WO2014173008A1 - 剥离设备的剥离能力的评定方法和系统及评定用部件 - Google Patents

剥离设备的剥离能力的评定方法和系统及评定用部件 Download PDF

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Publication number
WO2014173008A1
WO2014173008A1 PCT/CN2013/078437 CN2013078437W WO2014173008A1 WO 2014173008 A1 WO2014173008 A1 WO 2014173008A1 CN 2013078437 W CN2013078437 W CN 2013078437W WO 2014173008 A1 WO2014173008 A1 WO 2014173008A1
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Prior art keywords
photoresist
peeling
substrate
stripping
level
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PCT/CN2013/078437
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English (en)
French (fr)
Inventor
刘英伟
陈宁
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京东方科技集团股份有限公司
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Publication of WO2014173008A1 publication Critical patent/WO2014173008A1/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor

Definitions

  • the present invention relates to a method for evaluating the peeling ability of a peeling device, an evaluation system, and a component for evaluation. Background technique
  • the stripping ability of the stripping device on the photoresist coated on the array substrate has a direct influence on the quality of the array substrate. If the photoresist on the current layer of material is not stripped clean to produce a residue or the photoresist residue value exceeds the photoresist residue threshold, the next layer of coated material will precipitate at the residual photoresist, forming a defect.
  • the principle of peeling off the photoresist on the array substrate by the stripping device is that the photoresist is dissolved by the stripping solution of the stripping device to achieve the purpose of stripping the photoresist.
  • the peeling ability of the stripping equipment is closely related to factors such as the quality of the stripping liquid and the equipment state of the stripping equipment. In the actual production process, since the stripping ability of the current stripping device cannot be determined, after each stripping device strips the photoresist, it is necessary to detect the strip substrate after stripping the photoresist to ensure that there is no photoresist residue. , or the residual value of the photoresist is less than the residual threshold of the photoresist.
  • a method for evaluating the peeling ability of a peeling apparatus comprises: performing photoresist stripping treatment on at least two test blocks by using a stripping device, each test block being formed of a substrate and a photoresist coated on the substrate, and the photoresists of the respective test blocks have each other Different curing degree values; peeling effect detection on the peeled test piece; and determining the peeling ability level of the peeling device according to the photoresist curing degree value and the peeling effect of the test piece.
  • the peeling effect detection may include: determining a peeling effect level according to the photoresist residual value of the test block, wherein a lower the photoresist residual value of the test block corresponds to a peeling effect level
  • the higher the peeling ability level is based on the following relationship between the peeling effect detection result, the photoresist curing degree value, and the peeling ability level: the higher the curing degree value of the photoresist, the peeling-treated test piece The lower the photoresist residual value, the higher the peeling ability level of the peeling device.
  • the determining the peeling ability level comprises: determining a test block satisfying the set peeling effect level, and a photoresist curing degree value corresponding to the test block satisfying the set peeling effect level;
  • the peeling ability level corresponding to the peeling effect level and the highest degree of curing degree of the photoresist is the peeling ability level of the peeling apparatus.
  • the peeling effect detection comprises determining a peeling effect level; and the determining the peeling ability level is based on the following correspondence between the peeling effect, the photoresist curing degree value, and the peeling ability level: for the same peeling effect level, photolithography The higher the degree of cure of the glue, the higher the peeling ability level; and for the same degree of cure of the photoresist, the higher the peeling effect level, the higher the peeling ability level.
  • the method further comprises: forming the test block to be subjected to the stripping treatment in the following manner: coating a layer of photoresist on the substrate, and exposing and patterning the photoresist on the substrate to Forming a photoresist block on different regions of the substrate; and performing different degrees of exposure curing treatment on the photoresist block to obtain the test block having different degrees of curing degree of the photoresist.
  • performing different degrees of curing treatment on the photoresist block comprising: providing a grating plate, the grating plate having a plurality of gratings, each grating having different grating constants from each other; and The photoresist block is subjected to exposure curing, wherein each of the photoresist blocks corresponds to one of the gratings.
  • the grating plate has a grating constant between 10 ⁇ m and 90 ⁇ m.
  • the distance between the grating plate and the glass substrate is 100 ⁇ m to 300 ⁇ m.
  • the method further comprises: correcting the stripping device when the determined peeling ability level of the peeling device is lower than a lower limit of the peeling ability level.
  • a peeling ability evaluation system for a peeling device comprising: a photoresist stripping module and an evaluation module.
  • the photoresist stripping module is configured to perform photoresist stripping treatment on at least two test blocks by using a stripping device, each test block is formed by a substrate and a photoresist coated on the substrate, and each test block The photoresists have different degrees of cure values from each other.
  • the evaluation module is configured to perform a peeling effect test on the test block after the peeling process; The peeling ability level of the peeling device is determined according to the peeling effect detection result, the photoresist curing degree value, and the correspondence relationship between them and the peeling ability level.
  • the system further comprises: a photoresist curing device for coating a layer of photoresist on the substrate, exposing and patterning the photoresist on the substrate, and forming a photolithography on different regions of the substrate.
  • the rubber block is subjected to different exposure curing processes to obtain a test block having different degrees of curing of the photoresist.
  • the photoresist curing device is configured to: dry a grating block corresponding to each grating by vertically illuminating a grating of the grating plate by parallel infrared rays, wherein each grating of the grating plate has a different grating constant Thereby, photoresist blocks of different curing degree values are obtained, and the corresponding substrate region of each photoresist block and the photoresist in the region constitute a test block.
  • an evaluation member for evaluating a peeling ability of a peeling device comprising at least two test pieces each formed of a substrate and a photoresist coated on the substrate And the photoresist of each test block has different degrees of cure values from each other.
  • the at least two test blocks are integrated on one substrate.
  • FIG. 1 is a schematic flow chart showing a method for evaluating the peeling ability of a peeling device according to an embodiment of the present invention
  • FIG. 2 is a schematic view of a grating of a grating plate according to an embodiment of the present invention
  • FIG. 3 is a schematic view of a grating plate including a grating according to an embodiment of the present invention
  • FIG. 4 is a schematic diagram showing positions of devices in a test block according to an embodiment of the present invention.
  • FIG. 5 is a schematic flow chart showing an example of an application in a practical production method for evaluating a peeling ability of a peeling device according to an embodiment of the present invention
  • 6a is a schematic view of a peeling ability evaluation system of a peeling device according to an embodiment of the present invention.
  • FIG. 6b is a detailed schematic diagram of a peeling ability evaluation system of a peeling device according to an embodiment of the present invention. detailed description
  • the test block in order to evaluate the peeling ability of the stripping device, is subjected to a photoresist stripping treatment by using a stripping device, wherein the degree of curing of the photoresist in the test block is different;
  • the peeling effect test is performed to determine the peeling effect level; and, based on the peeling effect detection result and the photoresist curing degree value, the peeling ability level of the peeling device is determined.
  • at least one of the following can be achieved: determining the peeling ability of the different peeling devices; evaluating the peeling ability of the peeling device; determining whether the peeling ability of the peeling device changes; and monitoring the peeling ability of the peeling device.
  • Fig. 1 is a view showing a method for evaluating the peeling ability of a peeling apparatus in an embodiment of the present invention, the method comprising:
  • Step 101 performing photoresist stripping treatment on at least two test blocks by using a stripping device, each test block being formed of a substrate and a photoresist coated on the substrate, and the photoresists of the respective test blocks are different from each other Curing degree value;
  • Step 102 Perform a peeling effect test on the peeled test piece, and determine a peeling ability level of the peeling device according to the peeling effect detection result and the photoresist curing degree value.
  • the test block described in this embodiment may preferably include a substrate portion corresponding to the test block region and a photoresist portion in the region, that is, the test block includes two layers of a substrate portion and a photoresist portion.
  • the photoresist can also be applied to the substrate via other intermediate layers. For example, a substrate layer is first formed on the substrate, and a photoresist layer is formed on the substrate layer. Such a transformation is not limited to this embodiment.
  • the test block is manufactured as follows: a layer of photoresist is coated on the substrate, and the photoresist on the substrate is exposed and patterned to form a photoresist block; the photoresist block is processed by the grating plate containing the grating After the curing treatment, test pieces having different degrees of curing of the photoresist are obtained on the substrate.
  • the substrate is a glass substrate.
  • the grating of the grating plate is fabricated as follows: At least two gratings are fabricated on one grating plate, wherein each grating has a different grating constant. As shown in FIG. 2, the grating constant d of the grating on the grating plate includes the slit width a and the interval c.
  • the slit width a and the interval c are equal in one grating, and the different grating slit widths a and c are different.
  • the grating constant of the grating is preferably, but not limited to, between 10 ⁇ m and 90 ⁇ m.
  • the photoresist block is cured by a grating plate containing a grating, including: coating a photoresist on the same glass substrate as the grating plate to expose the photoresist and
  • the pattern processing is such that the position of the photoresist block after the pattern processing is the same as the position of the grating on the grating plate; the grating plate is placed above the glass substrate, and the infrared light is cured by the grating on the photoresist block on the glass substrate.
  • a test block having different degrees of curing of the photoresist was obtained.
  • the distance between the grating plate and the glass substrate is preferably, but not limited to, 100 ⁇ m to 300 ⁇ m.
  • the photoresist block on the glass substrate is cured by using, for example, infrared light through a grating
  • the infrared light emitted by the infrared light source is converted into parallel infrared light by the lens, and the parallel infrared light is vertically irradiated on the grating, and the grating is applied to the glass substrate.
  • the photoresist on the film is cured again. Due to the different grating constants of the grating, the degree of curing of the photoresist on the obtained glass substrate is also different. The larger the grating constant of the grating, the more infrared light is passed, and the more heat is absorbed by the photoresist block.
  • the grating constants corresponding to the nine gratings are: ⁇ , 20 ⁇ , 30 ⁇ , 40 ⁇ , 50 ⁇ , 60 ⁇ , 70 ⁇ , 80 ⁇ , 90 ⁇ , sorted according to the grating constant size, the smaller the grating constant, the lower the level, the grating is divided into Level 9.
  • the grating plate 41 containing the grating is placed on the patterned glass substrate 42, each grating corresponds to a photoresist block 43, and the distance between the grating plate 41 and the glass substrate 42 is 100 ⁇ m to 300 ⁇ m.
  • the infrared light emitted by the infrared light source is converted into parallel infrared light through the lens, and is vertically irradiated on the photoresist block 43 of the glass substrate to form a test block having different degrees of curing. The higher the degree of cure, the greater the difficulty of peeling off the test piece and the higher the peeling ability level.
  • the peeling ability level of the corresponding test block corresponding to each grating corresponds to the level of the grating, that is, on the substrate.
  • the nine test blocks correspond to nine peeling ability levels, and the higher the degree of cure of the test block, the higher the peeling ability level.
  • step 101 the stripping process is performed on the test block coated with the photoresist on the substrate by using a stripping device, including: the stripping device performs stripping treatment on the test block coated with the photoresist on the substrate before performing the production; After the calibration, the test block coated with the photoresist on the substrate is subjected to a peeling treatment; after the peeling device is operated for a set length of time, the test block coated with the photoresist on the substrate is subjected to a peeling treatment.
  • a stripping device including: the stripping device performs stripping treatment on the test block coated with the photoresist on the substrate before performing the production; After the calibration, the test block coated with the photoresist on the substrate is subjected to a peeling treatment; after the peeling device is operated for a set length of time, the test block coated with the photoresist on the substrate is subjected to a peeling treatment.
  • step 102 the peeling effect detection is performed on the test block after the peeling process, including: detecting, by using the detecting device, each test block on the peeled-treated glass substrate, if the peeling process is performed after using the appearance detecting machine or the like Each test block on the glass substrate is tested and the test results are recorded.
  • Determining the peeling ability level of the stripping device according to the peeling effect detection result, the curing degree value of the photoresist, and the correspondence relationship between them and the peeling ability level specifically comprising: the peeling device performs the photoresist-coated test piece After the photoresist stripping process, the peeling effect level corresponding to each test piece after the peeling process is recorded, and the test block after the peeling process that satisfies the set peeling effect level is determined; if a plurality of test blocks satisfy the set peeling effect Level, at this time, the peeling ability level corresponding to the test piece which satisfies the set peeling effect level which has the highest curing degree value of the photoresist is the peeling ability level of the peeling apparatus.
  • Determining the peeling effect level according to the photoresist residual value of the test block includes: dividing the peeling effect level corresponding to the peeling processed test block into at least two levels, and each layer corresponding to the photoresist residual value is different, the photoresist
  • the residual value may be determined according to the thickness of the residual photoresist, or determined according to the area of the residual photoresist, or may be determined according to any other quantifiable value; to classify the peeling effect level corresponding to the test block after the peeling treatment For the four levels, the residual thickness of the photoresist corresponding to each peeling effect level is different, and the other cases are similar, and will not be described herein.
  • the set peeling effect level is 4, and the peeling device performs the peeling test on the substrate containing 9 test blocks, and after the peeling is completed, the 9 test blocks are respectively separated. Perform a test to determine the peeling effect level of test block 1 ⁇ 4 is 4 If the corresponding peeling effect level on the test blocks 5 to 9 does not satisfy the set peeling effect level, it is determined that the current peeling ability level of the peeling device is 5 levels.
  • the peeling device performs peeling test on the substrate containing 9 test blocks, and after the peeling is completed, 9 test blocks are completed.
  • the detection is performed separately to determine that the peeling effect level of the test blocks 1 to 4 is 4, the peeling effect level of the test block 5 to 6 is 3, the peeling effect level of the test block 7 is 2, and the peeling effect of the test block 8-9
  • the level is 1 level, and the test block that meets the preset peeling effect level is ⁇ .
  • the test block 7 has the highest peeling ability level, and the peeling ability level is 7 level, so the stripping device The peeling ability level is 7th.
  • a grating plate having different grating constants is used as an embodiment, but the invention is not limited to such a grating plate, and may be other types of materials capable of curing the photoresist to different degrees.
  • the light-shielding materials having different light transmittances can make the required test blocks differently by using different amounts of light transmission in different regions, and the same test pieces can be produced in the same manner. A preferred embodiment.
  • the test block coated with the photoresist on the substrate is stripped by a stripping device, and each test block on the stripped substrate is inspected to determine that there is no photoresist.
  • the residual test piece determines the peeling ability level of the peeling device according to the peeling effect detection result, the curing degree value of the photoresist, and the correspondence relationship between them and the peeling ability level; determining the peeling ability level of the peeling device after the working set time length Whether it is lowered; if the peeling ability level of the peeling device is lowered, the peeling device is corrected, otherwise, the peeling device continues the peeling process.
  • the working time of the stripping device can be set according to factors such as the use time of the stripping solution of the stripping device and the working strength of the stripping device.
  • the method for evaluating the peeling ability of the stripping apparatus in the embodiment of the present invention includes:
  • Step 501 performing a stripping process on the photoresist-coated test piece by using a stripping device;
  • Step 502 testing each test block on the stripped substrate to determine a test block that satisfies the peeling effect level;
  • Step 503 determining a peeling ability level of the peeling device according to a peeling effect level, a degree of curing degree of the photoresist, and a correspondence relationship between them and a peeling ability level;
  • Step 504 Determine a peeling ability level of the stripping device
  • Step 505 determining whether the peeling ability level of the peeling device is lower than the lower limit of the peeling capacity, if it is lower than the lower limit of the peeling capacity, step 506 is performed, otherwise step 507 is performed;
  • Step 506 Correct the stripping device, and return to step 504;
  • Step 507 The stripping device continues the stripping process and ends the process.
  • the step 504 specifically includes: after the stripping device is set for a working length, the stripping device is used to perform a stripping process on the test block coated with the photoresist on the substrate, and each test block on the substrate after the stripping process is detected.
  • the test pieces satisfying the set peeling effect level are determined, and the peeling ability level of the current peeling apparatus is determined according to the peeling effect level, the degree of curing degree of the photoresist, and the correspondence relationship between them and the peeling ability level.
  • an embodiment of the present invention further provides a peeling ability evaluation system for a peeling device, and the principle of solving the problem is similar to the method for evaluating the peeling ability of the peeling device according to the embodiment of the present invention, so the system is For the implementation of the method, refer to the implementation of the method, and the repetition will not be repeated.
  • Figure 6a shows a stripping capability evaluation system for a stripping apparatus according to an embodiment of the present invention, the system comprising: a photoresist stripping module 601 and an evaluation module 602;
  • a photoresist stripping module 601 configured to perform photoresist stripping treatment on the photoresist-coated test piece by using a stripping device, wherein the photoresist coated on the test block has different degrees of curing;
  • the evaluation module 602 is configured to perform a peeling effect test on the peeled test piece; determine the peeling ability of the peeling device according to the peeling effect detection result, the photoresist curing degree value, and the correspondence relationship between them and the peeling ability level grade.
  • the system further includes a photoresist curing device 603 for applying a layer of photoresist on the substrate, exposing and patterning the photoresist on the substrate to form light.
  • the rubber block is cured by a grating plate containing a grating, and a test block having different degrees of curing of the photoresist is obtained on the substrate.
  • the grating of the grating plate is manufactured as follows: at least two gratings are fabricated on one grating plate, wherein the grating constant of each grating is different; the grating constant d of the grating on the grating plate includes the slit width a and the interval c, in one grating
  • the slit width a and the interval c have the same width, different grating slit widths Degree a is different from interval c.
  • the grating constant of the grating is preferably, but not limited to, between 10 ⁇ m and 90 ⁇ m.
  • the photoresist curing device 603 is specifically configured to apply a layer of photoresist on a substrate of the same size as the grating plate, and perform exposure and pattern processing on the photoresist to position and raster the patterned photoresist block.
  • the positions of the gratings on the plate are the same; the grating plates are placed above the substrate, and the infrared light is cured by the grating on the photoresist blocks on the substrate to obtain test blocks having different degrees of curing of the photoresist.
  • the distance between the grating plate and the substrate is preferably, but not limited to, 100 ⁇ m to 300 ⁇ m.
  • the photoresist block on the substrate is cured by using, for example, infrared light through the grating
  • the infrared light emitted by the infrared source is converted into parallel infrared light by the lens, and the parallel infrared rays are vertically irradiated on the grating, and the grating is applied to the substrate through the grating.
  • the photoresist is cured again. Due to the different grating constants of the grating, the degree of curing of the photoresist on the substrate is different. The larger the grating constant of the grating, the more infrared light is passed, and the more heat is absorbed by the photoresist block.
  • the photoresist stripping module 601 is specifically used for stripping equipment to perform stripping treatment on the substrate coated with the photoresist before the production; the stripping device performs the calibration test block on the substrate coated with the photoresist after the calibration Stripping treatment; After the stripping device is operated for a set length of time, the test block coated with the photoresist on the substrate is subjected to a stripping treatment.
  • the evaluation module 602 is specifically configured to detect each test block on the peeled glass substrate by using a detecting device, such as using an appearance detecting machine to detect each test block on the peeled glass substrate, And record the test results.
  • the peeling effect level corresponding to each of the peeling test pieces is recorded, and the peeling-treated test block that satisfies the set peeling effect level is determined. If there are a plurality of test blocks satisfying the set peeling effect level, the peeling ability level corresponding to the test piece satisfying the set peeling effect level having the highest curing degree value of the photoresist at this time is the peeling ability level of the peeling device; .
  • the stripping effect level corresponding to the stripped test piece is divided into at least two grades, and the photoresist residual value corresponding to each grade is different, and the photoresist residual value may be determined according to the thickness of the residual photoresist, or according to the residual
  • the area of the photoresist is determined and can also be determined based on any other quantifiable value. For the same peeling effect level, the higher the degree of curing of the photoresist, the higher the peeling ability level; for the same degree of curing of the photoresist, the higher the peeling effect level, the higher the peeling ability level.
  • an evaluation member for evaluating a peeling ability of a peeling device comprising at least two test pieces each formed of a substrate and a photoresist coated on the substrate And the photoresist of each test block has different degrees of cure values from each other.
  • the at least two test blocks are integrated on one substrate.
  • the spirit and scope of the invention are intended that the present invention cover the modifications and variations of the inventions

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  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

一种剥离设备的剥离能力的评定方法和系统以及其中使用的评定用部件，能够实现对剥离设备的剥离能力的评定和监控。该方法包括：利用剥离设备对包括固定程度值不同的光刻胶（43）的至少两个测试块进行光刻胶剥离处理（501）；对经过剥离处理后的测试块进行剥离效果检测（502）；以及根据测试块的光刻胶（43）固化程度值和剥离效果，确定所述剥离设备的剥离能力等级（503）。该评定系统包括光刻胶剥离模块（601）和评定模块（602）。用于评定剥离设备的剥离能力的评定用部件包括至少两个测试块，每一测试块由基板（42）和涂覆在所述基板（42）上的光刻胶（43）形成，并且各个测试块的光刻胶（43）具有彼此不同的固化程度值。

Description

剥离设备的剥离能力的评定方法和系统及评定用部件 技术领域
本发明涉及剥离设备的剥离能力的评定方法、评定系统以及评定用部件。 背景技术
在显示技术领域的基板构图工艺中， 例如， 在液晶显示器的阵列基板的 制作过程中， 剥离设备对阵列基板上涂覆的光刻胶的剥离能力， 对阵列基板 的质量有直接影响。 如果当前一层材料上的光刻胶没有剥离干净产生残留或 光刻胶残留值超过光刻胶残留阈值， 将导致下一层涂覆的材料在残留的光刻 胶处产生沉淀， 形成缺陷。
剥离设备对阵列基板上光刻胶的剥离原理是， 通过剥离设备的剥离液对 光刻胶进行溶解， 以达到剥离光刻胶的目的。 剥离设备的剥离能力与剥离液 的质量， 以及剥离设备的设备状态等因素密切相关。 在实际生产过程中， 由 于无法确定当前剥离设备的剥离能力， 因此每次剥离设备对光刻胶剥离后， 都需要对剥离光刻胶后的阵列基板进行检测， 以保证没有光刻胶的残留， 或 光刻胶的残留值小于光刻胶的残留阈值。
因此， 现有技术中没有对剥离设备剥离能力进行评定的一种方法， 无法 监控剥离设备的剥离能力。 发明内容
根据本发明实施例， 提供一种剥离设备的剥离能力的评定方法。 该方法 包括： 利用剥离设备对至少两个测试块进行光刻胶剥离处理， 每一测试块由 基板和涂覆在所述基板上的光刻胶形成， 并且各个测试块的光刻胶具有彼此 不同的固化程度值； 对经过剥离处理后的测试块进行剥离效果检测； 以及根 据测试块的光刻胶固化程度值和剥离效果， 确定所述剥离设备的剥离能力等 级。
优选， 所述剥离效果检测可以包括： 根据所述测试块的光刻胶残留值确 定剥离效果等级， 其中所述测试块的光刻胶残留值越低对应的剥离效果等级 越高； 所述确定剥离能力等级根据了剥离效果检测结果、 光刻胶固化程度值 以及剥离能力等级之间的以下对应关系： 光刻胶的固化程度值越高， 剥离处 理后的测试块的光刻胶残留值越低,所述剥离设备对应的剥离能力等级越高。
优选， 所述确定剥离能力等级包括： 确定满足设定的剥离效果等级的测 试块，以及所述满足设定的剥离效果等级的测试块对应的光刻胶固化程度值； 以及根据满足设定的剥离效果等级且光刻胶固化程度值最高的测试块对应的 剥离能力等级作为所述剥离设备的剥离能力等级。
优选， 所述剥离效果检测包括确定剥离效果等级； 并且所述确定剥离能 力等级基于剥离效果、 光刻胶固化程度值以及剥离能力等级之间的以下对应 关系： 对于相同的剥离效果等级， 光刻胶的固化程度值越高对应的剥离能力 等级越高； 以及对于相同的光刻胶的固化程度值， 剥离效果等级越高对应的 剥离能力等级越高。
优选，所述方法还包括采用下列方式制作待进行剥离处理的所述测试块： 在基板上涂覆一层光刻胶,并对所述基板上的光刻胶进行曝光和图形化处理， 以在基板上不同区域形成光刻胶块； 以及， 对所述光刻胶块进行不同程度的 曝光固化处理， 得到光刻胶固化程度值不同的所述测试块。
优选， 对所述光刻胶块进行不同程度的固化处理， 包括： 提供光栅板， 所述光栅板具有多个光栅， 每个光栅具有彼此不同的光栅常数； 以及经由所 述光栅板对所述光刻胶块进行曝光固化， 其中每个光刻胶块与其中一个光栅 相对应。
优选， 所述光栅板的光栅常数在 10μηι~90μηι之间。
优选， 在经由所述光栅板对所述光刻胶块进行曝光固化的过程中， 所述 光栅板与所述玻璃基板之间的距离为 100μηι~300μηι。
优选， 所述方法还包括： 当所确定的所述剥离设备的剥离能力等级低于 剥离能力等级下限时， 对所述剥离设备进行校正。
根据本发明实施例， 还提供一种剥离设备的剥离能力评定系统， 其中， 该系统包括： 光刻胶剥离模块和评定模块。 所述光刻胶剥离模块， 用于利用 剥离设备对至少两个测试块进行光刻胶剥离处理， 每一测试块由基板和涂覆 在所述基板上的光刻胶形成， 并且各个测试块的光刻胶具有彼此不同的固化 程度值。所述评定模块，用于对经过剥离处理后的测试块进行剥离效果检测； 根据剥离效果检测结果、 光刻胶固化程度值、 以及它们与剥离能力等级之间 的对应关系， 确定所述剥离设备的剥离能力等级。
优选， 该系统还包括： 光刻胶固化装置， 用于在基板上涂覆一层光刻胶， 对所述基板上的光刻胶进行曝光和图形化处理， 在基板上不同区域形成光刻 胶块， 对所述光刻胶块进行不同程度的曝光固化处理， 得到光刻胶固化程度 值不同的测试块。
所述光刻胶固化装置构造成： 通过平行的红外光线垂直照射光栅板的光 栅， 对每个光栅对应的光刻胶块进行烘干， 其中所述光栅板上的每个光栅的 光栅常数不同， 从而获得不同固化程度值的光刻胶块， 每个光刻胶块对应的 基板区域及该区域内的光刻胶构成一个测试块。
根据本发明实施例， 还提供一种用于评定剥离设备的剥离能力的评定用 部件， 其包括至少两个测试块， 每一测试块由基板和涂覆在所述基板上的光 刻胶形成， 并且各个测试块的光刻胶具有彼此不同的固化程度值。
优选， 所述至少两个测试块集成在一个基板上。 附图说明
为了更清楚地说明本发明实施例的技术方案， 下面将对实施例的附图作 筒单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例， 而非对本发明的限制。
图 1为本发明实施例中一种剥离设备的剥离能力的评定方法的流程示意 图；
图 2为本发明实施例中光栅板的光栅的示意图；
图 3为本发明实施例中含有光栅的光栅板示意图；
图 4为本发明实施例中制作测试块时各设备的位置示意图；
图 5为本发明实施例中剥离设备的剥离能力的评定方法的在实际生产中 的应用的一个示例的流程示意图；
图 6a为本发明实施例中一种剥离设备的剥离能力评定系统的示意图；以 及
图 6b 为本发明实施例中一种剥离设备的剥离能力评定系统的具体示意 图。 具体实施方式
为使本发明实施例的目的、 技术方案和优点更加清楚， 下面将结合本发 明实施例的附图，对本发明实施例的技术方案进行清楚、 完整地描述。显然， 所描述的实施例是本发明的一部分实施例， 而不是全部的实施例。 基于所描 述的本发明的实施例， 本领域普通技术人员在无需创造性劳动的前提下所获 得的所有其他实施例， 都属于本发明保护的范围。
根据本发明实施例， 为了评定剥离设备的剥离能力， 采用利用剥离设备 对测试块进行光刻胶剥离处理， 其中测试块中的光刻胶的固化程度值不同； 对经过剥离处理后的测试块进行剥离效果检测以确定剥离效果等级； 并且， 根据剥离效果检测结果以及光刻胶固化程度值， 确定剥离设备的剥离能力等 级。 这样， 能够实现以下各项中的至少一项： 确定不同剥离设备的剥离能力； 对剥离设备的剥离能力进行评定； 确定剥离设备的剥离能力是否发生变化； 对剥离设备的剥离能力进行监控。
下面结合说明书附图对本发明实施例作进一步详细描述。
图 1示出了本发明实施例中一种剥离设备的剥离能力的评定方法， 该方 法包括：
步骤 101 : 利用剥离设备对至少两个测试块进行光刻胶剥离处理， 每一 测试块由基板和涂覆在所述基板上的光刻胶形成， 并且各个测试块的光刻胶 具有彼此不同的固化程度值；
步骤 102: 对经过剥离处理后的测试块进行剥离效果检测， 并且根据剥 离效果检测结果和光刻胶固化程度值， 确定所述剥离设备的剥离能力等级。
本实施方式中所述的测试块， 优选可以为包括该测试块区域对应的基板 部分以及该区域内的光刻胶部分， 即该测试块包括基板部分和光刻胶部分这 两层。 当然， 光刻胶也可以经由其它的中间层而涂覆在基板上。 例如， 在基 板上先形成一层衬底层， 在衬底层上再形成光刻胶层。 此类变换不以本实施 例为限。
测试块的制作方法如下： 在基板上涂覆一层光刻胶， 对基板上的光刻胶 进行曝光和图形化处理， 形成光刻胶块； 通过含有光栅的光栅板对光刻胶块 进行固化处理， 在基板上得到光刻胶固化程度值不同的测试块。 较佳地， 基 板为玻璃基板。 光栅板的光栅的制作方法如下： 在一块光栅板上制作至少两个光栅， 其 中每个光栅的光栅常数不同。 如图 2所示， 光栅板上光栅的光栅常数 d包括 狭缝宽度 a和间隔 c。 如图 3所示， 在一个光栅内狭缝宽度 a和间隔 c的宽 度相等， 不同的光栅狭缝宽度 a和间隔 c不同。 光栅的光栅常数优选但不限 于 10μηι~90μηι之间。
以基板是玻璃基板为例， 通过含有光栅的光栅板对光刻胶块进行固化处 理， 包括： 在与光栅板大小相同的玻璃基板上涂覆一层光刻胶， 对光刻胶进 行曝光和图形处理， 使图形处理后的光刻胶块的位置与光栅板上光栅的位置 相同； 将光栅板放置在玻璃基板上方， 使红外光通过光栅对玻璃基板上的光 刻胶块进行固化处理， 得到光刻胶固化程度值不同的测试块。 光栅板与玻璃 基板之间的距离优选但不限于 100μηι~300μηι。
使用例如红外光通过光栅对玻璃基板上的光刻胶块进行固化处理时， 红 外光源发出的红外光通过透镜转变成平行的红外光， 平行的红外光线垂直照 射在光栅上， 通过光栅对玻璃基板上的光刻胶进行再次固化。 由于光栅的光 栅常数不同， 得到的玻璃基板上的光刻胶的固化程度值也不相同， 光栅的光 栅常数越大， 通过的红外光越多， 光刻胶块吸收的热量也就越多， 固化程度 值也就越高，得到的测试块的剥离难度就越大，对应的剥离能力等级也越高。 因此， 光栅常数越大的光栅对应的光刻胶块的固化程度值越高， 得到的测试 块对应的剥离能力等级也越高。
如图 3所示， 以在光栅板上制作 9个光栅常数不同的光栅为例， 其他情 况与之类似，在此不再赘述。 9个光栅对应的光栅常数分别为： ΙΟμηι, 20μηι, 30μηι, 40μηι, 50μηι, 60μηι, 70μηι, 80μηι, 90μηι, 按照光栅常数大小进行 等级排序， 光栅常数越小对应的等级越低， 将光栅分为 9级。
如图 4所示， 将含有光栅的光栅板 41放置在图形处理后的玻璃基板 42 上， 每个光栅对应一个光刻胶块 43 , 光栅板 41与玻璃基板 42之间的距离为 100μηι~300μηι, 红外光源发出的红外光通过透镜转变成平行的红外光， 垂直 照射在玻璃基板的光刻胶块 43上，形成固化程度值不同的测试块。其中固化 程度值越高的测试块剥离难度就越大， 对应的剥离能力等级也就越高。 以上 述一个金属上有 9个光栅常数不同的光栅为例， 由于光栅对应 9个等级， 每 个光栅对应得到的测试块的剥离能力等级与该光栅的等级对应， 即基板上的 9个测试块对应 9个剥离能力等级， 测试块的固化程度值越高对应的剥离能 力等级也越高。
步骤 101中， 利用剥离设备对基板上涂覆有光刻胶的测试块进行剥离处 理， 包括： 剥离设备在进行生产前对基板上涂覆有光刻胶的测试块进行剥离 处理； 剥离设备在校正后对基板上涂覆有光刻胶的测试块进行剥离处理； 剥 离设备工作设定时间长度后对基板上涂覆有光刻胶的测试块进行剥离处理。
步骤 102中， 对经过剥离处理后的测试块进行剥离效果检测， 包括： 使 用检测设备对经过剥离处理后的玻璃基板上的每个测试块进行检测， 如使用 外观检测机等对经过剥离处理后的玻璃基板上的每个测试块进行检测， 并记 录检测结果。
根据剥离效果检测结果、 光刻胶的固化程度值、 以及它们和剥离能力等 级之间的对应关系， 确定剥离设备的剥离能力等级， 具体包括： 剥离设备对 涂覆有光刻胶的测试块进行光刻胶剥离处理后， 记录每个剥离处理后的测试 块对应的剥离效果等级， 确定满足设定的剥离效果等级的剥离处理后的测试 块； 若有多个测试块满足设定的剥离效果等级， 则此时确定光刻胶的固化程 度值最高的满足设定的剥离效果等级的测试块对应的剥离能力等级为剥离设 备的剥离能力等级。
根据测试块的光刻胶残留值确定剥离效果等级， 包括： 将剥离处理后的 测试块对应的剥离效果等级分为至少两个等级， 每个等级对应的光刻胶残留 值不同， 光刻胶残留值可以根据残留的光刻胶的厚度确定， 或根据残留的光 刻胶的面积确定， 也可以根据其他任何能够量化的值确定； 以将剥离处理后 的测试块对应的剥离效果等级分为 4个等级， 每个剥离效果等级对应的光刻 胶的残留厚度不同为例， 其他情况与此类似， 在此不再赘述。 当剥离效果等 级为 1级时， 对应的光刻胶残留厚度 20μηι < ρ < 30μηι; 当剥离效果等级为 2 级时， 对应的光刻胶残留厚度 1 Ομηι < ρ < 20μηι; 当剥离效果等级为 3级时， 对应的光刻胶残留厚度 Ομηι < ρ < 1 Ομηι; 当剥离效果等级为 4级时， 对应的 光刻胶残留厚度 ρ=0μηι。
以上述基板上含有 9个剥离能力等级的测试块为例， 确定设定的剥离效 果等级为 4级， 剥离设备对含有 9个测试块的基板进行剥离测试， 剥离完成 后对 9个测试块分别进行检测， 确定测试块 1~4的剥离效果等级为 4级， 测 试块 5~9上对应的剥离效果等级不满足设定的剥离效果等级， 则确定剥离设 备当前的剥离能力等级为 5级。
或以上述基板上含有 9个剥离能力等级的测试块为例， 确定设定的剥离 效果等级为 2级， 剥离设备对含有 9个测试块的基板进行剥离测试， 剥离完 成后对 9个测试块分别进行检测， 确定测试块 1~4的剥离效果等级为 4级， 测试块 5~6的剥离效果等级为 3级， 测试块 7的剥离效果等级为 2级， 测试 块 8~9的剥离效果等级为 1级， 满足预设的剥离效果等级的测试块为 \〜Ί, 根据测试块对应的固化程度值确定， 测试块 7对应的剥离能力等级最高， 剥 离能力等级为 7级， 因此剥离设备的剥离能力等级为 7级。
对于相同的剥离效果等级， 光刻胶的固化程度值越高对应的剥离能力等 级越高； 对于相同的光刻胶的固化程度值， 剥离效果等级越高对应的剥离能 力等级越高。
需说明的是， 本实施方式中采用了不同光栅常数的光栅板材作为实施例 进行说明， 但本发明不限于此种光栅板材， 还可以是其他类型的能够对光刻 胶进行不同程度固化的材料， 比如， 具有不同透光程度的遮光材料， 利用不 同区域的透光量的不同， 使得不同区域的光刻胶固化程度不同， 同样能够制 作出所需要的测试块， 本实施方式中的例子仅为优选的实施例。
当剥离设备工作设定的时长后， 利用剥离设备对基板上涂覆有光刻胶的 测试块进行剥离处理， 对经过剥离处理后的基板上的每个测试块进行检测， 确定无光刻胶残留的测试块，根据剥离效果检测结果、光刻胶的固化程度值、 以及它们和剥离能力等级的对应关系， 确定剥离设备的剥离能力等级； 判断 剥离设备的剥离能力等级在工作设定时长后是否降低； 若剥离设备的剥离能 力等级降低， 则对剥离设备进行校正， 否则， 剥离设备继续进行剥离处理。 剥离设备的工作时长可以根据剥离设备的剥离液的使用时间， 以及剥离设备 的工作强度等因素进行设定。
如图 5所示， 为本发明实施例中剥离设备的剥离能力的评定方法的在实 际生产中的应用， 该方法包括：
步骤 501： 利用剥离设备对涂覆有光刻胶的测试块进行剥离处理； 步骤 502: 对经过剥离处理的基板上的每个测试块进行检测， 确定满足 剥离效果等级的测试块； 步骤 503 : 根据剥离效果等级、 光刻胶的固化程度值、 以及它们和剥离 能力等级之间的对应关系， 确定剥离设备的剥离能力等级；
步骤 504: 确定剥离设备的剥离能力等级；
步骤 505: 判断剥离设备的剥离能力等级是否低于剥离能力下限， 若低 于剥离能力下限， 执行步骤 506, 否则执行步骤 507;
步骤 506: 对剥离设备进行校正， 并返回步骤 504;
步骤 507: 剥离设备继续进行剥离处理， 并结束本流程。
其中， 步骤 504具体包括： 剥离设备工作设定时长后， 通过剥离设备对 基板上涂覆有光刻胶的测试块进行剥离处理， 对经过剥离处理后的基板上的 每个测试块进行检测， 确定满足设定的剥离效果等级的测试块， 根据剥离效 果等级、 光刻胶的固化程度值、 以及它们和剥离能力等级之间的对应关系， 确定当前剥离设备的剥离能力等级。
基于同一发明构思， 本发明实施例中还提供了一种剥离设备的剥离能力 评定系统， 由于该系统解决问题的原理与本发明实施例一种剥离设备的剥离 能力的评定方法相似， 因此该系统的实施可以参见方法的实施， 重复之处不 再赘述。
如图 6a所示为本发明实施例中一种剥离设备的剥离能力评定系统，该系 统包括： 光刻胶剥离模块 601和评定模块 602;
光刻胶剥离模块 601 , 用于利用剥离设备对涂覆有光刻胶的测试块进行 光刻胶剥离处理， 其中测试块上涂覆的光刻胶的固化程度值不同；
评定模块 602, 用于对经过剥离处理后的测试块进行剥离效果检测； 根 据剥离效果检测结果、 光刻胶固化程度值、 以及它们与剥离能力等级之间的 对应关系， 确定剥离设备的剥离能力等级。
较佳地， 如图 6b所示， 该系统还包括光刻胶固化装置 603 , 用于在基板 上涂覆一层光刻胶， 对基板上的光刻胶进行曝光和图形化处理， 形成光刻胶 块； 通过含有光栅的光栅板对光刻胶块进行固化处理， 在基板上得到光刻胶 固化程度值不同的测试块。
光栅板的光栅的制作方法如下： 在一块光栅板上制作至少两个光栅， 其 中每个光栅的光栅常数不同； 光栅板上光栅的光栅常数 d包括狭缝宽度 a和 间隔 c, 在一个光栅内狭缝宽度 a和间隔 c的宽度相等， 不同的光栅狭缝宽 度 a和间隔 c不同。 光栅的光栅常数优选但不限于在 10μηι~90μηι之间。 光刻胶固化装置 603 , 具体用于在与光栅板大小相同的基板上涂覆一层 光刻胶， 对光刻胶进行曝光和图形处理， 使图形处理后的光刻胶块的位置与 光栅板上光栅的位置相同； 将光栅板放置在基板上方， 使红外光通过光栅对 基板上的光刻胶块进行固化处理， 得到光刻胶固化程度值不同的测试块。 固 化过程中， 光栅板与基板之间的距离优选但不限于为 100μηι~300μηι。
使用例如红外光通过光栅对基板上的光刻胶块进行固化处理时， 红外光 源发出的红外光通过透镜转变成平行的红外光， 平行的红外光线垂直照射在 光栅上， 通过光栅对基板上的光刻胶进行再次固化。 由于光栅的光栅常数不 同， 得到的基板上的光刻胶的固化程度值也不相同， 光栅的光栅常数越大， 通过的红外光越多， 光刻胶块吸收的热量也就越多， 固化程度值也就越高， 得到的测试块的剥离难度就越大， 对应的剥离能力等级也越高。 因此， 光栅 常数越大的光栅对应的光刻胶块的固化程度值越高， 得到的测试块对应的剥 离能力等级也越高。
光刻胶剥离模块 601 , 具体用于剥离设备在进行生产前对基板上涂覆有 光刻胶的测试块进行剥离处理； 剥离设备在校正后对基板上涂覆有光刻胶的 测试块进行剥离处理； 剥离设备工作设定时间长度后对基板上涂覆有光刻胶 的测试块进行剥离处理。
评定模块 602 , 具体用于使用检测设备对经过剥离处理后的玻璃基板上 的每个测试块进行检测， 如使用外观检测机等对经过剥离处理后的玻璃基板 上的每个测试块进行检测， 并记录检测结果。
剥离设备对涂覆有光刻胶的测试块进行光刻胶剥离处理后， 记录每个剥 离处理后的测试块对应的剥离效果等级， 确定满足设定的剥离效果等级的剥 离处理后的测试块； 若有多个测试块满足设定的剥离效果等级， 则此时确定 光刻胶的固化程度值最高的满足设定的剥离效果等级的测试块对应的剥离能 力等级为剥离设备的剥离能力等级。
将剥离处理后的测试块对应的剥离效果等级分为至少两个等级， 每个等 级对应的光刻胶残留值不同， 光刻胶残留值可以根据残留的光刻胶的厚度确 定， 或根据残留的光刻胶的面积确定， 也可以根据其他任何能够量化的值确 定。 对于相同的剥离效果等级， 光刻胶的固化程度值越高对应的剥离能力等 级越高； 对于相同的光刻胶的固化程度值， 剥离效果等级越高对应的剥离能 力等级越高。
根据本发明实施例， 还提供一种用于评定剥离设备的剥离能力的评定用 部件， 其包括至少两个测试块， 每一测试块由基板和涂覆在所述基板上的光 刻胶形成， 并且各个测试块的光刻胶具有彼此不同的固化程度值。
优选， 所述至少两个测试块集成在一个基板上。 发明的精神和范围。 这样， 倘若本发明的这些修改和变型属于本发明权利要 求及其等同技术的范围之内， 则本发明也意图包含这些改动和变型在内。

Claims

权利要求书
1、 一种剥离设备的剥离能力的评定方法， 其中， 该方法包括： 利用剥离设备对至少两个测试块进行光刻胶剥离处理， 每一测试块由基 板和涂覆在所述基板上的光刻胶形成， 并且各个测试块的光刻胶具有彼此不 同的固化程度值；
对经过剥离处理后的测试块进行剥离效果检测； 以及
根据测试块的光刻胶固化程度值和剥离效果， 确定所述剥离设备的剥离 能力等级。
2、 如权利要求 1所述的方法， 其中，
所述剥离效果检测包括： 根据所述测试块的光刻胶残留值确定剥离效果 等级， 其中所述测试块的光刻胶残留值越低对应的剥离效果等级越高； 所述确定剥离能力等级基于剥离效果检测结果、 光刻胶固化程度值以及 剥离能力等级之间的以下对应关系： 光刻胶的固化程度值越高， 剥离处理后 的测试块的光刻胶残留值越低， 所述剥离设备对应的剥离能力等级越高。
3、 如权利要求 2所述的方法， 其中， 所述确定剥离能力等级包括： 确定满足设定的剥离效果等级的测试块， 以及所述满足设定的剥离效果 等级的测试块对应的光刻胶固化程度值； 以及
将满足设定的剥离效果等级且光刻胶固化程度值最高的测试块对应的剥 离能力等级作为所述剥离设备的剥离能力等级。
4、 如权利要求 1所述的方法， 其中，
所述剥离效果检测包括确定剥离效果等级； 以及
所述确定剥离能力等级基于剥离效果、 光刻胶固化程度值以及剥离能力 等级之间的以下对应关系：
对于相同的剥离效果等级， 光刻胶的固化程度值越高对应的剥离能力等 级越高；
对于相同的光刻胶的固化程度值， 剥离效果等级越高对应的剥离能力等 级越高。
5、 如权利要求 1-4中任一项所述的方法， 其中， 所述方法还包括采用下 列方式制作待进行剥离处理的所述测试块： 在基板上涂覆一层光刻胶， 并对所述基板上的光刻胶进行曝光和图形化 处理， 以在基板上不同区域形成光刻胶块；
对所述光刻胶块进行不同程度的曝光固化处理， 得到光刻胶固化程度值 不同的所述测试块。
6、如权利要求 5所述的方法， 其中， 对所述光刻胶块进行不同程度的固 化处理， 包括：
提供光栅板， 所述光栅板具有多个光栅， 每个光栅具有彼此不同的光栅 常数； 以及
经由所述光栅板对所述光刻胶块进行曝光固化， 其中每个光刻胶块与其 中一个光栅相对应。
7、 如权利要求 6 所述的方法， 其中， 所述光栅板的光栅常数在 10μηι~90μηι之间。
8、如权利要求 6或 7所述的方法， 其中， 在经由所述光栅板对所述光刻 胶块进行曝光固化的过程中， 所述光栅板与所述玻璃基板之间的距离为 100μηι~300μηι。
9、 如权利要求 1所述的方法， 其中， 该方法还包括：
当所确定的所述剥离设备的剥离能力等级低于剥离能力等级下限时， 对 所述剥离设备进行校正。
10、 一种剥离设备的剥离能力评定系统， 其中， 该系统包括： 光刻胶剥 离模块和评定模块；
所述光刻胶剥离模块， 用于利用剥离设备对至少两个测试块进行光刻胶 剥离处理， 每一测试块由基板和涂覆在所述基板上的光刻胶形成， 并且各个 测试块的光刻胶具有彼此不同的固化程度值；
所述评定模块， 用于对经过剥离处理后的测试块进行剥离效果检测； 根 据剥离效果检测结果、 光刻胶固化程度值、 以及它们与剥离能力等级之间的 对应关系， 确定所述剥离设备的剥离能力等级。
11、如权利要求 10所述的系统，其中，该系统还包括： 光刻胶固化装置， 用于在基板上涂覆一层光刻胶， 对所述基板上的光刻胶进行曝光和图形化处 理， 在基板上不同区域形成光刻胶块， 对所述光刻胶块进行不同程度的曝光 固化处理， 得到光刻胶固化程度值不同的测试块。
12、 如权利要求 11所述的系统， 其中， 所述光刻胶固化装置构造成： 通过平行的红外光线垂直照射光栅板的光栅， 对每个光栅对应的光刻胶 块进行烘干， 其中所述光栅板上的每个光栅的光栅常数不同， 从而获得不同 固化程度值的光刻胶块， 每个光刻胶块对应的基板区域及该区域内的光刻胶 构成一个测试块。
13、 一种用于评定剥离设备的剥离能力的评定用部件， 包括至少两个测 试块， 每一测试块由基板和涂覆在所述基板上的光刻胶形成， 并且各个测试 块的光刻胶具有彼此不同的固化程度值。
14、如权利要求 13所述的评定用部件， 其中， 所述至少两个测试块集成 在一个基板上。
PCT/CN2013/078437 2013-04-26 2013-06-28 剥离设备的剥离能力的评定方法和系统及评定用部件 WO2014173008A1 (zh)

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