WO2015087416A1 - Récipient recevant des substrats - Google Patents

Récipient recevant des substrats Download PDF

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Publication number
WO2015087416A1
WO2015087416A1 PCT/JP2013/083210 JP2013083210W WO2015087416A1 WO 2015087416 A1 WO2015087416 A1 WO 2015087416A1 JP 2013083210 W JP2013083210 W JP 2013083210W WO 2015087416 A1 WO2015087416 A1 WO 2015087416A1
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WO
WIPO (PCT)
Prior art keywords
container
resin material
substrate storage
substrate
container body
Prior art date
Application number
PCT/JP2013/083210
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English (en)
Japanese (ja)
Inventor
井上　修一
Original Assignee
ミライアル株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ミライアル株式会社 filed Critical ミライアル株式会社
Priority to PCT/JP2013/083210 priority Critical patent/WO2015087416A1/fr
Publication of WO2015087416A1 publication Critical patent/WO2015087416A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like

Definitions

  • the present invention relates to a substrate storage container used as an in-process container for storing a substrate made of a semiconductor wafer and transporting it in a process in a factory.
  • a substrate storage container for storing a substrate made of a semiconductor wafer and transporting it in a process in a factory, a structure including a container main body and a lid is known.
  • the container body has a cylindrical wall part in which an opening part of the container body is formed at one end and the other end is closed.
  • a substrate storage space is formed in the container body.
  • the substrate storage space is formed by being surrounded by a wall portion, and can store a plurality of substrates.
  • the lid can be attached to and detached from the container body opening, and the container body opening can be closed.
  • the substrate support plate-like portions are provided on the wall portion so as to form a pair in the substrate storage space.
  • the substrate support plate-like portion can support the edges of a plurality of substrates in a state where adjacent substrates are spaced apart and arranged in parallel when the container body opening is not closed by the lid. is there.
  • a front retainer is provided in a portion of the lid that faces the substrate storage space when the container main body opening is closed.
  • the front retainer can support the edges of the plurality of substrates when the container main body opening is closed by the lid.
  • the back substrate support portion is provided on the wall portion so as to be paired with the front retainer.
  • the back side substrate support part can support the edges of a plurality of substrates.
  • the container body is made of a resin material.
  • a conductive filler such as carbon fiber is added to the resin material.
  • the greater the amount of conductive filler added the smaller the surface resistance value of the resin material constituting the container body.
  • the surface resistance value of the resin material which comprises a container main body becomes large, so that the addition amount of a conductive filler is decreased. Since this is a property common to conductive fillers, there is no need to use a plurality of types of conductive fillers, and only one type is selected from various conductive fillers, and a predetermined amount is added to the resin material. Is done. Thereby, the surface resistance value of the resin material which comprises a container main body is made into a predetermined value.
  • An object of the present invention is to provide a substrate storage container in which the surface resistance value of the resin material constituting the container body is easily adjusted to a predetermined value.
  • the present invention is a substrate storage container used as an in-process container for storing a substrate made of a semiconductor wafer and transported in a process in a factory, and a substrate storage space capable of storing a plurality of substrates is formed therein,
  • a container main body having a container main body opening formed at one end thereof and communicating with the substrate storage space; and a lid detachably attached to the container main body opening and capable of closing the container main body opening.
  • the container main body relates to a substrate storage container made of a resin material to which carbon fibers and carbon nanotubes are added.
  • addition amount of the carbon fiber added to the resin material is C1
  • addition amount of the carbon nanotube added to the resin material is C2
  • the resin material preferably has a water absorption of 0.02% or less.
  • the resin material is preferably composed of at least one of cycloolefin polymer, cycloolefin copolymer, polyphenyl sulfide, liquid crystal polymer, and polyether ether ketone.
  • the present invention it is possible to provide a substrate storage container in which the surface resistance value of the resin material constituting the container body is easily adjusted to a predetermined value.
  • FIG. 1 is an exploded perspective view showing a substrate storage container 1 according to an embodiment of the present invention.
  • a direction from the container body 2 described later to the lid 3 is defined as the front direction D11, and the opposite direction is defined as the rear direction D12. These are defined as the front-rear direction D1.
  • a direction (upward direction in FIG. 1) from the lower wall 24 to the upper wall 23, which will be described later, is defined as an upward direction D21
  • the opposite direction is defined as a downward direction D22, and these are defined as a vertical direction D2.
  • a direction from the second side wall 26 to be described later to the first side wall 25 is defined as the left direction D31, and the opposite direction is defined as the right direction D32. Is defined as the left-right direction D3. In each drawing, description will be given with arrows indicating these directions.
  • the substrate W stored in the substrate storage container 1 is a disk-shaped silicon wafer, glass wafer, sapphire wafer or the like, and is a thin one used in the industry.
  • the substrate W in the present embodiment is a silicon wafer having a diameter of 300 mm.
  • the substrate storage container 1 is a substrate storage container used as an in-process container for storing a substrate and transporting it in a process in a factory.
  • the substrate storage container 1 includes a container main body 2, a lid 3, a front retainer (not shown) as a lid-side substrate support, and a back-side substrate support (not shown).
  • the container main body 2 has a cylindrical wall portion 20 in which a container main body opening 21 is formed at one end and the other end is closed.
  • a substrate storage space 27 is formed in the container body 2.
  • the substrate storage space 27 is formed so as to be surrounded by the wall portion 20.
  • a substrate support plate-shaped portion 201 is disposed in a portion of the wall portion 20 that forms the substrate storage space 27.
  • a plurality of substrates W can be stored in the substrate storage space 27.
  • the wall portion 20 is provided with a substrate support plate portion 201 so as to form a pair in the substrate storage space 27.
  • the substrate support plate-like portion 201 is arranged in such a manner that adjacent substrates W are separated from each other at a predetermined interval and are arranged in parallel.
  • the part can be supported.
  • a back side substrate support part (not shown) is provided on the back side of the substrate support plate-like part 201.
  • the back substrate support (not shown) can support the rear portions of the edges of the plurality of substrates W when the container body opening 21 is closed by the lid 3.
  • the lid 3 is detachable with respect to the opening peripheral edge 28 forming the container main body opening 21.
  • the lid 3 can close the container main body opening 21 in a positional relationship surrounded by the opening peripheral edge 28, that is, in a state of being fitted into the container main body opening 21 formed by the opening peripheral edge 28.
  • the front retainer (not shown) is a part of the lid 3 and is located on the side facing the substrate storage space 27 when the container body opening 21 is closed by the lid 3, that is, on the inside of the lid 3. Is provided.
  • the front retainer (not shown) is disposed inside the substrate storage space 27 so as to be paired with the back side substrate support portion (not shown).
  • the front retainer (not shown) can support the front portions of the edges of the plurality of substrates W when the container body opening 21 is closed by the lid 3.
  • the front retainer (not shown) supports the plurality of substrates W in cooperation with the back side substrate support portion (not shown) when the container body opening 21 is closed by the lid 3.
  • a plurality of substrates W are held in a state in which adjacent substrates W are separated from each other at a predetermined interval and arranged in parallel.
  • the container body 2 will be described in detail.
  • the wall portion 20 of the container body 2 includes a back wall 22, an upper wall 23, a lower wall 24, a first side wall 25, and a second side wall 26.
  • the first side wall 25 and the second side wall 26 face each other, and the upper wall 23 and the lower wall 24 face each other.
  • the rear end of the upper wall 23, the rear end of the lower wall 24, the rear end of the first side wall 25, and the rear end of the second side wall 26 are all connected to the back wall 22.
  • the front end of the upper wall 23, the front end of the lower wall 24, the front end of the first side wall 25, and the front end of the second side wall 26 have a positional relationship facing the back wall 22 and have a substantially rectangular shape. Opening peripheral edge portion 28 is formed.
  • the opening peripheral edge 28 is provided at one end of the container main body 2, and the back wall 22 is located at the other end of the container main body 2.
  • the outer shape of the container body 2 formed by the outer surface of the wall portion 20 is box-shaped.
  • the inner surface of the wall portion 20, that is, the inner surface of the back wall 22, the inner surface of the upper wall 23, the inner surface of the lower wall 24, the inner surface of the first side wall 25, and the inner surface of the second side wall 26 are surrounded by these. 27 is formed.
  • the container main body opening 21 formed in the opening peripheral edge portion 28 is surrounded by the wall portion 20 and communicates with the substrate storage space 27 formed in the container main body 2. A maximum of 21 substrates W can be stored in the substrate storage space 27.
  • the wall portion 20 constituted by the back wall 22, the upper wall 23, the lower wall 24, the first side wall 25, and the second side wall 26 is made of a resin material to which carbon fibers and carbon nanotubes are added.
  • the resin material is composed of at least one of cycloolefin polymer, cycloolefin copolymer, polyphenyl sulfide, liquid crystal polymer, and polyether ether ketone. These materials have very low water absorption, and the water absorption is 0.02% or less.
  • C1 is: 3wt% ⁇ C1 ⁇ 20wt%
  • C2 is 0.5wt% ⁇ C2 ⁇ 5wt% Satisfy the condition of Under this condition, when the surface resistance value of the container body 2 made of a resin material to which carbon fibers and carbon nanotubes are added is R, R is 10 5 ⁇ ⁇ R ⁇ 10 11 ⁇ Satisfy the condition of
  • the reason why the value of C1 is set to 3 wt% or more and 20 wt% or less is that, if out of this range, the surface resistance value R of the container body 2 is set when the addition amount C2 of the carbon nanotube is within the above value range. It is because it cannot be made the range of the said value.
  • the reason why the value of C2 is 0.5 wt% or more is that if it is less than this addition amount, a network of carbon nanotubes is not formed, and it is not possible to achieve a surface resistance value R of 10 11 ⁇ or less.
  • the reason why the value of C2 is set to 5 wt% or less is that the network density of the carbon nanotubes becomes too high, and the surface resistance value R becomes 10 5 ⁇ or less due to the conductivity of the carbon nanotubes themselves.
  • the reason why the value of R is set to 10 5 ⁇ or more is to suppress the amount of current flowing through the container body 2 during discharge and prevent damage to the substrate W.
  • the value of R is set to 10 11 ⁇ or less. This is to suppress the generation of static electricity and suppress the adhesion of particles to the container body 2 and the damage of the substrate W due to the discharge of static electricity.
  • Example 2 The container body 2 is manufactured by setting the C1 value to 7 wt%, the C2 value to 4 wt%, and manufacturing the container body 2 as Example 1, the C1 value to 12 wt%, and the C2 value to 0.5 wt%. This was designated as Example 2, and the value of C1 was 7 wt%, and the value of C2 was 1 wt% to produce the container body 2 as Example 3.
  • a container body manufactured with a C1 value of 1 wt%, a C2 value of 1 wt%, and a container body manufactured as Comparative Example 1 a C1 value of 1 wt%, and a C2 value of 4 wt% was manufactured.
  • Comparative Example 2 a container body manufactured with a C1 value of 22 wt%, a C2 value of 1 wt%, and a container body manufactured as Comparative Example 3
  • a C1 value of 22 wt%, and a C2 value of 4 wt% was manufactured.
  • Example 1 As the resin materials constituting Example 1, Example 2, Example 3, Comparative Example 1, Comparative Example 2, Comparative Example 3, and Comparative Example 4, all used cycloolefin polymers.
  • the test results are as shown in Table 1.
  • the surface resistance value has a certain range because the surface resistance value varies depending on the measurement location of the substrate container 1.
  • Example 1 when the value of C1 is 3 wt% or more and 20 wt% or less as in Example 1, Example 2, or Example 3, the value of C2 changes within the range of 0.5 wt% or more and 5 wt% or less.
  • the surface resistance value of the container body 2 can be greatly changed by simply making it, and the surface resistance value of the container body 2 can be set to 10 5 ⁇ ⁇ R ⁇ 10 11 ⁇ .
  • the value of C1 is as small as 7 wt%, whereas in Example 2, the value of C1 is as large as 12 wt%. Nevertheless, the surface resistance value of Example 2 is higher.
  • Example 1 when a larger amount of conductive filler composed of carbon such as carbon fiber or carbon nanotube is added, the surface resistance value becomes smaller.
  • the amount of carbon nanotubes added to the resin material is 4 wt% in Example 1, and 0.5 wt% in Example 2.
  • the amount of carbon nanotubes added in Example 1 is larger, The total amount of carbon fibers and carbon nanotubes to be added is 11 wt% in Example 1, 12.5 wt% in Example 2, and Example 2 has a larger amount of additive. Nevertheless, it can be seen that the surface resistance value of Example 2 is higher than the surface resistance value of Example 1.
  • Example 1 and Example 3 the amount of carbon fiber added is the same, but the amount of carbon nanotube added is different.
  • the surface resistance value naturally decreases as the amount of carbon nanotube added increases.
  • the variation in surface resistance is smaller in Example 1 where the amount of carbon nanotubes added is larger than that in Example 3.
  • the carbon fiber is reduced in order to increase the surface resistance value of the container body.
  • the surface resistance value R of the container body can be easily increased, 10 5 ⁇ ⁇ R ⁇ 10 11 ⁇ It can be seen that it can be within the range.
  • the substrate storage container 1 is used as an in-process container that stores a substrate W made of a semiconductor wafer and transports it in a process in a factory.
  • the substrate storage container 1 includes a container main body 2 in which a substrate storage space 27 capable of storing a plurality of substrates W is formed inside, and a container main body opening 21 communicating with the substrate storage space 27 is formed at one end thereof.
  • the lid 3 is detachable from the opening 21 and can close the container main body opening 21.
  • the container body 2 is made of a resin material to which carbon fibers and carbon nanotubes are added.
  • the surface resistance value of the container body 2 can be easily adjusted to a desired value by adjusting the carbon fibers and carbon nanotubes added to the resin material.
  • the surface resistance value of the container body 2 may vary depending on the position of the container body 2 only by adding carbon fiber to the resin material. However, by adding both carbon fibers and carbon nanotubes to the resin material, the surface resistance value of the container body 2 can be lowered as a whole. Variations in position can be suppressed. Moreover, the strength of the container body 2 can be increased.
  • addition amount of the carbon fiber added to the resin material is C1
  • addition amount of the carbon nanotube added to the resin material is C2
  • the surface resistance value R of the container body 2 can be greatly changed by slightly changing the C2 value range. Furthermore, the surface resistance value R can be reduced even if the amount of the additive composed of carbon (carbon fiber or carbon nanotube) is increased. From these, the surface resistance value R of the container body 2 is set to a predetermined value, for example, 10 5 ⁇ ⁇ R ⁇ 10 11 ⁇ Can be easily adjusted.
  • This configuration can suppress the generation of static electricity in the container body 2. As a result, it is possible to prevent particles from adhering to the container body 2 or damage to the substrate W due to electrostatic discharge.
  • the resin material has a water absorption of 0.02% or less.
  • the resin material is composed of at least one of cycloolefin polymer, cycloolefin copolymer, polyphenyl sulfide, liquid crystal polymer, and polyether ether ketone. With this configuration, the water absorption of the resin material constituting the container body 2 can be 0.02% or less.
  • the resin material is composed of at least one of cycloolefin polymer, cycloolefin copolymer, polyphenyl sulfide, liquid crystal polymer, and polyether ether ketone, but is not limited thereto.
  • the resin material should just have a water absorption of 0.02% or less.
  • the shape of the container body and the lid, the number of the substrates W that can be stored in the container body, and the dimensions thereof are the shape of the container body 2 and the lid 3 in the present embodiment, and the substrate W that can be stored in the container body 2. It is not limited to the number of sheets and dimensions.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

La présente invention concerne un récipient recevant des substrats, qui reçoit des substrats comportant des tranches en semiconducteurs et qui est utilisé comme récipient de transport dans un processus de production à l'intérieur d'une usine. Le récipient recevant des substrats comporte: un corps principal (2) de récipient dans lequel est formé un espace recevant des substrats capable de recevoir la pluralité de substrats, et à une extrémité duquel est formé une ouverture de corps principal de récipient qui communique avec l'espace recevant des substrats; et un corps de couvercle qui est susceptible d'être apposé sur et séparé de l'ouverture de corps principal de récipient, et qui est susceptible d'obturer l'ouverture de corps principal de récipient. Le corps principal (2) de récipient est constitué d'un matériau en résine auquel ont été ajoutés des fibres de carbone et des nanotubes de carbone.
PCT/JP2013/083210 2013-12-11 2013-12-11 Récipient recevant des substrats WO2015087416A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2013/083210 WO2015087416A1 (fr) 2013-12-11 2013-12-11 Récipient recevant des substrats

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2013/083210 WO2015087416A1 (fr) 2013-12-11 2013-12-11 Récipient recevant des substrats

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WO2015087416A1 true WO2015087416A1 (fr) 2015-06-18

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106317732A (zh) * 2015-06-25 2017-01-11 家登精密工业股份有限公司 环烯烃组合物及应用其的环烯烃半导体基板传送盒

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003341783A (ja) * 2002-05-28 2003-12-03 Fujitsu Ltd 基板収納装置
JP2004193381A (ja) * 2002-12-12 2004-07-08 Dainichi Shoji Kk ウエハーを含む半導体部材の運搬・保管用容器
JP2007332271A (ja) * 2006-06-15 2007-12-27 Miraial Kk 高分子成形製品
WO2011102318A1 (fr) * 2010-02-19 2011-08-25 信越ポリマー株式会社 Contenant de stockage de substrat

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003341783A (ja) * 2002-05-28 2003-12-03 Fujitsu Ltd 基板収納装置
JP2004193381A (ja) * 2002-12-12 2004-07-08 Dainichi Shoji Kk ウエハーを含む半導体部材の運搬・保管用容器
JP2007332271A (ja) * 2006-06-15 2007-12-27 Miraial Kk 高分子成形製品
WO2011102318A1 (fr) * 2010-02-19 2011-08-25 信越ポリマー株式会社 Contenant de stockage de substrat

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106317732A (zh) * 2015-06-25 2017-01-11 家登精密工业股份有限公司 环烯烃组合物及应用其的环烯烃半导体基板传送盒

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