WO2015056825A1 - Procédé de fabrication de carte de circuit imprimé souple par traitement thermique à haute température sur un substrat résistant à la chaleur et carte de circuit imprimé souple ainsi obtenue - Google Patents

Procédé de fabrication de carte de circuit imprimé souple par traitement thermique à haute température sur un substrat résistant à la chaleur et carte de circuit imprimé souple ainsi obtenue Download PDF

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Publication number
WO2015056825A1
WO2015056825A1 PCT/KR2013/009321 KR2013009321W WO2015056825A1 WO 2015056825 A1 WO2015056825 A1 WO 2015056825A1 KR 2013009321 W KR2013009321 W KR 2013009321W WO 2015056825 A1 WO2015056825 A1 WO 2015056825A1
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WO
WIPO (PCT)
Prior art keywords
heat
circuit board
resistant substrate
conductive
printed circuit
Prior art date
Application number
PCT/KR2013/009321
Other languages
English (en)
Korean (ko)
Inventor
박찬후
Original Assignee
박찬후
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020130122528A external-priority patent/KR101404681B1/ko
Application filed by 박찬후 filed Critical 박찬후
Publication of WO2015056825A1 publication Critical patent/WO2015056825A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/016—Temporary inorganic, non-metallic carrier, e.g. for processing or transferring

Definitions

  • the present invention relates to a method of manufacturing a flexible printed circuit board and a flexible printed circuit board. Specifically, after forming a printed circuit pattern with a conductive paste on a heat resistant substrate, a conductive electrode is formed through high temperature heat treatment, and the conductive electrode is applied to the flexible film. It transfers and manufactures a flexible printed circuit board.
  • printed circuit boards are divided into rigid circuit boards and flexible printed circuit boards. Recently, the use of flexible printed circuit boards that are light in weight and flexible in accordance with the miniaturization and light weight of electronic products has been increasing.
  • the conventional method of manufacturing a flexible printed circuit board is a conventional F-PCB method in which a PI (polyimide) film is attached to a thin copper foil, coated with a circuit pattern, and exposed by etching, removing portions except the circuit pattern, and forming a desired circuit pattern.
  • Conventional F-PCB manufacturing method is expensive because of complicated processing method, and various problems such as environmental pollution through plating are occurred.
  • One method of forming conductive material by printing conductive paste by silk screen etc. is a field of printed electronics. There is this.
  • a paste is prepared by adding an adhesive and a curing agent such as epoxy and acryl to a silver powder, and printing the desired circuit pattern on a film such as polyethylene terephthalate by using a screen or inkjet printer, and then using 200 degree centigrade.
  • an adhesive and a curing agent such as epoxy and acryl
  • a film such as polyethylene terephthalate
  • the flexible printed circuit board manufactured as described above is required to add epoxy, acrylic resin, and hardening agent that inhibit conductivity to adhere to the flexible film, and the conductive silver powder is less than 10 times the electrical conductivity of the bulk silver, so the copper foil is used. Compared to the flexible printed circuit board manufactured is limited in use.
  • the present invention provides a method for forming a flexible printed circuit board by forming a conductive electrode using a heat-resistant substrate at a high temperature of 600 degrees Celsius or more and transferring the conductive electrode to a film, and a flexible printed circuit board thereof.
  • the present invention enables the production of metal bulk from the metallic powder using the heat treatment at the firing temperature, and compared with the conventional copper foil etching method, the electrical conductivity is the same, the processing process is simple, and the manufacturing cost can be formed because the thin film can be formed. It is an object of the present invention to provide a method of manufacturing a flexible printed circuit board and a flexible printed circuit board, which are inexpensive and are advantageous in applications where thickness constraints such as mobile phones are difficult.
  • the present invention is a method of manufacturing a flexible printed circuit board that can be used in a wide range of applications without being limited in use because the electrical conductivity is remarkably superior to the conventional manufacturing method for forming a circuit by printing a conductive hardened silver electrode and its It is to provide a flexible printed circuit board.
  • the problem of the present invention is that a flexible film having a predetermined area and capable of bending, and an adhesive and a conductive paste applied to at least a portion of one surface of the flexible film are heat-treated to a firing temperature, and thus the flexible film is formed through the adhesive. It is achieved by a flexible circuit board having a conductive electrode formed by a high temperature heat treatment, characterized in that it comprises a conductive electrode attached to the top.
  • the upper surface of the conductive electrode may be further laminated with a combustion material produced by the combustion of the peeling resin in which the inorganic powder, carbon material or carbide is mixed with the resin.
  • the conductive electrode is formed by heat-treating the conductive paste laminated on a heat-resistant substrate with a peeling resin formed by mixing inorganic powder, carbon material or carbide with a resin to a firing temperature, and the heat-resistant substrate
  • the conductive electrode is transferred to the flexible film by contacting the conductive electrode formed by heat-treating the conductive paste laminated on the substrate to a firing temperature with the flexible film coated with the adhesive.
  • the object of the present invention is the step of forming a circuit pattern with a conductive paste on one surface of the heat-resistant substrate, heat-treating the heat-resistant substrate on which the circuit pattern is formed at a firing temperature to form a conductive electrode on the heat-resistant substrate and the heat treatment It is also achieved by a flexible printed circuit board manufacturing method comprising the step of transferring the conductive electrode to the flexible film by contacting the flexible film coated with an adhesive to the conductive electrode formed on one surface of the heat resistant substrate.
  • the step of forming the conductive electrode on the heat resistant substrate by heat-treating the heat resistant substrate on which the circuit pattern is formed at a firing temperature may include the conductive metal powder of the conductive paste constituting the circuit pattern.
  • the conductive electrode is formed by melting at this firing temperature and coalescing with each other to form an integral mass.
  • the step of forming a circuit pattern with a conductive paste on one surface of the heat resistant substrate may include applying a peeling resin to the heat resistant substrate and the peeling resin applied to the heat resistant substrate. Forming a circuit pattern on the upper portion of the conductive paste.
  • the peeling resin is formed by mixing an inorganic powder which does not burn at the firing temperature or a carbon material or carbide combusted at the firing temperature to form a combustion material in the resin.
  • the inorganic powder of the peeling resin includes paints, paints, inorganic oxides or minerals containing pigments that do not burn at the firing temperature.
  • the flexible printed circuit board manufacturing method and the flexible printed circuit board according to the present invention it is possible to manufacture a product having a thin film and excellent electrical conductivity, and the manufacturing method is easy because the manufacturing method is simple.
  • the flexible printed circuit board according to the present invention can heat-treat up to the firing temperature of the conductive metal, which is an electrode material, by using a high-temperature heat treatment method, so that the theoretical conductivity of each unique conductive metal can be realized.
  • the conductive metal which is an electrode material
  • the flexible printed circuit board according to the present invention has advantages in that all printing methods, such as screen printing, offset printing, gravure printing, and inkjet printing, can be applied to a method of printing a circuit pattern.
  • FIG. 1 is a schematic cross-sectional view showing a state in which a peeling resin and a conductive electrode material are applied to a heat resistant substrate in a method of manufacturing a flexible printed circuit board through high temperature heat treatment of a heat resistant substrate according to an embodiment of the present invention.
  • FIG. 2 is a flowchart sequentially illustrating a process of a method of manufacturing a flexible printed circuit board through high temperature heat treatment of a heat resistant substrate according to an embodiment of the present invention.
  • FIG. 3 is a process diagram schematically showing a process of a method of manufacturing a flexible printed circuit board through high temperature heat treatment of a heat resistant substrate according to an embodiment of the present invention.
  • FIG. 4 is a cross-sectional view illustrating a cross section of a flexible printed circuit board manufactured by a method of manufacturing a flexible printed circuit board through high temperature heat treatment of a heat resistant substrate according to the present invention.
  • FIG. 5 is a plan view illustrating an example of a circuit pattern of a conductive electrode that may be formed in a method of manufacturing a flexible printed circuit board through high temperature heat treatment of a heat resistant substrate according to an exemplary embodiment of the present invention.
  • FIG. 1 is a schematic cross-sectional view showing a state in which a peeling resin and a conductive paste are applied to a heat resistant substrate in a method of manufacturing a flexible printed circuit board through high temperature heat treatment of a heat resistant substrate according to an embodiment of the present invention
  • FIG. 3 is a flowchart sequentially illustrating a method of manufacturing a flexible printed circuit board through high temperature heat treatment of a heat resistant substrate
  • FIG. 3 is a method of manufacturing a flexible printed circuit board through high temperature heat treatment of a heat resistant substrate according to an embodiment of the present invention.
  • FIG. 4 is a cross-sectional view illustrating a cross section of a flexible printed circuit board manufactured according to a method of manufacturing a flexible printed circuit board through a high temperature heat treatment of a heat resistant substrate according to the present invention, and FIG. Plane showing an example of a circuit pattern that can be formed in a flexible printed circuit board manufacturing method through a high temperature heat treatment of the heat-resistant substrate according to an embodiment of the invention A.
  • the heat resistant substrate 10 is prepared with a flat surface capable of withstanding high temperature heat treatment of 600 degrees Celsius or more and capable of printing a circuit pattern (S1).
  • the heat-resistant substrate 10 may be a ceramic substrate including alumina, a substrate made of a common ceramic material, a substrate made of heat-resistant tempered glass, a metal substrate that can withstand high temperature heat treatment temperatures, and a conductive material which will be described later.
  • Metals having a firing temperature higher than that of the conductive metal, which is the main component of the paste, may be used as the material of the metal substrate.
  • the metal substrate may be formed of non-ferrous metals including stainless as well as iron.
  • Peeling resin 20 is applied to the upper portion of the heat-resistant substrate 10 (S2).
  • the peeling resin 20 for example, an inorganic powder (including minerals, pigments, etc.), a carbonaceous material or a peeling material 21 such as carbide is used evenly mixed with a resin (natural resin or synthetic resin).
  • the peeling material 21 plays an important role in peeling the conductive electrode 31 from the heat resistant substrate 10 in the process of transferring the conductive electrode 31 to the flexible film 40 in the method of manufacturing the flexible printed circuit board according to the present invention. It refers to a substance that makes.
  • the resin used for the peeling resin 20 can be applied and can be used in any form that is decomposed by heat above a predetermined temperature.
  • thermally decomposable resins including a liquid epoxy resin can be used and applied. Possible thermally decomposable resins are well known and thus detailed descriptions thereof will be omitted.
  • the inorganic powder which may be used as the peeling material 21 included in the peeling resin 20 may be an oily, aqueous, enamel paint using a pigment as a colorant, or a paint in the form of a paste in which the pigment is uniformly mixed into a medium or the like. have.
  • the liquid or resin contained in the peeling resin 20 is blown away or burned in the process of heating to the firing temperature, and the inorganic powder remains between the conductive electrode 31 and the heat-resistant substrate 10 so that the conductive electrode 31 and By preventing adhesion between the heat resistant substrates 10, the conductive electrodes 31 may be separated from the heat resistant substrates 10 in the process of transferring the conductive electrodes 31 to the flexible film 40. Therefore, the inorganic powder may not be burned or lost at the firing temperature of the electrode material (conductive metal) forming the conductive electrode 31, including a wide range of inorganic materials, inorganic oxides, minerals, ceramic powders, and the like. May be included.
  • a carbon material or a carbide may be used in place of the inorganic powder.
  • the carbon material or carbide is burned by the high temperature in the heat treatment process to be described later, and then the combustion material generated is left between the electrode material and the heat-resistant substrate to space the gap between the electrode material and the heat-resistant substrate so that the conductive electrode 31 is heat-resistant. It is possible to separate from the substrate 10.
  • Such carbon materials include, for example, graphite (graphite), and carbides, for example, calcium carbide, and the like.
  • various carbon materials and carbides, which generate a combustion material and enable separation of the conductive electrode and the heat-resistant substrate may be used. have.
  • the method of applying the peeling resin 20 may be a method such as low viscosity spray method, brushing method, gravure printing, offset printing, inkjet printing, high viscosity silk screen, solid powder coating method, powder coating, laser printer or the like.
  • the printed circuit pattern 30 is formed using a conductive paste containing a conductive electrode material on the peeling resin 20 coated on the heat resistant substrate 10 (S3). Since the conductive paste is known to be formed in the form of a paste for printing a circuit pattern of the conductive metal powder, which is an electrode material having excellent electrical conductivity, a detailed description thereof will be omitted. As the electrode material used for the conductive paste, various metal materials including copper and nickel as well as precious metal materials including gold and silver can be used.
  • the printed circuit pattern 30 As a method of forming the printed circuit pattern 30 from the conductive paste, screen printing, offset printing, gravure printing, inkjet printing, or the like may be used.
  • the heat resistant substrate 10 having the printed circuit pattern 30 formed of the conductive paste is heat-treated to a firing temperature of the electrode material of the conductive paste (S4).
  • the electrode material of the conductive paste a variety of materials may be used as described above. Since the firing temperature is different for each electrode material, heat treatment is performed to the firing temperature of the used electrode material. The ambient atmosphere during the calcining heat treatment loses its function as a conductive conductor when the electrode material is oxidized. Therefore, the surrounding atmosphere during the calcining heat treatment is preferably performed in a vacuum or in an inert gas atmosphere to prevent oxidation of the electrode material.
  • the ambient atmosphere during plastic heat treatment is possible even in the air when the electrode material is a precious metal such as gold or silver, but when the electrode material is a non-ferrous metal such as copper or nickel, oxidation occurs at high temperature and thus loses its function as a conductive conductor.
  • the surrounding atmosphere during the calcining heat treatment must be performed under vacuum or in an inert gas atmosphere.
  • the electrode material in the form of powder contained in the conductive paste by the heat treatment process up to the above firing temperature is melted and coalesced with each other by high temperature to form agglomerates, and the moisture and resin contained in the conductive paste are heat treated at the firing temperature. In the process of evaporation or combustion is blown away. That is, the electrode material powder contained in the conductive paste is melted and coalesced with each other by the heat treatment process up to the firing temperature, thereby changing the structure of the electrode material mass.
  • the electrical conductivity of the conductive electrode 31 is remarkably improved since the powdered electrode materials contained in the conductive paste are changed into a bulk state through the heat treatment to the firing temperature in the powder state, which is separated from each other.
  • the liquid or resin contained in the exfoliation resin 20 in the heat treatment process is evaporated and blown away or burned in the heating process at the firing temperature, so that the conductive electrode 31 and the heat-resistant substrate 10 ), Only the peeling material 21 such as the inorganic powder contained in the peeling resin 20 or the combustion material of the carbon material or carbide remains.
  • the peeling material 21, such as the inorganic powder in the peeling resin 20 or the combustion material of carbon material or carbide is located between the conductive electrode 31 and the heat resistant substrate 10, the conductive electrode 31 and the heat resistant member Attachment of the substrates 10 to each other is prevented, and as a result, the conductive electrodes 31 can be separated from the heat-resistant substrate 10 during the transfer of the conductive electrodes. If the peeling resin 20 does not contain the inorganic powder or the peeling material 21 such as carbon material or carbide, the electrode material of the conductive paste is melted in the firing process of the heat resistant substrate 10 and the heat resistant substrate 10 is left as it is. Since it is difficult to separate the conductive electrode 31 from the heat-resistant substrate 10, the conductive electrode 31 cannot be transferred to the flexible film 40 afterwards.
  • the method of transferring the conductive electrode 31 on the upper portion of the heat-resistant substrate 10 by contacting the flexible film 40 coated with the adhesive may be performed by transferring the printed circuit pattern 30 with a simple contact.
  • Various methods can be used, such as a roller method or a compression press method.
  • the flexible film 40 is not limited to a specific material, as well as the PI film used in the current F-PCB, inexpensive PET film may be used, and in addition, all synthetic resin films such as PS resin for mobile phones may be used.
  • the flexible film 40 may be a paper material or may be any object.
  • the adhesive applied for the transfer to the flexible film 40 may be used for all applications including solvent-based adhesives and water-soluble adhesives, and adhesives for aqueous, solid paste and post-it may also be used.
  • a layer of an adhesive (not shown) is placed on the flexible film 40 and the printed circuit pattern 30 formed by the conductive paste is formed on the layer of the adhesive.
  • the conductive electrode 31 formed by heat treatment to a firing temperature is stacked, and the upper surface of the conductive electrode 31 is formed by burning inorganic powder or carbon material or carbide formed by the heat-removing resin 20 at a firing temperature.
  • a peeling material 21 like the raw material is formed.
  • the present invention heat-treats the metal powder contained in the conductive paste as a conductive electrode material at a firing temperature. Since the metal powder is melted to form a bulk, the present invention is not necessarily limited to a temperature of 600 degrees Celsius or more, and to perform heat treatment in a range of 600 degrees Celsius or less depending on the type of conductive electrode material. Of course it includes.
  • the metal melts at a temperature lower than the intrinsic melting point of the metal. That is, the actual melting point is lower than the melting point inherent to the metal. Therefore, using the nanonized particles as the metal of the conductive electrode material, it is possible to form the same bulk at a temperature lower than the intrinsic firing temperature, thereby making it possible to make an electrode having good electrical conductivity.
  • the particle size of the metal is preferably about 50 to 100 nanometers as the electrode material.
  • the silver powder forming the conductive silver electrode may be silver bulked at a low heat treatment temperature of 600 degrees Celsius or less when the silver nanopowder having a particle diameter of up to 100 nanometers is used.
  • non-ferrous metals such as copper may be oxidized when heat treated to a firing temperature
  • plastic heat treatment should be performed in a reducing atmosphere.
  • the present invention is used in the manufacture of flexible circuit boards.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

La présente invention concerne un procédé de fabrication d'une carte de circuit imprimé souple et une carte de circuit imprimé souple obtenue par ledit procédé. Plus particulièrement, l'invention concerne un procédé de fabrication d'une carte de circuit imprimé par transfert, sur un film mince, d'une électrode conductrice formée par traitement thermique à haute température sur un substrat résistant à la chaleur. La carte de circuit imprimé souple fabriquée selon l'invention présente les avantages d'une conductivité électrique uniforme comparativement aux cartes traitées par les procédés classiques de gravure sur stratifié cuivré du fait qu'il est possible de former un matériau d'électrode en forme de masse de métal par traitement thermique sous une température de calcination selon un procédé de traitement simple qui réduit les coûts de fabrication en permettant la formation d'un film mince et qui peut être appliqué même dans les cas difficiles présentant de strictes limitations d'épaisseur, comme par exemple pour un téléphone mobile.
PCT/KR2013/009321 2013-10-15 2013-10-18 Procédé de fabrication de carte de circuit imprimé souple par traitement thermique à haute température sur un substrat résistant à la chaleur et carte de circuit imprimé souple ainsi obtenue WO2015056825A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1020130122528A KR101404681B1 (ko) 2012-10-23 2013-10-15 내열기판의 고온열처리를 통한 연성인쇄회로기판 제조방법 및 그 연성회로기판
KR1020130122584A KR101545607B1 (ko) 2012-10-23 2013-10-15 은 나노 파우더를 이용한 600도 이하의 열처리를 통한 연성인쇄회로기판 제조방법 및 그 연성회로기판
KR10-2013-0122584 2013-10-15
KR10-2013-0122528 2013-10-15

Publications (1)

Publication Number Publication Date
WO2015056825A1 true WO2015056825A1 (fr) 2015-04-23

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PCT/KR2013/009321 WO2015056825A1 (fr) 2013-10-15 2013-10-18 Procédé de fabrication de carte de circuit imprimé souple par traitement thermique à haute température sur un substrat résistant à la chaleur et carte de circuit imprimé souple ainsi obtenue

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001210933A (ja) * 1999-11-18 2001-08-03 Japan Aviation Electronics Industry Ltd 導体パターンの形成方法及びその形成方法を用いて製造される配線部材、コネクタ、フレキシブルプリント配線板、異方導電性部材
JP2004247572A (ja) * 2003-02-14 2004-09-02 Harima Chem Inc 微細配線パターンの形成方法
JP2006100371A (ja) * 2004-09-28 2006-04-13 Matsushita Electric Ind Co Ltd 配線基板とそれを用いた電子機器およびその製造方法
KR100918863B1 (ko) * 2006-07-05 2009-09-28 가부시키가이샤 히타치세이사쿠쇼 기판에의 도전패턴 형성장치 및 도전패턴 형성방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001210933A (ja) * 1999-11-18 2001-08-03 Japan Aviation Electronics Industry Ltd 導体パターンの形成方法及びその形成方法を用いて製造される配線部材、コネクタ、フレキシブルプリント配線板、異方導電性部材
JP2004247572A (ja) * 2003-02-14 2004-09-02 Harima Chem Inc 微細配線パターンの形成方法
JP2006100371A (ja) * 2004-09-28 2006-04-13 Matsushita Electric Ind Co Ltd 配線基板とそれを用いた電子機器およびその製造方法
KR100918863B1 (ko) * 2006-07-05 2009-09-28 가부시키가이샤 히타치세이사쿠쇼 기판에의 도전패턴 형성장치 및 도전패턴 형성방법

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