WO2015076625A1 - Appareil d'éclairage à del - Google Patents
Appareil d'éclairage à del Download PDFInfo
- Publication number
- WO2015076625A1 WO2015076625A1 PCT/KR2014/011290 KR2014011290W WO2015076625A1 WO 2015076625 A1 WO2015076625 A1 WO 2015076625A1 KR 2014011290 W KR2014011290 W KR 2014011290W WO 2015076625 A1 WO2015076625 A1 WO 2015076625A1
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- led
- light
- housing
- unit
- lighting
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Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/0008—Reflectors for light sources providing for indirect lighting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
- F21S8/08—Lighting devices intended for fixed installation with a standard
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/0008—Reflectors for light sources providing for indirect lighting
- F21V7/0016—Reflectors for light sources providing for indirect lighting on lighting devices that also provide for direct lighting, e.g. by means of independent light sources, by splitting of the light beam, by switching between both lighting modes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
- F21V21/14—Adjustable mountings
- F21V21/30—Pivoted housings or frames
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
- F21V23/023—Power supplies in a casing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
- F21V23/026—Fastening of transformers or ballasts
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the present invention relates to an LED luminaire, and more particularly, to an LED luminaire having excellent heat dissipation characteristics and easy light distribution control.
- Lighting devices using conventional light source means such as incandescent lamps, fluorescent lamps have problems such as high power consumption and short lifespan.
- lighting devices that use LEDs with low power consumption and long lifespan are being developed.
- the lifespan is significantly increased compared to the existing lighting device.
- the amount of waste is also greatly reduced to prevent environmental pollution. It is also expected to reduce power consumption and contribute to energy savings.
- LED has a problem of generating a large amount of heat despite this advantage. If the heat generated by the LED cannot be emitted to the outside, the lifespan of the LED luminaire is reduced, so the long life effect of using the LED as a light source is hardly expressed.
- the LED lighting device requires a switching mode power supply (SMPS) for converting an external AC power into a DC power supply to the LED.
- SMPS switching mode power supply
- Korean Utility Model Registration No. 20-0451090 discloses a case where an LED landscape lighting lamp with built-in SMPS is placed facing a substrate on which an LED is mounted and the SMPS is disposed between supporting surfaces. But SMPS generates heat by itself. Therefore, in the LED landscape lighting, there is a problem in that the heat generated from the SMPS and the heat generated from the LED interact to reduce the lifetime of both the SMPS and the LED.
- high power LED luminaires typically over 100 watts
- LED luminaires have generally used high power LED chips (eg, 1 watt LED chips) as light sources.
- high power LED chips eg, 1 watt LED chips
- FIG. 1 high power LED chips
- FIG. 1 high power LED chips
- FIG. 1 high power LED chips
- high-power LED chips generate more heat than low-power LED chips, requiring more effort to dissipate heat. Despite such deterioration in heat dissipation, high power LED chips had to be used to make light distribution control easier.
- the high-power luminaire when the high-power luminaire is implemented using a high power LED chip, a large heat dissipation means is required to solve the heat dissipation problem. Accordingly, the volume and weight of the device increase and the manufacturing cost also increases. Particularly, in the case of floodlight, a luminaire having a small size and low power consumption is required due to the large size of the lighting fixture and the large power consumption.
- an embodiment of the present invention can easily emit heat generated from the LED and can prevent the heat generated from the LED from being conducted to the surroundings, as well as control light distribution in a desired form. It is an object of the present invention to provide an LED lighting device.
- an embodiment of the present invention is to provide an LED lighting device that can block the heat conduction between the power supply and the lighting unit.
- an LED lighting device includes: (i) an illumination unit including a plurality of LEDs as a light source to generate light; (ii) a housing having an inner space having an opening on one surface and a light emitting portion for emitting light to the outside on the other surface; (iii) a reflection unit provided on an inner surface of the housing (ii) to reflect light generated from the lighting unit (i) to the light emitting unit; And (iv) a heat dissipation unit provided to the outside of the rear surface of the lighting unit i to emit heat to the outside, wherein the front surface of the lighting unit i faces the inner space of the housing to cover the opening.
- the light emitting unit is installed to emit light generated from the lighting unit (i) or to emit light reflected from the lighting unit (i) through the reflecting unit (iii).
- the LED lighting device includes a lighting unit including a substrate on which a plurality of low-power LED chip is mounted; A bottom, a housing having a first inclined surface forming an acute angle with the bottom surface, and a second inclined surface forming an acute angle with the bottom surface and connected to the first inclined surface, wherein the bottom, the first inclined surface and the second inclined surface A housing to which both ends of the bottom, the first inclined surface, and the second inclined surface are connected such that an inner space is formed at a boundary thereof; A reflection part installed to reflect light generated from the lighting part on an inner surface of the housing, wherein at least a part of the lighting part is a part of the first inclined surface such that the low power LED chips face an inner space of the housing; Is inserted through.
- LED lighting fixtures according to the embodiments of the present invention is excellent in heat dissipation characteristics, excellent in manufacturing efficiency, high productivity, and can reduce the overall weight and volume of the final product and smooth light control can be applied to various fields .
- FIG 1 shows an arrangement of LED chips of an LED luminaire according to an embodiment of the present invention.
- FIG 2 shows an arrangement of LED chips of an LED luminaire according to another embodiment of the present invention.
- FIG 3 is an exploded perspective view of the LED lighting fixture according to an embodiment of the present invention.
- FIG. 4 is a cross-sectional view showing an assembled state of the LED lighting fixture of FIG.
- FIG. 5 is a cross-sectional view illustrating the inclination angle of the reflecting surface of the LED lighting fixture of FIG.
- Figure 6 is a plan perspective view of the LED lighting fixture according to an embodiment of the present invention, the reflector is installed on the side.
- FIG. 7 is an exploded perspective view of a fixing frame applied to the LED lighting device according to an embodiment of the present invention.
- FIG. 8 is a perspective view of an LED lighting fixture according to another embodiment of the present invention.
- FIG. 9 is a side view of the LED luminaire of FIG. 8.
- FIG. 10 is an enlarged view of a part of the LED lighting fixture of FIG. 9.
- FIG. 11 is a cross-sectional view of the LED lighting fixture according to an embodiment of the present invention.
- Fig. 13 shows light emission of the LED luminaire when the inclination angle a is 45 degrees.
- FIG. 14 is a light distribution diagram and a direct illuminance diagram of the LED lighting device according to the embodiment of the present invention.
- FIG. 3 is an exploded perspective view of the LED lighting fixture according to an embodiment of the present invention
- Figure 4 is a cross-sectional view showing the assembled state of the LED lighting fixture of FIG.
- LED lighting apparatus comprises: (i) a lighting unit 100 having a plurality of LEDs as a light source to generate light; (ii) a housing 200 having an inner space having an opening 220 on one surface and a light emitting portion 210 emitting light to the outside on the other surface; (iii) a reflection unit 230 installed on an inner surface of the housing 200 to reflect light generated from the lighting unit 100 to the light emitting unit 210; And (iv) a heat dissipation unit 120 provided to be exposed to the outside of the lighting unit 100 to release the heat to the outside.
- the front surface of the lighting unit 100 is installed toward the inner space of the housing 200 to cover the opening 220, the light emitting unit 210 is generated from the lighting unit 100 It is installed to emit the light is reflected or reflected through the reflector 230 from the illumination unit 100.
- the lighting unit 100 supports a substrate 110, a plurality of LEDs 111 disposed on the substrate 110, and the substrate 110.
- the metal plate 130 is included.
- an LED chip is preferably used. COB (chip on board) type LED chips can also be used.
- the LED chip is a low power LED chip.
- a chip of 0.1 watt to 0.6 watt, preferably 0.2 watt to 0.5 watt may be used.
- Low-power LED chips have a narrower spacing between neighboring chips because they provide the same output in the same area and use more chips than higher-power high-power LED chips.
- FIGS. 1 and 2 are views showing the arrangement of the low power LED chips 111 and the high power LED chips 111 on the lighting unit of the LED luminaire according to an embodiment of the present invention, specifically, the substrate.
- LED luminaires using low power LED chips as shown in FIGS. 1 and 2 can have five 0.2 watt LED chips arranged in a unit area (indicated by "A” in the figures), while high power LEDs LED luminaires using chips can be aligned with one 1 watt LED chip (FIG. 2). This shows that the spacing between the low power chips labeled "d1" in FIG. 1 is smaller than the spacing between the high power chips labeled "d2" in FIG.
- the LED luminaire according to a modified embodiment of the present invention can be equipped with ten 0.1 watt LED chips, four 0.25 watt LED chips, or 0.5 watts in a unit area, depending on desired design specifications and / or customer requirements.
- the two LED chips can be aligned.
- each LED chip 111 serves as a heat transfer point and a heat source for transferring heat
- LED luminaires using low power LED chips according to an embodiment of the present invention are more uniform in the heat generated from the LED chips to the substrate. Can be delivered or discharged evenly.
- Low-power LED chips are less expensive and consume less power than high-power LED chips and generate less heat than high-power LED chips.
- Low power LED chips also have higher brightness efficiency than high power LED chips. For example, in theory, there is a lumen difference per watt between the luminous flux of each of the five 0.2 watt LED chips and the luminous flux of one 1.0 watt LED chip. That is, a 0.2 watt LED chip has about 160 lm / w while a 1.0 watt LED chip has about 140 lm / w, which means that the light efficiency of low power LED chips is higher than that of high power LED chips.
- a high power LED chip (eg, an LED chip of about 1 watt or more) may also be used.
- heat generated from the chip has a relatively higher temperature than a low power chip, which may cause a heat island phenomenon.
- the spacing between neighboring chips within the same area may be greater than in low power LED chips, making thermal conduction difficult. In high power LED chips, these can shorten the life of the LED chips. Therefore, heat dissipation design is of paramount importance in high-power LED chips. Therefore, when using a high power LED chip, it is desirable to have all of the heat dissipation designs described below as possible. Since the amount of heat generation and light distribution of the chip must be changed according to the type of chip, the design and structure of the lighting fixture must be adjusted accordingly.
- the lighting unit 100 may be detachably attached to the housing 200 so that the lighting unit 100 may be conveniently replaced and repaired.
- the lighting unit 100 is installed toward the inner space of the housing 200 such that the front surface where the LED is installed covers the opening 220 of the housing 200.
- the lighting unit 100 may be installed by being inserted into the opening 220 of the housing 200.
- the metal plate 130 to which the substrate 110 is attached is installed to have an acute inclination angle with respect to the ground. Accordingly, the LEDs 110 mounted on the substrate 110 are inclined with respect to the ground. This can be understood to increase the illuminance in the direct direction of the LED lighting device according to an embodiment of the present invention.
- the metal plate 130 may be manufactured by various methods.
- the metal plate 130 may be an extrusion molded product, preferably manufactured by extrusion molding.
- the metal plate 130 has a higher thermal conductivity than the housing 200, so that the heat generated from the LED chip is greater than that of the housing 200. Can be delivered quickly through
- a rear surface of the lighting unit 100 is provided to be exposed to the outside, and is provided with a heat dissipation unit 120 for emitting heat to the outside.
- a heat radiation fin is preferably used as the heat dissipation unit 120.
- a plurality of heat dissipation fins 120 protrude from the rear surface of the metal plate 130, and the substrate 110 may be fixed to the front surface of the metal plate 130 as shown in FIG. 4.
- the LED chip 111 is mounted on the substrate 110 as a light source. When heat is generated in the LED chip 111, the heat may be quickly transferred to the heat dissipation fins 120 through the metal plate 130.
- heat transfer to the heat dissipation fin 120 may be performed more quickly. Heat transferred to the heat dissipation fin 120 may be easily released to the outside through heat exchange with the outside air from the heat dissipation fin 120.
- the number, shape, and location of the heat dissipation fins 120 may be appropriately selected depending on desired design specifications and / or customer requirements.
- the heat radiating fins 120 may be formed horizontally.
- the heat radiation fins 120 may be formed in a vertical direction or in an inclined direction.
- the heat dissipation fins 120 are formed in a vertical direction or at least inclined with respect to the ground, foreign matters such as dust fall down by gravity to prevent deterioration of heat dissipation characteristics due to foreign matter deposition.
- air convection may be smooth. That is, when the heat radiating fins 120 are formed in the vertical direction, the air heat-exchanged in the space between the heat radiating fins 120 may rise smoothly without resistance to form convection. Therefore, the heat dissipation fin 120 is preferably formed in a direction inclined with respect to the ground, more preferably in a vertical direction. At least one of the heat sink fins 120 may be formed horizontally and / or at least one of them may be formed in an inclined direction or vertically.
- the heat dissipation fin 120 and the metal plate 130 may be formed separately and connected to each other in an appropriate manner. In other embodiments they may be formed integrally through processes such as extrusion or injection molding. In general, even the same material, the extrusion molded product has a higher thermal conductivity than the injection molded product. Therefore, the heat dissipation fin 120 and the metal plate 130 is preferably formed integrally, and more preferably manufactured by extrusion molding. In this case, the thermal conductivity is high, the heat dissipation effect is large.
- the metal plate 130 and the heat dissipation fins 120 are preferably made of a material having a greater thermal conductivity than the housing 110.
- the housing 200 has a bottom, a first inclined surface forming an acute angle with the bottom surface, and a second inclined surface forming an acute angle with the bottom surface and connected to the first inclined surface.
- the housing 200 is connected to both ends of the bottom surface, the first sloped surface and the second sloped surface such that an inner space is formed between the bottom surface, the first sloped surface, and the second sloped surface.
- the opening 220 is provided on the first inclined surface of the housing 200, and the light emitting part 210 is provided on the bottom surface of the housing 200.
- the angle formed by the bottom and first inclined surfaces, the angle formed by the first and second inclined surfaces, and the angle formed by the second and inclined surfaces may satisfy desired design specifications and / or customer requirements. Is set.
- the housing 200 may be formed through a process such as extrusion molding or injection molding.
- the housing 200 is formed entirely by injection molding. Since the injection molding housing 200 has a relatively low thermal conductivity, heat generated from the LED 111 may be conducted to the power supply 300, or conversely, heat of the power supply 300 may be reduced to the LED 111. to be.
- the housing 200 it is preferable to use a material having a relatively low thermal conductivity as compared to the metal plate 130 and the heat dissipation fin 120. This is because heat can be further reduced between the lighting unit 100 and the power supply unit 300 through the housing 200.
- the first inclined surface provided with the opening 220 is formed to be inclined with the ground to enable molding without using an insert in the injection mold.
- the heat insulation sealing unit 140 is disposed between the lighting unit 100, in particular, the metal plate 130 on which the LED chip is mounted and the housing 200.
- the heat insulation sealing part 140 is preferably made of a low thermal conductivity material.
- the insulation sealing unit 140 prevents water from flowing into the housing 200 and blocks heat generated from the LED 111 from being conducted to the housing 200, and is also generated by the power supply unit 300. Block the heat is conducted to the lighting unit (100).
- a reflector 230 may be installed on an inner surface of the housing 200 to reflect light generated from the lighting unit 100 to the light emitting unit (see FIG. 3).
- the reflector 230 may include a plurality of reflecting surfaces 231, and each reflecting surface 231 may have predetermined light distribution characteristics when light is emitted through the light emitting unit 210. To implement, they have different inclination angles ⁇ 1 , ⁇ 2 , ⁇ 3 ,..., Different curvatures, different areas or two or more of them. Thus, by using the reflector 230 having a plurality of reflecting surfaces 231 having different inclinations, light distribution can be efficiently controlled. In particular, when a low power LED chip is used as a light source, that is, when the number of chips is more difficult to control light distribution, desired light distribution can be easily obtained.
- the number of the low power LED chips 111 and the distance between neighboring chips may be adjusted to implement the predetermined light distribution characteristic, and the structure and shape of the reflector 230 may be appropriately designed.
- the LED chips may be mounted on the lighting unit 100 so that at least some of the light generated from the LED chips 111 may reach the reflector 230.
- the closer to the illumination unit 100, the narrower the area of the reflective surface, and the farther away from the illumination unit the larger the area may be.
- Reflector 230 may be formed on the ceiling surface of the inner surface of the housing 200, as shown in Figure 5, may be formed on both sides of the housing 200, as shown in Figure 6 or both May be 6 is a plan perspective view of a luminaire according to an embodiment of the present invention. As shown, the light generated from the LED chip 111 on the substrate 110 is reflected to the side and then emitted to the outside through the light emitting unit 210.
- the reflector 230 is detachably installed in the housing 200 to facilitate replacement and repair as well as to freely adjust the light distribution characteristics.
- the reflector 230 various materials such as aluminum may be used.
- various coating methods may be used to form the reflector 230. For example, a method of depositing, coating or laminating silver (Ag) on a polycarbonate may be used.
- the light emitting unit 210 is provided with a cover 240 covering the light emitting unit 210.
- the cover 240 prevents foreign substances such as dust from entering the housing 200.
- Cover 240 may be secured to housing 200 through methods known in the art.
- LED lighting fixture according to an embodiment of the present invention includes a fixing frame 250 for fixing the cover 240. The configuration and operation of the fixed frame 250 will be described in more detail later.
- the outer surface of the housing 200, a power supply unit 300 for supplying power to the lighting unit 100 may be mounted. At least one power supply hole 201 is provided on an outer surface of the power supply unit 300 to allow power to be supplied to the substrate 110.
- the power supply unit 300 may be mounted detachably or may be mounted non-removably. A detachable type is more preferable from a viewpoint of replacement or repair.
- the LED lighting device according to the embodiment of the present invention has excellent heat dissipation characteristics.
- the power supply unit 300 may be installed to be inclined with respect to the ground as shown in FIG. 4 and thus has an advantage of reducing the stacking of dust or foreign matter and reducing resistance by wind.
- the power supply 300 is provided with a fastening protrusion 310 protruding downward (FIG. 4).
- the fastening protrusion 310 may be mounted on an outer surface of the housing 200 so as to contact the upper surface of the housing 200 with a gap between the power supply 300 and the outer upper surface of the housing 200. Since the power supply unit 300 and the housing 200 are contacted only through the fastening protrusions, the heat conduction between them can be reduced. In addition, there is a space between the power supply unit 300 and the housing 200 in addition to the portion connected through the fastening protrusions to increase the heat dissipation effect. In another modified embodiment, as shown in FIG.
- the heat dissipation unit 320 is disposed on the outer surface of the power supply unit 300 so that heat dissipation is performed from the power supply unit 300 to the outside.
- a heat dissipation fin is preferably used as the heat dissipation unit 320.
- the heat dissipation fin is preferably formed to be inclined with the ground, more preferably in the vertical direction.
- the power supply unit 300 may be provided with an antenna 340 for receiving a wireless signal to adjust the power provided to the substrate 110 with a wireless signal from the outside (FIG. 3). It may be configured to include a controller for controlling the power supply according to the radio signal received through the antenna 340.
- the light emitting portion 210 may be provided on the bottom of the housing 200, and the opening 200 is upwards from one end of the bottom. It may be formed to be inclined, and the outer surface on which the power supply unit 300 is mounted may be formed to be inclined upward from another end of the bottom.
- FIG. 3 shows a fixed frame 250 applied to the LED lighting device according to an embodiment of the present invention
- FIG. 7 shows an exploded view of the fixed frame 250.
- the fixed frame 250 has a plurality of divided configurations. That is, in the fixed frame 250, a plurality of bending frames 251 and a linear frame 252 are combined with each other to form a fixed frame 250 having a window frame shape as a whole.
- the bending frame 251 is in contact with the vertex of the cover 240 and the edge around the vertex, respectively, and the straight frame 252 is in contact with the edge of the cover 240 between the bending frames 251 (see FIGS. 3 and 7).
- the bending frame 251 and the linear frame 252 may be coupled around the bottom light emitting portion 210 of the housing 200 through a coupling mechanism such as bolts, respectively.
- the bending frame 251 and the linear frame 252 may be coupled to overlap a part of each other, the overlapping portion may be provided with a stepped portion 253 is reversed up and down to engage each other.
- the bending frame 251 may be coupled to the housing 200 with the cover 240 interposed therebetween, and the straight frame 252 may be coupled to the housing 200.
- the stepped portion 253 formed at one end of the straight frame 252 may be in contact with the stepped portion 253 of the bending frame 251 and the edge of the straight frame 252 is substantially in the bending frame 251. It can be tightly fixed.
- the split type fixed frame 250 does not need to produce a variety of frames for each model has the advantage that the manufacturing cost can be reduced.
- the integral fixed frame may be distorted in the storage process when manufactured, but the split type fixed frame 250 according to an embodiment of the present invention is divided, so there is no fear of distortion. It can also be stored easily by reducing its volume.
- FIG. 8 is a perspective view of an LED lighting fixture according to another embodiment of the present invention
- FIG. 9 is a side view of the LED lighting fixture of FIG. 8
- FIG. 10 is a partially enlarged view of the LED lighting fixture of FIG. 9.
- the LED lighting device according to another embodiment of the present invention is coupled to the lighting unit 100, and an angle adjusting unit capable of tilting and rotating the LED lighting device according to the previous embodiment ( 400) is further included.
- the angle adjustment unit 400 is a first pivot bracket 410 fixed to one side end of the rear surface of the lighting unit 100, the second side fixed to the other side end of the rear surface of the lighting unit 100
- Rotating bracket 410 one end is rotatably coupled to the first rotation bracket 410, the other end is rotatable frame 420 is coupled to the second rotation bracket and the rotation frame portion 420
- It is configured to include an arm socket portion 430 detachably coupled to a portion of the) and to which the arm of the light stem can be coupled (see FIGS. 8 and 9).
- the arm socket part 430 may rotate the coupling structure of the lighting unit 100, the housing 200, and the power supply unit 300 according to the coupling angle thereof.
- the rotation bracket 410 By rotating the pivot frame 420, the angle at which the light emitted from the LED 111 is reflected through the reflector 230 and the angle emitted through the light emitter 210 may be adjusted (see FIG. 9). ).
- the rotation bracket 410 includes a rotation shaft part 412 fixed to the side of the lighting unit 100 by penetrating a part of the rotation frame 420 at the center thereof.
- the rotating bracket 410 is provided with an arc-shaped through portion 411 around the rotating shaft portion 412. Accordingly, the rotation frame 420 is not rotated by tightening the fixing bolt 421 coupled to the rotation bracket 410 through the penetrating portion 411 in a state in which the rotation angle of the rotation frame part 420 is properly adjusted.
- the pivot bracket 410 has a planar shape of 'c', and an arm socket part 430 may be coupled to a surface parallel to the illumination part 100.
- the arm socket portion 430 may be replaced with a socket or fastening member having various shapes or shapes as necessary.
- LED lighting fixtures according to an embodiment of the present invention can be applied to a variety of fields, including street lights, ceiling lights, harbor lights, park lights. That is, the LED lighting device according to an embodiment of the present invention may be installed on the arm of the street lamp post, or may be installed on a wall, a ceiling, or the like. LED lighting fixture according to an embodiment of the present invention can be freely adjusted up and down to achieve a suitable light distribution. For example, it can be adjusted from -70 to 110 degrees.
- FIG. 11 is a cross-sectional view of the LED lighting fixture according to an embodiment of the present invention.
- the metal plate 130 is inclined with respect to the ground, and the angle a with respect to the direction perpendicular to the light emitting part 210.
- the inclination angle a takes into account the roughness of the light emitting unit 210 in the direction immediately below.
- the range of the inclination angle a may be appropriately adjusted through design specifications such as predetermined light distribution.
- the amount of light emitted directly from the LED 111 chip to the light emitting portion 210 is too small to obtain desired light distribution.
- the amount of light directly emitted directly from the LED 111 chip to the light emitting portion 210 is too small to obtain desired light distribution.
- the inclination angle a is 0 degrees, most of the emitted light is reflected light through the reflector 230, and only a part of the emitted light directly from the illuminator is difficult to obtain proper light distribution.
- the inclination angle a is too large, the amount of light directly emitted to the light emitting unit 210 is too large to obtain desired light distribution. For example, as shown in FIG.
- the inclination angle a is not limited and may be in a range of more than 0 degrees and less than 45 degrees. Such a limitation of the inclination angle a takes into account that the present invention uses a larger number of LEDs than the conventional one due to the use of low power LEDs, and thus, there is a high necessity to control light distribution.
- the light emitting unit 210 and the straight line meet each other.
- the ratio of the length y to the point also affects the light distribution characteristic of the present invention (FIG. 11).
- the luminaire of FIG. 13 has a larger y / x ratio than the luminaire of FIG. 12 and thus the light distribution characteristic is completely different.
- the length y and the height x are preferably set to implement preset light distribution characteristics when light is emitted through the light emitting unit 210.
- the length y of the reflecting portion 231 is more than twice the height x and designed to be less than seven times the height x. Within the range of this aspect ratio, the light distribution characteristic is more excellent.
- the ratio of the luminous flux of the light (direct light) directly reflected from the light source and the light (reflected light) reflected through the reflector may be adjusted in a range of 4: 6 to 6: 4. .
- FIG. 14 is a light distribution diagram and a direct illuminance diagram of a lighting device according to an embodiment of the present invention.
- the luminaire is a luminaire that uses a 0.2 watt low power LED chip and consumes 300 watts and has a ratio of 51.4: 48.6 in the ratio of direct light and reflected light.
- the light distribution distribution diagram, the direct illuminance table, and the ratio of luminous flux between the direct light and the reflected light can be obtained by adjusting the inclination angles a, the ratio of y / x and the like as described above.
- Yet another embodiment of the present invention provides a lighting unit including a substrate on which a plurality of low power LED chips are mounted; A bottom, a housing having a first inclined surface forming an acute angle with the bottom surface, and a second inclined surface forming an acute angle with the bottom surface and connected to the first inclined surface, wherein the bottom, the first inclined surface and the second inclined surface A housing to which both ends of the bottom, the first inclined surface, and the second inclined surface are connected such that an inner space is formed at a boundary thereof; A reflection part installed to reflect light generated from the lighting part on an inner surface of the housing, wherein at least a part of the lighting part is a part of the first inclined surface such that the low power LED chips face an inner space of the housing; Provides an LED luminaire that is inserted through.
- the lighting unit and the power supply unit may be thermally insulated from other structural elements, and may heat (dissipate) individually, thereby preventing heat conduction between the lighting unit and the power supply unit and preventing shortening of life.
- the housing may be made of a material having a relatively low thermal conductivity through injection molding, thereby preventing heat conduction between the lighting unit and the power supply unit.
- the heat insulation sealing unit configured to block heat conduction is disposed between the lighting unit and the housing, thereby preventing heat conduction between the lighting unit and the housing (and the power supply unit).
- productivity can be improved by preventing deformation and damage of the frame.
- the lighting unit and the power supply unit can be manufactured in the form of separate pieces to implement the optimized weight and structure.
- the housing, the lighting unit and the power supply unit can be manufactured in the form of a separate piece to increase the productivity during mass production can reduce the manufacturing cost.
- the LED lighting fixtures according to some embodiments may further include an angle adjuster rotatably coupled to the lighting unit, wherein the structure or shape of the arm socket assembled with the angle bracket of the angle adjuster in the ground, ceiling It is possible to maintain the lighting direction irrespective of the installation position of the lighting fixture such as a wall. Therefore, LED lighting fixtures can be applied to various lighting fields and used for various purposes. In addition, LED luminaires can achieve the desired light distribution even when low power LED chips are used, reduce heat generated by the use of high power LED chips, and reduce weight and volume. In addition, the LED lighting fixtures according to some embodiments can control the lighting wirelessly, which is very convenient to operate.
- the luminaire according to one embodiment of the present invention can be used for high power lighting of 100 watt or more, in particular for floodlight.
- Floodlight is a luminaire that collects the light emitted from the light source to form a beam to illuminate a distant place, and is mainly used to illuminate distant places such as vehicles and ships, or to illuminate exterior walls of buildings, outdoor workshops, and sports facilities.
- the luminaire according to an embodiment of the present invention can obtain a desired heat dissipation characteristic and light distribution characteristic with a relatively small size, and thus can be used more effectively in floodlight.
- metal plate 140 heat insulation sealing part
- housing 210 light emitting portion
- stepped portion 300 power supply
- fastening protrusion 320 heat dissipation, heat radiation fins
- fixing bolt 430 arm socket portion
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA2931358A CA2931358C (fr) | 2013-11-22 | 2014-11-21 | Appareil d'eclairage a del |
CN201480063421.7A CN105745491A (zh) | 2013-11-22 | 2014-11-21 | Led照明器具 |
RU2016124536A RU2648013C2 (ru) | 2013-11-22 | 2014-11-21 | Сид осветительный прибор |
JP2016533126A JP6339199B2 (ja) | 2013-11-22 | 2014-11-21 | Led照明器具 |
AU2014353710A AU2014353710B2 (en) | 2013-11-22 | 2014-11-21 | LED lighting device |
EP14864495.8A EP3076072A4 (fr) | 2013-11-22 | 2014-11-21 | Appareil d'éclairage à del |
KR1020157006692A KR101693221B1 (ko) | 2013-11-22 | 2014-11-21 | Led 조명기구 |
PH12016500942A PH12016500942A1 (en) | 2013-11-22 | 2016-05-20 | Led lighting fixture |
ZA2016/03808A ZA201603808B (en) | 2013-11-22 | 2016-06-03 | Led lighting fixture |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20130142968 | 2013-11-22 | ||
KR10-2013-0142968 | 2013-11-22 | ||
KR20140015569 | 2014-02-11 | ||
KR10-2014-0015569 | 2014-02-11 |
Publications (1)
Publication Number | Publication Date |
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WO2015076625A1 true WO2015076625A1 (fr) | 2015-05-28 |
Family
ID=53179818
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2014/011290 WO2015076625A1 (fr) | 2013-11-22 | 2014-11-21 | Appareil d'éclairage à del |
Country Status (10)
Country | Link |
---|---|
EP (1) | EP3076072A4 (fr) |
JP (1) | JP6339199B2 (fr) |
KR (1) | KR101693221B1 (fr) |
CN (1) | CN105745491A (fr) |
AU (1) | AU2014353710B2 (fr) |
CA (1) | CA2931358C (fr) |
PH (1) | PH12016500942A1 (fr) |
RU (1) | RU2648013C2 (fr) |
WO (1) | WO2015076625A1 (fr) |
ZA (1) | ZA201603808B (fr) |
Cited By (3)
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WO2016200149A1 (fr) * | 2015-06-09 | 2016-12-15 | 엘지이노텍 주식회사 | Appareil d'éclairage |
WO2016200151A1 (fr) * | 2015-06-09 | 2016-12-15 | 엘지이노텍 주식회사 | Appareil d'éclairage |
JP2017120741A (ja) * | 2015-12-28 | 2017-07-06 | 株式会社Gsユアサ | 照明灯 |
Families Citing this family (2)
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JP2019179637A (ja) * | 2018-03-30 | 2019-10-17 | 東芝ライテック株式会社 | 照明器具 |
KR102132456B1 (ko) * | 2019-04-25 | 2020-07-09 | (주) 매그나텍 | 효율적인 배광 제어가 가능한 렌즈 구조를 구비한 엘이디 조명장치 |
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- 2014-11-21 CA CA2931358A patent/CA2931358C/fr not_active Expired - Fee Related
- 2014-11-21 AU AU2014353710A patent/AU2014353710B2/en active Active
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Also Published As
Publication number | Publication date |
---|---|
EP3076072A4 (fr) | 2017-07-19 |
JP6339199B2 (ja) | 2018-06-06 |
CA2931358A1 (fr) | 2015-05-28 |
KR20150071009A (ko) | 2015-06-25 |
RU2016124536A (ru) | 2017-12-25 |
AU2014353710A1 (en) | 2016-06-16 |
ZA201603808B (en) | 2018-07-25 |
PH12016500942A1 (en) | 2016-06-27 |
EP3076072A1 (fr) | 2016-10-05 |
CN105745491A (zh) | 2016-07-06 |
KR101693221B1 (ko) | 2017-01-05 |
AU2014353710B2 (en) | 2016-12-01 |
RU2648013C2 (ru) | 2018-03-21 |
JP2017500697A (ja) | 2017-01-05 |
CA2931358C (fr) | 2018-10-02 |
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