WO2015015850A1 - Module and method for manufacturing same - Google Patents

Module and method for manufacturing same Download PDF

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Publication number
WO2015015850A1
WO2015015850A1 PCT/JP2014/061524 JP2014061524W WO2015015850A1 WO 2015015850 A1 WO2015015850 A1 WO 2015015850A1 JP 2014061524 W JP2014061524 W JP 2014061524W WO 2015015850 A1 WO2015015850 A1 WO 2015015850A1
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WO
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Prior art keywords
lead
module
connection
leads
recess
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PCT/JP2014/061524
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French (fr)
Japanese (ja)
Inventor
順一 粕谷
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株式会社村田製作所
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Publication of WO2015015850A1 publication Critical patent/WO2015015850A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561—Batch processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Definitions

  • the present invention includes an electronic component, a lead frame having a plurality of leads connected to the electronic component, and a resin package that covers the electronic component and has a mounting surface on one side, and a connection surface provided on each lead
  • the present invention relates to a surface-mounting type module that is exposed to a mounting surface and forms an external connection terminal, and a manufacturing method thereof.
  • Patent Document 1 discloses a module 500 shown in FIGS. 12 and 13.
  • the module 500 includes a semiconductor chip 501 (electronic component), a lead frame 502 on which the semiconductor chip 501 is mounted and connected, and a semiconductor chip 501 that covers and is mounted on one side. And a resin package 503 having a surface 503a.
  • 12 is a perspective view of a conventional module as viewed from the mounting surface side
  • FIG. 13 is a cross-sectional view showing a state in which the module of FIG. 12 is mounted on a substrate.
  • the lead frame 502 includes a stage 504 on which a semiconductor chip 501 (electronic component) is mounted, and a plurality of leads 505 connected to the semiconductor chip 501 mounted on the stage 504 by bonding wires W. Further, the connection surface 505 a provided on each lead 505 is exposed so as to form the same surface as the mounting surface 503 a of the resin package 503, thereby configuring the external connection terminal 506 of the module 500.
  • each lead 505 arranged radially around the stage 504 along the outer periphery of the resin package 503 has a lead side surface 505b that is continuous with the connection surface 505a and forms the same surface as the package side surface 503b of the resin package 503. is doing. Further, a concave portion 505c is formed at a boundary portion between the lead side surface 505b and the connection surface 505a, and the inner side surface is plated. Therefore, as shown in FIG. 13, when the external connection terminal 506 of the module 500 is connected to the board MB using the solder H, the solder H enters the recess 505 c, thereby soldering the lead side surface 505 b of each lead 505. Fillets are easily formed. Therefore, the mounting strength of the module 500 on the board MB is improved by forming the solder fillet.
  • the module 500 is manufactured as follows, for example. That is, first, after the assembly of the modules 500 is formed, the assembly is cut by a cutting means such as a dicing blade and separated into individual modules, whereby the module 500 is manufactured. Specifically, an assembly of lead frames 502 made of a thin conductive plate is prepared. The assembly of the lead frames 502 is a combination of the lead frames 502 arranged in a matrix with a certain regularity.
  • the semiconductor chip 501 is mounted on the stage 504 of each lead frame 502, and the semiconductor chip 501 and each lead 505 of the lead frame 502 on which the semiconductor chip 501 is mounted are wired using wires W. Is done.
  • a resin layer such as an epoxy resin is filled so as to cover the semiconductor chip 501 to form a resin layer, whereby an assembly of the module 500 is formed.
  • the resin layer of the assembly of the modules 500 is cut into individual modules 500 by being cut by a cutting means such as a dicing blade along cutting lines set so as to surround the modules 500.
  • connection surface 505a is formed at a position corresponding to the cutting line of each lead 505 included in each lead frame 502, and a bottomed via hole is formed on the connection surface 505a so as to straddle the cutting line. Therefore, when the assembly of the modules 500 is separated into individual modules 500, the bottomed via holes formed in the connection surfaces 505a of the respective leads 505 are cut along the cutting lines, so that the resin package 503 is obtained.
  • a lead side surface 505b of each lead 505 is exposed and formed on the package side surface 503b, and a recess 505c is formed at a boundary portion between the lead side surface 505b and the connection surface 505a.
  • a bottomed via hole is formed in a portion where the lead 505 is cut during singulation, and the lead 505 is formed with a thin thickness at the cutting position, so that burrs are generated during cutting. It is suppressed.
  • the burrs generated enter the recess 505c, so that the burrs do not get in the way when the module 500 is connected to the substrate MB, so that the module 500 is inclined and connection failure occurs. Can be prevented.
  • Japanese Patent No. 4004445 paragraphs 0019-0039, FIGS. 1-8, etc.
  • the following problems may occur. That is, when a bubble is generated in the recess 505c, the bubble may be caught on the inner surface on the upper side of the recess 505c shown in the region surrounded by the dotted line in FIG. 13, and the bubble may not be discharged from the recess 505c. In this case, voids are generated in the connection portion of the external connection terminal 506 of the module 500 and the board MB by the solder H, so that the mounting strength of the module 500 to the board MB and its connection reliability are deteriorated.
  • the present invention has been made in view of the above-described problems, and provides a module capable of suppressing the generation of voids in a connection portion made of solder, and a technique capable of easily manufacturing the module.
  • the purpose is to do.
  • a module of the present invention includes an electronic component, a lead frame having a plurality of leads connected to the electronic component, and a resin package that covers the electronic component and has a mounting surface on one side. And a connection surface provided on each of the leads is exposed to the mounting surface to form an external connection terminal. At least one of the leads is continuous to the connection surface. And a lead side surface exposed on the package side surface of the resin package, and a concave portion recessed in a boundary portion between the lead side surface and the connection surface, and an inner side surface of the concave portion being directed toward the connection surface. It is characterized by being inclined.
  • At least one of the leads having a connection surface that is exposed on the mounting surface of the resin package and forms an external connection terminal is continuous with the connection surface exposed on the mounting surface of the resin package.
  • a lead side surface exposed on the package side surface of the package is provided.
  • a concave portion is provided in a boundary portion between the lead side surface exposed on the package side surface and the connection surface.
  • the inner side surface of the recess provided in the boundary portion between the lead side surface and the connection surface is formed so as to be inclined from the lead side surface side toward the connection surface.
  • the lead side is directed to the connection surface. Bubbles can move from the connection surface side toward the lead side surface along the inner side surface of the concave portion that is inclined along with it. Therefore, the bubbles generated in the recesses can be easily discharged from the opening on the side surface of the lead of the recess, so that it is possible to suppress the generation of voids in the connection portion by solder between the external connection terminal and the external substrate.
  • the inner side surface of the concave portion may be plated.
  • solder fillet is provided on the side of the lead where a recess is formed at the boundary between the external connection terminal and the substrate. It can be reliably formed.
  • the module manufacturing method of the present invention is a surface mounting type module manufacturing method in which a plurality of module regions are provided, and a plurality of leads connected to electronic components are arranged in each of the module regions.
  • At least one of the leads has the connection surface exposed on the mounting surface of the resin layer so as to straddle the cutting line, and a recess is formed on the connection surface so as to straddle the cutting line.
  • the lead side surface exposed to the package side surface of the resin package is formed so as to be continuous with the connection surface by being cut along the cutting line at the position of the depression.
  • a concave portion is formed at a boundary portion between the side surface of the lead and the connection surface, and the inner side surface of the concave portion is inclined toward the connection surface.
  • an electronic component is mounted in each module region of the lead frame and is connected to a plurality of leads arranged in the module region in which the electronic component is mounted.
  • a resin layer having a mounting surface where the connection surface provided on each lead is exposed as an external connection terminal is formed.
  • at least one of the leads has a connection surface exposed on the mounting surface of the resin layer so as to straddle the cutting line set so as to surround each module region, and straddle the cutting line on the connecting surface.
  • a depression is formed on the surface.
  • the recess formed on the connection surface of the lead so as to straddle the cutting line is cut along the cutting line. Is done. Therefore, the lead side surface exposed on the package side surface of the resin package is formed to be continuous with the connection surface, and a recess is formed at the boundary portion between the lead side surface and the connection surface. Further, the inner surface of the recess is formed so as to be inclined from the side surface of the lead toward the connection surface. Therefore, the inner surface of the recess of the lead connecting surface provided across the cutting line is formed in an appropriate shape, so that the inclination of the inner surface of the recess provided at the boundary portion with the connecting surface of the lead side surface is appropriate.
  • the module formed in (1) can be easily manufactured in substantially the same process as the conventional manufacturing method.
  • a plating step of plating at least the connection surface and the inner surface of the recess of the lead frame may be further provided before the singulation step.
  • the connection surface of the lead plated in the plating process and the inner surface of the recess are reliable. It will be in the state plated by. Therefore, the side surface of the lead formed by the singulation process is not plated, but the inner surface of the recess provided at the boundary portion with the connection surface of the side surface of the lead is in a plated state.
  • a solder fillet is reliably formed on the side surface of the lead. Therefore, since the step of plating the side surfaces of the leads is not necessary after the singulation step to reliably form the solder fillet, the manufacturing process can be simplified and the manufacturing cost can be reduced. it can.
  • the lead frame having the leads in which the depressions are formed by press working may be formed.
  • the lead frame having the leads in which the depressions are formed by etching may be formed.
  • the present invention when a module is mounted on an external substrate or the like using solder, if bubbles are generated in the recess formed at the boundary between the lead side surface and the connection surface, The bubbles are discharged out of the recesses as the bubbles move toward the side surface of the lead along the side surface, so that it is possible to suppress the formation of voids in the solder connecting the external connection terminal and the external substrate. .
  • FIG. 2 is a diagram showing an example of a method for manufacturing the module of FIG. 1, wherein (a) to (e) show different processes. It is a top view which shows a lead frame.
  • FIG. 7 is a diagram showing a method of manufacturing the lead frame of FIG. 6 by press working, and (a) to (c) show different states.
  • FIG. 7 is a plan view showing a state in which electronic components are mounted on the lead frame of FIG.
  • FIG. 9 is a diagram showing a modification of the shape of the inner surface of the recess, and (a) to (d) show different shapes. It is the perspective view which looked at the conventional module from the mounting surface side. It is sectional drawing which shows the state in which the module of FIG. 12 was mounted in the board
  • FIG. 1 is a cross-sectional view showing a state in which a module according to a first embodiment of the present invention is mounted on a substrate
  • FIG. 2 is an enlarged view of a main part of the module of FIG. 1
  • FIG. 3 is a main part of the module of FIG.
  • FIG. 4 is a side view showing a main part of the module shown in FIG.
  • FIG. 5 is a view showing an example of a method of manufacturing the module of FIG. 1, and (a) to (e) show different processes.
  • FIG. 6 is a plan view showing the lead frame
  • FIG. 7 is a view showing a method of manufacturing the lead frame of FIG. 6 by press working
  • FIG. 8 is a plan view showing a state where electronic components are mounted on the lead frame of FIG. 6 in the mounting process.
  • 2 to 4 are diagrams each showing a region surrounded by a dotted line of the module of FIG.
  • the module 1 includes an electronic component 2 composed of various semiconductor chips, a lead frame 3, and a resin package 4, and is mounted by being electrically connected to the substrate MB using solder H. It is configured as a surface mount type.
  • the lead frame 3 is formed of a metal material such as Cu, Cu alloy, or Fe—Ni alloy, and includes a stage 31 on which the electronic component 2 is mounted and a plurality of leads 32.
  • the electronic component 2 is mounted on the stage 31 in a face-up state by being bonded to the stage 31 using a bonding agent B such as an Ag paste.
  • a connection terminal (not shown) provided on the upper surface of the electronic component 2 mounted on the stage 31 and each lead 32 are electrically connected by using a general wire bonding wire W formed of Au or the like. Connected.
  • the resin package 4 is formed of a general resin for molding such as epoxy resin, and covers the electronic component 2 and has a mounting surface 41 on one side. Further, the lower surface 31 a of the stage 31 and the connection surface 33 provided on each lead 32 are exposed on the mounting surface 41 of the resin package 4. Further, the external connection terminals 5 of the module 1 are constituted by the connection surfaces 33 of the leads 32 exposed on the mounting surface 41 of the resin package 4.
  • the mounting surface of the resin package 4 is such that the lower surface 31 a of the stage 31 and the connection surface 33 provided on each lead 32 form the same surface as the mounting surface 41 of the resin package 4. 41 is exposed.
  • each lead 32 has a lead side surface 34 that is exposed to the package side surface 42 of the resin package 4 continuously to the connection surface 33 and forms the same surface as the package side surface 42.
  • a concave portion 35 is provided in a boundary portion between the lead side surface 42 and the connection surface 33.
  • the inner side surface 36 of the recess 35 provided at the boundary portion between the lead side surface 34 and the connection surface 33 is formed so as to be inclined from the lead side surface 34 side toward the connection surface 33. That is, the inner side surface 36 forms an inclined surface that is inclined monotonously from the lead side surface 34 side toward the connection surface 33. Accordingly, the inner side surface 36 is formed such that an angle ⁇ formed between the lead side surface 34 and a surface of the inner side surface 36 that contacts the lead side surface 34 satisfies 90 ° ⁇ ⁇ 180 °.
  • the inner surface 36 of the recess 35 is plated with Sn—Pb, Sn—Ag, Sn, Sn—Bi, Au, Ag, or the like.
  • the lower surface 31 a of the stage 31 is also exposed on the mounting surface 41 of the resin package 4 and connected to the substrate MB by the solder H. Therefore, the heat of the electronic component 2 is efficiently radiated to the substrate MB side through the stage 31.
  • the electronic component 2 is composed of various semiconductor chips that are mounted face up.
  • the electronic component 2 is configured by various semiconductor chips that are mounted face down, various MEMS, various ICs, and the like. It may be configured.
  • the electronic component 2 may be connected to the stage 31 using ultrasonic vibration, or the connection terminal of the electronic component 2 may be directly connected to each lead 32 using ultrasonic vibration or solder H. .
  • the modules 1 are manufactured by being separated into individual pieces.
  • a lead frame 6 that is an assembly of lead frames 3 is prepared (preparation step).
  • the lead frame 6 has a plurality of module regions 61, and a stage 31 on which the electronic component 2 is mounted and a plurality of leads 32 to which the electronic component 2 is connected are arranged in each module region 61.
  • the lead frame 6 includes a rectangular frame-shaped frame member 62, and each stage 31 and each lead 32 arranged in the frame member 62 are connected to the frame member 62 by suspension leads 63.
  • the cutting line CL shown with the broken line in the same figure shows the cutting position of the lead frame 6 which is the assembly of the lead frames 3 when the assembly of the plurality of modules 1 is separated. Yes.
  • each lead 32 is provided with a connection surface 33 exposed on the mounting surface 41 of the resin package 4 so as to straddle the cutting line CL.
  • a recess 64 is formed in the connection surface 33 so as to straddle the cutting line CL.
  • a press die 66 is pressed against a thin conductive plate 65 (for example, a Cu plate having a maximum thickness of about 0.2 mm).
  • the lead frame 6 having the leads 32 in which the depressions 64 are formed so as to straddle the cutting line CL is formed.
  • FIG. 7B when the press work is completed, the press die 66 pressed against the conductive plate 65 is removed to complete the lead frame 6 (FIG. 7C).
  • the electronic component 2 is mounted on the stage 31 disposed in each module area 61 of the lead frame 6 using Ag paste or the like. Further, the electronic component 2 mounted on the stage 31 and the plurality of leads 32 arranged in the module region 61 on which the electronic component 2 is mounted are connected using the wire W (mounting process).
  • thermosetting resin for molding is filled over the entire other side of the lead frame 6 so as to cover each electronic component 2.
  • an assembly of a plurality of modules 1 is formed (sealing process).
  • the lower surface 31 a of the stage 31 is exposed on the mounting surface 41 of the resin layer 7 so as to form the same surface as the mounting surface 41.
  • the resin layer 7 is cut along a cutting line CL set so as to surround each module region 61 by a general cutting device 8 such as a dicer (pieces). Detachment step). Then, the assembly of the plurality of modules 1 is separated into a plurality of resin packages 4, whereby the module 1 shown in FIG. 5E is completed (individualization step).
  • each lead 32 is cut along the cutting line CL at the position of the depression 64, so that the lead side surface 34 that forms the same surface as the package side surface 42 of the resin package 4 becomes the connection surface 33. It is formed to be continuous. Further, a recess 35 is formed at a boundary portion between the lead side surface 34 and the connection surface 33. Of the inner surface of the recess 64 cut along the cutting line CL, the shape of the portion outside the width of the dicing blade included in the cutting device 8 is appropriately formed, so that the inner surface of the recess 35 is It is formed so as to be inclined from the side surface 34 of the lead toward the connection surface 33.
  • connection surface 33 of the lead frame 6 and the inner surface of the recess 64 are plated at an appropriate timing before the singulation process (plating process).
  • each lead 32 having the connection surface 33 that is exposed to form the same surface as the mounting surface 41 of the resin package 4 and forms the external connection terminal 5 is formed on the mounting surface of the resin package 4.
  • 41 has a lead side surface 34 that is continuous with the connection surface 33 exposed at 41 and forms the same surface as the package side surface 42 of the resin package 4.
  • a recessed portion 35 is provided at a boundary portion between the lead side surface 34 exposed on the package side surface 42 and the connection surface 33.
  • the inner side surface 36 of the recess 35 provided at the boundary portion between the lead side surface 34 and the connection surface 33 is formed so as to be inclined from the lead side surface 34 side toward the connection surface 33.
  • the connection is made from the lead side surface 34 side. Air bubbles can move from the connection surface 33 side toward the lead side surface 34 along the inner side surface 36 of the recess 35 that inclines toward the surface 33. Accordingly, since the bubbles generated in the recess 35 are easily discharged from the opening on the lead side surface 34 side of the recess 35, it is possible to suppress the generation of voids in the solder H connecting the external connection terminal 5 and the substrate MB. .
  • the inner side surface 36 of the recess 35 is plated, the wettability of the solder H on the inner side surface 36 is improved. Therefore, the solder H is easily filled in the recess 35. Therefore, when the module 1 is mounted on the substrate MB using the solder H, the lead side surface 34 side where the concave portion 35 is formed at the boundary portion between the connection surface 33 in the connection portion between the external connection terminal 5 and the substrate MB. A solder fillet can be reliably formed.
  • the electronic component 2 is mounted in each of the module regions 61 of the lead frame 6.
  • Each electronic component 2 is connected to the plurality of leads 32 arranged in the module area 61 on which each electronic component 2 is mounted by wire bonding using wires W.
  • the resin layer 7 having the mounting surface 41 exposed so that the connection surface 33 provided on each lead 32 forms the same surface as the external connection terminal 5 is formed.
  • Each lead 32 has a connection surface 33 exposed on the mounting surface 41 of the resin layer 7 so as to straddle the cutting line CL set so as to surround each module region 61, and the cutting line CL is formed on the connection surface 33.
  • a depression 64 is formed so as to straddle.
  • the resin layer 7 is cut along the cutting line CL to be singulated into a plurality of resin packages 4, a depression formed on the connection surface 33 of each lead 32 so as to straddle the cutting line CL. 64 is cut along the cutting line CL. Therefore, the lead side surface 34 that forms the same surface as the package side surface 42 of the resin package 4 is formed so as to be continuous with the connection surface 33, and the recess 35 is formed at the boundary portion between the lead side surface 34 and the connection surface 33. . Further, the inner side surface 36 of the recess 35 is formed so as to be inclined from the lead side surface 34 side toward the connection surface 33.
  • the inner surface of the recess 64 of the connection surface 33 of each lead 32 provided across the cutting line CL is formed in an appropriate shape, so that the recess provided in the boundary portion between the lead side surface 34 and the connection surface 33.
  • the module 1 in which the inclination of the inner side surface 36 of 35 is appropriately formed can be easily manufactured by substantially the same process as the conventional manufacturing method.
  • connection surface 33 of the lead frame 6 and the inner surface of the recess 64 are plated in a plating process. Therefore, after each lead 32 is cut in the singulation step, at least the connection surface 33 and the concave portion of each lead 32 plated in the plating step among the surfaces of each lead 32 exposed on the surface of the resin package 4.
  • the inner surface 36 of 35 is surely plated. Therefore, the lead side surface 34 formed by the singulation process is not plated, but the inner side surface 36 of the recess 35 provided at the boundary portion between the lead side surface 34 and the connection surface 33 is plated. Therefore, when the module 1 is connected to the board MB by solder, a solder fillet is reliably formed on the side of the lead side surface 34. Therefore, since the process of plating the lead side surface 34 is not required after the singulation process to reliably form the solder fillet, the manufacturing process can be simplified and the manufacturing cost can be reduced. Can do.
  • the lead frame 6 having the leads 32 in which the depressions 64 are formed is formed by pressing, so that the lead frames 6 having the leads 32 in which the depressions 64 are formed can be collectively formed. So it is practical.
  • FIG. 9 is a view showing a method of manufacturing a lead frame according to the second embodiment of the present invention by etching.
  • FIG. 10 is a diagram illustrating a state in which the assembly of modules including the lead frame of FIG. 9 is cut along the cutting line CL.
  • This embodiment is different from the first embodiment described above in that, as shown in FIG. 9, in the preparation process, the lead frame 6 having the leads 32 in which the depressions 64 are formed by etching is formed. Therefore, it is practical because the lead frame 6 having the leads 32 in which the depressions 64 are formed can be collectively formed by etching. Since the other configuration is the same as that of the first embodiment described above, description of the configuration is omitted by attaching the same reference numerals.
  • a mask 9 is formed with a resist resin or the like at a necessary portion of one main surface of the conductive plate 65, and etching is performed.
  • the depression 64 is formed by isotropic etching. Therefore, as shown in FIG. 10, when the resin layer 7 is cut by the cutting device 8 along the cutting line CL, the angle ⁇ formed between the lead side surface 34 and the inner side surface 36 of the recess 35 is 90 ° ⁇ . What is necessary is just to make it the cross-sectional shape of the recessed part 35 become b> a so that it may become ⁇ 180 degrees. In this way, the inner side surface 36 of the recess 35 provided at the boundary portion between the lead side surface 34 and the connection surface 33 is formed so as to be inclined from the lead side surface 34 side toward the connection surface 33.
  • this embodiment can provide the same effects as those of the first embodiment described above.
  • FIG. 11 is a diagram showing a modification of the shape of the inner surface of the recess, and (a) to (d) show different shapes.
  • the inner surface 36 of the recess 35 only needs to be inclined from the lead side surface 34 side toward the connection surface 33. That is, when bubbles are generated in the recess 35, the bubbles move along the inner surface 36 from the connection surface 33 side toward the lead side surface 34, and the bubbles are discharged from the opening on the lead side surface 34 side of the recess 35. It is only necessary that the inner side surface 36 be inclined so as not to be hindered.
  • the lead side surface 34 is formed by the inner side surface 36 so that a portion where the bubble is caught or a portion having a slope that prevents the movement of the bubble toward the opening on the lead side surface 34 side of the recess 35 is not formed on the inner side surface 36.
  • An inclined surface that is inclined monotonously from the side toward the connection surface 33 may be formed. Therefore, it is only necessary that the inner side surface 36 of the concave portion 35 on the side of the lead side surface 34 is inclined toward the connection surface 33.
  • the inner side surface 36 is inclined in an arc shape from the lead side surface 34 side to the connection surface 33 and then inclined in a direction substantially orthogonal to the connection surface 33.
  • the inner side surface 36 is inclined linearly from the lead side surface 34 side to the connection surface 33 and then inclined in a direction substantially orthogonal to the connection surface 33.
  • the inner side surface 36 is inclined so that the inclination changes in two stages from the lead side surface 34 side to the connection surface 33 and then substantially orthogonal to the connection surface 33. Inclined in the direction.
  • the inner side surface 36 is inclined linearly without changing its inclination from the lead side surface 34 side to the connection surface 33.
  • All the leads 32 are configured to have the lead side surface 34, but the lead frame 3 may include at least one lead 32 having the lead side surface 34.
  • the connection surface 33 of the lead 32 that does not have the lead side surface 34 exposed on the package side surface 42 is exposed so as to be flush with the mounting surface 41 near the center of the mounting surface 41 of the resin package 4, for example.
  • the external connection terminal 5 may be formed. That is, when the lead 32 has the lead side surface 34 exposed to the package side surface 42 continuously to the connection surface 33, the recess 35 is formed at the boundary portion between the lead side surface 34 and the connection surface 33 as described above. Just do it.
  • the configuration of the lead frame 6 for forming the assembly of the modules 1 is not limited to the above-described example, and the number of the module regions 61 provided in the lead frame 6 and the arrangement state thereof are appropriately optimized. do it.
  • the number of leads 32 arranged in each module region and the arrangement state thereof may be appropriately changed according to the configuration of the electronic component 2 mounted on the stage 31.
  • a plurality of electronic components 2 may be mounted on the module 1.
  • an electronic component a lead frame having a plurality of leads connected to the electronic component, and a resin package that covers the electronic component and has a mounting surface on one side, a connection surface provided on each lead,
  • the present invention can be widely applied to a surface mounting type module that is exposed to a mounting surface and forms an external connection terminal, and a manufacturing method thereof.

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Abstract

Provided is a module which can be suppressed in occurrence of voids in a portion connected by a solder. A lead side surface (34), which is exposed in a package side surface (42), is provided with a recessed part (35) in the boundary with a connection surface (33). In addition, the inner surface (36) of the recessed part (35) of the lead side surface (34), said recessed part (35) being provided in the boundary with the connection surface (33), is formed to be inclined from the lead side surface (34) side toward the connection surface (33). Consequently, air bubbles generated within the recessed part (35) are more easily discharged from the opening of the recessed part (35) on the lead side surface (34) side, and therefore, the occurrence of voids in a solder (H), which connects an external connection terminal (5) and a substrate (MB) with each other, is able to be suppressed.

Description

モジュールおよびその製造方法Module and manufacturing method thereof
　本発明は、電子部品と、電子部品に接続された複数のリードを有するリードフレームと、電子部品を被覆し一側に実装面を有する樹脂パッケージとを備え、各リードそれぞれに設けられた接続面が、実装面に露出して外部接続端子を成す面実装型のモジュールおよびその製造方法に関する。 The present invention includes an electronic component, a lead frame having a plurality of leads connected to the electronic component, and a resin package that covers the electronic component and has a mounting surface on one side, and a connection surface provided on each lead However, the present invention relates to a surface-mounting type module that is exposed to a mounting surface and forms an external connection terminal, and a manufacturing method thereof.
　特許文献１には図１２および図１３に示すモジュール５００が開示されている。図１２および図１３に示すように、モジュール５００は、半導体チップ５０１（電子部品）と、半導体チップ５０１が搭載、接続されるリードフレーム５０２と、半導体チップ５０１を被覆して設けられ一側に実装面５０３ａを有する樹脂パッケージ５０３とを備えている。なお、図１２は従来のモジュールを実装面側から見た斜視図、図１３は図１２のモジュールが基板に実装された状態を示す断面図である。 Patent Document 1 discloses a module 500 shown in FIGS. 12 and 13. As shown in FIGS. 12 and 13, the module 500 includes a semiconductor chip 501 (electronic component), a lead frame 502 on which the semiconductor chip 501 is mounted and connected, and a semiconductor chip 501 that covers and is mounted on one side. And a resin package 503 having a surface 503a. 12 is a perspective view of a conventional module as viewed from the mounting surface side, and FIG. 13 is a cross-sectional view showing a state in which the module of FIG. 12 is mounted on a substrate.
　リードフレーム５０２は、半導体チップ５０１（電子部品）が搭載されるステージ５０４と、ステージ５０４に搭載された半導体チップ５０１にボンディングワイヤＷにより接続された複数のリード５０５とを備えている。また、各リード５０５それぞれに設けられた接続面５０５ａが、樹脂パッケージ５０３の実装面５０３ａと同一面を形成するように露出して、モジュール５００の外部接続端子５０６を構成している。 The lead frame 502 includes a stage 504 on which a semiconductor chip 501 (electronic component) is mounted, and a plurality of leads 505 connected to the semiconductor chip 501 mounted on the stage 504 by bonding wires W. Further, the connection surface 505 a provided on each lead 505 is exposed so as to form the same surface as the mounting surface 503 a of the resin package 503, thereby configuring the external connection terminal 506 of the module 500.
　また、樹脂パッケージ５０３の外周に沿ってステージ５０４の周囲に放射状に配置された各リード５０５は、その接続面５０５ａに連続し樹脂パッケージ５０３のパッケージ側面５０３ｂと同一面を形成するリード側面５０５ｂを有している。また、リード側面５０５ｂの接続面５０５ａとの境界部分に凹部５０５ｃが形成されると共に、その内側面にはめっきが施されている。そのため、図１３に示すように、モジュール５００の外部接続端子５０６がはんだＨを用いて基板ＭＢに接続されると、凹部５０５ｃ内にはんだＨが入り込むことにより、各リード５０５のリード側面５０５ｂにはんだフィレットが形成され易くなる。したがって、はんだフィレットが形成されることにより、モジュール５００の基板ＭＢへの実装強度が向上する。 Further, each lead 505 arranged radially around the stage 504 along the outer periphery of the resin package 503 has a lead side surface 505b that is continuous with the connection surface 505a and forms the same surface as the package side surface 503b of the resin package 503. is doing. Further, a concave portion 505c is formed at a boundary portion between the lead side surface 505b and the connection surface 505a, and the inner side surface is plated. Therefore, as shown in FIG. 13, when the external connection terminal 506 of the module 500 is connected to the board MB using the solder H, the solder H enters the recess 505 c, thereby soldering the lead side surface 505 b of each lead 505. Fillets are easily formed. Therefore, the mounting strength of the module 500 on the board MB is improved by forming the solder fillet.
　モジュール５００は、例えば次のようにして製造される。すなわち、まず、モジュール５００の集合体が形成された後に、この集合体がダイシングブレード等の切断手段により切断されて個々のモジュールに個片化されることによりモジュール５００が製造される。具体的には、薄板状の導電板からなるリードフレーム５０２の集合体が用意される。リードフレーム５０２の集合体は、各リードフレーム５０２が行列状に一定の規則性をもって配列された状態で連結されたものである。 The module 500 is manufactured as follows, for example. That is, first, after the assembly of the modules 500 is formed, the assembly is cut by a cutting means such as a dicing blade and separated into individual modules, whereby the module 500 is manufactured. Specifically, an assembly of lead frames 502 made of a thin conductive plate is prepared. The assembly of the lead frames 502 is a combination of the lead frames 502 arranged in a matrix with a certain regularity.
　次に、各リードフレーム５０２それぞれのステージ５０４に半導体チップ５０１が搭載されると共に、半導体チップ５０１と、当該半導体チップ５０１が搭載されたリードフレーム５０２の各リード５０５とがワイヤＷを用いてワイヤリング接続される。続いて、エポキシ樹脂等の樹脂が半導体チップ５０１が被覆されるように充填されて樹脂層が形成されることにより、モジュール５００の集合体が形成される。そして、モジュール５００の集合体の樹脂層が、各モジュール５００を囲むように設定された切断ラインに沿ってダイシングブレード等の切断手段により切断されて個々のモジュール５００に個片化される。 Next, the semiconductor chip 501 is mounted on the stage 504 of each lead frame 502, and the semiconductor chip 501 and each lead 505 of the lead frame 502 on which the semiconductor chip 501 is mounted are wired using wires W. Is done. Subsequently, a resin layer such as an epoxy resin is filled so as to cover the semiconductor chip 501 to form a resin layer, whereby an assembly of the module 500 is formed. Then, the resin layer of the assembly of the modules 500 is cut into individual modules 500 by being cut by a cutting means such as a dicing blade along cutting lines set so as to surround the modules 500.
　また、各リードフレーム５０２が有する各リード５０５の切断ラインに対応する位置に接続面５０５ａが形成されると共に、該接続面５０５ａに切断ラインを跨ぐように有底のビアホールが形成されている。そのため、モジュール５００の集合体が各モジュール５００に個片化される際に、各リード５０５の接続面５０５ａに形成された有底のビアホールが切断ラインに沿って切断されることにより、樹脂パッケージ５０３のパッケージ側面５０３ｂに各リード５０５のリード側面５０５ｂが露出して形成されると共に、リード側面５０５ｂの接続面５０５ａとの境界部分に凹部５０５ｃが形成される。 Further, a connection surface 505a is formed at a position corresponding to the cutting line of each lead 505 included in each lead frame 502, and a bottomed via hole is formed on the connection surface 505a so as to straddle the cutting line. Therefore, when the assembly of the modules 500 is separated into individual modules 500, the bottomed via holes formed in the connection surfaces 505a of the respective leads 505 are cut along the cutting lines, so that the resin package 503 is obtained. A lead side surface 505b of each lead 505 is exposed and formed on the package side surface 503b, and a recess 505c is formed at a boundary portion between the lead side surface 505b and the connection surface 505a.
　したがって、個片化の際にリード５０５が切断される部分に有底のビアホールが形成されて、リード５０５の切断位置における厚みが肉薄に形成されることにより、切断の際にバリが生じるのが抑制される。また、バリが生じても、生じたバリが凹部５０５ｃ内に入り込むことで、モジュール５００が基板ＭＢに接続される際にバリが邪魔にならないので、モジュール５００が傾くなどして接続不良が生じるのを防止することができる。 Therefore, a bottomed via hole is formed in a portion where the lead 505 is cut during singulation, and the lead 505 is formed with a thin thickness at the cutting position, so that burrs are generated during cutting. It is suppressed. In addition, even if burrs occur, the burrs generated enter the recess 505c, so that the burrs do not get in the way when the module 500 is connected to the substrate MB, so that the module 500 is inclined and connection failure occurs. Can be prevented.
特許第４００４４４５号公報（段落００１９～００３９、図１～図８など）Japanese Patent No. 4004445 (paragraphs 0019-0039, FIGS. 1-8, etc.)
　ところで、上記したモジュール５００では、モジュール５００がはんだＨを用いて基板ＭＢに実装される際に、次のような問題が生じるおそれがある。すなわち、凹部５０５ｃ内に気泡が生じた場合に、図１３の点線で囲まれた領域に示す凹部５０５ｃの上側の内側面に気泡が引っかかって、凹部５０５ｃ内から気泡が排出されないおそれがある。この場合、モジュール５００の外部接続端子５０６と基板ＭＢとのはんだＨによる接続部分にボイドが生じるので、モジュール５００の基板ＭＢへの実装強度およびその接続信頼性が劣化する。 Incidentally, in the above-described module 500, when the module 500 is mounted on the board MB using the solder H, the following problems may occur. That is, when a bubble is generated in the recess 505c, the bubble may be caught on the inner surface on the upper side of the recess 505c shown in the region surrounded by the dotted line in FIG. 13, and the bubble may not be discharged from the recess 505c. In this case, voids are generated in the connection portion of the external connection terminal 506 of the module 500 and the board MB by the solder H, so that the mounting strength of the module 500 to the board MB and its connection reliability are deteriorated.
　この発明は、上記した課題に鑑みてなされたものであり、はんだによる接続部分にボイドが生じるのを抑制することができるモジュールを提供すると共に、このモジュールを容易に製造することができる技術を提供することを目的とする。 The present invention has been made in view of the above-described problems, and provides a module capable of suppressing the generation of voids in a connection portion made of solder, and a technique capable of easily manufacturing the module. The purpose is to do.
　上記した目的を達成するために、本発明のモジュールは、電子部品と、前記電子部品に接続された複数のリードを有するリードフレームと、前記電子部品を被覆し一側に実装面を有する樹脂パッケージとを備え、前記各リードそれぞれに設けられた接続面が、前記実装面に露出して外部接続端子を成す面実装型のモジュールにおいて、前記各リードのうち少なくとも１つは、前記接続面に連続し前記樹脂パッケージのパッケージ側面に露出するリード側面を有すると共に、前記リード側面の前記接続面との境界部分に窪んだ凹部を有し、前記凹部の内側面は、前記接続面に向うに連れて傾斜して形成されていることを特徴としている。 In order to achieve the above object, a module of the present invention includes an electronic component, a lead frame having a plurality of leads connected to the electronic component, and a resin package that covers the electronic component and has a mounting surface on one side. And a connection surface provided on each of the leads is exposed to the mounting surface to form an external connection terminal. At least one of the leads is continuous to the connection surface. And a lead side surface exposed on the package side surface of the resin package, and a concave portion recessed in a boundary portion between the lead side surface and the connection surface, and an inner side surface of the concave portion being directed toward the connection surface. It is characterized by being inclined.
　このように構成された発明では、樹脂パッケージの実装面に露出して外部接続端子を成す接続面を有する各リードのうち少なくとも１つは、樹脂パッケージの実装面に露出する接続面に連続し樹脂パッケージのパッケージ側面に露出するリード側面を有している。また、パッケージ側面に露出するリード側面の接続面との境界部分に窪んだ凹部が設けられている。また、リード側面の接続面との境界部分に設けられた凹部の内側面は、リード側面側から接続面に向うに連れて傾斜するように形成されている。 In the invention configured as described above, at least one of the leads having a connection surface that is exposed on the mounting surface of the resin package and forms an external connection terminal is continuous with the connection surface exposed on the mounting surface of the resin package. A lead side surface exposed on the package side surface of the package is provided. In addition, a concave portion is provided in a boundary portion between the lead side surface exposed on the package side surface and the connection surface. In addition, the inner side surface of the recess provided in the boundary portion between the lead side surface and the connection surface is formed so as to be inclined from the lead side surface side toward the connection surface.
　そのため、モジュールが外部の基板等にはんだを用いて実装される際に、例えば、外部接続端子を成す接続面寄りの凹部内に気泡が生じた場合には、リード側面側から接続面に向うに連れて傾斜する凹部の内側面に沿って気泡が接続面側からリード側面に向けて移動することができる。したがって、凹部内に生じた気泡が凹部のリード側面側の開口から排出され易くなるので、外部接続端子と外部の基板等とのはんだによる接続部分にボイドが生じるのを抑制することができる。 Therefore, when a module is mounted on an external board or the like using solder, for example, if bubbles are generated in a recess near the connection surface forming the external connection terminal, the lead side is directed to the connection surface. Bubbles can move from the connection surface side toward the lead side surface along the inner side surface of the concave portion that is inclined along with it. Therefore, the bubbles generated in the recesses can be easily discharged from the opening on the side surface of the lead of the recess, so that it is possible to suppress the generation of voids in the connection portion by solder between the external connection terminal and the external substrate.
　また、前記凹部の前記内側面は、めっきされていてもよい。 Further, the inner side surface of the concave portion may be plated.
　このようにすれば、凹部の内側面のはんだの濡れ性が向上するので、凹部内にはんだが充填されやすくなる。したがって、モジュールが外部の基板等にはんだを用いて実装される際に、外部接続端子と基板等との接続部分において、接続面との境界部分に凹部が形成されたリード側面側にはんだフィレットを確実に形成することができる。 In this way, the wettability of the solder on the inner surface of the recess is improved, so that the recess is easily filled with solder. Therefore, when the module is mounted on an external substrate or the like using solder, a solder fillet is provided on the side of the lead where a recess is formed at the boundary between the external connection terminal and the substrate. It can be reliably formed.
　また、本発明のモジュールの製造方法は、面実装型のモジュールの製造方法において、複数のモジュール領域を有し、前記各モジュール領域のそれぞれに電子部品と接続される複数のリードが配置されたリードフレームを用意する用意工程と、前記リードフレームの前記各モジュール領域のそれぞれに前記電子部品を搭載すると共に当該電子部品が搭載された前記モジュール領域に配置された前記複数のリードと接続する搭載工程と、前記各電子部品を被覆すると共に、前記各リードそれぞれに設けられた接続面が外部接続端子として露出した実装面を有する樹脂層を形成する封止工程と、前記各モジュール領域を囲むように設定された切断ラインに沿って前記樹脂層を切断して複数の樹脂パッケージに個片化する個片化工程とを備え、前記各リードのうち少なくとも１つは、前記切断ラインを跨ぐように前記樹脂層の前記実装面に露出する前記接続面を有し、前記接続面に前記切断ラインを跨ぐように窪みが形成されており、前記個片化工程において前記窪みの位置で前記切断ラインに沿って切断されることにより、前記樹脂パッケージのパッケージ側面に露出するリード側面が前記接続面に連続するように形成されると共に、前記リード側面の前記接続面との境界部分に凹部が形成され、前記凹部の内側面は、前記接続面に向うに連れて傾斜していることを特徴としている。 The module manufacturing method of the present invention is a surface mounting type module manufacturing method in which a plurality of module regions are provided, and a plurality of leads connected to electronic components are arranged in each of the module regions. A preparing step of preparing a frame; and a mounting step of mounting the electronic component in each of the module regions of the lead frame and connecting to the plurality of leads arranged in the module region on which the electronic component is mounted; A sealing step for covering each electronic component and forming a resin layer having a mounting surface in which each connection surface provided on each lead is exposed as an external connection terminal; and so as to surround each module region Cutting the resin layer along the cut line and dividing the resin layer into a plurality of resin packages. At least one of the leads has the connection surface exposed on the mounting surface of the resin layer so as to straddle the cutting line, and a recess is formed on the connection surface so as to straddle the cutting line. In the individualization step, the lead side surface exposed to the package side surface of the resin package is formed so as to be continuous with the connection surface by being cut along the cutting line at the position of the depression. A concave portion is formed at a boundary portion between the side surface of the lead and the connection surface, and the inner side surface of the concave portion is inclined toward the connection surface.
　このように構成された発明では、リードフレームの各モジュール領域のそれぞれに電子部品が搭載されると共に、当該電子部品が搭載されたモジュール領域に配置された複数のリードと接続される。また、各リードそれぞれに設けられた接続面が外部接続端子として露出した実装面を有する樹脂層が形成される。また、各リードのうち少なくとも１つは、各モジュール領域を囲むように設定された切断ラインを跨ぐように樹脂層の実装面に露出する接続面を有し、その接続面に切断ラインを跨ぐように窪みが形成されている。 In the invention configured as described above, an electronic component is mounted in each module region of the lead frame and is connected to a plurality of leads arranged in the module region in which the electronic component is mounted. In addition, a resin layer having a mounting surface where the connection surface provided on each lead is exposed as an external connection terminal is formed. Further, at least one of the leads has a connection surface exposed on the mounting surface of the resin layer so as to straddle the cutting line set so as to surround each module region, and straddle the cutting line on the connecting surface. A depression is formed on the surface.
　そして、樹脂層が切断ラインに沿って切断されることにより複数の樹脂パッケージに個片化される際に、リードの接続面に切断ラインを跨ぐように形成された窪みが切断ラインに沿って切断される。そのため、樹脂パッケージのパッケージ側面に露出するリード側面が接続面に連続するように形成されると共に、リード側面の接続面との境界部分に凹部が形成される。また、凹部の内側面は、リード側面側から接続面に向うに連れて傾斜するように形成される。したがって、切断ラインを跨いで設けられたリードの接続面の窪みの内面が適切な形状に形成されることにより、リード側面の接続面との境界部分に設けられた凹部の内側面の傾斜が適切に形成されたモジュールを、従来の製造方法とほぼ同様の工程で容易に製造することができる。 Then, when the resin layer is cut along the cutting line and separated into a plurality of resin packages, the recess formed on the connection surface of the lead so as to straddle the cutting line is cut along the cutting line. Is done. Therefore, the lead side surface exposed on the package side surface of the resin package is formed to be continuous with the connection surface, and a recess is formed at the boundary portion between the lead side surface and the connection surface. Further, the inner surface of the recess is formed so as to be inclined from the side surface of the lead toward the connection surface. Therefore, the inner surface of the recess of the lead connecting surface provided across the cutting line is formed in an appropriate shape, so that the inclination of the inner surface of the recess provided at the boundary portion with the connecting surface of the lead side surface is appropriate. The module formed in (1) can be easily manufactured in substantially the same process as the conventional manufacturing method.
　また、前記個片化工程の前に、前記リードフレームの少なくとも前記接続面および前記窪みの内面をめっきするめっき工程をさらに備えていてもよい。 In addition, a plating step of plating at least the connection surface and the inner surface of the recess of the lead frame may be further provided before the singulation step.
　このようにすると、個片化工程においてリードが切断された後に、樹脂パッケージの表面に露出するリードの各面のうち、少なくとも、めっき工程においてめっきされたリードの接続面および凹部の内側面は確実にめっきされた状態となる。そのため、個片化工程により形成されるリード側面はめっきされていない状態であるが、リード側面の接続面との境界部分に設けられた凹部の内側面がめっきされた状態であるので、モジュールがはんだにより外部の基板等に接続される際に、リード側面側にはんだフィレットが確実に形成される。したがって、個片化工程の後に、はんだフィレットを確実に形成するためにリード側面をめっきする工程が不要であるので、製造工程の簡略化を図ることができると共に、製造コストの低減を図ることができる。 In this way, after the leads are cut in the singulation process, among the surfaces of the leads exposed on the surface of the resin package, at least the connection surface of the lead plated in the plating process and the inner surface of the recess are reliable. It will be in the state plated by. Therefore, the side surface of the lead formed by the singulation process is not plated, but the inner surface of the recess provided at the boundary portion with the connection surface of the side surface of the lead is in a plated state. When connected to an external substrate or the like by solder, a solder fillet is reliably formed on the side surface of the lead. Therefore, since the step of plating the side surfaces of the leads is not necessary after the singulation step to reliably form the solder fillet, the manufacturing process can be simplified and the manufacturing cost can be reduced. it can.
　また、前記用意工程において、プレス加工により前記窪みが形成された前記リードを有する前記リードフレームを形成するとよい。 In the preparing step, the lead frame having the leads in which the depressions are formed by press working may be formed.
　このようにすると、窪みが形成されたリードを有するリードフレームをプレス加工により一括で形成することができるので実用的である。 This is practical because a lead frame having leads with depressions can be collectively formed by pressing.
　また、前記用意工程において、エッチング加工により前記窪みが形成された前記リードを有する前記リードフレームを形成するようにしてもよい。 Further, in the preparation step, the lead frame having the leads in which the depressions are formed by etching may be formed.
　このようにすると、窪みが形成されたリードを有するリードフレームをエッチング加工により一括で形成することができるので実用的である。 This is practical because a lead frame having leads with depressions can be collectively formed by etching.
　本発明によれば、モジュールが外部の基板等にはんだを用いて実装される際に、リード側面の接続面との境界部分に形成された凹部内に気泡が生じた場合には、凹部の内側面に沿って気泡がリード側面に向けて移動することにより気泡が凹部の外に排出されるので、外部接続端子と外部の基板等とを接続するはんだにボイドが生じるのを抑制することができる。 According to the present invention, when a module is mounted on an external substrate or the like using solder, if bubbles are generated in the recess formed at the boundary between the lead side surface and the connection surface, The bubbles are discharged out of the recesses as the bubbles move toward the side surface of the lead along the side surface, so that it is possible to suppress the formation of voids in the solder connecting the external connection terminal and the external substrate. .
本発明の第１実施形態にかかるモジュールが基板に実装された状態を示す断面図である。It is sectional drawing which shows the state by which the module concerning 1st Embodiment of this invention was mounted in the board | substrate. 図１のモジュールの要部拡大図である。It is a principal part enlarged view of the module of FIG. 図１のモジュールの要部を示す左側面図である。It is a left view which shows the principal part of the module of FIG. 図１のモジュールの要部を示す底面図である。It is a bottom view which shows the principal part of the module of FIG. 図１のモジュールの製造方法の一例を示す図であって、（ａ）～（ｅ）はそれぞれ異なる工程を示す。FIG. 2 is a diagram showing an example of a method for manufacturing the module of FIG. 1, wherein (a) to (e) show different processes. リードフレームを示す平面図である。It is a top view which shows a lead frame. 図６のリードフレームをプレス加工により製造する方法を示す図であって、（ａ）～（ｃ）はそれぞれ異なる状態を示す。FIG. 7 is a diagram showing a method of manufacturing the lead frame of FIG. 6 by press working, and (a) to (c) show different states. 搭載工程において図６のリードフレームに電子部品が搭載された状態を示す平面図である。FIG. 7 is a plan view showing a state in which electronic components are mounted on the lead frame of FIG. 6 in the mounting step. 本発明の第２実施形態にかかるリードフレームをエッチング加工により製造する方法を示す図である。It is a figure which shows the method to manufacture the lead frame concerning 2nd Embodiment of this invention by an etching process. 図９のリードフレームを備えるモジュールの集合体が切断ラインに沿って切断される様子を示す図である。It is a figure which shows a mode that the aggregate | assembly of a module provided with the lead frame of FIG. 9 is cut | disconnected along a cutting line. 凹部の内側面の形状の変形例を示す図であって、（ａ）～（ｄ）はそれぞれ異なる形状を示す。FIG. 9 is a diagram showing a modification of the shape of the inner surface of the recess, and (a) to (d) show different shapes. 従来のモジュールを実装面側から見た斜視図である。It is the perspective view which looked at the conventional module from the mounting surface side. 図１２のモジュールが基板に実装された状態を示す断面図である。It is sectional drawing which shows the state in which the module of FIG. 12 was mounted in the board | substrate.
　＜第１実施形態＞
　本発明の第１実施形態について図１～図８を参照して説明する。 <First Embodiment>
A first embodiment of the present invention will be described with reference to FIGS.
　図１は本発明の第１実施形態にかかるモジュールが基板に実装された状態を示す断面図、図２は図１のモジュールの要部拡大図、図３は図１のモジュールの要部を示す側面図、図４は図１のモジュールの要部を示す底面図である。また、図５は図１のモジュールの製造方法の一例を示す図であって、（ａ）～（ｅ）はそれぞれ異なる工程を示す。また、図６はリードフレームを示す平面図、図７は図６のリードフレームをプレス加工により製造する方法を示す図であって、（ａ）～（ｃ）はそれぞれ異なる状態を示す。また、図８は搭載工程において図６のリードフレームに電子部品が搭載された状態を示す平面図である。なお、図２～図４はそれぞれ図１のモジュールの点線で囲まれた領域を示す図である。 1 is a cross-sectional view showing a state in which a module according to a first embodiment of the present invention is mounted on a substrate, FIG. 2 is an enlarged view of a main part of the module of FIG. 1, and FIG. 3 is a main part of the module of FIG. FIG. 4 is a side view showing a main part of the module shown in FIG. FIG. 5 is a view showing an example of a method of manufacturing the module of FIG. 1, and (a) to (e) show different processes. FIG. 6 is a plan view showing the lead frame, and FIG. 7 is a view showing a method of manufacturing the lead frame of FIG. 6 by press working, and (a) to (c) show different states. FIG. 8 is a plan view showing a state where electronic components are mounted on the lead frame of FIG. 6 in the mounting process. 2 to 4 are diagrams each showing a region surrounded by a dotted line of the module of FIG.
　（モジュール）
　図１に示すように、モジュール１は、各種の半導体チップから成る電子部品２と、リードフレーム３と、樹脂パッケージ４とを備え、はんだＨを用いて基板ＭＢに電気的に接続されて実装される面実装型に構成されている。 (module)
As shown in FIG. 1, the module 1 includes an electronic component 2 composed of various semiconductor chips, a lead frame 3, and a resin package 4, and is mounted by being electrically connected to the substrate MB using solder H. It is configured as a surface mount type.
　リードフレーム３は、Ｃｕ、Ｃｕ合金、Ｆｅ－Ｎｉ合金等の金属材料により形成され、電子部品２が搭載されるステージ３１と、複数のリード３２とを有している。電子部品２は、Ａｇペースト等の接合剤Ｂを用いてステージ３１に接着されることにより、ステージ３１にフェイスアップ状態で搭載される。また、ステージ３１に搭載された電子部品２の上面に設けられた接続端子（図示省略）と、各リード３２とが、Ａｕ等により形成される一般的なワイヤボンディング用のワイヤＷを用いて電気的に接続されている。 The lead frame 3 is formed of a metal material such as Cu, Cu alloy, or Fe—Ni alloy, and includes a stage 31 on which the electronic component 2 is mounted and a plurality of leads 32. The electronic component 2 is mounted on the stage 31 in a face-up state by being bonded to the stage 31 using a bonding agent B such as an Ag paste. Further, a connection terminal (not shown) provided on the upper surface of the electronic component 2 mounted on the stage 31 and each lead 32 are electrically connected by using a general wire bonding wire W formed of Au or the like. Connected.
　樹脂パッケージ４は、エポキシ樹脂等のモールド用の一般的な樹脂により形成され、電子部品２を被覆し一側に実装面４１を有している。また、ステージ３１の下面３１ａと、各リード３２それぞれに設けられた接続面３３とが、樹脂パッケージ４の実装面４１に露出している。また、樹脂パッケージ４の実装面４１に露出する各リード３２の接続面３３によりモジュール１の外部接続端子５が構成されている。なお、この実施形態では、ステージ３１の下面３１ａと、各リード３２それぞれに設けられた接続面３３とが、樹脂パッケージ４の実装面４１と同一面を形成するように、樹脂パッケージ４の実装面４１に露出している。 The resin package 4 is formed of a general resin for molding such as epoxy resin, and covers the electronic component 2 and has a mounting surface 41 on one side. Further, the lower surface 31 a of the stage 31 and the connection surface 33 provided on each lead 32 are exposed on the mounting surface 41 of the resin package 4. Further, the external connection terminals 5 of the module 1 are constituted by the connection surfaces 33 of the leads 32 exposed on the mounting surface 41 of the resin package 4. In this embodiment, the mounting surface of the resin package 4 is such that the lower surface 31 a of the stage 31 and the connection surface 33 provided on each lead 32 form the same surface as the mounting surface 41 of the resin package 4. 41 is exposed.
　各リード３２は、この実施形態では、接続面３３に連続して樹脂パッケージ４のパッケージ側面４２に露出して、パッケージ側面４２と同一面を形成するリード側面３４を有している。また、リード側面４２の接続面３３との境界部分に窪んだ凹部３５が設けられている。また、リード側面３４の接続面３３との境界部分に設けられた凹部３５の内側面３６は、リード側面３４側から接続面３３に向うに連れて傾斜するように形成されている。すなわち、内側面３６により、リード側面３４側から単調に接続面３３に向って傾斜する傾斜面が形成されている。したがって、リード側面３４と、内側面３６のうちリード側面３４と接する面とが成す角αが、９０°＜α＜１８０°、となるように内側面３６が形成されている。 In this embodiment, each lead 32 has a lead side surface 34 that is exposed to the package side surface 42 of the resin package 4 continuously to the connection surface 33 and forms the same surface as the package side surface 42. In addition, a concave portion 35 is provided in a boundary portion between the lead side surface 42 and the connection surface 33. Further, the inner side surface 36 of the recess 35 provided at the boundary portion between the lead side surface 34 and the connection surface 33 is formed so as to be inclined from the lead side surface 34 side toward the connection surface 33. That is, the inner side surface 36 forms an inclined surface that is inclined monotonously from the lead side surface 34 side toward the connection surface 33. Accordingly, the inner side surface 36 is formed such that an angle α formed between the lead side surface 34 and a surface of the inner side surface 36 that contacts the lead side surface 34 satisfies 90 ° <α <180 °.
　また、凹部３５の内側面３６は、Ｓｎ－Ｐｂ、Ｓｎ－Ａｇ、Ｓｎ、Ｓｎ－Ｂｉ、Ａｕ、Ａｇなどのめっきが施されている。 The inner surface 36 of the recess 35 is plated with Sn—Pb, Sn—Ag, Sn, Sn—Bi, Au, Ag, or the like.
　図１および図２に示すように、上記したように形成されたモジュール１が基板ＭＢにはんだＨを用いて実装された場合に、外部接続端子５を成すリード側面３４の接続面３３との境界部分に形成された凹部３５内に溶融したはんだＨが充填される。したがって、外部接続端子５の凹部３５部分においてリード側面３４側にはんだフィレットが形成される。 As shown in FIGS. 1 and 2, when the module 1 formed as described above is mounted on the board MB using the solder H, the boundary between the lead side surface 34 forming the external connection terminal 5 and the connection surface 33. The melted solder H is filled in the concave portion 35 formed in the portion. Therefore, a solder fillet is formed on the side of the lead side 34 in the concave portion 35 of the external connection terminal 5.
　また、上記したモジュール１では、ステージ３１の下面３１ａも樹脂パッケージ４の実装面４１に露出して、はんだＨにより基板ＭＢに接続される。したがって、電子部品２の熱がステージ３１を介して基板ＭＢ側に効率よく放熱される。 In the module 1 described above, the lower surface 31 a of the stage 31 is also exposed on the mounting surface 41 of the resin package 4 and connected to the substrate MB by the solder H. Therefore, the heat of the electronic component 2 is efficiently radiated to the substrate MB side through the stage 31.
　なお、上記した例では電子部品２はフェイスアップ実装される各種の半導体チップにより構成されているが、フェイスダウン実装される各種の半導体チップや、各種のＭＥＭＳ、各種のＩＣ等により電子部品２が構成されていてもよい。また、超音波振動を利用して電子部品２がステージ３１に接続されてもよいし、電子部品２の接続端子が各リード３２に超音波振動やはんだＨを利用して直接接続されてもよい。 In the above example, the electronic component 2 is composed of various semiconductor chips that are mounted face up. However, the electronic component 2 is configured by various semiconductor chips that are mounted face down, various MEMS, various ICs, and the like. It may be configured. The electronic component 2 may be connected to the stage 31 using ultrasonic vibration, or the connection terminal of the electronic component 2 may be directly connected to each lead 32 using ultrasonic vibration or solder H. .
　（製造方法）
　モジュール１の製造方法の各工程について説明する。 (Production method)
Each process of the manufacturing method of the module 1 is demonstrated.
　この実施形態では、複数のモジュール１の集合体が形成された後に、個片化されることによりモジュール１が製造される。 In this embodiment, after an assembly of a plurality of modules 1 is formed, the modules 1 are manufactured by being separated into individual pieces.
　まず、図５（ａ）および図６に示すように、リードフレーム３の集合体であるリードフレーム６が用意される（用意工程）。リードフレーム６は、複数のモジュール領域６１を有し、各モジュール領域６１のそれぞれに電子部品２が搭載されるステージ３１と、電子部品２が接続される複数のリード３２とが配置されている。また、リードフレーム６は矩形枠状のフレーム部材６２を備え、フレーム部材６２内に配置された各ステージ３１および各リード３２が、吊りリード６３によりフレーム部材６２に連結されている。なお、同図中に破線で示されている切断ラインＣＬは、複数のモジュール１の集合体が個片化される際の、リードフレーム３の集合体であるリードフレーム６の切断位置を示している。 First, as shown in FIGS. 5A and 6, a lead frame 6 that is an assembly of lead frames 3 is prepared (preparation step). The lead frame 6 has a plurality of module regions 61, and a stage 31 on which the electronic component 2 is mounted and a plurality of leads 32 to which the electronic component 2 is connected are arranged in each module region 61. The lead frame 6 includes a rectangular frame-shaped frame member 62, and each stage 31 and each lead 32 arranged in the frame member 62 are connected to the frame member 62 by suspension leads 63. In addition, the cutting line CL shown with the broken line in the same figure shows the cutting position of the lead frame 6 which is the assembly of the lead frames 3 when the assembly of the plurality of modules 1 is separated. Yes.
　また、各リード３２には、切断ラインＣＬを跨ぐように樹脂パッケージ４の実装面４１に露出する接続面３３が設けられている。また、接続面３３には、切断ラインＣＬを跨ぐように窪み６４が形成されている。 Further, each lead 32 is provided with a connection surface 33 exposed on the mounting surface 41 of the resin package 4 so as to straddle the cutting line CL. In addition, a recess 64 is formed in the connection surface 33 so as to straddle the cutting line CL.
　また、この実施形態では、図７（ａ）に示すように、薄板状の導電板６５（例えば最大厚みが約０．２ｍｍ程度のＣｕ板）に対してプレス型６６が押し当てられるプレス加工により、切断ラインＣＬを跨ぐように窪み６４が形成されたリード３２を有するリードフレーム６が形成される。図７（ｂ）に示すように、プレス加工が終了すると、導電板６５に押し付けられたプレス型６６が取り除かれることによりリードフレーム６が完成する（図７（ｃ））。 Further, in this embodiment, as shown in FIG. 7A, a press die 66 is pressed against a thin conductive plate 65 (for example, a Cu plate having a maximum thickness of about 0.2 mm). The lead frame 6 having the leads 32 in which the depressions 64 are formed so as to straddle the cutting line CL is formed. As shown in FIG. 7B, when the press work is completed, the press die 66 pressed against the conductive plate 65 is removed to complete the lead frame 6 (FIG. 7C).
　次に、図５（ｂ）および図８に示すように、リードフレーム６の各モジュール領域６１のそれぞれに配置されたステージ３１に電子部品２がＡｇペースト等を用いて搭載される。また、ステージ３１に搭載された電子部品２と、電子部品２が搭載されたモジュール領域６１に配置された複数のリード３２とがワイヤＷを用いて接続される（搭載工程）。 Next, as shown in FIGS. 5B and 8, the electronic component 2 is mounted on the stage 31 disposed in each module area 61 of the lead frame 6 using Ag paste or the like. Further, the electronic component 2 mounted on the stage 31 and the plurality of leads 32 arranged in the module region 61 on which the electronic component 2 is mounted are connected using the wire W (mounting process).
　続いて、図５（ｃ）に示すように、モールド用の熱硬化性の樹脂が各電子部品２を被覆するようにリードフレーム６の他側の全面に渡って充填される。そして、各電子部品２が被覆されると共に、各リード３２それぞれに設けられた接続面３３が外部接続端子５として同一面を形成するように露出した実装面４１を一側に有する樹脂層７が形成されることにより、複数のモジュール１の集合体が形成される（封止工程）。また、樹脂層７の実装面４１にはステージ３１の下面３１ａが、実装面４１と同一面を形成するように露出している。 Subsequently, as shown in FIG. 5C, a thermosetting resin for molding is filled over the entire other side of the lead frame 6 so as to cover each electronic component 2. The resin layer 7 having the mounting surface 41 exposed on one side so that each electronic component 2 is covered and the connection surface 33 provided on each lead 32 forms the same surface as the external connection terminal 5 is formed. By being formed, an assembly of a plurality of modules 1 is formed (sealing process). Further, the lower surface 31 a of the stage 31 is exposed on the mounting surface 41 of the resin layer 7 so as to form the same surface as the mounting surface 41.
　次に、図５（ｄ）に示すように、ダイサー等の一般的な切断装置８により、各モジュール領域６１を囲むように設定された切断ラインＣＬに沿って樹脂層７が切断される（個片化工程）。そして、複数のモジュール１の集合体が複数の樹脂パッケージ４に個片化されることにより、図５（ｅ）に示すモジュール１が完成する（個片化工程）。 Next, as shown in FIG. 5D, the resin layer 7 is cut along a cutting line CL set so as to surround each module region 61 by a general cutting device 8 such as a dicer (pieces). Detachment step). Then, the assembly of the plurality of modules 1 is separated into a plurality of resin packages 4, whereby the module 1 shown in FIG. 5E is completed (individualization step).
　また、個片化工程において、窪み６４の位置で切断ラインＣＬに沿って各リード３２が切断されることにより、樹脂パッケージ４のパッケージ側面４２と同一面を形成するリード側面３４が接続面３３に連続するように形成される。また、リード側面３４の接続面３３との境界部分に凹部３５が形成される。なお、切断ラインＣＬに沿って切断される窪み６４の内面のうち、切断装置８が備えるダイシングブレードの幅よりも外側の部分の形状が適切に形成されることにより、凹部３５の内側面が、リード側面３４側から接続面３３に向うに連れて傾斜するように形成される。 In the individualization step, each lead 32 is cut along the cutting line CL at the position of the depression 64, so that the lead side surface 34 that forms the same surface as the package side surface 42 of the resin package 4 becomes the connection surface 33. It is formed to be continuous. Further, a recess 35 is formed at a boundary portion between the lead side surface 34 and the connection surface 33. Of the inner surface of the recess 64 cut along the cutting line CL, the shape of the portion outside the width of the dicing blade included in the cutting device 8 is appropriately formed, so that the inner surface of the recess 35 is It is formed so as to be inclined from the side surface 34 of the lead toward the connection surface 33.
　また、上記した説明ではその説明を省略したが、個片化工程の前の適切なタイミングで、リードフレーム６の少なくとも接続面３３および窪み６４の内面にめっきが施されている（めっき工程）。 In addition, although the description is omitted in the above description, at least the connection surface 33 of the lead frame 6 and the inner surface of the recess 64 are plated at an appropriate timing before the singulation process (plating process).
　以上のように、この実施形態では、樹脂パッケージ４の実装面４１と同一面を形成するように露出して外部接続端子５を成す接続面３３を有する各リード３２は、樹脂パッケージ４の実装面４１に露出する接続面３３に連続し樹脂パッケージ４のパッケージ側面４２と同一面を形成するリード側面３４を有している。また、パッケージ側面４２に露出するリード側面３４の接続面３３との境界部分に窪んだ凹部３５が設けられている。また、リード側面３４の接続面３３との境界部分に設けられた凹部３５の内側面３６は、リード側面３４側から接続面３３に向うに連れて傾斜するように形成されている。 As described above, in this embodiment, each lead 32 having the connection surface 33 that is exposed to form the same surface as the mounting surface 41 of the resin package 4 and forms the external connection terminal 5 is formed on the mounting surface of the resin package 4. 41 has a lead side surface 34 that is continuous with the connection surface 33 exposed at 41 and forms the same surface as the package side surface 42 of the resin package 4. In addition, a recessed portion 35 is provided at a boundary portion between the lead side surface 34 exposed on the package side surface 42 and the connection surface 33. Further, the inner side surface 36 of the recess 35 provided at the boundary portion between the lead side surface 34 and the connection surface 33 is formed so as to be inclined from the lead side surface 34 side toward the connection surface 33.
　そのため、モジュール１が基板ＭＢにはんだＨを用いて実装される際に、例えば、外部接続端子５を成す接続面３３寄りの凹部３５内に気泡が生じた場合には、リード側面３４側から接続面３３に向うに連れて傾斜する凹部３５の内側面３６に沿って気泡が接続面３３側からリード側面３４に向って移動することができる。したがって、凹部３５内に生じた気泡が凹部３５のリード側面３４側の開口から排出され易くなるので、外部接続端子５と基板ＭＢとを接続するはんだＨにボイドが生じるのを抑制することができる。 Therefore, when the module 1 is mounted on the board MB using the solder H, for example, when bubbles are generated in the recess 35 near the connection surface 33 forming the external connection terminal 5, the connection is made from the lead side surface 34 side. Air bubbles can move from the connection surface 33 side toward the lead side surface 34 along the inner side surface 36 of the recess 35 that inclines toward the surface 33. Accordingly, since the bubbles generated in the recess 35 are easily discharged from the opening on the lead side surface 34 side of the recess 35, it is possible to suppress the generation of voids in the solder H connecting the external connection terminal 5 and the substrate MB. .
　また、凹部３５の内側面３６はめっきされているので、内側面３６のはんだＨの濡れ性が向上する。そのため、凹部３５内にはんだＨが充填されやすくなる。したがって、モジュール１が基板ＭＢにはんだＨを用いて実装される際に、外部接続端子５と基板ＭＢとの接続部分において、接続面３３との境界部分に凹部３５が形成されたリード側面３４側にはんだフィレットを確実に形成することができる。 Also, since the inner side surface 36 of the recess 35 is plated, the wettability of the solder H on the inner side surface 36 is improved. Therefore, the solder H is easily filled in the recess 35. Therefore, when the module 1 is mounted on the substrate MB using the solder H, the lead side surface 34 side where the concave portion 35 is formed at the boundary portion between the connection surface 33 in the connection portion between the external connection terminal 5 and the substrate MB. A solder fillet can be reliably formed.
　また、モジュール１が製造される際に、まず、リードフレーム６の各モジュール領域６１のそれぞれに電子部品２が搭載される。そして、各電子部品２は、それぞれが搭載されたモジュール領域６１に配置された複数のリード３２とワイヤＷを用いたワイヤボンディングにより接続される。また、各リード３２それぞれに設けられた接続面３３が外部接続端子５として同一面を形成するように露出した実装面４１を有する樹脂層７が形成される。また、各リード３２は、各モジュール領域６１を囲むように設定された切断ラインＣＬを跨ぐように樹脂層７の実装面４１に露出する接続面３３を有し、その接続面３３に切断ラインＣＬを跨ぐように窪み６４が形成されている。 Further, when the module 1 is manufactured, first, the electronic component 2 is mounted in each of the module regions 61 of the lead frame 6. Each electronic component 2 is connected to the plurality of leads 32 arranged in the module area 61 on which each electronic component 2 is mounted by wire bonding using wires W. Further, the resin layer 7 having the mounting surface 41 exposed so that the connection surface 33 provided on each lead 32 forms the same surface as the external connection terminal 5 is formed. Each lead 32 has a connection surface 33 exposed on the mounting surface 41 of the resin layer 7 so as to straddle the cutting line CL set so as to surround each module region 61, and the cutting line CL is formed on the connection surface 33. A depression 64 is formed so as to straddle.
　そして、樹脂層７が切断ラインＣＬに沿って切断されることにより複数の樹脂パッケージ４に個片化される際に、各リード３２の接続面３３に切断ラインＣＬを跨ぐように形成された窪み６４が切断ラインＣＬに沿って切断される。そのため、樹脂パッケージ４のパッケージ側面４２と同一面を形成するリード側面３４が接続面３３に連続するように形成されると共に、リード側面３４の接続面３３との境界部分に凹部３５が形成される。また、凹部３５の内側面３６は、リード側面３４側から接続面３３に向うに連れて傾斜するように形成される。したがって、切断ラインＣＬを跨いで設けられた各リード３２の接続面３３の窪み６４の内面が適切な形状に形成されることにより、リード側面３４の接続面３３との境界部分に設けられた凹部３５の内側面３６の傾斜が適切に形成されたモジュール１を、従来の製造方法とほぼ同様の工程で容易に製造することができる。 Then, when the resin layer 7 is cut along the cutting line CL to be singulated into a plurality of resin packages 4, a depression formed on the connection surface 33 of each lead 32 so as to straddle the cutting line CL. 64 is cut along the cutting line CL. Therefore, the lead side surface 34 that forms the same surface as the package side surface 42 of the resin package 4 is formed so as to be continuous with the connection surface 33, and the recess 35 is formed at the boundary portion between the lead side surface 34 and the connection surface 33. . Further, the inner side surface 36 of the recess 35 is formed so as to be inclined from the lead side surface 34 side toward the connection surface 33. Therefore, the inner surface of the recess 64 of the connection surface 33 of each lead 32 provided across the cutting line CL is formed in an appropriate shape, so that the recess provided in the boundary portion between the lead side surface 34 and the connection surface 33. The module 1 in which the inclination of the inner side surface 36 of 35 is appropriately formed can be easily manufactured by substantially the same process as the conventional manufacturing method.
　また、個片化工程の前に、リードフレーム６の少なくとも接続面３３および窪み６４の内面がめっき工程おいてめっきされる。したがって、個片化工程において各リード３２が切断された後に、樹脂パッケージ４の表面に露出する各リード３２の各面のうち、少なくとも、めっき工程においてめっきされた各リード３２の接続面３３および凹部３５の内側面３６は確実にめっきされた状態となる。そのため、個片化工程により形成されるリード側面３４はめっきされていない状態であるが、リード側面３４の接続面３３との境界部分に設けられた凹部３５の内側面３６がめっきされた状態であるので、モジュール１がはんだにより基板ＭＢに接続される際に、リード側面３４側にはんだフィレットが確実に形成される。したがって、個片化工程の後に、はんだフィレットを確実に形成するためにリード側面３４をめっきする工程が不要であるので、製造工程の簡略化を図ることができると共に、製造コストの低減を図ることができる。 Further, before the singulation process, at least the connection surface 33 of the lead frame 6 and the inner surface of the recess 64 are plated in a plating process. Therefore, after each lead 32 is cut in the singulation step, at least the connection surface 33 and the concave portion of each lead 32 plated in the plating step among the surfaces of each lead 32 exposed on the surface of the resin package 4. The inner surface 36 of 35 is surely plated. Therefore, the lead side surface 34 formed by the singulation process is not plated, but the inner side surface 36 of the recess 35 provided at the boundary portion between the lead side surface 34 and the connection surface 33 is plated. Therefore, when the module 1 is connected to the board MB by solder, a solder fillet is reliably formed on the side of the lead side surface 34. Therefore, since the process of plating the lead side surface 34 is not required after the singulation process to reliably form the solder fillet, the manufacturing process can be simplified and the manufacturing cost can be reduced. Can do.
　また、用意工程において、プレス加工により窪み６４が形成されたリード３２を有するリードフレーム６が形成されることにより、窪み６４が形成されたリード３２を有するリードフレーム６を一括で形成することができるので実用的である。 Further, in the preparation step, the lead frame 6 having the leads 32 in which the depressions 64 are formed is formed by pressing, so that the lead frames 6 having the leads 32 in which the depressions 64 are formed can be collectively formed. So it is practical.
　＜第２実施形態＞
　本発明の第２実施形態について図９および図１０を参照して説明する。図９は本発明の第２実施形態にかかるリードフレームをエッチング加工により製造する方法を示す図である。また、図１０は図９のリードフレームを備えるモジュールの集合体が切断ラインＣＬに沿って切断される様子を示す図である。 Second Embodiment
A second embodiment of the present invention will be described with reference to FIG. 9 and FIG. FIG. 9 is a view showing a method of manufacturing a lead frame according to the second embodiment of the present invention by etching. FIG. 10 is a diagram illustrating a state in which the assembly of modules including the lead frame of FIG. 9 is cut along the cutting line CL.
　この実施形態が上記した第１実施形態と異なるのは、図９に示すように、用意工程において、エッチング加工により窪み６４が形成されたリード３２を有するリードフレーム６が形成される点である。したがって、窪み６４が形成されたリード３２を有するリードフレーム６をエッチング加工により一括で形成することができるので実用的である。その他の構成は上記した第１実施形態と同様であるため、同一符号を付すことによりその構成の説明は省略する。 This embodiment is different from the first embodiment described above in that, as shown in FIG. 9, in the preparation process, the lead frame 6 having the leads 32 in which the depressions 64 are formed by etching is formed. Therefore, it is practical because the lead frame 6 having the leads 32 in which the depressions 64 are formed can be collectively formed by etching. Since the other configuration is the same as that of the first embodiment described above, description of the configuration is omitted by attaching the same reference numerals.
　図９に示すように、導電板６５の一側の主面の必要な箇所にレジスト樹脂等によりマスク９が形成されてエッチング加工が実行される。このとき、等方的にエッチングが進むことにより窪み６４が形成される。したがって、図１０に示すように、樹脂層７が切断ラインＣＬに沿って切断装置８により切断される際に、リード側面３４と凹部３５の内側面３６とが成す角αが、９０°＜α＜１８０°、となるように、凹部３５の断面形状が、ｂ＞ａ、となるようにすればよい。このようにすると、リード側面３４の接続面３３との境界部分に設けられた凹部３５の内側面３６は、リード側面３４側から接続面３３に向うに連れて傾斜するように形成される。 As shown in FIG. 9, a mask 9 is formed with a resist resin or the like at a necessary portion of one main surface of the conductive plate 65, and etching is performed. At this time, the depression 64 is formed by isotropic etching. Therefore, as shown in FIG. 10, when the resin layer 7 is cut by the cutting device 8 along the cutting line CL, the angle α formed between the lead side surface 34 and the inner side surface 36 of the recess 35 is 90 ° <α. What is necessary is just to make it the cross-sectional shape of the recessed part 35 become b> a so that it may become <180 degrees. In this way, the inner side surface 36 of the recess 35 provided at the boundary portion between the lead side surface 34 and the connection surface 33 is formed so as to be inclined from the lead side surface 34 side toward the connection surface 33.
　以上のように、この実施形態では上記した第１実施形態と同様の効果を奏することができる。 As described above, this embodiment can provide the same effects as those of the first embodiment described above.
　＜変形例＞
　リード側面３４の接続面３３との境界部分に形成された凹部３５の内側面３６の形状の変形例について図１１を参照して説明する。図１１は凹部の内側面の形状の変形例を示す図であって、（ａ）～（ｄ）はそれぞれ異なる形状を示す。 <Modification>
A modification of the shape of the inner side surface 36 of the recess 35 formed at the boundary between the lead side surface 34 and the connection surface 33 will be described with reference to FIG. FIG. 11 is a diagram showing a modification of the shape of the inner surface of the recess, and (a) to (d) show different shapes.
　上記したように、凹部３５の内側面３６は、リード側面３４側から接続面３３に向うに連れて傾斜していればよい。すなわち、凹部３５内に気泡が生じた場合に、気泡が接続面３３側からリード側面３４側に向けて内側面３６に沿って移動して、凹部３５のリード側面３４側の開口から気泡が排出されるのが阻害されないように内側面３６が傾斜していればよい。具体的には、気泡が引っ掛かる箇所や、凹部３５のリード側面３４側の開口へ向かう気泡の移動を妨げる斜度を有する箇所が内側面３６に形成されないように、内側面３６により、リード側面３４側から単調に接続面３３に向って傾斜する傾斜面が形成されるとよい。したがって、特に凹部３５のリード側面３４側の内側面３６が接続面３３に向うに連れて傾斜していればよい。 As described above, the inner surface 36 of the recess 35 only needs to be inclined from the lead side surface 34 side toward the connection surface 33. That is, when bubbles are generated in the recess 35, the bubbles move along the inner surface 36 from the connection surface 33 side toward the lead side surface 34, and the bubbles are discharged from the opening on the lead side surface 34 side of the recess 35. It is only necessary that the inner side surface 36 be inclined so as not to be hindered. Specifically, the lead side surface 34 is formed by the inner side surface 36 so that a portion where the bubble is caught or a portion having a slope that prevents the movement of the bubble toward the opening on the lead side surface 34 side of the recess 35 is not formed on the inner side surface 36. An inclined surface that is inclined monotonously from the side toward the connection surface 33 may be formed. Therefore, it is only necessary that the inner side surface 36 of the concave portion 35 on the side of the lead side surface 34 is inclined toward the connection surface 33.
　図１１（ａ）に示す例では、内側面３６は、リード側面３４側から接続面３３に向う途中まで円弧状に傾斜した後に、接続面３３にほぼ直交する方向に傾斜している。また、図１１（ｂ）に示す例では、内側面３６は、リード側面３４側から接続面３３に向う途中まで直線状に傾斜した後に、接続面３３にほぼ直交する方向に傾斜している。また、図１１（ｃ）に示す例では、内側面３６は、リード側面３４側から接続面３３に向う途中までその傾きが２段階に変化するように傾斜した後に、接続面３３にほぼ直交する方向に傾斜している。また、図１１（ｄ）に示す例では、内側面３６は、リード側面３４側から接続面３３までその傾きが変化せずに直線状に傾斜している。 In the example shown in FIG. 11A, the inner side surface 36 is inclined in an arc shape from the lead side surface 34 side to the connection surface 33 and then inclined in a direction substantially orthogonal to the connection surface 33. In the example shown in FIG. 11B, the inner side surface 36 is inclined linearly from the lead side surface 34 side to the connection surface 33 and then inclined in a direction substantially orthogonal to the connection surface 33. In the example shown in FIG. 11C, the inner side surface 36 is inclined so that the inclination changes in two stages from the lead side surface 34 side to the connection surface 33 and then substantially orthogonal to the connection surface 33. Inclined in the direction. In the example shown in FIG. 11D, the inner side surface 36 is inclined linearly without changing its inclination from the lead side surface 34 side to the connection surface 33.
　なお、本発明は上記した各実施形態に限定されるものではなく、その趣旨を逸脱しない限りにおいて、上記したもの以外に種々の変更を行なうことが可能であり、例えば、上記した実施形態では、全てのリード３２がリード側面３４を有するように構成されているが、リードフレーム３がリード側面３４を有するリード３２を少なくとも１つ備えていればよい。具体的には、パッケージ側面４２に露出するリード側面３４を有さないリード３２の接続面３３が、例えば樹脂パッケージ４の実装面４１の中央寄りに実装面４１と同一面を成すように露出して外部接続端子５が形成されていてもよい。すなわち、リード３２が、接続面３３に連続してパッケージ側面４２に露出するリード側面３４を有する場合に、該リード側面３４の接続面３３との境界部分に凹部３５が上記したように形成されていればよい。 The present invention is not limited to the above-described embodiments, and various modifications other than those described above can be made without departing from the spirit thereof. For example, in the above-described embodiments, All the leads 32 are configured to have the lead side surface 34, but the lead frame 3 may include at least one lead 32 having the lead side surface 34. Specifically, the connection surface 33 of the lead 32 that does not have the lead side surface 34 exposed on the package side surface 42 is exposed so as to be flush with the mounting surface 41 near the center of the mounting surface 41 of the resin package 4, for example. The external connection terminal 5 may be formed. That is, when the lead 32 has the lead side surface 34 exposed to the package side surface 42 continuously to the connection surface 33, the recess 35 is formed at the boundary portion between the lead side surface 34 and the connection surface 33 as described above. Just do it.
　また、モジュール１の集合体を形成するためのリードフレーム６の構成は上記した例に限定されるものではなく、リードフレーム６が備えるモジュール領域６１の数やその配列状態は適宜最適な形に構成すればよい。また、各モジュール領域に配置されるリード３２の数やその配置状態は、ステージ３１に搭載される電子部品２の構成に応じて適宜変更してもよい。また、モジュール１に複数の電子部品２が搭載されていてもよい。 Further, the configuration of the lead frame 6 for forming the assembly of the modules 1 is not limited to the above-described example, and the number of the module regions 61 provided in the lead frame 6 and the arrangement state thereof are appropriately optimized. do it. In addition, the number of leads 32 arranged in each module region and the arrangement state thereof may be appropriately changed according to the configuration of the electronic component 2 mounted on the stage 31. A plurality of electronic components 2 may be mounted on the module 1.
　また、電子部品と、電子部品に接続された複数のリードを有するリードフレームと、電子部品を被覆し一側に実装面を有する樹脂パッケージとを備え、各リードそれぞれに設けられた接続面が、実装面に露出して外部接続端子を成す面実装型のモジュールおよびその製造方法に本発明を広く適用することができる。 In addition, an electronic component, a lead frame having a plurality of leads connected to the electronic component, and a resin package that covers the electronic component and has a mounting surface on one side, a connection surface provided on each lead, The present invention can be widely applied to a surface mounting type module that is exposed to a mounting surface and forms an external connection terminal, and a manufacturing method thereof.
　１　　モジュール
　２　　電子部品
　３，６　　リードフレーム
　３２　　リード
　３３　　接続面
　３４　　リード側面
　３５　　凹部
　３６　　内側面
　４　　樹脂パッケージ
　４１　　実装面
　４２　　パッケージ側面
　５　　外部接続端子
　６１　　モジュール領域
　６４　　窪み
　７　　樹脂層
　ＣＬ　　切断ライン DESCRIPTION OF SYMBOLS 1 Module 2 Electronic component 3, 6 Lead frame 32 Lead 33 Connection surface 34 Lead side surface 35 Concave part 36 Inner side surface 4 Resin package 41 Mounting surface 42 Package side surface 5 External connection terminal 61 Module area | region 64 Depression 7 Resin layer CL cutting line

Claims (6)

  1. 　電子部品と、前記電子部品に接続された複数のリードを有するリードフレームと、前記電子部品を被覆し一側に実装面を有する樹脂パッケージとを備え、前記各リードそれぞれに設けられた接続面が、前記実装面に露出して外部接続端子を成す面実装型のモジュールにおいて、
    　前記各リードのうち少なくとも１つは、前記接続面に連続し前記樹脂パッケージのパッケージ側面に露出するリード側面を有すると共に、前記リード側面の前記接続面との境界部分に窪んだ凹部を有し、前記凹部の内側面は、前記接続面に向うに連れて傾斜して形成されている
    　ことを特徴とするモジュール。     An electronic component; a lead frame having a plurality of leads connected to the electronic component; and a resin package that covers the electronic component and has a mounting surface on one side; and a connection surface provided on each of the leads In a surface mount type module that is exposed on the mounting surface and forms an external connection terminal,
    At least one of the leads has a lead side surface that is continuous with the connection surface and exposed on a package side surface of the resin package, and has a concave portion that is recessed at a boundary portion between the lead side surface and the connection surface, The module is characterized in that an inner side surface of the concave portion is formed to be inclined toward the connection surface.
  2. 　前記凹部の前記内側面は、めっきされていることを特徴とする請求項１に記載のモジュール。 2. The module according to claim 1, wherein the inner surface of the recess is plated.
  3. 　面実装型のモジュールの製造方法において、
    　複数のモジュール領域を有し、前記各モジュール領域のそれぞれに電子部品と接続される複数のリードが配置されたリードフレームを用意する用意工程と、
    　前記リードフレームの前記各モジュール領域のそれぞれに前記電子部品を搭載すると共に当該電子部品が搭載された前記モジュール領域に配置された前記複数のリードと接続する搭載工程と、
    　前記各電子部品を被覆すると共に、前記各リードそれぞれに設けられた接続面が外部接続端子として露出した実装面を有する樹脂層を形成する封止工程と、
    　前記各モジュール領域を囲むように設定された切断ラインに沿って前記樹脂層を切断して複数の樹脂パッケージに個片化する個片化工程とを備え、
    　前記各リードのうち少なくとも１つは、前記切断ラインを跨ぐように前記樹脂層の前記実装面に露出する前記接続面を有し、前記接続面に前記切断ラインを跨ぐように窪みが形成されており、前記個片化工程において前記窪みの位置で前記切断ラインに沿って切断されることにより、前記樹脂パッケージのパッケージ側面に露出するリード側面が前記接続面に連続するように形成されると共に、前記リード側面の前記接続面との境界部分に凹部が形成され、前記凹部の内側面は、前記接続面に向うに連れて傾斜している
    　ことを特徴とするモジュールの製造方法。     In the manufacturing method of the surface mount type module,
    A preparation step of preparing a lead frame having a plurality of module regions, and each of the module regions having a plurality of leads connected to electronic components;
    A mounting step of mounting the electronic component in each of the module regions of the lead frame and connecting the plurality of leads arranged in the module region in which the electronic component is mounted;
    A sealing step of covering each electronic component and forming a resin layer having a mounting surface where the connection surface provided on each of the leads is exposed as an external connection terminal;
    A step of dividing the resin layer into a plurality of resin packages by cutting the resin layer along a cutting line set so as to surround each module region;
    At least one of the leads has the connection surface exposed on the mounting surface of the resin layer so as to straddle the cutting line, and a recess is formed on the connection surface so as to straddle the cutting line. In the individualization step, the lead side surface exposed to the package side surface of the resin package is formed to be continuous with the connection surface by being cut along the cutting line at the position of the depression. A method of manufacturing a module, wherein a concave portion is formed in a boundary portion between the lead side surface and the connection surface, and an inner surface of the concave portion is inclined toward the connection surface.
  4. 　前記個片化工程の前に、前記リードフレームの少なくとも前記接続面および前記窪みの内面をめっきするめっき工程をさらに備えることを特徴とする請求項３に記載のモジュールの製造方法。 4. The module manufacturing method according to claim 3, further comprising a plating step of plating at least the connection surface of the lead frame and an inner surface of the recess before the individualization step.
  5. 　前記用意工程において、プレス加工により前記窪みが形成された前記リードを有する前記リードフレームを形成することを特徴とする請求項３または４に記載のモジュールの製造方法。 The method for manufacturing a module according to claim 3 or 4, wherein, in the preparing step, the lead frame having the leads in which the depressions are formed is formed by press working.
  6. 　前記用意工程において、エッチング加工により前記窪みが形成された前記リードを有する前記リードフレームを形成することを特徴とする請求項３または４に記載のモジュールの製造方法。 The module manufacturing method according to claim 3 or 4, wherein, in the preparation step, the lead frame having the lead in which the recess is formed by etching is formed.
PCT/JP2014/061524 2013-08-02 2014-04-24 Module and method for manufacturing same WO2015015850A1 (en)

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JP2017038051A (en) * 2015-08-10 2017-02-16 株式会社ジェイデバイス Semiconductor package and manufacturing method of the same
CN106783792A (en) * 2017-03-22 2017-05-31 江苏长电科技股份有限公司 There is a kind of plastic-sealed body lateral leads side to climb the encapsulating structure of tin performance
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JP2012234955A (en) * 2011-04-28 2012-11-29 Toshiba Corp Led package and method for manufacturing the same

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Publication number Priority date Publication date Assignee Title
JP2017038051A (en) * 2015-08-10 2017-02-16 株式会社ジェイデバイス Semiconductor package and manufacturing method of the same
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CN106783792A (en) * 2017-03-22 2017-05-31 江苏长电科技股份有限公司 There is a kind of plastic-sealed body lateral leads side to climb the encapsulating structure of tin performance
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