WO2015091854A3 - Elektrisch leitende flüssigkeiten auf der basis von metall-diphosphonat-komplexen - Google Patents

Elektrisch leitende flüssigkeiten auf der basis von metall-diphosphonat-komplexen Download PDF

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Publication number
WO2015091854A3
WO2015091854A3 PCT/EP2014/078556 EP2014078556W WO2015091854A3 WO 2015091854 A3 WO2015091854 A3 WO 2015091854A3 EP 2014078556 W EP2014078556 W EP 2014078556W WO 2015091854 A3 WO2015091854 A3 WO 2015091854A3
Authority
WO
WIPO (PCT)
Prior art keywords
electrically conducting
metal
liquids based
conducting liquids
diphosphonate
Prior art date
Application number
PCT/EP2014/078556
Other languages
English (en)
French (fr)
Other versions
WO2015091854A2 (de
Inventor
Andreas Seidel
Fabian Distelrath
Thomas Booz
Original Assignee
Schlenk Metallfolien Gmbh & Co. Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schlenk Metallfolien Gmbh & Co. Kg filed Critical Schlenk Metallfolien Gmbh & Co. Kg
Priority to EP14821610.4A priority Critical patent/EP2989236B1/de
Priority to US15/105,816 priority patent/US20160319451A1/en
Publication of WO2015091854A2 publication Critical patent/WO2015091854A2/de
Publication of WO2015091854A3 publication Critical patent/WO2015091854A3/de

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0692—Regulating the thickness of the coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/54—Electroplating: Baths therefor from solutions of metals not provided for in groups C25D3/04 - C25D3/50
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0628—In vertical cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0664—Isolating rolls
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Chemically Coating (AREA)

Abstract

Die vorliegende Erfindung betrifft elektrisch leitende Flüssigkeiten auf der Basis von Diphosphonat-Komplexen sowie deren Verwendung bei Verfahren zur elektrolytischen Oberflächenmodifizierung eines flächigen Metallwerkstücks. Die Erfindung betrifft ferner die mit diesem Verfahren hergestellten flächigen Metallwerkstücke sowie die Verwendung der Metallwerkstücke als Substrat für die Bildung von festen Haftverbänden mit einer Vielzahl von Materialien und für die Aufnahme von flüssigen und festen Stoffen.
PCT/EP2014/078556 2013-12-19 2014-12-18 Elektrisch leitende flüssigkeiten auf der basis von metall-diphosphonat-komplexen WO2015091854A2 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP14821610.4A EP2989236B1 (de) 2013-12-19 2014-12-18 Elektrisch leitende flüssigkeiten auf der basis von metall-diphosphonat-komplexen
US15/105,816 US20160319451A1 (en) 2013-12-19 2014-12-18 Electrically conductive liquids based on metal-diphosphonate complexes

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102013021502.1A DE102013021502A1 (de) 2013-12-19 2013-12-19 Elektrisch leitende Flüssigkeiten auf der Basis von Metall-Diphosphonat-Komplexen
DE102013021502.1 2013-12-19

Publications (2)

Publication Number Publication Date
WO2015091854A2 WO2015091854A2 (de) 2015-06-25
WO2015091854A3 true WO2015091854A3 (de) 2015-09-11

Family

ID=52278621

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2014/078556 WO2015091854A2 (de) 2013-12-19 2014-12-18 Elektrisch leitende flüssigkeiten auf der basis von metall-diphosphonat-komplexen

Country Status (4)

Country Link
US (1) US20160319451A1 (de)
EP (1) EP2989236B1 (de)
DE (1) DE102013021502A1 (de)
WO (1) WO2015091854A2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017107007A1 (de) * 2017-03-31 2018-10-04 Mkm Mansfelder Kupfer Und Messing Gmbh Verfahren zum Herstellen eines Kupferprofils aus einem Kupferausgangsmaterial sowie Kupferprofil und Vorrichtung
CN113054257A (zh) * 2021-03-16 2021-06-29 广州天赐高新材料股份有限公司 磷酸酯类电解液添加剂、电解液及锂离子电池

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3970537A (en) * 1973-07-11 1976-07-20 Inland Steel Company Electrolytic treating apparatus
US4253920A (en) * 1980-03-20 1981-03-03 American Chemical & Refining Company, Incorporated Composition and method for gold plating
GB2097024A (en) * 1981-04-16 1982-10-27 Hooker Chemicals Plastics Corp Treating metal surfaces to improve corrosion resistance
GB2133040A (en) * 1983-01-03 1984-07-18 Omi Int Corp Copper plating bath process and anode therefore
DE19951325A1 (de) * 1999-10-20 2001-05-10 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitenden Strukturen auf Oberflächen von elektrisch isolierendem Folienmaterial sowie Anwendungen des Verfahrens
WO2004027120A1 (de) * 2002-09-17 2004-04-01 Omg Galvanotechnik Gmbh Dunkle schichten
JP2006265632A (ja) * 2005-03-24 2006-10-05 Ishihara Chem Co Ltd 電気銅メッキ浴、並びに銅メッキ方法
JP2006265572A (ja) * 2005-03-22 2006-10-05 Ishihara Chem Co Ltd 非シアン系のスズ−銀合金メッキ浴
EP1961840A1 (de) * 2007-02-14 2008-08-27 Umicore Galvanotechnik GmbH Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2602816A (en) 1947-06-18 1952-07-08 Goodrich Co B F Method for preparing sulfur-containing carboxylic acids
BE791401A (fr) * 1971-11-15 1973-05-14 Monsanto Co Compositions et procedes electrochimiques
CA1144304A (en) * 1978-10-23 1983-04-12 Glenn O. Mallory, Jr. Electroless deposition of copper
DE19951324C2 (de) 1999-10-20 2003-07-17 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch leitfähigen Oberflächen von gegeneinander vereinzelten Platten- und Folienmaterialstücken sowie Anwendung des Verfahrens
DE10046600C2 (de) * 2000-09-20 2003-02-20 Schloetter Fa Dr Ing Max Elektrolyt und Verfahren zur Abscheidung von Zinn-Kupfer-Legierungsschichten und Verwendung des Elektrolyten
RU2276205C1 (ru) * 2004-09-13 2006-05-10 Федеральное государственное унитарное предприятие "Калужский научно-исследовательский институт телемеханических устройств" Способ приготовления электролитов и растворов для получения покрытий металлами и сплавами
JP5368442B2 (ja) * 2008-06-26 2013-12-18 日本高純度化学株式会社 還元型無電解スズめっき液及びそれを用いたスズ皮膜
CN101660183B (zh) * 2008-08-27 2012-03-28 比亚迪股份有限公司 一种镁合金电镀方法
EP2588644B1 (de) * 2010-06-30 2014-06-18 Schauenburg Ruhrkunststoff GmbH Tribologisch belastbare edelmetall/metallschichten

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3970537A (en) * 1973-07-11 1976-07-20 Inland Steel Company Electrolytic treating apparatus
US4253920A (en) * 1980-03-20 1981-03-03 American Chemical & Refining Company, Incorporated Composition and method for gold plating
GB2097024A (en) * 1981-04-16 1982-10-27 Hooker Chemicals Plastics Corp Treating metal surfaces to improve corrosion resistance
GB2133040A (en) * 1983-01-03 1984-07-18 Omi Int Corp Copper plating bath process and anode therefore
DE19951325A1 (de) * 1999-10-20 2001-05-10 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitenden Strukturen auf Oberflächen von elektrisch isolierendem Folienmaterial sowie Anwendungen des Verfahrens
WO2004027120A1 (de) * 2002-09-17 2004-04-01 Omg Galvanotechnik Gmbh Dunkle schichten
JP2006265572A (ja) * 2005-03-22 2006-10-05 Ishihara Chem Co Ltd 非シアン系のスズ−銀合金メッキ浴
JP2006265632A (ja) * 2005-03-24 2006-10-05 Ishihara Chem Co Ltd 電気銅メッキ浴、並びに銅メッキ方法
EP1961840A1 (de) * 2007-02-14 2008-08-27 Umicore Galvanotechnik GmbH Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Week 200676, 5 October 2006 Derwent World Patents Index; AN 2006-735271, XP002738305 *
DATABASE WPI Week 200676, 5 October 2006 Derwent World Patents Index; AN 2006-735310, XP002738306 *

Also Published As

Publication number Publication date
DE102013021502A1 (de) 2015-06-25
WO2015091854A2 (de) 2015-06-25
EP2989236A2 (de) 2016-03-02
US20160319451A1 (en) 2016-11-03
EP2989236B1 (de) 2018-06-27

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