WO2014201747A1 - 一种靶材的刻蚀量测装置及量测方法 - Google Patents

一种靶材的刻蚀量测装置及量测方法 Download PDF

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Publication number
WO2014201747A1
WO2014201747A1 PCT/CN2013/079657 CN2013079657W WO2014201747A1 WO 2014201747 A1 WO2014201747 A1 WO 2014201747A1 CN 2013079657 W CN2013079657 W CN 2013079657W WO 2014201747 A1 WO2014201747 A1 WO 2014201747A1
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WIPO (PCT)
Prior art keywords
target
etch
guide rail
measuring
etching
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Ceased
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PCT/CN2013/079657
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English (en)
French (fr)
Inventor
傅品正
陈招睦
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Application filed by Shenzhen China Star Optoelectronics Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Technology Co Ltd
Priority to US14/111,801 priority Critical patent/US9366521B2/en
Publication of WO2014201747A1 publication Critical patent/WO2014201747A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/18—Measuring arrangements characterised by the use of mechanical techniques for measuring depth
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/18—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring depth
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/0002—Arrangements for supporting, fixing or guiding the measuring instrument or the object to be measured

Definitions

  • the invention belongs to the technical field of PVD, and particularly relates to an etching measuring device and a measuring method for a target. Background technique
  • An etch measuring device for a target wherein the etch measuring device of the target comprises a guide rail, a positioning component, and an etch depth measuring component, the etch depth amount
  • the measuring member is disposed on the rail in a manner of relative movement with the guide rail, and the positioning member is disposed on both sides of the rail to support the rail.
  • the etch depth measuring component includes a depth gauge for measuring an etch depth of the target.
  • the positioning member includes a magnetic member.
  • the magnetic member comprises a magnet or an electromagnet.
  • the etch measuring device of the target further includes a connection between the positioning component and the guide rail and between the etch depth measuring component and the guide rail. Connector.
  • the bottom side of the guide rail is provided with a sliding groove extending along the longitudinal direction of the guide rail.
  • the sliding slot has a sliding receiving portion and a clamping portion, and an upper portion of the connecting member is provided with a flange matching the sliding receiving portion, and the clamping portion is located in the sliding receiving portion Below the portion and used to hold the flange.
  • the upper part of the connecting member is provided with an elastic member having an upward movement tendency
  • the sliding groove is arranged with a plurality of positioning holes along the longitudinal direction of the guide rail, the elastic member and the elastic member The plurality of positioning holes are adapted.
  • the elastic member is a spring positioning pin.
  • the etch measuring device of the target further includes a connection between the positioning component and the guide rail and between the etch depth measuring component and the guide rail.
  • a connecting member a bottom side of the rail is provided with a sliding slot extending along a longitudinal direction of the rail, the sliding slot has a sliding receiving portion and a clamping portion, and an upper portion of the connecting member is provided with the sliding receiving portion A mating flange, the grip portion being located below the sliding receptacle and for retaining the flange.
  • an etching measurement method for a target includes the following steps:
  • the etch depth measuring component is positioned directly above the target by the positioning component, and the length direction measuring step moves the etch depth measuring component along the length direction of the guide rail to measure the etching depth of the target Measurement.
  • the etch depth measuring component includes a depth gauge for measuring an etch depth of the target.
  • the positioning member includes a magnetic member.
  • the magnetic member comprises a magnet or an electromagnet.
  • a connecting member is disposed between the positioning member and the guide rail and between the etching depth measuring member and the guide rail.
  • the bottom side of the guide rail is provided with a sliding slot extending along the longitudinal direction of the guide rail, the sliding slot has a sliding receiving portion and a clamping portion, and the upper portion of the connecting member is provided with The sliding receiving portion is matched to a flange, and the clamping portion is located below the sliding receiving portion and serves to hold the flange.
  • the beneficial effects of the present invention are:
  • the etch measuring device of the target of the present invention comprises a guide rail, a positioning component and an etch depth measuring component, wherein the etch depth measuring component is disposed in a manner of moving relative to the guide rail On the guide rail, the positioning component is disposed on two sides of the guide rail to support the guide rail, thereby fixing the guide rail above the surface of the target by the positioning component, and moving the etching depth measuring component to measure The etch depth anywhere on the surface of the target. Based on the measurement data of the etch depth measuring component, the magnet is adjusted to increase the uniformity of the etching depth of the target, thereby improving the utilization of the target.
  • Fig. 1 is a view for explaining a state of etching depth of a target.
  • FIG. 2 is a schematic front elevational view of an etch measuring apparatus for a target in accordance with an embodiment of the present invention.
  • Figure 3 is a plan view of the etching measuring device of the target of Figure 2;
  • Figure 4 is a bottom plan view of the guide rail of the etch measuring device of the target of Figure 2;
  • Figure 5 is a cross-sectional view taken along the line A-A of the guide rail of Figure 4;
  • Figure 6 is a front elevational view of the guide rail of Figure 4.
  • Figure 7 is a side elevational view of the connector of the etch measuring device of the target of Figure 2.
  • Figure 8 is a side elevational view of the depth gauge of the etch measuring apparatus of the target of Figure 2.
  • Figure 9 is a side elevational view of the support rod of the etch measuring device of the target of Figure 2.
  • Figure 10 is a diagram for explaining the flow of an etching measurement method of a target according to an embodiment of the present invention.
  • the etch depth h of the etched portion 102 of the target is not uniformly distributed.
  • the etch depth h of the target etch 102 is closely related to the magnet movement, gas flow, etc. in the PVD equipment machine. There will also be differences between PVD equipment machines in different factories and different periods.
  • the target can only be taken off the machine and sent back to the target manufacturer for re-production and return. Therefore, there is a need for a device that can measure the etch depth of a target directly on a PVD equipment machine during maintenance of the PVD equipment to obtain timely and accurate measured values, thereby adjusting the magnet to improve the target.
  • the uniformity of the etching depth, thereby improving the utilization of the target is of great significance in actual production.
  • the etch measuring device of the target includes a guide rail 400, a positioning member 600, and an etch depth measuring member 500.
  • the etch depth measuring member 500 is disposed on the guide rail 400 in such a manner as to move relative to the guide rail 400.
  • the positioning component 600 is provided
  • the rails 400 are supported on both sides of the guide rail 400.
  • the guide rail is fixed over the surface of the target by the positioning member, and the etching depth measuring member is moved to measure the etching depth anywhere on the surface of the target.
  • the magnet is adjusted to increase the uniformity of the etching depth of the target, thereby improving the utilization of the target.
  • the more uniform the etched depth of the target the higher the target utilization rate, thus extending the downtime of the target.
  • the downtime of the target is extended, which can save material costs.
  • the more uniform the etching depth of the target the smaller the defect probability of the formed product, and the better the production stability.
  • the etching depth measuring part 500 includes a depth gauge (also called an altimeter) for measuring the etching depth h of the target 100.
  • the depth gauge can be a commercially available digital depth gauge.
  • the positioning member 600 includes a magnetic member 200. More specifically, the magnetic member 200 may include a magnet or an electromagnet.
  • the etch measuring device of the target further includes a connecting member connected between the positioning member 600 and the guide rail 400 and connected between the etch depth measuring member 500 and the guide rail 400. 700.
  • the etch depth measuring member 500 is movably coupled to the guide rail 400 via a connector 700.
  • the positioning member 600 is movably coupled to the guide rail 400 by a connector 700. As shown in FIG.
  • the guide rail 400 in the etch measuring device of the target of the embodiment, includes a body 410 , an end cover 402 , and a sliding along the longitudinal direction X of the guide rail 400 .
  • a chute 430 is formed on the body 410.
  • the chute 430 is located on the bottom side of the guide rail 400.
  • End caps 402 can be sleeved on both ends 420 of body 410.
  • the connecting member 700 includes a body 720, a flange 730 disposed on an upper portion of the body 720, and an elasticity embedded in the body 720. And a connecting portion 710 for connecting the etch depth measuring component 500 or the positioning component 600.
  • the connecting portion 710 can be a threaded connecting portion.
  • the etch depth measuring component 500 includes a depth gauge for measuring the etch depth h of the target 100.
  • the depth gauge can be a digital depth gauge that is commercially available.
  • the etch depth measuring component 500 includes a body 510 and a probe 520.
  • the connecting portion 710 is coupled to the body 510.
  • the positioning component 600 can include a magnetic member 200. More specifically, the magnetic member 200 may include a magnet or an electromagnet. In the embodiment shown in Figure 1, the magnetic member 200 is an electromagnet.
  • the magnetic member 200 is connected to the connecting member 700 through the support rod 800. Thereby, the two magnetic members 200 disposed on the left and right can be used as the adsorption
  • the target etch measuring device is adsorbed on a suitable component (such as a cavity door panel).
  • the support rod 800 includes a body 810, a connecting rod 820, and a connecting groove 830.
  • the connection slot 830 is mated to the connection portion 710.
  • the lower end of the connecting rod 820 is coupled to the magnetic member 200.
  • the connecting rod 820 can be configured to be telescopically coupled to the body 810 for freely adjusting the height between the rail 400 and the target 100.
  • the chute 430 has a sliding receiving portion 432 and a clamping portion 434.
  • the upper portion of the connector 700 is correspondingly provided with a flange 732 that mates with the sliding receiving portion 432.
  • the grip portion 434 is located below the sliding receiving portion 432 and serves to retain the flange 732.
  • the etch depth measuring member 500 is movably coupled to the guide rail 400 through the connecting member 700 without coming off the guide rail 400.
  • the positioning member 600 is movably coupled to the guide rail 400 by a connector 700 without departing from the guide rail 400.
  • the upper portion of the connecting member 700 is provided with an elastic member 740 having an upward movement tendency.
  • the elastic member 740 is a spring positioning pin.
  • Spring locating pins are commercially available and are preferably spring locating pins with push buttons.
  • the chute 430 is provided with a plurality of positioning holes 440 along the longitudinal direction X of the guide rail 400.
  • the elastic member 740 is adapted to the plurality of positioning holes 440. Thereby, the positioning of the etching depth measuring component 500 and the positioning component 600 can be realized by the cooperation of the elastic member 740 and the positioning hole 440.
  • the elastic member 740 is pressed down by a button (not shown), and the etching depth measuring member 500 or the positioning member 600 is manually moved.
  • the etching measurement method of the target includes a positioning step S1 and a rail length direction X measuring step S2.
  • the etching depth measuring member 500 is positioned directly above the target 100 by the positioning member 600. After the positioning step S1, the etch depth measuring component 500 can be zero-aligned at the unetched edge of the target 100.
  • the etching depth measuring member 500 is moved along the longitudinal direction X of the rail to measure the etching depth h of the target 100.
  • the positioning step S1 and the rail length direction X measuring step S2 can be repeated as needed.
  • An etching measuring device that moves the target along the width direction Y of the target 100 measures the etching depth h of the arbitrary position of the target 100.
  • the etching depth of the target material can be directly measured on the PVD equipment machine during the maintenance of the PVD equipment machine, and the measured value can be obtained in time and accurately, and further Correct The magnet is adjusted to increase the uniformity of the etch depth of the target, thereby improving target utilization.
  • the utilization rate of the target material can be quickly and quickly improved, and the purchase amount of the target material can be reduced. For example, the price of ITO (Indium Tin Oxides) targets is high, which has long-term benefits for controlling costs.
  • the end product manufacturer does not need to send the residual target back to the target manufacturer for measurement, and then adjusts, and the etch measurement of the target can be performed by itself.
  • the measurement data feedback is timely, the cycle is short, and the magnet is adjusted on site, without using the logistics to return the target.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Physical Vapour Deposition (AREA)
  • Investigating Or Analyzing Materials By The Use Of Magnetic Means (AREA)
  • ing And Chemical Polishing (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)

Abstract

一种靶材的刻蚀量测装置及量测方法，其中靶材的刻蚀量测装置包括导轨（400）、定位部件（600）及刻蚀深度量测部件（500），刻蚀深度量测部件（500）以与导轨（400）相对移动的方式设置在导轨（400）上，定位部件（600）设置在导轨（400）的两侧以支撑导轨（400）。由此，通过定位部件将导轨固定在靶材的表面上方，并移动刻蚀深度量测部件以量测靶材的表面任意处的刻蚀深度。基于刻蚀深度量测部件的量测数据，对磁石进行调节以提高靶材的刻蚀深度的均匀度，从而提高靶材利用率。

Description

一种靶材的刻蚀量测装置及量测方法 技术领域
本发明属于 PVD工艺技术领域， 尤其涉及一种靶材的刻蚀量测装置及量测方 法。 背景技术
在 TFT( Thin film transistor )及液晶显示器制造技术领域中，许多 PVD(Physical Vapor Deposition)设备釆用磁控溅射来增加靶材效率。 设于靶材的下面的磁石可以 提高靶材的利用率， 但同时磁石的移动会形成刻蚀曲线。 当靶材的刻蚀深度 ( Erosion Depth )到达一定程度便无法使用。
因此， 需要量测已用靶材的刻蚀深度， 并调整磁石的移动和磁力线的分布， 使刻蚀曲线均匀分布， 以提高靶材利用率。 发明内容
本发明的目的在于， 提供一种靶材的刻蚀量测装置， 其能够量测靶材的刻蚀 深度。
本发明通过如下技术方案实现： 一种靶材的刻蚀量测装置， 其中， 所述靶材 的刻蚀量测装置包括导轨、 定位部件及刻蚀深度量测部件， 所述刻蚀深度量测部 件以与所述导轨相对移动的方式设置在所述导轨上， 所述定位部件设置在所述导 轨的两侧以支撑所述导轨。
作为上述技术方案的进一步改进， 所述刻蚀深度量测部件包括用于量测靶材 的刻蚀深度的深度计。
作为上述技术方案的进一步改进， 所述定位部件包括磁性件。
作为上述技术方案的进一步改进， 所述磁性件包括磁石或电磁铁。
作为上述技术方案的进一步改进， 所述靶材的刻蚀量测装置还包括连接在所 述定位部件与所述导轨之间及连接在所述刻蚀深度量测部件与所述导轨之间的连 接件。
作为上述技术方案的进一步改进， 所述导轨的底侧设有沿所述导轨的长度方 向延伸的滑槽。 作为上述技术方案的进一步改进， 所述滑槽具有滑动容纳部及夹持部， 所述 连接件的上部设有与所述滑动容纳部匹配的凸缘， 所述夹持部位于所述滑动容纳 部的下方并用于保持所述凸缘。
作为上述技术方案的进一步改进， 所述连接件的上部设有具有向上运动趋势 的弹性件， 所述滑槽沿所述导轨的长度方向均勾布置有多个定位孔， 所述弹性件 与所述多个定位孔相适配。
作为上述技术方案的进一步改进， 所述弹性件为弹簧定位销。
作为上述技术方案的进一步改进， 所述靶材的刻蚀量测装置还包括连接在所 述定位部件与所述导轨之间及连接在所述刻蚀深度量测部件与所述导轨之间的连 接件， 所述导轨的底侧设有沿所述导轨的长度方向延伸的滑槽， 所述滑槽具有滑 动容纳部及夹持部， 所述连接件的上部设有与所述滑动容纳部匹配的凸缘， 所述 夹持部位于所述滑动容纳部的下方并用于保持所述凸缘。
根据本发明的另一方面， 提供了一种靶材的刻蚀量测方法， 其中， 所述靶材 的刻蚀量测方法包括以下步骤：
定位步骤， 通过定位部件将刻蚀深度量测部件定位在靶材的正上方， 长度方向量测步骤， 沿一导轨的长度方向移动刻蚀深度量测部件， 对靶材的 刻蚀深度进行量测。
作为上述技术方案的进一步改进， 所述刻蚀深度量测部件包括用于量测靶材 的刻蚀深度的深度计。
作为上述技术方案的进一步改进， 所述定位部件包括磁性件。
作为上述技术方案的进一步改进， 所述磁性件包括磁石或电磁铁。
作为上述技术方案的进一步改进， 在所述定位部件与所述导轨之间及在所述 刻蚀深度量测部件与所述导轨之间设置有连接件。
作为上述技术方案的进一步改进， 所述导轨的底侧设有沿所述导轨的长度方 向延伸的滑槽， 所述滑槽具有滑动容纳部及夹持部， 所述连接件的上部设有与所 述滑动容纳部匹配的凸缘， 所述夹持部位于所述滑动容纳部的下方并用于保持所 述凸缘。
本发明的有益效果是： 本发明的靶材的刻蚀量测装置包括导轨、 定位部件及 刻蚀深度量测部件， 所述刻蚀深度量测部件以与所述导轨相对移动的方式设置在 所述导轨上， 所述定位部件设置在所述导轨的两侧以支撑所述导轨， 由此， 通过 定位部件将导轨固定在靶材的表面上方， 并移动刻蚀深度量测部件以量测靶材的 表面任意处的刻蚀深度。 基于刻蚀深度量测部件的量测数据， 对磁石进行调节以 提高靶材的刻蚀深度的均匀度， 从而提高靶材利用率。
附图说明
图 1是用于说明靶材的刻蚀深度的情形的图。
图 2是根据本发明的一个具体实施例的靶材的刻蚀量测装置的概略正面图。 图 3是图 2的靶材的刻蚀量测装置的俯视图。
图 4是图 2的靶材的刻蚀量测装置的导轨的仰视图。
图 5是图 4的导轨的 A-A截面图。
图 6是图 4的导轨的正面图。
图 7是图 2的靶材的刻蚀量测装置的连接件的侧视图。
图 8是图 2的靶材的刻蚀量测装置的深度计的侧视图。
图 9是图 2的靶材的刻蚀量测装置的支撑杆的侧视图。
图 10是用于说明根据本发明的一个具体实施例的靶材的刻蚀量测方法的流程 的图。
具体实施方式
以下结合附图对本发明的具体实施方式进行进一步的说明。
如图 1所示， 靶材的蚀刻处 102的刻蚀深度 h并不是均匀分布的。 靶材的蚀 刻处 102的刻蚀深度 h与 PVD设备机台内的磁石移动、 气流等紧密相关。 不同工 厂、 不同时期的 PVD设备机台之间也会有差别。 一旦靶材的刻蚀深度 h接近靶材 厚度 d值， 靶材就只能下机， 送回靶材厂商重新制作后送回。 因此， 需要一种可 以在 PVD设备机台保养时直接在 PVD设备机台上量测靶材的刻蚀深度的装置， 以得到及时、 准确的实测值， 进而对磁石进行调节以提高靶材的刻蚀深度的均匀 度， 从而提高靶材利用率， 这在实际生产中有着重大意义。
鉴于此， 本发明人提出了一种靶材的刻蚀量测装置。 该靶材的刻蚀量测装置 包括导轨 400、定位部件 600及刻蚀深度量测部件 500。所述刻蚀深度量测部件 500 以与所述导轨 400相对移动的方式设置在所述导轨 400上。 所述定位部件 600设 置在所述导轨 400的两侧以支撑所述导轨 400。
由此， 通过定位部件将导轨固定在靶材的表面上方， 并移动刻蚀深度量测部 件以量测靶材的表面任意处的刻蚀深度。 基于刻蚀深度量测部件的量测数据， 对 磁石进行调节以提高靶材的刻蚀深度的均匀度， 从而提高靶材利用率。 靶材的刻 蚀深度越均匀， 靶材的使用率越高， 从而延长靶材的下机时间。 靶材的下机时间 延长， 可以节约物料成本。 而且， 从生产工艺上考虑， 靶材的刻蚀深度越均匀， 形成的产品的缺陷几率越小， 生产稳定性越好。
本实施例的靶材的刻蚀量测装置中， 所述刻蚀深度量测部件 500 包括用于量 测靶材 100的刻蚀深度 h的深度计（也称高度计）。 深度计可以为市面销售的数显 深度计。 所述定位部件 600包括可以磁性件 200。 更具体而言， 所述磁性件 200可 以包括磁石或电磁铁。 此外， 所述靶材的刻蚀量测装置还包括连接在所述定位部 件 600与所述导轨 400之间及连接在所述刻蚀深度量测部件 500与所述导轨 400 之间的连接件 700。 易言之， 所述刻蚀深度量测部件 500通过连接件 700可移动地 连接在导轨 400上。 定位部件 600通过连接件 700可移动地连接在导轨 400上。 如图 1、 图 4及图 5所示， 本实施例的靶材的刻蚀量测装置中， 所述导轨 400 包括本体 410、 端盖 402、 沿所述导轨 400的长度方向 X延伸的滑槽 430、 定位孔 440。 滑槽 430形成于本体 410上。 且滑槽 430位于导轨 400的底侧。 端盖 402可 套设在本体 410的两个端部 420上。
如图 Ί所示， 在本实施例的靶材的刻蚀量测装置中， 所述连接件 700包括本 体 720、 设于本体 720上部的凸缘 730、 嵌设于所述本体 720内的弹性件 740、 及 用于连接刻蚀深度量测部件 500或定位部件 600的连接部 710。 其中， 连接部 710 可以为螺纹连接部。
如上所述， 所述刻蚀深度量测部件 500包括用于量测靶材 100的刻蚀深度 h 的深度计。 深度计可以为市面销售的数显深度计。 如图 8所示， 所述刻蚀深度量 测部件 500包括本体 510及探针 520。 连接部 710与本体 510连接。 所述定位部件 600可以包括磁性件 200。 更具体而言， 所述磁性件 200可以包括磁石或电磁铁。 在图 1所示的实施例中， 所述磁性件 200为电磁铁。 且所述磁性件 200通过支撑 杆 800与连接件 700连接。 由此， 可以通过左右设置的两个磁性件 200作为吸附 支脚， 将靶材的刻蚀量测装置吸附在适当的零部件（例如腔体门板）上。
其中， 如图 9所示， 支撑杆 800包括本体 810、 连接杆 820、 连接槽 830。 连 接槽 830与连接部 710匹配连接。 连接杆 820的下端与磁性件 200连接。 在本发 明的一个优选实施例中， 连接杆 820可以构成为与本体 810之间伸缩连接， 实现 导轨 400与靶材 100之间的高度自由调节。
如图 5所示， 所述滑槽 430具有滑动容纳部 432及夹持部 434。 如图 7所示， 所述连接件 700的上部相应地设有与所述滑动容纳部 432匹配的凸缘 732。所述夹 持部 434位于所述滑动容纳部 432的下方并用于保持所述凸缘 732。 由此， 所述刻 蚀深度量测部件 500通过连接件 700可移动地连接在导轨 400上， 且不会脱离导 轨 400。 定位部件 600通过连接件 700可移动地连接在导轨 400上， 且不会脱离导 轨 400。
此外，所述连接件 700的上部设有具有向上运动趋势的弹性件 740。具体而言， 本实施例中， 所述弹性件 740为弹簧定位销。 弹簧定位销可以从市场上购得， 并 优选具有按压按钮的弹簧定位销。 相应地， 如图 4所示， 所述滑槽 430沿所述导 轨 400的长度方向 X均勾布置有多个定位孔 440。 所述弹性件 740与所述多个定 位孔 440相适配。 由此， 可以通过弹性件 740与定位孔 440的配合， 实现刻蚀深 度量测部件 500及定位部件 600定位。 在需要刻蚀深度量测部件 500或定位部件 600时， 通过按钮（未图示）向下按压弹性件 740, 并手动移动刻蚀深度量测部件 500或定位部件 600即可。
根据本发明的另一方面， 还提供了一种靶材的刻蚀量测方法。 如图 10所示， 所述靶材的刻蚀量测方法包括定位步骤 S1及导轨长度方向 X量测步骤 S2。
在定位步骤 S1中，通过定位部件 600将刻蚀深度量测部件 500定位在靶材 100 的正上方。 在定位步骤 S1之后， 可以在靶材 100的未蚀刻的边缘处对刻蚀深度量 测部件 500进行调零校准。在导轨长度方向 X量测步骤 S2中， 沿导轨长度方向 X 移动刻蚀深度量测部件 500, 对靶材 100的刻蚀深度 h进行量测。 可以根据需要， 重复定位步骤 S1及导轨长度方向 X量测步骤 S2。 沿靶材 100的宽度方向 Y移动 靶材的刻蚀量测装置， 对靶材 100的任意位置的刻蚀深度 h进行量测。
根据本发明的靶材的刻蚀量测装置及量测方法， 可以在 PVD设备机台保养时 直接在 PVD设备机台上量测靶材的刻蚀深度， 得到及时、 准确的实测值， 进而对 磁石进行调节以提高靶材的刻蚀深度的均匀度， 从而提高靶材利用率。 根据本发 明的靶材的刻蚀量测装置及量测方法， 可及时快速的提高靶材利用率， 减少靶材 的购买数量。 例如 ITO ( Indium Tin Oxides )靶材的售价高昂， 这对控制成本有长 远利益。 根据本发明的靶材的刻蚀量测装置及量测方法， 终端产品生产商无需将 残靶送回到靶材厂商处量测后再进行调整， 可以自行进行靶材的刻蚀量测， 测量 数据反馈及时， 周期短， 现场调整磁石， 无需利用物流退运靶材。
以上具体实施方式对本发明进行了详细的说明， 但这些并非构成对本发明的 限制。 本发明的保护范围并不以上述实施方式为限， 但凡本领域普通技术人员根 据本发明所揭示内容所作的等效修饰或变化， 皆应纳入权利要求书中记载的保护 范围内。

Claims

权 利 要 求 书
1、一种靶材的刻蚀量测装置，其中 ,所述靶材的刻蚀量测装置包括导轨（ 400 )、 定位部件（600)及刻蚀深度量测部件（500), 所述刻蚀深度量测部件（500) 以 与所述导轨（ 400 )相对移动的方式设置在所述导轨（ 400 )上，所述定位部件（ 600 ) 设置在所述导轨（400) 的两侧以支撑所述导轨（400)。
2、 根据权利要求 1所述的靶材的刻蚀量测装置， 其中， 所述刻蚀深度量测部 件（500) 包括用于量测靶材 ( 100)的刻蚀深度 (h)的深度计。
3、 根据权利要求 1所述的靶材的刻蚀量测装置， 其中， 所述定位部件（600) 包括磁性件（ 200 )。
4、 根据权利要求 3 所述的靶材的刻蚀量测装置， 其中， 所述磁性件 (200) 包括磁石或电磁铁。
5、 根据权利要求 1所述的靶材的刻蚀量测装置， 其中， 所述靶材的刻蚀量测 装置还包括连接在所述定位部件（600)与所述导轨（400)之间及连接在所述刻 蚀深度量测部件（500)与所述导轨 (400)之间的连接件（700)。
6、 根据权利要求 5 所述的靶材的刻蚀量测装置， 其中， 所述导轨（400) 的 底侧设有沿所述导轨 (400) 的长度方向 （X)延伸的滑槽（430)。
7、 根据权利要求 6所述的靶材的刻蚀量测装置， 其中， 所述滑槽（430)具 有滑动容纳部（432)及夹持部（434), 所述连接件（700) 的上部设有与所述滑 动容纳部 ( 432 )匹配的凸缘 ( 732 ),所述夹持部 ( 434 )位于所述滑动容纳部 ( 432 ) 的下方并用于保持所述凸缘（732)。
8、 根据权利要求 Ί所述的靶材的刻蚀量测装置， 其中， 所述连接件 (700) 的上部设有具有向上运动趋势的弹性件 ( 740 ),所述滑槽（ 430 )沿所述导轨 ( 400 ) 的长度方向 （X)均勾布置有多个定位孔（440), 所述弹性件（740)与所述多个 定位孔 ( 440 )相适配。
9、 根据权利要求 8所述的靶材的刻蚀量测装置， 其中， 所述弹性件 (740) 为弹簧定位销。
10、 根据权利要求 1 所述的靶材的刻蚀量测装置， 其中， 所述靶材的刻蚀量 测装置还包括连接在所述定位部件（600)与所述导轨 (400)之间及连接在所述 刻蚀深度量测部件（ 500 )与所述导轨（ 400 )之间的连接件 ( 700 ),所述导轨（ 400 ) 具有滑动容纳部（432)及夹持部（434), 所述连接件 (700) 的上部设有与所述 滑动容纳部 （432) 匹配的凸缘（732), 所述夹持部（434)位于所述滑动容纳部 (432)的下方并用于保持所述凸缘（732)。
11、 一种靶材的刻蚀量测方法， 其中， 所述靶材的刻蚀量测方法包括以下步 骤：
定位步骤（S1), 通过定位部件（600)将刻蚀深度量测部件（500)定位在靶 材（ 100) 的正上方，
长度方向量测步骤（S2), 沿一导轨的长度方向 （X)移动刻蚀深度量测部件 (500), 对靶材 (100) 的刻蚀深度 (h)进行量测。
12、 根据权利要求 11所述的靶材的刻蚀量测方法， 其中， 所述刻蚀深度量测 部件（500) 包括用于量测靶材 (100) 的刻蚀深度 (h) 的深度计。
13、根据权利要求 11所述的靶材的刻蚀量测方法，其中，所述定位部件（600) 包括磁性件（ 200 )。
14、 根据权利要求 13所述的靶材的刻蚀量测方法， 其中， 所述磁性件（200) 包括磁石或电磁铁。
15、根据权利要求 11所述的靶材的刻蚀量测方法，其中，在所述定位部件（ 600 ) 与所述导轨之间及所述刻蚀深度量测部件（500)与所述导轨之间设置有连接件
( 700 )。
16、 根据权利要求 15所述的靶材的刻蚀量测方法， 其中， 所述导轨的底侧设 有沿所述导轨的长度方向 （X)延伸的滑槽（430), 所述滑槽（430)具有滑动容 纳部 （432)及夹持部 （434), 所述连接件 (700) 的上部设有与所述滑动容纳部
(432) 匹配的凸缘（732), 所述夹持部（434)位于所述滑动容纳部（432)的下 方并用于保持所述凸缘（732)。
PCT/CN2013/079657 2013-06-21 2013-07-19 一种靶材的刻蚀量测装置及量测方法 Ceased WO2014201747A1 (zh)

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