WO2015062118A1 - 一种导热装置、背光模组及液晶显示器 - Google Patents

一种导热装置、背光模组及液晶显示器 Download PDF

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Publication number
WO2015062118A1
WO2015062118A1 PCT/CN2013/086733 CN2013086733W WO2015062118A1 WO 2015062118 A1 WO2015062118 A1 WO 2015062118A1 CN 2013086733 W CN2013086733 W CN 2013086733W WO 2015062118 A1 WO2015062118 A1 WO 2015062118A1
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Prior art keywords
led
conductive plate
heat
frame
circuit board
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PCT/CN2013/086733
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English (en)
French (fr)
Inventor
俞刚
陈仕祥
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深圳市华星光电技术有限公司
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Priority to US14/119,191 priority Critical patent/US20150116986A1/en
Publication of WO2015062118A1 publication Critical patent/WO2015062118A1/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085—Means for removing heat created by the light source from the package
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133628—Illuminating devices with cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components

Definitions

  • Heat conduction device backlight module and liquid crystal display
  • the present invention relates to the field of image display, and in particular to a heat conducting device, a backlight module, and a liquid crystal display.
  • LED as a backlight for displays is a hot topic recently, mainly different types of LED backlight technology
  • the color, brightness, life, power consumption and environmental appeal are more advantageous than the traditional cold cathode tube (CCFL), which attracts the active investment.
  • the heat dissipation problem caused by high-brightness and high-power LEDs will be the key to affecting the function of the product.
  • the heat generated by the LED components must be quickly discharged to the surrounding environment.
  • the main way to dissipate heat is to use an aluminum backing plate that dissipates heat outward.
  • the backlight module especially the side-in type structure, has no direct heat conduction path with the back plate, which results in heat conduction only by air, which affects heat conduction efficiency and heat dissipation effect.
  • the technical problem to be solved by the present invention is to provide a heat conduction device, a backlight module and a liquid crystal display which improve heat conduction efficiency and heat dissipation effect.
  • the present invention provides a heat conducting device, comprising: a collecting frame and a conductive plate which are vertically connected to each other, and the collecting frame is used for surrounding the LED and closely fitting with the mounting surface of the circuit board, and the conductive plate is used for The back panel fits snugly.
  • the collection frame and the conductive plate are both metal foils.
  • the collection frame corresponds to the conductive plate.
  • the collection frame corresponds to the LED
  • the conductive plate is an integral sheet.
  • the conductive plate corresponds to the LED
  • the collecting frame is a monolithic sheet, and an opening for accommodating the LED is formed at a position corresponding to the LED.
  • the acquisition frame and the conductive plate are integral sheets, and the collection frame forms an opening for accommodating the LED at a position corresponding to the LED.
  • the present invention also provides a backlight module, comprising: a circuit board and a plurality of LEDs spaced apart on a mounting surface of the circuit board, wherein the heat conducting device further comprises a collecting frame and a conductive plate vertically connected to each other,
  • the acquisition frame is used to surround the LED and closely fits the mounting surface of the circuit board, and the conductive plate is used to closely fit the back plate.
  • the collection frame and the conductive plate are both metal foils.
  • the collection frame corresponds to the conductive plate.
  • the collection frame corresponds to the LED
  • the conductive plate is a monolithic sheet.
  • the conductive plate corresponds to the LED
  • the collecting frame is an integral sheet, and an opening for accommodating the LED is formed at a position corresponding to the LED.
  • the acquisition frame and the conductive plate are integral sheets, and the collection frame forms an opening for accommodating the LED at a position corresponding to the LED.
  • the present invention also provides a liquid crystal display, comprising: a backlight module, the backlight module comprising a circuit board and a plurality of LEDs spaced apart on a mounting surface of the circuit board, wherein the heat conduction device further comprises a mutual vertical
  • the connecting frame and the conductive plate are connected, and the collecting frame is used for surrounding the LED and closely fitting with the mounting surface of the circuit board, and the conductive plate is used for closely fitting with the backing plate.
  • the collection frame and the conductive plate are both metal foils.
  • the collection frame corresponds to the conductive plate.
  • the collection frame corresponds to the LED
  • the conductive plate is a monolithic sheet.
  • the conductive plate corresponds to the LED
  • the collecting frame is an integral sheet, and an opening for accommodating the LED is formed at a position corresponding to the LED.
  • the acquisition frame and the conductive plate are integral sheets, and the collection frame forms an opening for accommodating the LED at a position corresponding to the LED.
  • the invention overcomes the defect that there is no effective heat conduction path between the circuit board and the back board, and by disposing the heat conducting device, the heat accumulated on the circuit board is quickly and massively transmitted to the back board for heat dissipation, thereby improving the heat conduction efficiency and the heat dissipation effect.
  • FIG. 1 is a schematic view showing the assembly structure of a heat conducting device and a circuit board according to an embodiment of the present invention.
  • FIG. 2 is a schematic perspective view of a heat conducting device according to an embodiment of the present invention.
  • FIG. 3 is a schematic view showing the assembly structure of the heat conducting device and the circuit board according to the second embodiment of the present invention.
  • FIG. 4 is a schematic view showing the assembly structure of a heat conducting device and a circuit board according to an embodiment of the present invention.
  • FIG. 5 is a schematic view showing the assembly structure of the fourth heat conducting device and the circuit board according to the embodiment of the present invention.
  • the LED module is the main component of heat generation in the liquid crystal display, how to dissipate the heat quickly is a common problem faced by the industry.
  • Multiple LEDs are mounted on the board to form a backlight, and the heat generated by the LEDs is first concentrated on the board.
  • the idea of the present invention to overcome the defects of the prior art is to establish a heat conduction path between the circuit board and the back board, and directly derive the accumulated heat from the circuit board. To improve thermal conductivity and heat dissipation.
  • the heat conducting device 3 provided in the first embodiment of the present invention comprises a collecting frame 31 and a conducting plate 32 which are perpendicular to each other.
  • the collecting frame 31 is used for surrounding the LED 2 and is closely attached to the mounting surface 10 of the circuit board 1.
  • the conductive plate 32 is used for Close to the back panel.
  • the acquisition frame 31 and the conductive plate are in the form of a thin piece, both made of metal.
  • the collection frame 31 can also be set to have a certain thickness, so as not to exceed the height of the LED 2, and the LED 2 illumination effect is not affected.
  • the circuit board 1 is perpendicular to the backplane.
  • the circuit board 1 or the backplane is not in direct contact (the heat on the circuit board 1 cannot be directly transmitted to the backplane), or only in the The thickness of the circuit board 1 is in contact with the backplane (the contact area is small, resulting in poor thermal conductivity), but the heat conduction device having the "L" shape in cross section provided by the present invention is equivalent to establishing a heat conduction path, that is, the circuit board 1
  • the heat on the upper side is folded by the collection frame 31 which is closely attached to the mounting surface 10. To the "conduction plate 32, and the conductive plate 32 is bonded to the backing plate, heat is conducted to the backing plate.
  • the collecting frame 31 surrounds the LED 2, collecting heat from the circuit board 1; the collecting frame 31 and The conductive plate 32 is made of a metal material, so that the heat collected by the collecting frame 31 is also conducted to the conductive plate 32 in real time; and the conductive plate 32 is in close contact with the backing plate to conduct heat to the backing plate for outward emission.
  • the acquisition frame 31 corresponds to the conductive plate 32, and the number is the same as the number of the LEDs 2, that is, one acquisition frame 31 surrounds one LED 2, and conducts heat to the conductive plate 32 connected thereto.
  • Both the acquisition frame 31 and/or the conductive plate 32 can be made in one piece, which is illustrated below by three embodiments.
  • the acquisition frame 31 corresponds to the LED 2, and each of the acquisition frames 31 surrounds one LED 2, and the conductive plate 32 is no longer the one shown in FIG. A correspondence, but a monolithic sheet. This also increases the contact area between the conductive plate 32 and the back plate, so that heat is more transmitted to the back plate, further improving the heat conduction efficiency and the heat dissipation effect.
  • the conductive plate 32 corresponds to the LED 2
  • the acquisition frame 31 is an integral sheet disposed along the mounting surface 10 of the circuit board 1, at a position corresponding to the LED 2.
  • An opening is formed to accommodate the corresponding LED 2.
  • the integral acquisition frame 31 can increase the contact area with the circuit board 1, so that the heat on the circuit board 1 is more collected by the acquisition frame 31, further improving the heat conduction efficiency and the heat dissipation effect.
  • the fourth embodiment of the present invention combines the advantages of the second and third embodiments of the present invention, and the acquisition frame 31 and the conductive plate 32 are integrally formed, and the collection frame 31 is mounted along the mounting surface of the circuit board 1.
  • the monolithic sheet is provided with an opening at a position corresponding to the LED 2 to accommodate the corresponding LED 2; the conductive plate 32 is also a unitary sheet.
  • the integrated acquisition frame 31 can increase the contact area with the circuit board 1, so that the heat on the circuit board 1 is more collected by the acquisition frame 31; the integrated conductive plate 32 can increase the contact area with the back plate, so that the heat is more Ground conduction to the backplane further enhances thermal conductivity and heat dissipation.
  • a plurality of LEDs 2 are disposed on the circuit board 1 at intervals, and the acquisition frame 31 and the conductive plate 32 shown in Fig. 1 are spaced apart corresponding to the LEDs 2.
  • the "integral type" of the second to fourth embodiments of the present invention is relative to the spacing arrangement shown in Fig. 1, regardless of the number of LEDs 2 - correspondingly setting the acquisition frame 31 or the conductive plate 32.
  • the fifth embodiment of the present invention provides a The backlight module includes the foregoing heat conducting device.
  • the sixth embodiment of the present invention provides a liquid crystal display device, including the foregoing backlight module.
  • the invention overcomes the defect that there is no effective heat conduction path between the circuit board and the back board.
  • the heat conduction device By providing the heat conduction device, the heat accumulated on the circuit board is quickly and massively transmitted to the back board for heat dissipation, thereby improving the heat conduction efficiency and the heat dissipation effect.

Abstract

一种导热装置、背光模组及液晶显示器，导热装置（3）包括：相互垂直连接的采集框（31）和传导板（32），采集框（31）用于围绕LED（2）以及与电路板（1）的安装面（10）紧密贴合，传导板（32）用于与背板紧密贴合。背光模组包括导热装置（3），液晶显示器包括该背光模组。电路板（1）与背板之间没有有效导热途径的缺陷，通过设置导热装置（3），将电路板上积聚的热量迅速、大量地传导至背板进行散热，提高了导热效率和散热效果。

Description

一种导热装置、 背光模组及液晶显示器
本申请要求于 2013 年 10 月 31 日提交中国专利局、 申请号为 201310527632.9、 发明名称为 "一种导热装置、 背光模组及液晶显示器" 的 中国专利申请的优先权， 上述专利的全部内容通过引用结合在本申请中。 技术领域
本发明涉及图像显示领域， 尤其涉及一种导热装置、 背光模组及液晶显 示器。
背景技术
随着 LED材料及封装技术的不断演进， 促使 LED 产品亮度不断提高， LED的应用越来越广， 以 LED作为显示器的背光源， 更是近来热门的话题， 主要是不同种类的 LED背光源技术分别在色彩、 亮度、 寿命、耗电度及环保 诉求等均比传统冷阴极管 （CCFL ) 更具优势， 因而吸引业者积极投入。
高亮度、 高功率 LED所衍生的散热问题将是影响产品功能优劣关键， LED元件的发热量须迅速排出至周遭环境。对于液晶显示器来说， 目前主要 的散热方式是采用铝质背板， 由其将热量向外散发。 但是， 背光模组尤其是 侧入式结构， 与背板之间没有直接的导热途径， 导致仅能靠空气导热， 影响 了导热效率和散热效果。
发明内容
本发明所要解决的技术问题在于，提供一种提高导热效率和散热效果的 一种导热装置、 背光模组及液晶显示器。
为了解决上述技术问题， 本发明提供一种导热装置， 其中， 包括： 相互 垂直连接的采集框和传导板， 采集框用于围绕 LED以及与电路板的安装面 紧密贴合， 传导板用于与背板紧密贴合。
其中， 采集框和传导板均为金属薄片。
其中， 采集框与传导板——对应。
其中， 采集框与 LED——对应， 传导板为整体式薄片。 其中， 传导板与 LED——对应， 采集框为整体式薄片， 在相应于 LED 的位置处形成用于容纳 LED的开口。
其中， 采集框和传导板均为整体式薄片， 采集框在相应于 LED 的位置 处形成用于容纳 LED的开口。
本发明还提供一种背光模组， 包括： 电路板以及在电路板的安装面上间 隔设置的多颗 LED, 其中， 还包括导热装置， 导热装置进一步包括相互垂直 连接的采集框和传导板， 采集框用于围绕 LED以及与电路板的安装面紧密 贴合， 传导板用于与背板紧密贴合。
其中， 采集框和传导板均为金属薄片。
其中， 采集框与传导板——对应。
其中， 采集框与 LED——对应， 传导板为整体式薄片。
其中， 传导板与 LED——对应， 采集框为整体式薄片， 在相应于 LED 的位置处形成用于容纳 LED的开口。
其中， 采集框和传导板均为整体式薄片， 采集框在相应于 LED 的位置 处形成用于容纳 LED的开口。
本发明还提供一种液晶显示器， 其中， 包括背光模组， 背光模组包括电 路板以及在电路板的安装面上间隔设置的多颗 LED，其中，还包括导热装置， 导热装置进一步包括相互垂直连接的采集框和传导板，采集框用于围绕 LED 以及与电路板的安装面紧密贴合， 传导板用于与背板紧密贴合。
其中， 采集框和传导板均为金属薄片。
其中， 采集框与传导板——对应。
其中， 采集框与 LED——对应， 传导板为整体式薄片。
其中， 传导板与 LED——对应， 采集框为整体式薄片， 在相应于 LED 的位置处形成用于容纳 LED的开口。
其中， 采集框和传导板均为整体式薄片， 采集框在相应于 LED 的位置 处形成用于容纳 LED的开口。
本发明克服了电路板与背板之间没有有效导热途径的缺陷，通过设置导 热装置， 将电路板上积聚的热量迅速、 大量地传导至背板进行散热， 提高了 导热效率和散热效果。 附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案， 下面将对实 施例或现有技术描述中所需要使用的附图作简单地介绍， 显而易见地， 下面 描述中的附图仅仅是本发明的一些实施例， 对于本领域普通技术人员来讲， 在不付出创造性劳动的前提下， 还可以根据这些附图获得其他的附图。
图 1是本发明实施例一导热装置与电路板装配结构示意图。
图 2是本发明实施例一导热装置的立体结构示意图。
图 3是本发明实施例二导热装置与电路板装配结构示意图。
图 4是本发明实施例三导热装置与电路板装配结构示意图。
图 5是本发明实施例四导热装置与电路板装配结构示意图。
具体实施方式
下面参考附图对本发明的优选实施例进行描述。
由于在液晶显示器中， LED模组是热量的主要产生元件，如何将热量迅 速散发出去是业界共同面对的问题。 多个 LED 间隔安装在电路板上， 形成 背光源， LED产生的热量也首先集聚在电路板上。现有技术中电路板与背板 之间没有导热途径， 因此本发明克服现有技术缺陷的思路在于， 建立电路板 与背板之间的导热途径， 直接从电路板上将积聚的热量导出， 以提高导热效 率和散热效果。
请同时参照图 1、 图 2所示，在电路板 1的安装面 10上间隔设置有多颗 LED 2, 形成背光模组。 本发明实施例一提供的导热装置 3 , 包括相互垂直 的采集框 31和传导板 32, 采集框 31用于围绕 LED 2,且与电路板 1的安装 面 10紧密贴合， 传导板 32用于与背板紧密贴合。 采集框 31和传导板为薄 片状， 均由金属制成。 采集框 31也可设置具有一定厚度， 以不超过 LED 2 高度、 不影响 LED 2发光效果为宜。
对于侧入式结构， 电路板 1系垂直于背板， 根据不同的排布方式， 电路 板 1或者与背板没有直接接触 (电路板 1上的热量无法直接传导至背板）， 或者仅仅在电路板 1的厚度方向上与背板接触（接触面积小导致导热效果不 佳）， 但通过本发明提供的截面呈 "L" 形的导热装置， 相当于建立了一条导 热途径， 即电路板 1上的热量， 经由与安装面 10紧密贴合的采集框 31 "折 向" 传导板 32, 而传导板 32是和背板贴合的， 热量经此传导到背板。 换句 话说， 采集框 31围绕在 LED 2周围， 从电路板 1采集热量； 采集框 31和传 导板 32为金属材质， 因此采集框 31采集的热量也实时被传导至传导板 32; 而传导板 32与背板紧密接触， 则将热量传导至背板， 以便向外散发。
在本实施例中， 采集框 31与传导板 32——对应， 且数量均与 LED 2 的数量相同， 即一个采集框 31围绕一个 LED 2, 并将热量传导至与之相连 的传导板 32。 采集框 31和 /或传导板 32均可做成整体式， 以下通过三个实 施例分别予以说明。
如图 3所示， 本发明实施例二中， 采集框 31与 LED 2——对应， 每个 采集框 31围绕一个 LED 2, 而传导板 32不再是图 1所示的与采集框 31— 一对应， 而是为一整体式薄片。 这样还可起到增加传导板 32与背板接触面 积， 使热量更多地传导到背板， 进一步提升导热效率和散热效果的作用。
如图 4所示， 本发明实施例三中 , 传导板 32与 LED 2——对应 , 而采 集框 31为沿电路板 1的安装面 10设置的整体式薄片，在相应于 LED 2的位 置处形成开口， 以便容纳相应的 LED 2。 整体式采集框 31可以增加与电路 板 1的接触面积， 使电路板 1上的热量更多地被采集框 31所采集， 进一步 提升导热效率和散热效果。
再请参照图 5所示，本发明实施例四结合了本发明实施例二和三的优点， 将采集框 31和传导板 32均制成整体式， 采集框 31为沿电路板 1的安装面 10设置的整体式薄片， 在相应于 LED 2的位置处形成开口， 以便容纳相应 的 LED 2; 传导板 32亦为一整体式薄片。 整体式采集框 31可以增加与电路 板 1的接触面积， 使电路板 1上的热量更多地被采集框 31所采集； 整体式 传导板 32可以增加与背板的接触面积， 使热量更多地传导到背板， 进一步 提升导热效率和散热效果。
应当说明的是， 多颗 LED 2系间隔设置在电路板 1上， 图 1所示的采集 框 31和传导板 32均相应于 LED 2而间隔设置。本发明实施例二至四所说的 "整体式"是相对于图 1所示的间隔设置结构而言， 无需考虑 LED 2的数量 去——对应设置采集框 31或传导板 32。
基于本发明实施例一至四关于导热装置的说明，本发明实施例五提供一 种背光模组，包括前述的导热装置；本发明实施例六提供一种液晶显示装置， 包括前述的背光模组。
本发明克服了电路板与背板之间没有有效导热途径的缺陷，通过设置导 热装置， 将电路板上积聚的热量迅速、 大量地传导至背板进行散热， 提高了 导热效率和散热效果。
以上所揭露的仅为本发明较佳实施例而已， 当然不能以此来限定本发明 之权利范围， 因此依本发明权利要求所作的等同变化， 仍属本发明所涵盖的 范围。

Claims

权 利 要 求
1、 一种导热装置， 其中， 包括： 相互垂直连接的采集框和传导板， 所 述采集框用于围绕 LED 以及与电路板的安装面紧密贴合， 所述传导板用于 与背板紧密贴合。
2、 根据权利要求 1 所述的导热装置， 其中， 所述采集框和传导板均为 金属薄片。
3、 根据权利要求 1 所述的导热装置， 其中， 所述采集框与传导板一一 对应。
4、 根据权利要求 1所述的导热装置， 其中， 所述采集框与 LED——对 应， 所述传导板为整体式薄片。
5、 根据权利要求 1所述的导热装置， 其中， 所述传导板与 LED——对 应， 所述采集框为整体式薄片， 在相应于 LED的位置处形成用于容纳 LED 的开口。
6、 根据权利要求 1 所述的导热装置， 其中， 所述采集框和传导板均为 整体式薄片 ,所述采集框在相应于 LED的位置处形成用于容纳 LED的开口。
7、 一种背光模组， 包括： 电路板以及在所述电路板的安装面上间隔设 置的多颗 LED, 其中， 还包括导热装置， 所述导热装置进一步包括相互垂直 连接的采集框和传导板， 所述采集框用于围绕 LED以及与电路板的安装面 紧密贴合， 所述传导板用于与背板紧密贴合。
8、 根据权利要求 7所述的背光模组， 其中， 所述采集框和传导板均为 金属薄片。
9、 根据权利要求 7所述的背光模组， 其中， 所述采集框与传导板一一 对应。
10、 根据权利要求 7所述的背光模组， 其中， 所述采集框与 LED—— 对应， 所述传导板为整体式薄片。
11、 根据权利要求 7所述的背光模组， 其中， 所述传导板与 LED—— 对应，所述采集框为整体式薄片 ,在相应于 LED的位置处形成用于容纳 LED 的开口。 整体式薄片，所述采集框在相应于 LED的位置处形成用于容纳 LED的开口。
13、 一种液晶显示器， 其中， 包括背光模组， 所述背光模组包括电路板 以及在所述电路板的安装面上间隔设置的多颗 LE D ,其中，还包括导热装置， 所述导热装置进一步包括相互垂直连接的采集框和传导板， 所述采集框用于 围绕 LED以及与电路板的安装面紧密贴合， 所述传导板用于与背板紧密贴 合。
14、 根据权利要求 13所述的液晶显示器， 其中， 所述采集框和传导板 均为金属薄片。
15、 根据权利要求 13所述的液晶显示器， 其中， 所述采集框与传导板 一一对应。
16、 根据权利要求 13所述的液晶显示器， 其中， 所述采集框与 LED— 一对应， 所述传导板为整体式薄片。
17、 根据权利要求 13所述的液晶显示器， 其中， 所述传导板与 LED— 一对应， 所述采集框为整体式薄片， 在相应于 LED的位置处形成用于容纳 LED的开口。
18、 根据权利要求 13所述的液晶显示器， 其中， 所述采集框和传导板 均为整体式薄片， 所述采集框在相应于 LED的位置处形成用于容纳 LED的 开口。
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