WO2014129852A1

WO2014129852A1 - Touch panel sensor and method for manufacturing same

Info

Publication number: WO2014129852A1
Application number: PCT/KR2014/001446
Authority: WO
Inventors: 박철
Original assignee: (주)삼원에스티
Priority date: 2013-02-21
Filing date: 2014-02-21
Publication date: 2014-08-28

Abstract

Disclosed are a touch panel sensor with a structure simplified by a simple manufacturing process and improved reliability, and a method for manufacturing the same. The method for manufacturing a touch panel sensor arranged on the top of a display so as to sense the position of contacting an object includes the steps of: supplying a release film, a base layer formed on the release film, an electrode pattern formed on the top of the base layer, and a deposited film including a wire member electrically connected to the electrode pattern; depositing a glass substrate on the deposited film so as to cover the top of the base layer; removing the release film from the deposited film so as to transfer the base layer, the electrode pattern, and the wire member to the glass substrate simultaneously; and partially removing the base layer so as to expose one end of the wire member to the lower side of the base layer.

Description

Touch panel sensor and manufacturing method

The present invention relates to a touch panel sensor and a method of manufacturing the same, and more particularly, to a touch panel sensor capable of sensing a contact position of an object approaching a display.

1 is a perspective view illustrating a conventional capacitive touch panel sensor.

Referring to FIG. 1, in the conventional touch panel sensor, the lower insulating sheet 10 and the upper insulating sheet 20 are bonded to each other by a predetermined interval. The lower ITO electrode 30 and the upper ITO electrode 40 are vertically arranged on the opposite surfaces of the lower insulating sheet 10 and the upper insulating sheet 20, and specifically, the lower ITO electrode 30 is The upper surface of the lower insulating sheet 10 is oriented from left to right, and the upper ITO electrode 40 is oriented from the upper side to the lower side on the bottom surface of the upper insulating sheet 20.

The touch panel sensor has a predetermined capacitance, that is, a capacitance value corresponding to the area of each intersection point, at each intersection point of the lower ITO electrode 30 and the upper ITO electrode 40 disposed to cross each other. If a part is close, the area of the body part is added to the area of the upper ITO electrode 40 disposed thereon, and thus the capacitance value may be changed.

In addition, in order to electrically connect the upper ITO electrode 40 and the electrode 52 of the external circuit board 50, a connecting line 48 made of metal is formed from the end of the upper ITO electrode 40 from the upper insulating sheet 20. It extends to the bottom of the), the lower ITO electrode 20 is also connected to the circuit board 50 by a separate connection line.

In this case, the connecting line 48, which is generally provided as a metal, is shiny with metallic luster and does not pass through the light, so that the connecting line 48 may be visually confirmed on the upper portion of the transparent upper insulating sheet 20. Therefore, in the related art, a separate non-translucent film for window decoration 65 is formed on the bottom of the reinforcing substrate 60 such as glass or translucent reinforced plastic so that the connecting line 48 and the circuit board 50 are not visually checked. The reinforcing substrate 60 is disposed on the upper insulating sheet 20. For a detailed description of the above-described conventional touch panel sensor, reference may be made to the touch panel sensor disclosed in Korean Patent Laid-Open Publication No. 10-2011-0137231 (2011.12.22).

However, further providing a separate reinforcing substrate 60 on the upper insulating sheet 20 results in an increase in the thickness of the touch panel sensor, a disadvantage in that the assembly process is complicated, and an increase in the thickness of the touch panel sensor This may cause the transparency and clarity of the touch panel sensor to be degraded, and the sensitivity of the touch panel sensor may be reduced.

Accordingly, in recent years, various studies have been conducted to simplify the manufacturing process of the touch panel sensor, reduce the thickness, and improve the sensitivity.

The present invention can contribute to slimming, and provides a touch panel sensor and a method of manufacturing the same which can improve touch sensitivity.

In addition, the present invention provides a touch panel sensor and a method of manufacturing the same, which can simplify the manufacturing process and shorten the manufacturing time.

In addition, the present invention can reduce the defective rate, and provides a touch panel sensor and a manufacturing method that can reduce the manufacturing cost.

The present invention also provides a touch panel sensor and a method of manufacturing the same, which can directly transfer a window decoration on a display to visually block an opaque component of the touch panel sensor.

According to a preferred embodiment of the present invention for achieving the above object of the present invention, the manufacturing method of the touch panel sensor disposed on the display to detect the contact position of the object, the release film, the base layer formed on the release film Providing a laminated film including an electrode pattern formed on an upper surface of the base layer, and a wire member electrically connected to the electrode pattern; Stacking a glass substrate on the laminated film to cover the top surface of the base layer; Removing the release film from the laminated film and transferring the base layer, the electrode pattern and the wire member to the glass substrate at once; And partially removing the base layer to expose one end of the wire member to the bottom of the base layer.

The laminated film may be provided in various structures and manners according to required conditions and design specifications. For reference, only one electrode pattern layer may be provided on the laminated film, or a plurality of electrode pattern layers may be sequentially stacked. Alternatively, it is also possible to laminate a film member on which another electrode pattern is formed on the laminated film on which the electrode pattern is formed.

For example, providing a laminated film may include providing a release film; Forming a first base layer on an upper surface of the release film; Forming a first electrode pattern on an upper surface of the first base layer; Forming a first electrode pattern on an upper surface of the first base layer; And forming a first wire member on an upper surface of the first base layer to be electrically connected to the first electrode pattern, wherein the first base layer is partially removed from a bottom surface of the first base layer. The first through part may be formed in the base layer, and one end of the first wire member may be exposed to the bottom surface of the first base layer through the first through part.

As another example, providing a laminated film may include providing a release film; Forming a first base layer on an upper surface of the release film; Forming a first electrode pattern on an upper surface of the first base layer; Forming a second base layer on an upper surface of the first base layer to partially expose the first electrode pattern; Forming a second electrode pattern on an upper surface of the second base layer; And forming a first wire member on an upper surface of the first base layer to be electrically connected to the first electrode pattern and the second electrode pattern, respectively. The first base layer may be formed from a bottom surface of the first base layer. Partially removed to form a first through portion in the first base layer, one end of the first wire member may be exposed to the bottom surface of the first base layer through the first through portion. For reference, the second base layer is formed on the top surface of the first base layer so that the first electrode pattern is partially exposed. Here, the first electrode pattern is partially exposed. It can be understood that it is not covered by the two base layers. For example, since the second base layer may be formed to cover the first electrode pattern except for a portion of both ends of the first electrode pattern, both ends of the first electrode pattern may not be covered by the second base layer. May be exposed. In addition, while the second electrode pattern is patterned, a connection pattern electrically connected to the first electrode pattern may be formed together. That is, while the second electrode pattern is patterned, connection patterns electrically connected to the first electrode pattern may be formed at both ends of the first electrode pattern not covered by the second base layer. Of course, the second electrode pattern may be configured so that a separate connection pattern is not formed while the second electrode pattern is patterned, but both ends of the first electrode pattern which are not covered by the second base layer when the second electrode pattern is patterned are removed. Since it may be, there is a cumbersome problem of forming a separate pattern for electrically connecting the wire member and the first electrode pattern to be described later by a separate process. However, in the present invention, while the second electrode pattern is patterned without any additional process, the connection pattern may be formed together to cover both ends (exposed portions) of the first electrode pattern not covered by the second base layer. This simplifies the overall manufacturing process.

As another example, providing a laminated film may include providing a release film; Forming a first base layer on an upper surface of the release film; Forming a first electrode pattern on an upper surface of the first base layer; Forming a first wire member on an upper surface of the first base layer to be electrically connected to the first electrode pattern; Forming a second base layer on an upper surface of the first base layer to cover the first electrode pattern as a whole; Forming a second electrode pattern on an upper surface of the second base layer; And forming a second wire member on an upper surface of the first base layer to be electrically connected to the second electrode pattern, wherein the first base layer is partially removed from the bottom surface of the first base layer. Forming a first through portion in the base layer, partially removing the first base layer and the second base layer from the bottom of the first base layer, and having one end of the first wire member through the first through portion; The bottom surface of the first base layer may be exposed, and one end of the second wire member may be exposed to the bottom surface of the first base layer through the second through part.

The base layer can be formed in a variety of ways depending on the requirements and design specifications. For example, the base layer may be provided by applying a liquid curing agent on the upper surface of the release film and then curing the liquid curing agent. As another example, the base layer may be provided using a synthetic resin film of 10 ~ 30㎛ thickness.

The first through portion (or the second through portion) may be formed in the base layer by ordinary laser, etching, or machining, and the present invention is not limited or limited by the method of forming the first through portion. In addition, the first through portion may be provided in the form of a hole, or may be provided in the form of removing a part of the edge of the base layer.

The electrode pattern may be variously formed in a square or diamond shape according to required conditions and design specifications. In some cases, the electrode pattern may be provided in a general line shape or a group shape in which two or more of the lines are electrically connected to each other. The present invention is limited or limited by the shape and structure of the electrode pattern. no.

The electrode pattern may be formed of a conductive material and a transparent material, and the present invention is not limited or limited by the material of the electrode pattern. For example, the electrode pattern may be formed using ITO or IZO, ATO, AZO, carbon nanotubes, transparent organic materials, or the like. In some cases, the electrode pattern may be formed using a metal fiber such as silver nanofibers. Alternatively, a metal mesh having a thickness of about 10 μm or less may be applied instead of the electrode pattern.

An adhesive layer may be provided to cover the top surface of the laminated film on which the window decoration is formed, and the glass substrate may be laminated to be in close contact with the laminated film through the adhesive layer. The adhesive layer can be provided in a variety of ways depending on the desired conditions and design specifications. For example, the adhesive layer may be provided by applying a liquid adhesive (for example, an ultraviolet curing agent) and curing the coating, or may be provided using an optical adhesive film or an OCA (Optically Clear Adhesive) film.

By removing the release film from the laminated film, the base layer can be partially removed from the bottom of the base layer to form a first through portion (or a second through portion), and one end of the wire member passes through the first through portion. It may be exposed to the bottom of the, and then the external circuit board and the wire member attached to the bottom of the base layer can be electrically connected.

According to another preferred embodiment of the present invention, after the second electrode pattern is provided on a separate film member, it is also possible to be laminated on the above-mentioned laminated film. That is, the second electrode pattern and the second wire member electrically connected to the second electrode pattern may be formed on the upper surface of the film member, and the film member may be attached to the bottom surface of the laminated film. In addition, the film member may be formed by applying a curing agent of the liquid on the release film and then curing, or may be provided using a synthetic resin film.

According to another preferred embodiment of the present invention, the laminated film may be provided corresponding to at least one glass substrate, the laminated film may be provided cut to a size corresponding to the glass substrate before being laminated to the glass substrate. For example, according to the required conditions and design specifications, 4 * 4, 5 * 5, 6 * 6, 3 * 4, etc. can be laminated film formed at once, the present invention is limited by the arrangement of the laminated film It is not limited or restricted.

According to another preferred embodiment of the present invention, the laminated film may be provided including a laser absorbing layer formed on the upper surface of the base layer, the wire member may be formed on the upper surface of the laser absorbing layer. As the first laser absorbing layer, various functional layers capable of improving laser processing characteristics can be used. For example, the first laser absorbing layer may be formed using carbon or black printing. For reference, the first laser absorbing layer may be formed of a non-conductive material, and the first laser absorbing layer may be removed together when the first through portion is formed in laser processing. In some cases, the first laser absorbing layer may be formed of a conductive material. In this case, the first laser absorbing layer does not need to be removed.

According to another preferred embodiment of the present invention, the method for manufacturing a touch panel sensor disposed on the display to sense the contact position of the object, the second electrode pattern and the second wire member electrically connected to the second electrode pattern bottom surface Providing a glass substrate provided in the; Providing a laminated film including a release film, a base layer formed on the release film, a first electrode pattern formed on an upper surface of the base layer, and a first wire member electrically connected to the first electrode pattern; Stacking the glass substrate on the laminated film such that the bottom surface of the glass substrate covers the top surface of the base layer; Removing the release film from the laminated film and transferring the base layer, the first electrode pattern and the first wire member to the glass substrate at once; And partially removing the base layer to expose one end of the first wire member and the second wire member to the bottom surface of the base layer.

In addition, before laminating the glass substrate on the laminated film, a circuit board may be attached to be electrically connected between the first wire member and the second wire member between the laminated film and the glass substrate. Penetration can be ruled out. Alternatively, only the second wire member is electrically connected to the circuit board between the laminated film and the glass substrate, and the first wire member is exposed to the bottom of the base layer and then electrically connected to the bottom of the base layer. It is also possible to configure the connection.

According to another preferred embodiment of the present invention, the manufacturing method of the touch panel sensor disposed on the display to detect the contact position of the object, the release film, the base layer formed on the release film, the electrode formed on the upper surface of the base layer Providing a laminated film including a pattern and a wire member electrically connected to an electrode pattern and exposed at one end thereof to a bottom surface of the base layer to be electrically connected to an external device on the bottom surface of the base layer; Stacking a glass substrate on the laminated film to cover the top surface of the base layer; And removing the release film from the laminated film to transfer the base layer, the electrode pattern, and the wire member to the glass substrate at one time.

For example, providing a laminated film may include providing a release film; Forming a first base layer on an upper surface of the release film; Forming a first electrode pattern on an upper surface of the first base layer; Forming a first through portion in the first base layer; And forming a first wire member electrically connected to the first electrode pattern and having one end exposed to the bottom surface of the first base layer through the first through part.

As another example, providing a laminated film may include providing a release film; Forming a first base layer on an upper surface of the release film; Forming a first electrode pattern on an upper surface of the first base layer; Forming a second base layer on an upper surface of the first base layer to partially expose the first electrode pattern; Forming a second electrode pattern on an upper surface of the second base layer; Forming a first through portion in the first base layer; And forming a first wire member electrically connected to the first electrode pattern and the second electrode pattern, respectively, so that one end thereof is exposed to the bottom surface of the first base layer through the first through part. For reference, the second base layer is formed on the top surface of the first base layer so that the first electrode pattern is partially exposed. Here, the first electrode pattern is partially exposed. It can be understood that it is not covered by the two base layers. For example, since the second base layer may be formed to cover the first electrode pattern except for a portion of both ends of the first electrode pattern, both ends of the first electrode pattern may not be covered by the second base layer. May be exposed. In addition, while the second electrode pattern is patterned, a connection pattern electrically connected to the first electrode pattern may be formed together. That is, while the second electrode pattern is patterned, connection patterns electrically connected to the first electrode pattern may be formed at both ends of the first electrode pattern not covered by the second base layer. Of course, the second electrode pattern may be configured so that a separate connection pattern is not formed while the second electrode pattern is patterned, but both ends of the first electrode pattern which are not covered by the second base layer when the second electrode pattern is patterned are removed. Since it may be, there is a cumbersome problem of forming a separate pattern for electrically connecting the wire member and the first electrode pattern to be described later by a separate process. However, in the present invention, while the second electrode pattern is patterned without any additional process, the connection pattern may be formed together to cover both ends (exposed portions) of the first electrode pattern not covered by the second base layer. This simplifies the overall manufacturing process.

As another example, providing a laminated film may include providing a release film; Forming a first base layer on an upper surface of the release film; Forming a first electrode pattern on an upper surface of the first base layer; Forming a first through portion in the first base layer; Forming a first wire member electrically connected to the first electrode pattern and having one end exposed to the bottom surface of the first base layer through the first through part; Forming a second base layer on an upper surface of the first base layer to cover the first electrode pattern as a whole; Forming a second electrode pattern on an upper surface of the second base layer; Forming a second through portion in the second base layer and the first base layer; And forming a second wire member electrically connected to the second electrode pattern and having one end exposed to the bottom surface of the first base layer through the second through part.

The first through portion (or the second through portion) may be formed in the base layer by a conventional laser, machining or etching process, and the present invention is not limited or limited by the method of forming the first through portion. In addition, the first through portion may be provided in the form of a hole, or may be provided in the form of removing a part of the edge of the base layer. In some cases, when the first base layer is formed by a printing or etching method, the first through part may be formed together.

Here, when the first base layer is formed, the first through portion is formed together, excluding the additional process of forming the first through portion after forming the first base layer, and forming the first base layer. It can be understood that the first through portion is formed together during the printing or etching process. For example, the first base layer is provided by printing (or applying) a liquid curing agent on a release film and then curing the liquid curing agent, wherein the first through part forms a first base layer on an upper surface of the release film. It may be formed together with the first base layer by printing and curing the liquid curing agent except for the first through area. For example, the first base layer having the first through portion may be formed by gravure printing and curing the liquid curing agent on the release film.

Meanwhile, as the release film, a conventional synthetic resin film, a metal thin plate, or a synthetic resin film formed with a metal coating may be used. For reference, when a release film made of synthetic resin is used, the release film may be damaged when the first through portion (or the second through portion) is formed by laser processing. When used, damage to the release film due to laser processing can be prevented in advance. In addition, it is also possible to increase the laser resistance by chromium plating the thin metal plate (for example, copper thin plate). Alternatively, in order to increase the flexibility of the thin metal plate, it is possible to use a copper foil having a thickness of about 5 ~ 100㎛, and to attach a PET film or the like on the opposite side of the release-coated copper foil.

By removing the release film from the laminated film, one end of the wire member may be exposed to the bottom of the base layer, and then the external circuit board and the wire member attached to the bottom of the base layer may be electrically connected.

According to the touch panel sensor according to the present invention and a method of manufacturing the same, a window decoration is directly provided on an insulating substrate of the touch panel sensor without using a separate reinforcement substrate having a window decoration on the top layer, thereby reducing the thickness of the touch panel sensor. Can be.

In addition, since the electrode layer for the electrode pattern is conventionally formed and the electrode pattern is directly formed on the plastic film through a patterning process such as a photolithography process, the thickness of the plastic film used in the conventional touch panel sensor should be maintained at least several hundred μm. did. However, in the touch panel sensor and the manufacturing method according to the present invention, since the base layer is provided on the release film and the electrode pattern is formed on the base layer, there is no problem in forming the electrode pattern even if the thickness of the base layer is thin. The base layer can be made thinner. Therefore, the thickness of the touch panel sensor can be further reduced, and the sensitivity can be improved to improve the product quality of the product.

In addition, according to the present invention, since a circuit board may be attached to the bottom surface of the first base layer in a state in which glass substrates are laminated on the laminated film, space utilization and design freedom between the laminated film and the glass substrate may be maximized. The manufacturing process can be further simplified. Moreover, the glass substrate is laminated on the laminated film as a nearly finished product can be distributed, the manufacturer can simply complete the product by the process of connecting the circuit board.

In addition, according to the present invention, since the wire member electrically connected to each of the first electrode pattern and the second electrode pattern can be formed by a single step, the manufacturing process can be further simplified.

In addition, according to the present invention, by making a laminated film corresponding to a plurality of glass substrates, and can be used by cutting it can be a natural finish in the cutting process. Therefore, it is possible to shorten the time required for finishing the components formed by spin coating, such as a base layer on the release film, an adhesive layer that can be formed on the hard coating layer because no separate finishing treatment is required.

In addition, according to the present invention, since the adhesive layer, the window decoration, the first electrode pattern, the first base layer and the like can be transferred on the glass substrate at a time, the process time can be shortened, and it can occur when stacking the components one by one. It is possible to minimize the occurrence of defects due to position errors. In addition, it is possible to minimize the defect of the touch panel sensor due to the bubble generation by not bonding each layer of the touch panel sensor by adhesive.

1 is a perspective view illustrating a conventional touch panel sensor.

2 is a view showing a touch panel sensor according to the present invention.

3 to 12 are views for explaining the manufacturing method of the touch panel sensor according to the present invention.

13 and 14 are views for explaining a method of manufacturing a touch panel sensor according to another embodiment of the present invention.

15 to 20 are views for explaining a method of manufacturing a touch panel sensor according to another embodiment of the present invention, respectively.

21 is a diagram illustrating a touch panel sensor according to the present invention.

22 to 31 are views for explaining a method of manufacturing a touch panel sensor according to the present invention.

32 and 33 are views for explaining a method of manufacturing a touch panel sensor according to another embodiment of the present invention.

34 to 36 are views for explaining a method of manufacturing a touch panel sensor according to another embodiment of the present invention, respectively.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited or limited by the embodiments. For reference, in the present description, the same numbers refer to substantially the same elements, and may be described by referring to the contents described in the other drawings under these rules, and the contents determined to be obvious to those skilled in the art or repeated may be omitted.

2 is a view showing a touch panel sensor according to the present invention, Figures 3 to 12 are views for explaining a manufacturing method of the touch panel sensor according to the present invention.

2 to 12, the touch panel sensor according to the present invention may be used to detect a contact position of an object placed on a display and includes a laminated film 100 and a glass substrate 200.

Since the glass substrate 200 is directly touched by a body part such as a finger or a touch tool, the glass substrate 200 uses a rigid glass substrate having excellent strength and is not easily refracted, or has a high transparency and a high polycarbonate. Reinforced plastics can be used.

The laminated film 100 includes a first base layer 120, a first electrode pattern 130, a second base layer 140, a second electrode pattern 150, and a first wire member 160 sequentially stacked. And window decoration 170.

A first through part 122 is formed on the first base layer 120, and an upper surface of the first base layer 120 is electrically connected to the first electrode pattern 130 and the second electrode pattern 150. One end of the first wire member 160 formed on the first base member 120 may be exposed to the bottom surface of the first base layer 120 through the first through part 122, and the external circuit board 300 may be exposed to the first base layer 120. The first wire member 160 may be electrically connected to the first wire member 160 which is mounted on the bottom of the bottom surface and exposed to the bottom of the first base layer 120.

For reference, in the exemplary embodiment of the present invention, the laminated film is described with an example including a first base layer, a first electrode pattern, a second base layer, a second electrode pattern, a first wire member, and a window decoration. In some cases, the laminated film may include the first base layer and the first electrode pattern without the second base layer and the second electrode pattern.

In addition, in the embodiment of the present invention, for example, the window decoration is formed on the laminated film, but in some cases, after forming the window decoration on the bottom surface of the glass substrate, laminating the glass substrate on the upper surface of the laminated film It is possible.

Hereinafter, a method of manufacturing a touch panel sensor according to the present invention will be described with reference to FIGS. 3 to 12. For reference, FIG. 3 is a view for explaining a step of forming a first base layer, FIG. 4 is a view for explaining a step of forming a first electrode pattern, and FIG. 5 is a step for forming a second base layer. 6 is a view for explaining a step of forming a second electrode pattern. 7 is a view for explaining the step of forming the first wire member, FIG. 8 is a view for explaining the step of forming the window decoration, Figure 9 is a view for explaining the step of forming the adhesive layer. . In addition, Figure 10 is a view for explaining the step of laminating a glass substrate on the laminated film, Figure 11 is a view for explaining the step of removing the release film from the laminated film, Figure 12 is a step of forming the first through portion A diagram for explaining.

Referring to FIG. 3, first, a release film 110 is provided and a first base layer 120 is formed on an upper surface of the release film 110.

As the release film 110, a conventional synthetic resin film may be used. In some cases, a metal thin plate may be used as the release film, or a synthetic resin film having a metal coating formed on one surface thereof may be used.

For reference, a release adhesive layer 112 (or a release coating layer) may be formed on an upper surface of the release film 110. The release adhesive layer 112 (or release coating layer) may be a material such as silicone resin or acrylic resin, it may be coated on a film such as PET film by a process such as roll coating.

The first base layer 120 may be formed in various ways according to the required conditions and design specifications.

For example, the first base layer 120 may be provided by applying a liquid curing agent on the upper surface of the release film 110 and then curing the liquid curing agent. The first base layer 120 may be formed by applying a liquid curing agent to the upper surface of the release adhesive layer 112 by a conventional spin coating method and curing. In some cases, the liquid curing agent may be applied by printing or other methods using a roller (roll coating method) or the like, and the present invention is not limited or limited by the application method of the liquid curing agent. Hereinafter, an example in which an ordinary ultraviolet curing agent is used as the liquid curing agent will be described. In some cases, a thermosetting agent may be used instead of the ultraviolet curing agent as the liquid curing agent. Alternatively, it is also possible for the first base layer to be formed in other ways such as printing, etching and the like.

As another example, the first base layer 120 may be provided using a synthetic resin film. For reference, in general, the plastic film on which the electrode pattern is formed is provided to have a thickness of about several hundred μm. The reason is that the thickness of the plastic film should be maintained at least several hundred μm to lay the electrode layer for the electrode pattern on the plastic film and form the electrode pattern directly on the plastic film through a patterning process such as photolithography. However, in the present invention, since the first base layer 120 is formed on the release film 110 and the first electrode pattern 130 to be described later is formed on the upper surface of the first base layer 120, the first base is formed. Even if the thickness of the layer 120 is thin, there is no problem in forming the first electrode pattern 130. For example, the first base layer 120 may be provided using a synthetic resin film having a thickness of 10 to 30 μm that does not require a separate heat curing treatment or an ultraviolet curing treatment.

As the synthetic resin film, a plastic film such as polyethylene (polyethylene), polypropylene (polypropylene), acrylic (acryloyl), polyethylene terephthalate (PET) and the like may be used, and the present invention is limited by the type and properties of the synthetic resin film. It is not limited or restricted.

Next, as shown in FIG. 4, the first electrode pattern 130 is formed on the upper surface of the first base layer 120.

The first electrode pattern 130 may be variously formed in a square or diamond shape according to the required conditions and design specifications. In some cases, the first electrode pattern may be provided in a general line shape or a group shape in which two or more upper or lower portions of the line are electrically connected to each other. The present invention relates to a shape and a structure of the first electrode pattern 130. It is not limited or restricted by.

The first electrode pattern 130 may be formed using a conductive material and a transparent material, and the present invention is not limited or limited by the material of the first electrode pattern 130. For example, the first electrode pattern 130 may be formed using ITO or IZO, ATO, AZO, carbon nanotubes, transparent organic materials, or the like. In some cases, the first electrode pattern may be formed using a metal fiber such as silver nanofiber, and the first electrode pattern formed using the metal fiber solution may be formed of a thin metal fiber even if it is formed very thin. Since the fibers are connected to each other, it is possible to maintain high conductivity and to form a very thin thickness of 1 μm or less. Alternatively, a metal mesh having a thickness of about 10 μm or less may be applied instead of the first electrode pattern.

After forming the first electrode layer (not shown) on the upper surface of the first base layer 120 as a whole, the first electrode pattern 130 may pattern the first electrode layer in a predetermined form by a conventional etching method. In some cases, it is also possible to form the first electrode pattern by printing or other methods.

Next, as shown in FIG. 5, the second base layer 140 is formed on the top surface of the first base layer 120 to partially expose the first electrode pattern 130.

Here, the partial exposure of the first electrode pattern 130 may be understood as a part of the first electrode pattern 130 is not covered by the second base layer 140. For example, since the second base layer 140 may be formed to cover the first electrode pattern 130 except for a part of both ends of the first electrode pattern 130, the second base layer 140 may be formed to cover the first electrode pattern 130. Both ends may be exposed to the outside without being covered by the second base layer 140.

The second base layer 140 may be formed by applying a curing agent of the liquid in the same or similar manner as the aforementioned first base layer 120 and then curing, or may be provided using a synthetic resin film, and a detailed description thereof Will be omitted.

Next, as shown in FIG. 6, a second electrode pattern 150 is formed on the upper surface of the second base layer 140. The second electrode pattern 150 may be formed in the same or similar manner by using the same or similar material as the aforementioned first electrode pattern 130.

In addition, while the second electrode pattern 150 is patterned, a connection pattern 132 electrically connected to the first electrode pattern 130 may be formed together. That is, while the second electrode pattern 150 is patterned, the ends of the first electrode pattern 130 which are not covered by the second base layer 140 are electrically connected to the first electrode pattern 130. The pattern 132 may be formed.

Of course, the second electrode pattern 150 may be configured such that a separate connection pattern 132 is not formed while the second electrode pattern 150 is patterned. However, when the second electrode pattern 150 is patterned, the second electrode layer 150 is patterned by the second base layer 140. Since both end portions of the first electrode pattern 130 which are not covered may be removed, a separate pattern for electrically connecting the wire member and the first electrode pattern 130 to be described later is cumbersome to be formed by a separate process. There is a problem. However, in the present invention, while the second electrode pattern 150 is patterned without any additional process, both ends (exposed portions) of the first electrode pattern 130 which are not covered by the second base layer 140 are covered. Since the connection pattern 132 may be formed together, the overall manufacturing process may be simplified.

Next, as shown in FIG. 7, the first wire member 160 is formed on the top surface of the first base layer 120 to be electrically connected to the first electrode pattern 130 and the second electrode pattern 150. In addition, the first wire member 160 may be electrically connected to the first electrode pattern 130 through the above-described connection pattern 132.

The first wire member 160 may be formed by a conventional printing process, and in some cases, the first wire member may be formed by a metal thin film deposition or a metal electrode etching process.

Next, as illustrated in FIG. 8, a window decoration 170 having a frame shape is formed on the upper surface of the laminated film 100.

The window decoration 170 serves to cover the non-transparent components disposed below the first wire member 160 and the circuit board 300 disposed at the edge of the laminated film 100. It may be formed by a conventional printing process or the like.

Next, as shown in FIG. 9, the adhesive layer 180 is formed to cover the entire upper surface of the laminated film 100 on which the window decoration 170 is formed. In addition, the glass substrate 200 to be described later may be stacked in close contact with the laminated film 100 through the adhesive layer 180.

The adhesive layer 180 may be provided in various ways according to required conditions and design specifications. For example, the adhesive layer 180 may be provided by applying a liquid adhesive (for example, an ultraviolet curing agent) and curing the coating layer 180, or may be provided using an optical adhesive film or an OCA (Optically Clear Adhesive) film. Hereinafter, the adhesive layer 180 will be described with an example including a liquid adhesive layer 182 and an optical film adhesive layer 184.

The liquid adhesive layer 182 may be provided by applying a liquid curing agent to the upper surface of the laminated film 100 and curing, and the optical film adhesive layer 184 is laminated in close contact with the upper portion of the liquid adhesive layer 182. Can be. For reference, the optical film adhesive layer 184 may be stacked on top of the liquid adhesive layer 182 in a state of being attached to the bottom surface of the glass substrate 200. In some cases, only the liquid adhesive layer may be used alone as the adhesive layer, or only the optical film adhesive layer may be used alone.

Next, as shown in FIG. 10, the glass substrate 200 is stacked on the upper surface of the adhesive layer 180. As described above, the glass substrate 200 may be stacked to be in close contact with the laminated film 100 through the adhesive layer 180.

Next, as shown in FIG. 11, by removing the release film 110 from the laminated film 100, the first base layer 120, the first electrode pattern 130, the second base layer 140, and the second base film 120 are removed. The electrode pattern 150, the first wire member 160, and the window decoration 170 are transferred to the glass substrate 200 at one time.

Next, as shown in FIG. 12, the first base layer 120 is partially removed to expose one end of the first wire member 160 to the bottom surface of the first base layer 120.

For example, the first through part 122 may be formed on the first base layer 120 by partially removing the first base layer 120 from the bottom of the first base layer 120. One end of the member 160 may be exposed to the bottom surface of the first base layer 120 through the first through part 122.

The first through portion 122 may be formed in the form of a hole in the first base layer 120 by a conventional laser processing, etching or machining, such as seen by the method of forming the first through portion 122 The invention is not limited or limited. In some cases, the first through part may be formed by etching or some other method.

By forming the first through part 122 in the first base layer 120, one end of the first wire member 160 may be exposed to the bottom surface of the first base layer 120, and then the first base. The external circuit board 300 attached to the bottom of the layer 120 and the first wire member 160 may be electrically connected to each other. For reference, the external circuit board 300 may be attached by conventional ACF bonding, and the present invention is not limited or limited by the method of attaching the external circuit board. In some cases, it is also possible to attach the circuit board to the outside after the conductive material is filled in the inner space of the first through part.

Meanwhile, FIGS. 13 and 14 are views for explaining a method of manufacturing a touch panel sensor according to another exemplary embodiment of the present invention. In addition, the same or equivalent reference numerals are given to the same or equivalent components as those described above, and detailed description thereof will be omitted.

In the above-described and illustrated embodiments of the present invention, a second electrode pattern is formed together on the laminated film. For example, in some cases, the second electrode pattern is provided on a separate film member, and then the laminated film is described. It is also possible to be stacked.

Referring to FIG. 13, the laminated film may include a first base layer 1120, a first electrode pattern 1130, a first wire member 1160, and an adhesive layer sequentially provided on the release film (see 110 in FIG. 11). 1180 and the glass substrate 1200, and by removing the release film from the laminated film 1000, the first base layer 1120, the first electrode pattern 1130, and the first wire member. The adhesive layer 1180 may be transferred to the glass substrate 200 at one time. In addition, before the glass substrate 1200 is stacked on the upper surface of the adhesive layer 1180, a window decoration 1170 may be formed on the bottom surface of the glass substrate 1200.

In addition, as the release film is removed, the bottom surface of the first base layer 1120 may be exposed to the outside, and the first base layer 1120 may be partially removed from the bottom surface of the first base layer 1120. By forming the first through part 1122, one end of the first wire member 1160 may be exposed to the bottom surface of the first base layer 1120 through the first through part 1122.

In addition, a separate hard coat layer may be formed on the upper surface of the first base layer to protect the first electrode pattern. The hard coat layer may be formed using a liquid curing agent or film according to the required conditions and design specifications.

Next, referring to FIG. 14, the film member 1140 ′ having the second electrode pattern 1150 ′ and the second wire member 1162 electrically connected to the second electrode pattern 1150 ′ may be provided. Can be.

The film member 1140 ′ may be formed by applying a curing agent of a liquid on a release film and curing the same as the above-described laminated film, or may be provided using a synthetic resin film. Hereinafter, the film member 1140 'will be described with an example provided using a synthetic resin film.

After the second electrode pattern 1150 'is patterned on the top surface of the film member 1140', a second wire member 1162 electrically connected to the second electrode pattern 1150 'may be printed.

After that, by attaching an external circuit board 1300 between the laminated film 1000 and the film member 1140 ', the external circuit board 1300 of the outer surface of the film member 1140' is attached. The bottom surface may be electrically connected to the second wire member 1162, and the top surface of the external circuit board 1300 may be exposed to the bottom surface (the bottom surface of the first base layer) of the laminated film 1000. 1160 may be electrically connected. In addition, a separate adhesive layer may be provided between the top surface of the film member and the bottom surface of the laminated film.

For reference, in the exemplary embodiment of the present invention, the film member and the external circuit board are first connected, and then, for example, the laminated film is attached on the external circuit board. However, in some cases, the film for the external circuit board may be described. Attachment order of the member and the laminated film may be reversed.

15 to 20 are views for explaining a method of manufacturing a touch panel sensor according to another embodiment of the present invention, respectively. In addition, the same or equivalent reference numerals are given to the same or equivalent components as those described above, and detailed description thereof will be omitted.

Referring to FIG. 15, the laminated film 100 may be provided to correspond to at least one or more glass substrates 200, and the laminated film 100 may be formed on the glass substrate 200 before being laminated to the glass substrate 200. And cut to size corresponding to the size). For example, according to the required conditions and design specifications, 4 * 4, 5 * 5, 6 * 6, 3 * 4, etc. can be laminated film formed at once, the present invention is limited by the arrangement of the laminated film It is not limited or restricted.

In the above-described and illustrated embodiments of the present invention, when the second base layer and the second electrode pattern are formed on the laminated film, the second base layer is formed to partially cover the first electrode pattern. In some cases, the second base layer may be formed to cover the entire first electrode pattern.

That is, referring to FIG. 16, the laminated film 100 may include a first base layer 120, a first electrode pattern 130, a first wire member 160, and a second base layer on the release film 110. 140 '), the second electrode pattern 150, the second wire member 162', and the window decoration 170 may be sequentially stacked.

First, the first base layer 120 is formed on the release film 110, and the first electrode pattern 130 is formed on the upper surface of the first base layer 120, and then the first electrode pattern 130 is formed. The first wire member 160 is formed to be electrically connected to the second wire member 160.

Next, a second base layer 140 ′ is formed on the top surface of the first base layer 120 to cover the first electrode pattern 130 as a whole, and a second base layer 140 ′ is formed on the top surface of the second base layer 140 ′. After forming the electrode pattern 150, the second wire member 162 ′ is formed to be electrically connected to the second electrode pattern 150.

Next, by forming a frame-shaped window decoration 170 on the upper surface of the laminated film 100, sequentially laminating the adhesive layer 180 and the glass substrate 200, by removing the release film 110, The first base layer 120, the first electrode pattern 130, the first wire member 160, the second base layer 140 ', the second electrode pattern 150, the second wire member 162' and the window The decoration 170 may be transferred onto the glass substrate 200 at one time.

Next, by forming the first through portion 122 in the first base layer 120, one end of the first wire member 160 can be exposed to the bottom surface of the first base layer 120, the first By forming the second through portion 142 'in the second base layer 140' and the first base layer 120, one end of the second wire member 162 'is formed on the bottom surface of the first base layer 120. May be exposed.

Subsequently, an external circuit board (not shown) mounted on the bottom of the first base layer 120 may be connected to the first base layer 120 through the first through portion 122 and the second through portion 142 ′. It may be electrically connected to the first wire member 160 and the second wire member 162 ′ exposed to the bottom surface.

On the other hand, in the above-described and illustrated embodiments of the present invention, the first through-hole (or the second through-hole) is described as an example in which the hole is processed, but in some cases, the first through-hole (or the second through-hole). ) May be provided in a form in which a part of the edge of the first base layer (or the second base layer) is removed.

That is, referring to FIG. 17, a first through part 122 ′ is formed in the first base layer 120 and is electrically connected to the first electrode pattern 130 and the second electrode pattern 150. The wire member 160 may be exposed to the bottom surface of the first base layer 120 through the first through part 122 ′, and the first through part 122 ′ may be formed on the first base layer 120. It may be formed in a form in which the edge portion is partially removed.

In the exemplary embodiment of the present invention, the first through part 122 ′ is formed in the center of the lower edge of the first base layer 120 in the form of a substantially square groove, but the position and the shape of the first through part are required. It may be changed according to conditions and design specifications.

In addition, since the window decoration 170 and the adhesive layer 180 are formed on the first wire member 160, the end portion of the first wire member 160 is decorated with the first through portion by the decoration and adhesive layer 180. The state disposed on the 122 'can be stably maintained. In addition, the external circuit board 300 may be accommodated in the internal space of the first through part 122 ′.

On the other hand, when the above-described penetrating portion is formed by laser processing, a functional layer for further improving the processing characteristics by the laser can be provided.

Referring to FIG. 18, the laminated film 100 may include a first laser absorbing layer 125 formed on an upper surface of the first base layer 120, and the first wire member 160 may include the first laser. It may be formed on the upper surface of the absorber layer.

As the first laser absorbing layer 125, various functional layers capable of improving laser processing characteristics may be used. For example, the first laser absorbing layer 125 may be formed using carbon or black printing.

For reference, the first laser absorbing layer may be formed of a non-conductive material, and the first laser absorbing layer may be removed together when the first through portion is formed in laser processing. In some cases, the first laser absorbing layer may be formed of a conductive material. In this case, the first laser absorbing layer does not need to be removed.

On the other hand, when the first wire member is formed by metal thin film deposition and the first through portion is formed by laser processing, a part of the first wire member adjacent to the first through portion may be removed or damaged during laser processing. When a part of the first wire member is damaged, the electrical characteristics of the first wire member are difficult to be maintained stably.

To this end, when the through portion is formed by laser processing, the wire member may be provided in a double structure to prevent damage to the wire member by the laser.

Referring to FIG. 19, an auxiliary wire member 163 may be formed on an upper surface of the first wire member 160 to cover the first wire member 160, and a part of the first wire member 160 may be laser processed. Even if is damaged, the electrical connection state of the first wire member 160 by the conductive auxiliary wire member 163 can be stably maintained without interruption. Preferably, the auxiliary wire member 163 may be formed of a material having excellent durability against laser processing. For example, the auxiliary wire member 163 may be formed to partially cover a portion of the first wire member 160 by a printing method using silver paste.

Referring to FIG. 20, according to another exemplary embodiment of the present disclosure, the touch panel sensor may include a second wire member electrically connected to the second electrode pattern 2150 and the second electrode pattern 2150 (see 160 of FIG. 8). Providing a glass substrate 2200 having a bottom surface; A release film 2110, a base layer 2120 formed on the release film 2110, a first electrode pattern 2130 formed on an upper surface of the base layer 2120, and the first electrode pattern 2130. Providing a laminated film including a first wire member 2160 electrically connected to the first wire member 2160; Stacking the glass substrate 2200 on the laminated film such that the bottom surface of the glass substrate 2200 covers the top surface of the base layer 2120; Removing the release film 2110 from the laminated film and transferring the base layer 2120, the first electrode pattern 2130, and the first wire member 2160 to the glass substrate 2200 at one time; And partially removing the base layer 2120 to expose one end of the first wire member 2160 and the second wire member to the bottom surface of the base layer 2120.

Indeed, the glass substrate on which the second electrode pattern and the second wire member are provided on the bottom may be provided in various ways according to the required conditions and design specifications.

For example, after forming the electrode layer (not shown) on the bottom surface of the glass substrate as a whole, by patterning the electrode layer in a predetermined form by a conventional etching method to form a second electrode pattern, the second wire member is a conventional printing It can be formed by a process. In some cases, the second electrode pattern may be formed by printing or other methods, and the second wire member may be formed by a metal thin film deposition or a metal electrode etching process. As another example, by forming an auxiliary base layer on a separate auxiliary release film and forming a second electrode pattern and a second wire member on the auxiliary base layer, by removing the auxiliary release film while being laminated with a glass substrate. The auxiliary base layer, the second electrode pattern, and the second wire member may be transferred to the bottom surface of the glass substrate at one time. As another example, it is also possible to form a second electrode pattern and a second wire member on the bottom of the auxiliary base layer after transferring a separate auxiliary base layer to the bottom of the glass substrate using a separate auxiliary release film.

In addition, according to another embodiment of the present invention, before laminating the glass substrate on the laminated film, a circuit board may be attached to be electrically connected to the first wire member and the second wire member between the laminated film and the glass substrate. In this case, since the circuit board may be electrically connected to the first wire member and the second wire member between the laminated film and the glass substrate, the formation of the first through portion and the second through portion may be excluded. Alternatively, between the laminated film and the glass substrate, only the second wire member is electrically connected to the circuit board, and the first wire member is exposed to the bottom of the base layer and then attached to the bottom of the base layer. It is also possible to configure it to be electrically connected.

Hereinafter, a touch panel sensor and a manufacturing method thereof according to another embodiment of the present invention will be described. 21 is a view showing a touch panel sensor according to the present invention, Figures 22 to 31 are views for explaining a manufacturing method of the touch panel sensor according to the present invention.

21 to 31, a touch panel sensor according to the present invention may be used to detect a contact position of an object placed on a display and includes a laminated film 3100 and a glass substrate 3200.

Since the glass substrate 3200 is directly touched by a body part such as a finger or a touch tool, the glass substrate 3200 uses a rigid glass substrate having high strength and is not easily refracted, or a polycarbonate such as light having excellent strength. Reinforced plastics can be used.

The laminated film 3100 may include a first base layer 3120, a first electrode pattern 3130, a second base layer 3140, a second electrode pattern 3150, and a first wire member 3160 that are sequentially stacked. And window decoration 3170.

A first through part 3122 is formed on the first base layer 3120, and an upper surface of the first base layer 3120 to be electrically connected to the first electrode pattern 3130 and the second electrode pattern 3150. One end of the first wire member 3160 formed on the first wire member 3160 may be exposed to the bottom surface of the first base layer 3120 through the first through part 3122, and the external circuit board 3300 may be exposed to the first base layer 3120. The first wire member 3160 may be electrically connected to the first wire member 3160 that is mounted on the bottom of the first base layer 3120.

For reference, in the exemplary embodiment of the present invention, the laminated film is described with an example including a first base layer, a first electrode pattern, a second base layer, a second electrode pattern, a first wire member, and a window decoration. In some cases, the laminated film may include the first base layer and the first electrode pattern without the second base layer and the second electrode pattern. In addition, in the embodiment of the present invention, for example, the window decoration is formed on the laminated film, but in some cases, it is possible to configure the window decoration to be formed on the glass substrate or other members.

Hereinafter, a method of manufacturing a touch panel sensor according to the present invention will be described with reference to FIGS. 22 to 31. For reference, FIG. 22 is a view for explaining a step of forming a first base layer, FIG. 23 is a view for explaining a step of forming a first electrode pattern, and FIG. 24 is a step for forming a second base layer. 25 is a view for explaining a step of forming a second electrode pattern. FIG. 26 is a view for explaining a step of forming a first through part, FIG. 27 is a view for explaining a step of forming a first wire member, and FIG. 28 is a view for explaining a step of forming a window decoration. 29 is a view for explaining the step of forming an adhesive layer, Figure 30 is a view for explaining the step of laminating a glass substrate on the laminated film, Figure 31 is a step of removing the release film from the laminated film It is a figure for demonstrating.

Referring to FIG. 22, first, a release film 3110 is provided and a first base layer 3120 is formed on an upper surface of the release film 3110.

For reference, a release adhesive layer 3112 may be formed on an upper surface of the release film 3110. The release adhesive layer 3112 may be provided in a layer state and stacked on the release film 3110 as it is, but in this case, since bubbles may enter or the position may be displaced during the lamination process, the release adhesive layer is preferable. A liquid material for forming the layer 3112 is applied onto the release film 3110, and the release film 3110 is rotated to evenly spread the liquid material on the release film 3110 and then harden it. Can be.

The first base layer 3120 may be formed in various ways according to required conditions and design specifications.

For example, the first base layer 3120 may be provided by applying a liquid curing agent on the upper surface of the release film 3110 and then curing the liquid curing agent. The first base layer 3120 may be formed by applying a liquid curing agent to the upper surface of the release adhesive layer 3112 by a conventional spin coating method and curing the liquid. In some cases, the liquid curing agent may be applied in other ways using printing or rollers, and the present invention is not limited or limited by the application method of the liquid curing agent. Hereinafter, an example in which an ordinary ultraviolet curing agent is used as the liquid curing agent will be described. In some cases, a thermosetting agent may be used instead of the ultraviolet curing agent as the liquid curing agent. Alternatively, it is also possible for the first base layer to be formed in other ways such as printing, etching and the like.

As another example, the first base layer 3120 may be provided using a synthetic resin film. For reference, in general, the plastic film on which the electrode pattern is formed is provided to have a thickness of about several hundred μm. The reason is that the thickness of the plastic film should be maintained at least several hundred μm to lay the electrode layer for the electrode pattern on the plastic film and form the electrode pattern directly on the plastic film through a patterning process such as photolithography. However, in the present invention, since the first base layer 3120 is formed on the release film 3110, and the first electrode pattern 3130 to be described later is formed on the upper surface of the first base layer 3120, the first base is formed. Even if the thickness of the layer 3120 is thin, there is no problem in forming the first electrode pattern 3130. For example, the first base layer 3120 may be provided using a synthetic resin film having a thickness of 10 to 30 μm that does not require a separate heat curing treatment or an ultraviolet curing treatment.

Next, as shown in FIG. 23, a first electrode pattern 3130 is formed on an upper surface of the first base layer 3120.

The first electrode pattern 3130 may be variously formed in a square or diamond shape according to a required condition and a design specification. In some cases, the first electrode pattern may be provided in a general line shape or a group shape in which two or more upper or lower portions of the line are electrically connected to each other. The present invention relates to a shape and a structure of the first electrode pattern 3130. It is not limited or restricted by.

The first electrode pattern 3130 may be formed using a conductive material and a transparent material, and the present invention is not limited or limited by the material of the first electrode pattern 3130. For example, the first electrode pattern 3130 may be formed using ITO or IZO, ATO, AZO, carbon nanotubes, transparent organic materials, or the like. In some cases, the first electrode pattern may be formed using a metal fiber such as silver nanofiber, and the first electrode pattern formed using the metal fiber solution may be formed of a thin metal fiber even if it is formed very thin. Since the fibers are connected to each other, it is possible to maintain high conductivity and to form a very thin thickness of 1 μm or less. Alternatively, a metal mesh having a thickness of about 10 μm or less may be applied instead of the first electrode pattern.

After forming the first electrode layer (not shown) on the entire surface of the first base layer 3120, the first electrode pattern 3130 may pattern the first electrode layer into a predetermined shape by a conventional etching method. In some cases, it is also possible to form the first electrode pattern by printing or other methods.

Next, as shown in FIG. 24, the second base layer 3140 is formed on the top surface of the first base layer 3120 so that the first electrode pattern 3130 is partially exposed.

Here, the partial exposure of the first electrode pattern 3130 may be understood as a part of the first electrode pattern 3130 not covered by the second base layer 3140. For example, the second base layer 3140 may be formed to cover the first electrode pattern 3130 except for a part of both ends of the first electrode pattern 3130. Both ends may be exposed to the outside without being covered by the second base layer 3140.

The second base layer 3140 may be formed by applying a curing agent of a liquid in the same or similar manner as the first base layer 3120 described above, and then curing the same, or may be provided using a synthetic resin film. Will be omitted.

Next, as shown in FIG. 25, a second electrode pattern 3150 is formed on the top surface of the second base layer 3140. The second electrode pattern 3150 may be formed in the same or similar manner using the same or similar material as that of the first electrode pattern 3130 described above.

In addition, while the second electrode pattern 3150 is patterned, a connection pattern 3132 electrically connected to the first electrode pattern 3130 may be formed together. That is, while the second electrode pattern 3150 is patterned, a connection electrically connected to the first electrode pattern 3130 at both ends of the first electrode pattern 3130 that is not covered by the second base layer 3140. Pattern 3132 may be formed.

Of course, the second electrode pattern 3150 may be configured so that a separate connection pattern 3132 is not formed while the second electrode pattern 3150 is patterned. However, when the second electrode pattern 3150 is patterned, the second base layer 3140 is formed. Since both ends of the uncovered first electrode pattern 3130 may be removed, a separate pattern for electrically connecting the wire member and the first electrode pattern 3130, which will be described later, should be formed by a separate process. There is a problem. However, in the present invention, while the second electrode pattern 3150 is patterned without any additional process, both ends (exposed portions) of the first electrode pattern 3130 which are not covered by the second base layer 3140 are covered. Since the connection pattern 3132 may be formed together, the overall manufacturing process may be simplified.

Next, as shown in FIG. 26, a first through part 3122 is formed in the first base layer 3120.

The first through portion 3122 may be formed in the form of a hole in the first base layer 3120 by a conventional laser or machining, or the present invention is limited by the method of forming the first through portion 3122 It is not limited.

In some cases, when the first base layer is formed by a printing or etching method, the first through part may be formed together. Here, when the first base layer is formed, the first through portion is formed together, excluding the additional process of forming the first through portion after forming the first base layer, and forming the first base layer. It can be understood that the first through portion is formed together during the printing or etching process. For example, the first base layer is provided by printing (or applying) a liquid curing agent on a release film and then curing the liquid curing agent, wherein the first through part forms a first base layer on an upper surface of the release film. It may be formed together with the first base layer by printing and curing the liquid curing agent except for the first through area. For example, the first base layer having the first through portion may be formed by gravure printing and curing the liquid curing agent on the release film.

Meanwhile, as the release film 3110, a conventional synthetic resin film may be used, but in some cases, a metal thin plate may be used as the release film. For reference, when a release film made of synthetic resin is used, the release film may be damaged during laser processing to form the first through part, but a release film made of a metal thin film (or a synthetic resin film made of metal coating) may be used. In this case, damage to the release film due to laser processing can be prevented in advance.

In addition, it is also possible to increase the laser resistance by chromium plating the thin metal plate (for example, copper thin plate). Alternatively, in order to increase the flexibility of the thin metal plate, it is possible to use a copper foil having a thickness of about 5 ~ 100㎛, and to attach a PET film or the like on the opposite side of the release-coated copper foil.

Next, as shown in FIG. 27, the first electrode pattern 3130 and the second electrode pattern 3150 are electrically connected to each other, and one end of the first base layer 3120 is connected to the bottom surface of the first base layer 3120. The first wire member 3160 is formed to be exposed. In addition, the first wire member 3160 may be electrically connected to the first electrode pattern 3130 through the above-described connection pattern 3132.

The first wire member 3160 may be formed by a conventional printing process, and a raw material of the first wire member 3160 may be formed inside the first through part 3122 during the printing process of the first wire member 3160. Since one side of the first wire member 3160 may be substantially exposed to the bottom surface of the first base layer 3120 through the first through part 3122. In some cases, the first wire member may be formed by a metal thin film deposition or metal electrode etching process. In this case, a separate electrode printing process connecting the first through part and the metal thin film may be required.

Next, as shown in FIG. 28, a frame-shaped window decoration 3170 is formed on the upper surface of the laminated film 3100.

The window decoration 3170 serves to cover the non-transparent component disposed below the first wire member 3160 and the circuit board 3300 disposed at the edge of the laminated film 3100. It may be formed by a conventional printing process or the like.

Next, as shown in FIG. 29, the adhesive layer 3180 is formed to cover the entire upper surface of the laminated film 3100 on which the window decoration 3170 is formed. In addition, the glass substrate 3200 to be described later may be stacked in close contact with the laminated film 3100 through the adhesive layer 3180.

The adhesive layer 3180 may be provided in various ways according to required conditions and design specifications. For example, the adhesive layer 3180 may be provided by applying a liquid adhesive (for example, an ultraviolet curing agent) and curing the coating, or may be provided using an optical adhesive film or an OCA (Optically Clear Adhesive) film. Hereinafter, an example in which the adhesive layer 3180 includes the liquid adhesive layer 3322 and the optical film adhesive layer 3184 will be described.

The liquid adhesive layer 3318 may be provided by applying a liquid curing agent to the top surface of the laminated film 3100 and curing the optical adhesive layer 3184 to be in close contact with the upper portion of the liquid adhesive layer 3318. Can be. For reference, the optical film adhesive layer 3184 may be stacked on top of the liquid adhesive layer 3322 in a state of being attached to the bottom surface of the glass substrate 3200. In some cases, only the liquid adhesive layer may be used alone as the adhesive layer, or only the optical film adhesive layer may be used alone.

Next, as illustrated in FIG. 30, the glass substrate 3200 is stacked on the upper surface of the adhesive layer 3180. As described above, the glass substrate 3200 may be stacked to be in close contact with the laminated film 3100 through the adhesive layer 3180.

Next, as shown in FIG. 31, the release film 3110 is removed from the laminated film 3100 to thereby form the first base layer 3120, the first electrode pattern 3130, the second base layer 3140, and the second base film 3110. The electrode pattern 3150, the first wire member 3160, and the window decoration 3170 are transferred to the glass substrate 3200 at one time.

By removing the release film 3110 from the laminated film 3100, one end of the first wire member 3160 may be exposed to the bottom surface of the first base layer 3120, and then the first base layer 3120. An external circuit board 3300 and the first wire member 3160 may be electrically connected to the bottom surface of the substrate.

32 and 33 are views for explaining a method of manufacturing a touch panel sensor according to another exemplary embodiment of the present invention. In addition, the same or equivalent reference numerals are given to the same or equivalent components as those described above, and detailed description thereof will be omitted.

Referring to FIG. 32, the laminated film 3100 may include a first base layer 3120, a first electrode pattern 3130, a first wire member 3160, and window decoration that are sequentially provided on the release film 3110. 3170, an adhesive layer 3180, and a glass substrate 3200, and by removing the release film 3110 from the laminated film 3100, the first base layer 3120 and the first electrode pattern. The window decoration 3170 may be transferred to the glass substrate 3200 at one time. In addition, by removing the release film 3110 from the laminated film 3100, one end of the first wire member 3160 may be exposed to the bottom surface of the first base layer 3120.

Next, referring to FIG. 33, the film member 3140 ′ having the second electrode pattern 3150 ′ and the second wire member 3322 electrically connected to the second electrode pattern 3150 ′ may be provided on the upper surface. Can be.

The film member 3140 ′ may be formed by applying a curing agent of a liquid on a release film and curing the same as the above-described laminated film, or may be provided using a synthetic resin film. Hereinafter, the film member 3140 'will be described with an example provided using a synthetic resin film.

After the second electrode pattern 3150 'is patterned on the top surface of the film member 3140', a second wire member 3152 electrically connected to the second electrode pattern 3150 'may be printed on the film. The release film 3110 may be removed from the member 3140 ′.

Thereafter, the external circuit board 3300 attached to the top surface of the film member 3140 'may have a bottom surface electrically connected to the second wire member 3322, and the top surface of the external circuit board 3300 may be It may be electrically connected to the first wire member 3160 exposed to the bottom surface (the bottom surface of the first base layer) of the laminated film 3100 of FIG. 32.

34 to 36 are views for explaining a method of manufacturing a touch panel sensor according to another embodiment of the present invention, respectively. In addition, the same or equivalent reference numerals are given to the same or equivalent components as those described above, and detailed description thereof will be omitted.

Referring to FIG. 34, the laminated film 3100 may be provided to correspond to at least one or more glass substrates 3200, and the laminated film 3100 may be formed on the glass substrate (3200 of FIG. 21) before being laminated to the glass substrate 3200. And cut to size corresponding to the size). For example, according to the required conditions and design specifications, 4 * 4, 5 * 5, 6 * 6, 3 * 4, etc. can be laminated film formed at once, the present invention is limited by the arrangement of the laminated film It is not limited or restricted.

That is, referring to FIG. 35, the laminated film 3100 may include a first base layer 3120, a first electrode pattern 3130, a first wire member 3160, and a second base layer on the release film 3110. 3140 ′, the second electrode pattern 3150, the second wire member 3152 ′, and the window decoration 3170 may be sequentially stacked.

First, the first base layer 3120 is formed on the release film 3110, and the first electrode pattern 3130 is formed on the top surface of the first base layer 3120.

Next, after the first through part 3122 is formed in the first base layer 3120, the first base part 3122 is electrically connected to one end of the first base part through the first through part 3122. The first wire member 3160 is formed to be exposed to the bottom of the layer 3120.

Next, a second base layer 3140 ′ is formed on the top surface of the first base layer 3120 to cover the first electrode pattern 3130 as a whole, and then, The second electrode pattern 3150 is formed.

Next, a second through portion 3142 ′ is formed in the second base layer 3140 ′ and the first base layer 3120. The second through portion 3142 ′ may be formed in the same or similar manner as the first through portion 3122 described above.

Next, a second wire member 3152 'is formed to be electrically connected to the second electrode pattern 3150 so that one end thereof is exposed to the bottom surface of the first base layer 3120 through the second through part 3314'. . The second wire member 3152 'may be formed by a conventional printing process, and the second wire member 3322 may be formed inside the second through part 3322' during the printing process of the second wire member 3322 '. Since the raw material of ') may be filled, substantially one end of the second wire member 3152' may be exposed to the bottom surface of the first base layer 3120 through the second through portion 3322 '.

Next, by forming a frame-shaped window decoration (3170) on the upper surface of the laminated film 3100, and sequentially laminating the adhesive layer 3180 and the glass substrate 3200, and removed from the laminated film 3100, The first base layer 3120, the first electrode pattern 3130, the first wire member 3160, the second base layer 3140 ′, the second electrode pattern 3150, the second wire member 3316 ′, and the window The decoration 3170 may be transferred to the glass substrate 3200 at a time.

That is, referring to FIG. 36, a first through part 3122 ′ is formed in the first base layer 3120 and is electrically connected to the first electrode pattern 3130 and the second electrode pattern 3150. The wire member 3160 may be exposed to the bottom surface of the first base layer 3120 through the first through portion 3122 ', and the first through portion 3122' may be exposed to the bottom of the first base layer 3120. It may be formed in a form in which the edge portion is partially removed.

Since the first through part 3122 'is provided to have a sufficient size, even if the first wire member 3160 is not entirely filled in the inner space of the first through part 3122', the first wire member 3160 ) May be exposed to the bottom surface of the first base layer 3120 through the first through portion 3122 ′.

In the exemplary embodiment of the present invention, the first through part 3122 ′ is formed in the center of the lower edge of the first base layer 3120 in the form of a substantially square groove, but the position and shape of the first through part are required. It may be changed according to conditions and design specifications.

In addition, since the window decoration 3170 and the adhesive layer 3180 are formed on the upper portion of the first wire member 3160, the end portion of the first wire member 3160 is formed by the decoration and the adhesive layer 3180. The state disposed on 3122 'may be stably maintained. In addition, the external circuit board 3300 may be accommodated in the internal space of the first through part 3122 ′.

As described above, although described with reference to the preferred embodiment of the present invention, those skilled in the art various modifications and variations of the present invention without departing from the spirit and scope of the invention described in the claims below I can understand that you can.

Claims

In the manufacturing method of the touch panel sensor disposed on the display to detect the contact position of the object,

Providing a laminated film including a release film, a base layer formed on the release film, an electrode pattern formed on an upper surface of the base layer, and a wire member electrically connected to the electrode pattern;

Stacking a glass substrate on the laminated film to cover the top surface of the base layer;

Removing the release film from the laminated film and transferring the base layer, the electrode pattern, and the wire member to the glass substrate at once; And

Partially removing the base layer to expose one end of the wire member to the bottom of the base layer;

Method of manufacturing a touch panel sensor comprising a.
The method of claim 1,

Providing the laminated film,

Providing the release film;

Forming a first base layer on an upper surface of the release film;

Forming a first electrode pattern on an upper surface of the first base layer; And

And forming a first wire member on an upper surface of the first base layer to be electrically connected to the first electrode pattern.

Partially removing the first base layer from the bottom of the first base layer to form a first through portion in the first base layer, and one end of the first wire member through the first through portion; Method of manufacturing a touch panel sensor, characterized in that exposed to the bottom of the.
The method of claim 2,

Providing a film member having a second electrode pattern and a second wire member electrically connected to the second electrode pattern on an upper surface thereof; And

Stacking an upper surface of the film member on a bottom surface of the laminated film;

Method of manufacturing a touch panel sensor further comprises.
The method of claim 1,

Providing the laminated film,

Providing the release film;

Forming a first base layer on an upper surface of the release film;

Forming a first electrode pattern on an upper surface of the first base layer;

Forming a second base layer on an upper surface of the first base layer to partially expose the first electrode pattern;

Forming a second electrode pattern on an upper surface of the second base layer; And

Forming a first wire member on an upper surface of the first base layer to be electrically connected to the first electrode pattern and the second electrode pattern, respectively;

Partially removing the first base layer from the bottom of the first base layer to form a first through portion in the first base layer, and one end of the first wire member through the first through portion; Method of manufacturing a touch panel sensor, characterized in that exposed to the bottom of the.
The method of claim 4, wherein

While the second electrode pattern is patterned, a connection pattern electrically connected to the first electrode pattern is formed together, and the first wire member is electrically connected to the first electrode pattern through the connection pattern. Method of manufacturing a touch panel sensor.
The method of claim 1,

Providing the laminated film,

Providing the release film;

Forming a first base layer on an upper surface of the release film;

Forming a first electrode pattern on an upper surface of the first base layer;

Forming a first wire member on an upper surface of the first base layer to be electrically connected to the first electrode pattern;

Forming a second base layer on an upper surface of the first base layer to cover the first electrode pattern as a whole;

Forming a second electrode pattern on an upper surface of the second base layer; And

And forming a second wire member on an upper surface of the first base layer to be electrically connected to the second electrode pattern.

The first base layer is partially removed from the bottom surface of the first base layer to form a first through portion in the first base layer, and the first base layer and the second base layer from the bottom surface of the first base layer. Is partially removed to form a second penetration portion,

One end of the first wire member is exposed to the bottom surface of the first base layer through the first through portion, and one end of the second wire member is exposed to the bottom surface of the first base layer through the second through portion. Method of manufacturing a touch panel sensor characterized in that.
The method of claim 2,

The first through part is a manufacturing method of the touch panel sensor, characterized in that formed by any one of laser processing, etching processing, machining.
The method of claim 2,

The first through part is a manufacturing method of the touch panel sensor, characterized in that provided in the form of a hole.
The method of claim 2,

The first through part is a manufacturing method of the touch panel sensor, characterized in that provided in the form of removing the part of the edge of the first base layer.
The method of claim 1,

Forming a window decoration on the upper surface of the laminated film before laminating the glass substrate further comprising the step of manufacturing a touch panel sensor.
The method of claim 1,

And forming a window decoration on the bottom surface of the glass substrate before stacking the glass substrate.
The method of claim 2,

And forming a window decoration, a second electrode pattern, and a second wire member electrically connected to the second electrode pattern on the bottom surface of the glass substrate before laminating the glass substrate. Manufacturing method.
The method of claim 1,

The glass substrate is a method of manufacturing a touch panel sensor, characterized in that laminated on the laminated film via an adhesive layer.
The method of claim 13,

The adhesive layer is provided by curing a liquid adhesive, or a method of manufacturing a touch panel sensor, characterized in that it is provided using an adhesive film.
The method of claim 1,

The base layer is a method of manufacturing a touch panel sensor, characterized in that the liquid curing agent is applied on the release film, and then the curing agent of the liquid is provided.
The method of claim 1,

The base layer is a manufacturing method of the touch panel sensor, characterized in that provided using a synthetic resin film.
The method of claim 1,

The laminated film is provided to correspond to at least one glass substrate, the laminated film is a manufacturing method of the touch panel sensor, characterized in that the cut is provided corresponding to the glass substrate before being laminated to the glass substrate.
The method of claim 1,

The laminated film is provided including a laser absorbing layer formed on the upper surface of the base layer, the wire member is formed on the upper surface of the laser absorbing layer,

The base layer is partially removed from the bottom of the base layer by laser processing to form a through portion in the base layer, and one end of the wire member is exposed to the bottom surface of the base layer through the through portion. Method of manufacturing panel sensor.
The method of claim 18,

The laser absorption layer is a method of manufacturing a touch panel sensor, characterized in that formed using carbon or black printing.
The method of claim 1,

By partially removing the base layer from the bottom of the base layer by laser processing, one end of the wire member is exposed to the bottom of the base layer,

In order to compensate for the damage of the wire member by the laser processing, the laminated film is a manufacturing method of the touch panel sensor, characterized in that it further comprises an auxiliary wire member formed to partially cover the wire member.
In the manufacturing method of the touch panel sensor disposed on the display to detect the contact position of the object,

Providing a glass substrate having a second electrode pattern and a second wire member electrically connected to the second electrode pattern on a bottom surface thereof;

Providing a laminated film including a release film, a base layer formed on the release film, a first electrode pattern formed on an upper surface of the base layer, and a first wire member electrically connected to the first electrode pattern. ;

Stacking the glass substrate on the laminated film such that a bottom surface of the glass substrate covers the top surface of the base layer;

Removing the release film from the laminated film and transferring the base layer, the first electrode pattern, and the first wire member to the glass substrate at once; And

Partially removing the base layer to expose one end of the first wire member and the second wire member to a bottom surface of the base layer;

Method of manufacturing a touch panel sensor comprising a.
The method of claim 21,

Before laminating the glass substrate on the laminated film, further comprising attaching a circuit board to be electrically connected between the first wire member and the second wire member between the laminated film and the glass substrate. Method of manufacturing a touch panel sensor.
A touch panel sensor manufactured by the manufacturing method of any one of claims 1 to 22.
In the manufacturing method of the touch panel sensor disposed on the display to detect the contact position of the object,

A release film, a base layer formed on the release film, an electrode pattern formed on the upper surface of the base layer, and the electrode pattern is electrically connected to one end of the base layer to be electrically connected to an external device Providing a laminated film including a wire member exposed to the bottom of the base layer;

Stacking a glass substrate on the laminated film to cover the top surface of the base layer; And

Removing the release film from the laminated film and transferring the base layer, the electrode pattern, and the wire member to the glass substrate at once;

Method of manufacturing a touch panel sensor comprising a.
The method of claim 24,

A first through portion is formed in the base layer, and one end of the wire member is exposed to the bottom surface of the base layer through the first through portion.

The base layer is provided by applying a liquid curing agent on the release film, and then curing the liquid curing agent,

The first through portion is formed with the base layer according to the curing after printing the liquid curing agent except for the first through region when forming the base layer on the upper surface of the release film. Method of manufacturing a touch panel sensor.
The method of claim 24,

Providing the laminated film,

Providing the release film;

Forming a first base layer on an upper surface of the release film;

Forming a first electrode pattern on an upper surface of the first base layer;

Forming a first through portion in the first base layer; And

Forming a first wire member electrically connected to the first electrode pattern and having one end exposed to a bottom surface of the first base layer through the first through part;

Method of manufacturing a touch panel sensor comprising a.
The method of claim 25,

Providing a film member having a second electrode pattern and a second wire member electrically connected to the second electrode pattern on an upper surface thereof; And

Stacking an upper surface of the film member on a bottom surface of the laminated film;

Method of manufacturing a touch panel sensor further comprises.
The method of claim 24,

Providing the laminated film,

Providing the release film;

Forming a first base layer on an upper surface of the release film;

Forming a first electrode pattern on an upper surface of the first base layer;

Forming a second base layer on an upper surface of the first base layer to partially expose the first electrode pattern;

Forming a second electrode pattern on an upper surface of the second base layer;

Forming a first through portion in the first base layer; And

Forming a first wire member electrically connected to the first electrode pattern and the second electrode pattern, and having one end exposed to the bottom surface of the first base layer through the first through part;

Method of manufacturing a touch panel sensor comprising a.
The method of claim 24,

Providing the laminated film,

Providing the release film;

Forming a first base layer on an upper surface of the release film;

Forming a first electrode pattern on an upper surface of the first base layer;

Forming a first through portion in the first base layer;

Forming a first wire member electrically connected to the first electrode pattern and having one end exposed to a bottom surface of the first base layer through the first through part;

Forming a second base layer on an upper surface of the first base layer to cover the first electrode pattern as a whole;

Forming a second electrode pattern on an upper surface of the second base layer;

Forming a second through portion in the second base layer and the first base layer; And

Forming a second wire member electrically connected to the second electrode pattern and having one end exposed to the bottom surface of the first base layer through the second through part;

Method of manufacturing a touch panel sensor comprising a.