WO2014119891A1

WO2014119891A1 - Light emitting diode package and manufacturing method therefor

Info

Publication number: WO2014119891A1
Application number: PCT/KR2014/000766
Authority: WO
Inventors: 김미숙; 선순요
Original assignee: Kim Mi Suk; Sun Sun Yo
Priority date: 2013-01-31
Filing date: 2014-01-28
Publication date: 2014-08-07
Also published as: KR101403247B1

Abstract

The present invention relates to a light emitting diode package. Particularly, the purpose of the present invention is to provide a light emitting diode package in which a reflection part, which is laminated on the upper surface of a base part having a light emitting diode chip mounted thereon, is formed integrally with the base part, and the reflection part and the base part are made of metal; and a manufacturing method therefor. For this purpose, the light emitting diode package according to the present invention comprises the metallic base part having a mounting section on which the light emitting diode chip is mounted; the metallic reflection part having a through hole in the center thereof and laminated on the upper surface of the base part in such a manner that the end of one side of the reflection part is bent in the state of being connected with the end of one side of the base part; a terminal part arranged in parallel with the base part and separated from the base part and the reflection part at regular intervals; and an insulator inserted between the base part and the terminal part and between the reflection part and the terminal part, thereby insulating and fixing the base part, the reflection part and the terminal part.

Description

Light emitting diode package and its manufacturing method

The present invention relates to a light emitting diode package and a method for manufacturing the same, and more particularly, to a light emitting diode package and a method for manufacturing the same having excellent heat dissipation effect.

The light emitting diode (LED) of the conventional PN type is semi-permanent and environmentally friendly, and its efficiency is superior to that of a conventional light source. Accordingly, backlights, landscapes, automobile lights and general lighting of liquid crystal displays are rapidly being replaced by light emitting diodes.

At present, most of the commercially available PN-type conventional light emitting diode packages are constructed. In the conventional light emitting diode package, a lead frame is separated into an anode and a cathode, and an insulator molding using an injection molding resin is coupled to the separated lead frame. Done.

In this case, the insulator molding serves as a reflector to insulate the polarizations of the lead frame and to reflect light generated from the light emitting diodes.

Subsequently, the molded lead frame is mounted with the anode and the cathode of the light emitting diode chip bonded to each of the polarization wires of the lead frame, and the insulator molding on which the light emitting diode chip is mounted is subjected to silicon molding to attach a lens. do.

Such a conventional light emitting diode is 70 to 80% of the supplied power is emitted as heat, and if the heat generated during this operation is not smooth, the efficiency and life will be drastically reduced.

Therefore, the most considered factor in the design of the conventional light emitting diode is the development of a light emitting diode package having a low thermal resistance for high power illumination.

However, at present, since the insulator molding that separates the polarization of the lead frame serves as a reflector, the conventional light emitting diode serves as a peeling phenomenon and reflector due to plastic deterioration of the insulator molding due to an increase in temperature when the light emitting diode is driven. This results in problems such as a decrease in luminance due to discoloration of the insulator molding, and an expensive manufacturing cost when the insulator molding is composed of a ceramic.

Meanwhile, in the case of a conventional light emitting diode for improving heat dissipation performance by improving thermal conductivity of a lead frame, a metal such as copper (Cu) or aluminum (Al) having high thermal conductivity is used to maximize heat dissipation characteristics of a light emitting diode package. do.

As an example of such a conventional light emitting diode package, in the prior art of the Republic of Korea Patent Publication No. 10-2009-0046316, the metal powder is injected and mixed with an organic binder, and then the light emitting diode package is improved while removing the binder and sintering. In this case, a simple injection molding alone does not produce a smooth appearance, and the manufacturing process is expensive due to the problem of re-adjusting the dimensions of the appearance by the secondary processing, and impurities in the metal molding remain to reduce the heat transfer characteristics. The problem of bringing, and the lead frame used as an electrode, and the problem of having to manufacture a housing part surrounding the lead frame separately.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, wherein a reflecting portion stacked on an upper surface of a base portion on which a light emitting diode chip is mounted is integrally formed with the base portion, and the reflecting portion and the base portion are formed of metal. Another object of the present invention is to provide a light emitting diode package and a method of manufacturing the same.

According to an aspect of the present invention, there is provided a light emitting diode package including: a base part of a metal material having a mounting part on which a light emitting diode chip is mounted; A through hole is formed in the central portion, and one side end is bent in a state connected to one end of the base portion, and a metal reflective portion stacked on the top surface of the base portion; A terminal part disposed to be parallel to the base part and spaced apart from the base part and the reflecting part at a predetermined interval; And an insulator inserted between the base part and the terminal part and between the reflecting part and the terminal part to insulate and fix the base part, the reflecting part and the terminal part.

According to an aspect of the present invention, there is provided a method of manufacturing a light emitting diode package according to an embodiment of the present invention, comprising: a strip of metal plate material, a housing connected to the metal plate material by a first support part, and a second support part spaced apart from the housing; Forming a terminal portion connected to the metal plate material by; Bending one side of the housing to form a base part on which a light emitting diode chip is mounted, and stacking a reflector on which a through hole is formed on the base part; And molding the base, the reflecting portion and the terminal portion with an insulator to integrally form the base, the reflecting portion, and the terminal portion.

The present invention has the following effects.

First, since the base part and the reflecting part accommodating the light emitting diode chip are connected to a metal material such as Cu or Al, the heat dissipation through the large-area heat dissipation housing formed integrally with the base part and the reflecting part is excellent. The reflector does not deform or deteriorate.

Second, the surface of the reflector which functions as a reflector is plated with Al having good light reflectance in visible and ultraviolet regions, or Ag having excellent light reflectance in the visible region, thereby increasing light emission efficiency to the outside. You can. In particular, when the base portion and the reflective portion forming the housing are formed of Al, it is possible to use the plating without mirror processing during the housing processing.

Third, since the base portion and the reflecting portion can be manufactured integrally by using a stamping and bending process, the number of press processes can be reduced. That is, in the present invention, since the base portion and the reflecting portion are formed on one metal plate, and can be simultaneously formed in one process through bending bonding, the number of manufacturing processes can be reduced.

Fourth, since the reflector (Reflector) made of plastic (Plastic) is formed of a reflector made of a metal material, durability and strength can be improved.

Fifth, since the housing forming the base part and the reflecting part is formed in a state in which the terminal part and the one metal plate are separated from each other, and can be integrally formed by an insulator, the manufacturing process can be simplified.

1 is a perspective view of the upper end of the LED package according to the present invention.

FIG. 2 is a bottom perspective view of the light emitting diode package shown in FIG. 1. FIG.

3 is an exemplary view in which the state in which the light emitting diode package is processed according to the light emitting diode package manufacturing method according to the present invention is sequentially displayed.

Figure 4 is an exemplary view for explaining a method of forming a housing and a terminal portion of the light emitting diode package manufacturing method according to the present invention.

5 is an exemplary view for explaining a method of forming a through hole in the method of manufacturing a light emitting diode package according to the present invention.

Figure 6 is an exemplary view for explaining a method of forming the insulator insertion surface of the light emitting diode package manufacturing method according to the present invention.

Figure 7 is an exemplary view for explaining a method of bending one end of the housing of the light emitting diode package manufacturing method according to the present invention.

8 is an exemplary view for explaining a state of bending the housing of the light emitting diode package manufacturing method according to the present invention.

9 is an exemplary view for explaining a method of stacking a reflector on the upper surface of the base portion by bending the housing of the light emitting diode package manufacturing method according to the present invention.

10 is an exemplary view for explaining a method of plating the surface of the base portion and the reflecting portion of the light emitting diode package manufacturing method according to the present invention.

11 is an exemplary view for explaining a method of insulating between a base portion and a terminal portion and between a reflecting portion and a terminal portion in a method of manufacturing a light emitting diode package according to the present invention.

12 is an exemplary view showing a state in which a light emitting diode chip is mounted on a light emitting diode package according to the present invention manufactured according to the light emitting diode package manufacturing method according to the present invention.

13 and 14 are exemplary views showing various forms of through-holes forming the light emitting diode package according to the present invention manufactured according to the light emitting diode package manufacturing method according to the present invention.

15 is a variety of perspective view showing another embodiment of a light emitting diode package according to the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description, when the various embodiments are described, the same components will be denoted by the same reference numerals, and redundant description thereof will be omitted.

1 is a perspective view of the upper end of the LED package according to the present invention, Figure 2 is a perspective view of the lower end of the LED package shown in FIG.

As shown in FIGS. 1 and 2, the light emitting diode package according to the present invention includes a base portion 100 in which a mounting portion 110 on which a light emitting diode chip is mounted, and a through hole 210 in a central portion thereof. Is formed, one end is bent in a state connected to one end of the base portion 100, parallel to the reflecting portion 200, the base portion 100 stacked on the upper surface of the base portion 100 The terminal unit 300, which is spaced apart from the base unit 100 and the reflecting unit at a predetermined interval, and between the base unit 100 and the terminal unit 300, and the reflecting unit 200 and the terminal unit ( It is inserted between the 300, and includes an insulator 400 for insulating and fixing the base portion 100, the reflecting portion 200 and the terminal portion 300.

First, the base part 100 has a mounting part 110 on which the light emitting diode chip is mounted.

The base unit 100 is connected to the first electrode of the light emitting diode chip through a wire. That is, since the base part 100 is made of metal, the base part 100 may be connected to the first electrode of the light emitting diode chip to supply power to the light emitting diode chip.

As shown in FIGS. 1 and 2, a base protruding from the side of the base part 100 so that an external power supply terminal and the base part 100 can be easily connected to the base part 100. The external terminal 120 may be formed. That is, since the base part 100 is made of metal, any part of the base part 100 may be connected to an external power supply terminal, but in particular, may be connected through the base outer terminal 120. .

In addition, since the base part 100 is formed of a metal, the base part 100 may perform a function of releasing heat generated from the light emitting diode chip to the outside.

Although the base part 100 is illustrated in a rectangular plate shape in FIGS. 1 and 2, the shape of the base part 100 may be variously modified.

Next, in the state in which the reflector 200 is integrally formed with the base part 100, the reflector 200 is bent to the top of the base part 100 and stacked on the top surface of the base part 100.

The through hole 210 is formed in the center of the reflector 200. The through hole 210 has a light emitting diode chip mounted on the mounting portion 100 formed on the base portion 100 while the reflecting portion 200 is stacked on the upper surface of the base portion 100. It is formed in the shape surrounding.

The inner diameter of the through hole 210 is formed to increase in the direction away from the contact surface where the reflecting portion 200 and the base portion 100 abut. That is, in FIG. 1, the inner diameter of the through hole 210 is the minimum at the contact surface where the reflector 200 and the base part 100 come into contact with each other, and is formed to increase toward the upper end. Here, the through hole 210 may be formed in various forms including not only a circle but also a quadrangle as shown in FIG. 1, wherein the inner diameter is based on an inner diameter of the polygon or a center point of the polygon. It is the spacing between the facing inner faces.

By the inclined surface 220 having the inner diameter as described above, the light emitted from the light emitting diode chip can be efficiently reflected in the upper direction.

In addition, since the reflector 200 is formed of a metal, it may perform a function of emitting heat generated from the light emitting diode chip to the outside.

Next, the terminal part 300 is spaced apart from the base part 100 and the reflecting part 200 at regular intervals.

The terminal unit 300 is connected to the second electrode of the light emitting diode chip through a wire. That is, since the terminal part 300 is formed of metal similarly to the base part 100, the terminal part 300 may be connected to the second electrode of the light emitting diode chip to supply power to the light emitting diode chip.

As shown in FIGS. 1 and 2, the terminal portion 300 protrudes from the side of the terminal portion 300 so that an external power supply terminal and the terminal portion 300 can be easily connected to the terminal portion 300. 310 may be formed. That is, since the terminal part 300 is made of metal, any part of the terminal part 300 may be connected to an external power supply terminal, but in particular, the terminal part 300 may be connected to the external terminal 310.

In addition, since the terminal unit 300 is formed of a metal, it may perform a function of dissipating heat generated from the light emitting diode chip to the outside.

The base part 100, the reflecting part 200, and the terminal part 300 may be selected from metals such as copper, aluminum, zinc, and nickel having high thermal conductivity.

In particular, since the base part 100, the reflecting part 200 and the terminal part 300 are processed from one metal plate, the above components are formed of the same metal.

The metal plate may be formed of any kind of conductive metal, such as copper (Cu), aluminum (Al), or an alloy thereof.

Next, the insulator 400 is inserted between the base part 100 and the terminal part 300, and between the reflecting part 200 and the terminal part 300, and the base part 100 and the reflecting part. It performs a function of insulating and fixing the 200 and the terminal 300.

That is, the insulator 400 includes the base part 100 connected to the first electrode of the light emitting diode chip and the reflector 200 integrally formed with the base part 100 of the light emitting diode chip. While performing the function of insulating the terminal portion 300 connected to the second electrode, it improves the coupling force of the components, thereby performing the function to be integrally combined. To this end, the insulator 400 may be formed along the periphery of the base part 100, the reflecting part 200, and the terminal part 300, as shown in FIGS. 1 and 2.

The insulator 400 may be made of a thermoplastic resin such as LCP, PCT, or PA (nylon), and a thermosetting resin such as silicon and epoxy. In addition, the insulator 400 may be formed of glass frit.

In addition, as a molding method for coupling the insulator 400 to the base part 100, the reflecting part 200, and the terminal part 300, a method of coating a material as described above using an insert molding method. Alternatively, a method of dispensing the material as described above may be applied.

In the light emitting diode package according to the present invention as described above, the reflective part 200 formed of a metal is stacked on the base part 100 formed of a metal.

Therefore, since all the components arranged closest to the light emitting diode chip are arranged with a thermally conductive metal, the area for dissipating heat generated from the light emitting diode chip is maximized, so that the heat dissipation performance is significantly larger than that of the conventional light emitting diode package. Can be improved.

For this reason, the light emitting diode package according to the present invention can maximize heat dissipation performance and prevent degradation of the light emitting diode chip, thereby extending the life of the light emitting diode chip.

On the contrary, in the conventional LED package, only a portion where the LED chip is seated is formed of a metal, and since the injection molding material is made of plastic near the side of the LED chip, the heat dissipation efficiency is lower than that of the LED package according to the present invention. Nothing else but to do.

Finally, a plating layer may be formed on the surface of the base part 100 and the surface of the reflecting part 200, in particular, the inclined surface 220. In addition, a plating layer may be formed on the surface of the terminal unit 300.

The plating layer may be formed of any one of metals such as aluminum (Al), gold (Au), silver (Ag), nickel (Ni), zinc (Zn), and the like. As a result, the efficiency of light reflected from the light emitting diode chip mounted on the surface of the base part 100 is reflected by the base part 100, the reflecting part 200, and the terminal part 300. The amount of light guided to the upper end of the reflector 200 may be increased.

In particular, since the plating layer is formed on the metal surface, the plating layer is not deformed or degraded even by heat generated from the light emitting diode chip. In the conventional light emitting diode package, since the plating layer is formed in the plastic housing, the plating layer is easily deteriorated by heat generated from the light emitting diode chip.

Hereinafter, a method of manufacturing a light emitting diode package according to the present invention will be described. In the following description, the content overlapping with the description of the light emitting diode package is omitted or simply described.

FIG. 3 is an exemplary view sequentially showing a state in which a light emitting diode package is processed according to a light emitting diode package manufacturing method according to the present invention, and FIG. 4 shows a housing and a terminal portion of the light emitting diode package manufacturing method according to the present invention. 5 is an exemplary view for explaining a method, Figure 5 is an exemplary view for explaining a method for forming a through hole in the light emitting diode package manufacturing method according to the invention, Figure 6 is an insulator in the light emitting diode package manufacturing method according to the present invention 7 is an exemplary view for explaining a method of forming an insertion surface, Figure 7 is an exemplary view for explaining a method of bending one end of the housing of the light emitting diode package manufacturing method according to the present invention, Figure 8 is a light emission according to the present invention Exemplary diagram for explaining a state of bending the housing of the diode package manufacturing method, Figure 9 is a present invention FIG. 10 is an exemplary view illustrating a method of bending a housing and stacking a reflective part on an upper surface of a base part of the method of manufacturing a light emitting diode package according to the present invention, and FIG. 10 illustrates surfaces of a base part and a reflective part of a method of manufacturing a light emitting diode package according to the present invention. FIG. 11 is an exemplary view for explaining a plating method, and FIG. 11 is an exemplary view for explaining a method of insulating between a base part and a terminal part and between a reflecting part and a terminal part in the method of manufacturing a light emitting diode package according to the present invention. FIG. 13 is a view illustrating a state in which a light emitting diode chip is mounted on a light emitting diode package according to the present invention manufactured according to the method of manufacturing a light emitting diode package according to the present invention. FIGS. 13 and 14 illustrate a method of manufacturing a light emitting diode package according to the present invention. A variety of through-holes forming the light emitting diode package according to the present invention manufactured according to An exemplary view showing the shape.

In the method of manufacturing a light emitting diode package according to the present invention, the metal plate 900 is stripped and connected to the metal plate 900 by the first support part 130 to the housing 910 and the housing 910. Forming a terminal part 300 connected to the metal plate 900 by the second support part 140 in a spaced apart state (S702 to S708), and bending the side ends of the housing 910 to emit light at the bottom; Forming a base part 100 on which a diode chip is mounted, and stacking the reflective part 200 having the through-hole 210 formed on the base part 100 (S710, S712) and the base ( 100 and the reflector 200 and the terminal 300 are molded by an insulator 400 to integrally form the base 100, the reflector 200, and the terminal 300. Steps.

3 is an exemplary view sequentially showing a state in which a light emitting diode package is processed according to the light emitting diode package manufacturing method according to the present invention, wherein the light emitting diode package according to the present invention is a metal as shown in FIG. It may be formed by the processing of the plate member 900. The metal plate 900 may be formed of various metals as described above.

First, the metal sheet 900 is stripped, and the housing 910 is connected to the metal sheet 900 by the first support 130, and the second support portion is spaced apart from the housing 910. Forming the terminal unit 300 connected to the metal plate 900 by the step (S702 to S708) may include the following detailed steps.

First, as shown in FIG. 4, in the step S702 of forming the housing 910 and the terminal portion 300 in the metal plate 900, the housing 910 is formed by stripping the metal plate 900. ) And the terminal portion 300 is formed. In this case, the housing 910 is connected to the metal plate 900 by the first support 130, and the terminal portion 300 is connected to the metal plate 900 by the second support 140. It is.

That is, when the housing 910 and the terminal portion 300 are stripped, the housing 910 and the terminal portion 300 may be stripped in a form in which a part of the housing 910 and the terminal portion 300 are not completely separated from the metal plate 900. have.

In this case, as the strip method, sheet metal processing stamping using a press die, or cutting processing may be applied.

On the other hand, by the strip process, the housing 910 and the terminal portion 300 is formed in the metal plate 900 in a completely separated state.

Second, as shown in FIG. 5, in the forming of the through hole 210 in the housing 910 (S704), one side of the housing 910 that is not connected to the first support part 130. The through hole 210 is formed in the.

As described above, the inner diameter of the through hole 210 may be formed to increase in the direction away from the contact surface where the reflector 200 and the base portion 100 abut.

In addition, the through hole 210 may be formed in a quadrangular shape, as shown in FIGS. 1 to 12, but may be formed in a circular shape as shown in FIG. 13, and a hexagon as shown in FIG. 14. It may be formed in the form, in addition to it may be formed in various forms.

Third, as illustrated in FIG. 6, in the forming of the insulator insertion surface 230 by processing any one of the surfaces forming the through hole, the housing may include the housing, among the edges surrounding the through hole. The step of reducing the thickness of the insulator insertion surface 230 is performed such that the insulator insertion surface 230 facing the terminal portion does not contact the terminal portion 300 in the step of bending the side end of the 900. The process may be performed by a cutting method or a pressing method.

Fourth, as shown in FIG 7, in the step (S708) of bending the one end 240 of the housing 910, the housing 910, the reflecting portion 200 and the base portion formed by the bending of the In order to increase the adhesion of the 100, a process of bending one end 240 of the housing 910 is performed. That is, the one end 240 is an end of the reflecting unit 200 formed through the bending step, the one end 240 is in contact with the base portion 100.

Next, the side end of the housing 900 is bent to form a base part 100 on which a light emitting diode chip is mounted, and a reflecting part in which a through hole 210 is formed on the base part 100. Steps S710 and S712 of stacking 200 may include the following detailed steps.

First, as shown in FIG. 8, a process of bending one side of the housing 910 that is not connected to the first support 130 is performed. In the bending process, a stamping process or a bending process may be applied.

Second, as shown in FIG. 9, a process of bringing the reflective part 200 bent through the process of the housing 910 into close contact with the top surface of the base part 100 is performed.

The bending process as described above may be carried out by the airing method.

Finally, the base 100, the reflecting unit 200, and the terminal unit 300 are molded by an insulator 400 to form the base 100, the reflecting unit 200, and the terminal unit 300. ) May be integrally formed as follows.

First, as shown in FIG. 10, in the state where the reflector 200 is bent and stacked on the top surface of the base 100, the base unit 100, the reflector 200, and the terminal unit ( A process of forming the plating layer 500 on the surface of 300 may be performed.

As described above, the plating layer 500 may be formed using a metal such as aluminum, gold, or silver, and may be formed using at least one of electroplating, sputter deposition, vacuum deposition, and spray deposition. Can be. The plating layer 500 may be formed by forming a plating layer 500 having a high reflectance of light on the surfaces of the base part 100, the reflector 200, and the terminal part 300, thereby maximizing light emission performance. It is performed for the purpose. Conventionally, since a plastic housing is used, a metal surface with good reflectance cannot be formed as in the present invention.

Second, as shown in FIG. 11, a process of insulating and bonding between the base part 100 and the terminal part 300 and between the reflecting part 200 and the terminal part 300 with an insulator is performed.

The insulator 400 is formed between the base part and the terminal part 410, between the reflecting part 200 and the terminal part 300, and on the outer surface 430 of the base part and the terminal part and the reflecting part. Can be.

In addition to the molding step of forming the insulator, the base part 100, the reflection part 200, and the terminal part 300, the components are integrally formed. Here, since the molding method has been described above, it will not be repeated.

In the method of manufacturing a light emitting diode package according to the present invention as described above, since all components except the insulator 400 are formed of metal, heat dissipation performance may be maximized.

In addition, conventionally, in order to maximize heat dissipation performance, a separate metal is laminated or a lamic housing is formed. However, in the method of manufacturing a light emitting diode package according to the present invention, since a method of bending a metal of high purity is used, light emission requiring high heat radiation is required. In manufacturing the diode, the manufacturing cost can be significantly reduced.

In addition, in the method of manufacturing a light emitting diode package according to the present invention, since the reflector 200 forming one side end of the housing 910 is bent and stacked on the top surface of the base part 100, Since the pressing process is reduced than in the conventional case, the manufacturing cost can be reduced.

12 illustrates a state in which the LED chip 800 is mounted in the LED package according to the present invention manufactured by the LED package manufacturing method as described above.

As described above, the first electrode of the LED chip 800 may be connected to the base part 100 through a first wire 810, and the second electrode may be connected to the terminal part 300 by a second wire ( The base unit 100 and the terminal unit 300 may be connected to an external power supply terminal to supply power to the first electrode and the second electrode.

15 is a perspective view showing another embodiment of a light emitting diode package according to the present invention. Among these, (a) and (b) show another type of light emitting diode package, (a) shows a state before the insulator is formed, and (b) shows a state where the insulator is formed. In addition, (c) and (d) also shows another type of light emitting diode package, (c) shows a state before the insulator is formed, (d) shows a state in which the insulator is formed.

On the other hand, the configuration of the light emitting diode package according to the present invention shown in Figure 15, the configuration of the other light emitting diode package in accordance with the present invention described above is almost the same, can be manufactured by the light emitting diode package manufacturing method described above have. Therefore, hereinafter, only the light emitting diode package described above and a method and a structure other than the manufacturing method thereof will be described.

First, in the light emitting diode package described with reference to FIGS. 1 to 14, the base external terminal 120 is based on the mounting unit 110 on which the light emitting diode chip 800 is mounted. Although formed in a direction perpendicular to the direction, the light emitting diode package illustrated in FIG. 15 is formed such that the base outer terminal 120 faces the terminal outer terminal 130.

Accordingly, the base portion outer terminal 120 is connected to the first support portion 130 facing the second support portion 140 on the metal plate 900.

In addition, the shape of the base outer terminal 120 and the terminal outer terminal 310 to be applied to the light emitting diode package shown in (a) and (b) of FIG. have. The base outer terminal 120 and the terminal outer terminal 310 applied to the present invention may be configured in various forms in addition to those shown in FIGS. 1 and 15 (a) and (b).

Meanwhile, in the light emitting diode package illustrated in FIG. 15, the base outer terminal 120 and the first support part 130 face the terminal outer terminal 310 and the second support part 140. Since the reflector 200 is not formed as shown in FIG. 8, the reflector 200 may not be bent.

Instead, in the light emitting diode package illustrated in FIG. 15, the reflector 200 is bent in a vertical direction of a straight line formed by the base outer terminal 120 and the terminal outer terminal 310.

The present invention as described above is summarized as follows.

The light emitting diode package according to the present invention is to solve the problems of the conventional plastic leaded chip carrier (PLCC) package, in which a high-efficiency, high-rigidity metal housing (base portion and reflecting portion) is insulated by plastic. It is formed in a configuration.

The light emitting diode manufacturing method according to the present invention uses a metal plate material such as Cu or Al and a stamping bending bonding process, and relates to a method for manufacturing and manufacturing a high reliability package having excellent high temperature reliability, that is, excellent heat dissipation characteristics. will be.

That is, according to the present invention, the metal material may be molded by using a stamping molding method to integrally manufacture the base part 100 on which the light emitting diode chip is mounted and the reflecting part 200 which functions as a reflector. . For example, after forming the reflector 200 by extending the housing 910 in which the bay part and the reflector are to be formed, the reflector 200 is bent to be joined to the base part 100, and the upper end of the base part is formed. On the surface, instead of a plastic reflector, a reflector 200 formed of metal is formed.

In the present invention, since the reflective part 200 formed of the metal and the base part 100 are integrated, the cross-sectional area of the metal heat dissipation part can be maximized, and the reflective part 200 is made of metal instead of plastic, which is susceptible to heat. Since it is reinforced, the problem of deformation by heat can be solved.

That is, according to the present invention, the manufacturing cost can be significantly reduced, and by using a high purity material, the heat dissipation effect can be maximized.

To summarize the features of the present invention, it can be divided into three as follows.

First, in the present invention, since the metal surrounds the slope of the organic light emitting diode package, when the light emitting diode chip is mounted and used, deformation of the cup shape due to an increase in temperature can be fundamentally prevented (conventional light emitting diode package). Is plastic and will deform with increasing temperature). In addition, since the organic light emitting diode package according to the present invention is manufactured using the metal plate material 900 having the same thickness, heat dissipation characteristics may be improved by maximizing the area of the metal having good thermal conductivity.

Second, in the organic light emitting diode package according to the present invention, the base part 100 and the reflecting part 200 are integrally formed. That is, the reflecting unit 200 and the base unit 100 are integrally connected and bent therebetween, so that the reflecting unit 200 is integrally laminated on the top surface of the base unit 100 without separation. Can be.

In addition, the depth, that is, the thickness of the reflector 200 may be adjusted according to the shape of the light emitting diode chip. That is, the reflective part 200 and the base part 100 are integrally formed, but only the reflective part 200 is processed by pressing or cutting, such that the thickness of the reflective part 200 is The base portion 100 may have a different thickness.

In addition, the base portion and the reflecting portion are connected by the same metal material to form a single body, and may be bent and joined one or more times.

In addition, the shape of the through hole 210 formed in the reflector 200 may be formed in a polygon, such as a triangle, a quadrangle, a pentagon, a hexagon, an octagon, a decagon, or a circle or an ellipse.

In addition, the base part 100 and the terminal part 300 are separated by an insulator 400.

In addition, in order to solder the PCB, the terminal part 300 may be formed to be spaced apart from the base part 100 in the through hole, or the terminal part outer terminal 310 formed to extend outside the through hole. It may also include.

In addition, since the size of the base unit 100 may be changed according to the number of light emitting diode chips 800 to be mounted, all types of light emitting diode chips from Single Chip to Multi Chip may be applied.

In addition, a space in which the insulator 400 may be inserted is formed between the reflective part 200 and the terminal part 300 and between the base part 100 and the terminal part 300.

Third, in the method of manufacturing an organic light emitting diode according to the present invention, the base part 100 and the reflecting part 200 are simultaneously formed in a metal plate material 900 using a press die, and then the reflecting part 200 is formed. ) Is bent and stacked on the top surface of the base part 100, and the terminal part 300 may also be formed together with the base part 100 and the reflecting part 200 in the metal plate 900. .

In addition, by using a mold, the shape of the bonding and bending of the reflector, and the angle of the inclined surface of the reflector can be freely adjusted.

In addition, as the material of the metal plate 900, Cu, Al, Mg or their compounds and all metals having excellent mechanical properties and excellent thermal conductivity may be applied.

In addition, the surface of the base portion 100, the reflecting portion 200 and the terminal portion 300 may be plated with Al, Ag, Au, etc. to a predetermined thickness to increase the light emission effect, the electroplating method as a plating method , Sputtering, vacuum deposition, spraying, etc. may be applied.

In addition, as the insulator 400, all thermoplastic resins such as LCP, PCT, and PA, and all thermosetting resins such as silicon and epoxy, or glass frit may be used. The insulator 400 may be coated by insert molding. How to. It may be injected between the base portion 100 and the terminal portion 300, the reflecting portion 200, the terminal portion 300, or the like through a method of dispensing the insulator.

The invention thus described is merely illustrative. Therefore, it will be understood that the present invention is not limited to the forms mentioned in the detailed description above. Therefore, the technical protection scope of the present invention will be defined by the technical spirit of the appended claims. That is, the technical protection scope of the present invention should be construed to include modifications, equivalents, and substitutes for the components described in the above embodiments.

Claims

A base portion of a metal material having a mounting portion on which a light emitting diode chip is mounted;

A through hole is formed in the central portion, and one side end is bent in a state connected to one end of the base portion, and a metal reflective portion stacked on the top surface of the base portion;

A terminal part disposed to be parallel to the base part and spaced apart from the base part and the reflecting part at a predetermined interval; And

And an insulator inserted between the base part and the terminal part and between the reflecting part and the terminal part to insulate and fix the base part, the reflecting part and the terminal part.
The method of claim 1,

The base portion is connected to the first electrode of the light emitting diode chip,

The terminal unit is connected to the second electrode of the LED chip.
The method of claim 1,

A light emitting diode package, characterized in that the plating layer is formed on the surface of the base portion and the surface of the reflecting portion.
The method of claim 1,

The light emitting diode package according to claim 1, wherein the through hole surrounds the mounting unit in a state in which the reflecting unit is stacked on an upper surface of the base unit.
The method of claim 1,

The inner diameter of the through hole is larger in the direction away from the contact surface where the reflecting portion and the base portion abut, the light emitting diode package.
Stripping a metal plate to form a housing connected to the metal plate by a first support, and a terminal portion connected to the metal plate by a second support while spaced apart from the housing;

Bending one side of the housing to form a base part on which a light emitting diode chip is mounted, and stacking a reflector on which a through hole is formed on the base part; And

And molding the base, the reflecting portion and the terminal portion with an insulator to integrally form the base, the reflecting portion, and the terminal portion.
The method of claim 6,

Forming the housing and the terminal portion,

The reflective part in which the through hole is formed is formed on one side of the housing that is not connected to the first support part.

The inner diameter of the through hole is larger in the direction away from the contact surface where the reflecting portion and the base portion abut, the method of manufacturing a light emitting diode package.
The method of claim 7, wherein

Forming the housing and the terminal portion,

The method of manufacturing a light emitting diode package, characterized in that the thickness of the insulator insertion surface is reduced so that the insulator insertion surface facing the terminal portion in the bending step is not in contact with the terminal portion among the edges surrounding the through hole.
The method of claim 6,

After bending the housing, further comprising forming a plating layer on the surface of the base portion and the surface of the reflecting portion.
The method of claim 6,

Molding with the insulator,

And insulating and fixing the insulator between the base part and the terminal part and between the reflecting part and the terminal part to insulate and fix the base part, the reflecting part and the terminal part.