacer region 122 provides a buffer space for the thermal expansion of the conductive foil 121, and allows the internal heat between the conductive foil 121 and the substrate 100 to be dissipated more quickly and uniformly, effectively preventing conductive foil on the printed circuit board.
  • the problem of heat loss and warpage of the substrate improves the yield of the product and also increases the life of the product.
  • the structure of the printed circuit board is mostly a rectangular structure, and of course, there are other printed circuit boards of the structure.
  • This embodiment is described with a rectangular printed circuit board.
  • the spacing area 122 is disposed perpendicular to the long side of the printed circuit board. This is because a single piece of conductive foil without a spacer region has a large proportion of expansion in the long direction.
  • the spacer region 122 is disposed perpendicular to the long side, which provides a buffer space for the expansion of the conductive foil.
  • the entire piece of conductive foil 121 is divided into a plurality of regions to avoid a large proportion of expansion and cause shedding. At the same time, a more uniform heat dissipation can be achieved, and heat can be dissipated from the space without being accumulated for a long time inside.
  • the traces 123 of the spacer region are laid in the spacer region at the same interval as a further improvement of the embodiment.
  • the spacer region 122 is removed.
  • the line 123 is divided into a first group of traces 123a and a second group of traces 123b.
  • the first set of traces 123a and the second set of traces 123b are respectively laid at the same pitch, and the first set of traces 123a and The second set of traces 123b are interdigitated to form a mesh structure.
  • the two sets of traces are interleaved to form a mesh structure to ensure that the printed circuit board can better avoid EMI interference problems.
  • the spacing between the traces is 0.13 ⁇ 0.5mm. Under this spacing, the EMI interference problem can be better avoided, and the circuit design and the problem of avoiding warpage of the copper foil are more convenient.
  • the width of the trace is 0.13 ⁇ 0.5mm. At this width, it is possible to avoid a large proportion of expansion of the conductive foil while effectively avoiding EMI problems.
  • the cost control is required to be high, and the printed circuit board described in this embodiment can be used in the field of display devices.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一种印制电路板及使用该印制电路板的显示装置，包括：基板（100）以及贴附在基板（100）上的导电箔片（121）；所述基板（100）包括用于封装电子元件的第一面以及一用于贴附导电箔片（121）的第二面（120）；所述导电箔片（121）包括多个分块，所述分块之间设置有间隔区域（122），所述分块之间的所述间隔区域（122）设置有走线（123）进行电性连接。

Description

印制电路板及使用该印制电路板的显示装置
【技术领域】
本发明涉及印制电路板制造领域， 更具体的说， 涉及一种印制电路板及使 用该印制电路板的显示装置。
【背景技术】
随着市面上产品竟争越来越激烈， 为了降低成本， 很多厂商将印制电路板 压缩到二层板， 如图 1-2所示， 二层板结构的印制电路板的基板 100包括： 用于 SMT电子元件（SMT区域 111 ) 的第一面 110以及用于贴附导电箔片 121的第 二面 120, 在印制电路板的加工过程中， 由于基板 100与导电箔片 121的黏合剂 在浸焊或受热时， 产生挥发性气体、 热量不易排除， 导致导电箔片 121 膨胀、 脱落现象， 严重者则导致 PCB板子翘曲， 致使 SMT电子元件安装无法进行、 或电子元件与印制电路板焊点接触不良； 波峰焊时基板有些部位焊盘接触不到 焊锡面而焊不上锡等。 因此， 这些问题亟待解决。
【发明内容】
本发明所要解决的技术问题是提供一种散热性好， 导电箔片不易脱落的印 制电路板及使用该印制电路板的显示装置。
本发明的目的是通过以下技术方案来实现的： 一种印制电路板， 包括： 基板， 其包括用于封装电子元件的第一面， 以及一第二面；
导电箔片， 其贴附在所述基板的第二面上；
所述导电箔片包括多个分块， 所述分块之间设置有间隔区域， 所述分块之 间的所述间隔区域设置有走线进行电性连接。
优选的， 所述印制电路板为矩形结构， 所述间隔区域的设置与所述印制电 路板的长边垂直。 印制电路板上的导电箔片在长方向上发生膨胀的比例较大， 而间隔区域与长边垂直设置， 分成了多块区域的铜箔则可以避免较大比例的膨 胀而导致脱落， 提供了膨胀緩沖空间， 同时可以实现更为均匀的散热， 热量可 以从间隔区域散发而不会在内部长时间集聚。
优选的， 所述间隔区域的走线按相同的间距铺设在所述间隔区域内。 这样 有利于在进行线路布局时确保线路间的电性连接。
优选的， 所述间隔区域的走线分为第一组走线以及第二组走线， 所述第一 组走线与第二组走线分别各自按相同的间距铺设， 所述第一组走线与所述第二 组走线相互交错形成网状结构。 两组走线交错形成网状结构， 屏蔽性能更好， 可以更好的避免 EMI干扰问题。
优选的， 所述间距为 0.13~0.5mm。 在这个间距下， 可以更好的避免 EMI干 扰问题， 同时更方便于线路设计以及达到避免铜箔翘曲的问题。
优选的， 所述走线的宽度为 0.13~0.5mm。 在这个宽度下， 可以 4艮好的避免 导电箔片发生较大比例的膨胀， 同时有效避免 EMI问题。
一种液晶显示装置， 包括一个或多个印制电路板， 所述印制电路板， 包括： 基板， 其包括用于封装电子元件的第一面， 以及一第二面；
导电箔片， 其贴附在所述基板的第二面上；
所述导电箔片包括多个分块， 所述分块之间设置有间隔区域， 所述分块之 间的所述间隔区域设置有走线进行电性连接。
优选的， 所述印制电路板为矩形结构， 所述间隔区域的设置与所述印制电 路板的长边垂直。
优选的， 所述间隔区域的走线分为第一组走线以及第二组走线， 所述第一 组走线与第二组走线分别各自按相同的间距铺设， 所述第一组走线与所述第二 组走线相互交错形成网状结构。
优选的， 所述间距为 0.13~0.5mm, 所述走线的宽度为 0.13~0.5mm。
本发明由于将印制电路板的导电箔片分割成多块， 多块之间设置间隔区域， 并且， 多块之间通过走线进行电性连接， 间隔区域为导电箔片的受热膨胀提供 了緩沖空间， 同时使得导电箔片与基板之间的内部热量可以更快、 更均匀的散 出去， 有效的防止印制电路板上铜箔受热脱落、 基板翘曲的问题， 提高了产品 的良率， 同时也提高了产品的寿命。
【附图说明】
图 1是现有的印制电路板的第一面结构，
图 2是现有的印制电路板的第二面结构，
图 3是本发明实施例一的印制电路板的结构，
图 4是本发明实施例一的印制电路板的改进结构。
【具体实施方式】
下面结合附图和较佳的实施例对本发明作进一步说明。
如图 3所示为本发明给出的一种印制电路板实施例， 该印制电路板包括： 基 板 100以及贴附在基板 100上的导电箔片 121 , 导电箔片 121可以是导电铜箔、 也可以是导电银箔、 金箔等导电性能较好的材料； 所述基板 100包括用于 SMT 封装电子元件的第一面 110 (参考图 1 ) 以及一用于贴附导电箔片 121的第二面 120; 所述导电箔片 121 包括多个分块， 所述分块之间设置有间隔区域 122, 所 述分块之间的所述间隔区域 122设置有走线 123进行电性连接。 间隔区域 122 为导电箔片 121的受热膨胀提供了緩沖空间，同时使得导电箔片 121与基板 100 之间的内部热量可以更快、 更均匀的散出去， 有效的防止印制电路板上导电箔 片受热脱落、 基板翘曲的问题， 提高了产品的良率， 同时也提高了产品的寿命。
一般来说， 印制电路板的结构多为矩形结构， 当然也有其他结构的印制电路 板。 本实施例以矩形结构的印制电路板进行说明， 如图 3 所示， 对于矩形结构 的印制电路板而言， 所述间隔区域 122 的设置与所述印制电路板的长边垂直， 这是因为没有间隔区域的一整块导电箔片在长方向上发生膨胀的比例较大， 而 本实施例中间隔区域 122与长边垂直设置， 为导电箔片的膨胀提供了緩沖空间， 将整块导电箔片 121 分成了多块区域则可以避免较大比例的膨胀而导致脱落， 同时可以实现更为均匀的散热， 热量可以从间隔区域散发而不会在内部长时间 集聚。
在本实施例中， 所述间隔区域的走线 123按相同的间距铺设在所述间隔区域 作为本实施例的进一步改进， 为避免 EMI干扰， 如图 4所示， 所述间隔区域 122的走线 123分为第一组走线 123a以及第二组走线 123b,所述第一组走线 123a 与第二组走线 123b分别各自按相同的间距铺设， 所述第一组走线 123a与所述 第二组走线 123b相互交错形成网状结构。 两组走线交错形成网状结构， 确保印 制电路板可以更好的避免 EMI干扰问题。
在本实施例中， 走线之间的间距为 0.13~0.5mm, 在这个间距下， 可以更好的 避免 EMI干扰问题， 同时更方便于线路设计以及达到避免铜箔翘曲的问题。 所 述走线的宽度为 0.13~0.5mm。 在这个宽度下， 可以 4艮好的避免导电箔片发生较 大比例的膨胀， 同时有效避免 EMI问题。
作为上述实施例的一种具体应用， 特别是显示装置领域， 对成本的控制要求 较高， 本实施例中所述的印制电路板可以用于显示装置领域。
以上内容是结合具体的优选实施方式对本发明所作的进一步详细说明， 不能 认定本发明的具体实施只局限于这些说明。 对于本发明所属技术领域的普通技 术人员来说， 在不脱离本发明构思的前提下， 还可以做出若干筒单推演或替换， 都应当视为属于本发明的保护范围。

Claims

权利要求
1、 一种印制电路板， 包括：
基板， 其包括用于封装电子元件的第一面， 以及与第一面相反的第二面； 导电箔片， 其贴附在所述基板的第二面上；
所述导电箔片包括多个分块， 所述分块之间设置有间隔区域， 所述分块之 间的所述间隔区域设置有走线进行电性连接。
2、 如权利要求 1所述的印制电路板， 其中， 所述印制电路板为矩形结构， 所述间隔区域的设置与所述印制电路板的长边垂直。
3、 如权利要求 1所述的印制电路板， 其中， 所述间隔区域的走线按相同的 间距铺设在所述间隔区域内。
4、 如权利要求 1所述的印制电路板， 其中， 所述间隔区域的走线分为第一 组走线以及第二组走线， 所述第一组走线与第二组走线分别各自按相同的间距 铺设， 所述第一组走线与所述第二组走线相互交错形成网状结构。
5、 如权利要求 3所述的印制电路板， 其中， 所述间距为 0.13~0.5mm。
6、如权利要求 3所述的印制电路板，其中，所述走线的宽度为 0.13~0.5mm。
7、 一种显示装置， 包括一个或多个印制电路板， 所述印制电路板， 包括： 基板， 其包括用于 SMT电子元件的第一面， 以及一第二面；
导电箔片， 其贴附在所述基板的第二面上；
所述导电箔片包括多个分块， 所述分块之间设置有间隔区域， 所述分块之 间的所述间隔区域设置有走线进行电性连接。
8、 如权利要求 7所述的显示装置， 其中， 所述印制电路板为矩形结构， 所 述间隔区域的设置与所述印制电路板的长边垂直。
9、 如权利要求 7所述的显示装置， 其中， 所述间隔区域的走线分为第一组 走线以及第二组走线， 所述第一组走线与第二组走线分别各自按相同的间距铺 设， 所述第一组走线与所述第二组走线相互交错形成网状结构。
10、 如权利要求 9所述的显示装置， 其中， 所述间距为 0.13~0.5mm, 所述 走线的宽度为 0.13~0.5mm。
PCT/CN2014/070436 2013-12-31 2014-01-10 印制电路板及使用该印制电路板的显示装置 Ceased WO2015100785A1 (zh)

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