WO2015069048A1 - Touch panel for implementing touch sensor using one sheet of film and method for manufacturing same - Google Patents

Touch panel for implementing touch sensor using one sheet of film and method for manufacturing same Download PDF

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Publication number
WO2015069048A1
WO2015069048A1 PCT/KR2014/010636 KR2014010636W WO2015069048A1 WO 2015069048 A1 WO2015069048 A1 WO 2015069048A1 KR 2014010636 W KR2014010636 W KR 2014010636W WO 2015069048 A1 WO2015069048 A1 WO 2015069048A1
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WO
WIPO (PCT)
Prior art keywords
touch panel
axis electrostatic
electrostatic electrodes
transparent conductive
electrode
Prior art date
Application number
PCT/KR2014/010636
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French (fr)
Korean (ko)
Inventor
박준영
정주현
송영진
노수천
한원희
김기보
Original Assignee
주식회사 티메이
박준영
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Priority claimed from KR1020140009463A external-priority patent/KR20150054613A/en
Application filed by 주식회사 티메이, 박준영 filed Critical 주식회사 티메이
Publication of WO2015069048A1 publication Critical patent/WO2015069048A1/en

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Definitions

  • the present invention relates to a method for manufacturing a touch panel, and in particular, a plurality of electrode terminals are formed in an FPCB bonding region in which a driving electrode and a sensing electrode are formed on an ITO film, and are combined with a flexible printed circuit board (FPCB).
  • the present invention relates to a touch panel and a manufacturing method for implementing a touch sensor using a single piece of film to reduce the number of pads by tying.
  • the touch panel is an input device that can be easily used by anyone by interactively and intuitively operating a computer or the like by touching a button with a finger.
  • Such a touch panel has a resistive method, a capacitive method, an infrared method, an ultrasonic method, and the like, depending on a method of sensing a touch, and a resistive method is currently used, but it is advantageous for durability and light and simple characteristics in the future. The use of capacitive methods will be increased.
  • Such a capacitive touch panel especially a touch screen, has a structure of indium tin oxide (ITO) made of a transparent conductor on a transparent insulator film such as polyethylene terephthalate (PET) or glass, and a silver paste on the edge of the ITO.
  • ITO indium tin oxide
  • PET polyethylene terephthalate
  • Pads made of lead wires are laminated up and down by adding an adhesive layer or an insulator layer.
  • ITO is composed of X-axis ITO having X-axis electrostatic electrodes formed at equal intervals and Y-axis ITO having Y-axis electrostatic electrodes formed at equal intervals so as to be stacked.
  • the touch screen formed as above is a controller that receives a touch signal according to a user's touch and outputs a coordinate signal.
  • the electrostatic electrodes arranged side by side on the X axis or the Y axis are arranged at different distances from the lead wire. Since different electrostatic electrodes are disposed between them, each electrostatic electrode has different electrical characteristics when viewed from the part where the lead wire is connected.
  • FIG. 1 is a view showing an X-axis electrode pattern in a conventional capacitive touch panel
  • Figure 2 is a view showing a Y-axis electrode pattern in a conventional capacitive touch panel
  • Figure 3 is a conventional capacitive touch panel 4 is a view illustrating a state in which the X-axis electrode pattern and the Y-axis electrode pattern are coalesced
  • FIG. 4 is a view illustrating a layer structure in a state in which the X-axis electrode pattern and the Y-axis electrode pattern are coalesced in a conventional capacitive touch panel. to be.
  • FIG. 1 is a diagram illustrating a conventional bottom pattern layer, and shows an X-axis electrode pattern
  • FIG. 2 is a diagram illustrating a conventional top pattern layer, and a Y-axis electrode pattern.
  • a bottom pattern having an X-axis electrostatic electrode 10 and a top pattern having a Y-axis electrostatic electrode 20 as shown in FIGS. 1 and 2 are respectively fabricated and laminated between layers, and then a window is attached to the touch panel. To prepare. The touch panel completed by this manufacturing process is shown in FIG. 3.
  • a conventional capacitive touch panel includes a bottom pattern having an X-axis electrostatic electrode 10 as a driving electrode and a top pattern having a Y-axis electrostatic electrode 20 as a sensing electrode. It is formed evenly on the upper surface of the connection electrodes 30, 40 on one side.
  • the layer structure of the conventional capacitive touch panel is shown in FIG. 4.
  • the OCA must be added to the top of the ITO film essentially, two ITO films were used, so two OCAs were required.
  • the conventional touch panel has a disadvantage in that it is expensive because two sheets of ITO film and OCA are used to make one touch panel product.
  • the present invention forms a drive electrode and a sensing electrode on a sheet of ITO film, and a method of tying a plurality of electrode terminals together in an FPCB bonding region combined with a flexible printed circuit board (FPCB). It is an object of the present invention to provide a touch panel and a manufacturing method for implementing a touch sensor using a single film to reduce the number of pads.
  • a photosensitive material of an insulating material is formed on the upper surface of the touch panel, and a layer formed of a transparent photosensitive material extends to a part of the FPCB bonding region coupled with the flexible printed circuit board (FPCB) to form a horizontal direction. Removing and opening an area where one end portion of each first axis electrostatic electrode is located; And
  • a metal layer is formed on the upper surface of the touch panel, and the metal layer is selectively removed to connect one end portion of each of the first axis electrostatic electrodes formed in the horizontal direction to one area in the horizontal direction, thereby connecting one side of each first axis electrostatic electrode.
  • Forming a first metal lead of the metal layer by tying one end to a metal electrode portion coupled to the FPCB.
  • a touch panel corresponds to a window area of a touch panel and is spaced apart in a horizontal direction at intervals of a predetermined distance to form a plurality of electrostatic electrodes, and a plurality of electrostatic electrodes are formed for each column by a predetermined distance.
  • One end portion of each of the first axis electrostatic electrodes formed in the upper surface of the touch panel and extending in a horizontal direction to a part of the FPCB bonding region coupled to the flexible printed circuit board (FPCB) is positioned.
  • each first axis electrostatic electrode formed in the horizontal direction By connecting one area where one end of each first axis electrostatic electrode formed in the horizontal direction is located in one horizontal direction, one end of each first axis electrostatic electrode and a metal electrode portion coupled to the FPCB are bundled together as a first metal lead. It includes a metal layer to form.
  • the present invention can reduce the thickness by manufacturing a touch sensor formed with a drive electrode and a sensing electrode on one sheet of ITO film, there is an effect that can reduce the raw material cost and process cost.
  • the present invention can implement a narrow bezel (Bezel) has the effect of forming a wide window area that is a user's touch area.
  • Bezel has the effect of forming a wide window area that is a user's touch area.
  • sharpness is excellent after forming an electrode trace based on a photolithography method.
  • the present invention has the effect of reducing the number of pads (Pad) by insulating and opening the jumping connection region for connecting the electrode terminal, and then bundling the jumping connection region by screen printing silver paste.
  • the metal layer is thinly formed to a thickness of 0.2 ⁇ m or less by a metal sputtering process, thereby reducing bubbles when laminating with glass by OCA, thereby securing high yield.
  • FIG. 1 is a view showing an X-axis electrode pattern in a conventional capacitive touch panel.
  • FIG. 2 illustrates a Y-axis electrode pattern in a conventional capacitive touch panel.
  • FIG. 3 is a view illustrating a state in which an X-axis electrode pattern and a Y-axis electrode pattern are coalesced in a conventional capacitive touch panel.
  • FIG. 4 is a diagram illustrating a layer structure in a state in which an X-axis electrode pattern and a Y-axis electrode pattern are combined in a conventional capacitive touch panel.
  • 5 to 7 are diagrams illustrating a method of manufacturing a touch panel implementing a touch sensor using a single film according to an embodiment of the present invention in a layer structure on the side.
  • FIG. 8 is a plan view showing a top view of a touch panel implementing a touch sensor using a single film according to an embodiment of the present invention.
  • FIG. 9 is a view schematically illustrating a touch panel implementing a touch sensor using a single film according to an embodiment of the present invention.
  • FIG. 10 is a diagram illustrating an example of a metal lead connected to each X-axis electrostatic electrode and one end thereof in a touch panel according to an exemplary embodiment of the present invention.
  • FIG. 11 is a diagram illustrating an example of a metal lead connected to each Y-axis electrostatic electrode and one end thereof in a touch panel according to an exemplary embodiment of the present invention.
  • FIG. 12 is a view showing an example in which a transparent conductive layer according to another embodiment of the present invention is formed of a transparent conductive photosensitive film.
  • FIG. 13 is a view showing an example in which a transparent conductive layer is formed of a conductive polymer according to another embodiment of the present invention.
  • the sensing electrode senses a change in the voltage value of the mutual cap to detect whether or not the touch is performed. The touch position is detected.
  • the sensing electrodes Receive and Rx detect whether the touch panel is touched and the touch position as a change in the voltage value, and the driving voltages of the touch electrodes Transfer and Tx are applied.
  • FIG. 5 to 7 are diagrams showing a method of manufacturing a touch panel implementing a touch sensor using a single film according to an embodiment of the present invention in a layer structure on the side
  • FIG. 8 is a view according to an embodiment of the present invention.
  • 9 is a plan view illustrating a touch panel implementing a touch sensor using a sheet of film
  • FIG. 9 is a view schematically illustrating a touch panel implementing a touch sensor using a sheet of film according to an embodiment of the present invention.
  • FIG. 10 is a view showing an example of each of the X-axis electrostatic electrode and the metal conductor connected to one end thereof in the touch panel according to an embodiment of the present invention
  • Figure 11 is a respective Y axis in the touch panel according to an embodiment of the present invention
  • 2 is a diagram illustrating an example of a metal conductive wire connected to an electrostatic electrode and one end thereof.
  • an index matching layer (Index-Matching) 112 is formed on the upper surface of the insulator layer 110, and thereon.
  • the transparent conductive layer 120 is formed.
  • the insulator layer 110 is formed of an organic insulator or an inorganic insulator of a transparent material, and the organic insulator is polyimide or polyethylene terephthalate (PET), polyethylenenaphthalate (PEN), polycarbonate, PC), acrylic plastic material, and the inorganic insulator is made of glass material and optically treated glass material.
  • Index-Matching (112) is a coating to form an insulating film layer using an insulating material having a difference in refractive index with the transparent conductive layer 120, and to treat the presence or absence of ITO after the ITO (120) pattern to be,
  • the index matching layer 112 forms a pattern on the transparent conductive layer 120 and improves visibility due to the difference in reflectance between the portions with and without the transparent conductive layer 120.
  • the index matching layer 112 is an insulating layer having a refractive index that can improve the visibility of the circuit of the transparent conductive layer 120.
  • the index matching layer 112 means that the lower layer of the ITO 120 is optically treated so that the portion of the ITO and the portion of the non-existent ITO film are not detected by the eye when the capacitive ITO film is manufactured.
  • the index matching layer 112 may raise SiO 2 , TiO 2, Ceo 2, or the like by a dry method (deposition), or may perform a chemical treatment by a wet method.
  • the index matching layer 112 may have an insulating layer such as SiO 2 , TiO 2, Ceo 2, or Nb 2 O 5 having a refractive index capable of compensating for the height of the transparent conductive layer 120 in a single or multiple layer structure. Form.
  • a transparent conductive layer 120 is a transparent conductive oxide (Transparent Conducting Oxide, TCO) and formed of a conductive material of transparent material, such as, specifically, including ITO or IZO (Indium Zinc Oxide) or ITO, IZO, SnO 2, AZO It is formed of a transparent conductive material.
  • TCO Transparent Conducting Oxide
  • the transparent conductive layer 120 is a transparent conductive photosensitive film, a conductive polymer, carbon nanotubes (CNT), graphene (Graphene), conductive polymers, silver nanowires (AGNW), Hybrid AGNW ( CNT + AGNW), hybrid graphene (AGNW + graphene) and the like can be formed of a transparent conductive material.
  • the transparent conductive layer (ITO film, etc.) 120 of the present invention includes an index matching layer (insulation layer) 112 on the bottom surface.
  • the present invention forms a first photosensitive material 140 on the upper surface of the transparent conductive layer 120, the pattern is formed When UV irradiation is performed using the first artwork film 142, a pattern is formed on the first photosensitive material 140 (exposure), and an open pattern is formed on the first photosensitive material 140 using a weak alkali solution. (phenomenon).
  • the present invention illustrates the first artwork film 142 in which the pattern is formed
  • the present invention is not limited thereto, and any pattern tool may be used, and using the equipment for directly implementing the pattern without the pattern tool. An exposure process may also be performed.
  • the process of forming the first photosensitive material 140 is formed by coating a liquid photoresist or laminating a dry film.
  • a coating process may be used, and in the case of using an insulating material of SiO 2 or TiO 2 , a deposition process may be used.
  • the present invention selectively etches the transparent conductive layer 120 using an acidic chemical to the first photosensitive material 140 having an open pattern.
  • the first photosensitive material 140 is removed using a strong alkali chemical to form the electrostatic electrode pattern 121 (etching process, peeling process).
  • 6 (e) and 6 (f) are subjected to laminating, exposure, development, etching, and peeling by a process of photolithography.
  • the electrostatic electrode pattern 121 is a portion corresponding to the window area (the area where the screen is displayed) of the touch panel, and represents a pattern representing a plurality of electrostatic electrodes formed spaced at intervals of a predetermined distance, and represents a user's touch pattern area.
  • the electrostatic electrode pattern 121 includes a plurality of X-axis electrostatic electrodes 122 and respective Y-axis electrostatic electrodes 124 which are adjacently surrounded by the respective X-axis electrostatic electrodes 122.
  • the plurality of X-axis electrostatic electrodes 122 represent a plurality of driving electrodes Transfer and Tx
  • the plurality of Y-axis electrostatic electrodes 124 include sensing electrodes Receive and Rx surrounding each driving electrode.
  • the plurality of X-axis electrostatic electrodes 122 are spaced apart in the horizontal direction at intervals of a predetermined distance in the window area of the touch panel to form a plurality of electrostatic electrodes, and the plurality of electrostatics The electrodes are formed at intervals of a certain distance apart.
  • the plurality of Y-axis electrostatic electrodes 124 are a plurality of electrostatic electrodes that are adjacently surrounded by the respective X-axis electrostatic electrodes 122 in the vertical direction, and the plurality of electrostatics The electrodes are formed in rows by spaced distances.
  • the plurality of X-axis electrostatic electrodes 122 extend from one side of each X-axis electrostatic electrode formed in the horizontal direction to a part of the FPCB bonding region 200, respectively.
  • the plurality of Y-axis electrostatic electrodes 124 extends to a part of the FPCB bonding region 200 by connecting each of the Y-axis electrostatic electrodes formed in the vertical direction to one.
  • the FPCB bonding region 200 is an edge region excluding the window region of the touch panel, and includes a metal electrode portion coupled to a flexible printed circuit board (FPCB) and a region except the window region touched by the user.
  • FPCB flexible printed circuit board
  • the transparent photosensitive material of transparent material is formed on the upper surface of the touch panel. 150) (laminating, coating or deposition process).
  • the transparent photosensitive material 150 may include a transparent dry film as an example of a photosensitive transparent insulating material.
  • the transparent photosensitive material 150 it can be left in the transparent window area, it is possible to prevent a defect such as scratches in the post-process.
  • the transparent photosensitive material 150 is used as an insulating material.
  • the present invention forms a second artwork film 152 on the upper surface of the transparent photosensitive material 150, and the photolithography exposure and development process By selectively removing the jumping connection region 160 in the layer of the transparent photosensitive material 150 of the touch panel to open.
  • the jumping connection region 160 extends from a layer formed of the transparent photosensitive material 150 to a part of the FPCB bonding region 200 so that one end portion of each X-axis electrostatic electrode 122 formed in the horizontal direction is located. Indicates.
  • the jumping connection region 160 extends from a layer formed of the transparent photosensitive material 150 to a part of the FPCB bonding region 200 and is located at one end portion of each of the Y-axis electrostatic electrodes 124 formed in the vertical direction. Indicates.
  • the pattern of opening the jumping connection region 160 to the transparent photosensitive material 150 is a jump of the touch panel in the layer made of the transparent photosensitive material 150 formed on the upper surface of the touch panel as shown in FIG.
  • the pattern corresponding to the connection region 160 is an open pattern.
  • the present invention illustrates the patterned second artwork film 152, but is not limited thereto, and any pattern tool having a pattern for opening the jumping connection region 160 may be used.
  • An exposure process may be performed using equipment that implements a pattern.
  • the present invention forms a metal layer 130 on the upper surface of the touch panel.
  • Circuit formation of the metal layer 130 is deposited by a metal sputter (Metal Sputter) to form a pattern using a process of photolithography.
  • Metal Sputter Metal Sputter
  • the metal layer 130 may be formed of Cu, Cu alloy, Ag, Ag alloy, Ni + Cr, Ni + Ni alloy, Mo / Ag, Mo / Al / Mo, Ni + Cr / Cu / Ni + Cr, Ni alloy / Cu, Ni Alloy / Cu / Ni alloy, Mo / APC, Cu / Ni + Cu + Ti, Ni + Cu + Ti / Cu / Ni + Cu + Ti, carbon and all conductive materials are included.
  • the metal layer 130 may be formed of a silver paste, or various methods may be used, such as depositing copper.
  • the metal layer 130 may use various metals and is preferably copper or aluminum in consideration of ease of manufacture and electrical conductivity.
  • the jumping connection region 160 which is an area where one end of each of the X-axis electrostatic electrodes 122 formed in the horizontal direction by selectively removing the metal layer 130 by the photolithography process, is positioned in the horizontal direction.
  • the first metal lead wire 132 is formed by connecting to one end and tying together one end of each X-axis electrostatic electrode 122 and the metal electrode part coupled to the FPCB (FIGS. 8, 9, and 10).
  • the metal layer 130 is selectively removed by the photolithography process, and the metal electrode portion coupled to the FPCB from one end of the Y-axis electrostatic electrode 124 extending to a part of the FPCB bonding region 200.
  • the second metal lead wire 134 is formed (FIGS. 8, 9, and 11).
  • lamination, exposure, development, etching, and peeling are performed by a process of photolithography.
  • each of the first metal conductors 132 is connected to the metal electrode portion to which the FPCB is coupled by tying one end portion of each X-axis electrostatic electrode 122 formed in the horizontal direction in one horizontal direction. do.
  • each second metal lead 134 is connected from one end portion of each of the Y-axis electrostatic electrodes 124 formed in the vertical direction to the metal electrode portion to which the FPCB is coupled.
  • the present invention forms an open pattern on the first photosensitive material 140, and then screen-prints the silver paste using the ink for silk screen printing or applies the silver paste to the exposure and development process of photolithography.
  • photosensitive silver paste printing the number of pads is reduced by bonding the electrode terminals (the first metal lead 132 and the second metal lead 134) into one.
  • FIG. 12 is a view showing an example in which a transparent conductive layer according to another embodiment of the present invention is formed of a transparent conductive photosensitive film.
  • the transparent conductive layer 120 of the present invention may be composed of transparent conductive photosensitive films 170 and 172.
  • the transparent conductive photosensitive films 170 and 172 include a transparent photosensitive resin layer 172 and a transparent conductive material 170 stacked thereon.
  • the transparent conductive material 170 is a conductive and photosensitive transparent material, carbon nanotubes (CNT), graphene, conductive polymers, silver nanowires (AGNW), hybrid AGNW ( CNT + AGNW), formed of a transparent conductive material composed of hybrid graphene (AGNW + graphene) and the like, and conductive polymer, Cu, Cu alloy, Ag, Ag alloy, Ni + Cr, Ni + Ni alloy, Mo / Ag, Mo / Al / Mo, Ni + Cr / Cu / Ni + Cr, Ni alloy / Cu, Ni alloy / Cu / Ni alloy, Mo / APC, Cu / Ni + Cu + Ti, Ni + Cu + Ti / Cu / Ni + The concept includes all conductive materials such as Cu + Ti, carbon, and transparent conducting oxide (TCO).
  • TCO transparent conducting oxide
  • the present invention selectively removes the transparent photosensitive resin layer 172 and the transparent conductive material 170 stacked thereon from a layer formed of the transparent conductive photosensitive films 170 and 172 by photolithography exposure and development processes.
  • An X-axis electrostatic electrode 122 and a plurality of Y-axis electrostatic electrodes 124 are formed.
  • the open pattern formed on the transparent conductive photosensitive film 160 represents the electrostatic electrode pattern 121 including the plurality of X-axis electrostatic electrodes 122 and the plurality of Y-axis electrostatic electrodes 124.
  • the electrostatic electrode pattern 121 is formed by an exposure and development process of photolithography. After that, since the electrode forming procedure is performed in the same manner as the electrode forming procedure of FIGS. 6G to 7K, detailed descriptions thereof will be omitted.
  • FIG. 13 is a view showing an example in which a transparent conductive layer is formed of a conductive polymer according to another embodiment of the present invention.
  • the transparent conductive layer 120 of the present invention may be made of a conductive polymer.
  • the conductive polymer may be polythiophene-based, polypyrrole-based, polyaniline-based, polyacetylene-based, polyphenylene-based, or the like, and is particularly preferred among the polythiophene-based PEDOT / PSS compounds.
  • One or more of the compounds may be mixed and used.
  • the conductivity may be increased.
  • the conductive polymer maintains conductivity by the structure of the double bond benzene ring.
  • the conductive polymer can be removed by the wet process, the wet process can be removed by boiling the structure of the double bond benzene ring by reacting with the etchant (180) as shown in Figure 8 to make a single bond. have.
  • the conductive polymer is made of the non-conductive polymer 190, the polymer layer is maintained as it is, but the conductivity is lost, and the conductivity does not return to the original state because it is not restored to the double bond again without a special catalyst.
  • the electrostatic electrode pattern 121 including the plurality of X-axis electrostatic electrodes 122 and the plurality of Y-axis electrostatic electrodes 124 may be formed by a wet process. It maintains the conductivity of the conductive polymer, and loses the conductivity of the conductive polymer in the region other than the touch pattern to make a non-conductive polymer 190 (conductive polymer patterning process). After that, since the electrode forming procedure is performed in the same manner as the electrode forming procedure of FIGS. 6G to 7K, detailed descriptions thereof will be omitted.
  • the present invention covers the FPCB bonding region 200 with a conductive polymer to prevent corrosion of the oxidation generating region, to prevent the problem of metal cracking by external pressure, and to perform a buffering function during FPCB bonding, and a separate sealing and water repellent coating process Omitted to reduce process costs.
  • the present invention has excellent visibility in terms of visibility by implementing a touch sensor by using the characteristics of the conductive polymer, and thus an index matching layer process is unnecessary.
  • the present invention has advantages in terms of productivity and cost because the coating speed of the conductive polymer is superior to that of ITO or metal deposition.
  • the present invention can reduce the thickness by manufacturing a touch sensor formed with a drive electrode and a sensing electrode on one sheet of ITO film, there is an effect that can reduce the raw material cost and process cost.
  • the present invention can implement a narrow bezel (Bezel) has the effect of forming a wide window area that is a user's touch area.
  • Bezel has the effect of forming a wide window area that is a user's touch area.
  • sharpness is excellent after forming an electrode trace based on a photolithography method.
  • the present invention has the effect of reducing the number of pads (Pad) by insulating and opening the jumping connection region for connecting the electrode terminal, and then bundling the jumping connection region by screen printing silver paste.
  • the metal layer is thinly formed to a thickness of 0.2 ⁇ m or less by a metal sputtering process, thereby reducing bubbles when laminating with glass by OCA, thereby securing high yield.

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  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
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Abstract

A method for manufacturing a touch panel comprises the steps of: forming a plurality of electrostatic electrodes which correspond to window regions of a touch panel and are spaced at each predetermined distance interval in a widthwise direction, and forming, as transparent conductive layers, first axis electrostatic electrodes formed in every column by spacing the plurality of electrostatic electrodes at a predetermined distance and a plurality of second axis electrostatic electrodes formed so as to be adjacent to each of the first axis electrostatic electrodes of a longitudinal direction; forming a photosensitive material made of an insulation material on an upper surface of the touch panel, and removing and opening, at a layer formed from a transparent photosensitive material, regions in which one-sided end parts of each of the first axis electrostatic electrodes which are formed in a widthwise direction by extending up to a partial position of a flexible printed circuit board (FPCB) bonding region coupled with a FPCB are located; and forming a metal layer on the upper surface of the touch panel, and horizontally connecting, into one, the regions in which the one-sided end parts of each of the first axis electrostatic electrodes formed in the widthwise direction are located by selectively removing the metal layer, so as to form a first metal conducting wire of the metal layer by binding, into one, metal electrode parts coupled to an FPCB and the one-sided end parts of each of the first axis electrostatic electrodes.

Description

한 장의 필름을 이용한 터치 센서를 구현하는 터치 패널 및 제조 방법Touch panel and manufacturing method for implementing a touch sensor using a single film
본 발명은 터치 패널의 제조 방법에 관한 것으로서, 특히 ITO 필름 한 장에 구동 전극과 센싱 전극을 형성하고 연성회로기판(Flexible Printed Circuit Board, FPCB)과 결합되는 FPCB 본딩 영역에서 복수개의 전극 단자를 하나로 묶는 방법으로 패드 수량을 감소시키는 한 장의 필름을 이용한 터치 센서를 구현하는 터치 패널 및 제조 방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a touch panel, and in particular, a plurality of electrode terminals are formed in an FPCB bonding region in which a driving electrode and a sensing electrode are formed on an ITO film, and are combined with a flexible printed circuit board (FPCB). The present invention relates to a touch panel and a manufacturing method for implementing a touch sensor using a single piece of film to reduce the number of pads by tying.
일반적으로 터치 패널은 버튼을 손가락으로 접촉하여 컴퓨터 등을 대화적, 직감적으로 조작함으로써 누구나 쉽게 사용할 수 있는 입력 장치이다.In general, the touch panel is an input device that can be easily used by anyone by interactively and intuitively operating a computer or the like by touching a button with a finger.
이러한 터치 패널은 접촉을 감지하는 방식에 따라 저항막 방식과 정전용량 방식, 적외선방식, 초음파 방식 등이 사용되고 있으며, 현재는 저항막 방식이 많이 사용되어지고 있으나, 향후 내구성 및 경박 단소한 특성에 유리한 정전용량 방식의 사용이 증가될 것이다.Such a touch panel has a resistive method, a capacitive method, an infrared method, an ultrasonic method, and the like, depending on a method of sensing a touch, and a resistive method is currently used, but it is advantageous for durability and light and simple characteristics in the future. The use of capacitive methods will be increased.
이와 같은 정전용량방식의 터치 패널, 특히 터치스크린은 그 구조가 PET(Polyethylene Terephthalate)나 유리 등의 투명한 절연체 필름 상에 투광 도전체로 이루어진 ITO(Indium Tin Oxide)와, ITO의 테두리에 실버 페이스트 등의 리드선으로 이루어진 패드를 접착제층이나 절연체층을 부가하여 상하로 적층하여 구성된다.Such a capacitive touch panel, especially a touch screen, has a structure of indium tin oxide (ITO) made of a transparent conductor on a transparent insulator film such as polyethylene terephthalate (PET) or glass, and a silver paste on the edge of the ITO. Pads made of lead wires are laminated up and down by adding an adhesive layer or an insulator layer.
여기서, ITO는 X축의 X축 정전전극을 등 간격으로 형성한 X축 ITO와 Y축의 Y축 정전전극을 등 간격으로 형성한 Y축 ITO로 구성하여 적층되도록 한다.Here, ITO is composed of X-axis ITO having X-axis electrostatic electrodes formed at equal intervals and Y-axis ITO having Y-axis electrostatic electrodes formed at equal intervals so as to be stacked.
위와 같이 형성된 터치스크린은 사용자의 터치에 따른 터치 신호를 컨트롤러가 입력 받아서 좌표 신호를 출력하는 것이다.The touch screen formed as above is a controller that receives a touch signal according to a user's touch and outputs a coordinate signal.
그런데 이와 같이 X축 또는 Y축에 나란하게 배치되는 정전전극은 리드선으로부터 각각 다른 이격거리를 가지고 배치된다. 이들 사이에는 다른 정전전극이 배치되므로 리드선이 연결되는 부분에서 바라보면 각각의 정전전극은 서로 다른 전기적 특성을 가지게 된다.As described above, the electrostatic electrodes arranged side by side on the X axis or the Y axis are arranged at different distances from the lead wire. Since different electrostatic electrodes are disposed between them, each electrostatic electrode has different electrical characteristics when viewed from the part where the lead wire is connected.
이하에서는 이러한 터치 패널의 종래 기술에 관하여 도 1 내지 도 4를 참조하여 설명한다.Hereinafter, the prior art of such a touch panel will be described with reference to FIGS. 1 to 4.
도 1은 종래의 정전용량 방식 터치 패널에서 X축 전극 패턴을 나타낸 도면이고, 도 2는 종래의 정전용량 방식 터치 패널에서 Y축 전극 패턴을 나타낸 도면이고, 도 3은 종래의 정전용량 방식 터치 패널에서 X축 전극 패턴과 Y축 전극 패턴을 합체한 상태를 나타낸 도면이고, 도 4는 종래의 정전용량 방식 터치 패널에서 X축 전극 패턴과 Y축 전극 패턴을 합체한 상태에서의 층 구조를 나타낸 도면이다.1 is a view showing an X-axis electrode pattern in a conventional capacitive touch panel, Figure 2 is a view showing a Y-axis electrode pattern in a conventional capacitive touch panel, Figure 3 is a conventional capacitive touch panel 4 is a view illustrating a state in which the X-axis electrode pattern and the Y-axis electrode pattern are coalesced, and FIG. 4 is a view illustrating a layer structure in a state in which the X-axis electrode pattern and the Y-axis electrode pattern are coalesced in a conventional capacitive touch panel. to be.
도 1은 종래의 바텀(Bottom) 패턴층을 나타내는 도면으로서 X축 전극 패턴을 나타내고, 도 2는 종래의 탑(Top) 패턴층을 나타내는 도면으로서 Y축 전극 패턴을 나타낸다.FIG. 1 is a diagram illustrating a conventional bottom pattern layer, and shows an X-axis electrode pattern, and FIG. 2 is a diagram illustrating a conventional top pattern layer, and a Y-axis electrode pattern.
도 1 및 도 2와 같은 X축 정전전극(10)을 갖는 바텀(Bottom) 패턴과 Y축 정전전극(20)을 갖는 탑(Top) 패턴을 각각 제작하여 층간 합지한 후 윈도우를 부착하여 터치 패널을 제조한다. 이러한 제조 과정에 의해 완성된 터치 패널은 평면도를 도 3에 도시하였다.A bottom pattern having an X-axis electrostatic electrode 10 and a top pattern having a Y-axis electrostatic electrode 20 as shown in FIGS. 1 and 2 are respectively fabricated and laminated between layers, and then a window is attached to the touch panel. To prepare. The touch panel completed by this manufacturing process is shown in FIG. 3.
도 3을 참조하면, 종래의 정전방식 터치 패널은 구동 전극인 X축 정전전극(10)을 갖는 바텀(Bottom) 패턴과 센싱 전극인 Y축 정전전극(20)을 갖는 탑(Top) 패턴이 패널의 상부면에 고루 형성되고, 일측에 연결전극(30, 40)을 형성하였다.Referring to FIG. 3, a conventional capacitive touch panel includes a bottom pattern having an X-axis electrostatic electrode 10 as a driving electrode and a top pattern having a Y-axis electrostatic electrode 20 as a sensing electrode. It is formed evenly on the upper surface of the connection electrodes 30, 40 on one side.
이러한 종래의 정전방식 터치 패널의 층 구조를 보면 도 4와 같다.The layer structure of the conventional capacitive touch panel is shown in FIG. 4.
도 4를 참조하면, 종래에는 탑(Top) 패턴과 바텀(Bottom) 패턴을 각각 제작하므로 탑(Top) 패턴과 바텀(Bottom) 패턴에 사용되는 ITO 필름이 2장 필요하였다.Referring to FIG. 4, in the related art, two ITO films used for the top pattern and the bottom pattern were required because the top pattern and the bottom pattern were manufactured.
또한, ITO 필름 상부에는 OCA가 필수적으로 부가되어야 하는데, ITO 필름이 2장 사용되므로 OCA도 2장 필요하였다.In addition, the OCA must be added to the top of the ITO film essentially, two ITO films were used, so two OCAs were required.
따라서, 종래의 터치 패널은 하나의 터치 패널 제품을 만들기위해 ITO 필름과 OCA가 각각 두 장이 사용되기 때문에 가격적으로 비싼 단점이 있다.Accordingly, the conventional touch panel has a disadvantage in that it is expensive because two sheets of ITO film and OCA are used to make one touch panel product.
종래의 터치 패널은 송신 전극과 수신 전극으로 2개 층을 사용하기 때문에 두께 축소가 어렵고 높은 원자재 비용과 공정 비용이 높게 발생하며 투과도가 떨어지는 문제점이 있었다.In the conventional touch panel, since two layers are used as the transmitting electrode and the receiving electrode, it is difficult to reduce the thickness, high raw material cost and high processing cost, and poor transmittance.
또한, 종래의 터치 패널은 탑 패턴층과 바텀 패턴층의 합지할 때, 셀바이셀(Cell by cell) 방식이 아니라 시트바이시트(Sheet by sheet) 방식으로 하기 때문에 패턴층 별로 불량률을 측정하는 특성에 의해 수율이 좋지 않았다. 특히, 층별 합지시 얼라인 공차를 맞추기가 힘들어 수율이 좋지 않고, 타이트한 공차 관리가 어려운 단점이 있다.In the conventional touch panel, when the top pattern layer and the bottom pattern layer are laminated, the defect rate is measured for each pattern layer because the sheet by sheet method is used instead of the cell by cell method. Yield was not good by In particular, it is difficult to meet the alignment tolerance when laminating each floor, the yield is not good, and tight tolerance management has a disadvantage.
따라서, 이러한 문제점을 해결할 수 있는 정전용량 터치 패널의 구조의 개발이 필요한 실정이다.Therefore, the development of the structure of the capacitive touch panel that can solve this problem is required.
이와 같은 문제점을 해결하기 위하여, 본 발명은 ITO 필름 한 장에 구동 전극과 센싱 전극을 형성하고 연성회로기판(Flexible Printed Circuit Board, FPCB)과 결합되는 FPCB 본딩 영역에서 복수개의 전극 단자를 하나로 묶는 방법으로 패드 수량을 감소시키는 한 장의 필름을 이용한 터치 센서를 구현하는 터치 패널 및 제조 방법을 제공하는데 그 목적이 있다.In order to solve this problem, the present invention forms a drive electrode and a sensing electrode on a sheet of ITO film, and a method of tying a plurality of electrode terminals together in an FPCB bonding region combined with a flexible printed circuit board (FPCB). It is an object of the present invention to provide a touch panel and a manufacturing method for implementing a touch sensor using a single film to reduce the number of pads.
상기 목적을 달성하기 위하여, 본 발명의 특징에 따른 터치 패널의 제조 방법은,In order to achieve the above object, the manufacturing method of the touch panel according to the characteristics of the present invention,
터치 패널의 원도우 영역에 해당하고 일정거리의 간격마다 가로 방향으로 이격되어 복수개의 정전전극을 형성되고, 복수개의 정전전극을 일정거리 이격하여 열마다 형성하는 제1축 정전전극과, 세로 방향의 상기 각각의 제1축 정전전극과 인접하도록 형성한 복수개의 제2축 정전전극을 투명 도전층으로 형성하는 단계;A first axis electrostatic electrode corresponding to the window area of the touch panel and spaced apart in a horizontal direction at intervals of a predetermined distance to form a plurality of electrostatic electrodes; Forming a plurality of second axis electrostatic electrodes formed to be adjacent to each first axis electrostatic electrode as a transparent conductive layer;
터치 패널의 상부면에 절연 물질의 감광성 소재를 형성하고, 투명 감광성 소재로 형성된 층에서 연성회로기판(Flexible Printed Circuit Board, FPCB)과 결합되는 FPCB 본딩 영역의 일부 위치까지 연장되어 가로 방향으로 형성한 각각의 제1축 정전전극의 일측 끝단 부분이 위치한 영역을 제거하여 개방하는 단계; 및A photosensitive material of an insulating material is formed on the upper surface of the touch panel, and a layer formed of a transparent photosensitive material extends to a part of the FPCB bonding region coupled with the flexible printed circuit board (FPCB) to form a horizontal direction. Removing and opening an area where one end portion of each first axis electrostatic electrode is located; And
터치 패널의 상부면에 금속층을 형성하고, 금속층을 선택적으로 제거하여 가로 방향으로 형성된 각각의 제1축 정전전극의 일측 끝단이 위치한 영역을 수평 방향으로 하나로 연결하여 각각의 제1축 정전전극의 일측 끝단과 FPCB와 결합되는 금속 전극 부분까지 하나로 묶어 금속층의 제1 금속도선으로 형성하는 단계를 포함한다.A metal layer is formed on the upper surface of the touch panel, and the metal layer is selectively removed to connect one end portion of each of the first axis electrostatic electrodes formed in the horizontal direction to one area in the horizontal direction, thereby connecting one side of each first axis electrostatic electrode. Forming a first metal lead of the metal layer by tying one end to a metal electrode portion coupled to the FPCB.
본 발명의 특징에 따른 터치 패널은 터치 패널의 원도우 영역에 해당하고 일정거리의 간격마다 가로 방향으로 이격되어 복수개의 정전전극을 형성하고, 복수개의 정전전극을 일정거리 이격하여 열마다 형성하는 제1축 정전전극과, 세로 방향의 각각의 제1축 정전전극과 인접하도록 형성한 복수개의 제2축 정전전극을 나타내는 투명 도전층;According to an aspect of the present invention, a touch panel corresponds to a window area of a touch panel and is spaced apart in a horizontal direction at intervals of a predetermined distance to form a plurality of electrostatic electrodes, and a plurality of electrostatic electrodes are formed for each column by a predetermined distance. A transparent conductive layer representing the axial electrostatic electrode and a plurality of second axial electrostatic electrodes formed to be adjacent to each of the first axial electrostatic electrodes in the longitudinal direction;
터치 패널의 상부면에 형성되고, 연성회로기판(Flexible Printed Circuit Board, FPCB)과 결합되는 FPCB 본딩 영역의 일부 위치까지 연장되어 가로 방향으로 형성한 각각의 제1축 정전전극의 일측 끝단 부분이 위치한 영역이 개방된 절연 물질의 감광성 소재; 및One end portion of each of the first axis electrostatic electrodes formed in the upper surface of the touch panel and extending in a horizontal direction to a part of the FPCB bonding region coupled to the flexible printed circuit board (FPCB) is positioned. A photosensitive material of an insulating material having an open area; And
가로 방향으로 형성된 각각의 제1축 정전전극의 일측 끝단이 위치한 영역을 수평 방향으로 하나로 연결하여 각각의 제1축 정전전극의 일측 끝단과 FPCB와 결합되는 금속 전극 부분까지 하나로 묶어 제1 금속도선으로 형성하는 금속층을 포함한다.By connecting one area where one end of each first axis electrostatic electrode formed in the horizontal direction is located in one horizontal direction, one end of each first axis electrostatic electrode and a metal electrode portion coupled to the FPCB are bundled together as a first metal lead. It includes a metal layer to form.
전술한 구성에 의하여, 본 발명은 ITO 필름 한장에 구동 전극과 센싱 전극을 형성한 터치 센서를 제조하여 두께를 줄일 수 있고 원자재 비용과 공정 비용을 낮출 수 있는 효과가 있다.By the above-described configuration, the present invention can reduce the thickness by manufacturing a touch sensor formed with a drive electrode and a sensing electrode on one sheet of ITO film, there is an effect that can reduce the raw material cost and process cost.
본 발명은 Narrow 베젤(Bezel) 구현이 가능하여 사용자의 터치 영역인 원도우 영역을 넓게 형성하는 효과가 있다.The present invention can implement a narrow bezel (Bezel) has the effect of forming a wide window area that is a user's touch area.
본 발명은 포토리소 공법에 기반하여 전극 트레이스 형성 후 Sharpness가 우수한 효과가 있다.According to the present invention, sharpness is excellent after forming an electrode trace based on a photolithography method.
본 발명은 전극 단자를 연결하기 위한 점핑 연결 영역을 절연 및 개방한 후, 점핑 연결 영역을 실버 페이스트를 스크린 인쇄하여 하나로 묶는 방법으로 패드(Pad) 수량을 감소하는 효과가 있다.The present invention has the effect of reducing the number of pads (Pad) by insulating and opening the jumping connection region for connecting the electrode terminal, and then bundling the jumping connection region by screen printing silver paste.
본 발명은 메탈 스퍼터링 공정에 의해 금속층이 0.2㎛ 이하로 얇게 형성되어 OCA로 글라스와 합지시 기포가 감소되어 높은 수율을 확보하는 효과가 있다.According to the present invention, the metal layer is thinly formed to a thickness of 0.2 μm or less by a metal sputtering process, thereby reducing bubbles when laminating with glass by OCA, thereby securing high yield.
도 1은 종래의 정전용량 방식 터치 패널에서 X축 전극 패턴을 나타낸 도면이다.1 is a view showing an X-axis electrode pattern in a conventional capacitive touch panel.
도 2는 종래의 정전용량 방식 터치 패널에서 Y축 전극 패턴을 나타낸 도면이다.2 illustrates a Y-axis electrode pattern in a conventional capacitive touch panel.
도 3은 종래의 정전용량 방식 터치 패널에서 X축 전극 패턴과 Y축 전극 패턴을 합체한 상태를 나타낸 도면이다.3 is a view illustrating a state in which an X-axis electrode pattern and a Y-axis electrode pattern are coalesced in a conventional capacitive touch panel.
도 4는 종래의 정전용량 방식 터치 패널에서 X축 전극 패턴과 Y축 전극 패턴을 합체한 상태에서의 층 구조를 나타낸 도면이다.4 is a diagram illustrating a layer structure in a state in which an X-axis electrode pattern and a Y-axis electrode pattern are combined in a conventional capacitive touch panel.
도 5 내지 도 7은 본 발명의 실시예에 따른 한 장의 필름을 이용한 터치 센서를 구현하는 터치 패널의 제조 방법을 측면에서의 층 구조로 나타낸 도면이다.5 to 7 are diagrams illustrating a method of manufacturing a touch panel implementing a touch sensor using a single film according to an embodiment of the present invention in a layer structure on the side.
도 8은 본 발명의 실시예에 따른 한 장의 필름을 이용한 터치 센서를 구현하는 터치 패널을 위에서 본 모습을 나타낸 평면도이다.FIG. 8 is a plan view showing a top view of a touch panel implementing a touch sensor using a single film according to an embodiment of the present invention. FIG.
도 9는 본 발명의 실시예에 따른 한 장의 필름을 이용한 터치 센서를 구현하는 터치 패널을 간략하게 나타낸 도면이다.FIG. 9 is a view schematically illustrating a touch panel implementing a touch sensor using a single film according to an embodiment of the present invention.
도 10은 본 발명의 실시예에 따른 터치 패널에서 각각의 X축 정전전극와 이의 일측 끝단에 연결되는 금속 도선의 일례를 나타낸 도면이다.FIG. 10 is a diagram illustrating an example of a metal lead connected to each X-axis electrostatic electrode and one end thereof in a touch panel according to an exemplary embodiment of the present invention.
도 11은 본 발명의 실시예에 따른 터치 패널에서 각각의 Y축 정전전극와 이의 일측 끝단에 연결되는 금속 도선의 일례를 나타낸 도면이다.FIG. 11 is a diagram illustrating an example of a metal lead connected to each Y-axis electrostatic electrode and one end thereof in a touch panel according to an exemplary embodiment of the present invention.
도 12는 본 발명의 다른 실시예에 따른 투명 도전층을 투명 전도성 감광필름으로 형성한 일례를 나타낸 도면이다.12 is a view showing an example in which a transparent conductive layer according to another embodiment of the present invention is formed of a transparent conductive photosensitive film.
도 13은 본 발명의 또 다른 실시예에 따른 투명 도전층을 전도성 고분자로 형성한 일례를 나타낸 도면이다.13 is a view showing an example in which a transparent conductive layer is formed of a conductive polymer according to another embodiment of the present invention.
아래에서는 첨부한 도면을 참고로 하여 본 발명의 실시예에 대하여 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 상세히 설명한다. 그러나 본 발명은 여러 가지 상이한 형태로 구현될 수 있으며 여기에서 설명하는 실시예에 한정되지 않는다. 그리고 도면에서 본 발명을 명확하게 설명하기 위해서 설명과 관계없는 부분은 생략하였으며, 명세서 전체를 통하여 유사한 부분에 대해서는 유사한 도면 부호를 붙였다.DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like parts throughout the specification.
명세서 전체에서, 어떤 부분이 어떤 구성요소를 "포함"한다고 할 때, 이는 특별히 반대되는 기재가 없는 한 다른 구성요소를 제외하는 것이 아니라 다른 구성요소를 더 포함할 수 있는 것을 의미한다.Throughout the specification, when a part is said to "include" a certain component, it means that it can further include other components, without excluding other components unless specifically stated otherwise.
터치 패널의 상호 정전용량 방식은 구동 전극에 구동 전압이 인가되면, 구동 전극과 센싱 전극의 사이에서 상호 캡(Mutual Cap)이 형성되고 센싱 전극에서 상호 캡의 전압값의 변화를 감지하여 터치 여부 및 터치 위치를 검출하게 된다. In the mutual capacitance method of the touch panel, when a driving voltage is applied to the driving electrode, a mutual cap is formed between the driving electrode and the sensing electrode, and the sensing electrode senses a change in the voltage value of the mutual cap to detect whether or not the touch is performed. The touch position is detected.
센싱 전극(Receive, Rx)은 터치 패널의 터치 여부 및 터치 위치를 전압값의 변화로 감지하고, 구동 전극(Transfer, Tx)은 터치 패널의 구동 전압이 인가된다.The sensing electrodes Receive and Rx detect whether the touch panel is touched and the touch position as a change in the voltage value, and the driving voltages of the touch electrodes Transfer and Tx are applied.
도 5 내지 도 7은 본 발명의 실시예에 따른 한 장의 필름을 이용한 터치 센서를 구현하는 터치 패널의 제조 방법을 측면에서의 층 구조로 나타낸 도면이고, 도 8은 본 발명의 실시예에 따른 한 장의 필름을 이용한 터치 센서를 구현하는 터치 패널을 위에서 본 모습을 나타낸 평면도이고, 도 9는 본 발명의 실시예에 따른 한 장의 필름을 이용한 터치 센서를 구현하는 터치 패널을 간략하게 나타낸 도면이고, 도 10은 본 발명의 실시예에 따른 터치 패널에서 각각의 X축 정전전극와 이의 일측 끝단에 연결되는 금속 도선의 일례를 나타낸 도면이고, 도 11은 본 발명의 실시예에 따른 터치 패널에서 각각의 Y축 정전전극와 이의 일측 끝단에 연결되는 금속 도선의 일례를 나타낸 도면이다.5 to 7 are diagrams showing a method of manufacturing a touch panel implementing a touch sensor using a single film according to an embodiment of the present invention in a layer structure on the side, and FIG. 8 is a view according to an embodiment of the present invention. 9 is a plan view illustrating a touch panel implementing a touch sensor using a sheet of film, and FIG. 9 is a view schematically illustrating a touch panel implementing a touch sensor using a sheet of film according to an embodiment of the present invention. 10 is a view showing an example of each of the X-axis electrostatic electrode and the metal conductor connected to one end thereof in the touch panel according to an embodiment of the present invention, Figure 11 is a respective Y axis in the touch panel according to an embodiment of the present invention 2 is a diagram illustrating an example of a metal conductive wire connected to an electrostatic electrode and one end thereof.
도 5의 (a)에 도시된 바와 같이, 본 발명의 실시예에 따른 터치 패널의 제조 방법은 절연체층(110)의 상면에 인덱스 매칭층(Index-Matching)(112)을 형성하고, 그 위에 투명 도전층(120)을 형성한다. 여기서, 절연체층(110)은 투명한 재질의 유기 절연체 또는 무기 절연체로 형성되고, 유기 절연체는 폴리이미드 또는 폴리에틸렌 테레프탈레이트(Polyethylene Terephthalate, PET), 폴리에틸렌나프탈레이트(Polyethylenenaphthalate, PEN), 폴리카보네이트(Polycarbonate, PC), 아크릴의 플라스틱 소재를 포함하며 무기 절연체는 글라스(Glass) 소재, 광학 처리된 글라스 소재로 이루어진다.As shown in (a) of FIG. 5, in the method of manufacturing a touch panel according to the embodiment of the present invention, an index matching layer (Index-Matching) 112 is formed on the upper surface of the insulator layer 110, and thereon. The transparent conductive layer 120 is formed. Here, the insulator layer 110 is formed of an organic insulator or an inorganic insulator of a transparent material, and the organic insulator is polyimide or polyethylene terephthalate (PET), polyethylenenaphthalate (PEN), polycarbonate, PC), acrylic plastic material, and the inorganic insulator is made of glass material and optically treated glass material.
인덱스 매칭층(Index-Matching)(112)은 투명 도전층(120)과의 굴절율 차이가 있는 절연 소재를 이용하여 절연막층을 형성하고, ITO(120) 패턴후 ITO 유무가 확인되지 않도록 처리하는 코팅이다,Index-Matching (112) is a coating to form an insulating film layer using an insulating material having a difference in refractive index with the transparent conductive layer 120, and to treat the presence or absence of ITO after the ITO (120) pattern to be,
인덱스 매칭층(112)은 투명 도전층(120)의 위에 패턴을 형성한 후 투명 도전층(120)이 있고 없는 부분의 반사율 차이로 인해 시인 현상을 개선하는 역할을 한다.The index matching layer 112 forms a pattern on the transparent conductive layer 120 and improves visibility due to the difference in reflectance between the portions with and without the transparent conductive layer 120.
인덱스 매칭층(112)은 투명 도전층(120)의 위에 패턴이 형성된 경우, 투명 도전층(120)의 회로가 보이는 시인성을 개선할 수 있는 굴절율을 가진 절연막층이다.When the pattern is formed on the transparent conductive layer 120, the index matching layer 112 is an insulating layer having a refractive index that can improve the visibility of the circuit of the transparent conductive layer 120.
인덱스 매칭층(112)은 정전 용량의 ITO 필름 제작시 ITO가 존재하는 부분과 존재하지 않는 부분이 눈에서 감지하지 못하도록 ITO(120)의 하부층에 광학 처리를 하는 것을 의미한다.The index matching layer 112 means that the lower layer of the ITO 120 is optically treated so that the portion of the ITO and the portion of the non-existent ITO film are not detected by the eye when the capacitive ITO film is manufactured.
인덱스 매칭층(112)은 건식 방식(증착)으로 SiO2,TiO2, Ceo2 등을 올리는 경우도 있고, 습식 방식으로 약품 처리를 하는 경우도 있다.The index matching layer 112 may raise SiO 2 , TiO 2, Ceo 2, or the like by a dry method (deposition), or may perform a chemical treatment by a wet method.
인덱스 매칭층(112)은 투명 도전층(120)의 높이를 보상할 수 있는 굴절율을 보유하고 있는 SiO2,TiO2, Ceo2, Nb2O5 등의 절연막층을 단독 또는 복수개의 층 구조로 형성한다.The index matching layer 112 may have an insulating layer such as SiO 2 , TiO 2, Ceo 2, or Nb 2 O 5 having a refractive index capable of compensating for the height of the transparent conductive layer 120 in a single or multiple layer structure. Form.
투명 도전층(120)은 투명 전도성 산화물(Transparent Conducting Oxide, TCO)와 같은 투명한 재질의 전도성 물질로 형성되며, 구체적으로는 ITO 또는 IZO(Indium Zinc Oxide)를 포함하거나 ITO, IZO, SnO2, AZO로 이루어지는 투명 전도성 물질로 형성한다.A transparent conductive layer 120 is a transparent conductive oxide (Transparent Conducting Oxide, TCO) and formed of a conductive material of transparent material, such as, specifically, including ITO or IZO (Indium Zinc Oxide) or ITO, IZO, SnO 2, AZO It is formed of a transparent conductive material.
또한, 투명 도전층(120)은 투명 전도성 감광필름, 전도성 고분자, 탄소나노튜브(Carbon Nano Tube, CNT), 그라핀(Graphene), 전도성 폴리머, 은 나노와이어(Silver Nanowires, AGNW), Hybrid AGNW(CNT+AGNW), Hybrid 그라핀(AGNW+그라핀) 등으로 이루어지는 투명 전도성 물질로 형성할 수 있다.In addition, the transparent conductive layer 120 is a transparent conductive photosensitive film, a conductive polymer, carbon nanotubes (CNT), graphene (Graphene), conductive polymers, silver nanowires (AGNW), Hybrid AGNW ( CNT + AGNW), hybrid graphene (AGNW + graphene) and the like can be formed of a transparent conductive material.
본 발명의 투명 도전층(ITO 필름 등)(120)은 하부면에 인덱스 매칭층(절연막층)(112)을 포함하고 있다.The transparent conductive layer (ITO film, etc.) 120 of the present invention includes an index matching layer (insulation layer) 112 on the bottom surface.
다음으로, 도 5의 (b), (c), (d)에 도시된 바와 같이, 본 발명은 투명 도전층(120)의 상부면에 제1 감광성 소재(140)를 형성하고, 패턴이 형성된 제1 아트워크 필름(142)을 이용하여 UV 조사하면, 제1 감광성 소재(140)에 패턴을 형성하며(노광), 약한 알칼리 용액을 이용하여 제1 감광성 소재(140)에 개방 패턴을 형성한다(현상).Next, as shown in (b), (c), (d) of Figure 5, the present invention forms a first photosensitive material 140 on the upper surface of the transparent conductive layer 120, the pattern is formed When UV irradiation is performed using the first artwork film 142, a pattern is formed on the first photosensitive material 140 (exposure), and an open pattern is formed on the first photosensitive material 140 using a weak alkali solution. (phenomenon).
본 발명은 패턴이 형성된 제1 아트워크 필름(142)을 예시하고 있지만, 이에 한정하지 않고 패턴이 형성된 패턴 툴(Tool)이면 어떠한 것도 가능하며, 패턴 툴 없이 직접적으로 패턴을 구현하는 장비를 이용하여 노광 공정을 수행할 수도 있다.Although the present invention illustrates the first artwork film 142 in which the pattern is formed, the present invention is not limited thereto, and any pattern tool may be used, and using the equipment for directly implementing the pattern without the pattern tool. An exposure process may also be performed.
또한, 제1 감광성 소재(140)를 형성하는 공정은 액상 포토 레지스트를 코팅하거나 드라이필름을 라미네이팅하여 형성한다. 이외에 액상 타입의 실리콘, 에폭시 소재를 사용하는 경우 코팅 공정을, SiO2, TiO2의 절연 물질을 사용하는 경우, 증착 공정을 사용할 수 있다.In addition, the process of forming the first photosensitive material 140 is formed by coating a liquid photoresist or laminating a dry film. In addition, in the case of using a liquid type silicon or epoxy material, a coating process may be used, and in the case of using an insulating material of SiO 2 or TiO 2 , a deposition process may be used.
다음으로, 본 발명은 도 6의 (e), (f)에 도시된 바와 같이, 개방 패턴이 형성된 제1 감광성 소재(140)에 산성 약품을 이용하여 투명 도전층(120)을 선택적으로 에칭하고 강알칼리 약품을 이용하여 제1 감광성 소재(140)를 제거하여 정전전극 패턴(121)을 형성한다(에칭 공정, 박리 공정). 여기서, 도 6의 (e), (f)는 포토리소그래피(Photolithography)의 공정에 의해 라미네이팅, 노광, 현상, 에칭, 박리 과정을 거친다.Next, as shown in FIGS. 6E and 6F, the present invention selectively etches the transparent conductive layer 120 using an acidic chemical to the first photosensitive material 140 having an open pattern. The first photosensitive material 140 is removed using a strong alkali chemical to form the electrostatic electrode pattern 121 (etching process, peeling process). 6 (e) and 6 (f) are subjected to laminating, exposure, development, etching, and peeling by a process of photolithography.
정전전극 패턴(121)은 터치 패널의 원도우 영역(화면이 표시되는 영역)에 해당하는 부분으로 일정거리의 간격마다 이격되어 형성된 복수개의 정전전극을 나타내는 패턴을 나타내며, 사용자의 터치 패턴 영역을 나타낸다.The electrostatic electrode pattern 121 is a portion corresponding to the window area (the area where the screen is displayed) of the touch panel, and represents a pattern representing a plurality of electrostatic electrodes formed spaced at intervals of a predetermined distance, and represents a user's touch pattern area.
정전전극 패턴(121)은 복수개의 X축 정전전극(122)과, 각각의 X축 정전전극(122)과 인접하게 둘러싸고 있는 각각의 Y축 정전전극(124)을 포함한다.The electrostatic electrode pattern 121 includes a plurality of X-axis electrostatic electrodes 122 and respective Y-axis electrostatic electrodes 124 which are adjacently surrounded by the respective X-axis electrostatic electrodes 122.
복수개의 X축 정전전극(122)은 복수개의 구동 전극(Transfer, Tx)을 나타내고, 복수개의 Y축 정전전극(124)은 각각의 구동 전극을 둘러싸고 있는 센싱 전극(Receive, Rx)을 포함한다.The plurality of X-axis electrostatic electrodes 122 represent a plurality of driving electrodes Transfer and Tx, and the plurality of Y-axis electrostatic electrodes 124 include sensing electrodes Receive and Rx surrounding each driving electrode.
복수개의 X축 정전전극(122)은 도 8, 도 9 및 도 10에 도시된 바와 같이, 터치 패널의 원도우 영역에서 일정거리의 간격마다 가로 방향으로 이격되어 복수개의 정전전극을 형성하고 복수개의 정전전극을 일정거리 이격하여 열마다 형성한다.As illustrated in FIGS. 8, 9, and 10, the plurality of X-axis electrostatic electrodes 122 are spaced apart in the horizontal direction at intervals of a predetermined distance in the window area of the touch panel to form a plurality of electrostatic electrodes, and the plurality of electrostatics The electrodes are formed at intervals of a certain distance apart.
복수개의 Y축 정전전극(124)은 도 8, 도 9 및 도 11에 도시된 바와 같이, 세로 방향의 각각의 X축 정전전극(122)과 인접하여 둘러싸고 있는 복수개의 정전전극이며, 복수개의 정전전극을 일정거리 이격하여 행마다 형성한다.As shown in FIGS. 8, 9, and 11, the plurality of Y-axis electrostatic electrodes 124 are a plurality of electrostatic electrodes that are adjacently surrounded by the respective X-axis electrostatic electrodes 122 in the vertical direction, and the plurality of electrostatics The electrodes are formed in rows by spaced distances.
복수개의 X축 정전전극(122)은 가로 방향으로 형성한 각각의 X축 정전전극의 일측으로부터 FPCB 본딩 영역(200)의 일부 위치까지 각각 연장된다.The plurality of X-axis electrostatic electrodes 122 extend from one side of each X-axis electrostatic electrode formed in the horizontal direction to a part of the FPCB bonding region 200, respectively.
복수개의 Y축 정전전극(124)은 세로 방향으로 형성한 각각의 Y축 정전전극을 하나로 연결하여 FPCB 본딩 영역(200)의 일부 위치까지 연장된다.The plurality of Y-axis electrostatic electrodes 124 extends to a part of the FPCB bonding region 200 by connecting each of the Y-axis electrostatic electrodes formed in the vertical direction to one.
FPCB 본딩 영역(200)은 터치 패널의 원도우 영역을 제외한 가장 자리 영역으로서 연성회로기판(Flexible Printed Circuit Board, FPCB)과 결합되는 금속 전극 부분과 사용자가 터치하는 원도우 영역을 제외한 영역을 포함한다.The FPCB bonding region 200 is an edge region excluding the window region of the touch panel, and includes a metal electrode portion coupled to a flexible printed circuit board (FPCB) and a region except the window region touched by the user.
다음으로, 도 6의 (g)에 도시된 바와 같이, 본 발명은 투명 도전층(120)으로 이루어진 정전전극 패턴(121)을 형성한 후, 터치 패널의 상부면에 투명한 재질의 투명 감광성 소재(150)를 형성한다(라미네이팅, 코팅 또는 증착 공정). 여기서, 투명 감광성 소재(150)는 감광성이 있는 투명 절연 물질로서 투명 드라이 필름을 일례로 들 수 있다.Next, as illustrated in FIG. 6G, after forming the electrostatic electrode pattern 121 made of the transparent conductive layer 120, the transparent photosensitive material of transparent material is formed on the upper surface of the touch panel. 150) (laminating, coating or deposition process). Here, the transparent photosensitive material 150 may include a transparent dry film as an example of a photosensitive transparent insulating material.
투명 감광성 소재(150)를 사용하는 경우, 투명 원도우 영역에 남길 수 있어 후공정에서 스크래치 등의 불량을 방지할 수 있다.In the case of using the transparent photosensitive material 150, it can be left in the transparent window area, it is possible to prevent a defect such as scratches in the post-process.
만약, 불투명한 일반 드라이 필름, 액상 포토레지스트 등을 사용하는 경우, FPCB 본딩 영역(200)에 있는 감광성 소재를 남기고 원도우 영역 부분에 있는 감광성 소재를 포토리소그래피의 노광 및 현상 공정에 의해 제거하는 공정을 추가적으로 수행한다.If an opaque general dry film, a liquid photoresist, or the like is used, the process of removing the photosensitive material in the portion of the window region by the photolithography exposure and development process, leaving the photosensitive material in the FPCB bonding region 200. Additionally.
이하에서는 설명의 편의를 위해 절연 물질로 투명 감광성 소재(150)를 사용하는 것으로 한다.Hereinafter, for convenience of description, the transparent photosensitive material 150 is used as an insulating material.
다음으로, 도 7의 (h), (i)에 도시된 바와 같이, 본 발명은 투명 감광성 소재(150)의 상부면에 제2 아트워크 필름(152)을 형성하고 포토리소그래피의 노광 및 현상 공정에 의해 터치 패널의 투명 감광성 소재(150)로 이루어진 층에서 점핑 연결 영역(160)을 선택적으로 제거하여 개방한다.Next, as shown in (h) and (i) of FIG. 7, the present invention forms a second artwork film 152 on the upper surface of the transparent photosensitive material 150, and the photolithography exposure and development process By selectively removing the jumping connection region 160 in the layer of the transparent photosensitive material 150 of the touch panel to open.
점핑 연결 영역(160)은 투명 감광성 소재(150)로 형성된 층에서 FPCB 본딩 영역(200)의 일부 위치까지 연장되어 가로 방향으로 형성한 각각의 X축 정전전극(122)의 일측 끝단 부분이 위치한 영역을 나타낸다.The jumping connection region 160 extends from a layer formed of the transparent photosensitive material 150 to a part of the FPCB bonding region 200 so that one end portion of each X-axis electrostatic electrode 122 formed in the horizontal direction is located. Indicates.
점핑 연결 영역(160)은 투명 감광성 소재(150)로 형성된 층에서 FPCB 본딩 영역(200)의 일부 위치까지 연장되어 세로 방향으로 형성한 각각의 Y축 정전전극(124)의 일측 끝단 부분이 위치한 영역을 나타낸다.The jumping connection region 160 extends from a layer formed of the transparent photosensitive material 150 to a part of the FPCB bonding region 200 and is located at one end portion of each of the Y-axis electrostatic electrodes 124 formed in the vertical direction. Indicates.
더욱 상세하게 설명하면, 본 발명은 점핑 연결 영역(160)을 개방하는 패턴이 형성된 제2 아트워크 필름(152)을 이용하여 UV 조사하면, 투명 감광성 소재(150)에 패턴을 형성하고(노광), 약한 알칼리 용액을 이용하여 투명 감광성 소재(150)에 점핑 연결 영역(160)을 개방하는 패턴을 형성한다(현상).In more detail, in the present invention, when UV irradiation is performed using the second artwork film 152 having the pattern for opening the jumping connection region 160, a pattern is formed on the transparent photosensitive material 150 (exposure). , Using the weak alkaline solution to form a pattern for opening the jumping connection region 160 in the transparent photosensitive material 150 (development).
여기서, 투명 감광성 소재(150)에 점핑 연결 영역(160)을 개방하는 패턴은 도 7의 (j)와 같이, 터치 패널의 상부면에 형성된 투명 감광성 소재(150)로 이루어진 층에서 터치 패널의 점핑 연결 영역(160)에 해당하는 영역이 개방된 패턴을 의미한다.Here, the pattern of opening the jumping connection region 160 to the transparent photosensitive material 150 is a jump of the touch panel in the layer made of the transparent photosensitive material 150 formed on the upper surface of the touch panel as shown in FIG. The pattern corresponding to the connection region 160 is an open pattern.
본 발명은 패턴이 형성된 제2 아트워크 필름(152)을 예시하고 있지만, 이에 한정하지 않고 점핑 연결 영역(160)을 개방하는 패턴이 형성된 패턴 툴(Tool)이면 어떠한 것도 가능하며, 패턴 툴 없이 직접적으로 패턴을 구현하는 장비를 이용하여 노광 공정을 수행할 수도 있다.The present invention illustrates the patterned second artwork film 152, but is not limited thereto, and any pattern tool having a pattern for opening the jumping connection region 160 may be used. An exposure process may be performed using equipment that implements a pattern.
다음으로, 도 7의 (j) (k)에 도시된 바와 같이, 본 발명은 터치 패널의 상부면에 금속층(130)를 형성한다. 금속층(130)의 회로 형성은 메탈 스퍼터(Metal Sputter)로 증착한 후 포토리소그래피의 공정을 이용하여 패턴을 형성한다.Next, as shown in (j) (k) of Figure 7, the present invention forms a metal layer 130 on the upper surface of the touch panel. Circuit formation of the metal layer 130 is deposited by a metal sputter (Metal Sputter) to form a pattern using a process of photolithography.
금속층(130)은 Cu, Cu alloy, Ag, Ag alloy, Ni+Cr, Ni+Ni alloy, Mo/Ag, Mo/Al/Mo, Ni+Cr/Cu/Ni+Cr, Ni alloy/Cu, Ni alloy/Cu/Ni alloy, Mo/APC, Cu/Ni+Cu+Ti, Ni+Cu+Ti/Cu/Ni+Cu+Ti, 카본 등 전도성 물질을 모두 포함한다.The metal layer 130 may be formed of Cu, Cu alloy, Ag, Ag alloy, Ni + Cr, Ni + Ni alloy, Mo / Ag, Mo / Al / Mo, Ni + Cr / Cu / Ni + Cr, Ni alloy / Cu, Ni Alloy / Cu / Ni alloy, Mo / APC, Cu / Ni + Cu + Ti, Ni + Cu + Ti / Cu / Ni + Cu + Ti, carbon and all conductive materials are included.
예를 들면, 금속층(130)은 은 페이스트로 형성할 수 있고, 구리를 증착시킬 수도 있는 등 다양한 방법이 가능하다.For example, the metal layer 130 may be formed of a silver paste, or various methods may be used, such as depositing copper.
금속층(130)은 다양한 금속을 사용할 수 있으며 제조의 용이성 및 전기 전도도를 고려하여 구리 또는 알루미늄으로 하는 것이 바람직하다.The metal layer 130 may use various metals and is preferably copper or aluminum in consideration of ease of manufacture and electrical conductivity.
이어서, 본 발명은 포토리소그래피의 공정에 의해 금속층(130)을 선택적으로 제거하여 가로 방향으로 형성된 각각의 X축 정전전극(122)의 일측 끝단이 위치한 영역인 점핑 연결 영역(160)을 수평 방향으로 하나로 연결하여 각각의 X축 정전전극(122)의 일측 끝단과 FPCB와 결합되는 금속 전극 부분까지 하나로 묶어 제1 금속도선(132)을 형성한다(도 8, 도 9 및 도 10).Subsequently, in the present invention, the jumping connection region 160, which is an area where one end of each of the X-axis electrostatic electrodes 122 formed in the horizontal direction by selectively removing the metal layer 130 by the photolithography process, is positioned in the horizontal direction. The first metal lead wire 132 is formed by connecting to one end and tying together one end of each X-axis electrostatic electrode 122 and the metal electrode part coupled to the FPCB (FIGS. 8, 9, and 10).
또한, 본 발명은 포토리소그래피의 공정에 의해 금속층(130)을 선택적으로 제거하여 FPCB 본딩 영역(200)의 일부 위치까지 연장된 Y축 정전전극(124)의 일측 끝단부터 FPCB와 결합되는 금속 전극 부분까지 제2 금속도선(134)을 형성한다(도 8, 도 9 및 도 11). 여기서, 포토리소그래피(Photolithography)의 공정에 의해 라미네이팅, 노광, 현상, 에칭, 박리 과정을 거친다.In addition, according to an embodiment of the present invention, the metal layer 130 is selectively removed by the photolithography process, and the metal electrode portion coupled to the FPCB from one end of the Y-axis electrostatic electrode 124 extending to a part of the FPCB bonding region 200. The second metal lead wire 134 is formed (FIGS. 8, 9, and 11). Here, lamination, exposure, development, etching, and peeling are performed by a process of photolithography.
도 10에 도시된 바와 같이, 각각의 제1 금속 도선(132)은 가로 방향으로 형성된 각각의 X축 정전전극(122)의 일측 끝단 부분을 수평 방향으로 하나로 묶어 FPCB가 결합하는 금속 전극 부분까지 연결된다.As shown in FIG. 10, each of the first metal conductors 132 is connected to the metal electrode portion to which the FPCB is coupled by tying one end portion of each X-axis electrostatic electrode 122 formed in the horizontal direction in one horizontal direction. do.
도 11에 도시된 바와 같이, 각각의 제2 금속 도선(134)은 세로 방향으로 형성된 각각의 Y축 정전전극(124)의 일측 끝단 부분부터 FPCB가 결합하는 금속 전극 부분까지 연결된다.As shown in FIG. 11, each second metal lead 134 is connected from one end portion of each of the Y-axis electrostatic electrodes 124 formed in the vertical direction to the metal electrode portion to which the FPCB is coupled.
다른 실시예로서, 본 발명은 제1 감광성 소재(140)에 개방 패턴을 형성한 후, 실크 스크린 인쇄용 잉크를 사용하여 실버 페이스트를 스크린 인쇄하거나 실버 페이스트를 도포한 후 포토리소그래피의 노광 및 현상 공정에 의해 감광성 실버 페이스트 인쇄를 이용하여 전극 단자(제1 금속도선(132), 제2 금속도선(134))를 하나로 묶는 방법으로 패드(Pad) 수량을 감소한다.In another embodiment, the present invention forms an open pattern on the first photosensitive material 140, and then screen-prints the silver paste using the ink for silk screen printing or applies the silver paste to the exposure and development process of photolithography. By using photosensitive silver paste printing, the number of pads is reduced by bonding the electrode terminals (the first metal lead 132 and the second metal lead 134) into one.
도 12는 본 발명의 다른 실시예에 따른 투명 도전층을 투명 전도성 감광필름으로 형성한 일례를 나타낸 도면이다.12 is a view showing an example in which a transparent conductive layer according to another embodiment of the present invention is formed of a transparent conductive photosensitive film.
본 발명의 투명 도전층(120)은 투명 전도성 감광필름(170, 172)으로 구성할 수 있다. 투명 전도성 감광필름(170, 172)은 투명 감광성 수지층(172)과 그 위에 적층된 투명 전도성 물질(170)를 포함한다.The transparent conductive layer 120 of the present invention may be composed of transparent conductive photosensitive films 170 and 172. The transparent conductive photosensitive films 170 and 172 include a transparent photosensitive resin layer 172 and a transparent conductive material 170 stacked thereon.
투명 전도성 물질(170)은 전도성과 감광성이 있는 투명한 재질의 물질로서 탄소나노튜브(Carbon Nano Tube, CNT), 그라핀(Graphene), 전도성 폴리머, 은 나노와이어(Silver Nanowires, AGNW), Hybrid AGNW(CNT+AGNW), Hybrid 그라핀(AGNW+그라핀) 등으로 이루어지는 투명 전도성 물질로 형성하며, 전도성 고분자, Cu, Cu alloy, Ag, Ag alloy, Ni+Cr, Ni+Ni alloy, Mo/Ag, Mo/Al/Mo, Ni+Cr/Cu/Ni+Cr, Ni alloy/Cu, Ni alloy/Cu/Ni alloy, Mo/APC, Cu/Ni+Cu+Ti, Ni+Cu+Ti/Cu/Ni+Cu+Ti, 카본, 투명 전도성 산화물(Transparent Conducting Oxide, TCO) 등 전도성 물질을 모두 포함하는 개념이다.The transparent conductive material 170 is a conductive and photosensitive transparent material, carbon nanotubes (CNT), graphene, conductive polymers, silver nanowires (AGNW), hybrid AGNW ( CNT + AGNW), formed of a transparent conductive material composed of hybrid graphene (AGNW + graphene) and the like, and conductive polymer, Cu, Cu alloy, Ag, Ag alloy, Ni + Cr, Ni + Ni alloy, Mo / Ag, Mo / Al / Mo, Ni + Cr / Cu / Ni + Cr, Ni alloy / Cu, Ni alloy / Cu / Ni alloy, Mo / APC, Cu / Ni + Cu + Ti, Ni + Cu + Ti / Cu / Ni + The concept includes all conductive materials such as Cu + Ti, carbon, and transparent conducting oxide (TCO).
본 발명은 포토리소그래피의 노광 및 현상 공정에 의해 투명 전도성 감광필름(170, 172)으로 형성된 층에서 투명 감광성 수지층(172)과 그 위에 적층된 투명 전도성 물질(170)을 선택적으로 제거하여 복수개의 X축 정전전극(122)와 복수개의 Y축 정전전극(124)을 형성한다.The present invention selectively removes the transparent photosensitive resin layer 172 and the transparent conductive material 170 stacked thereon from a layer formed of the transparent conductive photosensitive films 170 and 172 by photolithography exposure and development processes. An X-axis electrostatic electrode 122 and a plurality of Y-axis electrostatic electrodes 124 are formed.
더욱 상세하게 설명하면, 본 발명은 패턴이 형성된 제1 아트워크 필름(142)을 이용하여 UV 조사하면, 투명 전도성 감광필름(170, 172)에 패턴을 형성하고(노광), 약한 알칼리 용액을 이용하여 투명 전도성 감광필름(170, 172)에 개방 패턴을 형성한다(현상). 여기서, 투명 전도성 감광필름(160)에 형성된 개방 패턴은 복수개의 X축 정전전극(122)과 복수개의 Y축 정전전극(124)을 포함한 정전전극 패턴(121)을 나타낸다.In more detail, in the present invention, when UV irradiation is performed using the patterned first artwork film 142, a pattern is formed on the transparent conductive photosensitive films 170 and 172 (exposure), and a weak alkaline solution is used. To form an open pattern on the transparent conductive photosensitive films 170 and 172 (developing). Here, the open pattern formed on the transparent conductive photosensitive film 160 represents the electrostatic electrode pattern 121 including the plurality of X-axis electrostatic electrodes 122 and the plurality of Y-axis electrostatic electrodes 124.
본 발명은 절연체층(110)의 상부면에 투명 전도성 감광필름(170, 172)을 형성한 후, 포토리소그래피의 노광 및 현상 공정에 의해 정전전극 패턴(121)을 형성한다. 그 이후에 전극 형성 절차는 도 6의 (g)부터 도 7의 (k)까지의 전극 형성 절차와 동일하게 수행하므로 상세한 설명을 생략한다.After the transparent conductive photosensitive films 170 and 172 are formed on the upper surface of the insulator layer 110, the electrostatic electrode pattern 121 is formed by an exposure and development process of photolithography. After that, since the electrode forming procedure is performed in the same manner as the electrode forming procedure of FIGS. 6G to 7K, detailed descriptions thereof will be omitted.
도 13은 본 발명의 또 다른 실시예에 따른 투명 도전층을 전도성 고분자로 형성한 일례를 나타낸 도면이다.13 is a view showing an example in which a transparent conductive layer is formed of a conductive polymer according to another embodiment of the present invention.
본 발명의 투명 도전층(120)은 전도성 고분자로 구성할 수 있다.The transparent conductive layer 120 of the present invention may be made of a conductive polymer.
전도성 고분자는 유기계 화합물로 폴리티오펜계, 폴리피롤계, 폴리아닐린계, 폴리아세틸렌계, 폴리페닐렌계 등이 사용될 수 있으며, 특히 폴리티오펜계 중에서도 PEDOT/PSS 화합물의 경우가 가장 바람직하고, 전술한 유기계 화합물 중 1종 이상을 혼합하여 사용할 수 있다.The conductive polymer may be polythiophene-based, polypyrrole-based, polyaniline-based, polyacetylene-based, polyphenylene-based, or the like, and is particularly preferred among the polythiophene-based PEDOT / PSS compounds. One or more of the compounds may be mixed and used.
또한, 전술한 유기계 화합물에 카본 나노튜브 등을 더 혼합하는 경우 전도성을 높일 수 있다.In addition, when the carbon nanotubes and the like are further mixed with the organic compound, the conductivity may be increased.
전도성 고분자는 2중 결합 벤젠고리의 구조에 의해 전도성을 유지한다.The conductive polymer maintains conductivity by the structure of the double bond benzene ring.
전도성 고분자는 습식 공정에 의해 전도성을 없앨 수 있는데 습식 공정은 도 8에 도시된 바와 같이, 부식액(ETCHANT)(180)과 반응시켜 2중 결합 벤젠고리의 구조를 끓어 단일 결합으로 만들면 전도성을 없앨 수 있다.The conductive polymer can be removed by the wet process, the wet process can be removed by boiling the structure of the double bond benzene ring by reacting with the etchant (180) as shown in Figure 8 to make a single bond. have.
이와 같이 전도성 고분자를 비전도성 고분자(190)로 만들면 고분자층을 그대로 유지하되 전도성을 잃게 되며 특별한 촉매제 없이 다시 2중 결합으로 복원되지 않으므로 전도성이 원상 복귀하지 않는다.In this way, when the conductive polymer is made of the non-conductive polymer 190, the polymer layer is maintained as it is, but the conductivity is lost, and the conductivity does not return to the original state because it is not restored to the double bond again without a special catalyst.
본 발명은 절연체층(110)의 상부면에 전도성 고분자를 형성한 후, 습식 공정에 의해 복수개의 X축 정전전극(122)과 복수개의 Y축 정전전극(124)을 포함한 정전전극 패턴(121)의 전도성 고분자의 전도성을 유지하고, 터치 패턴이 아닌 영역의 전도성 고분자의 전도성을 잃게 하여 비전도성 고분자(190)로 만든다(전도성 고분자 패턴닝 공정). 그 이후에 전극 형성 절차는 도 6의 (g)부터 도 7의 (k)까지의 전극 형성 절차와 동일하게 수행하므로 상세한 설명을 생략한다.After the conductive polymer is formed on the upper surface of the insulator layer 110, the electrostatic electrode pattern 121 including the plurality of X-axis electrostatic electrodes 122 and the plurality of Y-axis electrostatic electrodes 124 may be formed by a wet process. It maintains the conductivity of the conductive polymer, and loses the conductivity of the conductive polymer in the region other than the touch pattern to make a non-conductive polymer 190 (conductive polymer patterning process). After that, since the electrode forming procedure is performed in the same manner as the electrode forming procedure of FIGS. 6G to 7K, detailed descriptions thereof will be omitted.
본 발명은 FPCB 본딩 영역(200)을 전도성 고분자로 커버하여 산화 발생 구역의 부식을 방지하고 외부의 압력으로 금속 균열되는 문제점을 방지하고 FPCB 본딩시 완충 역할을 수행하며 별도의 실링, 발수 코팅 공정이 생략되어 공정 비용이 감소된다.The present invention covers the FPCB bonding region 200 with a conductive polymer to prevent corrosion of the oxidation generating region, to prevent the problem of metal cracking by external pressure, and to perform a buffering function during FPCB bonding, and a separate sealing and water repellent coating process Omitted to reduce process costs.
본 발명은 전도성 고분자의 특성을 이용하여 터치 센서를 구현함으로써 시인성 측면에서 우수하며 이로 인하여 인덱스 매칭층 공정이 불필요하다.The present invention has excellent visibility in terms of visibility by implementing a touch sensor by using the characteristics of the conductive polymer, and thus an index matching layer process is unnecessary.
본 발명은 전도성 고분자의 코팅 속도가 ITO 또는 메탈 증착 속도에 비해 월등히 뛰어나기 때문에 생산성 및 단가적인 측면에서 장점이 있다.The present invention has advantages in terms of productivity and cost because the coating speed of the conductive polymer is superior to that of ITO or metal deposition.
이상에서 설명한 본 발명의 실시예는 장치 및/또는 방법을 통해서만 구현이 되는 것은 아니며, 본 발명의 실시예의 구성에 대응하는 기능을 실현하기 위한 프로그램, 그 프로그램이 기록된 기록 매체 등을 통해 구현될 수도 있으며, 이러한 구현은 앞서 설명한 실시예의 기재로부터 본 발명이 속하는 기술분야의 전문가라면 쉽게 구현할 수 있는 것이다.The embodiments of the present invention described above are not implemented only by the apparatus and / or method, but may be implemented through a program for realizing a function corresponding to the configuration of the embodiments of the present invention, a recording medium on which the program is recorded, and the like. Such implementations may be readily implemented by those skilled in the art from the description of the above-described embodiments.
이상에서 본 발명의 실시예에 대하여 상세하게 설명하였지만 본 발명의 권리범위는 이에 한정되는 것은 아니고 다음의 청구범위에서 정의하고 있는 본 발명의 기본 개념을 이용한 당업자의 여러 변형 및 개량 형태 또한 본 발명의 권리범위에 속하는 것이다.Although the embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concepts of the present invention defined in the following claims are also provided. It belongs to the scope of rights.
[부호의 설명][Description of the code]
110: 절연체층110: insulator layer
112: 인덱스 매칭층112: index matching layer
120: 투명 도전층120: transparent conductive layer
121: 정전전극 패턴121: electrostatic electrode pattern
122: X축 정전전극122: X-axis electrostatic electrode
124: Y축 정전전극124: Y-axis electrostatic electrode
130: 금속층130: metal layer
132: 제1 금속도선132: first metal lead
134: 제2 금속도선134: second metal lead
140: 제1 감광성 소재140: first photosensitive material
142: 제1 아트워크 필름142: first artwork film
150: 투명 감광성 소재150: transparent photosensitive material
152: 제2 아트워크 필름152: second artwork film
160: 점핑 연결 영역160: jumping connection area
170: 투명 전도성 물질170: transparent conductive material
172: 투명 감광성 수지층172: transparent photosensitive resin layer
180: 부식액180: corrosion solution
190: 비전도성 고분자190: non-conductive polymer
200: FPCB 본딩 영역200: FPCB bonding area
전술한 구성에 의하여, 본 발명은 ITO 필름 한장에 구동 전극과 센싱 전극을 형성한 터치 센서를 제조하여 두께를 줄일 수 있고 원자재 비용과 공정 비용을 낮출 수 있는 효과가 있다.By the above-described configuration, the present invention can reduce the thickness by manufacturing a touch sensor formed with a drive electrode and a sensing electrode on one sheet of ITO film, there is an effect that can reduce the raw material cost and process cost.
본 발명은 Narrow 베젤(Bezel) 구현이 가능하여 사용자의 터치 영역인 원도우 영역을 넓게 형성하는 효과가 있다.The present invention can implement a narrow bezel (Bezel) has the effect of forming a wide window area that is a user's touch area.
본 발명은 포토리소 공법에 기반하여 전극 트레이스 형성 후 Sharpness가 우수한 효과가 있다.According to the present invention, sharpness is excellent after forming an electrode trace based on a photolithography method.
본 발명은 전극 단자를 연결하기 위한 점핑 연결 영역을 절연 및 개방한 후, 점핑 연결 영역을 실버 페이스트를 스크린 인쇄하여 하나로 묶는 방법으로 패드(Pad) 수량을 감소하는 효과가 있다.The present invention has the effect of reducing the number of pads (Pad) by insulating and opening the jumping connection region for connecting the electrode terminal, and then bundling the jumping connection region by screen printing silver paste.
본 발명은 메탈 스퍼터링 공정에 의해 금속층이 0.2㎛ 이하로 얇게 형성되어 OCA로 글라스와 합지시 기포가 감소되어 높은 수율을 확보하는 효과가 있다.According to the present invention, the metal layer is thinly formed to a thickness of 0.2 μm or less by a metal sputtering process, thereby reducing bubbles when laminating with glass by OCA, thereby securing high yield.

Claims (16)

  1. 터치 패널의 제조 방법에 있어서,In the manufacturing method of a touch panel,
    상기 터치 패널의 원도우 영역에 해당하고 일정거리의 간격마다 가로 방향으로 이격되어 복수개의 정전전극을 형성되고, 상기 복수개의 정전전극을 일정거리 이격하여 열마다 형성하는 제1축 정전전극과, 세로 방향의 상기 각각의 제1축 정전전극과 인접하도록 형성한 복수개의 제2축 정전전극을 투명 도전층으로 형성하는 단계;A first axis electrostatic electrode corresponding to the window area of the touch panel and spaced apart in a horizontal direction at intervals of a predetermined distance to form a plurality of electrostatic electrodes; Forming a plurality of second axis electrostatic electrodes formed to be adjacent to each of the first axis electrostatic electrodes of a transparent conductive layer;
    상기 터치 패널의 상부면에 절연 물질의 감광성 소재를 형성하고, 상기 감광성 소재로 형성된 층에서 연성회로기판(Flexible Printed Circuit Board, FPCB)과 결합되는 FPCB 본딩 영역의 일부 위치까지 연장되어 상기 가로 방향으로 형성한 각각의 제1축 정전전극의 일측 끝단 부분이 위치한 영역을 제거하여 개방하는 단계; 및A photosensitive material of an insulating material is formed on the upper surface of the touch panel, and extends from the layer formed of the photosensitive material to a part of the FPCB bonding region coupled with the flexible printed circuit board (FPCB) in the horizontal direction. Removing and opening a region where one end portion of each of the first axis electrostatic electrodes formed is located; And
    상기 터치 패널의 상부면에 금속층을 형성하고, 상기 금속층을 선택적으로 제거하여 상기 가로 방향으로 형성된 각각의 제1축 정전전극의 일측 끝단이 위치한 영역을 수평 방향으로 하나로 연결하여 상기 각각의 제1축 정전전극의 일측 끝단과 상기 FPCB와 결합되는 금속 전극 부분까지 하나로 묶어 상기 금속층의 제1 금속도선으로 형성하는 단계A metal layer is formed on the upper surface of the touch panel, and the metal layer is selectively removed to connect the regions where one end of each of the first axis electrostatic electrodes formed in the horizontal direction are located in a horizontal direction to each one of the first axes. Forming a first metal lead of the metal layer by tying one end of the electrostatic electrode and a metal electrode portion coupled to the FPCB to one;
    를 포함하는 터치 패널의 제조 방법.Method of manufacturing a touch panel comprising a.
  2. 제1항에 있어서,The method of claim 1,
    상기 각각의 제1축 정전전극의 일측 끝단 부분이 위치한 영역을 제거하여 개방하는 단계는,Removing and opening an area where one end portion of each of the first axis electrostatic electrodes is located may include:
    상기 FPCB 본딩 영역의 일부 위치까지 연장되어 상기 세로 방향으로 형성한 제2축 정전전극의 일측 끝단 부분이 위치한 영역을 제거하여 개방하는 단계Removing and opening a region where one end portion of the second axis electrostatic electrode formed in the longitudinal direction is extended to a part of the FPCB bonding region
    를 포함하는 터치 패널의 제조 방법.Method of manufacturing a touch panel comprising a.
  3. 제1항에 있어서,The method of claim 1,
    상기 금속층의 제1 금속도선으로 형성하는 단계는,Forming the first metal lead of the metal layer,
    상기 FPCB 본딩 영역의 일부 위치까지 연장된 제2축 정전전극의 일측 끝단 부분과 상기 FPCB와 결합되는 금속 전극 부분까지 상기 금속층의 제2 금속도선으로 형성하는 단계Forming a second metal lead of the metal layer up to one end portion of the second axis electrostatic electrode extending to a portion of the FPCB bonding region and the metal electrode portion coupled to the FPCB;
    를 포함하는 터치 패널의 제조 방법.Method of manufacturing a touch panel comprising a.
  4. 제1항에 있어서,The method of claim 1,
    상기 투명 도전층으로 형성하는 단계는,Forming the transparent conductive layer,
    상기 가로 방향으로 형성한 각각의 제1축 정전전극의 일측으로부터 상기 FPCB 본딩 영역의 일부 위치까지 각각 연장되고, 상기 세로 방향으로 형성한 각각의 제2축 정전전극을 하나로 연결하여 상기 FPCB 본딩 영역의 일부 위치까지 연장하는 단계Each of the first axis electrostatic electrodes formed in the horizontal direction extends from one side to a part of the FPCB bonding area, and the second axis electrostatic electrodes formed in the longitudinal direction are connected to each other to form the FPCB bonding area. Extending to some position
    를 포함하는 터치 패널의 제조 방법.Method of manufacturing a touch panel comprising a.
  5. 제1항에 있어서,The method of claim 1,
    상기 투명 도전층으로 형성하는 단계는,Forming the transparent conductive layer,
    한 장의 투명 도전층에 상기 터치 패널의 구동 전압이 인가하는 구동 전극(Transfer, Tx)으로 상기 각각의 제1축 정전전극과, 상기 터치 패널의 터치 여부 및 터치 위치를 전압값의 변화로 감지하는 센싱 전극(Receive, Rx)으로 상기 각각의 제2축 정전전극을 동시에 형성하는 터치 패널의 제조 방법.A driving electrode (Transfer, Tx) to which the driving voltage of the touch panel is applied to one transparent conductive layer detects each of the first axis electrostatic electrode, whether the touch panel is touched, and the touch position by changing the voltage value. A method of manufacturing a touch panel in which each of the second axis electrostatic electrodes is formed simultaneously with a sensing electrode (Receive, Rx).
  6. 제1항에 있어서,The method of claim 1,
    상기 투명 도전층으로 형성하는 단계는,Forming the transparent conductive layer,
    상기 터치 패널의 상부면에 전도성 고분자로 이루어진 층을 형성하는 단계; 및Forming a layer made of a conductive polymer on an upper surface of the touch panel; And
    부식액과 반응시켜 2중 결합 벤젠고리의 구조를 끓어 단일 결합으로 만들어 전도성을 없애는 습식 공정에 의해 상기 전도성 고분자로 형성된 층에서 상기 복수개의 제1축 정전전극과 상기 복수개의 제2축 정전전극의 전도성 고분자의 전도성을 유지하고 상기 각각의 제1축 정전전극과 상기 각각의 제2축 정전전극에 해당하지 않는 부분의 전도성 고분자의 전도성을 잃게 하여 비전도성 고분자로 만드는 단계The conductivity of the plurality of first axis electrostatic electrodes and the plurality of second axis electrostatic electrodes in a layer formed of the conductive polymer by a wet process of reacting with a corrosion solution to remove the conductivity by boiling a structure of a double bond benzene ring to form a single bond. Maintaining the conductivity of the polymer and losing the conductivity of the conductive polymer in the portion not corresponding to each of the first and second axial electrostatic electrodes, thereby making it a non-conductive polymer.
    를 포함하는 터치 패널의 제조 방법.Method of manufacturing a touch panel comprising a.
  7. 제1항에 있어서,The method of claim 1,
    상기 투명 도전층으로 형성하는 단계는,Forming the transparent conductive layer,
    상기 터치 패널의 상부면에 투명 절연 물질로 이루어진 투명 감광성 수지층과, 그 위에 적층되고 전도성과 감광성이 있는 투명한 재질의 투명 전도성 물질로 이루어진 투명 전도성 감광필름을 형성하는 단계; 및Forming a transparent photosensitive resin layer formed of a transparent insulating material on an upper surface of the touch panel, and a transparent conductive photosensitive film made of a transparent conductive material of a transparent material having a conductivity and photosensitive property laminated thereon; And
    포토리소그래피의 노광 및 현상 공정에 의해 상기 투명 전도성 감광필름으로 형성된 층에서 상기 투명 전도성 감광필름을 선택적으로 제거하여 상기 복수개의 제1축 정전전극과 상기 복수개의 제2축 정전전극을 형성하는 단계Selectively removing the transparent conductive photosensitive film from the layer formed of the transparent conductive photosensitive film by a photolithography exposure and developing process to form the plurality of first and second axial electrostatic electrodes
    를 포함하는 터치 패널의 제조 방법.Method of manufacturing a touch panel comprising a.
  8. 터치 패널에 있어서,In the touch panel,
    상기 터치 패널의 원도우 영역에 해당하고 일정거리의 간격마다 가로 방향으로 이격되어 복수개의 정전전극을 형성하고, 상기 복수개의 정전전극을 일정거리 이격하여 열마다 형성하는 제1축 정전전극과, 세로 방향의 상기 각각의 제1축 정전전극과 인접하도록 형성한 복수개의 제2축 정전전극을 나타내는 투명 도전층;A first axis electrostatic electrode corresponding to the window area of the touch panel and spaced apart in a horizontal direction at intervals of a predetermined distance to form a plurality of electrostatic electrodes, and formed in rows by spaced apart from the plurality of electrostatic electrodes at a predetermined distance; A transparent conductive layer representing a plurality of second axis electrostatic electrodes formed so as to be adjacent to each of the first axis electrostatic electrodes of;
    상기 터치 패널의 상부면에 형성되고, 연성회로기판(Flexible Printed Circuit Board, FPCB)과 결합되는 FPCB 본딩 영역의 일부 위치까지 연장되어 상기 가로 방향으로 형성한 각각의 제1축 정전전극의 일측 끝단 부분이 위치한 영역이 개방된 절연 물질의 감광성 소재; 및One end portion of each of the first axis electrostatic electrodes formed in the horizontal direction by being formed on the upper surface of the touch panel and extending to a portion of the FPCB bonding region coupled to the flexible printed circuit board (FPCB). A photosensitive material of an insulating material having an open area in which it is located; And
    상기 가로 방향으로 형성된 각각의 제1축 정전전극의 일측 끝단이 위치한 영역을 수평 방향으로 하나로 연결하여 상기 각각의 제1축 정전전극의 일측 끝단과 상기 FPCB와 결합되는 금속 전극 부분까지 하나로 묶어 제1 금속도선으로 형성하는 금속층A region in which one end of each of the first axis electrostatic electrodes formed in the horizontal direction is located as one in the horizontal direction is tied to one end of each of the first axis electrostatic electrodes and a metal electrode portion coupled to the FPCB. Metal layer formed by metal lead
    을 포함하는 터치 패널.Touch panel comprising a.
  9. 제8항에 있어서,The method of claim 8,
    상기 투명 도전층은 상기 가로 방향으로 형성한 각각의 제1축 정전전극의 일측으로부터 상기 FPCB 본딩 영역의 일부 위치까지 각각 연장되고, 상기 세로 방향으로 형성한 각각의 제2축 정전전극을 하나로 연결하여 상기 FPCB 본딩 영역의 일부 위치까지 연장하는 터치 패널.The transparent conductive layer extends from one side of each of the first axis electrostatic electrodes formed in the horizontal direction to a part of the FPCB bonding region, and connects the second axis electrostatic electrodes formed in the longitudinal direction to one. A touch panel extending to a portion of the FPCB bonding region.
  10. 제8항에 있어서,The method of claim 8,
    상기 감광성 소재는 상기 FPCB 본딩 영역의 일부 위치까지 연장되어 상기 세로 방향으로 형성한 제2축 정전전극의 일측 끝단 부분이 위치한 영역이 개방되는 터치 패널.The photosensitive material extends to a part of the FPCB bonding region and opens a region where one end portion of the second axis electrostatic electrode formed in the longitudinal direction is opened.
  11. 제8항에 있어서,The method of claim 8,
    상기 금속층은 상기 FPCB 본딩 영역의 일부 위치까지 연장된 제2축 정전전극의 일측 끝단 부분과 상기 FPCB와 결합되는 금속 전극 부분까지 제2 금속도선으로 형성하는 터치 패널.And the metal layer is formed of a second metal lead from one end portion of the second axis electrostatic electrode extending to a part of the FPCB bonding region and a metal electrode portion coupled to the FPCB.
  12. 제8항에 있어서,The method of claim 8,
    상기 각각의 제2축 정전전극은 상기 각각의 제1축 정전전극을 둘러싸고 있는 형태인 터치 패널.And each of the second axis electrostatic electrodes surrounds each of the first axis electrostatic electrodes.
  13. 제8항에 있어서,The method of claim 8,
    상기 투명 도전층은 상기 터치 패널의 구동 전압이 인가하는 구동 전극(Transfer, Tx)으로 상기 각각의 제1축 정전전극과, 상기 터치 패널의 터치 여부 및 터치 위치를 전압값의 변화로 감지하는 센싱 전극(Receive, Rx)으로 상기 각각의 제2축 정전전극을 동시에 한 장으로 형성하는 터치 패널.The transparent conductive layer is a driving electrode (Transfer, Tx) applied by the driving voltage of the touch panel to sense each of the first axis electrostatic electrode, whether the touch panel is touched, and a touch position by a change in voltage value. A touch panel for forming the second axis electrostatic electrode in one sheet at the same time with an electrode (Receive, Rx).
  14. 제8항에 있어서,The method of claim 8,
    상기 투명 도전층은 투명한 재질의 전도성 물질의 투명 전도성 산화물(Transparent Conducting Oxide, TCO), 전도성 고분자, 탄소나노튜브(Carbon Nano Tube, CNT), 그라핀(Graphene), 전도성 폴리머, 은 나노와이어(Silver Nanowires, AGNW), 투명 전도성 감광필름 중 하나의 물질인 터치 패널.The transparent conductive layer may be formed of a transparent conductive oxide (TCO), a conductive polymer, a carbon nanotube (CNT), a graphene, a conductive polymer, and a silver nanowire. Nanowires, AGNW), a touch panel material of one of the transparent conductive photosensitive film.
  15. 제8항에 있어서,The method of claim 8,
    상기 투명 도전층은 투명 절연 물질로 이루어진 투명 감광성 수지층과, 그 위에 적층되고 전도성과 감광성이 있는 투명한 재질의 투명 전도성 물질로 이루어진 투명 전도성 감광필름이고, 포토리소그래피의 노광 및 현상 공정에 의해 상기 투명 전도성 감광필름으로 형성된 층에서 상기 투명 전도성 감광필름을 선택적으로 제거하여 상기 복수개의 제1축 정전전극과 상기 복수개의 제2축 정전전극을 형성하는 터치 패널.The transparent conductive layer is a transparent conductive photosensitive film made of a transparent photosensitive resin layer made of a transparent insulating material, and a transparent conductive material of a transparent material having a conductive property and photosensitive laminated thereon, the transparent by photolithography exposure and development process And selectively removing the transparent conductive photosensitive film from the layer formed of the conductive photosensitive film to form the plurality of first axis electrostatic electrodes and the plurality of second axis electrostatic electrodes.
  16. 제8항에 있어서,The method of claim 8,
    상기 투명 도전층은 전도성 고분자인 경우, 상기 복수개의 제1축 정전전극과 상기 복수개의 제2축 정전전극의 전도성 고분자의 전도성을 유지하고, 나머지 영역의 전도성 고분자의 전도성을 잃게 하여 비전도성 고분자로 만드는 터치 패널.When the transparent conductive layer is a conductive polymer, the conductive polymer maintains the conductivity of the conductive polymers of the plurality of first axis electrostatic electrodes and the plurality of second axis electrostatic electrodes, and loses the conductivity of the conductive polymers in the remaining areas. Making touch panel.
PCT/KR2014/010636 2013-11-11 2014-11-06 Touch panel for implementing touch sensor using one sheet of film and method for manufacturing same WO2015069048A1 (en)

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KR1020140009463A KR20150054613A (en) 2013-11-11 2014-01-27 Touch Panel for Implementing Touch Sensor of One-Film and Method for Making the Same
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