WO2014200202A1 - Method for manufacturing touch panel sensor and touch panel sensor - Google Patents

Abstract

Provided is a method for manufacturing a touch panel sensor which is arranged on a display and detects a contact position of an object, the method comprising the steps of: forming a transparent conductive film on an insulation substrate by using a metal fiber solution; forming, on the transparent conductive film, a wire pattern for electrically connecting the touch panel sensor to an external device; forming a transparent insulation pattern corresponding to the wire pattern on the transparent conductive film; and forming a transparent conductive pattern from the transparent conductive film by using the transparent insulation pattern as a mask.

Description

Manufacturing Method of Touch Panel Sensor and Touch Panel Sensor

The present invention relates to a method for manufacturing a touch panel sensor and a touch panel sensor, and more particularly, to a touch panel sensor capable of sensing a contact position of an object approaching a display.

1 is a perspective view illustrating a conventional capacitive touch panel sensor.

Referring to FIG. 1, in the conventional touch panel sensor, the lower insulating sheet 10 and the upper insulating sheet 20 are bonded to each other by a predetermined interval. The lower ITO electrode 30 and the upper ITO electrode 40 are vertically arranged on the upper surface of the lower insulating sheet 10 and the lower surface of the upper insulating sheet 20, respectively.

At each intersection of the lower ITO electrode 30 and the upper ITO electrode 40, there is a predetermined capacitance, that is, a capacitance value corresponding to the area of each intersection. When the body part is close, the upper ITO electrode disposed on the upper part An area of the body part is added to the area of 40 to change the capacitance value.

In addition, in order to electrically connect the upper ITO electrode 40 and the electrode 52 of the external circuit board 50, a connecting line 48 made of metal is formed from the end of the upper ITO electrode 40 from the upper insulating sheet 20. The lower ITO electrode 30 is also connected to the circuit board 50 by a separate connection line.

In general, the connection line 48 provided as a metal may be visually confirmed on the upper portion of the transparent upper insulating sheet 20 because the light reflects the light or does not pass through the light. Thus, in the related art, a separate non-translucent film for the frame-shaped window decoration 65 is formed on the bottom of the reinforcing substrate 60 such as glass or translucent reinforced plastic so that the connecting line 48 and the circuit board 50 are not visible. The reinforcing substrate 60 is disposed on the upper insulating sheet 20.

The present invention provides a method of manufacturing a touch panel sensor that can simplify the process of forming a transparent conductive pattern and a wire pattern.

The present invention provides a method of manufacturing a touch panel sensor capable of forming a conductive pattern in a thin and uniform thickness.

The present invention provides a method for manufacturing a touch panel sensor that is advantageous for mass production through an automated process using a roll film.

According to an exemplary embodiment of the present invention, a method of manufacturing a touch panel sensor disposed on an upper part of a display to detect a contact position of an object may include forming a transparent conductive film using a metal fiber solution on an insulating substrate, and a transparent conductive film. Forming a wire pattern for electrical connection to the outside on the substrate, forming a transparent insulation pattern on the transparent conductive film corresponding to the wire pattern, and using the transparent insulation pattern as a mask, Forming a step.

The metal fiber solution may be provided in a metal nano wire such as silver nano, including a synthetic resin and a volatile solvent (or water) for dissolving the synthetic resin, and a transparent conductive film as a whole on an insulating substrate. Since it forms, the pattern of uniform thickness can be formed. For reference, in the process of forming a transparent conductive pattern having a thickness of about 0.1 to 0.5 μm with silver nanofibers, the metal fiber solution is applied to a thickness of about 20 μm or more. In this case, the metal fiber solution may have a uniform thickness due to the surface tension of the metal fiber solution. It may not be easy to form a conductive pattern. However, in the present invention, since the transparent conductive film is formed on the insulating substrate over the entire surface, a conductive pattern having a uniform thickness can be obtained.

For reference, the metal fiber in the present invention refers to a fibrous metal, and may include other metals (Al, Ag, Au, Cu, W) on a fiber other than silver (Ag) nanofibers.

In order to form a transparent conductive pattern, a method such as etching or chemical dissociation can be used. For example, a transparent conductive pattern may be formed by removing an area except for a portion protected by a transparent insulating pattern, or alternatively, by dissociating metal fibers in a region except for a portion protected by a transparent insulating pattern, each other may be transparent. The part protected by the insulation pattern can be formed in a transparent conductive pattern. For example, the transparent conductive film partially protected by the transparent insulating pattern may be precipitated in the high concentration resin solution, and the high concentration resin solution may penetrate between the metal fibers to dissociate the exposed metal fibers from each other.

Although only one touch panel sensor may be formed on the insulating substrate, it is also possible to define the touch panel sensor as one cell and simultaneously form a plurality of touch panel sensors on one insulating substrate. After simultaneously forming a plurality of touch panel sensors, each cell may be cut and used as a conductive pattern film of the touch panel sensor.

 According to another exemplary embodiment of the present invention, the touch panel sensor disposed on the display and detecting the contact position of the object is formed on an insulating substrate, an insulating substrate, and a transparent conductive pattern and transparent provided using a metal fiber solution. The wire pattern is formed on the transparent conductive pattern to electrically connect the conductive pattern and the outside, and is provided in the same shape as the transparent conductive pattern and includes a transparent insulating pattern for forming the transparent conductive pattern.

The transparent conductive pattern may be formed using a transparent insulating pattern as a mask, and may be provided through etching or chemical dissociation. The transparent conductive pattern may be provided in various shapes such as straight lines, diamonds, squares, triangles, meshes, etc. according to the required pattern, and the present invention is not limited by the shape, arrangement, and size of the pattern.

Since the wire pattern and the transparent insulating pattern are formed on the transparent conductive film to function as a mask, a portion of the transparent conductive film may remain in the pattern shape under the transparent insulating pattern and the wire pattern. Here, a part of the transparent conductive film under the transparent insulating pattern may be defined as a transparent conductive pattern.

According to another exemplary embodiment of the present invention, a method of manufacturing a touch panel sensor disposed on an upper part of a display to sense a contact position of an object may include forming a transparent conductive film on an insulating substrate, and forming a transparent conductive film on the transparent substrate. Forming a wire pattern for electrical connection, forming a transparent insulating pattern on the transparent conductive film corresponding to the wire pattern, and forming a transparent conductive pattern from the transparent conductive film using the transparent insulating pattern as a mask. Include.

The transparent conductive film may be formed of a material which can be used as a transparent conductive film such as ITO (indium oxide), IZO (zinc oxide), ATO (antimony), conductive polymer, silver nanowire, and CNT (carbon fiber).

In addition, according to another exemplary embodiment of the present invention, the manufacturing method of the touch panel sensor disposed on the display to detect the contact position of the object, by using a conductive fiber solution to form a transparent conductive film on the insulating substrate over the entire surface Forming a wire pattern for electrical connection to the outside on the transparent conductive film while maintaining the transparent conductive film as it is, forming a transparent insulating pattern on the transparent conductive film corresponding to the wire pattern, and a transparent insulating pattern Using the mask as a mask to dissociate the conductive fibers in the regions except for the portion protected by the transparent insulating pattern, and to form a transparent conductive pattern from the transparent conductive film in the portion protected by the transparent insulating pattern. do.

The conductive fiber may include a metal fiber including other metals (Al, Ag, Au, Cu, W) on a fiber other than the silver (Ag) nanofibers mentioned above, and may not be composed of a metal. It may include a fibrous nonmetallic fibrous material having conductivity such as carbon fiber.

In addition, dissociation used in the present specification may mean simply dissolving or dissolving. More specifically, dissociation of the conductive fibers contained in the transparent conductive film is entangled with each other, resulting in electrical conduction ability. It can be said that it is loosened so as to keep it sufficiently separated from each other.

In addition, the conductive fiber solution includes a conductive fiber, a water-soluble binder, and a water-soluble solvent for dissolving the water-soluble binder, wherein the conductive fiber is removed from the insulating substrate by a phenomenon such as volatilization, and the conductive fiber is removed from the insulating substrate by the water-soluble binder. It is adhered to form a transparent conductive film, the transparent insulating pattern is formed by curing the oil-based resin on the transparent conductive film by using a liquid oil-based resin alone or mixed with an oil-based solvent for dissolving the oil-based resin, In the step of forming the transparent conductive pattern, the conductive fiber may be dissociated by using a dissociative resin solution in which the water-soluble binder is dissolved.

The oily resin of the transparent insulation pattern may include at least one of urethane, epoxy acrylate, and polyester acrylate, and the oily solvent of the transparent insulation pattern may include acetone, acetone, Methyl isobutyl ketone (MIBK), methyl ethyl ketone (MEK), cyclohexane, toluene, ethylate, ethyl acetate, butyl acetate ( butyl acetate).

In addition, the water-soluble binder of the conductive fiber solution may include ethyl cellulose, and the water-soluble solvent of the conductive fiber solution may include water or an alcohol meter.

On the other hand, although the specific materials of the water-soluble binder of the conductive fiber solution, the oil-based resin of the transparent insulating pattern and the oil-based solvents are listed above, the water-soluble binder of the conductive fiber solution includes a synthetic resin having other water solubility that can be dissolved later by the dissociative resin solution. It is apparent that the oil-based resin and the oil-based solvent of the transparent insulating pattern may also include other oil-based (or fat-soluble) synthetic resins which are not dissolved by the dissociative resin solution.

The conductive fiber in the region excluding the portion protected by the transparent conductive pattern is uniformly gradient in the dissociating resin solution and cured as it is, so that the dissociating resin solution is cured. The conductive film may lose electrical conductivity.

In particular, when the metal fiber is evenly gradient in the dissociation resin solution disposed above the excluded region, and the dissipation resin solution is cured as it is in the dissociated state, the region and the transparent conduction except for the portion protected by the transparent conductive pattern The light transmission by the metal fiber in the portion protected by the pattern may be the same.

The dissociation resin solution may include a water-soluble resin and a water-soluble solvent for dissolving the water-soluble resin, and the water-soluble resin may include at least one of a water-soluble photocurable resin, a water-soluble natural drying resin, and a water-soluble thermosetting resin. In addition, the water-soluble solvent may be used alone or mixed with water or alcohol (alcohol meter).

In addition, after the transparent conductive pattern is formed, a protective coating layer may be formed.

In the method of manufacturing a touch panel sensor of the present invention, a transparent conductive pattern is formed, a mask pattern is formed, a transparent conductive pattern is formed by etching, a mask pattern is removed before the wire pattern is formed, and then a wire pattern is formed. The process can be simplified and the defects generated in the process can be reduced.

In the method of manufacturing the touch panel sensor of the present invention, since the transparent conductive pattern is formed, the conductive film is thinly formed on the entire surface, and thus the pattern itself can be formed to have a uniform thickness.

The manufacturing method of the touch panel sensor of the present invention forms a transparent conductive pattern, but can be mass-produced through an automated process using a roll film, so that the production speed, accuracy, and yield are higher than those of the conventional technology of manufacturing one cell unit. You can increase it.

1 is a perspective view illustrating a conventional touch panel sensor.

2 is an exploded perspective view of a touch panel sensor according to an exemplary embodiment of the present invention.

3 to 7 are plan views and cross-sectional views for explaining a process of manufacturing the top sheet shown in FIG.

8 and 9 are plan and cross-sectional views illustrating a process of manufacturing the top sheet of the touch panel sensor according to another embodiment of the present invention.

10 and 11 are plan views and cross-sectional views for explaining a process of manufacturing a top sheet of a touch panel sensor according to another embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited or limited by the embodiments. For reference, in the present description, the same numbers refer to substantially the same elements, and may be described by referring to the contents described in the other drawings under these rules, and the contents determined to be obvious to those skilled in the art or repeated may be omitted.

2 is an exploded perspective view of a touch panel sensor according to an exemplary embodiment of the present invention, and FIGS. 3 to 7 are plan and cross-sectional views illustrating a process of manufacturing the top sheet shown in FIG. 2.

Referring to FIG. 2, the touch panel sensor 100 according to the present exemplary embodiment includes an upper cover substrate 110, an upper sheet 120, a lower sheet 130, and a flexible circuit board 140.

The upper sheet 120 includes an upper insulating substrate 122, an upper silver nano conductive pattern 126, an upper wire pattern 128, and an upper conductive terminal 129. The lower sheet 130 also includes a lower insulating substrate 132, a lower silver nano conductive pattern 136, a lower wire pattern 138, and a lower conductive terminal 139. For reference, the conductive patterns may be a capacitive touch panel sensor, and the lower silver nano conductive pattern 136 may operate as a transmitter and the upper silver nano conductive pattern 126 may operate as a receiver. .

The upper silver nano conductive pattern 126 and the upper wire pattern 128 may be disposed on the upper insulating substrate 122, and the lower silver nano conductive pattern 136 and the lower wire pattern 138 may be disposed on the lower insulating substrate 132. do. In addition, the upper silver nano conductive pattern 126 is disposed in the longitudinal direction on the upper insulating substrate 122 with reference to FIG. 2, and the lower silver nano conductive pattern 136 is disposed in the transverse direction on the lower insulating substrate 132 so that the upper silver nano conductive pattern 126 is disposed. An area intersecting with the conductive pattern 126 may be formed.

The upper cover substrate 110 may use a rigid glass substrate having high strength and not easily refracted due to direct contact with a part of the body, or a light-transmitting reinforced plastic such as polycarbonate having excellent strength and not easily refracted. .

In addition, the bottom surface of the upper cover substrate 110 is provided with a frame-shaped window decoration 112, the window decoration 112 is a non-transparent component, for example, the upper insulating substrate 122 And the upper and lower wire patterns 128 and 138 disposed on the edges of the lower insulating substrate 132 and the flexible circuit board 140. In some cases, the upper cover substrate functions as an insulating substrate so that the upper silver nano conductive pattern may be directly formed on the bottom surface of the upper cover substrate, and the lower silver nano conductive pattern may also be formed on the upper cover substrate according to the structure of the touch panel sensor. It may be.

For reference, the upper and lower insulating substrates 132 may use materials such as polyethylene, polypropylene, acrylic, acrylic, polyethylene terephthalate (PET), and glass.

Meanwhile, an optical adhesive layer may be interposed between the upper cover substrate 110, the upper sheet 120, and the lower sheet 130, and the optical adhesive layer may be optically excellent because light is transmitted through the optical adhesive layer. Alternatively, an OCA (Optically Clear Adhesive) film, a UV curing agent, or the like may be used.

In addition, the flexible circuit board 140 may include terminals electrically connected to the upper and lower wire patterns 128 and 138 formed on the upper insulating substrate 122 and the lower insulating substrate 132. Therefore, when the object approaches the surface of the upper cover substrate 110, the capacitance value caused by the interaction between the upper silver nano conductive pattern 126 and the lower silver nano conductive pattern 136 interacts with the upper and lower wire patterns 128 and 138. Accordingly, the control unit may be transmitted to an external device, and the control unit corresponding to the external device may calculate the touch position by using the change of the value.

The configuration and components of the touch panel sensor according to the present invention have been described above. Hereinafter, the manufacturing process of the upper and lower sheets for generating an electric signal by the approach of the touch panel sensor, in particular, will be described. The description of the lower sheet may be replaced with the description of the upper sheet.

Hereinafter, a manufacturing process of the top sheet 120 will be described with reference to FIGS. 3 to 7. As will be described later, the following process may be applied to the manufacturing process of the lower sheet 130 by changing only the pattern, and may also be applied to the case of forming the upper conductive pattern and the lower conductive pattern on the upper and lower surfaces of one insulating substrate.

In addition, the top sheet 120 may be formed at the same time as a plurality of cells on the original one insulating substrate base material, it can be progressed as shown in the following drawings.

Referring to FIG. 3, a roll-shaped insulating disc 121 for a touch panel sensor of a plurality of cells is provided. The transparent conductive film 124 is coated on the entire surface of the insulating disc 121 and is provided. The transparent conductive film 124 may be provided using a silver nanofiber solution, and the silver nano conductive film may be formed directly on an insulating substrate or may be formed by a half coating method, depending on the formation method thereof.

Referring to FIG. 4, a wire pattern 128 is formed on the transparent conductive film 124. The wire pattern 128 may be electrically connected to the terminals of the flexible circuit board 140, and may include silver paste silk printing, gravure printing of conductive ink including silver ink, printing methods such as flexographic printing, metal thin film formation and etching, and the like. It can be formed in a variety of ways. Since the conductive pattern 126 is not formed when the wire pattern 128 is formed, the wire pattern 128 can be formed in advance corresponding to the formation position of the conductive pattern 126.

Referring to FIG. 5, a transparent insulating pattern 156 is formed on the transparent conductive film 124 corresponding to the shape of the transparent conductive pattern 126. The transparent insulating pattern 156 has a rectangular shape extending vertically up and down, and includes a rectangular hole formed at even intervals therein. Therefore, the transparent insulating pattern 156 is provided with three straight patterns connected to the top and bottom and formed in a uniform width and spacing. Three straight patterns form a group, and six transparent insulating patterns 156 are arranged in parallel at equal intervals. For reference, the above structure may be formed of various structures such as a diamond structure according to the type of the touch sensor as an example of the transparent conductive pattern.

In FIG. 5A, transparent insulating patterns 156 are formed on the transparent conductive film 124 at uniform intervals. In FIG. 5B, the wire patterns 128 are formed on the transparent conductive film 124. An end is positioned, and a transparent insulating pattern 156 is formed thereon.

Referring to FIG. 6, a portion not covered by the transparent insulating pattern 156 may be removed by etching. The transparent insulating pattern 156 functions as a mask, and a part of the transparent conductive layer 124 including silver nanofibers may be removed by an aqueous solution or a silver etching solution. The transparent conductive pattern 126 can be formed by partially removing a portion of the transparent conductive film 124 not printed with the transparent insulating pattern 156.

Referring to FIG. 7, after the transparent conductive pattern 126 is formed, the protective coating layer 125 may be formed, and an insulating substrate 122 corresponding to each cell may be provided by cutting the insulating insulating plate 121 of a paper shape. have. In general, it is preferable to form the protective coating layer 125 and to cut the insulating disk 121 in the form of a base paper. However, in some cases, the protective coating layer 125 may be formed after cutting.

As described above, the upper silver nano conductive pattern and the upper wire pattern may be separately formed on the upper insulating substrate having a size used for one touch panel sensor. However, in the present exemplary embodiment, the upper silver nano conductive pattern 126 and the upper wire pattern 128 are provided by drawing the upper insulating plate 121 corresponding to at least one or more upper insulating substrates 122 from the winding rollers. The upper insulated substrate 122 of the sheet is produced in a batch, and can be cut and used immediately before use to the touch panel sensor 100.

The upper insulating plate 121 of the present embodiment is provided in a size corresponding to at least one or more upper insulating substrates 122, specifically, the process of forming the upper insulating substrate 122 of 1 * x at a time, Depending on the manufacturer's intention, the design can be changed to x * y, such as 5 * 5, 6 * 6, 3 * 4, etc.

The transparent conductive pattern 126 of the upper insulating plate 121 is protected by the protective coating layer 125 covering the entire insulating plate 121. Can escape.

For reference, the silver nano conductive pattern 126 may be provided at about 0.1 to about 0.2 μm, and the protective coating layer 125 may be provided at about 0.5 μm or more to expose the upper silver nano conductive pattern 126 to the surface of the upper protective coating layer 125. Can be prevented.

The protective coating layer 125 also covers the upper wire pattern 128 as mentioned above. Therefore, in order to electrically connect the upper wire pattern 128 with an external device such as the controller or the flexible circuit board 140, it is necessary to partially remove the protective coating layer 125 to expose the end portion of the upper wire pattern 128. have.

Through holes are formed in the upper protective coating layer 125 using a laser to expose the ends of the wire patterns 128, and the conductive terminals 129 exposed from the wire patterns 128 are connected to the flexible circuit board 140. I can connect it. Electrical changes generated in the silver nano-conductive pattern 126 may be sequentially transmitted through the wire pattern 128 and the flexible circuit board 140 by the approach of the object, and the control unit may use the electrical changes to touch the touch position. Can be calculated. Of course, in addition to the laser etching method of selectively peeling only the protective coating layer to form the through hole, a method of chemical etching or physical perforation may be used.

For reference, in the present embodiment, the conductive patterns 126 and 136 have a group structure in which upper and lower ends are connected such that three straight patterns form a group, but the present invention is not limited to the structure of the conductive pattern. The conductive pattern may be applied to a structure already disclosed in touch panel sensors such as Publication Nos. 10-2011-0092814, 10-2010-0138849, and 10-2011-0095684.

In the present embodiment, the upper sheet has been described as an object, but the same may be applied to the lower sheet, and may also be described as the case where the upper and lower conductive patterns are simultaneously or sequentially formed on both surfaces in one roll film. In addition, the upper conductive pattern may be directly formed on the tempered glass substrate, and the lower conductive pattern may be formed on the insulating substrate and then attached to each other.

8 and 9 are plan and cross-sectional views illustrating a process of manufacturing the top sheet of the touch panel sensor according to another embodiment of the present invention. For reference, the description of the insulating disc, the transparent insulating pattern, the transparent conductive film, and the process of forming the same may refer to the above description.

Referring to FIG. 8, a transparent insulating pattern 256 is formed on the transparent conductive film 224 to correspond to a desired shape of the transparent conductive pattern 226. In FIG. 8A, transparent insulating patterns 256 are formed on the transparent conductive film 224 at uniform intervals, and in FIG. 8B, the wire patterns 228 are formed on the transparent conductive film 224. An end is positioned and a transparent insulating pattern 256 is formed thereon.

Referring to FIG. 9, a portion that is not protected by the transparent insulating pattern 256 may be chemically dissociated by immersing or passing the insulating disc 221 in the dissociation solution. For example, the insulating disc 221 may be passed through the high concentration resin solution, and in this process, the resin may penetrate between the silver nanofibers of the silver nanoconductive film 224 to separate electrical bonds between the fibers.

Thus, similarly to the removal, a transparent conductive pattern 226 is formed, and a portion of the remaining but dissociated conductive film 224 remains in the insulating disc 221 as the dissociated pattern 227.

Here again, the transparent insulating pattern 256 functions as a mask, and a portion except the dissociated pattern 227 of the transparent conductive film 224 including silver nanofibers is defined as the transparent conductive pattern 226.

10 and 11 are plan views and cross-sectional views for explaining a process of manufacturing a top sheet of a touch panel sensor according to another embodiment of the present invention. For reference, the description of the insulating disc, the transparent insulating pattern, the transparent conductive film, and the process of forming the same may refer to the above description.

Referring to FIG. 10, first, a transparent conductive film 324 is formed of a conductive fiber solution in which a conductive fiber, a water-soluble binder, and a water-soluble solvent for dissolving the water-soluble binder are mixed on the insulating disc 321. The water-soluble solvent is volatilized and disappeared using water or alcohol, and substantially the conductive fiber is stably attached on the insulating disc 321 through the water-soluble binder. In this state, since the conductive fibers are entangled with each other, the transparent conductive film 324 is conductive even if a water-soluble binder is sandwiched in between. In this embodiment, ethyl cellulose may be used as the water-soluble binder of the conductive fiber solution, and water or an alcohol-based material may be used as the water-soluble solvent. In this embodiment, the conductive fiber may include a metal fiber including other metals (Al, Ag, Au, Cu, W) on a fiber other than the silver (Ag) nanofibers mentioned above, and furthermore, Although not constituted, it may include a fibrous nonmetallic fibrous material having conductivity such as carbon fiber.

Thereafter, the wire pattern 328 is provided, and then a transparent insulating pattern 356 is formed on the transparent conductive film 324 corresponding to the desired shape of the transparent conductive pattern 326.

The transparent insulating pattern 326 may be a liquid oil resin alone, but may be formed by mixing an oil solvent for dissolving the oil resin with the oil resin and curing the oil resin on the transparent conductive film 324.

The oily resin of the transparent insulation pattern may include at least one of urethane, epoxy acrylate, and polyester acrylate, and the oily solvent of the transparent insulation pattern may include acetone, acetone, Methyl isobutyl ketone (MIBK), methyl ethyl ketone (MEK), cyclohexane, toluene, ethylate, ethyl acetate, butyl acetate butyl acetate).

10A, a transparent insulating pattern 356 is formed on the transparent conductive film 324 at uniform intervals, and in FIG. 10B, a wire pattern 328 is formed on the transparent conductive film 324. An end is located and a transparent insulating pattern 356 is formed thereon.

Next, the conductive fibers in the transparent conductive film 324 in the portion not protected by the transparent insulating pattern 356 can be dissociated so as to lose conductivity. This process may refer to FIG. 11. Here, the dissociation may imply the meaning of simply dissolving, but more specifically, the conductive fibers contained in the transparent conductive film 324 are entangled with each other to be released and released to lose electrical conduction ability. It can have the meaning of changing to a sufficiently separated state.

Referring to FIG. 11, the dissociation resin solution 360 is coated on the insulating disc 321 so that the transparent insulating pattern 356 is sufficiently covered.

Here, the height of the dissociation resin solution 360 can be adjusted as long as the conductive fibers contained in the transparent conductive film 324 can provide a space that can be sufficiently spaced apart to lose electrical conductivity.

In addition, the dissociation resin solution 360 may include a water-soluble resin and a water-soluble solvent for dissolution of the water-soluble resin. In the process of curing the dissociation resin solution 360, the water-soluble solvent may be volatilized, and thus, the dissociation resin After curing of the solution 360 (substantially to cure the water-soluble resin), the height of the dissociation resin solution 360 may be somewhat reduced, but as mentioned above, the height of the dissociated resin solution 360, which is reduced and changed, is transparent. The conductive fibers contained in the film 324 should be adjusted within a range that can be sufficiently spaced apart to lose electrical conductivity.

In any case, if the remaining water-soluble resin hardens as it is after the water-soluble solvent in the dissociative resin solution 360 is volatilized, the conductive fibers that have been dissociated in the water-soluble resin and kept separated from each other naturally cannot conduct electricity any more. The transparent conductive film 324 exposed to the dissociation resin solution 360, that is, not protected by the transparent insulating pattern 356, may lose electrical conductivity.

In particular, when the metal fiber is evenly gradient in the dissociation resin solution disposed above the excluded region, and the dissipation resin solution is cured as it is in the dissociated state, the region and the transparent conduction except for the portion protected by the transparent conductive pattern The light transmission by the metal fiber in the portion protected by the pattern may be the same. Therefore, when the touch panel sensor manufactured by the present manufacturing method is viewed from above, the boundary portion of the transparent conductive pattern may be virtually obscured and may provide an effect that is not visually confirmed.

In addition, the water-soluble resin of the dissociation resin solution 360 may be used by dissolving at least one of a water-soluble photocurable resin, a water-soluble natural drying resin, and a water-soluble thermosetting resin in a water-soluble solvent. The curing process may change depending on the propensity of the water-soluble resin used. For example, Alberdingk Boley's LUX series products are representative water soluble photocurable resins, and LUX 220, 250 and 255 products are cured by UV light.

Therefore, when Alberdingk Boley Co., Ltd. LUX product is used as a water-soluble resin, the water-soluble solvent may use only general water, and in some cases, when a water-soluble resin is dissolved in alcohol, an alcohol-based material may be used as the water-soluble solvent. For reference, the water-soluble resin may be provided with the same material as the water-soluble binder of the conductive fiber solution.

In summary, the portion that is not protected by the transparent insulating pattern 356 is dissociated and is not substantially removed. However, the transparent conductive film 324 may be realized in the same way as it is physically removed. The portion except for the dissociated pattern 327 is defined as the transparent conductive pattern 326.

In the present exemplary embodiment, the protective coating layer may be formed after the transparent conductive pattern is formed in the same manner as in the previous embodiments, but in this embodiment, the dissociative resin solution 360 may actually serve as a protective coating layer.

In addition, looking at the above embodiments, the surface is not smooth unless the protective coating layer is thickened by a wire pattern or transparent insulating patterns.

However, in the present embodiment, the dissociation resin solution 360 is hardened and the surface thereof is smoothly provided, thereby greatly reducing the defect rate caused by bubbles interposed between the sheet and the optical adhesive layer used for bonding between the upper and lower sheets.

As described above, although described with reference to the preferred embodiment of the present invention, those skilled in the art various modifications and variations of the present invention without departing from the spirit and scope of the invention described in the claims below I can understand that you can.

The touch panel sensor according to the present invention can be widely applied to a display for the purpose of detecting a contact position of an object.

Claims (20)

1. In the manufacturing method of the touch panel sensor disposed on the display to detect the contact position of the object,

   Forming a transparent conductive film using a metal fiber solution on an insulating substrate;

   Forming a wire pattern on the transparent conductive film for electrical connection with the outside;

   Forming a transparent insulating pattern on the transparent conductive film corresponding to the wire pattern; And

   Forming a transparent conductive pattern from the transparent conductive film using the transparent insulating pattern as a mask;

   Method of manufacturing a touch panel sensor comprising a.
2. The method of claim 1,

   The metal fiber solution includes a metal nano wire, a synthetic resin, and a solvent,

   The metal fiber solution is coated on the entire surface of the insulating film manufacturing method of the touch panel sensor, characterized in that to form the transparent conductive film.
3. The method of claim 1,

   And removing an area except the portion protected by the transparent insulating pattern to form the transparent conductive pattern.
4. The method of claim 1,

   After forming the transparent conductive pattern, a method of manufacturing a touch panel sensor, characterized in that to form a protective coating layer.
5. The method of claim 1,

   A cell for one or a plurality of touch panel sensors is formed simultaneously on the insulating substrate, and the insulating substrate is provided in the form of a flat film or a roll film.
6. In the touch panel sensor disposed on the display to sense the contact position of the object,

   Insulating substrate;

   A transparent conductive pattern formed on the insulating substrate and provided using a metal fiber solution;

   A wire pattern formed on the transparent conductive pattern to electrically connect the transparent conductive pattern and the outside; And

   A transparent insulating pattern provided in the same shape as the transparent conductive pattern and for forming the transparent conductive pattern;

   Touch panel sensor comprising a.
7. The method of claim 6,

   The transparent conductive pattern is a manufacturing method of the touch panel sensor, characterized in that provided by removing the area except the portion protected by the transparent insulating pattern.
8. The method of claim 6,

   The touch panel sensor further comprises a protective coating layer covering the transparent conductive pattern and the transparent insulating pattern.
9. In the manufacturing method of the touch panel sensor disposed on the display to detect the contact position of the object,

   Forming a transparent conductive film on the insulating substrate;

   Forming a wire pattern on the transparent conductive film for electrical connection with the outside;

   Forming a transparent insulating pattern on the transparent conductive film corresponding to the wire pattern; And

   Forming a transparent conductive pattern from the transparent conductive film using the transparent insulating pattern as a mask;

   Method of manufacturing a touch panel sensor comprising a.
10. The method of claim 9,

    The transparent conductive film is a method of manufacturing a touch panel sensor, characterized in that formed using at least one of ITO, IZO, ATO, conductive polymer, silver nano wire, and CNT.
11. The method of claim 9,

    And etching the region except the portion protected by the transparent insulating pattern to form the transparent conductive pattern.
12. In the manufacturing method of the touch panel sensor disposed on the display to detect the contact position of the object,

    Forming a transparent conductive film over the insulating substrate using a conductive fiber solution;

    Forming a wire pattern on the transparent conductive film for electrical connection with the outside while maintaining the transparent conductive film as it is;

    Forming a transparent insulating pattern on the transparent conductive film corresponding to the wire pattern; And

    Using the transparent insulating pattern as a mask, the conductive fibers in the regions excluding the portion protected by the transparent insulating pattern are dissociated from each other electrically, and the transparent conductive film is separated from the transparent conductive film in the portion protected by the transparent insulating pattern. Forming a pattern;

    Touch panel sensor comprising a.
13. The method of claim 12,

    The conductive fiber solution includes the conductive fiber, the water-soluble binder, and a water-soluble solvent for dissolving the water-soluble binder, and the conductive fiber is removed from the insulating substrate by the water-soluble binder on the insulating substrate. Adhere to form the transparent conductive film,

    The transparent insulating pattern is formed by using a liquid oil resin alone or by mixing an oil solvent for dissolving the oil resin with the oil resin, by curing the oil resin on the transparent conductive film,

    Method of manufacturing a touch panel sensor, characterized in that for dissolving the conductive fiber using a dissociating resin solution to dissolve the water-soluble binder in the step of forming the transparent conductive pattern.
14. The method of claim 13,

    The oily resin of the transparent insulating pattern includes at least one of urethane, epoxy acrylate, and polyester acrylate,

    The oil-based solvent of the transparent insulating pattern is acetone (acetone), methyl isobutyl ketone (MIBK; Methyl isobutyl ketone), methyl ethyl ketone (MEK; methyl ethyl ketone), cyclohexane, toluene, ethylate Method of manufacturing a touch panel sensor comprising at least any one of (ethylate), ethyl acetate, and butyl acetate.
15. The method of claim 13,

    The water-soluble binder of the conductive fiber solution includes ethyl cellulose (ethyl cellulose),

    The water-soluble solvent of the conductive fiber solution is a method of manufacturing a touch panel sensor, characterized in that it comprises water or alcohol (alcohol meter).
16. The method of claim 13,

    The dissociation resin solution is cured as it is while the conductive fibers in the region excluding the portion protected by the transparent conductive pattern are evenly gradient and dissociated in the dissociation resin solution.

    The method of manufacturing a touch panel sensor, wherein the transparent conductive film loses electrical conductivity in a region except for a portion protected by the transparent conductive pattern.
17. The method of claim 13,

    The dissociation resin solution comprises a water-soluble resin and a water-soluble solvent for dissolving the water-soluble resin.
18. The method of claim 17,

    The water-soluble resin is a method for manufacturing a touch panel sensor, characterized in that it comprises at least one of a water-soluble photo-curing resin, water-soluble natural drying resin, and a water-soluble thermosetting resin.
19. The method of claim 17,

    The water-soluble solvent is a method of manufacturing a touch panel sensor, characterized in that used alone or mixed with water or alcohol (alcohol meter).
20. The method of claim 12,

    After forming the transparent conductive pattern, a method of manufacturing a touch panel sensor, characterized in that to form a protective coating layer.

Images