WO2014155841A1 - Method for manufacturing resistor, and resistor - Google Patents
Method for manufacturing resistor, and resistor Download PDFInfo
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- WO2014155841A1 WO2014155841A1 PCT/JP2013/082669 JP2013082669W WO2014155841A1 WO 2014155841 A1 WO2014155841 A1 WO 2014155841A1 JP 2013082669 W JP2013082669 W JP 2013082669W WO 2014155841 A1 WO2014155841 A1 WO 2014155841A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
- H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
Definitions
- the present invention relates to a chip resistor manufacturing technique using a metal plate.
- the chip resistor is composed of a resistor made of a noble metal alloy or a metal alloy, a highly conductive electrode, and a molten solder material. The resistor and the electrode are firmly bonded, and the resistor is used for resistance adjustment.
- a structure having no notch is known (see Patent Document 1 below).
- an electrode is formed on one surface of a plate-shaped resistance material, and after being mechanically cut into a strip shape or a comb shape, an electrode coating material is formed by plating. An electrode coating material can also be formed on the cut end face.
- the present invention aims to reduce the influence of damage to the surface to be plated.
- a chip resistor is a laminated material composed of a first metal material and a second metal material, wherein a resistor is formed by the first metal material and a pair of electrodes are formed by the second metal material.
- Preparing a laminated material having a region where a plurality of vessels can be formed, extending in a first direction within the plane of the laminated material, and forming a slit penetrating the laminated material; and the second metal material side Forming a first mask adjacent to the slit and extending in the first direction on the surface of the substrate, and plating an electrode coating material on the laminated material on which the first mask is formed, whereby the electrode A step of covering a surface of the second metal material opposite to the first metal material and an inner surface of the slit with a coating material; removing the first mask; and selectively removing the second metal material And exposing the first metal material to the first material
- Method of manufacturing a chip resistor characterized in that it comprises a step, a of
- a slit having a cross section is formed in the laminated material in advance at a position that will later become the side surface of the electrode, and the electrode coating material is plated using the first mask for electrode formation so that the first electrode coating material is used. Since the lower surface of the two metal materials opposite to the first metal material and the inner surface of the slit are coated, the step of forming the electrode coating agent on the side surface after forming the side surface by shearing or the like The degree of freedom is improved. Further, since so-called soft etching such as wet etching can be selected as the step of forming the side surface covered with the electrode coating material, damage between the electrode coating material and the side surface can be reduced.
- each resistor can be separated in the second direction by the slit by cutting at a position intersecting the slit.
- the step of forming the first mask corresponds to a distance between the electrodes when the first mask is formed so that the width in the second direction separates the second metal material to form an electrode. It is a step of forming a distance between an end of the first mask on the second direction side and an end of the adjacent slit at a position corresponding to the electrode width.
- the distance between electrodes and electrode width can be determined by photolithography or the like, the dimensional accuracy of the resistor is improved.
- a second mask having a first opening extending in a first direction in the plane of the first metal material is formed, and in the plane of the second metal material.
- the opening diameters of the slits can be made substantially the same, for example.
- a laminated material composed of a first metal material and a second metal material, wherein a resistor is formed by the first metal material, and a pair of electrodes is formed by the second metal material.
- a plurality of slits adjacent to each other in the second direction orthogonal to the first direction that has not reached and one between the two adjacent slits are arranged in the first direction on the second metal material side
- An opening that extends to expose a surface of the first metal material and separate the second metal material along the first direction to form a pair of electrodes, and the first of the pair of electrodes
- FIGS. 1A and 1B are diagrams showing a configuration example of the chip resistor according to the present embodiment.
- FIG. 2 is a diagram showing a cross-sectional structure of FIG. It is a perspective view which shows the principal part of the manufacturing process of a resistor. It is a perspective view which shows the principal part of the manufacturing process of a resistor.
- 4 is a cross-sectional view of the main part in FIGS. 3A and 3B. It is a flowchart figure which shows the example of a manufacturing process. It is sectional drawing of the resistor by this Embodiment.
- FIGS. 1A and 1B are diagrams showing a configuration example of the chip resistor according to the present embodiment.
- FIG. 2A is a diagram showing the cross-sectional structure.
- the chip resistor A according to the present embodiment is formed on a resistor plate 111 such as a Ni—Cr system and one surface thereof (resistor lower surface 111b opposite to the resistor upper surface 111a) at a certain distance, For example, it has two electrodes 113 made of Cu, and the resistor lower surface 111b is exposed in a region between the electrodes 113 on one surface.
- a protective film may be formed on the exposed surface.
- FIG. 2B is a diagram showing a configuration in which the chip resistor A shown in FIGS. 1 and 2A is arranged on the wiring 150 formed on the surface of the substrate 160.
- the electrode 113 of the resistor A is electrically connected and fixed to the wiring 150 by a solder (Sn) fillet 140.
- the electrode 113 is exposed on the inner side surface 113 c of the electrode 113.
- FIGS. 3A and 3B are perspective views
- FIG. 4 is a cross-sectional view of the main part in FIGS. 3A and B
- FIG. 5 is an example of the manufacturing process.
- a flat laminated material 110 with an electrode plate (layer) 113 made of a material is prepared (step S1).
- a slit 201 that penetrates in the thickness direction and extends in one direction (first direction) in the surface is formed in the laminated material 110 (step S2). ). Therefore, a resist pattern A1 having an opening in the width of the slit 201 is formed on one surface of the electrode material 113 side, and a resist pattern A2 having an opening in the same region is formed on the other surface.
- a plurality of slits 201 are provided at intervals in a second direction orthogonal to the first direction. Note that the slit width and interval may be changed depending on the position to form resistors having different widths. In short, the width of the resistor is determined by the spacing between the slits.
- the resistor plate 111 and the electrode plate 113 are etched using the resist patterns A1 and A2. Etching may be either wet etching or dry etching, and may be punched out by pressing or the like.
- Etching may be either wet etching or dry etching, and may be punched out by pressing or the like.
- a slit 201 penetrating the resistor plate 111 and the electrode plate 113 is formed. ((C) of FIG. 3A).
- One position of the slit is located on the side surface 113b and the resistor end surface 111d of the electrode 113 shown in FIGS.
- the slit 201 is not formed up to the end surface of the laminated material 110 in the first direction.
- photoresists B1 and B2 are respectively applied to both surfaces of the laminated material 110 in which the slits 201 are formed.
- a resist pattern B2-1 extending in the same direction as the slit 201 is formed on one surface of the electrode material of the laminated material 110 on the plate 113 side.
- the width of the resist pattern B2-1 corresponds to the distance between adjacent electrodes when the electrodes 113 are formed by separating the electrode material plate 113, and the end of the slit 201 adjacent to the end of the resist pattern B2-1. Is formed at a position corresponding to the electrode width. Therefore, the interelectrode distance and the electrode width can be defined at this stage.
- the photoresist B1 is left on the entire surface of the resistance material of the laminated material 110 on the plate 111 side.
- an electrode coating material 131 is formed by electrolytic plating of Sn or the like (FIG. 3A (f)). As shown in FIG. 4 (3), the side surfaces of the resistor plate 111 and the electrode plate 113 are covered with the electrode coating material 131 (step S3).
- the resist patterns B2-1 and B1 are removed.
- B1 may be left.
- the surface of the electrode material 113 is exposed in the region 141 from which the resist pattern B2-1 has been removed (step S4).
- step S5 Cu is selectively etched with respect to Ni—Cr using, for example, an aqueous solution of ferric chloride.
- step S5 the resistor plate 111 is exposed in the region 141 where the resist pattern B2-1 is removed, and the electrode 131 is separated.
- the laminated material 110 is cut by dicing, shearing, or the like in a direction perpendicular to the extending direction of the slit 201 at a position in the slit 201 near the end of the slit 201. (Step S6).
- the laminated material 110 is cut into pieces by dicing, shearing, or the like in a direction orthogonal to the extending direction of the slit 201. Thereby, as shown to (6) of FIG. 4, the structure similar to FIG. 1 can be formed.
- the slit 201 having a cross section is formed in the laminated material 110 in advance at a position to be the side surface of the electrode 113 in advance, and after the electrode material 113 is formed, the side surface is sheared or the like.
- the degree of freedom of the process is improved, and so-called soft etching such as wet etching can be selected.
- the distance between the electrodes and the electrode width can be determined by photolithography, the dimensional accuracy of the resistor is improved.
- the resist opening width O2 ′ on the resistor plate 111 side is made narrower than the resist opening width O1 on the electrode plate 113 side by considering the difference in etching rate (O1>).
- O2 ′ as shown in FIG. 6B, the openings on the electrode coating material 131 and the electrode material plate 113 side can have the same width (see L1). Since the end surface L1 of the laminated material 110 is tapered by wet etching, there is an advantage that the adhesion area of the solder fillet 140 is increased, and the anchor effect and the fixing force are improved.
- the present invention can be used in a method for manufacturing a resistor.
- a ... chip resistor, 110 ... laminated material, 111 ... resistor plate, 113 ... electrode material plate, 131 ... electrode coating material, 140 ... solder fillet, 150 ... wiring, 160 ... substrate, 201 ... slit.
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Abstract
This method for manufacturing a chip resistor is characterized in having: a step for preparing a layered material comprising a first metal material and a second metal material and having a region capable of being provided with a plurality of chip resistors having a resistor body formed using the first metal material and a pair of electrodes formed using the second metal material, and forming a slit extending in a first direction in the plane of the layered material and penetrating the layered material; a step for forming a first mask, which is adjacent to the slit and which extends in the first direction, on the surface on the second metal material side; a step for plating the layered material having the first mask formed thereon with an electrode coating material and thereby using the electrode coating material to coat the lower surface of the second metal material on the opposite side from the first metal material and the inner-surface outside end face of the slit; a step for removing the first mask, selectively removing the second metal material, and exposing the first metal material; and a step for cutting the layered material in a second direction orthogonal to the first direction.
Description
本発明は、金属板を使用したチップ抵抗器の製造技術に関する。
The present invention relates to a chip resistor manufacturing technique using a metal plate.
電流の検出用にミリオーム程度の極めて抵抗値が小さいチップ抵抗器（シャント抵抗器）を用いることは良く知られている。チップ抵抗器は、貴金属合金あるいは金属合金から作製される抵抗体および高伝導性の電極および溶融はんだ材から構成され、抵抗体と電極は強固に接合されており、抵抗体には抵抗調整用の切り込みがない構造が知られている（下記特許文献１参照）。
It is well known to use a chip resistor (shunt resistor) with a very small resistance value of about milliohm for current detection. The chip resistor is composed of a resistor made of a noble metal alloy or a metal alloy, a highly conductive electrode, and a molten solder material. The resistor and the electrode are firmly bonded, and the resistor is used for resistance adjustment. A structure having no notch is known (see Patent Document 1 below).
下記特許文献２には、金属板製抵抗体における片面に左右一対の端子電極を設けて成るチップ抵抗器において、チップ抵抗器における両端子電極の下面と、抵抗体における左右両端面との両方にわたって半田メッキ層を形成することが開示されている。これにより、半田付け強度の向上を図ることができる。
In the following Patent Document 2, in a chip resistor in which a pair of left and right terminal electrodes are provided on one surface of a metal plate resistor, both the lower surface of both terminal electrodes of the chip resistor and both left and right end surfaces of the resistor are covered. Forming a solder plating layer is disclosed. Thereby, improvement of soldering strength can be aimed at.
上記特許文献２に記載されている技術では、板状の抵抗材の一面に電極を形成し、短冊状又は櫛状に機械的に切断した後に、電極コート材をメッキにより形成し、電極上とともに切り出した端面にも電極コート材を形成することができる。
In the technique described in Patent Document 2, an electrode is formed on one surface of a plate-shaped resistance material, and after being mechanically cut into a strip shape or a comb shape, an electrode coating material is formed by plating. An electrode coating material can also be formed on the cut end face.
しかしながら、この方法によると、機械的な切断時における被メッキ面へのダメージの影響が残りやすいという問題があった。
However, according to this method, there is a problem that the influence of damage to the surface to be plated at the time of mechanical cutting tends to remain.
本発明は、被メッキ面へのダメージの影響を低減することを目的とする。
The present invention aims to reduce the influence of damage to the surface to be plated.
本発明の一観点によれば、第１金属材と第２金属材からなる積層材であって、前記第１金属材により抵抗体を、前記第２金属材により一対の電極を形成したチップ抵抗器を複数形成可能な領域を有する積層材を準備し、前記積層材の面内の第１の方向に延在し、前記積層材を貫通するスリットを形成する工程と、前記第２金属材側の表面に前記スリットに隣接し前記第１の方向に延在する第１のマスクを形成する工程と、前記第１のマスクが形成された積層材に電極コート材をメッキすることで、前記電極コート材により前記第２金属材の前記第１金属材とは反対側の面と前記スリットの内面とを被覆する工程と、前記第１のマスクを除去し、第２金属材を選択的に除去し、前記第１金属材を露出させる工程と、前記積層材を前記第１の方向と直交する第２の方向に切断する工程と、を有することを特徴とするチップ抵抗器の製造方法が提供される。
According to one aspect of the present invention, a chip resistor is a laminated material composed of a first metal material and a second metal material, wherein a resistor is formed by the first metal material and a pair of electrodes are formed by the second metal material. Preparing a laminated material having a region where a plurality of vessels can be formed, extending in a first direction within the plane of the laminated material, and forming a slit penetrating the laminated material; and the second metal material side Forming a first mask adjacent to the slit and extending in the first direction on the surface of the substrate, and plating an electrode coating material on the laminated material on which the first mask is formed, whereby the electrode A step of covering a surface of the second metal material opposite to the first metal material and an inner surface of the slit with a coating material; removing the first mask; and selectively removing the second metal material And exposing the first metal material to the first material Method of manufacturing a chip resistor, characterized in that it comprises a step, a of cutting in a second direction perpendicular is provided with.
積層材に予め、後に電極の側面となる位置に断面を有するスリットを形成しておき、電極形成用の第１のマスクを利用して電極コート材をメッキすることで前記電極コート材により前記第２金属材の前記第１金属材とは反対側の下面と前記スリットの内面とを被覆されるため、せん断などにより側面を形成した後に側面に電極コート剤を形成する場合に比べて、工程の自由度が向上する。また、電極コート材により被覆する側面を形成する工程としてウェットエッチングなどのいわゆるソフトエッチングを選択することができるため、電極コート材と側面との間のダメージを低減することができる。前記積層材を前記第１の方向と直交する第２の方向に切断する際に、前記スリットと交差する位置で切ることで、スリットにより各抵抗器を第２の方向において分離することができる。
A slit having a cross section is formed in the laminated material in advance at a position that will later become the side surface of the electrode, and the electrode coating material is plated using the first mask for electrode formation so that the first electrode coating material is used. Since the lower surface of the two metal materials opposite to the first metal material and the inner surface of the slit are coated, the step of forming the electrode coating agent on the side surface after forming the side surface by shearing or the like The degree of freedom is improved. Further, since so-called soft etching such as wet etching can be selected as the step of forming the side surface covered with the electrode coating material, damage between the electrode coating material and the side surface can be reduced. When the laminated material is cut in a second direction orthogonal to the first direction, each resistor can be separated in the second direction by the slit by cutting at a position intersecting the slit.
前記第１のマスクを形成する工程は、前記第１のマスクを、前記第２の方向の幅が前記第２金属材を分離して電極を形成した場合における電極間距離に対応し、前記第１のマスクの前記第２の方向側の端部と隣接する前記スリットの端部との間の距離が電極幅に対応する位置に形成する工程であることを特徴とする。
The step of forming the first mask corresponds to a distance between the electrodes when the first mask is formed so that the width in the second direction separates the second metal material to form an electrode. It is a step of forming a distance between an end of the first mask on the second direction side and an end of the adjacent slit at a position corresponding to the electrode width.
電極間の距離や電極幅を、フォトリソグラフィー等により決めることができるため、抵抗体の寸法精度が良くなる。
Since the distance between electrodes and electrode width can be determined by photolithography or the like, the dimensional accuracy of the resistor is improved.
前記スリットを形成する工程において、前記第１の金属材の面内の第１の方向に延在する第１の開口を有する第２のマスクを形成し、前記第２の金属材の面内の第１の方向に延在する第２の開口を有し、前記第２のマスクと対応する位置に第３のレジストマスクを形成し、前記第１の金属材と前記第２の金属材とのエッチング速度を考慮して前記第１の開口の幅と前記第２の開口の幅とが略等しくなるように前記第１の開口幅と前記第２の開口幅とを調整しておくことを特徴とする。
In the step of forming the slit, a second mask having a first opening extending in a first direction in the plane of the first metal material is formed, and in the plane of the second metal material. A second opening extending in a first direction, a third resist mask is formed at a position corresponding to the second mask, and the first metal material and the second metal material The first opening width and the second opening width are adjusted so that the width of the first opening and the width of the second opening are substantially equal in consideration of the etching rate. And
第１の金属材と第２の金属材との開口幅を調整しておくことで、スリットの開口径を例えば略同じにすることができる。
By adjusting the opening widths of the first metal material and the second metal material, the opening diameters of the slits can be made substantially the same, for example.
本発明の他の観点によれば、第１金属材と第２金属材からなる積層材であって、前記第１金属材により抵抗体を、前記第２金属材により一対の電極を形成した抵抗器を、複数形成可能な領域を有する積層材であって、前記積層材の面内の第１の方向に延在し前記積層材を貫通するとともに、延在する方向が前記積層材の端面に到達していない前記第１の方向と直交する第２の方向に隣接する複数のスリットと、隣接する２本の前記スリット間に１つ配置され、第２金属材側に前記第１の方向に延在し前記第１の金属材の表面を露出させ前記第２金属材を前記第１の方向に沿って分離することで一対の電極を形成する開口部と、前記一対の電極の前記第１金属材とは反対側の面と前記スリットの内面とを被覆する電極コート材と、を有することを特徴とするチップ抵抗器用の積層材が提供される。
According to another aspect of the present invention, there is provided a laminated material composed of a first metal material and a second metal material, wherein a resistor is formed by the first metal material, and a pair of electrodes is formed by the second metal material. A laminate having a region where a plurality of containers can be formed, extending in a first direction in the plane of the laminate and penetrating the laminate, and extending in the end face of the laminate A plurality of slits adjacent to each other in the second direction orthogonal to the first direction that has not reached and one between the two adjacent slits are arranged in the first direction on the second metal material side An opening that extends to expose a surface of the first metal material and separate the second metal material along the first direction to form a pair of electrodes, and the first of the pair of electrodes An electrode coating material covering the surface opposite to the metal material and the inner surface of the slit. Laminate chip resistors dexterity is provided, wherein.
この中間体によれば、カットする前の縁がある板状態の積層材が形成された中間体で保持することができるため、カット前に、運搬、検査などを行うこともできる。
</ RTI> According to this intermediate, since it can be held by the intermediate in which a laminated material in a plate state with an edge before cutting is formed, transportation, inspection, etc. can be performed before cutting.
本明細書は本願の優先権の基礎である日本国特許出願２０１３－０６９９２３号の明細書および／または図面に記載される内容を包含する。
This specification includes the contents described in the specification and / or drawings of Japanese Patent Application No. 2013-069923, which is the basis of the priority of the present application.
本発明によれば、チップ抵抗器における被メッキ面へのダメージの影響を低減することができる。
According to the present invention, it is possible to reduce the influence of damage to the surface to be plated in the chip resistor.
以下、本発明の実施の形態によるチップ抵抗器の製造技術について図面を参照しながら詳細に説明する。
Hereinafter, a chip resistor manufacturing technique according to an embodiment of the present invention will be described in detail with reference to the drawings.
図１（ａ）、（ｂ）は、本実施の形態によるチップ抵抗器の一構成例を示す図である。図２（ａ）は、その断面構造を示す図である。本実施の形態によるチップ抵抗器Ａは、Ｎｉ－Ｃｒ系などの抵抗体の板１１１と、その一面（抵抗体上面１１１ａの反対側の抵抗体下面１１１ｂ）に、ある距離だけ離れて形成され、例えばＣｕからなる２つの電極１１３とを有し、一面の電極１１３間の領域に抵抗体下面１１１ｂが露出している。その露出面に保護膜が形成されていても良い。ここで、抵抗体の板１１１とは反対側の電極１１３の下面１１３ａと電極１１３の外側面１１３ｂ及び抵抗体端面１１１ｄとが、電極コート材１３１により被覆されている。 図２（ｂ）は、図１、図２（ａ）に示すチップ抵抗器Ａを、基板１６０面上に形成された配線１５０に配置した構成を示す図である。抵抗体Ａの電極１１３が、はんだ（Ｓｎ）フィレット１４０により、配線１５０に電気的に接続されて固定されている。ここで、電極１１３の内側側面１１３ｃは電極１１３が露出している。電極内側面１１３ｃにＣｕの酸化膜を形成することではんだフィレット１４０の這い上がりを防止するとともに、Ｓｎの付着に起因する抵抗値の変動を防止することができる。
FIGS. 1A and 1B are diagrams showing a configuration example of the chip resistor according to the present embodiment. FIG. 2A is a diagram showing the cross-sectional structure. The chip resistor A according to the present embodiment is formed on a resistor plate 111 such as a Ni—Cr system and one surface thereof (resistor lower surface 111b opposite to the resistor upper surface 111a) at a certain distance, For example, it has two electrodes 113 made of Cu, and the resistor lower surface 111b is exposed in a region between the electrodes 113 on one surface. A protective film may be formed on the exposed surface. Here, the lower surface 113 a of the electrode 113 opposite to the resistor plate 111, the outer surface 113 b of the electrode 113, and the resistor end surface 111 d are covered with the electrode coating material 131. FIG. 2B is a diagram showing a configuration in which the chip resistor A shown in FIGS. 1 and 2A is arranged on the wiring 150 formed on the surface of the substrate 160. The electrode 113 of the resistor A is electrically connected and fixed to the wiring 150 by a solder (Sn) fillet 140. Here, the electrode 113 is exposed on the inner side surface 113 c of the electrode 113. By forming a Cu oxide film on the inner surface 113c of the electrode, it is possible to prevent the solder fillet 140 from creeping up and to prevent fluctuations in resistance value due to Sn adhesion.
以下に、上記の抵抗器Ａの製造方法について説明する。図３から図５までは、抵抗体の製造工程の要部を示す図であり、図３Ａ、Ｂは斜視図、図４は図３Ａ，Ｂにおける要部断面図、図５は製造工程の例を示すフローチャート図である。
Hereinafter, a method for manufacturing the resistor A will be described. 3 to 5 are diagrams showing the main part of the resistor manufacturing process, FIGS. 3A and 3B are perspective views, FIG. 4 is a cross-sectional view of the main part in FIGS. 3A and B, and FIG. 5 is an example of the manufacturing process. FIG.
まず、図３Ａ（ａ）、図４の（１）に示すように、例えば、Ｎｉ－Ｃｒ系などの第１の金属材からなる抵抗体の板（層）１１１とＣｕなどの第２の金属材からなる電極板（層）１１３との平板状の積層材１１０を準備する（ステップＳ１）。
First, as shown in FIGS. 3A (a) and 4 (1), for example, a resistor plate (layer) 111 made of a first metal material such as Ni—Cr and a second metal such as Cu. A flat laminated material 110 with an electrode plate (layer) 113 made of a material is prepared (step S1).
次いで、フォトレジストなどを用いたリソグラフィー技術を利用して、積層材１１０に、厚さ方向に貫通し、面内の一方向（第１の方向）に延在するスリット２０１を形成する（ステップＳ２）。そのために、電極材１１３側の一面に、スリット２０１の幅の領域を開口するレジストパターンＡ１が、他の一面にも同じ領域に開口を有するレジストパターンＡ２が形成される。スリット２０１は、第１の方向と直交する第２の方向に間隔をあけて複数設けられる。尚、スリット幅と間隔は、それぞれ、位置により変更して、異なる幅の抵抗器を形成するようにしても良い。要するに、抵抗器の幅がスリット間の間隔により決定する。
Next, using a lithography technique using a photoresist or the like, a slit 201 that penetrates in the thickness direction and extends in one direction (first direction) in the surface is formed in the laminated material 110 (step S2). ). Therefore, a resist pattern A1 having an opening in the width of the slit 201 is formed on one surface of the electrode material 113 side, and a resist pattern A2 having an opening in the same region is formed on the other surface. A plurality of slits 201 are provided at intervals in a second direction orthogonal to the first direction. Note that the slit width and interval may be changed depending on the position to form resistors having different widths. In short, the width of the resistor is determined by the spacing between the slits.
次いで、レジストパターンＡ１、Ａ２を利用して、抵抗体の板１１１と電極板１１３とをエッチングする。エッチングは、ウェットエッチング、ドライエッチングのいずれでもよく、プレスなどにより打ち抜いて良い。次いで、レジストを除去すると、図４（２）に示すように、抵抗体の板１１１と電極板１１３と貫通するスリット２０１が形成される。（図３Ａの（ｃ））。このスリットの一方の位置は、図１、図２に示す電極１１３の側面１１３ｂ及び抵抗体端面１１１ｄに位置する。スリット２０１は、積層材１１０の第１の方向の端面までは形成されていない。
Next, the resistor plate 111 and the electrode plate 113 are etched using the resist patterns A1 and A2. Etching may be either wet etching or dry etching, and may be punched out by pressing or the like. Next, when the resist is removed, as shown in FIG. 4B, a slit 201 penetrating the resistor plate 111 and the electrode plate 113 is formed. ((C) of FIG. 3A). One position of the slit is located on the side surface 113b and the resistor end surface 111d of the electrode 113 shown in FIGS. The slit 201 is not formed up to the end surface of the laminated material 110 in the first direction.
次いで、図３Ａの（ｄ）に示すように、スリット２０１が形成された積層材１１０の両面にそれぞれフォトレジストＢ１、Ｂ２を塗布する。
Next, as shown in FIG. 3A (d), photoresists B1 and B2 are respectively applied to both surfaces of the laminated material 110 in which the slits 201 are formed.
次いで、図３Ａの（ｅ）に示すように、積層材１１０の電極材の板１１３側の一面に、スリット２０１と同じ方向に延在するレジストパターンＢ２－１を形成する。レジストパターンＢ２－１の幅は、電極材の板１１３を分離して電極を形成した場合における隣接する電極間の距離に対応し、レジストパターンＢ２－１の端部と隣接するスリット２０１の端部との間の距離が電極幅に対応する位置に形成される。したがって、この段階で、電極間距離と電極幅とを規定することができる。この際、積層材１１０の抵抗材の板１１１側の一面には全面にフォトレジストＢ１を残しておく。次いで、レジストパターンＢ２－１をマスクとして、Ｓｎの電解メッキなどにより電極コート材１３１を形成する（図３Ａ（ｆ））。図４の（３）に示すように、抵抗体の板１１１と電極板１１３の側面が、電極コート材１３１により被覆される（ステップＳ３）。
Next, as shown in FIG. 3A (e), a resist pattern B2-1 extending in the same direction as the slit 201 is formed on one surface of the electrode material of the laminated material 110 on the plate 113 side. The width of the resist pattern B2-1 corresponds to the distance between adjacent electrodes when the electrodes 113 are formed by separating the electrode material plate 113, and the end of the slit 201 adjacent to the end of the resist pattern B2-1. Is formed at a position corresponding to the electrode width. Therefore, the interelectrode distance and the electrode width can be defined at this stage. At this time, the photoresist B1 is left on the entire surface of the resistance material of the laminated material 110 on the plate 111 side. Next, using the resist pattern B2-1 as a mask, an electrode coating material 131 is formed by electrolytic plating of Sn or the like (FIG. 3A (f)). As shown in FIG. 4 (3), the side surfaces of the resistor plate 111 and the electrode plate 113 are covered with the electrode coating material 131 (step S3).
次いで、図３Ｂ（ｇ）に示すように、レジストパターンＢ２－１とＢ１とを除去する。Ｂ１は残しても良い。すると、図４の（４）に示すように、レジストパターンＢ２－１を除去した領域１４１に、電極材１１３の表面が露出する（ステップＳ４）。
Next, as shown in FIG. 3B (g), the resist patterns B2-1 and B1 are removed. B1 may be left. Then, as shown in FIG. 4 (4), the surface of the electrode material 113 is exposed in the region 141 from which the resist pattern B2-1 has been removed (step S4).
次いで、図３Ｂ（ｈ）に示すように、例えば塩化第二鉄の水溶液を用いて、Ｎｉ－Ｃｒに対してＣｕの選択エッチングを行う。これにより、図４Ｂの５）に示すように、レジストパターンＢ２－１を除去した領域１４１に抵抗体の板１１１が露出し、電極１３１が分離する（ステップＳ５）。
Next, as shown in FIG. 3B (h), Cu is selectively etched with respect to Ni—Cr using, for example, an aqueous solution of ferric chloride. As a result, as shown in 5) of FIG. 4B, the resistor plate 111 is exposed in the region 141 where the resist pattern B2-1 is removed, and the electrode 131 is separated (step S5).
次いで、図３Ｂ（ｉ）に示すように、スリット２０１の端部近傍のスリット２０１内の位置で、スリット２０１の延在方向と直交する方向に、ダイシング、せん断などにより、積層材１１０をカットする（ステップＳ６）。
Next, as shown in FIG. 3B (i), the laminated material 110 is cut by dicing, shearing, or the like in a direction perpendicular to the extending direction of the slit 201 at a position in the slit 201 near the end of the slit 201. (Step S6).
次いで、図３Ｂ（ｊ）に示すように、スリット２０１の延在方向と直交する方向に、ダイシング、せん断などにより、積層材１１０をカットして個片化する。これにより、図４の（６）に示すように、図１と同様の構造を形成することができる。
Next, as shown in FIG. 3B (j), the laminated material 110 is cut into pieces by dicing, shearing, or the like in a direction orthogonal to the extending direction of the slit 201. Thereby, as shown to (6) of FIG. 4, the structure similar to FIG. 1 can be formed.
このように、本実施の形態によれば、積層材１１０に予め、後に電極１１３の側面となる位置に断面を有するスリット２０１を形成しておき、電極材１１３を形成したのちにせん断などにより側面を形成する場合に比べて、工程の自由度が向上し、ウェットエッチングなどのいわゆるソフトエッチングを選択することができる。また、電極間の距離や電極幅を、フォトリソグラフィーにより決めることができるため、抵抗体の寸法精度が良くなる。
As described above, according to the present embodiment, the slit 201 having a cross section is formed in the laminated material 110 in advance at a position to be the side surface of the electrode 113 in advance, and after the electrode material 113 is formed, the side surface is sheared or the like. Compared with the case of forming, the degree of freedom of the process is improved, and so-called soft etching such as wet etching can be selected. Further, since the distance between the electrodes and the electrode width can be determined by photolithography, the dimensional accuracy of the resistor is improved.
次に、スリット２０１を形成する工程（図３Ａの（ｂ）（ｃ））の詳細を説明する。図６（ａ）に示すように、抵抗体の板１１１側のレジスト開口幅Ｏ２’を電極材の板１１３側のレジスト開口幅Ｏ１よりもエッチング速度の違いを考慮した分だけ狭くする（Ｏ１＞Ｏ２’）ことで、図６（ｂ）に示すように、電極コート材１３１と、電極材の板１１３側との開口を同じ幅とすることができる（Ｌ１参照）。ウェットエッチングによって積層材１１０の端面Ｌ１はテーパ形状となるため、はんだフィレット１４０の付着面積が大きくなり、アンカー効果、固着力が向上するという利点がある。
Next, the details of the step of forming the slit 201 ((b) and (c) of FIG. 3A) will be described. As shown in FIG. 6A, the resist opening width O2 ′ on the resistor plate 111 side is made narrower than the resist opening width O1 on the electrode plate 113 side by considering the difference in etching rate (O1>). O2 ′), as shown in FIG. 6B, the openings on the electrode coating material 131 and the electrode material plate 113 side can have the same width (see L1). Since the end surface L1 of the laminated material 110 is tapered by wet etching, there is an advantage that the adhesion area of the solder fillet 140 is increased, and the anchor effect and the fixing force are improved.
上記の実施の形態において、添付図面に図示されている構成等については、これらに限定されるものではなく、本発明の効果を発揮する範囲内で適宜変更することが可能である。その他、本発明の目的の範囲を逸脱しない限りにおいて適宜変更して実施することが可能である。また、本発明の各構成要素は、任意に取捨選択することができ、取捨選択した構成を具備する発明も本発明に含まれるものである。
In the above-described embodiment, the configuration and the like illustrated in the accompanying drawings are not limited to these, and can be changed as appropriate within the scope of the effects of the present invention. In addition, various modifications can be made without departing from the scope of the object of the present invention. Each component of the present invention can be arbitrarily selected, and an invention having a selected configuration is also included in the present invention.
本発明は、抵抗器の製造方法に利用できる。
The present invention can be used in a method for manufacturing a resistor.
Ａ…チップ抵抗器、１１０…積層材、１１１…抵抗体の板、１１３…電極材の板、１３１…電極コート材、１４０…はんだフィレット、１５０…配線、１６０…基板、２０１…スリット。
A ... chip resistor, 110 ... laminated material, 111 ... resistor plate, 113 ... electrode material plate, 131 ... electrode coating material, 140 ... solder fillet, 150 ... wiring, 160 ... substrate, 201 ... slit.
本明細書で引用した全ての刊行物、特許および特許出願をそのまま参考として本明細書にとり入れるものとする。
All publications, patents and patent applications cited in this specification shall be incorporated into the present specification as they are.
Claims (4)
- 第１金属材と第２金属材からなる積層材であって、前記第１金属材により抵抗体を、前記第２金属材により一対の電極を形成したチップ抵抗器を複数形成可能な領域を有する積層材を準備し、
前記積層材の面内の第１の方向に延在し、前記積層材を貫通するスリットを形成する工程と、
前記第２金属材側の表面に前記スリットに隣接し前記第１の方向に延在する第１のマスクを形成する工程と、
前記第１のマスクが形成された積層材に電極コート材をメッキすることで、前記電極コート材により前記第２金属材の前記第１金属材とは反対側の面と前記スリットの内面とを被覆する工程と、
前記第１のマスクを除去し、前記第２金属材を選択的に除去し、前記第１金属材を露出させる工程と、
前記積層材を前記第１の方向と直交する第２の方向に切断する工程と
を有することを特徴とするチップ抵抗器の製造方法。 A laminated material composed of a first metal material and a second metal material, having a region where a plurality of chip resistors in which a resistor is formed by the first metal material and a pair of electrodes are formed by the second metal material can be formed. Prepare the laminate,
Extending in a first direction in the plane of the laminate and forming a slit penetrating the laminate;
Forming a first mask adjacent to the slit and extending in the first direction on the surface of the second metal material side;
By plating an electrode coating material on the laminated material on which the first mask is formed, the surface of the second metal material opposite to the first metal material and the inner surface of the slit are formed by the electrode coating material. Coating, and
Removing the first mask, selectively removing the second metal material, and exposing the first metal material;
Cutting the laminated material in a second direction orthogonal to the first direction. A method of manufacturing a chip resistor, comprising: - 前記第１のマスクを形成する工程は、
前記第１のマスクを、前記第２の方向の幅が前記第２金属材を分離して電極を形成した場合における電極間距離に対応し、前記第１のマスクの前記第２の方向側の端部と隣接する前記スリットの端部との間の距離が電極幅に対応する位置に形成する工程であることを特徴とする請求項１に記載のチップ抵抗器の製造方法。 The step of forming the first mask includes:
The first mask has a width in the second direction corresponding to an inter-electrode distance when the second metal material is separated to form an electrode, and the first mask has a width on the second direction side of the first mask. 2. The method of manufacturing a chip resistor according to claim 1, wherein the distance between the end portion and the end portion of the adjacent slit is a step of forming at a position corresponding to the electrode width. - 前記スリットを形成する工程において、
前記第１の金属材の面内の第１の方向に延在する第１の開口を有する第２のマスクを形成し、前記第２の金属材の面内の第１の方向に延在する第２の開口を有し、前記第２のマスクと対応する位置に第３のマスクを形成し、
前記第１の金属材と前記第２の金属材とのエッチング速度を考慮して前記第１の開口の幅と前記第２の開口の幅とが略等しくなるように前記第１の開口幅と前記第２の開口幅とを調整しておくことを特徴とする請求項１又は２に記載のチップ抵抗器の製造方法。 In the step of forming the slit,
Forming a second mask having a first opening extending in a first direction in a plane of the first metal material and extending in a first direction in a plane of the second metal material; Forming a third mask at a position corresponding to the second mask having a second opening;
Considering the etching rate of the first metal material and the second metal material, the width of the first opening and the width of the second opening are substantially equal to each other. The method of manufacturing a chip resistor according to claim 1, wherein the second opening width is adjusted. - 第１金属材と第２金属材からなる積層材であって、前記第１金属材により抵抗体を、前記第２金属材により一対の電極を形成した抵抗器を、複数形成可能な領域を有する積層材であって、
前記積層材の面内の第１の方向に延在し前記積層材を貫通するとともに、延在する方向が前記積層材の端面に到達していない前記第１の方向と直交する第２の方向に隣接する複数のスリットと、
隣接する２本の前記スリット間に１つ配置され、第２金属材側に前記第１の方向に延在し前記第１の金属材の表面を露出させ前記第２金属材を前記第１の方向に沿って分離することで一対の電極を形成する開口部と、
前記一対の電極の前記第１金属材とは反対側の面と前記スリットの内面とを被覆する電極コート材と、
を有することを特徴とするチップ抵抗器用の積層材。 A laminated material composed of a first metal material and a second metal material, wherein the first metal material has a region in which a plurality of resistors can be formed and a resistor having a pair of electrodes formed by the second metal material. A laminated material,
A second direction that extends in a first direction within the plane of the laminated material and penetrates the laminated material, and the extending direction is orthogonal to the first direction that does not reach the end face of the laminated material. A plurality of slits adjacent to
One is arranged between the two adjacent slits, extends in the first direction on the second metal material side, exposes the surface of the first metal material, and causes the second metal material to pass through the first metal material. An opening that forms a pair of electrodes by separating along a direction;
An electrode coating material that covers a surface of the pair of electrodes opposite to the first metal material and an inner surface of the slit;
A laminated material for a chip resistor, comprising:
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| JP7018251B2 (en) * | 2015-05-21 | 2022-02-10 | ローム株式会社 | Chip resistor |
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