WO2015074341A1 - 一种以酚醛树脂为壁材的环氧微胶囊的制备方法 - Google Patents
一种以酚醛树脂为壁材的环氧微胶囊的制备方法 Download PDFInfo
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- WO2015074341A1 WO2015074341A1 PCT/CN2014/071279 CN2014071279W WO2015074341A1 WO 2015074341 A1 WO2015074341 A1 WO 2015074341A1 CN 2014071279 W CN2014071279 W CN 2014071279W WO 2015074341 A1 WO2015074341 A1 WO 2015074341A1
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- wall material
- epoxy
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- phenolic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
- B01J13/02—Making microcapsules or microballoons
- B01J13/06—Making microcapsules or microballoons by phase separation
- B01J13/14—Polymerisation; cross-linking
Definitions
- the invention relates to the field of self-repairing materials, in particular to the field of self-repairing concrete, in particular to a method for preparing epoxy microcapsules using phenolic resin as a wall material.
- the self-healing material is a smart material that can repair its own defects such as voids and cracks.
- a main method for realizing the self-repairing function of materials is to pre-embed the repairing agent in the matrix material. When the matrix material is cracked or void due to some physical or chemical factors, the repairing agent will be automatically released. Self-repairing defects.
- microcracks There are a large number of microcracks in the concrete members, and these microcracks are difficult to be detected and manually repaired. In humid atmospheres, especially in coastal environments, their presence accelerates the corrosion of steel bars, reduces the durability of concrete works, and shortens project life.
- Phenolic resin is a polymer widely used in the industry, which is obtained by a polycondensation reaction of a phenol with an aldehyde. According to a synthesis method, a phenol resin is classified into a Novolak resin and a Resole resin. Novolak resin requires the addition of a curing agent to crosslink to form the wall of the capsule, while the Resole resin can be cured to form a wall by heating and conditioning. Since the curing agent of Novolak resin also cures the epoxy, a resole resin such as a phenolic resin is generally used as a phenolic precursor to prepare an epoxy microcapsule with a phenolic resin as a wall material.
- the first-order Resole resin is sensitive to pH when it is acidified and cured.
- the inappropriate pH value often does not form a phenolic capsule wall.
- a large amount of methylol in the resole resin is easy to be epoxy.
- the epoxy end group of the resin undergoes an addition reaction to cure the epoxy. Therefore, it is difficult to prepare an epoxy microcapsule using a phenol resin as a wall material by using a resole resin as a precursor.
- the object of the present invention is to disclose a method for preparing an epoxy microcapsule using a phenolic resin as a wall material to solve the deficiencies of the prior art.
- the technical solution adopted by the present invention to solve the above technical problem is to provide a method for preparing an epoxy microcapsule using a phenolic resin as a wall material, comprising the following steps:
- step S3 adding polyphenol, curing accelerator, pH adjuster II to the solution obtained in step S2, adjusting the pH to 2 ⁇ 4, reacting for 2 ⁇ 3 hours, cooling, standing, filtering, drying, then obtaining phenolic resin Epoxy microcapsules for wall materials.
- the beneficial effects of the technical scheme of the present invention are as follows: (1) selecting a surfactant having a specific molecular structure as an emulsifier, which not only can emulsify the epoxy resin well under the reaction condition, but also is a good cover for the epoxy group.
- the agent prevents the reaction of the epoxy group with a large amount of methylol groups contained in the phenolic resin precursor A-step Resole resin; (2) the specific process conditions of the present invention also effectively prevent the curing reaction between the core material and the wall material It ensures the formation of microcapsules; (3) phenolic resin is obtained by polycondensation reaction of phenol and aldehyde, and the process is simple and inexpensive; the cured phenolic is a highly crosslinked brittle structure polymer, which meets the requirements of stress triggering. (4) The epoxy microcapsules prepared by the method with phenolic resin as the wall material have good morphology and high coverage.
- Example 1 is an SEM image of an epoxy microcapsule prepared by using a phenol resin as a wall material in Example 1 of the present invention
- Example 2 is an SEM image of an epoxy microcapsule prepared by using a phenol resin as a wall material in Example 2 of the present invention.
- the object of the present invention is to disclose a method for preparing an epoxy microcapsule using a phenolic resin as a wall material to solve the deficiencies of the prior art.
- the technical solution adopted by the present invention to solve the above technical problem is to provide a method for preparing an epoxy microcapsule using a phenolic resin as a wall material, comprising the following steps:
- step S3 adding polyphenol, curing accelerator, pH adjuster II to the solution obtained in step S2, adjusting the pH to 2 ⁇ 4, reacting for 2 ⁇ 3 hours, cooling, standing, filtering, drying, then obtaining phenolic resin Epoxy microcapsules for wall materials.
- the emulsifier in the step S1 is a polyhydroxy compound selected from at least one of polyvinyl alcohol, polyacryl alcohol, polysaccharide, and alkyl glycoside. Further, the mass ratio of the epoxy resin, the emulsifier, and the water in the step S1 is 1: 0.05 ⁇ 0.2: 10 ⁇ 30; for sufficient emulsification, the stirring time is 30 ⁇ 60 min.
- the phenol in the step S2 is at least one selected from the group consisting of phenol, cresol and mixed cresol, preferably phenol;
- the aldehyde is at least one selected from the group consisting of formaldehyde, paraformaldehyde, furfural and acetaldehyde, preferably formaldehyde.
- the molar ratio of phenol to aldehyde is 1: 1.2 ⁇ 2.5, preferably the molar ratio is 1:2; the mass ratio of the phenol to the epoxy resin in the step S1 is 1:1.5 ⁇ 12.
- the pH adjuster I in the step S2 is preferably 5 A wt% aqueous ammonia solution is adjusted so that the pH of the reaction solution in this step is 7-9.
- the polyphenol in step S3 is preferably resorcinol, tea polyphenol, and the amount of the polyphenol is 5.5 to 30 of the aldehyde in step S2. %; the curing accelerator is ammonium chloride, the mass fraction of the curing accelerator is 10-40% of the aldehyde in S2; the pH adjuster II in step S3 is preferably 3.7 The aqueous solution of wt% hydrochloric acid is adjusted so that the pH of the reaction solution in this step is 2 to 4.
- the epoxy microcapsules prepared by the present invention having a phenolic resin as a wall material have a good morphology and a high coating ratio, and the present invention will be further explained below in conjunction with specific examples.
- reaction liquid After the reaction liquid is cooled, it is allowed to stand 30 Min, filter, dry at 40 ⁇ 50 °C for 1-2 hours to obtain the target product. Scanning electron microscope observation, as shown in Figure 1, the formed microcapsule particles in good shape, high coverage, particle size between 30 ⁇ 60 microns.
- Example 2 was essentially the same as Example 1, except that the pH was adjusted to 8 in the stage A resole phenolic resin formation stage and the pH was adjusted to 3 in the cross-linking curing stage. Specific steps are as follows:
- the reaction liquid After the reaction liquid is cooled, it is allowed to stand 30 Min, filter, dry at 40 ⁇ 50 °C for 1-2 hours to obtain the target product. Scanning electron microscope observation, as shown in Fig. 2, the microcapsules formed have a particle size of 10 to 40 ⁇ m, and the morphology is good, and the coating ratio is high. Compared with the product obtained in Example 1, the capsule wall is wrinkled, and there is no The smoothness of Example 1.
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- Chemical & Material Sciences (AREA)
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- Dispersion Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing Of Micro-Capsules (AREA)
Abstract
Description
Claims (10)
- 一种以酚醛树脂为壁材的环氧微胶囊的制备方法,包括以下步骤:S1:将环氧树脂、乳化剂、水混合,搅拌制成乳液;S2:在所述乳液中加入酚、醛和pH值调节剂I,调节pH值至7 ~ 9,搅拌;S3:在步骤S2所得溶液中加入多元酚、固化促进剂、pH值调节剂II,调节pH值至2 ~ 4,反应2~3小时,经冷却、静置、过滤、干燥,即得以酚醛树脂为壁材的环氧微胶囊。
- 根据权利要求1所述的制备方法,其特征在于,所述乳化剂为多羟基化合物,所述多羟基化合物选自聚乙烯醇、聚丙烯醇、多聚糖、烷基糖苷中的一种。
- 根据权利要求1或2所述的制备方法,其特征在于,步骤S1中所述环氧树脂、乳化剂、水的质量比为1: 0.05~ 0.2 : 10~30。
- 根据权利要求1所述的制备方法,其特征在于,步骤S2中所述酚选自苯酚、甲酚、混甲酚中的至少一种;所述醛选自甲醛、多聚甲醛、糠醛、乙醛中的至少一种;所述酚与所述醛的摩尔比为1: 1.2~2.5。
- 根据权利要求1所述的制备方法,其特征在于,步骤S2中所述酚与步骤S1中所述环氧树脂的质量比为1: 1.5~12。
- 根据权利要求1所述的制备方法,其特征在于,步骤S3中所述多元酚为间苯二酚、茶多酚,所述多元酚的质量分数为步骤S2中所述醛的5.5~30 %。
- 根据权利要求1所述的制备方法,其特征在于,步骤S3中所述固化促进剂为氯化铵,所述固化促进剂的质量分数为步骤S2中所述醛的10~40%。
- 根据权利要求1所述的制备方法,其特征在于,步骤S2中所述pH值调节剂I为5 wt%氨水水溶液,所述pH值调节剂II为3.7 wt%盐酸水溶液。
- 根据权利要求1所述的制备方法,其特征在于,步骤S1中所述搅拌的时间为30~60 min。
- 一种根据权利要求1~9中任一项所述的制备方法所制备的以酚醛树脂为壁材的环氧微胶囊,其特征在于,所述微胶囊的芯材和壁材的质量比为0.5~3 : 1。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310602919.3A CN103599739B (zh) | 2013-11-25 | 2013-11-25 | 一种以酚醛树脂为壁材的环氧微胶囊的制备方法 |
| CN201310602919.3 | 2013-11-25 |
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| WO2015074341A1 true WO2015074341A1 (zh) | 2015-05-28 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113813890A (zh) * | 2021-08-31 | 2021-12-21 | 无锡拜纳高分子材料科技有限公司 | 一种微囊化液体潜伏性单组分环氧固化剂的制备工艺方法 |
| CN114989786A (zh) * | 2022-06-09 | 2022-09-02 | 纯钧新材料(深圳)有限公司 | 沙林树脂相变微胶囊及其制备方法 |
| CN115678524A (zh) * | 2022-10-11 | 2023-02-03 | 中国石油天然气集团有限公司 | 一种油气井固井用套管防腐复合剂、胶囊及其制备方法和应用 |
| CN120854050A (zh) * | 2025-09-25 | 2025-10-28 | 长春职业技术大学 | 一种高性能多功能电缆及其制备方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111588116A (zh) * | 2020-05-14 | 2020-08-28 | 广州新济薇娜生物科技有限公司 | 香味缓释微囊口罩及其制备方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH054873A (ja) * | 1991-06-24 | 1993-01-14 | Shinagawa Refract Co Ltd | 不定形耐火物 |
| WO2012067097A1 (ja) * | 2010-11-16 | 2012-05-24 | 日本ケミコン株式会社 | 難燃性電解コンデンサ |
| CN103301789A (zh) * | 2013-06-07 | 2013-09-18 | 深圳大学 | 一种以酚醛树脂为壁材用于自修复材料的微胶囊的制备方法 |
| CN103304775A (zh) * | 2013-06-03 | 2013-09-18 | 深圳大学 | 环氧微胶囊及其制备方法 |
| CN103331133A (zh) * | 2013-06-07 | 2013-10-02 | 深圳大学 | 一种以聚脲为壁材的环氧微胶囊及其制备方法 |
-
2013
- 2013-11-25 CN CN201310602919.3A patent/CN103599739B/zh not_active Expired - Fee Related
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2014
- 2014-01-23 WO PCT/CN2014/071279 patent/WO2015074341A1/zh not_active Ceased
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH054873A (ja) * | 1991-06-24 | 1993-01-14 | Shinagawa Refract Co Ltd | 不定形耐火物 |
| WO2012067097A1 (ja) * | 2010-11-16 | 2012-05-24 | 日本ケミコン株式会社 | 難燃性電解コンデンサ |
| CN103304775A (zh) * | 2013-06-03 | 2013-09-18 | 深圳大学 | 环氧微胶囊及其制备方法 |
| CN103301789A (zh) * | 2013-06-07 | 2013-09-18 | 深圳大学 | 一种以酚醛树脂为壁材用于自修复材料的微胶囊的制备方法 |
| CN103331133A (zh) * | 2013-06-07 | 2013-10-02 | 深圳大学 | 一种以聚脲为壁材的环氧微胶囊及其制备方法 |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113813890A (zh) * | 2021-08-31 | 2021-12-21 | 无锡拜纳高分子材料科技有限公司 | 一种微囊化液体潜伏性单组分环氧固化剂的制备工艺方法 |
| CN113813890B (zh) * | 2021-08-31 | 2024-01-23 | 无锡拜纳高分子材料科技有限公司 | 一种微囊化液体潜伏性单组分环氧固化剂的制备工艺方法 |
| CN114989786A (zh) * | 2022-06-09 | 2022-09-02 | 纯钧新材料(深圳)有限公司 | 沙林树脂相变微胶囊及其制备方法 |
| CN114989786B (zh) * | 2022-06-09 | 2023-08-15 | 纯钧新材料(深圳)有限公司 | 沙林树脂相变微胶囊及其制备方法 |
| CN115678524A (zh) * | 2022-10-11 | 2023-02-03 | 中国石油天然气集团有限公司 | 一种油气井固井用套管防腐复合剂、胶囊及其制备方法和应用 |
| CN115678524B (zh) * | 2022-10-11 | 2023-10-10 | 中国石油天然气集团有限公司 | 一种油气井固井用套管防腐复合剂、胶囊及其制备方法和应用 |
| CN120854050A (zh) * | 2025-09-25 | 2025-10-28 | 长春职业技术大学 | 一种高性能多功能电缆及其制备方法 |
| CN120854050B (zh) * | 2025-09-25 | 2025-11-28 | 长春职业技术大学 | 一种高性能多功能电缆及其制备方法 |
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| CN103599739B (zh) | 2015-10-21 |
| CN103599739A (zh) | 2014-02-26 |
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