WO2015032359A1 - 一种屏蔽盖及一种移动终端 - Google Patents

一种屏蔽盖及一种移动终端 Download PDF

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Publication number
WO2015032359A1
WO2015032359A1 PCT/CN2014/086119 CN2014086119W WO2015032359A1 WO 2015032359 A1 WO2015032359 A1 WO 2015032359A1 CN 2014086119 W CN2014086119 W CN 2014086119W WO 2015032359 A1 WO2015032359 A1 WO 2015032359A1
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Prior art keywords
shielding
substrate
flap
shielding cover
mobile terminal
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PCT/CN2014/086119
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English (en)
French (fr)
Inventor
陈晓晨
燕青
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华为终端有限公司
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Publication of WO2015032359A1 publication Critical patent/WO2015032359A1/zh

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0022Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/181Enclosures
    • G06F1/182Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0249Details of the mechanical connection between the housing parts or relating to the method of assembly

Definitions

  • the utility model relates to an electrical product manufacturing technology, and more particularly to a shielding cover and a mobile terminal.
  • a stack structure of a main circuit board and a sub-circuit board which is required to be configured with a dedicated shield cover and a shield frame for the main circuit board and the sub-circuit board, respectively. Shield isolation of signals between the primary and secondary boards.
  • the shielding frame is used as an attachment frame of the shielding cover, and can surround the circuit board responsible for shielding; the shielding cover covers the outside of the shielding frame.
  • conductive foam is adhered between the shielding cover of the main circuit board and the shielding cover of the sub-board.
  • the shielding design between the main and sub-board stack structures requires that the main circuit board shield frame and the main circuit board shield be sequentially disposed between the main circuit board and the sub-circuit board.
  • the cover, the conductive foam, the sub-circuit board shielding cover and the sub-circuit board shielding frame, such structure design uses more materials, so the cost is relatively high, and the fabricated circuit board stack structure is also relatively large.
  • the present invention provides a shield cover and a mobile terminal to overcome the problems of high cost of the shielding scheme of the circuit board stack structure and large volume of the finished product in the prior art.
  • the present invention provides the following technical solutions:
  • a shielding cover comprising a substrate, a plurality of first folding plates disposed at a periphery of the substrate, and a plurality of second folding plates; the first folding plate and the second folding The plates are alternately disposed around the periphery of the substrate; the first and second flaps are perpendicular to the substrate and are folded toward different sides of the substrate.
  • the method further includes:
  • first flap or a second flap disposed on the surface of the substrate.
  • the first flap and the second flap have a width ranging from 4 mm to 8 mm.
  • the material of the substrate, the first flap, and the second flap is metal.
  • first flap and the second flap are provided with a convex structure protruding toward the substrate side.
  • the raised structure is a semicircular body having a diameter ranging from 0.5 mm to 0.7 mm.
  • the shielding cover further includes:
  • the first shielding frame is provided with a circular hole corresponding to the convex structure on the first folding plate; the second shielding frame is provided with a protrusion corresponding to the second folding plate A circular hole corresponding to the structure.
  • the present invention also discloses a mobile terminal, the first aspect of the mobile terminal includes a first circuit board, a second circuit board, and a shielding device disposed between the first circuit board and the second circuit board
  • the shielding device comprises a first shielding frame, a second shielding frame and a shielding cover; the shielding cover is the shielding cover described above.
  • the mobile terminal is a mobile phone, a tablet computer, a computer or a set top box.
  • the embodiment of the present invention discloses a shielding cover and a mobile terminal, and the shielding cover includes a substrate, a plurality of first folding plates and a plurality of second folding portions.
  • the first folding plate and the second folding plate are alternately disposed on the periphery of the substrate, and the first folding plate and the second folding plate are respectively perpendicular to the substrate and are folded to different sides of the substrate.
  • the shielding device between the two circuit boards includes only two shielding frames and one shielding cover, compared with the prior art shielding structure including two shielding frames, two shielding covers and a layer of conductive foam.
  • the use of materials is greatly reduced, which not only reduces the manufacturing cost, but also significantly reduces the volume of the finished circuit board structure.
  • FIG. 1 is a schematic structural view of a shielding cover disclosed in an embodiment of the present invention.
  • FIG. 2 is a top view of a shield cover disclosed in an embodiment of the present invention.
  • Figure 3 is a side view of the shield cover disclosed in the embodiment of the present invention.
  • FIG. 4 is a schematic structural diagram of a mobile terminal according to an embodiment of the present invention.
  • FIG. 1 is a schematic structural view of a shielding cover according to an embodiment of the present invention.
  • the shielding cover may include:
  • first folded plates 11 and second folded plates 12 disposed at a periphery of the substrate; the first folded plate 11 and the second folded plate 12 are alternately disposed around the periphery of the substrate 10; The first flap 11 and the second flap 12 are perpendicular to the substrate 10 and are folded toward different sides of the substrate 10, respectively.
  • the width of the first flap 11 and the second flap 12 may range from 4 mm to 8 mm, that is, the connection length of the flap and the substrate 10 may be any one between 4 mm and 8 mm. Value.
  • the sizes of the first flap 11 and the second flap 12 are not fixedly limited, and the widths of the first flap 11 and the second flap 12 may be different, and each first fold
  • the size of the plate 11 or the second flap 12 may also be different.
  • the size of the flap may be determined according to the size and shape of the shield frame that the shield cover needs to be fastened, and is not necessarily limited to between 4 mm and 8 mm.
  • the substrate 10, the first folded edge 11 and the second folded edge 12 may be made of a metal material, so that the shielding cover may shield the interference signals between different circuit boards on the one hand, and also meet the requirements of the RF grounding.
  • the materials of the substrate 10, the first folded edge 11 and the second folded edge 12 are not fixedly limited to a metal material, and a shielding material may be sprayed with a plastic material instead of the metal material.
  • FIG. 2 is a schematic structural view of a shield cover with the raised structure 13.
  • FIG. 2 is a schematic structural view of another shield cover disclosed in the embodiment of the present invention.
  • the protruding structure 13 can cooperate with a circular hole on the shielding frame corresponding to the size and shape of the shielding cover, so that the shielding cover and the shielding frame are fixedly connected together.
  • the raised structure 13 is formed by die forming, so that the raised structure 13 is generally semi-circular and the inner cavity is empty.
  • the diameter of the protruding structure 13 is generally in the range of 0.5 mm to 0.7 mm, and the diameter dimension thereof is not fixed, and may be, for example, 0.45 mm or 0.75mm, can be designed according to user requirements.
  • the shape of the protruding structure 13 is also not limited to a semi-circular body, and may be other shapes that can be made by the prior art.
  • the first flap of the shielding cover can be fixedly coupled with a shielding frame, and the second folding plate of the shielding cover can be fixedly coupled with another shielding frame, so that one shielding cover can be simultaneously combined with two
  • the shielding frame is fastened, so that the shielding device between the two circuit boards includes only two shielding frames and one shielding cover, and two shielding frames, two shielding covers and one layer of conductive bubbles are included in the prior art.
  • the cotton shielding device greatly reduces the use of materials, not only reduces the manufacturing cost, but also significantly reduces the volume of the finished circuit board structure.
  • FIG. 3 is a schematic structural view of still another shielding cover according to an embodiment of the present invention.
  • the shielding cover may include:
  • first folded plates 11 and the second folded plates 12 are alternately disposed around the periphery of the substrate 10
  • the first flap 11 and the second flap 12 are perpendicular to the substrate 10 and folded to different sides of the substrate 10, and further include a first fold disposed on the surface of the substrate 10 Plate 11 or second flap 12.
  • the first folding plate 11 and the second folding plate 12 on the shielding cover may be disposed only at the periphery of the substrate 10.
  • the shielding cover requires the size and shape of the two shielding frames that are snap-fitted, in addition to the first flange 11 and the second flange 12 disposed at the periphery of the substrate 10, in order to ensure the shielding cover and
  • the fixing effect of the two shielding frames may partially flip one or more first hem 11 and/or second hem 12 on the surface of the substrate 10 to be located on the surface of the substrate 10 The border of the shield frame is snapped.
  • the shielding cover may include a shielding frame for use with the shielding cover in addition to the substrate, the plurality of first folding plates, and the plurality of second folding plates. Specifically, it may be a first shielding frame corresponding to a shape surrounded by the first folding plate, and a second shielding frame corresponding to a shape surrounded by the second folding plate.
  • the first shielding frame may be provided with a circular hole corresponding to the convex structure on the first folding plate, and the second shielding frame may be provided with a protrusion corresponding to the second folding plate. Corresponding circular holes are formed to achieve a tight snap-fit connection between the shielding cover and the first shielding frame and the second shielding frame, respectively.
  • the first flap of the shielding cover can be fixedly coupled with a shielding frame
  • the second folding plate of the shielding cover can be fixedly coupled with another shielding frame, so that one shielding cover can be simultaneously combined with two
  • the shielding frame is fastened, so that the shielding device between the two circuit boards includes only two shielding frames and one shielding cover, and two shielding frames, two shielding covers and one layer of conductive bubbles are included in the prior art.
  • the cotton shielding device greatly reduces the use of materials, not only reduces the manufacturing cost, but also significantly reduces the volume of the finished circuit board structure.
  • the first folding plate or the second folding plate may also be disposed on the surface of the substrate, so as to be different The size or shape of the shield can also achieve a tight snap-fit connection.
  • the present invention also discloses a mobile terminal.
  • 4 is a schematic structural diagram of a mobile terminal according to an embodiment of the present invention.
  • the mobile terminal includes a first circuit board 41, a second circuit board (not shown in FIG. 4), and a shielding device between the first circuit board 41 and the second circuit board;
  • the shielding device includes a first shielding frame 42, a second shielding frame 43 and a shielding cover;
  • the shielding cover is the shielding cover disclosed in the above embodiment
  • the substrate, the first flap 11 and the second flap 12 are included.
  • the mobile terminal may be, but is not limited to, a mobile phone, a tablet computer, a computer, or a set top box.
  • any mobile terminal that may include a two-layer circuit board should be within the scope of the present application.
  • the shielding cover of the circuit structure in the mobile terminal disclosed in this embodiment can be simultaneously engaged with the two shielding frames, so the volume is relatively small, so that the volume of the mobile terminal can be indirectly reduced as a whole.
  • the first flap of the shielding cover in the circuit board structure can be fixedly coupled with the first shielding frame, and the second folding plate of the shielding cover can be fixedly coupled with the second shielding frame, so that one shielding cover can simultaneously be combined with two
  • the shielding frame is fastened and connected, so that the shielding device between the two circuit boards includes only two shielding frames and one shielding cover.
  • Such shielding device not only reduces the manufacturing cost, but also significantly reduces the volume of the finished mobile terminal. .
  • the steps of a method or algorithm described in connection with the embodiments disclosed herein can be implemented directly in hardware, a software module executed by a processor, or a combination of both.
  • the software module can be placed in random access memory (RAM), memory, read only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, removable disk, CD-ROM, or technical field. Any other form of storage medium known.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Power Engineering (AREA)
  • Telephone Set Structure (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

本发明公开了一种屏蔽盖及一种移动终端。所述屏蔽盖包括基板(10)、多个第一折板(11)和多个第二折板(12),所述第一折板(11)和第二折板(12)在所述基板(10)周边交替设置,所述第一折板(11)和第二折板(12)分别与所述基板(10)垂直,并折向所述基板(10)的不同侧。应用本发明的屏蔽盖及移动终端,可以将屏蔽盖一侧的第一折板(11)与一个屏蔽框(42, 43)配合固定,从而使得两个电路板之间的屏蔽装置只包括两个屏蔽框一个屏蔽盖,相对于现有技术中包括两个屏蔽框、两个屏蔽盖及一层导电泡棉的屏蔽装置,大大减少了物料的使用,不仅降低了制造成本,而且也明显缩小了电路板结构成品的体积。

Description

一种屏蔽盖及一种移动终端
本申请要求于2013年09月09日提交中国专利局、申请号为201320560418.9、发明名称为“一种屏蔽盖及一种移动终端”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。
技术领域
本实用新型涉及电气产品制造技术,更具体的说,是涉及一种屏蔽盖及一种移动终端。
背景技术
在电气产品的制造技术领域,存在一种主电路板和副电路板的堆叠结构,这种结构在制造时,需要分别为主电路板和副电路板配置专用的屏蔽盖和屏蔽框,以实现主、副电路板之间信号的屏蔽隔离。其中,屏蔽框作为屏蔽盖的附着框架,能够将其负责屏蔽的电路板包围起来;屏蔽盖则覆盖扣合在屏蔽框的外部。除此之外,通常情况下,为了更好的满足上述堆叠结构的射频接地性能,主电路板的屏蔽盖和副电路板的屏蔽盖之间会粘贴设置导电泡棉。
综上所述可以看出,现有技术中,主、副电路板堆叠结构之间的屏蔽设计方案,需要在主电路板和副电路板之间依次设置主电路板屏蔽框、主电路板屏蔽盖、导电泡棉、副电路板屏蔽盖和副电路板屏蔽框,这样的结构设计使用的物料比较多,因此成本比较高,而且制成的电路板堆叠结构体积也比较大。
发明内容
有鉴于此,本实用新型提供了一种屏蔽盖及一种移动终端,以克服现有技术中电路板堆叠结构的屏蔽方案成本高和成品体积大的问题。
为实现上述目的,本实用新型提供如下技术方案:
一种屏蔽盖,所述屏蔽盖的第一个方面包括基板、设置在所述基板周边的多个第一折板及多个第二折板;所述第一折板和所述第二折板在所述基板周边交替设置;所述第一折板和所述第二折板分别与所述基板垂直,并折向所述基板的不同侧。
结合第一方面,在第一方面的第一种可能的实现方式中,还包括:
设置在所述基板板面上的第一折板或第二折板。
可选的,所述第一折板和所述第二折板的宽度取值范围为4mm-8mm。
可选的,所述基板、第一折板和第二折板的材料为金属。
可选的,所述第一折板和所述第二折板上设置有凸向所述基板侧的凸起结构。
可选的,所述凸起结构为直径取值范围为0.5mm-0.7mm的半圆体。
结合第一方面,在第一方面的第二种可能的实现方式中,所述屏蔽盖还包括:
与所述第一折板围绕成的形状相对应的第一屏蔽框;
与所述第二折板围绕成的形状相对应的第二屏蔽框。
可选的,所述第一屏蔽框上设置有与所述第一折板上的凸起结构对应的圆孔;所述第二屏蔽框上设置有与所述第二折板上的凸起结构对应的圆孔。
本实用新型还公开了一种移动终端,所述移动终端的第一方面包括第一电路板、第二电路板及设置在所述第一电路板和所述第二电路板之间的屏蔽装置;所述屏蔽装置包括第一屏蔽框、第二屏蔽框和屏蔽盖;所述屏蔽盖为上面所述的屏蔽盖。
可选的,所述移动终端为手机、平板电脑、计算机或机顶盒。
经由上述的技术方案可知,与现有技术相比,本实用新型实施例公开了一种屏蔽盖及一种移动终端,所述屏蔽盖包括基板、多个第一折板和多个第二折板,所述第一折板和第二折板在所述基板周边交替设置,所述第一折板和第二折板分别与所述基板垂直,并折向所述基板的不同侧。通过本实用新型实施例公开的屏蔽盖及移动终端,可以将屏蔽盖一侧的第一折板与一个屏蔽框配合固定,并将屏蔽盖另一侧的第二折板与另一个屏蔽框配合固定,从而使得两个电路板之间的屏蔽装置只包括两个屏蔽框及一个屏蔽盖,相对于现有技术中包括两个屏蔽框、两个屏蔽盖及一层导电泡棉的屏蔽结构,大大减少了物料的使用,不仅降低了制造成本,而且也明显缩小了电路板结构成品的体积。
附图说明
为了更清楚地说明本实用新型实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本实用新型的实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据提供的附图获得其他的附图。
图1为本实用新型实施例公开的屏蔽盖结构示意图;
图2为本实用新型实施例公开的屏蔽盖俯视图;
图3为本实用新型实施例公开的屏蔽盖侧视图;
图4为本实用新型实施例公开的移动终端的结构示意图。
具体实施方式
下面将结合本实用新型实施例中的附图,对本实用新型实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本实用新型一部分实施例,而不是全部的实施例。基于本实用新型中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本实用新型保护的范围。
图1为本实用新型实施例公开的屏蔽盖结构示意图,参见图1所示,所述屏蔽盖可以包括:
基板10、设置在所述基板周边的多个第一折板11及多个第二折板12;所述第一折板11和所述第二折板12在所述基板10周边交替设置;所述第一折板11和所述第二折板12分别与所述基板10垂直,并折向所述基板10的不同侧。
其中,所述第一折板11和所述第二折板12的宽度取值范围可以为4mm-8mm,即折板与所述基板10的连接长度为可以位于4mm-8mm之间的任意一个数值。当然,所述第一折板11和所述第二折板12的尺寸并没有固定限制,所述第一折板11和所述第二折板12的宽度可以不同,且每一个第一折板11或第二折板12的尺寸也可以不同。具体的,折板的尺寸可以根据所述屏蔽盖需要扣合连接的屏蔽框的大小及形状来确定,并不一定局限于4mm-8mm之间。
其中,所述基板10、第一折边11和第二折边12可以为金属材料,这样,所述屏蔽盖一方面可能屏蔽隔离不同电路板之间的干扰信号,也可以满足射频接地的要求。当然,所述基板10、第一折边11和第二折边12的材料也不固定限制为金属材料,也可以用塑胶材料喷涂屏蔽漆来替代金属材料。
其中,所述第一折边11和所述第二折边12上可以设置有凸向所述基板侧的凸起结构13。带有所述凸起结构13的屏蔽盖的结构示意图可以参见图2,图2为本实用新型实施例公开的另一种屏蔽盖的结构示意图。
所述凸起结构13可以和与所述屏蔽盖大小及形状相应的屏蔽框上的圆孔相配合,使所述屏蔽盖与屏蔽框固定连接在一起。通常情况下,所述凸起结构13采用冲模成型的方式形成,因此所述凸起结构13一般为半圆体,内腔为空。所述凸起结构13的直径一般在0.5mm-0.7mm范围内,其直径尺寸并没有固定限制,例如也可以是0.45mm或 0.75mm,具体可以根据用户要求来设计。当然,所述凸起结构13的形状也不固定限制为半圆体,也可以为现有技术能够实现制成的其他形状。
本实施例中,所述屏蔽盖的第一折板可以与一个屏蔽框配合固定,所述屏蔽盖的第二折板可以与另一个屏蔽框配合固定,从而使得一个屏蔽盖可以同时与两个屏蔽框进行扣合连接,这样,两个电路板之间的屏蔽装置只包括两个屏蔽框及一个屏蔽盖,相对于现有技术中包括两个屏蔽框、两个屏蔽盖及一层导电泡棉的屏蔽装置,大大减少了物料的使用,不仅降低了制造成本,而且也明显缩小了电路板结构成品的体积。
图3为本实用新型实施例公开的又一种屏蔽盖的结构示意图,参见图3所示,所述屏蔽盖可以包括:
基板10、设置在所述基板10周边的多个第一折板11及多个第二折板12;所述第一折板11和所述第二折板12在所述基板10周边交替设置;所述第一折板11和所述第二折板12分别与所述基板10垂直,并折向所述基板10的不同侧;还包括设置在所述基板10板面上的第一折板11或第二折板12。
在所述屏蔽盖需要扣合连接的两个屏蔽框的大小及形状相同时,所述屏蔽盖上的第一折板11和第二折板12可以只设置在所述基板10的周边。但是,当所述屏蔽盖需要扣合连接的两个屏蔽框的大小和或形状同时,除了设置在所述基板10周边的第一折边11和第二折边12外,为了保证屏蔽盖和两个屏蔽框的固定效果,可以在所述基板10的板面上,局部翻起一个或多个第一折边11和/或第二折边12,以和位于所述基板10板面上的屏蔽框的边界进行扣合。
在其他的实施例中,所述屏蔽盖除了基板、多个第一折板和多个第二折板外,还可以包括与所述屏蔽盖配合使用的屏蔽框。具体的,可以是与所述第一折板围绕成的形状相对应的第一屏蔽框,以及与所述第二折板围绕成的形状相对应的第二屏蔽框。
其中,所述第一屏蔽框上可以设置有与所述第一折板上的凸起结构对应的圆孔,所述第二屏蔽框上可以设置有与所述第二折板上的凸起结构对应的圆孔,以实现所述屏蔽盖分别与所述第一屏蔽框和所述第二屏蔽框之间的紧密扣合连接。
本实施例中,所述屏蔽盖的第一折板可以与一个屏蔽框配合固定,所述屏蔽盖的第二折板可以与另一个屏蔽框配合固定,从而使得一个屏蔽盖可以同时与两个屏蔽框进行扣合连接,这样,两个电路板之间的屏蔽装置只包括两个屏蔽框及一个屏蔽盖,相对于现有技术中包括两个屏蔽框、两个屏蔽盖及一层导电泡棉的屏蔽装置,大大减少了物料的使用,不仅降低了制造成本,而且也明显缩小了电路板结构成品的体积。此外,本实施例公开的屏蔽盖中,基板的板面上也可以设置有第一折板或第二折板,从而针对不同 大小或形状的屏蔽板,也能够实现紧密的扣合连接。
除上述的屏蔽盖外,本实用新型还公开了一种移动终端。图4为本实用新型实施例公开的移动终端的结构示意图,参见图4所示,所述移动终端包括第一电路板41、第二电路板(图4中未示出)及设置在所述第一电路板41和所述第二电路板之间的屏蔽装置;所述屏蔽装置包括第一屏蔽框42、第二屏蔽框43和屏蔽盖;所述屏蔽盖为上述实施例公开的屏蔽盖,包括基板、第一折板11和第二折板12。
其中,所述移动终端可以是但不限定为手机、平板电脑、计算机或机顶盒。当然,凡是可能包括双层电路板的移动终端都应在本申请的保护范围内。本实施例公开的移动终端中的电路结构的屏蔽盖可以同时与两个屏蔽框进行扣合,因此体积比较小,从而能够间接的从整体上减小移动终端的体积。
所述电路板结构中的屏蔽盖的第一折板可以与第一屏蔽框配合固定,所述屏蔽盖的第二折板可以与第二屏蔽框配合固定,从而使得一个屏蔽盖可以同时与两个屏蔽框进行扣合连接,这样,两个电路板之间的屏蔽装置只包括两个屏蔽框及一个屏蔽盖,这样的屏蔽装置不仅降低了制造成本,而且也明显缩小了移动终端成品的体积。
本说明书中各个实施例采用递进的方式描述,每个实施例重点说明的都是与其他实施例的不同之处,各个实施例之间相同相似部分互相参见即可。对于实施例公开的装置而言,由于其与实施例公开的方法相对应,所以描述的比较简单,相关之处参见方法部分说明即可。
还需要说明的是,在本文中,诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来,而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且,术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含,从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素,而且还包括没有明确列出的其他要素,或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下,由语句“包括一个……”限定的要素,并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。
结合本文中所公开的实施例描述的方法或算法的步骤可以直接用硬件、处理器执行的软件模块,或者二者的结合来实施。软件模块可以置于随机存储器(RAM)、内存、只读存储器(ROM)、电可编程ROM、电可擦除可编程ROM、寄存器、硬盘、可移动磁盘、CD-ROM、或技术领域内所公知的任意其它形式的存储介质中。
对所公开的实施例的上述说明,使本领域专业技术人员能够实现或使用本实用新型。对这些实施例的多种修改对本领域的专业技术人员来说将是显而易见的,本文中所定义的一般原理可以在不脱离本实用新型的精神或范围的情况下,在其它实施例中实现。因此,本实用新型将不会被限制于本文所示的这些实施例,而是要符合与本文所公开的原理和新颖特点相一致的最宽的范围。

Claims (10)

  1. 一种屏蔽盖,其特征在于,包括基板、设置在所述基板周边的多个第一折板及多个第二折板;所述第一折板和所述第二折板在所述基板周边交替设置;所述第一折板和所述第二折板分别与所述基板垂直,并折向所述基板的不同侧。
  2. 根据权利要求1所述的屏蔽盖,其特征在于,还包括:
    设置在所述基板板面上的第一折板或第二折板。
  3. 根据权利要求1所述的屏蔽盖,其特征在于,所述第一折板和所述第二折板的宽度取值范围为4mm-8mm。
  4. 根据权利要求1所述的屏蔽盖,其特征在于,所述基板、第一折板和第二折板的材料为金属。
  5. 根据权利要求1所述的屏蔽盖,其特征在于,所述第一折板和所述第二折板上设置有凸向所述基板侧的凸起结构。
  6. 根据权利要求5所述的屏蔽盖,其特征在于,所述凸起结构为直径取值范围为0.5mm-0.7mm的半圆体。
  7. 根据权利要求5所述的屏蔽盖,其特征在于,还包括:
    与所述第一折板围绕成的形状相对应的第一屏蔽框;
    与所述第二折板围绕成的形状相对应的第二屏蔽框。
  8. 根据权利要求6所述的屏蔽盖,其特征在于,所述第一屏蔽框上设置有与所述第一折板上的凸起结构对应的圆孔;所述第二屏蔽框上设置有与所述第二折板上的凸起结构对应的圆孔。
  9. 一种移动终端,其特征在于,包括第一电路板、第二电路板及设置在所述第一电路板和所述第二电路板之间的屏蔽装置;所述屏蔽装置包括第一屏蔽框、第二屏蔽框和屏蔽盖;所述屏蔽盖为权利要求1-6任一项所述的屏蔽盖。
  10. 根据权利要求9所述的移动终端,其特征在于,所述移动终端为手机、平板电脑、计算机或机顶盒。
PCT/CN2014/086119 2013-09-09 2014-09-09 一种屏蔽盖及一种移动终端 WO2015032359A1 (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106412165A (zh) * 2016-11-22 2017-02-15 努比亚技术有限公司 一种屏蔽组件和移动终端
CN113314872A (zh) * 2020-02-27 2021-08-27 庆虹电子(苏州)有限公司 电连接器的传输片

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203590673U (zh) * 2013-09-09 2014-05-07 华为终端有限公司 一种屏蔽盖及一种移动终端
CN106890007A (zh) * 2017-04-18 2017-06-27 深圳开立生物医疗科技股份有限公司 一种用于便携式彩超的机身、便携式彩超
CN112888237A (zh) * 2021-01-21 2021-06-01 重庆蓝岸通讯技术有限公司 用于电子产品装置的多用途散热屏蔽防静电结构
CN115884583A (zh) * 2021-09-30 2023-03-31 荣耀终端有限公司 电路板组件以及电子设备
CN115417480B (zh) * 2022-08-12 2024-03-19 金剑环保集团有限公司 一种方便拼装的不锈钢折板

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020126466A1 (en) * 2001-03-09 2002-09-12 Kenji Suzuki Radio-frequency apparatus
CN1838869A (zh) * 2005-12-14 2006-09-27 惠州Tcl移动通信有限公司 一种屏蔽罩
CN101170890A (zh) * 2006-10-25 2008-04-30 鸿富锦精密工业(深圳)有限公司 屏蔽装置及使用所述屏蔽装置的电子产品
CN201303485Y (zh) * 2008-10-27 2009-09-02 深圳华为通信技术有限公司 一种屏蔽罩和一种组件
CN101867627A (zh) * 2009-12-22 2010-10-20 康佳集团股份有限公司 一种手机基带屏蔽盖装置
CN102348367A (zh) * 2010-08-04 2012-02-08 深圳富泰宏精密工业有限公司 屏蔽罩及应用该屏蔽罩的电子装置
CN203590673U (zh) * 2013-09-09 2014-05-07 华为终端有限公司 一种屏蔽盖及一种移动终端

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020126466A1 (en) * 2001-03-09 2002-09-12 Kenji Suzuki Radio-frequency apparatus
CN1838869A (zh) * 2005-12-14 2006-09-27 惠州Tcl移动通信有限公司 一种屏蔽罩
CN101170890A (zh) * 2006-10-25 2008-04-30 鸿富锦精密工业(深圳)有限公司 屏蔽装置及使用所述屏蔽装置的电子产品
CN201303485Y (zh) * 2008-10-27 2009-09-02 深圳华为通信技术有限公司 一种屏蔽罩和一种组件
CN101867627A (zh) * 2009-12-22 2010-10-20 康佳集团股份有限公司 一种手机基带屏蔽盖装置
CN102348367A (zh) * 2010-08-04 2012-02-08 深圳富泰宏精密工业有限公司 屏蔽罩及应用该屏蔽罩的电子装置
CN203590673U (zh) * 2013-09-09 2014-05-07 华为终端有限公司 一种屏蔽盖及一种移动终端

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106412165A (zh) * 2016-11-22 2017-02-15 努比亚技术有限公司 一种屏蔽组件和移动终端
CN106412165B (zh) * 2016-11-22 2020-06-16 亳州鼎源科技信息有限公司 一种屏蔽组件和移动终端
CN113314872A (zh) * 2020-02-27 2021-08-27 庆虹电子(苏州)有限公司 电连接器的传输片

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