WO2014163300A1 - 터치패널용 점착제 조성물, 점착 필름 및 터치 패널 - Google Patents
터치패널용 점착제 조성물, 점착 필름 및 터치 패널 Download PDFInfo
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- WO2014163300A1 WO2014163300A1 PCT/KR2014/001623 KR2014001623W WO2014163300A1 WO 2014163300 A1 WO2014163300 A1 WO 2014163300A1 KR 2014001623 W KR2014001623 W KR 2014001623W WO 2014163300 A1 WO2014163300 A1 WO 2014163300A1
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- WIPO (PCT)
- Prior art keywords
- meth
- acrylate
- adhesive composition
- group
- touch panel
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 68
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 29
- 239000000853 adhesive Substances 0.000 title claims abstract description 26
- 239000002313 adhesive film Substances 0.000 title claims abstract description 25
- 239000000178 monomer Substances 0.000 claims abstract description 77
- 239000010410 layer Substances 0.000 claims abstract description 42
- 125000000524 functional group Chemical group 0.000 claims abstract description 24
- 238000003860 storage Methods 0.000 claims abstract description 20
- 239000002985 plastic film Substances 0.000 claims abstract description 14
- 229920006255 plastic film Polymers 0.000 claims abstract description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 73
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 70
- -1 t -Butyl Chemical group 0.000 claims description 44
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 26
- 239000002318 adhesion promoter Substances 0.000 claims description 15
- 125000000217 alkyl group Chemical group 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- 239000003607 modifier Substances 0.000 claims description 12
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 12
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 12
- 239000003999 initiator Substances 0.000 claims description 11
- 229920000642 polymer Polymers 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 7
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical group C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 claims description 6
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 claims description 6
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 claims description 6
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 claims description 5
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 5
- 229920001083 polybutene Polymers 0.000 claims description 5
- 125000003277 amino group Chemical group 0.000 claims description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 4
- 125000001174 sulfone group Chemical group 0.000 claims description 4
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 claims description 3
- 125000006176 2-ethylbutyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(C([H])([H])*)C([H])([H])C([H])([H])[H] 0.000 claims description 3
- 244000028419 Styrax benzoin Species 0.000 claims description 3
- 235000000126 Styrax benzoin Nutrition 0.000 claims description 3
- 235000008411 Sumatra benzointree Nutrition 0.000 claims description 3
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 3
- 150000001412 amines Chemical class 0.000 claims description 3
- 229960002130 benzoin Drugs 0.000 claims description 3
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 claims description 3
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 3
- 235000019382 gum benzoic Nutrition 0.000 claims description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 3
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 3
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 3
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 claims description 3
- 239000003208 petroleum Substances 0.000 claims description 3
- 229920000768 polyamine Polymers 0.000 claims description 3
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 3
- CWERGRDVMFNCDR-UHFFFAOYSA-N thioglycolic acid Chemical compound OC(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-N 0.000 claims description 3
- 229910044991 metal oxide Inorganic materials 0.000 claims description 2
- 150000004706 metal oxides Chemical class 0.000 claims description 2
- 239000012790 adhesive layer Substances 0.000 abstract description 6
- 239000003623 enhancer Substances 0.000 abstract description 3
- 230000000052 comparative effect Effects 0.000 description 16
- 239000011521 glass Substances 0.000 description 10
- 239000000758 substrate Substances 0.000 description 8
- 238000010521 absorption reaction Methods 0.000 description 7
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 229920003023 plastic Polymers 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 238000001723 curing Methods 0.000 description 5
- 230000000704 physical effect Effects 0.000 description 5
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 4
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 3
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 150000003254 radicals Chemical group 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 2
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 2
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 2
- 229920006225 ethylene-methyl acrylate Polymers 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 239000013638 trimer Substances 0.000 description 2
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- NQUXRXBRYDZZDL-UHFFFAOYSA-N 1-(2-prop-2-enoyloxyethyl)cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1(CCOC(=O)C=C)C(O)=O NQUXRXBRYDZZDL-UHFFFAOYSA-N 0.000 description 1
- YUTHQCGFZNYPIG-UHFFFAOYSA-N 1-[2-(2-methylprop-2-enoyloxy)ethyl]cyclohexane-1,2-dicarboxylic acid Chemical compound CC(=C)C(=O)OCCC1(C(O)=O)CCCCC1C(O)=O YUTHQCGFZNYPIG-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- IEQWWMKDFZUMMU-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethyl)butanedioic acid Chemical compound OC(=O)CC(C(O)=O)CCOC(=O)C=C IEQWWMKDFZUMMU-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- LBNDGEZENJUBCO-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethyl]butanedioic acid Chemical compound CC(=C)C(=O)OCCC(C(O)=O)CC(O)=O LBNDGEZENJUBCO-UHFFFAOYSA-N 0.000 description 1
- QISZCVLALJOROC-UHFFFAOYSA-N 3-(2-hydroxyethyl)-4-(2-prop-2-enoyloxyethyl)phthalic acid Chemical compound OCCC1=C(CCOC(=O)C=C)C=CC(C(O)=O)=C1C(O)=O QISZCVLALJOROC-UHFFFAOYSA-N 0.000 description 1
- UXTGJIIBLZIQPK-UHFFFAOYSA-N 3-(2-prop-2-enoyloxyethyl)phthalic acid Chemical compound OC(=O)C1=CC=CC(CCOC(=O)C=C)=C1C(O)=O UXTGJIIBLZIQPK-UHFFFAOYSA-N 0.000 description 1
- DWTKNKBWDQHROK-UHFFFAOYSA-N 3-[2-(2-methylprop-2-enoyloxy)ethyl]phthalic acid Chemical compound CC(=C)C(=O)OCCC1=CC=CC(C(O)=O)=C1C(O)=O DWTKNKBWDQHROK-UHFFFAOYSA-N 0.000 description 1
- NZEDMAWEJPYWCD-UHFFFAOYSA-N 3-prop-2-enylsulfonylprop-1-ene Chemical compound C=CCS(=O)(=O)CC=C NZEDMAWEJPYWCD-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- 241001214176 Capros Species 0.000 description 1
- WBYWAXJHAXSJNI-SREVYHEPSA-N Cinnamic acid Chemical compound OC(=O)\C=C/C1=CC=CC=C1 WBYWAXJHAXSJNI-SREVYHEPSA-N 0.000 description 1
- 101000720524 Gordonia sp. (strain TY-5) Acetone monooxygenase (methyl acetate-forming) Proteins 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 241000519995 Stachys sylvatica Species 0.000 description 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- MZVQCMJNVPIDEA-UHFFFAOYSA-N [CH2]CN(CC)CC Chemical group [CH2]CN(CC)CC MZVQCMJNVPIDEA-UHFFFAOYSA-N 0.000 description 1
- 238000002835 absorbance Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000012986 chain transfer agent Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229930016911 cinnamic acid Natural products 0.000 description 1
- 235000013985 cinnamic acid Nutrition 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- PSACHCMMPFMFAJ-UHFFFAOYSA-N nmm n-methylmorpholine Chemical compound CN1CCOCC1.CN1CCOCC1 PSACHCMMPFMFAJ-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920006264 polyurethane film Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 230000000638 stimulation Effects 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- OFBPGACXRPVDQW-UHFFFAOYSA-N thiirane 1,1-dioxide Chemical compound O=S1(=O)CC1 OFBPGACXRPVDQW-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1808—C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S20/00—Supporting structures for PV modules
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1811—C10or C11-(Meth)acrylate, e.g. isodecyl (meth)acrylate, isobornyl (meth)acrylate or 2-naphthyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- It relates to an adhesive composition for a touch panel, an adhesive film and a touch panel.
- a transparent conductive plastic film is used for light weight and prevention of cracking.
- a film based on a polyethylene terephthalate (PET) film and a conductive layer such as indium tin oxide (ITO) formed on one surface thereof, and the film is conductive by an adhesive layer. It is laminated
- PET polyethylene terephthalate
- ITO indium tin oxide
- the pressure-sensitive adhesive used for attaching the transparent conductive film in the touch screen or the touch panel includes a step absorbency capable of absorbing the printing step caused by the decor film; When exposed to harsh conditions such as high temperature or high humidity conditions, various physical properties such as durability that can suppress the occurrence of cloudiness are required.
- One embodiment of the present invention provides a pressure-sensitive adhesive composition for a touch panel having excellent step absorption ability and high temperature reliability and reliability for turbidity.
- Another embodiment of the present invention provides an adhesive film using the adhesive composition for a touch panel.
- Another embodiment of the present invention provides a touch panel to which the adhesive film is applied.
- the dielectric constant is less than about 3.5 at a frequency in the region of about 100kHz to about 2MHz
- the storage modulus is about 1.0X10 5 at about 25 °C to about 85 °C It provides a pressure-sensitive adhesive composition for a touch panel that is Pa to about 7.0X10 5 Pa.
- the hydrophilic functional group-containing monomer may be at least one selected from the group consisting of a hydroxyl group-containing monomer, an amino group-containing monomer, a carboxyl group-containing monomer, a sulfone group-containing monomer, a morpholine group-containing monomer, a glycidyl group-containing monomer, and a combination thereof.
- the hydrophilic functional group-containing monomer may be about 30 parts by weight or less based on 100 parts by weight of the (meth) acrylic acid ester monomer.
- the polymer molecular weight of the (meth) acrylic acid ester monomer and the hydrophilic functional group-containing monomer may be about 600,000 to about 1.2 million.
- the (meth) acrylic acid ester monomer may be an alkyl (meth) acrylate, and the alkyl of the alkyl (meth) acrylate may be linear or branched C1 to C14 alkyl.
- the (meth) acrylic acid ester monomer is methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, t -Butyl (meth) acrylate, sec-butyl (meth) acrylate, pentyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, 2-ethylbutyl (meth) acrylate, n-octyl (meth) At least one selected from the group consisting of acrylate, isooctyl (meth) acrylate, isononyl (meth) acrylate, lauryl (meth) acrylate, tetradecyl (meth) acrylate, and combinations thereof.
- the adhesion promoter may be at least one selected from the group consisting of an amine liquid polymer, poly amine, petroleum resin, polybutene, acrylic modified resin, acryloyl morpholine resin, and combinations thereof.
- It may further comprise a molecular weight regulator.
- the molecular weight modifier may be at least one selected from the group consisting of 2-mercaptoacetate, n-dodecyl mercaptan, 4-4 'triobisbenzenetriol, and combinations thereof.
- the photoinitiator may be at least one selected from the group consisting of a benzoin initiator, a hydroxy ketone initiator, an amino ketone initiator caprolactam, and a combination thereof.
- an adhesive film comprising an adhesive layer including a cured product of the adhesive composition for a touch panel.
- the pressure-sensitive adhesive layer had a dielectric constant of about 3.5 or less at a frequency of about 100kHz to about 2MHz region, the storage modulus may be from about 25 °C to about 85 °C about 1.0X10 5 Pa to about 7.0X10 5 Pa.
- a conductive plastic film formed with a conductive layer on one surface; And a pressure-sensitive adhesive layer attached to the conductive layer and including a cured product of the pressure-sensitive adhesive composition for touch panels.
- the conductive plastic film may be a polyethylene terephthalate film having an ITO (conductive metal oxide) layer formed on one surface thereof.
- ITO conductive metal oxide
- the pressure-sensitive adhesive composition for a touch panel may provide a pressure-sensitive adhesive film having excellent step absorption ability, high temperature reliability, and durability.
- FIG. 1 is a schematic cross-sectional view of an adhesive film according to an embodiment of the present invention.
- FIG. 2 is a schematic cross-sectional view of a touch panel according to other embodiments of the present invention.
- FIG. 3 is a schematic cross-sectional view of a touch panel according to another embodiment of the present invention.
- any configuration is formed on the “top (or bottom)" of the substrate or “top (or bottom)” of the substrate means that any configuration is formed in contact with the top (or bottom) of the substrate.
- it is not limited to not including other configurations between the substrate and any configuration formed on (or under) the substrate.
- a hydrophilic functional group-containing monomer and an adhesion promoter the dielectric constant of 3.5 or less at a frequency in the region of 100kHz to 2MHz
- the storage modulus is 1.0X10 5 Pa to 7.0X10 5 Pa at 25 °C to 85 °C It provides the pressure-sensitive adhesive composition for a touch panel.
- the adhesive composition for the touch panel may have a dielectric constant of about 3.5 or less at a frequency in a range of about 100 kHz to about 2 MHz.
- the degree of polarity of the solvent and the copolymer can be expressed by permittivity. When the polarity is high as the polarity, the dielectric constant is high, and when the polarity is low as the nonpolarity, the dielectric constant is low.
- the pressure-sensitive adhesive composition for the touch panel has a dielectric constant of about 3.5 or less at a frequency in the range of about 100 kHz to about 2 MHz, so that the pressure-sensitive adhesive composition for the touch panel may increase sensitivity due to signal enhancement for stimulation such as touch, and improve sensitivity. Due to this can be obtained an adhesive film showing a fast reaction rate.
- the pressure-sensitive adhesive composition for a touch panel has an improved storage modulus at a high temperature, thereby improving high temperature reliability.
- the storage modulus describes the elasticity of the pressure-sensitive adhesive composition for a touch panel, and relates to the performance characteristics of the pressure-sensitive adhesive composition such as shear resistance, bonding and debonding behavior.
- Elasticity includes a spring-like response to a force, the spring-like property providing a resistance to a force that provides adequate peel adhesion.
- the touch-sensitive adhesive composition for a panel may have about 1.0X10 5 Pa to about 7.0X10 5 Pa of storage modulus at about 25 °C to about 85 °C.
- the storage modulus of the pressure-sensitive adhesive composition for the touch panel may have the above range at high temperature, thereby providing excellent durability under high step absorbing capacity and high temperature and high humidity conditions.
- the hydrophilic functional group-containing monomer may be at least one selected from the group consisting of a hydroxyl group-containing monomer, an amino group-containing monomer, a carboxyl group-containing monomer, a sulfone group-containing monomer, a morpholine group-containing monomer, a glycidyl group-containing monomer, and a combination thereof.
- hydroxyl-containing monomer 2-hydroxyethyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 5-hydroxypentyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, for example (Meth) acrylic acid hydroxyalkyl esters, such as 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, and (4-hydroxymethylcyclohexyl) methyl (meth) acrylate, and capro Caprolactone-modified monomers such as lactone-modified 2-hydroxyethyl (meth) acrylate, 2-acryloyloxyethyl-2-hydroxyethylphthalic acid, N-methylol (meth) acrylamide, N-hydroxyethyl ( Primary hydroxyl group-containing monomers such as meta) acrylamide; 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 2-hydroxy
- hydroxyl group-containing monomers it is particularly preferable to use 2-hydroxyethyl (meth) acrylate because it contains little impurities such as di (meth) acrylate and is easy to manufacture.
- amino-group containing monomer dimethylaminoethyl (meth) acrylate, diethylaminoethyl (meth) acrylate, etc. are mentioned, for example.
- carboxyl group-containing monomers examples include acrylic acid, methacrylic acid, crotonic acid, maleic acid, maleic anhydride, itaconic acid, fumaric acid, acrylamide N-glycolic acid, cinnamic acid, and Michael adducts of (meth) acrylic acid (for example, acrylic acid). Dimer, methacrylic acid dimer, acrylic acid trimer, methacrylic acid trimer, acrylic acid tetramer, methacrylic acid tetramer and the like), 2- (meth) acryloyloxyethyldicarboxylic acid monoester (e.g.
- sulfone group-containing monomers examples include olefin sulfones such as ethylene sulfone, allyl sulfone, and metaallyl sulfone, 2-acrylamide-2-methylpropane sulfone, styrene sulfone or salts thereof.
- 4-methylmorpholine (4-Methylmorpholine) and the said glycidyl-group containing monomer are glycidyl (meth) acrylate, allyl glycidyl ether, etc. are mentioned as said morpholine group containing monomer.
- the hydrophilic functional group-containing monomer may be about 30 parts by weight or less based on 100 parts by weight of the (meth) acrylic acid ester monomer.
- the content of the hydrophilic functional group-containing monomer having high polarity may be limited.
- the hydrophilic functional group-containing monomer is about 30 parts by weight or less based on 100 parts by weight of the (meth) acrylic acid ester monomer. More specifically, the pressure-sensitive adhesive composition containing about 20 parts by weight or less can be provided.
- the overall polarity of the pressure-sensitive adhesive composition is reduced, thereby ensuring an improved storage modulus at a high temperature, and the dielectric constant may also be reduced compared to a pressure-sensitive adhesive composition for a conventional touch panel.
- the polymer molecular weight of the (meth) acrylic acid ester monomer and the hydrophilic functional group-containing monomer may be about 600,000 to about 1.2 million, respectively.
- the polymer molecular weight exceeds about 1.2 million, there is a problem in that the specific gravity of the pressure-sensitive adhesive composition is increased, and when the polymer molecular weight is less than about 600,000, there is a fear that durability is weak. Therefore, the polymer has an advantage in that durability and adhesion are excellent by maintaining the above molecular weight range.
- the (meth) acrylic acid ester monomer may be, for example, alkyl (meth) acrylate, but is not limited thereto.
- Alkyl of the alkyl (meth) acrylate may be linear or branched C 1 to C 14 alkyl, specifically may be C 1 to C 8 alkyl.
- the cured product of the pressure-sensitive adhesive composition for a touch panel may be adjusted to have appropriate cohesion, glass transition temperature, and adhesive properties.
- the (meth) acrylic acid ester monomer is methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, t -Butyl (meth) acrylate, sec-butyl (meth) acrylate, pentyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, 2-ethylbutyl (meth) acrylate, n-octyl (meth) At least one selected from the group consisting of acrylate, isooctyl (meth) acrylate, isononyl (meth) acrylate, lauryl (meth) acrylate, tetradecyl (meth) acrylate, and combinations thereof.
- the pressure-sensitive adhesive composition for a touch panel includes an adhesion promoter together with a hydrophilic functional group-containing monomer.
- the adhesion promoter may be added to polymerize monomers included in the pressure-sensitive adhesive composition well to each other and improve the adhesion level.
- the adhesive property may be reduced, and the polarity may be reduced to suppress the clouding phenomenon of the adhesive composition applied to the liquid crystal display device in an external environment such as high temperature and high humidity.
- the content of the adhesion promoter is not limited, specifically, the adhesion promoter may be about 1 part by weight to about 20 parts by weight based on 100 parts by weight of the (meth) acrylic acid ester monomer.
- the pressure-sensitive adhesive agent is less than about 1 part by weight based on 100 parts by weight of the (meth) acrylic acid ester monomer, there is a problem in that the pressure-sensitive adhesive effect of the pressure-sensitive adhesive composition is insufficient. There may be a phenomenon that a phenomenon occurs, or an unreacted substance moves. Therefore, there is an advantage in maintaining the compatibility of the pressure-sensitive adhesive composition by maintaining the content of the pressure-sensitive adhesive agent, and to stably implement the physical properties.
- the type of adhesion promoter is not limited, but selected from the group consisting of amine liquid polymer, polyamine, petroleum resin, polybutene, acrylic modified resin, acryloyl morpholine resin and combinations thereof It may contain the above.
- the pressure-sensitive adhesive composition for a touch panel may further include a molecular weight regulator.
- the molecular weight modifier may also be referred to as a chain transfer agent and may soften the performance of the pressure-sensitive adhesive composition for a touch panel formed according to the content.
- the active point at which addition reaction occurs in the radical polymerization for forming the pressure-sensitive adhesive composition for a touch panel from the polymer of the (meth) acrylic acid ester monomer and the hydrophilic functional group-containing monomer is called a radical chain.
- the molecular weight regulator reacts with the radical chain more easily than the conventionally added monomers to stop the growth of the growing radical chain, and the molecular weight modifier has an active point and serves to transfer the active point to other monomers. It can adjust and soften the property of the adhesive composition formed.
- a molecular weight modifier additionally, it is possible to improve the step absorption ability of the pressure-sensitive adhesive composition for touch panels.
- the content of the molecular weight modifier is not limited, but specifically, the molecular weight modifier may include about 0.01 part by weight to about 0.5 part by weight based on 100 parts by weight of the (meth) acrylic acid ester monomer.
- the content of the molecular weight regulator is less than 0.01 parts by weight, there is a problem that the amount of change in molecular weight is less, and when it exceeds about 0.5 parts by weight, the reactivity is excessively suppressed and there is a fear that the durability is lowered. Therefore, the molecular weight modifier has the advantage of improving the flexibility and adhesion of the pressure-sensitive adhesive composition by maintaining the content in the above range.
- the molecular weight modifier may be at least one selected from the group consisting of 2-mercaptoacetate, n-dodecyl mercaptan, 4-4 'triobisbenzenetriol, and combinations thereof. Specifically, by using n-dodecyl mercaptan as the molecular weight regulator, it can have an excellent effect in controlling the molecular weight of the pressure-sensitive adhesive composition and making the physical properties smooth.
- the pressure-sensitive adhesive composition for the touch panel may further include a photoinitiator. Specifically, based on 100 parts by weight of the (meth) acrylic acid ester monomer, about 0.5 to about 1.0 parts by weight of the photopolymerization initiator may be further included. When the photopolymerization initiator is out of the above range, many molecules having a short bond length may be generated, and thus durability may be weak.
- the type of photoinitiator is not limited, but may include one selected from the group consisting of a benzoin initiator, a hydroxy ketone initiator, an amino ketone initiator caprolactam, and a combination thereof.
- the dielectric constant is 3.5 or less at a frequency in the region of 100kHz to 2MHz
- storage modulus is 25 °C
- a pressure-sensitive adhesive film comprising a pressure-sensitive adhesive layer containing a cured product of the pressure-sensitive adhesive composition for a touch panel is 1.0X10 5 Pa to 7.0X10 5 Pa at 85 °C.
- electron rays, proton rays, neutral magnetic rays, and the like may be used in addition to electromagnetic waves such as ultraviolet rays such as far ultraviolet rays, ultraviolet rays, near ultraviolet rays, infrared rays, X rays, and ⁇ rays, but the curing rate, Curing by ultraviolet irradiation is advantageous from the ease of obtaining the irradiation device, the price, and the like.
- a high pressure mercury lamp As the light source for the ultraviolet irradiation, a high pressure mercury lamp, an electrodeless lamp, an ultra high pressure mercury lamp, a carbon arc lamp, a xenon lamp, a metal halide lamp, a chemical lamp, a black light, and the like are used.
- the high-pressure mercury lamp for example, it is carried out under the conditions of about 5mJ / cm 2 to 3000mJ / cm 2, preferably about 10mJ / cm 2 to about 1000mJ / cm 2.
- the electrodeless lamp for example, it is carried out under the conditions of about 2 mJ / cm 2 to about 1500 mJ / cm 2, preferably about 5 mJ / cm 2 to about 500 mJ / cm 2.
- the irradiation time may vary depending on the type of light source, the distance between the light source and the coated surface, the coating thickness, and other conditions, but may usually be several seconds to several tens of seconds, and in some cases, one second of water.
- the pressure-sensitive adhesive layer including the cured product of the pressure-sensitive adhesive composition for the touch panel has a dielectric constant of 3.5 or less at a frequency of 100 kHz to 2 MHz, and a storage modulus of about 1.0X10 5 Pa to about 7.0X10 5 Pa at about 25 ° C to about 85 ° C. Can be.
- the dielectric constant and storage modulus of the pressure-sensitive adhesive composition for the touch panel may have the above range at a high temperature, thereby providing excellent endurance ability and excellent durability under high temperature and high humidity conditions.
- the pressure-sensitive adhesive film 100 may include a base layer 20, pressure-sensitive adhesive layer 10, the base layer 20 from above.
- the adhesive layer 10 may have a thickness of about 50 ⁇ m to about 300 ⁇ m, specifically about 50 ⁇ m to about 150 ⁇ m. By making the pressure-sensitive adhesive layer 10 have a thickness in the above range, it can be applied to a thin touch panel or a touch screen, but can implement an adhesive film 100 having excellent durability.
- the specific kind of the substrate layer 10 is not particularly limited, and for example, a general plastic film in this field may be used.
- the base layer 10 polyethylene terephthalate, polytetrafluoroethylene, polyethylene, polypropylene, polybutene, polybutadiene, vinyl chloride copolymer, polyurethane, ethylene-vinylacetate, ethylene-propylene copolymer , An ethylene-ethyl acrylate copolymer, an ethylene-methyl acrylate copolymer, a polyimide, and a combination thereof may be used.
- the base layer 11 may be a polyethylene terephthalate film, but is not limited thereto.
- the substrate layer 10 may have a thickness of about 25 ⁇ m to about 300 ⁇ m, specifically about 30 ⁇ m to about 200 ⁇ m. By having the base layer 10 have a thickness in the above range, it can be applied to a thin touch panel or a touch screen, but can implement an adhesive film 100 with excellent durability.
- a conductive plastic film formed with a conductive layer on one surface; And a hydrophilic functional group-containing monomer and an adhesion promoter with respect to 100 parts by weight of the (meth) acrylic acid ester monomer, attached to the conductive layer, and having a dielectric constant of 3.5 or less at a frequency in the range of 100 kHz to 2 MHz, and a storage modulus of 25 ° C. It provides a touch panel comprising a pressure-sensitive adhesive layer containing a cured product of the pressure-sensitive adhesive composition for a touch panel that is 1.0X10 5 Pa to 7.0X10 5 Pa at 85 °C.
- the touch panel 200 includes a conductive plastic film 50 including a plastic base layer 40 and a conductive layer 30 formed on one surface of the plastic base layer 40.
- the adhesive layer 10 may have a structure attached to one surface of the conductive layer 30 of the conductive plastic film 50.
- the pressure-sensitive adhesive layer 10 may have a structure attached to both surfaces of the conductive layer 30 of the conductive plastic film 50.
- the touch panel may be, for example, a capacitive touch panel.
- the specific structure of the touch panel or a method of forming the same is not particularly limited as long as the above-described pressure-sensitive adhesive composition for the touch panel is applied, and a general configuration in this field may be adopted.
- the conductive plastic film 50 is not particularly limited, and a conductive film known in the art may be used.
- the conductive film 50 may be a transparent plastic film having an ITO electrode layer formed on one surface thereof.
- the transparent plastic film forming the plastic base layer 40 polyethylene terephthalate film, polytetrafluoroethylene film, polyethylene film, polypropylene film, polybutene film, polybutadiene film, vinyl chloride air Copolymer film, polyurethane film, ethylene-vinyl acetate film, ethylene-propylene copolymer film, ethylene-ethyl acrylate copolymer film, ethylene-methyl acrylate copolymer film or polyimide film and the like can be used, but are not limited thereto.
- the plastic base layer 40 may be a polyethylene terephthalate (PET) film.
- Toluene was mixed as a solvent to prepare a coating solution, and the coating solution was coated on a release-treated polyethylene terephthalate film (thickness: 75 ⁇ m) using a bar coater such that the pressure-sensitive adhesive layer became 100 ⁇ m after UV curing. Thereafter, an adhesive film was prepared by irradiating and curing ultraviolet rays for 10 minutes using a UV lamp.
- a pressure-sensitive adhesive film was prepared in the same manner as in Example 1, except that an adhesive composition including 0.05 parts by weight of n-dodecyl mercaptan as an molecular weight regulator was added to 100 parts by weight of 2-EHA (ethylhexyl acrylate). Prepared.
- An adhesive film was prepared in the same manner as in Example 2 except for changing the content ratio of the molecular weight regulator as shown in Table 1 below.
- Toluene was mixed as a solvent to prepare a coating solution, and the coating solution was coated on a release-treated polyethylene terephthalate film (thickness: 75 ⁇ m) using a bar coater such that the pressure-sensitive adhesive layer became 100 ⁇ m after UV curing. Thereafter, an adhesive film was prepared by irradiating and curing ultraviolet rays for 10 minutes using a UV lamp.
- a pressure-sensitive adhesive film was prepared in the same manner as in Comparative Example 1 except for changing the content ratio of 2-EHA (ethylhexyl acrylate) and HEA (hydroxyethyl acrylate) as shown in Table 1 below.
- step absorption capacity 10 ⁇ m to 15 ⁇ m height of the printing step is differently printed on the glass (Glass) differently attached to the adhesive film of the above Examples and Comparative Examples and then laminated another glass (Glass) of the bubble (Bubble) The incidence was measured. At this time, compared to the thickness of the pressure-sensitive adhesive film of the above Examples and Comparative Examples, the step difference absorption capacity was measured by comparing the printing step that does not generate bubbles (dl).
- Dielectric constant measurement The dielectric films were measured using an E4980 LCR meter manufactured by Agilent, by measuring the adhesive films of Examples and Comparative Examples with a size of 5 mm in diameter.
- the step absorption capacity refers to the degree to which the thickness of the ink printed on the glass glass can be filled without air (Bubble) by applying the adhesive films of Examples and Comparative Examples between the glass glass, and the higher the step absorption capacity, the insertion of air. It is possible to provide a touch panel to which an ink layer is attached well without.
- Example 2 Compared to Example 1, the case of Examples 2 to 6 further comprising a molecular weight modifier exhibited a higher step absorbing capacity, and as the content of the molecular weight modifier is increased, the step absorbing capacity is also improved. It turned out that the property of the adhesive composition for touch panels becomes smoother.
- Figure 1 shows a graph showing the storage modulus according to the temperature of Examples 5 and 6, Comparative Examples 1 and 2, it can be seen that the storage modulus of Examples 5 and 6 is higher than that of Comparative Examples 1 and 2. there was.
- the step absorbing ability was measured to be 25% and 30% higher than those of Comparative Examples 1 and 2 in proportion to the measured value of the storage modulus, and the pressure-sensitive adhesive composition for the touch panel had a high storage modulus at a high temperature. It was found that an adhesive film having excellent step absorbing ability could be provided.
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- General Engineering & Computer Science (AREA)
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- General Physics & Mathematics (AREA)
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Abstract
Description
Claims (15)
- 친수성 관능기 함유 단량체 및 점착증진제를 포함하고,100kHz 내지 2MHz 영역의 주파수에서 유전율이 3.5이하이고, 저장 모듈러스는 25℃ 내지 85℃에서 1.0X105Pa 내지 7.0X105Pa인터치패널용 점착제 조성물.
- 제 1항에 있어서,상기 친수성 관능기 함유 단량체가 수산기 함유 단량체, 아미노기 함유 단량체, 카르복실기 함유 단량체, 설폰기 함유 단량체, 모르폴린기 함유 단량체, 글리시딜기 함유 단량체 및 이들의 조합으로 이루어진 군으로부터 선택된 하나 이상인터치패널용 점착제 조성물.
- 제 1항에 있어서,상기 친수성 관능기 함유 단량체가 (메타) 아크릴산 에스테르계 단량체 100중량부에 대해서 30중량부 이하인터치패널용 점착제 조성물.
- 제 3항에 있어서,상기 (메타) 아크릴산 에스테르계 단량체 및 상기 친수성 관능기 함유 단량체의 중합체 분자량이 60만 내지 120만인터치패널용 점착제 조성물.
- 제 3항에 있어서,상기 (메타)아크릴산 에스테르계 단량체가 알킬(메타)아크릴레이트이고, 상기 알킬(메타)아크릴레이트의 알킬은 선형 또는 분지형 C1 내지 C14 알킬인터치패널용 점착제 조성물.
- 제 3항에 있어서,상기 (메타) 아크릴산 에스테르계 단량체가 메틸 (메타)아크릴레이트, 에틸 (메타)아크릴레이트, n-프로필 (메타)아크릴레이트, 이소프로필 (메타)아크릴레이트, n-부틸 (메타)아크릴레이트, t-부틸 (메타)아크릴레이트, sec-부틸 (메타)아크릴레이트, 펜틸 (메타)아크릴레이트, 2-에틸헥실 (메타)아크릴레이트, 2-에틸부틸 (메타)아크릴레이트, n-옥틸 (메타)아크릴레이트, 이소옥틸 (메타)아크릴레이트, 이소노닐 (메타)아크릴레이트, 라우릴 (메타)아크릴레이트, 테트라데실 (메타)아크릴레이트 및 이들의 조합으로 이루어진 군으로부터 선택된 하나 이상인터치패널용 점착제 조성물.
- 제 1항에 있어서,상기 점착증진제는 아민계 액상 고분자, 폴리 아민, 석유수지, 폴리부텐, 아크릴계 변성수지, 아크릴로일 모폴라인 수지 및 이들의 조합으로 이루어진 군으로부터 선택된 하나 이상인터치패널용 점착제 조성물.
- 제 1항에 있어서,분자량 조절제 더 포함하는터치패널용 점착제 조성물.
- 제 8항에 있어서,상기 분자량 조절제는 2-메르캅토아세테이트, n-도데실메르캅탄, 4-4’트리오비스벤젠트리올 및 이들의 조합으로 이루어진 군으로부터 선택된 하나 이상인터치패널용 점착제 조성물.
- 제 1항에 있어서,광개시제를 더 포함하는터치패널용 점착제 조성물.
- 제 10항에 있어서,상기 광개시제는 벤조인계 개시제, 히드록시 케톤계 개시제, 아미노 케톤계 개시제 카프로락탐 및 이들의 조합으로 이루어진 군으로부터 선택된 하나 이상인터치패널용 점착제 조성물.
- 제 1항 내지 제 11항 중 어느 한 항에 따른 터치패널용 점착제 조성물의 경화물을 포함하는 점착제층을 포함하는 점착필름.
- 제 11항에 있어서,상기 점착제층은 100kHz 내지 2MHz 영역의 주파수에서 유전율이 3.5이하이고, 저장 모듈러스는 25℃ 내지 85℃에서 1.0X105Pa 내지 7.0X105Pa인점착필름.
- 일면에 도전층이 형성된 전도성 플라스틱 필름; 및상기 도전층에 부착되고, 제 1항 내지 제 11항 중 어느 한 항에 따른 터치패널용 점착제 조성물의 경화물을 포함하는 점착제층을 포함하는터치 패널.
- 제 14항에 있어서,상기 전도성 필라스틱 필름이 ITO(도전성 금속 산화물)층이 일면에 형성된 폴리에틸렌테레프탈레이트 필름인터치 패널.
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CN201480020291.9A CN105102563B (zh) | 2013-04-05 | 2014-02-27 | 触控面板用粘结剂组合物、粘结膜及触控面板 |
JP2016506224A JP2016522273A (ja) | 2013-04-05 | 2014-02-27 | タッチパネル用粘着剤組成物、及び、粘着フィルムおよびタッチパネル |
EP14780018.9A EP2982724A4 (en) | 2013-04-05 | 2014-02-27 | ADHESIVE COMPOSITION FOR TOUCH SCREEN, ADHESIVE FILM, AND TOUCH SCREEN |
US14/782,330 US10144854B2 (en) | 2013-04-05 | 2014-02-27 | Adhesive composition for touch panel, adhesive film and touch panel |
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KR101775187B1 (ko) * | 2013-04-05 | 2017-09-05 | 주식회사 엘지화학 | 터치패널용 점착제 조성물, 점착 필름 및 터치 패널 |
JP7469926B2 (ja) | 2020-03-24 | 2024-04-17 | 日東電工株式会社 | 粘着シート |
US11725846B2 (en) | 2021-03-31 | 2023-08-15 | Trane International Inc. | Sound attenuation for HVAC devices |
CN115290597B (zh) * | 2022-10-08 | 2023-03-17 | 首都师范大学 | 基于太赫兹技术的涂层紧贴型无黏结缺陷检测方法及系统 |
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EP2982724A4 (en) | 2016-03-09 |
US10144854B2 (en) | 2018-12-04 |
JP2018188672A (ja) | 2018-11-29 |
US20160108294A1 (en) | 2016-04-21 |
KR101775187B1 (ko) | 2017-09-05 |
JP2016522273A (ja) | 2016-07-28 |
CN105102563B (zh) | 2017-10-10 |
TW201439274A (zh) | 2014-10-16 |
CN105102563A (zh) | 2015-11-25 |
EP2982724A1 (en) | 2016-02-10 |
TWI564365B (zh) | 2017-01-01 |
KR20140121922A (ko) | 2014-10-17 |
JP2020125495A (ja) | 2020-08-20 |
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