WO2014161667A1

WO2014161667A1 - Method for producing a security element with negative inscription

Info

Publication number: WO2014161667A1
Application number: PCT/EP2014/000889
Authority: WO
Inventors: Winfried HOFFMÜLLER; Michael Rahm; Andreas Rauch; Theodor Burchard
Original assignee: Giesecke & Devrient Gmbh
Priority date: 2013-04-05
Filing date: 2014-04-03
Publication date: 2014-10-09
Also published as: CN105263719B; CN105263719A; EP2981419A1; DE102013005937A1; EP2981419B1

Abstract

The invention relates to a method for producing a security element (1) with negative inscription (3), comprising the following steps: a) producing a first security element sub-element (10) by providing a first carrier substrate (11), applying a first functional layer (12) to the first carrier substrate (11), applying a resistance layer (30) to the first functional layer (12) in the form of a pre-determined pattern (7) with resistance areas (33) and recesses (34) between the resistance areas; b) producing a second security element sub-element (20) by providing a second carrier substrate (21), applying a second functional layer (22) to the first second substrate (21); c) assembling the first (10) and the second (20) security element sub-element to form a composite (5) such that the resistance layer (30) and the second functional layer (22) face each other, and adhering the first (10) and the second (20) security element sub-elements together; d) separating the second carrier substrate (21) from the adhered composite (5), said second functional layer (22) remaining adhered to the resistance layer (33) due to the formation of the second functional layer (23), whilst the remaining areas of the second functional layer (22) are separated together with the second carrier substrate (21), second recesses (24) being formed in the second functional layer (22). and e) removing the area of the first functional layer (12) not protected by the resistance area (33) by means of etching in order to form first functional areas (13) and first recesses (14), which form together with the recesses (34) in the resistance layer (30) and the second recesses (24) in the second functional layer (22) made of a material which is resistance to etching, the negative inscription (3).

Description

Method for producing a security element with negative writing

The invention relates to a method for producing a

Security elements with two mutually-matched motif layers, in particular motif layers having visible in transmitted light and preferably in incident light characters, a security element obtainable by the method, the trained as a transfer element security element, equipped with the security item valuables and a method for producing such a valuables.

Valuables, in particular value documents such as banknotes, shares, identity cards, credit cards, certificates, checks and others

For counterfeit-endangered papers, such as identity documents of various kinds, but also branded goods and packaging of branded goods are like to be equipped with security elements for security, which allow verification of their authenticity and at the same time serve as protection against unauthorized reproduction. The security elements can

For example, have the form of security threads or stickers or any other in a valuables or security paper can be introduced or applied form, wherein a "valuable asset" in the context of the present invention, any security against counterfeiting object, especially a value document, while a

"Security paper" the precursor to a

Represents value document.

Security elements are typically multilayer elements with multiple functional layers. Functional layers are generally layers that have any properties that can be detected visually or by machine. Functional layers therefore contain, for example, dyes, luminescent substances, thermochromic substances, Liquid crystals, interference pigments, electrically conductive substances,

magnetic substances, light-diffractive or refractive structures or combinations thereof. The functional layers are usually designed as geometric or figurative patterns or motifs, d. H. there are functional areas with the detectable property within one shift

(For example, luminescence) and recesses in between. If a plurality of functional layers are arranged one above the other, it is generally desirable for the functional areas and the recesses in the individual functional layers to be exactly in register, that is to say in the individual functional layers. H. with high

Register accuracy, and with sharp contours between the edges

Functional areas and the recesses are formed one above the other. In this way, one functional layer can be hidden under another, for example magnetic substances under a colored layer, or security elements with a plurality of functional layers can be hidden

Negative writing.

Negative-type security elements comprise a transparent substrate having at least one non-transparent coating having recesses (the negative writing). These recesses may have any shapes, such as letters, numbers or patterns of any kind, especially line patterns. The term "negative writing" used in this application accordingly comprises recesses of any shape, that is to say any non-fullness in a non-transparent coating

more transparent, d. H. the more translucent the carrier substrate is, the more pronounced is the contrast between coated and not

coated areas. For very transparent substrates is the

Negative writing clearly visible in reflected light, with less transparent substrates only in transmitted light. Has such a security element with negative writing two different functional layers, for example a motive in the form of a gold-colored metallic coating and the same motif as a red printing ink on it, this motif appears to the viewer in a golden color from one side, red from the other side.

Such multilayer motifs are difficult to imitate due to the required high registration accuracy. Especially motives with

Negative fonts provide a good protection against counterfeiting, since in the transmitted light inaccuracies in the production are particularly easily recognizable, and "primitive" counterfeiting attempts, such as copying with color copiers, even for the untrained eye are immediately recognizable.

The tamper-proof is the higher the finer the structures in the functional layers are with the matched-to-each other motifs. Finest structures contour sharp and in perfect register with each other

However, training also provides for authorized manufacturers

A number of methods are known which are intended to enable recesses in a plurality of superimposed functional layers with register accuracy, ie. H. congruent in all layers, train.

From WO 92/11142 it is known to produce negative writings in functional layers by means of heat-activatable printing inks. The printing inks are printed in the form of the desired negative writing under the functional layers and contain waxes or intumescent additives which soften when heated or split off a gas and thereby produce foam structures. As a result, the adhesion in the areas which can be printed with the activatable ink is reduced, and the functional layers can be removed mechanically in these areas. DE 10 2007 055 112 discloses a method for register-containing, ie

Congruent training a negative font in several

Functional layers with the help of one in the form of the trainees

Negative type printed under the functional layers ink containing a component which causes a process on irradiation or heating or in contact with a washing liquid, which causes the part of the ink on the overlying coating a force is applied, which break the coating leaves. This force can be exerted by a gas generated from constituents of the printing ink when they come into contact with washing liquid, irradiated and / or heated, or by a swelling agent in the printing ink, which swells upon contact with a washing liquid. Once the multilayer coating is broken, it is for one

Wash with washing liquid relatively easily accessible.

The methods mentioned work satisfactorily, as long as no very fine structures are to be formed. A method for providing congruent patterns or motifs with high contour sharpness and register accuracy is described in WO 2010/015384 A2. Of the

The basic idea is to use a stickable resist layer in order to form congruent patterns in two functional layers. For this purpose, a resist layer in the form of the desired pattern is applied to a first functional layer. The pattern will be in the first

Functional layer reproduced exactly by the not protected by the resist areas of the first functional layer are removed.

Subsequently, the pattern in the second functional layer

reproduced by the second functional layer is glued to the resist. The bonding takes place only in the areas where the second Functional layer has contact with the resist. The non-bonded areas of the second functional layer are then removed, while the bonded areas can not be removed, whereby in the second

Functional layer an exact reproduction of the pattern of the resist layer and the first functional layer is formed.

The process described in WO 2010/015384 A2 is associated with difficulties in that the thermoplastic used

Resist varnishes must be tack free at room temperature. Since the step of adhering the functional layers by means of the resist can not be closely related to the pressure of the thermoplastic resist, the possibility of using crosslinking adhesive systems is considerably limited. This results in a resistance of the resist to solvents. In particular, solvents which are used in the step of printing the thermoplastic resin used in each case lead to a dissolution of the polymer. This has the consequence that overprinting with corresponding solvent-containing systems, despite the transferred in the transfer step functional layer a considerable

Sources of thermoplastic resists. Furthermore, damage may possibly occur to the functional layers, e.g. Metallizations, embossed structures. In addition, one remains

permanent instability to individual solvents on the resulting composite layer exist. Proceeding from this, the object of the invention is to provide a method for the production of security elements which is improved over the above prior art and which makes it possible to form congruent patterns or motifs in two superimposed layers at least partially. The object of the present invention is in particular a

To provide security element with two motif layers with corresponding patterns or motifs, which have a high registration accuracy, the security element having an improved resistance and in terms of its production a greater process reliability.

A preferred object of the present invention is to provide a security element having two metallizations each having an embossed structure, wherein the metallizations are in the form of two motif layers with corresponding patterns having high register accuracy and improved durability and with respect to their production a bigger one

Have process reliability.

This task is accomplished by the manufacturing process, the

Security element and the transfer material having the features according to the independent claims. Further developments of the invention are the subject of the dependent claims.

Summary of the invention

1. (First aspect of the invention) Method for producing a

Negative security security elements for a security paper or a valuable article, in particular a value document, comprising the following steps: a) producing a first security element subelement al) providing a first transparent or translucent

A2) application of a first functional layer to the first carrier substrate or to a previously applied intermediate layer, a3) application of a resist layer to the first functional layer in the form of a predetermined pattern with resist areas and recesses between the resist areas, b) producing a second security element partial element b) providing a second carrier substrate, b2) applying a second functional layer to the second carrier substrate or to a previously applied intermediate layer, c) assembling the first and second security element partial elements into a composite such that the resist layer and the second functional layer face one another and adhering the first and second security element partial elements, preferably under elevated pressure and elevated temperature, d) separating the second carrier substrate from the bonded composite, the second functional layer forming a second

Functional areas adhered to the resist areas, while the remaining areas of the second functional layer are separated together with the second carrier substrate, whereby in the second functional layer second recesses are formed, and e) removing the areas of the first functional layer not protected by resist areas by means of etching to form first functional areas and first recesses therebetween, which together with the recesses in the resist layer and the second recesses in the second etch resistant material

Function layer form the negative writing.

2. (Preferred embodiment) The method according to paragraph 1, wherein the first security element subelement is produced by

Providing the first carrier substrate,

Applying a first embossing lacquer layer as an intermediate layer to the first carrier substrate,

Applying a first metallization as the first functional layer to the first embossing lacquer layer,

Embossing the first embossing lacquer layer before or after the application of the first metallization, and

Applying the resist layer to the first metallization, wherein the

Resist layer has resist areas and recesses or in it

Resist areas and recesses are formed.

3. (Preferred embodiment) Method according to paragraph 1 or 2, wherein the second security element sub-element is made by

Providing the second carrier substrate,

Applying a second embossing lacquer layer as an intermediate layer to the second carrier substrate,

Applying a second metallization as a second functional layer to the second embossing lacquer layer, Embossing the second embossing lacquer layer before or after the application of the second metallization.

4. (Preferred embodiment) The method according to any one of paragraphs 1 to 3, wherein the second functional layer made of nickel, chromium, silver or gold or of a nickel alloy, a chromium alloy, a silver alloy, a gold alloy or a resistant to etching

Aluminum alloy is formed. 5. (Preferred Embodiment) The method according to any one of paragraphs 1 to 4, wherein the first functional layer is formed of aluminum.

6. (Preferred Embodiment) Method according to one of paragraphs 1 to 5, wherein the second functional layer is formed of a magnetic properties having metallization, in particular nickel.

7. (Preferred embodiment) The method according to paragraph 6, wherein the second functional layer is a metallization of nickel and the second

Functional areas are adapted to provide a magnetic coding.

8. (Preferred embodiment) The method according to paragraph 7, wherein the second functional areas have a structure obtainable in particular by embossing, which is adapted to a high-resolution magnetic

To provide coding.

9. (Second aspect of the invention) Security element with negative writing for attachment to or at least partial introduction into a

Security paper or a valuable item, in particular a A value document obtainable by a method according to any one of paragraphs 1 to 8.

10. (Third aspect of the invention) Transfer material for transferring security elements to a security paper or a valuable article such as a value document, wherein the transfer material has a plurality of security elements according to paragraph 9 designed as transfer elements. 11. (Fourth aspect of the invention) A process for producing a

Security paper or a valuable article, such as a value document, in which a security element according to paragraph 9 is applied to or at least partially incorporated in a security paper or substrate.

Detailed description of the invention

Similar to the production method described in WO 2010/015384 A2 (hereinafter referred to as "Document D1"), an adhesive resist layer is used according to the invention to form congruent patterns in two functional layers, in particular metallizations The following steps are carried out in the method described in D1 for producing a two-sidedly matched metallization:

Step Γ: Provision of an embossing lacquer layer (reference number 15 in Fig. 2a of the Dl). Step 2: Provide an aluminum metallization (reference number 12 in Fig. 2a of the Dl). Step 3: Providing a resist layer (reference number 30 in Fig. 2a of the Dl).

Step 4: Demetallization by means of etching (see FIGS. 2a and 2b of the D1, in particular those obtained after the demetallization step

Metallization 12 in Fig. 2b).

Step 5: Produce a metal donation sheet (see Fig. 2c of the Dl).

Step 5.1: Provision of an embossing lacquer layer (reference number 25 in Fig. 2c of the Dl).

Step 5.2: Providing a non-adherent aluminum metallization (reference number 22 in Fig. 2c of the Dl). Step 6: Assemble the resist layer (Reference No. 30 in Fig. 2b of D1) with the non-adherent metallization (Reference No. 22 in Fig. 2c of D1) under increased pressure and elevated temperature to thereby form a composite (Reference No. 5 in Fig 2d the Dl) to obtain. Step 7: Step the divider winding, where the two connected

Security element sub-elements are pulled apart to provide in this way a two-sided passaged metallization (reference number 1 in Fig. 2e of the Dl). In the procedure described in document D1, the resist coating applied in step 3 must still be embossable and tacky under the influence of temperature in step 6. One of the consequences of this circumstance is that the choice of suitable adhesives is subject to considerable restrictions. In a simple way, the process sequence described in the D1 can not be changed because, for example, in a demetallization by means of etching postponed to a later step, the exposed aluminum glued onto the resist in step 6 (reference number 22 in FIG. 2d of D1 ) would be etched away.

The present invention is based on the idea of transferring metals or metal alloys other than aluminum from an embossing lacquer layer which can not be etched or demetallized under the conditions under which aluminum is demetallizable. Such a resistant metal can by the printing pattern of the resist or

Adhesive can be structured and is not damaged under process conditions by which a common aluminum metallization is removed. The advantages of the invention will be explained in more detail below with reference to a preferred embodiment in conjunction with the accompanying drawings, in the representation of a scale and proportionate reproduction has been omitted in order to increase the clarity. Show it:

1 shows a security element according to the invention in transparent

View, FIGS. 2a-2e the procedure in the production of a

Security element according to the invention, illustrated in sections through the security element of Fig. 1 along the line A-A '.

Fig. 1 shows an inventive security element 1 in a view in transmitted light. The security element 1 has at least the following layers: a transparent substrate 11, a first and a second one

Functional layer (motif layers), and a resist layer, which adheres the first and the second functional layer. The two motif layers have the same size and shape in the exemplary embodiment and only partially cover the carrier substrate 11. Of course, the motif layers can also cover the carrier substrate over the entire surface. In addition, one of the

Motif layers only partially cover the other motif layer or partially overlap with it.

In the embodiment of the invention shown in FIG

Security elements form the two motif layers a triangular pattern 7 of lines 4, wherein the lines 4 are formed from the functional areas of the functional layers (motif layers) bonded by means of resist. The lines 4 are separated by recesses 3, wherein the recesses 3 through the congruent recesses in the

Functional areas and the resist layer are formed. The lines 4 vary in their width y, which in looking through the

Security element a sub-pattern 7 'becomes perceptible, in the embodiment shown another triangle.

Of course, the functional areas do not necessarily have to be in the form of parallel lines, but can have any other shapes. Which subject a viewer perceives in front-side light view and back-elevation view depends on the particular one

Design of the functional areas of the first and the second

Functional layer from.

Fig. 2 illustrates the process flow in the manufacture of a security element according to the invention 1. Shown is a section along the line A-A 'of the security element shown in Fig. 1. The sequence of layers is merely exemplary.

FIG. 2 a shows a first security element partial element 10, consisting of a first carrier substrate 11, for example a foil

Polyethylene terephthalate (PET), an embossing lacquer layer 15 applied thereto with an impressed diffraction structure 15 'with an aluminum metallization. The aluminum metallization forms a first

Functional layer 12, on the turn, a layer 30 of resist in the form of a pattern with resist areas 33 and recesses 34th

printed in between. The diffraction structure 15 'continues in the functional layer as a diffraction structure 12'.

2 b shows a section through the second security element subelement 20 to be combined with the first security element subelement 10. The second security element subelement 20 consists of the second carrier substrate 21, the second functional layer 22 and a second security subelement 20

Embossing lacquer layer 25 in between. In the embossing lacquer layer 25 is a

Diffraction structure 25 'impressed, which continues in the second functional layer 22 as a diffraction structure 22'. The second functional layer 22 is a nickel metallization. The embossing lacquer 25 was before the application of the metallization 22 washed with an aqueous surfactant solution, so that the metallization 22 badly adheres to the embossing lacquer. FIG. 2 c shows how the first security element partial element 10 from FIG. 2 a and the second security element partial element 20 from FIG. 2 b are combined to form a composite 5.

The two sub-elements are pressed together, whereby the diffraction structure 22 'of the second functional layer 22 transmits into the resist areas 33, since the resist used is a deformable resist. By means of the resist areas 33, the first

Security element sub-element and the second security element sub-element glued together.

The compression of the two security elements sub-elements can take place in one or more stages, i. the two sub-elements are preferably at elevated temperature in a heat roller with a

(single-stage compression) or more so-called

Calender rolls pressed together (multi-stage compression), or else the two sub-elements are pressed against each other at several heating rollers, which are each equipped with one or more so-called calender rolls (multi-stage compression). The multi-stage compression can, depending on the particular embodiment, lead to a particularly strong connection of the security element sub-elements. When using multiple heat rollers can also

Temperature profiles can be realized during compression. After bonding and, if appropriate, after a certain waiting time for cooling and for stabilizing the adhesive bond, the second carrier substrate 21 and the second embossing lacquer layer 25 are peeled off, for example by a separating winding. The result is shown in Fig. 2d. Only the regions 23 of the second functional layer 22, which were in contact with resist regions 33, were bonded to the first security element partial element 10. These regions constitute the second functional regions 23, which represent an exact reproduction of the pattern of the resist regions 33. The remaining regions of the second functional layer 22 were peeled off together with the second carrier substrate 21 and the embossing lacquer layer 25.

Fig. 2e shows the layer structure after treatment with an etchant.

As a result of the etching, the regions not protected by resist areas 33 became the first formed by aluminum metallization

Function layer 12, while the resist areas 33 through

Protected areas of the first functional layer 12 were preserved and the first functional areas 13 form. The first functional regions 13 represent an exact reproduction of the pattern of the resist regions 33. In addition, the second functional regions 23 formed by nickel metallization have been preserved upon treatment with an etchant

The areas 13, 33 and 23 are each exactly congruent and form in the illustration of Fig. 1, the lines 4. The recesses 3 between the lines 4 are also exactly congruent and by the

Recesses 14 in the first functional layer 12, the recesses 34 in the resist layer 30 and the recesses 24 in the second

Functional layer 22 is formed. The lines 4 (which are formed by the first functional areas 13, the resist areas 33 and the second functional areas 23) are carriers of a diffraction structure in the embodiment shown in FIG. 2, respectively. The diffraction structures may, for example, be hologram structures, with different hologram structures preferably being present in the first functional areas 13 and the second functional areas 23. In this case, a viewer in the transmitted light view recognizes the line pattern shown in FIG. 1, in the front-side reflected light view, the side of the first carrier substrate 11 as the front side, the hologram of the first functional layer 12, and the hologram of the second one in the rear side elevational view Functional layer 22.

As a second security element sub-element, for example, a hot stamping foil can be used. In this case, at the

Separation winding only the second carrier substrate 21 are withdrawn, while the embossing lacquer layer 25 would remain on the formed security element 1. It can also serve as a protective layer. In general, the provision of a protective layer (not shown in the figure) on the second functional areas or the second functional layer is useful, in particular therefore z. For example, the diffraction structure 22 'shown in FIG. 2e or the impression of the diffraction structure 25' in the functional layer 22 are covered and thus are not accessible to counterfeiting attacks.

A particular advantage of the production method according to the invention described by way of example with reference to FIGS. 2 a to 2 e is that with regard to the method suitable for the formation of the resist layer 30

Adhesives have no restrictions. Examples of suitable adhesives are typical laminating adhesives. Adhesives are advantageously used which have good printability and good metal adhesion. It is preferred that the viscosity at room temperature after bonding be so high that an uncontrolled flow or a ^; Removal of the adhesive from one of the two functional layers or metallizations is unlikely. Both solvent-based and solvent-free adhesives can be used. The adhesives can be one-component or two-component. Furthermore, it is preferred that the adhesive used after curing is so stable that the diffraction or embossing structures transferred from the functional layers or metallizations into the resist areas no longer flow and are stable with respect to the pressures and solvents used in subsequent process steps.

The requirement for typical adhesives in the state immediately after physical drying is to be tack free at room temperature. This requirement does not apply to cross-linking adhesives. For this reason, it is particularly advantageous to use crosslinking adhesives to form the resist layer. In this way, the risk of destruction of once formed diffraction or embossed structures in

be significantly reduced subsequent process steps.

In the step of compressing the two security element partial elements, the temperature and the pressure in the laminating gap can be chosen to be significantly lower compared to the process described in document D1, which is based on thermoplastic resist.

Due to the significantly milder conditions in the laminating gap results in view of the selection of suitable substrates, a higher degree of freedom. In addition, the milder conditions in the laminating gap lead to an improved impression quality of the functional layers or Metallizations in the resist areas transmitted diffraction or

Surface textures.

To carry out the production method according to the invention, the physical properties of the first functional ^layer and of the second functional layer are coordinated so that the second functional layer is not damaged in the step of removing the first functional layer, for example by means of etching

Functional layer is advantageously an aluminum metallization. to

Formation of the second functional layer are suitable e.g. Metallizations of nickel, chromium, silver or gold or metallizations of a nickel alloy, a chromium alloy, a silver alloy, a gold alloy or an etching resistant aluminum alloy. In the choice of nickel as a metallization includes after the

process according to the invention additionally magnetic properties, so that in the product, a magnetic coding

can be provided. Therefore, the choice of a nickel metallization to form the second functional layer is particularly preferred. Due to the diffraction or embossing structure of the nickel metallization, such a functional layer can in particular provide a high-resolution magnetic coding. If this is shown in FIG. 2e

Security elements applied to a value-document substrate in such a way that the nickel-formed functional areas 23 of the

Substrate-substrate are facing and the functional areas formed of aluminum 13 facing the viewer of the value document, the responsible for the magnetic coding, formed of nickel functional areas 23 are hidden for the viewer when viewing the value document in incident light. In a further advantageous variant of that shown in FIG. 2e

Security elements are the functional areas 23 formed from an etch resistant aluminum alloy and the

Functional areas 13 formed of aluminum. In this way, when viewing the security element in both front-side reflected light, as well as in the rear reflected light, the impression of an identical metallic color can be ensured. In a further advantageous variant of that shown in FIG. 2e

Security elements are the functional areas 23 formed of copper or gold and the functional areas 13 formed of aluminum. In this way, when viewing the security element in front incident light on the one hand and in the rear reflected light on the other

different colored impressions are caused.

The carrier substrate of the security element partial elements which can be used according to the invention is preferably a film, for example made of polypropylene, polyethylene, polystyrene, polyester, in particular polycarbonate or

Polyethylene terephthalate. Transparent or translucent films are particularly preferred. When using such films, the registration formed recesses in the individual

Functional layers are clearly recognized as negative writing. The application of the functional layers is carried out by known methods that are suitable for the respective functional layer, for example by physical vapor deposition (PVD) in metals. The application can be made over the entire area or only in partial areas. The functional layer can be formed directly on the carrier substrate, or one or more intermediate layers can be provided. For some functional layers intermediate layers are absolutely necessary, for example if the motif of the

Functional layer is a metallized hologram, Kinegram, Pixelgram or other metallized diffraction structure. In such a case, first an embossing lacquer layer is applied and in the

Embossing lacquer layer, before or after the metallization, embossed the desired diffractive structure. In the case of liquid-crystal layers as well, an intermediate layer is generally required which ensures a suitable orientation of the liquid crystals. Suitable orientation layers can be, for example, embossed lacquer layers embossed diffractive structures. Alternatively, if appropriate, the carrier film can also be suitably treated.

It is preferred that at least one of the functional layers is a metallized diffraction structure, such as a metallized hologram.

Particularly preferably, both functional layers are metallized

Diffraction structures, e.g. metallized holograms. When in the

It will be understood that the same applies to other diffraction structures and refractive structures as well as so-called "matt structures" (grating images with achromatic grating regions), as defined and described, for example, in WO 2007/107235 A1 (see in particular claim 1).

In principle, the holograms or structural information in the functional layers of a security element according to the invention can be the same or different. Materials for embossing lacquer layers are one

Specialist known. Suitable embossing lacquers are disclosed in, for example DE 10 2004 035 979 AI, which discloses heat-sealing lacquers which can likewise be used as embossing lacquer

The resist is preferably applied in the form of the desired pattern, for example printed. The skilled person is suitable for this

Printing method known.

In the step of removing the non-resist protected areas of the first functional layer by means of etching, for example, by etchant, such as alkalis or acids, take place. Suitable methods are known to the person skilled in the art.

The negative writing, for example, a coding or a

form geometric or figurative motif.

In the step of separating the second carrier substrate from the bonded composite, e.g. by separation winding, the carrier substrate of the second security element subelement is separated together with parts of the functional layer of the second security element subelement. Therefore, it is necessary that the functional layer has only a slight adhesion to the carrier substrate.

The required low adhesive force is in many

Functional layer materials, in particular metallization, achieved solely by the fact that adhesion-promoting measures between

Carrier substrate and functional layer is omitted. The meeting

Prosecution measures between the individual layers of a security element is otherwise customary, and the corresponding

Arrangements known to a person skilled in the art. If the adhesive force between the carrier substrate and the functional layer is too high, it can be reduced by treating the carrier substrate with suitable additives. For example, the carrier substrate can be washed off with water and / or solvents with or without suitable additives. Suitable additives are, for example, surface-active substances, defoamers or thickeners. Additives can also be introduced into the carrier substrate itself. Alternatively, adhesion-reducing layers can be provided with ^• the functional layer. For the adhesion-reducing layers, materials are selected on the surfaces of which, as is generally known, a relatively poor adhesion occurs, for example siliconizations, layers containing release additives (eg Byk 3500), waxes, cured UV lacquers, metallizations, untreated foils such as e.g. Eg PET. By vote of

Surface energy ratios of the carrier substrate or the

adhesion-reducing layer and the functional layer to be detached, an easy detachability of the functional layer can be achieved and thus the desired pattern can be produced in the functional layer of the second security element partial element.

The same applies to any intermediate layers present between the carrier substrate and the functional layer, for example

Embossing lacquer layers for a hologram. If such an embossing lacquer layer or other intermediate layer together with the carrier substrate

must be deducted accordingly the adhesion between the

Intermediate layer and the functional layer, so for example between the embossing lacquer layer and a metallization applied thereto, be low. If the adhesive force is too high, the intermediate layer should be treated with the above-mentioned additives or an adhesion-reducing layer should be provided. If a treatment of the carrier substrate or an intermediate layer with adhesion-reducing additives is carried out, residues of the additives can remain on the functional layer after the carrier substrate or the intermediate layer has been separated off. These can normally be washed away simply with an aqueous solution whose pH is suitably adjusted and which may optionally also contain surfactants. Even a laundry with solvents is possible. In stubborn cases can also be with

High pressure nozzles and / or mechanical support (felts, brushes), but this is usually not necessary. Small additive residues can also be "burned away" by means of a corona treatment. Moreover, in many cases can be completely dispensed with a removal of additive residues. Suitable formulated conformal coatings can also adhere adequately to "additive-loaded" functional layers.

The security elements according to the invention can be in the form of

Transfer materials, d. H. Films or tapes with a variety of finished and prepared for transfer security elements,

to be provided. In the case of a transfer material, the layer structure of the later security element is prepared on a carrier material in the reverse order in which the layer structure is later to be stored on a valuable object, wherein the layer structure of the security element in continuous form or already in the final outline form used as security element on the Carrier material can be prepared. The transfer of the security element on the object of value to be secured by means of an adhesive layer, which is typically provided on the transfer material, but can also be provided on the object of value. Preferably, a hot melt adhesive is used for this purpose. Will the security element be in endless form prepared, may be provided for transmission either only in the areas to be transmitted of the security element, an adhesive layer, or the adhesive is activated only in the areas to be transferred. The carrier material of the transfer elements is usually deducted from the layer structure of the security elements during or after their transfer to the valuable article. To facilitate the detachment, between the carrier material and the part to be detached

Security elements a release layer (release layer) are provided. Optionally, the carrier material can also be transferred to the

Security element remain.

The security elements according to the invention can be used to authenticate goods of any kind. Preferably, they are used to authenticate value documents, for example banknotes, checks or identity cards. They can do it on one

Surface of the value document are arranged or embedded in whole or in part in the value document. With particular advantage they are used in value documents hole hole hole. In this case, the advantages of the security elements according to the invention with transparent carrier substrates and from both sides of the value document to be considered, carefully matched motifs, can be particularly beautiful. Even negative fonts with the finest structures and sub-patterns can be clearly recognized in transmitted light. You are in the achievable according to the invention precision of a counterfeiter practically imitated. Also, a detachment of the security elements in order to transfer them to another valuable article, is practically not possible, because the security elements according to the invention always contain at least two adhesive layers, ie they contain an adhesive resist layer and are provided with an adhesive layer with the valuable object to be secured connected. If, for the bonding of the security element to the object of value, an adhesive which is similar in terms of its chemical and physical properties to the resist in the layer structure of the security element is used in stripping attempts

Layer structure of the security element destroyed.

Claims

Patent claims

1. A method for producing a security element (1) with negative writing (3) for a security paper or a valuable item, in particular a value document, comprising the following steps: a) producing a first security element partial element (10) by al) providing a first transparent or translucent

Carrier substrate (11), a2) applying a first functional layer (12) on the first carrier substrate (11) or on a previously applied intermediate layer (15), a3) applying a resist layer (30) on the first functional layer (12) in the form of a predetermined Pattern (7) with resist areas (33) and

Recesses (34) between the resist areas, b) producing a second security element partial element (20) by bl) providing a second carrier substrate (21), b2) applying a second functional layer (22) to the second

Carrier substrate (21) or on a previously applied intermediate layer (25), c) assembling the first (10) and the second (20) security element subelement into a composite (5) such that the resist layer (30) and the second functional layer ( 22) face each other, and bonding the d) separating the second carrier substrate (21) from the bonded composite (5), wherein the second functional layer (22) forms a second

Functional areas (23) adheres to the resist areas (33), while the remaining areas of the second functional layer (22) are separated together with the second carrier substrate (21), whereby in the second functional layer (22) second recesses (24) are formed, and e) removing areas of the first functional layer (12) not protected by resist areas (33) by etching to form first functional areas (13) and first recesses (14) therebetween, which together with the recesses (34) in the resist layer (14). 30) and the second recesses (24) in the second, of a resistant to etching material functional layer (22) form the negative writing (3).

2. The method of claim 1, wherein the first security element partial element (10) is produced by

Providing the first carrier substrate (11),

Applying a first embossing lacquer layer (15) as an intermediate layer to the first carrier substrate (11),

Applying a first metallization (12) as a first functional layer to the first embossing lacquer layer (15),

Embossing the first embossing lacquer layer (15) before or after the application of the first metallization (15), and

- Applying the resist layer (30) on the first metallization (12), wherein the resist layer resist areas (33) and recesses (34) or in their resist areas (33) and recesses (34) are formed.

3. The method of claim 1 or 2, wherein the second security element partial element (20) is made by

Providing the second carrier substrate (21),

Applying a second embossing lacquer layer (25) as an intermediate layer to the second carrier substrate (21),

- Applying a second metallization (22) as a second functional layer on the second embossing lacquer layer (25),

- Embossing of the second embossing lacquer layer (25) before or after the application of the second metallization (22).

4. The method according to any one of claims 1 to 3, wherein the second

Functional layer (22) made of nickel, chromium, silver or gold or of a nickel alloy, a chromium alloy, a silver alloy, a gold alloy or an etching resistant aluminum alloy is formed.

5. The method according to any one of claims 1 to 4, wherein the first

Functional layer (12) is formed of aluminum.

6. The method according to any one of claims 1 to 5, wherein the second

Functional layer (22) of a magnetic properties having metallization, in particular nickel, is formed.

The method of claim 6, wherein the second functional layer (22) is a metallization of nickel and the second functional regions (23) are adapted to provide magnetic encoding.

8. The method according to claim 7, wherein the second functional areas (23) have a structure obtainable in particular by embossing, which is adapted to a high-resolution magnetic coding

provide.

9. security element (1) with negative writing (3) for attachment to or at least partial introduction into a security paper or a valuable item, in particular a value document that after a

Method according to one of claims 1 to 8 obtainable.

10. Transfer material for transferring security elements to a security paper or a valuable article such as a value document, wherein the transfer material has a plurality of security elements (1) designed as transfer elements according to claim 9.

11. A process for producing a security paper or a

A valuable article, such as a value document, in which a security element (1) according to claim 9 is applied to a security paper or valuable object substrate or at least partially introduced therein.