WO2014123139A1 - Short-circuit element and circuit using same - Google Patents

Short-circuit element and circuit using same Download PDF

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Publication number
WO2014123139A1
WO2014123139A1 PCT/JP2014/052634 JP2014052634W WO2014123139A1 WO 2014123139 A1 WO2014123139 A1 WO 2014123139A1 JP 2014052634 W JP2014052634 W JP 2014052634W WO 2014123139 A1 WO2014123139 A1 WO 2014123139A1
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WO
WIPO (PCT)
Prior art keywords
short
electrode
circuit element
switch
fuse
Prior art date
Application number
PCT/JP2014/052634
Other languages
French (fr)
Japanese (ja)
Inventor
吉弘 米田
Original Assignee
デクセリアルズ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2013125078A external-priority patent/JP6246503B2/en
Priority claimed from JP2013125079A external-priority patent/JP6161967B2/en
Priority claimed from JP2013125077A external-priority patent/JP6254777B2/en
Application filed by デクセリアルズ株式会社 filed Critical デクセリアルズ株式会社
Priority to CN201480007625.9A priority Critical patent/CN105027252B/en
Priority to KR1020157024285A priority patent/KR102115999B1/en
Publication of WO2014123139A1 publication Critical patent/WO2014123139A1/en
Priority to US14/819,328 priority patent/US9953793B2/en
Priority to US14/818,862 priority patent/US9899179B2/en
Priority to US14/819,061 priority patent/US9953792B2/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H61/00—Electrothermal relays
    • H01H61/02—Electrothermal relays wherein the thermally-sensitive member is heated indirectly, e.g. resistively, inductively
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/572—Means for preventing undesired use or discharge
    • H01M50/574—Devices or arrangements for the interruption of current
    • H01M50/583—Devices or arrangements for the interruption of current in response to current, e.g. fuses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/572—Means for preventing undesired use or discharge
    • H01M50/574—Devices or arrangements for the interruption of current
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
    • H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
    • H01H37/767—Normally open
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/05—Accumulators with non-aqueous electrolyte
    • H01M10/052—Li-accumulators
    • H01M10/0525—Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M2200/00—Safety devices for primary or secondary batteries
    • H01M2200/10—Temperature sensitive devices
    • H01M2200/103—Fuse
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M2200/00—Safety devices for primary or secondary batteries
    • H01M2200/10—Temperature sensitive devices
    • H01M2200/108—Normal resistors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • the present invention relates to a short-circuit element that eliminates only abnormal parts in an electronic device using a short-circuit element provided with a heating resistor and a fuse element on a substrate, and a circuit using the same.
  • a battery pack incorporates a number of protection circuits such as overcharge protection and overdischarge protection, It has a function of shutting off the output of the battery pack in a predetermined case.
  • Some types of protection elements perform overcharge protection or overdischarge protection operation of the battery pack by turning on / off the output using an FET switch built in the battery pack.
  • FET switch When the FET switch is short-circuited for some reason, a lightning surge or the like is applied and an instantaneous large current flows, or the output voltage drops abnormally due to the life of the battery cell, or excessively abnormal Even when the voltage is output, the battery pack and the electronic device must be protected from accidents such as ignition. Therefore, in order to safely shut off the output of the battery cell in any possible abnormal state, a protection element made of a fuse element having a function of cutting off the current path by an external signal is used. .
  • a protection element of a protection circuit for such a lithium ion secondary battery or the like As a protection element of a protection circuit for such a lithium ion secondary battery or the like, as described in Patent Document 1, a first electrode on a current path, a conductor layer connected to a heating element, a second electrode Some fusible conductors are connected to form part of the current path, and the fusible conductor on the current path is melted by self-heating due to overcurrent or by a heating element provided inside the protective element. . In such a protection element, the molten liquid soluble conductor is collected on the conductor layer connected to the heating element, thereby interrupting the current path.
  • a configuration has been proposed in which a short-circuit element is connected in parallel to each of the LED elements connected in series, and when the LED is abnormal, the short-circuit element is short-circuited at a predetermined voltage to emit a normal LED.
  • Patent Document 2 a plurality of elements each having a predetermined thickness of an insulating barrier layer sandwiched between metals are connected in series.
  • HEV Hybrid Electric Vehicle
  • EV Electric Vehicle
  • a lithium ion secondary battery has been used from the viewpoint of energy density and output characteristics.
  • a high voltage and a large current are required.
  • dedicated cells that can withstand high voltages and large currents have been developed, but in many cases due to manufacturing cost problems, it is necessary to connect multiple battery cells in series and in parallel to use general-purpose cells. Secures the correct voltage and current.
  • the resistance value when 10 V is applied is as high as about 17 K ⁇ , and the resistance value is further increased in order to bypass the open LED element efficiently. Lowering is desired.
  • the present invention eliminates only abnormal battery cells in a battery pack composed of a plurality of cells, and in a protective element that can effectively use normal battery cells, a short-circuit element that can form a bypass path, and the same
  • An object of the present invention is to provide a circuit using this.
  • a short-circuit element includes an insulating substrate, a heating resistor provided on the insulating substrate, and first and second electrodes provided adjacent to each other on the insulating substrate. Between the first electrode and the third electrode, the third electrode provided on the insulating substrate adjacent to the first electrode, and electrically connected to the heating resistor. Provided with a first soluble conductor that melts the current path between the first and third electrodes by heating from the heating resistor, and the heating resistor. The first electrode and the second electrode are short-circuited by the first soluble conductor that is melted by heating from the first electrode and aggregated on the first and second electrodes. is there.
  • the short-circuit element circuit includes a fuse, a heating resistor connected to one end of the fuse, and a switch connected to the other end of the fuse to which the heating resistor is not connected.
  • the switch is short-circuited in conjunction with the fusing of the fuse.
  • the compensation circuit includes a fuse, a heating resistor connected to one end of the fuse, and a switch connected to the other end of the fuse to which the heating resistor is not connected.
  • the switch includes a short-circuit element that is short-circuited in conjunction with the fusing of the fuse and an electronic component, and the switch has both terminals connected in parallel to the electronic component, and the open terminal of the heating resistor is the The switch terminal is connected to a terminal to which the fuse is not connected, and when the electronic component is abnormal, the fuse is melted to short-circuit the switch, thereby forming a bypass current path that bypasses the electronic component. It is.
  • the compensation circuit includes a fuse, a heating resistor connected to one end of the fuse, and a switch connected to the other end of the fuse to which the heating resistor is not connected.
  • the switch is connected to a short-circuit element that is short-circuited in conjunction with the melting of the fuse, an electronic component, and a current path of the electronic component, and interrupts energization of the electronic component with an electrical signal when the electronic component is abnormal
  • a protection element that detects an abnormality of the electronic component and outputs an abnormality signal
  • a control element that operates in response to the abnormality signal of the protection component, and includes both ends of the electronic component and the protection element.
  • Both terminals of the switch are connected in parallel, the open terminal of the heating resistor and the input terminal of the electrical signal of the protection element are connected to the control element, and when the electronic component is abnormal, the protection unit
  • the control element operates in response to an abnormal signal from the protective element, the current path of the electronic component is cut off by the protection element, and the switch is short-circuited in conjunction with the fusing of the fuse to form a bypass current path It is.
  • the short-circuit element circuit includes a fuse, a heating resistor connected to one end of the fuse, a switch connected to the other end of the fuse to which the heating resistor is not connected, and the switch And a protective resistor connected to at least one of the terminals, and the switch is short-circuited in conjunction with the fusing of the fuse.
  • the compensation circuit according to the present invention includes a fuse, a heating resistor connected to one end of the fuse, a switch connected to the other end of the fuse not connected to the heating resistor, A protection resistor connected to a terminal to which the fuse is not connected, and the switch includes a short-circuit element that is short-circuited in conjunction with the melting of the fuse, and an electronic component, The terminal to which the fuse is connected and the open terminal of the protective resistor and the electronic component are connected in parallel, and the heating resistor is connected to the protective resistor, and when the electronic component is abnormal, the fuse is By melting, the switch is turned on, and a bypass current path is formed.
  • the compensation circuit includes a fuse, a heating resistor connected to one end of the fuse, a switch connected to the other end of the fuse not connected to the heating resistor, A protection resistor connected to a terminal to which the fuse is not connected, and the switch includes a short-circuit element that is short-circuited in conjunction with the melting of the fuse, an electronic component, and a current of the electronic component A protection element that is connected on the path and that interrupts energization of the electronic component with an electric signal when the electronic component is abnormal; a protective component that detects an abnormality of the electronic component and outputs an abnormal signal; and A control element that operates in response to an abnormal signal, and connects both ends of the electronic component and the protection element, a connection terminal to the fuse of the switch, and the protection resistor in parallel, and An open terminal of a resistor and an input terminal of the electrical signal of the protective element are connected to the control element, and when the electronic component is abnormal, the control element is operated in response to an abnormal signal from the protective component, By interrupt
  • the mounting body according to the present invention is a mounting body in which the short-circuit element is mounted on the mounting target, and the short-circuit element is formed on the insulating substrate, the heating resistor provided on the insulating substrate, and the insulating substrate.
  • First and second electrodes provided adjacent to each other; and a third electrode provided on the insulating substrate adjacent to the first electrode and electrically connected to the heating resistor;
  • a first current path is formed between the first and third electrodes to form a current path, and the current path between the first and third electrodes is fused by heating from the heating resistor.
  • a first external connection electrode that is formed on the same surface as the surface on which the first and second electrodes of the insulating substrate are formed, and is continuous with the first electrode, and the second electrode.
  • a second external connection electrode that is continuous with the first electrode.
  • a second external connection terminal connected to the mounting object via a first external connection terminal connected on the external connection electrode, and the second electrode connected to the second external connection electrode.
  • the first electrode and the first electrode are connected by the first soluble conductor that is connected to the mounting object through the heating resistor, melted by heating from the heating resistor, and aggregated on the first and second electrodes.
  • the combined resistance of the first external connection terminal and the second external connection terminal is lower than the conduction resistance between the first and second external connection electrodes when the second electrode is short-circuited. It is characterized by.
  • a short-circuit element according to the present invention is provided adjacent to each other on an insulating substrate, first and second heating resistors formed on the insulating substrate, and the insulating substrate.
  • the first and second electrodes, the third electrode provided on the insulating substrate adjacent to the first electrode, and electrically connected to the first heating resistor, and the insulation Provided adjacent to the second electrode on the substrate, and provided between the fourth electrode electrically connected to the second heating resistor and the first and third electrodes.
  • a first fusible conductor that cuts off the current path between the first and third electrodes by heating from the first heating resistor, and the second and fourth Current path is formed by being provided between the electrodes, and the second heating resistor is formed.
  • a second fusible conductor that melts the current path between the second and fourth electrodes, and melts by heating from the first and second heating resistors. 1.
  • the first electrode and the second electrode are short-circuited by the first and second soluble conductors aggregated on the second electrode.
  • the short-circuit element circuit includes a switch, a first fuse connected to one end of the switch, a second fuse connected to the other end of the switch, and the first fuse.
  • a first heating resistor connected to the other end opposite to the one end connected to the switch; and a second heating resistor connected to the other end opposite to the one end connected to the switch of the second fuse.
  • the switch has a heating resistor, and the switch is short-circuited by the molten conductor of the first and second fuses when the first and second fuses are blown.
  • the compensation circuit includes a switch, a first fuse connected to one end of the switch, a second fuse connected to the other end of the switch, and the switch of the first fuse.
  • a first heating resistor connected to the other end opposite to the one end connected to the second end, and a second heat generation connected to the other end opposite to the one end connected to the switch of the second fuse.
  • the switch includes a short-circuit element that is short-circuited by the molten conductor of the first and second fuses when the first and second fuses are blown, an electronic component, and the above-described switch
  • a protection element that is connected on the current path of the electronic component and that cuts off the energization of the electronic component with an electric signal when the electronic component is abnormal; a protective component that detects an abnormality of the electronic component and outputs an abnormal signal; Abnormal signal of the above protection parts First to third control elements that operate in parallel, both ends of the electronic component and the protection element, and both terminals of the switch are connected in parallel, and the first and second heating resistors, And the electrical signal input terminal of the protection element are connected to the first to third control elements, respectively, and when the electronic component is abnormal, the abnormality signal from the protection component is received and the first to third control elements are received.
  • the control element operates, the current path of the electronic component is cut off by the protection element, and the switch is short-circuited in conjunction with the fusing
  • the compensation circuit includes a switch, a first fuse connected to one end of the switch, a second fuse connected to the other end of the switch, and the switch of the first fuse.
  • a first heating resistor connected to the other end opposite to the one end connected to the second end, and a second heat generation connected to the other end opposite to the one end connected to the switch of the second fuse.
  • the switch includes a short-circuit element that is short-circuited by the molten conductor of the first and second fuses when the first and second fuses are blown, an electronic component, and the above-described switch
  • a protection element that is connected on the current path of the electronic component and that cuts off the energization of the electronic component with an electric signal when the electronic component is abnormal; a protective component that detects an abnormality of the electronic component and outputs an abnormal signal; Abnormal signal of the above protection parts
  • First and second control elements operating in parallel, both ends of the electronic component and the protection element, and both terminals of the switch are connected in parallel, and the terminal of the first heating resistor is connected to the terminal Connected to the first control element, and connected to the second control element are electrical signal input terminals of the second heating resistor and the protection element.
  • the first and second control elements operate to interrupt the current path of the electronic component by the protection element and to short-circuit the switch in conjunction with the fusing of the first and second fuses.
  • the short-circuit element circuit includes a switch, a first fuse connected to one end of the switch, a second fuse connected to the other end of the switch, and the first fuse.
  • a first heating resistor connected to the other end opposite to the one end connected to the switch; and a second heating resistor connected to the other end opposite to the one end connected to the switch of the second fuse.
  • a heating resistor and a protective resistor connected to the switch, the switch being short-circuited by the molten conductor of the first and second fuses when the first and second fuses are blown; It is what is done.
  • the compensation circuit according to the present invention is connected to the first fuse connected to one end of the switch, the second fuse connected to the other end of the switch, and the switch of the first fuse.
  • a first heating resistor connected to the other end opposite to the other end, and a second heating resistor connected to the other end opposite to the one end connected to the switch of the second fuse.
  • a protective resistor connected to the switch, the switch being short-circuited by the molten conductor of the first and second fuses when the first and second fuses are blown.
  • an electronic component a protection element that is connected on the current path of the electronic component, and that interrupts energization of the electronic component with an electric signal when the electronic component is abnormal, and detects an abnormality of the electronic component
  • Protective parts that output First to third control elements that operate in response to an abnormality signal of the protective component, and connect both ends of the electronic component and the protective element to both terminals of the switch and the protective resistor in parallel.
  • the first and second heating resistors and the electrical signal input terminal of the protection element are connected to the first to third control elements, respectively.
  • the first to third control elements operate to interrupt the current path of the electronic component by the protection element and to short-circuit the switch in conjunction with the fusing of the first and second fuses. And a bypass current path is formed.
  • the compensation circuit includes a switch, a first fuse connected to one end of the switch, a second fuse connected to the other end of the switch, and the switch of the first fuse.
  • a first heating resistor connected to the other end opposite to the one end connected to the second end, and a second heat generation connected to the other end opposite to the one end connected to the switch of the second fuse.
  • a first control element and a second control element that operate in response to an abnormality signal of the protection part, and both ends of the electronic part and the protection element, both terminals of the switch, and the protection resistor are arranged in parallel.
  • the terminal of the first heating resistor is connected to the first control element, and the input terminals of the electrical signals of the second heating resistor and the protection element are connected to the second control element.
  • the first and second control elements are operated in response to an abnormal signal from the protective component, and the current path of the electronic component is blocked by the protective element, and the first The switch is short-circuited in conjunction with the fusing of the second fuse, thereby forming a bypass current path.
  • the mounting body according to the present invention is a mounting body in which the short-circuit element is mounted on the mounting target, wherein the short-circuit element includes an insulating substrate, and first and second heating resistors formed on the insulating substrate.
  • the first and second electrodes provided adjacent to each other on the insulating substrate, and provided on the insulating substrate adjacent to the first electrode and electrically connected to the first heating resistor.
  • a first current path is formed between the first and third electrodes to form a current path, and the current path between the first and third electrodes is blown by heating from the first heating resistor.
  • a second fusible conductor that forms a flow path and blows off the current path between the second and fourth electrodes by heating from the second heating resistor; and A first external connection electrode that is formed on the same surface as the surface on which the second electrode is formed and that is continuous with the first electrode; and a second external connection electrode that is continuous with the second electrode, and The first electrode is connected to the mounting object via a first external connection terminal connected to the first external connection electrode, and the second electrode is connected to the second external connection electrode. The second object is connected to the mounting object via the second external connection terminal, melted by heating from the first and second heating resistors, and aggregated on the first and second electrodes. 1.
  • the first electrode and the second electrode are short-circuited by the second soluble conductor, 1, than the conduction resistance between the second electrode for external connection, and is characterized in that the combined resistance between the first external connection terminal and the second external connection terminals is low.
  • a short-circuit element according to the present invention is provided adjacent to each other on an insulating substrate, first and second heating resistors formed on the insulating substrate, and the insulating substrate.
  • the first soluble conductor for fusing the path, and the second to the fourth electrodes, and the above 5 is provided across the five electrodes to form a current path, and by heating from the second heating resistor, between the second electrode and the fourth electrode, and the fourth electrode, A second fusible conductor that melts each current path between the first electrode and the fifth electrode, and is melted by heating from the first and second heating resistors.
  • the first and second soluble conductors agglomerated on the electrode short-circuit the first electrode and the second electrode.
  • the short-circuit element circuit includes a switch, a first fuse connected to one end of the switch, a first heating resistor connected to an open end of the first fuse, and the switch Second and third fuses connected in series to the open end of the first and second heating resistors connected to the connection point of the second and third fuses, and the second heating resistor
  • the second and third fuses are blown by the heat generation of the first fuse, and the first fuse is blown by the heat generation of the first heating resistor, whereby the switch is short-circuited by the molten conductor of the first fuse. It is what is done.
  • the compensation circuit includes a switch, a first fuse connected to one end of the switch, a first heating resistor connected to the open end of the first fuse, and the switch.
  • a second and third fuse connected in series with the open end; and a second heating resistor connected to a connection point of the second and third fuses;
  • the second and third fuses are blown by heat generation, and the first fuse is blown by heat generation of the first heating resistor, whereby the switch is short-circuited by the molten conductor of the first fuse.
  • a short circuit element an electronic component, a protective component that detects an abnormality of the electronic component and outputs an abnormal signal, and first and second control elements that operate in response to the abnormal signal of the protective component,
  • the second and third fuses and the electrons Are connected in series to form a current path, the connection point between the switch and the first fuse is bypassed to the open end of the electronic component, and the first heating resistor is opened.
  • the first control element is connected to the end, the second control element is connected to the open end of the second heating resistor, and when the electronic component is abnormal, an abnormal signal is received from the protective component.
  • the first and second control elements operate to cut off the current path of the electronic component and short the switch in conjunction with the fusing of the first fuse, thereby forming a bypass current path. .
  • the short-circuit element circuit includes a switch, a first fuse connected to one end of the switch, a first heating resistor connected to an open end of the first fuse, and the switch And a protective resistor connected to a connection point of the first fuse, a second and third fuse connected in series with the open end of the switch, and a connection point of the second and third fuses.
  • a second heat generating resistor connected, the second and third fuses are blown by heat generated by the second heat generating resistor, and the first fuse is generated by heat generated by the first heat generating resistor. Is blown, the switch is short-circuited by the molten conductor of the first fuse.
  • the compensation circuit includes a switch, a first fuse connected to one end of the switch, a first heating resistor connected to an open end of the first fuse, and the switch.
  • a protective resistor connected to the connection point with the first fuse, a second and third fuse connected in series with the open end of the switch, and a connection point between the second and third fuses.
  • the second heat generating resistor, the second and third fuses are blown by the heat generated by the second heat generating resistor, and the first fuse is heated by the heat generated by the first heat generating resistor.
  • First and second control elements, the second and third fuses and the electronic component are connected in series to form a current path, and the open end of the protective resistor is the open end of the electronic component Connecting the first control element to the open end of the first heating resistor, connecting the second control element to the open end of the second heating resistor,
  • the first and second control elements operate in response to an abnormal signal from the protective component, and are linked to the interruption of the current path of the electronic component and the fusing of the first fuse.
  • the switch is short-circuited to form a bypass current path.
  • the mounting body according to the present invention is a mounting body in which the short-circuit element is mounted on the mounting target, wherein the short-circuit element includes an insulating substrate, and first and second heating resistors formed on the insulating substrate.
  • the first and second electrodes provided adjacent to each other on the insulating substrate, and provided on the insulating substrate adjacent to the first electrode and electrically connected to the first heating resistor.
  • a third electrode connected to the second substrate; a fourth electrode provided on the insulating substrate adjacent to the second electrode; and electrically connected to the second heating resistor;
  • a current path is formed by being provided between the first electrode and the third electrode, and by heating from the first heating resistor, A first soluble conductor for fusing the current path between the first and third electrodes;
  • a current path is formed by being provided across the fifth electrode from the second through the fourth electrode, and the second electrode and the second electrode are heated by the second heating resistor.
  • a second soluble conductor that blows off each of the current paths between the fourth electrode and between the fourth electrode and the fifth electrode, and the first and second electrodes of the insulating substrate.
  • the combined resistance of the first external connection terminal and the second external connection terminal is lower than the conduction resistance between the second external connection electrodes.
  • the insulated first electrode and the second electrode are short-circuited by the molten conductor that is melted by heating from the heating resistor and aggregated on the first and second electrodes.
  • a new bypass current path can be formed.
  • the first electrode and the second electrode which are melted by heating from the first and second heating resistors and are insulated by the molten conductor aggregated on the first and second electrodes.
  • a new bypass current path can be formed.
  • FIG. 1 It is a figure which shows the short circuit element to which this invention was applied, (A) is a top view, (B) is sectional drawing. It is a circuit diagram of a short circuiting element, (A) shows a state where the switch is turned off, and (B) shows a state where the switch is short-circuited. It is a figure which shows the state by which the 1st, 2nd electrode which was insulated was short-circuited by the molten conductor, (A) is a top view, (B) is sectional drawing. It is a top view which shows the state which the 2nd soluble conductor melt
  • FIG. 1 It is a figure which shows the other short circuit element to which this invention was applied, (A) shows the state after melt
  • FIG. 1 It is a figure which shows a protection element, (A) is sectional drawing, (B) is a top view. It is a circuit diagram of a protection element. It is a top view which shows the short circuit element which incorporated the protective resistance. It is a circuit diagram of a short circuit element incorporating a protective resistor. It is a circuit diagram of the LED illuminating device using the short circuit element which incorporated the protective resistance. It is a circuit diagram of a battery pack using a short-circuit element incorporating a protective resistor. It is a figure which shows the short circuit element to which this invention was applied, (A) is a top view, (B) is sectional drawing.
  • FIG. 1 It is a circuit diagram of a short circuiting element, (A) shows a state where the switch is turned off, and (B) shows a state where the switch is short-circuited. It is a figure which shows a short circuit element, (A) is a top view which shows the state by which the insulated 1st, 2nd electrode was short-circuited by the molten conductor, (B) is sectional drawing. In a short circuiting element, it is a top view showing the state where the 2nd soluble conductor has melted previously. It is sectional drawing which shows the modification of a short circuit element. It is sectional drawing which shows the modification of a short circuit element. It is sectional drawing which shows the modification of a short circuit element. It is sectional drawing which shows the modification of a short circuit element.
  • FIG. 4 is a circuit diagram of a battery pack using a short-circuit element, where (A) is normal, (B) is a state in which a protection element is operated, and (C) and (D) are operating a short-circuit element to form a bypass current path Indicates the state. It is a figure which shows a protection element, (A) is sectional drawing, (B) is a top view.
  • a short circuiting element it is a top view showing the state where the 2nd soluble conductor melted first. It is a figure which shows a short circuit element, (A) is a top view which shows the state by which the insulated 1st, 2nd electrode was short-circuited by the molten conductor, (B) is sectional drawing. It is sectional drawing which shows the modification of a short circuit element. It is sectional drawing which shows the modification of a short circuit element. It is sectional drawing which shows the modification of a short circuit element.
  • FIG. 1 It is sectional drawing which shows the other short circuit element to which this invention was applied, (A) shows the state after melt
  • FIG. 1A shows a plan view of the short-circuit element 1
  • FIG. 1B shows a cross-sectional view of the short-circuit element 1.
  • the short-circuit element 1 includes an insulating substrate 2, a heating resistor 3 provided on the insulating substrate 2, a first electrode 4 and a second electrode 5 provided adjacent to each other on the insulating substrate 2, and a first element A third electrode 6 provided adjacent to the first electrode 4 and electrically connected to the heating resistor 3; a fourth electrode 7 provided adjacent to the second electrode 5;
  • the first current path is formed between the third electrodes 4 and 6 and the current path between the first and third electrodes 4 and 6 is blown by heating from the heating resistor 3.
  • the second conductor 4 is provided between the fusible conductor 8 and the second and fourth electrodes 5 and 7, and melts the current path between the second and fourth electrodes 5 and 7 by heating from the heating resistor 3. 2 soluble conductors 9.
  • a cover member 10 that protects the inside is attached on the insulating substrate 2.
  • the insulating substrate 2 is formed in a substantially square shape using an insulating member such as alumina, glass ceramics, mullite, zirconia, and the like.
  • the insulating substrate 2 may be made of a material used for a printed wiring board such as a glass epoxy board or a phenol board, but it is necessary to pay attention to the temperature at which the fuse is blown.
  • the insulating substrate 2 has external terminals 12 formed on the back surface.
  • the heating resistor 3 is a conductive member that has a relatively high resistance value and generates heat when energized, and is made of, for example, W, Mo, Ru, or the like. These alloys, compositions, or compound powders are mixed with a resin binder or the like to form a paste on the insulating substrate 2 by patterning using a screen printing technique and firing.
  • the heating resistor 3 is covered with an insulating layer 11 on the insulating substrate 2.
  • the insulating layer 11 is provided to efficiently transmit the heat of the heating resistor 3 to the first to fourth electrodes 4 to 7, and is made of, for example, a glass layer.
  • the heating resistor 3 can easily aggregate the molten conductor by heating the first to fourth electrodes 4 to 7.
  • first to fourth electrodes 4, 5, 6, and 7 are formed on the insulating layer 11 covering the heating resistor 3.
  • the first electrode 4 is formed adjacent to the second electrode 5 on one side and insulated.
  • a third electrode 6 is formed on the other side of the first electrode 4.
  • the first electrode 4 and the third electrode 6 are electrically connected by connecting a first soluble conductor 8 to be described later, and constitute a current path of the short-circuit element 1.
  • the first electrode 4 is formed with a first electrode terminal portion 4 a that faces the side surface of the insulating substrate 2.
  • the first electrode terminal portion 4a is connected to an external terminal 12 provided on the back surface of the insulating substrate 2 through a through hole.
  • the third electrode 6 is connected to the heating resistor 3 through the heating element lead electrode 13 provided on the insulating substrate 2 or the insulating layer 11. Further, the heating resistor 3 is formed with a resistor terminal portion 3 a that faces the side edge of the insulating substrate 2 through the heating element lead-out electrode 13. The resistor terminal portion 3a is connected to an external terminal 12 provided on the back surface of the insulating substrate 2 through a through hole.
  • a fourth electrode 7 is formed on the other side of the second electrode 5 opposite to the one side adjacent to the first electrode 4.
  • a second soluble conductor 9 described later is connected to the second electrode 5 and the fourth electrode 7.
  • the second electrode 5 is formed with a second electrode terminal portion 5 a facing the side surface of the insulating substrate 2.
  • the second electrode terminal portion 5a is connected to an external terminal 12 provided on the back surface of the insulating substrate 2 through a through hole.
  • the first to fourth electrodes 4, 5, 6, and 7 can be formed using a general electrode material such as Cu or Ag, but at least the first and second electrodes 4, 5 are formed.
  • a coating such as Ni / Au plating, Ni / Pd plating, or Ni / Pd / Au plating is preferably formed on the surface by a known plating process. Thereby, oxidation of the 1st, 2nd electrodes 4 and 5 can be prevented, and a molten conductor can be hold
  • a solder that connects the first and second soluble conductors 8 and 9 or a low melting point metal that forms an outer layer of the first and second soluble conductors 8 and 9 is used. By melting, the first and second electrodes 4 and 5 can be prevented from being melted (soldered) and cut.
  • the first and second fusible conductors 8 and 9 are made of a low melting point metal that is quickly melted by the heat generated by the heating resistor 3, and, for example, Pb-free solder containing Sn as a main component can be suitably used.
  • the first and second soluble conductors 8 and 9 may contain a low melting point metal and a high melting point metal.
  • the low melting point metal it is preferable to use solder such as Pb-free solder, and as the high melting point metal, it is preferable to use Ag, Cu or an alloy containing these as a main component.
  • the first and second fusible conductors 8 and 9 may be formed by depositing a low melting point metal on a high melting point metal using a plating technique, and other well-known lamination techniques and film forming techniques may be used. You may form by using.
  • the first and second soluble conductors 8 and 9 are connected to the first and third electrodes 4 and 6 or the second and fourth electrodes 5 and 7 by using a low melting point metal constituting the outer layer. Can be soldered.
  • the first and second fusible conductors 8 and 9 may have an inner layer made of a low melting point metal and an outer layer made of a high melting point metal.
  • a soluble conductor in which the entire surface of the inner low melting point metal layer is covered with the outer high melting point metal layer, even when using a low melting point metal having a melting point lower than the reflow temperature, the inner layer has a low Outflow of the melting point metal to the outside can be suppressed. Further, when the inner layer low melting point metal melts, the outer layer high melting point metal is also eroded (soldered) and can be quickly melted.
  • first and second soluble conductors 8 and 9 may have a covering structure in which the inner layer is made of a high melting point metal and the outer layer is made of a low melting point metal.
  • the inner layer is made of a high melting point metal
  • the outer layer is made of a low melting point metal.
  • the first and second soluble conductors 8 and 9 may have a laminated structure in which a low melting point metal layer and a high melting point metal layer are laminated. Moreover, it is good also as a multilayered structure of four or more layers by which the low melting metal layer and the high melting metal layer were laminated
  • the first and second soluble conductors 8 and 9 may be composed of a high melting point metal having a large number of openings and a low melting point metal inserted into the openings.
  • the area of the refractory metal layer in contact with the molten low melting point metal layer increases, so that the low melting point metal layer can erode the refractory metal layer in a shorter time. Therefore, the soluble conductor can be blown out more quickly and reliably.
  • the first and second soluble conductors 8 and 9 have a volume of the low melting point metal larger than that of the high melting point metal. Thereby, the 1st, 2nd soluble conductors 8 and 9 can perform fusing in a short time by the corrosion of a refractory metal layer effectively.
  • the first and second possible conductors 8 and 9 are used.
  • a flux 15 is applied on the molten conductors 8 and 9.
  • the inside of the short-circuit element 1 is protected by covering the insulating substrate 2 with the cover member 10.
  • the cover member 10 has a side wall 16 that constitutes a side surface of the short-circuit element 1 and a top surface portion 17 that constitutes an upper surface of the short-circuit element 1, and the short-circuit element 1 is connected to the side wall 16 on the insulating substrate 2. It becomes a lid that closes the inside of the.
  • the cover member 10 is formed using an insulating member such as a thermoplastic, ceramic, glass epoxy substrate, etc., as with the insulating substrate 2.
  • the cover member 10 may have a cover electrode 18 formed on the inner surface side of the top surface portion 17.
  • the cover part electrode 18 is formed at a position overlapping the first and second electrodes 4 and 5.
  • the cover electrode 18 has a molten conductor aggregated on the first and second electrodes 4 and 5.
  • the short-circuit element 1 as described above has a circuit configuration as shown in FIGS. That is, in the short-circuit element 1, the first electrode 4 a and the second electrode 5 a are normally insulated (FIG. 2A), and the first and second soluble conductors 8 are generated by the heat generated by the heating resistor 3. , 9 constitutes a switch 20 that is short-circuited through the molten conductor (FIG. 2B). The first electrode terminal portion 4a and the second electrode terminal portion 5a constitute both terminals of the switch 20. The first fusible conductor 8 is connected to the heating resistor 3 via the third electrode 6 and the heating element lead electrode 13.
  • the short-circuit element 1 is incorporated in an electronic device or the like, whereby both terminals 4a and 5a of the switch 20 are connected in parallel with the current path of the electronic device, and the electronic component on the current path When an abnormality occurs, the switch 20 is short-circuited to form a bypass current path that bypasses the electronic component.
  • the short-circuit element 1 when an abnormality occurs in the electronic components connected in parallel, the short-circuit element 1 is supplied with electric power from the resistor terminal portion 3a side, and generates heat when the heating resistor 3 is energized. When the first and second fusible conductors 8 and 9 are melted by this heat, the molten conductors aggregate on the first and second electrodes 4 and 5 as shown in FIGS. . Since the first and second electrodes 4 and 5 are formed adjacent to each other, the agglomerated molten conductors are coupled to each other on the first and second electrodes 4 and 5, thereby the first and second electrodes 4. , 5 are short-circuited. That is, the short-circuit element 1 is short-circuited between both terminals of the switch 20 (FIG. 2B).
  • the short-circuit element 1 has a heating resistor 3 in which the overlapping area with the second soluble conductor 9 is larger than the overlapping area with the first soluble conductor 8. It is formed on the second soluble conductor 9 side so as to be wide. Thereby, although the heating resistor 3 can be heated over almost the entire surface of the second soluble conductor 9, the heating area of the first soluble conductor 8 is reduced, and as shown in FIG. The soluble conductor 9 can be melted prior to the first soluble conductor 8.
  • the short-circuit element 1 forms the second fusible conductor 9 by forming the second fusible conductor 9 narrower than the first fusible conductor 8.
  • the fusible conductor may be melted before the fusible conductor. Since the fusing time can be shortened by forming the second fusible conductor 9 narrow, the second fusible conductor 9 can be melted ahead of the first fusible conductor 8. it can.
  • the area of the first electrode 4 is preferably larger than that of the third electrode 6, and the area of the second electrode 5 is preferably larger than that of the fourth electrode 7. Since the holding amount of the molten conductor increases in proportion to the electrode area, the area of the first and second electrodes 4 and 5 is made larger than that of the third and fourth electrodes 6 and 7, thereby increasing the amount of the molten conductor.
  • the molten conductor can be agglomerated on the first and second electrodes 4 and 5, and the first and second electrodes 4 and 5 can be reliably short-circuited (FIG. 1B, FIG. 3). (B)).
  • the short-circuit element 1 does not necessarily need to cover the heating resistor 3 with the insulating layer 11, and the heating resistor 3 may be installed inside the insulating substrate 2 as shown in FIG. 6.
  • the heating resistor 3 can be heated in the same manner as when the insulating layer 11 such as a glass layer is interposed.
  • the short-circuit element 1 is shown in FIG.
  • the heating resistor 3 may be disposed on the surface of the insulating substrate 2 opposite to the surface on which the first to fourth electrodes 4, 5, 6, 7 are formed.
  • the heating resistor 3 By forming the heating resistor 3 on the back surface of the insulating substrate 2, it can be formed by a simpler process than in the insulating substrate 2.
  • the insulating layer 11 is formed on the heating resistor 3 in terms of protecting the resistor and ensuring insulation during mounting.
  • the heating resistor 3 may be disposed on the formation surface of the first to fourth electrodes 4, 5, 6, 7 of the insulating substrate 2 as shown in FIG.
  • the heating resistor 3 By forming the heating resistor 3 on the surface of the insulating substrate 2, it can be formed by a simpler process than in the insulating substrate 2.
  • the insulating layer 11 is formed on the heating resistor 3.
  • the short-circuit element according to the present invention may be formed by omitting the fourth electrode 7 and the second soluble conductor 9 of the short-circuit element 1 as shown in FIGS.
  • the first soluble conductor 8 connected between the first and third electrodes 4 and 6 is melted, so that the molten conductor wets and spreads to the second electrode 5.
  • the short-circuit element 1 is the same as that described above except that the fourth electrode 7 and the second fusible conductor 9 are omitted.
  • the first and second electrodes 4 and 5 preferably have a larger area than the third electrode 6.
  • the short-circuit element 1 can agglomerate more molten conductors on the first and second electrodes 4 and 5, and without the second soluble conductor 9, The first and second electrodes 4 and 5 can be reliably short-circuited.
  • the second electrode 5 may be provided with a second soluble conductor.
  • the second soluble conductor on the second electrode 5 is melted together with the first soluble conductor 8 by heating from the heating resistor 3, and draws the first soluble conductor 8. Thereby, the 1st electrode 4 and the 2nd electrode 5 can be short-circuited.
  • the protective resistance is a resistance value corresponding to the internal resistance of the electronic component connected to the short-circuit element.
  • the short-circuit element to which the present invention is applied is not limited to the provision of the external terminal 12 that is continuous with the first and second electrodes through the through-holes on the back surface of the insulating substrate 2, as shown in FIGS.
  • the first external connection electrode 21 that is continuous with the first electrode 4 on the surface of the insulating substrate 2 on which the first and second electrodes 4 and 5 are formed, as shown in FIG.
  • One or a plurality of first external connection terminals 22 provided on the connection electrode 21, a second external connection electrode 23 continuous with the second electrode 5, and a second external connection electrode 23 are provided.
  • one or a plurality of second external connection terminals 24 may be formed.
  • the first and second external connection electrodes 21 and 23 are electrodes that connect the short-circuit element 25 and a circuit of an electronic device in which the short-circuit element 25 is incorporated, and the first external connection electrode 21 is the same as the first electrode 4.
  • the second external connection electrode 23 is continuous with the second electrode 5.
  • the first and second external connection electrodes 21 and 23 are formed using a general electrode material such as Cu or Ag, and are the same surface as the formation surfaces of the first and second electrodes 4 and 5 of the insulating substrate 2. Is formed. That is, as for the short circuit element 25 shown in FIG. 11, the surface in which the soluble conductor 13 is provided becomes a mounting surface.
  • the first and second external connection electrodes 21 and 23 can be formed simultaneously with the first and second electrodes 4 and 5.
  • a first external connection terminal 22 is provided on the first external connection electrode 21.
  • a second external connection terminal 24 is provided on the second external connection electrode 23.
  • These first and second external connection terminals 22 and 24 are connection terminals for mounting on an electronic device, and are formed using, for example, metal bumps or metal posts. Further, as shown in FIG. 11A, the first and second external connection terminals 22 and 24 have a height protruding from the cover member 10 provided on the insulating substrate 2, and the short-circuit element 25. It can be mounted on the side of the board that is the mounting target.
  • the heating resistor 3 of the short-circuit element 25 is formed with a resistor connecting terminal 3b via the heating element lead-out electrode 13 and the resistor terminal portion 3a.
  • the resistor connection terminal 3 b is formed using a metal bump or a metal post, and protrudes upward through the insulating layer 11.
  • the short circuit element 25 is provided with the external terminal 12 on the back surface of the insulating substrate 2 like the short circuit element 1 and connects the first and second electrodes 4 and 5 and the external terminal 12 through a through hole.
  • the external connection terminals 22 and 24 are formed on the same surface as the first and second electrodes 4 and 5 via the external connection electrodes 21 and 23. Then, as shown in FIG. 11B, the short-circuit element 25 is connected between the first and second external connection electrodes 21 and 23 when the first electrode 4 and the second electrode 5 are short-circuited.
  • the combined resistance of the first external connection terminal 22 and the second external connection terminal 24 is configured to be lower than the resistance.
  • the short-circuit element 25 can improve the rating when the first and second electrodes 4 and 5 are short-circuited to form a bypass current path, and can cope with a large current. That is, in high current applications such as lithium ion secondary batteries used as power sources such as HEV and EV, further improvement of the rating of the short-circuit element is required. Then, the conduction resistance between the first and second external connection electrodes 21 and 23 short-circuited by the fusible conductor can be sufficiently lowered (for example, less than 0.4 m ⁇ ) to meet the rating improvement.
  • the first and second electrodes 4 , 5 and the external terminal 12 have a high conduction resistance (for example, 0.5 to 1.0 m ⁇ ), and even if a conductor is filled in the through hole, there is a limit to lowering the conduction resistance of the entire short-circuit element.
  • heat generated by flowing a large current between the high resistance first and second electrodes 4 and 5 and the external terminal 12 may cause damage to the bypass current path and thermal effects on other peripheral devices.
  • the short-circuit element 25 is provided with external connection terminals 22 and 24 on the same surface as the first and second electrodes 4 and 5.
  • the external connection terminals 22 and 24 are provided on the external connection electrodes 21 and 23, and a terminal having a high degree of freedom in shape and size and a low conduction resistance can be easily provided.
  • the short-circuit element 25 has a first external connection rather than a conduction resistance between the first and second external connection electrodes 21 and 23 when the first electrode 4 and the second electrode 5 are short-circuited.
  • the combined resistance of the terminal 22 and the second external connection terminal 24 is configured to be low.
  • the conduction resistance ahead of the first and second external connection electrodes 21 and 23, which are high in the configuration of the short-circuit element 1, can be easily lowered, and the rating is dramatically improved. Can be achieved.
  • first and second external connection terminals 22 and 24 for example, metal bumps or metal posts made of Pb-free solder whose main component is Sn can be used.
  • the shape of the metal bump or the metal post is not limited.
  • the resistance values of the first and second external connection terminals 22 and 24 can be obtained from the material, shape, and size. As an example, when a rectangular parallelepiped metal post (Cu core: 0.6 mm ⁇ 0.6 mm, cross-sectional area 0.36 mm 2, height 1 mm, specific resistance 17.2 ⁇ m ⁇ ⁇ mm) is used.
  • the resistance value of the Cu core of one terminal is about 0.048 m ⁇ , and the resistance value obtained by connecting the first and second external connection terminals 22 and 24 in series is as low as less than 0.096 m ⁇ in consideration of the solder coating. It can be seen that the overall rating of the short-circuit element 25 can be improved.
  • the short-circuit element 25 obtains the total resistance value of the entire element from the resistance value between the first and second external connection terminals 22 and 24 at the time of the short-circuit, and this total resistance value is known as the first and second values. From the difference with the combined resistance of the external connection terminals 22 and 24, the conduction resistance between the first and second external connection electrodes 21 and 23 at the time of short circuit can be obtained.
  • the short-circuit element 25 measures the resistance between the first and second external connection electrodes 21 and 23 at the time of short-circuit, and the first and second external elements are calculated from the difference from the total resistance value of the entire element at the time of short-circuit. The combined resistance of the connection terminals 22 and 24 can be obtained.
  • the short-circuit element 25 is widely provided by forming the first and second external connection electrodes 21 and 23 in a rectangular shape, and the first and second external connection terminals 22 and 24 are provided.
  • the conduction resistance may be lowered by providing a plurality.
  • the short-circuit element 25 reduces the conduction resistance by providing the first and second external connection terminals 22 and 24 having large diameters on the first and second external connection electrodes 21 and 23 that are widely provided. May be.
  • the first and second external connection terminals 22 and 24 may be formed by providing low melting point metal layers 22b and 24b on the surfaces of the high melting point metals 22a and 24a serving as cores.
  • the metal constituting the low melting point metal layers 22b and 24b solder such as Pb free solder containing Sn as a main component can be preferably used.
  • the high melting point metals 22a and 24a Cu or Ag is used as a main component. An alloy to be used can be preferably used.
  • the reflow temperature exceeds the melting temperature of the low melting point metal layers 22b and 24b when the short circuit element 25 is reflow mounted. Even if the metal is melted, it can be prevented from melting as the first and second external connection terminals 22 and 24.
  • the first and second external connection terminals 22 and 24 can be connected to the first and second external connection electrodes 21 and 23 using a low melting point metal constituting the outer layer.
  • the first and second external connection terminals 22 and 24 can be formed by forming a low melting point metal on the high melting point metal 22a and 24a by using a plating technique, and other known lamination techniques and films. It can also be formed by using a forming technique.
  • the first and second external connection terminals 22 and 24 are formed by a conductive plating layer or a conductive layer formed by applying a conductive paste, in addition to using metal bumps or metal posts. May be.
  • first and second external connection terminals 22 and 24 are provided in advance on the mounting object side such as a substrate on which the short-circuit element 25 is mounted, and in the mounting body on which the short-circuit element is mounted, You may make it connect with the external connection electrodes 21 and 23.
  • FIG. 13 is a diagram illustrating a circuit configuration of the LED lighting device 30 as an example of the electronic apparatus.
  • the LED lighting device 30 has a plurality of light emitting diodes 31 connected in series on the current path. Further, in the LED lighting device 30, each light emitting diode 31 and both terminals 4 a and 5 a of the switch 20 of the short-circuit element 1 are connected in parallel via the protective resistor 34, and the resistor terminal portion 3 a of the short-circuit element 1. Are connected on the current path, thereby forming the LED unit 32.
  • the LED lighting device 30 is configured by connecting a plurality of LED units 32 in series.
  • the protective resistor 34 has a resistance value corresponding to the internal resistance of the light emitting diode 31. Further, the resistance value of the heating resistor 3 is larger than the internal resistance of the light emitting diode 31. Therefore, when the light emitting diode 31 is operating normally, the LED lighting device 30 does not flow to the short-circuit element 1 side but flows to the light emitting diode 31 side as shown in FIG. 13B.
  • the LED lighting device 30 causes the current E to flow to the resistor terminal portion 3a side of the short-circuit element 1. Flowing. As a result, in the short-circuit element 1, the heating resistor 3 generates heat, the first and second soluble conductors 8 and 9 are melted, and the molten conductor is aggregated on the first and second electrodes 4 and 5. . Therefore, as shown in FIG. 13D, the short-circuit element 1 can form a bypass current path by short-circuiting both terminals 4a and 5a of the switch 20. The first and second fusible conductors 8 and 9 are fused to stop the power supply to the heating resistor 3.
  • a bypass current path that bypasses the light emitting diode 31 can be formed.
  • the lighting function can be maintained.
  • the protection resistor 34 has substantially the same resistance value as the internal resistance of the light emitting diode 31, the LED lighting device 30 can have substantially the same current value as in the normal state on the bypass current path.
  • FIG. 14 is a diagram illustrating a circuit configuration of a battery pack 40 in which a lithium ion battery used in various electronic devices such as a car and an electric tool is built.
  • the battery pack 40 ensures a high voltage and a large current by connecting a plurality of battery cells 41 in series on the current path.
  • a protection element 42 that interrupts the current path when an abnormality such as overcharge or overdischarge of the battery cell 41 is connected to each battery cell 41.
  • the protection element 42 is formed on the insulating substrate 44, the heating resistor 46 laminated on the insulating substrate 44 and covered with the insulating member 45, and both ends of the insulating substrate 44. Electrodes 47 (A 1) and 47 (A 2), a heating element extraction electrode 48 laminated on the insulating member 45 so as to overlap the heating resistor 46, and electrodes 47 (A 1) and 47 (A 2) at both ends. And a fusible conductor 49 having a central portion connected to the heating element extraction electrode 48.
  • the insulating substrate 44 is formed in a substantially rectangular shape using the same material as that of the insulating substrate 2 described above.
  • the heating resistor 46 is formed by the same manufacturing method using the same material as the heating resistor 3 described above.
  • an insulating member 45 is disposed so as to cover the heating resistor 46, and a heating element extraction electrode 48 is disposed so as to face the heating resistor 46 through the insulating member 45.
  • an insulating member 45 may be laminated between the heating resistor 46 and the insulating substrate 44.
  • One end of the heating element extraction electrode 48 is connected to the heating element electrode 50 (P1).
  • the other end of the heating resistor 46 is connected to the other heating element electrode 50 (P2).
  • the soluble conductor 49 can be the same as the first and second soluble conductors 8 and 9 described above.
  • the flux may be applied to almost the entire surface of the soluble conductor 49 in order to prevent the soluble conductor 49 from being oxidized, as in the case of the short-circuit element 1.
  • the protection element 42 may place a cover member on the insulating substrate 44 in order to protect the inside.
  • the protective element 42 as described above has a circuit configuration as shown in FIG. That is, the protection element 42 generates heat by melting the soluble conductor 49 by energizing the soluble conductor 49 connected in series via the heating element extraction electrode 48 and the connection point of the soluble conductor 49 to generate heat.
  • the circuit configuration includes a resistor 46. Of the two electrodes 47 of the protection element 42, one is connected to A1, and the other is connected to A2. Further, the heating element extraction electrode 48 and the heating element electrode 50 connected thereto are connected to P1, and the other heating element electrode 50 is connected to P2.
  • the protection element 42 is used for the circuit in the battery pack 40 of a lithium ion secondary battery, as shown to FIG. 14 (A).
  • the battery pack 40 includes a battery cell 41, a protection element 42, a short-circuit element 1, a first current control element 52 that controls the operation of the protection element 42, and a second current control that controls the operation of the short-circuit element 1.
  • a plurality of battery units 51 each including an element 53 and a protective resistor 54 are provided, and the plurality of battery units 51 are connected in series.
  • the battery pack 40 detects the voltage of the battery unit 51, the charge / discharge control circuit 55 that controls charging / discharging of the battery unit 51, and the battery cell 41 of each battery unit 51, and the protection element 42 and the short-circuit element 1. And a detection circuit 56 for outputting an abnormal signal to the first and second current control elements 52 and 53 for controlling the operation.
  • the electrode 47 (A1) of the protection element 42 is connected in series with the battery cell 41, and the electrode 47 (A2) is connected to the charge / discharge current path of the battery pack 40.
  • the second electrode terminal portion 5 a of the short-circuit element 1 is connected to the open end of the protective element 42 via the protective resistor 54, and the first electrode terminal portion 4 a is open to the battery cell 41.
  • the protection element 42 and the battery cell 41 and the short-circuit element 1 are connected in parallel.
  • the heating element electrode 50 (P2) of the protection element 42 is connected to the first current control element 52, and the resistor terminal portion 3a of the short circuit element 1 is connected to the second current control element 53. ing.
  • the detection circuit 56 is connected to each battery cell 41, detects the voltage value of each battery cell 41, and supplies each voltage value to the control unit 59 of the charge / discharge control circuit 55. Further, when the battery cell 41 becomes an overcharge voltage or an overdischarge voltage, the detection circuit 56 sends an abnormal signal to the first and second current control elements 52 and 53 of the battery unit 51 having the battery cell 41. Output.
  • the first and second current control elements 52 and 53 are constituted by, for example, field effect transistors (hereinafter referred to as FETs), and the voltage value of the battery cell 41 is set to a predetermined value by a detection signal output from the detection circuit 56.
  • FETs field effect transistors
  • the protection element 42 and the short-circuit element 1 are operated to switch the charge / discharge current path of the battery unit 51 through the third and fourth current control elements 57 and 58. Regardless of whether it is cut off, the switch 20 of the short-circuit element 1 is short-circuited, and control is performed so as to form a bypass current path that bypasses the battery unit 51.
  • the battery pack 40 is detachably connected to the charging device via the positive terminal 40a and a negative terminal (not shown), and the charging voltage from the charging device is applied to each battery cell 41.
  • the battery pack 40 charged by the charging device can operate the electronic device by connecting the positive electrode terminal 40a and the negative electrode terminal to the electronic device operated by the battery.
  • the charge / discharge control circuit 55 controls the operations of the third and fourth current control elements 57 and 58 connected in series to the current path flowing from the battery unit 51 to the charging device, and the operations of these current control elements 57 and 58.
  • the third and fourth current control elements 57 and 58 are configured by, for example, FETs, and control the gate voltage by the control unit 59 to control conduction and interruption of the current path of the battery unit 51.
  • the control unit 59 operates by receiving power supply from the charging device, and according to the detection result by the detection circuit 56, when the battery unit 51 is overdischarged or overcharged, the current control element is cut off.
  • the operations of 57 and 58 are controlled.
  • the battery pack 40 when a voltage abnormality or the like is detected in the battery cell 41, an abnormality signal is output from the detection circuit 56 to the first current control element 52, and the heating resistor 46 of the protection element 42 generates heat. . As shown in FIG. 14C, the protection element 42 heats and melts the fusible conductor 49 by the heating resistor 46, thereby blocking between the electrodes 47 (A1) and 47 (A2). Thereby, the battery unit 51 having the abnormal battery cell 41 can be shut off from the charge / discharge current path of the battery pack 40. Note that power supply to the heating resistor 46 is stopped when the fusible conductor 49 is melted.
  • the short-circuit element 1 has the first and second electrodes 4, 5 by heating and melting the first and second soluble conductors 8, 9 by the heating resistor 3.
  • the molten conductor agglomerates on the top, and the first electrode terminal portion 4a and the second electrode terminal portion 5a of the switch 20 are short-circuited.
  • the short circuit element 1 can form a bypass current path that bypasses the battery unit 51.
  • the first and second fusible conductors 8 and 9 are fused to stop the power supply to the heating resistor 3.
  • the protective resistor 54 has substantially the same resistance value as the internal resistance of the battery cell 41, so that it can have the same capacity as normal even on the bypass current path.
  • a bypass current path that bypasses the battery unit 51 can be formed and is charged by the remaining normal battery units 51.
  • the discharge function can be maintained.
  • the protection element of the present invention is not limited to use in a battery pack of a lithium ion secondary battery, and can of course be applied to various uses that require interruption of a current path and bypass by an electric signal.
  • the operating conditions of the first and second current control elements 52 and 53 and the third and fourth current control elements 57 and 58 are not limited to the case where the voltage of the battery cell 41 is abnormal. It can be activated by detecting any accident such as a sudden rise or submersion.
  • the short-circuit element may be formed by incorporating a protective resistor in advance.
  • symbol is attached
  • FIG. 17 is a plan view of the short-circuit element 60 in which the protective resistor 61 is formed on the insulating substrate 2.
  • the short-circuit element 60 includes a protective resistor 61 connected to the second electrode 5, and a second electrode terminal portion 5 a is formed via the protective resistor 61.
  • the protective resistor 61 can be formed simultaneously by the same process using the same material as the heating resistor 3 described above.
  • FIG. 18 is a diagram illustrating a circuit configuration of the short-circuit element 60.
  • the first electrode terminal portion 4 a and the second electrode terminal portion 5 a are connected via the protective resistor 61 when the switch 20 is short-circuited. That is, the circuit configuration of the short-circuit element 60 is connected to the fuses 8 and 9, the heating resistor 3 connected to one end of the fuses 8 and 9, and the other end of the fuses 8 and 9 to which the heating resistor 3 is not connected.
  • the switch 20 and a protective resistor 61 connected to at least one of the terminals of the switch 20 are provided, and the switch 20 is short-circuited in conjunction with the fusing of the fuses 8 and 9.
  • FIG. 19 is a diagram illustrating a circuit configuration of the LED lighting device 62 in which the short-circuit element 60 is incorporated.
  • the circuit configuration of the LED lighting device 62 has the same configuration as the LED lighting device 30 described above except that the short-circuit element 60 is used instead of the short-circuit element 1. That is, the circuit configuration of the LED lighting device 62 includes the short-circuit element 60 and the light-emitting diode 31 described above, the terminal 4a to which the switch 20 and the fuses 8 and 9 are connected, the open terminal 5a of the protective resistor 61, and the light-emitting diode. 31 are connected in parallel, and the heating resistor 3 is connected to the protective resistor 61.
  • the protective resistor 61 of the short-circuit element 60 has substantially the same resistance value as the internal resistance of the light emitting diode 31 of each LED unit 32.
  • a bypass current path that bypasses the light emitting diode 31 can be formed.
  • the lighting function can be maintained.
  • the protection resistor 61 has substantially the same resistance value as the internal resistance of the light emitting diode 31
  • the LED illumination device 62 can have the same current value as that in the normal state on the bypass current path.
  • FIG. 20 is a diagram illustrating a circuit configuration of the battery pack 65 in which the short-circuit element 60 is incorporated.
  • the circuit configuration of the battery pack 65 is the same as the circuit configuration of the battery pack 40 described above except that the short-circuit element 60 is used instead of the short-circuit element 1. That is, the circuit configuration of the battery pack 65 is connected to the above-described short-circuit element 60, the battery cell 41, and the current path of the battery cell 41, and the battery cell 41 is energized by an electrical signal when the battery cell 41 is abnormal.
  • a protection element 42 that shuts off, a detection circuit 56 that detects an abnormality of the battery cell 41 and outputs an abnormality signal, and first and second current control elements 52 and 53 that operate in response to the abnormality signal of the detection circuit 56; And connecting both ends of the battery cell 41 and the protection element 42 to the connection terminal 4a of the fuse 8.9 of the switch 20 and the open terminal 5a of the protection resistor 61 in parallel, and a resistor terminal portion of the heating resistor 3 3a and the input terminal P2 of the electric signal of the protection element 42 are connected to the first and second current control elements 52 and 53, and when the battery cell 41 is abnormal, an abnormal signal from the detection circuit 56 In response, the first and second current control elements 52 and 53 operate, the protection element 42 cuts off the current path of the battery cell 41, and the switch 20 is short-circuited in conjunction with the fusing of the fuses 8 and 9. A path is formed.
  • the protective resistance 61 of the short-circuit element 60 provided in each battery unit 51 has substantially the
  • a bypass current path that bypasses the battery unit 51 can be formed and charged by the remaining normal battery units 51.
  • the discharge function can be maintained.
  • the battery pack 65 can have the same current value as that in the normal state on the bypass current path because the protective resistance 61 has substantially the same resistance value as the internal resistance of the battery cell 41.
  • the external terminal 12 is provided on the back surface of the insulating substrate 2, and the first electrode terminal portion 4a and the second electrode terminal portion 5a are connected to the external terminal 12 through a through hole.
  • the first external connection electrode 21 that is continuous with the first electrode 4 the first electrode 4 is formed on the surface of the insulating substrate 2 on which the first and second electrodes 4 and 5 are formed. You may make it form the 2nd external connection electrode 23 and the 2nd external connection terminal 24 which follow the 2nd electrode 5 via the external connection terminal 22, the protective resistance 61, and.
  • FIG. 21A is a plan view of the short-circuit element 101
  • FIG. 21B is a cross-sectional view of the short-circuit element 101.
  • the short circuit element 101 includes an insulating substrate 102, a first heating resistor 121 and a second heating resistor 122 provided on the insulating substrate 102, and a first electrode provided adjacent to the insulating substrate 102.
  • 104, the second electrode 105, and the third electrode 106 provided adjacent to the first electrode 104 and electrically connected to the first heating resistor 121, and adjacent to the second electrode 105.
  • a current path configured by being provided between the fourth electrode 107 electrically connected to the second heating resistor 122 and the first and third electrodes 104 and 106, Between the first fusible conductor 108 and the second and fourth electrodes 105 and 107, which melt the current path between the first and third electrodes 104 and 106 by heating from the first heating resistor 121.
  • a second exothermic resistor By heating from the body 122, and a second, second fusible conductor 109 to fuse the current path between the fourth electrode 105 and 107.
  • the short-circuit element 101 has a cover member 110 that protects the inside on the insulating substrate 102.
  • the insulating substrate 102 is formed in a substantially square shape using an insulating member such as alumina, glass ceramics, mullite, zirconia, and the like.
  • the insulating substrate 102 may be made of a material used for a printed wiring board such as a glass epoxy board or a phenol board, but it is necessary to pay attention to the temperature at which the fuse is blown.
  • the insulating substrate 102 has an external terminal 112 formed on the back surface.
  • the first and second heating resistors 121 and 122 are conductive members that have a relatively high resistance value and generate heat when energized, and are made of, for example, W, Mo, Ru, or the like. These alloys, compositions, or compound powders are mixed with a resin binder or the like to form a paste on the insulating substrate 102 using a screen printing technique and then fired.
  • the first and second heating resistors 121 and 122 are covered with the insulating layer 111 on the insulating substrate 102.
  • First and third electrodes 104 and 106 are formed on the insulating layer 111 covering the first heating resistor 121, and the second electrode 104, 106 is formed on the insulating layer 111 covering the second heating resistor 122.
  • the fourth electrodes 105 and 107 are formed.
  • the first electrode 104 is formed adjacent to the second electrode 105 on one side and is insulated.
  • a third electrode 106 is formed on the other side of the first electrode 104.
  • the first electrode 104 and the third electrode 106 are electrically connected when the first fusible conductor 108 is connected to form a current path of the short-circuit element 101.
  • the first electrode 104 is connected to the first electrode terminal portion 104 a facing the side surface of the insulating substrate 102.
  • the first electrode terminal portion 104a is connected to an external terminal 112 provided on the back surface of the insulating substrate 102 through a through hole.
  • the third electrode 106 is connected to the first heating resistor 121 through the first heating element lead electrode 123 provided on the insulating substrate 102 or the insulating layer 111.
  • the first heating resistor 121 is connected to the first resistor terminal portion 121 a facing the side edge of the insulating substrate 102 via the first heating element lead-out electrode 123.
  • the first resistor terminal portion 121a is connected to an external terminal 112 provided on the back surface of the insulating substrate 102 through a through hole.
  • a fourth electrode 107 is formed on the other side of the second electrode 105 opposite to the one side adjacent to the first electrode 104.
  • a second soluble conductor 109 is connected to the second electrode 105 and the fourth electrode 107.
  • the second electrode 105 is connected to the second electrode terminal portion 105 a facing the side surface of the insulating substrate 102.
  • the second electrode terminal portion 105a is connected to an external terminal 112 provided on the back surface of the insulating substrate 102 through a through hole.
  • the fourth electrode 107 is connected to the second heating resistor 122 through the second heating element lead electrode 124 provided on the insulating substrate 102 or the insulating layer 111.
  • the second heating resistor 122 is connected to the second resistor terminal portion 122a facing the side edge of the insulating substrate 102 through the second heating element lead-out electrode 124.
  • the second resistor terminal portion 122a is connected to an external terminal 112 provided on the back surface of the insulating substrate 102 through a through hole.
  • the first to fourth electrodes 104, 105, 106, and 107 can be formed using a general electrode material such as Cu or Ag, but at least the first and second electrodes 104 and 105 are formed.
  • a coating such as Ni / Au plating, Ni / Pd plating, or Ni / Pd / Au plating is preferably formed on the surface by a known plating process. Thereby, the oxidation of the first and second electrodes 104 and 105 can be prevented, and the molten conductor can be reliably held.
  • the short-circuit element 101 when the short-circuit element 101 is mounted by reflow soldering, a solder that connects the first and second soluble conductors 108 and 109 or a low melting point metal that forms an outer layer of the first and second soluble conductors 108 and 109 is used. By melting, the first and second electrodes 104 and 105 can be prevented from being eroded (soldered) and cut.
  • the first and second fusible conductors 108 and 109 are made of a low melting point metal that is quickly melted by the heat generated by the first and second heat generating resistors 121 and 122, for example, Pb-free solder containing Sn as a main component. Can be suitably used.
  • the first and second soluble conductors 108 and 109 may contain a low melting point metal and a high melting point metal.
  • the low melting point metal it is preferable to use solder such as Pb-free solder, and as the high melting point metal, it is preferable to use Ag, Cu or an alloy containing these as a main component.
  • the high melting point metal and the low melting point metal even when the reflow temperature exceeds the melting temperature of the low melting point metal layer and the low melting point metal is melted when the short circuit element 101 is reflow mounted, the first, The second soluble conductors 108 and 109 do not blow out.
  • the first and second fusible conductors 108 and 109 may be formed by depositing a low melting point metal on a high melting point metal using a plating technique, and other well-known lamination techniques and film forming techniques may be used. You may form by using.
  • the first and second fusible conductors 108 and 109 are connected to the first and third electrodes 104 and 106 or the second and fourth electrodes 105 and 107 using a low melting point metal constituting the outer layer. Can be soldered.
  • the first and second soluble conductors 108 and 109 may have a low melting point metal for the inner layer and a high melting point metal for the outer layer.
  • a soluble conductor in which the entire surface of the inner low melting point metal layer is covered with the outer high melting point metal layer even when using a low melting point metal having a melting point lower than the reflow temperature, the inner layer has a low Outflow of the melting point metal to the outside can be suppressed. Further, when the inner layer low melting point metal melts, the outer layer high melting point metal is also eroded (soldered) and can be quickly melted.
  • the first and second fusible conductors 108 and 109 may have a coating structure in which the inner layer is made of a high melting point metal and the outer layer is made of a low melting point metal.
  • the inner layer is made of a high melting point metal
  • the outer layer is made of a low melting point metal.
  • first and second soluble conductors 108 and 109 may have a laminated structure in which a low melting point metal layer and a high melting point metal layer are laminated. Moreover, it is good also as a multilayered structure of four or more layers by which the low melting metal layer and the high melting metal layer were laminated
  • the first and second fusible conductors 108 and 109 may be composed of a high melting point metal having a large number of openings and a low melting point metal inserted into the openings.
  • a high melting point metal having a large number of openings
  • a low melting point metal inserted into the openings.
  • the first and second soluble conductors 108 and 109 have a low melting point metal volume larger than the high melting point metal volume. Thereby, the 1st, 2nd soluble conductors 108 and 109 can perform fusing in a short time by the corrosion of a refractory metal layer effectively.
  • the first and second soluble conductors 108 and 109 can be improved.
  • a flux 115 is applied on the molten conductors 108 and 109.
  • the inside of the short circuit element 101 is protected by covering the insulating substrate 102 with the cover member 110.
  • the cover member 110 has a side wall 116 that constitutes a side surface of the short-circuit element 101 and a top surface portion 117 that constitutes an upper surface of the short-circuit element 101, and the short-circuit element 101 is connected to the side wall 116 on the insulating substrate 102. It becomes a lid that closes the inside of the.
  • the cover member 110 is formed using an insulating member such as a thermoplastic, ceramic, or glass epoxy substrate.
  • the cover member 110 may be formed with a cover portion electrode 118 on the inner surface side of the top surface portion 117.
  • the cover part electrode 118 is formed at a position overlapping the first and second electrodes 104 and 105.
  • the cover electrode 118 has the first and second electrodes 104, When the molten conductor aggregated on 105 comes into contact and spreads wet, the allowable amount for holding the molten conductor can be increased.
  • the short circuit element 101 as described above has a circuit configuration as shown in FIGS. That is, in the short-circuit element 101, the first electrode 104 and the second electrode 105 are insulated during normal operation, and the first and second fusible conductors are generated by the heat generated by the first and second heating resistors 121 and 122. When the fuses 108 and 109 are melted, the switch 120 is configured to be short-circuited through the molten conductor (FIG. 22B).
  • the first electrode terminal portion 104a and the second electrode terminal portion 105a constitute both terminals of the switch 120.
  • the first fusible conductor 108 is connected to the first heating resistor 121 through the third electrode 106 and the first heating element extraction electrode 123.
  • the second fusible conductor 109 is connected to the second heating resistor 122 via the fourth electrode 107 and the second heating element extraction electrode 124.
  • the short-circuit element 101 is incorporated in an electronic device or the like, whereby both terminals 104a and 105a of the switch 120 are connected in parallel with the current path of the electronic device, and the electronic component on the current path is connected.
  • the switch 120 is short-circuited to form a bypass current path that bypasses the electronic component.
  • the short-circuit element 101 when an abnormality occurs in the electronic components connected in parallel, the short-circuit element 101 is supplied with power from the first and second resistor terminal portions 121a and 122a, and the first and second heating resistors.
  • the body 121, 122 generates heat when energized.
  • the first and second fusible conductors 108 and 109 are melted by this heat, the molten conductor aggregates on the first and second electrodes 104 and 105. Since the first and second electrodes 104 and 105 are formed adjacent to each other, the agglomerated molten conductors are coupled to each other on the first and second electrodes 104 and 105, thereby the first and second electrodes 104. , 105 are short-circuited. That is, the shorting element 101 is short-circuited between both terminals of the switch 120 (FIG. 22B).
  • first heating resistor 121 is stopped because the first fusible conductor 108 is cut off and the first and third electrodes 104 and 106 are cut off, and the second heating element 121 is stopped.
  • the energization of the resistor 122 is stopped because the second fusible conductor 109 is melted and the second and fourth electrodes 105 and 107 are cut off.
  • the second soluble conductor 109 is preferably melted before the first soluble conductor 108. Since the first heating resistor 121 and the second heating resistor 122 are separately heated in the short-circuit element 101, the second heating resistor 122 is first heated as the energization timing, and thereafter By causing the first heating resistor 121 to generate heat, as shown in FIG. 24, the second soluble conductor 109 is easily melted ahead of the first soluble conductor 108, and FIG.
  • the molten conductors of the first and second fusible conductors 108 and 109 are surely agglomerated and bonded onto the first and second electrodes 104 and 105, so that the first and second The electrodes 104 and 105 can be short-circuited.
  • the short-circuit element 101 forms the second fusible conductor 109 narrower than the first fusible conductor 108 by forming the second fusible conductor 109 more narrowly than the first fusible conductor 108. It may be melted first.
  • the fusing time can be shortened, so that the second soluble conductor 109 can be melted ahead of the first soluble conductor 108. it can.
  • the area of the first electrode 104 is preferably larger than that of the third electrode 106 and the area of the second electrode 105 is preferably larger than that of the fourth electrode 107. Since the holding amount of the molten conductor increases in proportion to the electrode area, the area of the first and second electrodes 104 and 105 is made larger than that of the third and fourth electrodes 106 and 107. These molten conductors can be agglomerated on the first and second electrodes 104 and 105, and the first and second electrodes 104 and 105 can be reliably short-circuited.
  • the short-circuit element 101 does not necessarily need to cover the first and second heat generating resistors 121 and 122 with the insulating layer 111.
  • the first and second heating resistors 121 and 122 can be heated in the same manner as when the insulating layer 111 such as a glass layer is interposed. it can.
  • the short-circuit element 101 has the first and second heating resistors 121 and 122 opposite to the formation surfaces of the first to fourth electrodes 104, 105, 106, and 107 of the insulating substrate 102. It may be installed on the back side of.
  • the first and second heat generating resistors 121 and 122 can be formed by a simpler process than in the insulating substrate 102.
  • the insulating layer 111 is formed on the first and second heating resistors 121 and 122 in terms of protecting the resistor and ensuring insulation during mounting.
  • the short-circuit element 101 has the first and second heating resistors 121 and 122 on the formation surface of the first to fourth electrodes 104, 105, 106, and 107 of the insulating substrate 2. It may be installed.
  • the first and second heat generating resistors 121 and 122 can be formed by a simpler process than that in the insulating substrate 102.
  • the insulating layer 111 is formed on the first and second heating resistors 121 and 122.
  • the protective resistance is a resistance value corresponding to the internal resistance of the electronic component connected to the short-circuit element, and is smaller than the resistance values of the heating resistors 121 and 122. That is, when the electronic component is operating normally, current does not flow to the short-circuit element side but flows to the electronic component side.
  • the short-circuit element 101 to which the present invention is applied is not limited to the provision of the external terminal 112 continuous with the first and second electrodes 104 and 105 through the through-holes on the back surface of the insulating substrate 102 as shown in FIG. )
  • a first external connection electrode 131 continuous with the first electrode 104 is formed on the surface of the insulating substrate 102 on which the first and second electrodes 104 and 105 are formed, like a short-circuit element 130 shown in FIG.
  • first external connection terminals 132 provided on the first external connection electrode 131, a second external connection electrode 133 continuous with the second electrode 105, and a second external connection electrode 133 You may make it form the 2nd external connection terminal 134 which consists of one or more provided on the top.
  • the first and second external connection electrodes 131 and 133 are electrodes that connect the short-circuit element 130 and a circuit of an electronic device in which the short-circuit element 130 is incorporated, and the first external connection electrode 131 is connected to the first electrode 104.
  • the second external connection electrode 133 is continuous with the second electrode 105.
  • the first and second external connection electrodes 131 and 133 are formed using a general electrode material such as Cu or Ag, and are the same as the formation surfaces of the first and second electrodes 104 and 105 of the insulating substrate 102. Is formed. In other words, in the short-circuit element 130 shown in FIG. Note that the first and second external connection electrodes 131 and 133 can be formed simultaneously with the first and second electrodes 104 and 105.
  • the first external connection terminal 132 is provided on the first external connection electrode 131.
  • a second external connection terminal 134 is provided on the second external connection electrode 133.
  • These first and second external connection terminals 132 and 134 are connection terminals for mounting on an electronic device, and are formed using, for example, metal bumps or metal posts. Further, as shown in FIG. 28A, the first and second external connection terminals 132 and 134 have a height protruding from the cover member 110 provided on the insulating substrate 102, and the short-circuit element 130. It can be mounted on the side of the board that is the mounting target.
  • the first heating resistor 121 of the short-circuit element 130 is formed with a first resistor connection terminal 121b via the first heating element lead-out electrode 123 and the first resistor terminal portion 121a.
  • the second heating resistor 122 of the short-circuit element 130 has a second resistor connection terminal 122b formed through the second heating element lead electrode 124 and the second resistor terminal portion 122a.
  • the first and second resistor connection terminals 121b and 122b are formed by using metal bumps or metal posts, and upward through the insulating layer 111. It is protruding.
  • the short-circuit element 130 is provided with the external terminal 112 on the back surface of the insulating substrate 102 like the short-circuit element 101 and connects the first and second electrodes 104 and 105 and the external terminal 112 through a through hole.
  • external connection terminals 132 and 134 are formed on the same surface as the first and second electrodes 104 and 105 via external connection electrodes 131 and 133.
  • the short-circuit element 130 is connected between the first and second external connection electrodes 131 and 133 when the first electrode 104 and the second electrode 105 are short-circuited.
  • the combined resistance of the first external connection terminal 132 and the second external connection terminal 134 is configured to be lower than the resistance.
  • the short-circuit element 130 can improve the rating when the first and second electrodes 104 and 105 are short-circuited to form a bypass current path, and can cope with a large current. That is, in high current applications such as lithium ion secondary batteries used as power sources such as HEV and EV, further improvement of the rating of the short-circuit element is required. Then, the conduction resistance between the first and second external connection electrodes 131 and 133 short-circuited by the fusible conductor can be lowered sufficiently to meet the rating improvement (for example, less than 0.4 m ⁇ ).
  • the first and second electrodes 104 are provided.
  • 105 and the external terminal 112 have high conduction resistance (for example, 0.5 to 1.0 m ⁇ ), and there is a limit to lowering the conduction resistance of the entire short-circuit element even if a conductor is filled in the through hole.
  • heat generated by flowing a large current between the high resistance first and second electrodes 104 and 105 and the external terminal 112 may cause damage to the bypass current path and heat effects on other peripheral devices.
  • the short-circuit element 130 has external connection terminals 132 and 134 on the same surface as the first and second electrodes 104 and 105.
  • the external connection terminals 132 and 134 are provided on the external connection electrodes 131 and 133, and a terminal having a high degree of freedom in shape and size and a low conduction resistance can be easily provided.
  • the short-circuit element 130 is connected to the first external connection rather than the conduction resistance between the first and second external connection electrodes 131 and 133 when the first electrode 104 and the second electrode 105 are short-circuited.
  • the combined resistance of the terminal 132 and the second external connection terminal 134 is configured to be low.
  • the conduction resistance ahead of the first and second external connection electrodes 131 and 133 which are high in the configuration of the short-circuit element 101, can be easily lowered, and the rating is dramatically improved. Can be achieved.
  • the first and second external connection terminals 132 and 134 can be configured using, for example, metal bumps or metal posts made of Pb-free solder whose main component is Sn.
  • the shape of the metal bump or the metal post is not limited.
  • the resistance values of the first and second external connection terminals 132 and 134 can be obtained from the material, shape, and size. As an example, when a rectangular parallelepiped metal post (Cu core: 0.6 mm ⁇ 0.6 mm, cross-sectional area 0.36 mm 2, height 1 mm, specific resistance 17.2 ⁇ ⁇ mm) is used.
  • the resistance value of the Cu core of one terminal is about 0.048 m ⁇ , and considering the solder coating, the resistance value obtained by connecting the first and second external connection terminals 132 and 134 in series is as low as less than 0.096 m ⁇ . It can be seen that the overall rating of the short-circuit element 130 can be improved.
  • the short-circuit element 130 obtains the total resistance value of the entire element from the resistance value between the first and second external connection terminals 132 and 134 at the time of the short circuit, and the total resistance value and the known first and second values. From the difference from the combined resistance of the external connection terminals 132 and 134, the conduction resistance between the first and second external connection electrodes 131 and 133 at the time of a short circuit can be obtained. In addition, the short-circuit element 130 measures the resistance between the first and second external connection electrodes 131 and 133 at the time of the short-circuit, and the first and second external elements are calculated based on the difference from the total resistance value of the entire element at the time of the short-circuit. The combined resistance of the connection terminals 132 and 134 can be obtained.
  • the short-circuit element 130 is widely provided by forming the first and second external connection electrodes 131 and 133 in a rectangular shape or the like, and the first and second external connection terminals 132 and 134 are provided.
  • the conduction resistance may be lowered by providing a plurality.
  • the short-circuit element 130 reduces the conduction resistance by providing the first and second external connection terminals 132 and 134 having large diameters on the widely provided first and second external connection electrodes 131 and 133. May be.
  • first and second external connection terminals 132 and 134 may be formed by providing the low melting point metal layers 132b and 134b on the surfaces of the high melting point metals 132a and 134a serving as the core.
  • the metal constituting the low melting point metal layers 132b and 134b solder such as Pb-free solder containing Sn as a main component can be preferably used.
  • the high melting point metals 132a and 134a Cu or Ag is used as a main component.
  • An alloy to be used can be preferably used.
  • the reflow temperature exceeds the melting temperature of the low melting point metal layers 132b and 134b when the short circuit element 130 is reflow mounted. Even if the metal is melted, it can be prevented from melting as the first and second external connection terminals 132 and 134.
  • the first and second external connection terminals 132 and 134 can be connected to the first and second external connection electrodes 131 and 133 using a low melting point metal constituting the outer layer.
  • the first and second external connection terminals 132 and 134 can be formed by forming a low melting point metal on the high melting point metals 132a and 134a by using a plating technique, and other well-known lamination techniques and films. It can also be formed by using a forming technique.
  • the first and second external connection terminals 132 and 134 are formed by using a conductive plating layer or a conductive layer formed by applying a conductive paste, in addition to using metal bumps or metal posts. May be.
  • first and second external connection terminals 132 and 134 are provided in advance on the mounting object side such as a substrate on which the short-circuit element 130 is mounted, and in the mounting body on which the short-circuit element is mounted,
  • the external connection electrodes 131 and 133 or the first and second electrodes 104 and 105 may be connected.
  • FIG. 30 is a diagram showing a circuit configuration of a battery pack 140 in which a lithium ion battery used in various electronic devices such as cars and electric tools is built.
  • the battery pack 140 ensures a high voltage and a large current by connecting a plurality of battery cells 141 in series on the current path.
  • each battery cell 141 is connected to a protection element 142 that interrupts the current path when an abnormality such as overcharge or overdischarge of the battery cell 141 occurs.
  • the protective element 142 is formed on the insulating substrate 144, the heating resistor 146 laminated on the insulating substrate 144 and covered with the insulating member 145, and both ends of the insulating substrate 144. Electrodes 147 (A1) and 147 (A2), a heating element extraction electrode 148 laminated on the insulating member 145 so as to overlap the heating resistor 146, and electrodes 147 (A1) and 147 (A2) at both ends. And a soluble conductor 149 having a central portion connected to the heating element extraction electrode 148.
  • the insulating substrate 144 is formed in a substantially rectangular shape using the same material as the insulating substrate 102 described above.
  • the heating resistor 146 is formed by the same manufacturing method using the same material as the first and second heating resistors 121 and 122 described above.
  • an insulating member 145 is disposed so as to cover the heating resistor 146, and a heating element extraction electrode 148 is disposed so as to face the heating resistor 146 through the insulating member 145.
  • an insulating member 145 may be laminated between the heating resistor 146 and the insulating substrate 144.
  • the soluble conductor 149 may be the same as the first and second soluble conductors 108 and 109 described above.
  • the protective element 142 similarly to the short-circuit element 101, flux may be applied to almost the entire surface of the soluble conductor 149 in order to prevent the soluble conductor 149 from being oxidized. Further, the protective element 142 may have a cover member placed on the insulating substrate 144 in order to protect the inside.
  • the protective element 142 as described above has a circuit configuration as shown in FIG. That is, the protection element 142 generates heat by melting the soluble conductor 149 by energizing the soluble conductor 149 connected in series via the heating element extraction electrode 148 and the connection point of the soluble conductor 149 to generate heat.
  • the circuit configuration includes a resistor 146. Of the two electrodes 147 of the protective element 142, one is connected to A1, and the other is connected to A2. Further, the heating element extraction electrode 148 and the heating element electrode 150 connected thereto are connected to P1, and the other heating element electrode 150 is connected to P2.
  • Battery pack 140 has a plurality of battery units 184 connected in series.
  • Each battery unit 184 includes a battery cell 141, a protection element 142, a short-circuit element 101, a first current control element 181 that controls the operation of the protection element 142, and a second and second control that controls the operation of the short-circuit element 101.
  • the battery pack 140 detects the voltage of the battery unit 184, the charge / discharge control circuit 155 that controls the charge / discharge of the battery unit 184, and the battery cell 141 of each battery unit 184, and the protection element 142 and the short-circuit element 101. And a detection circuit 156 that outputs an abnormal signal to the first to third current control elements 181 to 183 that control the operation of the first current control element.
  • the electrode 147 (A1) of the protection element 142 is connected in series with the battery cell 141, and the electrode 147 (A2) is connected to the charge / discharge current path of the battery pack 140.
  • the second electrode terminal portion 105a of the short-circuit element 101 is connected to the open end of the protective element 142 via the protective resistor 154, and the first electrode terminal portion 104a is connected to the open end of the battery cell 141.
  • the protection element 142 and the battery cell 141 and the short-circuit element 101 are connected in parallel.
  • the heating element electrode 150 (P2) of the protection element 142 is connected to the first current control element 181, and the first resistor terminal portion 121a of the short-circuit element 101 is the second current control element 182. And the second resistor terminal portion 122a of the short-circuit element 101 is connected to the third current control element 183.
  • the detection circuit 156 is connected to each battery cell 141, detects the voltage value of each battery cell 141, and supplies each voltage value to the control unit 159 of the charge / discharge control circuit 155. Further, when the battery cell 141 becomes an overcharge voltage or an overdischarge voltage, the detection circuit 156 sends an abnormal signal to the first to third current control elements 181 to 183 of the battery unit 184 having the battery cell 141. Output.
  • the first to third current control elements 181 to 183 are constituted by, for example, FETs, and the voltage value of the battery cell 141 is set to a voltage exceeding a predetermined overdischarge or overcharge state by a detection signal output from the detection circuit 156. Then, the protection element 142 and the short-circuit element 101 are operated to cut off the charging / discharging current path of the battery unit 184 regardless of the switching operation of the third and fourth current control elements 157 and 158 and the short-circuit element 101. Is controlled to form a bypass current path that bypasses the battery unit 184.
  • an abnormality signal is output from the detection circuit 156 to the first current control element 181, and the heating resistor 146 of the protection element 142 is heated.
  • the protection element 142 heats and melts the fusible conductor 149 with the heating resistor 146, thereby blocking between the electrodes 147 (A1) and 147 (A2).
  • the battery unit 184 having the abnormal battery cell 141 can be cut off from the charge / discharge current path of the battery pack 140.
  • power supply to the heating resistor 146 is stopped when the fusible conductor 149 is melted.
  • the detection circuit 156 outputs an abnormal signal to the second current control element 182 of the battery unit 184, and the first heating resistor 121 of the short-circuit element 101 also generates heat.
  • the molten conductor aggregates on the first electrode 104 by heating and melting the first soluble conductor 108 by the first heating resistor 121.
  • the battery pack 140 outputs an abnormal signal to the third current control element 183 following the output to the second current control element 182 to cause the second heating resistor 122 to generate heat.
  • the molten conductor aggregates on the second electrode 104 by heating and melting the second soluble conductor 109 by the second heating resistor 122.
  • the battery pack 140 has a bypass current path in which the first electrode terminal portion 104a and the second electrode terminal portion 105a of the switch 120 are short-circuited to bypass the battery unit 184. Can be formed.
  • the first and second fusible conductors 108 and 109 are blown, whereby the power supply to the first and second heating resistors 121 and 122 is stopped.
  • the protective resistor 154 has substantially the same resistance value as the internal resistance of the battery cell 141, and thus can have the same capacity as that in the normal state on the bypass current path.
  • FIG. 33 is a plan view of the short-circuit element 160 in which the protective resistor 161 is formed on the insulating substrate 102.
  • the short-circuit element 160 includes a protective resistor 161 connected to the second electrode 105, and a second electrode terminal portion 105 a is formed via the protective resistor 161.
  • the protective resistor 161 can be formed simultaneously by the same process using the same material as the first and second heating resistors 121 and 122 described above.
  • FIG. 34A and 34B are diagrams showing the circuit configuration of the short-circuit element 160.
  • FIG. The circuit configuration of the short-circuit element 160 is such that the first electrode terminal portion 104a and the second electrode terminal portion 105a are connected via the protective resistor 161 when the switch 120 is short-circuited.
  • the circuit configuration of the short-circuit element 160 is such that the first and second fusible conductors (fuses) 108 and 109 and the first and second fusible conductors 108 and 109 connected to one end of the first and second fusible conductors 108 and 109.
  • the switch 120 connected to the other end to which the first and second heat generating resistors 121 and 122 are not connected, and the switch And a protective resistor 161 connected to at least one of the 120 terminals, and the switch 120 is short-circuited in conjunction with the fusing of the first and second fusible conductors 108 and 109.
  • the external terminal 112 is provided on the back surface of the insulating substrate 102 and the first electrode terminal portion 104a and the second electrode terminal portion 105a are connected to the external terminal 112 through a through hole.
  • the first external connection electrode 131 that is continuous with the first electrode 104, the first electrode on the surface of the insulating substrate 102 on which the first and second electrodes 104 and 105 are formed.
  • a second external connection electrode 133 continuous with the second electrode 105 and a second external connection terminal 134 may be formed via the external connection terminal 132, the protective resistor 161.
  • FIG. 35 is a diagram showing a circuit configuration of a battery pack 170 in which the short-circuit element 160 is incorporated.
  • the battery pack 170 has the same configuration as the battery pack 140 described above except that the short-circuit element 160 is used. That is, the circuit configuration of the battery pack 170 is connected to the above-described short-circuit element 160, the battery cell 141, and the current path of the battery cell 141, and the electric current is supplied to the battery cell 141 by an electric signal when the battery cell 141 is abnormal.
  • a protection element 142 that shuts off, a detection circuit 156 that detects abnormality of the battery cell 141 and outputs an abnormality signal, and first to third current control elements 181 and 182 that operate in response to the abnormality signal of the detection circuit 156, 183, and both ends of the battery cell 141 and the protection element 142 are connected in parallel with the connection terminal 104 a of the first and second fusible conductors 108 and 109 of the switch 120 and the open terminal 105 a of the protection resistor 161.
  • the first and second resistor terminal portions 121a and 122a of the first and second heating resistors 121 and 122 are connected to the second and third current control elements.
  • the heating element electrode 150 (P2) which is connected to 182 and 183 and serves as an input terminal for the electrical signal of the protection element 142 is connected to the first control element 181.
  • an abnormal signal is output from the detection circuit 156.
  • the first to third current control elements 181, 182, and 183 operate to interrupt the current path of the battery cell 141 by the protection element 142 and to blow the first and second fusible conductors 108 and 109.
  • the interlocked switch 120 is short-circuited to form a bypass current path.
  • the protective resistance 161 of the short-circuit element 160 provided in each battery unit 184 has substantially the same resistance value as the internal resistance of the battery cell 141 of the battery unit 184.
  • a bypass current path that bypasses the battery unit 184 can be formed and charged by the remaining normal battery units 184.
  • the discharge function can be maintained.
  • the battery pack 170 can have the same capacity as that in the normal state on the bypass current path because the protective resistor 161 has substantially the same resistance value as the internal resistance of the battery cell 141.
  • the battery pack 190 incorporating the short-circuit element 160 shown in FIG. 36 is connected to the current control element connected to the protection element 142 and the first resistor terminal portion 121a among the first to third current control elements.
  • the current control element to be shared is shared. That is, as shown in FIG. 36, in the battery pack 190, the heating element electrode 150 (P2) of the protection element 142 and the first resistor terminal portion 121a of the short-circuit element 160 are connected to the first current control element 191.
  • the second resistor terminal portion 122a of the short-circuit element 160 is connected to the second current control element 192.
  • the first and second current control elements 191 and 192 are connected to the detection circuit 156, and when the overcharge voltage or overdischarge voltage of the battery cell 141 is detected by the detection circuit 156, an abnormal signal is output.
  • the first and second current control elements 191 and 192 are constituted by, for example, FETs, and the voltage value of the battery cell 141 exceeds a predetermined overdischarge or overcharge state by an abnormal signal output from the detection circuit 156. When this happens, the protection element 142 and the short-circuit element 160 are operated.
  • the detection circuit 156 first outputs an abnormal signal to the first current control element 191, and then outputs an abnormal signal to the second current control element 192.
  • the heating resistor 146 of the protection element 142 and the first heating resistor 121 of the short circuit element 160 are energized to generate heat.
  • the battery pack 190 cuts off the charging / discharging current path of the battery unit 184 when the soluble conductor 149 of the protection element 142 is melted, and the first soluble conductor 108 of the short-circuit element 160 is melted.
  • the second current control element 192 receives an abnormal signal
  • the second heating resistor 122 of the short-circuit element 160 is energized to generate heat.
  • the battery pack 190 is melted in the second fusible conductor 109 of the short-circuiting element 160 and is coupled to the first fusible conductor 108 that has been melted first. Aggregate on 105. Accordingly, the short-circuit element 160 short-circuits the switch 120 and forms a bypass current path that bypasses the battery unit 184. According to such a battery pack 190, the number of current control elements can be reduced, and the circuit configuration can be simplified.
  • FIG. 37A is a plan view of the short-circuit element 201
  • FIG. 37B is a cross-sectional view of the short-circuit element 201.
  • the short-circuit element 201 includes an insulating substrate 202, a first heating resistor 221 and a second heating resistor 222 provided on the insulating substrate 202, and a first electrode provided adjacent to the insulating substrate 202.
  • a current path is formed by being provided between the fifth electrode 231 (A2) and the first and third electrodes 204 and 206, and the first and second electrodes are heated by the first heating resistor 221.
  • Current flow between the three electrodes 204 and 206 A first fusible conductor 208, a second electrode 205 (A 1), a fourth electrode 207 (P 1), and a fifth electrode 231 (A 2).
  • the short-circuit element 201 is provided with a cover member 210 that protects the inside on the insulating substrate 202.
  • the insulating substrate 202 is formed in a substantially square shape using an insulating member such as alumina, glass ceramics, mullite, zirconia, and the like.
  • the insulating substrate 202 may be made of a material used for a printed wiring board such as a glass epoxy board or a phenol board, but it is necessary to pay attention to the temperature at the time of blowing the fuse.
  • the insulating substrate 202 has an external terminal 212 formed on the back surface.
  • the first and second heat generating resistors 221 and 222 are conductive members that have a relatively high resistance value and generate heat when energized, and are made of, for example, W, Mo, Ru, or the like. These alloys, compositions, or compound powders are mixed with a resin binder or the like to form a paste on the insulating substrate 2 by patterning using a screen printing technique and firing.
  • first and second heating resistors 221 and 222 are covered with the insulating layer 211 on the insulating substrate 202.
  • First and third electrodes 204 and 206 are formed on the insulating layer 211 covering the first heating resistor 221, and the second electrode 204 and 206 are formed on the insulating layer 211 covering the second heating resistor 222.
  • Fourth and fifth electrodes 205, 207, and 231 are formed.
  • the first electrode 204 is formed adjacent to the second electrode 205 on one side and insulated.
  • a third electrode 206 is formed on the other side of the first electrode 204.
  • the first electrode 204 and the third electrode 206 are brought into conduction when the first fusible conductor 208 is connected to form a current path of the short-circuit element 201.
  • the first electrode 204 is connected to the first electrode terminal portion 204 a facing the side surface of the insulating substrate 202.
  • the first electrode terminal portion 204a is connected to an external terminal 212 provided on the back surface of the insulating substrate 202 through a through hole.
  • the third electrode 206 is connected to the first heating resistor 221 via the first heating element lead-out electrode 223 provided on the insulating substrate 202 or the insulating layer 211.
  • the first heating resistor 221 is connected to the first resistor terminal portion 221 a facing the side edge of the insulating substrate 202 via the first heating element lead-out electrode 223.
  • the first resistor terminal portion 221a is connected to an external terminal 212 provided on the back surface of the insulating substrate 202 through a through hole.
  • the fourth electrode 207 (P1) is formed on the other side opposite to the one side adjacent to the first electrode 204 of the second electrode 205 (A1).
  • a fifth electrode 231 (A2) is formed on the other side of the fourth electrode 207 (P1) opposite to the one side adjacent to the second electrode 205 (A1).
  • the second electrode 205 (A1), the fourth electrode 207 (P1), and the fifth electrode 231 (A2) are connected to the second soluble conductor 209.
  • the second electrode 205 (A1) is connected to the second electrode terminal portion 205a facing the side surface of the insulating substrate 202.
  • the second electrode terminal portion 205a is connected to an external terminal 212 provided on the back surface of the insulating substrate 202 through a through hole.
  • the fourth electrode 207 (P1) is connected to the second heating resistor 222 via the second heating element extraction electrode 224 provided on the insulating substrate 202 or the insulating layer 211.
  • the second heating resistor 222 is connected to the second resistor terminal portion 222a (P2) facing the side edge of the insulating substrate 202 via the second heating element lead-out electrode 224.
  • the second resistor terminal portion 222a (P2) is connected to an external terminal 212 provided on the back surface of the insulating substrate 202 through a through hole.
  • the fifth electrode 231 (A2) is connected to the fifth electrode terminal portion 231a facing the side surface of the insulating substrate 202.
  • the fifth electrode terminal portion 231a is connected to an external terminal 212 provided on the back surface of the insulating substrate 202 through a through hole.
  • the first to fifth electrodes 204, 205, 206, 207, 231 can be formed using a general electrode material such as Cu or Ag, but at least the first and second electrodes 204, A coating such as Ni / Au plating, Ni / Pd plating, or Ni / Pd / Au plating is preferably formed on the surface of 205 by a known plating process. Thereby, the oxidation of the first and second electrodes 204 and 205 can be prevented, and the molten conductor can be reliably held.
  • the short-circuit element 201 when the short-circuit element 201 is mounted by reflow soldering, a solder that connects the first and second soluble conductors 208 and 209 or a low melting point metal that forms an outer layer of the first and second soluble conductors 208 and 209 is used. By melting, the first and second electrodes 204 and 205 can be prevented from being melted (soldered) and cut.
  • the first and second fusible conductors 208 and 209 are made of a low melting point metal that is quickly melted by the heat generated by the first and second heating resistors 221 and 222, for example, Pb-free solder mainly composed of Sn. Can be suitably used.
  • first and second soluble conductors 208 and 209 may contain a low melting point metal and a high melting point metal.
  • the low melting point metal it is preferable to use solder such as Pb-free solder, and as the high melting point metal, it is preferable to use Ag, Cu or an alloy containing these as a main component.
  • the high melting point metal and the low melting point metal even when the reflow temperature exceeds the melting temperature of the low melting point metal layer and the low melting point metal melts, The second soluble conductors 208 and 209 do not melt.
  • the first and second fusible conductors 208 and 209 may be formed by depositing a low melting point metal on a high melting point metal using a plating technique, and other well-known lamination techniques and film forming techniques may be used. You may form by using.
  • the first and second fusible conductors 208 and 209 are made of a low melting point metal constituting the outer layer, and the first and third electrodes 204 and 206 or the second, fourth and fifth electrodes 205 are used. , 207, 231 can be soldered.
  • the first and second soluble conductors 208 and 209 may have an inner layer made of a low melting point metal and an outer layer made of a high melting point metal.
  • an inner layer made of a low melting point metal By using a soluble conductor in which the entire surface of the inner low melting point metal layer is covered with the outer high melting point metal layer, even when using a low melting point metal having a melting point lower than the reflow temperature, the inner layer has a low Outflow of the melting point metal to the outside can be suppressed. Further, when the inner layer low melting point metal melts, the outer layer high melting point metal is also eroded (soldered) and can be quickly melted.
  • first and second soluble conductors 208 and 209 may have a covering structure in which the inner layer is made of a high melting point metal and the outer layer is made of a low melting point metal.
  • the inner layer is made of a high melting point metal
  • the outer layer is made of a low melting point metal.
  • first and second soluble conductors 208 and 209 may have a laminated structure in which a low melting point metal layer and a high melting point metal layer are laminated. Moreover, it is good also as a multilayered structure of four or more layers by which the low melting metal layer and the high melting metal layer were laminated
  • the first and second soluble conductors 208 and 209 may be composed of a high melting point metal having a large number of openings and a low melting point metal inserted into the openings.
  • the area of the refractory metal layer in contact with the molten low melting point metal layer increases, so that the low melting point metal layer can erode the refractory metal layer in a shorter time. Therefore, the soluble conductor can be blown out more quickly and reliably.
  • the first and second soluble conductors 208 and 209 have a volume of the low melting point metal larger than that of the high melting point metal. Thereby, the 1st, 2nd soluble conductors 208 and 209 can perform fusing in a short time by the corrosion of a refractory metal layer effectively.
  • the first and second soluble conductors 208 and 209 are improved.
  • a flux 215 is applied on the molten conductors 208 and 209.
  • the inside of the short-circuit element 201 is protected by covering the insulating substrate 202 with the cover member 210.
  • the cover member 210 has a side wall 216 that forms the side surface of the short-circuit element 201 and a top surface portion 217 that forms the upper surface of the short-circuit element 201, and the short-circuit element 201 is connected to the side wall 216 on the insulating substrate 202. It becomes a lid that closes the inside of the.
  • the cover member 210 is formed using an insulating member such as a thermoplastic, ceramic, glass epoxy substrate, or the like.
  • the cover member 210 may have a cover portion electrode 218 formed on the inner surface side of the top surface portion 217.
  • the cover part electrode 218 is formed at a position overlapping the first and second electrodes 204 and 205.
  • the cover electrode 218 has the first and second electrodes 204, When the molten conductor agglomerated on 205 contacts and spreads wet, the allowable amount for holding the molten conductor can be increased.
  • the short circuit element 201 as described above has a circuit configuration as shown in FIG. That is, in the short-circuit element 201, the first electrode 204 and the second electrode 205 are normally insulated, and the first and second fusible conductors are generated by the heat generated by the first and second heating resistors 221 and 222. When 208 and 209 are melted, the switch 220 is configured to be short-circuited through the molten conductor.
  • the first electrode terminal portion 204a and the second electrode terminal portion 205a constitute both terminals of the switch 220.
  • the first soluble conductor 208 is connected to the first heating resistor 221 via the third electrode 206 and the first heating element lead-out electrode 223.
  • the second soluble conductor 209 is connected to the second heating resistor 222 and the second resistor terminal portion 222a (P2) through the fourth electrode 207 (P1) and the second heating element lead-out electrode 224.
  • the second electrode 205 (A1), the fourth electrode 207 (P1), and the fifth electrode 231 (A2) to which the second soluble conductor 209 is connected function as a protective element.
  • the short-circuit element 201 When the short-circuit element 201 is energized from the second resistor terminal portion 222a (P2), as shown in FIG. 39, the second heating resistor 222 generates heat, and the second soluble conductor 209 is connected. By melting, the current path extending between the second electrode 205 (A1) and the fifth electrode 231 (A2) connected via the fourth electrode 207 (P1) is cut off. Further, when the short-circuit element 201 is energized from the first resistor terminal portion 221a, the first heating resistor 221 generates heat and melts the first soluble conductor 208. As a result, as shown in FIG.
  • the short-circuit element 201 is formed by combining the molten conductors of the first and second soluble conductors 208 and 209 that are aggregated into the first electrode 204 and the second electrode 205.
  • the insulated first electrode 204 and second electrode 205 can be short-circuited, that is, the switch 220 can be short-circuited.
  • the energization of the first heating resistor 221 is stopped because the first fusible conductor 208 is cut off and the first and third electrodes 204 and 206 are cut off, and the second heat generation is stopped. Since the current to the resistor 222 is cut off between the second and fourth electrodes 205 and 207 and between the fourth and fifth electrodes 207 and 231 when the second soluble conductor 209 is melted, Stopped.
  • the second soluble conductor 209 is melted prior to the first soluble conductor 208.
  • the first heating resistor 221 and the second heating resistor 222 are separately heated, so that the second heating resistor 222 is first heated as the energization timing, and thereafter
  • the first heating resistor 221 By causing the first heating resistor 221 to generate heat, as shown in FIG. 39, the second soluble conductor 209 is easily melted ahead of the first soluble conductor 208, as shown in FIG.
  • the molten conductors of the first and second fusible conductors 208 and 209 are surely aggregated and bonded onto the first and second electrodes 204 and 205, and the first and second electrodes 204 and 205 are short-circuited. Can be made.
  • the short-circuit element 201 forms the second fusible conductor 209 narrower than the first fusible conductor 208 by forming the second fusible conductor 209 narrower than the first fusible conductor 208. It may be melted first.
  • the fusing time can be shortened, so that the second soluble conductor 209 can be melted prior to the first soluble conductor 208. it can.
  • the area of the first electrode 204 is preferably larger than that of the third electrode 206, and the area of the second electrode 205 is preferably larger than those of the fourth and fifth electrodes 207 and 231. . Since the holding amount of the molten conductor increases in proportion to the electrode area, the areas of the first and second electrodes 204 and 205 are formed wider than those of the third, fourth, and fifth electrodes 206, 207, and 231. As a result, more molten conductors can be aggregated on the first and second electrodes 204 and 205, and the first and second electrodes 204 and 205 can be short-circuited reliably.
  • the short-circuit element 201 does not necessarily have to cover the first and second heating resistors 221 and 222 with the insulating layer 211.
  • the first and second heating resistors 221 and 221 222 may be installed inside the insulating substrate 202.
  • the first and second heating resistors 221 and 222 can be heated in the same manner as when the insulating layer 211 such as a glass layer is interposed. it can.
  • the first and second heating resistors 221 and 222 are formed on the surface on which the first to fifth electrodes 204, 205, 206, 207, and 231 of the insulating substrate 202 are formed. It may be installed on the back side opposite to.
  • the first and second heat generating resistors 221 and 222 can be formed by a simpler process than forming in the insulating substrate 202.
  • the insulating layer 211 is formed on the first and second heating resistors 221 and 222 in terms of protecting the resistor and ensuring insulation during mounting.
  • the first and second heating resistors 221 and 222 are formed on the surface on which the first to fifth electrodes 204, 205, 206, 207, and 231 of the insulating substrate 2 are formed. It may be installed on top.
  • the first and second heat generating resistors 221 and 222 can be formed by a simpler process than forming in the insulating substrate 202. In this case as well, it is desirable to form the insulating layer 211 on the first and second heating resistors 221 and 222.
  • a configuration may be employed in which a protective resistor connected to either the first electrode 204 or the second electrode 205 is provided.
  • the protective resistance is a resistance value corresponding to the internal resistance of the electronic component connected to the short circuit element, and is smaller than the resistance value of the first or second heating resistor 221, 222. That is, when the electronic component is operating normally, current does not flow to the short-circuit element side but flows to the electronic component side.
  • the short-circuit element to which the present invention is applied is not limited to the provision of the external terminal 212 continuous with the first and second electrodes 204 and 205 through the through-holes on the back surface of the insulating substrate 202, as shown in FIG.
  • the first external connection electrode 234 continuous with the first electrode 204, the first electrode 204, 205 are formed on the surface of the insulating substrate 202 where the first and second electrodes 204, 205 are formed.
  • One or a plurality of second external connection terminals 237 may be formed.
  • the first and second external connection electrodes 234 and 236 are electrodes that connect the short-circuit element 233 and the circuit of the electronic device in which the short-circuit element 233 is incorporated, and the first external connection electrode 234 is the same as the first electrode 204.
  • the second external connection electrode 236 is continuous with the second electrode 205.
  • the first and second external connection electrodes 234 and 236 are formed using a general electrode material such as Cu or Ag, and are the same surface as the formation surface of the first and second electrodes 204 and 205 of the insulating substrate 202. Is formed. That is, in the short-circuit element 233 shown in FIG. 44, the surface on which the first and second fusible conductors 208 and 209 are provided is the mounting surface. Note that the first and second external connection electrodes 234 and 236 can be formed simultaneously with the first and second electrodes 204 and 205.
  • the first external connection terminal 235 is provided on the first external connection electrode 234.
  • a second external connection terminal 237 is provided on the second external connection electrode 236.
  • the first and second external connection terminals 235 and 237 are connection terminals for mounting on an electronic device, and are formed using, for example, metal bumps or metal posts. Further, as shown in FIG. 44A, the first and second external connection terminals 235 and 237 have a height protruding from the cover member 210 provided on the insulating substrate 202, and the short-circuit element 233. It can be mounted on the substrate side that is the mounting object.
  • the first heating resistor 221 of the short-circuit element 233 is formed with a first resistor connection terminal 221b via the first heating element lead-out electrode 223 and the first resistor terminal portion 221a.
  • the second heating resistor 222 of the short-circuit element 233 has a second resistor connection terminal 222b formed via the second heating element lead-out electrode 224 and the second resistor terminal portion 222a.
  • the fifth electrode 231 has a third external connection terminal 231b formed on the fifth electrode terminal portion 231a.
  • the first and second resistor connection terminals 221b and 222b and the third external connection terminal 231b are formed using metal bumps or metal posts, similarly to the first and second external connection terminals 235 and 237. It protrudes upward through the insulating layer 211.
  • the short-circuit element 233 is provided with the external terminal 212 on the back surface of the insulating substrate 202 like the short-circuit element 201 and connects the first and second electrodes 204 and 205 and the external terminal 212 through a through hole.
  • the first and second external connection terminals 235 and 237 are formed on the same surface as the first and second electrodes 204 and 205 via the first and second external connection electrodes 234 and 236. Yes.
  • the short-circuit element 233 is connected between the first and second external connection electrodes 234 and 236 when the first electrode 204 and the second electrode 205 are short-circuited.
  • the combined resistance of the first external connection terminal 235 and the second external connection terminal 237 is configured to be lower than the resistance.
  • the short-circuit element 233 can improve the rating when the first and second electrodes 204 and 205 are short-circuited to form a bypass current path, and can cope with a large current. That is, in high current applications such as lithium ion secondary batteries used as power sources such as HEV and EV, further improvement of the rating of the short-circuit element is required.
  • the conduction resistance between the first and second external connection electrodes 234 and 236 short-circuited by the fusible conductor can be sufficiently lowered to meet the rating improvement (for example, less than 0.4 m ⁇ ).
  • the first and second electrodes 204 are provided.
  • the first and second electrodes 204 have a high conduction resistance (for example, 0.5 to 1.0 m ⁇ ), and even if a conductor is filled in the through hole, there is a limit to lowering the conduction resistance of the entire short-circuit element.
  • the short-circuit element 233 is provided with external connection terminals 235 and 237 on the same surface as the first and second electrodes 204 and 205.
  • the external connection terminals 235 and 237 are provided on the external connection electrodes 234 and 236, and a terminal having a high degree of freedom in shape and size and having a low conduction resistance can be easily provided.
  • the short-circuit element 233 has a first external connection rather than a conduction resistance between the first and second external connection electrodes 234 and 236 when the first electrode 204 and the second electrode 205 are short-circuited.
  • the combined resistance of the terminal 235 and the second external connection terminal 237 is configured to be low.
  • the conduction resistance ahead of the first and second external connection electrodes 234 and 236, which is high in the configuration of the short-circuit element 201, can be easily lowered, and the rating is dramatically improved. Can be achieved.
  • the first and second external connection terminals 232 and 234 can be configured using, for example, metal bumps or metal posts made of Pb-free solder whose main component is Sn.
  • the shape of the metal bump or the metal post is not limited.
  • the resistance values of the first and second external connection terminals 235 and 237 can be obtained from the material, shape, and size. As an example, when a rectangular parallelepiped metal post (Cu core: 0.6 mm ⁇ 0.6 mm, cross-sectional area 0.36 mm 2, height 1 mm, specific resistance 17.2 ⁇ ⁇ mm) is used.
  • the resistance value of the Cu core of one terminal is about 0.048 m ⁇ , and the resistance value obtained by connecting the first and second external connection terminals 235 and 237 in series is as low as less than 0.096 m ⁇ in consideration of the solder coating. It can be seen that the overall rating of the short-circuit element 233 can be improved.
  • the short-circuit element 233 obtains the total resistance value of the entire element from the resistance value between the first and second external connection terminals 235 and 237 at the time of the short-circuit, and the total resistance value and the known first and second values. From the difference between the combined resistance of the external connection terminals 235 and 237, the conduction resistance between the first and second external connection electrodes 234 and 236 at the time of short circuit can be obtained. The short-circuit element 233 measures the resistance between the first and second external connection electrodes 234 and 236 at the time of short-circuit, and the first and second external elements are calculated from the difference from the total resistance value of the entire element at the time of short-circuit. The combined resistance of the connection terminals 235 and 237 can be obtained.
  • the short-circuit element 233 is provided wider by forming the first and second external connection electrodes 234 and 236 in a rectangular shape, and the first and second external connection terminals 235 and 237 are provided.
  • the conduction resistance may be lowered by providing a plurality.
  • the short-circuit element 233 reduces the conduction resistance by providing the first and second external connection terminals 235 and 237 having large diameters on the first and second external connection electrodes 234 and 236 that are widely provided. May be.
  • first and second external connection terminals 235 and 237 may be formed by providing low melting point metal layers 235b and 237b on the surfaces of the high melting point metals 235a and 237a serving as cores.
  • solder such as Pb-free solder containing Sn as a main component can be suitably used.
  • An alloy to be used can be preferably used.
  • the reflow temperature exceeds the melting temperature of the low melting point metal layers 235b and 237b, Even when the metal is melted, it can be prevented that the first and second external connection terminals 235 and 237 are melted.
  • the first and second external connection terminals 235 and 237 can be connected to the first and second external connection electrodes 234 and 236 using a low melting point metal constituting the outer layer.
  • the first and second external connection terminals 235 and 237 can be formed by forming a low melting point metal on the high melting point metal 235a and 237a by using a plating technique, and other well-known lamination techniques and films. It can also be formed by using a forming technique.
  • the first and second external connection terminals 235 and 237 are formed by using a conductive plating layer or a conductive layer formed by applying a conductive paste, in addition to using metal bumps or metal posts. May be.
  • first and second external connection terminals 235 and 237 are provided in advance on the mounting object side such as a substrate on which the short-circuit element 233 is mounted.
  • the external connection electrodes 234 and 236 or the first and second electrodes 204 and 205 may be connected.
  • FIG. 46 is a diagram showing a circuit configuration of a battery pack 240 in which a lithium ion battery used in various electronic devices such as cars and electric tools is built.
  • the battery pack 240 includes a battery cell 241, a short-circuit element 201, first and second current control elements 261 and 262 that control the operation of the short-circuit element 201, and a protective resistor 254. And a plurality of battery units 263 connected in series.
  • the battery pack 240 detects the voltage of the battery unit 263, the charge / discharge control circuit 255 that controls the charge / discharge of the battery unit 263, and the battery cell 241 of each battery unit 263, and the operation of the short-circuit element 201. And a detection circuit 256 that outputs an abnormal signal to the first and second current control elements 261 and 262 to be controlled.
  • the charge / discharge control circuit 255 controls the operation of the third and fourth current control elements 257 and 258 connected in series to the current path flowing from the battery unit 263 to the charging device, and the operation of these current control elements 257 and 258. Part 259.
  • the second electrode terminal portion 205a of the second electrode 205 (A1) of the short-circuit element 201 is connected to the charge / discharge current path of the battery pack 240, and the fifth electrode 231 (A2) By connecting the electrode terminal portion 231 a to the battery cell 41, the short-circuit element 201 is connected in series with the battery cell 241.
  • the second heating resistor 222 is connected to the first current control element 261 via the second resistor terminal portion 222a (P2).
  • the first electrode terminal portion 204a of the first electrode 204 is connected to the open end of the battery cell 241 via the protective resistor 254, so that the switch 220 is charged / discharged by the battery cell 241. Bypassed from the route.
  • the first heating resistor 221 is connected to the second current control element 262 via the first resistor terminal portion 221a.
  • the detection circuit 256 is connected to each battery cell 241, detects the voltage value of each battery cell 241, and when the battery cell 241 becomes an overcharge voltage or an overdischarge voltage, the battery unit having the battery cell 241. An abnormal signal is output to the first and second current control elements 261 and 262 of H.263.
  • the first and second current control elements 261 and 262 are configured by, for example, FETs, and the voltage value of the battery cell 241 exceeds a predetermined overdischarge or overcharge state by a detection signal output from the detection circuit 256.
  • the short-circuit element 201 is operated to cut off the charging / discharging current path of the battery unit 263 regardless of the switching operation of the third and fourth current control elements 257 and 258, and the switch 220 of the short-circuit element 201 is turned off. Control is performed so as to form a bypass current path that short-circuits and bypasses the battery unit 263.
  • the short-circuit element 201 is formed by heating and melting the second fusible conductor 209 with the second heating resistor 222 to thereby form the second electrode 205 (A1) and the fourth electrode. Between the first electrode 207 (P1) and between the fourth electrode 207 (P1) and the fifth electrode 231 (A2). Thus, as shown in FIG. 46B, the battery unit 263 having the abnormal battery cell 241 can be blocked from the charge / discharge current path of the battery pack 240. Note that power supply to the second heating resistor 222 is stopped when the second fusible conductor 209 is melted.
  • the battery pack 240 causes the detection circuit 256 to output an abnormal signal to the second current control element 262 of the battery unit 263 with a slight delay from the first current control element 261, and the first heat generation of the short-circuit element 201.
  • the resistor 221 also generates heat.
  • the short-circuit element 201 is configured to heat and melt the first fusible conductor 208 by the first heating resistor 221, so that the first and second possible electrodes aggregated into the first electrode 204 and the second electrode 205.
  • the molten conductors 208 and 209 are joined together.
  • the short-circuit element 201 can form a bypass current path that bypasses the battery unit 263 as shown in FIG. Note that power supply to the first heating resistor 221 is stopped when the first fusible conductor 208 is melted.
  • the protective resistor 254 has almost the same resistance value as the internal resistance of the battery cell 241, so that it can have the same capacity as that in the normal state even on the bypass current path.
  • a bypass current path that bypasses the battery unit 263 can be formed and is charged by the remaining normal battery units 263.
  • the discharge function can be maintained.
  • FIG. 47 is a plan view of the short-circuit element 270 in which the protective resistor 271 is formed on the insulating substrate 202.
  • the short-circuit element 270 includes a protective resistor 271 connected to the first electrode 204, and a first electrode terminal portion 204a is formed via the protective resistor 271.
  • the protective resistor 271 can be formed simultaneously by the same process using the same material as the first and second heating resistors 221 and 222 described above.
  • FIG. 48 is a diagram showing a circuit configuration of the short-circuit element 270.
  • the circuit configuration of the short-circuit element 270 includes a first fusible conductor (fuse) 208, a first heating resistor 221 connected to one end of the first fusible conductor 208, and a first fusible conductor. 208, a switch 220 connected to the other end to which the first heating resistor 221 is not connected, and a protective resistor 271 connected to at least one of the terminals of the switch 220. This is a short circuit in conjunction with the melting of the fusible conductor 208.
  • an external terminal 212 is provided on the back surface of the insulating substrate 202 and the first electrode terminal portion 204a and the second electrode terminal portion 205a are connected to the external terminal 212 through a through hole.
  • a first external connection that is continuous with the first electrode 204 through the protective resistor 271 is formed on the surface of the insulating substrate 202 on which the first and second electrodes 204 and 205 are formed.
  • the electrode 234, the first external connection terminal 235, the second external connection electrode 236 continuous with the second electrode 205, and the second external connection terminal 237 may be formed.
  • FIG. 49 is a diagram showing a circuit configuration of a battery pack 280 in which the short-circuit element 270 is incorporated.
  • Battery pack 280 has the same configuration as battery pack 240 described above except that short-circuit element 270 is used instead of short-circuit element 201. That is, the battery pack 280 includes a plurality of battery units 273 including battery cells 241, short-circuit elements 270, and first and second current control elements 261 and 262 that control the operation of the short-circuit elements 270. A plurality of battery units 273 are connected in series.
  • the protective resistance 271 of the short-circuit element 270 provided in each battery unit has substantially the same resistance value as the internal resistance of the battery cell 241 of the battery unit 273.
  • a bypass current path that bypasses the battery unit 273 can be formed, and the remaining normal battery unit 273 can be charged.
  • the discharge function can be maintained.
  • the battery pack 280 can have the same current capacity as that in the normal state on the bypass current path because the protective resistance 271 has substantially the same resistance value as the internal resistance of the battery cell 241.

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Abstract

In the present invention, only abnormal cells or abnormal electronic components in an electronic device are excluded, and the resistance is decreased by forming a bypass channel while maintaining functionality. The electronic device is composed of multiple battery cells or electronic components. An insulating substrate (2), a heat-generating resistor (3), first and second electrodes (4, 5), a third electrode (6), and a first soluble conductor (8) are provided. The heat-generating resistor is provided on the insulating substrate (2). The first and second electrodes are provided adjacent to each other on the insulating substrate (2). The third electrode is provided adjacent to the first electrode (4) on the insulating substrate (2), and is electrically connected to the heat-generating resistor. The first soluble conductor is provided between the first and third electrodes (4, 6) so as to configure a current channel, and is heated by the heat-generating resistor (3) so as to fuse the current channel between the first and third electrodes (4, 6). The first electrode (4) and the second electrode (5) are short-circuited by the first soluble conductor (8). The first soluble conductor is heated by the heat-generating resistor (3) so as to be melted and is agglomerated on the first and second electrodes (4, 5).

Description

短絡素子、およびこれを用いた回路Short circuit element and circuit using the same
　本発明は、基板上に発熱抵抗体とヒューズエレメントを設けた短絡素子を用いて、電子機器内の異常部品のみを排除する短絡素子及びこれを用いた回路に関する。 The present invention relates to a short-circuit element that eliminates only abnormal parts in an electronic device using a short-circuit element provided with a heating resistor and a fuse element on a substrate, and a circuit using the same.
　充電して繰り返し利用することのできる二次電池の多くは、バッテリパックに加工されてユーザに提供される。特に重量エネルギー密度の高いリチウムイオン二次電池においては、ユーザ及び電子機器の安全を確保するために、一般的に、過充電保護、過放電保護等のいくつもの保護回路をバッテリパックに内蔵し、所定の場合にバッテリパックの出力を遮断する機能を有している。 Most of the rechargeable batteries that can be charged and used repeatedly are processed into battery packs and provided to users. Particularly in lithium ion secondary batteries with high weight energy density, in order to ensure the safety of users and electronic devices, in general, a battery pack incorporates a number of protection circuits such as overcharge protection and overdischarge protection, It has a function of shutting off the output of the battery pack in a predetermined case.
　この種の保護素子には、バッテリパックに内蔵されたＦＥＴスイッチを用いて出力のＯＮ／ＯＦＦを行うことにより、バッテリパックの過充電保護又は過放電保護動作を行うものがある。しかしながら、何らかの原因でＦＥＴスイッチが短絡破壊した場合、雷サージ等が印加されて瞬間的な大電流が流れた場合、あるいはバッテリセルの寿命によって出力電圧が異常に低下したり、逆に過大な異常電圧を出力した場合であっても、バッテリパックや電子機器は、発火等の事故から保護されなければならない。そこで、このような想定し得るいかなる異常状態においても、バッテリセルの出力を安全に遮断するために、外部からの信号によって電流経路を遮断する機能を有するヒューズ素子からなる保護素子が用いられている。 Some types of protection elements perform overcharge protection or overdischarge protection operation of the battery pack by turning on / off the output using an FET switch built in the battery pack. However, when the FET switch is short-circuited for some reason, a lightning surge or the like is applied and an instantaneous large current flows, or the output voltage drops abnormally due to the life of the battery cell, or excessively abnormal Even when the voltage is output, the battery pack and the electronic device must be protected from accidents such as ignition. Therefore, in order to safely shut off the output of the battery cell in any possible abnormal state, a protection element made of a fuse element having a function of cutting off the current path by an external signal is used. .
　このようなリチウムイオン二次電池等向けの保護回路の保護素子としては、特許文献１に記載されているように、電流経路上の第１の電極，発熱体に繋がる導体層，第２の電極間に亘って可溶導体を接続して電流経路の一部をなし、この電流経路上の可溶導体を、過電流による自己発熱、あるいは保護素子内部に設けた発熱体によって溶断するものがある。このような保護素子では、溶融した液体状の可溶導体を発熱体に繋がる導体層上に集めることにより電流経路を遮断する。 As a protection element of a protection circuit for such a lithium ion secondary battery or the like, as described in Patent Document 1, a first electrode on a current path, a conductor layer connected to a heating element, a second electrode Some fusible conductors are connected to form part of the current path, and the fusible conductor on the current path is melted by self-heating due to overcurrent or by a heating element provided inside the protective element. . In such a protection element, the molten liquid soluble conductor is collected on the conductor layer connected to the heating element, thereby interrupting the current path.
　また、ＬＥＤ照明装置においては、直列接続されたＬＥＤ素子の個々に短絡素子を並列に接続し、ＬＥＤの異常時に所定の電圧で短絡素子が短絡して正常なＬＥＤを発光させる構成が提案されている（特許文献２）。特許文献２に記載の短絡素子は、所定膜厚の絶縁障壁層を、金属で挟んで構成された素子を、複数個直列に接続させている。 Moreover, in the LED lighting device, a configuration has been proposed in which a short-circuit element is connected in parallel to each of the LED elements connected in series, and when the LED is abnormal, the short-circuit element is short-circuited at a predetermined voltage to emit a normal LED. (Patent Document 2). In the short-circuit element described in Patent Document 2, a plurality of elements each having a predetermined thickness of an insulating barrier layer sandwiched between metals are connected in series.
特開２０１０－００３６６５号公報JP 2010-003665 A 特開２００７－１２３８１号公報JP 2007-12811 A
　近年、バッテリとモーターを使用したＨＥＶ（Hybrid Electric Vehicle）やＥＶ（Electric Vehicle）が急速に普及している。ＨＥＶやＥＶの動力源としては、エネルギー密度と出力特性からリチウムイオン二次電池が使用されるようになってきている。自動車用途では、高電圧、大電流が必要とされる。このため、高電圧、大電流に耐えられる専用セルが開発されているが、製造コスト上の問題から多くの場合、複数のバッテリセルを直列、並列に接続することで、汎用セルを用いて必要な電圧電流を確保している。 In recent years, HEV (Hybrid Electric Vehicle) and EV (Electric Vehicle) using a battery and a motor are rapidly spreading. As a power source for HEV and EV, a lithium ion secondary battery has been used from the viewpoint of energy density and output characteristics. In automobile applications, a high voltage and a large current are required. For this reason, dedicated cells that can withstand high voltages and large currents have been developed, but in many cases due to manufacturing cost problems, it is necessary to connect multiple battery cells in series and in parallel to use general-purpose cells. Secures the correct voltage and current.
　ところで、高速移動中の自動車等では、急激な駆動力の低下や急停止は却って危険な場合があり、非常時を想定したバッテリ管理が求められている。例えば、走行中にバッテリーシステムの異常が起きた際にも、修理工場もしくは安全な場所まで移動するための駆動力、あるいはハザードランプやエアコン用の駆動力を供給できることが、危険回避上、好ましい。 By the way, in a car or the like moving at high speed, a sudden drop in driving force or a sudden stop may be dangerous, and battery management that assumes an emergency is required. For example, when a battery system abnormality occurs during traveling, it is preferable to supply driving force for moving to a repair shop or a safe place, or driving force for a hazard lamp or an air conditioner.
　しかし、特許文献１のような複数のバッテリセルが直列に接続されたバッテリパックにおいては、充放電経路上にのみ保護素子を設けたような場合、バッテリセルの一部に異常が発生し保護素子を作動させると、バッテリパック全体の充放電経路が遮断されてしまい、これ以上、電力を供給することができない。 However, in a battery pack in which a plurality of battery cells as in Patent Document 1 are connected in series, when a protection element is provided only on the charge / discharge path, an abnormality occurs in a part of the battery cell, and the protection element When is operated, the charging / discharging path of the entire battery pack is interrupted, and no more power can be supplied.
　また、特許文献２に記載されている短絡素子においては、電流電圧特性カーブによると、１０Ｖ印加時の抵抗値が約１７ＫΩと高く、オープン状態のＬＥＤ素子を効率よくバイパスするには更に抵抗値を下げることが望まれる。 Further, in the short-circuit element described in Patent Document 2, according to the current-voltage characteristic curve, the resistance value when 10 V is applied is as high as about 17 KΩ, and the resistance value is further increased in order to bypass the open LED element efficiently. Lowering is desired.
　そこで、本発明は、複数セルで構成されたバッテリパック内の異常バッテリセルのみを排除し、正常なバッテリセルを有効に活用できる保護素子において、バイパス経路を形成することができる短絡素子、およびこれを用いた回路を提供することを目的とする。 Therefore, the present invention eliminates only abnormal battery cells in a battery pack composed of a plurality of cells, and in a protective element that can effectively use normal battery cells, a short-circuit element that can form a bypass path, and the same An object of the present invention is to provide a circuit using this.
　上述した課題を解決するために、本発明に係る短絡素子は、絶縁基板と、上記絶縁基板に設けられた発熱抵抗体と、上記絶縁基板に、互いに隣接して設けられた第１、第２の電極と、上記絶縁基板に、上記第１の電極と隣接して設けられるとともに、上記発熱抵抗体に電気的に接続された第３の電極と、上記第１、第３の電極間に亘って設けられることにより電流経路を構成し、上記発熱抵抗体からの加熱により、上記第１、第３の電極間の上記電流経路を溶断する第１の可溶導体とを備え、上記発熱抵抗体からの加熱により溶融し、上記第１、第２の電極上に凝集した上記第１の可溶導体によって、上記第１の電極と上記第２の電極とが短絡することを特徴とするものである。 In order to solve the above-described problem, a short-circuit element according to the present invention includes an insulating substrate, a heating resistor provided on the insulating substrate, and first and second electrodes provided adjacent to each other on the insulating substrate. Between the first electrode and the third electrode, the third electrode provided on the insulating substrate adjacent to the first electrode, and electrically connected to the heating resistor. Provided with a first soluble conductor that melts the current path between the first and third electrodes by heating from the heating resistor, and the heating resistor. The first electrode and the second electrode are short-circuited by the first soluble conductor that is melted by heating from the first electrode and aggregated on the first and second electrodes. is there.
　また、本発明に係る短絡素子回路は、ヒューズと、上記ヒューズの一端に接続された発熱抵抗体と、上記ヒューズの上記発熱抵抗体が接続されていない他端に接続されたスイッチとを備え、上記スイッチは、上記ヒューズの溶断に連動して短絡するものである。 The short-circuit element circuit according to the present invention includes a fuse, a heating resistor connected to one end of the fuse, and a switch connected to the other end of the fuse to which the heating resistor is not connected. The switch is short-circuited in conjunction with the fusing of the fuse.
　また、本発明に係る補償回路は、ヒューズと、上記ヒューズの一端に接続された発熱抵抗体と、上記ヒューズの上記発熱抵抗体が接続されていない他端に接続されたスイッチとを有し、上記スイッチは、上記ヒューズの溶断に連動して短絡する短絡素子と、電子部品とを備え、上記スイッチは、両端子が上記電子部品と並列に接続され、上記発熱抵抗体の開放端子が、上記スイッチ端子のうち上記ヒューズが接続されていない端子に接続され、上記電子部品の異常時には、上記ヒューズが溶融することにより上記スイッチが短絡され、上記電子部品を迂回するバイパス電流経路が形成されるものである。 The compensation circuit according to the present invention includes a fuse, a heating resistor connected to one end of the fuse, and a switch connected to the other end of the fuse to which the heating resistor is not connected. The switch includes a short-circuit element that is short-circuited in conjunction with the fusing of the fuse and an electronic component, and the switch has both terminals connected in parallel to the electronic component, and the open terminal of the heating resistor is the The switch terminal is connected to a terminal to which the fuse is not connected, and when the electronic component is abnormal, the fuse is melted to short-circuit the switch, thereby forming a bypass current path that bypasses the electronic component. It is.
　また、本発明に係る補償回路は、ヒューズと、上記ヒューズの一端に接続された発熱抵抗体と、上記ヒューズの上記発熱抵抗体が接続されていない他端に接続されたスイッチとを有し、上記スイッチは、上記ヒューズの溶断に連動して短絡する短絡素子と、電子部品と、上記電子部品の電流経路上に接続され、上記電子部品の異常時に該電子部品への通電を電気信号で遮断する保護素子と、上記電子部品の異常を検知し、異常信号を出力する保護部品と、上記保護部品の異常信号を受けて動作する制御素子とを備え、上記電子部品及び上記保護素子の両端と、上記スイッチの両端子とを並列に接続し、上記発熱抵抗体の開放端子と上記保護素子の上記電気信号の入力端子を、上記制御素子に接続し、上記電子部品の異常時には、上記保護部品からの異常信号を受けて上記制御素子が動作し、上記保護素子による上記電子部品の電流経路の遮断と、上記ヒューズの溶断に連動した上記スイッチの短絡を行い、バイパス電流経路が形成されるものである。 The compensation circuit according to the present invention includes a fuse, a heating resistor connected to one end of the fuse, and a switch connected to the other end of the fuse to which the heating resistor is not connected. The switch is connected to a short-circuit element that is short-circuited in conjunction with the melting of the fuse, an electronic component, and a current path of the electronic component, and interrupts energization of the electronic component with an electrical signal when the electronic component is abnormal A protection element that detects an abnormality of the electronic component and outputs an abnormality signal, and a control element that operates in response to the abnormality signal of the protection component, and includes both ends of the electronic component and the protection element. , Both terminals of the switch are connected in parallel, the open terminal of the heating resistor and the input terminal of the electrical signal of the protection element are connected to the control element, and when the electronic component is abnormal, the protection unit The control element operates in response to an abnormal signal from the protective element, the current path of the electronic component is cut off by the protection element, and the switch is short-circuited in conjunction with the fusing of the fuse to form a bypass current path It is.
　また、本発明に係る短絡素子回路は、ヒューズと、上記ヒューズの一端に接続された発熱抵抗体と、上記ヒューズの上記発熱抵抗体が接続されていない他端に接続されたスイッチと、上記スイッチの端子の少なくとも一方の端子に接続された保護抵抗とを備え、上記スイッチは、上記ヒューズの溶断に連動して短絡するものである。 The short-circuit element circuit according to the present invention includes a fuse, a heating resistor connected to one end of the fuse, a switch connected to the other end of the fuse to which the heating resistor is not connected, and the switch And a protective resistor connected to at least one of the terminals, and the switch is short-circuited in conjunction with the fusing of the fuse.
　また、本発明に係る補償回路は、ヒューズと、上記ヒューズの一端に接続された発熱抵抗体と、上記ヒューズの上記発熱抵抗体が接続されていない他端に接続されたスイッチと、上記スイッチの端子のうち、上記ヒューズが接続されていない端子に接続された保護抵抗とを有し、上記スイッチは、上記ヒューズの溶断に連動して短絡する短絡素子と、電子部品とを備え、上記スイッチと上記ヒューズが接続された端子及び上記保護抵抗の開放端子と、上記電子部品とを、並列に接続し、上記発熱抵抗体は、上記保護抵抗と接続し、上記電子部品の異常時には、上記ヒューズが溶融することにより上記スイッチがオンとなり、バイパス電流経路が形成されるものである。 The compensation circuit according to the present invention includes a fuse, a heating resistor connected to one end of the fuse, a switch connected to the other end of the fuse not connected to the heating resistor, A protection resistor connected to a terminal to which the fuse is not connected, and the switch includes a short-circuit element that is short-circuited in conjunction with the melting of the fuse, and an electronic component, The terminal to which the fuse is connected and the open terminal of the protective resistor and the electronic component are connected in parallel, and the heating resistor is connected to the protective resistor, and when the electronic component is abnormal, the fuse is By melting, the switch is turned on, and a bypass current path is formed.
　また、本発明に係る補償回路は、ヒューズと、上記ヒューズの一端に接続された発熱抵抗体と、上記ヒューズの上記発熱抵抗体が接続されていない他端に接続されたスイッチと、上記スイッチの端子のうち、上記ヒューズが接続されていない端子に接続された保護抵抗とを有し、上記スイッチは、上記ヒューズの溶断に連動して短絡する短絡素子と、電子部品と、上記電子部品の電流経路上に接続され、上記電子部品の異常時に該電子部品への通電を電気信号で遮断する保護素子と、上記電子部品の異常を検知し、異常信号を出力する保護部品と、上記保護部品の異常信号を受けて動作する制御素子とを備え、上記電子部品及び上記保護素子の両端と、上記スイッチの上記ヒューズとの接続端子及び上記保護抵抗とを並列に接続し、上記発熱抵抗体の開放端子と上記保護素子の上記電気信号の入力端子を、上記制御素子に接続し、上記電子部品の異常時には、上記保護部品からの異常信号を受けて上記制御素子が動作し、上記保護素子による上記電子部品の電流経路の遮断と、上記ヒューズの溶断に連動した上記スイッチの短絡を行い、バイパス電流経路が形成されるものである。 The compensation circuit according to the present invention includes a fuse, a heating resistor connected to one end of the fuse, a switch connected to the other end of the fuse not connected to the heating resistor, A protection resistor connected to a terminal to which the fuse is not connected, and the switch includes a short-circuit element that is short-circuited in conjunction with the melting of the fuse, an electronic component, and a current of the electronic component A protection element that is connected on the path and that interrupts energization of the electronic component with an electric signal when the electronic component is abnormal; a protective component that detects an abnormality of the electronic component and outputs an abnormal signal; and A control element that operates in response to an abnormal signal, and connects both ends of the electronic component and the protection element, a connection terminal to the fuse of the switch, and the protection resistor in parallel, and An open terminal of a resistor and an input terminal of the electrical signal of the protective element are connected to the control element, and when the electronic component is abnormal, the control element is operated in response to an abnormal signal from the protective component, By interrupting the current path of the electronic component by the protective element and shorting the switch in conjunction with the fusing of the fuse, a bypass current path is formed.
　また、本発明に係る実装体は、短絡素子が実装対象物に実装された実装体において、上記短絡素子は、絶縁基板と、上記絶縁基板に設けられた発熱抵抗体と、上記絶縁基板に、互いに隣接して設けられた第１、第２の電極と、上記絶縁基板に、上記第１の電極と隣接して設けられるとともに、上記発熱抵抗体に電気的に接続された第３の電極と、上記第１、第３の電極間に亘って設けられることにより電流経路を構成し、上記発熱抵抗体からの加熱により、上記第１、第３の電極間の上記電流経路を溶断する第１の可溶導体と、上記絶縁基板の上記第１、第２の電極が形成された面と同一表面に形成され、上記第１の電極と連続する第１の外部接続電極及び上記第２の電極と連続する第２の外部接続電極とを備え、上記第１の電極が上記第１の外部接続電極上に接続された第１の外部接続端子を介して上記実装対象物と接続され、上記第２の電極が上記第２の外部接続電極上に接続された第２の外部接続端子を介して上記実装対象物と接続され、上記発熱抵抗体からの加熱により溶融し、上記第１、第２の電極上に凝集した上記第１の可溶導体によって、上記第１の電極と上記第２の電極とが短絡したときの、上記第１、第２の外部接続電極間の導通抵抗よりも、上記第１の外部接続端子と上記第２の外部接続端子との合成抵抗が低いことを特徴とするものである。 Further, the mounting body according to the present invention is a mounting body in which the short-circuit element is mounted on the mounting target, and the short-circuit element is formed on the insulating substrate, the heating resistor provided on the insulating substrate, and the insulating substrate. First and second electrodes provided adjacent to each other; and a third electrode provided on the insulating substrate adjacent to the first electrode and electrically connected to the heating resistor; A first current path is formed between the first and third electrodes to form a current path, and the current path between the first and third electrodes is fused by heating from the heating resistor. A first external connection electrode that is formed on the same surface as the surface on which the first and second electrodes of the insulating substrate are formed, and is continuous with the first electrode, and the second electrode. And a second external connection electrode that is continuous with the first electrode. A second external connection terminal connected to the mounting object via a first external connection terminal connected on the external connection electrode, and the second electrode connected to the second external connection electrode The first electrode and the first electrode are connected by the first soluble conductor that is connected to the mounting object through the heating resistor, melted by heating from the heating resistor, and aggregated on the first and second electrodes. The combined resistance of the first external connection terminal and the second external connection terminal is lower than the conduction resistance between the first and second external connection electrodes when the second electrode is short-circuited. It is characterized by.
　上述した課題を解決するために、本発明に係る短絡素子は、絶縁基板と、上記絶縁基板に形成された第１及び第２の発熱抵抗体と、上記絶縁基板に、互いに隣接して設けられた第１、第２の電極と、上記絶縁基板に、上記第１の電極と隣接して設けられるとともに、上記第１の発熱抵抗体に電気的に接続された第３の電極と、上記絶縁基板に、上記第２の電極と隣接して設けられるとともに、上記第２の発熱抵抗体に電気的に接続された第４の電極と、上記第１、第３の電極間に亘って設けられることにより電流経路を構成し、上記第１の発熱抵抗体からの加熱により、上記第１、第３の電極間の上記電流経路を溶断する第１の可溶導体と、上記第２、第４の電極間に亘って設けられることにより電流経路を構成し、上記第２の発熱抵抗体からの加熱により、上記第２、第４の電極間の上記電流経路を溶断する第２の可溶導体とを備え、上記第１、第２の発熱抵抗体からの加熱により溶融し、上記第１、第２の電極上に凝集した上記第１、第２の可溶導体によって、上記第１の電極と上記第２の電極とが短絡するものである。 In order to solve the above-described problem, a short-circuit element according to the present invention is provided adjacent to each other on an insulating substrate, first and second heating resistors formed on the insulating substrate, and the insulating substrate. The first and second electrodes, the third electrode provided on the insulating substrate adjacent to the first electrode, and electrically connected to the first heating resistor, and the insulation Provided adjacent to the second electrode on the substrate, and provided between the fourth electrode electrically connected to the second heating resistor and the first and third electrodes. A first fusible conductor that cuts off the current path between the first and third electrodes by heating from the first heating resistor, and the second and fourth Current path is formed by being provided between the electrodes, and the second heating resistor is formed. And a second fusible conductor that melts the current path between the second and fourth electrodes, and melts by heating from the first and second heating resistors. 1. The first electrode and the second electrode are short-circuited by the first and second soluble conductors aggregated on the second electrode.
　また、本発明に係る短絡素子回路は、スイッチと、上記スイッチの一端に接続された第１のヒューズと、上記スイッチの他端に接続された第２のヒューズと、上記第１のヒューズの上記スイッチと接続された一端と反対側の他端に接続された第１の発熱抵抗体と、上記第２のヒューズの上記スイッチと接続された一端と反対側の他端に接続された第２の発熱抵抗体とを有し、上記スイッチは、上記第１及び第２のヒューズが溶断されることにより、該第１及び第２のヒューズの溶融導体によって短絡されるものである。 The short-circuit element circuit according to the present invention includes a switch, a first fuse connected to one end of the switch, a second fuse connected to the other end of the switch, and the first fuse. A first heating resistor connected to the other end opposite to the one end connected to the switch; and a second heating resistor connected to the other end opposite to the one end connected to the switch of the second fuse. The switch has a heating resistor, and the switch is short-circuited by the molten conductor of the first and second fuses when the first and second fuses are blown.
　また、本発明に係る補償回路は、スイッチと、上記スイッチの一端に接続された第１のヒューズと、上記スイッチの他端に接続された第２のヒューズと、上記第１のヒューズの上記スイッチと接続された一端と反対側の他端に接続された第１の発熱抵抗体と、上記第２のヒューズの上記スイッチと接続された一端と反対側の他端に接続された第２の発熱抵抗体とを有し、上記スイッチは、上記第１及び第２のヒューズが溶断されることにより、該第１及び第２のヒューズの溶融導体によって短絡される短絡素子と、電子部品と、上記電子部品の電流経路上に接続され、上記電子部品の異常時に該電子部品への通電を電気信号で遮断する保護素子と、上記電子部品の異常を検知し、異常信号を出力する保護部品と、上記保護部品の異常信号を受けて動作する第１～第３の制御素子とを備え、上記電子部品及び上記保護素子の両端と、上記スイッチの両端子とを並列に接続し、上記第１、第２の発熱抵抗体、及び上記保護素子の電気信号の入力端子とを、それぞれ上記第１～第３の制御素子に接続し、上記電子部品の異常時には、上記保護部品からの異常信号を受けて上記第１～第３の制御素子が動作し、上記保護素子による上記電子部品の電流経路の遮断と、上記第１、第２のヒューズの溶断に連動した上記スイッチの短絡を行い、バイパス電流経路が形成されるものである。 The compensation circuit according to the present invention includes a switch, a first fuse connected to one end of the switch, a second fuse connected to the other end of the switch, and the switch of the first fuse. A first heating resistor connected to the other end opposite to the one end connected to the second end, and a second heat generation connected to the other end opposite to the one end connected to the switch of the second fuse. The switch includes a short-circuit element that is short-circuited by the molten conductor of the first and second fuses when the first and second fuses are blown, an electronic component, and the above-described switch A protection element that is connected on the current path of the electronic component and that cuts off the energization of the electronic component with an electric signal when the electronic component is abnormal; a protective component that detects an abnormality of the electronic component and outputs an abnormal signal; Abnormal signal of the above protection parts First to third control elements that operate in parallel, both ends of the electronic component and the protection element, and both terminals of the switch are connected in parallel, and the first and second heating resistors, And the electrical signal input terminal of the protection element are connected to the first to third control elements, respectively, and when the electronic component is abnormal, the abnormality signal from the protection component is received and the first to third control elements are received. The control element operates, the current path of the electronic component is cut off by the protection element, and the switch is short-circuited in conjunction with the fusing of the first and second fuses, thereby forming a bypass current path. is there.
　また、本発明に係る補償回路は、スイッチと、上記スイッチの一端に接続された第１のヒューズと、上記スイッチの他端に接続された第２のヒューズと、上記第１のヒューズの上記スイッチと接続された一端と反対側の他端に接続された第１の発熱抵抗体と、上記第２のヒューズの上記スイッチと接続された一端と反対側の他端に接続された第２の発熱抵抗体とを有し、上記スイッチは、上記第１及び第２のヒューズが溶断されることにより、該第１及び第２のヒューズの溶融導体によって短絡される短絡素子と、電子部品と、上記電子部品の電流経路上に接続され、上記電子部品の異常時に該電子部品への通電を電気信号で遮断する保護素子と、上記電子部品の異常を検知し、異常信号を出力する保護部品と、上記保護部品の異常信号を受けて動作する第１、第２の制御素子とを備え、上記電子部品及び上記保護素子の両端と、上記スイッチの両端子とを並列に接続し、上記第１の発熱抵抗体の端子を上記第１の制御素子に接続し、上記第２の発熱抵抗体及び上記保護素子の電気信号の入力端子を、上記第２の制御素子に接続し、上記電子部品の異常時には、上記保護部品からの異常信号を受けて上記第１、第２の制御素子が動作し、上記保護素子による上記電子部品の電流経路の遮断と、上記第１、第２のヒューズの溶断に連動した上記スイッチの短絡を行い、バイパス電流経路が形成されるものである。 The compensation circuit according to the present invention includes a switch, a first fuse connected to one end of the switch, a second fuse connected to the other end of the switch, and the switch of the first fuse. A first heating resistor connected to the other end opposite to the one end connected to the second end, and a second heat generation connected to the other end opposite to the one end connected to the switch of the second fuse. The switch includes a short-circuit element that is short-circuited by the molten conductor of the first and second fuses when the first and second fuses are blown, an electronic component, and the above-described switch A protection element that is connected on the current path of the electronic component and that cuts off the energization of the electronic component with an electric signal when the electronic component is abnormal; a protective component that detects an abnormality of the electronic component and outputs an abnormal signal; Abnormal signal of the above protection parts First and second control elements operating in parallel, both ends of the electronic component and the protection element, and both terminals of the switch are connected in parallel, and the terminal of the first heating resistor is connected to the terminal Connected to the first control element, and connected to the second control element are electrical signal input terminals of the second heating resistor and the protection element. In response to the abnormal signal, the first and second control elements operate to interrupt the current path of the electronic component by the protection element and to short-circuit the switch in conjunction with the fusing of the first and second fuses. And a bypass current path is formed.
　また、本発明に係る短絡素子回路は、スイッチと、上記スイッチの一端に接続された第１のヒューズと、上記スイッチの他端に接続された第２のヒューズと、上記第１のヒューズの上記スイッチと接続された一端と反対側の他端に接続された第１の発熱抵抗体と、上記第２のヒューズの上記スイッチと接続された一端と反対側の他端に接続された第２の発熱抵抗体と、上記スイッチに接続された保護抵抗とを有し、上記スイッチが、上記第１及び第２のヒューズが溶断されることにより、該第１及び第２のヒューズの溶融導体によって短絡されるものである。 The short-circuit element circuit according to the present invention includes a switch, a first fuse connected to one end of the switch, a second fuse connected to the other end of the switch, and the first fuse. A first heating resistor connected to the other end opposite to the one end connected to the switch; and a second heating resistor connected to the other end opposite to the one end connected to the switch of the second fuse. A heating resistor and a protective resistor connected to the switch, the switch being short-circuited by the molten conductor of the first and second fuses when the first and second fuses are blown; It is what is done.
　また、本発明に係る補償回路は、上記スイッチの一端に接続された第１のヒューズと、上記スイッチの他端に接続された第２のヒューズと、上記第１のヒューズの上記スイッチと接続された一端と反対側の他端に接続された第１の発熱抵抗体と、上記第２のヒューズの上記スイッチと接続された一端と反対側の他端に接続された第２の発熱抵抗体と、上記スイッチに接続された保護抵抗とを有し、上記スイッチは、上記第１及び第２のヒューズが溶断されることにより、該第１及び第２のヒューズの溶融導体によって短絡される短絡素子と、電子部品と、上記電子部品の電流経路上に接続され、上記電子部品の異常時に該電子部品への通電を電気信号で遮断する保護素子と、上記電子部品の異常を検知し、異常信号を出力する保護部品と、上記保護部品の異常信号を受けて動作する第１～第３の制御素子とを備え、上記電子部品及び上記保護素子の両端と、上記スイッチの両端子及び上記保護抵抗とを並列に接続し、上記第１、第２の発熱抵抗体、及び上記保護素子の電気信号の入力端子とを、それぞれ上記第１～第３の制御素子に接続し、上記電子部品の異常時には、上記保護部品からの異常信号を受けて上記第１～第３の制御素子が動作し、上記保護素子による上記電子部品の電流経路の遮断と、上記第１、第２のヒューズの溶断に連動した上記スイッチの短絡を行い、バイパス電流経路が形成されるものである。 The compensation circuit according to the present invention is connected to the first fuse connected to one end of the switch, the second fuse connected to the other end of the switch, and the switch of the first fuse. A first heating resistor connected to the other end opposite to the other end, and a second heating resistor connected to the other end opposite to the one end connected to the switch of the second fuse. And a protective resistor connected to the switch, the switch being short-circuited by the molten conductor of the first and second fuses when the first and second fuses are blown. And an electronic component, a protection element that is connected on the current path of the electronic component, and that interrupts energization of the electronic component with an electric signal when the electronic component is abnormal, and detects an abnormality of the electronic component, Protective parts that output First to third control elements that operate in response to an abnormality signal of the protective component, and connect both ends of the electronic component and the protective element to both terminals of the switch and the protective resistor in parallel. The first and second heating resistors and the electrical signal input terminal of the protection element are connected to the first to third control elements, respectively. In response to the abnormal signal, the first to third control elements operate to interrupt the current path of the electronic component by the protection element and to short-circuit the switch in conjunction with the fusing of the first and second fuses. And a bypass current path is formed.
　また、本発明に係る補償回路は、スイッチと、上記スイッチの一端に接続された第１のヒューズと、上記スイッチの他端に接続された第２のヒューズと、上記第１のヒューズの上記スイッチと接続された一端と反対側の他端に接続された第１の発熱抵抗体と、上記第２のヒューズの上記スイッチと接続された一端と反対側の他端に接続された第２の発熱抵抗体と、上記スイッチに接続された保護抵抗とを有し、上記スイッチは、上記第１及び第２のヒューズが溶断されることにより、該第１及び第２のヒューズの溶融導体によって短絡される短絡素子と、電子部品と、上記電子部品の電流経路上に接続され、上記電子部品の異常時に該電子部品への通電を電気信号で遮断する保護素子と、上記電子部品の異常を検知し、異常信号を出力する保護部品と、上記保護部品の異常信号を受けて動作する第１、第２の制御素子とを備え、上記電子部品及び上記保護素子の両端と、上記スイッチの両端子及び上記保護抵抗とを並列に接続し、上記第１の発熱抵抗体の端子を上記第１の制御素子に接続し、上記第２の発熱抵抗体及び上記保護素子の電気信号の入力端子を、上記第２の制御素子に接続し、上記電子部品の異常時には、上記保護部品からの異常信号を受けて上記第１、第２の制御素子が動作し、上記保護素子による上記電子部品の電流経路の遮断と、上記第１、第２のヒューズの溶断に連動した上記スイッチの短絡を行い、バイパス電流経路が形成されるものである。 The compensation circuit according to the present invention includes a switch, a first fuse connected to one end of the switch, a second fuse connected to the other end of the switch, and the switch of the first fuse. A first heating resistor connected to the other end opposite to the one end connected to the second end, and a second heat generation connected to the other end opposite to the one end connected to the switch of the second fuse. A resistor and a protective resistor connected to the switch, the switch being short-circuited by the molten conductor of the first and second fuses when the first and second fuses are blown; A short-circuit element, an electronic component, a protection element that is connected on a current path of the electronic component, and that interrupts energization of the electronic component with an electrical signal when the electronic component is abnormal, and detects an abnormality of the electronic component. Output an abnormal signal And a first control element and a second control element that operate in response to an abnormality signal of the protection part, and both ends of the electronic part and the protection element, both terminals of the switch, and the protection resistor are arranged in parallel. Connected to the first control element, the terminal of the first heating resistor is connected to the first control element, and the input terminals of the electrical signals of the second heating resistor and the protection element are connected to the second control element. When the electronic component is abnormal, the first and second control elements are operated in response to an abnormal signal from the protective component, and the current path of the electronic component is blocked by the protective element, and the first The switch is short-circuited in conjunction with the fusing of the second fuse, thereby forming a bypass current path.
　また、本発明に係る実装体は、短絡素子が実装対象物に実装された実装体において、上記短絡素子は、絶縁基板と、上記絶縁基板に形成された第１及び第２の発熱抵抗体と、上記絶縁基板に、互いに隣接して設けられた第１、第２の電極と、上記絶縁基板に、上記第１の電極と隣接して設けられるとともに、上記第１の発熱抵抗体に電気的に接続された第３の電極と、上記絶縁基板に、上記第２の電極と隣接して設けられるとともに、上記第２の発熱抵抗体に電気的に接続された第４の電極と、上記第１、第３の電極間に亘って設けられることにより電流経路を構成し、上記第１の発熱抵抗体からの加熱により、上記第１、第３の電極間の上記電流経路を溶断する第１の可溶導体と、上記第２、第４の電極間に亘って設けられることにより電流経路を構成し、上記第２の発熱抵抗体からの加熱により、上記第２、第４の電極間の上記電流経路を溶断する第２の可溶導体と、上記絶縁基板の上記第１、第２の電極が形成された面と同一表面に形成され、上記第１の電極と連続する第１の外部接続電極及び上記第２の電極と連続する第２の外部接続電極とを備え、上記第１の電極が上記第１の外部接続電極上に接続された第１の外部接続端子を介して上記実装対象物と接続され、上記第２の電極が上記第２の外部接続電極上に接続された第２の外部接続端子を介して上記実装対象物と接続され、上記第１、第２の発熱抵抗体からの加熱により溶融し、上記第１、第２の電極上に凝集した上記第１、第２の可溶導体によって、上記第１の電極と上記第２の電極とが短絡したときの、上記第１、第２の外部接続電極間の導通抵抗よりも、上記第１の外部接続端子と上記第２の外部接続端子との合成抵抗が低いことを特徴とするものである。 Further, the mounting body according to the present invention is a mounting body in which the short-circuit element is mounted on the mounting target, wherein the short-circuit element includes an insulating substrate, and first and second heating resistors formed on the insulating substrate. The first and second electrodes provided adjacent to each other on the insulating substrate, and provided on the insulating substrate adjacent to the first electrode and electrically connected to the first heating resistor. A third electrode connected to the second substrate; a fourth electrode provided on the insulating substrate adjacent to the second electrode; and electrically connected to the second heating resistor; A first current path is formed between the first and third electrodes to form a current path, and the current path between the first and third electrodes is blown by heating from the first heating resistor. Provided between the fusible conductor and the second and fourth electrodes. A second fusible conductor that forms a flow path and blows off the current path between the second and fourth electrodes by heating from the second heating resistor; and A first external connection electrode that is formed on the same surface as the surface on which the second electrode is formed and that is continuous with the first electrode; and a second external connection electrode that is continuous with the second electrode, and The first electrode is connected to the mounting object via a first external connection terminal connected to the first external connection electrode, and the second electrode is connected to the second external connection electrode. The second object is connected to the mounting object via the second external connection terminal, melted by heating from the first and second heating resistors, and aggregated on the first and second electrodes. 1. When the first electrode and the second electrode are short-circuited by the second soluble conductor, 1, than the conduction resistance between the second electrode for external connection, and is characterized in that the combined resistance between the first external connection terminal and the second external connection terminals is low.
　上述した課題を解決するために、本発明に係る短絡素子は、絶縁基板と、上記絶縁基板に形成された第１及び第２の発熱抵抗体と、上記絶縁基板に、互いに隣接して設けられた第１、第２の電極と、上記絶縁基板に、上記第１の電極と隣接して設けられるとともに、上記第１の発熱抵抗体に電気的に接続された第３の電極と、上記絶縁基板に、上記第２の電極と隣接して設けられるとともに、上記第２の発熱抵抗体に電気的に接続された第４の電極と、上記第４の電極に隣接して設けられた第５の電極と、上記第１、第３の電極間に亘って設けられることにより電流経路を構成し、上記第１の発熱抵抗体からの加熱により、上記第１、第３の電極間の上記電流経路を溶断する第１の可溶導体と、上記第２から上記第４の電極を経由して上記第５の電極に亘って設けられることにより電流経路を構成し、上記第２の発熱抵抗体からの加熱により、上記第２の電極と上記第４の電極との間、及び上記第４の電極と上記第５の電極との間の各上記電流経路を溶断する第２の可溶導体とを備え、上記第１、第２の発熱抵抗体からの加熱により溶融し、上記第１、第２の電極上に凝集した上記第１、第２の可溶導体によって、上記第１の電極と上記第２の電極とが短絡するものである。 In order to solve the above-described problem, a short-circuit element according to the present invention is provided adjacent to each other on an insulating substrate, first and second heating resistors formed on the insulating substrate, and the insulating substrate. The first and second electrodes, the third electrode provided on the insulating substrate adjacent to the first electrode, and electrically connected to the first heating resistor, and the insulation A fourth electrode provided on the substrate adjacent to the second electrode and electrically connected to the second heating resistor, and a fifth electrode provided adjacent to the fourth electrode. Between the first electrode and the first and third electrodes to form a current path, and by heating from the first heating resistor, the current between the first and third electrodes. The first soluble conductor for fusing the path, and the second to the fourth electrodes, and the above 5 is provided across the five electrodes to form a current path, and by heating from the second heating resistor, between the second electrode and the fourth electrode, and the fourth electrode, A second fusible conductor that melts each current path between the first electrode and the fifth electrode, and is melted by heating from the first and second heating resistors. The first and second soluble conductors agglomerated on the electrode short-circuit the first electrode and the second electrode.
　また、本発明に係る短絡素子回路は、スイッチと、上記スイッチの一端に接続された第１のヒューズと、上記第１のヒューズの開放端に接続された第１の発熱抵抗体と、上記スイッチの開放端と直列に接続された第２、第３のヒューズと、上記第２、第３のヒューズの接続点に接続された第２の発熱抵抗体とを備え、上記第２の発熱抵抗体の発熱により上記第２、第３のヒューズが溶断され、上記第１の発熱抵抗体の発熱により上記第１のヒューズが溶断されることにより、該第１のヒューズの溶融導体によって上記スイッチが短絡されるものである。 The short-circuit element circuit according to the present invention includes a switch, a first fuse connected to one end of the switch, a first heating resistor connected to an open end of the first fuse, and the switch Second and third fuses connected in series to the open end of the first and second heating resistors connected to the connection point of the second and third fuses, and the second heating resistor The second and third fuses are blown by the heat generation of the first fuse, and the first fuse is blown by the heat generation of the first heating resistor, whereby the switch is short-circuited by the molten conductor of the first fuse. It is what is done.
　また、本発明に係る補償回路は、スイッチと、上記スイッチの一端に接続された第１のヒューズと、上記第１のヒューズの開放端に接続された第１の発熱抵抗体と、上記スイッチの開放端と直列に接続された第２、第３のヒューズと、上記第２、第３のヒューズの接続点と接続された第２の発熱抵抗体とを備え、上記第２の発熱抵抗体の発熱により上記第２、第３のヒューズが溶断され、上記第１の発熱抵抗体の発熱により上記第１のヒューズが溶断されることにより、該第１のヒューズの溶融導体によって上記スイッチが短絡される短絡素子と、電子部品と、上記電子部品の異常を検知し、異常信号を出力する保護部品と、上記保護部品の異常信号を受けて動作する第１、第２の制御素子とを備え、上記第２、第３のヒューズと上記電子部品とを直列に接続して電流経路を構成し、上記スイッチと上記第１のヒューズとの接続点を上記電子部品の開放端にバイパスするように接続し、上記第１の発熱抵抗体の開放端に上記第１の制御素子を接続し、上記第２の発熱抵抗体の開放端に上記第２の制御素子を接続し、上記電子部品の異常時には、上記保護部品からの異常信号を受けて上記第１、第２の制御素子が動作し、上記電子部品の電流経路の遮断と、上記第１のヒューズの溶断に連動した上記スイッチの短絡を行い、バイパス電流経路が形成されるものである。 The compensation circuit according to the present invention includes a switch, a first fuse connected to one end of the switch, a first heating resistor connected to the open end of the first fuse, and the switch. A second and third fuse connected in series with the open end; and a second heating resistor connected to a connection point of the second and third fuses; The second and third fuses are blown by heat generation, and the first fuse is blown by heat generation of the first heating resistor, whereby the switch is short-circuited by the molten conductor of the first fuse. A short circuit element, an electronic component, a protective component that detects an abnormality of the electronic component and outputs an abnormal signal, and first and second control elements that operate in response to the abnormal signal of the protective component, The second and third fuses and the electrons Are connected in series to form a current path, the connection point between the switch and the first fuse is bypassed to the open end of the electronic component, and the first heating resistor is opened. The first control element is connected to the end, the second control element is connected to the open end of the second heating resistor, and when the electronic component is abnormal, an abnormal signal is received from the protective component. The first and second control elements operate to cut off the current path of the electronic component and short the switch in conjunction with the fusing of the first fuse, thereby forming a bypass current path. .
　また、本発明に係る短絡素子回路は、スイッチと、上記スイッチの一端に接続された第１のヒューズと、上記第１のヒューズの開放端に接続された第１の発熱抵抗体と、上記スイッチと上記第１のヒューズとの接続点と接続された保護抵抗と、上記スイッチの開放端と直列に接続された第２、第３のヒューズと、上記第２、第３のヒューズの接続点に接続された第２の発熱抵抗体とを備え、上記第２の発熱抵抗体の発熱により上記第２、第３のヒューズが溶断され、上記第１の発熱抵抗体の発熱により上記第１のヒューズが溶断されることにより、該第１のヒューズの溶融導体によって上記スイッチが短絡されるものである。 The short-circuit element circuit according to the present invention includes a switch, a first fuse connected to one end of the switch, a first heating resistor connected to an open end of the first fuse, and the switch And a protective resistor connected to a connection point of the first fuse, a second and third fuse connected in series with the open end of the switch, and a connection point of the second and third fuses. A second heat generating resistor connected, the second and third fuses are blown by heat generated by the second heat generating resistor, and the first fuse is generated by heat generated by the first heat generating resistor. Is blown, the switch is short-circuited by the molten conductor of the first fuse.
　また、本発明に係る補償回路は、スイッチと、上記スイッチの一端に接続された第１のヒューズと、上記第１のヒューズの開放端に接続された第１の発熱抵抗体と、上記スイッチと上記第１のヒューズとの接続点と接続された保護抵抗と、上記スイッチの開放端と直列に接続された第２、第３のヒューズと、上記第２、第３のヒューズの接続点に接続された第２の発熱抵抗体とを備え、上記第２の発熱抵抗体の発熱により上記第２、第３のヒューズが溶断され、上記第１の発熱抵抗体の発熱により上記第１のヒューズが溶断されることにより、該第１のヒューズの溶融導体によって上記スイッチが短絡される短絡素子と、電子部品と、上記電子部品の異常を検知し、異常信号を出力する保護部品と、上記保護部品の異常信号を受けて動作する第１、第２の制御素子とを備え、上記第２、第３のヒューズと上記電子部品とを直列に接続して電流経路を構成し、上記保護抵抗の開放端を上記電子部品の開放端にバイパスするように接続し、上記第１の発熱抵抗体の開放端に上記第１の制御素子を接続し、上記第２の発熱抵抗体の開放端に上記第２の制御素子を接続し、上記電子部品の異常時には、上記保護部品からの異常信号を受けて上記第１、第２の制御素子が動作し、上記電子部品の電流経路の遮断と、上記第１のヒューズの溶断に連動した上記スイッチの短絡を行い、バイパス電流経路が形成されるものである。 The compensation circuit according to the present invention includes a switch, a first fuse connected to one end of the switch, a first heating resistor connected to an open end of the first fuse, and the switch. A protective resistor connected to the connection point with the first fuse, a second and third fuse connected in series with the open end of the switch, and a connection point between the second and third fuses The second heat generating resistor, the second and third fuses are blown by the heat generated by the second heat generating resistor, and the first fuse is heated by the heat generated by the first heat generating resistor. A short-circuit element in which the switch is short-circuited by the molten conductor of the first fuse by being melted, an electronic component, a protective component that detects an abnormality of the electronic component and outputs an abnormal signal, and the protective component Operates in response to an abnormal signal First and second control elements, the second and third fuses and the electronic component are connected in series to form a current path, and the open end of the protective resistor is the open end of the electronic component Connecting the first control element to the open end of the first heating resistor, connecting the second control element to the open end of the second heating resistor, When the electronic component is abnormal, the first and second control elements operate in response to an abnormal signal from the protective component, and are linked to the interruption of the current path of the electronic component and the fusing of the first fuse. The switch is short-circuited to form a bypass current path.
　また、本発明に係る実装体は、短絡素子が実装対象物に実装された実装体において、上記短絡素子は、絶縁基板と、上記絶縁基板に形成された第１及び第２の発熱抵抗体と、上記絶縁基板に、互いに隣接して設けられた第１、第２の電極と、上記絶縁基板に、上記第１の電極と隣接して設けられるとともに、上記第１の発熱抵抗体に電気的に接続された第３の電極と、上記絶縁基板に、上記第２の電極と隣接して設けられるとともに、上記第２の発熱抵抗体に電気的に接続された第４の電極と、上記第４の電極に隣接して設けられた第５の電極と、上記第１、第３の電極間に亘って設けられることにより電流経路を構成し、上記第１の発熱抵抗体からの加熱により、上記第１、第３の電極間の上記電流経路を溶断する第１の可溶導体と、上記第２から上記第４の電極を経由して上記第５の電極に亘って設けられることにより電流経路を構成し、上記第２の発熱抵抗体からの加熱により、上記第２の電極と上記第４の電極との間、及び上記第４の電極と上記第５の電極との間の各上記電流経路を溶断する第２の可溶導体と、上記絶縁基板の上記第１、第２の電極が形成された面と同一表面に形成され、上記第１の電極と連続する第１の外部接続電極及び上記第２の電極と連続する第２の外部接続電極とを備え、上記第１の電極が上記第１の外部接続電極上に接続された第１の外部接続端子を介して上記実装対象物と接続され、上記第２の電極が上記第２の外部接続電極上に接続された第２の外部接続端子を介して上記実装対象物と接続され、上記第１、第２の発熱抵抗体からの加熱により溶融し、上記第１、第２の電極上に凝集した上記第１、第２の可溶導体によって、上記第１の電極と上記第２の電極とが短絡したときの、上記第１、第２の外部接続電極間の導通抵抗よりも、上記第１の外部接続端子と上記第２の外部接続端子との合成抵抗が低いことを特徴とするものである。 Further, the mounting body according to the present invention is a mounting body in which the short-circuit element is mounted on the mounting target, wherein the short-circuit element includes an insulating substrate, and first and second heating resistors formed on the insulating substrate. The first and second electrodes provided adjacent to each other on the insulating substrate, and provided on the insulating substrate adjacent to the first electrode and electrically connected to the first heating resistor. A third electrode connected to the second substrate; a fourth electrode provided on the insulating substrate adjacent to the second electrode; and electrically connected to the second heating resistor; A current path is formed by being provided between the first electrode and the third electrode, and by heating from the first heating resistor, A first soluble conductor for fusing the current path between the first and third electrodes; A current path is formed by being provided across the fifth electrode from the second through the fourth electrode, and the second electrode and the second electrode are heated by the second heating resistor. A second soluble conductor that blows off each of the current paths between the fourth electrode and between the fourth electrode and the fifth electrode, and the first and second electrodes of the insulating substrate. A first external connection electrode that is continuous with the first electrode and a second external connection electrode that is continuous with the second electrode, and the first electrode Is connected to the mounting object via a first external connection terminal connected to the first external connection electrode, and the second electrode is connected to the second external connection electrode. Connected to the mounting object via the external connection terminals of the first and second heating resistors. The first and second electrodes when the first electrode and the second electrode are short-circuited by the first and second fusible conductors that are more melted and aggregated on the first and second electrodes. The combined resistance of the first external connection terminal and the second external connection terminal is lower than the conduction resistance between the second external connection electrodes.
　本発明によれば、発熱抵抗体からの加熱により溶融し、第１、第２の電極上に凝集した溶融導体によって、絶縁されていた第１の電極と第２の電極とが短絡することにより、新たなバイパス電流経路を形成することができる。 According to the present invention, the insulated first electrode and the second electrode are short-circuited by the molten conductor that is melted by heating from the heating resistor and aggregated on the first and second electrodes. A new bypass current path can be formed.
　また、本発明によれば、第１、第２の発熱抵抗体からの加熱により溶融し、第１、第２の電極上に凝集した溶融導体によって、絶縁されていた第１の電極と第２の電極とが短絡することにより、新たなバイパス電流経路を形成することができる。 Further, according to the present invention, the first electrode and the second electrode which are melted by heating from the first and second heating resistors and are insulated by the molten conductor aggregated on the first and second electrodes. By short-circuiting the electrodes, a new bypass current path can be formed.
本発明が適用された短絡素子を示す図であり、（Ａ）は平面図、（Ｂ）は断面図である。It is a figure which shows the short circuit element to which this invention was applied, (A) is a top view, (B) is sectional drawing. 短絡素子の回路図であり、（Ａ）はスイッチが切れている状態、（Ｂ）はスイッチが短絡した状態を示す。It is a circuit diagram of a short circuiting element, (A) shows a state where the switch is turned off, and (B) shows a state where the switch is short-circuited. 絶縁されていた第１、第２の電極が溶融導体によって短絡された状態を示す図であり、（Ａ）は平面図、（Ｂ）は断面図である。It is a figure which shows the state by which the 1st, 2nd electrode which was insulated was short-circuited by the molten conductor, (A) is a top view, (B) is sectional drawing. 第２の可溶導体が先に溶融している状態を示す平面図である。It is a top view which shows the state which the 2nd soluble conductor melt | dissolved previously. 第２の可溶導体を幅狭に形成した短絡素子を示す平面図である。It is a top view which shows the short circuit element which formed the 2nd soluble conductor narrowly. 短絡素子の変形例を示す断面図である。It is sectional drawing which shows the modification of a short circuit element. 短絡素子の変形例を示す断面図である。It is sectional drawing which shows the modification of a short circuit element. 短絡素子の変形例を示す断面図である。It is sectional drawing which shows the modification of a short circuit element. 第４の電極及び第２の可溶導体を省略して形成された短絡素子を示す図であり、（Ａ）は平面図、（Ｂ）は断面図である。It is a figure which shows the short circuit element which abbreviate | omitted the 4th electrode and the 2nd soluble conductor, (A) is a top view, (B) is sectional drawing. 第４の電極及び第２の可溶導体を省略して形成された短絡素子において、絶縁されていた第１、第２の電極が溶融導体によって短絡された状態を示す断面図である。It is sectional drawing which shows the state by which the insulated 1st and 2nd electrode was short-circuited by the molten conductor in the short circuit element formed by abbreviate | omitting a 4th electrode and a 2nd soluble conductor. 本発明が適用された他の短絡素子を示す図であり、（Ａ）は可溶導体の溶融前、（Ｂ）は可溶導体の溶融後の状態を示す。It is a figure which shows the other short circuit element to which this invention was applied, (A) shows the state after melt | dissolution of a soluble conductor, (B) shows the state after melt | dissolution of a soluble conductor. 本発明が適用された他の短絡素子を示す平面図である。It is a top view which shows the other short circuit element to which this invention was applied. 短絡素子を用いたＬＥＤ照明装置の回路図であり、（Ａ）（Ｂ）は正常時、（Ｃ）は異常発生時、（Ｄ）はバイパス電流経路が形成された状態を示す。It is a circuit diagram of the LED illuminating device using a short circuit element, (A) (B) is normal, (C) is abnormal, (D) shows the state where the bypass current path was formed. 短絡素子を用いたバッテリパックの回路図であり、（Ａ）（Ｂ）は正常時、（Ｃ）は異常発生時、（Ｄ）はバイパス電流経路が形成された状態を示す。It is a circuit diagram of the battery pack using a short circuit element, (A) and (B) at the time of normality, (C) at the time of abnormal occurrence, and (D) showing the state where a bypass current course was formed. 保護素子を示す図であり、（Ａ）は断面図、（Ｂ）は平面図である。It is a figure which shows a protection element, (A) is sectional drawing, (B) is a top view. 保護素子の回路図である。It is a circuit diagram of a protection element. 保護抵抗を内蔵した短絡素子を示す平面図である。It is a top view which shows the short circuit element which incorporated the protective resistance. 保護抵抗を内蔵した短絡素子の回路図である。It is a circuit diagram of a short circuit element incorporating a protective resistor. 保護抵抗を内蔵した短絡素子を用いたＬＥＤ照明装置の回路図である。It is a circuit diagram of the LED illuminating device using the short circuit element which incorporated the protective resistance. 保護抵抗を内蔵した短絡素子を用いたバッテリパックの回路図である。It is a circuit diagram of a battery pack using a short-circuit element incorporating a protective resistor. 本発明が適用された短絡素子を示す図であり、（Ａ）は平面図、（Ｂ）は断面図である。It is a figure which shows the short circuit element to which this invention was applied, (A) is a top view, (B) is sectional drawing. 短絡素子の回路図であり、（Ａ）はスイッチが切れている状態、（Ｂ）はスイッチが短絡した状態を示す。It is a circuit diagram of a short circuiting element, (A) shows a state where the switch is turned off, and (B) shows a state where the switch is short-circuited. 短絡素子を示す図であり、（Ａ）は、絶縁されていた第１、第２の電極が溶融導体によって短絡された状態を示す平面図であり、（Ｂ）は断面図である。It is a figure which shows a short circuit element, (A) is a top view which shows the state by which the insulated 1st, 2nd electrode was short-circuited by the molten conductor, (B) is sectional drawing. 短絡素子において、第２の可溶導体が先に溶融している状態を示す平面図である。In a short circuiting element, it is a top view showing the state where the 2nd soluble conductor has melted previously. 短絡素子の変形例を示す断面図である。It is sectional drawing which shows the modification of a short circuit element. 短絡素子の変形例を示す断面図である。It is sectional drawing which shows the modification of a short circuit element. 短絡素子の変形例を示す断面図である。It is sectional drawing which shows the modification of a short circuit element. 本発明が適用された他の短絡素子を示す断面図であり、（Ａ）は可溶導体の溶融前、（Ｂ）は可溶導体の溶融後の状態を示す。It is sectional drawing which shows the other short circuit element to which this invention was applied, (A) shows the state after melt | dissolution of a soluble conductor, (B) shows the state after melt | dissolution of a soluble conductor. 本発明が適用された他の短絡素子を示す平面図である。It is a top view which shows the other short circuit element to which this invention was applied. 短絡素子を用いたバッテリパックの回路図であり、（Ａ）は正常時、（Ｂ）は保護素子を動作させた状態、（Ｃ）（Ｄ）は短絡素子を動作させバイパス電流経路が形成された状態を示す。FIG. 4 is a circuit diagram of a battery pack using a short-circuit element, where (A) is normal, (B) is a state in which a protection element is operated, and (C) and (D) are operating a short-circuit element to form a bypass current path Indicates the state. 保護素子を示す図であり、（Ａ）は断面図、（Ｂ）は平面図である。It is a figure which shows a protection element, (A) is sectional drawing, (B) is a top view. 保護素子の回路図である。It is a circuit diagram of a protection element. 保護抵抗を備える短絡素子を示す平面図である。It is a top view which shows a short circuit element provided with protection resistance. 保護抵抗を備える短絡素子の回路図であり、（Ａ）はスイッチが切れている状態、（Ｂ）はスイッチが短絡した状態を示す。It is a circuit diagram of a short circuiting element provided with protection resistance, (A) shows the state where a switch is cut off, and (B) shows the state where a switch was short-circuited. 保護抵抗を備える短絡素子を用いたバッテリパックの回路図である。It is a circuit diagram of the battery pack using the short circuit element provided with a protective resistance. 保護抵抗を備える短絡素子を用いたバッテリパックの変形例を示す回路図である。It is a circuit diagram which shows the modification of the battery pack using the short circuit element provided with a protection resistance. 短絡素子を示す図であり、（Ａ）は平面図、（Ｂ）は断面図である。It is a figure which shows a short circuit element, (A) is a top view, (B) is sectional drawing. 短絡素子の回路図である。It is a circuit diagram of a short circuit element. 短絡素子において、第２の可溶導体が先に溶融した状態を示す平面図である。In a short circuiting element, it is a top view showing the state where the 2nd soluble conductor melted first. 短絡素子を示す図であり、（Ａ）は絶縁されていた第１、第２の電極が溶融導体によって短絡された状態を示す平面図であり、（Ｂ）は断面図である。It is a figure which shows a short circuit element, (A) is a top view which shows the state by which the insulated 1st, 2nd electrode was short-circuited by the molten conductor, (B) is sectional drawing. 短絡素子の変形例を示す断面図である。It is sectional drawing which shows the modification of a short circuit element. 短絡素子の変形例を示す断面図である。It is sectional drawing which shows the modification of a short circuit element. 短絡素子の変形例を示す断面図である。It is sectional drawing which shows the modification of a short circuit element. 本発明が適用された他の短絡素子を示す断面図であり、（Ａ）は可溶導体の溶融前、（Ｂ）は可溶導体の溶融後の状態を示す。It is sectional drawing which shows the other short circuit element to which this invention was applied, (A) shows the state after melt | dissolution of a soluble conductor, (B) shows the state after melt | dissolution of a soluble conductor. 本発明が適用された他の短絡素子を示す平面図である。It is a top view which shows the other short circuit element to which this invention was applied. 短絡素子を用いたバッテリパックの回路図であり、（Ａ）は正常時、（Ｂ）は異常発生時、（Ｃ）はバイパス電流経路が形成された状態を示す。It is a circuit diagram of the battery pack using a short circuit element, (A) is normal, (B) is abnormal, and (C) shows a state where a bypass current path is formed. 保護抵抗を備える短絡素子を示す平面図である。It is a top view which shows a short circuit element provided with protection resistance. 保護抵抗を備える短絡素子の回路図である。It is a circuit diagram of a short circuit element provided with protection resistance. 保護抵抗を備える短絡素子を用いたバッテリパックの回路図である。It is a circuit diagram of the battery pack using the short circuit element provided with a protective resistance.
　以下、本発明が適用された短絡素子およびこれを用いた回路について、図面を参照しながら詳細に説明する。なお、本発明は、以下の実施形態のみに限定されるものではなく、本発明の要旨を逸脱しない範囲内において種々の変更が可能であることは勿論である。また、図面は模式的なものであり、各寸法の比率等は現実のものとは異なることがある。具体的な寸法等は以下の説明を参酌して判断すべきものである。また、図面相互間においても互いの寸法の関係や比率が異なる部分が含まれていることは勿論である。 Hereinafter, a short-circuit element to which the present invention is applied and a circuit using the same will be described in detail with reference to the drawings. It should be noted that the present invention is not limited to the following embodiments, and various modifications can be made without departing from the scope of the present invention. Further, the drawings are schematic, and the ratio of each dimension may be different from the actual one. Specific dimensions should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.
　［第１の実施の形態］
　［短絡素子］
　先ず、本発明の第１の実施の形態について説明する。図１（Ａ）に、短絡素子１の平面図を示し、図１（Ｂ）に、短絡素子１の断面図を示す。短絡素子１は、絶縁基板２と、絶縁基板２に設けられた発熱抵抗体３と、絶縁基板２に、互いに隣接して設けられた第１の電極４及び第２の電極５と、第１の電極４と隣接して設けられるとともに、発熱抵抗体３に電気的に接続された第３の電極６と、第２の電極５と隣接して設けられた第４の電極７と、第１、第３の電極４，６間に亘って設けられることにより電流経路構成し、発熱抵抗体３からの加熱により、第１、第３の電極４，６間の電流経路を溶断する第１の可溶導体８と、第２、第４の電極５，７間に亘って設けられ、発熱抵抗体３からの加熱により、第２、第４の電極５，７間の電流経路を溶断する第２の可溶導体９とを備える。そして、短絡素子１は、絶縁基板２上に内部を保護するカバー部材１０が取り付けられている。 [First Embodiment]
[Short-circuit element]
First, a first embodiment of the present invention will be described. FIG. 1A shows a plan view of the short-circuit element 1, and FIG. 1B shows a cross-sectional view of the short-circuit element 1. The short-circuit element 1 includes an insulating substrate 2, a heating resistor 3 provided on the insulating substrate 2, a first electrode 4 and a second electrode 5 provided adjacent to each other on the insulating substrate 2, and a first element A third electrode 6 provided adjacent to the first electrode 4 and electrically connected to the heating resistor 3; a fourth electrode 7 provided adjacent to the second electrode 5; The first current path is formed between the third electrodes 4 and 6 and the current path between the first and third electrodes 4 and 6 is blown by heating from the heating resistor 3. The second conductor 4 is provided between the fusible conductor 8 and the second and fourth electrodes 5 and 7, and melts the current path between the second and fourth electrodes 5 and 7 by heating from the heating resistor 3. 2 soluble conductors 9. In the short-circuit element 1, a cover member 10 that protects the inside is attached on the insulating substrate 2.
　絶縁基板２は、たとえば、アルミナ、ガラスセラミックス、ムライト、ジルコニアなどの絶縁性を有する部材を用いて略方形状に形成されている。絶縁基板２は、その他にも、ガラスエポキシ基板、フェノール基板等のプリント配線基板に用いられる材料を用いてもよいが、ヒューズ溶断時の温度に留意する必要がある。なお、絶縁基板２は、裏面に外部端子１２が形成されている。 The insulating substrate 2 is formed in a substantially square shape using an insulating member such as alumina, glass ceramics, mullite, zirconia, and the like. In addition, the insulating substrate 2 may be made of a material used for a printed wiring board such as a glass epoxy board or a phenol board, but it is necessary to pay attention to the temperature at which the fuse is blown. The insulating substrate 2 has external terminals 12 formed on the back surface.
　発熱抵抗体３は、比較的抵抗値が高く通電すると発熱する導電性を有する部材であって、たとえばＷ、Ｍｏ、Ｒｕ等からなる。これらの合金あるいは組成物、化合物の粉状体を樹脂バインダ等と混合して、ペースト状にしたものを絶縁基板２上にスクリーン印刷技術を用いてパターン形成して、焼成する等によって形成する。 The heating resistor 3 is a conductive member that has a relatively high resistance value and generates heat when energized, and is made of, for example, W, Mo, Ru, or the like. These alloys, compositions, or compound powders are mixed with a resin binder or the like to form a paste on the insulating substrate 2 by patterning using a screen printing technique and firing.
　発熱抵抗体３は、絶縁基板２上において絶縁層１１に被覆されている。絶縁層１１は、発熱抵抗体３の熱を効率よく第１～第４の電極４～７へ伝えるために設けられ、例えばガラス層からなる。発熱抵抗体３は、第１～第４の電極４～７を加熱することにより、溶融導体を凝集しやすくすることができる。 The heating resistor 3 is covered with an insulating layer 11 on the insulating substrate 2. The insulating layer 11 is provided to efficiently transmit the heat of the heating resistor 3 to the first to fourth electrodes 4 to 7, and is made of, for example, a glass layer. The heating resistor 3 can easily aggregate the molten conductor by heating the first to fourth electrodes 4 to 7.
　発熱抵抗体３を被覆する絶縁層１１上には、第１～第４の電極４，５，６，７が形成されている。第１の電極４は、一方側において第２の電極５と隣接して形成されるとともに、絶縁されている。第１の電極４の他方側には第３の電極６が形成されている。第１の電極４と第３の電極６とは、後述する第１の可溶導体８が接続されることにより導通され、短絡素子１の電流経路を構成する。また、第１の電極４は、絶縁基板２の側面に臨む第１の電極端子部４ａが形成されている。第１の電極端子部４ａは、スルーホールを介して絶縁基板２の裏面に設けられた外部端子１２と接続されている。 On the insulating layer 11 covering the heating resistor 3, first to fourth electrodes 4, 5, 6, and 7 are formed. The first electrode 4 is formed adjacent to the second electrode 5 on one side and insulated. A third electrode 6 is formed on the other side of the first electrode 4. The first electrode 4 and the third electrode 6 are electrically connected by connecting a first soluble conductor 8 to be described later, and constitute a current path of the short-circuit element 1. The first electrode 4 is formed with a first electrode terminal portion 4 a that faces the side surface of the insulating substrate 2. The first electrode terminal portion 4a is connected to an external terminal 12 provided on the back surface of the insulating substrate 2 through a through hole.
　また、第３の電極６は、絶縁基板２あるいは絶縁層１１に設けられた発熱体引出電極１３を介して発熱抵抗体３と接続されている。また、発熱抵抗体３は、発熱体引出電極１３を介して、絶縁基板２の側縁に臨む抵抗体端子部３ａが形成されている。抵抗体端子部３ａは、スルーホールを介して、絶縁基板２の裏面に設けられた外部端子１２と接続されている。 The third electrode 6 is connected to the heating resistor 3 through the heating element lead electrode 13 provided on the insulating substrate 2 or the insulating layer 11. Further, the heating resistor 3 is formed with a resistor terminal portion 3 a that faces the side edge of the insulating substrate 2 through the heating element lead-out electrode 13. The resistor terminal portion 3a is connected to an external terminal 12 provided on the back surface of the insulating substrate 2 through a through hole.
　第２の電極５の第１の電極４と隣接する一方側と反対の他方側には、第４の電極７が形成されている。第２の電極５と第４の電極７とは、後述する第２の可溶導体９が接続されている。また、第２の電極５は、絶縁基板２の側面に臨む第２の電極端子部５ａが形成されている。第２の電極端子部５ａは、スルーホールを介して絶縁基板２の裏面に設けられた外部端子１２と接続されている。 A fourth electrode 7 is formed on the other side of the second electrode 5 opposite to the one side adjacent to the first electrode 4. A second soluble conductor 9 described later is connected to the second electrode 5 and the fourth electrode 7. Further, the second electrode 5 is formed with a second electrode terminal portion 5 a facing the side surface of the insulating substrate 2. The second electrode terminal portion 5a is connected to an external terminal 12 provided on the back surface of the insulating substrate 2 through a through hole.
　なお、第１～第４の電極４，５，６，７は、ＣｕやＡｇ等の一般的な電極材料を用いて形成することができるが、少なくとも第１、第２の電極４，５の表面上には、Ｎｉ／Ａｕメッキ、Ｎｉ／Ｐｄメッキ、Ｎｉ／Ｐｄ／Ａｕメッキ等の被膜が、公知のメッキ処理により形成されていることが好ましい。これにより、第１、第２の電極４，５の酸化を防止し、溶融導体を確実に保持させることができる。また、短絡素子１をリフロー実装する場合に、第１、第２の可溶導体８，９を接続するハンダあるいは第１、第２の可溶導体８，９の外層を形成する低融点金属が溶融することにより第１、第２の電極４，５を溶食（ハンダ食われ）して切断するのを防ぐことができる。 The first to fourth electrodes 4, 5, 6, and 7 can be formed using a general electrode material such as Cu or Ag, but at least the first and second electrodes 4, 5 are formed. A coating such as Ni / Au plating, Ni / Pd plating, or Ni / Pd / Au plating is preferably formed on the surface by a known plating process. Thereby, oxidation of the 1st, 2nd electrodes 4 and 5 can be prevented, and a molten conductor can be hold | maintained reliably. In addition, when the short-circuit element 1 is mounted by reflow soldering, a solder that connects the first and second soluble conductors 8 and 9 or a low melting point metal that forms an outer layer of the first and second soluble conductors 8 and 9 is used. By melting, the first and second electrodes 4 and 5 can be prevented from being melted (soldered) and cut.
　［可溶導体］
　第１、第２の可溶導体８，９は、発熱抵抗体３の発熱により速やかに溶断される低融点金属からなり、例えばＳｎを主成分とするＰｂフリーハンダを好適に用いることができる。 [Soluble conductor]
The first and second fusible conductors 8 and 9 are made of a low melting point metal that is quickly melted by the heat generated by the heating resistor 3, and, for example, Pb-free solder containing Sn as a main component can be suitably used.
　また、第１、第２の可溶導体８，９は、低融点金属と高融点金属とを含有してもよい。低融点金属としては、Ｐｂフリーハンダなどのハンダを用いることが好ましく、高融点金属としては、Ａｇ、Ｃｕ又はこれらを主成分とする合金などを用いることが好ましい。高融点金属と低融点金属とを含有することによって、短絡素子１をリフロー実装する場合に、リフロー温度が低融点金属層の溶融温度を超えて、低融点金属が溶融しても、第１、第２の可溶導体８，９として溶断するに至らない。かかる第１、第２の可溶導体８，９は、高融点金属に低融点金属をメッキ技術を用いて成膜することによって形成してもよく、他の周知の積層技術、膜形成技術を用いることによって形成してもよい。なお、第１、第２の可溶導体８，９は、外層を構成する低融点金属を用いて、第１及び第３の電極４，６、又は第２及び第４の電極５，７へ、ハンダ接続することができる。 The first and second soluble conductors 8 and 9 may contain a low melting point metal and a high melting point metal. As the low melting point metal, it is preferable to use solder such as Pb-free solder, and as the high melting point metal, it is preferable to use Ag, Cu or an alloy containing these as a main component. By including the high melting point metal and the low melting point metal, even when the reflow temperature exceeds the melting temperature of the low melting point metal layer and the low melting point metal is melted when the short circuit element 1 is reflow mounted, the first, The second soluble conductors 8 and 9 do not blow out. The first and second fusible conductors 8 and 9 may be formed by depositing a low melting point metal on a high melting point metal using a plating technique, and other well-known lamination techniques and film forming techniques may be used. You may form by using. The first and second soluble conductors 8 and 9 are connected to the first and third electrodes 4 and 6 or the second and fourth electrodes 5 and 7 by using a low melting point metal constituting the outer layer. Can be soldered.
　第１、第２の可溶導体８，９は、内層を低融点金属とし、外層を高融点金属としてもよい。内層の低融点金属層の全表面を外層の高融点金属層で被覆した可溶導体を用いることにより、リフロー温度よりも融点の低い低融点金属を用いた場合でも、リフロー実装時に、内層の低融点金属の外部への流出を抑制することができる。また、溶断時も、内層の低融点金属が溶融することにより、外層の高融点金属を溶食（ハンダ食われ）し、速やかに溶断することができる。 The first and second fusible conductors 8 and 9 may have an inner layer made of a low melting point metal and an outer layer made of a high melting point metal. By using a soluble conductor in which the entire surface of the inner low melting point metal layer is covered with the outer high melting point metal layer, even when using a low melting point metal having a melting point lower than the reflow temperature, the inner layer has a low Outflow of the melting point metal to the outside can be suppressed. Further, when the inner layer low melting point metal melts, the outer layer high melting point metal is also eroded (soldered) and can be quickly melted.
　また、第１、第２の可溶導体８，９は、内層を高融点金属とし、外層を低融点金属とする被覆構造としてもよい。内層の高融点金属層の全表面を外層の低融点金属層で被覆した可溶導体を用いることにより、外層の低融点金属層を介して電極上に接続することができ、また、溶断時も、低融点金属層が速やかに溶融して高融点金属を溶食するため、速やかに溶断することができる。 Further, the first and second soluble conductors 8 and 9 may have a covering structure in which the inner layer is made of a high melting point metal and the outer layer is made of a low melting point metal. By using a soluble conductor in which the entire surface of the inner high-melting-point metal layer is covered with an outer low-melting-point metal layer, it can be connected to the electrode via the outer-layer low-melting-point metal layer. Since the low melting point metal layer melts rapidly and erodes the high melting point metal, it can be melted quickly.
　また、第１、第２の可溶導体８，９は、低融点金属層と、高融点金属層とが積層された積層構造としてもよい。また、低融点金属層と、高融点金属層とが交互に積層された４層以上の多層構造としてもよい。また、第１、第２の可溶導体８，９は、低融点金属層の表面に高融点金属層が面方向にストライプ状に積層してもよい。これらの構造によっても、低融点金属による高融点金属の溶食／溶断を短時間で行うことができる。 The first and second soluble conductors 8 and 9 may have a laminated structure in which a low melting point metal layer and a high melting point metal layer are laminated. Moreover, it is good also as a multilayered structure of four or more layers by which the low melting metal layer and the high melting metal layer were laminated | stacked alternately. Moreover, the 1st, 2nd soluble conductors 8 and 9 may laminate | stack a refractory metal layer on the surface of a low melting metal layer in stripe form at the surface direction. Even with these structures, the melting / cutting of the high melting point metal by the low melting point metal can be performed in a short time.
　また、第１、第２の可溶導体８，９は、多数の開口部を有する高融点金属と、上記開口部に挿入された低融点金属とから構成してもよい。これにより、溶融する低融点金属層に接する高融点金属層の面積が増大するので、より短時間で低融点金属層が高融点金属層を溶食することができるようになる。したがって、より速やか、かつ確実に可溶導体を溶断させることが可能となる。 The first and second soluble conductors 8 and 9 may be composed of a high melting point metal having a large number of openings and a low melting point metal inserted into the openings. As a result, the area of the refractory metal layer in contact with the molten low melting point metal layer increases, so that the low melting point metal layer can erode the refractory metal layer in a shorter time. Therefore, the soluble conductor can be blown out more quickly and reliably.
　また、第１、第２の可溶導体８，９は、高融点金属の体積よりも低融点金属の体積を多くすることが好ましい。これにより、第１、第２の可溶導体８，９は、効果的に高融点金属層の溶食による短時間での溶断を行うことができる。 Further, it is preferable that the first and second soluble conductors 8 and 9 have a volume of the low melting point metal larger than that of the high melting point metal. Thereby, the 1st, 2nd soluble conductors 8 and 9 can perform fusing in a short time by the corrosion of a refractory metal layer effectively.
　なお、第１、第２の可溶導体８，９の酸化防止、及び第１、第２の可溶導体８，９の溶融時における濡れ性を向上させるために、第１、第２の可溶導体８，９の上にはフラックス１５が塗布されている。 In order to prevent oxidation of the first and second soluble conductors 8 and 9 and to improve the wettability when the first and second soluble conductors 8 and 9 are melted, the first and second possible conductors 8 and 9 are used. A flux 15 is applied on the molten conductors 8 and 9.
　短絡素子１は、絶縁基板２がカバー部材１０に覆われることによりその内部が保護されている。カバー部材１０は、短絡素子１の側面を構成する側壁１６と、短絡素子１の上面を構成する天面部１７とを有し、側壁１６が絶縁基板２上に接続されることにより、短絡素子１の内部を閉塞する蓋体となる。このカバー部材１０は、上記絶縁基板２と同様に、たとえば、熱可塑性プラスチック，セラミックス，ガラスエポキシ基板等の絶縁性を有する部材を用いて形成されている。 The inside of the short-circuit element 1 is protected by covering the insulating substrate 2 with the cover member 10. The cover member 10 has a side wall 16 that constitutes a side surface of the short-circuit element 1 and a top surface portion 17 that constitutes an upper surface of the short-circuit element 1, and the short-circuit element 1 is connected to the side wall 16 on the insulating substrate 2. It becomes a lid that closes the inside of the. The cover member 10 is formed using an insulating member such as a thermoplastic, ceramic, glass epoxy substrate, etc., as with the insulating substrate 2.
　また、カバー部材１０は、天面部１７の内面側に、カバー部電極１８が形成されても良い。カバー部電極１８は、第１、第２の電極４，５と重畳する位置に形成されている。このカバー部電極１８は、発熱抵抗体３が発熱し、第１、第２の可溶導体８，９が溶融されると、第１、第２の電極４，５上に凝集した溶融導体が接触して濡れ広がることにより、溶融導体を保持する許容量を増加させることができる。 Further, the cover member 10 may have a cover electrode 18 formed on the inner surface side of the top surface portion 17. The cover part electrode 18 is formed at a position overlapping the first and second electrodes 4 and 5. When the heating resistor 3 generates heat and the first and second fusible conductors 8 and 9 are melted, the cover electrode 18 has a molten conductor aggregated on the first and second electrodes 4 and 5. By allowing the wet conductor to spread by contact, the allowable amount for holding the molten conductor can be increased.
　［短絡素子回路］
　以上のような短絡素子１は、図２（Ａ）（Ｂ）に示すような回路構成を有する。すなわち、短絡素子１は、第１の電極４ａと第２の電極５ａとが、正常時には絶縁され（図２（Ａ））、発熱抵抗体３の発熱により第１、第２の可溶導体８，９が溶融すると、当該溶融導体を介して短絡するスイッチ２０を構成する（図２（Ｂ））。そして、第１の電極端子部４ａと第２の電極端子部５ａは、スイッチ２０の両端子を構成する。また、第１の可溶導体８は、第３の電極６及び発熱体引出電極１３を介して発熱抵抗体３と接続されている。 [Short-circuit element circuit]
The short-circuit element 1 as described above has a circuit configuration as shown in FIGS. That is, in the short-circuit element 1, the first electrode 4 a and the second electrode 5 a are normally insulated (FIG. 2A), and the first and second soluble conductors 8 are generated by the heat generated by the heating resistor 3. , 9 constitutes a switch 20 that is short-circuited through the molten conductor (FIG. 2B). The first electrode terminal portion 4a and the second electrode terminal portion 5a constitute both terminals of the switch 20. The first fusible conductor 8 is connected to the heating resistor 3 via the third electrode 6 and the heating element lead electrode 13.
　そして、短絡素子１は、後述するように、電子機器等に組み込まれることにより、スイッチ２０の両端子４ａ、５ａが、当該電子機器の電流経路と並列に接続され、当該電流経路上の電子部品に異常が発生した場合に、スイッチ２０を短絡させ、当該電子部品をバイパスするバイパス電流経路を形成する。 As will be described later, the short-circuit element 1 is incorporated in an electronic device or the like, whereby both terminals 4a and 5a of the switch 20 are connected in parallel with the current path of the electronic device, and the electronic component on the current path When an abnormality occurs, the switch 20 is short-circuited to form a bypass current path that bypasses the electronic component.
　具体的に、短絡素子１は、並列接続されている電子部品に異常が生じると、抵抗体端子部３ａ側から電力が供給され、発熱抵抗体３が通電することにより発熱する。この熱により第１、第２の可溶導体８，９が溶融すると、溶融導体は、図３（Ａ）（Ｂ）に示すように、第１、第２の電極４，５上に凝集する。第１、第２の電極４，５は隣接して形成されているため、第１、第２の電極４，５上に凝集した溶融導体が結合し、これにより第１、第２の電極４，５が短絡する。すなわち、短絡素子１は、スイッチ２０の両端子間が短絡される（図２（Ｂ））。 Specifically, when an abnormality occurs in the electronic components connected in parallel, the short-circuit element 1 is supplied with electric power from the resistor terminal portion 3a side, and generates heat when the heating resistor 3 is energized. When the first and second fusible conductors 8 and 9 are melted by this heat, the molten conductors aggregate on the first and second electrodes 4 and 5 as shown in FIGS. . Since the first and second electrodes 4 and 5 are formed adjacent to each other, the agglomerated molten conductors are coupled to each other on the first and second electrodes 4 and 5, thereby the first and second electrodes 4. , 5 are short-circuited. That is, the short-circuit element 1 is short-circuited between both terminals of the switch 20 (FIG. 2B).
　なお、発熱抵抗体３への通電は、第１の可溶導体８が溶断することにより第１、第３の電極４，６間が遮断されるため、停止される。 It should be noted that energization to the heating resistor 3 is stopped because the first soluble conductor 8 is blown and the first and third electrodes 4 and 6 are cut off.
　［第２の可溶導体の先溶融］
　ここで、短絡素子１は、第２の可溶導体９が第１の可溶導体８よりも先行して溶融することが好ましい。第１の可溶導体８が第２の可溶導体９よりも先行して溶融すると、第２の可溶導体９が溶融する前に第１、第３の電極４，６間が遮断され、第１，第２の電極４，５上での溶融導体の結合が不充分となるおそれがある。 [First melting of second soluble conductor]
Here, in the short-circuit element 1, it is preferable that the second soluble conductor 9 is melted prior to the first soluble conductor 8. When the first fusible conductor 8 is melted prior to the second fusible conductor 9, the first and third electrodes 4, 6 are blocked before the second fusible conductor 9 is melted. There is a possibility that the bonding of the molten conductor on the first and second electrodes 4 and 5 becomes insufficient.
　このため、短絡素子１は、図１（Ａ）に示すように、発熱抵抗体３は、第２の可溶導体９との重畳面積が、第１の可溶導体８との重畳面積よりも広くなるように、第２の可溶導体９側に形成されている。これにより、発熱抵抗体３は、第２の可溶導体９のほぼ全面に亘って加熱できるが、第１の可溶導体８は加熱面積が少なくなり、図４に示すように、第２の可溶導体９が第１の可溶導体８よりも先行して溶融させることができる。 For this reason, as shown in FIG. 1A, the short-circuit element 1 has a heating resistor 3 in which the overlapping area with the second soluble conductor 9 is larger than the overlapping area with the first soluble conductor 8. It is formed on the second soluble conductor 9 side so as to be wide. Thereby, although the heating resistor 3 can be heated over almost the entire surface of the second soluble conductor 9, the heating area of the first soluble conductor 8 is reduced, and as shown in FIG. The soluble conductor 9 can be melted prior to the first soluble conductor 8.
　また、短絡素子１は、図５に示すように、第２の可溶導体９を、第１の可溶導体８よりも幅狭に形成することにより、第２の可溶導体９を第１の可溶導体よりも先に溶断するようにしてもよい。第２の可溶導体９を幅狭に形成することにより、溶断時間を短くすることができるため、第２の可溶導体９が第１の可溶導体８よりも先行して溶融させることができる。 Further, as shown in FIG. 5, the short-circuit element 1 forms the second fusible conductor 9 by forming the second fusible conductor 9 narrower than the first fusible conductor 8. The fusible conductor may be melted before the fusible conductor. Since the fusing time can be shortened by forming the second fusible conductor 9 narrow, the second fusible conductor 9 can be melted ahead of the first fusible conductor 8. it can.
　［電極面積］
　また、短絡素子１は、第１の電極４の面積を第３の電極６よりも広くし、第２の電極５の面積を第４の電極７よりも広くすることが好ましい。溶融導体の保持量は、電極面積に比例して多くなるため、第１、第２の電極４，５の面積を第３、第４の電極６，７よりも広く形成することにより、より多くの溶融導体を第１、第２の電極４，５上に凝集させることができ、第１、第２の電極４，５間を確実に短絡させることができる（図１（Ｂ）、図３（Ｂ））。 [Electrode area]
In the short-circuit element 1, the area of the first electrode 4 is preferably larger than that of the third electrode 6, and the area of the second electrode 5 is preferably larger than that of the fourth electrode 7. Since the holding amount of the molten conductor increases in proportion to the electrode area, the area of the first and second electrodes 4 and 5 is made larger than that of the third and fourth electrodes 6 and 7, thereby increasing the amount of the molten conductor. The molten conductor can be agglomerated on the first and second electrodes 4 and 5, and the first and second electrodes 4 and 5 can be reliably short-circuited (FIG. 1B, FIG. 3). (B)).
　［短絡素子の変形例］
　なお、短絡素子１は、必ずしも、発熱抵抗体３を絶縁層１１によって被覆する必要はなく、図６に示すように、発熱抵抗体３が絶縁基板２の内部に設置されてもよい。絶縁基板２の材料として熱伝導性に優れたものを用いることにより、発熱抵抗体３をガラス層等の絶縁層１１を介した場合と同等に加熱することができる。 [Modification of short circuit element]
The short-circuit element 1 does not necessarily need to cover the heating resistor 3 with the insulating layer 11, and the heating resistor 3 may be installed inside the insulating substrate 2 as shown in FIG. 6. By using a material having excellent thermal conductivity as the material of the insulating substrate 2, the heating resistor 3 can be heated in the same manner as when the insulating layer 11 such as a glass layer is interposed.
　また、短絡素子１は、上述したように発熱抵抗体３を絶縁基板２上の第１～第４の電極４，５，６，７の形成面側に形成する他にも、図７に示すように、発熱抵抗体３が絶縁基板２の第１～第４の電極４，５，６，７の形成面と反対の面に設置されてもよい。発熱抵抗体３を絶縁基板２の裏面に形成することにより、絶縁基板２内に形成するよりも簡易な工程で形成することができる。なお、この場合、発熱抵抗体３上には、絶縁層１１が形成されると抵抗体の保護や実装時の絶縁性確保と言う意味で好ましい。 In addition to forming the heating resistor 3 on the formation surface side of the first to fourth electrodes 4, 5, 6 and 7 on the insulating substrate 2 as described above, the short-circuit element 1 is shown in FIG. As described above, the heating resistor 3 may be disposed on the surface of the insulating substrate 2 opposite to the surface on which the first to fourth electrodes 4, 5, 6, 7 are formed. By forming the heating resistor 3 on the back surface of the insulating substrate 2, it can be formed by a simpler process than in the insulating substrate 2. In this case, it is preferable that the insulating layer 11 is formed on the heating resistor 3 in terms of protecting the resistor and ensuring insulation during mounting.
　さらに、短絡素子１は、図８に示すように、発熱抵抗体３が絶縁基板２の第１～第４の電極４，５，６，７の形成面上に設置されてもよい。発熱抵抗体３を絶縁基板２の表面に形成することにより、絶縁基板２内に形成するよりも簡易な工程で形成することができる。なお、この場合も、発熱抵抗体３上には、絶縁層１１が形成される事が好ましい。 Furthermore, in the short-circuit element 1, the heating resistor 3 may be disposed on the formation surface of the first to fourth electrodes 4, 5, 6, 7 of the insulating substrate 2 as shown in FIG. By forming the heating resistor 3 on the surface of the insulating substrate 2, it can be formed by a simpler process than in the insulating substrate 2. In this case also, it is preferable that the insulating layer 11 is formed on the heating resistor 3.
　［第４の電極、第２の可溶導体の省略］
　また、本発明に係る短絡素子は、図９（Ａ）（Ｂ）に示すように、短絡素子１の第４の電極７及び第２の可溶導体９を省いて形成してもよい。この短絡素子１では、第１、第３の電極４，６間に亘って接続された第１の可溶導体８が溶融することにより、当該溶融導体が第２の電極５まで濡れ拡がり、第１、第２の電極４，５を短絡させる。短絡素子１は、第４の電極７及び第２の可溶導体９が省かれている他は、上述した構成と同じであるため、同一の符号を付して詳細を省略する。 [Omission of fourth electrode and second soluble conductor]
Moreover, the short-circuit element according to the present invention may be formed by omitting the fourth electrode 7 and the second soluble conductor 9 of the short-circuit element 1 as shown in FIGS. In the short-circuit element 1, the first soluble conductor 8 connected between the first and third electrodes 4 and 6 is melted, so that the molten conductor wets and spreads to the second electrode 5. 1. Short-circuit the second electrodes 4 and 5. The short-circuit element 1 is the same as that described above except that the fourth electrode 7 and the second fusible conductor 9 are omitted.
　短絡素子１においても、第１、第２の電極４，５は、第３の電極６よりも広い面積を有することが好ましい。これにより、図１０に示すように、短絡素子１は、より多くの溶融導体を第１、第２の電極４，５上に凝集させることができ、第２の可溶導体９が無くとも第１、第２の電極４，５間を確実に短絡させることができる。 Also in the short-circuit element 1, the first and second electrodes 4 and 5 preferably have a larger area than the third electrode 6. As a result, as shown in FIG. 10, the short-circuit element 1 can agglomerate more molten conductors on the first and second electrodes 4 and 5, and without the second soluble conductor 9, The first and second electrodes 4 and 5 can be reliably short-circuited.
　また、図９（Ａ）（Ｂ）に示す短絡素子おいて、第２の電極５に第２の可溶導体を設けるようにしてもよい。第２の電極５上の第２の可溶導体は、発熱抵抗体３からの加熱により第１の可溶導体８とともに溶融し、第１の可溶導体８を引き寄せる。これにより、第１の電極４と第２の電極５とを短絡させることができる。 In the short-circuit element shown in FIGS. 9A and 9B, the second electrode 5 may be provided with a second soluble conductor. The second soluble conductor on the second electrode 5 is melted together with the first soluble conductor 8 by heating from the heating resistor 3, and draws the first soluble conductor 8. Thereby, the 1st electrode 4 and the 2nd electrode 5 can be short-circuited.
　また、第１の電極４又は第２の電極５のいずれか一方に接続される保護抵抗を備える構成としてもよい。ここで、保護抵抗は、短絡素子に接続する電子部品の内部抵抗相当の抵抗値とする。 Also, a configuration may be adopted in which a protective resistor connected to either the first electrode 4 or the second electrode 5 is provided. Here, the protective resistance is a resistance value corresponding to the internal resistance of the electronic component connected to the short-circuit element.
　また、本発明が適用された短絡素子は、絶縁基板２の裏面に第１、第２の電極とスルーホールを介して連続する外部端子１２を設ける以外にも、図１１（Ａ）（Ｂ）に示す短絡素子２５のように、絶縁基板２の第１、第２の電極４，５が形成された表面に、第１の電極４と連続する第１の外部接続電極２１、第１の外部接続電極２１上に設けられた１個もしくは複数個からなる第１の外部接続端子２２、第２の電極５と連続する第２の外部接続電極２３、第２の外部接続電極２３上に設けられた１個もしくは複数個からなる第２の外部接続端子２４を形成するようにしてもよい。 Further, the short-circuit element to which the present invention is applied is not limited to the provision of the external terminal 12 that is continuous with the first and second electrodes through the through-holes on the back surface of the insulating substrate 2, as shown in FIGS. The first external connection electrode 21 that is continuous with the first electrode 4 on the surface of the insulating substrate 2 on which the first and second electrodes 4 and 5 are formed, as shown in FIG. One or a plurality of first external connection terminals 22 provided on the connection electrode 21, a second external connection electrode 23 continuous with the second electrode 5, and a second external connection electrode 23 are provided. Alternatively, one or a plurality of second external connection terminals 24 may be formed.
　第１、第２の外部接続電極２１，２３は、短絡素子２５と短絡素子２５が組み込まれる電子機器の回路とを接続する電極であり、第１の外部接続電極２１は第１の電極４と連続され、第２の外部接続電極２３は第２の電極５と連続されている。 The first and second external connection electrodes 21 and 23 are electrodes that connect the short-circuit element 25 and a circuit of an electronic device in which the short-circuit element 25 is incorporated, and the first external connection electrode 21 is the same as the first electrode 4. The second external connection electrode 23 is continuous with the second electrode 5.
　第１、第２の外部接続電極２１，２３は、ＣｕやＡｇ等の一般的な電極材料を用いて形成され、絶縁基板２の第１、第２の電極４，５の形成面と同一面に形成されている。すなわち、図１１に示す短絡素子２５は、可溶導体１３が設けられる表面が実装面となる。なお、第１、第２の外部接続電極２１，２３は、第１、第２の電極４，５と同時に形成することができる。 The first and second external connection electrodes 21 and 23 are formed using a general electrode material such as Cu or Ag, and are the same surface as the formation surfaces of the first and second electrodes 4 and 5 of the insulating substrate 2. Is formed. That is, as for the short circuit element 25 shown in FIG. 11, the surface in which the soluble conductor 13 is provided becomes a mounting surface. The first and second external connection electrodes 21 and 23 can be formed simultaneously with the first and second electrodes 4 and 5.
　第１の外部接続電極２１上には、第１の外部接続端子２２が設けられている。同様に、第２の外部接続電極２３上には、第２の外部接続端子２４が設けられている。これら第１、第２の外部接続端子２２，２４は、電子機器へ実装するための接続端子であり、例えば金属バンプや、金属ポストを用いて形成されている。また、第１、第２の外部接続端子２２，２４は、図１１（Ａ）に示すように、絶縁基板２上に設けられたカバー部材１０よりも突出する高さを有し、短絡素子２５の実装対象物となる基板側に実装可能とされている。 A first external connection terminal 22 is provided on the first external connection electrode 21. Similarly, a second external connection terminal 24 is provided on the second external connection electrode 23. These first and second external connection terminals 22 and 24 are connection terminals for mounting on an electronic device, and are formed using, for example, metal bumps or metal posts. Further, as shown in FIG. 11A, the first and second external connection terminals 22 and 24 have a height protruding from the cover member 10 provided on the insulating substrate 2, and the short-circuit element 25. It can be mounted on the side of the board that is the mounting target.
　なお、短絡素子２５の発熱抵抗体３は、発熱体引出電極１３、及び抵抗体端子部３ａを介して、抵抗体接続端子３ｂが形成されている。抵抗体接続端子３ｂは、第１、第２の外部接続端子２２，２４と同様に、金属バンプや金属ポストを用いて形成され、絶縁層１１を介して上方に突出されている。 The heating resistor 3 of the short-circuit element 25 is formed with a resistor connecting terminal 3b via the heating element lead-out electrode 13 and the resistor terminal portion 3a. Similarly to the first and second external connection terminals 22 and 24, the resistor connection terminal 3 b is formed using a metal bump or a metal post, and protrudes upward through the insulating layer 11.
　このように、短絡素子２５は、上記短絡素子１のように絶縁基板２の裏面に外部端子１２を設けて第１、第２の電極４，５と当該外部端子１２とをスルーホールによって接続するものではなく、第１、第２の電極４，５と同一表面に、外部接続電極２１，２３を介して外部接続端子２２，２４を形成している。そして、図１１（Ｂ）に示すように、短絡素子２５は、第１の電極４と第２の電極５とが短絡したときの、第１、第２の外部接続電極２１，２３間の導通抵抗よりも、第１の外部接続端子２２と第２の外部接続端子２４との合成抵抗が低く構成されている。 Thus, the short circuit element 25 is provided with the external terminal 12 on the back surface of the insulating substrate 2 like the short circuit element 1 and connects the first and second electrodes 4 and 5 and the external terminal 12 through a through hole. Instead, the external connection terminals 22 and 24 are formed on the same surface as the first and second electrodes 4 and 5 via the external connection electrodes 21 and 23. Then, as shown in FIG. 11B, the short-circuit element 25 is connected between the first and second external connection electrodes 21 and 23 when the first electrode 4 and the second electrode 5 are short-circuited. The combined resistance of the first external connection terminal 22 and the second external connection terminal 24 is configured to be lower than the resistance.
　これにより、短絡素子２５は、第１、第２の電極４，５が短絡しバイパス電流経路を構成した際における定格を向上させ、大電流に対応することができる。すなわち、ＨＥＶやＥＶ等の動力源として使用されるリチウムイオン二次電池等の大電流用途においては、短絡素子の定格のさらなる向上が求められている。そして、可溶導体によって短絡された第１、第２の外部接続電極２１，２３間の導通抵抗は定格向上に応えることができる程度に十分下げることができる（例えば０．４ｍΩ未満）。 Thereby, the short-circuit element 25 can improve the rating when the first and second electrodes 4 and 5 are short-circuited to form a bypass current path, and can cope with a large current. That is, in high current applications such as lithium ion secondary batteries used as power sources such as HEV and EV, further improvement of the rating of the short-circuit element is required. Then, the conduction resistance between the first and second external connection electrodes 21 and 23 short-circuited by the fusible conductor can be sufficiently lowered (for example, less than 0.4 mΩ) to meet the rating improvement.
　しかし、絶縁基板２の裏面に外部端子１２を設け、第１、第２の電極４，５と当該外部端子１２とをスルーホールによって接続する短絡素子１においては、第１、第２の電極４，５と外部端子１２との間の導通抵抗が高く（例えば０．５～１．０ｍΩ）、スルーホール内に導体を充填したとしても、短絡素子全体の導通抵抗を下げるには限界がある。 However, in the short-circuit element 1 in which the external terminal 12 is provided on the back surface of the insulating substrate 2 and the first and second electrodes 4 and 5 and the external terminal 12 are connected by a through hole, the first and second electrodes 4 , 5 and the external terminal 12 have a high conduction resistance (for example, 0.5 to 1.0 mΩ), and even if a conductor is filled in the through hole, there is a limit to lowering the conduction resistance of the entire short-circuit element.
　また、高抵抗の第１、第２の電極４，５と外部端子１２との間に大電流を流すことによる発熱で、バイパス電流経路の破壊や、他の周辺機器への熱影響も懸念される。 In addition, heat generated by flowing a large current between the high resistance first and second electrodes 4 and 5 and the external terminal 12 may cause damage to the bypass current path and thermal effects on other peripheral devices. The
　この点、短絡素子２５は、第１、第２の電極４，５と同一表面に外部接続端子２２，２４を設けている。この外部接続端子２２，２４は、外部接続電極２１，２３上に設けるものであり、形状やサイズ等の自由度が高く、導通抵抗の低い端子を容易に設けることができる。これにより、短絡素子２５は、第１の電極４と第２の電極５とが短絡したときの、第１、第２の外部接続電極２１，２３間の導通抵抗よりも、第１の外部接続端子２２と第２の外部接続端子２４との合成抵抗が低く構成されている。 In this respect, the short-circuit element 25 is provided with external connection terminals 22 and 24 on the same surface as the first and second electrodes 4 and 5. The external connection terminals 22 and 24 are provided on the external connection electrodes 21 and 23, and a terminal having a high degree of freedom in shape and size and a low conduction resistance can be easily provided. Thus, the short-circuit element 25 has a first external connection rather than a conduction resistance between the first and second external connection electrodes 21 and 23 when the first electrode 4 and the second electrode 5 are short-circuited. The combined resistance of the terminal 22 and the second external connection terminal 24 is configured to be low.
　したがって、短絡素子２５によれば、短絡素子１の構成おいては高くなる第１、第２の外部接続電極２１，２３から先の導通抵抗を容易に下げることができ、定格の飛躍的な向上を図ることができる。 Therefore, according to the short-circuit element 25, the conduction resistance ahead of the first and second external connection electrodes 21 and 23, which are high in the configuration of the short-circuit element 1, can be easily lowered, and the rating is dramatically improved. Can be achieved.
　第１、第２の外部接続端子２２，２４としては、例えば、Ｓｎを主成分とするＰｂフリーハンダからなる金属バンプや金属ポストを用いて構成することができる。金属バンプや金属ポストの形状は問わない。第１、第２の外部接続端子２２，２４の抵抗値は材料や形状、サイズから求めることができる。一例として、Ｃｕコアの表面にハンダをコーティングした直方体の金属ポスト（Ｃｕコア：０．６ｍｍ×０．６ｍｍ、断面積０．３６ｍｍ２、高さ１ｍｍ、比抵抗１７．２μｍΩ・ｍｍ）を用いた場合、その１端子のＣｕコア部抵抗値は約０．０４８ｍΩであり、ハンダコーティング分を考慮すると第１、第２の外部接続端子２２，２４を直列接続させた抵抗値が０．０９６ｍΩ未満と低く、短絡素子２５全体の定格を向上できることがわかる。 As the first and second external connection terminals 22 and 24, for example, metal bumps or metal posts made of Pb-free solder whose main component is Sn can be used. The shape of the metal bump or the metal post is not limited. The resistance values of the first and second external connection terminals 22 and 24 can be obtained from the material, shape, and size. As an example, when a rectangular parallelepiped metal post (Cu core: 0.6 mm × 0.6 mm, cross-sectional area 0.36 mm 2, height 1 mm, specific resistance 17.2 μmΩ · mm) is used. The resistance value of the Cu core of one terminal is about 0.048 mΩ, and the resistance value obtained by connecting the first and second external connection terminals 22 and 24 in series is as low as less than 0.096 mΩ in consideration of the solder coating. It can be seen that the overall rating of the short-circuit element 25 can be improved.
　なお、短絡素子２５は、短絡時における第１、第２の外部接続端子２２，２４間に亘る抵抗値より素子全体の全抵抗値を求め、この全抵抗値と既知である第１、第２の外部接続端子２２，２４の合成抵抗との差より、短絡時における第１、第２の外部接続電極２１，２３間の導通抵抗を求めることができる。また、短絡素子２５は、短絡時における第１、第２の外部接続電極２１，２３間の抵抗を測定し、短絡時における素子全体の全抵抗値との差より、第１、第２の外部接続端子２２，２４の合成抵抗を求めることができる。 The short-circuit element 25 obtains the total resistance value of the entire element from the resistance value between the first and second external connection terminals 22 and 24 at the time of the short-circuit, and this total resistance value is known as the first and second values. From the difference with the combined resistance of the external connection terminals 22 and 24, the conduction resistance between the first and second external connection electrodes 21 and 23 at the time of short circuit can be obtained. The short-circuit element 25 measures the resistance between the first and second external connection electrodes 21 and 23 at the time of short-circuit, and the first and second external elements are calculated from the difference from the total resistance value of the entire element at the time of short-circuit. The combined resistance of the connection terminals 22 and 24 can be obtained.
　また、図１２に示すように、短絡素子２５は、第１、第２の外部接続電極２１，２３を矩形状に形成する等により広く設け、第１、第２の外部接続端子２２，２４を複数設けることにより導通抵抗を下げるようにしてもよい。その他にも、短絡素子２５は、広く設けた第１、第２の外部接続電極２１，２３に大径の第１、第２の外部接続端子２２，２４を設けることにより導通抵抗を下げるようにしてもよい。 In addition, as shown in FIG. 12, the short-circuit element 25 is widely provided by forming the first and second external connection electrodes 21 and 23 in a rectangular shape, and the first and second external connection terminals 22 and 24 are provided. The conduction resistance may be lowered by providing a plurality. In addition, the short-circuit element 25 reduces the conduction resistance by providing the first and second external connection terminals 22 and 24 having large diameters on the first and second external connection electrodes 21 and 23 that are widely provided. May be.
　また、第１、第２の外部接続端子２２，２４は、コアとなる高融点金属２２ａ，２４ａの表面に低融点金属層２２ｂ，２４ｂを設けることにより形成してもよい。低融点金属層２２ｂ，２４ｂを構成する金属としては、Ｓｎを主成分とするＰｂフリーハンダなどのハンダを好適に用いることができ、高融点金属２２ａ，２４ａとしては、ＣｕやＡｇを主成分とする合金などを好適に用いることができる。 The first and second external connection terminals 22 and 24 may be formed by providing low melting point metal layers 22b and 24b on the surfaces of the high melting point metals 22a and 24a serving as cores. As the metal constituting the low melting point metal layers 22b and 24b, solder such as Pb free solder containing Sn as a main component can be preferably used. As the high melting point metals 22a and 24a, Cu or Ag is used as a main component. An alloy to be used can be preferably used.
　高融点金属２２ａ，２４ａの表面に低融点金属層２２ｂ，２４ｂを設けることにより、短絡素子２５をリフロー実装する場合に、リフロー温度が低融点金属層２２ｂ，２４ｂの溶融温度を超えて、低融点金属が溶融しても、第１、第２の外部接続端子２２，２４として溶融することを防止することができる。また、第１、第２の外部接続端子２２，２４は、外層を構成する低融点金属を用いて、第１、第２の外部接続電極２１，２３へ接続することができる。 By providing the low melting point metal layers 22b and 24b on the surfaces of the high melting point metals 22a and 24a, the reflow temperature exceeds the melting temperature of the low melting point metal layers 22b and 24b when the short circuit element 25 is reflow mounted. Even if the metal is melted, it can be prevented from melting as the first and second external connection terminals 22 and 24. The first and second external connection terminals 22 and 24 can be connected to the first and second external connection electrodes 21 and 23 using a low melting point metal constituting the outer layer.
　第１、第２の外部接続端子２２，２４は、高融点金属２２ａ，２４ａに低融点金属をメッキ技術を用いて成膜することにより形成することができ、またその他の周知の積層技術、膜形成技術を用いることによっても形成することができる。 The first and second external connection terminals 22 and 24 can be formed by forming a low melting point metal on the high melting point metal 22a and 24a by using a plating technique, and other known lamination techniques and films. It can also be formed by using a forming technique.
　なお、第１、第２の外部接続端子２２，２４は、金属バンプや金属ポストを用いて形成する他にも、導電メッキ層や、導電ペーストを塗布することにより形成された導電層により形成してもよい。 The first and second external connection terminals 22 and 24 are formed by a conductive plating layer or a conductive layer formed by applying a conductive paste, in addition to using metal bumps or metal posts. May be.
　また、第１、第２の外部接続端子２２，２４は、短絡素子２５が実装される基板等の実装対象物側に予め設け、短絡素子が実装された実装体において、第１、第２の外部接続電極２１，２３と接続されるようにしてもよい。 In addition, the first and second external connection terminals 22 and 24 are provided in advance on the mounting object side such as a substrate on which the short-circuit element 25 is mounted, and in the mounting body on which the short-circuit element is mounted, You may make it connect with the external connection electrodes 21 and 23. FIG.
　［ＬＥＤ補償回路］
　次いで、短絡素子１を組み込んだ電子機器の回路構成について説明する。図１３は、電子機器の例としてＬＥＤ照明装置３０の回路構成を示す図である。図１３（Ａ）に示すように、ＬＥＤ照明装置３０は、電流経路上に複数の発光ダイオード３１が直列に接続されている。また、ＬＥＤ照明装置３０は、各発光ダイオード３１と、短絡素子１のスイッチ２０の両端子４ａ、５ａとが保護抵抗３４を介して並列に接続されるとともに、短絡素子１の抵抗体端子部３ａが電流経路上に接続され、これによりＬＥＤユニット３２を構成する。ＬＥＤ照明装置３０は、複数のＬＥＤユニット３２が直列に接続されて構成されている。 [LED compensation circuit]
Next, a circuit configuration of an electronic device incorporating the short-circuit element 1 will be described. FIG. 13 is a diagram illustrating a circuit configuration of the LED lighting device 30 as an example of the electronic apparatus. As shown in FIG. 13A, the LED lighting device 30 has a plurality of light emitting diodes 31 connected in series on the current path. Further, in the LED lighting device 30, each light emitting diode 31 and both terminals 4 a and 5 a of the switch 20 of the short-circuit element 1 are connected in parallel via the protective resistor 34, and the resistor terminal portion 3 a of the short-circuit element 1. Are connected on the current path, thereby forming the LED unit 32. The LED lighting device 30 is configured by connecting a plurality of LED units 32 in series.
　保護抵抗３４は、発光ダイオード３１の内部抵抗相当の抵抗値を有する。また、発熱抵抗体３の抵抗値は、発光ダイオード３１の内部抵抗よりも大きい。したがって、発光ダイオード３１が正常に作動している場合、ＬＥＤ照明装置３０は、図１３（Ｂ）に示すように、電流Ｅは短絡素子１側へは流れず、発光ダイオード３１側に流れる。 The protective resistor 34 has a resistance value corresponding to the internal resistance of the light emitting diode 31. Further, the resistance value of the heating resistor 3 is larger than the internal resistance of the light emitting diode 31. Therefore, when the light emitting diode 31 is operating normally, the LED lighting device 30 does not flow to the short-circuit element 1 side but flows to the light emitting diode 31 side as shown in FIG. 13B.
　しかし、発光ダイオード３１に異常が現れて、電気的に開放されてしまうと、図１３（Ｃ）に示すように、ＬＥＤ照明装置３０は、電流Ｅが短絡素子１の抵抗体端子部３ａ側へ流れる。これにより、短絡素子１は、発熱抵抗体３が発熱し、第１、第２の可溶導体８，９が溶融し、この溶融導体が第１、第２の電極４，５上へ凝集する。したがって、短絡素子１は、図１３（Ｄ）に示すように、スイッチ２０の両端子４ａ、５ａが短絡することにより、バイパス電流経路を形成することができる。なお、第１、第２の可溶導体８，９が溶断することにより、発熱抵抗体３への給電は停止される。 However, if an abnormality appears in the light emitting diode 31 and it is electrically opened, as shown in FIG. 13C, the LED lighting device 30 causes the current E to flow to the resistor terminal portion 3a side of the short-circuit element 1. Flowing. As a result, in the short-circuit element 1, the heating resistor 3 generates heat, the first and second soluble conductors 8 and 9 are melted, and the molten conductor is aggregated on the first and second electrodes 4 and 5. . Therefore, as shown in FIG. 13D, the short-circuit element 1 can form a bypass current path by short-circuiting both terminals 4a and 5a of the switch 20. The first and second fusible conductors 8 and 9 are fused to stop the power supply to the heating resistor 3.
　このようなＬＥＤ照明装置３０によれば、一つの発光ダイオード３１に異常が起きた場合にも、当該発光ダイオード３１を迂回するバイパス電流経路を形成することができ、残りの正常な発光ダイオード３１によって照明機能を維持することができる。このとき、ＬＥＤ照明装置３０は、保護抵抗３４が発光ダイオード３１の内部抵抗とほぼ同じ抵抗値を有するため、バイパス電流経路上においても、正常時とほぼ同じ電流値とすることができる。 According to such an LED lighting device 30, even when an abnormality occurs in one light emitting diode 31, a bypass current path that bypasses the light emitting diode 31 can be formed. The lighting function can be maintained. At this time, since the protection resistor 34 has substantially the same resistance value as the internal resistance of the light emitting diode 31, the LED lighting device 30 can have substantially the same current value as in the normal state on the bypass current path.
　［バッテリ補償回路］
　次いで、短絡素子１を組み込んだ他の電子機器の回路構成について説明する。図１４は、クルマや電動工具等の各種電子機器に搭載されて用いられるリチウムイオンバッテリーが内蔵されたバッテリパック４０の回路構成を示す図である。図１４（Ａ）に示すように、バッテリパック４０は、電流経路上に複数のバッテリセル４１が直列に接続されることで、高電圧、大電流を確保している。また、バッテリパック４０は、各バッテリセル４１に、当該バッテリセル４１の過充電あるいは過放電等の異常時に電流経路を遮断する保護素子４２が接続されている。 [Battery compensation circuit]
Next, a circuit configuration of another electronic device incorporating the short-circuit element 1 will be described. FIG. 14 is a diagram illustrating a circuit configuration of a battery pack 40 in which a lithium ion battery used in various electronic devices such as a car and an electric tool is built. As shown in FIG. 14A, the battery pack 40 ensures a high voltage and a large current by connecting a plurality of battery cells 41 in series on the current path. In the battery pack 40, a protection element 42 that interrupts the current path when an abnormality such as overcharge or overdischarge of the battery cell 41 is connected to each battery cell 41.
　［保護素子の構成］
　保護素子４２は、図１５（Ａ）（Ｂ）に示すように、絶縁基板４４と、絶縁基板４４に積層され、絶縁部材４５に覆われた発熱抵抗体４６と、絶縁基板４４の両端に形成された電極４７（Ａ１），４７（Ａ２）と、絶縁部材４５上に発熱抵抗体４６と重畳するように積層された発熱体引出電極４８と、両端が電極４７（Ａ１），４７（Ａ２）にそれぞれ接続され、中央部が発熱体引出電極４８に接続された可溶導体４９とを備える。 [Configuration of protection element]
As shown in FIGS. 15A and 15B, the protection element 42 is formed on the insulating substrate 44, the heating resistor 46 laminated on the insulating substrate 44 and covered with the insulating member 45, and both ends of the insulating substrate 44. Electrodes 47 (A 1) and 47 (A 2), a heating element extraction electrode 48 laminated on the insulating member 45 so as to overlap the heating resistor 46, and electrodes 47 (A 1) and 47 (A 2) at both ends. And a fusible conductor 49 having a central portion connected to the heating element extraction electrode 48.
　絶縁基板４４は、上述した絶縁基板２と同様の材料を用いて、略方形状に形成されている。発熱抵抗体４６は、上述した発熱抵抗体３と同様の材料を用いて、同様の製法で形成される。保護素子４２は、発熱抵抗体４６を覆うように絶縁部材４５が配置され、この絶縁部材４５を介して発熱抵抗体４６に対向するように発熱体引出電極４８が配置される。発熱抵抗体４６の熱を効率良く可溶導体４９に伝えるために、発熱抵抗体４６と絶縁基板４４の間に絶縁部材４５を積層しても良い。発熱体引出電極４８の一端は、発熱体電極５０（Ｐ１）に接続される。また、発熱抵抗体４６の他端は、他方の発熱体電極５０（Ｐ２）に接続される。可溶導体４９は、上述した第１、第２の可溶導体８，９と同じものを用いることができる。 The insulating substrate 44 is formed in a substantially rectangular shape using the same material as that of the insulating substrate 2 described above. The heating resistor 46 is formed by the same manufacturing method using the same material as the heating resistor 3 described above. In the protection element 42, an insulating member 45 is disposed so as to cover the heating resistor 46, and a heating element extraction electrode 48 is disposed so as to face the heating resistor 46 through the insulating member 45. In order to efficiently transfer the heat of the heating resistor 46 to the fusible conductor 49, an insulating member 45 may be laminated between the heating resistor 46 and the insulating substrate 44. One end of the heating element extraction electrode 48 is connected to the heating element electrode 50 (P1). The other end of the heating resistor 46 is connected to the other heating element electrode 50 (P2). The soluble conductor 49 can be the same as the first and second soluble conductors 8 and 9 described above.
　なお、保護素子４２においても、上記短絡素子１と同様に、可溶導体４９の酸化防止のために、可溶導体４９上のほぼ全面にフラックスを塗布してもよい。また、保護素子４２は、内部を保護するためにカバー部材を絶縁基板４４上に載置してもよい。 In the protective element 42 as well, the flux may be applied to almost the entire surface of the soluble conductor 49 in order to prevent the soluble conductor 49 from being oxidized, as in the case of the short-circuit element 1. In addition, the protection element 42 may place a cover member on the insulating substrate 44 in order to protect the inside.
　以上のような保護素子４２は、図１６に示すような回路構成を有する。すなわち、保護素子４２は、発熱体引出電極４８を介して直列接続された可溶導体４９と、可溶導体４９の接続点を介して通電して発熱させることによって可溶導体４９を溶融する発熱抵抗体４６とからなる回路構成である。保護素子４２の２個の電極４７のうち、一方は、Ａ１に接続され、他方は、Ａ２に接続される。また、発熱体引出電極４８とこれに接続された発熱体電極５０は、Ｐ１に接続され、他方の発熱体電極５０は、Ｐ２に接続される。 The protective element 42 as described above has a circuit configuration as shown in FIG. That is, the protection element 42 generates heat by melting the soluble conductor 49 by energizing the soluble conductor 49 connected in series via the heating element extraction electrode 48 and the connection point of the soluble conductor 49 to generate heat. The circuit configuration includes a resistor 46. Of the two electrodes 47 of the protection element 42, one is connected to A1, and the other is connected to A2. Further, the heating element extraction electrode 48 and the heating element electrode 50 connected thereto are connected to P1, and the other heating element electrode 50 is connected to P2.
　［バッテリパックの回路構成］
　そして、保護素子４２は、図１４（Ａ）に示すように、リチウムイオン二次電池のバッテリパック４０内の回路に用いられる。バッテリパック４０は、バッテリセル４１と、保護素子４２と、短絡素子１と、保護素子４２の動作を制御する第１の電流制御素子５２と、短絡素子１の動作を制御する第２の電流制御素子５３と、保護抵抗５４とで構成されるバッテリユニット５１を複数備え、これら複数のバッテリユニット５１が直列に接続されている。 [Battery pack circuit configuration]
And the protection element 42 is used for the circuit in the battery pack 40 of a lithium ion secondary battery, as shown to FIG. 14 (A). The battery pack 40 includes a battery cell 41, a protection element 42, a short-circuit element 1, a first current control element 52 that controls the operation of the protection element 42, and a second current control that controls the operation of the short-circuit element 1. A plurality of battery units 51 each including an element 53 and a protective resistor 54 are provided, and the plurality of battery units 51 are connected in series.
　また、バッテリパック４０は、バッテリユニット５１と、バッテリユニット５１の充放電を制御する充放電制御回路５５と、各バッテリユニット５１のバッテリセル４１の電圧を検出するとともに、保護素子４２や短絡素子１の動作を制御する第１、第２の電流制御素子５２，５３に異常信号を出力する検出回路５６とを備える。 In addition, the battery pack 40 detects the voltage of the battery unit 51, the charge / discharge control circuit 55 that controls charging / discharging of the battery unit 51, and the battery cell 41 of each battery unit 51, and the protection element 42 and the short-circuit element 1. And a detection circuit 56 for outputting an abnormal signal to the first and second current control elements 52 and 53 for controlling the operation.
　各バッテリユニット５１は、保護素子４２の電極４７（Ａ１）がバッテリセル４１と直列に接続され、電極４７（Ａ２）がバッテリパック４０の充放電電流経路に接続される。また、バッテリユニット５１は、短絡素子１の第２の電極端子部５ａが保護素子４２の開放端と、保護抵抗５４を介して接続され、第１の電極端子部４ａがバッテリセル４１の開放端と接続されることにより、保護素子４２及びバッテリセル４１と、短絡素子１とが並列に接続されている。また、バッテリユニット５１は、保護素子４２の発熱体電極５０（Ｐ２）が第１の電流制御素子５２と接続され、短絡素子１の抵抗体端子部３ａが第２の電流制御素子５３と接続されている。 In each battery unit 51, the electrode 47 (A1) of the protection element 42 is connected in series with the battery cell 41, and the electrode 47 (A2) is connected to the charge / discharge current path of the battery pack 40. In the battery unit 51, the second electrode terminal portion 5 a of the short-circuit element 1 is connected to the open end of the protective element 42 via the protective resistor 54, and the first electrode terminal portion 4 a is open to the battery cell 41. , The protection element 42 and the battery cell 41 and the short-circuit element 1 are connected in parallel. Further, in the battery unit 51, the heating element electrode 50 (P2) of the protection element 42 is connected to the first current control element 52, and the resistor terminal portion 3a of the short circuit element 1 is connected to the second current control element 53. ing.
　検出回路５６は、各バッテリセル４１と接続され、各バッテリセル４１の電圧値を検出して、各電圧値を充放電制御回路５５の制御部５９に供給する。また、検出回路５６は、バッテリセル４１が過充電電圧又は過放電電圧になったときに、当該バッテリセル４１を有するバッテリユニット５１の第１、第２の電流制御素子５２，５３へ異常信号を出力する。 The detection circuit 56 is connected to each battery cell 41, detects the voltage value of each battery cell 41, and supplies each voltage value to the control unit 59 of the charge / discharge control circuit 55. Further, when the battery cell 41 becomes an overcharge voltage or an overdischarge voltage, the detection circuit 56 sends an abnormal signal to the first and second current control elements 52 and 53 of the battery unit 51 having the battery cell 41. Output.
　第１、第２の電流制御素子５２，５３は、たとえば電界効果トランジスタ（以下、ＦＥＴと呼ぶ。）により構成され、検出回路５６から出力される検出信号によって、バッテリセル４１の電圧値が所定の過放電又は過充電状態を超える電圧になったとき、保護素子４２及び短絡素子１を動作させて、バッテリユニット５１の充放電電流経路を第３、第４の電流制御素子５７，５８のスイッチ動作によらず遮断するとともに、短絡素子１のスイッチ２０を短絡させ、当該バッテリユニット５１をバイパスするバイパス電流経路を形成するように制御する。 The first and second current control elements 52 and 53 are constituted by, for example, field effect transistors (hereinafter referred to as FETs), and the voltage value of the battery cell 41 is set to a predetermined value by a detection signal output from the detection circuit 56. When the voltage exceeds the overdischarge or overcharge state, the protection element 42 and the short-circuit element 1 are operated to switch the charge / discharge current path of the battery unit 51 through the third and fourth current control elements 57 and 58. Regardless of whether it is cut off, the switch 20 of the short-circuit element 1 is short-circuited, and control is performed so as to form a bypass current path that bypasses the battery unit 51.
　また、バッテリパック４０は、正極端子４０ａ、図示しない負極端子を介して、着脱可能に充電装置に接続され、各バッテリセル４１に充電装置からの充電電圧が印加される。充電装置により充電されたバッテリパック４０は、正極端子４０ａ、負極端子をバッテリで動作する電子機器に接続することによって、この電子機器を動作させることができる。 Further, the battery pack 40 is detachably connected to the charging device via the positive terminal 40a and a negative terminal (not shown), and the charging voltage from the charging device is applied to each battery cell 41. The battery pack 40 charged by the charging device can operate the electronic device by connecting the positive electrode terminal 40a and the negative electrode terminal to the electronic device operated by the battery.
　充放電制御回路５５は、バッテリユニット５１から充電装置に流れる電流経路に直列接続された第３、第４の電流制御素子５７，５８と、これらの電流制御素子５７，５８の動作を制御する制御部５９とを備える。第３、第４の電流制御素子５７，５８は、たとえばＦＥＴにより構成され、制御部５９によりゲート電圧を制御することによって、バッテリユニット５１の電流経路の導通と遮断とを制御する。制御部５９は、充電装置から電力供給を受けて動作し、検出回路５６による検出結果に応じて、バッテリユニット５１が過放電又は過充電であるとき、電流経路を遮断するように、電流制御素子５７，５８の動作を制御する。 The charge / discharge control circuit 55 controls the operations of the third and fourth current control elements 57 and 58 connected in series to the current path flowing from the battery unit 51 to the charging device, and the operations of these current control elements 57 and 58. Part 59. The third and fourth current control elements 57 and 58 are configured by, for example, FETs, and control the gate voltage by the control unit 59 to control conduction and interruption of the current path of the battery unit 51. The control unit 59 operates by receiving power supply from the charging device, and according to the detection result by the detection circuit 56, when the battery unit 51 is overdischarged or overcharged, the current control element is cut off. The operations of 57 and 58 are controlled.
　このようなバッテリパック４０は、正常時には、短絡素子１のスイッチ２０が短絡されていないため、図１４（Ｂ）に示すように、電流Ｅは保護素子４２及びバッテリセル４１側に流れる。 In such a battery pack 40, since the switch 20 of the short-circuit element 1 is not short-circuited at normal times, the current E flows to the protection element 42 and the battery cell 41 side as shown in FIG.
　しかし、バッテリパック４０は、バッテリセル４１に電圧異常等が検知されると、検出回路５６より第１の電流制御素子５２に異常信号が出力され、保護素子４２の発熱抵抗体４６が発熱される。図１４（Ｃ）に示すように、保護素子４２は、発熱抵抗体４６によって、可溶導体４９を加熱、溶融させることにより、電極４７（Ａ１），４７（Ａ２）間を遮断する。これにより、異常なバッテリセル４１を有する当該バッテリユニット５１を、バッテリパック４０の充放電電流経路上から遮断することができる。なお、可溶導体４９が溶断することにより、発熱抵抗体４６への給電は停止される。 However, in the battery pack 40, when a voltage abnormality or the like is detected in the battery cell 41, an abnormality signal is output from the detection circuit 56 to the first current control element 52, and the heating resistor 46 of the protection element 42 generates heat. . As shown in FIG. 14C, the protection element 42 heats and melts the fusible conductor 49 by the heating resistor 46, thereby blocking between the electrodes 47 (A1) and 47 (A2). Thereby, the battery unit 51 having the abnormal battery cell 41 can be shut off from the charge / discharge current path of the battery pack 40. Note that power supply to the heating resistor 46 is stopped when the fusible conductor 49 is melted.
　次いで、バッテリパック４０は、検出回路５６により当該バッテリユニット５１の第２の電流制御素子５３にも異常信号が出力され、短絡素子１の発熱抵抗体３も発熱する。図１４（Ｄ）に示すように、短絡素子１は、発熱抵抗体３によって第１、第２の可溶導体８，９を加熱、溶融させることにより、第１、第２の電極４，５上に溶融導体が凝集し、スイッチ２０の第１の電極端子部４ａ及び第２の電極端子部５ａが短絡される。これにより、短絡素子１は、当該バッテリユニット５１をバイパスするバイパス電流経路を形成することができる。なお、第１、第２の可溶導体８，９が溶断することにより、発熱抵抗体３への給電は停止される。 Next, in the battery pack 40, an abnormality signal is output to the second current control element 53 of the battery unit 51 by the detection circuit 56, and the heating resistor 3 of the short-circuit element 1 also generates heat. As shown in FIG. 14 (D), the short-circuit element 1 has the first and second electrodes 4, 5 by heating and melting the first and second soluble conductors 8, 9 by the heating resistor 3. The molten conductor agglomerates on the top, and the first electrode terminal portion 4a and the second electrode terminal portion 5a of the switch 20 are short-circuited. Thereby, the short circuit element 1 can form a bypass current path that bypasses the battery unit 51. The first and second fusible conductors 8 and 9 are fused to stop the power supply to the heating resistor 3.
　なお、保護抵抗５４は、バッテリセル４１の内部抵抗とほぼ同じ抵抗値を有することにより、バイパス電流経路上においても、正常時と同じ容量とすることができる。 Note that the protective resistor 54 has substantially the same resistance value as the internal resistance of the battery cell 41, so that it can have the same capacity as normal even on the bypass current path.
　このようなバッテリパック４０によれば、一つのバッテリユニット５１に異常が起きた場合にも、当該バッテリユニット５１を迂回するバイパス電流経路を形成することができ、残りの正常なバッテリユニット５１によって充放電機能を維持することができる。 According to such a battery pack 40, even when an abnormality occurs in one battery unit 51, a bypass current path that bypasses the battery unit 51 can be formed and is charged by the remaining normal battery units 51. The discharge function can be maintained.
　なお、本発明の保護素子は、リチウムイオン二次電池のバッテリパックに用いる場合に限らず、電気信号による電流経路の遮断及びバイパスを必要とする様々な用途にももちろん応用可能である。また、第１、第２の電流制御素子５２，５３や第３、第４の電流制御素子５７，５８の作動条件は、バッテリセル４１の電圧異常の場合に限らず、例えば周囲の温度の異常な上昇や、水没等、あらゆるアクシデントを検知することによって作動させることができる。 Note that the protection element of the present invention is not limited to use in a battery pack of a lithium ion secondary battery, and can of course be applied to various uses that require interruption of a current path and bypass by an electric signal. In addition, the operating conditions of the first and second current control elements 52 and 53 and the third and fourth current control elements 57 and 58 are not limited to the case where the voltage of the battery cell 41 is abnormal. It can be activated by detecting any accident such as a sudden rise or submersion.
　［短絡素子（保護抵抗内蔵）］
　また、短絡素子は、予め保護抵抗を内蔵させて形成してもよい。なお、以下の説明において、上述した短絡素子１や保護素子４２、ＬＥＤ照明装置３０やバッテリパック４０と同じ構成については、同一の符号を付してその詳細を省略する。 [Short-circuit element (built-in protection resistor)]
Further, the short-circuit element may be formed by incorporating a protective resistor in advance. In addition, in the following description, about the same structure as the short circuit element 1, the protection element 42, LED lighting apparatus 30, and the battery pack 40 mentioned above, the same code | symbol is attached | subjected and the detail is abbreviate | omitted.
　図１７は、絶縁基板２上に保護抵抗６１が形成された短絡素子６０の平面図である。短絡素子６０は、上述した短絡素子１の構成に加え、第２の電極５と接続された保護抵抗６１が形成され、この保護抵抗６１を介して第２の電極端子部５ａが形成されている。保護抵抗６１は、上述した発熱抵抗体３と同じ材料を用いて、同一のプロセスで同時に形成することができる。 FIG. 17 is a plan view of the short-circuit element 60 in which the protective resistor 61 is formed on the insulating substrate 2. In addition to the configuration of the short-circuit element 1 described above, the short-circuit element 60 includes a protective resistor 61 connected to the second electrode 5, and a second electrode terminal portion 5 a is formed via the protective resistor 61. . The protective resistor 61 can be formed simultaneously by the same process using the same material as the heating resistor 3 described above.
　このように電子機器やバッテリパック４０における内部抵抗が決まっているような場合、予め保護抵抗６１を内蔵した短絡素子６０を用いることにより、実装等の工程を省力化することができる。 When the internal resistance of the electronic device or the battery pack 40 is determined in this way, the mounting and other steps can be saved by using the short-circuit element 60 in which the protective resistor 61 is built in in advance.
　図１８は、短絡素子６０の回路構成を示す図である。短絡素子６０の回路構成は、スイッチ２０が短絡することにより、第１の電極端子部４ａと第２の電極端子部５ａとが、保護抵抗６１を介して接続される。すなわち、短絡素子６０の回路構成は、ヒューズ８，９と、ヒューズ８，９の一端に接続された発熱抵抗体３と、ヒューズ８，９の発熱抵抗体３が接続されていない他端に接続されたスイッチ２０と、スイッチ２０の端子の少なくとも一方の端子に接続された保護抵抗６１とを備え、スイッチ２０が、ヒューズ８，９の溶断に連動して短絡するものである。 FIG. 18 is a diagram illustrating a circuit configuration of the short-circuit element 60. As for the circuit configuration of the short-circuit element 60, the first electrode terminal portion 4 a and the second electrode terminal portion 5 a are connected via the protective resistor 61 when the switch 20 is short-circuited. That is, the circuit configuration of the short-circuit element 60 is connected to the fuses 8 and 9, the heating resistor 3 connected to one end of the fuses 8 and 9, and the other end of the fuses 8 and 9 to which the heating resistor 3 is not connected. The switch 20 and a protective resistor 61 connected to at least one of the terminals of the switch 20 are provided, and the switch 20 is short-circuited in conjunction with the fusing of the fuses 8 and 9.
　［ＬＥＤ補償回路（保護抵抗内蔵）］
　図１９は、短絡素子６０を組み込んだＬＥＤ照明装置６２の回路構成を示す図である。ＬＥＤ照明装置６２の回路構成は、短絡素子１に代えて短絡素子６０を用いた点を除いて、上述したＬＥＤ照明装置３０と同じ構成を有する。すなわち、ＬＥＤ照明装置６２の回路構成は、前述の短絡素子６０と、発光ダイオード３１とを備え、スイッチ２０とヒューズ８，９が接続された端子４ａ及び保護抵抗６１の開放端子５ａと、発光ダイオード３１とを、並列に接続し、発熱抵抗体３は、保護抵抗６１と接続し、発光ダイオード３１の異常時には、ヒューズ８，９が溶融することによりスイッチ２０がオンとなり、バイパス電流経路が形成されるものである。ＬＥＤ照明装置６２の回路構成において、短絡素子６０の保護抵抗６１は、各ＬＥＤユニット３２の発光ダイオード３１の内部抵抗とほぼ同じ抵抗値を有する。 [LED compensation circuit (built-in protection resistor)]
FIG. 19 is a diagram illustrating a circuit configuration of the LED lighting device 62 in which the short-circuit element 60 is incorporated. The circuit configuration of the LED lighting device 62 has the same configuration as the LED lighting device 30 described above except that the short-circuit element 60 is used instead of the short-circuit element 1. That is, the circuit configuration of the LED lighting device 62 includes the short-circuit element 60 and the light-emitting diode 31 described above, the terminal 4a to which the switch 20 and the fuses 8 and 9 are connected, the open terminal 5a of the protective resistor 61, and the light-emitting diode. 31 are connected in parallel, and the heating resistor 3 is connected to the protective resistor 61. When the light emitting diode 31 is abnormal, the fuses 8 and 9 are melted to turn on the switch 20, thereby forming a bypass current path. Is. In the circuit configuration of the LED lighting device 62, the protective resistor 61 of the short-circuit element 60 has substantially the same resistance value as the internal resistance of the light emitting diode 31 of each LED unit 32.
　このようなＬＥＤ照明装置６２によれば、一つの発光ダイオード３１に異常が起きた場合にも、当該発光ダイオード３１を迂回するバイパス電流経路を形成することができ、残りの正常な発光ダイオード３１によって照明機能を維持することができる。このとき、ＬＥＤ照明装置６２は、保護抵抗６１が発光ダイオード３１の内部抵抗とほぼ同じ抵抗値を有するため、バイパス電流経路上においても、正常時とほぼ同じ電流値とすることができる。 According to such an LED lighting device 62, even when an abnormality occurs in one light emitting diode 31, a bypass current path that bypasses the light emitting diode 31 can be formed. The lighting function can be maintained. At this time, since the protection resistor 61 has substantially the same resistance value as the internal resistance of the light emitting diode 31, the LED illumination device 62 can have the same current value as that in the normal state on the bypass current path.
　［バッテリ補償回路（保護抵抗内蔵）］
　図２０は、短絡素子６０を組み込んだバッテリパック６５の回路構成を示す図である。バッテリパック６５の回路構成は、短絡素子１に代えて短絡素子６０を用いた点を除いて、上述したバッテリパック４０の回路構成と同じ構成を有する。すなわち、バッテリパック６５の回路構成は、前述の短絡素子６０と、バッテリセル４１と、バッテリセル４１の電流経路上に接続され、バッテリセル４１の異常時に該バッテリセル４１への通電を電気信号で遮断する保護素子４２と、バッテリセル４１の異常を検知し、異常信号を出力する検出回路５６と、検出回路５６の異常信号を受けて動作する第１、第２の電流制御素子５２，５３とを備え、バッテリセル４１及び保護素子４２の両端と、スイッチ２０のヒューズ８．９との接続端子４ａ及び保護抵抗６１の開放端子５ａとを並列に接続し、発熱抵抗体３の抵抗体端子部３ａと保護素子４２の電気信号の入力端子Ｐ２を、第１、第２の電流制御素子５２，５３に接続し、バッテリセル４１の異常時には、検出回路５６からの異常信号を受けて第１、第２の電流制御素子５２，５３が動作し、保護素子４２によるバッテリセル４１の電流経路の遮断と、ヒューズ８，９の溶断に連動したスイッチ２０の短絡を行い、バイパス電流経路が形成されるものである。バッテリパック６５の回路構成において、各バッテリユニット５１に設けられた短絡素子６０の保護抵抗６１は、当該バッテリユニット５１のバッテリセル４１の内部抵抗とほぼ同じ抵抗値を有する。 [Battery compensation circuit (built-in protection resistor)]
FIG. 20 is a diagram illustrating a circuit configuration of the battery pack 65 in which the short-circuit element 60 is incorporated. The circuit configuration of the battery pack 65 is the same as the circuit configuration of the battery pack 40 described above except that the short-circuit element 60 is used instead of the short-circuit element 1. That is, the circuit configuration of the battery pack 65 is connected to the above-described short-circuit element 60, the battery cell 41, and the current path of the battery cell 41, and the battery cell 41 is energized by an electrical signal when the battery cell 41 is abnormal. A protection element 42 that shuts off, a detection circuit 56 that detects an abnormality of the battery cell 41 and outputs an abnormality signal, and first and second current control elements 52 and 53 that operate in response to the abnormality signal of the detection circuit 56; And connecting both ends of the battery cell 41 and the protection element 42 to the connection terminal 4a of the fuse 8.9 of the switch 20 and the open terminal 5a of the protection resistor 61 in parallel, and a resistor terminal portion of the heating resistor 3 3a and the input terminal P2 of the electric signal of the protection element 42 are connected to the first and second current control elements 52 and 53, and when the battery cell 41 is abnormal, an abnormal signal from the detection circuit 56 In response, the first and second current control elements 52 and 53 operate, the protection element 42 cuts off the current path of the battery cell 41, and the switch 20 is short-circuited in conjunction with the fusing of the fuses 8 and 9. A path is formed. In the circuit configuration of the battery pack 65, the protective resistance 61 of the short-circuit element 60 provided in each battery unit 51 has substantially the same resistance value as the internal resistance of the battery cell 41 of the battery unit 51.
　このようなバッテリパック６５によれば、一つのバッテリユニット５１に異常が起きた場合にも、当該バッテリユニット５１を迂回するバイパス電流経路を形成することができ、残りの正常なバッテリユニット５１によって充放電機能を維持することができる。このとき、バッテリパック６５は、保護抵抗６１が、バッテリセル４１の内部抵抗とほぼ同じ抵抗値を有することにより、バイパス電流経路上においても、正常時と同じ電流値とすることができる。 According to such a battery pack 65, even when an abnormality occurs in one battery unit 51, a bypass current path that bypasses the battery unit 51 can be formed and charged by the remaining normal battery units 51. The discharge function can be maintained. At this time, the battery pack 65 can have the same current value as that in the normal state on the bypass current path because the protective resistance 61 has substantially the same resistance value as the internal resistance of the battery cell 41.
　なお、短絡素子６０においても、絶縁基板２の裏面に外部端子１２を設けて第１の電極端子部４ａ及び第２の電極端子部５ａと当該外部端子１２とをスルーホールによって接続する以外にも、上述した短絡素子２５と同様に、絶縁基板２の第１、第２の電極４，５が形成された表面に、第１の電極４と連続する第１の外部接続電極２１、第１の外部接続端子２２、保護抵抗６１を介して第２の電極５と連続する第２の外部接続電極２３、及び第２の外部接続端子２４を形成するようにしてもよい。 In the short-circuit element 60, the external terminal 12 is provided on the back surface of the insulating substrate 2, and the first electrode terminal portion 4a and the second electrode terminal portion 5a are connected to the external terminal 12 through a through hole. As in the case of the short-circuit element 25 described above, the first external connection electrode 21 that is continuous with the first electrode 4, the first electrode 4 is formed on the surface of the insulating substrate 2 on which the first and second electrodes 4 and 5 are formed. You may make it form the 2nd external connection electrode 23 and the 2nd external connection terminal 24 which follow the 2nd electrode 5 via the external connection terminal 22, the protective resistance 61, and.
　［第２の実施の形態］
　［短絡素子］
　次いで、本発明の第２の実施の形態について説明する。図２１（Ａ）に短絡素子１０１の平面図、及び図２１（Ｂ）に短絡素子１０１の断面図を示す。短絡素子１０１は、絶縁基板１０２と、絶縁基板１０２に設けられた第１の発熱抵抗体１２１及び第２の発熱抵抗体１２２と、絶縁基板１０２に、互いに隣接して設けられた第１の電極１０４及び第２の電極１０５と、第１の電極１０４と隣接して設けられるとともに、第１の発熱抵抗体１２１に電気的に接続された第３の電極１０６と、第２の電極１０５と隣接して設けられるとともに、第２の発熱抵抗体１２２に電気的に接続された第４の電極１０７と、第１、第３の電極１０４，１０６間に亘って設けられることにより電流経路構成し、第１の発熱抵抗体１２１からの加熱により、第１、第３の電極１０４，１０６間の電流経路を溶断する第１の可溶導体１０８と、第２、第４の電極１０５，１０７間に亘って設けられ、第２の発熱抵抗体１２２からの加熱により、第２、第４の電極１０５，１０７間の電流経路を溶断する第２の可溶導体１０９とを備える。そして、短絡素子１０１は、絶縁基板１０２上に内部を保護するカバー部材１１０が取り付けられている。 [Second Embodiment]
[Short-circuit element]
Next, a second embodiment of the present invention will be described. FIG. 21A is a plan view of the short-circuit element 101, and FIG. 21B is a cross-sectional view of the short-circuit element 101. The short circuit element 101 includes an insulating substrate 102, a first heating resistor 121 and a second heating resistor 122 provided on the insulating substrate 102, and a first electrode provided adjacent to the insulating substrate 102. 104, the second electrode 105, and the third electrode 106 provided adjacent to the first electrode 104 and electrically connected to the first heating resistor 121, and adjacent to the second electrode 105. And a current path configured by being provided between the fourth electrode 107 electrically connected to the second heating resistor 122 and the first and third electrodes 104 and 106, Between the first fusible conductor 108 and the second and fourth electrodes 105 and 107, which melt the current path between the first and third electrodes 104 and 106 by heating from the first heating resistor 121. A second exothermic resistor By heating from the body 122, and a second, second fusible conductor 109 to fuse the current path between the fourth electrode 105 and 107. The short-circuit element 101 has a cover member 110 that protects the inside on the insulating substrate 102.
　絶縁基板１０２は、たとえば、アルミナ、ガラスセラミックス、ムライト、ジルコニアなどの絶縁性を有する部材を用いて略方形状に形成されている。絶縁基板１０２は、その他にも、ガラスエポキシ基板、フェノール基板等のプリント配線基板に用いられる材料を用いてもよいが、ヒューズ溶断時の温度に留意する必要がある。なお、絶縁基板１０２は、裏面に外部端子１１２が形成されている。 The insulating substrate 102 is formed in a substantially square shape using an insulating member such as alumina, glass ceramics, mullite, zirconia, and the like. In addition, the insulating substrate 102 may be made of a material used for a printed wiring board such as a glass epoxy board or a phenol board, but it is necessary to pay attention to the temperature at which the fuse is blown. The insulating substrate 102 has an external terminal 112 formed on the back surface.
　第１、第２の発熱抵抗体１２１，１２２は、比較的抵抗値が高く通電すると発熱する導電性を有する部材であって、たとえばＷ、Ｍｏ、Ｒｕ等からなる。これらの合金あるいは組成物、化合物の粉状体を樹脂バインダ等と混合して、ペースト状にしたものを絶縁基板１０２上にスクリーン印刷技術を用いてパターン形成して、焼成する等によって形成する。 The first and second heating resistors 121 and 122 are conductive members that have a relatively high resistance value and generate heat when energized, and are made of, for example, W, Mo, Ru, or the like. These alloys, compositions, or compound powders are mixed with a resin binder or the like to form a paste on the insulating substrate 102 using a screen printing technique and then fired.
　また、第１、第２の発熱抵抗体１２１，１２２は、絶縁基板１０２上において絶縁層１１１に被覆されている。第１の発熱抵抗体１２１を被覆する絶縁層１１１上には、第１、第３の電極１０４，１０６が形成され、第２の発熱抵抗体１２２を被覆する絶縁層１１１上には、第２、第４の電極１０５，１０７が形成されている。第１の電極１０４は、一方側において第２の電極１０５と隣接して形成されるとともに、絶縁されている。第１の電極１０４の他方側には第３の電極１０６が形成されている。第１の電極１０４と第３の電極１０６とは、第１の可溶導体１０８が接続されることにより導通され、短絡素子１０１の電流経路を構成する。また、第１の電極１０４は、絶縁基板１０２の側面に臨む第１の電極端子部１０４ａに接続されている。第１の電極端子部１０４ａは、スルーホールを介して絶縁基板１０２の裏面に設けられた外部端子１１２と接続されている。 The first and second heating resistors 121 and 122 are covered with the insulating layer 111 on the insulating substrate 102. First and third electrodes 104 and 106 are formed on the insulating layer 111 covering the first heating resistor 121, and the second electrode 104, 106 is formed on the insulating layer 111 covering the second heating resistor 122. The fourth electrodes 105 and 107 are formed. The first electrode 104 is formed adjacent to the second electrode 105 on one side and is insulated. A third electrode 106 is formed on the other side of the first electrode 104. The first electrode 104 and the third electrode 106 are electrically connected when the first fusible conductor 108 is connected to form a current path of the short-circuit element 101. The first electrode 104 is connected to the first electrode terminal portion 104 a facing the side surface of the insulating substrate 102. The first electrode terminal portion 104a is connected to an external terminal 112 provided on the back surface of the insulating substrate 102 through a through hole.
　また、第３の電極１０６は、絶縁基板１０２あるいは絶縁層１１１に設けられた第１の発熱体引出電極１２３を介して第１の発熱抵抗体１２１と接続されている。また、第１の発熱抵抗体１２１は、第１の発熱体引出電極１２３を介して、絶縁基板１０２の側縁に臨む第１の抵抗体端子部１２１ａに接続されている。第１の抵抗体端子部１２１ａは、スルーホールを介して、絶縁基板１０２の裏面に設けられた外部端子１１２と接続されている。 The third electrode 106 is connected to the first heating resistor 121 through the first heating element lead electrode 123 provided on the insulating substrate 102 or the insulating layer 111. The first heating resistor 121 is connected to the first resistor terminal portion 121 a facing the side edge of the insulating substrate 102 via the first heating element lead-out electrode 123. The first resistor terminal portion 121a is connected to an external terminal 112 provided on the back surface of the insulating substrate 102 through a through hole.
　第２の電極１０５の第１の電極１０４と隣接する一方側と反対の他方側には、第４の電極１０７が形成されている。第２の電極１０５と第４の電極１０７とは、第２の可溶導体１０９が接続されている。また、第２の電極１０５は、絶縁基板１０２の側面に臨む第２の電極端子部１０５ａに接続されている。第２の電極端子部１０５ａは、スルーホールを介して絶縁基板１０２の裏面に設けられた外部端子１１２と接続されている。 A fourth electrode 107 is formed on the other side of the second electrode 105 opposite to the one side adjacent to the first electrode 104. A second soluble conductor 109 is connected to the second electrode 105 and the fourth electrode 107. The second electrode 105 is connected to the second electrode terminal portion 105 a facing the side surface of the insulating substrate 102. The second electrode terminal portion 105a is connected to an external terminal 112 provided on the back surface of the insulating substrate 102 through a through hole.
　また、第４の電極１０７は、絶縁基板１０２あるいは絶縁層１１１に設けられた第２の発熱体引出電極１２４を介して第２の発熱抵抗体１２２と接続されている。また、第２の発熱抵抗体１２２は、第２の発熱体引出電極１２４を介して、絶縁基板１０２の側縁に臨む第２の抵抗体端子部１２２ａに接続されている。第２の抵抗体端子部１２２ａは、スルーホールを介して、絶縁基板１０２の裏面に設けられた外部端子１１２と接続されている。 The fourth electrode 107 is connected to the second heating resistor 122 through the second heating element lead electrode 124 provided on the insulating substrate 102 or the insulating layer 111. The second heating resistor 122 is connected to the second resistor terminal portion 122a facing the side edge of the insulating substrate 102 through the second heating element lead-out electrode 124. The second resistor terminal portion 122a is connected to an external terminal 112 provided on the back surface of the insulating substrate 102 through a through hole.
　なお、第１～第４の電極１０４，１０５，１０６，１０７は、ＣｕやＡｇ等の一般的な電極材料を用いて形成することができるが、少なくとも第１、第２の電極１０４，１０５の表面上には、Ｎｉ／Ａｕメッキ、Ｎｉ／Ｐｄメッキ、Ｎｉ／Ｐｄ／Ａｕメッキ等の被膜が、公知のメッキ処理により形成されていることが好ましい。これにより、第１、第２の電極１０４，１０５の酸化を防止し、溶融導体を確実に保持させることができる。また、短絡素子１０１をリフロー実装する場合に、第１、第２の可溶導体１０８，１０９を接続するハンダあるいは第１、第２の可溶導体１０８，１０９の外層を形成する低融点金属が溶融することにより第１、第２の電極１０４，１０５を溶食（ハンダ食われ）して切断するのを防ぐことができる。 The first to fourth electrodes 104, 105, 106, and 107 can be formed using a general electrode material such as Cu or Ag, but at least the first and second electrodes 104 and 105 are formed. A coating such as Ni / Au plating, Ni / Pd plating, or Ni / Pd / Au plating is preferably formed on the surface by a known plating process. Thereby, the oxidation of the first and second electrodes 104 and 105 can be prevented, and the molten conductor can be reliably held. In addition, when the short-circuit element 101 is mounted by reflow soldering, a solder that connects the first and second soluble conductors 108 and 109 or a low melting point metal that forms an outer layer of the first and second soluble conductors 108 and 109 is used. By melting, the first and second electrodes 104 and 105 can be prevented from being eroded (soldered) and cut.
　［可溶導体］
　第１、第２の可溶導体１０８，１０９は、第１、第２の発熱抵抗体１２１，１２２の発熱により速やかに溶断される低融点金属からなり、例えばＳｎを主成分とするＰｂフリーハンダを好適に用いることができる。 [Soluble conductor]
The first and second fusible conductors 108 and 109 are made of a low melting point metal that is quickly melted by the heat generated by the first and second heat generating resistors 121 and 122, for example, Pb-free solder containing Sn as a main component. Can be suitably used.
　また、第１、第２の可溶導体１０８，１０９は、低融点金属と高融点金属とを含有してもよい。低融点金属としては、Ｐｂフリーハンダなどのハンダを用いることが好ましく、高融点金属としては、Ａｇ、Ｃｕ又はこれらを主成分とする合金などを用いることが好ましい。高融点金属と低融点金属とを含有することによって、短絡素子１０１をリフロー実装する場合に、リフロー温度が低融点金属層の溶融温度を超えて、低融点金属が溶融しても、第１、第２の可溶導体１０８，１０９として溶断するに至らない。かかる第１、第２の可溶導体１０８，１０９は、高融点金属に低融点金属をメッキ技術を用いて成膜することによって形成してもよく、他の周知の積層技術、膜形成技術を用いることによって形成してもよい。なお、第１、第２の可溶導体１０８，１０９は、外層を構成する低融点金属を用いて、第１及び第３の電極１０４，１０６、又は第２及び第４の電極１０５，１０７へ、ハンダ接続することができる。 Further, the first and second soluble conductors 108 and 109 may contain a low melting point metal and a high melting point metal. As the low melting point metal, it is preferable to use solder such as Pb-free solder, and as the high melting point metal, it is preferable to use Ag, Cu or an alloy containing these as a main component. By including the high melting point metal and the low melting point metal, even when the reflow temperature exceeds the melting temperature of the low melting point metal layer and the low melting point metal is melted when the short circuit element 101 is reflow mounted, the first, The second soluble conductors 108 and 109 do not blow out. The first and second fusible conductors 108 and 109 may be formed by depositing a low melting point metal on a high melting point metal using a plating technique, and other well-known lamination techniques and film forming techniques may be used. You may form by using. The first and second fusible conductors 108 and 109 are connected to the first and third electrodes 104 and 106 or the second and fourth electrodes 105 and 107 using a low melting point metal constituting the outer layer. Can be soldered.
　第１、第２の可溶導体１０８，１０９は、内層を低融点金属とし、外層を高融点金属としてもよい。内層の低融点金属層の全表面を外層の高融点金属層で被覆した可溶導体を用いることにより、リフロー温度よりも融点の低い低融点金属を用いた場合でも、リフロー実装時に、内層の低融点金属の外部への流出を抑制することができる。また、溶断時も、内層の低融点金属が溶融することにより、外層の高融点金属を溶食（ハンダ食われ）し、速やかに溶断することができる。 The first and second soluble conductors 108 and 109 may have a low melting point metal for the inner layer and a high melting point metal for the outer layer. By using a soluble conductor in which the entire surface of the inner low melting point metal layer is covered with the outer high melting point metal layer, even when using a low melting point metal having a melting point lower than the reflow temperature, the inner layer has a low Outflow of the melting point metal to the outside can be suppressed. Further, when the inner layer low melting point metal melts, the outer layer high melting point metal is also eroded (soldered) and can be quickly melted.
　また、第１、第２の可溶導体１０８，１０９は、内層を高融点金属とし、外層を低融点金属とする被覆構造としてもよい。内層の高融点金属層の全表面を外層の低融点金属層で被覆した可溶導体を用いることにより、外層の低融点金属層を介して電極上に接続することができ、また、溶断時も、低融点金属層が速やかに溶融して高融点金属を溶食するため、速やかに溶断することができる。 The first and second fusible conductors 108 and 109 may have a coating structure in which the inner layer is made of a high melting point metal and the outer layer is made of a low melting point metal. By using a soluble conductor in which the entire surface of the inner high-melting-point metal layer is covered with an outer low-melting-point metal layer, it can be connected to the electrode via the outer-layer low-melting-point metal layer. Since the low melting point metal layer melts rapidly and erodes the high melting point metal, it can be melted quickly.
　また、第１、第２の可溶導体１０８，１０９は、低融点金属層と、高融点金属層とが積層された積層構造としてもよい。また、低融点金属層と、高融点金属層とが交互に積層された４層以上の多層構造としてもよい。また、第１、第２の可溶導体１０８，１０９は、低融点金属層の表面に高融点金属層が面方向にストライプ状に積層してもよい。これらの構造によっても、低融点金属による高融点金属の溶食／溶断を短時間で行うことができる。 Further, the first and second soluble conductors 108 and 109 may have a laminated structure in which a low melting point metal layer and a high melting point metal layer are laminated. Moreover, it is good also as a multilayered structure of four or more layers by which the low melting metal layer and the high melting metal layer were laminated | stacked alternately. Further, the first and second soluble conductors 108 and 109 may be formed by laminating a high melting point metal layer in a stripe shape on the surface of the low melting point metal layer. Even with these structures, the melting / cutting of the high melting point metal by the low melting point metal can be performed in a short time.
　また、第１、第２の可溶導体１０８，１０９は、多数の開口部を有する高融点金属と、上記開口部に挿入された低融点金属とから構成してもよい。これにより、溶融する低融点金属層に接する高融点金属層の面積が増大するので、より短時間で低融点金属層が高融点金属層を溶食することができるようになる。したがって、より速やか、かつ確実に可溶導体を溶断させることが可能となる。 The first and second fusible conductors 108 and 109 may be composed of a high melting point metal having a large number of openings and a low melting point metal inserted into the openings. As a result, the area of the refractory metal layer in contact with the molten low melting point metal layer increases, so that the low melting point metal layer can erode the refractory metal layer in a shorter time. Therefore, the soluble conductor can be blown out more quickly and reliably.
　また、第１、第２の可溶導体１０８，１０９は、高融点金属の体積よりも低融点金属の体積を多くすることが好ましい。これにより、第１、第２の可溶導体１０８，１０９は、効果的に高融点金属層の溶食による短時間での溶断を行うことができる。 Also, it is preferable that the first and second soluble conductors 108 and 109 have a low melting point metal volume larger than the high melting point metal volume. Thereby, the 1st, 2nd soluble conductors 108 and 109 can perform fusing in a short time by the corrosion of a refractory metal layer effectively.
　なお、第１、第２の可溶導体１０８，１０９の酸化防止、及び第１、第２の可溶導体１０８，１０９の溶融時における濡れ性を向上させるために、第１、第２の可溶導体１０８，１０９の上にはフラックス１１５が塗布されている。 In order to prevent oxidation of the first and second soluble conductors 108 and 109 and to improve the wettability of the first and second soluble conductors 108 and 109 during melting, the first and second soluble conductors 108 and 109 can be improved. A flux 115 is applied on the molten conductors 108 and 109.
　短絡素子１０１は、絶縁基板１０２がカバー部材１１０に覆われることによりその内部が保護されている。カバー部材１１０は、短絡素子１０１の側面を構成する側壁１１６と、短絡素子１０１の上面を構成する天面部１１７とを有し、側壁１１６が絶縁基板１０２上に接続されることにより、短絡素子１０１の内部を閉塞する蓋体となる。このカバー部材１１０は、上記絶縁基板１０２と同様に、たとえば、熱可塑性プラスチック，セラミックス，ガラスエポキシ基板等の絶縁性を有する部材を用いて形成されている。 The inside of the short circuit element 101 is protected by covering the insulating substrate 102 with the cover member 110. The cover member 110 has a side wall 116 that constitutes a side surface of the short-circuit element 101 and a top surface portion 117 that constitutes an upper surface of the short-circuit element 101, and the short-circuit element 101 is connected to the side wall 116 on the insulating substrate 102. It becomes a lid that closes the inside of the. Similar to the insulating substrate 102, the cover member 110 is formed using an insulating member such as a thermoplastic, ceramic, or glass epoxy substrate.
　また、カバー部材１１０は、天面部１１７の内面側に、カバー部電極１１８が形成されても良い。カバー部電極１１８は、第１、第２の電極１０４，１０５と重畳する位置に形成されている。このカバー部電極１１８は、第１、第２の発熱抵抗体１２１，１２２が発熱し、第１、第２の可溶導体１０８，１０９が溶融されると、第１、第２の電極１０４，１０５上に凝集した溶融導体が接触して濡れ広がることにより、溶融導体を保持する許容量を増加させることができる。 Further, the cover member 110 may be formed with a cover portion electrode 118 on the inner surface side of the top surface portion 117. The cover part electrode 118 is formed at a position overlapping the first and second electrodes 104 and 105. When the first and second heating resistors 121 and 122 generate heat and the first and second fusible conductors 108 and 109 are melted, the cover electrode 118 has the first and second electrodes 104, When the molten conductor aggregated on 105 comes into contact and spreads wet, the allowable amount for holding the molten conductor can be increased.
　［短絡素子回路］
　以上のような短絡素子１０１は、図２２（Ａ）（Ｂ）に示すような回路構成を有する。すなわち、短絡素子１０１は、第１の電極１０４と第２の電極１０５とが、正常時には絶縁され、第１、第２の発熱抵抗体１２１，１２２の発熱により第１、第２の可溶導体１０８，１０９が溶融すると、当該溶融導体を介して短絡するスイッチ１２０を構成する（図２２（Ｂ））。そして、第１の電極端子部１０４ａと第２の電極端子部１０５ａは、スイッチ１２０の両端子を構成する。また、第１の可溶導体１０８は、第３の電極１０６及び第１の発熱体引出電極１２３を介して第１の発熱抵抗体１２１と接続されている。同様に、第２の可溶導体１０９は、第４の電極１０７及び第２の発熱体引出電極１２４を介して第２の発熱抵抗体１２２と接続されている。 [Short-circuit element circuit]
The short circuit element 101 as described above has a circuit configuration as shown in FIGS. That is, in the short-circuit element 101, the first electrode 104 and the second electrode 105 are insulated during normal operation, and the first and second fusible conductors are generated by the heat generated by the first and second heating resistors 121 and 122. When the fuses 108 and 109 are melted, the switch 120 is configured to be short-circuited through the molten conductor (FIG. 22B). The first electrode terminal portion 104a and the second electrode terminal portion 105a constitute both terminals of the switch 120. The first fusible conductor 108 is connected to the first heating resistor 121 through the third electrode 106 and the first heating element extraction electrode 123. Similarly, the second fusible conductor 109 is connected to the second heating resistor 122 via the fourth electrode 107 and the second heating element extraction electrode 124.
　そして、短絡素子１０１は、後述するように、電子機器等に組み込まれることにより、スイッチ１２０の両端子１０４ａ、１０５ａが、当該電子機器の電流経路と並列に接続され、当該電流経路上の電子部品に異常が発生した場合に、スイッチ１２０を短絡させ、当該電子部品をバイパスするバイパス電流経路を形成する。 As will be described later, the short-circuit element 101 is incorporated in an electronic device or the like, whereby both terminals 104a and 105a of the switch 120 are connected in parallel with the current path of the electronic device, and the electronic component on the current path is connected. When an abnormality occurs, the switch 120 is short-circuited to form a bypass current path that bypasses the electronic component.
　具体的に、短絡素子１０１は、並列接続されている電子部品に異常が生じると、第１、第２の抵抗体端子部１２１ａ，１２２ａ側から電力が供給され、第１、第２の発熱抵抗体１２１，１２２が通電することにより発熱する。この熱により第１、第２の可溶導体１０８，１０９が溶融すると、溶融導体は、第１、第２の電極１０４，１０５上に凝集する。第１、第２の電極１０４，１０５は隣接して形成されているため、第１、第２の電極１０４，１０５上に凝集した溶融導体が結合し、これにより第１、第２の電極１０４，１０５が短絡する。すなわち、短絡素子１０１は、スイッチ１２０の両端子間が短絡される（図２２（Ｂ））。 Specifically, when an abnormality occurs in the electronic components connected in parallel, the short-circuit element 101 is supplied with power from the first and second resistor terminal portions 121a and 122a, and the first and second heating resistors. The body 121, 122 generates heat when energized. When the first and second fusible conductors 108 and 109 are melted by this heat, the molten conductor aggregates on the first and second electrodes 104 and 105. Since the first and second electrodes 104 and 105 are formed adjacent to each other, the agglomerated molten conductors are coupled to each other on the first and second electrodes 104 and 105, thereby the first and second electrodes 104. , 105 are short-circuited. That is, the shorting element 101 is short-circuited between both terminals of the switch 120 (FIG. 22B).
　なお、第１の発熱抵抗体１２１への通電は、第１の可溶導体１０８が溶断することにより第１、第３の電極１０４，１０６間が遮断されるため、停止され、第２の発熱抵抗体１２２への通電は、第２の可溶導体１０９が溶断することにより、第２、第４の電極１０５，１０７間が遮断されるため、停止される。 Note that energization of the first heating resistor 121 is stopped because the first fusible conductor 108 is cut off and the first and third electrodes 104 and 106 are cut off, and the second heating element 121 is stopped. The energization of the resistor 122 is stopped because the second fusible conductor 109 is melted and the second and fourth electrodes 105 and 107 are cut off.
　［第２の可溶導体の先溶融］
　ここで、短絡素子１０１は、第２の可溶導体１０９が第１の可溶導体１０８よりも先行して溶融することが好ましい。短絡素子１０１は、第１の発熱抵抗体１２１と第２の発熱抵抗体１２２とが、別々に発熱されることから、通電のタイミングとして第２の発熱抵抗体１２２を先に発熱させ、その後に第１の発熱抵抗体１２１を発熱させることで、図２４に示すように、容易に第２の可溶導体１０９を第１の可溶導体１０８よりも先行して溶融させ、図２３（Ａ）、（Ｂ）に示すように、確実に第１、第２の電極１０４，１０５上に、第１、第２の可溶導体１０８，１０９の溶融導体を凝集、結合させ、第１、第２の電極１０４，１０５を短絡させることができる。 [First melting of second soluble conductor]
Here, in the short-circuit element 101, the second soluble conductor 109 is preferably melted before the first soluble conductor 108. Since the first heating resistor 121 and the second heating resistor 122 are separately heated in the short-circuit element 101, the second heating resistor 122 is first heated as the energization timing, and thereafter By causing the first heating resistor 121 to generate heat, as shown in FIG. 24, the second soluble conductor 109 is easily melted ahead of the first soluble conductor 108, and FIG. (B), the molten conductors of the first and second fusible conductors 108 and 109 are surely agglomerated and bonded onto the first and second electrodes 104 and 105, so that the first and second The electrodes 104 and 105 can be short-circuited.
　また、短絡素子１０１は、第２の可溶導体１０９を、第１の可溶導体１０８よりも幅狭に形成することにより、第２の可溶導体１０９を第１の可溶導体１０８よりも先に溶断するようにしてもよい。第２の可溶導体１０９を幅狭に形成することにより、溶断時間を短くすることができるため、第２の可溶導体１０９が第１の可溶導体１０８よりも先行して溶融させることができる。 In addition, the short-circuit element 101 forms the second fusible conductor 109 narrower than the first fusible conductor 108 by forming the second fusible conductor 109 more narrowly than the first fusible conductor 108. It may be melted first. By forming the second soluble conductor 109 narrowly, the fusing time can be shortened, so that the second soluble conductor 109 can be melted ahead of the first soluble conductor 108. it can.
　［電極面積］
　また、短絡素子１０１は、第１の電極１０４の面積を第３の電極１０６よりも広くし、第２の電極１０５の面積を第４の電極１０７よりも広くすることが好ましい。溶融導体の保持量は、電極面積に比例して多くなるため、第１、第２の電極１０４，１０５の面積を第３、第４の電極１０６，１０７よりも広く形成することにより、より多くの溶融導体を第１、第２の電極１０４，１０５上に凝集させることができ、第１、第２の電極１０４，１０５間を確実に短絡させることができる。 [Electrode area]
In the short-circuit element 101, the area of the first electrode 104 is preferably larger than that of the third electrode 106 and the area of the second electrode 105 is preferably larger than that of the fourth electrode 107. Since the holding amount of the molten conductor increases in proportion to the electrode area, the area of the first and second electrodes 104 and 105 is made larger than that of the third and fourth electrodes 106 and 107. These molten conductors can be agglomerated on the first and second electrodes 104 and 105, and the first and second electrodes 104 and 105 can be reliably short-circuited.
　［短絡素子の変形例］
　なお、短絡素子１０１は、必ずしも、第１、第２の発熱抵抗体１２１，１２２を絶縁層１１１によって被覆する必要はなく、図２５に示すように、第１、第２の発熱抵抗体１２１，１２２が絶縁基板１０２の内部に設置されてもよい。絶縁基板１０２の材料として熱伝導性に優れたものを用いることにより、第１、第２の発熱抵抗体１２１，１２２は、ガラス層等の絶縁層１１１を介した場合と同等に加熱することができる。 [Modification of short circuit element]
Note that the short-circuit element 101 does not necessarily need to cover the first and second heat generating resistors 121 and 122 with the insulating layer 111. As shown in FIG. 122 may be installed inside the insulating substrate 102. By using a material having excellent thermal conductivity as the material of the insulating substrate 102, the first and second heating resistors 121 and 122 can be heated in the same manner as when the insulating layer 111 such as a glass layer is interposed. it can.
　また、短絡素子１０１は、図２６に示すように、第１、第２の発熱抵抗体１２１，１２２が絶縁基板１０２の第１～第４の電極１０４，１０５，１０６，１０７の形成面と反対の裏面に設置されてもよい。第１、第２の発熱抵抗体１２１，１２２を絶縁基板１０２の裏面に形成することにより、絶縁基板１０２内に形成するよりも簡易な工程で形成することができる。なお、この場合、第１、第２の発熱抵抗体１２１，１２２上には、絶縁層１１１が形成されると抵抗体の保護や実装時の絶縁性確保と言う意味で好ましい。 Further, as shown in FIG. 26, the short-circuit element 101 has the first and second heating resistors 121 and 122 opposite to the formation surfaces of the first to fourth electrodes 104, 105, 106, and 107 of the insulating substrate 102. It may be installed on the back side of. By forming the first and second heat generating resistors 121 and 122 on the back surface of the insulating substrate 102, the first and second heat generating resistors 121 and 122 can be formed by a simpler process than in the insulating substrate 102. In this case, it is preferable that the insulating layer 111 is formed on the first and second heating resistors 121 and 122 in terms of protecting the resistor and ensuring insulation during mounting.
　さらに、短絡素子１０１は、図２７に示すように、第１、第２の発熱抵抗体１２１，１２２が絶縁基板２の第１～第４の電極１０４，１０５，１０６，１０７の形成面上に設置されてもよい。第１、第２の発熱抵抗体１２１，１２２を絶縁基板１０２の表面に形成することにより、絶縁基板１０２内に形成するよりも簡易な工程で形成することができる。なお、この場合も、第１、第２の発熱抵抗体１２１，１２２上には、絶縁層１１１が形成される事が好ましい。 Further, as shown in FIG. 27, the short-circuit element 101 has the first and second heating resistors 121 and 122 on the formation surface of the first to fourth electrodes 104, 105, 106, and 107 of the insulating substrate 2. It may be installed. By forming the first and second heat generating resistors 121 and 122 on the surface of the insulating substrate 102, the first and second heat generating resistors 121 and 122 can be formed by a simpler process than that in the insulating substrate 102. Also in this case, it is preferable that the insulating layer 111 is formed on the first and second heating resistors 121 and 122.
　また、第１の電極１０４又は第２の電極１０５のいずれか一方に接続される保護抵抗を備える構成としてもよい。ここで、保護抵抗は、短絡素子に接続する電子部品の内部抵抗相当の抵抗値とし、発熱抵抗体１２１，１２２の抵抗値よりも小さくする。すなわち、電子部品が正常に作動している場合、電流は短絡素子側へは流れず電子部品側に流れる。 In addition, a configuration may be adopted in which a protective resistor connected to either the first electrode 104 or the second electrode 105 is provided. Here, the protective resistance is a resistance value corresponding to the internal resistance of the electronic component connected to the short-circuit element, and is smaller than the resistance values of the heating resistors 121 and 122. That is, when the electronic component is operating normally, current does not flow to the short-circuit element side but flows to the electronic component side.
　また、本発明が適用された短絡素子１０１は、絶縁基板１０２の裏面に第１、第２の電極１０４，１０５とスルーホールを介して連続する外部端子１１２を設ける以外にも、図２８（Ａ）（Ｂ）に示す短絡素子１３０のように、絶縁基板１０２の第１、第２の電極１０４，１０５が形成された表面に、第１の電極１０４と連続する第１の外部接続電極１３１、第１の外部接続電極１３１上に設けられた１個もしくは複数個からなる第１の外部接続端子１３２、第２の電極１０５と連続する第２の外部接続電極１３３、第２の外部接続電極１３３上に設けられた１個もしくは複数個からなる第２の外部接続端子１３４を形成するようにしてもよい。 Further, the short-circuit element 101 to which the present invention is applied is not limited to the provision of the external terminal 112 continuous with the first and second electrodes 104 and 105 through the through-holes on the back surface of the insulating substrate 102 as shown in FIG. ) A first external connection electrode 131 continuous with the first electrode 104 is formed on the surface of the insulating substrate 102 on which the first and second electrodes 104 and 105 are formed, like a short-circuit element 130 shown in FIG. One or a plurality of first external connection terminals 132 provided on the first external connection electrode 131, a second external connection electrode 133 continuous with the second electrode 105, and a second external connection electrode 133 You may make it form the 2nd external connection terminal 134 which consists of one or more provided on the top.
　第１、第２の外部接続電極１３１，１３３は、短絡素子１３０と短絡素子１３０が組み込まれる電子機器の回路とを接続する電極であり、第１の外部接続電極１３１は第１の電極１０４と連続され、第２の外部接続電極１３３は第２の電極１０５と連続されている。 The first and second external connection electrodes 131 and 133 are electrodes that connect the short-circuit element 130 and a circuit of an electronic device in which the short-circuit element 130 is incorporated, and the first external connection electrode 131 is connected to the first electrode 104. The second external connection electrode 133 is continuous with the second electrode 105.
　第１、第２の外部接続電極１３１，１３３は、ＣｕやＡｇ等の一般的な電極材料を用いて形成され、絶縁基板１０２の第１、第２の電極１０４，１０５の形成面と同一面に形成されている。すなわち、図２８に示す短絡素子１３０は、第１、第２の可溶導体１０８，１０９が設けられる表面が実装面となる。なお、第１、第２の外部接続電極１３１，１３３は、第１、第２の電極１０４，１０５と同時に形成することができる。 The first and second external connection electrodes 131 and 133 are formed using a general electrode material such as Cu or Ag, and are the same as the formation surfaces of the first and second electrodes 104 and 105 of the insulating substrate 102. Is formed. In other words, in the short-circuit element 130 shown in FIG. Note that the first and second external connection electrodes 131 and 133 can be formed simultaneously with the first and second electrodes 104 and 105.
　第１の外部接続電極１３１上には、第１の外部接続端子１３２が設けられている。同様に、第２の外部接続電極１３３上には、第２の外部接続端子１３４が設けられている。これら第１、第２の外部接続端子１３２，１３４は、電子機器へ実装するための接続端子であり、例えば金属バンプや、金属ポストを用いて形成されている。また、第１、第２の外部接続端子１３２，１３４は、図２８（Ａ）に示すように、絶縁基板１０２上に設けられたカバー部材１１０よりも突出する高さを有し、短絡素子１３０の実装対象物となる基板側に実装可能とされている。 The first external connection terminal 132 is provided on the first external connection electrode 131. Similarly, a second external connection terminal 134 is provided on the second external connection electrode 133. These first and second external connection terminals 132 and 134 are connection terminals for mounting on an electronic device, and are formed using, for example, metal bumps or metal posts. Further, as shown in FIG. 28A, the first and second external connection terminals 132 and 134 have a height protruding from the cover member 110 provided on the insulating substrate 102, and the short-circuit element 130. It can be mounted on the side of the board that is the mounting target.
　なお、短絡素子１３０の第１の発熱抵抗体１２１は、第１の発熱体引出電極１２３、及び第１の抵抗体端子部１２１ａを介して、第１の抵抗体接続端子１２１ｂが形成されている。また、短絡素子１３０の第２の発熱抵抗体１２２は、第２の発熱体引出電極１２４、及び第２の抵抗体端子部１２２ａを介して、第２の抵抗体接続端子１２２ｂが形成されている。第１、第２の抵抗体接続端子１２１ｂ，１２２ｂは、第１、第２の外部接続端子１３２，１３４と同様に、金属バンプや金属ポストを用いて形成され、絶縁層１１１を介して上方に突出されている。 The first heating resistor 121 of the short-circuit element 130 is formed with a first resistor connection terminal 121b via the first heating element lead-out electrode 123 and the first resistor terminal portion 121a. . In addition, the second heating resistor 122 of the short-circuit element 130 has a second resistor connection terminal 122b formed through the second heating element lead electrode 124 and the second resistor terminal portion 122a. . Similar to the first and second external connection terminals 132 and 134, the first and second resistor connection terminals 121b and 122b are formed by using metal bumps or metal posts, and upward through the insulating layer 111. It is protruding.
　このように、短絡素子１３０は、上記短絡素子１０１のように絶縁基板１０２の裏面に外部端子１１２を設けて第１、第２の電極１０４，１０５と当該外部端子１１２とをスルーホールによって接続するものではなく、第１、第２の電極１０４，１０５と同一表面に、外部接続電極１３１，１３３を介して外部接続端子１３２，１３４を形成している。そして、図２８（Ｂ）に示すように、短絡素子１３０は、第１の電極１０４と第２の電極１０５とが短絡したときの、第１、第２の外部接続電極１３１，１３３間の導通抵抗よりも、第１の外部接続端子１３２と第２の外部接続端子１３４との合成抵抗が低く構成されている。 As described above, the short-circuit element 130 is provided with the external terminal 112 on the back surface of the insulating substrate 102 like the short-circuit element 101 and connects the first and second electrodes 104 and 105 and the external terminal 112 through a through hole. Instead, external connection terminals 132 and 134 are formed on the same surface as the first and second electrodes 104 and 105 via external connection electrodes 131 and 133. As shown in FIG. 28B, the short-circuit element 130 is connected between the first and second external connection electrodes 131 and 133 when the first electrode 104 and the second electrode 105 are short-circuited. The combined resistance of the first external connection terminal 132 and the second external connection terminal 134 is configured to be lower than the resistance.
　これにより、短絡素子１３０は、第１、第２の電極１０４，１０５が短絡しバイパス電流経路を構成した際における定格を向上させ、大電流に対応することができる。すなわち、ＨＥＶやＥＶ等の動力源として使用されるリチウムイオン二次電池等の大電流用途においては、短絡素子の定格のさらなる向上が求められている。そして、可溶導体によって短絡された第１、第２の外部接続電極１３１，１３３間の導通抵抗は定格向上に応えることができる程度に十分下げることができる（例えば０．４ｍΩ未満）。 Thereby, the short-circuit element 130 can improve the rating when the first and second electrodes 104 and 105 are short-circuited to form a bypass current path, and can cope with a large current. That is, in high current applications such as lithium ion secondary batteries used as power sources such as HEV and EV, further improvement of the rating of the short-circuit element is required. Then, the conduction resistance between the first and second external connection electrodes 131 and 133 short-circuited by the fusible conductor can be lowered sufficiently to meet the rating improvement (for example, less than 0.4 mΩ).
　しかし、絶縁基板１０２の裏面に外部端子１１２を設け、第１、第２の電極１０４，１０５と当該外部端子１１２とをスルーホールによって接続する短絡素子１０１においては、第１、第２の電極１０４，１０５と外部端子１１２との間の導通抵抗が高く（例えば０．５～１．０ｍΩ）、スルーホール内に導体を充填したとしても、短絡素子全体の導通抵抗を下げるには限界がある。 However, in the short-circuit element 101 in which the external terminal 112 is provided on the back surface of the insulating substrate 102 and the first and second electrodes 104 and 105 are connected to the external terminal 112 through a through hole, the first and second electrodes 104 are provided. , 105 and the external terminal 112 have high conduction resistance (for example, 0.5 to 1.0 mΩ), and there is a limit to lowering the conduction resistance of the entire short-circuit element even if a conductor is filled in the through hole.
　また、高抵抗の第１、第２の電極１０４，１０５と外部端子１１２との間に大電流を流すことによる発熱で、バイパス電流経路の破壊や、他の周辺機器への熱影響も懸念される。 In addition, heat generated by flowing a large current between the high resistance first and second electrodes 104 and 105 and the external terminal 112 may cause damage to the bypass current path and heat effects on other peripheral devices. The
　この点、短絡素子１３０は、第１、第２の電極１０４，１０５と同一表面に外部接続端子１３２，１３４を設けている。この外部接続端子１３２，１３４は、外部接続電極１３１，１３３上に設けるものであり、形状やサイズ等の自由度が高く、導通抵抗の低い端子を容易に設けることができる。これにより、短絡素子１３０は、第１の電極１０４と第２の電極１０５とが短絡したときの、第１、第２の外部接続電極１３１，１３３間の導通抵抗よりも、第１の外部接続端子１３２と第２の外部接続端子１３４との合成抵抗が低く構成されている。 In this respect, the short-circuit element 130 has external connection terminals 132 and 134 on the same surface as the first and second electrodes 104 and 105. The external connection terminals 132 and 134 are provided on the external connection electrodes 131 and 133, and a terminal having a high degree of freedom in shape and size and a low conduction resistance can be easily provided. As a result, the short-circuit element 130 is connected to the first external connection rather than the conduction resistance between the first and second external connection electrodes 131 and 133 when the first electrode 104 and the second electrode 105 are short-circuited. The combined resistance of the terminal 132 and the second external connection terminal 134 is configured to be low.
　したがって、短絡素子１３０によれば、短絡素子１０１の構成おいては高くなる第１、第２の外部接続電極１３１，１３３から先の導通抵抗を容易に下げることができ、定格の飛躍的な向上を図ることができる。 Therefore, according to the short-circuit element 130, the conduction resistance ahead of the first and second external connection electrodes 131 and 133, which are high in the configuration of the short-circuit element 101, can be easily lowered, and the rating is dramatically improved. Can be achieved.
　第１、第２の外部接続端子１３２，１３４としては、例えば、Ｓｎを主成分とするＰｂフリーハンダからなる金属バンプや金属ポストを用いて構成することができる。金属バンプや金属ポストの形状は問わない。第１、第２の外部接続端子１３２，１３４の抵抗値は材料や形状、サイズから求めることができる。一例として、Ｃｕコアの表面にハンダをコーティングした直方体の金属ポスト（Ｃｕコア：０．６ｍｍ×０．６ｍｍ、断面積０．３６ｍｍ２、高さ１ｍｍ、比抵抗１７．２μΩ・ｍｍ）を用いた場合、その１端子のＣｕコア部抵抗値は約０．０４８ｍΩであり、ハンダコーティング分を考慮すると第１、第２の外部接続端子１３２，１３４を直列接続させた抵抗値が０．０９６ｍΩ未満と低く、短絡素子１３０全体の定格を向上できることがわかる。 The first and second external connection terminals 132 and 134 can be configured using, for example, metal bumps or metal posts made of Pb-free solder whose main component is Sn. The shape of the metal bump or the metal post is not limited. The resistance values of the first and second external connection terminals 132 and 134 can be obtained from the material, shape, and size. As an example, when a rectangular parallelepiped metal post (Cu core: 0.6 mm × 0.6 mm, cross-sectional area 0.36 mm 2, height 1 mm, specific resistance 17.2 μΩ · mm) is used. The resistance value of the Cu core of one terminal is about 0.048 mΩ, and considering the solder coating, the resistance value obtained by connecting the first and second external connection terminals 132 and 134 in series is as low as less than 0.096 mΩ. It can be seen that the overall rating of the short-circuit element 130 can be improved.
　なお、短絡素子１３０は、短絡時における第１、第２の外部接続端子１３２，１３４間に亘る抵抗値より素子全体の全抵抗値を求め、この全抵抗値と既知である第１、第２の外部接続端子１３２，１３４の合成抵抗との差より、短絡時における第１、第２の外部接続電極１３１，１３３間の導通抵抗を求めることができる。また、短絡素子１３０は、短絡時における第１、第２の外部接続電極１３１，１３３間の抵抗を測定し、短絡時における素子全体の全抵抗値との差より、第１、第２の外部接続端子１３２，１３４の合成抵抗を求めることができる。 The short-circuit element 130 obtains the total resistance value of the entire element from the resistance value between the first and second external connection terminals 132 and 134 at the time of the short circuit, and the total resistance value and the known first and second values. From the difference from the combined resistance of the external connection terminals 132 and 134, the conduction resistance between the first and second external connection electrodes 131 and 133 at the time of a short circuit can be obtained. In addition, the short-circuit element 130 measures the resistance between the first and second external connection electrodes 131 and 133 at the time of the short-circuit, and the first and second external elements are calculated based on the difference from the total resistance value of the entire element at the time of the short-circuit. The combined resistance of the connection terminals 132 and 134 can be obtained.
　また、図２９に示すように、短絡素子１３０は、第１、第２の外部接続電極１３１，１３３を矩形状に形成する等により広く設け、第１、第２の外部接続端子１３２，１３４を複数設けることにより導通抵抗を下げるようにしてもよい。その他にも、短絡素子１３０は、広く設けた第１、第２の外部接続電極１３１，１３３に大径の第１、第２の外部接続端子１３２，１３４を設けることにより導通抵抗を下げるようにしてもよい。 Further, as shown in FIG. 29, the short-circuit element 130 is widely provided by forming the first and second external connection electrodes 131 and 133 in a rectangular shape or the like, and the first and second external connection terminals 132 and 134 are provided. The conduction resistance may be lowered by providing a plurality. In addition, the short-circuit element 130 reduces the conduction resistance by providing the first and second external connection terminals 132 and 134 having large diameters on the widely provided first and second external connection electrodes 131 and 133. May be.
　また、第１、第２の外部接続端子１３２，１３４は、コアとなる高融点金属１３２ａ，１３４ａの表面に低融点金属層１３２ｂ，１３４ｂを設けることにより形成してもよい。低融点金属層１３２ｂ，１３４ｂを構成する金属としては、Ｓｎを主成分とするＰｂフリーハンダなどのハンダを好適に用いることができ、高融点金属１３２ａ，１３４ａとしては、ＣｕやＡｇを主成分とする合金などを好適に用いることができる。 Further, the first and second external connection terminals 132 and 134 may be formed by providing the low melting point metal layers 132b and 134b on the surfaces of the high melting point metals 132a and 134a serving as the core. As the metal constituting the low melting point metal layers 132b and 134b, solder such as Pb-free solder containing Sn as a main component can be preferably used. As the high melting point metals 132a and 134a, Cu or Ag is used as a main component. An alloy to be used can be preferably used.
　高融点金属１３２ａ，１３４ａの表面に低融点金属層１３２ｂ，１３４ｂを設けることにより、短絡素子１３０をリフロー実装する場合に、リフロー温度が低融点金属層１３２ｂ，１３４ｂの溶融温度を超えて、低融点金属が溶融しても、第１、第２の外部接続端子１３２，１３４として溶融することを防止することができる。また、第１、第２の外部接続端子１３２，１３４は、外層を構成する低融点金属を用いて、第１、第２の外部接続電極１３１，１３３へ接続することができる。 By providing the low melting point metal layers 132b and 134b on the surfaces of the high melting point metals 132a and 134a, the reflow temperature exceeds the melting temperature of the low melting point metal layers 132b and 134b when the short circuit element 130 is reflow mounted. Even if the metal is melted, it can be prevented from melting as the first and second external connection terminals 132 and 134. The first and second external connection terminals 132 and 134 can be connected to the first and second external connection electrodes 131 and 133 using a low melting point metal constituting the outer layer.
　第１、第２の外部接続端子１３２，１３４は、高融点金属１３２ａ，１３４ａに低融点金属をメッキ技術を用いて成膜することにより形成することができ、またその他の周知の積層技術、膜形成技術を用いることによっても形成することができる。 The first and second external connection terminals 132 and 134 can be formed by forming a low melting point metal on the high melting point metals 132a and 134a by using a plating technique, and other well-known lamination techniques and films. It can also be formed by using a forming technique.
　なお、第１、第２の外部接続端子１３２，１３４は、金属バンプや金属ポストを用いて形成する他にも、導電メッキ層や、導電ペーストを塗布することにより形成された導電層により形成してもよい。 The first and second external connection terminals 132 and 134 are formed by using a conductive plating layer or a conductive layer formed by applying a conductive paste, in addition to using metal bumps or metal posts. May be.
　また、第１、第２の外部接続端子１３２，１３４は、短絡素子１３０が実装される基板等の実装対象物側に予め設け、短絡素子が実装された実装体において、第１、第２の外部接続電極１３１，１３３、あるいは第１、第２の電極１０４，１０５と接続されるようにしてもよい。 Further, the first and second external connection terminals 132 and 134 are provided in advance on the mounting object side such as a substrate on which the short-circuit element 130 is mounted, and in the mounting body on which the short-circuit element is mounted, The external connection electrodes 131 and 133 or the first and second electrodes 104 and 105 may be connected.
　［バッテリパックの回路構成］
　次いで、短絡素子１０１を組み込んだ電子機器の回路構成について説明する。図３０は、クルマや電動工具等の各種電子機器に搭載されて用いられるリチウムイオンバッテリーが内蔵されたバッテリパック１４０の回路構成を示す図である。図３０（Ａ）に示すように、バッテリパック１４０は、電流経路上に複数のバッテリセル１４１が直列に接続されることで、高電圧、大電流を確保している。また、バッテリパック１４０は、各バッテリセル１４１に、当該バッテリセル１４１の過充電あるいは過放電等の異常時に電流経路を遮断する保護素子１４２が接続されている。 [Battery pack circuit configuration]
Next, a circuit configuration of an electronic device incorporating the short-circuit element 101 will be described. FIG. 30 is a diagram showing a circuit configuration of a battery pack 140 in which a lithium ion battery used in various electronic devices such as cars and electric tools is built. As shown in FIG. 30 (A), the battery pack 140 ensures a high voltage and a large current by connecting a plurality of battery cells 141 in series on the current path. In the battery pack 140, each battery cell 141 is connected to a protection element 142 that interrupts the current path when an abnormality such as overcharge or overdischarge of the battery cell 141 occurs.
　保護素子１４２は、図３１（Ａ）（Ｂ）に示すように、絶縁基板１４４と、絶縁基板１４４に積層され、絶縁部材１４５に覆われた発熱抵抗体１４６と、絶縁基板１４４の両端に形成された電極１４７（Ａ１），１４７（Ａ２）と、絶縁部材１４５上に発熱抵抗体１４６と重畳するように積層された発熱体引出電極１４８と、両端が電極１４７（Ａ１），１４７（Ａ２）にそれぞれ接続され、中央部が発熱体引出電極１４８に接続された可溶導体１４９とを備える。 31A and 31B, the protective element 142 is formed on the insulating substrate 144, the heating resistor 146 laminated on the insulating substrate 144 and covered with the insulating member 145, and both ends of the insulating substrate 144. Electrodes 147 (A1) and 147 (A2), a heating element extraction electrode 148 laminated on the insulating member 145 so as to overlap the heating resistor 146, and electrodes 147 (A1) and 147 (A2) at both ends. And a soluble conductor 149 having a central portion connected to the heating element extraction electrode 148.
　絶縁基板１４４は、上述した絶縁基板１０２と同様の材料を用いて、略方形状に形成されている。発熱抵抗体１４６は、上述した第１、第２の発熱抵抗体１２１，１２２と同様の材料を用いて、同様の製法で形成される。保護素子１４２は、発熱抵抗体１４６を覆うように絶縁部材１４５が配置され、この絶縁部材１４５を介して発熱抵抗体１４６に対向するように発熱体引出電極１４８が配置される。発熱抵抗体１４６の熱を効率良く可溶導体１４９に伝えるために、発熱抵抗体１４６と絶縁基板１４４の間に絶縁部材１４５を積層しても良い。発熱体引出電極１４８の一端は、発熱体電極１５０（Ｐ１）に接続される。また、発熱抵抗体１４６の他端は、他方の発熱体電極１５０（Ｐ２）に接続される。可溶導体１４９は、上述した第１、第２の可溶導体１０８，１０９と同じものを用いることができる。 The insulating substrate 144 is formed in a substantially rectangular shape using the same material as the insulating substrate 102 described above. The heating resistor 146 is formed by the same manufacturing method using the same material as the first and second heating resistors 121 and 122 described above. In the protection element 142, an insulating member 145 is disposed so as to cover the heating resistor 146, and a heating element extraction electrode 148 is disposed so as to face the heating resistor 146 through the insulating member 145. In order to efficiently transfer the heat of the heating resistor 146 to the fusible conductor 149, an insulating member 145 may be laminated between the heating resistor 146 and the insulating substrate 144. One end of the heating element extraction electrode 148 is connected to the heating element electrode 150 (P1). The other end of the heating resistor 146 is connected to the other heating element electrode 150 (P2). The soluble conductor 149 may be the same as the first and second soluble conductors 108 and 109 described above.
　なお、保護素子１４２においても、上記短絡素子１０１と同様に、可溶導体１４９の酸化防止のために、可溶導体１４９上のほぼ全面にフラックスを塗布してもよい。また、保護素子１４２は、内部を保護するためにカバー部材を絶縁基板１４４上に載置してもよい。 Note that, in the protective element 142, similarly to the short-circuit element 101, flux may be applied to almost the entire surface of the soluble conductor 149 in order to prevent the soluble conductor 149 from being oxidized. Further, the protective element 142 may have a cover member placed on the insulating substrate 144 in order to protect the inside.
　以上のような保護素子１４２は、図３２に示すような回路構成を有する。すなわち、保護素子１４２は、発熱体引出電極１４８を介して直列接続された可溶導体１４９と、可溶導体１４９の接続点を介して通電して発熱させることによって可溶導体１４９を溶融する発熱抵抗体１４６とからなる回路構成である。保護素子１４２の２個の電極１４７のうち、一方は、Ａ１に接続され、他方は、Ａ２に接続される。また、発熱体引出電極１４８とこれに接続された発熱体電極１５０は、Ｐ１に接続され、他方の発熱体電極１５０は、Ｐ２に接続される。 The protective element 142 as described above has a circuit configuration as shown in FIG. That is, the protection element 142 generates heat by melting the soluble conductor 149 by energizing the soluble conductor 149 connected in series via the heating element extraction electrode 148 and the connection point of the soluble conductor 149 to generate heat. The circuit configuration includes a resistor 146. Of the two electrodes 147 of the protective element 142, one is connected to A1, and the other is connected to A2. Further, the heating element extraction electrode 148 and the heating element electrode 150 connected thereto are connected to P1, and the other heating element electrode 150 is connected to P2.
　そして、保護素子１４２は、図３０（Ａ）に示すように、リチウムイオン二次電池のバッテリパック１４０内の回路に用いられる。バッテリパック１４０は、直列に接続された複数のバッテリユニット１８４を有する。各バッテリユニット１８４は、バッテリセル１４１と、保護素子１４２と、短絡素子１０１と、保護素子１４２の動作を制御する第１の電流制御素子１８１と、短絡素子１０１の動作を制御する第２、第３の電流制御素子１８２，１８３と、保護抵抗１５４とで構成される。 And the protection element 142 is used for the circuit in the battery pack 140 of a lithium ion secondary battery, as shown to FIG. 30 (A). Battery pack 140 has a plurality of battery units 184 connected in series. Each battery unit 184 includes a battery cell 141, a protection element 142, a short-circuit element 101, a first current control element 181 that controls the operation of the protection element 142, and a second and second control that controls the operation of the short-circuit element 101. 3 current control elements 182 and 183 and a protective resistor 154.
　また、バッテリパック１４０は、バッテリユニット１８４と、バッテリユニット１８４の充放電を制御する充放電制御回路１５５と、各バッテリユニット１８４のバッテリセル１４１の電圧を検出するとともに、保護素子１４２や短絡素子１０１の動作を制御する第１～第３の電流制御素子１８１～１８３に異常信号を出力する検出回路１５６とを備える。 In addition, the battery pack 140 detects the voltage of the battery unit 184, the charge / discharge control circuit 155 that controls the charge / discharge of the battery unit 184, and the battery cell 141 of each battery unit 184, and the protection element 142 and the short-circuit element 101. And a detection circuit 156 that outputs an abnormal signal to the first to third current control elements 181 to 183 that control the operation of the first current control element.
　各バッテリユニット１８４は、保護素子１４２の電極１４７（Ａ１）がバッテリセル１４１と直列に接続され、電極１４７（Ａ２）がバッテリパック１４０の充放電電流経路に接続される。また、バッテリユニット１８４は、短絡素子１０１の第２の電極端子部１０５ａが保護素子１４２の開放端と、保護抵抗１５４を介して接続され、第１の電極端子部１０４ａがバッテリセル１４１の開放端と接続されることにより、保護素子１４２及びバッテリセル１４１と、短絡素子１０１とが並列に接続されている。また、バッテリユニット１８４は、保護素子１４２の発熱体電極１５０（Ｐ２）が第１の電流制御素子１８１と接続され、短絡素子１０１の第１の抵抗体端子部１２１ａが第２の電流制御素子１８２と接続され、短絡素子１０１の第２の抵抗体端子部１２２ａが第３の電流制御素子１８３と接続されている。 In each battery unit 184, the electrode 147 (A1) of the protection element 142 is connected in series with the battery cell 141, and the electrode 147 (A2) is connected to the charge / discharge current path of the battery pack 140. In the battery unit 184, the second electrode terminal portion 105a of the short-circuit element 101 is connected to the open end of the protective element 142 via the protective resistor 154, and the first electrode terminal portion 104a is connected to the open end of the battery cell 141. , The protection element 142 and the battery cell 141 and the short-circuit element 101 are connected in parallel. Further, in the battery unit 184, the heating element electrode 150 (P2) of the protection element 142 is connected to the first current control element 181, and the first resistor terminal portion 121a of the short-circuit element 101 is the second current control element 182. And the second resistor terminal portion 122a of the short-circuit element 101 is connected to the third current control element 183.
　検出回路１５６は、各バッテリセル１４１と接続され、各バッテリセル１４１の電圧値を検出して、各電圧値を充放電制御回路１５５の制御部１５９に供給する。また、検出回路１５６は、バッテリセル１４１が過充電電圧又は過放電電圧になったときに、当該バッテリセル１４１を有するバッテリユニット１８４の第１～第３の電流制御素子１８１～１８３へ異常信号を出力する。 The detection circuit 156 is connected to each battery cell 141, detects the voltage value of each battery cell 141, and supplies each voltage value to the control unit 159 of the charge / discharge control circuit 155. Further, when the battery cell 141 becomes an overcharge voltage or an overdischarge voltage, the detection circuit 156 sends an abnormal signal to the first to third current control elements 181 to 183 of the battery unit 184 having the battery cell 141. Output.
　第１～第３の電流制御素子１８１～１８３は、たとえばＦＥＴにより構成され、検出回路１５６から出力される検出信号によって、バッテリセル１４１の電圧値が所定の過放電又は過充電状態を超える電圧になったとき、保護素子１４２及び短絡素子１０１を動作させて、バッテリユニット１８４の充放電電流経路を第３、第４の電流制御素子１５７，１５８のスイッチ動作によらず遮断するとともに、短絡素子１０１のスイッチ１２０を短絡させ、当該バッテリユニット１８４をバイパスするバイパス電流経路を形成するように制御する。 The first to third current control elements 181 to 183 are constituted by, for example, FETs, and the voltage value of the battery cell 141 is set to a voltage exceeding a predetermined overdischarge or overcharge state by a detection signal output from the detection circuit 156. Then, the protection element 142 and the short-circuit element 101 are operated to cut off the charging / discharging current path of the battery unit 184 regardless of the switching operation of the third and fourth current control elements 157 and 158 and the short-circuit element 101. Is controlled to form a bypass current path that bypasses the battery unit 184.
　このようなバッテリパック１４０は、正常時には、短絡素子１０１のスイッチ１２０が短絡されていないため、図３０（Ａ）に示すように、電流Ｅは保護素子１４２及びバッテリセル１４１側に流れる。 In such a battery pack 140, since the switch 120 of the short-circuit element 101 is not short-circuited at normal times, the current E flows to the protection element 142 and the battery cell 141 side as shown in FIG.
　バッテリセル１４１に電圧異常等が検知されると、検出回路１５６より第１の電流制御素子１８１に異常信号が出力され、保護素子１４２の発熱抵抗体１４６が発熱される。図３０（Ｂ）に示すように、保護素子１４２は、発熱抵抗体１４６によって、可溶導体１４９を加熱、溶融させることにより、電極１４７（Ａ１），１４７（Ａ２）間を遮断する。これにより、異常なバッテリセル１４１を有する当該バッテリユニット１８４を、バッテリパック１４０の充放電電流経路上から遮断することができる。なお、可溶導体１４９が溶断することにより、発熱抵抗体１４６への給電は停止される。 When a voltage abnormality or the like is detected in the battery cell 141, an abnormality signal is output from the detection circuit 156 to the first current control element 181, and the heating resistor 146 of the protection element 142 is heated. As shown in FIG. 30 (B), the protection element 142 heats and melts the fusible conductor 149 with the heating resistor 146, thereby blocking between the electrodes 147 (A1) and 147 (A2). Thereby, the battery unit 184 having the abnormal battery cell 141 can be cut off from the charge / discharge current path of the battery pack 140. In addition, power supply to the heating resistor 146 is stopped when the fusible conductor 149 is melted.
　次いで、バッテリパック１４０は、検出回路１５６により当該バッテリユニット１８４の第２の電流制御素子１８２にも異常信号が出力され、短絡素子１０１の第１の発熱抵抗体１２１も発熱する。図３０（Ｃ）に示すように、短絡素子１０１は、第１の発熱抵抗体１２１によって第１の可溶導体１０８を加熱、溶融させることにより、第１の電極１０４上に溶融導体が凝集する。また、バッテリパック１４０は、第２の電流制御素子１８２への出力に続いて、第３の電流制御素子１８３へ異常信号を出力し、第２の発熱抵抗体１２２を発熱させる。短絡素子１０１は、第２の発熱抵抗体１２２によって第２の可溶導体１０９を加熱、溶融させることにより、第２の電極１０４上に溶融導体が凝集する。 Next, in the battery pack 140, the detection circuit 156 outputs an abnormal signal to the second current control element 182 of the battery unit 184, and the first heating resistor 121 of the short-circuit element 101 also generates heat. As shown in FIG. 30C, in the short-circuit element 101, the molten conductor aggregates on the first electrode 104 by heating and melting the first soluble conductor 108 by the first heating resistor 121. . Further, the battery pack 140 outputs an abnormal signal to the third current control element 183 following the output to the second current control element 182 to cause the second heating resistor 122 to generate heat. In the short-circuit element 101, the molten conductor aggregates on the second electrode 104 by heating and melting the second soluble conductor 109 by the second heating resistor 122.
　これにより、バッテリパック１４０は、図３０（Ｄ）に示すように、スイッチ１２０の第１の電極端子部１０４ａ及び第２の電極端子部１０５ａが短絡され、当該バッテリユニット１８４をバイパスするバイパス電流経路を形成することができる。なお、第１、第２の可溶導体１０８，１０９が溶断することにより、第１、第２の発熱抵抗体１２１，１２２への給電は停止される。 Thereby, as shown in FIG. 30D, the battery pack 140 has a bypass current path in which the first electrode terminal portion 104a and the second electrode terminal portion 105a of the switch 120 are short-circuited to bypass the battery unit 184. Can be formed. The first and second fusible conductors 108 and 109 are blown, whereby the power supply to the first and second heating resistors 121 and 122 is stopped.
　なお、保護抵抗１５４は、バッテリセル１４１の内部抵抗とほぼ同じ抵抗値を有することにより、バイパス電流経路上においても、正常時と同じ容量とすることができる。 Note that the protective resistor 154 has substantially the same resistance value as the internal resistance of the battery cell 141, and thus can have the same capacity as that in the normal state on the bypass current path.
　このようなバッテリパック１４０によっても、一つのバッテリユニット１８４に異常が起きた場合にも、当該バッテリユニット１８４を迂回するバイパス電流経路を形成することができ、残りの正常なバッテリユニット１８４によって充放電機能を維持することができる。 Even with such a battery pack 140, even when an abnormality occurs in one battery unit 184, a bypass current path that bypasses the battery unit 184 can be formed, and charging and discharging are performed by the remaining normal battery units 184. The function can be maintained.
　［短絡素子（保護抵抗内蔵）］
　また、短絡素子は、予め保護抵抗を内蔵させて形成してもよい。図３３は、絶縁基板１０２上に保護抵抗１６１が形成された短絡素子１６０の平面図である。短絡素子１６０は、上述した短絡素子１０１の構成に加え、第２の電極１０５と接続された保護抵抗１６１が形成され、この保護抵抗１６１を介して第２の電極端子部１０５ａが形成されている。保護抵抗１６１は、上述した第１，第２の発熱抵抗体１２１，１２２と同じ材料を用いて、同一のプロセスで同時に形成することができる。 [Short-circuit element (built-in protection resistor)]
Further, the short-circuit element may be formed by incorporating a protective resistor in advance. FIG. 33 is a plan view of the short-circuit element 160 in which the protective resistor 161 is formed on the insulating substrate 102. In addition to the configuration of the short-circuit element 101 described above, the short-circuit element 160 includes a protective resistor 161 connected to the second electrode 105, and a second electrode terminal portion 105 a is formed via the protective resistor 161. . The protective resistor 161 can be formed simultaneously by the same process using the same material as the first and second heating resistors 121 and 122 described above.
　このように電子機器やバッテリパックにおける内部抵抗が決まっているような場合、予め保護抵抗１６１を内蔵した短絡素子１６０を用いることにより、実装等の工程を省力化することができる。 When the internal resistance of the electronic device or battery pack is determined in this way, the mounting and other steps can be saved by using the short-circuit element 160 having the protective resistor 161 built-in in advance.
　図３４（Ａ）（Ｂ）は、短絡素子１６０の回路構成を示す図である。短絡素子１６０の回路構成は、スイッチ１２０が短絡することにより、第１の電極端子部１０４ａと第２の電極端子部１０５ａとが、保護抵抗１６１を介して接続される。すなわち、短絡素子１６０の回路構成は、第１、第２の可溶導体（ヒューズ）１０８，１０９と、第１、第２の可溶導体１０８，１０９の一端に接続された第１、第２の発熱抵抗体１２１、１２２と、第１、第２の可溶導体１０８，１０９の第１、第２の発熱抵抗体１２１，１２２が接続されていない他端に接続されたスイッチ１２０と、スイッチ１２０の端子の少なくとも一方の端子に接続された保護抵抗１６１とを備え、スイッチ１２０が、第１、第２の可溶導体１０８，１０９の溶断に連動して短絡するものである。 34A and 34B are diagrams showing the circuit configuration of the short-circuit element 160. FIG. The circuit configuration of the short-circuit element 160 is such that the first electrode terminal portion 104a and the second electrode terminal portion 105a are connected via the protective resistor 161 when the switch 120 is short-circuited. In other words, the circuit configuration of the short-circuit element 160 is such that the first and second fusible conductors (fuses) 108 and 109 and the first and second fusible conductors 108 and 109 connected to one end of the first and second fusible conductors 108 and 109. Of the first and second fusible conductors 108 and 109, the switch 120 connected to the other end to which the first and second heat generating resistors 121 and 122 are not connected, and the switch And a protective resistor 161 connected to at least one of the 120 terminals, and the switch 120 is short-circuited in conjunction with the fusing of the first and second fusible conductors 108 and 109.
　なお、短絡素子１６０においても、絶縁基板１０２の裏面に外部端子１１２を設けて第１の電極端子部１０４ａ及び第２の電極端子部１０５ａと当該外部端子１１２とをスルーホールによって接続する以外にも、上述した短絡素子１３０と同様に、絶縁基板１０２の第１、第２の電極１０４，１０５が形成された表面に、第１の電極１０４と連続する第１の外部接続電極１３１、第１の外部接続端子１３２、保護抵抗１６１を介して第２の電極１０５と連続する第２の外部接続電極１３３、及び第２の外部接続端子１３４を形成するようにしてもよい。 In the short-circuit element 160, the external terminal 112 is provided on the back surface of the insulating substrate 102 and the first electrode terminal portion 104a and the second electrode terminal portion 105a are connected to the external terminal 112 through a through hole. As in the case of the short-circuit element 130 described above, the first external connection electrode 131 that is continuous with the first electrode 104, the first electrode on the surface of the insulating substrate 102 on which the first and second electrodes 104 and 105 are formed. A second external connection electrode 133 continuous with the second electrode 105 and a second external connection terminal 134 may be formed via the external connection terminal 132, the protective resistor 161.
　［バッテリパックの回路構成（保護抵抗内蔵）］
　図３５は、短絡素子１６０を組み込んだバッテリパック１７０の回路構成を示す図である。バッテリパック１７０は、短絡素子１６０を用いた点を除いて、上述したバッテリパック１４０と同じ構成を有する。すなわち、バッテリパック１７０の回路構成は、前述の短絡素子１６０と、バッテリセル１４１と、バッテリセル１４１の電流経路上に接続され、バッテリセル１４１の異常時に該バッテリセル１４１への通電を電気信号で遮断する保護素子１４２と、バッテリセル１４１の異常を検知し、異常信号を出力する検出回路１５６と、検出回路１５６の異常信号を受けて動作する第１～第３の電流制御素子１８１，１８２、１８３とを備え、バッテリセル１４１及び保護素子１４２の両端と、スイッチ１２０の第１、第２の可溶導体１０８，１０９との接続端子１０４ａ及び保護抵抗１６１の開放端子１０５ａとを並列に接続し、第１、第２の発熱抵抗体１２１，１２２の第１、第２の抵抗体端子部１２１ａ、１２２ａを第２、第３の電流制御素子１８２，１８３に接続し、保護素子１４２の電気信号の入力端子となる発熱体電極１５０（Ｐ２）を第１の制御素子１８１に接続し、バッテリセル１４１の異常時には、検出回路１５６からの異常信号を受けて第１～第３の電流制御素子１８１，１８２，１８３が動作し、保護素子１４２によるバッテリセル１４１の電流経路の遮断と、第１、第２の可溶導体１０８，１０９の溶断に連動したスイッチ１２０の短絡を行い、バイパス電流経路が形成されるものである。バッテリパック１７０において、各バッテリユニット１８４に設けられた短絡素子１６０の保護抵抗１６１は、当該バッテリユニット１８４のバッテリセル１４１の内部抵抗とほぼ同じ抵抗値を有する。 [Battery pack circuit configuration (built-in protection resistor)]
FIG. 35 is a diagram showing a circuit configuration of a battery pack 170 in which the short-circuit element 160 is incorporated. The battery pack 170 has the same configuration as the battery pack 140 described above except that the short-circuit element 160 is used. That is, the circuit configuration of the battery pack 170 is connected to the above-described short-circuit element 160, the battery cell 141, and the current path of the battery cell 141, and the electric current is supplied to the battery cell 141 by an electric signal when the battery cell 141 is abnormal. A protection element 142 that shuts off, a detection circuit 156 that detects abnormality of the battery cell 141 and outputs an abnormality signal, and first to third current control elements 181 and 182 that operate in response to the abnormality signal of the detection circuit 156, 183, and both ends of the battery cell 141 and the protection element 142 are connected in parallel with the connection terminal 104 a of the first and second fusible conductors 108 and 109 of the switch 120 and the open terminal 105 a of the protection resistor 161. The first and second resistor terminal portions 121a and 122a of the first and second heating resistors 121 and 122 are connected to the second and third current control elements. The heating element electrode 150 (P2) which is connected to 182 and 183 and serves as an input terminal for the electrical signal of the protection element 142 is connected to the first control element 181. When the battery cell 141 is abnormal, an abnormal signal is output from the detection circuit 156. In response, the first to third current control elements 181, 182, and 183 operate to interrupt the current path of the battery cell 141 by the protection element 142 and to blow the first and second fusible conductors 108 and 109. The interlocked switch 120 is short-circuited to form a bypass current path. In the battery pack 170, the protective resistance 161 of the short-circuit element 160 provided in each battery unit 184 has substantially the same resistance value as the internal resistance of the battery cell 141 of the battery unit 184.
　このようなバッテリパック１７０によれば、一つのバッテリユニット１８４に異常が起きた場合にも、当該バッテリユニット１８４を迂回するバイパス電流経路を形成することができ、残りの正常なバッテリユニット１８４によって充放電機能を維持することができる。このとき、バッテリパック１７０は、保護抵抗１６１が、バッテリセル１４１の内部抵抗とほぼ同じ抵抗値を有することにより、バイパス電流経路上においても、正常時と同じ容量とすることができる。 According to such a battery pack 170, even when an abnormality occurs in one battery unit 184, a bypass current path that bypasses the battery unit 184 can be formed and charged by the remaining normal battery units 184. The discharge function can be maintained. At this time, the battery pack 170 can have the same capacity as that in the normal state on the bypass current path because the protective resistor 161 has substantially the same resistance value as the internal resistance of the battery cell 141.
　［バッテリパックの回路構成（制御素子共有）］
　また、図３６に示す短絡素子１６０を組み込んだバッテリパック１９０は、第１～第３の電流制御素子のうち、保護素子１４２と接続する電流制御素子と、第１の抵抗体端子部１２１ａと接続する電流制御素子とを共有にしたものである。すなわち、図３６に示すように、バッテリパック１９０は、保護素子１４２の発熱体電極１５０（Ｐ２）、及び短絡素子１６０の第１の抵抗体端子部１２１ａが第１の電流制御素子１９１と接続され、短絡素子１６０の第２の抵抗体端子部１２２ａが第２の電流制御素子１９２と接続されている。第１、第２の電流制御素子１９１，１９２は、検出回路１５６と接続され、検出回路１５６によってバッテリセル１４１の過充電電圧又は過放電電圧が検出されると、異常信号が出力される。 [Battery pack circuit configuration (shared control elements)]
Also, the battery pack 190 incorporating the short-circuit element 160 shown in FIG. 36 is connected to the current control element connected to the protection element 142 and the first resistor terminal portion 121a among the first to third current control elements. The current control element to be shared is shared. That is, as shown in FIG. 36, in the battery pack 190, the heating element electrode 150 (P2) of the protection element 142 and the first resistor terminal portion 121a of the short-circuit element 160 are connected to the first current control element 191. The second resistor terminal portion 122a of the short-circuit element 160 is connected to the second current control element 192. The first and second current control elements 191 and 192 are connected to the detection circuit 156, and when the overcharge voltage or overdischarge voltage of the battery cell 141 is detected by the detection circuit 156, an abnormal signal is output.
　第１、第２の電流制御素子１９１，１９２は、たとえばＦＥＴにより構成され、検出回路１５６から出力される異常信号によって、バッテリセル１４１の電圧値が所定の過放電又は過充電状態を超える電圧になったとき、保護素子１４２及び短絡素子１６０を動作させる。 The first and second current control elements 191 and 192 are constituted by, for example, FETs, and the voltage value of the battery cell 141 exceeds a predetermined overdischarge or overcharge state by an abnormal signal output from the detection circuit 156. When this happens, the protection element 142 and the short-circuit element 160 are operated.
　このとき検出回路１５６は、先ず第１の電流制御素子１９１に異常信号を出力し、次いで、第２の電流制御素子１９２に異常信号を出力する。第１の電流制御素子１９１が異常信号を受信すると、保護素子１４２の発熱抵抗体１４６、及び短絡素子１６０の第１の発熱抵抗体１２１に通電し、発熱させる。これにより、バッテリパック１９０は、保護素子１４２の可溶導体１４９が溶断することによりバッテリユニット１８４の充放電電流経路を遮断するとともに、短絡素子１６０の第１の可溶導体１０８が溶融する。次いで、第２の電流制御素子１９２が異常信号を受信すると、短絡素子１６０の第２の発熱抵抗体１２２に通電し、発熱させる。これにより、バッテリパック１９０は、短絡素子１６０の第２の可溶導体１０９が溶融し、先に溶融している第１の可溶導体１０８と結合して、第１、第２の電極１０４，１０５上に凝集する。したがって、短絡素子１６０は、スイッチ１２０を短絡させ、当該バッテリユニット１８４をバイパスするバイパス電流経路を形成する。このようなバッテリパック１９０によれば、電流制御素子を減らすことができ、回路構成を単純化することができる。 At this time, the detection circuit 156 first outputs an abnormal signal to the first current control element 191, and then outputs an abnormal signal to the second current control element 192. When the first current control element 191 receives the abnormal signal, the heating resistor 146 of the protection element 142 and the first heating resistor 121 of the short circuit element 160 are energized to generate heat. Thereby, the battery pack 190 cuts off the charging / discharging current path of the battery unit 184 when the soluble conductor 149 of the protection element 142 is melted, and the first soluble conductor 108 of the short-circuit element 160 is melted. Next, when the second current control element 192 receives an abnormal signal, the second heating resistor 122 of the short-circuit element 160 is energized to generate heat. As a result, the battery pack 190 is melted in the second fusible conductor 109 of the short-circuiting element 160 and is coupled to the first fusible conductor 108 that has been melted first. Aggregate on 105. Accordingly, the short-circuit element 160 short-circuits the switch 120 and forms a bypass current path that bypasses the battery unit 184. According to such a battery pack 190, the number of current control elements can be reduced, and the circuit configuration can be simplified.
　［第３の実施の形態］
　［短絡素子］
　次いで、本発明の第３の実施の形態について説明する。図３７（Ａ）に短絡素子２０１の平面図、及び図３７（Ｂ）に短絡素子２０１の断面図を示す。短絡素子２０１は、絶縁基板２０２と、絶縁基板２０２に設けられた第１の発熱抵抗体２２１及び第２の発熱抵抗体２２２と、絶縁基板２０２に、互いに隣接して設けられた第１の電極２０４及び第２の電極２０５（Ａ１）と、第１の電極２０４と隣接して設けられるとともに、第１の発熱抵抗体２２１に電気的に接続された第３の電極２０６と、第２の電極２０５（Ａ１）と隣接して設けられるとともに、第２の発熱抵抗体２２２に電気的に接続された第４の電極２０７（Ｐ１）と、第４の電極２０７（Ｐ１）に隣接して設けられる第５の電極２３１（Ａ２）と、第１、第３の電極２０４，２０６間に亘って設けられることにより電流経路を構成し、第１の発熱抵抗体２２１からの加熱により、第１、第３の電極２０４，２０６間の電流経路を溶断する第１の可溶導体２０８と、第２の電極２０５（Ａ１）から第４の電極２０７（Ｐ１）を経て第５の電極２３１（Ａ２）に亘って設けられ、第２の発熱抵抗体２２２からの加熱により、第２、第４、第５の電極２０５（Ａ１），２０７（Ｐ１），２３１（Ａ２）間の電流経路を溶断する第２の可溶導体２０９とを備える。そして、短絡素子２０１は、絶縁基板２０２上に内部を保護するカバー部材２１０が取り付けられている。 [Third Embodiment]
[Short-circuit element]
Next, a third embodiment of the present invention will be described. FIG. 37A is a plan view of the short-circuit element 201, and FIG. 37B is a cross-sectional view of the short-circuit element 201. The short-circuit element 201 includes an insulating substrate 202, a first heating resistor 221 and a second heating resistor 222 provided on the insulating substrate 202, and a first electrode provided adjacent to the insulating substrate 202. 204, the second electrode 205 (A1), a third electrode 206 provided adjacent to the first electrode 204 and electrically connected to the first heating resistor 221; and a second electrode 205 (A1) and adjacent to the fourth electrode 207 (P1) electrically connected to the second heating resistor 222 and adjacent to the fourth electrode 207 (P1). A current path is formed by being provided between the fifth electrode 231 (A2) and the first and third electrodes 204 and 206, and the first and second electrodes are heated by the first heating resistor 221. Current flow between the three electrodes 204 and 206 A first fusible conductor 208, a second electrode 205 (A 1), a fourth electrode 207 (P 1), and a fifth electrode 231 (A 2). And a second soluble conductor 209 that melts the current path between the second, fourth, and fifth electrodes 205 (A1), 207 (P1), and 231 (A2) by heating from the body 222. The short-circuit element 201 is provided with a cover member 210 that protects the inside on the insulating substrate 202.
　絶縁基板２０２は、たとえば、アルミナ、ガラスセラミックス、ムライト、ジルコニアなどの絶縁性を有する部材を用いて略方形状に形成されている。絶縁基板２０２は、その他にも、ガラスエポキシ基板、フェノール基板等のプリント配線基板に用いられる材料を用いてもよいが、ヒューズ溶断時の温度に留意する必要がある。なお、絶縁基板２０２は、裏面に外部端子２１２が形成されている。 The insulating substrate 202 is formed in a substantially square shape using an insulating member such as alumina, glass ceramics, mullite, zirconia, and the like. In addition, the insulating substrate 202 may be made of a material used for a printed wiring board such as a glass epoxy board or a phenol board, but it is necessary to pay attention to the temperature at the time of blowing the fuse. The insulating substrate 202 has an external terminal 212 formed on the back surface.
　第１、第２の発熱抵抗体２２１，２２２は、比較的抵抗値が高く通電すると発熱する導電性を有する部材であって、たとえばＷ、Ｍｏ、Ｒｕ等からなる。これらの合金あるいは組成物、化合物の粉状体を樹脂バインダ等と混合して、ペースト状にしたものを絶縁基板２上にスクリーン印刷技術を用いてパターン形成して、焼成する等によって形成する。 The first and second heat generating resistors 221 and 222 are conductive members that have a relatively high resistance value and generate heat when energized, and are made of, for example, W, Mo, Ru, or the like. These alloys, compositions, or compound powders are mixed with a resin binder or the like to form a paste on the insulating substrate 2 by patterning using a screen printing technique and firing.
　また、第１、第２の発熱抵抗体２２１，２２２は、絶縁基板２０２上において絶縁層２１１に被覆されている。第１の発熱抵抗体２２１を被覆する絶縁層２１１上には、第１、第３の電極２０４，２０６が形成され、第２の発熱抵抗体２２２を被覆する絶縁層２１１上には、第２、第４、第５の電極２０５，２０７，２３１が形成されている。第１の電極２０４は、一方側において第２の電極２０５と隣接して形成されるとともに、絶縁されている。第１の電極２０４の他方側には第３の電極２０６が形成されている。第１の電極２０４と第３の電極２０６とは、第１の可溶導体２０８が接続されることにより導通され、短絡素子２０１の電流経路を構成する。また、第１の電極２０４は、絶縁基板２０２の側面に臨む第１の電極端子部２０４ａに接続されている。第１の電極端子部２０４ａは、スルーホールを介して絶縁基板２０２の裏面に設けられた外部端子２１２と接続されている。 Further, the first and second heating resistors 221 and 222 are covered with the insulating layer 211 on the insulating substrate 202. First and third electrodes 204 and 206 are formed on the insulating layer 211 covering the first heating resistor 221, and the second electrode 204 and 206 are formed on the insulating layer 211 covering the second heating resistor 222. Fourth and fifth electrodes 205, 207, and 231 are formed. The first electrode 204 is formed adjacent to the second electrode 205 on one side and insulated. A third electrode 206 is formed on the other side of the first electrode 204. The first electrode 204 and the third electrode 206 are brought into conduction when the first fusible conductor 208 is connected to form a current path of the short-circuit element 201. The first electrode 204 is connected to the first electrode terminal portion 204 a facing the side surface of the insulating substrate 202. The first electrode terminal portion 204a is connected to an external terminal 212 provided on the back surface of the insulating substrate 202 through a through hole.
　また、第３の電極２０６は、絶縁基板２０２あるいは絶縁層２１１に設けられた第１の発熱体引出電極２２３を介して第１の発熱抵抗体２２１と接続されている。また、第１の発熱抵抗体２２１は、第１の発熱体引出電極２２３を介して、絶縁基板２０２の側縁に臨む第１の抵抗体端子部２２１ａに接続されている。第１の抵抗体端子部２２１ａは、スルーホールを介して、絶縁基板２０２の裏面に設けられた外部端子２１２と接続されている。 Further, the third electrode 206 is connected to the first heating resistor 221 via the first heating element lead-out electrode 223 provided on the insulating substrate 202 or the insulating layer 211. The first heating resistor 221 is connected to the first resistor terminal portion 221 a facing the side edge of the insulating substrate 202 via the first heating element lead-out electrode 223. The first resistor terminal portion 221a is connected to an external terminal 212 provided on the back surface of the insulating substrate 202 through a through hole.
　第２の電極２０５（Ａ１）の第１の電極２０４と隣接する一方側と反対の他方側には、第４の電極２０７（Ｐ１）が形成されている。また、第４の電極２０７（Ｐ１）の第２の電極２０５（Ａ１）と隣接する一方側と反対の他方側には、第５の電極２３１（Ａ２）が形成されている。第２の電極２０５（Ａ１）、第４の電極２０７（Ｐ１）及び第５の電極２３１（Ａ２）は、第２の可溶導体２０９と接続されている。また、第２の電極２０５（Ａ１）は、絶縁基板２０２の側面に臨む第２の電極端子部２０５ａに接続されている。第２の電極端子部２０５ａは、スルーホールを介して絶縁基板２０２の裏面に設けられた外部端子２１２と接続されている。 The fourth electrode 207 (P1) is formed on the other side opposite to the one side adjacent to the first electrode 204 of the second electrode 205 (A1). A fifth electrode 231 (A2) is formed on the other side of the fourth electrode 207 (P1) opposite to the one side adjacent to the second electrode 205 (A1). The second electrode 205 (A1), the fourth electrode 207 (P1), and the fifth electrode 231 (A2) are connected to the second soluble conductor 209. The second electrode 205 (A1) is connected to the second electrode terminal portion 205a facing the side surface of the insulating substrate 202. The second electrode terminal portion 205a is connected to an external terminal 212 provided on the back surface of the insulating substrate 202 through a through hole.
　また、第４の電極２０７（Ｐ１）は、絶縁基板２０２あるいは絶縁層２１１に設けられた第２の発熱体引出電極２２４を介して第２の発熱抵抗体２２２と接続されている。また、第２の発熱抵抗体２２２は、第２の発熱体引出電極２２４を介して、絶縁基板２０２の側縁に臨む第２の抵抗体端子部２２２ａ（Ｐ２）に接続されている。第２の抵抗体端子部２２２ａ（Ｐ２）は、スルーホールを介して、絶縁基板２０２の裏面に設けられた外部端子２１２と接続されている。 The fourth electrode 207 (P1) is connected to the second heating resistor 222 via the second heating element extraction electrode 224 provided on the insulating substrate 202 or the insulating layer 211. The second heating resistor 222 is connected to the second resistor terminal portion 222a (P2) facing the side edge of the insulating substrate 202 via the second heating element lead-out electrode 224. The second resistor terminal portion 222a (P2) is connected to an external terminal 212 provided on the back surface of the insulating substrate 202 through a through hole.
　さらに、第５の電極２３１（Ａ２）は、絶縁基板２０２の側面に臨む第５の電極端子部２３１ａに接続されている。第５の電極端子部２３１ａは、スルーホールを介して絶縁基板２０２の裏面に設けられた外部端子２１２と接続されている。 Furthermore, the fifth electrode 231 (A2) is connected to the fifth electrode terminal portion 231a facing the side surface of the insulating substrate 202. The fifth electrode terminal portion 231a is connected to an external terminal 212 provided on the back surface of the insulating substrate 202 through a through hole.
　なお、第１～第５の電極２０４，２０５，２０６，２０７，２３１は、ＣｕやＡｇ等の一般的な電極材料を用いて形成することができるが、少なくとも第１、第２の電極２０４，２０５の表面上には、Ｎｉ／Ａｕメッキ、Ｎｉ／Ｐｄメッキ、Ｎｉ／Ｐｄ／Ａｕメッキ等の被膜が、公知のメッキ処理により形成されていることが好ましい。これにより、第１、第２の電極２０４，２０５の酸化を防止し、溶融導体を確実に保持させることができる。また、短絡素子２０１をリフロー実装する場合に、第１、第２の可溶導体２０８，２０９を接続するハンダあるいは第１、第２の可溶導体２０８，２０９の外層を形成する低融点金属が溶融することにより第１、第２の電極２０４，２０５を溶食（ハンダ食われ）して切断するのを防ぐことができる。 Note that the first to fifth electrodes 204, 205, 206, 207, 231 can be formed using a general electrode material such as Cu or Ag, but at least the first and second electrodes 204, A coating such as Ni / Au plating, Ni / Pd plating, or Ni / Pd / Au plating is preferably formed on the surface of 205 by a known plating process. Thereby, the oxidation of the first and second electrodes 204 and 205 can be prevented, and the molten conductor can be reliably held. In addition, when the short-circuit element 201 is mounted by reflow soldering, a solder that connects the first and second soluble conductors 208 and 209 or a low melting point metal that forms an outer layer of the first and second soluble conductors 208 and 209 is used. By melting, the first and second electrodes 204 and 205 can be prevented from being melted (soldered) and cut.
　［可溶導体］
　第１、第２の可溶導体２０８，２０９は、第１、第２の発熱抵抗体２２１，２２２の発熱により速やかに溶断される低融点金属からなり、例えばＳｎを主成分とするＰｂフリーハンダを好適に用いることができる。 [Soluble conductor]
The first and second fusible conductors 208 and 209 are made of a low melting point metal that is quickly melted by the heat generated by the first and second heating resistors 221 and 222, for example, Pb-free solder mainly composed of Sn. Can be suitably used.
　また、第１、第２の可溶導体２０８，２０９は、低融点金属と高融点金属を含有してもよい。低融点金属としては、Ｐｂフリーハンダなどのハンダを用いることが好ましく、高融点金属としては、Ａｇ、Ｃｕ又はこれらを主成分とする合金などを用いることが好ましい。高融点金属と低融点金属とを含有することによって、短絡素子２０１をリフロー実装する場合に、リフロー温度が低融点金属層の溶融温度を超えて、低融点金属が溶融しても、第１、第２の可溶導体２０８，２０９として溶断するに至らない。かかる第１、第２の可溶導体２０８，２０９は、高融点金属に低融点金属をメッキ技術を用いて成膜することによって形成してもよく、他の周知の積層技術、膜形成技術を用いることによって形成してもよい。なお、第１、第２の可溶導体２０８，２０９は、外層を構成する低融点金属を用いて、第１及び第３の電極２０４，２０６、又は第２、第４及び第５の電極２０５，２０７，２３１へ、ハンダ接続することができる。 Further, the first and second soluble conductors 208 and 209 may contain a low melting point metal and a high melting point metal. As the low melting point metal, it is preferable to use solder such as Pb-free solder, and as the high melting point metal, it is preferable to use Ag, Cu or an alloy containing these as a main component. By including the high melting point metal and the low melting point metal, even when the reflow temperature exceeds the melting temperature of the low melting point metal layer and the low melting point metal melts, The second soluble conductors 208 and 209 do not melt. The first and second fusible conductors 208 and 209 may be formed by depositing a low melting point metal on a high melting point metal using a plating technique, and other well-known lamination techniques and film forming techniques may be used. You may form by using. The first and second fusible conductors 208 and 209 are made of a low melting point metal constituting the outer layer, and the first and third electrodes 204 and 206 or the second, fourth and fifth electrodes 205 are used. , 207, 231 can be soldered.
　第１、第２の可溶導体２０８，２０９は、内層を低融点金属とし、外層を高融点金属としてもよい。内層の低融点金属層の全表面を外層の高融点金属層で被覆した可溶導体を用いることにより、リフロー温度よりも融点の低い低融点金属を用いた場合でも、リフロー実装時に、内層の低融点金属の外部への流出を抑制することができる。また、溶断時も、内層の低融点金属が溶融することにより、外層の高融点金属を溶食（ハンダ食われ）し、速やかに溶断することができる。 The first and second soluble conductors 208 and 209 may have an inner layer made of a low melting point metal and an outer layer made of a high melting point metal. By using a soluble conductor in which the entire surface of the inner low melting point metal layer is covered with the outer high melting point metal layer, even when using a low melting point metal having a melting point lower than the reflow temperature, the inner layer has a low Outflow of the melting point metal to the outside can be suppressed. Further, when the inner layer low melting point metal melts, the outer layer high melting point metal is also eroded (soldered) and can be quickly melted.
　また、第１、第２の可溶導体２０８，２０９は、内層を高融点金属とし、外層を低融点金属とする被覆構造としてもよい。内層の高融点金属層の全表面を外層の低融点金属層で被覆した可溶導体を用いることにより、外層の低融点金属層を介して電極上に接続することができ、また、溶断時も、低融点金属層が速やかに溶融して高融点金属を溶食するため、速やかに溶断することができる。 Further, the first and second soluble conductors 208 and 209 may have a covering structure in which the inner layer is made of a high melting point metal and the outer layer is made of a low melting point metal. By using a soluble conductor in which the entire surface of the inner high-melting-point metal layer is covered with an outer low-melting-point metal layer, it can be connected to the electrode via the outer-layer low-melting-point metal layer. Since the low melting point metal layer melts rapidly and erodes the high melting point metal, it can be melted quickly.
　また、第１、第２の可溶導体２０８，２０９は、低融点金属層と、高融点金属層とが積層された積層構造としてもよい。また、低融点金属層と、高融点金属層とが交互に積層された４層以上の多層構造としてもよい。また、第１、第２の可溶導体２０８，２０９は、内層を構成する低融点金属層の表面を高融点金属層にてストライプ状に部分的に積層してもよい。これらの構造によっても、低融点金属による高融点金属の溶食による短時間での溶断を行うことができる。 Further, the first and second soluble conductors 208 and 209 may have a laminated structure in which a low melting point metal layer and a high melting point metal layer are laminated. Moreover, it is good also as a multilayered structure of four or more layers by which the low melting metal layer and the high melting metal layer were laminated | stacked alternately. Further, the first and second soluble conductors 208 and 209 may be partially laminated in a stripe shape with the high melting point metal layer on the surface of the low melting point metal layer constituting the inner layer. Even with these structures, it is possible to perform fusing in a short time by the corrosion of the high melting point metal by the low melting point metal.
　また、第１、第２の可溶導体２０８，２０９は、多数の開口部を有する高融点金属と、上記開口部に挿入された低融点金属とから構成してもよい。これにより、溶融する低融点金属層に接する高融点金属層の面積が増大するので、より短時間で低融点金属層が高融点金属層を溶食することができるようになる。したがって、より速やか、かつ確実に可溶導体を溶断させることが可能となる。 The first and second soluble conductors 208 and 209 may be composed of a high melting point metal having a large number of openings and a low melting point metal inserted into the openings. As a result, the area of the refractory metal layer in contact with the molten low melting point metal layer increases, so that the low melting point metal layer can erode the refractory metal layer in a shorter time. Therefore, the soluble conductor can be blown out more quickly and reliably.
　また、第１、第２の可溶導体２０８，２０９は、高融点金属の体積よりも低融点金属の体積を多くすることが好ましい。これにより、第１、第２の可溶導体２０８，２０９は、効果的に高融点金属層の溶食による短時間での溶断を行うことができる。 Further, it is preferable that the first and second soluble conductors 208 and 209 have a volume of the low melting point metal larger than that of the high melting point metal. Thereby, the 1st, 2nd soluble conductors 208 and 209 can perform fusing in a short time by the corrosion of a refractory metal layer effectively.
　なお、第１、第２の可溶導体２０８，２０９の酸化防止、及び第１、第２の可溶導体２０８，２０９の溶融時における濡れ性を向上させるために、第１、第２の可溶導体２０８，２０９の上にはフラックス２１５が塗布されている。 In order to prevent oxidation of the first and second soluble conductors 208 and 209 and to improve the wettability of the first and second soluble conductors 208 and 209 during melting, the first and second soluble conductors 208 and 209 are improved. A flux 215 is applied on the molten conductors 208 and 209.
　短絡素子２０１は、絶縁基板２０２がカバー部材２１０に覆われることによりその内部が保護されている。カバー部材２１０は、短絡素子２０１の側面を構成する側壁２１６と、短絡素子２０１の上面を構成する天面部２１７とを有し、側壁２１６が絶縁基板２０２上に接続されることにより、短絡素子２０１の内部を閉塞する蓋体となる。このカバー部材２１０は、上記絶縁基板２０２と同様に、たとえば、熱可塑性プラスチック，セラミックス、ガラスエポキシ基板等の絶縁性を有する部材を用いて形成されている。 The inside of the short-circuit element 201 is protected by covering the insulating substrate 202 with the cover member 210. The cover member 210 has a side wall 216 that forms the side surface of the short-circuit element 201 and a top surface portion 217 that forms the upper surface of the short-circuit element 201, and the short-circuit element 201 is connected to the side wall 216 on the insulating substrate 202. It becomes a lid that closes the inside of the. Similar to the insulating substrate 202, the cover member 210 is formed using an insulating member such as a thermoplastic, ceramic, glass epoxy substrate, or the like.
　また、カバー部材２１０は、天面部２１７の内面側に、カバー部電極２１８が形成されていても良い。カバー部電極２１８は、第１、第２の電極２０４，２０５と重畳する位置に形成されている。このカバー部電極２１８は、第１、第２の発熱抵抗体２２１，２２２が発熱し、第１、第２の可溶導体２０８，２０９が溶融されると、第１、第２の電極２０４，２０５上に凝集した溶融導体が接触して濡れ広がることにより、溶融導体を保持する許容量を増加させることができる。 Further, the cover member 210 may have a cover portion electrode 218 formed on the inner surface side of the top surface portion 217. The cover part electrode 218 is formed at a position overlapping the first and second electrodes 204 and 205. When the first and second heating resistors 221 and 222 generate heat and the first and second fusible conductors 208 and 209 are melted, the cover electrode 218 has the first and second electrodes 204, When the molten conductor agglomerated on 205 contacts and spreads wet, the allowable amount for holding the molten conductor can be increased.
　［短絡素子回路］
　以上のような短絡素子２０１は、図３８に示すような回路構成を有する。すなわち、短絡素子２０１は、第１の電極２０４と第２の電極２０５とが、正常時には絶縁され、第１、第２の発熱抵抗体２２１，２２２の発熱により第１、第２の可溶導体２０８，２０９が溶融すると、当該溶融導体を介して短絡するスイッチ２２０を構成する。そして、第１の電極端子部２０４ａと第２の電極端子部２０５ａは、スイッチ２２０の両端子を構成する。 [Short-circuit element circuit]
The short circuit element 201 as described above has a circuit configuration as shown in FIG. That is, in the short-circuit element 201, the first electrode 204 and the second electrode 205 are normally insulated, and the first and second fusible conductors are generated by the heat generated by the first and second heating resistors 221 and 222. When 208 and 209 are melted, the switch 220 is configured to be short-circuited through the molten conductor. The first electrode terminal portion 204a and the second electrode terminal portion 205a constitute both terminals of the switch 220.
　また、第１の可溶導体２０８は、第３の電極２０６及び第１の発熱体引出電極２２３を介して第１の発熱抵抗体２２１と接続されている。第２の可溶導体２０９は、第４の電極２０７（Ｐ１）及び第２の発熱体引出電極２２４を介して第２の発熱抵抗体２２２及び第２の抵抗体端子部２２２ａ（Ｐ２）と接続されている。すなわち、第２の可溶導体２０９が接続される第２の電極２０５（Ａ１）、第４の電極２０７（Ｐ１）及び第５の電極２３１（Ａ２）は、保護素子として機能する。 The first soluble conductor 208 is connected to the first heating resistor 221 via the third electrode 206 and the first heating element lead-out electrode 223. The second soluble conductor 209 is connected to the second heating resistor 222 and the second resistor terminal portion 222a (P2) through the fourth electrode 207 (P1) and the second heating element lead-out electrode 224. Has been. That is, the second electrode 205 (A1), the fourth electrode 207 (P1), and the fifth electrode 231 (A2) to which the second soluble conductor 209 is connected function as a protective element.
　そして、短絡素子２０１は、第２の抵抗体端子部２２２ａ（Ｐ２）より通電されると、図３９に示すように、第２の発熱抵抗体２２２が発熱し、第２の可溶導体２０９を溶融させることにより、第４の電極２０７（Ｐ１）を介して接続されている第２の電極２０５（Ａ１）と第５の電極２３１（Ａ２）とに亘る電流経路を遮断する。また、短絡素子２０１は、第１の抵抗体端子部２２１ａより通電されると、第１の発熱抵抗体２２１が発熱し、第１の可溶導体２０８を溶融させる。これにより、短絡素子２０１は、図４０に示すように、第１の電極２０４と第２の電極２０５とに凝集した第１、第２の可溶導体２０８，２０９の溶融導体が結合することにより、絶縁されていた第１の電極２０４と第２の電極２０５とを短絡させる、すなわちスイッチ２２０を短絡させることができる。 When the short-circuit element 201 is energized from the second resistor terminal portion 222a (P2), as shown in FIG. 39, the second heating resistor 222 generates heat, and the second soluble conductor 209 is connected. By melting, the current path extending between the second electrode 205 (A1) and the fifth electrode 231 (A2) connected via the fourth electrode 207 (P1) is cut off. Further, when the short-circuit element 201 is energized from the first resistor terminal portion 221a, the first heating resistor 221 generates heat and melts the first soluble conductor 208. As a result, as shown in FIG. 40, the short-circuit element 201 is formed by combining the molten conductors of the first and second soluble conductors 208 and 209 that are aggregated into the first electrode 204 and the second electrode 205. The insulated first electrode 204 and second electrode 205 can be short-circuited, that is, the switch 220 can be short-circuited.
　なお、第１の発熱抵抗体２２１への通電は、第１の可溶導体２０８が溶断することにより第１、第３の電極２０４，２０６間が遮断されるため、停止され、第２の発熱抵抗体２２２への通電は、第２の可溶導体２０９が溶断することにより、第２、第４の電極２０５，２０７間及び第４、第５の電極２０７，２３１間が遮断されるため、停止される。 The energization of the first heating resistor 221 is stopped because the first fusible conductor 208 is cut off and the first and third electrodes 204 and 206 are cut off, and the second heat generation is stopped. Since the current to the resistor 222 is cut off between the second and fourth electrodes 205 and 207 and between the fourth and fifth electrodes 207 and 231 when the second soluble conductor 209 is melted, Stopped.
　［第２の可溶導体の先溶融］
　ここで、短絡素子２０１は、第２の可溶導体２０９が第１の可溶導体２０８よりも先行して溶融することが好ましい。短絡素子２０１は、第１の発熱抵抗体２２１と第２の発熱抵抗体２２２とが、別々に発熱されることから、通電のタイミングとして第２の発熱抵抗体２２２を先に発熱させ、その後に第１の発熱抵抗体２２１を発熱させることで、図３９に示すように、容易に第２の可溶導体２０９を第１の可溶導体２０８よりも先行して溶融させ、図４０に示すように、確実に第１、第２の電極２０４，２０５上に、第１、第２の可溶導体２０８，２０９の溶融導体を凝集、結合させ、第１、第２の電極２０４，２０５を短絡させることができる。 [First melting of second soluble conductor]
Here, in the short-circuit element 201, it is preferable that the second soluble conductor 209 is melted prior to the first soluble conductor 208. In the short-circuit element 201, the first heating resistor 221 and the second heating resistor 222 are separately heated, so that the second heating resistor 222 is first heated as the energization timing, and thereafter By causing the first heating resistor 221 to generate heat, as shown in FIG. 39, the second soluble conductor 209 is easily melted ahead of the first soluble conductor 208, as shown in FIG. Further, the molten conductors of the first and second fusible conductors 208 and 209 are surely aggregated and bonded onto the first and second electrodes 204 and 205, and the first and second electrodes 204 and 205 are short-circuited. Can be made.
　また、短絡素子２０１は、第２の可溶導体２０９を、第１の可溶導体２０８よりも幅狭に形成することにより、第２の可溶導体２０９を第１の可溶導体２０８よりも先に溶断するようにしてもよい。第２の可溶導体２０９を幅狭に形成することにより、溶断時間を短くすることができるため、第２の可溶導体２０９が第１の可溶導体２０８よりも先行して溶融させることができる。 Further, the short-circuit element 201 forms the second fusible conductor 209 narrower than the first fusible conductor 208 by forming the second fusible conductor 209 narrower than the first fusible conductor 208. It may be melted first. By forming the second soluble conductor 209 narrowly, the fusing time can be shortened, so that the second soluble conductor 209 can be melted prior to the first soluble conductor 208. it can.
　［電極面積］
　また、短絡素子２０１は、第１の電極２０４の面積を第３の電極２０６よりも広くし、第２の電極２０５の面積を第４、第５の電極２０７，２３１よりも広くすることが好ましい。溶融導体の保持量は、電極面積に比例して多くなるため、第１、第２の電極２０４，２０５の面積を第３、第４、第５の電極２０６，２０７，２３１よりも広く形成することにより、より多くの溶融導体を第１、第２の電極２０４，２０５上に凝集させることができ、第１、第２の電極２０４，２０５間を確実に短絡させることができる。 [Electrode area]
In the short-circuit element 201, the area of the first electrode 204 is preferably larger than that of the third electrode 206, and the area of the second electrode 205 is preferably larger than those of the fourth and fifth electrodes 207 and 231. . Since the holding amount of the molten conductor increases in proportion to the electrode area, the areas of the first and second electrodes 204 and 205 are formed wider than those of the third, fourth, and fifth electrodes 206, 207, and 231. As a result, more molten conductors can be aggregated on the first and second electrodes 204 and 205, and the first and second electrodes 204 and 205 can be short-circuited reliably.
　［短絡素子の変形例］
　なお、短絡素子２０１は、必ずしも、第１、第２の発熱抵抗体２２１，２２２を絶縁層２１１によって被覆する必要はなく、図４１に示すように、第１、第２の発熱抵抗体２２１，２２２が絶縁基板２０２の内部に設置されてもよい。絶縁基板２０２の材料として熱伝導性に優れたものを用いることにより、第１、第２の発熱抵抗体２２１，２２２は、ガラス層等の絶縁層２１１を介した場合と同等に加熱することができる。 [Modification of short circuit element]
The short-circuit element 201 does not necessarily have to cover the first and second heating resistors 221 and 222 with the insulating layer 211. As shown in FIG. 41, the first and second heating resistors 221 and 221 222 may be installed inside the insulating substrate 202. By using a material having excellent thermal conductivity as the material of the insulating substrate 202, the first and second heating resistors 221 and 222 can be heated in the same manner as when the insulating layer 211 such as a glass layer is interposed. it can.
　また、短絡素子２０１は、図４２に示すように、第１、第２の発熱抵抗体２２１，２２２が絶縁基板２０２の第１～第５の電極２０４，２０５，２０６，２０７，２３１の形成面と反対の裏面に設置されてもよい。第１、第２の発熱抵抗体２２１，２２２を絶縁基板２０２の裏面に形成することにより、絶縁基板２０２内に形成するよりも簡易な工程で形成することができる。なお、この場合、第１、第２の発熱抵抗体２２１，２２２上には、絶縁層２１１が形成されると抵抗体の保護や実装時の絶縁性確保と言う意味で好ましい。 42, the first and second heating resistors 221 and 222 are formed on the surface on which the first to fifth electrodes 204, 205, 206, 207, and 231 of the insulating substrate 202 are formed. It may be installed on the back side opposite to. By forming the first and second heat generating resistors 221 and 222 on the back surface of the insulating substrate 202, the first and second heating resistors 221 and 222 can be formed by a simpler process than forming in the insulating substrate 202. In this case, it is preferable that the insulating layer 211 is formed on the first and second heating resistors 221 and 222 in terms of protecting the resistor and ensuring insulation during mounting.
　さらに、短絡素子２０１は、図４３に示すように、第１、第２の発熱抵抗体２２１，２２２が絶縁基板２の第１～第５の電極２０４，２０５，２０６，２０７，２３１の形成面上に設置されてもよい。第１、第２の発熱抵抗体２２１，２２２を絶縁基板２０２の表面に形成することにより、絶縁基板２０２内に形成するよりも簡易な工程で形成することができる。なお、この場合も、第１、第２の発熱抵抗体２２１，２２２上には、絶縁層２１１が形成される事が望ましい。 43, the first and second heating resistors 221 and 222 are formed on the surface on which the first to fifth electrodes 204, 205, 206, 207, and 231 of the insulating substrate 2 are formed. It may be installed on top. By forming the first and second heat generating resistors 221 and 222 on the surface of the insulating substrate 202, the first and second heat generating resistors 221 and 222 can be formed by a simpler process than forming in the insulating substrate 202. In this case as well, it is desirable to form the insulating layer 211 on the first and second heating resistors 221 and 222.
　また、第１の電極２０４又は第２の電極２０５のいずれか一方に接続される保護抵抗を備える構成としてもよい。ここで、保護抵抗は、短絡素子に接続する電子部品の内部抵抗相当の抵抗値とし、第１又は第２の発熱抵抗体２２１，２２２の抵抗値よりも小さくする。すなわち、電子部品が正常に作動している場合、電流は短絡素子側へは流れず電子部品側に流れる。 In addition, a configuration may be employed in which a protective resistor connected to either the first electrode 204 or the second electrode 205 is provided. Here, the protective resistance is a resistance value corresponding to the internal resistance of the electronic component connected to the short circuit element, and is smaller than the resistance value of the first or second heating resistor 221, 222. That is, when the electronic component is operating normally, current does not flow to the short-circuit element side but flows to the electronic component side.
　また、本発明が適用された短絡素子は、絶縁基板２０２の裏面に第１、第２の電極２０４，２０５とスルーホールを介して連続する外部端子２１２を設ける以外にも、図４４（Ａ）（Ｂ）に示す短絡素子２３３のように、絶縁基板２０２の第１、第２の電極２０４，２０５が形成された表面に、第１の電極２０４と連続する第１の外部接続電極２３４、第１の外部接続電極２３４上に設けられた１個もしくは複数個からなる第１の外部接続端子２３５、第２の電極２０５と連続する第２の外部接続電極２３６、第２の外部接続電極２３６上に設けられた１個もしくは複数個からなる第２の外部接続端子２３７を形成するようにしてもよい。 The short-circuit element to which the present invention is applied is not limited to the provision of the external terminal 212 continuous with the first and second electrodes 204 and 205 through the through-holes on the back surface of the insulating substrate 202, as shown in FIG. Like the short-circuit element 233 shown in FIG. 5B, the first external connection electrode 234 continuous with the first electrode 204, the first electrode 204, 205 are formed on the surface of the insulating substrate 202 where the first and second electrodes 204, 205 are formed. One or a plurality of first external connection terminals 235 provided on one external connection electrode 234, a second external connection electrode 236 continuous with the second electrode 205, and a second external connection electrode 236 One or a plurality of second external connection terminals 237 may be formed.
　第１、第２の外部接続電極２３４，２３６は、短絡素子２３３と短絡素子２３３が組み込まれる電子機器の回路とを接続する電極であり、第１の外部接続電極２３４は第１の電極２０４と連続され、第２の外部接続電極２３６は第２の電極２０５と連続されている。 The first and second external connection electrodes 234 and 236 are electrodes that connect the short-circuit element 233 and the circuit of the electronic device in which the short-circuit element 233 is incorporated, and the first external connection electrode 234 is the same as the first electrode 204. The second external connection electrode 236 is continuous with the second electrode 205.
　第１、第２の外部接続電極２３４，２３６は、ＣｕやＡｇ等の一般的な電極材料を用いて形成され、絶縁基板２０２の第１、第２の電極２０４，２０５の形成面と同一面に形成されている。すなわち、図４４に示す短絡素子２３３は、第１、第２の可溶導体２０８，２０９が設けられる表面が実装面となる。なお、第１、第２の外部接続電極２３４，２３６は、第１、第２の電極２０４，２０５と同時に形成することができる。 The first and second external connection electrodes 234 and 236 are formed using a general electrode material such as Cu or Ag, and are the same surface as the formation surface of the first and second electrodes 204 and 205 of the insulating substrate 202. Is formed. That is, in the short-circuit element 233 shown in FIG. 44, the surface on which the first and second fusible conductors 208 and 209 are provided is the mounting surface. Note that the first and second external connection electrodes 234 and 236 can be formed simultaneously with the first and second electrodes 204 and 205.
　第１の外部接続電極２３４上には、第１の外部接続端子２３５が設けられている。同様に、第２の外部接続電極２３６上には、第２の外部接続端子２３７が設けられている。これら第１、第２の外部接続端子２３５，２３７は、電子機器へ実装するための接続端子であり、例えば金属バンプや、金属ポストを用いて形成されている。また、第１、第２の外部接続端子２３５，２３７は、図４４（Ａ）に示すように、絶縁基板２０２上に設けられたカバー部材２１０よりも突出する高さを有し、短絡素子２３３の実装対象物となる基板側に実装可能とされている。 The first external connection terminal 235 is provided on the first external connection electrode 234. Similarly, a second external connection terminal 237 is provided on the second external connection electrode 236. The first and second external connection terminals 235 and 237 are connection terminals for mounting on an electronic device, and are formed using, for example, metal bumps or metal posts. Further, as shown in FIG. 44A, the first and second external connection terminals 235 and 237 have a height protruding from the cover member 210 provided on the insulating substrate 202, and the short-circuit element 233. It can be mounted on the substrate side that is the mounting object.
　なお、短絡素子２３３の第１の発熱抵抗体２２１は、第１の発熱体引出電極２２３、及び第１の抵抗体端子部２２１ａを介して、第１の抵抗体接続端子２２１ｂが形成されている。また、短絡素子２３３の第２の発熱抵抗体２２２は、第２の発熱体引出電極２２４、及び第２の抵抗体端子部２２２ａを介して、第２の抵抗体接続端子２２２ｂが形成されている。また、第５の電極２３１は、第５の電極端子部２３１ａ上に第３の外部接続端子２３１ｂが形成されている。第１、第２の抵抗体接続端子２２１ｂ，２２２ｂ及び第３の外部接続端子２３１ｂは、第１、第２の外部接続端子２３５，２３７と同様に、金属バンプや金属ポストを用いて形成され、絶縁層２１１を介して上方に突出されている。 The first heating resistor 221 of the short-circuit element 233 is formed with a first resistor connection terminal 221b via the first heating element lead-out electrode 223 and the first resistor terminal portion 221a. . In addition, the second heating resistor 222 of the short-circuit element 233 has a second resistor connection terminal 222b formed via the second heating element lead-out electrode 224 and the second resistor terminal portion 222a. . The fifth electrode 231 has a third external connection terminal 231b formed on the fifth electrode terminal portion 231a. The first and second resistor connection terminals 221b and 222b and the third external connection terminal 231b are formed using metal bumps or metal posts, similarly to the first and second external connection terminals 235 and 237. It protrudes upward through the insulating layer 211.
　このように、短絡素子２３３は、上記短絡素子２０１のように絶縁基板２０２の裏面に外部端子２１２を設けて第１、第２の電極２０４，２０５と当該外部端子２１２とをスルーホールによって接続するものではなく、第１、第２の電極２０４，２０５と同一表面に、第１、第２の外部接続電極２３４，２３６を介して第１、第２の外部接続端子２３５，２３７を形成している。そして、図４４（Ｂ）に示すように、短絡素子２３３は、第１の電極２０４と第２の電極２０５とが短絡したときの、第１、第２の外部接続電極２３４，２３６間の導通抵抗よりも、第１の外部接続端子２３５と第２の外部接続端子２３７との合成抵抗が低く構成されている。 As described above, the short-circuit element 233 is provided with the external terminal 212 on the back surface of the insulating substrate 202 like the short-circuit element 201 and connects the first and second electrodes 204 and 205 and the external terminal 212 through a through hole. The first and second external connection terminals 235 and 237 are formed on the same surface as the first and second electrodes 204 and 205 via the first and second external connection electrodes 234 and 236. Yes. Then, as shown in FIG. 44B, the short-circuit element 233 is connected between the first and second external connection electrodes 234 and 236 when the first electrode 204 and the second electrode 205 are short-circuited. The combined resistance of the first external connection terminal 235 and the second external connection terminal 237 is configured to be lower than the resistance.
　これにより、短絡素子２３３は、第１、第２の電極２０４，２０５が短絡しバイパス電流経路を構成した際における定格を向上させ、大電流に対応することができる。すなわち、ＨＥＶやＥＶ等の動力源として使用されるリチウムイオン二次電池等の大電流用途においては、短絡素子の定格のさらなる向上が求められている。そして、可溶導体によって短絡された第１、第２の外部接続電極２３４，２３６間の導通抵抗は定格向上に応えることができる程度に十分下げることができる（例えば０．４ｍΩ未満）。 Thereby, the short-circuit element 233 can improve the rating when the first and second electrodes 204 and 205 are short-circuited to form a bypass current path, and can cope with a large current. That is, in high current applications such as lithium ion secondary batteries used as power sources such as HEV and EV, further improvement of the rating of the short-circuit element is required. The conduction resistance between the first and second external connection electrodes 234 and 236 short-circuited by the fusible conductor can be sufficiently lowered to meet the rating improvement (for example, less than 0.4 mΩ).
　しかし、絶縁基板２０２の裏面に外部端子２１２を設け、第１、第２の電極２０４，２０５と当該外部端子２１２とをスルーホールによって接続する短絡素子２０１においては、第１、第２の電極２０４，２０５と外部端子２１２との間の導通抵抗が高く（例えば０．５～１．０ｍΩ）、スルーホール内に導体を充填したとしても、短絡素子全体の導通抵抗を下げるには限界がある。 However, in the short-circuit element 201 in which the external terminal 212 is provided on the back surface of the insulating substrate 202 and the first and second electrodes 204 and 205 are connected to the external terminal 212 through a through hole, the first and second electrodes 204 are provided. , 205 and the external terminal 212 have a high conduction resistance (for example, 0.5 to 1.0 mΩ), and even if a conductor is filled in the through hole, there is a limit to lowering the conduction resistance of the entire short-circuit element.
　また、高抵抗の第１、第２の電極２０４，２０５と外部端子２１２との間に大電流を流すことによる発熱で、バイパス電流経路の破壊や、他の周辺機器への熱影響も懸念される。 In addition, heat is generated by flowing a large current between the high resistance first and second electrodes 204 and 205 and the external terminal 212, and there is a concern about the destruction of the bypass current path and the thermal influence on other peripheral devices. The
　この点、短絡素子２３３は、第１、第２の電極２０４，２０５と同一表面に外部接続端子２３５，２３７を設けている。この外部接続端子２３５，２３７は、外部接続電極２３４，２３６上に設けるものであり、形状やサイズ等の自由度が高く、導通抵抗の低い端子を容易に設けることができる。これにより、短絡素子２３３は、第１の電極２０４と第２の電極２０５とが短絡したときの、第１、第２の外部接続電極２３４，２３６間の導通抵抗よりも、第１の外部接続端子２３５と第２の外部接続端子２３７との合成抵抗が低く構成されている。 In this respect, the short-circuit element 233 is provided with external connection terminals 235 and 237 on the same surface as the first and second electrodes 204 and 205. The external connection terminals 235 and 237 are provided on the external connection electrodes 234 and 236, and a terminal having a high degree of freedom in shape and size and having a low conduction resistance can be easily provided. Thus, the short-circuit element 233 has a first external connection rather than a conduction resistance between the first and second external connection electrodes 234 and 236 when the first electrode 204 and the second electrode 205 are short-circuited. The combined resistance of the terminal 235 and the second external connection terminal 237 is configured to be low.
　したがって、短絡素子２３３によれば、短絡素子２０１の構成おいては高くなる第１、第２の外部接続電極２３４，２３６から先の導通抵抗を容易に下げることができ、定格の飛躍的な向上を図ることができる。 Therefore, according to the short-circuit element 233, the conduction resistance ahead of the first and second external connection electrodes 234 and 236, which is high in the configuration of the short-circuit element 201, can be easily lowered, and the rating is dramatically improved. Can be achieved.
　第１、第２の外部接続端子２３２，２３４としては、例えば、Ｓｎを主成分とするＰｂフリーハンダからなる金属バンプや金属ポストを用いて構成することができる。金属バンプや金属ポストの形状は問わない。第１、第２の外部接続端子２３５，２３７の抵抗値は材料や形状、サイズから求めることができる。一例として、Ｃｕコアの表面にハンダをコーティングした直方体の金属ポスト（Ｃｕコア：０．６ｍｍ×０．６ｍｍ、断面積０．３６ｍｍ２、高さ１ｍｍ、比抵抗１７．２μΩ・ｍｍ）を用いた場合、その１端子のＣｕコア部抵抗値は約０．０４８ｍΩであり、ハンダコーティング分を考慮すると第１、第２の外部接続端子２３５，２３７を直列接続させた抵抗値が０．０９６ｍΩ未満と低く、短絡素子２３３全体の定格を向上できることがわかる。 The first and second external connection terminals 232 and 234 can be configured using, for example, metal bumps or metal posts made of Pb-free solder whose main component is Sn. The shape of the metal bump or the metal post is not limited. The resistance values of the first and second external connection terminals 235 and 237 can be obtained from the material, shape, and size. As an example, when a rectangular parallelepiped metal post (Cu core: 0.6 mm × 0.6 mm, cross-sectional area 0.36 mm 2, height 1 mm, specific resistance 17.2 μΩ · mm) is used. The resistance value of the Cu core of one terminal is about 0.048 mΩ, and the resistance value obtained by connecting the first and second external connection terminals 235 and 237 in series is as low as less than 0.096 mΩ in consideration of the solder coating. It can be seen that the overall rating of the short-circuit element 233 can be improved.
　なお、短絡素子２３３は、短絡時における第１、第２の外部接続端子２３５，２３７間に亘る抵抗値より素子全体の全抵抗値を求め、この全抵抗値と既知である第１、第２の外部接続端子２３５，２３７の合成抵抗との差より、短絡時における第１、第２の外部接続電極２３４，２３６間の導通抵抗を求めることができる。また、短絡素子２３３は、短絡時における第１、第２の外部接続電極２３４，２３６間の抵抗を測定し、短絡時における素子全体の全抵抗値との差より、第１、第２の外部接続端子２３５，２３７の合成抵抗を求めることができる。 The short-circuit element 233 obtains the total resistance value of the entire element from the resistance value between the first and second external connection terminals 235 and 237 at the time of the short-circuit, and the total resistance value and the known first and second values. From the difference between the combined resistance of the external connection terminals 235 and 237, the conduction resistance between the first and second external connection electrodes 234 and 236 at the time of short circuit can be obtained. The short-circuit element 233 measures the resistance between the first and second external connection electrodes 234 and 236 at the time of short-circuit, and the first and second external elements are calculated from the difference from the total resistance value of the entire element at the time of short-circuit. The combined resistance of the connection terminals 235 and 237 can be obtained.
　また、図４５に示すように、短絡素子２３３は、第１、第２の外部接続電極２３４，２３６を矩形状に形成する等により広く設け、第１、第２の外部接続端子２３５，２３７を複数設けることにより導通抵抗を下げるようにしてもよい。その他にも、短絡素子２３３は、広く設けた第１、第２の外部接続電極２３４，２３６に大径の第１、第２の外部接続端子２３５，２３７を設けることにより導通抵抗を下げるようにしてもよい。 Further, as shown in FIG. 45, the short-circuit element 233 is provided wider by forming the first and second external connection electrodes 234 and 236 in a rectangular shape, and the first and second external connection terminals 235 and 237 are provided. The conduction resistance may be lowered by providing a plurality. In addition, the short-circuit element 233 reduces the conduction resistance by providing the first and second external connection terminals 235 and 237 having large diameters on the first and second external connection electrodes 234 and 236 that are widely provided. May be.
　また、第１、第２の外部接続端子２３５，２３７は、コアとなる高融点金属２３５ａ，２３７ａの表面に低融点金属層２３５ｂ，２３７ｂを設けることにより形成してもよい。低融点金属層２３５ｂ，２３７ｂを構成する金属としては、Ｓｎを主成分とするＰｂフリーハンダなどのハンダを好適に用いることができ、高融点金属２３５ａ，２３７ａとしては、ＣｕやＡｇを主成分とする合金などを好適に用いることができる。 Further, the first and second external connection terminals 235 and 237 may be formed by providing low melting point metal layers 235b and 237b on the surfaces of the high melting point metals 235a and 237a serving as cores. As the metal constituting the low melting point metal layers 235b and 237b, solder such as Pb-free solder containing Sn as a main component can be suitably used. An alloy to be used can be preferably used.
　高融点金属２３５ａ，２３７ａの表面に低融点金属層２３５ｂ，２３７ｂを設けることにより、短絡素子２３３をリフロー実装する場合に、リフロー温度が低融点金属層２３５ｂ，２３７ｂの溶融温度を超えて、低融点金属が溶融しても、第１、第２の外部接続端子２３５，２３７として溶融することを防止することができる。また、第１、第２の外部接続端子２３５，２３７は、外層を構成する低融点金属を用いて、第１、第２の外部接続電極２３４，２３６へ接続することができる。 By providing the low melting point metal layers 235b and 237b on the surfaces of the high melting point metals 235a and 237a, when the short-circuit element 233 is reflow mounted, the reflow temperature exceeds the melting temperature of the low melting point metal layers 235b and 237b, Even when the metal is melted, it can be prevented that the first and second external connection terminals 235 and 237 are melted. The first and second external connection terminals 235 and 237 can be connected to the first and second external connection electrodes 234 and 236 using a low melting point metal constituting the outer layer.
　第１、第２の外部接続端子２３５，２３７は、高融点金属２３５ａ，２３７ａに低融点金属をメッキ技術を用いて成膜することにより形成することができ、またその他の周知の積層技術、膜形成技術を用いることによっても形成することができる。 The first and second external connection terminals 235 and 237 can be formed by forming a low melting point metal on the high melting point metal 235a and 237a by using a plating technique, and other well-known lamination techniques and films. It can also be formed by using a forming technique.
　なお、第１、第２の外部接続端子２３５，２３７は、金属バンプや金属ポストを用いて形成する他にも、導電メッキ層や、導電ペーストを塗布することにより形成された導電層により形成してもよい。 The first and second external connection terminals 235 and 237 are formed by using a conductive plating layer or a conductive layer formed by applying a conductive paste, in addition to using metal bumps or metal posts. May be.
　また、第１、第２の外部接続端子２３５，２３７は、短絡素子２３３が実装される基板等の実装対象物側に予め設け、短絡素子が実装された実装体において、第１、第２の外部接続電極２３４，２３６、あるいは第１、第２の電極２０４，２０５と接続されるようにしてもよい。 In addition, the first and second external connection terminals 235 and 237 are provided in advance on the mounting object side such as a substrate on which the short-circuit element 233 is mounted. The external connection electrodes 234 and 236 or the first and second electrodes 204 and 205 may be connected.
　［バッテリパックの回路構成］
　次いで、短絡素子２０１を組み込んだ電子機器の回路構成について説明する。図４６は、クルマや電動工具等の各種電子機器に搭載されて用いられるリチウムイオンバッテリーが内蔵されたバッテリパック２４０の回路構成を示す図である。図４６（Ａ）に示すように、バッテリパック２４０は、バッテリセル２４１と、短絡素子２０１と、短絡素子２０１の動作を制御する第１、第２の電流制御素子２６１，２６２と、保護抵抗２５４とで構成されるバッテリユニット２６３を複数備え、これら複数のバッテリユニット２６３が直列に接続されている。 [Battery pack circuit configuration]
Next, a circuit configuration of an electronic device incorporating the short-circuit element 201 will be described. FIG. 46 is a diagram showing a circuit configuration of a battery pack 240 in which a lithium ion battery used in various electronic devices such as cars and electric tools is built. As shown in FIG. 46A, the battery pack 240 includes a battery cell 241, a short-circuit element 201, first and second current control elements 261 and 262 that control the operation of the short-circuit element 201, and a protective resistor 254. And a plurality of battery units 263 connected in series.
　その他に、バッテリパック２４０は、バッテリユニット２６３と、バッテリユニット２６３の充放電を制御する充放電制御回路２５５と、各バッテリユニット２６３のバッテリセル２４１の電圧を検出するとともに、短絡素子２０１の動作を制御する第１、第２の電流制御素子２６１，２６２に異常信号を出力する検出回路２５６とを備える。充放電制御回路２５５は、バッテリユニット２６３から充電装置に流れる電流経路に直列接続された第３、第４の電流制御素子２５７，２５８と、これらの電流制御素子２５７，２５８の動作を制御する制御部２５９とを備える。 In addition, the battery pack 240 detects the voltage of the battery unit 263, the charge / discharge control circuit 255 that controls the charge / discharge of the battery unit 263, and the battery cell 241 of each battery unit 263, and the operation of the short-circuit element 201. And a detection circuit 256 that outputs an abnormal signal to the first and second current control elements 261 and 262 to be controlled. The charge / discharge control circuit 255 controls the operation of the third and fourth current control elements 257 and 258 connected in series to the current path flowing from the battery unit 263 to the charging device, and the operation of these current control elements 257 and 258. Part 259.
　各バッテリユニット２６３は、短絡素子２０１の第２の電極２０５（Ａ１）の第２の電極端子部２０５ａがバッテリパック２４０の充放電電流経路と接続され、第５の電極２３１（Ａ２）の第５の電極端子部２３１ａがバッテリセル４１に接続されることにより、短絡素子２０１がバッテリセル２４１と直列に接続されている。また、バッテリユニット２６３は、第２の発熱抵抗体２２２が第２の抵抗体端子部２２２ａ（Ｐ２）を介して第１の電流制御素子２６１に接続されている。 In each battery unit 263, the second electrode terminal portion 205a of the second electrode 205 (A1) of the short-circuit element 201 is connected to the charge / discharge current path of the battery pack 240, and the fifth electrode 231 (A2) By connecting the electrode terminal portion 231 a to the battery cell 41, the short-circuit element 201 is connected in series with the battery cell 241. In the battery unit 263, the second heating resistor 222 is connected to the first current control element 261 via the second resistor terminal portion 222a (P2).
　また、バッテリユニット２６３は、第１の電極２０４の第１の電極端子部２０４ａが保護抵抗２５４を介してバッテリセル２４１の開放端と接続されることにより、スイッチ２２０がバッテリセル２４１の充放電電流経路からバイパスされている。また、バッテリユニット２６３は、第１の発熱抵抗体２２１が第１の抵抗体端子部２２１ａを介して第２の電流制御素子２６２に接続されている。 Further, in the battery unit 263, the first electrode terminal portion 204a of the first electrode 204 is connected to the open end of the battery cell 241 via the protective resistor 254, so that the switch 220 is charged / discharged by the battery cell 241. Bypassed from the route. In the battery unit 263, the first heating resistor 221 is connected to the second current control element 262 via the first resistor terminal portion 221a.
　検出回路２５６は、各バッテリセル２４１と接続され、各バッテリセル２４１の電圧値を検出して、バッテリセル２４１が過充電電圧又は過放電電圧になったときに、当該バッテリセル２４１を有するバッテリユニット２６３の第１、第２の電流制御素子２６１，２６２へ異常信号を出力する。 The detection circuit 256 is connected to each battery cell 241, detects the voltage value of each battery cell 241, and when the battery cell 241 becomes an overcharge voltage or an overdischarge voltage, the battery unit having the battery cell 241. An abnormal signal is output to the first and second current control elements 261 and 262 of H.263.
　第１、第２の電流制御素子２６１，２６２は、たとえばＦＥＴにより構成され、検出回路２５６から出力される検出信号によって、バッテリセル２４１の電圧値が所定の過放電又は過充電状態を超える電圧になったとき、短絡素子２０１を動作させて、バッテリユニット２６３の充放電電流経路を第３、第４の電流制御素子２５７，２５８のスイッチ動作によらず遮断するとともに、短絡素子２０１のスイッチ２２０を短絡させ、当該バッテリユニット２６３をバイパスするバイパス電流経路を形成するように制御する。 The first and second current control elements 261 and 262 are configured by, for example, FETs, and the voltage value of the battery cell 241 exceeds a predetermined overdischarge or overcharge state by a detection signal output from the detection circuit 256. When this happens, the short-circuit element 201 is operated to cut off the charging / discharging current path of the battery unit 263 regardless of the switching operation of the third and fourth current control elements 257 and 258, and the switch 220 of the short-circuit element 201 is turned off. Control is performed so as to form a bypass current path that short-circuits and bypasses the battery unit 263.
　このようなバッテリパック２４０は、正常時には、図４６（Ａ）に示すように、短絡素子２０１のスイッチ２２０が短絡されていないため、電流は第２の可溶導体２０９を介してバッテリセル２４１側に流れる。 When such a battery pack 240 is normal, as shown in FIG. 46A, the switch 220 of the short-circuiting element 201 is not short-circuited, so that the current flows through the second fusible conductor 209 to the battery cell 241 side. Flowing into.
　バッテリセル２４１に電圧異常等が検知されると、検出回路２５６より第１の電流制御素子２６１に異常信号が出力され、短絡素子２０１の第２の発熱抵抗体２２２が発熱される。図４６（Ｂ）に示すように、短絡素子２０１は、第２の発熱抵抗体２２２によって、第２の可溶導体２０９を加熱、溶融させることにより、第２の電極２０５（Ａ１）と第４の電極２０７（Ｐ１）との間、及び第４の電極２０７（Ｐ１）と第５の電極２３１（Ａ２）との間を遮断する。これにより、図４６（Ｂ）に示すように、異常なバッテリセル２４１を有する当該バッテリユニット２６３を、バッテリパック２４０の充放電電流経路上から遮断することができる。なお、第２の可溶導体２０９が溶断することにより、第２の発熱抵抗体２２２への給電は停止される。 When a voltage abnormality or the like is detected in the battery cell 241, an abnormality signal is output from the detection circuit 256 to the first current control element 261, and the second heating resistor 222 of the short circuit element 201 is heated. As shown in FIG. 46B, the short-circuit element 201 is formed by heating and melting the second fusible conductor 209 with the second heating resistor 222 to thereby form the second electrode 205 (A1) and the fourth electrode. Between the first electrode 207 (P1) and between the fourth electrode 207 (P1) and the fifth electrode 231 (A2). Thus, as shown in FIG. 46B, the battery unit 263 having the abnormal battery cell 241 can be blocked from the charge / discharge current path of the battery pack 240. Note that power supply to the second heating resistor 222 is stopped when the second fusible conductor 209 is melted.
　次いで、バッテリパック２４０は、検出回路２５６により第１の電流制御素子２６１に少し遅れて当該バッテリユニット２６３の第２の電流制御素子２６２にも異常信号が出力され、短絡素子２０１の第１の発熱抵抗体２２１も発熱する。短絡素子２０１は、第１の発熱抵抗体２２１によって第１の可溶導体２０８を加熱、溶融させることにより、第１の電極２０４と第２の電極２０５とに凝集した第１、第２の可溶導体２０８，２０９の溶融導体が結合する。これにより、絶縁されていた第１の電極２０４と第２の電極２０５とが短絡され、スイッチ２２０の第１の電極端子部２０４ａ及び第２の電極端子部２０５ａが短絡される。これにより、短絡素子２０１は、図４６（Ｃ）に示すように、当該バッテリユニット２６３をバイパスするバイパス電流経路を形成することができる。なお、第１の可溶導体２０８が溶断することにより、第１の発熱抵抗体２２１への給電は停止される。 Next, the battery pack 240 causes the detection circuit 256 to output an abnormal signal to the second current control element 262 of the battery unit 263 with a slight delay from the first current control element 261, and the first heat generation of the short-circuit element 201. The resistor 221 also generates heat. The short-circuit element 201 is configured to heat and melt the first fusible conductor 208 by the first heating resistor 221, so that the first and second possible electrodes aggregated into the first electrode 204 and the second electrode 205. The molten conductors 208 and 209 are joined together. As a result, the insulated first electrode 204 and second electrode 205 are short-circuited, and the first electrode terminal portion 204a and the second electrode terminal portion 205a of the switch 220 are short-circuited. Accordingly, the short-circuit element 201 can form a bypass current path that bypasses the battery unit 263 as shown in FIG. Note that power supply to the first heating resistor 221 is stopped when the first fusible conductor 208 is melted.
　なお、保護抵抗２５４は、バッテリセル２４１の内部抵抗とほぼ同じ抵抗値を有することにより、バイパス電流経路上においても、正常時と同じ容量とすることができる。 Note that the protective resistor 254 has almost the same resistance value as the internal resistance of the battery cell 241, so that it can have the same capacity as that in the normal state even on the bypass current path.
　このようなバッテリパック２４０によれば、一つのバッテリユニット２６３に異常が起きた場合にも、当該バッテリユニット２６３を迂回するバイパス電流経路を形成することができ、残りの正常なバッテリユニット２６３によって充放電機能を維持することができる。 According to such a battery pack 240, even when an abnormality occurs in one battery unit 263, a bypass current path that bypasses the battery unit 263 can be formed and is charged by the remaining normal battery units 263. The discharge function can be maintained.
　［短絡素子（保護抵抗内蔵）］
　また、短絡素子は、予め保護抵抗を内蔵させて形成してもよい。図４７は、絶縁基板２０２上に保護抵抗２７１が形成された短絡素子２７０の平面図である。短絡素子２７０は、上述した短絡素子２０１の構成に加え、第１の電極２０４と接続された保護抵抗２７１が形成され、この保護抵抗２７１を介して第１の電極端子部２０４ａが形成されている。保護抵抗２７１は、上述した第１、第２の発熱抵抗体２２１，２２２と同じ材料を用いて、同一のプロセスで同時に形成することができる。 [Short-circuit element (built-in protection resistor)]
Further, the short-circuit element may be formed by incorporating a protective resistor in advance. FIG. 47 is a plan view of the short-circuit element 270 in which the protective resistor 271 is formed on the insulating substrate 202. In addition to the configuration of the short-circuit element 201 described above, the short-circuit element 270 includes a protective resistor 271 connected to the first electrode 204, and a first electrode terminal portion 204a is formed via the protective resistor 271. . The protective resistor 271 can be formed simultaneously by the same process using the same material as the first and second heating resistors 221 and 222 described above.
　このように電子機器やバッテリパックにおける内部抵抗が決まっているような場合、予め保護抵抗２７１を内蔵した短絡素子２７０を用いることにより、実装等の工程を省力化することができる。 When the internal resistance of the electronic device or battery pack is determined in this way, the mounting and other steps can be saved by using the short-circuit element 270 with the protective resistor 271 built in beforehand.
　図４８は、短絡素子２７０の回路構成を示す図である。短絡素子２７０の回路構成は、スイッチ２２０が短絡することにより、第１の電極端子部２０４ａと第２の電極端子部２０５ａとが、保護抵抗２７１を介して接続される。すなわち、短絡素子２７０の回路構成は、第１の可溶導体（ヒューズ）２０８と、第１の可溶導体２０８の一端に接続された第１の発熱抵抗体２２１と、第１の可溶導体２０８の第１の発熱抵抗体２２１が接続されていない他端に接続されたスイッチ２２０と、スイッチ２２０の端子の少なくとも一方の端子に接続された保護抵抗２７１とを備え、スイッチ２２０が、第１の可溶導体２０８の溶断に連動して短絡するものである。 FIG. 48 is a diagram showing a circuit configuration of the short-circuit element 270. As for the circuit configuration of the short-circuit element 270, the first electrode terminal portion 204a and the second electrode terminal portion 205a are connected via the protective resistor 271 when the switch 220 is short-circuited. That is, the circuit configuration of the short-circuit element 270 includes a first fusible conductor (fuse) 208, a first heating resistor 221 connected to one end of the first fusible conductor 208, and a first fusible conductor. 208, a switch 220 connected to the other end to which the first heating resistor 221 is not connected, and a protective resistor 271 connected to at least one of the terminals of the switch 220. This is a short circuit in conjunction with the melting of the fusible conductor 208.
　なお、短絡素子２７０においても、絶縁基板２０２の裏面に外部端子２１２を設けて第１の電極端子部２０４ａ及び第２の電極端子部２０５ａと当該外部端子２１２とをスルーホールによって接続する以外にも、上述した短絡素子２３３と同様に、絶縁基板２０２の第１、第２の電極２０４，２０５が形成された表面に、保護抵抗２７１を介して第１の電極２０４と連続する第１の外部接続電極２３４、第１の外部接続端子２３５、第２の電極２０５と連続する第２の外部接続電極２３６、及び第２の外部接続端子２３７を形成するようにしてもよい。 In the short-circuit element 270, an external terminal 212 is provided on the back surface of the insulating substrate 202 and the first electrode terminal portion 204a and the second electrode terminal portion 205a are connected to the external terminal 212 through a through hole. As in the case of the short-circuit element 233 described above, a first external connection that is continuous with the first electrode 204 through the protective resistor 271 is formed on the surface of the insulating substrate 202 on which the first and second electrodes 204 and 205 are formed. The electrode 234, the first external connection terminal 235, the second external connection electrode 236 continuous with the second electrode 205, and the second external connection terminal 237 may be formed.
　［バッテリパックの回路構成（保護抵抗内蔵）］
　図４９は、短絡素子２７０を組み込んだバッテリパック２８０の回路構成を示す図である。バッテリパック２８０は、短絡素子２０１に代えて短絡素子２７０を用いた点を除いて、上述したバッテリパック２４０と同じ構成を有する。すなわち、バッテリパック２８０は、バッテリセル２４１と、短絡素子２７０と、短絡素子２７０の動作を制御する第１、第２の電流制御素子２６１，２６２とで構成されるバッテリユニット２７３を複数備え、これら複数のバッテリユニット２７３が直列に接続されている。バッテリパック２８０において、各バッテリユニットに設けられた短絡素子２７０の保護抵抗２７１は、当該バッテリユニット２７３のバッテリセル２４１の内部抵抗とほぼ同じ抵抗値を有する。 [Battery pack circuit configuration (built-in protection resistor)]
FIG. 49 is a diagram showing a circuit configuration of a battery pack 280 in which the short-circuit element 270 is incorporated. Battery pack 280 has the same configuration as battery pack 240 described above except that short-circuit element 270 is used instead of short-circuit element 201. That is, the battery pack 280 includes a plurality of battery units 273 including battery cells 241, short-circuit elements 270, and first and second current control elements 261 and 262 that control the operation of the short-circuit elements 270. A plurality of battery units 273 are connected in series. In the battery pack 280, the protective resistance 271 of the short-circuit element 270 provided in each battery unit has substantially the same resistance value as the internal resistance of the battery cell 241 of the battery unit 273.
　このようなバッテリパック２８０によれば、一つのバッテリユニット２７３に異常が起きた場合にも、当該バッテリユニット２７３を迂回するバイパス電流経路を形成することができ、残りの正常なバッテリユニット２７３によって充放電機能を維持することができる。このとき、バッテリパック２８０は、保護抵抗２７１が、バッテリセル２４１の内部抵抗とほぼ同じ抵抗値を有することにより、バイパス電流経路上においても、正常時と同じ電流容量とすることができる。 According to such a battery pack 280, even when an abnormality occurs in one battery unit 273, a bypass current path that bypasses the battery unit 273 can be formed, and the remaining normal battery unit 273 can be charged. The discharge function can be maintained. At this time, the battery pack 280 can have the same current capacity as that in the normal state on the bypass current path because the protective resistance 271 has substantially the same resistance value as the internal resistance of the battery cell 241.
 １　短絡素子、２　絶縁基板、３　発熱抵抗体、３ａ　抵抗体端子部、３ｂ　抵抗体接続端子、４　第１の電極、４ａ　第１の電極端子部、５　第２の電極、５ａ　第２の電極端子部、６　第３の電極、７　第４の電極、８　第１の可溶導体、９　第２の可溶導体、１０　カバー部材、１１　絶縁層、１２　外部端子、１３　発熱体引出電極、１５　フラックス、１８　カバー部電極、２０　スイッチ、２１　第１の外部接続電極、２２　第１の外部接続端子、２３　第２の外部接続電極、２４　第２の外部接続端子、２５　短絡素子、３０　ＬＥＤ照明装置、３１　発光ダイオード、３２　ＬＥＤユニット、３４　保護抵抗、４０　バッテリパック、４１　バッテリセル、４２　保護素子、４４　絶縁基板、４５　絶縁部材、４６　発熱抵抗体、４７　電極、４８　発熱体引出電極、４９　可溶導体、５０　発熱体電極、５１　バッテリユニット、５２　第１の電流制御素子、５３　第２の電流制御素子、５４　保護抵抗、５５　充放電制御回路、５６　検出回路、５７　第３の電流制御素子、５８　第４の電流制御素子、５９　制御部、６０　短絡素子、６１　保護抵抗、６２　ＬＥＤ照明装置、６５　バッテリパック、１０１　短絡素子、１０２　絶縁基板、１０４　第１の電極、１０４ａ　第１の電極端子部、１０５　第２の電極、１０５ａ　第２の電極端子部、１０６　第３の電極、１０７　第４の電極、１０８　第１の可溶導体、１０９　第２の可溶導体、１１０　カバー部材、１１１　絶縁層、１１２　外部端子、１１５　フラックス、１１８　カバー部電極、１２０　スイッチ、１２１　第１の発熱抵抗体、１２１ａ　第１の抵抗体端子部、１２１ｂ　第１の抵抗体接続端子、１２２　第２の発熱抵抗体、１２２ａ　第２の抵抗体端子部、１２２ｂ　第２の抵抗体接続端子、１２３　第１の発熱体引出電極、１２４　第１の発熱体引出電極、１３０　短絡素子、１３１　第１の外部接続電極、１３２　第１の外部接続端子、１３３　第２の外部接続電極、１３４　第２の外部接続端子、１４０　バッテリパック、１４１　バッテリセル、１４２　保護素子、１４４　絶縁基板、１４５　絶縁部材、１４６　発熱抵抗体、１４７　電極、１４８　発熱体引出電極、１４９　可溶導体、１５０　発熱体電極、１５４　保護抵抗、１５５　充放電制御回路、１５６　検出回路、１５７　第３の電流制御素子、１５８　第４の電流制御素子、１５９　制御部、１６０　短絡素子、１６１　保護抵抗、１７０　バッテリパック、１８１　第１の電流制御素子、１８２　第２の電流制御素子、１８３　第３の電流制御素子、１８４　バッテリユニット、１９０　バッテリパック、１９１　第１の電流制御素子、１９２　第２の電流制御素子、２０１　短絡素子、２０２　絶縁基板、２０４　第１の電極、２０４ａ　第１の電極端子部、２０５　第２の電極、２０５ａ　第２の電極端子部、２０６　第３の電極、２０７　第４の電極、２０８　第１の可溶導体、２０９　第２の可溶導体、２１０　カバー部材、２１１　絶縁層、２１２　外部端子、２１５　フラックス、２１８　カバー部電極、２２０　スイッチ、２２１　第１の発熱抵抗体、２２１ａ　第１の抵抗体端子部、２２１ｂ　第１の抵抗体接続端子、２２２　第２の発熱抵抗体、２２２ａ　第２の抵抗体端子部、２２２ｂ　第２の抵抗体接続端子、２２３　第１の発熱体引出電極、２２４　第２の発熱体引出電極、２３１　第５の電極、２３１ａ　第５の電極端子部、２３１ｂ　第３の外部接続端子、２３３　短絡素子、２３４　第１の外部接続電極、２３５　第１の外部接続端子、２３６　第２の外部接続電極、２３７　第２の外部接続端子、２４０　バッテリパック、２４１　バッテリセル、２５４　保護抵抗、２５５　充放電制御回路、２５６　検出回路、２５７　第３の電流制御素子、２５８　第４の電流制御素子、２５９　制御部、２６１　第１の電流制御素子、２６２　第２の電流制御素子、２６３　バッテリユニット、２７０　短絡素子、２７１　保護抵抗、２７３　バッテリユニット、２８０　バッテリパック 1 shorting element, 2 insulating substrate, 3 heating resistor, 3a resistor terminal, 3b resistor connecting terminal, 4th electrode, 4a first electrode terminal, 5, second electrode, 5a second electrode Terminal part, 6 3rd electrode, 7 4th electrode, 8 1st soluble conductor, 9 2nd soluble conductor, 10 Cover member, 11 Insulating layer, 12 External terminal, 13 Heating element extraction electrode, 15 Flux, 18 cover part electrode, 20 switch, 21 first external connection electrode, 22 first external connection terminal, 23 second external connection electrode, 24 second external connection terminal, 25 short circuit element, 30 LED lighting device , 31 Light emitting diode, 32 LED unit, 34 Protection resistance, 40 Battery pack, 41 Battery cell, 42 Protection element, 44 Insulating substrate, 45 Insulating member, 46 Heat generation Antibody, 47 electrode, 48 heating element extraction electrode, 49 soluble conductor, 50 heating element electrode, 51 battery unit, 52 first current control element, 53 second current control element, 54 protective resistance, 55 charge / discharge control circuit , 56 detection circuit, 57 third current control element, 58 fourth current control element, 59 control unit, 60 short circuit element, 61 protective resistance, 62 LED lighting device, 65 battery pack, 101 short circuit element, 102 insulating substrate, 104 1st electrode, 104a 1st electrode terminal part, 105 2nd electrode, 105a 2nd electrode terminal part, 106 3rd electrode, 107 4th electrode, 108 1st soluble conductor, 109 1st 2 soluble conductors, 110 cover member, 111 insulating layer, 112 external terminal, 115 flux, 118 cover part electrode, 12 0 switch, 121 first heating resistor, 121a first resistor terminal, 121b first resistor connecting terminal, 122 second heating resistor, 122a second resistor terminal, 122b second Resistor connection terminal, 123, first heating element extraction electrode, 124, first heating element extraction electrode, 130, short-circuit element, 131, first external connection electrode, 132, first external connection terminal, 133, second external connection electrode 134, second external connection terminal, 140 battery pack, 141 battery cell, 142 protective element, 144 insulating substrate, 145 insulating member, 146 heating resistor, 147 electrode, 148 heating element extraction electrode, 149 soluble conductor, 150 heat generation Body electrode, 154 protective resistance, 155 charge / discharge control circuit, 156 detection circuit, 157 third current control element, 1 8 Fourth current control element, 159 control unit, 160 short circuit element, 161 protection resistor, 170 battery pack, 181 first current control element, 182 second current control element, 183 third current control element, 184 battery Unit, 190 battery pack, 191 first current control element, 192 second current control element, 201 short circuit element, 202 insulating substrate, 204 first electrode, 204a first electrode terminal, 205 second electrode, 205a second electrode terminal portion, 206 third electrode, 207 fourth electrode, 208 first soluble conductor, 209 second soluble conductor, 210 cover member, 211 insulating layer, 212 external terminal, 215 flux 218 cover part electrode, 220 switch, 221 first heating resistor, 221a first Resistor terminal portion, 221b, first resistor connection terminal, 222, second heating resistor, 222a, second resistor terminal portion, 222b, second resistor connection terminal, 223, first heating element lead electrode, 224 2nd heating element extraction electrode, 231 5th electrode, 231a 5th electrode terminal part, 231b 3rd external connection terminal, 233 short circuit element, 234 1st external connection electrode, 235 1st external connection terminal, 236, second external connection electrode, 237, second external connection terminal, 240 battery pack, 241 battery cell, 254 protection resistor, 255 charge / discharge control circuit, 256 detection circuit, 257 third current control element, 258 fourth Current control element, 259 control unit, 261 first current control element, 262 second current control element, 263 battery unit, 27 0 short element, 271 protection resistance, 273 battery unit, 280 battery pack

Claims (121)

  1. 　絶縁基板と、
    　上記絶縁基板に設けられた発熱抵抗体と、
    　上記絶縁基板に、互いに隣接して設けられた第１、第２の電極と、
    　上記絶縁基板に、上記第１の電極と隣接して設けられるとともに、上記発熱抵抗体に電気的に接続された第３の電極と、
    　上記第１、第３の電極間に亘って設けられることにより電流経路を構成し、上記発熱抵抗体からの加熱により、上記第１、第３の電極間の上記電流経路を溶断する第１の可溶導体とを備え、
    　上記発熱抵抗体からの加熱により溶融し、上記第１、第２の電極上に凝集した上記第１の可溶導体によって、上記第１の電極と上記第２の電極とが短絡することを特徴とする短絡素子。     An insulating substrate;
    A heating resistor provided on the insulating substrate;
    First and second electrodes provided adjacent to each other on the insulating substrate;
    A third electrode provided on the insulating substrate adjacent to the first electrode and electrically connected to the heating resistor;
    A current path is formed by being provided between the first and third electrodes, and the current path between the first and third electrodes is fused by heating from the heating resistor. A soluble conductor,
    The first electrode and the second electrode are short-circuited by the first soluble conductor melted by heating from the heating resistor and aggregated on the first and second electrodes. A short-circuit element.
  2. 　上記第２の電極に設けられた第２の可溶導体を備え、
    　上記発熱抵抗体からの加熱により溶融し、上記第１、第２の電極上に凝集した上記第１、第２の可溶導体によって、上記第１の電極と上記第２の電極とが短絡することを特徴とする請求項１記載の短絡素子。     A second soluble conductor provided on the second electrode;
    The first electrode and the second electrode are short-circuited by the first and second fusible conductors melted by heating from the heating resistor and aggregated on the first and second electrodes. The short-circuit element according to claim 1.
  3. 　上記絶縁基板に、上記第２の電極と隣接して設けられた第４の電極と、
    　上記第２、第４の電極間に亘って設けられ、上記発熱抵抗体からの加熱により、上記第２、第４の電極間の上記電流経路を溶断する第２の可溶導体とを有し、
    　上記発熱抵抗体からの加熱により溶融し、上記第１、第２の電極上に凝集した上記第１、第２の可溶導体によって、上記第１の電極と上記第２の電極とが短絡することを特徴とする請求項１記載の短絡素子。     A fourth electrode provided adjacent to the second electrode on the insulating substrate;
    A second soluble conductor provided between the second and fourth electrodes and fusing the current path between the second and fourth electrodes by heating from the heating resistor. ,
    The first electrode and the second electrode are short-circuited by the first and second fusible conductors melted by heating from the heating resistor and aggregated on the first and second electrodes. The short-circuit element according to claim 1.
  4. 　上記絶縁基板上に積層された絶縁層を備え、
    　上記第１～第３の電極が、上記絶縁層上に設置され、
    　上記発熱抵抗体が、上記絶縁層の内部もしくは上記絶縁層と上記絶縁基板の間に設置されている請求項１乃至請求項３のいずれか１項に記載の短絡素子。     Comprising an insulating layer laminated on the insulating substrate;
    The first to third electrodes are disposed on the insulating layer;
    The short-circuit element according to any one of claims 1 to 3, wherein the heating resistor is disposed inside the insulating layer or between the insulating layer and the insulating substrate.
  5. 　上記発熱抵抗体が、前記絶縁基板の内部に設置されてなる請求項１乃至請求項３のいずれか１項に記載の短絡素子。 4. The short-circuit element according to any one of claims 1 to 3, wherein the heating resistor is installed inside the insulating substrate.
  6. 　上記発熱抵抗体が、前記絶縁基板の電極形成面と反対の面に設置されてなる請求項１乃至請求項３のいずれか１項に記載の短絡素子。 4. The short-circuit element according to claim 1, wherein the heating resistor is disposed on a surface opposite to an electrode forming surface of the insulating substrate.
  7. 　上記発熱抵抗体が、前記絶縁基板の電極形成面上に設置されてなる請求項１乃至請求項３のいずれか１項に記載の短絡素子。 4. The short-circuit element according to any one of claims 1 to 3, wherein the heating resistor is disposed on an electrode forming surface of the insulating substrate.
  8. 　上記第２の電極に設けられた第２の可溶導体を備え、
    　上記発熱抵抗体が、上記第１の可溶導体及び上記第２の可溶導体に重畳され、上記第２の可溶導体との重畳面積が、上記第１の可溶導体との重畳面積よりも広い請求項１乃至請求項３のいずれか１項に記載の短絡素子。     A second soluble conductor provided on the second electrode;
    The heating resistor is superimposed on the first soluble conductor and the second soluble conductor, and the overlapping area with the second soluble conductor is greater than the overlapping area with the first soluble conductor. The short-circuit element according to claim 1, wherein the short-circuit element is wide.
  9. 　上記第２の可溶導体の幅が、上記第１の可溶導体よりも狭い請求項２又は請求項３のいずれか１項に記載の短絡素子。 4. The short-circuit element according to claim 2, wherein a width of the second soluble conductor is narrower than that of the first soluble conductor.
  10. 　上記第１の電極及び上記第２の電極の表面に、Ｎｉ／Ａｕメッキ、Ｎｉ／Ｐｄメッキ、Ｎｉ／Ｐｄ／Ａｕメッキの何れか１つが被覆されている請求項１乃至請求項３のいずれか１項に記載の短絡素子。 The surface of each of the first electrode and the second electrode is covered with any one of Ni / Au plating, Ni / Pd plating, and Ni / Pd / Au plating. The short-circuit element according to item 1.
  11. 　上記絶縁基板に、上記第２の電極と隣接して設けられた第４の電極と、
    　上記第２、第４の電極間に亘って設けられ、上記発熱抵抗体からの加熱により、上記第２、第４の電極間の上記電流経路を溶断する第２の可溶導体とを有し、
    　上記第１の電極の面積が、上記第３の電極よりも広く、上記第２の電極の面積が、上記第４の電極よりも広い請求項１乃至請求項３のいずれか１項に記載の短絡素子。     A fourth electrode provided adjacent to the second electrode on the insulating substrate;
    A second soluble conductor provided between the second and fourth electrodes and fusing the current path between the second and fourth electrodes by heating from the heating resistor. ,
    The area of the first electrode is larger than that of the third electrode, and the area of the second electrode is larger than that of the fourth electrode. Short circuit element.
  12. 　上記絶縁基板上に設けられた内部を保護するカバー部材と、
    　上記カバー部材の内面に設けられるカバー部電極とを備え、
    　上記カバー部電極が、上記第１の電極及び上記第２の電極と重畳する位置に設置されてなる請求項１乃至請求項３のいずれか１項に記載の短絡素子。     A cover member for protecting the inside provided on the insulating substrate;
    A cover part electrode provided on the inner surface of the cover member,
    4. The short-circuit element according to claim 1, wherein the cover part electrode is disposed at a position overlapping the first electrode and the second electrode. 5.
  13. 　上記絶縁基板上に、上記第１の電極又は上記第２の電極のいずれか一方に接続される保護抵抗を備える請求項１乃至請求項３のいずれか１項に記載の短絡素子。 The short-circuit element according to any one of claims 1 to 3, further comprising a protective resistor connected to either the first electrode or the second electrode on the insulating substrate.
  14. 　上記第２の電極に設けられた第２の可溶導体を備え、
    　上記第１及び第２の可溶導体が、Ｓｎを主成分とするＰｂフリーハンダである請求項１乃至請求項３のいずれか１項に記載の短絡素子。     A second soluble conductor provided on the second electrode;
    4. The short-circuit element according to claim 1, wherein the first and second fusible conductors are Pb-free solder containing Sn as a main component. 5.
  15. 　上記第２の電極に設けられた第２の可溶導体を備え、
    　上記第１及び第２の可溶導体が、低融点金属と高融点金属とを含有し、
    　上記低融点金属が、上記発熱抵抗体から発する熱により溶融することで、上記高融点金属を溶食する請求項１乃至請求項３のいずれか１項に記載の短絡素子。     A second soluble conductor provided on the second electrode;
    The first and second soluble conductors contain a low melting point metal and a high melting point metal,
    4. The short-circuit element according to claim 1, wherein the low-melting-point metal melts due to heat generated from the heating resistor to corrode the high-melting-point metal. 5.
  16. 　上記低融点金属が、ハンダであり、
    　上記高融点金属が、Ａｇ、Ｃｕ、又はＡｇ若しくはＣｕを主成分とする合金である請求項１５記載の短絡素子。     The low melting point metal is solder,
    The short-circuit element according to claim 15, wherein the refractory metal is Ag, Cu, or an alloy containing Ag or Cu as a main component.
  17. 　上記第１及び第２の可溶導体は、内層が上記低融点金属であり、外層が上記高融点金属の被覆構造である請求項１５記載の短絡素子。 16. The short-circuit element according to claim 15, wherein the first and second soluble conductors have an inner layer made of the low melting point metal and an outer layer made of the high melting point metal.
  18. 　上記第１及び第２の可溶導体は、内層が上記高融点金属であり、外層が上記低融点金属の被覆構造である請求項１５記載の短絡素子。 16. The short-circuit element according to claim 15, wherein the first and second soluble conductors have an inner layer made of the high melting point metal and an outer layer made of the low melting point metal.
  19. 　上記第１及び第２の可溶導体が、上記低融点金属と、上記高融点金属とが積層された積層構造である請求項１５記載の短絡素子。 16. The short-circuit element according to claim 15, wherein the first and second soluble conductors have a laminated structure in which the low melting point metal and the high melting point metal are laminated.
  20. 　上記第１及び第２の可溶導体が、上記低融点金属と、上記高融点金属とが交互に積層された４層以上の多層構造である請求項１５記載の短絡素子。 16. The short-circuit element according to claim 15, wherein the first and second soluble conductors have a multilayer structure of four or more layers in which the low melting point metal and the high melting point metal are alternately laminated.
  21. 　上記第１及び第２の可溶導体が、内層を構成する低融点金属の表面を高融点金属にてストライプ状に部分的に積層する請求項１５記載の短絡素子。 16. The short-circuit element according to claim 15, wherein the first and second fusible conductors are formed by partially laminating a surface of a low melting point metal constituting the inner layer with a high melting point metal.
  22. 　上記第１及び第２の可溶導体が、多数の開口部を有する高融点金属と、上記開口部に挿入された低融点金属とからなる請求項１５記載の短絡素子。 16. The short-circuit element according to claim 15, wherein the first and second soluble conductors are composed of a high melting point metal having a large number of openings and a low melting point metal inserted into the openings.
  23. 　上記第１及び第２の可溶導体は、低融点金属の体積が、高融点金属の体積よりも多い請求項１５記載の短絡素子。 The short-circuit element according to claim 15, wherein the first and second soluble conductors have a volume of low melting point metal larger than that of high melting point metal.
  24. 　ヒューズと、
    　上記ヒューズの一端に接続された発熱抵抗体と、
    　上記ヒューズの上記発熱抵抗体が接続されていない他端に接続されたスイッチとを備え、
    　上記スイッチが、上記ヒューズの溶断に連動して短絡する短絡素子回路。     A fuse,
    A heating resistor connected to one end of the fuse;
    A switch connected to the other end of the fuse to which the heating resistor is not connected,
    A short-circuit element circuit in which the switch is short-circuited in conjunction with the melting of the fuse.
  25. 　ヒューズと、上記ヒューズの一端に接続された発熱抵抗体と、上記ヒューズの上記発熱抵抗体が接続されていない他端に接続されたスイッチとを有し、上記スイッチは、上記ヒューズの溶断に連動して短絡する短絡素子と、
    　電子部品とを備え、
    　上記スイッチが、両端子が上記電子部品と並列に接続され、
    　上記発熱抵抗体の開放端子が、上記スイッチ端子のうち上記ヒューズが接続されていない端子に接続され、
    　上記電子部品の異常時には、上記ヒューズが溶融することにより上記スイッチが短絡され、上記電子部品を迂回するバイパス電流経路が形成される補償回路。     A fuse, a heating resistor connected to one end of the fuse, and a switch connected to the other end of the fuse to which the heating resistor is not connected, the switch interlocking with the fusing of the fuse And a short-circuit element that short-circuits,
    With electronic components,
    The switch has both terminals connected in parallel with the electronic component,
    An open terminal of the heating resistor is connected to a terminal of the switch terminal to which the fuse is not connected,
    A compensation circuit in which when the electronic component is abnormal, the switch is short-circuited due to melting of the fuse, thereby forming a bypass current path that bypasses the electronic component.
  26. 　上記電子部品が、異常時に電気的開放を伴う発光ダイオードである請求項２５記載の補償回路。 26. The compensation circuit according to claim 25, wherein the electronic component is a light emitting diode that is electrically open when an abnormality occurs.
  27. 　上記バイパス電流経路上に、上記電子部品の内部抵抗相当の保護抵抗が接続されている請求項２５又は請求項２６に記載の補償回路。 27. The compensation circuit according to claim 25 or claim 26, wherein a protective resistance corresponding to an internal resistance of the electronic component is connected on the bypass current path.
  28. 　ヒューズと、上記ヒューズの一端に接続された発熱抵抗体と、上記ヒューズの上記発熱抵抗体が接続されていない他端に接続されたスイッチとを有し、上記スイッチは、上記ヒューズの溶断に連動して短絡する短絡素子と、
    　電子部品と、
    　上記電子部品の電流経路上に接続され、上記電子部品の異常時に該電子部品への通電を電気信号で遮断する保護素子と、
    　上記電子部品の異常を検知し、異常信号を出力する保護部品と、
    　上記保護部品の異常信号を受けて動作する制御素子とを備え、
    　上記電子部品及び上記保護素子の両端と、上記スイッチの両端子とを並列に接続し、
    　上記発熱抵抗体の開放端子と上記保護素子の上記電気信号の入力端子を、上記制御素子に接続し、
    　上記電子部品の異常時には、上記保護部品からの異常信号を受けて上記制御素子が動作し、上記保護素子による上記電子部品の電流経路の遮断と、上記ヒューズの溶断に連動した上記スイッチの短絡を行い、バイパス電流経路が形成される補償回路。     A fuse, a heating resistor connected to one end of the fuse, and a switch connected to the other end of the fuse to which the heating resistor is not connected, the switch interlocking with the fusing of the fuse And a short-circuit element that short-circuits,
    Electronic components,
    A protective element that is connected on the current path of the electronic component, and that interrupts energization of the electronic component with an electrical signal when the electronic component is abnormal;
    A protective component that detects an abnormality of the electronic component and outputs an abnormality signal;
    A control element that operates in response to an abnormality signal of the protective component,
    Connect both ends of the electronic component and the protection element and both terminals of the switch in parallel,
    An open terminal of the heating resistor and an input terminal of the electrical signal of the protection element are connected to the control element,
    When the electronic component is abnormal, the control element operates in response to an abnormal signal from the protective component, and the switch interrupts the current path of the electronic component by the protective element and the short circuit of the switch in conjunction with the fusing of the fuse. Compensation circuit that performs bypass current path.
  29. 　上記電子部品は、異常時に電気的短絡又は熱暴走を伴うバッテリセルである請求項２８記載の補償回路。 29. The compensation circuit according to claim 28, wherein the electronic component is a battery cell accompanied by an electrical short circuit or thermal runaway in an abnormal state.
  30. 　上記バイパス電流経路上に、上記電子部品の内部抵抗相当の保護抵抗が接続されている請求項２８に記載の補償回路。 29. The compensation circuit according to claim 28, wherein a protective resistance corresponding to an internal resistance of the electronic component is connected on the bypass current path.
  31. 　上記制御素子は、上記発熱抵抗体の開放端子に接続された第１の制御素子と、上記保護素子の電気信号の入力端子に接続された第２の制御素子とを備え、
    　上記保護部品及び上記第１、第２の制御素子を制御することにより、上記保護素子による電流経路の遮断を行い、その後、上記短絡素子によるバイパス電流経路を形成する請求項２８又は請求項３０のいずれか１項に記載の補償回路。     The control element includes a first control element connected to an open terminal of the heating resistor, and a second control element connected to an electric signal input terminal of the protection element,
    The current path by the protection element is interrupted by controlling the protection component and the first and second control elements, and then the bypass current path by the short-circuit element is formed. The compensation circuit according to any one of claims.
  32. 　ヒューズと、
    　上記ヒューズの一端に接続された発熱抵抗体と、
    　上記ヒューズの上記発熱抵抗体が接続されていない他端に接続されたスイッチと、
    　上記スイッチの端子の少なくとも一方の端子に接続された保護抵抗とを備え、
    　上記スイッチは、上記ヒューズの溶断に連動して短絡する短絡素子回路。     A fuse,
    A heating resistor connected to one end of the fuse;
    A switch connected to the other end of the fuse to which the heating resistor is not connected;
    A protective resistor connected to at least one of the terminals of the switch,
    The switch is a short-circuit element circuit that is short-circuited in conjunction with the melting of the fuse.
  33. 　ヒューズと、上記ヒューズの一端に接続された発熱抵抗体と、上記ヒューズの上記発熱抵抗体が接続されていない他端に接続されたスイッチと、上記スイッチの端子のうち、上記ヒューズが接続されていない端子に接続された保護抵抗とを有し、上記スイッチは、上記ヒューズの溶断に連動して短絡する短絡素子と、
    　電子部品とを備え、
    　上記スイッチと上記ヒューズが接続された端子及び上記保護抵抗の開放端子と、上記電子部品とを、並列に接続し、
    　上記発熱抵抗体は、上記保護抵抗と接続し、
    　上記電子部品の異常時には、上記ヒューズが溶融することにより上記スイッチがオンとなり、バイパス電流経路が形成される補償回路。     Of the fuse, a heating resistor connected to one end of the fuse, a switch connected to the other end of the fuse not connected to the heating resistor, and a terminal of the switch, the fuse is connected A protective resistor connected to a non-terminal, and the switch includes a short-circuit element that is short-circuited in conjunction with the melting of the fuse,
    With electronic components,
    The terminal to which the switch and the fuse are connected and the open terminal of the protective resistor and the electronic component are connected in parallel,
    The heating resistor is connected to the protective resistor,
    A compensation circuit in which when the electronic component is abnormal, the switch is turned on by melting the fuse and a bypass current path is formed.
  34. 　上記電子部品は、異常時に電気的開放を伴う発光ダイオードである請求項３３記載の補償回路。 34. The compensation circuit according to claim 33, wherein the electronic component is a light emitting diode that is electrically open when an abnormality occurs.
  35. 　ヒューズと、上記ヒューズの一端に接続された発熱抵抗体と、上記ヒューズの上記発熱抵抗体が接続されていない他端に接続されたスイッチと、上記スイッチの端子のうち、上記ヒューズが接続されていない端子に接続された保護抵抗とを有し、上記スイッチは、上記ヒューズの溶断に連動して短絡する短絡素子と、
    　電子部品と、
    　上記電子部品の電流経路上に接続され、上記電子部品の異常時に該電子部品への通電を電気信号で遮断する保護素子と、
    　上記電子部品の異常を検知し、異常信号を出力する保護部品と、
    　上記保護部品の異常信号を受けて動作する制御素子とを備え、
    　上記電子部品及び上記保護素子の両端と、上記スイッチの上記ヒューズとの接続端子及び上記保護抵抗とを並列に接続し、
    　上記発熱抵抗体の開放端子と上記保護素子の上記電気信号の入力端子を、上記制御素子に接続し、
    　上記電子部品の異常時には、上記保護部品からの異常信号を受けて上記制御素子が動作し、上記保護素子による上記電子部品の電流経路の遮断と、上記ヒューズの溶断に連動した上記スイッチの短絡を行い、バイパス電流経路が形成される補償回路。     Of the fuse, a heating resistor connected to one end of the fuse, a switch connected to the other end of the fuse not connected to the heating resistor, and a terminal of the switch, the fuse is connected A protective resistor connected to a non-terminal, and the switch includes a short-circuit element that is short-circuited in conjunction with the melting of the fuse,
    Electronic components,
    A protective element that is connected on the current path of the electronic component, and that interrupts energization of the electronic component with an electrical signal when the electronic component is abnormal;
    A protective component that detects an abnormality of the electronic component and outputs an abnormality signal;
    A control element that operates in response to an abnormality signal of the protective component,
    Connecting both ends of the electronic component and the protection element, the connection terminal of the fuse of the switch and the protection resistor in parallel;
    An open terminal of the heating resistor and an input terminal of the electrical signal of the protection element are connected to the control element,
    When the electronic component is abnormal, the control element operates in response to an abnormal signal from the protective component, and the switch interrupts the current path of the electronic component by the protective element and the short circuit of the switch in conjunction with the fusing of the fuse. Compensation circuit that performs bypass current path.
  36. 　上記電子部品は、異常時に電気的短絡又は熱暴走を伴うバッテリセルである請求項３５記載の補償回路。 36. The compensation circuit according to claim 35, wherein the electronic component is a battery cell accompanied by an electrical short circuit or thermal runaway in an abnormal state.
  37. 　上記制御素子は、上記発熱抵抗体の開放端子に接続された第１の制御素子と、上記保護素子の電気信号の入力端子に接続された第２の制御素子とを備え、
    　上記保護部品及び上記第１、第２の制御素子を制御することにより、上記保護素子による電流経路の遮断を行い、その後、上記短絡素子によるバイパス電流経路を形成する請求項３５又は請求項３６に記載の補償回路。     The control element includes a first control element connected to an open terminal of the heating resistor, and a second control element connected to an electric signal input terminal of the protection element,
    37. The current path by the protection element is blocked by controlling the protection component and the first and second control elements, and then a bypass current path by the short circuit element is formed. The compensation circuit described.
  38. 　上記絶縁基板には、上記可溶導体が設けられた面と同一面に、上記第１の電極と連続する第１の外部接続電極と、上記第１の外部接続電極上に設けられる１又は複数の第１の外部接続端子と、上記第２の電極と連続する第２の外部接続電極と、上記第２の外部接続電極上に設けられる１又は複数の第２の外部接続端子が形成され、
    　上記第１の電極と上記第２の電極とが短絡したときの、上記第１、第２の外部接続電極間の導通抵抗よりも、上記第１の外部接続端子と上記第２の外部接続端子との合成抵抗が低い請求項１乃至請求項３のいずれか１項に記載の短絡素子。     The insulating substrate has a first external connection electrode continuous with the first electrode on the same surface as the surface on which the soluble conductor is provided, and one or more provided on the first external connection electrode. A first external connection terminal, a second external connection electrode continuous with the second electrode, and one or a plurality of second external connection terminals provided on the second external connection electrode,
    The first external connection terminal and the second external connection terminal than the conduction resistance between the first and second external connection electrodes when the first electrode and the second electrode are short-circuited. The short circuit element of any one of Claim 1 thru | or 3 with low synthetic | combination resistance.
  39. 　上記外部接続端子が、金属バンプ又は金属ポストである請求項３８記載の短絡素子。 The short-circuit element according to claim 38, wherein the external connection terminal is a metal bump or a metal post.
  40. 　上記金属バンプ又は金属ポストは、高融点金属の表面に低融点金属層が形成されている請求項３９記載の短絡素子。 40. The short circuit element according to claim 39, wherein the metal bump or the metal post has a low melting point metal layer formed on the surface of the high melting point metal.
  41. 　上記高融点金属は銅又は銀を主成分とし、上記低融点金属は錫を主成分とする鉛フリー半田である請求項４０記載の短絡素子。 41. The short-circuit element according to claim 40, wherein the refractory metal is lead-free solder mainly composed of copper or silver, and the low-melting metal is tin-based.
  42. 　上記外部接続端子が、錫を主成分とする鉛フリー半田からなる金属バンプである請求項３８記載の短絡素子。 The short-circuit element according to claim 38, wherein the external connection terminal is a metal bump made of lead-free solder mainly composed of tin.
  43. 　短絡素子が実装対象物に実装された実装体において、
    　上記短絡素子は、
    　絶縁基板と、
    　上記絶縁基板に設けられた発熱抵抗体と、
    　上記絶縁基板に、互いに隣接して設けられた第１、第２の電極と、
    　上記絶縁基板に、上記第１の電極と隣接して設けられるとともに、上記発熱抵抗体に電気的に接続された第３の電極と、
    　上記第１、第３の電極間に亘って設けられることにより電流経路を構成し、上記発熱抵抗体からの加熱により、上記第１、第３の電極間の上記電流経路を溶断する第１の可溶導体と、
    　上記絶縁基板の上記第１、第２の電極が形成された面と同一表面に形成され、上記第１の電極と連続する第１の外部接続電極及び上記第２の電極と連続する第２の外部接続電極とを備え、
    　上記第１の電極が上記第１の外部接続電極上に接続された第１の外部接続端子を介して上記実装対象物と接続され、上記第２の電極が上記第２の外部接続電極上に接続された第２の外部接続端子を介して上記実装対象物と接続され、
    　上記発熱抵抗体からの加熱により溶融し、上記第１、第２の電極上に凝集した上記第１の可溶導体によって、上記第１の電極と上記第２の電極とが短絡したときの、上記第１、第２の外部接続電極間の導通抵抗よりも、上記第１の外部接続端子と上記第２の外部接続端子との合成抵抗が低いことを特徴とする実装体。     In the mounting body in which the short-circuit element is mounted on the mounting target,
    The short-circuit element is
    An insulating substrate;
    A heating resistor provided on the insulating substrate;
    First and second electrodes provided adjacent to each other on the insulating substrate;
    A third electrode provided on the insulating substrate adjacent to the first electrode and electrically connected to the heating resistor;
    A current path is formed by being provided between the first and third electrodes, and the current path between the first and third electrodes is fused by heating from the heating resistor. A soluble conductor;
    A first external connection electrode that is formed on the same surface as the surface on which the first and second electrodes of the insulating substrate are formed and that is continuous with the first electrode and a second electrode that is continuous with the second electrode. With external connection electrodes,
    The first electrode is connected to the mounting object via a first external connection terminal connected on the first external connection electrode, and the second electrode is on the second external connection electrode. It is connected to the mounting object through the connected second external connection terminal,
    When the first electrode and the second electrode are short-circuited by the first soluble conductor melted by heating from the heating resistor and aggregated on the first and second electrodes, A mounting body, wherein a combined resistance of the first external connection terminal and the second external connection terminal is lower than a conduction resistance between the first and second external connection electrodes.
  44. 　絶縁基板と、
    　上記絶縁基板に形成された第１及び第２の発熱抵抗体と、
    　上記絶縁基板に、互いに隣接して設けられた第１、第２の電極と、
    　上記絶縁基板に、上記第１の電極と隣接して設けられるとともに、上記第１の発熱抵抗体に電気的に接続された第３の電極と、
    　上記絶縁基板に、上記第２の電極と隣接して設けられるとともに、上記第２の発熱抵抗体に電気的に接続された第４の電極と、
    　上記第１、第３の電極間に亘って設けられることにより電流経路を構成し、上記第１の発熱抵抗体からの加熱により、上記第１、第３の電極間の上記電流経路を溶断する第１の可溶導体と、
    　上記第２、第４の電極間に亘って設けられることにより電流経路を構成し、上記第２の発熱抵抗体からの加熱により、上記第２、第４の電極間の上記電流経路を溶断する第２の可溶導体とを備え、
    　上記第１、第２の発熱抵抗体からの加熱により溶融し、上記第１、第２の電極上に凝集した上記第１、第２の可溶導体によって、上記第１の電極と上記第２の電極とが短絡することを特徴とする短絡素子。     An insulating substrate;
    First and second heating resistors formed on the insulating substrate;
    First and second electrodes provided adjacent to each other on the insulating substrate;
    A third electrode provided on the insulating substrate adjacent to the first electrode and electrically connected to the first heating resistor;
    A fourth electrode provided on the insulating substrate adjacent to the second electrode and electrically connected to the second heating resistor;
    A current path is formed by being provided between the first and third electrodes, and the current path between the first and third electrodes is blown by heating from the first heating resistor. A first soluble conductor;
    A current path is formed by being provided between the second and fourth electrodes, and the current path between the second and fourth electrodes is blown by heating from the second heating resistor. A second soluble conductor,
    The first and second fusible conductors are melted by heating from the first and second heating resistors and aggregated on the first and second electrodes, so that the first electrode and the second electrode A short-circuit element characterized in that the electrode is short-circuited.
  45. 　上記第１、第２の可溶導体の一方を他方に先行して溶断させる請求項４４記載の短絡素子。 45. The short-circuit element according to claim 44, wherein one of the first and second soluble conductors is fused prior to the other.
  46. 　上記第１、第２の可溶導体の一方の幅を他方の幅よりも狭くすることにより、当該幅の狭い方の可溶導体を先行して溶断させる請求項４５記載の短絡素子。 46. The short-circuit element according to claim 45, wherein one of the first and second fusible conductors is made narrower than the other, thereby fusing the fusible conductor having the narrower width first.
  47. 　上記絶縁基板上に積層された絶縁層を備え、
    　上記第１～第４の電極が、上記絶縁層上に設置され、
    　上記第１、第２の発熱抵抗体が、上記絶縁層の内部もしくは上記絶縁層と上記絶縁基板の間に設置されている請求項４４乃至請求項４６のいずれか１項に記載の短絡素子。     Comprising an insulating layer laminated on the insulating substrate;
    The first to fourth electrodes are disposed on the insulating layer;
    The short circuit element according to any one of claims 44 to 46, wherein the first and second heating resistors are disposed inside the insulating layer or between the insulating layer and the insulating substrate.
  48. 　上記第１、第２の発熱抵抗体が、前記絶縁基板の内部に設置されてなる請求項４４乃至請求項４６のいずれか１項に記載の短絡素子。 The short-circuit element according to any one of claims 44 to 46, wherein the first and second heating resistors are installed inside the insulating substrate.
  49. 　上記第１、第２の発熱抵抗体が、前記絶縁基板の電極形成面と反対の面に設置されてなる請求項４４乃至請求項４６のいずれか１項に短絡素子。 The short circuit element according to any one of claims 44 to 46, wherein the first and second heating resistors are provided on a surface opposite to an electrode forming surface of the insulating substrate.
  50. 　上記第１、第２の発熱抵抗体が、前記絶縁基板の電極形成面上に設置されてなる請求項４４乃至請求項４６のいずれか１項に記載の短絡素子。 The short-circuit element according to any one of claims 44 to 46, wherein the first and second heating resistors are provided on an electrode forming surface of the insulating substrate.
  51. 　上記第１の電極及び上記第２の電極の表面に、Ｎｉ／Ａｕメッキ，Ｎｉ／Ｐｄメッキ，Ｎｉ／Ｐｄ／Ａｕメッキのいずれか１つが被覆されている請求項４４乃至請求項４６のいずれか１項に記載の短絡素子。 The surface of the first electrode and the second electrode is coated with any one of Ni / Au plating, Ni / Pd plating, and Ni / Pd / Au plating. The short-circuit element according to item 1.
  52. 　上記第１の電極の面積が、上記第３の電極よりも広く、上記第２の電極の面積が、上記第４の電極よりも広い請求項４４乃至請求項４６のいずれか１項に記載の短絡素子。 47. The area according to any one of claims 44 to 46, wherein an area of the first electrode is larger than that of the third electrode, and an area of the second electrode is larger than that of the fourth electrode. Short circuit element.
  53. 　上記絶縁基板上に設けられた内部を保護するカバー部材と、
    　上記カバー部材の内面に設けられるカバー部電極とを備え、
    　上記カバー部電極が、上記第１の電極及び上記第２の電極と重畳する位置に設置されてなる請求項４４乃至請求項４６のいずれか１項に記載の短絡素子。     A cover member for protecting the inside provided on the insulating substrate;
    A cover part electrode provided on the inner surface of the cover member,
    47. The short-circuit element according to any one of claims 44 to 46, wherein the cover part electrode is disposed at a position overlapping the first electrode and the second electrode.
  54. 　上記絶縁基板上に、上記第１の電極又は上記第２の電極のいずれか一方に接続される保護抵抗を備える請求項４４乃至請求項４６のいずれか１項に記載の短絡素子。 The short-circuit element according to any one of claims 44 to 46, further comprising a protective resistor connected to either the first electrode or the second electrode on the insulating substrate.
  55. 　上記第１及び第２の可溶導体が、Ｓｎを主成分とするＰｂフリーハンダである請求項４４乃至請求項４６のいずれか１項に記載の短絡素子。 47. The short-circuit element according to any one of claims 44 to 46, wherein the first and second soluble conductors are Pb-free solder containing Sn as a main component.
  56. 　上記第１及び第２の可溶導体が、低融点金属と高融点金属とを含有し、
    　上記低融点金属が、上記発熱抵抗体から発する熱により溶融することで、上記高融点金属を溶食する請求項４４乃至請求項４６のいずれか１項に記載の短絡素子。     The first and second soluble conductors contain a low melting point metal and a high melting point metal,
    The short-circuit element according to any one of claims 44 to 46, wherein the low-melting-point metal is melted by heat generated from the heating resistor, and the high-melting-point metal is eroded.
  57. 　上記低融点金属が、ハンダであり、
    　上記高融点金属が、Ａｇ、Ｃｕ、又はＡｇ若しくはＣｕを主成分とする合金である請求項５６記載の短絡素子。     The low melting point metal is solder,
    57. The short-circuit element according to claim 56, wherein the refractory metal is Ag, Cu, or an alloy containing Ag or Cu as a main component.
  58. 　上記第１及び第２の可溶導体は、内層が上記低融点金属であり、外層が上記高融点金属である被覆構造である請求項５６記載の短絡素子。 57. The short-circuit element according to claim 56, wherein the first and second soluble conductors have a covering structure in which an inner layer is the low melting point metal and an outer layer is the high melting point metal.
  59. 　上記第１及び第２の可溶導体は、内層が上記高融点金属であり、外層が上記低融点金属である被覆構造である請求項５６記載の短絡素子。 57. The short-circuit element according to claim 56, wherein the first and second soluble conductors have a covering structure in which an inner layer is the high melting point metal and an outer layer is the low melting point metal.
  60. 　上記第１及び第２の可溶導体が、上記低融点金属と、上記高融点金属とが積層された積層構造である請求項５６記載の短絡素子。 57. The short circuit element according to claim 56, wherein the first and second soluble conductors have a laminated structure in which the low melting point metal and the high melting point metal are laminated.
  61. 　上記第１及び第２の可溶導体が、上記低融点金属と、上記高融点金属とが交互に積層された４層以上の多層構造である請求項５６記載の短絡素子。 57. The short-circuit element according to claim 56, wherein the first and second soluble conductors have a multilayer structure of four or more layers in which the low melting point metal and the high melting point metal are alternately laminated.
  62. 　上記第１及び第２の可溶導体が、内層を構成する低融点金属の表面を高融点金属にてストライプ状に部分的に積層する請求項５６記載の短絡素子。 57. The short-circuit element according to claim 56, wherein the first and second fusible conductors are formed by partially laminating a surface of a low melting point metal constituting the inner layer with a high melting point metal.
  63. 　上記第１及び第２の可溶導体が、多数の開口部を有する高融点金属と、上記開口部に挿入された低融点金属とからなる請求項５６記載の短絡素子。 57. The short-circuit element according to claim 56, wherein the first and second soluble conductors are composed of a refractory metal having a large number of openings and a low-melting point metal inserted into the openings.
  64. 　上記第１及び第２の可溶導体は、低融点金属の体積が、高融点金属の体積よりも多い請求項５６記載の短絡素子。 57. The short-circuit element according to claim 56, wherein the first and second soluble conductors have a volume of low melting point metal larger than that of high melting point metal.
  65. 　スイッチと、
    　上記スイッチの一端に接続された第１のヒューズと、
    　上記スイッチの他端に接続された第２のヒューズと、
    　上記第１のヒューズの上記スイッチと接続された一端と反対側の他端に接続された第１
    の発熱抵抗体と、
    　上記第２のヒューズの上記スイッチと接続された一端と反対側の他端に接続された第２の発熱抵抗体とを有し、
    　上記スイッチが、上記第１及び第２のヒューズが溶断されることにより、該第１及び第２のヒューズの溶融導体によって短絡される短絡素子回路。     A switch,
    A first fuse connected to one end of the switch;
    A second fuse connected to the other end of the switch;
    The first fuse connected to the other end opposite to the one end connected to the switch of the first fuse.
    A heating resistor of
    A second heating resistor connected to one end connected to the switch of the second fuse and the other end on the opposite side;
    A short-circuit element circuit in which the switch is short-circuited by a molten conductor of the first and second fuses when the first and second fuses are blown.
  66. 　スイッチと、上記スイッチの一端に接続された第１のヒューズと、上記スイッチの他端に接続された第２のヒューズと、上記第１のヒューズの上記スイッチと接続された一端と反対側の他端に接続された第１の発熱抵抗体と、上記第２のヒューズの上記スイッチと接続された一端と反対側の他端に接続された第２の発熱抵抗体とを有し、上記スイッチは、上記第１及び第２のヒューズが溶断されることにより、該第１及び第２のヒューズの溶融導体によって短絡される短絡素子と、
    　電子部品と、
    　上記電子部品の電流経路上に接続され、上記電子部品の異常時に該電子部品への通電を電気信号で遮断する保護素子と、
    　上記電子部品の異常を検知し、異常信号を出力する保護部品と、
    　上記保護部品の異常信号を受けて動作する第１～第３の制御素子とを備え、
    　上記電子部品及び上記保護素子の両端と、上記スイッチの両端子とを並列に接続し、
    　上記第１、第２の発熱抵抗体、及び上記保護素子の電気信号の入力端子とを、それぞれ上記第１～第３の制御素子に接続し、
    　上記電子部品の異常時には、上記保護部品からの異常信号を受けて上記第１～第３の制御素子が動作し、上記保護素子による上記電子部品の電流経路の遮断と、上記第１、第２のヒューズの溶断に連動した上記スイッチの短絡を行い、バイパス電流経路が形成される補償回路。     A switch, a first fuse connected to one end of the switch, a second fuse connected to the other end of the switch, and the other side of the first fuse opposite to the end connected to the switch. A first heat generating resistor connected to the end, and a second heat generating resistor connected to the other end opposite to the one end connected to the switch of the second fuse. A short-circuit element that is short-circuited by a molten conductor of the first and second fuses by melting the first and second fuses;
    Electronic components,
    A protective element that is connected on the current path of the electronic component, and that interrupts energization of the electronic component with an electrical signal when the electronic component is abnormal;
    A protective component that detects an abnormality of the electronic component and outputs an abnormality signal;
    First to third control elements that operate in response to an abnormality signal of the protective component,
    Connect both ends of the electronic component and the protection element and both terminals of the switch in parallel,
    The first and second heating resistors and the electrical signal input terminal of the protection element are connected to the first to third control elements, respectively.
    When the electronic component is abnormal, the first to third control elements operate in response to an abnormal signal from the protective component, and the current path of the electronic component is blocked by the protective element, and the first and second control elements are operated. A compensation circuit in which a bypass current path is formed by short-circuiting the switch in conjunction with the fusing of the fuse.
  67. 　上記保護部品及び上記第１～第３の制御素子を制御することにより、上記保護素子による電流経路の遮断を行い、その後上記短絡素子による上記バイパス電流経路を形成する請求項６６に記載の補償回路。 The compensation circuit according to claim 66, wherein the protection component and the first to third control elements are controlled to block a current path by the protection element, and then form the bypass current path by the short-circuit element. .
  68. 　上記電子部品は、異常時に電気的短絡又は熱暴走を伴うバッテリセルである請求項６６記載の補償回路。 67. The compensation circuit according to claim 66, wherein the electronic component is a battery cell accompanied by an electrical short circuit or thermal runaway in an abnormal state.
  69. 　スイッチと、上記スイッチの一端に接続された第１のヒューズと、上記スイッチの他端に接続された第２のヒューズと、上記第１のヒューズの上記スイッチと接続された一端と反対側の他端に接続された第１の発熱抵抗体と、上記第２のヒューズの上記スイッチと接続された一端と反対側の他端に接続された第２の発熱抵抗体とを有し、上記スイッチは、上記第１及び第２のヒューズが溶断されることにより、該第１及び第２のヒューズの溶融導体によって短絡される短絡素子と、
    　電子部品と、
    　上記電子部品の電流経路上に接続され、上記電子部品の異常時に該電子部品への通電を電気信号で遮断する保護素子と、
    　上記電子部品の異常を検知し、異常信号を出力する保護部品と、
    　上記保護部品の異常信号を受けて動作する第１、第２の制御素子とを備え、
    　上記電子部品及び上記保護素子の両端と、上記スイッチの両端子とを並列に接続し、
    　上記第１の発熱抵抗体の端子を上記第１の制御素子に接続し、上記第２の発熱抵抗体及び上記保護素子の電気信号の入力端子を、上記第２の制御素子に接続し、
    　上記電子部品の異常時には、上記保護部品からの異常信号を受けて上記第１、第２の制御素子が動作し、上記保護素子による上記電子部品の電流経路の遮断と、上記第１、第２のヒューズの溶断に連動した上記スイッチの短絡を行い、バイパス電流経路が形成される補償回路。     A switch, a first fuse connected to one end of the switch, a second fuse connected to the other end of the switch, and the other side of the first fuse opposite to the end connected to the switch. A first heat generating resistor connected to the end, and a second heat generating resistor connected to the other end opposite to the one end connected to the switch of the second fuse. A short-circuit element that is short-circuited by a molten conductor of the first and second fuses by melting the first and second fuses;
    Electronic components,
    A protective element that is connected on the current path of the electronic component, and that interrupts energization of the electronic component with an electrical signal when the electronic component is abnormal;
    A protective component that detects an abnormality of the electronic component and outputs an abnormality signal;
    First and second control elements that operate in response to an abnormality signal of the protective component,
    Connect both ends of the electronic component and the protection element and both terminals of the switch in parallel,
    A terminal of the first heating resistor is connected to the first control element; an input terminal of an electric signal of the second heating resistor and the protection element is connected to the second control element;
    When the electronic component is abnormal, the first and second control elements operate in response to an abnormal signal from the protective component, and the current path of the electronic component is blocked by the protective element, and the first and second control elements are operated. A compensation circuit in which a bypass current path is formed by short-circuiting the switch in conjunction with the fusing of the fuse.
  70. 　上記保護部品及び上記第１、第２の制御素子を制御することにより、上記保護素子による電流経路の遮断を行い、その後上記短絡素子による上記バイパス電流経路を形成する請求項６９に記載の補償回路。 70. The compensation circuit according to claim 69, wherein the protection component and the first and second control elements are controlled to block a current path by the protection element, and then form the bypass current path by the short-circuit element. .
  71. 　上記バイパス電流経路上に、上記電子部品の内部抵抗相当の保護抵抗が接続されている請求項６６乃至請求項７０のいずれか１項に記載の補償回路。 The compensation circuit according to any one of claims 66 to 70, wherein a protective resistance corresponding to an internal resistance of the electronic component is connected to the bypass current path.
  72. 　上記電子部品は、異常時に電気的短絡又は熱暴走を伴うバッテリセルである請求項６９又は請求項７０に記載の補償回路。 The compensation circuit according to claim 69 or 70, wherein the electronic component is a battery cell accompanied by an electrical short circuit or thermal runaway in an abnormal state.
  73. 　スイッチと、
    　上記スイッチの一端に接続された第１のヒューズと、
    　上記スイッチの他端に接続された第２のヒューズと、
    　上記第１のヒューズの上記スイッチと接続された一端と反対側の他端に接続された第１の発熱抵抗体と、
    　上記第２のヒューズの上記スイッチと接続された一端と反対側の他端に接続された第２の発熱抵抗体と、
    　上記スイッチに接続された保護抵抗とを有し、
    　上記スイッチが、上記第１及び第２のヒューズが溶断されることにより、該第１及び第２のヒューズの溶融導体によって短絡される短絡素子回路。     A switch,
    A first fuse connected to one end of the switch;
    A second fuse connected to the other end of the switch;
    A first heating resistor connected to the other end opposite to the one end connected to the switch of the first fuse;
    A second heating resistor connected to the other end opposite to the one end connected to the switch of the second fuse;
    A protective resistor connected to the switch,
    A short-circuit element circuit in which the switch is short-circuited by a molten conductor of the first and second fuses when the first and second fuses are blown.
  74. 　上記スイッチの一端に接続された第１のヒューズと、上記スイッチの他端に接続された第２のヒューズと、上記第１のヒューズの上記スイッチと接続された一端と反対側の他端に接続された第１の発熱抵抗体と、上記第２のヒューズの上記スイッチと接続された一端と反対側の他端に接続された第２の発熱抵抗体と、上記スイッチに接続された保護抵抗とを有し、上記スイッチは、上記第１及び第２のヒューズが溶断されることにより、該第１及び第２のヒューズの溶融導体によって短絡される短絡素子と、
    　電子部品と、
    　上記電子部品の電流経路上に接続され、上記電子部品の異常時に該電子部品への通電を電気信号で遮断する保護素子と、
    　上記電子部品の異常を検知し、異常信号を出力する保護部品と、
    　上記保護部品の異常信号を受けて動作する第１～第３の制御素子とを備え、
    　上記電子部品及び上記保護素子の両端と、上記スイッチの両端子及び上記保護抵抗とを並列に接続し、
    　上記第１、第２の発熱抵抗体、及び上記保護素子の電気信号の入力端子とを、それぞれ上記第１～第３の制御素子に接続し、
    　上記電子部品の異常時には、上記保護部品からの異常信号を受けて上記第１～第３の制御素子が動作し、上記保護素子による上記電子部品の電流経路の遮断と、上記第１、第２のヒューズの溶断に連動した上記スイッチの短絡を行い、バイパス電流経路が形成される補償回路。     A first fuse connected to one end of the switch; a second fuse connected to the other end of the switch; and a second fuse connected to the other end of the first fuse opposite to the switch. A first heat generating resistor, a second heat generating resistor connected to the other end of the second fuse opposite to the one connected to the switch, and a protective resistor connected to the switch. And the switch includes a short-circuit element that is short-circuited by the molten conductor of the first and second fuses when the first and second fuses are blown.
    Electronic components,
    A protective element that is connected on the current path of the electronic component, and that interrupts energization of the electronic component with an electrical signal when the electronic component is abnormal;
    A protective component that detects an abnormality of the electronic component and outputs an abnormality signal;
    First to third control elements that operate in response to an abnormality signal of the protective component,
    Connect both ends of the electronic component and the protection element in parallel with both terminals of the switch and the protection resistor,
    The first and second heating resistors and the electrical signal input terminal of the protection element are connected to the first to third control elements, respectively.
    When the electronic component is abnormal, the first to third control elements operate in response to an abnormal signal from the protective component, and the current path of the electronic component is blocked by the protective element, and the first and second control elements are operated. A compensation circuit in which a bypass current path is formed by short-circuiting the switch in conjunction with the fusing of the fuse.
  75. 　上記保護部品及び上記第１～第３の制御素子を制御することにより、上記保護素子による電流経路の遮断を行い、その後上記短絡素子による上記バイパス電流経路を形成する請求項７４に記載の補償回路。 75. The compensation circuit according to claim 74, wherein the protection component and the first to third control elements are controlled to cut off a current path by the protection element and then form the bypass current path by the short-circuit element. .
  76. 　上記電子部品は、異常時に電気的短絡又は熱暴走を伴うバッテリセルである請求項７４又は請求項７５記載の補償回路。 The compensation circuit according to claim 74 or 75, wherein the electronic component is a battery cell accompanied by an electrical short circuit or thermal runaway in an abnormal state.
  77. 　スイッチと、上記スイッチの一端に接続された第１のヒューズと、上記スイッチの他端
    に接続された第２のヒューズと、上記第１のヒューズの上記スイッチと接続された一端と反対側の他端に接続された第１の発熱抵抗体と、上記第２のヒューズの上記スイッチと接続された一端と反対側の他端に接続された第２の発熱抵抗体と、上記スイッチに接続された保護抵抗とを有し、上記スイッチは、上記第１及び第２のヒューズが溶断されることにより、該第１及び第２のヒューズの溶融導体によって短絡される短絡素子と、
    　電子部品と、
    　上記電子部品の電流経路上に接続され、上記電子部品の異常時に該電子部品への通電を電気信号で遮断する保護素子と、
    　上記電子部品の異常を検知し、異常信号を出力する保護部品と、
    　上記保護部品の異常信号を受けて動作する第１、第２の制御素子とを備え、
    　上記電子部品及び上記保護素子の両端と、上記スイッチの両端子及び上記保護抵抗とを並列に接続し、
    　上記第１の発熱抵抗体の端子を上記第１の制御素子に接続し、上記第２の発熱抵抗体及び上記保護素子の電気信号の入力端子を、上記第２の制御素子に接続し、
    　上記電子部品の異常時には、上記保護部品からの異常信号を受けて上記第１、第２の制御素子が動作し、上記保護素子による上記電子部品の電流経路の遮断と、上記第１、第２のヒューズの溶断に連動した上記スイッチの短絡を行い、バイパス電流経路が形成される補償回路。     A switch, a first fuse connected to one end of the switch, a second fuse connected to the other end of the switch, and the other side of the first fuse opposite to the end connected to the switch. A first heat generating resistor connected to the end, a second heat generating resistor connected to the other end opposite to the one end connected to the switch of the second fuse, and a switch connected to the switch A short-circuit element that is short-circuited by the molten conductor of the first and second fuses when the first and second fuses are blown.
    Electronic components,
    A protective element that is connected on the current path of the electronic component, and that interrupts energization of the electronic component with an electrical signal when the electronic component is abnormal;
    A protective component that detects an abnormality of the electronic component and outputs an abnormality signal;
    First and second control elements that operate in response to an abnormality signal of the protective component,
    Connect both ends of the electronic component and the protection element in parallel with both terminals of the switch and the protection resistor,
    A terminal of the first heating resistor is connected to the first control element; an input terminal of an electric signal of the second heating resistor and the protection element is connected to the second control element;
    When the electronic component is abnormal, the first and second control elements operate in response to an abnormal signal from the protective component, and the current path of the electronic component is blocked by the protective element, and the first and second control elements are operated. A compensation circuit in which a bypass current path is formed by short-circuiting the switch in conjunction with the fusing of the fuse.
  78. 　上記保護部品及び上記第１、第２の制御素子を制御することにより、上記保護素子による電流経路の遮断を行い、その後上記短絡素子による上記バイパス電流経路を形成する請求項７７に記載の補償回路。 78. The compensation circuit according to claim 77, wherein the protection component and the first and second control elements are controlled to block a current path by the protection element, and then form the bypass current path by the short-circuit element. .
  79. 　上記電子部品は、異常時に電気的短絡又は熱暴走を伴うバッテリセルである請求項７７又は請求項７８記載の補償回路。 79. The compensation circuit according to claim 77 or 78, wherein the electronic component is a battery cell accompanied by an electrical short circuit or thermal runaway in an abnormal state.
  80. 　上記絶縁基板には、上記可溶導体が設けられた面と同一面に、上記第１の電極と連続する第１の外部接続電極と、上記第１の外部接続電極上に設けられる１又は複数の第１の外部接続端子と、上記第２の電極と連続する第２の外部接続電極と、上記第２の外部接続電極上に設けられる１又は複数の第２の外部接続端子が形成され、
    　上記第１の電極と上記第２の電極とが短絡したときの、上記第１、第２の外部接続電極間の導通抵抗よりも、上記第１の外部接続端子と上記第２の外部接続端子との合成抵抗が低い請求項４４乃至請求項４６のいずれか１項に記載の短絡素子。     The insulating substrate has a first external connection electrode continuous with the first electrode on the same surface as the surface on which the soluble conductor is provided, and one or more provided on the first external connection electrode. A first external connection terminal, a second external connection electrode continuous with the second electrode, and one or a plurality of second external connection terminals provided on the second external connection electrode,
    The first external connection terminal and the second external connection terminal than the conduction resistance between the first and second external connection electrodes when the first electrode and the second electrode are short-circuited. The short circuiting element according to any one of claims 44 to 46, wherein the combined resistance with the low is low.
  81. 　上記外部接続端子が、金属バンプ又は金属ポストである請求項８０記載の短絡素子。 The short-circuit element according to claim 80, wherein the external connection terminal is a metal bump or a metal post.
  82. 　上記金属バンプ又は金属ポストは、高融点金属の表面に低融点金属層が形成されている請求項８１記載の短絡素子。 82. The short circuit element according to claim 81, wherein the metal bump or the metal post has a low melting point metal layer formed on the surface of the high melting point metal.
  83. 　上記高融点金属は銅又は銀を主成分とし、上記低融点金属は錫を主成分とする鉛フリー半田である請求項８２記載の短絡素子。 83. The short-circuit element according to claim 82, wherein the refractory metal is a lead-free solder mainly composed of copper or silver, and the low-melting metal is tin.
  84. 　上記外部接続端子が、錫を主成分とする鉛フリー半田からなる金属バンプである請求項８０記載の短絡素子。 81. The short-circuit element according to claim 80, wherein the external connection terminal is a metal bump made of lead-free solder mainly composed of tin.
  85. 　短絡素子が実装対象物に実装された実装体において、
    　上記短絡素子は、
    　絶縁基板と、
    　上記絶縁基板に形成された第１及び第２の発熱抵抗体と、
    　上記絶縁基板に、互いに隣接して設けられた第１、第２の電極と、
    　上記絶縁基板に、上記第１の電極と隣接して設けられるとともに、上記第１の発熱抵抗体に電気的に接続された第３の電極と、
    　上記絶縁基板に、上記第２の電極と隣接して設けられるとともに、上記第２の発熱抵抗体に電気的に接続された第４の電極と、
    　上記第１、第３の電極間に亘って設けられることにより電流経路を構成し、上記第１の発熱抵抗体からの加熱により、上記第１、第３の電極間の上記電流経路を溶断する第１の可溶導体と、
    　上記第２、第４の電極間に亘って設けられることにより電流経路を構成し、上記第２の発熱抵抗体からの加熱により、上記第２、第４の電極間の上記電流経路を溶断する第２の可溶導体と、
    　上記絶縁基板の上記第１、第２の電極が形成された面と同一表面に形成され、上記第１の電極と連続する第１の外部接続電極及び上記第２の電極と連続する第２の外部接続電極とを備え、
    　上記第１の電極が上記第１の外部接続電極上に接続された第１の外部接続端子を介して上記実装対象物と接続され、上記第２の電極が上記第２の外部接続電極上に接続された第２の外部接続端子を介して上記実装対象物と接続され、
    　上記第１、第２の発熱抵抗体からの加熱により溶融し、上記第１、第２の電極上に凝集した上記第１、第２の可溶導体によって、上記第１の電極と上記第２の電極とが短絡したときの、上記第１、第２の外部接続電極間の導通抵抗よりも、上記第１の外部接続端子と上記第２の外部接続端子との合成抵抗が低いことを特徴とする実装体。     In the mounting body in which the short-circuit element is mounted on the mounting target,
    The short-circuit element is
    An insulating substrate;
    First and second heating resistors formed on the insulating substrate;
    First and second electrodes provided adjacent to each other on the insulating substrate;
    A third electrode provided on the insulating substrate adjacent to the first electrode and electrically connected to the first heating resistor;
    A fourth electrode provided on the insulating substrate adjacent to the second electrode and electrically connected to the second heating resistor;
    A current path is formed by being provided between the first and third electrodes, and the current path between the first and third electrodes is blown by heating from the first heating resistor. A first soluble conductor;
    A current path is formed by being provided between the second and fourth electrodes, and the current path between the second and fourth electrodes is blown by heating from the second heating resistor. A second soluble conductor;
    A first external connection electrode that is formed on the same surface as the surface on which the first and second electrodes of the insulating substrate are formed and that is continuous with the first electrode and a second electrode that is continuous with the second electrode. With external connection electrodes,
    The first electrode is connected to the mounting object via a first external connection terminal connected on the first external connection electrode, and the second electrode is on the second external connection electrode. It is connected to the mounting object through the connected second external connection terminal,
    The first and second fusible conductors are melted by heating from the first and second heating resistors and aggregated on the first and second electrodes, so that the first electrode and the second electrode The combined resistance of the first external connection terminal and the second external connection terminal is lower than the conduction resistance between the first and second external connection electrodes when the electrode is short-circuited. An implementation body.
  86. 　絶縁基板と、
    　上記絶縁基板に形成された第１及び第２の発熱抵抗体と、
    　上記絶縁基板に、互いに隣接して設けられた第１、第２の電極と、
    　上記絶縁基板に、上記第１の電極と隣接して設けられるとともに、上記第１の発熱抵抗体に電気的に接続された第３の電極と、
    　上記絶縁基板に、上記第２の電極と隣接して設けられるとともに、上記第２の発熱抵抗体に電気的に接続された第４の電極と、
    　上記第４の電極に隣接して設けられた第５の電極と、
    　上記第１、第３の電極間に亘って設けられることにより電流経路を構成し、上記第１の発熱抵抗体からの加熱により、上記第１、第３の電極間の上記電流経路を溶断する第１の可溶導体と、
    　上記第２から上記第４の電極を経由して上記第５の電極に亘って設けられることにより電流経路を構成し、上記第２の発熱抵抗体からの加熱により、上記第２の電極と上記第４の電極との間、及び上記第４の電極と上記第５の電極との間の各上記電流経路を溶断する第２の可溶導体とを備え、
    　上記第１、第２の発熱抵抗体からの加熱により溶融し、上記第１、第２の電極上に凝集した上記第１、第２の可溶導体によって、上記第１の電極と上記第２の電極とが短絡することを特徴とする短絡素子。     An insulating substrate;
    First and second heating resistors formed on the insulating substrate;
    First and second electrodes provided adjacent to each other on the insulating substrate;
    A third electrode provided on the insulating substrate adjacent to the first electrode and electrically connected to the first heating resistor;
    A fourth electrode provided on the insulating substrate adjacent to the second electrode and electrically connected to the second heating resistor;
    A fifth electrode provided adjacent to the fourth electrode;
    A current path is formed by being provided between the first and third electrodes, and the current path between the first and third electrodes is blown by heating from the first heating resistor. A first soluble conductor;
    A current path is formed by being provided across the fifth electrode through the second to fourth electrodes, and the second electrode and the above are heated by heating from the second heating resistor. A second soluble conductor for fusing each of the current paths between the fourth electrode and between the fourth electrode and the fifth electrode;
    The first and second fusible conductors are melted by heating from the first and second heating resistors and aggregated on the first and second electrodes, so that the first electrode and the second electrode A short-circuit element characterized in that the electrode is short-circuited.
  87. 　上記第２の可溶導体が、上記第１の可溶導体に先行して溶断する請求項８６記載の短絡素子。 87. The short-circuit element according to claim 86, wherein the second soluble conductor is fused prior to the first soluble conductor.
  88. 　上記第２の可溶導体の幅が、上記第１の可溶導体よりも狭い請求項８７記載の短絡素子。 88. The short-circuit element according to claim 87, wherein the width of the second soluble conductor is narrower than that of the first soluble conductor.
  89. 　上記絶縁基板上に積層された絶縁層を備え、
    　上記第１～第５の電極が、上記絶縁層上に設置され、
    　上記第１、第２の発熱抵抗体が、上記絶縁層の内部もしくは上記絶縁層と上記絶縁基板の間に設置されている請求項８６乃至請求項８８のいずれか１項に記載の短絡素子。     Comprising an insulating layer laminated on the insulating substrate;
    The first to fifth electrodes are disposed on the insulating layer;
    The short-circuit element according to any one of claims 86 to 88, wherein the first and second heating resistors are disposed inside the insulating layer or between the insulating layer and the insulating substrate.
  90. 　上記第１、第２の発熱抵抗体が、上記絶縁基板の内部に設置されてなる請求項８６乃至請求項８８のいずれか１項に記載の短絡素子。 The short-circuit element according to any one of claims 86 to 88, wherein the first and second heating resistors are installed inside the insulating substrate.
  91. 　上記第１、第２の発熱抵抗体が、上記絶縁基板の電極形成面と反対の面に設置されてなる請求項８６乃至請求項８８のいずれか１項に短絡素子。 The short circuit element according to any one of claims 86 to 88, wherein the first and second heating resistors are disposed on a surface opposite to the electrode forming surface of the insulating substrate.
  92. 　上記第１、第２の発熱抵抗体が、上記絶縁基板の電極形成面上に設置されてなる請求項８６乃至請求項８８のいずれか１項に記載の短絡素子。 The short-circuit element according to any one of claims 86 to 88, wherein the first and second heating resistors are provided on an electrode formation surface of the insulating substrate.
  93. 　上記第１の電極及び上記第２の電極の表面に、Ｎｉ／Ａｕメッキ、Ｎｉ／Ｐｄメッキ、Ｎｉ／Ｐｄ／Ａｕメッキのいずれか１つが被覆されている請求項８６乃至請求項８８のいずれか１項に記載の短絡素子。 The surface of each of the first electrode and the second electrode is coated with any one of Ni / Au plating, Ni / Pd plating, and Ni / Pd / Au plating. The short-circuit element according to item 1.
  94. 　上記第１の電極の面積が、上記第３の電極よりも広く、上記第２の電極の面積が、上記第４及び第５の電極よりも広い請求項８６乃至請求項８８のいずれか１項に記載の短絡素子。 The area of the first electrode is larger than that of the third electrode, and the area of the second electrode is larger than those of the fourth and fifth electrodes. The short-circuit element described in 1.
  95. 　上記絶縁基板上に設けられた内部を保護するカバー部材と、
    　上記カバー部材の内面に設けられるカバー部電極とを備え、
    　上記カバー部電極が、上記第１の電極及び上記第２の電極と重畳する位置に設置されてなる請求項８６乃至請求項８８のいずれか１項に記載の短絡素子。     A cover member for protecting the inside provided on the insulating substrate;
    A cover part electrode provided on the inner surface of the cover member,
    89. The short-circuit element according to any one of claims 86 to 88, wherein the cover part electrode is installed at a position overlapping the first electrode and the second electrode.
  96. 　上記絶縁基板上に、上記第１の電極又は上記第２の電極のいずれか一方に接続される保護抵抗を備える請求項８６乃至請求項８８のいずれか１項に記載の短絡素子。 89. The short-circuit element according to claim 86, further comprising a protective resistor connected to either the first electrode or the second electrode on the insulating substrate.
  97. 　上記第１の可溶導体又は第２の可溶導体の少なくともいずれか一方が、Ｓｎを主成分とするＰｂフリーハンダである請求項８６乃至請求項８８のいずれか１項に記載の短絡素子。 The short-circuit element according to any one of claims 86 to 88, wherein at least one of the first soluble conductor and the second soluble conductor is Pb-free solder containing Sn as a main component.
  98. 　上記第１の可溶導体又は第２の可溶導体の少なくともいずれか一方が、低融点金属と高融点金属とを含有し、
    　上記低融点金属が、上記発熱抵抗体から発する熱により溶融することで、上記高融点金属を溶食する請求項８６乃至請求項８８のいずれか１項に記載の短絡素子。     At least one of the first soluble conductor and the second soluble conductor contains a low melting point metal and a high melting point metal,
    The short-circuit element according to any one of claims 86 to 88, wherein the low-melting-point metal is melted by heat generated from the heating resistor, and the high-melting-point metal is eroded.
  99. 　上記低融点金属が、ハンダであり、
    　上記高融点金属が、Ａｇ、Ｃｕ、又はＡｇ若しくはＣｕを主成分とする合金である請求項９８記載の短絡素子。     The low melting point metal is solder,
    99. The short-circuit element according to claim 98, wherein the refractory metal is Ag, Cu, or an alloy mainly composed of Ag or Cu.
  100. 　上記第１の可溶導体又は第２の可溶導体の少なくともいずれか一方は、内層が上記低融点金属であり、外層が上記高融点金属の被覆構造である請求項９８記載の短絡素子。 99. The short-circuit element according to claim 98, wherein at least one of the first soluble conductor and the second soluble conductor has an inner layer made of the low melting point metal and an outer layer made of the high melting point metal.
  101. 　上記第１の可溶導体又は第２の可溶導体の少なくともいずれか一方は、内層が上記高融点金属であり、外層が上記低融点金属の被覆構造である請求項９８記載の短絡素子。 99. The short-circuit element according to claim 98, wherein at least one of the first soluble conductor and the second soluble conductor has an inner layer made of the refractory metal and an outer layer covered with the low-melting metal.
  102. 　上記第１の可溶導体又は第２の可溶導体の少なくともいずれか一方が、上記低融点金属と、上記高融点金属とが積層された積層構造である請求項９８記載の短絡素子。 99. The short circuit element according to claim 98, wherein at least one of the first soluble conductor and the second soluble conductor has a laminated structure in which the low melting point metal and the high melting point metal are laminated.
  103. 　上記第１の可溶導体又は第２の可溶導体の少なくともいずれか一方が、上記低融点金属と、上記高融点金属とが交互に積層された４層以上の多層構造である請求項９８記載の短絡素子。 99. At least one of the first soluble conductor and the second soluble conductor has a multilayer structure of four or more layers in which the low melting point metal and the high melting point metal are alternately laminated. Short circuit element.
  104. 　上記第１の可溶導体又は第２の可溶導体の少なくともいずれか一方が、内層を構成する低融点金属の表面を、高融点金属にてストライプ状に部分的に積層する請求項９８記載の短絡素子。 99. The method according to claim 98, wherein at least one of the first soluble conductor and the second soluble conductor partially laminates the surface of the low melting point metal constituting the inner layer in a stripe shape with the high melting point metal. Short circuit element.
  105. 　上記第１の可溶導体又は第２の可溶導体の少なくともいずれか一方が、多数の開口部を
    有する高融点金属と、上記開口部に挿入された低融点金属とからなる請求項９８記載の短絡素子。     99. The method according to claim 98, wherein at least one of the first soluble conductor and the second soluble conductor is composed of a high melting point metal having a large number of openings and a low melting point metal inserted into the openings. Short circuit element.
  106. 　上記第１の可溶導体又は第２の可溶導体の少なくともいずれか一方の低融点金属の体積が、高融点金属の体積よりも多い請求項９８記載の短絡素子 99. The short-circuit element according to claim 98, wherein the volume of the low melting point metal of at least one of the first soluble conductor and the second soluble conductor is larger than the volume of the high melting point metal.
  107. 　スイッチと、
    　上記スイッチの一端に接続された第１のヒューズと、
    　上記第１のヒューズの開放端に接続された第１の発熱抵抗体と、
    　上記スイッチの開放端と直列に接続された第２、第３のヒューズと、
    　上記第２、第３のヒューズの接続点に接続された第２の発熱抵抗体とを備え、
    　上記第２の発熱抵抗体の発熱により上記第２、第３のヒューズが溶断され、
    　上記第１の発熱抵抗体の発熱により上記第１のヒューズが溶断されることにより、該第１のヒューズの溶融導体によって上記スイッチが短絡される短絡素子回路。     A switch,
    A first fuse connected to one end of the switch;
    A first heating resistor connected to the open end of the first fuse;
    Second and third fuses connected in series with the open end of the switch;
    A second heating resistor connected to the connection point of the second and third fuses,
    The second and third fuses are blown by heat generated by the second heating resistor,
    A short-circuit element circuit in which the switch is short-circuited by a molten conductor of the first fuse when the first fuse is blown by heat generation of the first heating resistor.
  108. 　スイッチと、上記スイッチの一端に接続された第１のヒューズと、上記第１のヒューズの開放端に接続された第１の発熱抵抗体と、上記スイッチの開放端と直列に接続された第２、第３のヒューズと、上記第２、第３のヒューズの接続点に接続された第２の発熱抵抗体とを備え、上記第２の発熱抵抗体の発熱により上記第２、第３のヒューズが溶断され、上記第１の発熱抵抗体の発熱により上記第１のヒューズが溶断されることにより、該第１のヒューズの溶融導体によって上記スイッチが短絡される短絡素子と、
    　電子部品と、
    　上記電子部品の異常を検知し、異常信号を出力する保護部品と、
    　上記保護部品の異常信号を受けて動作する第１、第２の制御素子とを備え、
    　上記第２、第３のヒューズと上記電子部品とを直列に接続して電流経路を構成し、
    　上記スイッチと上記第１のヒューズとの接続点を上記電子部品の開放端にバイパスするように接続し、
    　上記第１の発熱抵抗体の開放端に上記第１の制御素子を接続し、
    　上記第２の発熱抵抗体の開放端に上記第２の制御素子を接続し、
    　上記電子部品の異常時には、上記保護部品からの異常信号を受けて上記第１、第２の制御素子が動作し、上記電子部品の電流経路の遮断と、上記第１のヒューズの溶断に連動した上記スイッチの短絡を行い、バイパス電流経路が形成される補償回路。     A switch; a first fuse connected to one end of the switch; a first heating resistor connected to the open end of the first fuse; and a second connected in series to the open end of the switch. , A third fuse and a second heating resistor connected to a connection point of the second and third fuses, and the second and third fuses are generated by the heat generated by the second heating resistor. A short-circuit element in which the switch is short-circuited by a molten conductor of the first fuse by fusing the first fuse due to heat generation of the first heating resistor,
    Electronic components,
    A protective component that detects an abnormality of the electronic component and outputs an abnormality signal;
    First and second control elements that operate in response to an abnormality signal of the protective component,
    A current path is formed by connecting the second and third fuses and the electronic component in series,
    Connecting the connection point of the switch and the first fuse so as to bypass the open end of the electronic component;
    Connecting the first control element to the open end of the first heating resistor;
    Connecting the second control element to the open end of the second heating resistor;
    When the electronic component is abnormal, the first and second control elements operate in response to an abnormal signal from the protective component, and are linked to the interruption of the current path of the electronic component and the fusing of the first fuse. A compensation circuit in which a bypass current path is formed by short-circuiting the switch.
  109. 　上記保護部品及び上記第１、第２の制御素子を制御することにより、上記電子部品の電流経路の遮断を行い、その後上記短絡素子による上記バイパス電流経路を形成する請求項１０８に記載の補償回路。 The compensation circuit according to claim 108, wherein the current path of the electronic component is interrupted by controlling the protection component and the first and second control elements, and then the bypass current path is formed by the short-circuit element. .
  110. 　上記電子部品は、異常時に電気的短絡又は熱暴走を伴うバッテリセルである請求項１０８記載の補償回路。 109. The compensation circuit according to claim 108, wherein the electronic component is a battery cell accompanied by an electrical short circuit or thermal runaway in the event of an abnormality.
  111. 　上記バイパス電流経路上に、上記電子部品の内部抵抗相当の保護抵抗が接続されている請求項１０８乃至請求項１１０記載の補償回路。 111. The compensation circuit according to claim 108, wherein a protective resistance corresponding to an internal resistance of the electronic component is connected on the bypass current path.
  112. 　スイッチと、
    　上記スイッチの一端に接続された第１のヒューズと、
    　上記第１のヒューズの開放端に接続された第１の発熱抵抗体と、
    　上記スイッチと上記第１のヒューズとの接続点と接続された保護抵抗と、
    　上記スイッチの開放端と直列に接続された第２、第３のヒューズと、
    　上記第２、第３のヒューズの接続点に接続された第２の発熱抵抗体とを備え、
    　上記第２の発熱抵抗体の発熱により上記第２、第３のヒューズが溶断され、
    　上記第１の発熱抵抗体の発熱により上記第１のヒューズが溶断されることにより、該第１のヒューズの溶融導体によって上記スイッチが短絡される短絡素子回路。     A switch,
    A first fuse connected to one end of the switch;
    A first heating resistor connected to the open end of the first fuse;
    A protective resistor connected to a connection point between the switch and the first fuse;
    Second and third fuses connected in series with the open end of the switch;
    A second heating resistor connected to the connection point of the second and third fuses,
    The second and third fuses are blown by heat generated by the second heating resistor,
    A short-circuit element circuit in which the switch is short-circuited by a molten conductor of the first fuse when the first fuse is blown by heat generation of the first heating resistor.
  113. 　スイッチと、上記スイッチの一端に接続された第１のヒューズと、上記第１のヒューズの開放端に接続された第１の発熱抵抗体と、上記スイッチと上記第１のヒューズとの接続点と接続された保護抵抗と、上記スイッチの開放端と直列に接続された第２、第３のヒューズと、上記第２、第３のヒューズの接続点に接続された第２の発熱抵抗体とを備え、上記第２の発熱抵抗体の発熱により上記第２、第３のヒューズが溶断され、上記第１の発熱抵抗体の発熱により上記第１のヒューズが溶断されることにより、該第１のヒューズの溶融導体によって上記スイッチが短絡される短絡素子と、
    　電子部品と、
    　上記電子部品の異常を検知し、異常信号を出力する保護部品と、
    　上記保護部品の異常信号を受けて動作する第１、第２の制御素子とを備え、
    　上記第２、第３のヒューズと上記電子部品とを直列に接続して電流経路を構成し、
    　上記保護抵抗の開放端を上記電子部品の開放端にバイパスするように接続し、
    　上記第１の発熱抵抗体の開放端に上記第１の制御素子を接続し、
    　上記第２の発熱抵抗体の開放端に上記第２の制御素子を接続し、
    　上記電子部品の異常時には、上記保護部品からの異常信号を受けて上記第１、第２の制御素子が動作し、上記電子部品の電流経路の遮断と、上記第１のヒューズの溶断に連動した上記スイッチの短絡を行い、バイパス電流経路が形成される補償回路。     A switch, a first fuse connected to one end of the switch, a first heating resistor connected to an open end of the first fuse, and a connection point between the switch and the first fuse A connected protection resistor; second and third fuses connected in series with the open end of the switch; and a second heating resistor connected to a connection point of the second and third fuses. And the second and third fuses are blown by the heat generated by the second heat generating resistor, and the first fuse is blown by the heat generated by the first heat generating resistor. A short-circuit element in which the switch is short-circuited by a fused conductor of a fuse;
    Electronic components,
    A protective component that detects an abnormality of the electronic component and outputs an abnormality signal;
    First and second control elements that operate in response to an abnormality signal of the protective component,
    A current path is formed by connecting the second and third fuses and the electronic component in series,
    Connect the open end of the protective resistor to bypass the open end of the electronic component,
    Connecting the first control element to the open end of the first heating resistor;
    Connecting the second control element to the open end of the second heating resistor;
    When the electronic component is abnormal, the first and second control elements operate in response to an abnormal signal from the protective component, and are linked to the interruption of the current path of the electronic component and the fusing of the first fuse. A compensation circuit in which a bypass current path is formed by short-circuiting the switch.
  114. 　上記保護部品及び上記第１、第２の制御素子を制御することにより、上記電子部品の電流経路の遮断を行い、その後上記短絡素子による上記バイパス電流経路を形成する請求項１１３に記載の補償回路。 114. The compensation circuit according to claim 113, wherein the current path of the electronic component is interrupted by controlling the protection component and the first and second control elements, and then the bypass current path is formed by the short-circuit element. .
  115. 　上記電子部品は、異常時に電気的短絡又は熱暴走を伴うバッテリセルである請求項１１３又は請求項１１４記載の補償回路。 115. The compensation circuit according to claim 113, wherein the electronic component is a battery cell accompanied by an electrical short circuit or thermal runaway in an abnormal state.
  116. 　上記絶縁基板には、上記可溶導体が設けられた面と同一面に、上記第１の電極と連続する第１の外部接続電極と、上記第１の外部接続電極上に設けられる１又は複数の第１の外部接続端子と、上記第２の電極と連続する第２の外部接続電極と、上記第２の外部接続電極上に設けられる１又は複数の第２の外部接続端子が形成され、
    　上記第１の電極と上記第２の電極とが短絡したときの、上記第１、第２の外部接続電極間の導通抵抗よりも、上記第１の外部接続端子と上記第２の外部接続端子との合成抵抗が低い請求項８６乃至請求項８８のいずれか１項に記載の短絡素子。     The insulating substrate has a first external connection electrode continuous with the first electrode on the same surface as the surface on which the soluble conductor is provided, and one or more provided on the first external connection electrode. A first external connection terminal, a second external connection electrode continuous with the second electrode, and one or a plurality of second external connection terminals provided on the second external connection electrode,
    The first external connection terminal and the second external connection terminal than the conduction resistance between the first and second external connection electrodes when the first electrode and the second electrode are short-circuited. The short circuit element according to any one of claims 86 to 88, which has a low combined resistance.
  117. 　上記外部接続端子が、金属バンプ又は金属ポストである請求項１１６記載の短絡素子。 117. The short-circuit element according to claim 116, wherein the external connection terminal is a metal bump or a metal post.
  118. 　上記金属バンプ又は金属ポストは、高融点金属の表面に低融点金属層が形成されている請求項１１７記載の短絡素子。 118. The short circuit element according to claim 117, wherein the metal bump or the metal post has a low melting point metal layer formed on the surface of the high melting point metal.
  119. 　上記高融点金属は銅又は銀を主成分とし、上記低融点金属は錫を主成分とする鉛フリー半田である請求項１１８記載の短絡素子。 119. The short-circuit element according to claim 118, wherein the refractory metal is lead-free solder containing copper or silver as a main component and the low-melting metal is mainly tin.
  120. 　上記外部接続端子が、錫を主成分とする鉛フリー半田からなる金属バンプである請求項１１６記載の短絡素子。 117. The short-circuit element according to claim 116, wherein the external connection terminal is a metal bump made of lead-free solder mainly composed of tin.
  121. 　短絡素子が実装対象物に実装された実装体において、
    　上記短絡素子は、
    　絶縁基板と、
    　上記絶縁基板に形成された第１及び第２の発熱抵抗体と、
    　上記絶縁基板に、互いに隣接して設けられた第１、第２の電極と、
    　上記絶縁基板に、上記第１の電極と隣接して設けられるとともに、上記第１の発熱抵抗体に電気的に接続された第３の電極と、
    　上記絶縁基板に、上記第２の電極と隣接して設けられるとともに、上記第２の発熱抵抗体に電気的に接続された第４の電極と、
    　上記第４の電極に隣接して設けられた第５の電極と、
    　上記第１、第３の電極間に亘って設けられることにより電流経路を構成し、上記第１の発熱抵抗体からの加熱により、上記第１、第３の電極間の上記電流経路を溶断する第１の可溶導体と、
    　上記第２から上記第４の電極を経由して上記第５の電極に亘って設けられることにより電流経路を構成し、上記第２の発熱抵抗体からの加熱により、上記第２の電極と上記第４の電極との間、及び上記第４の電極と上記第５の電極との間の各上記電流経路を溶断する第２の可溶導体と、
    　上記絶縁基板の上記第１、第２の電極が形成された面と同一表面に形成され、上記第１の電極と連続する第１の外部接続電極及び上記第２の電極と連続する第２の外部接続電極とを備え、
    　上記第１の電極が上記第１の外部接続電極上に接続された第１の外部接続端子を介して上記実装対象物と接続され、上記第２の電極が上記第２の外部接続電極上に接続された第２の外部接続端子を介して上記実装対象物と接続され、
    　上記第１、第２の発熱抵抗体からの加熱により溶融し、上記第１、第２の電極上に凝集した上記第１、第２の可溶導体によって、上記第１の電極と上記第２の電極とが短絡したときの、上記第１、第２の外部接続電極間の導通抵抗よりも、上記第１の外部接続端子と上記第２の外部接続端子との合成抵抗が低いことを特徴とする実装体。
          In the mounting body in which the short-circuit element is mounted on the mounting target,
    The short-circuit element is
    An insulating substrate;
    First and second heating resistors formed on the insulating substrate;
    First and second electrodes provided adjacent to each other on the insulating substrate;
    A third electrode provided on the insulating substrate adjacent to the first electrode and electrically connected to the first heating resistor;
    A fourth electrode provided on the insulating substrate adjacent to the second electrode and electrically connected to the second heating resistor;
    A fifth electrode provided adjacent to the fourth electrode;
    A current path is formed by being provided between the first and third electrodes, and the current path between the first and third electrodes is blown by heating from the first heating resistor. A first soluble conductor;
    A current path is formed by being provided across the fifth electrode through the second to fourth electrodes, and the second electrode and the above are heated by heating from the second heating resistor. A second soluble conductor that blows off each of the current paths between the fourth electrode and between the fourth electrode and the fifth electrode;
    A first external connection electrode that is formed on the same surface as the surface on which the first and second electrodes of the insulating substrate are formed and that is continuous with the first electrode and a second electrode that is continuous with the second electrode. With external connection electrodes,
    The first electrode is connected to the mounting object via a first external connection terminal connected on the first external connection electrode, and the second electrode is on the second external connection electrode. It is connected to the mounting object through the connected second external connection terminal,
    The first and second fusible conductors are melted by heating from the first and second heating resistors and aggregated on the first and second electrodes, so that the first electrode and the second electrode The combined resistance of the first external connection terminal and the second external connection terminal is lower than the conduction resistance between the first and second external connection electrodes when the electrode is short-circuited. An implementation body.
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WO2015037210A1 (en) * 2013-09-11 2015-03-19 デクセリアルズ株式会社 Switching circuit
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