WO2015037919A1 - Method for manufacturing touch panel sensor - Google Patents

Method for manufacturing touch panel sensor Download PDF

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Publication number
WO2015037919A1
WO2015037919A1 PCT/KR2014/008475 KR2014008475W WO2015037919A1 WO 2015037919 A1 WO2015037919 A1 WO 2015037919A1 KR 2014008475 W KR2014008475 W KR 2014008475W WO 2015037919 A1 WO2015037919 A1 WO 2015037919A1
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WO
WIPO (PCT)
Prior art keywords
pattern
transparent conductive
transparent
conductive film
water
Prior art date
Application number
PCT/KR2014/008475
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French (fr)
Korean (ko)
Inventor
박철
Original Assignee
(주)삼원에스티
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from KR20130108765A external-priority patent/KR20150029492A/en
Priority claimed from KR1020140076326A external-priority patent/KR101679399B1/en
Application filed by (주)삼원에스티 filed Critical (주)삼원에스티
Publication of WO2015037919A1 publication Critical patent/WO2015037919A1/en

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Definitions

  • the present invention relates to a method of manufacturing a touch panel sensor capable of sensing a contact position of an object approaching a display.
  • FIG. 1 is a perspective view illustrating a conventional capacitive touch panel sensor.
  • the conventional touch panel sensor is bonded to the lower insulating sheet 10 and the upper insulating sheet 20.
  • the lower ITO electrode 30 and the upper ITO electrode 40 are vertically arranged on the upper surface of the lower insulating sheet 10 and the lower surface of the upper insulating sheet 20, respectively.
  • the touch panel sensor has a capacitance value corresponding to the area of each intersection at each intersection of the lower ITO electrode 30 and the upper ITO electrode 40.
  • the upper ITO electrode disposed on the upper part of the touch panel sensor.
  • An area of the body part is added to the area of 40 to change the capacitance value.
  • connection line 48 made of metal electrically connecting the upper ITO electrode 40 and the electrode 52 of the external circuit board 50 may be formed from the end of the upper ITO electrode 40.
  • the lower ITO electrode 30 is also connected to the circuit board 50 by a separate connection line.
  • connection line 48 which is provided as a metal, may not be visually seen from the upper part of the transparent upper insulating sheet 20 because light does not pass through. In the related art, the connection line 48 and the circuit board 50 are not visually confirmed.
  • a separate reinforcement substrate 60 having a frame-shaped window decoration 65 is disposed on the upper insulating sheet 20 so as to be prevented.
  • the ITO electrode 40 forms an ITO thin film on the insulating sheet 20, forms a mask for the pattern on the ITO thin film by a method such as a photoresist, and uses the mask to form the ITO thin film. Patterning and removing the mask to form the ITO electrode 40. In this process, it is troublesome to go through several processes such as film formation, etching and cleaning.
  • the cumbersome process can continue.
  • a process of forming the metal connecting line 48 is necessary.
  • a metal thin film is formed on the insulating substrate 20 on which the ITO electrode 40 is formed by sputtering or vapor deposition, and then a mask for a pattern is formed by a method such as photoresist to pattern the connecting line 48 again.
  • the connecting line 48 may be formed.
  • the present invention provides a method of manufacturing a touch panel sensor that can simplify the process of forming a conductive pattern and a wire pattern.
  • the present invention provides a method of manufacturing a touch panel sensor capable of forming a conductive pattern in a thin and uniform thickness.
  • a method of manufacturing a touch panel sensor disposed on an upper part of a display and sensing a contact position of an object may include an end portion of a transparent conductive pattern formed from a transparent conductive layer and a transparent conductive layer on an insulating substrate. Forming a connection pattern disposed on each of the substrates, forming a transparent insulating pattern corresponding to the transparent conductive pattern on the transparent conductive film, and exposing a part of the connection pattern, and using the transparent insulating pattern as a mask The method may include forming a transparent conductive pattern electrically connected to a wire pattern for electrical connection from the outside.
  • the forming order of the transparent conductive film and the connection pattern may be changed.
  • a transparent conductive film may be first formed on an insulating substrate, and a connection pattern may be formed on the transparent conductive film, or a connection pattern may be formed first on the insulating substrate, and the transparent conductive film may be covered to cover the transparent conductive film and the insulating substrate.
  • a film may also be formed.
  • the transparent insulating pattern may be formed before the wire pattern, and the wire pattern may be formed before the transparent insulating pattern.
  • the transparent conductive pattern can be formed from the transparent conductive film through the etching or dissociation process after forming the transparent insulating pattern and the wire pattern.
  • the wire pattern may be provided through a printing method using silver paste.
  • the wire pattern may also be provided through etching in a situation where a transparent insulating pattern is already formed.
  • the wire layer may be formed to entirely cover the transparent conductive film and the transparent insulating pattern formed thereon, and then the wire pattern may be completed through an etching process for the designed wire pattern. In the etching process, the transparent conductive film under the transparent insulating pattern may be protected as it is.
  • the wire layer can be applied to a method using sputtering from a method such as coating or printing.
  • Korean Patent No. 10-1192645 discloses the formation of a transparent electrode using silver nanowires, but a metal fiber solution is formed in the process of forming a transparent conductive pattern having a thickness of about 0.1 to 0.5 ⁇ m from silver nanofibers. It is applied to a thickness of about 20 ⁇ m or more, in this case it may not be easy to form a transparent conductive pattern of a uniform thickness due to the surface tension of the metal fiber solution.
  • a transparent conductive pattern may be formed by removing an area except for a portion protected by a transparent insulating pattern.
  • the transparent conductive pattern may be formed by chemical or physical method such as chemical treatment or exposure to a specific wavelength. The film may be partially adjusted to lose conductivity to form a transparent conductive pattern. In this process, the transparent insulating pattern may be used as a mask.
  • the conductive fibers in the areas excluding the portion protected by the transparent insulating pattern can be dissociated to form a portion protected by the transparent insulating pattern as the transparent conductive pattern.
  • the transparent conductive film, which is partially protected by the transparent insulating pattern may be precipitated in the high concentration resin solution, and the metal fibers in the portion where the high concentration resin solution is exposed may be dissociated. In this process, the transparent conductive layer under the transparent insulating pattern may be protected.
  • the wire pattern may be formed to be electrically connected to the transparent conductive pattern through the connection pattern exposed from the transparent insulating pattern after the transparent conductive pattern is formed.
  • the transparent conductive pattern is formed through dissociation after forming the wire pattern while maintaining the transparent conductive film as it is, the transparent conductive film under the wire pattern may be protected.
  • a part of the transparent conductive film may remain in the pattern shape on the lower portion of the wire pattern as well as the transparent insulating pattern.
  • a portion of the transparent conductive film under the pattern may be defined as an electrode pattern.
  • the transparent conductive pattern may be provided in various shapes such as straight lines, diamonds, squares, triangles, meshes, etc. according to the required pattern, and the present invention is not limited by the shape, arrangement, and size of the pattern.
  • the connection pattern is formed to be exposed to the outside from the transparent insulating pattern, so that the wire pattern is easily connected to the transparent conductive pattern positioned below the transparent insulating pattern through the connection pattern.
  • a silver paste material such as a wire pattern may be adopted to increase mutual bonding.
  • the transparent conductive film is carbon fiber, carbon powder, metal powder, conductive ink, conductive organic material, PEDOT (polyethylene dioxythiophene), ITO, IZO, AZO (Al-doped zinc oxide), silver nano wire, CNT (carbon Nanotube), graphene (graphene), and carbon powder (carbon powder) may include at least any one, it may be used a conductive fiber solution.
  • the conductive fiber solution may be provided by including a synthetic resin and a volatile solvent (or water) in a metal nano wire such as silver nano wire.
  • the conductive fiber in the present invention may include a metal fiber including other metals (Al, Ag, Au, Cu, W) on the fiber other than the aforementioned silver (Ag) nanofibers, and further, although not composed of a metal, it may include a fibrous nonmetallic fibrous material having conductivity such as carbon fiber.
  • dissociation used in the present specification may mean simply dissolving or dissolving. More specifically, dissociation of the conductive fibers contained in the transparent conductive film is entangled with each other, resulting in electrical conduction ability. It can be said that it is loosened so as to keep it sufficiently separated from each other.
  • the conductive fiber solution includes a conductive fiber, a water-soluble binder, and a water-soluble solvent for dissolving the water-soluble binder.
  • the conductive fiber is fixed on the insulating substrate by the water-soluble binder to form a transparent conductive film.
  • the insulating pattern is formed by using a liquid oily resin alone or by mixing an oily solvent for dissolving the oily resin with the oily resin, curing the oily resin on the transparent conductive film, and forming a water-soluble binder in the step of forming a transparent conductive pattern.
  • the conductive fiber can be dissociated using a dissociable resin solution to dissolve.
  • the oily resin of the transparent insulation pattern may include at least one of urethane, epoxy acrylate, and polyester acrylate
  • the oily solvent of the transparent insulation pattern may include acetone, acetone, Methyl isobutyl ketone (MIBK), methyl ethyl ketone (MEK), cyclohexane, toluene, ethylate, ethyl acetate, butyl acetate ( butyl acetate).
  • the water-soluble binder of the conductive fiber solution may include ethyl cellulose
  • the water-soluble solvent of the conductive fiber solution may include water or an alcohol meter
  • the water-soluble binder of the conductive fiber solution includes a synthetic resin having other water solubility that can be dissolved later by the dissociative resin solution. It is apparent that the oil-based resin and the oil-based solvent of the transparent insulating pattern may also include other oil-based (or fat-soluble) synthetic resins which are not dissolved by the dissociative resin solution.
  • the conductive fiber in the region excluding the portion protected by the transparent conductive pattern is uniformly gradient in the dissociating resin solution and cured as it is, so that the dissociating resin solution is cured as it is, so that it is transparent in the region except the portion protected by the transparent conductive pattern.
  • the conductive film may lose electrical conductivity.
  • the region and the transparent conduction except for the portion protected by the transparent conductive pattern may be the same.
  • the dissociation resin solution may include a water-soluble resin and a water-soluble solvent for dissolving the water-soluble resin
  • the water-soluble resin may include at least one of a water-soluble photocurable resin, a water-soluble natural drying resin, and a water-soluble thermosetting resin.
  • the water-soluble solvent may be used alone or mixed with water or alcohol (alcohol meter).
  • touch panel sensor may be formed on the insulating substrate, it is also possible to define the touch panel sensor as one cell and simultaneously form a plurality of touch panel sensors on one insulating substrate. After simultaneously forming a plurality of touch panel sensors, each cell may be cut and used as a conductive pattern film of the touch panel sensor.
  • a protective coating layer may be formed.
  • a transparent conductive pattern is formed, but a mask pattern is formed as many times as in the prior art, a transparent conductive pattern is formed by etching, the mask pattern is removed before the wire pattern is formed, and then The process of forming the wire pattern can be simplified, and the defects generated in the process can be reduced by reducing the number of processes.
  • the transparent conductive film is thinly formed on the entire surface and the transparent conductive pattern is formed using the transparent conductive pattern, the transparent conductive pattern itself can be formed to have a uniform thickness.
  • the manufacturing method of the touch panel sensor of the present invention forms a transparent conductive pattern, but can be mass-produced through an automated process using a roll film, so that the production speed, accuracy, and yield are higher than those of the conventional technology of manufacturing one cell unit. You can increase it.
  • FIG. 1 is a perspective view illustrating a conventional touch panel sensor.
  • FIG. 2 is an exploded perspective view of a touch panel sensor according to an exemplary embodiment of the present invention.
  • 3 to 8 are plan views and cross-sectional views for explaining a process of manufacturing the top sheet shown in FIG.
  • 9 and 10 are a plan view and a cross-sectional view for explaining a process of manufacturing a top sheet of a touch panel sensor according to another embodiment of the present invention.
  • 11 and 12 are plan views and cross-sectional views illustrating a process of manufacturing a top sheet of a touch panel sensor according to another embodiment of the present invention.
  • FIG. 13 is an exploded perspective view of a touch panel sensor according to another embodiment of the present invention.
  • 14 to 18 are plan views and cross-sectional views for explaining a process of manufacturing the top sheet shown in FIG.
  • FIG. 2 is an exploded perspective view of a touch panel sensor according to an exemplary embodiment of the present invention
  • FIGS. 3 to 8 are plan and cross-sectional views illustrating a process of manufacturing the top sheet shown in FIG. 2.
  • the touch panel sensor 100 includes an upper cover substrate 110, an upper sheet 120, a lower sheet 130, and a flexible circuit board 140.
  • the upper sheet 120 includes an upper insulating substrate 122, an upper conductive pattern 126, an upper wire pattern 128, and an upper conductive terminal 129.
  • the lower sheet 130 also includes a lower insulating substrate 132, a lower conductive pattern 136, a lower wire pattern 138, and a lower conductive terminal 139.
  • the conductive patterns are for a capacitive touch panel sensor, the lower conductive pattern 136 may operate as a transmitter, and the upper conductive pattern 126 may operate as a receiver.
  • the upper conductive pattern 126 and the upper wire pattern 128 may be disposed on the upper insulating substrate 122, and the lower conductive pattern 136 and the lower wire pattern 138 may be disposed on the lower insulating substrate 132.
  • the upper conductive pattern 126 is disposed in the longitudinal direction on the upper insulating substrate 122 with reference to FIG. 2, and the lower conductive pattern 136 is disposed in the transverse direction on the lower insulating substrate 132 so that the upper conductive pattern ( 126 may be formed to intersect with each other.
  • the upper cover substrate 110 may use a rigid glass substrate having high strength and not easily refracted due to direct contact with a part of the body, or a light-transmitting reinforced plastic such as polycarbonate having excellent strength and not easily refracted. .
  • the bottom surface of the upper cover substrate 110 is provided with a frame-shaped window decoration 112, the window decoration 112 is a non-transparent component, for example, the upper insulating substrate 122 And the upper and lower wire patterns 128 and 138 disposed on the edges of the lower insulating substrate 132 and the flexible circuit board 140.
  • the upper cover substrate functions as an insulating substrate so that the upper conductive pattern may be directly formed on the bottom surface of the upper cover substrate, and the lower conductive pattern may be formed on the upper cover substrate according to the structure of the touch panel sensor. .
  • Conductive patterns may be formed on both the top and bottom surfaces of the substrate.
  • This can be referred to a conventional laminated structure, the laminated structure of the substrate, film, etc., except for the relationship between the conductive pattern, the wire pattern, and the insulating pattern does not limit the present invention.
  • the upper and lower insulating substrates 122 and 132 may use materials such as polyethylene, polypropylene, acrylloyl, polyethylene terephthalate, and glass.
  • an optical adhesive layer may be interposed between the upper cover substrate 110, the upper sheet 120, and the lower sheet 130, and the optical adhesive layer may be optically excellent because light is transmitted through the optical adhesive layer.
  • an OCA (Optically Clear Adhesive) film, a UV curing agent, or the like may be used.
  • the flexible circuit board 140 may include terminals electrically connected to the upper and lower wire patterns 128 and 138 formed on the upper insulating substrate 122 and the lower insulating substrate 132. Therefore, when an object approaches the surface of the upper cover substrate 110, the change in capacitance value caused by the interaction between the upper conductive pattern 126 and the lower conductive pattern 136 is along the upper and lower wire patterns 128 and 138.
  • the touch position may be transmitted to an external device, and the control unit corresponding to the external device may calculate the touch position by using the change in the value.
  • top sheet 120 a manufacturing process of the top sheet 120 will be described with reference to FIGS. 3 to 8.
  • the following process may be applied to the manufacturing process of the lower sheet 130 by changing only the pattern, and may also be applied to the case of forming the upper conductive pattern and the lower conductive pattern on the upper and lower surfaces of one insulating substrate.
  • the top sheet 120 may be formed at the same time as a plurality of cells on the original one insulating substrate base material, it can be progressed as shown in the following drawings. In addition, this process may be easily changed in favor of mass production through the process through the roller.
  • connection pattern 170 and the transparent conductive layer 124 are coated on the entire surface of the insulating disc 121.
  • the connection pattern 170 is provided later than the transparent conductive film 124, but the order of forming the transparent conductive film and the connection pattern may be changed.
  • the connection pattern may be first formed on the insulating substrate, and the transparent conductive film may be formed to cover both the connection pattern and the insulating substrate.
  • connection pattern 170 may be provided with the same material as the transparent conductive layer 124, but the transparent conductive layer 124 may not be affected in an etching process of forming the transparent conductive pattern 126 from the transparent conductive layer 124. ) And heterogeneous materials are preferred. In addition, by adopting a material similar to the wire pattern, such as silver paste or carbon ink, bonding to the wire pattern may be improved.
  • the transparent conductive film 124 may be provided as an electrically conductive film using an ITO conductive film or a conductive fiber solution, which may be provided in the field according to a conventional method or may be provided by an external company in the already formed state.
  • a transparent insulating pattern 156 corresponding to the shape of the transparent conductive pattern 126 designed on the transparent conductive layer 124 is formed, and the wire pattern 128 and the connection pattern 170 are later connected.
  • the connection pattern 170 is partially exposed so as to be exposed.
  • the transparent insulating pattern 156 has a rectangular shape extending vertically up and down, and includes a rectangular hole formed at even intervals therein. Therefore, the transparent insulating pattern 156 is provided with three straight patterns connected to the top and bottom and formed in a uniform width and spacing. Three straight patterns form a group, and six transparent insulating patterns 156 are arranged in parallel at equal intervals.
  • the above structure may be formed of various structures such as a diamond structure or a transmitter according to the type or function of the touch panel sensor as an example of a transparent conductive pattern.
  • a portion of the transparent conductive film 124 not covered by the transparent insulating pattern 156 may be removed by etching.
  • the transparent insulating pattern 156 functions as a mask, and a part of the transparent conductive film 124 including ITO or conductive fibers may be removed by an etching method used for receding etching, an aqueous solution, or a silver etching solution.
  • the transparent conductive pattern 126 may be formed by partially removing a portion of the transparent conductive film 124 not printed with the transparent insulating pattern 156.
  • the wire layer 127 is formed to cover the insulating disc 121 as a whole.
  • the wire layer may be applied to a method using sputtering from a method such as coating, printing, or silk screen.
  • the etching process of the wire layer 127 for the designed wire pattern 128 may be performed. Even during the etching of the wire layer 127, the transparent conductive pattern 126 below the transparent insulating pattern 156 may be protected as it is, and in this process, the portion of the wire layer 127 contacting the connection pattern 170 may be different. It is etched so as to have a larger area than the portion to increase the bonding property and the electrical conductivity of the connection pattern 170 and the wire pattern 128 disposed thereon. The wire pattern 128 directly connected to the connection pattern 170 may be electrically connected to the transparent conductive pattern 126 under the transparent insulation pattern 156 through the connection pattern 170.
  • the wire layer 127 may be applied to a method using sputtering from a method such as coating or printing.
  • the wire pattern may be provided through a printing method using a printing method such as silver paste silk printing, gravure printing of a conductive ink including silver ink, flexographic printing, or the like.
  • the transparent insulating pattern 156 may be provided. Is formed first, and the wire pattern 128 is formed.
  • the wire pattern 128 may also be formed through an etching process of the wire layer 127, and the wire pattern 128 may be formed on the flexible circuit board 140. It may be electrically connected to the terminal.
  • the transparent conductive pattern 126 is formed by leaving the transparent conductive film 124 under the transparent insulating pattern 156 by etching, and then, from the wire layer 127.
  • the wire pattern 128 was formed.
  • the transparent insulating pattern and the wire pattern may be formed regardless of the order, and then the transparent conductive pattern may be formed by etching or dissociation using the transparent conductive film. In this case, the transparent conductive film under the wire pattern may also remain on the insulating disc.
  • the protective coating layer 125 is formed, and an insulating substrate corresponding to each cell is cut by cutting the insulating base plate 121 in a paper form. 122 may be provided. In general, it is preferable to form the protective coating layer 125 and to cut the insulating disk 121 in the form of a base paper. However, in some cases, the protective coating layer 125 may be formed after cutting.
  • the upper conductive pattern and the upper wire pattern may be separately formed each time on the upper insulating substrate having a size used for one touch panel sensor.
  • the upper conductive pattern 126 and the upper wire pattern 128 are provided by drawing out the upper insulating plate 121 corresponding to at least one or more upper insulating substrates 122 from the winding rollers.
  • the upper insulating substrate 122 is produced in a batch, and can be cut and used directly before the touch panel sensor 100 is used.
  • the upper insulating plate 121 of the present embodiment is provided in a size corresponding to at least one or more upper insulating substrates 122, specifically, the process of forming the upper insulating substrate 122 of 1 * x at a time, Depending on the manufacturer's intention, the design can be changed to x * y, such as 5 * 5, 6 * 6, 3 * 4, etc.
  • the transparent conductive pattern 126 of the upper insulating plate 121 is protected by the protective coating layer 125 covering the entire insulating plate 121. Can escape.
  • the conductive pattern 126 may be provided at about 0.1 to about 0.2 ⁇ m, and the protective coating layer 125 may be provided at about 0.5 ⁇ m or more to expose the upper conductive pattern 126 to the surface of the upper protective coating layer 125. Can be prevented.
  • the protective coating layer 125 also covers the upper wire pattern 128 as mentioned above. Therefore, in order to electrically connect the upper wire pattern 128 with an external device such as the controller or the flexible circuit board 140, it is necessary to partially remove the protective coating layer 125 to expose the end portion of the upper wire pattern 128. have.
  • Through holes are formed in the upper protective coating layer 125 using a laser to expose the ends of the wire patterns 128, and the conductive terminals 129 exposed from the wire patterns 128 are connected to the flexible circuit board 140. I can connect it. Electrical changes generated in the conductive pattern 126 by the approach of the object may be sequentially transmitted through the wire pattern 128 and the flexible circuit board 140 to the controller, and the controller may adjust the touch position by using the electrical changes. Can be calculated Of course, in addition to the laser etching method of selectively peeling only the protective coating layer to form the through hole, a method of chemical etching or physical perforation may be used.
  • the protective coating layer when forming the protective coating layer, the protective coating layer may be printed so that the through hole is formed from the beginning, and the conductive terminal may be directly exposed to the outside at the same time as printing, in this case, laser or chemical etching on the protective coating layer.
  • the process of forming the through hole can be omitted.
  • the conductive patterns 126 and 136 have a group structure in which upper and lower ends are connected such that three straight patterns form a group, but the present invention is not limited to the structure of the conductive pattern.
  • the conductive pattern may be applied to a structure already disclosed in touch panel sensors such as Publication Nos. 10-2011-0092814, 10-2010-0138849, and 10-2011-0095684.
  • the upper sheet has been described as an object, but the same may be applied to the lower sheet, and may also be described as the case where the upper and lower conductive patterns are simultaneously or sequentially formed on both surfaces in one roll film.
  • the upper conductive pattern may be directly formed on the tempered glass substrate, and the lower conductive pattern may be formed on the insulating substrate and then attached to each other.
  • 9 and 10 are a plan view and a cross-sectional view for explaining a process of manufacturing a top sheet of a touch panel sensor according to another embodiment of the present invention.
  • the description of the insulating disc, the connection pattern, the transparent insulating pattern, and the transparent conductive film and the process of forming the same may refer to the above description.
  • a transparent conductive film 224 is formed of a conductive fiber solution containing a conductive fiber, a water-soluble binder, and a water-soluble solvent for dissolving the water-soluble binder on the insulating disc 221, and thereon.
  • the connection pattern 270 is formed, the order of forming the conductive film and the connection pattern may be changed.
  • the water-soluble solvent is volatilized and disappeared using water or alcohol, and substantially the conductive fiber is stably attached onto the insulating disc 221 through the water-soluble binder. .
  • the transparent conductive film 224 has conductivity even if a water-soluble binder is interposed therebetween.
  • ethyl cellulose may be used as the water-soluble binder of the conductive fiber solution, and water or an alcohol-based material may be used as the water-soluble solvent.
  • the conductive fiber may include a metal fiber including other metals (Al, Ag, Au, Cu, W) on a fiber other than the silver (Ag) nanofibers mentioned above, and furthermore, although not constituted, it may include a fibrous nonmetallic fibrous material having conductivity such as carbon fiber.
  • the transparent conductive film may be printed and formed only on the touch area in which the transparent conductive pattern is disposed, or the non-touch area in which the transparent conductive film is formed on the front surface and the wire member or window decoration is disposed (bezel area). ) May be removed in advance by etching. That is, it is also possible to form a transparent conductive film corresponding to the touch area.
  • the wire pattern 228 is provided, and then a transparent insulating pattern 256 is formed on the transparent conductive film 224 to correspond to the desired shape of the transparent conductive pattern 226.
  • a transparent insulating pattern first and then provide a wire pattern, and the process of forming a transparent conductive pattern by dissociating or etching the transparent conductive film irrespective of the order of forming the wire pattern and the transparent insulating pattern will be thereafter. Can be.
  • the present embodiment sequentially provides the wire pattern 228 and the transparent insulating pattern 256, and does not cover the wire pattern 228 or the transparent insulating pattern 256. It will be described as a case of dissociating to provide the transparent conductive pattern 226. This can be confirmed through the laminated structure of each component in FIG.
  • the transparent insulating pattern 256 may be a liquid oil resin alone, but may be formed by mixing an oil solvent for dissolving the oil resin with the oil resin and curing the oil resin on the transparent conductive film 224.
  • the oily resin of the transparent insulation pattern may include at least one of urethane, epoxy acrylate, and polyester acrylate
  • the oily solvent of the transparent insulation pattern may include acetone, acetone, Methyl isobutyl ketone (MIBK), methyl ethyl ketone (MEK), cyclohexane, toluene, ethylate, ethyl acetate, butyl acetate ( butyl acetate).
  • transparent insulating patterns 256 are formed on the transparent conductive film 224 at uniform intervals, and ends of the wire patterns 228 are positioned on the transparent conductive film 224, and the transparent insulating patterns are disposed thereon. 256 is formed.
  • the conductive fibers in the transparent conductive film 224 of the portion not protected by the wire pattern 228 or the transparent insulating pattern 256 can be dissociated so as to lose conductivity.
  • This process may refer to FIG. 10.
  • the dissociation may imply a simple dissolver, but more specifically, the conductive fibers contained in the transparent conductive film 224 are entangled with each other to be released and terminated to lose electrical conduction ability. It can have the meaning of changing to a sufficiently separated state.
  • the dissociation resin solution 260 is coated on the insulating disc 221 so that the transparent insulating pattern 256 is sufficiently covered.
  • the height of the dissociation resin solution 260 can be adjusted as long as the conductive fibers contained in the transparent conductive film 224 can be spaced enough to lose electrical conductivity.
  • the dissociation resin solution 260 may include a water-soluble resin and a water-soluble solvent for dissolving the water-soluble resin.
  • the water-soluble solvent may be volatilized, and thus, the dissociation resin
  • the height of the dissociation resin solution 260 may be somewhat reduced, but as mentioned above, the height of the dissociated resin solution 260, which has been reduced and changed, is transparent.
  • the conductive fibers contained in the film 224 must be adjusted within a range that can be sufficiently spaced apart to lose electrical conductivity.
  • the conductive fibers that are dissociated in the water-soluble resin and kept separated from each other naturally cannot conduct electricity any more.
  • the transparent conductive film 224 exposed to the dissociation resin solution 260, that is, not protected by the transparent insulating pattern 256, may lose electrical conductivity.
  • the region and the transparent conduction except for the portion protected by the transparent conductive pattern may be the same. Therefore, when the touch panel sensor manufactured by the present manufacturing method is viewed from above, the boundary portion of the transparent conductive pattern may be virtually obscured and may provide an effect that is not visually confirmed.
  • the water-soluble resin of the dissociation resin solution 260 may be used by dissolving at least one of a water-soluble photocurable resin, a water-soluble natural drying resin, and a water-soluble thermosetting resin in a water-soluble solvent, and the dissociation resin solution 260 may be The curing process may change depending on the propensity of the water-soluble resin used. For example, Alberdingk Boley's LUX series products are representative water soluble photocurable resins, and LUX 220, 250 and 255 products are cured by UV light.
  • the water-soluble solvent may use only general water, and in some cases, when a water-soluble resin is dissolved in alcohol, an alcohol-based material may be used as the water-soluble solvent.
  • the water-soluble resin may be provided with the same material as the water-soluble binder of the conductive fiber solution.
  • the portion that is not protected by the transparent insulating pattern 256 is dissociated and is not substantially removed.
  • the transparent conductive layer 224 may realize the effect of losing electrical conductivity as if physically removed.
  • the portion except for the dissociated pattern 227 is defined as the transparent conductive pattern 226.
  • the protective coating layer may be formed after the transparent conductive pattern is formed in the same manner as in the previous embodiments, but in this embodiment, the dissociative resin solution 260 may actually serve as a protective coating layer.
  • the surface is not smooth unless the protective coating layer is thickened by a wire pattern or transparent insulating patterns.
  • the dissociation resin solution 260 is cured and the surface thereof is smoothly provided, thereby greatly lowering the defect rate caused by bubbles interposed between the optical adhesive layer and the sheet used for bonding between upper and lower sheets.
  • 11 and 12 are plan views and cross-sectional views illustrating a process of manufacturing a top sheet of a touch panel sensor according to another embodiment of the present invention.
  • the description of the insulating disc, the connection pattern, the transparent insulating pattern, and the transparent conductive film and the process of forming the same may refer to the above description.
  • connection pattern 370 is first formed on the insulating plate 321, and the transparent conductive film 324 is partially formed on the insulating plate 321 unlike the previous embodiment.
  • the pattern 370 is formed to be printed with a transparent conductive fiber solution so as to partially expose the pattern 370.
  • a transparent insulating pattern 356 is formed on the transparent conductive film corresponding to the desired shape of the transparent conductive pattern 326, but the connection pattern 370 is partially exposed for connection with the wire pattern 328.
  • a wire pattern 328 electrically connected to the connection pattern 370 is formed. In FIG. 11, it can be confirmed through the laminated structure of each component.
  • connection pattern 370, the transparent conductive film 324, the transparent insulation pattern 356, and the wire pattern 328 are sequentially stacked on the insulating disc 321.
  • the conductive fibers in the transparent conductive film 324 in the portion not protected by the wire pattern 328 or the transparent insulating pattern 356 can be dissociated so as to lose conductivity. This process may refer to FIG. 12.
  • the dissociation resin solution 360 is coated on the insulating disc 321 so that the transparent insulating pattern 356 is sufficiently covered.
  • the conductive fibers that are dissociated in the water-soluble resin and kept separated from each other naturally cannot conduct electricity any more.
  • the transparent conductive film 324 exposed to the dissociation resin solution 360, that is, not protected by the transparent insulating pattern 356, may lose electrical conductivity.
  • the portion that is not protected by the transparent insulating pattern 356 is dissociated and is not substantially removed.
  • the transparent conductive film 324 may be realized in the same way as it is physically removed.
  • the portion except for the dissociated pattern 327 may be defined as the transparent conductive pattern 326.
  • the dissociation resin solution 360 may be provided in a state in which the end portion of the wire pattern 328 and the terminal of the flexible circuit board are connected to each other. However, even if it is provided entirely on the insulating disk, it is also possible to remove a part of the dissociative resin solution 360 cured at the end of the wire pattern connected to the flexible circuit board terminal by using a laser.
  • FIG. 13 is an exploded perspective view of a touch panel sensor according to another embodiment of the present invention
  • FIGS. 14 to 18 are plan and cross-sectional views illustrating a process of manufacturing the top sheet shown in FIG. 13.
  • reference numerals of the touch panel sensor according to the present exemplary embodiment are distinguished from the same reference numerals mentioned above with reference to FIGS. 13 to 18.
  • the touch panel sensor 100 includes an upper cover substrate 110, an upper sheet 120, a lower sheet 130, and a flexible circuit board 140.
  • the upper sheet 120 includes an upper insulating substrate 122, an upper conductive pattern 126, an upper wire pattern 128, and an upper conductive terminal 129.
  • the lower sheet 130 also includes a lower insulating substrate 132, a lower conductive pattern 136, a lower wire pattern 138, and a lower conductive terminal 139.
  • the upper conductive pattern 126 and the upper wire pattern 128 may be disposed on the upper insulating substrate 122, and the lower conductive pattern 136 and the lower wire pattern 138 may be disposed on the lower insulating substrate 132.
  • the bottom surface of the upper cover substrate 110 is provided with a frame-shaped window decoration 112, the upper and lower wire patterns 128, 138 disposed on the edge of the upper insulating substrate 122 and the lower insulating substrate 132.
  • the flexible circuit board 140 may be provided.
  • an optical adhesive layer may be interposed between the upper cover substrate 110, the upper sheet 120, and the lower sheet 130 to be bonded to each other.
  • the flexible circuit board 140 may include terminals electrically connected to the upper and lower wire patterns 128 and 138 formed on the upper insulating substrate 122 and the lower insulating substrate 132.
  • top sheet 120 a manufacturing process of the top sheet 120 will be described with reference to FIGS. 14 to 18.
  • the following process may be applied to the manufacturing process of the lower sheet 130 by changing only the pattern, and may also be applied to the case of forming the upper conductive pattern and the lower conductive pattern on the upper and lower surfaces of one insulating substrate.
  • top sheet 120 may be formed at the same time as a plurality of cells on the original one insulating substrate base material, it can be progressed as shown in the following drawings.
  • a roll-shaped insulating disc 121 for a touch panel sensor of a plurality of cells is provided.
  • the transparent conductive film 124 is coated on the entire surface of the insulating disc 121 and is provided.
  • the transparent conductive film 124 may be provided as an ITO conductive film.
  • a wire pattern 128 is formed on the transparent conductive film 124.
  • the wire pattern 128 may be electrically connected to the terminals of the flexible circuit board 140. Since the conductive pattern 126 is not yet formed when the wire pattern 128 is formed, the wire pattern 128 can be accurately formed in advance corresponding to the position where the conductive pattern 126 is to be formed.
  • a transparent insulating pattern 156 is formed on the transparent conductive film 124 corresponding to the shape of the transparent conductive pattern 126.
  • the transparent insulating pattern 156 has a rectangular shape extending vertically up and down, and includes a rectangular hole formed at even intervals therein. Therefore, the transparent insulating pattern 156 is provided with three straight patterns connected to the top and bottom and formed in a uniform width and spacing. Three straight patterns form a group, and six transparent insulating patterns 156 are arranged in parallel at equal intervals.
  • a transparent insulating pattern 156 is formed on the transparent conductive film 124 at uniform intervals.
  • the wire pattern 128 is formed on the transparent conductive film 124.
  • An end is positioned, and a transparent insulating pattern 156 is formed thereon.
  • a portion not covered by the transparent insulating pattern 156 may be removed by etching.
  • the transparent insulating pattern 156 functions as a mask, and a part of the transparent conductive layer 124 including fibers may be removed by an aqueous solution or a silver etching solution.
  • the transparent conductive pattern 126 can be formed by partially removing a portion of the transparent conductive film 124 not printed with the transparent insulating pattern 156.
  • the protective coating layer 125 may be formed, and an insulating substrate 122 corresponding to each cell may be provided by cutting the insulating insulating plate 121 in the form of a paper. have.
  • the protective coating layer 125 covering the entire insulating disc 121 also covers the upper wire pattern 128. Therefore, in order to electrically connect the upper wire pattern 128 with an external device such as the controller or the flexible circuit board 140, it is necessary to partially remove the protective coating layer 125 to expose the end portion of the upper wire pattern 128. have.
  • Through holes are formed in the upper protective coating layer 125 using a laser to expose the ends of the wire patterns 128, and the conductive terminals 129 exposed from the wire patterns 128 are connected to the flexible circuit board 140. I can connect it.
  • the conductive patterns 126 and 136 have a group structure in which upper and lower ends are connected such that three straight patterns form a group, but the present invention is not limited to the structure of the conductive pattern. .
  • the touch panel sensor according to the present invention can be widely applied to a display for the purpose of detecting a contact position of an object.

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Abstract

A method for manufacturing a touch panel sensor for sensing the contact position of an object, the touch panel sensor being arranged on the top of a display, comprises the steps of: forming, on an insulating substrate, a connection pattern which is arranged at each end portion of a transparent conductive film and of a transparent conductive pattern formed from the transparent conductive film; forming, on the transparent conductive film, a transparent insulating pattern which corresponds to the transparent conductive pattern and exposes a portion of the connection pattern; and forming the transparent conductive pattern from the transparent conductive film by using the transparent insulating pattern as a mask, the transparent conductive pattern being electrically connected with a wire pattern for external electrical connection.

Description

터치패널센서의 제조방법Manufacturing Method of Touch Panel Sensor
본 발명은 디스플레이 상에 접근하는 대상체의 접촉 위치를 감지할 수 있는 터치패널센서의 제조방법에 관한 것이다.The present invention relates to a method of manufacturing a touch panel sensor capable of sensing a contact position of an object approaching a display.
도 1은 종래의 정전용량 방식의 터치패널센서를 설명하기 위한 사시도이다. 1 is a perspective view illustrating a conventional capacitive touch panel sensor.
도 1을 참조하면, 종래의 터치패널센서는 하부 절연시트(10) 및 상부 절연시트(20)가 접합된다. 하부 절연시트(10)의 상면과 상부 절연시트(20)의 저면에는 각각 하부 ITO전극(30)과 상부 ITO전극(40)이 상호 수직하게 배열되어 있다.Referring to FIG. 1, the conventional touch panel sensor is bonded to the lower insulating sheet 10 and the upper insulating sheet 20. The lower ITO electrode 30 and the upper ITO electrode 40 are vertically arranged on the upper surface of the lower insulating sheet 10 and the lower surface of the upper insulating sheet 20, respectively.
상술한 터치패널센서는 하부 ITO전극(30) 및 상부 ITO전극(40)의 각 교차지점마다 각 교차지점의 면적에 대응하는 커패시턴스 값이 존재하는데, 신체 일부가 근접하면 상부에 배치된 상부 ITO전극(40)의 면적에 신체 일부의 면적이 더해져 커패시턴스 값이 변경될 수 있다. The touch panel sensor has a capacitance value corresponding to the area of each intersection at each intersection of the lower ITO electrode 30 and the upper ITO electrode 40. When the body part is close, the upper ITO electrode disposed on the upper part of the touch panel sensor. An area of the body part is added to the area of 40 to change the capacitance value.
또한, 상부 ITO전극(40)과 외부의 회로기판(50)의 전극(52)을 전기적으로 연결하는 금속 재질의 연결선(48)이 상부 ITO전극(40)의 단부로부터 상부 절연시트(20)의 하부까지 연장되어 있으며, 하부 ITO전극(30) 또한 별도의 연결선에 의해서 회로기판(50)과 연결된다.In addition, a connection line 48 made of metal electrically connecting the upper ITO electrode 40 and the electrode 52 of the external circuit board 50 may be formed from the end of the upper ITO electrode 40. The lower ITO electrode 30 is also connected to the circuit board 50 by a separate connection line.
일반적으로 금속으로 제공되는 연결선(48)은 빛이 통과하지 않아 투명한 상부 절연시트(20)의 상부에서 육안으로 확인될 수 있고, 종래에는 연결선(48) 및 회로기판(50)이 육안으로 확인되지 않도록 액자 형상의 윈도우 데코레이션(65)을 갖는 별도의 강화기판(60)을 상부 절연시트(20) 상부에 배치한다.In general, the connection line 48, which is provided as a metal, may not be visually seen from the upper part of the transparent upper insulating sheet 20 because light does not pass through. In the related art, the connection line 48 and the circuit board 50 are not visually confirmed. A separate reinforcement substrate 60 having a frame-shaped window decoration 65 is disposed on the upper insulating sheet 20 so as to be prevented.
종래의 방법에 따르면, ITO전극(40)은 절연시트(20) 상에 ITO 박막을 형성하고, ITO 박막 상에 포토레지스트 등의 방법으로 패턴을 위한 마스크를 형성하고, 그 마스크를 이용하여 ITO 박막을 패터닝하고, 마스크를 제거함으로써 ITO 전극(40)을 형성하는 과정을 거친다. 이 과정에서 여러 번의 성막, 에칭, 세정 등의 과정을 거쳐야 하는 번거로움이 있다. According to the conventional method, the ITO electrode 40 forms an ITO thin film on the insulating sheet 20, forms a mask for the pattern on the ITO thin film by a method such as a photoresist, and uses the mask to form the ITO thin film. Patterning and removing the mask to form the ITO electrode 40. In this process, it is troublesome to go through several processes such as film formation, etching and cleaning.
이 후에도 번거로운 과정은 계속될 수 있다. ITO 전극(40)을 형성한 후, 다시 금속 연결선(48)을 형성하는 과정이 필요하다. 이를 위해서 역시 ITO 전극(40)이 형성된 절연기판(20) 상에 스퍼터링이나 증착 등의 방법으로 금속 박막을 형성하고, 다시 연결선(48)을 패터닝하기 위해 포토레지스트 등의 방법으로 패턴을 위한 마스크를 형성하고, 그 마스크를 이용하여 금속 박막을 패터닝하고, 다시 마스크를 제거함으로써 연결선(48)을 형성하는 과정을 거칠 수 있다.After this, the cumbersome process can continue. After the ITO electrode 40 is formed, a process of forming the metal connecting line 48 is necessary. To this end, a metal thin film is formed on the insulating substrate 20 on which the ITO electrode 40 is formed by sputtering or vapor deposition, and then a mask for a pattern is formed by a method such as photoresist to pattern the connecting line 48 again. After forming, patterning the metal thin film using the mask, and removing the mask again, the connecting line 48 may be formed.
이와 같이, 매번 마스크 형성, 패터닝, 에칭, 세정 및 마스크 제거 등의 방법을 수 차례 거치게 되면, 전체적인 제조과정이 길어지는 것은 물론, 많은 과정을 거치기 때문에 불량이 발생할 확률도 같이 높아지게 된다.As described above, if the mask formation, patterning, etching, cleaning, and mask removal are performed several times each time, the overall manufacturing process is long and, as a result, many processes are performed, thereby increasing the probability of defects.
본 발명은 도전패턴 및 와이어패턴 형성 과정을 단순화할 수 있는 터치패널센서의 제조방법을 제공한다. The present invention provides a method of manufacturing a touch panel sensor that can simplify the process of forming a conductive pattern and a wire pattern.
본 발명은 얇고 균일한 두께로 도전패턴을 형성할 수 있는 터치패널센서의 제조방법을 제공한다.The present invention provides a method of manufacturing a touch panel sensor capable of forming a conductive pattern in a thin and uniform thickness.
본 발명의 예시적인 일 실시예에 따르면, 디스플레이 상부에 배치되어 대상체의 접촉위치를 감지하는 터치패널센서의 제조방법은, 절연기판 상에 투명 도전막 및 투명 도전막으로부터 형성되는 투명 도전패턴의 단부 각각에 배치되는 연결패턴을 형성하는 단계, 투명 도전막 상에 투명 도전패턴에 대응하되, 연결패턴의 일부를 노출시키는 투명 절연패턴을 형성하는 단계, 및 투명 절연패턴을 마스크로 이용하여 투명 도전막으로부터 외부와의 전기적 연결을 위한 와이어패턴과 전기적으로 연결되는 투명 도전패턴을 형성하는 단계를 포함할 수 있다. According to an exemplary embodiment of the present invention, a method of manufacturing a touch panel sensor disposed on an upper part of a display and sensing a contact position of an object may include an end portion of a transparent conductive pattern formed from a transparent conductive layer and a transparent conductive layer on an insulating substrate. Forming a connection pattern disposed on each of the substrates, forming a transparent insulating pattern corresponding to the transparent conductive pattern on the transparent conductive film, and exposing a part of the connection pattern, and using the transparent insulating pattern as a mask The method may include forming a transparent conductive pattern electrically connected to a wire pattern for electrical connection from the outside.
또한, 투명 도전막 및 연결패턴을 형성하는 단계에서, 투명 도전막과 연결패턴의 형성 순서는 바뀔 수 있다. 예를 들어, 절연기판 상에 투명 도전막을 먼저 형성하고, 연결패턴을 투명 도전막 상에 형성할 수도 있고, 절연기판 상에 연결패턴을 먼저 형성하고, 투명 도전막 및 절연기판을 커버하도록 투명 도전막을 형성할 수도 있다. In addition, in the step of forming the transparent conductive film and the connection pattern, the forming order of the transparent conductive film and the connection pattern may be changed. For example, a transparent conductive film may be first formed on an insulating substrate, and a connection pattern may be formed on the transparent conductive film, or a connection pattern may be formed first on the insulating substrate, and the transparent conductive film may be covered to cover the transparent conductive film and the insulating substrate. A film may also be formed.
그리고, 투명 도전막과 연결패턴의 형성 순서와는 무관하게 투명 절연패턴을 와이어패턴보다 선행하여 형성할 수 있고, 와이어패턴을 투명 절연패턴보다 선행해서 형성하는 것도 가능하다. 어느 경우던지, 투명 절연패턴과 와이어패턴을 형성하고 나서 에칭이나 해리 과정을 통해서 투명 도전막으로부터 투명 도전패턴을 형성할 수 있다. Regardless of the order of forming the transparent conductive film and the connection pattern, the transparent insulating pattern may be formed before the wire pattern, and the wire pattern may be formed before the transparent insulating pattern. In any case, the transparent conductive pattern can be formed from the transparent conductive film through the etching or dissociation process after forming the transparent insulating pattern and the wire pattern.
와이어패턴은 실버페이스트를 이용한 인쇄 방법을 통해서 제공할 수도 있지만, 특히, 투명 절연패턴이 이미 형성되어 있는 상황에서는 에칭을 통해서도 와이어패턴을 제공할 수 있다. 구체적으로, 투명 도전막 및 그 상에 형성되는 투명 절연패턴을 전체적으로 덮도록 와이어층을 형성하고 나서, 설계된 와이어패턴을 위한 에칭 과정을 거쳐서 와이어패턴을 완성시킬 수 있다. 에칭 과정에서 투명 절연패턴의 하부의 투명 도전막은 그대로 보호될 수 있다. 또한, 와이어층은 도포나 인쇄 등의 방법부터 스퍼터링(sputtering)을 이용한 방법을 두루 적용할 수 있다. The wire pattern may be provided through a printing method using silver paste. In particular, the wire pattern may also be provided through etching in a situation where a transparent insulating pattern is already formed. Specifically, the wire layer may be formed to entirely cover the transparent conductive film and the transparent insulating pattern formed thereon, and then the wire pattern may be completed through an etching process for the designed wire pattern. In the etching process, the transparent conductive film under the transparent insulating pattern may be protected as it is. In addition, the wire layer can be applied to a method using sputtering from a method such as coating or printing.
특히, 본 발명에서는 투명 도전패턴을 위하여 절연기판 상에 전체적으로 투명 도전막을 형성하기 때문에 어떠한 재질을 사용하던 균일한 두께의 투명 도전패턴을 형성할 수가 있다. 참고로, 한국등록특허 제10-1192645호에 은나노와이어를 이용하여 투명전극을 형성하는 내용이 공개되어 있으나, 은나노 섬유로 약 0.1 내지 0.5㎛ 두께의 투명 도전패턴을 형성하는 과정에서 금속섬유용액을 약 20㎛ 이상의 두께로 도포하게 되는데, 이 경우 금속섬유용액의 표면장력 등으로 인해 균일한 두께의 투명 도전패턴을 형성하는 것이 쉽지 않을 수가 있다. In particular, in the present invention, since the transparent conductive film is formed on the insulating substrate as a whole for the transparent conductive pattern, it is possible to form a transparent conductive pattern having a uniform thickness using any material. For reference, Korean Patent No. 10-1192645 discloses the formation of a transparent electrode using silver nanowires, but a metal fiber solution is formed in the process of forming a transparent conductive pattern having a thickness of about 0.1 to 0.5 μm from silver nanofibers. It is applied to a thickness of about 20㎛ or more, in this case it may not be easy to form a transparent conductive pattern of a uniform thickness due to the surface tension of the metal fiber solution.
또한, 투명 도전패턴을 형성하기 위해서 에칭 또는 화학적 해리 등의 방법을 사용할 수 있다. 예를 들어, 투명 절연패턴에 의해서 보호된 부분을 제외한 영역을 에칭으로 제거하여 투명 도전패턴을 형성할 수 있으며, 다르게는 화학약품 처리를 하거나 특정 파장에 노출시키는 등 화학적 또는 물리적 방법을 통해 투명 도전막을 부분적으로 도전성을 상실하도록 조정하여 투명 도전패턴을 형성할 수도 있다. 이 과정에서 투명 절연패턴은 마스크로 이용될 수 있다. Moreover, in order to form a transparent conductive pattern, methods, such as an etching or chemical dissociation, can be used. For example, a transparent conductive pattern may be formed by removing an area except for a portion protected by a transparent insulating pattern. Alternatively, the transparent conductive pattern may be formed by chemical or physical method such as chemical treatment or exposure to a specific wavelength. The film may be partially adjusted to lose conductivity to form a transparent conductive pattern. In this process, the transparent insulating pattern may be used as a mask.
또한, 투명 도전막을 도전섬유용액을 이용하여 제공한 경우, 투명 절연패턴에 의해서 보호된 부분을 제외한 영역의 도전섬유를 상호 해리시켜 상기 투명 절연패턴에 의해서 보호된 부분을 투명 도전패턴으로 형성할 수가 있다. 일 예로, 투명 절연패턴에 의해서 부분적으로 보호되는 투명 도전막을 고농도 수지 용액에 침전시킬 수 있으며, 고농도 수지 용액이 노출된 부분의 금속섬유를 해리시킬 수가 있다. 이 과정에서 투명 절연패턴 하부의 투명 도전막은 보호될 수 있다. In addition, in the case where the transparent conductive film is provided using the conductive fiber solution, the conductive fibers in the areas excluding the portion protected by the transparent insulating pattern can be dissociated to form a portion protected by the transparent insulating pattern as the transparent conductive pattern. have. For example, the transparent conductive film, which is partially protected by the transparent insulating pattern, may be precipitated in the high concentration resin solution, and the metal fibers in the portion where the high concentration resin solution is exposed may be dissociated. In this process, the transparent conductive layer under the transparent insulating pattern may be protected.
또한, 와이어패턴은 투명 도전패턴을 형성한 후에 투명 절연패턴으로부터 노출되는 연결패턴을 통해서 투명 도전패턴과 전기적으로 연결되게 형성할 수도 있다. In addition, the wire pattern may be formed to be electrically connected to the transparent conductive pattern through the connection pattern exposed from the transparent insulating pattern after the transparent conductive pattern is formed.
만약, 투명 도전막을 그대로 유지하면서 와이어패턴을 형성한 후에 해리를 통한 투명 도전패턴을 형성하는 경우에는 와이어패턴 하부의 투명 도전막도 보호될 수 있다. If the transparent conductive pattern is formed through dissociation after forming the wire pattern while maintaining the transparent conductive film as it is, the transparent conductive film under the wire pattern may be protected.
참고로, 와이어패턴 및 투명 절연패턴이 투명 도전막 상에 형성되어 마스크로 기능을 하는 경우, 투명 절연패턴은 물론 와이어패턴의 하부에도 투명 도전막의 일부가 패턴 형상으로 잔류할 수 있으나, 여기서 투명 절연패턴 하부에 있는 투명 도전막의 일부를 전극패턴으로 정의할 수 있다. For reference, when the wire pattern and the transparent insulating pattern are formed on the transparent conductive film to function as a mask, a part of the transparent conductive film may remain in the pattern shape on the lower portion of the wire pattern as well as the transparent insulating pattern. A portion of the transparent conductive film under the pattern may be defined as an electrode pattern.
또한, 투명 도전패턴은 요구되는 패턴의 방식에 따라 직선, 다이아몬드, 사각형, 삼각형, 그물형 등 다양한 모양으로 제공될 수 있으며, 패턴의 형상, 배열, 크기 등에 의해서 본 발명이 제한되지 않는다.In addition, the transparent conductive pattern may be provided in various shapes such as straight lines, diamonds, squares, triangles, meshes, etc. according to the required pattern, and the present invention is not limited by the shape, arrangement, and size of the pattern.
여기서, 투명 도전막이 투명 절연패턴의 형상에 대응하게 잔류하거나 투명 절연패턴 하부의 투명 도전막만이 도전성을 유지한 채로 투명 도전패턴을 형성하기 때문에 추후 투명 도전패턴과 와이어패턴을 전기적으로 연결하기 쉽지 않을 수 있다. 하지만, 본 발명에서는 연결패턴이 투명 절연패턴으로부터 외측으로 노출되게 형성되어 있어서 와이어패턴은 연결패턴을 통해서 투명 절연패턴 하부에 위치한 투명 도전패턴과 전기적 연결이 용이해진다. 또한, 연결패턴이 투명 도전막 위에 형성되는 경우, 와이어패턴과 같은 실버페이스트 재질을 채택하여 상호 접합성을 높일 수도 있다. Here, since the transparent conductive film remains corresponding to the shape of the transparent insulating pattern or only the transparent conductive film under the transparent insulating pattern maintains conductivity, it is easy to electrically connect the transparent conductive pattern and the wire pattern later. You may not. However, in the present invention, the connection pattern is formed to be exposed to the outside from the transparent insulating pattern, so that the wire pattern is easily connected to the transparent conductive pattern positioned below the transparent insulating pattern through the connection pattern. In addition, when the connection pattern is formed on the transparent conductive film, a silver paste material such as a wire pattern may be adopted to increase mutual bonding.
한편, 투명 도전막은 카본 파이버, 카본 파우더, 금속을 이용한 파우더, 도전성 잉크, 도전성 유기물질, PEDOT(폴리에틸렌디옥시티오펜), ITO, IZO, AZO(Al-doped zinc oxide), 은나노 와이어, CNT(탄소나노튜브), 그래핀(graphene), 및 카본 파우더(carbon powder) 중 적어도 어느 하나를 포함할 수도 있고, 도전섬유용액을 이용할 수도 있다. 도전섬유용액은 은나노 와이어와 같은 금속 나노 와이어(metal nano wire)에 합성수지 및 휘발성 용매(또는 물) 등을 포함하여 제공될 수 있다. On the other hand, the transparent conductive film is carbon fiber, carbon powder, metal powder, conductive ink, conductive organic material, PEDOT (polyethylene dioxythiophene), ITO, IZO, AZO (Al-doped zinc oxide), silver nano wire, CNT (carbon Nanotube), graphene (graphene), and carbon powder (carbon powder) may include at least any one, it may be used a conductive fiber solution. The conductive fiber solution may be provided by including a synthetic resin and a volatile solvent (or water) in a metal nano wire such as silver nano wire.
참고로, 본 발명에서 도전섬유라 함은, 앞서 언급한 은(Ag) 나노 섬유 외의 섬유 상의 여타의 금속(Al, Ag, Au, Cu, W)들을 포함하는 금속섬유를 포함할 수 있고, 나아가 금속으로 구성되지는 않더라도 카본섬유와 같이 도전성을 갖는 섬유상의 비금속 섬유형상의 재질을 포함할 수 있다. For reference, the conductive fiber in the present invention may include a metal fiber including other metals (Al, Ag, Au, Cu, W) on the fiber other than the aforementioned silver (Ag) nanofibers, and further, Although not composed of a metal, it may include a fibrous nonmetallic fibrous material having conductivity such as carbon fiber.
또한, 본 명세서에서 사용되는 해리는 단순하게 녹이거나 용해(dissolver)시키는 것을 의미할 수 있지만, 보다 구체적으로 해리는 투명 도전막 내에 내포된 도전섬유들이 서로 엉겨 붙어 있는 상태가 해지되어 전기적인 통전 능력을 상실하도록 풀려서 서로 충분히 떨어져 있는 상태를 유지하게 하는 것을 해리라 지칭할 수 있다. In addition, dissociation used in the present specification may mean simply dissolving or dissolving. More specifically, dissociation of the conductive fibers contained in the transparent conductive film is entangled with each other, resulting in electrical conduction ability. It can be said that it is loosened so as to keep it sufficiently separated from each other.
또한, 도전섬유용액은 도전섬유, 수용성 바인더, 및 수용성 바인더의 용해를 위한 수용성 용매를 포함하고, 수용성 용매가 휘발되면서 도전섬유가 수용성 바인더에 의해서 절연기판 상에 고착되어 투명 도전막을 형성하며, 투명 절연패턴은 액상의 유성 수지를 단독으로 사용하거나 유성 수지의 용해를 위한 유성 용매를 유성 수지와 혼합하여, 투명 도전막 상에서 유성 수지를 경화시켜 형성하며, 투명 도전패턴을 형성하는 단계에서 수용성 바인더를 용해시키는 해리용 수지용액을 이용하여 도전섬유를 해리시킬 수 있다. In addition, the conductive fiber solution includes a conductive fiber, a water-soluble binder, and a water-soluble solvent for dissolving the water-soluble binder. As the water-soluble solvent is volatilized, the conductive fiber is fixed on the insulating substrate by the water-soluble binder to form a transparent conductive film. The insulating pattern is formed by using a liquid oily resin alone or by mixing an oily solvent for dissolving the oily resin with the oily resin, curing the oily resin on the transparent conductive film, and forming a water-soluble binder in the step of forming a transparent conductive pattern. The conductive fiber can be dissociated using a dissociable resin solution to dissolve.
투명 절연패턴의 유성 수지는 우레탄(urethane), 에폭시 아크릴레이트(epoxy acrylate), 폴리에스터 아크릴레이트(polyester acrylate) 중 적어도 어느 하나를 포함할 수 있고, 투명 절연패턴의 유성 용매는 아세톤(acetone), 메틸이소부틸케톤(MIBK; Methyl isobutyl ketone), 메틸에틸케톤(MEK; methyl ethyl ketone), 사이클로헥산(Cyclohexane), 톨루엔(toluene), 에틸레이트(ethylate), 아세트산에틸(ethyl acetate), 부틸 아세테이트(butyl acetate) 중 적어도 어느 하나를 포함할 수 있다. The oily resin of the transparent insulation pattern may include at least one of urethane, epoxy acrylate, and polyester acrylate, and the oily solvent of the transparent insulation pattern may include acetone, acetone, Methyl isobutyl ketone (MIBK), methyl ethyl ketone (MEK), cyclohexane, toluene, ethylate, ethyl acetate, butyl acetate ( butyl acetate).
또한, 도전섬유용액의 수용성 바인더는 에틸셀룰로스(ethyl cellulose)를 포함하며, 도전섬유용액의 수용성 용매는 물 또는 알코올계(alcohol meter)를 포함할 수 있다. In addition, the water-soluble binder of the conductive fiber solution may include ethyl cellulose, and the water-soluble solvent of the conductive fiber solution may include water or an alcohol meter.
한편, 도전섬유용액의 수용성 바인더, 투명 절연패턴의 유성 수지 및 유성 용매들의 구체적인 재료들을 앞에서 나열했지만, 도전섬유용액의 수용성 바인더는 추후 해리용 수지용액에 의해서 용해가 가능한 다른 수용성을 갖는 합성수지를 포함할 수 있음은 자명하며, 투명 절연패턴의 유성 수지 및 유성 용매들 또한 해리용 수지용액에 의해서 용해되지 않는 다른 유성(또는 지용성)의 합성수지를 포함할 수 있는 것은 자명한 사항이다. On the other hand, although the specific materials of the water-soluble binder of the conductive fiber solution, the oil-based resin of the transparent insulating pattern and the oil-based solvents are listed above, the water-soluble binder of the conductive fiber solution includes a synthetic resin having other water solubility that can be dissolved later by the dissociative resin solution. It is apparent that the oil-based resin and the oil-based solvent of the transparent insulating pattern may also include other oil-based (or fat-soluble) synthetic resins which are not dissolved by the dissociative resin solution.
투명 도전패턴에 의해서 보호된 부분을 제외한 영역의 도전섬유가 해리용 수지용액 내에서 고르게 구배되어 해리된 상태에서 그대로 해리용 수지용액이 경화됨으로써, 투명 도전패턴에 의해서 보호된 부분을 제외한 영역에서 투명 도전막은 전기 도전성을 상실할 수 있다. The conductive fiber in the region excluding the portion protected by the transparent conductive pattern is uniformly gradient in the dissociating resin solution and cured as it is, so that the dissociating resin solution is cured as it is, so that it is transparent in the region except the portion protected by the transparent conductive pattern. The conductive film may lose electrical conductivity.
특히, 금속섬유가 상기 제외한 영역 상부에 배치되는 해리용 수지용액 내에서 고르게 구배되고, 해리된 상태에서 그대로 해리용 수지용액을 경화시키는 경우, 투명 도전패턴에 의해서 보호된 부분을 제외한 영역 및 투명 도전패턴에 의해서 보호된 부분에서 금속섬유에 의한 광 투과도 저하는 동일할 수 있다. In particular, when the metal fiber is evenly gradient in the dissociation resin solution disposed above the excluded region, and the dissipation resin solution is cured as it is in the dissociated state, the region and the transparent conduction except for the portion protected by the transparent conductive pattern The light transmission by the metal fiber in the portion protected by the pattern may be the same.
해리용 수지용액은 수용성 수지 및 수용성 수지의 용해를 위한 수용성 용매를 포함할 수 있으며, 수용성 수지는 수용성 광경화 수지, 수용성 자연건조 수지, 및 수용성 열경화 수지 중 적어도 어느 하나를 포함할 수 있다. 또한, 수용성 용매는 물 또는 알코올계(alcohol meter)를 단독 또는 혼합하여 사용할 수 있다. The dissociation resin solution may include a water-soluble resin and a water-soluble solvent for dissolving the water-soluble resin, and the water-soluble resin may include at least one of a water-soluble photocurable resin, a water-soluble natural drying resin, and a water-soluble thermosetting resin. In addition, the water-soluble solvent may be used alone or mixed with water or alcohol (alcohol meter).
절연기판 상에는 하나의 터치패널센서만 형성할 수도 있지만, 터치패널센서를 하나의 셀로 정의하고 하나의 절연기판에 복수 셀의 터치패널센서를 동시에 형성하는 것도 가능하다. 복수 셀의 터치패널센서를 동시에 형성한 후, 각 셀을 재단하여 각각 터치패널센서의 도전패턴필름으로 사용이 가능하다. Although only one touch panel sensor may be formed on the insulating substrate, it is also possible to define the touch panel sensor as one cell and simultaneously form a plurality of touch panel sensors on one insulating substrate. After simultaneously forming a plurality of touch panel sensors, each cell may be cut and used as a conductive pattern film of the touch panel sensor.
또한, 투명 도전패턴을 형성한 후, 보호 코팅층을 형성할 수 있다. In addition, after the transparent conductive pattern is formed, a protective coating layer may be formed.
본 발명의 터치패널센서의 제조방법은 투명 도전패턴을 형성하되 종래와 같이 여러 번 마스크 패턴을 형성하고, 에칭으로 투명 도전패턴을 형성하고, 와이어패턴을 형성하기 전에 마스크 패턴을 제거하고, 그 다음 와이어패턴을 형성하는 과정을 단순화할 수 있으며, 공정의 수를 줄임으로써 공정상 발생하는 불량을 줄일 수가 있다. In the method of manufacturing a touch panel sensor of the present invention, a transparent conductive pattern is formed, but a mask pattern is formed as many times as in the prior art, a transparent conductive pattern is formed by etching, the mask pattern is removed before the wire pattern is formed, and then The process of forming the wire pattern can be simplified, and the defects generated in the process can be reduced by reducing the number of processes.
본 발명의 터치패널센서의 제조방법은 얇고 전면적으로 투명 도전막을 형성하고, 이를 이용하여 투명 도전패턴을 형성하기 때문에 투명 도전패턴 자체도 균일한 두께로 형성할 수 있다. In the manufacturing method of the touch panel sensor of the present invention, since the transparent conductive film is thinly formed on the entire surface and the transparent conductive pattern is formed using the transparent conductive pattern, the transparent conductive pattern itself can be formed to have a uniform thickness.
본 발명의 터치패널센서의 제조방법은 투명 도전패턴을 형성하되 롤 필름을 이용한 자동화 공정을 통해서 대량생산을 할 수 있기 때문에 하나의 셀 단위로 제작하는 종래의 기술에 비해 생산 속도 및 정확도, 수율을 높일 수가 있다.The manufacturing method of the touch panel sensor of the present invention forms a transparent conductive pattern, but can be mass-produced through an automated process using a roll film, so that the production speed, accuracy, and yield are higher than those of the conventional technology of manufacturing one cell unit. You can increase it.
도 1은 종래의 터치패널센서를 설명하기 위한 사시도이다.1 is a perspective view illustrating a conventional touch panel sensor.
도 2는 본 발명의 일 실시예에 따른 터치패널센서의 분해 사시도이다.2 is an exploded perspective view of a touch panel sensor according to an exemplary embodiment of the present invention.
도 3 내지 도 8은 도 2에 도시되는 상부시트를 제조하는 공정을 설명하기 위한 평면도 및 단면도들이다.3 to 8 are plan views and cross-sectional views for explaining a process of manufacturing the top sheet shown in FIG.
도 9 및 도 10은 본 발명의 다른 실시예에 따른 터치패널센서의 상부시트를 제조하는 공정을 설명하기 위한 평면도 및 단면도들이다.9 and 10 are a plan view and a cross-sectional view for explaining a process of manufacturing a top sheet of a touch panel sensor according to another embodiment of the present invention.
도 11 및 도 12는 본 발명의 또 다른 실시예에 따른 터치패널센서의 상부시트를 제조하는 공정을 설명하기 위한 평면도 및 단면도들이다.11 and 12 are plan views and cross-sectional views illustrating a process of manufacturing a top sheet of a touch panel sensor according to another embodiment of the present invention.
도 13은 본 발명의 또 다른 실시예에 따른 터치패널센서의 분해 사시도이다. 13 is an exploded perspective view of a touch panel sensor according to another embodiment of the present invention.
도 14 내지 도 18은 도 13에 도시되는 상부시트를 제조하는 공정을 설명하기 위한 평면도 및 단면도들이다. 14 to 18 are plan views and cross-sectional views for explaining a process of manufacturing the top sheet shown in FIG.
이하 첨부된 도면들을 참조하여 본 발명의 바람직한 실시예들을 상세하게 설명하지만, 본 발명이 실시예들에 의해 제한되거나 한정되는 것은 아니다. 참고로, 본 설명에서 동일한 번호는 실질적으로 동일한 요소를 지칭하며, 이러한 규칙 하에서 다른 도면에 기재된 내용을 인용하여 설명할 수 있고, 당업자에게 자명하다고 판단되거나 반복되는 내용은 생략될 수 있다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited or limited by the embodiments. For reference, in the present description, the same numbers refer to substantially the same elements, and may be described by referring to the contents described in the other drawings under these rules, and the contents determined to be obvious to those skilled in the art or repeated may be omitted.
도 2는 본 발명의 일 실시예에 따른 터치패널센서의 분해 사시도이며, 도 3 내지 도 8은 도 2에 도시되는 상부시트를 제조하는 공정을 설명하기 위한 평면도 및 단면도들이다.2 is an exploded perspective view of a touch panel sensor according to an exemplary embodiment of the present invention, and FIGS. 3 to 8 are plan and cross-sectional views illustrating a process of manufacturing the top sheet shown in FIG. 2.
도 2를 참조하면, 본 실시예에 따른 터치패널센서(100)는 상부커버기판(110), 상부시트(120), 하부시트(130), 및 연성회로기판(140)을 포함한다. Referring to FIG. 2, the touch panel sensor 100 according to the present exemplary embodiment includes an upper cover substrate 110, an upper sheet 120, a lower sheet 130, and a flexible circuit board 140.
상부시트(120)는 상부 절연기판(122), 상부 도전패턴(126), 상부 와이어패턴(128), 및 상부 도전성 단자(129)를 포함한다. 그리고, 하부시트(130) 역시 하부 절연기판(132), 하부 도전패턴(136), 하부 와이어패턴(138), 및 하부 도전성 단자(139)를 포함한다. 참고로, 도전패턴들은 정전용량방식 터치패널센서를 위한 것으로서, 하부 도전패턴(136)은 트랜스미터(transmitter)로 작동을 하며, 상부 도전패턴(126)은 리시버(receiver)로 작동할 수가 있다.The upper sheet 120 includes an upper insulating substrate 122, an upper conductive pattern 126, an upper wire pattern 128, and an upper conductive terminal 129. The lower sheet 130 also includes a lower insulating substrate 132, a lower conductive pattern 136, a lower wire pattern 138, and a lower conductive terminal 139. For reference, the conductive patterns are for a capacitive touch panel sensor, the lower conductive pattern 136 may operate as a transmitter, and the upper conductive pattern 126 may operate as a receiver.
상부 절연기판(122) 상에는 상부 도전패턴(126) 및 상부 와이어패턴(128)이 배치될 수 있고, 하부 절연기판(132) 상에는 하부 도전패턴(136) 및 하부 와이어패턴(138)이 배치된다. 그리고, 상부 도전패턴(126)은 도 2를 기준으로 상부 절연기판(122) 상에서 종방향으로 배치되며, 하부 도전패턴(136)은 하부 절연기판(132) 상에서 횡방향으로 배치되어 상부 도전패턴(126)과 서로 교차하는 영역을 형성할 수 있다. The upper conductive pattern 126 and the upper wire pattern 128 may be disposed on the upper insulating substrate 122, and the lower conductive pattern 136 and the lower wire pattern 138 may be disposed on the lower insulating substrate 132. In addition, the upper conductive pattern 126 is disposed in the longitudinal direction on the upper insulating substrate 122 with reference to FIG. 2, and the lower conductive pattern 136 is disposed in the transverse direction on the lower insulating substrate 132 so that the upper conductive pattern ( 126 may be formed to intersect with each other.
상부커버기판(110)은 신체 일부가 직접 터치되는 관계로 강도가 뛰어나 쉽게 굴절되지 않는 강성 유리 기판을 사용하거나, 강도가 뛰어나 쉽게 굴절되지 않는 폴리카보네이트(polycarbonate)와 같은 투광성 강화플라스틱을 사용할 수 있다. The upper cover substrate 110 may use a rigid glass substrate having high strength and not easily refracted due to direct contact with a part of the body, or a light-transmitting reinforced plastic such as polycarbonate having excellent strength and not easily refracted. .
또한, 상부커버기판(110)의 저면에는 액자 형상의 윈도우 데코레이션(112)이 제공되는데, 윈도우 데코레이션(112)은 그 하부에 배치되는 투명하지 못한 구성요소, 예를 들면, 상부 절연기판(122)과 하부 절연기판(132)의 가장자리에 배치되는 상부 및 하부 와이어패턴(128, 138) 및 연성회로기판(140)을 가리는 용도로서 제공될 수 있다. 경우에 따라서는 상부커버기판이 절연기판으로 기능을 하여, 상부 도전패턴이 상부커버기판의 저면에 바로 형성될 수도 있고, 터치패널센서의 구조에 따라 하부 도전패턴도 상부커버기판에 형성될 수도 있다. 즉, 도면과 같이, 유리기판-상부 필름-하부 필름의 구조로 제공되는 것 외에도, 유리기판-필름의 구조로 제공되어 유리기판의 저면 및 필름의 상면에 각각 도전패턴이 형성될 수도 있고, 필름의 상면 및 저면 모두 도전 패턴이 형성될 수도 있다. 이에 대해서는 종래의 적층 구조를 참조할 수 있으며, 도전패턴과 와이어패턴, 절연패턴 간의 관계를 제외한 기판, 필름 등의 적층구조는 본 발명을 제한하지 않는다. In addition, the bottom surface of the upper cover substrate 110 is provided with a frame-shaped window decoration 112, the window decoration 112 is a non-transparent component, for example, the upper insulating substrate 122 And the upper and lower wire patterns 128 and 138 disposed on the edges of the lower insulating substrate 132 and the flexible circuit board 140. In some cases, the upper cover substrate functions as an insulating substrate so that the upper conductive pattern may be directly formed on the bottom surface of the upper cover substrate, and the lower conductive pattern may be formed on the upper cover substrate according to the structure of the touch panel sensor. . That is, as shown in the drawing, in addition to the structure of the glass substrate-upper film-lower film, it is provided in the structure of the glass substrate-film to form a conductive pattern on the bottom surface of the glass substrate and the top surface of the film, respectively, Conductive patterns may be formed on both the top and bottom surfaces of the substrate. This can be referred to a conventional laminated structure, the laminated structure of the substrate, film, etc., except for the relationship between the conductive pattern, the wire pattern, and the insulating pattern does not limit the present invention.
참고로, 상부 및 하부 절연기판(122, 132)은 폴리에틸렌(polyethylene), 폴리프로필렌(polypropylene), 아크릴(acryloyl), 폴리에틸렌 테레프탈레이트(PET) 등의 플라스틱 및 유리 등의 소재를 두루 이용할 수 있다. For reference, the upper and lower insulating substrates 122 and 132 may use materials such as polyethylene, polypropylene, acrylloyl, polyethylene terephthalate, and glass.
한편, 상부커버기판(110), 상부시트(120), 및 하부시트(130) 사이 사이에는 광학접착층이 개재되어 상호 접합될 수 있고, 광학접착층은 빛이 잘 투과되어 광학적으로도 우수한 광학접착필름 또는 OCA(Optically Clear Adhesive)필름, UV 경화제 등을 이용할 수 있다. Meanwhile, an optical adhesive layer may be interposed between the upper cover substrate 110, the upper sheet 120, and the lower sheet 130, and the optical adhesive layer may be optically excellent because light is transmitted through the optical adhesive layer. Alternatively, an OCA (Optically Clear Adhesive) film, a UV curing agent, or the like may be used.
또한, 연성회로기판(140)에는 상부 절연기판(122) 및 하부 절연기판(132)에 형성되는 상부 및 하부 와이어패턴(128, 138)과 전기적으로 접합되는 단자가 배치될 수 있다. 따라서, 상부커버기판(110) 표면에 대상체가 접근하면 상부 도전패턴(126) 및 하부 도전패턴(136)이 상호 작용하여 발생하는 커패시턴스 값의 변화가 상부 및 하부 와이어패턴(128, 138)을 따라서 외부장치에 전송될 수 있고, 여기서 외부장치에 해당하는 제어부에서는 상기 값의 변화를 이용하여 터치 위치를 계산할 수 있다. In addition, the flexible circuit board 140 may include terminals electrically connected to the upper and lower wire patterns 128 and 138 formed on the upper insulating substrate 122 and the lower insulating substrate 132. Therefore, when an object approaches the surface of the upper cover substrate 110, the change in capacitance value caused by the interaction between the upper conductive pattern 126 and the lower conductive pattern 136 is along the upper and lower wire patterns 128 and 138. The touch position may be transmitted to an external device, and the control unit corresponding to the external device may calculate the touch position by using the change in the value.
이상 본 발명에 따른 터치패널센서의 개략적인 구성 및 그 구성요소에 대하여 언급하였으며, 이하 상기 터치패널센서 특히, 대상체의 접근에 의한 전기신호를 발생시키는 상부 및 하부시트의 제조 과정을 중점적으로 설명하되, 하부시트에 대한 설명은 상부시트에 대한 설명으로 대체할 수 있다. The configuration and components of the touch panel sensor according to the present invention have been described above. Hereinafter, the manufacturing process of the upper and lower sheets for generating an electric signal by the approach of the touch panel sensor, in particular, will be described. The description of the lower sheet may be replaced with the description of the upper sheet.
이하, 도 3 내지 도 8을 참조하면서 상부시트(120)의 제조과정을 설명한다. 후술하겠지만, 아래의 과정은 패턴만 달리하여 하부시트(130)의 제조과정에서도 적용될 수 있으며, 하나의 절연기판 상하면에 상부 도전패턴 및 하부 도전패턴을 형성하는 경우에도 적용될 수 있다. Hereinafter, a manufacturing process of the top sheet 120 will be described with reference to FIGS. 3 to 8. As will be described later, the following process may be applied to the manufacturing process of the lower sheet 130 by changing only the pattern, and may also be applied to the case of forming the upper conductive pattern and the lower conductive pattern on the upper and lower surfaces of one insulating substrate.
또한, 상부시트(120)는 원래 하나의 절연기판 원지에 복수 셀로 동시에 형성될 수 있으며, 이러한 과정에 이하 도면과 같이 진행될 수 있다. 또한, 이러한 과정을 롤러를 통과하는 과정을 통해서 대량생산에 유리하게 쉽게 변경될 수도 있다. In addition, the top sheet 120 may be formed at the same time as a plurality of cells on the original one insulating substrate base material, it can be progressed as shown in the following drawings. In addition, this process may be easily changed in favor of mass production through the process through the roller.
도 3을 참조하면, 복수 셀의 터치패널센서를 위한 롤 형태의 절연원판(121)이 제공된다. 절연원판(121)의 상면에는 연결패턴(170) 및 투명 도전막(124)이 전면적으로 도포되어 제공된다. 본 실시예에서, 연결패턴(170)이 투명 도전막(124)보다 나중에 제공되지만, 투명 도전막과 연결패턴의 형성 순서는 바뀔 수 있다. 구체적으로, 본 발명의 다른 실시예에서는 절연기판 상에 연결패턴을 먼저 형성하고, 투명 도전막을 연결패턴과 절연기판을 모두 커버하게 형성할 수도 있다. Referring to FIG. 3, a roll-shaped insulating disc 121 for a touch panel sensor of a plurality of cells is provided. The connection pattern 170 and the transparent conductive layer 124 are coated on the entire surface of the insulating disc 121. In the present embodiment, the connection pattern 170 is provided later than the transparent conductive film 124, but the order of forming the transparent conductive film and the connection pattern may be changed. Specifically, in another embodiment of the present invention, the connection pattern may be first formed on the insulating substrate, and the transparent conductive film may be formed to cover both the connection pattern and the insulating substrate.
연결패턴(170)은 투명 도전막(124)과 동일한 재질로 제공될 수도 있으나, 추후 투명 도전막(124)으로부터 투명 도전패턴(126)을 형성하는 에칭 과정에서 영향을 받지 않도록 투명 도전막(124)과 이종의 재질로 제공되는 것이 바람직하다. 그리고, 실버페이스트나 카본 잉크와 같이 와이어패턴과 유사한 재질을 채택하여 와이어패턴과의 접합성을 높일 수도 있다.The connection pattern 170 may be provided with the same material as the transparent conductive layer 124, but the transparent conductive layer 124 may not be affected in an etching process of forming the transparent conductive pattern 126 from the transparent conductive layer 124. ) And heterogeneous materials are preferred. In addition, by adopting a material similar to the wire pattern, such as silver paste or carbon ink, bonding to the wire pattern may be improved.
상기 투명 도전막(124)은 ITO 도전막 혹은 도전섬유용액을 이용한 도전막으로 제공될 수 있으며, 이는 종래의 방법에 따라 현장에서 형성되거나 이미 형성된 상태로 외부 업체에서 제공받을 수가 있다. The transparent conductive film 124 may be provided as an electrically conductive film using an ITO conductive film or a conductive fiber solution, which may be provided in the field according to a conventional method or may be provided by an external company in the already formed state.
도 4를 참조하면, 투명 도전막(124) 상에 설계된 투명 도전패턴(126)의 형상에 대응하는 투명 절연패턴(156)을 형성하되, 추후 와이어패턴(128)과 연결패턴(170)을 연결할 수 있도록 연결패턴(170)을 일부 노출시킨 상태로 형성한다. 투명 절연패턴(156)은 상하로 길게 연장된 직사각형의 외형을 가지며, 내부로는 균일한 간격으로 형성된 사각형 홀을 포함한다. 따라서 투명 절연패턴(156)에는 상부 및 하부가 연결되어 있으며 균일한 폭 및 간격으로 형성된 3개의 직선 패턴이 제공된다. 3개의 직선 패턴이 하나의 그룹을 형성하며, 6개의 투명 절연패턴(156)이 균일한 간격으로 평행하게 배치된다.Referring to FIG. 4, a transparent insulating pattern 156 corresponding to the shape of the transparent conductive pattern 126 designed on the transparent conductive layer 124 is formed, and the wire pattern 128 and the connection pattern 170 are later connected. The connection pattern 170 is partially exposed so as to be exposed. The transparent insulating pattern 156 has a rectangular shape extending vertically up and down, and includes a rectangular hole formed at even intervals therein. Therefore, the transparent insulating pattern 156 is provided with three straight patterns connected to the top and bottom and formed in a uniform width and spacing. Three straight patterns form a group, and six transparent insulating patterns 156 are arranged in parallel at equal intervals.
참고로, 위의 구조는 투명 도전패턴으로 가능한 일 예로서, 터치패널센서의 종류 또는 기능에 따라 다이아몬드 구조나 트랜스미터 등의 다양한 구조로 형성될 수가 있다.For reference, the above structure may be formed of various structures such as a diamond structure or a transmitter according to the type or function of the touch panel sensor as an example of a transparent conductive pattern.
투명 절연패턴(156)을 형성하고 나서, 도 5를 참조하면, 에칭을 통해서 투명 절연패턴(156)에 의해서 덮이지 않은 투명 도전막(124) 부분을 제거할 수 있다. 투명 절연패턴(156)은 마스크로 기능을 하며, ITO 또는 도전섬유를 포함하는 투명 도전막(124)의 일부는 사직식각에 사용하는 식각방법이나 수성 용액이나 은 에칭 용액에 의해서 제거될 수 있다. 투명 도전막(124) 중 투명 절연패턴(156)이 인쇄되지 않은 부분을 부분적으로 제거함으로써 투명 도전패턴(126)을 형성할 수가 있다. After the transparent insulating pattern 156 is formed, referring to FIG. 5, a portion of the transparent conductive film 124 not covered by the transparent insulating pattern 156 may be removed by etching. The transparent insulating pattern 156 functions as a mask, and a part of the transparent conductive film 124 including ITO or conductive fibers may be removed by an etching method used for receding etching, an aqueous solution, or a silver etching solution. The transparent conductive pattern 126 may be formed by partially removing a portion of the transparent conductive film 124 not printed with the transparent insulating pattern 156.
그리고 나서, 도 6을 참조하면, 절연원판(121)을 전체적으로 덮도록 와이어층(127)을 형성한다. 여기서, 와이어층은 도포나 인쇄, 실크스크린 등의 방법부터 스퍼터링(sputtering)을 이용한 방법을 두루 적용할 수 있다.Then, referring to FIG. 6, the wire layer 127 is formed to cover the insulating disc 121 as a whole. Here, the wire layer may be applied to a method using sputtering from a method such as coating, printing, or silk screen.
그 후에, 도 7에 도시되는 바와 같이, 설계된 와이어패턴(128)을 위한 와이어층(127)의 에칭 과정을 거칠 수 있다. 와이어층(127)의 에칭 과정에서도 투명 절연패턴(156)의 하부의 투명 도전패턴(126)은 그대로 보호될 수 있고, 이 과정에서 연결패턴(170)과 접촉되는 와이어층(127) 부분은 다른 부분보다 넓은 면적으로 남도록 에칭하여 연결패턴(170)과 그 상부에 배치되는 와이어패턴(128)의 접합성 및 전기 도전성을 높게 한다. 이렇게 연결패턴(170)과 직접 연결되는 와이어패턴(128)은 연결패턴(170)을 통해서 투명 절연패턴(156) 하부의 투명 도전패턴(126)과 전기적으로 연결될 수 있다. Thereafter, as shown in FIG. 7, the etching process of the wire layer 127 for the designed wire pattern 128 may be performed. Even during the etching of the wire layer 127, the transparent conductive pattern 126 below the transparent insulating pattern 156 may be protected as it is, and in this process, the portion of the wire layer 127 contacting the connection pattern 170 may be different. It is etched so as to have a larger area than the portion to increase the bonding property and the electrical conductivity of the connection pattern 170 and the wire pattern 128 disposed thereon. The wire pattern 128 directly connected to the connection pattern 170 may be electrically connected to the transparent conductive pattern 126 under the transparent insulation pattern 156 through the connection pattern 170.
본 실시예에서 와이어층(127)은 도포나 인쇄 등의 방법부터 스퍼터링을 이용한 방법을 두루 적용할 수 있다. 물론, 와이어패턴을 실버페이스트 실크인쇄, 실버잉크를 포함하는 도전성 잉크의 그라비아 인쇄, 플렉소 인쇄 등의 인쇄 방법 등을 이용한 인쇄 방법을 통해서 제공할 수도 있지만, 본 실시예에서는 투명 절연패턴(156)을 먼저 형성하고, 와이어패턴(128)을 형성하기 때문에 와이어패턴(128)을 와이어층(127)의 에칭 공정을 통해서도 형성할 수 있으며, 이렇게 형성된 와이어패턴(128)은 연성회로기판(140)의 단자와 전기적으로 연결될 수 있다. In the present embodiment, the wire layer 127 may be applied to a method using sputtering from a method such as coating or printing. Of course, the wire pattern may be provided through a printing method using a printing method such as silver paste silk printing, gravure printing of a conductive ink including silver ink, flexographic printing, or the like. In this embodiment, the transparent insulating pattern 156 may be provided. Is formed first, and the wire pattern 128 is formed. Thus, the wire pattern 128 may also be formed through an etching process of the wire layer 127, and the wire pattern 128 may be formed on the flexible circuit board 140. It may be electrically connected to the terminal.
본 실시예에서는 투명 절연패턴(156)을 만들고 나서, 에칭으로 투명 절연패턴(156) 하부의 투명 도전막(124)을 남겨 투명 도전패턴(126)을 형성하고, 그 후에 와이어층(127)로부터 와이어패턴(128)을 형성하였다. In the present embodiment, after the transparent insulating pattern 156 is formed, the transparent conductive pattern 126 is formed by leaving the transparent conductive film 124 under the transparent insulating pattern 156 by etching, and then, from the wire layer 127. The wire pattern 128 was formed.
다만, 경우에 따라서 투명 절연패턴 및 와이어패턴을 순서에 무관하게 형성하고, 그 다음에 투명 도전막을 이용하여 에칭이나 해리를 통해 투명 도전패턴을 형성하는 것도 가능하다. 이러한 경우, 와이어패턴 하부의 투명 도전막도 절연원판 상에 잔류할 수 있다. In some cases, however, the transparent insulating pattern and the wire pattern may be formed regardless of the order, and then the transparent conductive pattern may be formed by etching or dissociation using the transparent conductive film. In this case, the transparent conductive film under the wire pattern may also remain on the insulating disc.
도 8을 참조하면, 투명 도전패턴(126) 및 와이어패턴(128)을 모두 형성한 후 보호 코팅층(125)을 형성하고, 원지 형태의 절연원판(121)을 재단하여 각 셀에 대응하는 절연기판(122)을 제공할 수 있다. 일반적으로 보호 코팅층(125)을 형성하고 원지 형태의 절연원판(121)을 재단하는 것이 바람직하지만, 경우에 따라서는 보호 코팅층(125)을 재단 후 형성할 수도 있다.Referring to FIG. 8, after forming both the transparent conductive pattern 126 and the wire pattern 128, the protective coating layer 125 is formed, and an insulating substrate corresponding to each cell is cut by cutting the insulating base plate 121 in a paper form. 122 may be provided. In general, it is preferable to form the protective coating layer 125 and to cut the insulating disk 121 in the form of a base paper. However, in some cases, the protective coating layer 125 may be formed after cutting.
상술한 바와 같이, 터치패널센서 하나에 사용되는 크기의 상부 절연기판 상에 상부 도전패턴 및 상부 와이어패턴을 매번 개별적으로 형성할 수도 있다. 하지만, 본 실시예에서는 적어도 한 장 이상의 상부 절연기판(122)에 대응하는 상부 절연원판(121)을 권취롤러에서 인출하면서 상부 도전패턴(126) 및 상부 와이어패턴(128)을 제공하여, 여러 장의 상부 절연기판(122)을 일괄적으로 생산하고, 이를 사용하기 전에 재단하여 터치패널센서(100)에 바로 적용할 수 있다. As described above, the upper conductive pattern and the upper wire pattern may be separately formed each time on the upper insulating substrate having a size used for one touch panel sensor. However, in the present exemplary embodiment, the upper conductive pattern 126 and the upper wire pattern 128 are provided by drawing out the upper insulating plate 121 corresponding to at least one or more upper insulating substrates 122 from the winding rollers. The upper insulating substrate 122 is produced in a batch, and can be cut and used directly before the touch panel sensor 100 is used.
본 실시예의 상부 절연원판(121)은 적어도 하나 이상의 상부 절연기판(122)에 대응하는 크기로 제공되며, 구체적으로, 1*x의 상부 절연기판(122)을 한꺼번에 형성할 수 있는 공정을 따르되, 제작자의 의도에 따라서 5*5, 6*6, 3*4 등과 같이 x*y로 설계 변경할 수도 있다. The upper insulating plate 121 of the present embodiment is provided in a size corresponding to at least one or more upper insulating substrates 122, specifically, the process of forming the upper insulating substrate 122 of 1 * x at a time, Depending on the manufacturer's intention, the design can be changed to x * y, such as 5 * 5, 6 * 6, 3 * 4, etc.
절연원판(121) 전체를 덮고 있는 보호 코팅층(125)에 의해서 상부 절연원판(121)의 투명 도전패턴(126)은 외부의 물리적 충격에 의해서 전기적인 단락이 최소화되고, 산화되는 화학적인 영향으로부터도 벗어날 수 있다. The transparent conductive pattern 126 of the upper insulating plate 121 is protected by the protective coating layer 125 covering the entire insulating plate 121. Can escape.
참고로, 도전패턴(126)은 대략 0.1 내지 0.2㎛ 정도로 제공 가능하고, 보호 코팅층(125)은 대략 0.5㎛ 이상으로 제공되어 상부 도전패턴(126)이 상부 보호 코팅층(125) 표면으로 노출되는 것이 방지될 수 있다. For reference, the conductive pattern 126 may be provided at about 0.1 to about 0.2 μm, and the protective coating layer 125 may be provided at about 0.5 μm or more to expose the upper conductive pattern 126 to the surface of the upper protective coating layer 125. Can be prevented.
보호 코팅층(125)은 앞서 언급했듯이 상부 와이어패턴(128) 역시 커버하고 있다. 따라서, 제어부 또는 연성회로기판(140)과 같은 외부장치와 상부 와이어패턴(128)을 전기적으로 연결하기 위해서는 보호 코팅층(125)을 부분적으로 제거하여 상부 와이어패턴(128)의 단부를 노출시킬 필요가 있다. The protective coating layer 125 also covers the upper wire pattern 128 as mentioned above. Therefore, in order to electrically connect the upper wire pattern 128 with an external device such as the controller or the flexible circuit board 140, it is necessary to partially remove the protective coating layer 125 to expose the end portion of the upper wire pattern 128. have.
와이어패턴(128)의 단부를 노출시킬 수 있도록 레이저를 이용하여 상부 보호 코팅층(125)에 관통 홀을 형성하고, 와이어패턴(128)에서 노출된 도전성 단자(129)를 연성회로기판(140)과 연결할 수가 있다. 대상체의 접근에 의해서 도전패턴(126)에서 발생하는 전기적 변화가 와이어패턴(128) 및 연성회로기판(140)을 순차적으로 지나 제어부로 전송될 수 있고, 제어부에서는 상기 전기적 변화를 이용하여 터치 위치를 계산할 수 있다. 물론, 관통 홀을 형성하기 위해서 보호코팅층만 선택적으로 벗겨내는 레이저 에칭 방법 외에도 화학적 에칭이나 물리적 타공의 방법을 사용할 수도 있다.Through holes are formed in the upper protective coating layer 125 using a laser to expose the ends of the wire patterns 128, and the conductive terminals 129 exposed from the wire patterns 128 are connected to the flexible circuit board 140. I can connect it. Electrical changes generated in the conductive pattern 126 by the approach of the object may be sequentially transmitted through the wire pattern 128 and the flexible circuit board 140 to the controller, and the controller may adjust the touch position by using the electrical changes. Can be calculated Of course, in addition to the laser etching method of selectively peeling only the protective coating layer to form the through hole, a method of chemical etching or physical perforation may be used.
이 외에도 보호코팅층을 형성할 때, 처음부터 관통 홀이 형성되도록 보호코팅층을 인쇄할 수 있으며, 인쇄와 동시에 도전성 단자가 바로 외부로 노출될 수도 있는 것도 가능하며, 이 경우 보호코팅층에서 레이저나 화학적 에칭으로 관통 홀을 형성하는 과정을 생략할 수가 있다. In addition, when forming the protective coating layer, the protective coating layer may be printed so that the through hole is formed from the beginning, and the conductive terminal may be directly exposed to the outside at the same time as printing, in this case, laser or chemical etching on the protective coating layer. The process of forming the through hole can be omitted.
참고로, 본 실시예에서 도전패턴(126, 136)은 3개의 직선 패턴이 하나의 그룹을 형성하도록 상부와 하부 단부가 연결되는 그룹 구조를 가지나, 본 발명이 도전패턴의 구조에 제한되지는 않으며, 도전패턴은 공개번호 10-2011-0092814, 10-2010-0138849, 및 10-2011-0095684 등의 터치패널센서에 이미 개시된 구조를 두루 적용할 수 있다. For reference, in the present embodiment, the conductive patterns 126 and 136 have a group structure in which upper and lower ends are connected such that three straight patterns form a group, but the present invention is not limited to the structure of the conductive pattern. The conductive pattern may be applied to a structure already disclosed in touch panel sensors such as Publication Nos. 10-2011-0092814, 10-2010-0138849, and 10-2011-0095684.
본 실시예에서는 상부시트를 대상으로 설명하였지만, 하부시트에서도 동일하게 적용될 수 있으며, 하나의 롤 필름에서 양면에 상부 및 하부의 도전패턴을 동시에 또는 차례로 형성하는 경우로도 설명될 수 있다. 또한, 강화유리기판에 상부 도전패턴을 직접 형성하고, 설명된 방법으로 하부 도전패턴을 절연기판 상에 형성한 후 상호 부착하는 경우도 이에 해당할 수 있다.In the present embodiment, the upper sheet has been described as an object, but the same may be applied to the lower sheet, and may also be described as the case where the upper and lower conductive patterns are simultaneously or sequentially formed on both surfaces in one roll film. In addition, the upper conductive pattern may be directly formed on the tempered glass substrate, and the lower conductive pattern may be formed on the insulating substrate and then attached to each other.
도 9는 및 도 10은 본 발명의 다른 실시예에 따른 터치패널센서의 상부시트를 제조하는 공정을 설명하기 위한 평면도 및 단면도들이다. 참고로, 절연원판, 연결패턴, 투명 절연패턴, 및 투명 도전막에 대한 설명 및 이를 형성하는 과정에 대해서는 상술한 설명을 참조할 수 있다.9 and 10 are a plan view and a cross-sectional view for explaining a process of manufacturing a top sheet of a touch panel sensor according to another embodiment of the present invention. For reference, the description of the insulating disc, the connection pattern, the transparent insulating pattern, and the transparent conductive film and the process of forming the same may refer to the above description.
도 9를 참조하면, 본 실시예에서는 절연원판(221)에 도전섬유, 수용성 바인더, 및 수용성 바인더의 용해를 위한 수용성 용매가 혼합된 도전섬유용액으로 투명 도전막(224)을 형성하고, 그 위에 연결패턴(270)을 형성하지만, 도전막 및 연결패턴은 그 형성 순서를 변경할 수도 있다. 도전섬유용액으로부터 투명 도전막(224)을 형성하는 과정에서, 수용성 용매는 물이나 알코올계를 사용하여 휘발되어 사라지고, 실질적으로 도전섬유는 수용성 바인더를 통해서 절연원판(221)상에 안정적으로 부착된다. 이 상태에서는 도전섬유가 서로 얽혀 있기 때문에 비록 중간에 수용성 바인더가 끼어 들어 있더라도 투명 도전막(224)은 도전성을 가진다. 본 실시예에서, 도전섬유용액의 수용성 바인더로 에틸셀룰로스(ethyl cellulose)를 사용할 수 있고, 수용성 용매로는 물 또는 알코올계 재료를 사용할 수 있다. 본 실시예에서 도전섬유라 함은, 앞서 언급한 은(Ag) 나노 섬유 외의 섬유 상의 여타의 금속(Al, Ag, Au, Cu, W)들을 포함하는 금속섬유를 포함할 수 있고, 나아가 금속으로 구성되지는 않더라도 카본섬유와 같이 도전성을 갖는 섬유상의 비금속 섬유형상의 재질을 포함할 수 있다. Referring to FIG. 9, in the present embodiment, a transparent conductive film 224 is formed of a conductive fiber solution containing a conductive fiber, a water-soluble binder, and a water-soluble solvent for dissolving the water-soluble binder on the insulating disc 221, and thereon. Although the connection pattern 270 is formed, the order of forming the conductive film and the connection pattern may be changed. In the process of forming the transparent conductive film 224 from the conductive fiber solution, the water-soluble solvent is volatilized and disappeared using water or alcohol, and substantially the conductive fiber is stably attached onto the insulating disc 221 through the water-soluble binder. . In this state, since the conductive fibers are entangled with each other, the transparent conductive film 224 has conductivity even if a water-soluble binder is interposed therebetween. In this embodiment, ethyl cellulose may be used as the water-soluble binder of the conductive fiber solution, and water or an alcohol-based material may be used as the water-soluble solvent. In this embodiment, the conductive fiber may include a metal fiber including other metals (Al, Ag, Au, Cu, W) on a fiber other than the silver (Ag) nanofibers mentioned above, and furthermore, Although not constituted, it may include a fibrous nonmetallic fibrous material having conductivity such as carbon fiber.
참고로, 투명 도전막을 형성하는 과정에서, 투명 도전패턴이 배치되는 터치영역에만 투명 도전막을 인쇄 형성할 수도 있고, 전면에 투명 도전막을 형성하고 와이어부재나 윈도우 데코레이션이 배치되는 비터치영역(베젤영역)의 투명 도전막은 에칭을 통해서 미리 제거해둘 수도 있다. 즉, 투명 도전막을 터치영역에 대응하게 형성하는 것도 가능하다.For reference, in the process of forming the transparent conductive film, the transparent conductive film may be printed and formed only on the touch area in which the transparent conductive pattern is disposed, or the non-touch area in which the transparent conductive film is formed on the front surface and the wire member or window decoration is disposed (bezel area). ) May be removed in advance by etching. That is, it is also possible to form a transparent conductive film corresponding to the touch area.
그 후에, 와이어패턴(228)을 제공한 다음, 원하는 투명 도전패턴(226) 형상에 대응하여 투명 도전막(224) 상에 투명 절연패턴(256)을 형성한다. 물론, 투명 절연패턴을 먼저 형성하고 나서 와이어패턴을 제공하는 것도 가능하고, 와이어패턴과 투명 절연패턴의 형성 순서와 무관하게 투명 도전막을 해리나 에칭하여 투명 도전패턴을 형성하는 과정은 그 이후가 될 수 있다. Thereafter, the wire pattern 228 is provided, and then a transparent insulating pattern 256 is formed on the transparent conductive film 224 to correspond to the desired shape of the transparent conductive pattern 226. Of course, it is also possible to form a transparent insulating pattern first and then provide a wire pattern, and the process of forming a transparent conductive pattern by dissociating or etching the transparent conductive film irrespective of the order of forming the wire pattern and the transparent insulating pattern will be thereafter. Can be.
본 실시예에서는 앞선 실시예와는 다르게 와이어패턴(228)과 투명 절연패턴(256)을 순차적으로 제공하고, 와이어패턴(228)이나 투명 절연패턴(256)에 가려지지 않는 투명 도전막(224)을 해리하여 투명 도전패턴(226)을 제공하는 경우로 설명한다. 이는 도 10의 (b)에서 각 구성요소의 적층구조를 통해서 확인할 수 있다. Unlike the previous embodiment, the present embodiment sequentially provides the wire pattern 228 and the transparent insulating pattern 256, and does not cover the wire pattern 228 or the transparent insulating pattern 256. It will be described as a case of dissociating to provide the transparent conductive pattern 226. This can be confirmed through the laminated structure of each component in FIG.
투명 절연패턴(256)은 액상의 유성 수지를 단독으로 사용할 수도 있지만, 유성 수지의 용해를 위한 유성 용매를 유성 수지와 혼합하여, 투명 도전막(224) 상에서 유성 수지를 경화시켜 형성할 수 있다. The transparent insulating pattern 256 may be a liquid oil resin alone, but may be formed by mixing an oil solvent for dissolving the oil resin with the oil resin and curing the oil resin on the transparent conductive film 224.
투명 절연패턴의 유성 수지는 우레탄(urethane), 에폭시 아크릴레이트(epoxy acrylate), 폴리에스터 아크릴레이트(polyester acrylate) 중 적어도 어느 하나를 포함할 수 있고, 투명 절연패턴의 유성 용매는 아세톤(acetone), 메틸이소부틸케톤(MIBK; Methyl isobutyl ketone), 메틸에틸케톤(MEK; methyl ethyl ketone), 사이클로헥산(Cyclohexane), 톨루엔(toluene), 에틸레이트(ethylate), 아세트산에틸(ethyl acetate), 부틸 아세테이트(butyl acetate) 중 적어도 어느 하나를 포함할 수 있다. The oily resin of the transparent insulation pattern may include at least one of urethane, epoxy acrylate, and polyester acrylate, and the oily solvent of the transparent insulation pattern may include acetone, acetone, Methyl isobutyl ketone (MIBK), methyl ethyl ketone (MEK), cyclohexane, toluene, ethylate, ethyl acetate, butyl acetate ( butyl acetate).
도 9를 다시 살피면 투명 도전막(224) 상에 투명 절연패턴(256)이 균일 간격으로 형성되어 있으며, 투명 도전막(224) 상에 와이어패턴(228)의 단부가 위치하고, 그 위로 투명 절연패턴(256)이 형성되어 있다. Referring to FIG. 9 again, transparent insulating patterns 256 are formed on the transparent conductive film 224 at uniform intervals, and ends of the wire patterns 228 are positioned on the transparent conductive film 224, and the transparent insulating patterns are disposed thereon. 256 is formed.
그 다음으로, 와이어패턴(228)이나 투명 절연패턴(256)에 의해서 보호되지 않은 부분의 투명 도전막(224) 내의 도전섬유가 도전성을 상실하도록 해리시킬 수 있다. 이 과정은 도 10을 참조할 수 있다. 여기서, 해리는 단순하게 용해(dissolver)시키는 의미를 내포할 수도 있지만, 보다 구체적으로 투명 도전막(224) 내에 내포된 도전섬유들이 서로 엉겨 붙어 있는 상태가 풀려서 해지되어 전기적인 통전 능력을 상실하도록 서로 충분히 떨어져 있는 상태로 변화시키는 의미를 가질 수 있다. Next, the conductive fibers in the transparent conductive film 224 of the portion not protected by the wire pattern 228 or the transparent insulating pattern 256 can be dissociated so as to lose conductivity. This process may refer to FIG. 10. Here, the dissociation may imply a simple dissolver, but more specifically, the conductive fibers contained in the transparent conductive film 224 are entangled with each other to be released and terminated to lose electrical conduction ability. It can have the meaning of changing to a sufficiently separated state.
도 10을 참조하면, 절연원판(221) 상에 투명 절연패턴(256)이 충분히 덮이도록 해리용 수지용액(260)을 도포한다. Referring to FIG. 10, the dissociation resin solution 260 is coated on the insulating disc 221 so that the transparent insulating pattern 256 is sufficiently covered.
여기서, 해리용 수지용액(260)의 높이는 투명 도전막(224) 내에 내포된 도전섬유들이 전기 도전성을 상실하게 충분히 이격될 수 있는 공간을 줄 수 있는 범위 내에서 얼마든지 조절 가능하다. Here, the height of the dissociation resin solution 260 can be adjusted as long as the conductive fibers contained in the transparent conductive film 224 can be spaced enough to lose electrical conductivity.
또한, 해리용 수지용액(260)은 수용성 수지 및 수용성 수지의 용해를 위한 수용성 용매를 포함하는데, 해리용 수지용액(260)을 경화시키는 과정에서 수용성 용매는 휘발될 수 있고, 따라서, 해리용 수지용액(260)의 경화 후(실질적으로는 수용성 수지를 경화하는 것임), 해리용 수지용액(260)의 높이는 다소 줄어들 수 있지만, 앞서 언급했듯이 줄어들어 변화한 해리용 수지용액(260)의 높이는 투명 도전막(224) 내에 내포된 도전섬유들이 전기 도전성을 상실하게 충분히 이격될 수 있는 범위 내에서 조절되어야 한다. In addition, the dissociation resin solution 260 may include a water-soluble resin and a water-soluble solvent for dissolving the water-soluble resin. In the process of curing the dissociation resin solution 260, the water-soluble solvent may be volatilized, and thus, the dissociation resin After curing of the solution 260 (substantially to cure the water-soluble resin), the height of the dissociation resin solution 260 may be somewhat reduced, but as mentioned above, the height of the dissociated resin solution 260, which has been reduced and changed, is transparent. The conductive fibers contained in the film 224 must be adjusted within a range that can be sufficiently spaced apart to lose electrical conductivity.
여하튼, 해리용 수지용액(260) 중 수용성 용매가 휘발된 후에 남아 있는 수용성 수지가 그대로 굳어 지면, 수용성 수지 내에 해리되어 서로 풀어져 떨어진 상태를 유지하고 있던 도전섬유는 자연스럽게 더 이상 전기를 통전시킬 수 없게 되고, 해리용 수지용액(260)에 노출되는 즉, 투명 절연패턴(256)에 의해서 보호되지 않은 부분의 투명 도전막(224)은 전기 도전성을 상실할 수 있다. In any case, if the remaining water-soluble resin hardens as it is after the water-soluble solvent in the dissociative resin solution 260 volatilizes, the conductive fibers that are dissociated in the water-soluble resin and kept separated from each other naturally cannot conduct electricity any more. The transparent conductive film 224 exposed to the dissociation resin solution 260, that is, not protected by the transparent insulating pattern 256, may lose electrical conductivity.
특히, 금속섬유가 상기 제외한 영역 상부에 배치되는 해리용 수지용액 내에서 고르게 구배되고, 해리된 상태에서 그대로 해리용 수지용액을 경화시키는 경우, 투명 도전패턴에 의해서 보호된 부분을 제외한 영역 및 투명 도전패턴에 의해서 보호된 부분에서 금속섬유에 의한 광 투과도 저하는 동일할 수 있다. 따라서, 본 제조방법으로 제조된 터치패널센서를 상부에서 바라보면 투명 도전패턴의 경계부분이 사실상 모호해 육안으로 확인되지 않는 효과를 제공할 수 있다. In particular, when the metal fiber is evenly gradient in the dissociation resin solution disposed above the excluded region, and the dissipation resin solution is cured as it is in the dissociated state, the region and the transparent conduction except for the portion protected by the transparent conductive pattern The light transmission by the metal fiber in the portion protected by the pattern may be the same. Therefore, when the touch panel sensor manufactured by the present manufacturing method is viewed from above, the boundary portion of the transparent conductive pattern may be virtually obscured and may provide an effect that is not visually confirmed.
또한, 해리용 수지용액(260)의 수용성 수지는 수용성 광경화 수지, 수용성 자연건조 수지, 및 수용성 열경화 수지 중 적어도 어느 하나를 수용성 용매에 용해시켜 사용할 수 있으며, 해리용 수지용액(260)은 사용된 수용성 수지의 성향에 따라서 경화 과정이 바뀔 수 있다. 예를 들어, Alberdingk Boley사의 LUX 계열 제품은 대표적인 물에 용해 가능한 수용성 광경화 수지이며, LUX 220, 250, 255 등의 제품들은 자외선에 의해서 경화된다. In addition, the water-soluble resin of the dissociation resin solution 260 may be used by dissolving at least one of a water-soluble photocurable resin, a water-soluble natural drying resin, and a water-soluble thermosetting resin in a water-soluble solvent, and the dissociation resin solution 260 may be The curing process may change depending on the propensity of the water-soluble resin used. For example, Alberdingk Boley's LUX series products are representative water soluble photocurable resins, and LUX 220, 250 and 255 products are cured by UV light.
따라서, Alberdingk Boley사의 LUX 계열 제품을 수용성 수지로 사용하면, 수용성 용매는 일반적인 물만을 사용할 수 있고, 경우에 따라서 알코올에 용해되는 수용성 수지를 선택한 경우, 알코올계 재료를 수용성 용매로 사용할 수 있다. 참고로, 수용성 수지는 도전섬유용액의 수용성 바인더와 같은 재질로 제공하는 것도 무방하다. Therefore, when Alberdingk Boley Co., Ltd. LUX product is used as a water-soluble resin, the water-soluble solvent may use only general water, and in some cases, when a water-soluble resin is dissolved in alcohol, an alcohol-based material may be used as the water-soluble solvent. For reference, the water-soluble resin may be provided with the same material as the water-soluble binder of the conductive fiber solution.
정리하면, 투명 절연패턴(256)에 보호되지 않는 부분은 해리되어 실질적으로 제거되지는 않지만, 마치 물리적으로 제거되는 것과 같이 동일하게 전기 도전성을 상실시키는 효과를 구현할 수 있으며, 실제로 투명 도전막(224)의 해리된 패턴(227)을 제외한 부분이 투명 도전패턴(226)으로 정의된다.In summary, the portion that is not protected by the transparent insulating pattern 256 is dissociated and is not substantially removed. However, the transparent conductive layer 224 may realize the effect of losing electrical conductivity as if physically removed. The portion except for the dissociated pattern 227 is defined as the transparent conductive pattern 226.
본 실시예에서도 앞선 실시예들과 마찬가지로 투명 도전패턴을 형성한 후 보호 코팅층을 형성할 수도 있겠지만, 본 실시예에서는 해리용 수지용액(260)이 사실상 보호 코팅층의 역할을 할 수 있다. In the present exemplary embodiment, the protective coating layer may be formed after the transparent conductive pattern is formed in the same manner as in the previous embodiments, but in this embodiment, the dissociative resin solution 260 may actually serve as a protective coating layer.
또한, 앞선 실시예들을 살펴보면, 와이어패턴이나 투명 절연패턴들에 의해서 보호 코팅층을 여간 두껍게 하지 않는 이상 그 표면이 매끄럽지 않을 수 밖에 없다. In addition, looking at the above embodiments, the surface is not smooth unless the protective coating layer is thickened by a wire pattern or transparent insulating patterns.
하지만, 본 실시예에서는 해리용 수지용액(260)이 경화되어 그 표면이 매끄럽게 제공되어 추후 상하부시트간의 접합 시 사용되는 광학접착층과 시트 사이에 기포가 끼어들어 발생하는 불량률을 크게 낮출 수 있다. However, in the present embodiment, the dissociation resin solution 260 is cured and the surface thereof is smoothly provided, thereby greatly lowering the defect rate caused by bubbles interposed between the optical adhesive layer and the sheet used for bonding between upper and lower sheets.
도 11 및 도 12는 본 발명의 또 다른 실시예에 따른 터치패널센서의 상부시트를 제조하는 공정을 설명하기 위한 평면도 및 단면도들이다. 참고로, 절연원판, 연결패턴, 투명 절연패턴, 및 투명 도전막에 대한 설명 및 이를 형성하는 과정에 대해서는 상술한 설명을 참조할 수 있다.11 and 12 are plan views and cross-sectional views illustrating a process of manufacturing a top sheet of a touch panel sensor according to another embodiment of the present invention. For reference, the description of the insulating disc, the connection pattern, the transparent insulating pattern, and the transparent conductive film and the process of forming the same may refer to the above description.
도 11을 참조하면, 본 실시예에서는 절연원판(321)에 연결패턴(370)을 먼저 형성하고, 투명 도전막(324)은 앞선 실시예와 다르게 절연원판(321) 상에 일부만 형성하되, 연결패턴(370)이 일부 노출되게 투명 도전섬유용액으로 인쇄 형성한다. 그 후에 원하는 투명 도전패턴(326) 형상에 대응하여 투명 도전막 상에 투명 절연패턴(356)을 형성하되, 연결패턴(370)은 와이어패턴(328)과의 접속을 위하여 일부 노출시킨다. 그리고, 연결패턴(370)과 전기적으로 연결되는 와이어패턴(328)을 형성한다. 도 11에서 각 구성요소의 적층구조를 통해서 확인할 수 있다. Referring to FIG. 11, in this embodiment, the connection pattern 370 is first formed on the insulating plate 321, and the transparent conductive film 324 is partially formed on the insulating plate 321 unlike the previous embodiment. The pattern 370 is formed to be printed with a transparent conductive fiber solution so as to partially expose the pattern 370. Thereafter, a transparent insulating pattern 356 is formed on the transparent conductive film corresponding to the desired shape of the transparent conductive pattern 326, but the connection pattern 370 is partially exposed for connection with the wire pattern 328. In addition, a wire pattern 328 electrically connected to the connection pattern 370 is formed. In FIG. 11, it can be confirmed through the laminated structure of each component.
도 11을 다시 살피면 절연원판(321)상에 연결패턴(370), 투명 도전막(324), 투명 절연패턴(356), 및 와이어패턴(328)이 순차적으로 적층되어 있다. 11, the connection pattern 370, the transparent conductive film 324, the transparent insulation pattern 356, and the wire pattern 328 are sequentially stacked on the insulating disc 321.
그 다음으로, 와이어패턴(328)이나 투명 절연패턴(356)에 의해서 보호되지 않은 부분의 투명 도전막(324) 내의 도전섬유가 도전성을 상실하도록 해리시킬 수 있다. 이 과정은 도 12를 참조할 수 있다. Next, the conductive fibers in the transparent conductive film 324 in the portion not protected by the wire pattern 328 or the transparent insulating pattern 356 can be dissociated so as to lose conductivity. This process may refer to FIG. 12.
도 12를 참조하면, 절연원판(321) 상에 투명 절연패턴(356)이 충분히 덮이도록 해리용 수지용액(360)을 도포한다. Referring to FIG. 12, the dissociation resin solution 360 is coated on the insulating disc 321 so that the transparent insulating pattern 356 is sufficiently covered.
해리용 수지용액(360) 중 수용성 용매가 휘발된 후에 남아 있는 수용성 수지가 그대로 굳어 지면, 수용성 수지 내에 해리되어 서로 풀어져 떨어진 상태를 유지하고 있던 도전섬유는 자연스럽게 더 이상 전기를 통전시킬 수 없게 되고, 해리용 수지용액(360)에 노출되는 즉, 투명 절연패턴(356)에 의해서 보호되지 않은 부분의 투명 도전막(324)은 전기 도전성을 상실할 수 있다. If the remaining water-soluble resin hardens as it is after the water-soluble solvent in the dissociation resin solution 360 is volatilized, the conductive fibers that are dissociated in the water-soluble resin and kept separated from each other naturally cannot conduct electricity any more. The transparent conductive film 324 exposed to the dissociation resin solution 360, that is, not protected by the transparent insulating pattern 356, may lose electrical conductivity.
정리하면, 투명 절연패턴(356)에 보호되지 않는 부분은 해리되어 실질적으로 제거되지는 않지만, 마치 물리적으로 제거되는 것과 같이 동일하게 전기 도전성을 상실시키는 효과를 구현할 수 있으며, 실제로 투명 도전막(324)의 해리된 패턴(327)을 제외한 부분이 투명 도전패턴(326)으로 정의될 수 있다.In summary, the portion that is not protected by the transparent insulating pattern 356 is dissociated and is not substantially removed. However, the transparent conductive film 324 may be realized in the same way as it is physically removed. The portion except for the dissociated pattern 327 may be defined as the transparent conductive pattern 326.
참고로, 해리용 수지용액(360)은 와이어패턴(328)의 단부와 연성회로기판의 단자가 접속하는 부분은 제외한 상태로 제공될 수 있다. 다만, 절연원판 상에 전체적으로 제공되더라도 추후 연성회로기판 단자와 연결되는 와이어패턴의 단부에서 경화된 해리용 수지용액(360)을 레이저를 이용하여 일부 제거하는 것도 가능하다. For reference, the dissociation resin solution 360 may be provided in a state in which the end portion of the wire pattern 328 and the terminal of the flexible circuit board are connected to each other. However, even if it is provided entirely on the insulating disk, it is also possible to remove a part of the dissociative resin solution 360 cured at the end of the wire pattern connected to the flexible circuit board terminal by using a laser.
도 13은 본 발명의 또 다른 실시예에 따른 터치패널센서의 분해 사시도이며, 도 14 내지 도 18은 도 13에 도시되는 상부시트를 제조하는 공정을 설명하기 위한 평면도 및 단면도들이다. 참고로, 본 실시예에 따르는 터치패널센서의 도면부호들은 도 13 내지 도 18을 참조하여, 앞서 언급되는 동일한 도면부호들과는 구분된다. 13 is an exploded perspective view of a touch panel sensor according to another embodiment of the present invention, and FIGS. 14 to 18 are plan and cross-sectional views illustrating a process of manufacturing the top sheet shown in FIG. 13. For reference, reference numerals of the touch panel sensor according to the present exemplary embodiment are distinguished from the same reference numerals mentioned above with reference to FIGS. 13 to 18.
도 13을 참조하면, 본 실시예에 따른 터치패널센서(100)는 상부커버기판(110), 상부시트(120), 하부시트(130) 및 연성회로기판(140)을 포함한다. Referring to FIG. 13, the touch panel sensor 100 according to the present exemplary embodiment includes an upper cover substrate 110, an upper sheet 120, a lower sheet 130, and a flexible circuit board 140.
상부시트(120)는 상부 절연기판(122), 상부 도전패턴(126), 상부 와이어패턴(128) 및 상부 도전성 단자(129)를 포함한다. 그리고, 하부시트(130) 역시 하부 절연기판(132), 하부 도전패턴(136), 하부 와이어패턴(138) 및 하부 도전성 단자(139)를 포함한다. The upper sheet 120 includes an upper insulating substrate 122, an upper conductive pattern 126, an upper wire pattern 128, and an upper conductive terminal 129. The lower sheet 130 also includes a lower insulating substrate 132, a lower conductive pattern 136, a lower wire pattern 138, and a lower conductive terminal 139.
상부 절연기판(122) 상에는 상부 도전패턴(126) 및 상부 와이어패턴(128)이 배치될 수 있고, 하부 절연기판(132) 상에는 하부 도전패턴(136) 및 하부 와이어패턴(138)이 배치된다. The upper conductive pattern 126 and the upper wire pattern 128 may be disposed on the upper insulating substrate 122, and the lower conductive pattern 136 and the lower wire pattern 138 may be disposed on the lower insulating substrate 132.
또한, 상부커버기판(110)의 저면에는 액자 형상의 윈도우 데코레이션(112)이 제공되며, 상부 절연기판(122)과 하부 절연기판(132)의 가장자리에 배치되는 상부 및 하부 와이어패턴(128, 138) 및 연성회로기판(140)을 가리는 용도로서 제공될 수 있다. In addition, the bottom surface of the upper cover substrate 110 is provided with a frame-shaped window decoration 112, the upper and lower wire patterns 128, 138 disposed on the edge of the upper insulating substrate 122 and the lower insulating substrate 132. And the flexible circuit board 140 may be provided.
한편, 상부커버기판(110), 상부시트(120), 및 하부시트(130) 사이 사이에는 광학접착층이 개재되어 상호 접합될 수 있다. Meanwhile, an optical adhesive layer may be interposed between the upper cover substrate 110, the upper sheet 120, and the lower sheet 130 to be bonded to each other.
또한, 연성회로기판(140)에는 상부 절연기판(122) 및 하부 절연기판(132)에 형성되는 상부 및 하부 와이어패턴(128, 138)과 전기적으로 접합되는 단자가 배치될 수 있다. In addition, the flexible circuit board 140 may include terminals electrically connected to the upper and lower wire patterns 128 and 138 formed on the upper insulating substrate 122 and the lower insulating substrate 132.
이하, 도 14 내지 도 18을 참조하면서 상부시트(120)의 제조과정을 설명한다. 후술하겠지만, 아래의 과정은 패턴만 달리하여 하부시트(130)의 제조과정에서도 적용될 수 있으며, 하나의 절연기판 상하면에 상부 도전패턴 및 하부 도전패턴을 형성하는 경우에도 적용될 수 있다. Hereinafter, a manufacturing process of the top sheet 120 will be described with reference to FIGS. 14 to 18. As will be described later, the following process may be applied to the manufacturing process of the lower sheet 130 by changing only the pattern, and may also be applied to the case of forming the upper conductive pattern and the lower conductive pattern on the upper and lower surfaces of one insulating substrate.
또한, 상부시트(120)는 원래 하나의 절연기판 원지에 복수 셀로 동시에 형성될 수 있으며, 이러한 과정에 이하 도면과 같이 진행될 수 있다. In addition, the top sheet 120 may be formed at the same time as a plurality of cells on the original one insulating substrate base material, it can be progressed as shown in the following drawings.
도 14를 참조하면, 복수 셀의 터치패널센서를 위한 롤 형태의 절연원판(121)이 제공된다. 절연원판(121)의 상면에는 투명 도전막(124)이 전면적으로 도포되어 제공된다. 상기 투명 도전막(124)은 ITO 도전막으로 제공될 수 있다. Referring to FIG. 14, a roll-shaped insulating disc 121 for a touch panel sensor of a plurality of cells is provided. The transparent conductive film 124 is coated on the entire surface of the insulating disc 121 and is provided. The transparent conductive film 124 may be provided as an ITO conductive film.
도 15를 참조하면, 투명 도전막(124) 상에 와이어패턴(128)을 형성한다. 와이어패턴(128)은 연성회로기판(140)의 단자와 전기적으로 연결될 수 있다. 와이어패턴(128)을 형성할 때에는 도전패턴(126)이 아직 형성되지 않았으므로, 도전패턴(126)이 형성될 위치에 대응하여 와이어패턴(128)을 미리 정확하게 형성할 수가 있다. Referring to FIG. 15, a wire pattern 128 is formed on the transparent conductive film 124. The wire pattern 128 may be electrically connected to the terminals of the flexible circuit board 140. Since the conductive pattern 126 is not yet formed when the wire pattern 128 is formed, the wire pattern 128 can be accurately formed in advance corresponding to the position where the conductive pattern 126 is to be formed.
도 16을 참조하면, 투명 도전패턴(126) 형상에 대응하여 투명 도전막(124) 상에 투명 절연패턴(156)을 형성한다. 투명 절연패턴(156)은 상하로 길게 연장된 직사각형의 외형을 가지며, 내부로는 균일한 간격으로 형성된 사각형 홀을 포함한다. 따라서 투명 절연패턴(156)에는 상부 및 하부가 연결되어 있으며 균일한 폭 및 간격으로 형성된 3개의 직선 패턴이 제공된다. 3개의 직선 패턴이 하나의 그룹을 형성하며, 6개의 투명 절연패턴(156)이 균일한 간격으로 평행하게 배치된다. Referring to FIG. 16, a transparent insulating pattern 156 is formed on the transparent conductive film 124 corresponding to the shape of the transparent conductive pattern 126. The transparent insulating pattern 156 has a rectangular shape extending vertically up and down, and includes a rectangular hole formed at even intervals therein. Therefore, the transparent insulating pattern 156 is provided with three straight patterns connected to the top and bottom and formed in a uniform width and spacing. Three straight patterns form a group, and six transparent insulating patterns 156 are arranged in parallel at equal intervals.
도 16의 (a)에는 투명 도전막(124) 상에 투명 절연패턴(156)이 균일 간격으로 형성되어 있으며, 도 5의 (b)에는 투명 도전막(124) 상에 와이어패턴(128)의 단부가 위치하며, 그 위로 투명 절연패턴(156)이 형성되어 있다. In FIG. 16A, a transparent insulating pattern 156 is formed on the transparent conductive film 124 at uniform intervals. In FIG. 5B, the wire pattern 128 is formed on the transparent conductive film 124. An end is positioned, and a transparent insulating pattern 156 is formed thereon.
도 17을 참조하면, 에칭을 통해서 투명 절연패턴(156)에 의해서 덮이지 않은 부분을 제거할 수 있다. 투명 절연패턴(156)은 마스크로 기능을 하며, 섬유를 포함하는 투명 도전막(124)의 일부는 수성 용액이나 은 에칭 용액에 의해서 제거될 수 있다. 투명 도전막(124) 중 투명절연패턴(156)이 인쇄되지 않은 부분을 부분적으로 제거함으로써 투명 도전패턴(126)을 형성할 수가 있다. Referring to FIG. 17, a portion not covered by the transparent insulating pattern 156 may be removed by etching. The transparent insulating pattern 156 functions as a mask, and a part of the transparent conductive layer 124 including fibers may be removed by an aqueous solution or a silver etching solution. The transparent conductive pattern 126 can be formed by partially removing a portion of the transparent conductive film 124 not printed with the transparent insulating pattern 156.
도 18을 참조하면, 투명 도전패턴(126)을 형성한 후 보호 코팅층(125)을 형성하고, 원지 형태의 절연원판(121)을 재단하여 각 셀에 대응하는 절연기판(122)을 제공할 수 있다. Referring to FIG. 18, after the transparent conductive pattern 126 is formed, the protective coating layer 125 may be formed, and an insulating substrate 122 corresponding to each cell may be provided by cutting the insulating insulating plate 121 in the form of a paper. have.
절연원판(121) 전체를 덮고 있는 보호 코팅층(125)은 상부 와이어패턴(128) 역시 커버하고 있다. 따라서, 제어부 또는 연성회로기판(140)과 같은 외부장치와 상부 와이어패턴(128)을 전기적으로 연결하기 위해서는 보호 코팅층(125)을 부분적으로 제거하여 상부 와이어패턴(128)의 단부를 노출시킬 필요가 있다. The protective coating layer 125 covering the entire insulating disc 121 also covers the upper wire pattern 128. Therefore, in order to electrically connect the upper wire pattern 128 with an external device such as the controller or the flexible circuit board 140, it is necessary to partially remove the protective coating layer 125 to expose the end portion of the upper wire pattern 128. have.
와이어패턴(128)의 단부를 노출시킬 수 있도록 레이저를 이용하여 상부 보호 코팅층(125)에 관통 홀을 형성하고, 와이어패턴(128)에서 노출된 도전성 단자(129)를 연성회로기판(140)과 연결할 수가 있다. Through holes are formed in the upper protective coating layer 125 using a laser to expose the ends of the wire patterns 128, and the conductive terminals 129 exposed from the wire patterns 128 are connected to the flexible circuit board 140. I can connect it.
참고로, 본 실시예에서 도전패턴(126, 136)은 3개의 직선 패턴이 하나의 그룹을 형성하도록 상부와 하부 단부가 연결되는 그룹 구조를 가지나, 본 발명이 도전패턴의 구조에 제한되지는 않는다. For reference, in the present embodiment, the conductive patterns 126 and 136 have a group structure in which upper and lower ends are connected such that three straight patterns form a group, but the present invention is not limited to the structure of the conductive pattern. .
상술한 바와 같이, 본 발명의 바람직한 실시예를 참조하여 설명하였지만 해당 기술분야의 숙련된 당업자라면 하기의 청구범위에 기재된 본 발명의 사상 및 영역으로부터 벗어나지 않는 범위 내에서 본 발명을 다양하게 수정 및 변경시킬 수 있음을 이해할 수 있을 것이다.As described above, although described with reference to the preferred embodiment of the present invention, those skilled in the art various modifications and variations of the present invention without departing from the spirit and scope of the invention described in the claims below I can understand that you can.
본 발명에 따른 터치패널센서는 피대상물의 접촉 위치를 감지하기 위한 용도로 디스플레이에 널리 적용될 수 있다. The touch panel sensor according to the present invention can be widely applied to a display for the purpose of detecting a contact position of an object.

Claims (20)

  1. 디스플레이 상부에 배치되어 대상체의 접촉위치를 감지하는 터치패널센서의 제조방법에 있어서,In the manufacturing method of the touch panel sensor disposed on the display to detect the contact position of the object,
    절연기판 상에 투명 도전막을 형성하는 단계;Forming a transparent conductive film on the insulating substrate;
    상기 투명 도전막 상에 상기 투명 도전패턴에 대응하는 투명 절연패턴을 형성하는 단계; 및 Forming a transparent insulating pattern corresponding to the transparent conductive pattern on the transparent conductive film; And
    상기 투명 절연패턴을 마스크로 이용하여 상기 투명 도전막으로부터 외부와의 전기적 연결을 위한 와이어패턴과 전기적으로 연결되는 상기 투명 도전패턴을 형성하는 단계;Forming the transparent conductive pattern electrically connected to a wire pattern for electrical connection from the transparent conductive layer to the outside using the transparent insulating pattern as a mask;
    를 포함하는 것을 특징으로 하는 터치패널센서의 제조방법.Method of manufacturing a touch panel sensor comprising a.
  2. 제1항에 있어서,The method of claim 1,
    상기 절연기판 상에 상기 투명 도전막을 형성하는 단계에서 상기 절연기판 상에 상기 투명 도전막으로부터 형성되는 상기 투명 도전패턴의 단부 각각에 배치되는 연결패턴을 형성하며, In the step of forming the transparent conductive film on the insulating substrate to form a connection pattern disposed on each end of the transparent conductive pattern formed from the transparent conductive film on the insulating substrate,
    상기 투명 절연패턴은 상기 투명 도전막 상에 상기 투명 도전패턴에 대응하되, 상기 연결패턴의 일부를 노출시키는 것을 특징으로 하는 터치패널센서의 제조방법.The transparent insulating pattern corresponds to the transparent conductive pattern on the transparent conductive film, the manufacturing method of the touch panel sensor, characterized in that to expose a portion of the connection pattern.
  3. 제2항에 있어서,The method of claim 2,
    상기 투명 도전막 및 상기 연결패턴을 형성하는 단계에서, In the forming of the transparent conductive film and the connection pattern,
    상기 절연기판 상에 상기 투명 도전막을 먼저 형성하고, 상기 연결패턴을 상기 투명 도전막 상에 형성하는 것을 특징으로 하는 터치패널센서의 제조방법.The transparent conductive film is first formed on the insulating substrate, and the connection pattern is formed on the transparent conductive film.
  4. 제2항에 있어서,The method of claim 2,
    상기 투명 도전막 및 상기 연결패턴을 형성하는 단계에서, In the forming of the transparent conductive film and the connection pattern,
    상기 절연기판 상에 상기 연결패턴을 먼저 형성하고, 상기 투명 도전막 및 상기 절연기판을 커버하도록 상기 투명 도전막을 형성하는 것을 특징으로 하는 터치패널센서의 제조방법.And first forming the connection pattern on the insulating substrate, and forming the transparent conductive film to cover the transparent conductive film and the insulating substrate.
  5. 제2항에 있어서,The method of claim 2,
    상기 투명 절연패턴에 의해서 보호된 부분을 제외한 영역을 에칭하여 상기 투명 도전막으로부터 상기 투명 도전패턴을 형성하는 것을 특징으로 하는 터치패널센서의 제조방법.And etching the region excluding the portion protected by the transparent insulating pattern to form the transparent conductive pattern from the transparent conductive film.
  6. 제2항에 있어서,The method of claim 2,
    상기 투명 도전막은 카본 파이버, 카본 파우더, 금속을 이용한 파우더, 도전성 잉크, 도전성 유기물질, PEDOT(폴리에틸렌디옥시티오펜), ITO, IZO, AZO(Al-doped zinc oxide), 은나노 와이어, CNT(탄소나노튜브), 그래핀(graphene), 및 카본 파우더(carbon powder) 중 적어도 어느 하나를 포함하는 것을 특징으로 하는 터치패널센서의 제조방법. The transparent conductive film is carbon fiber, carbon powder, powder using metal, conductive ink, conductive organic material, PEDOT (polyethylene dioxythiophene), ITO, IZO, AZO (Al-doped zinc oxide), silver nano wire, CNT (carbon nano) Tube), graphene (graphene), and carbon powder (carbon powder) at least one of the manufacturing method of the touch panel sensor comprising a.
  7. 제2항에 있어서,The method of claim 2,
    상기 투명 도전막은 도전섬유용액을 이용하며, The transparent conductive film uses a conductive fiber solution,
    상기 투명 절연패턴을 마스크로 이용하여 상기 투명 절연패턴에 의해서 보호된 부분을 제외한 영역의 도전섬유가 상호 전기적으로 분리되도록 해리시키며, 상기 투명 절연패턴에 의해서 보호된 부분의 상기 투명 도전막으로부터 상기 투명 도전패턴을 형성하는 것을 특징으로 하는 터치패널센서의 제조방법. Using the transparent insulating pattern as a mask, the conductive fibers in the regions excluding the portions protected by the transparent insulating pattern are dissociated from each other. Method for manufacturing a touch panel sensor, characterized in that to form a conductive pattern.
  8. 제7항에 있어서,The method of claim 7, wherein
    상기 도전섬유용액은 상기 도전섬유, 수용성 바인더, 및 상기 수용성 바인더의 용해를 위한 수용성 용매를 포함하고, 상기 수용성 용매가 휘발되면서 상기 도전섬유가 상기 수용성 바인더에 의해서 상기 절연기판 상에 고착되어 상기 투명 도전막을 형성하며, The conductive fiber solution includes the conductive fiber, the water-soluble binder, and a water-soluble solvent for dissolving the water-soluble binder, and the conductive fiber is fixed on the insulating substrate by the water-soluble binder while the water-soluble solvent is volatilized, so that the transparent fiber is fixed. Forming a conductive film,
    상기 투명 절연패턴은 액상의 유성 수지를 단독으로 사용하거나 상기 유성 수지의 용해를 위한 유성 용매를 상기 유성 수지와 혼합하여, 상기 투명 도전막 상에서 상기 유성 수지를 경화시켜 형성하며, The transparent insulating pattern is formed by using a liquid oil resin alone or by mixing an oil solvent for dissolving the oil resin with the oil resin, by curing the oil resin on the transparent conductive film,
    상기 투명 도전패턴을 형성하는 단계에서 상기 수용성 바인더를 용해시키는 해리용 수지용액을 이용하여 상기 도전섬유를 해리시키는 것을 특징으로 하는 터치패널센서의 제조방법.Method of manufacturing a touch panel sensor, characterized in that for dissolving the conductive fiber using a dissociating resin solution to dissolve the water-soluble binder in the step of forming the transparent conductive pattern.
  9. 제8항에 있어서,The method of claim 8,
    상기 투명 절연패턴의 상기 유성 수지는 우레탄(urethane), 에폭시 아크릴레이트(epoxy acrylate), 및 폴리에스터 아크릴레이트(polyester acrylate) 중 적어도 어느 하나를 포함하며, The oily resin of the transparent insulating pattern includes at least one of urethane, epoxy acrylate, and polyester acrylate,
    상기 투명 절연패턴의 상기 유성 용매는 아세톤(acetone), 메틸이소부틸케톤(MIBK; Methyl isobutyl ketone), 메틸에틸케톤(MEK; methyl ethyl ketone), 사이클로헥산(Cyclohexane), 톨루엔(toluene), 에틸레이트(ethylate), 아세트산에틸(ethyl acetate), 및 부틸 아세테이트(butyl acetate) 중 적어도 어느 하나를 포함하는 것을 특징으로 하는 터치패널센서의 제조방법.The oil-based solvent of the transparent insulating pattern is acetone (acetone), methyl isobutyl ketone (MIBK; Methyl isobutyl ketone), methyl ethyl ketone (MEK; methyl ethyl ketone), cyclohexane, toluene, ethylate Method of manufacturing a touch panel sensor comprising at least any one of (ethylate), ethyl acetate, and butyl acetate.
  10. 제8항에 있어서,The method of claim 8,
    상기 도전섬유용액의 상기 수용성 바인더는 에틸셀룰로스(ethyl cellulose)를 포함하며, The water-soluble binder of the conductive fiber solution includes ethyl cellulose (ethyl cellulose),
    상기 도전섬유용액의 상기 수용성 용매는 물 또는 알코올계(alcohol meter)를 포함하는 것을 특징으로 하는 터치패널센서의 제조방법.The water-soluble solvent of the conductive fiber solution is a method of manufacturing a touch panel sensor, characterized in that it comprises water or alcohol (alcohol meter).
  11. 제8항에 있어서,The method of claim 8,
    상기 투명 도전패턴에 의해서 보호된 부분을 제외한 영역의 상기 도전섬유가 상기 해리용 수지용액 내에서 고르게 구배되어 해리된 상태에서 그대로 상기 해리용 수지용액이 경화됨으로써, The dissociation resin solution is cured as it is while the conductive fibers in the region excluding the portion protected by the transparent conductive pattern are evenly gradient and dissociated in the dissociation resin solution.
    상기 투명 도전패턴에 의해서 보호된 부분을 제외한 영역에서 상기 투명 도전막은 전기 도전성을 상실하는 것을 특징으로 하는 터치패널센서의 제조방법.The method of manufacturing a touch panel sensor, wherein the transparent conductive film loses electrical conductivity in a region excluding a portion protected by the transparent conductive pattern.
  12. 제8항에 있어서, The method of claim 8,
    상기 해리용 수지용액은 수용성 수지 및 상기 수용성 수지의 용해를 위한 수용성 용매를 포함하는 것을 특징으로 하는 터치패널센서의 제조방법.The dissociation resin solution comprises a water-soluble resin and a water-soluble solvent for dissolving the water-soluble resin.
  13. 제12항에 있어서, The method of claim 12,
    상기 수용성 수지는 수용성 광경화 수지, 수용성 자연건조 수지, 및 수용성 열경화 수지 중 적어도 어느 하나를 포함하는 것을 특징으로 하는 터치패널센서의 제조방법.The water-soluble resin is a method for manufacturing a touch panel sensor, characterized in that it comprises at least one of a water-soluble photo-curing resin, water-soluble natural drying resin, and a water-soluble thermosetting resin.
  14. 제12항에 있어서, The method of claim 12,
    상기 수용성 용매는 물 또는 알코올계(alcohol meter)를 단독 또는 혼합하여 사용하는 것을 특징으로 하는 터치패널센서의 제조방법.The water-soluble solvent is a method of manufacturing a touch panel sensor, characterized in that used alone or mixed with water or alcohol (alcohol meter).
  15. 제2항에 있어서,The method of claim 2,
    상기 투명 절연패턴을 마스크로 이용하여 상기 투명 도전패턴을 형성한 후에, After the transparent conductive pattern is formed using the transparent insulating pattern as a mask,
    상기 투명 절연패턴으로부터 노출되는 상기 연결패턴을 통해서 상기 투명 도전패턴과 전기적으로 연결되는 상기 와이어패턴을 형성하는 것을 특징으로 하는 터치패널센서의 제조방법.And forming the wire pattern electrically connected to the transparent conductive pattern through the connection pattern exposed from the transparent insulating pattern.
  16. 제2항에 있어서,The method of claim 2,
    상기 투명 도전막을 그대로 유지하면서 상기 투명 절연패턴으로부터 노출되는 상기 연결패턴을 통해서 상기 투명 도전패턴과 전기적으로 연결되는 상기 와이어패턴을 형성한 후에, After forming the wire pattern electrically connected to the transparent conductive pattern through the connection pattern exposed from the transparent insulating pattern while maintaining the transparent conductive film as it is,
    상기 투명 절연패턴을 마스크로 이용하여 상기 투명 도전패턴을 형성하는 것을 특징으로 하는 터치패널센서의 제조방법.And manufacturing the transparent conductive pattern using the transparent insulating pattern as a mask.
  17. 제2항에 있어서,The method of claim 2,
    상기 투명 도전막을 그대로 유지하면서 상기 연결패턴을 통해서 상기 투명 도전패턴과 전기적으로 연결되는 상기 와이어패턴을 형성한 후에, After forming the wire pattern electrically connected to the transparent conductive pattern through the connection pattern while maintaining the transparent conductive film as it is,
    상기 연결패턴의 일부를 노출시키는 투명 절연패턴을 형성하고, 상기 투명 절연패턴을 마스크로 이용하여 상기 투명 절연패턴을 형성하는 것을 특징으로 하는 터치패널센서의 제조방법.And forming a transparent insulating pattern exposing a part of the connection pattern, and using the transparent insulating pattern as a mask to form the transparent insulating pattern.
  18. 제2항에 있어서,The method of claim 2,
    상기 와이어패턴은 상기 투명 도전막 전체를 덮도록 제공되는 와이어층을 에칭하여 제공되며, 상기 투명 절연패턴의 하부의 상기 투명 도전막은 에칭 과정에서 보호되는 것을 특징으로 하는 터치패널센서의 제조방법.The wire pattern is provided by etching a wire layer provided to cover the entire transparent conductive film, the method of manufacturing a touch panel sensor, characterized in that the transparent conductive film under the transparent insulating pattern is protected during the etching process.
  19. 제2항에 있어서,The method of claim 2,
    상기 투명 도전패턴을 형성한 후, 보호 코팅층을 형성하는 것을 특징으로 하는 터치패널센서의 제조방법.After forming the transparent conductive pattern, a method of manufacturing a touch panel sensor, characterized in that to form a protective coating layer.
  20. 제2항에 있어서,The method of claim 2,
    상기 절연기판 상에 하나 또는 복수개의 터치패널센서를 위한 셀이 동시에 형성되며, 상기 절연기판은 평판 필름 또는 롤 필름 형태로 제공되는 것을 특징으로 하는 터치패널센서의 제조방법.A cell for one or a plurality of touch panel sensors is formed simultaneously on the insulating substrate, and the insulating substrate is provided in the form of a flat film or a roll film.
PCT/KR2014/008475 2013-09-10 2014-09-11 Method for manufacturing touch panel sensor WO2015037919A1 (en)

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KR20130108765A KR20150029492A (en) 2013-09-10 2013-09-10 Manufacturing method of touch panel sensor and the touch panel sensor
KR10-2013-0108765 2013-09-10
KR1020140076326A KR101679399B1 (en) 2014-06-23 2014-06-23 Manufacturing method of touch panel sensor
KR10-2014-0076326 2014-06-23

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Citations (5)

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Publication number Priority date Publication date Assignee Title
WO2010090394A2 (en) * 2009-02-06 2010-08-12 주식회사 엘지화학 Method for manufacturing an insulated conductive pattern
KR20110054369A (en) * 2009-11-17 2011-05-25 (주)삼원에스티 Touch panel sensor
KR20120017165A (en) * 2010-08-18 2012-02-28 엘지디스플레이 주식회사 Electrostatic capacity type touch screen panel and method of manufacturing the same
KR20120116835A (en) * 2011-05-27 2012-10-23 (주)삼원에스티 Touch panel sensor
KR20130056003A (en) * 2011-11-21 2013-05-29 (주)삼원에스티 Touch panel sensor

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010090394A2 (en) * 2009-02-06 2010-08-12 주식회사 엘지화학 Method for manufacturing an insulated conductive pattern
KR20110054369A (en) * 2009-11-17 2011-05-25 (주)삼원에스티 Touch panel sensor
KR20120017165A (en) * 2010-08-18 2012-02-28 엘지디스플레이 주식회사 Electrostatic capacity type touch screen panel and method of manufacturing the same
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