WO2014128861A1

WO2014128861A1 - Data management device

Info

Publication number: WO2014128861A1
Application number: PCT/JP2013/054172
Authority: WO
Inventors: 輝之大橋
Original assignee: 富士機械製造株式会社
Priority date: 2013-02-20
Filing date: 2013-02-20
Publication date: 2014-08-28
Also published as: JP6148721B2; JPWO2014128861A1

Abstract

In a data management device, for each component type of an electronic component, a plurality of data, which are related to an electronic component associated with an electronic component identification code (vendor code, lot number) imparted at electronic component manufacture time, are stored. Then, a component code indicating the component type of the electronic component and an electronic component identification code are acquired, and data related to the electronic component, which are stored in association with the component code and the electronic component identification code, are acquired. A taped component or the like that contains an electronic component, at manufacturing time at a manufacturing company, has indicated thereupon a component code, a vendor code indicating the manufacturing company, a lot number indicating the period of production, and the like. Therefore, by acquiring the data related to the electronic component using a vendor code or the like that has been indicated beforehand on a taped component or the like, it is possible to acquire data related to the electronic component without trouble.

Description

Data management device

The present invention relates to a data management apparatus that manages data related to electronic components used in an electronic component mounting system that performs an operation of mounting electronic components on a circuit board.

In the electronic component mounting system, an electronic component is mounted on a circuit board. Among the electronic components, there are some of the same types of electronic components whose electronic component dimensions and the like differ depending on the electronic component manufacturer, manufacturing time, and the like. Specifically, many electronic parts having predetermined characteristics are manufactured by a plurality of companies, and even electronic parts from different manufacturers have the same characteristics. In other words, even electronic parts from different manufacturers have the same characteristics as each other and are handled as the same kind of electronic parts. For this reason, for example, when an electronic component made by company A is lost, an electronic component made by company B having the same characteristics as the electronic component can be used instead of the electronic component made by company A. However, the size and the like may be different between the part manufactured by company A and the part manufactured by company B. Further, even if the manufacturing company has the same electronic component, the dimensions and the like of the electronic component may be slightly different if the manufacturing time is different. For this reason, the data regarding the dimension of an electronic component, etc. are required at the time of the mounting operation of an electronic component.

Therefore, in the system described in the following patent document, a label on which a code for distinguishing the electronic components for each manufacturing period is attached to a taped component or the like for the same type of electronic components. Map data that associates the code with the data related to the electronic component is created. Then, the code is read from the attached label, and the map data is referred to, whereby data related to the electronic component corresponding to the read code is acquired.

JP-T-2002-512733

According to the technique described in the above-mentioned patent document, even with the same type of electronic component, data on the electronic component can be acquired for each manufacturing company and each manufacturing period. However, the operation of attaching the label to the taped component of the electronic component used in the electronic component mounting system is a very time-consuming operation. For this reason, it is desired to obtain data relating to electronic parts without trouble for the same type of electronic parts at each manufacturing company and every manufacturing period.

In addition, when electronic parts are replenished, new electronic parts are replenished at a predetermined supply position in the system. The supply form at the predetermined supply position and the new supply position are newly supplied. There are cases where the supply form of the electronic component is different. Specifically, for example, when supplying an electronic component manufactured by company B having the same characteristics as the electronic component instead of the electronic component manufactured by company A to the supply position where the electronic component manufactured by company A was supplied, There are cases where the supply form of electronic parts manufactured by company A, that is, the supply form at a predetermined supply position, and the supply form of electronic parts manufactured by company B are different. In such a case, the electronic parts manufactured by B cannot be replenished to the supply position where the electronic parts manufactured by A are supplied, and the operator is confused. Therefore, there is a possibility that the confusion of the operator can be solved by acquiring data relating to the supply form as data relating to the newly supplied electronic component and appropriately utilizing the data relating to the supply form.

As described above, there is still a lot of room for improvement in the acquisition and utilization of data related to electronic components, and the practical use of a data management device that acquires and uses data related to electronic components by making some improvements. Can be improved. The present invention has been made in view of such circumstances, and an object thereof is to provide a highly practical data management apparatus.

In order to solve the above-described problem, a data management device according to claim 1 of the present application is a data management device that manages data relating to an electronic component used in an electronic component mounting system that performs an electronic component mounting operation on a circuit board. A storage unit capable of storing a plurality of data related to an electronic component associated with an electronic component identification code given at the time of manufacturing the electronic component for each component type of the electronic component, and a component code indicating the component type of the electronic component And a code acquisition unit that acquires the electronic component identification code, and the electronic component stored in the storage unit in association with the component code and the electronic component identification code acquired by the code acquisition unit And a component data acquisition unit that acquires target component data that is data.

According to a second aspect of the present invention, in the data management device according to the first aspect, the target component data includes data related to a supply form of an electronic component, and the data management device includes the electronic component mounting. A determination unit that determines whether or not a supply form of an electronic component at a predetermined supply position of the system and a target component supply form that is a supply form of the electronic component indicated by the target part data match. To do.

According to a third aspect of the present invention, there is provided the data management device according to the second aspect, wherein the electronic component supply form at the predetermined supply position of the electronic component mounting system and the target component supply form are the same. In the case where they do not coincide with each other, a notifying unit for notifying the supply position of the electronic component mounting system that matches the target component supply form is provided.

Moreover, in the data management device according to claim 4, in the data management device according to any one of claims 1 to 3, the component data acquisition unit acquires the component acquired by the information acquisition unit. The target component data is acquired when the component type of the electronic component indicated by the code is the component type of the electronic component necessary for the mounting operation in the electronic component mounting system.

A data management device according to claim 5 is a data management device for managing data relating to an electronic component used in an electronic component mounting system for performing an electronic component mounting operation on a circuit board, wherein the electronic component unit For each product type, a storage unit that stores data relating to the supply form of the electronic component, a code acquisition unit that acquires a component code indicating the component type of the electronic component, and an electronic that corresponds to the component code acquired by the code acquisition unit A component data acquisition unit that acquires data related to a component supply mode, a supply mode of an electronic component at a predetermined supply position of the electronic component mounting system, and a supply of an electronic component indicated by data acquired by the component data acquisition unit And a determination unit that determines whether or not the form matches.

In the data management apparatus according to the first aspect, for each type of electronic component, an electronic component identification code given at the time of manufacturing the electronic component and data related to the electronic component are stored in association with each other. Then, a component code indicating the component type of the electronic component and an electronic component identification code are acquired, and data relating to the electronic component stored in association with the component code and the electronic component identification code is acquired. A taped part or the like that accommodates an electronic part has a part code indicating a part type, a vendor code indicating a manufacturing company, a lot number indicating a manufacturing time, and the like at the time of manufacture by the manufacturing company. Therefore, in the data management apparatus according to the first aspect, the data related to the electronic component is acquired by using a vendor code or the like recorded in advance on the taped component or the like. Thereby, the operator can acquire the data regarding an electronic component without trouble, without sticking a label etc. on a taped component.

Further, in the data management device according to claim 2 and claim 5, data relating to the electronic component supply form is included in the acquired data relating to the electronic component (hereinafter sometimes referred to as “target component data”). ing. The electronic component supply form at a predetermined supply position of the electronic component mounting system matches the electronic component supply form indicated by the target component data (hereinafter, sometimes referred to as “target component supply form”). It is determined whether or not. That is, it is determined whether or not an electronic component (hereinafter sometimes referred to as “target component”) indicated by the target component data can be supplied to a predetermined position. Accordingly, for example, when the target part cannot be replenished at a predetermined position, it is possible to notify the operator of that fact, and it is possible to eliminate the operator's confusion.

According to a third aspect of the present invention, there is provided the data management apparatus according to the third aspect, wherein when the electronic component supply form at the predetermined supply position of the electronic component mounting system does not match the target component supply form, the supply matches the target part supply form. The position is notified. That is, when the target part cannot be supplied to the predetermined position, the new supply position of the target part is notified. As a result, the operator can recognize a new supply position of the target part, and convenience is improved.

Further, in the data management apparatus according to claim 4, when the component type of the target component is the component type of the electronic component necessary for the mounting operation in the electronic component mounting system, the target component data is acquired. That is, target part data is acquired when the target part is an electronic part actually used in the system. This makes it possible to avoid unnecessary acquisition of target part data.

It is a perspective view which shows the to-substrate work system in which the data managed by the data management apparatus which is an Example of this invention are used. It is a perspective view which shows the mounting apparatus with which the to-board work system of FIG. 1 is provided. It is a block diagram which shows the control apparatus with which the board | substrate work system of FIG. 1 is provided. It is a figure which shows typically the map data which linked | related the vendor code, lot number, and the data regarding an electronic component for every component kind. It is a flowchart which shows the program for acquiring the data regarding an electronic component. It is a flowchart which shows the program for displaying the replenishment position of an electronic component on a display apparatus using the data regarding an electronic component. It is a flowchart which shows the program for displaying the replenishment position of an electronic component on a display apparatus using the data regarding an electronic component. It is a flowchart which shows the program for changing a work procedure using the data regarding an electronic component.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as modes for carrying out the present invention.

<Configuration of the work system for substrates>
FIG. 1 shows a substrate working system 10. A system 10 shown in FIG. 1 is a system for mounting electronic components on a circuit board. The on-board working system 10 includes four electronic component mounting apparatuses (hereinafter, may be abbreviated as “mounting apparatuses”) 12. The four mounting devices 12 are arranged in a row in an adjacent state. In the following description, the direction in which the mounting devices 12 are arranged is referred to as the X-axis direction, and the horizontal direction perpendicular to the direction is referred to as the Y-axis direction.

The four mounting devices 12 have substantially the same configuration. Therefore, one of the four mounting devices 12 will be described as a representative. As shown in FIG. 2, the mounting device 12 has one system base 14 and two mounting machines 16 adjacent to the system base 14. Each mounting machine 16 mainly includes a mounting machine main body 20, a transport device 22, a mounting head moving device (hereinafter also abbreviated as “moving device”) 24, a supply device 26, and a mounting head 28. The mounting machine main body 20 includes a frame portion 30 and a beam portion 32 that is overlaid on the frame portion 30.

The transport device 22 includes two

conveyor devices

40 and 42. The two

conveyor devices

40 and 42 are disposed in the frame portion 30 so as to be parallel to each other and extend in the X-axis direction. Each of the two

conveyor devices

40 and 42 conveys a circuit board supported by the

conveyor devices

40 and 42 in the X-axis direction by an electromagnetic motor (see FIG. 3) 46. The circuit board is fixedly held by a board holding device (see FIG. 3) 48 at a predetermined position.

The moving device 24 is an XY robot type moving device. The moving device 24 includes an electromagnetic motor (see FIG. 3) 52 that slides the slider 50 in the X-axis direction and an electromagnetic motor (see FIG. 3) 54 that slides in the Y-axis direction. A mounting head 28 is attached to the slider 50, and the mounting head 28 moves to an arbitrary position on the frame unit 30 by the operation of the two

electromagnetic motors

52 and 54.

The supply device 26 is a feeder-type supply device, and is disposed at the front end of the frame portion 30. The supply device 26 has a tape feeder 70. The tape feeder 70 accommodates the taped component in a wound state. The taped component is a taped electronic component. Then, the tape feeder 70 sends out the taped parts by a delivery device (see FIG. 3) 76. Thereby, the feeder type supply device 26 supplies the electronic component at the supply position by feeding the taped component. The tape feeder 70 can be attached to and detached from the frame unit 30 and can cope with replacement of electronic components. The frame 30 can be mounted with a tape feeder 70 that accommodates a taped part having a predetermined width and a tape feeder 70 that accommodates a taped part wider than the predetermined width. is there.

The mounting head 28 is for mounting electronic components on the circuit board. The mounting head 28 has a suction nozzle 78 provided on the lower end surface. The suction nozzle 78 communicates with a positive / negative pressure supply device (see FIG. 3) 80 via negative pressure air and positive pressure air passages. The suction nozzle 78 sucks and holds the electronic component with a negative pressure, and releases the held electronic component with a positive pressure. The mounting head 28 has a nozzle lifting / lowering device (see FIG. 3) 82 that lifts and lowers the suction nozzle 78. The mounting head 28 changes the vertical position of the electronic component to be held by the nozzle lifting device 82. The suction nozzle 78 can be attached to and detached from the mounting head 28, and can be replaced according to the size of the electronic component.

The on-board working system 10 includes a mark camera (see FIG. 3) 90 and a parts camera (see FIG. 2) 92. The mark camera 90 is fixed to the lower surface of the slider 50 while facing downward. As a result, the slider 50 is moved by the moving device 24 so that an arbitrary position on the frame unit 30 can be imaged. On the other hand, the parts camera 92 is provided on the frame unit 30 so as to face upward, and images the electronic component held by the suction nozzle 78 of the mounting head 28.

Furthermore, the substrate work system 10 includes a control device 100 as shown in FIG. The control device 100 includes a controller 102, a plurality of drive circuits 106, and a control circuit 108. The plurality of drive circuits 106 are connected to the

electromagnetic motors

46, 52, 54, the substrate holding device 48, the delivery device 76, the positive / negative pressure supply device 80, and the nozzle lifting / lowering device 82. The controller 102 includes a CPU, a ROM, a RAM, and the like, mainly a computer, and is connected to a plurality of drive circuits 106. Thereby, the operations of the transport device 22 and the moving device 24 are controlled by the controller 102.

The controller 102 is connected to an image processing apparatus 110 that processes image data obtained by the mark camera 90 and the part camera 92, and acquires various types of information from the image data. The controller 102 is connected to the display device 112 via the control circuit 108, and various work information is displayed on the display device 112. Further, an input device 114 is connected to the controller 102. The input device 114 has a barcode reader (not shown), and reads a barcode such as a component code, a vendor code, and a lot number written on a taped component. As a result, the controller 102 acquires the component type, manufacturing company, lot number, and the like of the electronic component accommodated in the taped component.

<Mounting work with the substrate working system>
With the above-described configuration, in the on-board working system 10, the circuit board is transported inside the eight mounting machines 16 by the transport device 22, and electronic components are mounted on the circuit board by each mounting machine 16.

Specifically, first, the circuit board is carried into the mounting machine 16 arranged at the most upstream of the eight mounting machines 16. In the mounting machine 16, the circuit board is transported to the work position according to a command from the controller 102, and is fixedly held by the board holding device 48 at that position. Further, the tape feeder 70 sends out a taped component and supplies an electronic component at a supply position in accordance with a command from the controller 102. Then, the mounting head 28 moves above the electronic component supply position in accordance with a command from the controller 102, and the electronic component is sucked and held by the suction nozzle 78. Subsequently, the mounting head 28 moves above the circuit board and mounts the held electronic component on the circuit board. When the mounting operation of the electronic component on the circuit board is completed, the circuit board is transported toward the downstream side and carried into the mounting machine 16 disposed on the downstream side. Then, the mounting operation is sequentially executed by each mounting machine 16 to produce a circuit board on which electronic components are mounted.

<Replenishment and replacement of electronic components in the substrate-based system>
In the substrate working system 10, as described above, the mounting head 28 sucks and holds the electronic component supplied by the tape feeder 70, and the electronic component is mounted on the circuit board. In the substrate-to-board working system 10 configured as described above, when the number of electronic components accommodated in the tape feeder 70 is less than a predetermined number in order to avoid insufficient supply of electronic components, a tape is displayed on the display device 112. A screen for prompting replacement of the feeder 70, splicing work, and the like is displayed. Further, when the type of circuit board to be manufactured is replaced, the electronic component to be mounted is replaced, and therefore a screen for prompting replacement to the tape feeder 70 corresponding to the electronic component to be mounted is displayed. Displayed on device 112. Then, the worker performs replacement of the tape feeder 70, splicing work, and the like according to the display screen. Thereby, it is possible to appropriately cope with replenishment and replacement of electronic components.

However, even if the electronic component is the same type of electronic component, the size of the electronic component may vary depending on the electronic component manufacturer and the timing of manufacture. Need to get. Specifically, many electronic parts having predetermined characteristics are manufactured by a plurality of companies, and even electronic parts from different manufacturers have the same characteristics. In other words, even electronic parts from different manufacturers have the same characteristics as each other and are handled as the same kind of electronic parts. For this reason, for example, when there is no electronic component manufactured by company A, an electronic component manufactured by company B having the same characteristics as the electronic component can be supplied instead of the electronic component manufactured by company A.

However, even if the electronic parts from different manufacturers are the same type of electronic parts, the appearances such as dimensions, shapes and colors may be different. In such a case, it is necessary to acquire data regarding the appearance of the electronic component to be replenished at the time of replenishment of the electronic component or the like in order to cope with the change of the suction position or the like. Further, if the dimensions and the like are different, for example, it may be necessary to change the type of the suction nozzle used at the time of electronic component suction. Furthermore, if the shape or the like is different, for example, the suction location or the like may need to be changed. For this reason, it is necessary to acquire data related to the type and position of the suction nozzle corresponding to the electronic component to be supplied, that is, data related to the electronic component suction method.

Furthermore, even if the electronic parts of different manufacturers are the same type of electronic parts, the supply form of the electronic parts may be different. Specifically, for example, when the dimensions are different, the width of the taped part may be different. Also, for example, there are cases where electronic components are delivered in a state of being placed on a tray, and cases where electronic components are delivered in a state of being accommodated in a taped component. The electronic components supplied by the tray type supply device and housed in the taped components are supplied by the tape feeder. Thus, when the supply form of an electronic component differs, it is necessary to select the supply position, supply apparatus, etc. according to a supply form. For this reason, at the time of replenishment of electronic components, it is necessary to acquire data relating to the supply form of the replenished electronic components.

In addition, even if the manufacturing company has the same electronic component, the appearance such as the dimensions of the electronic component may be slightly different if the manufacturing time is different, and it is necessary to acquire data on the external appearance of the electronic component to be replenished. Moreover, even if a manufacturing company is the same electronic component, the supply form of an electronic component may differ according to the number of electronic components delivered. Specifically, for example, when the number of electronic components delivered is small, the electronic components placed on the tray are delivered, and when the number of electronic components delivered is large, the electronic components are contained in a taped component. Electronic parts may be delivered. For this reason, even if a manufacturing company is the same electronic component, it is necessary to acquire the data regarding the supply form of the electronic component supplied.

Thus, at the time of replenishment or replacement of an electronic component, it is necessary to acquire data on the appearance, suction method, supply form, etc. of the electronic component. For this reason, in the conventional system, the map data that associates the code with the data related to the electronic component is attached to the taped component, etc., with the label that identifies the manufacturer and the code for each production time. I was creating. And the code | cord | chord was acquired from the stuck label and the data regarding the electronic component according to the acquired code | cord | chord were acquired from map data. Thereby, it was possible to acquire the data regarding an electronic component. However, the work of sticking a label on which a code for distinguishing each manufacturing company and each manufacturing time is attached to a taped part or the like is a very time-consuming work.

Therefore, in the on-board work system 10, data on electronic parts is acquired by using a vendor code and a lot number recorded in advance on the taped parts. Specifically, a taped part or the like has a part code indicating a part type, a vendor code indicating a manufacturing company, and a lot number indicating a manufacturing time when manufactured by the manufacturing company. Then, the manufacturer of the circuit board that purchased the taped part or the like creates map data in which an identification code such as a vendor code and a lot number is associated with data on the electronic part for each part type.

Specifically, for example, as shown in FIG. 4, with respect to a component type whose component code is “01”, a vendor code “X1” and “Data1” which is data related to an electronic component of the vendor code “X1” Associate. Further, the vendor code “X2” and the lot number “Y1” are associated with “Data2” that is data relating to the electronic component of the vendor code “X2” and the lot number “Y1”. Further, the vendor code “X2” and the lot number “Y2” are associated with “Data3” that is data relating to the electronic component of the vendor code “X2” and the lot number “Y2”. Further, a code other than the vendor code “X1” or the vendor code “X2” and the lot numbers “Y1” and “Y2” is associated with “Data4” which is default data. Then, the map data associated as described above is stored in the controller 102 of the control device 100.

Note that “Data 4” as default data is data relating to an electronic component that is generally used in a component type having a component code “01”. All data of the electronic component, that is, appearance, suction method, supply form, and the like. Data on is included. In addition, “Data 1”, “Data 2”, and “Data 3” include all data of electronic parts corresponding to each data, that is, data relating to appearance, suction method, supply form, and the like.

Then, at the time of replenishment / replacement of the electronic component, data relating to the electronic component to be replenished / replaced (hereinafter sometimes referred to as “target component data”) is acquired based on the map data stored in the controller 102. The Specifically, when an electronic component to be replenished / replaced (hereinafter sometimes referred to as “target component”) is displayed on the display device 112, the worker follows the display to indicate the taped component in which the target component is accommodated. Prepare etc. Then, the operator reads the part code, the vendor code, and the lot number written on the taped part by the input device 114. The read part code, vendor code, and lot number are input to the controller 102. The controller 102 refers to the map data, and extracts data relating to electronic parts stored in association with the part code, vendor code, and lot number.

Specifically, for example, when the part code, the vendor code, and the lot number input to the controller 102 are the part code “01”, the vendor code “X2”, and the lot number “Y1”, “Data2” is extracted. Is done. Further, for example, when the component code input to the controller 102 is the component code “01” and the vendor code input to the controller 102 is a code other than the vendor codes “X1” and “X2”, “Data4” is extracted. Thereby, the controller 102 acquires target component data. As described above, the substrate-based work system 10 can acquire data on electronic components without performing label sticking work or the like on a taped component or the like.

Then, in the controller 102, the target component is mounted using the acquired target component data. Specifically, the dimensions of the target part are changed using data relating to the appearance of the target part data for the program for executing the mounting operation of the target part. Further, the suction nozzle used at the time of sucking the target component is changed using the data regarding the sucking method of the target component data. Further, using the data related to the supply form of the target part data, the work order of the target part mounting work is changed.

By the way, when changing the work order of the mounting work with respect to the program using the data related to the supply form of the target part data, the supply form of the target part data and the supply position displayed on the display device 112 are displayed. When the comparison with the supply form of the electronic components is performed and the supply forms are different from each other, the work order of the mounting work with respect to the program is changed.

Specifically, when the target part is displayed on the display device 112, the supply / replacement position of the target part, that is, the supply position of the target part is also displayed on the display device 112. Then, the worker replenishes / exchanges the target part at the displayed supply position. However, if the supply form of the target component data is different from the supply form of the electronic component at the supply position displayed on the display device 112, the operator may not be able to replenish and replace the target part. For example, the supply form of the electronic component at the displayed supply position is a supply form of a tape feeder in which a taped part having a predetermined width is accommodated, and the supply form of the target component data is wider than the predetermined width. There is a case where the supply form is a tape feeder (hereinafter, may be referred to as a “wide tape feeder”) in which taped parts are accommodated. In such a case, the operator cannot replenish / replace the target part at the displayed supply position. Further, for example, when the electronic component supply form at the displayed supply position is a supply form in a tray-type supply apparatus, and the supply form of target component data is a supply form in a feeder-type supply apparatus There is. Even in such a case, the operator cannot replenish and replace the target part at the displayed supply position.

For this reason, when the supply form of the target component data and the supply form of the electronic component at the supply position displayed on the display device 112 are different, a search for a supply position different from the supply position displayed on the display device 112 is performed. Done. Specifically, in the controller 102, the mounting machine 16 serving as a supply position displayed on the display device 112 (hereinafter sometimes referred to as “target mounting machine”) and the mounting machine 16 disposed downstream of the target mounting machine. In step (1), it is determined whether or not the target component can be supplied in the supply form of the target component data. Specifically, for example, when the supply form of the target part data is a supply form with a wide tape feeder, the supply with the wide tape feeder is performed in the target mounting machine and the mounting machine arranged downstream from the target mounting machine. It is determined whether it is possible. When the target mounting machine and the mounting machine arranged on the downstream side of the target mounting machine can supply with the wide tape feeder, the supply position that can be supplied with the wide tape feeder is displayed on the display device 112. The Thereby, the target part is replenished / replaced at a new supply position. That is, the mounting operation of the target component is performed at a new supply position instead of the preset supply position. For this reason, the work order of the mounting work is changed with respect to the program for executing the mounting work.

In addition, if the target mounting machine and the mounting machine arranged downstream of the target mounting machine cannot supply the target part data, the target part cannot be replenished / replaced. Specifically, for example, when the supply form of the target component data is a supply form with a tray-type supply device, the tray-type supply device is not employed in the substrate-based work system 10, and thus the tray-type supply device is not used. The target part cannot be supplied by the supply device. For this reason, in such a case, a display indicating that the electronic component prepared by the worker as the target component is not suitable for the mounting operation, that is, “Verify NG” is displayed on the display device 112.

In the above description, the target part is replenished / replaced at the supply position displayed on the display device 112, but the target part may not be replenished / replaced at the supply position displayed on the display device 112. Specifically, when the supply position of the target part is displayed together with the target part on the display device 112, the target part is not the displayed supply position but a position close to the worker, a position where the worker can easily work, and the like. Parts may be replenished or replaced.

In such a case, it is determined whether or not the replenished / replaced electronic component is a target component. This is because an operator sometimes supplies and replaces a different type of electronic component from the target component by mistake. If the replenished / replaced electronic part is the target part, the mounting machine (hereinafter referred to as “replenishment”) where the supply position where the actual replenishment / replacement is performed becomes the supply position of the target part before replenishment / replacement. It may be referred to as “front mounting machine”), or it is determined whether or not it is located on the mounting machine downstream from the pre-replenishment mounting machine. This means that if the supply position where replenishment / replacement is actually performed is located on the mounting machine upstream from the pre-replenishment placement machine, it will be replenished / replaced instead of the electronic parts before replenishment / replacement. This is because the electronic components cannot be used. In other words, when the supply position where replenishment / replacement is actually performed is located on the pre-replenishment mounting machine or on the mounting machine downstream from the pre-replenishment mounting machine, Used as a part.

For this reason, when the supply position where the replenishment / replacement is actually performed is located on the pre-replenishment mounting machine or on the mounting machine on the downstream side of the pre-replenishment mounting machine, data regarding electronic components is acquired. . That is, the map data is referred to, and data relating to the electronic component stored in association with the component code, the vendor code, and the lot number is acquired. Then, using the data related to the electronic component, the program is changed to a program corresponding to the mounting operation at the supply position where the supply / replacement is actually performed.

<Control program>
Acquisition of target component data at the time of component replenishment is performed by executing a program whose flowchart is shown in FIG. Further, the display of the supply position in accordance with the target component data on the display device 112 and the change of the program are performed by executing the program shown in the flowchart in FIGS. 6 and 7. Further, the change of the program according to the position of the replenished / replaced electronic component is performed by executing the program shown in the flowchart of FIG. Each program is stored in the controller 102 of the control device 100 and executed by the controller 102. Hereinafter, processing of each program will be described in detail.

In the program shown in FIG. 5, in step 100 (hereinafter simply referred to as “S100”. The same applies to other steps), the controller 102 acquires a part code by the input device 114. Next, in S 102, the controller 102 acquires a vendor code and a lot number using the input device 114. In step S 104, the controller 102 determines whether the component type indicated by the acquired component code matches the component type of the target component.

If the part type indicated by the acquired part code does not match the part type of the target part, the controller 102 displays “verify NG” on the display device 112 in S106. This is because the electronic component prepared by the worker is not suitable for the mounting operation. Then, the process returns to S100.

On the other hand, if the component type indicated by the acquired component code matches the component type of the target component, in S108, the controller 102 determines whether or not the target component has been replenished. If the target part has been replenished, in S110, the controller 102 determines whether there is data stored in association with the acquired vendor code and lot number. Specifically, map data corresponding to FIG. 4 is stored in the controller 102, and the presence or absence of data stored in association with the acquired vendor code and lot number is determined with reference to the map data. If there is data stored in association with the vendor code and lot number, in S112, the controller 102 acquires data stored in association with the vendor code and lot number. Then, the process proceeds to S116.

On the other hand, if there is no data stored in association with the vendor code and the lot number, the controller 102 acquires default data in S114. Then, the process proceeds to S116. In S116, the controller 102 executes the mounting operation using the acquired data. Thereby, the execution of this program is completed. Note that the execution of this program is also terminated when the target part is not replenished in S108.

In the programs shown in FIGS. 6 and 7, the controller 102 acquires a part code by the input device 114 in S200. Next, in S 202, the controller 102 acquires a vendor code and a lot number using the input device 114. In step S204, the controller 102 determines whether or not the component type indicated by the acquired component code matches the component type of the target component.

If the component type indicated by the acquired component code does not match the component type of the target component, the controller 102 displays “verify NG” on the display device 112 in S206. Then, the process returns to S200.

On the other hand, if the component type indicated by the acquired component code matches the component type of the target component, in S208, the controller 102 has data stored in association with the acquired vendor code and lot number. Judge whether or not. If there is data stored in association with the vendor code and lot number, the controller 102 acquires data stored in association with the vendor code and lot number in S210. Then, the process proceeds to S214.

On the other hand, if there is no data stored in association with the vendor code and lot number, the controller 102 acquires default data in S212. Then, the process proceeds to S214. In S 214, the controller 102 determines whether or not the acquired data supply form matches the current supply position, that is, the supply form at the supply position of the electronic component before supply. When the acquired data supply form matches the supply form at the current supply position, in S216, the controller 102 displays on the display device 112 a display indicating that the parts are supplied to the current supply position. . Then, the process proceeds to S218.

On the other hand, if the supply form of the acquired data does not match the supply form at the current supply position, in S220, the controller 102 changes the part mounting process to a process subsequent to the scheduled process. Determine whether it is possible. Specifically, it is determined whether or not the target component can be supplied in the target component data supply form in the target mounting machine and the mounting machine arranged on the downstream side of the target mounting machine. If the component mounting process cannot be changed to a process subsequent to the scheduled process, the process returns to S206.

On the other hand, if the component mounting process can be changed to a process subsequent to the scheduled process, the controller 102 displays the changed supply position on the display device 112 in S222. Specifically, in the target mounting machine and the mounting machine arranged on the downstream side of the target mounting machine, a supply position at which the target part can be supplied in the target part data supply form is displayed on the display device 112. In S224, the controller 102 sets the flag value of the supply position change flag to 1, and proceeds to S218. The supply position change flag is a flag indicating whether or not the supply position of the target part has been changed. When the flag value of the flag is 1, the supply position change flag indicates that the supply position of the target part has been changed. When the value is 0, it indicates that the supply position of the target part has not been changed.

In S218, the controller 102 determines whether or not the target part has been replenished. When the target part has been replenished, in S226, the controller 102 determines whether or not the flag value of the supply position change flag is 1. If the flag value of the supply position change flag is 1, in S228, the controller 102 uses the acquired data regarding the electronic component to apply the mounting work program corresponding to the mounting work at the changed supply position. Make a change. Then, the mounting operation is executed according to the changed program. Thereby, the execution of this program is completed.

On the other hand, when the flag value of the supply position change flag is 0, in S230, the controller 102 executes the mounting operation using the acquired data. Thereby, the execution of this program is completed. Note that the execution of this program also ends when the target part is not replenished in S218.

In the program shown in FIG. 8, in S300, the controller 102 determines whether or not an electronic component has been replenished at an arbitrary position. When an electronic component is replenished at an arbitrary position, the controller 102 acquires a component code by the input device 114 in S302. In step S 304, the controller 102 acquires a vendor code and a lot number using the input device 114. In step S306, the controller 102 determines whether the supplied electronic component is a target component. That is, it is determined whether or not the component type indicated by the acquired component code matches the component type of the target component.

When the replenished electronic component is the target component, in S308, the controller 102 determines whether or not the replenishment position of the component is after the mounting machine before replenishment. When the replenishment position of the part is after the pre-replenishment mounting machine, in S310, the controller 102 determines whether or not the replenishment target part remains. That is, it is determined whether or not the mounting work target has been switched from the component to be supplied to the component to be supplied.

If the parts to be replenished do not remain, that is, if the mounting operation target is switched from the parts to be replenished to the replenished parts, the controller 102 acquires the acquired vendor code and lot number in S312. It is determined whether there is data stored in association with. If there is data stored in association with the vendor code and lot number, in S314, the controller 102 acquires data stored in association with the vendor code and lot number. Then, the process proceeds to S318.

On the other hand, if there is no data stored in association with the vendor code and the lot number, the controller 102 acquires default data in S316. Then, the process proceeds to S318. In S 318, the controller 102 changes the mounting work program corresponding to the mounting work at the new supply position using the acquired data regarding the electronic component. Then, the mounting operation is executed according to the changed program. Thereby, the execution of this program is completed.

If the electronic component is not replenished at an arbitrary position in S300, the electronic component replenished in S306 is not the target component, if the replenishment position of the component is not after the pre-replacement mounting machine in S308, the target of replenishment in S310 Execution of this program is also terminated when parts remain.

<Functional configuration of control device>
The controller 102 of the control device 100 that executes each of the above programs can be considered to have a functional configuration as shown in FIG. 3 in view of its execution processing. As can be seen from the figure, the controller 102 includes a storage unit 120, a code acquisition unit 122, a component data acquisition unit 124, a determination unit 126, and a display unit 128. The code acquisition unit 122 is a functional unit that executes the processes of S100, S102, S200, S202, S302, and S304, that is, a functional unit that acquires a part code, a vendor code, and a lot number. The component data acquisition unit 124 is a functional unit that executes the processes of S112, S114, S212, S214, S314, and S316, that is, a functional unit that acquires data related to electronic components. The determination unit 126 is a functional unit that executes the process of S214, that is, a functional unit that determines whether the acquired supply form of data matches the supply form at a predetermined supply position. The display unit 128 is a functional unit that executes the process of S222, that is, a functional unit that displays on the display device 112 a supply position that can be supplied in the acquired data supply form. The storage unit 120 is a functional unit that stores map data in which an identification code such as a vendor code and a lot number is associated with data on an electronic component for each component type.

Incidentally, in the above embodiment, the substrate work system 10 is an example of an electronic component mounting system. The control device 100 is an example of a data management device. The storage unit 120 is an example of a storage unit. The code acquisition unit 122 is an example of a code acquisition unit. The component data acquisition unit 124 is an example of a component data acquisition unit. The determination unit 126 is an example of a determination unit. The display unit 128 is an example of a notification unit. The vendor code and lot number are examples of the electronic component identification code.

In addition, this invention is not limited to the said Example, It is possible to implement in the various aspect which gave various change and improvement based on the knowledge of those skilled in the art. Specifically, for example, in the above-described embodiment, as data related to the electronic component stored in association with the vendor code or the like, all data of the electronic component, that is, data related to the appearance, the suction method, the supply form, and the like is stored in the controller 102. Although stored, only data different from the default data among all data of the electronic component may be stored. Specifically, for example, as the default data “Data 4” shown in FIG. 4, all data of electronic components, that is, data relating to appearance, suction method, supply form, and the like are stored. If the data related to the electronic component of the vendor code “X1” is the same as “Data4” except for the data related to the supply form, for example, only the data related to the supply form is stored as “Data1”. ing. When the data related to the electronic component of the vendor code “X1” is acquired, the data related to the electronic component of the vendor code “X1” is obtained by subtracting the data related to the supply form from “Data1” and “Data4”. Get as.

In the above-described embodiment, a vendor code and a lot number are used as the electronic component identification code. However, various codes such as a code indicating a manufacturing date and a code arbitrarily set by the user can be used. is there. Examples of codes arbitrarily set by the user include various codes such as codes set in accordance with characteristics of electronic components, for example, resistance value ranges.

Further, in the above embodiment, the component code or the like is obtained directly from the taped component or the like, but it can also be obtained indirectly. Specifically, for example, when a serial number or the like is written on a taped component, the serial number and a component code are associated with each other. Therefore, a serial number may be acquired, and a component code associated with the serial number, that is, a component type may be acquired.

In addition, the control device 100 that controls the operation of the substrate working system 10 stores and manages data related to electronic components, but is a dedicated data management device for storing and managing data related to electronic components. May be provided.

10: On-board work system (electronic component mounting system) 100: Control device (data management device) 120: Storage unit 122: Code acquisition unit 124: Component data acquisition unit 126: Judgment unit 128: Display unit (notification unit)

Claims

In a data management device that manages data related to electronic components used in an electronic component mounting system that performs mounting work of electronic components on a circuit board,
The data management device is
A storage unit capable of storing a plurality of data related to electronic components associated with an electronic component identification code given at the time of electronic component manufacture for each electronic component type, and
A code acquisition unit for acquiring a component code indicating a component type of the electronic component and the electronic component identification code;
A component data acquisition unit that acquires target component data that is data related to the electronic component stored in the storage unit in association with the component code acquired by the code acquisition unit and the electronic component identification code; A data management apparatus comprising:
The target part data is
Including data on the supply form of electronic components,
The data management device is
The electronic component mounting system includes a determination unit that determines whether an electronic component supply form at a predetermined supply position matches a target component supply form that is an electronic component supply form indicated by the target component data. The data management apparatus according to claim 1.
The data management device is
When the electronic component supply form at a predetermined supply position of the electronic component mounting system does not match the target component supply form, the supply position of the electronic component mounting system that matches the target component supply form is notified. The data management apparatus according to claim 2, further comprising a notification unit.
The component data acquisition unit
Acquiring the target component data when the component type of the electronic component indicated by the component code acquired by the information acquisition unit is the component type of the electronic component required for the mounting operation in the electronic component mounting system; The data management device according to claim 1, wherein the data management device is a data management device.
In a data management device that manages data related to electronic components used in an electronic component mounting system that performs mounting work of electronic components on a circuit board,
The data management device is
For each component type of electronic component, a storage unit that stores data related to the supply form of the electronic component,
A code acquisition unit for acquiring a component code indicating a component type of the electronic component;
A component data acquisition unit that acquires data relating to a supply form of an electronic component according to the component code acquired by the code acquisition unit;
A determination unit that determines whether or not an electronic component supply form at a predetermined supply position of the electronic component mounting system matches an electronic component supply form indicated by the data acquired by the component data acquisition unit; A data management apparatus comprising: