WO2014188772A1 - 石膏ボードの製造方法および製造装置 - Google Patents
石膏ボードの製造方法および製造装置 Download PDFInfo
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- WO2014188772A1 WO2014188772A1 PCT/JP2014/057964 JP2014057964W WO2014188772A1 WO 2014188772 A1 WO2014188772 A1 WO 2014188772A1 JP 2014057964 W JP2014057964 W JP 2014057964W WO 2014188772 A1 WO2014188772 A1 WO 2014188772A1
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- Prior art keywords
- molding
- plate body
- embedded
- plate
- pair
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B19/00—Machines or methods for applying the material to surfaces to form a permanent layer thereon
- B28B19/0092—Machines or methods for applying the material to surfaces to form a permanent layer thereon to webs, sheets or the like, e.g. of paper, cardboard
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B17/00—Details of, or accessories for, apparatus for shaping the material; Auxiliary measures taken in connection with such shaping
- B28B17/0063—Control arrangements
- B28B17/0081—Process control
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B19/00—Machines or methods for applying the material to surfaces to form a permanent layer thereon
- B28B19/0015—Machines or methods for applying the material to surfaces to form a permanent layer thereon on multilayered articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B7/00—Moulds; Cores; Mandrels
- B28B7/0097—Press moulds; Press-mould and press-ram assemblies
Definitions
- the present invention relates to a method and apparatus for producing a gypsum board.
- the gypsum board is a plate-like body having a structure in which the upper surface, the lower surface, and the left and right side surfaces of the gypsum plate are covered with a base paper for board, and is widely used as a building material such as a ceiling material, a wall material, and a floor material.
- a method for producing a gypsum board for example, the following production methods are known. First, while continuously supplying a pair of upper and lower board base papers, a laminate is formed in which gypsum slurry is continuously injected into the gap between the pair of board base papers. At this time, the lower board base paper is folded upward along a score line formed on both side edges. Accordingly, the upper surface of the gypsum slurry is covered with the upper board base paper, and the lower face side and the left and right side faces are covered with the lower board base paper. By passing the laminate formed in this way between a pair of upper and lower molding plates, a molded body having a thickness corresponding to the interval between the plates is obtained. If this molded body is dried, a gypsum board as the final product can be obtained.
- this apparatus has a roll 136, an upper molding plate 124, a lower molding plate 108, and a lower molding plate 108 on the downstream side of the lower molding plate 108.
- An electrode (lower external electrode 138) spaced apart, a current detector 120, and an air cylinder 122 are provided.
- the lower external electrode 138 and the lower molding plate 108 are electrically connected to form a circuit 140, and the current detector 120 and the power source D are electrically connected to the circuit 140.
- the gypsum board manufacturing apparatus 100 makes it possible to detect the breakage of the board base paper by using the fact that the base paper for board is an insulator and that the gypsum slurry is a good electrical conductor. That is, in the gypsum board manufacturing apparatus 100, when the lower paper 116 that is an insulator is cut, the gypsum slurry that is a good conductor comes into contact with the lower molding plate 108 and the lower external electrode 138, and current is conducted to the circuit 140. Therefore, the current detector 120 can detect the cutting of the lower paper 116.
- the air cylinder 122 pulls up the upper molding plate 124 in accordance with a signal from the current detector 120, thereby widening the interval between the upper molding plate 124 and the lower molding plate 108. Thereby, the foreign material caught between the upper molding plate 124 and the lower molding plate 108 passes between the pair of molding plates. Thereafter, when the upper molding plate 124 is returned to the original position, the production can be resumed.
- the gypsum board can be continuously manufactured without stopping the manufacturing, and a large number of defective products are not continuously manufactured.
- gypsum mud leaks when the board base paper originally has a defect (hole), and the current is conducted to the circuit 140 to detect the presence of the defect. Can be detected.
- the present invention has been made in order to solve the above-described problems of the prior art, and can cope with an increase in the production speed of gypsum board, an increase in tension applied to the base paper for board, and a reduction in weight and thickness of the base paper for board.
- a gypsum board manufacturing method and a manufacturing apparatus capable of performing continuous production of gypsum board without stopping the manufacturing are provided.
- the present inventors have conventionally solved the problems of the prior art by embedding a paper break detection electrode, which has been disposed downstream of the end of the molding plate, inside the molding plate.
- the present invention has been completed by finding that it can be solved.
- a laminate is formed in which gypsum slurry is continuously injected into a gap between the upper and lower pair of board base papers, Is a method for producing a gypsum board having a step of obtaining a molded body having a thickness corresponding to the interval between plates by passing between a pair of upper and lower molding plates, wherein at least one of the pair of upper and lower molding plates is conductive.
- a method for manufacturing a gypsum board wherein the distance between the pair of upper and lower molding plates is expanded and the pair of upper and lower molding plates are returned to the original distance after the cause of conduction is eliminated.
- the embedded electrode is embedded in a portion of the plate body on the downstream side of the following molding start position.
- Molding start position Of the following (1) and (2), the most downstream position. (1) The position of the upstream end of one of the pair of upper and lower molding plates. (2) At least one of the pair of upper and lower molding plates is formed with a tapered portion whose plate thickness becomes thinner as it approaches the upstream end, and the taper portion allows the interval between the pair of molded plates to be the upstream end. The position of the downstream end of the said taper part in the form which has expanded as it approaches.
- the embedded electrode is embedded in a portion of the plate body from the molding start position to a position 50 mm downstream of the molding start position;
- at least one material selected from the group consisting of a cloth base phenolic resin laminate, a paper base phenolic resin laminate, an epoxy resin impregnated glass fiber cloth and an epoxy resin impregnated paper as the insulator;
- the material it is preferable to use at least one material selected from the group consisting of iron, stainless steel, and aluminum, or a material in which the material is hard chrome plated.
- a pair of upper and lower molding plates for molding a laminate in which gypsum slurry is injected into the gap between the pair of upper and lower board base papers to a thickness corresponding to the plate interval.
- At least one of the molded plates has a plate body made of a conductive material and an embedded electrode embedded in the plate body, and the embedded electrode is electrically isolated from the plate body by an insulator. Insulated and embedded so that a part thereof is exposed on the surface of the plate main body that contacts the base paper for board, the plate main body, and the embedded electrode embedded in the plate main body, Are electrically connected to form a circuit, and a current detector electrically connected to the circuit and at least one component in response to an electric signal from the current detector.
- Apparatus for manufacturing a gypsum board characterized by comprising an actuator for raising and lowering the plate, is provided.
- the embedded electrode is embedded in a portion of the plate body on the downstream side of the following molding start position.
- Molding start position Of the following (1) and (2), the most downstream position. (1) The position of the upstream end of one of the pair of upper and lower molding plates. (2) At least one of the pair of upper and lower molding plates is formed with a tapered portion whose plate thickness becomes thinner as it approaches the upstream end, and the taper portion allows the interval between the pair of molded plates to be the upstream end. The position of the downstream end of the said taper part in the form which has expanded as it approaches.
- the embedded electrode is embedded in a portion of the plate body from the molding start position to a position 50 mm downstream of the molding start position;
- the insulator is made of at least one material selected from the group consisting of a cloth base phenolic resin laminate, a paper base phenolic resin laminate, an epoxy resin impregnated glass fiber cloth, and an epoxy resin impregnated paper;
- the conductive material is at least one material selected from the group consisting of iron, stainless steel, and aluminum, or the material is hard chrome plated.
- gypsum board of the present invention it is possible to cope with the increase in production speed of gypsum board, the increase in tension applied to the base paper for board, and the reduction in weight and thickness of the base paper for board. Without making it possible, continuous production of gypsum board is possible.
- the gypsum board manufacturing method of the present invention forms a laminate in which gypsum slurry is continuously injected into the gap between a pair of board base papers while continuously supplying a pair of upper and lower board base papers.
- the present invention relates to a method for manufacturing a gypsum board having a step of obtaining a molded body having a thickness corresponding to a plate interval by passing between a pair of upper and lower molded plates.
- the manufacturing apparatus 1 shown in FIG. 1, the manufacturing apparatus 1A shown in FIG. 2, the manufacturing apparatus 1B shown in FIG. 3, and the manufacturing apparatus 1C shown in FIG. 5 are all manufacturing apparatuses capable of performing the manufacturing method of the present invention.
- a laminate is formed in which gypsum slurry 4 is continuously injected into the gap between the pair of board base papers 2.
- a step of obtaining a molded body having a thickness corresponding to the plate interval can be performed.
- Gypsum mud is calcined gypsum ( ⁇ -type hemihydrate gypsum, ⁇ -type hemihydrate gypsum) and mud (slurry) mainly composed of water.
- gypsum slurry also includes type III anhydrous gypsum in place of all or part of calcined gypsum.
- the gypsum slurry may contain additives such as an adhesion aid, a curing accelerator, and an admixture.
- Board base paper is paperboard for gypsum board production.
- a glass fiber mat for producing gypsum board is also included in the base paper for board.
- a sizing agent is mixed with board base paper (hereinafter sometimes referred to simply as “base paper”) in order to suppress water absorption during molding and to ensure insulation. Therefore, immediately after the base paper comes into contact with the gypsum slurry, moisture in the gypsum slurry does not penetrate to the surface layer of the base paper (the layer on the non-contact surface side with the gypsum slurry), and the base paper functions as an insulator.
- the thickness of the base paper for board is not particularly limited, but usually 0.2 to 1.0 mm is used.
- the production method of the present invention can be suitably used when producing a gypsum board at high speed. Specifically, it can be suitably used when producing a gypsum board at a production rate of 60 m / min or more.
- Molded plate In the manufacturing method of the present invention, as at least one of the pair of upper and lower molded plates, a plate body made of a conductive material and an embedded electrode embedded in the plate body are provided, and the embedded electrode is insulated. A body that is electrically insulated from the plate body by a body and embedded so that a part of the plate body is in contact with the board base paper is exposed. By embedding the electrode for detecting the breakage of the base paper for board in the plate body, it becomes possible to detect the breakage of the base paper for board earlier than the case where the electrode is arranged downstream from the end of the plate body.
- the lower embedded electrode 12 is electrically insulated from the lower plate body 10 by an insulator 14.
- the one embedded in the surface in contact with the lower board base paper 16 so as to be partially exposed is used.
- an upper plate body 26 made of a conductive material is used as the upper molding plate 24, as in the manufacturing apparatus 1A shown in FIG.
- An upper embedded electrode 28 embedded in the plate body 26 the upper embedded electrode 28 is electrically insulated from the upper plate body 26 by an insulator 30, and the upper board base paper of the upper plate body 26 What is necessary is just to use what was embedded so that the part might be exposed to the surface which touches 32.
- the lower molding plate 8 as shown in FIG. 1 and the upper molding plate 24 as shown in FIG. can also be used together. That is, as in the manufacturing apparatus 1B shown in FIG. 3, the lower molding plate 8 having the lower embedded electrode 12 is used, and the upper molding plate 24 having the upper embedded electrode 28 is used.
- an external electrode for detecting a piece of paper can be installed outside the molding plate.
- the manufacturing apparatus 1 ⁇ / b> C shown in FIG. 5 uses the lower molding plate 8 having the lower embedded electrode 12, and further has a lower external electrode 38 for detecting a piece of paper outside the lower molding plate 8. Is.
- the lower external electrode 38 is disposed on the downstream side of the lower molding plate 8 so as to be separated from the lower molding plate 8.
- the lower external electrode 38 is disposed so as to be in contact with the lower board base paper 16.
- the circuit 18 including the lower embedded electrode 12, the lower plate body 10, and the power source D1 even if a paper break cannot be detected by the circuit 18 including the lower embedded electrode 12, the lower plate body 10, and the power source D1, the lower external electrode 38, the lower plate body 10 and the power source are not detected.
- the circuit 40 including D3 backs up the circuit 18 and can detect a paper break.
- the lower external electrode 38 as shown in FIG. 5 can be installed in the manufacturing apparatus 1A as shown in FIG. 2 or the manufacturing apparatus 1B as shown in FIG. Also in these cases, the circuit 40 including the lower external electrode 38, the lower plate body 10 and the power source D3 shown in FIG. 5 is like the circuit 34 shown in FIG. 2, the circuits 18 and 34 shown in FIG. The effect of backing up the circuit including the buried electrode (lower buried electrode 12, upper buried electrode 28) can be obtained.
- the upper external electrode can also be used as an external electrode for backup (not shown).
- the upper external electrode is an electrode arranged on the downstream side of the upper molding plate and spaced apart from the upper molding plate, and is arranged so as to contact the upper board base paper.
- the backup circuit composed of the upper external electrode, the upper plate body, and the power source can detect a paper break in the same manner as the circuit 40 including the lower external electrode 38 shown in FIG. 5, and backs up the circuit including the embedded electrode. An effect can be obtained. Therefore, the circuit including the upper external electrode can be used in place of the circuit 40 including the lower external electrode 38 shown in FIG.
- the configuration of the lower molding plate and the upper molding plate is particularly important. Specifically, the arrangement position of the upper embedded electrode or the lower embedded electrode, the material of the insulator, the material of the conductive material constituting the upper plate body or the lower plate body, and the like are important. These points will be specifically described in the section of the manufacturing apparatus.
- a circuit In the manufacturing method of the present invention, a circuit is configured by electrically connecting a plate body and an embedded electrode embedded in the plate body, and a voltage is applied to the circuit. Accordingly, when the plate body and the embedded electrode come into contact with the gypsum slurry and a current flows, it is possible to detect the cutting of the base paper for board.
- a circuit 18 is configured by electrically connecting the lower embedded electrode 12 and the lower plate body 10 as shown in FIG. Apply voltage.
- the upper embedded electrode 28 and the upper plate body 26 are electrically connected to form a circuit 34 as shown in FIG. That's fine.
- the lower embedded electrode 12 and the lower plate body 10 are electrically connected as shown in FIG.
- the upper embedded electrode 28 and the upper plate body 26 are electrically connected to form the circuit 34, and a voltage may be applied to the circuit 18 and the circuit 34.
- the voltage applied to the circuit may be alternating current or direct current, and is preferably a low voltage that does not cause danger even if an operator touches it. For example, it is preferably about AC8V. Further, as shown in FIGS. 1 to 3, it is preferable that the lower plate body 10 and / or the upper plate body 26 be connected to the ground C. By connecting these plate bodies to the ground, even a small potential difference can be reliably detected.
- the distance between the pair of molding plates 6 can be expanded when a current flows through the circuit 18 (that is, when a break in the lower board base paper 16 is detected). it can.
- the manufacturing apparatus 1A shown in FIG. 2 the interval between the pair of molding plates 6 can be expanded when a current flows through the circuit 34 (that is, when the cutting of the upper board base paper 32 or the like is detected).
- the manufacturing apparatus 1B shown in FIG. 3 when a current flows through either the circuit 18 or the circuit 34 (that is, any one of the lower board base paper 16 and the upper board base paper 32 is detected). The distance between the pair of molding plates 6 can be expanded.
- Such a method is preferable to the methods (ii) and (iii) from the viewpoint of easy flow of the lower board base paper when the interval between the molding plates 6 is expanded.
- the method (ii) or (iii) may be employed for the purpose of facilitating the cleaning of the apparatus.
- the distance between the molding plates may be expanded to such an extent that foreign matter passes between the pair of plates.
- the specific interval is not particularly limited, but it is preferably extended by 2 to 4 cm from the original interval, and more preferably extended by 2 cm, for the reason of allowing the foreign object to pass through with a short extension time.
- the means for expanding and returning the plate interval is not particularly limited.
- an actuator that moves up and down at least one of a pair of upper and lower molding plates in response to an electrical signal when current is detected can be used.
- the actuator will be specifically described in the section of the manufacturing apparatus.
- [1-4] Restoring plate interval In the manufacturing method of the present invention, the pair of molded plates is returned to the original interval after the cause of conduction is eliminated. “After the cause of continuity has been erased” means after the foreign matter that has caused the cause of continuity (ie, the cutting of the base paper for board) has passed between the molding plates. By returning the molding plate to the original interval after the foreign material passes between the molding plates, it is possible to prevent the foreign material from being caught again between the molding plates and cutting the board base paper. Moreover, the production of the gypsum board (the step of obtaining a molded body corresponding to the plate interval) is resumed. By adopting such a method, the base paper for board is not completely torn and the production does not stop. That is, there is no need to perform a cumbersome operation of removing foreign matters, passing the base paper for board again between the pair of upper and lower molding plates, pouring gypsum slurry, and restarting production.
- Whether or not the cause of continuity has been erased is determined by both the fact that no current flows through the circuit and that foreign matter has passed between the molding plates.
- the fact that no current flows can be detected by a current detector or the like electrically connected to the circuit.
- a current detector or the like electrically connected to the circuit.
- For the passage of foreign matter between molding plates for example, from the feed speed of the laminate made of board base paper and gypsum slurry and the length of the molding plate, obtain the passage time for the foreign matter to pass between the plates, There is a method of returning the plate interval after the passage time has elapsed.
- the roll rotation speed of the belt conveyor for feeding the laminate is counted by a measure roll, and the roll rotation speed at which foreign matter passes between the plates is determined from the relationship between the roll rotation speed and the feed distance of the belt conveyor. There is a method of returning the plate interval to the original after counting.
- the speed at which the interval between the forming plates is returned is not particularly limited. However, it is preferable to set the speed so that the upper or lower board base paper is not cut or the gypsum slurry on the lower board base paper overflows and leaks to the outside.
- Gypsum board manufacturing equipment The gypsum board manufacturing method of the present invention can be carried out, for example, by the gypsum board manufacturing apparatus of the present invention described below.
- the gypsum board manufacturing apparatus of the present invention includes a pair of upper and lower molded plates, a current detector, and an actuator as constituent members. Hereinafter, each component will be described.
- the manufacturing apparatus of the present invention includes a pair of upper and lower molding plates for molding a laminate in which gypsum slurry is injected into a gap between a pair of upper and lower board base papers to a thickness corresponding to the plate interval.
- a pair of upper and lower molding plates 6 (lower molding plate 8 and upper molding plate 24) for molding to a thickness according to the interval is provided.
- At least one of the pair of upper and lower molding plates has a plate body made of a conductive material and an embedded electrode embedded in the plate body. With this embedded electrode, it is possible to detect a break in the board base paper at an early stage.
- the manufacturing apparatus 1 shown in FIG. 1 detects the cutting of the lower board base paper 16 so that the lower molding plate 8 is embedded in the lower plate body 10 and the lower plate body 10. And an electrode 12.
- the upper molding plate 24 includes an upper plate body 26 and an upper embedded electrode 28 embedded in the upper plate body 26 in order to detect the cutting of the upper board base paper 32.
- the lower molding plate 8 includes the lower plate body 10 and the lower plate body as in the manufacturing apparatus 1B shown in FIG. 10, and the upper molding plate 24 may have an upper plate body 26 and an upper embedded electrode 28 embedded in the upper plate body 26.
- the plate body is a member that is electrically connected to the embedded electrode and constitutes a circuit, it needs to be made of a conductive material.
- the kind of conductive material is not particularly limited. However, since the plate body is an important member that determines the thickness of the molded body, it is necessary to avoid the shape change due to wear as much as possible. Accordingly, the conductive material constituting the plate body is preferably at least one material selected from the group consisting of iron, stainless steel, and aluminum, or a material in which the material is hard chrome plated. These materials are preferable in that they have conductivity, high rigidity, and excellent wear resistance and dimensional accuracy.
- the material constituting the embedded electrode at least one material selected from the group consisting of iron, stainless steel and aluminum is used, or the material is hard chrome plated for the same reason as the plate body. Is preferred.
- the shape of the embedded electrode is not particularly limited as long as it has a width that covers the entire width of the gypsum board to be manufactured. For example, various shapes such as a round bar shape, a square bar shape, and a plate shape can be used.
- the embedded electrode is electrically insulated from the plate body in which the embedded electrode is embedded by an insulator. As a result, a short circuit between the embedded electrode and the plate body can be prevented, and the current flowing between the embedded electrode and the plate body can be reliably detected.
- the lower embedded electrode 12 and the lower plate body 10 are electrically insulated by an insulator 14.
- the upper embedded electrode 28 and the upper plate body 26 are electrically insulated by an insulator 30.
- the lower embedded electrode 12 and the lower plate body 10 are electrically insulated by the insulator 14, and the upper embedded electrode 28 and the upper plate body 26 are insulated. It is electrically insulated by the body 30.
- the insulator is embedded in the plate body together with the embedded electrode. Since the plate body is an important member for determining the thickness of the molded body, it is necessary to avoid the shape change due to wear as much as possible for the insulator forming a part of the plate body. Further, it is not preferable that the replacement work of the member becomes complicated because the replacement period for each member is different due to the difference in wear resistance from the plate body and the like. Therefore, the insulator is required to have good wear resistance in addition to the insulating performance. In addition, since the insulator is a member embedded in the plate body, (1) workability is high and processing is performed with high dimensional accuracy so as not to generate a gap or a step between the plate body and the embedded electrode. (2) It is preferable that the gap and the step are not easily formed due to a change in dimensions over time.
- the molding plate is made of a single material, and there is a concept of embedding detection electrodes inside the molding plate. I didn't. For this reason, it is considered that the lower external electrode 138 for detecting a piece of paper is disposed further downstream than the downstream end of the molding plate (lower molding plate 108) as in the manufacturing apparatus 100 shown in FIG.
- the insulator may be a cloth base phenolic resin laminate (also referred to as “battery with cloth”), a paper base phenolic resin laminate (also referred to as “paper bakelite”).
- At least one selected from the group consisting of epoxy resin-impregnated glass fiber cloth (also referred to as “glass-epoxy resin”) and epoxy resin-impregnated paper (also referred to as “paper-epoxy resin”) is comprised with the material of.
- These materials can be suitably used in terms of good wear resistance and workability in addition to insulating performance, and good dimensional accuracy.
- the embedded electrode is embedded so that a part of the embedded electrode is exposed on the surface of the plate body that contacts the board base paper. At this time, it is preferable that there is no step between the surface of the plate main body in contact with the board base paper and the surface of the embedded electrode, and there is no gap between the insulator and the insulator described later.
- the rod-like lower embedded electrode 12 is filled in the groove portion of the insulator 14 having a substantially U-shaped cross section, and the surface of the lower plate main body 10 is one of them. It is embedded so that the part (upper surface) is exposed.
- the rod-shaped upper embedded electrode 28 is filled in the groove portion of the insulator 30 having a substantially U-shaped cross section, and a part of the upper plate body 26 is formed on the surface. It is embedded so that (bottom surface) is exposed.
- the rod-shaped lower embedded electrode 12 is filled in the groove portion of the insulator 14 having a substantially U-shaped cross section, and the surface of the lower plate main body 10 is It is embedded so that a part (upper surface) is exposed.
- the rod-shaped upper embedded electrode 28 is filled in the groove portion of the insulator 30 having a substantially U-shaped cross section, and is embedded so that a part (bottom surface) thereof is exposed on the surface of the upper plate body 26. It is.
- a taper portion is formed on at least one of the pair of upper and lower molding plates so that the plate thickness becomes thinner as the upstream end is approached, and the interval between the pair of molding plates is reduced by the taper portion. It is preferable that it is the form which has expanded as it approaches.
- gypsum slurry can be accumulated immediately before the molding start position, and the amount of gypsum slurry retained can be made constant at all times. Therefore, it is possible to effectively prevent a situation in which a gypsum board in which the gypsum sludge is molded while embracing air and an internal void is formed is manufactured.
- problems such as swelling and dents in the gypsum board, a decrease in smoothness, and removal of nails and screws during fixing (inadequate board fixing) due to the internal gap can be solved.
- the manufacturing apparatus 1 shown in FIG. 1, the manufacturing apparatus 1A shown in FIG. 2, the manufacturing apparatus 1B shown in FIG. 3, and the manufacturing apparatus 1C shown in FIG. A taper portion in which the plate thickness becomes thinner as it approaches the edge) is formed, and the interval between the pair of molded plates 6 is increased by the taper portion as it approaches the upstream end.
- the upper molding plate may be formed with a taper portion where the plate thickness becomes thinner as it approaches the upstream end, or both the lower molding plate and the upper molding plate may be formed with the taper portion. Good (not shown).
- the embedded electrode is preferably embedded in a portion of the plate body downstream of the molding start position, and the embedded electrode is molded from the molding start position of the plate body. More preferably, it is embedded in a portion up to a position 50 mm downstream of the start position.
- the molding start position is such that the laminate in which gypsum slurry is injected into the gap between the upper and lower pair of board base papers is molded to a thickness corresponding to the plate spacing, so the plate spacing is narrower than the upstream side of the molding start position. For this reason, the molding start position is a part where foreign matter is likely to be caught and the board base paper is likely to be cut.
- the embedded electrode it is preferable to dispose the embedded electrode at a position close to the molding start position in order to detect the cutting of the board base paper at an early stage. Specifically, it is particularly preferable that the embedded electrode is embedded in a portion from the molding start position to a position 25 mm downstream of the molding start position.
- the embedded electrode is embedded in a portion slightly downstream of the molding start position rather than being embedded in the molding start position in the plate body. Further, when the production speed of the gypsum board becomes high, the gypsum slurry leaks after the base paper for the board is cut, and the position where detection is possible becomes far from the molding start position. Therefore, when high-speed manufacturing is performed, it is preferable that the embedded electrode is embedded in a further downstream portion of the plate body than when low-speed manufacturing is performed. Specifically, it is preferable that the embedded electrode is embedded in a portion further downstream from the position 15 mm downstream of the molding start position in the plate body.
- the embedded position of the embedded electrode is in the portion of the plate body on the downstream side of the molding start position (particularly, the portion from the molding start position to the position 50 mm downstream of the molding start position). Therefore, it is necessary to determine an appropriate position in consideration of the manufacturing speed.
- the “molding start position” is a position at which molding of a laminate in which gypsum slurry is injected into the gap between a pair of upper and lower board base papers, specifically, the following (1) and (2) ) Means the most downstream position.
- the molding start position will be described with reference to FIGS. 6A to 6E.
- embedded electrodes, insulators, etc. are omitted, and only the shape of the molded plate is shown.
- the thick arrows in FIGS. 6A to 6E indicate the transport direction (that is, the downstream direction) of the laminate.
- At least one of the pair of upper and lower molding plates is formed with a tapered portion whose plate thickness becomes thinner as it approaches the upstream end, and the taper portion allows the interval between the pair of molded plates to be at the upstream end.
- the manufacturing apparatus of the present invention is to obtain a molded body having a thickness corresponding to the plate interval by passing the laminate between a pair of upper and lower molded plates. Accordingly, the molding of the laminate is started from a position where the pair of upper and lower molding plates are arranged to face each other and the interval between the plates is sufficiently narrow to allow molding. In the case where the tapered portion is not formed on the upstream end side of any of the pair of upper and lower molding plates (upper molding plate and lower molding plate), the upstream end of one of the pair of upper and lower molding plates The position becomes the molding start position.
- the upstream end 24a of the upper molding plate 24 and the upstream end 8a of the lower molding plate 8 are aligned. That is, on the downstream side from the upstream ends 24a, 8a, the pair of upper and lower molding plates 6 are arranged so as to face each other, and the interval between the plates is sufficiently narrow to allow molding. Therefore, the position of the upstream end 24a of the upper molding plate 24 (or the position of the upstream end 8a of the lower molding plate 8) is the molding start position P.
- the upstream end 8a of the lower molding plate 8 is disposed so as to protrude upstream from the upstream end 24a of the upper molding plate 24.
- the pair of upper and lower molding plates 6 are arranged so as to face each other on the downstream side from the upstream end 24a of the upper molding plate 24, and the interval between the plates is sufficiently narrow to allow molding. Yes. Accordingly, the position of the upstream end 24a of the upper molding plate 24 is the molding start position P.
- At least one of the pair of upper and lower molding plates is formed with a tapered portion whose plate thickness decreases as it approaches the upstream end, and the taper portion causes the interval between the pair of molded plates to approach the upstream end.
- the position of the downstream end of the tapered portion can be the molding start position in addition to the position of the upstream end of the pair of upper and lower molding plates.
- the interval between the pair of molding plates is increased by the taper portion as it approaches the upstream end
- the inclined surface of the taper portion is the side of the surface of the molding plate that contacts the board base paper. It means that it is formed.
- the upstream end 24a of the upper molding plate 24 and the upstream end 8a of the lower molding plate 8 are aligned. That is, a pair of upper and lower molding plates 6 are arranged to face each other on the downstream side from the upstream ends 24a and 8a.
- the distance between the pair of molding plates 6 is widened by the tapered portion 8b, and is not narrow enough to allow molding. Therefore, the position of the downstream end 8c of the tapered portion 8b where the plate interval between the pair of upper and lower molding plates 6 is sufficiently narrow becomes the molding start position P.
- the upstream end 24a of the upper molding plate 24 and the upstream end 8a of the lower molding plate 8 are aligned, and a pair of upper and lower moldings are provided downstream from the upstream ends 24a, 8a. It arrange
- the distance between the pair of molding plates 6 is widened by the tapered portion 24b, and is not narrow enough to allow molding. Accordingly, the position of the downstream end 24c of the tapered portion 24b where the plate interval between the pair of upper and lower molding plates 6 is sufficiently narrow becomes the molding start position P.
- the upstream end 8 a of the lower molding plate 8 is disposed so as to protrude upstream from the upstream end 24 a of the upper molding plate 24, and the upstream end 24 a of the upper molding plate 24 is arranged.
- a pair of upper and lower molding plates 6 are arranged so as to face each other on the downstream side.
- the distance between the pair of molding plates 6 is widened by the taper portion 24b of the upper molding plate 24 and the taper portion 8b of the lower molding plate 8. It is not narrow enough. Accordingly, the position of the downstream end 24c of the tapered portion 24b where the plate interval between the pair of upper and lower molding plates 6 is sufficiently narrow becomes the molding start position P.
- circuit In the gypsum board manufacturing apparatus of the present invention, the circuit is configured by electrically connecting the embedded electrode and the plate body in which the embedded electrode is embedded.
- the manufacturing apparatus 1 shown in FIG. 1 is an example in which the circuit 18 is configured by electrically connecting the lower embedded electrode 12, the lower plate body 10, and the power source D1.
- the manufacturing apparatus 1 ⁇ / b> A shown in FIG. 2 is an example in which the upper embedded electrode 28 and the upper plate body 26 are electrically connected to form a circuit 34.
- the manufacturing apparatus 1B shown in FIG. 3 the lower embedded electrode 12 and the lower plate body 10 are electrically connected to form the circuit 18, and in addition to the upper embedded electrode 28 and the upper plate The plate body 26 may be electrically connected to constitute the circuit 34.
- a circuit 40 including the lower external electrode 38, the lower plate body 10, and the power source D3 may be configured.
- the circuit 40 including the lower external electrode 38 may be formed together with a circuit 34 including the upper embedded electrode 28 as shown in FIG. 2 (not shown). Further, it may be formed together with a circuit 18 including the lower embedded electrode 12 and a circuit 34 including the upper embedded electrode 28 as shown in FIG. 3 (not shown).
- the gypsum board manufacturing apparatus of the present invention includes a current detector electrically connected to a circuit connecting the embedded electrode and the plate body. With this current detector, it is possible to detect cutting of the base paper for board.
- the manufacturing apparatus 1 shown in FIG. 1 includes a current detector 20 electrically connected to the circuit 18 and can detect a current flowing between the lower embedded electrode 12 and the lower plate body 10.
- the manufacturing apparatus 1A shown in FIG. 2 includes a current detector 20 electrically connected to the circuit 34, and can detect a current flowing between the upper embedded electrode 28 and the upper plate body 26.
- the manufacturing apparatus 1 ⁇ / b> B shown in FIG. 3 includes a current detector 20 that is electrically connected to both the circuit 18 and the circuit 34. As a result, both the current flowing between the lower embedded electrode 12 and the lower plate body 10 and the current flowing between the upper embedded electrode 28 and the upper plate body 26 can be detected.
- the current detector 20 may be shared by the plurality of circuits 18 and 34 as shown in FIG.
- the gypsum board manufacturing apparatus of the present invention includes an actuator that moves up and down at least one molded plate in response to an electrical signal from a current detector.
- An actuator 22 for moving up and down 24 is provided.
- the manufacturing apparatus of the present invention may include an actuator that moves the lower molding plate up and down, or may include an actuator that raises and lowers both the upper molding plate and the lower molding plate ( Not shown).
- the actuator may be any device that can drive the molding plate up and down by an electric signal from the current detector.
- the kind of concrete apparatus is not specifically limited, For example, an air cylinder, an oil cylinder, a servomotor etc. can be mentioned.
- Example 1 As the manufacturing apparatus of Example 1, the manufacturing apparatus 1 shown in FIG.
- the gypsum board to be manufactured had a width of 910 mm and a thickness of 9.5 mm.
- the board base paper 2 (the upper board base paper 32 and the lower board base paper 16) moves from the right side to the left side in the drawing.
- the gypsum slurry 4 is continuously supplied onto the lower board base paper 16.
- the roll 36 is a roll for changing the supply direction of the upper board base paper 32.
- Molded plate A pair of upper and lower molding plates 6 (a lower molding plate 8 and an upper molding plate 24) are provided.
- the lower molding plate 8 has a lower plate body 10 and a lower embedded electrode 12 embedded in the lower plate body 10.
- the upper plate body 26 and the lower plate body 10 were made of a hard chrome plated iron material.
- the lower embedded electrode 12 was made of a stainless material, and had a square shape with a cross-sectional shape of 6 mm ⁇ 6 mm and a length of 1200 mm.
- the lower embedded electrode 12 and the lower plate body 10 were electrically insulated by an insulator 14.
- the insulator 14 was composed of a cloth base phenolic resin laminate. The shape has a substantially U-shaped cross section, and has a substantially square bar shape with a groove.
- the lower buried electrode 12 was filled in the groove portion of the insulator 14 and buried so that a part (upper surface) of the lower plate body 10 was exposed on the surface of the lower plate body 10.
- An insulator 14 having a width of 5 mm was disposed before and after the lower embedded electrode 12 to electrically insulate the lower embedded electrode 12.
- the lower embedded electrode 12 was embedded in the lower plate body 10 from the position 15 mm downstream of the molding start position to the position 21 mm downstream of the molding start position. That is, the lower embedded electrode 12 was exposed on the surface of the lower plate body 10 over a width of 6 mm.
- a tapered portion was formed on the upstream end side of the lower molding plate 8.
- the length of the tapered portion was 50 mm, and the height of the tapered portion was 4 mm.
- the lower molding plate 8 and the upper molding plate 24 are disposed so as to face each other, and a molding space is formed in which the plate interval is sufficiently narrow to allow molding. .
- the molding space is formed from the molding start position to a position 300 mm downstream of the molding start position.
- a current detector 20 was electrically connected to the circuit 18.
- Actuator In response to an electrical signal from the current detector 20, an actuator 22 that moves the upper molding plate 24 up and down is installed. An air cylinder was used as the actuator.
- a gypsum board was manufactured using the manufacturing apparatus.
- the production rate of the gypsum board was 150 m / min.
- the manufacturing apparatus was operated for 20 days under the condition of continuously operating for 24 hours per day, the base paper for board was completely torn and the continuous production was stopped only once.
- Example 2 As a manufacturing apparatus of Example 2, a manufacturing apparatus 1A shown in FIG. Except for the items described below, it was produced in the same manner as the production apparatus of Example 1.
- Molded plate A pair of upper and lower molding plates 6 (a lower molding plate 8 and an upper molding plate 24) are provided.
- the upper plate body 26 and the lower plate body 10 are made of a material in which an iron material is hard chrome plated.
- the lower embedded electrode was not disposed on the lower molded plate 8, and the upper embedded electrode 28 was disposed on the upper molded plate 24.
- the upper embedded electrode 28 is made of a stainless material, and has a square shape with a cross-sectional shape of 6 mm ⁇ 6 mm and a length of 1200 mm.
- the upper embedded electrode 28 and the upper plate body 26 were electrically insulated by an insulator 30.
- the insulator 30 was composed of a cloth base material phenolic resin laminate. The shape has a substantially U-shaped cross section, and has a substantially square bar shape with a groove.
- the upper embedded electrode 28 was filled in the groove portion of the insulator 30 and was embedded so that a part (bottom surface) of the upper embedded electrode 28 was exposed on the surface of the upper plate body 26.
- An insulator 30 having a width of 5 mm was disposed before and after the upper embedded electrode 28 to electrically insulate the upper embedded electrode 28.
- the upper embedded electrode 28 was embedded in the upper plate body 26 from the position 15 mm downstream of the molding start position to the position 21 mm downstream of the molding start position. That is, the upper embedded electrode 28 was exposed on the surface of the upper plate body 26 over a width of 6 mm.
- a gypsum board was manufactured using the manufacturing apparatus.
- the production rate of the gypsum board was 150 m / min.
- the manufacturing apparatus was operated for 20 days under the condition of continuously operating for 24 hours per day, the board base paper was completely broken and the continuous production was stopped only twice.
- Example 3 As a manufacturing apparatus of Example 3, a manufacturing apparatus 1B shown in FIG. Except for the items described below, it was produced in the same manner as the production apparatus of Example 1.
- the lower molding plate 8 was configured in the same manner as the manufacturing apparatus of Example 1.
- the lower embedded electrode 12 was embedded in the lower plate body 10 from the position 15 mm downstream of the molding start position to the position 21 mm downstream of the molding start position.
- the upper molding plate 24 was configured in the same manner as the manufacturing apparatus of Example 2.
- [3-2] Circuit The lower embedded electrode 12, the lower plate body 10 and the power source D1 are electrically connected to form a circuit 18, and the upper embedded electrode 28, the upper plate body 26 and the power source D2 are electrically connected to form a circuit 34. Configured.
- the current detector 20 is electrically connected to the circuit 18 and the circuit 34.
- a gypsum board was manufactured using the manufacturing apparatus.
- the production rate of the gypsum board was 150 m / min.
- the manufacturing apparatus was operated for 20 days under the condition of continuously operating for 24 hours per day, the base paper for board was completely torn and the continuous production was stopped only once.
- Example 4 As a manufacturing apparatus of Example 4, a manufacturing apparatus 1B shown in FIG. Except for the items described below, it was produced in the same manner as the production apparatus of Example 1.
- the lower molding plate 8 was configured in the same manner as the manufacturing apparatus of Example 1 except for the position of the lower embedded electrode 12.
- the lower embedded electrode 12 was embedded in the lower plate body 10 from the position 25 mm downstream of the molding start position to the position 31 mm downstream of the molding start position.
- the upper molding plate 24 was configured in the same manner as the manufacturing apparatus of Example 2.
- [4-2] Circuit The lower embedded electrode 12, the lower plate body 10 and the power source D1 are electrically connected to form a circuit 18, and the upper embedded electrode 28, the upper plate body 26 and the power source D2 are electrically connected to form a circuit 34. Configured.
- the current detector 20 is electrically connected to the circuit 18 and the circuit 34.
- a gypsum board was manufactured using the manufacturing apparatus.
- the production rate of the gypsum board was 150 m / min.
- the manufacturing apparatus was operated for 20 days under the condition of continuously operating for 24 hours per day, the base paper for board was not completely broken, and continuous production was not stopped.
- Comparative Example 1 As a manufacturing apparatus of Comparative Example 1, a manufacturing apparatus 100 shown in FIG. Except for the items described below, it was produced in the same manner as the production apparatus of Example 1.
- Molded plate For the lower molding plate 108, the lower embedded electrode was not disposed. Instead, the lower external electrode 138 was arranged at a position 10 mm away from the end (downstream end) of the lower molding plate 108 on the downstream side. The lower external electrode 138 was disposed in a state of being electrically insulated from the surroundings.
- the lower external electrode 138 is made of an iron material plated with hard chrome and has a square shape with a cross-sectional shape of 24 mm ⁇ 24 mm and a length of 1200 mm.
- the upper molding plate 124 was configured in the same manner as the upper molding plate 24 of the manufacturing apparatus of Example 1.
- a current detector 120 is electrically connected to the circuit 140.
- a gypsum board was manufactured using the manufacturing apparatus.
- the production rate of the gypsum board was 150 m / min.
- the manufacturing apparatus was operated for 20 days under the condition of continuously operating for 24 hours per day, the board base paper was completely torn and the continuous production was stopped 10 times.
- the method and apparatus for producing gypsum board of the present invention can be suitably used for producing gypsum board useful as building materials such as ceiling materials, wall materials, floor materials and the like.
- 1, 1A, 1B, 1C manufacturing apparatus (for gypsum board), 2: base paper for board, 4: gypsum slurry, 6: molding plate, 8: lower molding plate, 8a: upstream end, 8b: taper portion, 8c : Downstream end, 10: lower plate body, 12: lower embedded electrode, 14: insulator, 16: base paper for lower board, 18: circuit, 20: current detector, 22: actuator, 24: upper molding Plate, 24a: Upstream end, 24b: Tapered portion, 24c: Downstream end, 26: Upper plate body, 28: Upper embedded electrode, 30: Insulator, 32: Base paper for upper board, 34: Circuit, 36: Roll, 38: Lower external electrode, 40: Circuit, 100: Manufacturing device (for gypsum board), 104: Gypsum slurry, 108: Lower molding plate, 116: Lower paper, 120: Current detector, 122: Air cylinder, 124 : Upper side Plate, 132: upper sheet, 136: Roll 138: lower external electrode, 140
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Mechanical Engineering (AREA)
- Automation & Control Theory (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Producing Shaped Articles From Materials (AREA)
- Panels For Use In Building Construction (AREA)
- Building Environments (AREA)
- Press-Shaping Or Shaping Using Conveyers (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
[成型開始位置]
下記(1)および下記(2)のうち、最も下流側の位置。
(1)前記上下一対の成型プレートのいずれか一方の上流端の位置。
(2)前記上下一対の成型プレートの少なくとも一方に、その上流端に近づくに連れてプレート厚が薄くなるテーパー部が形成され、かつ、前記テーパー部によって前記一対の成型プレートの間隔が前記上流端に近づくに連れて拡がっている形態における、前記テーパー部の下流端の位置。
[成型開始位置]
下記(1)および下記(2)のうち、最も下流側の位置。
(1)前記上下一対の成型プレートのいずれか一方の上流端の位置。
(2)前記上下一対の成型プレートの少なくとも一方に、その上流端に近づくに連れてプレート厚が薄くなるテーパー部が形成され、かつ、前記テーパー部によって前記一対の成型プレートの間隔が前記上流端に近づくに連れて拡がっている形態における、前記テーパー部の下流端の位置。
本発明の石膏ボードの製造方法は、上下一対のボード用原紙を連続的に供給しながら、一対のボード用原紙の間隙に石膏泥漿が連続的に注入された積層物を形成し、積層物を上下一対の成型プレートの間を通過させることにより、プレート間隔に応じた厚さの成型体を得る工程を有する石膏ボードの製造方法に関するものである。
本発明の製造方法においては、上下一対の成型プレートの少なくとも一方として、導電性材料により構成されたプレート本体と、前記プレート本体に埋め込まれた埋込電極とを有し、前記埋込電極が絶縁体によって前記プレート本体とは電気的に絶縁され、かつ、前記プレート本体の前記ボード用原紙と接する表面にその一部が露出されるように埋め込まれたものを用いる。ボード用原紙の切れ検出用の電極をプレート本体に埋め込むことで、プレート本体の末端より下流側に電極を配置した場合よりも早期にボード用原紙の切れを検出することが可能となる。
本発明の製造方法においては、プレート本体と当該プレート本体に埋め込まれた埋込電極とを電気的に接続して回路を構成し、その回路に電圧をかける。これにより、プレート本体と埋込電極が石膏泥漿と接触して電流が流れた場合、ボード用原紙の切れを検出することが可能となる。
本発明の製造方法においては、回路に電流が流れた時(即ちボード用原紙の切れ等を検出した時)に一対の成型プレートの間隔を拡張させる。これにより、上下一対の成型プレートの間に引っかかっていた異物は容易に成型プレートの間を通過する。従って、前記異物によってボード用原紙が切れ続けることはなく、ボード用原紙が完全に破断されて製造が停止することもない。
本発明の製造方法においては、導通の原因が消去された後に一対の成型プレートを元の間隔に戻す。「導通の原因が消去された後」とは、導通の原因(即ち、ボード用原紙の切れ等)を生起した異物が成型プレートの間を通過した後、を意味する。異物が成型プレートの間を通過した後に、成型プレートを元の間隔に戻すことで、異物が成型プレートの間に再度引っかかり、ボード用原紙が切れる事態を防止することができる。また、石膏ボードの製造(プレート間隔に応じた成型体を得る工程)が再開される。このような方法を採れば、ボード用原紙が完全に断裂されて製造が停止することはない。即ち、異物を取り除き、改めて上下一対の成型プレートの間にボード用原紙を通し直し、石膏泥漿を流し込み、製造を再開するという煩瑣な操作を行う必要がない。
本発明の石膏ボードの製造方法は、例えば以下に説明する本発明の石膏ボードの製造装置により実施することができる。本発明の石膏ボードの製造装置は、上下一対の成型プレート、電流検知器、アクチュエータを構成部材として備えたものである。以下、構成部材ごとに説明する。
本発明の製造装置は、上下一対のボード用原紙の間隙に石膏泥漿が注入された積層物を、プレート間隔に応じた厚さに成型するための上下一対の成型プレートを備えている。例えば図1に示す製造装置1、図2に示す製造装置1A、図3に示す製造装置1Bは、いずれも上下一対のボード用原紙2の間隙に石膏泥漿4が注入された積層物を、プレート間隔に応じた厚さに成型するための上下一対の成型プレート6(下側成型プレート8、上側成型プレート24)を備えている。
(1)前記上下一対の成型プレートのいずれか一方の上流端の位置。
(2)前記上下一対の成型プレートの少なくとも一方にその上流端に近づくに連れてプレート厚が薄くなるテーパー部が形成され、かつ、前記テーパー部によって前記一対の成型プレートの間隔が前記上流端に近づくに連れて拡がっている形態における前記テーパー部の下流端の位置。
本発明の石膏ボードの製造装置においては、埋込電極と前記埋込電極が埋め込まれているプレート本体が電気的に接続されて回路が構成されている。
本発明の石膏ボードの製造装置は、埋込電極とプレート本体とを接続する回路に、電気的に接続された電流検知器を備えている。この電流検知器によって、ボード用原紙の切れ等を検出することができる。
本発明の石膏ボードの製造装置は、電流検知器からの電気信号に応答して、少なくとも一方の成型プレートを上下させるアクチュエータを備えている。
実施例1の製造装置として、図1に示す製造装置1を作製した。製造する石膏ボードは幅910mm、厚さ9.5mmのものとした。製造装置1においては、ボード用原紙2(上側ボード用原紙32、下側ボード用原紙16)は、図中右側から左側に向かって移動する。下側ボード用原紙16上には石膏泥漿4が連続的に供給されるように構成されている。ロール36は、上側ボード用原紙32の供給方向を変更するためのロールである。
上下一対の成型プレート6(下側成型プレート8、上側成型プレート24)を備えるものとした。下側成型プレート8は、下側プレート本体10と、下側プレート本体10に埋め込まれた下側埋込電極12とを有するものとした。上側プレート本体26、下側プレート本体10は、鉄材がハードクロムメッキされたものにより構成した。下側埋込電極12は、ステンレス材からなり、断面形状が6mm×6mmの正方形状で、長さ1200mmの角棒状のものとした。
下側埋込電極12、下側プレート本体10および電源D1は電気的に接続して回路18を構成した。
回路18には電流検知器20を電気的に接続した。
電流検知器20からの電気信号に応答して、上側成型プレート24を上下させるアクチュエータ22を設置した。アクチュエータとしてはエアシリンダーを用いた。
前記製造装置を用いて、石膏ボードを製造した。石膏ボードの製造速度は150m/分とした。前記製造装置を1日当たり24時間連続稼働させる条件で、20日間稼働させたところ、ボード用原紙が完全に断裂され、連続的な製造が停止した回数は1回のみであった。
実施例2の製造装置として、図2に示す製造装置1Aを作製した。以下に記載する事項を除いては、実施例1の製造装置と同様に作製した。
上下一対の成型プレート6(下側成型プレート8、上側成型プレート24)を備えるものとした。上側プレート本体26、下側プレート本体10は、鉄材がハードクロムメッキされた材料により構成した。下側成型プレート8には下側埋込電極を配置せず、上側成型プレート24に上側埋込電極28を配置した。上側埋込電極28は、ステンレス材からなり、断面形状が6mm×6mmの正方形状で、長さ1200mmの角棒状のものとした。
上側埋込電極28、上側プレート本体26および電源D2は電気的に接続して回路34を構成した。
回路34には電流検知器20を電気的に接続した。
前記製造装置を用いて、石膏ボードを製造した。石膏ボードの製造速度は150m/分とした。前記製造装置を1日当たり24時間連続稼働させる条件で、20日間稼働させたところ、ボード用原紙が完全に破断され、連続的な製造が停止した回数は2回のみであった。
実施例3の製造装置として、図3に示す製造装置1Bを作製した。以下に記載する事項を除いては、実施例1の製造装置と同様に作製した。
下側成型プレート8については、実施例1の製造装置と同様に構成した。下側埋込電極12は、下側プレート本体10における、成型開始位置の下流側15mmの位置から、成型開始位置の下流側21mmの位置に至るまでの部分に埋め込んだ。上側成型プレート24については、実施例2の製造装置と同様に構成した。
下側埋込電極12、下側プレート本体10および電源D1は電気的に接続して回路18を構成し、上側埋込電極28、上側プレート本体26および電源D2は電気的に接続して回路34を構成した。
回路18および回路34には電流検知器20を電気的に接続した。
前記製造装置を用いて、石膏ボードを製造した。石膏ボードの製造速度は150m/分とした。前記製造装置を1日当たり24時間連続稼働させる条件で、20日間稼働させたところ、ボード用原紙が完全に断裂され、連続的な製造が停止した回数は1回のみであった。
実施例4の製造装置として、図3に示す製造装置1Bを作製した。以下に記載する事項を除いては、実施例1の製造装置と同様に作製した。
下側成型プレート8については、下側埋込電極12の位置を除き、実施例1の製造装置と同様に構成した。下側埋込電極12は、下側プレート本体10における、成型開始位置の下流側25mmの位置から、成型開始位置の下流側31mmの位置に至るまでの部分に埋め込んだ。上側成型プレート24については、実施例2の製造装置と同様に構成した。
下側埋込電極12、下側プレート本体10および電源D1は電気的に接続して回路18を構成し、上側埋込電極28、上側プレート本体26および電源D2は電気的に接続して回路34を構成した。
回路18および回路34には電流検知器20を電気的に接続した。
前記製造装置を用いて、石膏ボードを製造した。石膏ボードの製造速度は150m/分とした。前記製造装置を1日当たり24時間連続稼働させる条件で、20日間稼働させたところ、ボード用原紙が完全に破断されることはなく、連続的な製造が停止することはなかった。
比較例1の製造装置として、図4に示す製造装置100を作製した。以下に記載する事項を除いては、実施例1の製造装置と同様に作製した。
下側成型プレート108については、下側埋込電極を配置しなかった。その代わりに、下側成型プレート108の末端(下流端)から下流側に10mm離れた位置に下側外部電極138を配置した。下側外部電極138は周囲から電気的に絶縁した状態で配置した。下側外部電極138は、ハードクロムメッキされた鉄材からなり、断面形状が24mm×24mmの正方形状で、長さ1200mmの角棒状のものとした。上側成型プレート124については、実施例1の製造装置の上側成型プレート24と同様に構成した。
下側外部電極138、下側成型プレート108および電源D3は電気的に接続して回路140を構成した。
回路140には電流検知器120を電気的に接続した。
前記製造装置を用いて、石膏ボードを製造した。石膏ボードの製造速度は150m/分とした。前記製造装置を1日当たり24時間連続稼働させる条件で、20日間稼働させたところ、ボード用原紙が完全に断裂され、連続的な製造が停止した回数は10回に及んだ。
Claims (10)
- 上下一対のボード用原紙を連続的に供給しながら、前記上下一対のボード用原紙の間隙に石膏泥漿が連続的に注入された積層物を形成し、前記積層物を上下一対の成型プレートの間を通過させることにより、プレート間隔に応じた厚さの成型体を得る工程を有する石膏ボードの製造方法であって、
前記上下一対の成型プレートの少なくとも一方として、導電性材料により構成されたプレート本体と、前記プレート本体に埋め込まれた埋込電極とを有し、前記埋込電極が絶縁体によって前記プレート本体とは電気的に絶縁され、かつ、前記プレート本体の前記ボード用原紙と接する表面にその一部が露出されるように埋め込まれたものを用い、
前記プレート本体と、当該プレート本体に埋め込まれた前記埋込電極とを電気的に接続して回路を構成し、前記回路に電圧をかけ、
前記ボード用原紙が切れて前記プレート本体と前記埋込電極が前記石膏泥漿と接触し、前記回路に電流が流れた時に前記上下一対の成型プレートの間隔を拡張させ、導通の原因が消去された後に前記上下一対の成型プレートを元の間隔に戻すことを特徴とする石膏ボードの製造方法。 - 前記埋込電極が、前記プレート本体における、下記成型開始位置よりも下流側の部分に埋め込まれている請求項1に記載の石膏ボードの製造方法。
[成型開始位置]
下記(1)および下記(2)のうち、最も下流側の位置。
(1)前記上下一対の成型プレートのいずれか一方の上流端の位置。
(2)前記上下一対の成型プレートの少なくとも一方に、その上流端に近づくに連れてプレート厚が薄くなるテーパー部が形成され、かつ、前記テーパー部によって前記一対の成型プレートの間隔が前記上流端に近づくに連れて拡がっている形態における、前記テーパー部の下流端の位置。 - 前記埋込電極が、前記プレート本体における、前記成型開始位置から、前記成型開始位置の下流側50mmの位置に至るまでの部分に埋め込まれている請求項2に記載の石膏ボードの製造方法。
- 前記絶縁体として、布基材フェノール樹脂積層板、紙基材フェノール樹脂積層板、エポキシ樹脂含浸ガラス繊維布およびエポキシ樹脂含浸紙からなる群より選択された少なくとも1種の材料を用いる請求項1~3のいずれか1項に記載の石膏ボードの製造方法。
- 前記導電性材料として、鉄材、ステンレス鋼材およびアルミニウム材からなる群より選択される少なくとも1種の材料、または前記材料がハードクロムメッキされたものを用いる請求項1~4のいずれか1項に記載の石膏ボードの製造方法。
- 上下一対のボード用原紙の間隙に石膏泥漿が注入された積層物を、プレート間隔に応じた厚さに成型するための上下一対の成型プレートを備え、
前記上下一対の成型プレートの少なくとも一方が、導電性材料により構成されたプレート本体と、前記プレート本体に埋め込まれた埋込電極とを有し、前記埋込電極が絶縁体によって前記プレート本体とは電気的に絶縁され、かつ、前記プレート本体の前記ボード用原紙と接する表面にその一部が露出されるように埋め込まれたものであり、
前記プレート本体と、当該プレート本体に埋め込まれた前記埋込電極とが電気的に接続されて回路が構成されており、
前記回路に電気的に接続された電流検知器と、
前記電流検知器からの電気信号に応答して、少なくとも一方の成型プレートを上下させるアクチュエータと、を備えたことを特徴とする石膏ボードの製造装置。 - 前記埋込電極が、前記プレート本体における、下記成型開始位置よりも下流側の部分に埋め込まれている請求項6に記載の石膏ボードの製造装置。
[成型開始位置]
下記(1)および下記(2)のうち、最も下流側の位置。
(1)前記上下一対の成型プレートのいずれか一方の上流端の位置。
(2)前記上下一対の成型プレートの少なくとも一方に、その上流端に近づくに連れてプレート厚が薄くなるテーパー部が形成され、かつ、前記テーパー部によって前記一対の成型プレートの間隔が前記上流端に近づくに連れて拡がっている形態における、前記テーパー部の下流端の位置。 - 前記埋込電極が、前記プレート本体における、前記成型開始位置から、前記成型開始位置の下流側50mmの位置に至るまでの部分に埋め込まれている請求項7に記載の石膏ボードの製造装置。
- 前記絶縁体が、布基材フェノール樹脂積層板、紙基材フェノール樹脂積層板、エポキシ樹脂含浸ガラス繊維布およびエポキシ樹脂含浸紙からなる群より選択された少なくとも1種の材料により構成されている請求項6~8のいずれか1項に記載の石膏ボードの製造装置。
- 前記導電性材料が、鉄材、ステンレス鋼材およびアルミニウム材からなる群より選択される少なくとも1種の材料、または前記材料がハードクロムメッキされたものである請求項6~9のいずれか1項に記載の石膏ボードの製造装置。
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