EP3076072A1 - Appareil d'éclairage à del - Google Patents

Appareil d'éclairage à del Download PDF

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Publication number
EP3076072A1
EP3076072A1 EP14864495.8A EP14864495A EP3076072A1 EP 3076072 A1 EP3076072 A1 EP 3076072A1 EP 14864495 A EP14864495 A EP 14864495A EP 3076072 A1 EP3076072 A1 EP 3076072A1
Authority
EP
European Patent Office
Prior art keywords
lighting device
led lighting
housing
light
face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14864495.8A
Other languages
German (de)
English (en)
Other versions
EP3076072A4 (fr
Inventor
Duk Yong Kim
Byung Ju Kang
Hyun Ki Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GigaTera Inc
Original Assignee
KMW Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KMW Inc filed Critical KMW Inc
Publication of EP3076072A1 publication Critical patent/EP3076072A1/fr
Publication of EP3076072A4 publication Critical patent/EP3076072A4/fr
Withdrawn legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/0008—Reflectors for light sources providing for indirect lighting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/08—Lighting devices intended for fixed installation with a standard
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/0008—Reflectors for light sources providing for indirect lighting
    • F21V7/0016—Reflectors for light sources providing for indirect lighting on lighting devices that also provide for direct lighting, e.g. by means of independent light sources, by splitting of the light beam, by switching between both lighting modes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/14—Adjustable mountings
    • F21V21/30—Pivoted housings or frames
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
    • F21V23/023—Power supplies in a casing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
    • F21V23/026—Fastening of transformers or ballasts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to an LED lighting device, and more particularly, to an LED lighting device that is excellent in heat radiation characteristic and which is easy to control a light distribution.
  • Illumination devices using existing light source means such as an incandescent lamp and a fluorescent lamp have problems of high-power consumption and a short lifespan, for example.
  • illumination devices using an LED as a light source, have been developed, in which the LEDs consume little power and have a long lifespan.
  • the lifespan may increase remarkably compared to existing illumination devices.
  • the quantity of waste can also be greatly reduced to prevent environmental pollution.
  • the LED illumination devices may contribute to energy saving.
  • the LED has a problem in that it generates a large quantity of heat.
  • the life span of the LED illumination devices will be reduced and thus, the long lifespan effect according to the use of the LED as a light source cannot be achieved as expected.
  • the LED illumination devices require a Switching Mode Power Supply (SMPS) which converts an external Alternating Current (AC) power into a direct current (DC) power to be supplied to the LED.
  • SMPS Switching Mode Power Supply
  • AC Alternating Current
  • DC direct current
  • Korean Registered Utility Model No. 20-0451090 discloses an LED landscape illumination lamp equipped with an SMPS, in which a substrate, on which an LED is mounted, and the SMPS are positioned to be opposite to each other with a support face being interposed therebetween.
  • the SMPS itself generates heat.
  • the LED landscape lamp has a problem in that the heat generated from the SMPS and the heat generated from the LED interact with each other so that the lifespans of both the SMPS and the LED are shortened.
  • high-power LED chips e.g., 1 watt LED chips
  • FIG. 1 the number of LED chips required when low-power LED chips ( FIG. 1 ) are used should be relatively larger than the number of LED chips required when high-power LED chips ( FIG. 2 ) are used (see FIG. 1 ), and as a result, light distribution becomes difficult to control.
  • 1 watt high-power LED chips one hundred LED chips are required in order to provide a high output of 100 watt.
  • the high-power LED chips generate a lot of heat compared to the low-power LED chips, it is necessary to put more effort in heat radiation. Despite the degradation of the heat radiation characteristic, there has been no choice but to use the high-power LED chips in order to control the light distribution more easily.
  • one embodiment of the present invention is intended to provide an LED lighting device which is capable of easily radiate heat generated from LEDs, preventing the heat generated from the LEDs from being transferred to the surroundings, and controlling a light distribution in a desired form.
  • one embodiment of the present invention is intended to provide an LED lighting device that is capable of blocking heat conduction between a power supply and a lighting unit.
  • An LED lighting device includes: (i) a lighting unit provided with a plurality of LEDs as a light source to generate light; (ii) a housing including an opening provided on one face, a light emitting part provided on the other face to emit light outwardly, and an inner space; (iii) a reflecting part provided on an inner face of the housing (ii) to reflect light generated from the lighting unit (i) to the light emitting part; and (iv) a heat radiation unit provided on a rear face of the lighting unit (i) to be exposed outwardly so as to radiate heat outwardly.
  • the lighting unit (i) is installed to cover the opening such that its front face is directed toward the inner space of the housing (ii), and the light emitting part is installed to emit the light generated from the lighting unit (i) or to emit light reflected through the reflecting part (iii) from the lighting unit (i).
  • An LED lighting device includes: a lighting unit including a substrate, on which a plurality of low-power LED chips are mounted; a housing including a bottom face, a first inclined face formed an acute angle with the bottom face, and a second inclined face connected with the first inclined face, in which opposite ends of the bottom face, the first inclined face, and the second inclined face are connected with each other to form an inner space defined by the bottom face, the first inclined face, and the second face as boundaries; and a reflecting part on an inner face of the housing to reflect light generated from the lighting unit. At least a part of the lighting unit is inserted through a part of the first inclined face such that the low-power LED chips are directed to the inner space of the housing.
  • LED lighting devices according to the present invention are applicable to various since they are excellent in heat radiation characteristic and production efficiency, they may be manufactured with high productivity, they may allow an entire weight and volume of a final product to be reduced, and they enable a smooth light distribution control.
  • FIG. 3 is a perspective view illustrating an LED lighting device according to one embodiment of the present invention in a disassembled state
  • FIG. 4 is a cross-sectional view illustrating the LED lighting device of FIG. 3 in the assembled state.
  • the LED lighting device includes: (i) a lighting unit 100 provided with a plurality of LEDs as light sources to generate light; (ii) a housing 200 including an opening 220 provided on one face, a light emitting part 210 provided on the other face to emits light outwardly, and an inner space; (iii) a reflecting part 230 provided on an inner face of the housing 200 to reflect the light generated from the lighting unit 100 to the light emitting part 210; and (iv) a heat radiation unit 120 provided on a rear face of the lighting unit 100 to be exposed outwardly so as to radiate the heat outwardly.
  • the lighting unit 100 is installed to cover the opening 220 such that its front face is directed toward the inner space of the housing 200, and the light emitting part 210 is installed to emit the light generated from the lighting unit 100 or to emit the light reflected through the reflecting part 230 from the lighting unit 100.
  • the lighting unit 100 includes a substrate 110, a plurality of LEDs 111 placed on the substrate 110, and a metal plate 130 that supports the substrate 110.
  • LED chips are preferably used. COB (chip on board) type LED chips may also be used.
  • the LED chips are preferably low-power LED chips.
  • the low-power LED chips chips of 0.1 watts to 0.6 watts, preferably 0.2 watts to 0.5 watts may be used. Since the number of chips when low-power LED chips are used is larger than the number of chips when high-power LED chips having a higher power are used to provide the same output on the same area, the low-power LED chips are distributed such that the intervals between neighboring chips are narrower.
  • FIGS. 1 and 2 illustrate lighting units of LED lighting devices according to embodiments of the present invention, more specifically an arrangement of low-power LED chips 111 and an arrangement of high-power LED chips 111 on the substrate, respectively.
  • five 0.2 watt LED chips may be arranged in a unit area (the parts indicated by "A” in the drawings) ( FIG. 1 ) while in the LED lighting device using the high-power LED chips, one 1 watt LED chip may be arranged in the unit area ( FIG. 2 ).
  • the interval between each two adjacent low-power chips which is indicated by "d1" in FIG.
  • an LED lighting device may include ten 0.1 watt LED chips, four 0.25 watt LED chips, or two 0.5 watt LED chips arranged within the unit area according to desired design specifications and/or customers' requests.
  • each of the LED chips 111 serves as a heat transfer point that transfers heat and a heat source
  • LED lighting devices using the low-power LED chips may transfer or radiate heat generated from the used LED chips to the substrate more uniformly (evenly).
  • the low-power LED chips are more inexpensive, consume less power, and generate a smaller amount of heat than the high-power LED chips.
  • the low-power LED chips have a higher brightness efficiency than the high-power LED chips. For example, theoretically, there is a lumen difference per watt between the light beam of each of five 0.2 watt LED chips and the light beam of the one 1.0 watt LED chip. That is, the 0.2 watt LED chip has about 160 lm/w while the 1.0 watt LED chip has about 140 lm/w, which means that the optical efficiency of the low-power LED chips is higher than that of the high-power LED chips.
  • the high-power LED chips (e.g., LED chips, of which the power consumption is about 1 watt) may also be used.
  • the heat generated from the chips has a relatively high temperature as compared that generated from the low-power chips, which may generate a heat island phenomenon.
  • the interval between each two neighboring chips is longer than that in the low-power LED chips in the same area, heat conduction may become difficult. Due to this, the lifespan of the high-power LED chips may be shortened. Accordingly, heat radiation design is far more important in the high-power LED chips. Accordingly, when the high-power LED chips are used, all the heat radiation design factors to be described below are preferably provided if possible. Since an amount of generated heat and a light distribution characteristic of the chips should be varied depending on the types of chips, the design and structure of a lighting device should be adjusted accordingly.
  • the lighting unit 100 is detachable from/attachable to the housing 200 so that the lighting unit 100 can be easily replaced and repaired.
  • the lighting unit 100 is installed to close an opening 220 of the housing 200 in a state where the front face, on which the LEDs are installed, is directed toward the inner space of the housing 200.
  • the lighting unit 100 may be installed by being inserted into and coupled to the opening 220 of the housing 200.
  • the metal plate 130, to which the substrate 110 is attached has an inclined angle of an acute angle with respect to the ground.
  • the LEDs 110 mounted on the substrate 110 are arranged to be inclined with respect to the ground. It may be understood that this is to increase the illuminance in a directly downward direction of the LED lighting device according to one embodiment of the present invention.
  • the metal plate 130 may be manufactured by various methods.
  • the metal plate 130 may be an extrusion-molded product, which is manufactured through extrusion molding.
  • the thermal conductivity of the metal plate 130 is higher than that of the housing 200, and thus, the heat generated from the LED chips can be rapidly conducted through the metal plate 130 rather than through the housing 200.
  • a heat radiation unit 120 is provided on the rear face of the lighting unit 100 to be exposed outwardly, thereby radiating the heat outwardly.
  • Heat radiation fins may be preferably used for the heat radiation unit 120.
  • a plurality of heat radiation fins 120 protrudes on the rear face 130 of the metal plate 130, and the substrate 110 may be fixedly installed on the front face of the metal plate 130, as illustrated in FIG. 4 .
  • the LED chips 111 are mounted on the substrate 110 as light sources. When heat generated from the LED chips 111, the heat may be rapidly transferred to the heat radiation fins 120 through the metal plate 130.
  • the heat transfer to the heat radiation fins 120 may be executed more rapidly.
  • the heat transferred to the heat radiation fins 120 can be easily radiated through heat exchange with the external air from the heat radiation fins 120.
  • the number, shapes, and positions of the heat radiation fins 120 may be properly selected according to design specifications and/or a customers' request.
  • the heat radiation fins 120 may be formed horizontally.
  • the heat radiation fins 120 may be formed in the vertical direction or in an inclined direction.
  • the heat radiation fins 120 When the heat radiation fins 120 are formed in the vertical direction or in an inclined direction with respect to the ground, foreign matter such as dusts may fall down by gravity so that degradation of a heat radiation characteristic caused by deposition of foreign matter can be prevented. In particular, when the heat radiation fins 120 are formed in the vertical direction, convection of air can be facilitated. That is, when heat radiation fins 120 are formed in the vertical direction, the air heat-exchanged in the space formed between the heat radiation fins 120 may smoothly ascend without resistance to form a convection flow. Thus, the heat radiation fins 120 are formed preferably in an inclined direction with respect to the ground, more preferably in the vertical direction. At least one of the heat radiation fins 120 may be formed in the horizontal direction and/or at least one of the heat radiation fins 120 may be formed in the inclined direction or vertical direction.
  • the heat radiation fins 120 and the metal plate 130 may be separately formed and interconnected with each other through a proper method.
  • the heat radiation fins 120 and the metal plate 130 may be integrally formed through a process such as extrusion molding or injection molding.
  • an extrusion-molded product has a thermal conductivity higher than that of an injection-molded product.
  • the heat radiation fins 120 and the metal plate 130 are formed preferably integrally, more preferably, through extrusion molding. In this case, the heat radiation effect is high due to the high thermal conductivity.
  • the metal plate 130 and the heat radiation fins 120 are made of, preferably a material having a thermal conductivity higher than that of the housing 110.
  • the housing 200 includes a bottom face, a first included face forming an acute angle with the bottom face, and a second inclined face forming an acute angle with the bottom face and connected with the first inclined face.
  • the ends of the bottom face, the first inclined face, and the second inclined face are connected with each other to form an internal space defined by the bottom face, the first inclined face, and the second inclined face as boundaries.
  • the opening 220 is provided through the first inclined face of the housing 200 and the light emitting part 210 is provided on the bottom face.
  • the angle formed by the bottom face and the first inclined face, the angle formed by the first inclined face and the second inclined face, and the angle formed by the second inclined face and the bottom face are set to satisfy desired design specifications and/or a customers' request.
  • the housing 200 may be formed through a process such as extrusion molding or injection molding.
  • the housing 200 is formed through the injection molding in its entirety. This is because the housing 200 as an injection-molded product has a relatively low thermal conductivity so that heat conduction of the heat generated from the LEDs 111 to a power supply 300 or conversely, conduction of the heat generated from the power supply 300 to the LEDs 111 may be reduced.
  • a material have a relatively low thermal conductivity compared to the metal plate 130 and the heat radiation fins 120 is preferably used for the housing 200. This is because heat conduction between the lighting unit 100 and the power supply 300 through the housing 200 can be further reduced.
  • the first inclined face provided with the opening 220 is formed to be inclined with respect to the ground.
  • a heat insulation sealing unit 140 is disposed in the lighting unit 100, in particular between the metal plate 130, on which the LED chips are mounted, and the housing 200.
  • the heat insulation sealing unit 140 is formed of, preferably, a material having a low thermal conductivity.
  • the heat insulation sealing unit 140 prevents infiltration of water into the inside of the housing 200 and at the same time, blocks the conduction of the heat generated from the LEDs 111 to the housing 200.
  • the heat insulation sealing unit 140 blocks the conduction of the heat generated from the power supply 300 to the lighting unit 100.
  • a reflecting part 230 may be installed on an inner face of the housing 200 to reflect the light generated from the lighting unit 100 to the light emitting part (see FIG. 3 ).
  • the reflecting part 230 may be formed of a plurality of reflecting faces 231, in which the respective reflecting faces 231 have different inclined angles ⁇ 1, ⁇ 2, ⁇ 3,..., different curvatures, different areas, or at least two of these features so as to implement a pre-set light distribution characteristic when light is emitted through the light emitting part 210.
  • the reflecting part 230 having the plurality of reflecting faces 231 with different inclined angles the light distribution may be efficiently controlled.
  • a desired light distribution can be easily obtained.
  • the number of the low-power LED chips 111 and the interval between each two neighboring chips can be adjusted.
  • the structure and shape of the reflecting part 230 can be preferably designed.
  • the LED chips may be mounted on the lighting unit 100 so that at least a part of light generated from the LED chips 111 can reach the reflecting part 230.
  • the reflecting faces may be designed such that a reflecting face nearer to the lighting unit 100 has a narrower area and a reflecting face farther away from the lighting unit has a wider area.
  • the reflecting part 230 may be formed on the ceiling within the housing 200, on the opposite side faces of the housing 200, or on the ceiling and the opposite side faces of the housing 200.
  • FIG. 6 is a plan view of a lighting device according to one embodiment of the present invention. As illustrated, the light generated from the LED chips 111 on the substrate 110 are reflected laterally and then emitted outwardly through the light emitting part 210.
  • the reflecting part 230 is provided to be attachable to/detachable from the housing 200, replacement and repair are easy to perform and further, the light distribution characteristic can be freely adjusted.
  • Various materials such as aluminum, may be used for the reflecting part 230.
  • various coating methods may be used for forming the reflecting part 230. For example, a method of depositing silver (Ag) on a Poly Carbonate (PC) to be coated or laminated may be used.
  • a cover 240 is installed on the light emitting part 210 to cover the light emitting part 240.
  • the cover 240 prevents foreign matter such as dusts from infiltrating into the housing 200.
  • the cover 240 may be fixed to the housing 200 through a method known in the corresponding technical field.
  • An LED lighting device includes a fixing frame 250 that fixes the cover 240. The configuration and actions of the fixing frame 250 will be described in more detail below.
  • the power supply 300 that supplies power to the lighting unit 100 is mounted on an outer face of the housing 200. At least one power supply port 201 is provided on the outer face of the power supply 300 so as to supply power to the substrate 110.
  • the power supply 300 may be detachably or non-detachably mounted. In view of replacement or repair, the detachable type is more preferable.
  • the LED lighting device according to one embodiment of the present invention may have an excellent heat radiation characteristic.
  • the power supply 300 may be installed to be inclined with respect to the ground as illustrated in FIG. 4 and as a result, deposition of foreign matter, such as dusts, and resistance by wind may be reduced.
  • the power supply 300 is provided with fastening lugs 310 protruding downwardly ( FIG. 4 ).
  • the fastening lug 310 may be mounted on the outer face of the housing 200 to be in contact with the top face of the housing 200 with a gap being interposed between the power supply 300 and the outer top surface of the housing 200. Since the power supply 300 and the housing 200 are in contact with each other only through the fastening lugs, heat conduction between the power supply 300 and the housing 200 may be reduced. In addition, a space exists between the power supply 300 and the housing 200 except for the portion connected through the fastening lugs, the heat radiation effect can be enhanced. In another modified embodiment, as illustrated in FIG.
  • a heat radiation part 320 is also provided on the outer face of the power supply 300 so that heat radiation from the power supply 300 itself to the outside may be performed.
  • heat radiation fins may be preferably used.
  • the heat radiation fins are formed preferably to be inclined with respect to the ground, more preferably, in the vertical direction.
  • the power supply 300 may be provided with an antenna 340 that receives a wireless signal so that the power supplied to the substrate 110 can be adjusted wirelessly from the outside ( FIG. 3 ), and may include a controller that controls supply of the power according to the wireless signal received through the antenna 340.
  • the positions of the light emitting part 210, the opening 220, and the power supply 300 mounted on the outer face of the housing 200 may be determined depending on design specifications and/or customers' requests.
  • the light emitting part 210 may be provided on the bottom face of the housing 200, and the opening 200 may be formed to be inclined from one end of the bottom face toward the top side, and the outer face, on which the power supply 300 is mounted, may be formed to be inclined from the other end of the bottom face toward the top side.
  • FIG. 3 illustrates a fixing frame 250 applied to an LED lighting device according to one embodiment of the present invention
  • FIG. 7 illustrates the fixing frame 250 in a disassembled state.
  • the fixing frame 250 has a configuration that is divided into a plurality of frames. That is, the fixing frame 250 is formed generally in a window frame shape by assembling a plurality of bent frames 251 and linear frames 252 with each other.
  • bent frames 251 come in contact with apexes of the cover 240 and edges around the apexes, respectively, and the linear frames 252 come in contact with the edges of the cover 240 between the bent frames 251, respectively (see FIGS. 3 and 7 ).
  • each of the bent frames 251 and the linear frames 252 is coupled around the bottom light emitting part 210 of the housing 200 through coupling mechanisms, such as bolts.
  • the bent frames 251 and the linear frames 252 may be coupled to be partly overlapped, and the overlapped parts may be provided with stepped portions 253 having complementary shapes to be engaged with each other.
  • the bent frames 251 may be assembled to the housing 200 with the cover 240 being interposed therebetween, and the linear frames 252 may be assembled to the housing 200.
  • the stepped portion 253 formed in each end portion of a linear frame 252 may be in contact with the corresponding stepped portion 253 of a bent frame 251 to be engaged with the stepped portion 253, and the edge of the linear frame 252 may be substantially in close contact with the bent frame 251 to be fixed.
  • bent frames 251 and the linear frames 252 are fixed to each other through the close contact and fixation between the stepped portions 253, the use of bolts for fixing opposite end portions of the bent frames 251 and the opposite end portions of the linear frames 252 may be omitted.
  • the time required for an assembling process can be shortened and the manufacturing costs can be reduced.
  • the fixing frame 250 can be used merely by changing the lengths of the linear frames 252 to be suitable for the size.
  • the divided fixing frame 250 it is not necessary to produce various frames by models so that the production costs can be reduced.
  • a fixing frame produced in an integral form may be deformed during production
  • the divided fixing frame 250 according to one embodiment of the present invention does not tend to be deformed since it is divided.
  • the divided fixing frame 250 may be easily stored by reducing the volume thereof.
  • FIG. 8 is a perspective view of an LED lighting device according to another embodiment of the present invention
  • FIG. 9 is a side view of the LED lighting device of FIG. 8
  • FIG. 10 is a view illustrating a part of the LED lighting device of FIG. 9 in an enlarged scale.
  • an LED lighting device according to another embodiment of the present invention further includes an angle adjusting unit 400 coupled to the lighting unit 100 so as to tilt and pivot the LED lighting device according to the above-mentioned embodiments.
  • the angle adjusting unit 400 includes a first pivot bracket 410 fixed to one side end of the rear face of the lighting unit 100, a second pivot bracket 410 fixed to the other side end of the rear face of the lighting unit 100, a pivot fame 420 pivotally connected with the first pivot bracket 410 at one end and pivotally connected with the second pivot bracket at the other end, and an arm socket 430 coupled to a part of the pivot frame 420 to be attachable/detachable, and joined with a light stem (see FIGS. 8 and 9 ).
  • the arm socket 430 allows an assembled structure of the lighting unit 100, the housing 200, and the power supply 300 to be pivoted according to the joined angle.
  • the pivot brackets 410 include a rotation shaft 412 at the centers thereof, in which the rotation shaft penetrates a part of the pivot frame 420 to be fixed to a side face of the lighting unit 100.
  • Each of the pivot brackets 410 is provided with a circular arc-shaped penetration part 411 with the rotation shaft 412 as the center.
  • the pivot frame 420 may be fixed not to be pivoted by tightening an anchoring bolt 421 coupled to one or each of the pivot brackets 410 through the penetration part 411 in a state where the pivot angle of the pivot frame 420 is properly adjusted.
  • the pivot brackets 410 has a "U" shape in a plan view, and the arm socket 430 may be coupled to the face of the pivot frame 420, which is parallel with the lighting unit 100.
  • the arm socket 430 may be substituted by sockets or fastening members having various shapes or profiles as needed.
  • the light emission direction may be adjusted regardless of an installation position ( FIG. 8 ).
  • the LED lighting devices according to the embodiments of the present invention are applicable to various fields including a street lamp, a ceiling lamp, a harbor lamp, and a park lamp. That is, the LED lighting devices according to the embodiments of the present invention may be installed on a pillar of a street lamp, a wall or a ceiling, for example.
  • the LED lighting device according to one embodiment of the present invention may be freely adjusted vertically so as to achieve a proper light distribution. For example, the LED lighting device may be adjusted from 70 degrees to 110 degrees.
  • FIG. 11 is a cross-sectional view of an LED lighting device according to one embodiment of the present invention.
  • the metal plate 130 is inclined with respect to the ground as described above, and inclined by an angle "a" with respect to a direction perpendicular to the light emitting part 210.
  • the inclined angle "a” is determined by taking the illuminance in the directly downward direction of the light emitting part 210 and the range of the inclined angle "a” may be properly adjusted with reference to design specifications such as a predetermined light distribution.
  • the amount of light directly emitted from the LED chips 111 to the light emitting part 210 is too little to obtain a desired light distribution.
  • the inclined angle "a" is zero (0) degrees as illustrated in FIG. 12
  • most of the emitted light will be the light reflected through the reflecting part 230 and merely a part of the emitted light will be directly emitted from the lighting unit.
  • it will be difficult to obtain a suitable light distribution.
  • the inclined angle "a” is too large, the amount of light directly emitted from the light emitting part 210 will be too large to obtain the desired light distribution.
  • the inclined angle "a" is 45 degrees as illustrated in FIG.
  • the inclined angle "a" may be but not exclusively larger than zero (0) degrees and smaller than 45 degrees. This limit for the inclined angle "a” is determined in consideration of the fact that due to the use of low power LEDs, the present invention uses more LEDs than the prior art, and thus, the necessity to control the light distribution is high.
  • the ratio between the height "x" of the peak of the reflecting part 231 from the light emitting part 210 and the length "y” from the intersection point between the reflecting part and the light emitting part 210 to the intersection point of the light emitting part 210 and the straight line also has an influence on the light distribution characteristic of the present invention ( FIG. 11 ).
  • the ratio of y/x in the lighting device of FIG. 13 is relatively large compared to that in the lighting device of FIG. 12 and thus, the lighting devices become different from each other in terms of the light distribution characteristic.
  • the length "y” and the height “x” may be preferably set to implement the pre-set light distribution characteristic when the light emitted through the light emitting part 210.
  • the reflecting part 230 is designed such that the length "y" exceeds two times the height "x" and smaller than seven times the height "x". A more excellent light distribution characteristic can be obtained in this aspect ratio.
  • the ratio in luminous flux between the light directly distributed from the light sources (direct light) and the light distributed by being reflected through the reflecting part (reflected light) may be adjusted in a range of 4:6 to 6:4.
  • FIG. 14 illustrates a light distribution diagram and a direct downward illuminance diagram of a lighting device according to one embodiment of the present invention.
  • the lighting device used 0.2 watt low-power LED chips, the power consumption of the lighting device was 300 watt, and the ratio in luminous flux between direct light and reflected light was 51.4:48.6.
  • the light distribution diagram and the directly downward illuminance diagram illustrated in FIG. 14 and the ratio in luminous flux between the direct light and the reflected light can be obtained by properly adjusting, for example, the inclined angle "a" and the ratio of y/x as described above.
  • Still another embodiment of the present invention provides an LED lighting device including: a lighting unit including a substrate, on which a plurality of low-power LED chips are mounted; a housing including a bottom face, a first inclined face formed an acute angle with the bottom face, and a second inclined face connected with the first inclined face, opposite ends of the bottom face, the first inclined face, and the second inclined face are connected with each other to form an inner space defined by the bottom face, the first inclined face, and the second face as boundaries; and a reflecting part on an inner face of the housing to reflect light generated from the lighting unit. At least a part of the lighting unit is inserted through a part of the first inclined face such that the low-power LED chips are directed to the inner space of the housing.
  • each of the lighting unit and the power supply is capable of being thermally isolated from the other structural elements and individually releasing (radiating) heat so that thermal conduction between the lighting unit and the power supply and hence reduction of the lifespan can be suppressed.
  • the housing may be made of a material having a relatively low thermal conductivity through injection molding, the thermal conduction between the lighting unit and the power supply can be suppressed.
  • the heat insulation sealing unit configured to block thermal conduction is disposed between the lighting unit and the housing, the thermal conduction between the lighting unit and the housing (and the power supply) can be suppressed.
  • the housing includes a modified type of a frame that fixes the cover that covers the light emitting face, the deformation and damage of the frame can be prevented, thereby improving the productivity.
  • the lighting unit and the power supply can be manufactured in the form of separated pieces, an optimized weight and structure can be implemented.
  • the housing, the lighting unit, and the power supply can be manufactured in the form of separated pieces, the productivity can be enhanced at the time of mass production and hence the manufacturing costs can be reduced.
  • the LED lighting devices of some embodiments may further include the angle adjusting unit pivotally coupled with the lighting unit, in which since the structure or shape of the arm socket assembled with the pivot bracket of the angle adjusting unit is variable, the illumination direction may be maintained regardless of the installation position of the lighting device, such as a ground, a ceiling, or a wall. Accordingly, the LED lighting devices can be applicable to various illumination fields and can be used for various purposes. In addition, even if low-power LED chips are used, the LED lighting devices may obtain a desired light distribution, heat generation caused by the use of the high-power LED chips can be reduced, and the weight and volume of the LED lighting devices can be reduced. In addition, since the LED lighting devices can be wirelessly controlled in terms of illumination, it is very convenient to operate the LED lighting devices.
  • the lighting device may be used for a floodlighting device with high-output illumination of 100 watts or more.
  • the floodlighting device refers to a lighting device that collects light emitted from a light source so as to illuminate a distant place and is mainly used as a lamp for a vehicle or a ship which illuminates a distant location or lamps for external walls of building, an outdoor work area or a sport facility, for example.
  • an outdoor floodlighting device has a large scale and consumes a very large amount of resource and power. Thus, it is necessary to reduce the consumption of resource and power as much as possible.
  • the lighting devices according to the embodiments of the present invention can achieve desired heat radiation and light distribution characteristics with a relatively size, and thus, can be used more efficiently in floodlighting.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
EP14864495.8A 2013-11-22 2014-11-21 Appareil d'éclairage à del Withdrawn EP3076072A4 (fr)

Applications Claiming Priority (3)

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KR20140015569 2014-02-11
PCT/KR2014/011290 WO2015076625A1 (fr) 2013-11-22 2014-11-21 Appareil d'éclairage à del

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AU (1) AU2014353710B2 (fr)
CA (1) CA2931358C (fr)
PH (1) PH12016500942A1 (fr)
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WO2015076625A1 (fr) 2015-05-28
EP3076072A4 (fr) 2017-07-19
JP6339199B2 (ja) 2018-06-06
CA2931358A1 (fr) 2015-05-28
KR20150071009A (ko) 2015-06-25
RU2016124536A (ru) 2017-12-25
AU2014353710A1 (en) 2016-06-16
ZA201603808B (en) 2018-07-25
PH12016500942A1 (en) 2016-06-27
CN105745491A (zh) 2016-07-06
KR101693221B1 (ko) 2017-01-05
AU2014353710B2 (en) 2016-12-01
RU2648013C2 (ru) 2018-03-21
JP2017500697A (ja) 2017-01-05
CA2931358C (fr) 2018-10-02

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