WO2014096554A1 - Étiquette rfid, insert pour une étiquette rfid, procédés et moules de coulée pour la fabrication d'une étiquette rfid et d'un insert, procédés pour accorder une étiquette rfid, adaptateur à fixation rapide pour une étiquette rfid et applications d'une étiquette rfid - Google Patents

Étiquette rfid, insert pour une étiquette rfid, procédés et moules de coulée pour la fabrication d'une étiquette rfid et d'un insert, procédés pour accorder une étiquette rfid, adaptateur à fixation rapide pour une étiquette rfid et applications d'une étiquette rfid Download PDF

Info

Publication number
WO2014096554A1
WO2014096554A1 PCT/FI2013/051199 FI2013051199W WO2014096554A1 WO 2014096554 A1 WO2014096554 A1 WO 2014096554A1 FI 2013051199 W FI2013051199 W FI 2013051199W WO 2014096554 A1 WO2014096554 A1 WO 2014096554A1
Authority
WO
WIPO (PCT)
Prior art keywords
rfid tag
insert
mould
case
rfid
Prior art date
Application number
PCT/FI2013/051199
Other languages
English (en)
Inventor
Esa PARTANEN
Asko PUOLIVÄLI
Original Assignee
Wisteq Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wisteq Oy filed Critical Wisteq Oy
Priority to EP13863941.4A priority Critical patent/EP2936398A4/fr
Publication of WO2014096554A1 publication Critical patent/WO2014096554A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/33—Moulds having transversely, e.g. radially, movable mould parts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/005—Record carriers for use with machines and with at least a part designed to carry digital markings the record carrier comprising an arrangement to facilitate insertion into a holding device, e.g. an arrangement that makes the record carrier fit into an etui or a casing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
    • B29C45/0055—Shaping
    • B29C2045/0058—Shaping removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14131—Positioning or centering articles in the mould using positioning or centering means forming part of the insert
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
    • B29C45/0055—Shaping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
    • B29C45/376—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings adjustable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3456—Antennas, e.g. radomes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements

Definitions

  • the present invention relates to an RFID tag, which includes
  • the invention also relates to an insert for an RFID tag, methods and moulds for manufacturing an RFID tag and insert, and a quick-fastening adapter.
  • thermoplastic case Conventional RFID tags encapsulated in a thermoplastic case are manufactured from two halves to be attached to each oth- er.
  • the insert containing the actual RFID chip and antenna (or coil), more generally, the RFID electronics, are installed in the cavity formed inside the encapsulation, for example by gluing, in the defined installation place being in one of the case halves.
  • the halves are combined and the seam of the case is reinforced if necessary, for example by ultrasound welding.
  • a challenge in the construction is the empty air space remaining inside the casing and the low strength of the joint seam of the casing halves, which limits the durability and hermetic tightness of the construction in any even slightly challenging environmental conditions, in which, for example, largish variations in temperature and pressure occur .
  • the casing materials have, for example, a high resistance to variations in heat and temperature, stability to the effects of chemicals, resistance to pressure variations, and resistance to liquids and vapours.
  • the RFID tag should operate reliably under different conditions, such as, for example, in the immediate vicinity of the conductive metal structures and liquids .
  • Patent US 5973599 discloses a screw-attached RFID tag, the manufacture of which uses materials resistant to high temperatures, suitable for demanding conditions.
  • the circuit-board insert is encapsulated with the aid of epoxy moulding, before the insert can be installed tightly between the covers.
  • the tightness of the encapsulation of the case leaves something to be desired.
  • a seam with deficient hermetic tightness xemai-tts- -i-n- the- e-a-s-e- "campOieTvC-.
  • a high local stress peak is created in the attachment point, which is directed particularly to the seam of the case.
  • local fractures can easily arise in the surroundings of the screw.
  • the nozzle and counter-piece are so shaped that in the final stage of the solid casting they form a screw hole remaining in the solid moulding, which has no seams at all with the circuit-board insert.
  • the retainer rods are removed during the final stage of moulding, so that the molten moulding material finally fills the empty spaces remaining from the removal of the retainers.
  • this construction is not as sensitive to damage as the solution of patent US 5973599, as there are no external or internal seams in the area compressed by the screw.
  • Another usual method is to attach the RFID tag to its point of use with an adhesive.
  • This installation method is usually faster than the previous one.
  • the surface Before gluing, the surface should be cleaned while, and depending on the adhesive, the setting time can be at worst several days. Poorly adhering gluing increases maintenance work costs.
  • the device break, or its replacement time run out a well-glued device is difficult to detach (without damaging the point of use) and after detachment maintenance work at the point of use gives rise to costs.
  • the installation costs are usually slightly lower than those of the previous method, but the maintenance costs can rise to become clearly higher.
  • a third quite usual way to attach an RFID tag to its point of use is to equip the point of use with a separate adapter, which is usually of moulded plastic or metal.
  • the adapter is attached to the point of use, for example, by a screw, a rivet, or an adhesive.
  • the tag is attached to the adapter, for example, by pushing pins in the adapter into holes in the case of the device, or flexible press snaps in the adapter into corresponding loops.
  • the case of the device can also be equipped with press snaps or plastic pins, which fit into loops and holes in the adapter.
  • Epoxy-moulding attachment is sometimes used with thick- jacketed metal pieces.
  • a suitable recess is machined into the surface of the metal, into which an epoxy composite is placed.
  • An RFID tag suitable for this attachment method is installed inside the recess, preferably with the upper surface of the tag lying slightly below the metal surface being adjacent to the recess.
  • the amount of epoxy composite should be such that the final installation covers the RFID tag completely and the surface is at most at the same level as the metal surface. This reduces the risk of damage from possible impacts.
  • Sunk attachment is an installation method that is multi-stage, laborious, and very expensive.
  • sinking reduces the reading distance of the RFID tag.
  • the removal of a damaged RFID tag is also a laborious procedure. All in all, the installation and maintenance costs are many times those of the previous attachment methods.
  • the present invention is intended to create an improved RFID tag, an insert for an RFID tag, and methods and moulds for manufacturing an RFID tag and insert, which are simple to implement and permit the manufacture of different models of RFID tag and insert.
  • the characteristic features of an RFID tag according to the invention are stated in Claim 1 and of the insert in Claim 13, of the methods in Claims 15 and 23, of the moulds in Claims 25 and 29, of the tuning method in Claim 32, and of the quick-fastening adapter in Claim 33.
  • a quick- fastening arrangement can be arranged in the case of an RFID tag for installing the RFID tag in its point of use.
  • the attachment mechanism can be based on shape-locking interference.
  • the physical shape of the RFID tag can be tailored simply as required by its point of use.
  • the RFID tag can be tailored to suit widely already existing attachment places in a transportation unit, or to a tailored quick-fastening adapter, to which the invention for its part also relates, to be attached separately to a transport unit.
  • the physical shape of the RFID tag also permits strong and rapid quick-fastening ' and detaching, which brings significant savings in time and cost in work time.
  • the more important benefits of the quick fastening are low startup and maintenance costs, as well as reliable operation.
  • Quick fastening according to the invention can also be applied in other RFID tags than those with a solid-moulded case .
  • the structure of an RFID tag can be tailored simply as required by the point of use also in its internal construction.
  • the insert of an RFID tag can be tailored to any RFID frequency range whatsoever.
  • RFID tags can then be used according to the various RFID monitoring techniques defined by the RFID standards.
  • the insert of the RFID tag can be finished by installing the necessary RFID electronics to the body of the insert.
  • the insert can be tailored in such a way that the sensitivity of the tag to, for example, the effects of metal surfaces and liquid can be minimized, while the reading certainty remains nevertheless sufficiently good.
  • One method to reduce the effect of the environment, suitable for several types of antenna is to arrange a metal surface for the backside of the RFID antenna structure, in such a way that the distance of the metal surface from the antenna structure is suitable-
  • a metal film can, if necessary, be arranged for the back surface of the body part of the insert.
  • the body of the insert can be moulded in its own moulding process, from the same material -a-s—the- e-a-s-e—-ha-t rs mouirdet around it afterwards .
  • the properties of the microstructures of the insert and the case will be mainly the same. This permits micro-seams that may remain in the structure to be sealed, for example, with the aid of local melting of the moulding surfaces in finishing processing .
  • Solutions of the invention can be applied both to small-series production and expanded to mass production.
  • One example of an application of the invention is in various washing and sterilization uses, in which sterilization containers, baskets, and trolleys equipped with RFID devices are recycled, without, however restricting the uses to only these applications.
  • applications can be found for RFID identifiers, for example, in hospital and medical-centre equipment servicing and personnel and patient monitoring, without, however, in any way excluding other applications.
  • Figures la - lc show examples of the schematic construction of an RFID tag, seen from different directions
  • Figures 2a - 2d show examples of the schematic constr c Lc;n of an ' Tnsert, which are suitable for various kinds of RFID module,
  • Figures 3a and 3b show cross-sections of example of mould for moulding the inner piece of the insert, when the mould is open and closed,
  • Figures 4a - 4c show cross-sections of a first example of a mould for moulding a case around the insert, seen from different directions with the mould open and closed,
  • Figures 5a - 5d show cross-sections of a second example of a mould for moulding a case around the insert, seen from different directions with the mould open and closed,
  • Figures 6a - 6d show cross-sections of a third example of mould for moulding a case around the insert, seen from different directions with the mould open and closed,
  • Figure 7a shows the situation at the end of the moulding stage, using the mould of Figures 4a - 4c,
  • Figure 7b shows the situation at the end of the moulding stage, using the mould of Figures 5a - 5d
  • Figure 7c shows the situation at the end of the moulding stage, using the mould of Figures 6a - 6d
  • Figure 8 shows an example of an unfinished RFID tag after solid moulding, which is manufactured using the moulds of Figures 4a - 4c or 5a - 5d,
  • Figure 9 shows an example of a finished RFID tag after finishing
  • Figure 10 shows examples of the dimensions of an
  • Figures 12a and 12b show an example of a second practical application for an RFID tag
  • Figures 13a and 13b show an example of a third practical application for an RFID tag, and the quick-fastening adapter to be used with it,
  • Figures 14a - 14d show examples of quick-fastening adapters for an RFID tag
  • Figure 15 shows an example a second RFID tag equipped with a quick-fastening arrangement
  • FIG. shows a exploded view of the RFID tag of Figure 15,
  • Figure shows a cross-section of the RFID tag of Figure 15 installed in the identifier place
  • Figures 18a - 18e show some examples of quick-fastening arrangements for the RFID tag shown in Figure 8.
  • Figures la - lc show one example of the schematic construction of an RFID tag 10, seen from different directions.
  • the RFID tag 10 can include at least one micro- circuit 35, in which electronics intended for specific functions are integrated.
  • the RFID tag 10 can also include at least one inductive coil or antenna structure 34 receiving and transmitting RF radiation.
  • the RFID tag 10 can, in a known manner, be in contact through an electromagnetic field with reader apparatus controlling it, through an antenna connected to the reader .
  • the RFID electronics 34, 35 is now integrated in a moulded piece 33 inside the RFID tag 10. Together with the moulded piece 33, the RFID electronics 34, 35 form an insert 11. Thus the insert 11 includes the RFID electronics 34, 35.
  • a case 12 is, in turn, moulded around the insert 11. It encloses the insert 11, and the RFID-tag module 14 belonging to it.
  • the case 12 is also of moulded material.
  • the insert 11 is equipped with a carrier arrangement 13 to support it when moulding the case 12 around the insert 11.
  • the carrier arrangement 13 is at the opposite ends of the insert 11.
  • the RFID tag 10 is compact and withstands demanding operating conditions.
  • the construction of the RFID tag 10 itself can be such that it contains a suitable fastening mechanism required for each point of use.
  • Figures 2a - 2d show some examples of the schematic construction of the insert 11 of the RFID tag 10, which are suitable for various kinds of RFID-tag modules 14.
  • the core part of the RFID tag 10, i.e. the insert 11, includes a body part 33 made of moulded material, for example in injection moulding, which in this case has the basic shape of a rectangular boxlike moulded piece.
  • the body part 33 of the insert 11 need not necessarily be box-like, instead the surfaces and edges of its body part 33 can be made into a piece with any shape whatever.
  • One example of a shape can be a flat cylindrical piece (coin-shaped).
  • the shape of the insert 11 can be selected case-specifically, so that the moulding of the external case 12 into the desired shape is appropriate to the point of use in question and that the shape suits the RFID- tag module 14 to be attached to the body part 33 of the insert 11.
  • the base of the insert 11 need not be planar, but can also have a suitably curved surface.
  • the RFID-tag module 14 to be integrated in the insert 11 can have a structure of any kind at all.
  • the RFID-tag module 14 is sufficiently small in size to be fitted into the body part 33 and, in addition, will withstand the thermo-mechanical stresses caused by the solid moulding of the case part 12 to be performed around the insert 11.
  • the RFID-tag module 14 includes an RFID chip 35, an antenna arrangement 34, and a substrate 32, to which the antenna arrangement 34 is attached.
  • tag modules are inductive antennae (coil), of which one example is shown in Figure 2a, or inlay tags 14 forming a dipole, of which one example is shown in Figure 2b.
  • inlay tags 14 forming a dipole of which one example is shown in Figure 2b.
  • a folded inlay for example, a paffa structure
  • a flexible inlay material withstanding high temperatures is used (Figure 2c) .
  • the tag module 14 is in the form of a membrane, it can also be folded around the body part 33 of the insert 11, or installed directly above or under the body part 33, as has been done in Figures 2a and 2b.
  • FIG. 2d shows an example of an insert 11, in which, for example, a ceramic patch antenna (microstrip antenna) is used.
  • the patch antenna is formed of conductive surfaces above and below the circuit-board substrate 32, which are manufactured by etching, printing, or in some other suitable manner, on a ceramic substrate 32.
  • the flat surfaces are connected to the pins of the RFID chip 35 through conductor surfaces between the flat surfaces.
  • a patch-type antenna 34 is then formed to the ceramic 32 the properties of which depend mainly on the 3D dimensions of the antenna surfaces and the properties of the intermediate material.
  • the intermediate material of the antenna surfaces can also be, for example, heat-resistant plastic, instead of ceramics.
  • the body part 33 of the insert 11 of Figure 2d there is an installation location 30, a recess, of a hard RFID-tag- module 14 in which the tag module 14 can be installed. Substrates 32 equipped with a ceramic medium will resist temperature best.
  • the body part 33 of the insert 11 is dimensioned according to the tag module 14.
  • the shape and size of the insert 11 can be selected in such a way that the tag module 14 to be set into it and the possible conductive surface 15 are in a mutually suitable position and scale.
  • the insert 11 should, however, be sufficiently small, so that the finished tag 10 created in manufacture can be manufactured according to dimensions appropriate to the purpose.
  • the insert 11 is equipped with a carrier arrangement 13 for supporting it when moulding the case 12.
  • the carrier arrangement 13 is fixed to the body part 33.
  • the carrier arrangement 13 has the task of supporting the insert 11 of the tag 10, when the outer moulded case 12 is made around the insert 11 of the tag 10, for example by injection moulding.
  • To make support of the insert 11 possible there must be at least one carrier.
  • the carrier arrangement 13 is formed of carrier formations, 'shafts' 26, at the shortest opposite ends of the body part 33 of the plate-like insert 11, of which there are in this case two at each end of the piece 33.
  • the carrier formations 26 are, for example, carrier pins protruding from the body 33 of the insert 11, which are at a distance from each other on their side.
  • the construction of the carrier formations 26 is not limited to only such protruding pins, but that any suitable protrusion from the body 33 can be -u-s-ee —a-s—tang—ecs rt is ilsi rf e Tn terms of the mould structure or practical requirements.
  • the carrier arrangement 13 includes protruding elements 26 integrated in the body part 33.
  • the number and location of the carriers 26 can var in many ways in the body part 33. Other practical places for the carriers in addition to the ends and side edges are, for example, the bottom and top side of the insert 11.
  • the carriers 26 can also be located in any of the insert's 11 corners.
  • the location of the carriers 26 can be selected case-specifically to be such that the insert 11 and the tag module 14 to be installed in it and solid moulding can be made according to the dimensional requirements of the application and that in the solid - moulding of the case 12 the moulding mass covers the insert 11 in the desired manner.
  • the carriers 26 of the insert 11 also make it possible for the insert 11 to remain stationary during moulding relative to the mould 50, 51.
  • the carriers 26 align and support the insert 11 at its simplest inside a two-part external mould 50, 51 in such a way that it is possible to create the desired moulding volume inside the mould 50, 51 for moulding the solidly moulded case of the tag 10 when moulding it around the insert 11.
  • the sturdy positioning of the insert 11 in the mould cavity during moulding of the case 12 reinforces the structure of the tag 10 and improves the hermetic protection of the RFID electronics 34, 35.
  • the temperatures used during the injection moulding of the jacket 12 of the RFID tag 10 can be so high that the material of the circuit board 32 of the RFID-tag module 14 integrated in the insert 11, the quality of the joints of the microcir- cuit 35 and the antenna 34, and the additional protection that may possibly be required, must be considered case- specifically.
  • flexible circuit boards for example PI membranes are suitable for injection moulding, but a PET membrane will not normally withstand moulding.
  • the insert 11 can be manufactured is such a way as to protect the most critical parts of the RFID electronics 34, 35, if necessary, with additional shielding, which will prevent damages during the moulding of the jacket 12 of the RFID tag 10.
  • the insert 11 also permits the tuning of the RFID tag 10 and also the stabilization of its frequency properties, in order to minimize the effect of conductive elements in the vicinity.
  • the frequency properties of the RFID tag 10 are significantly improved over what can be achieved with a tra ⁇ ditionally cased RFID-tag module. This will be returned to in greater detail somewhat later in the description.
  • Figures 3a and 3b show cross-sections of a schematic example of a two-sided aluminium or steel mould 40 for moulding the body part 33 of the insert 11.
  • the invention also relates equally to an insert 11 for an RFID tag 10, which can be equipped with RFID electronics 34, 35.
  • the mould 40 is open and in Figure 3b it is closed.
  • the body part 33 of the insert 11 can be manufactured, for example, by injection moulding.
  • the material of the body part 33 can be selected to withstand the necessary requirements imposed by the operating environment and to be, in addition, also compatible with the case material 12 to be moulded separately later.
  • the mould 40 permits adjustment of the dimensions of the body part 33 of the insert 11 and/or the functionalities to be adapted to it to be taken into account.
  • the mould 40 can be designed in such a way that the total thickness LI of the body part 33 of the insert 11 and/or the possible thickness L2 of the base of the installation location 33 of the RFID-tag module 14 can, if necessary, be adjusted with the aid of the mould 40 prior to moulding, both separately. This takes place with the aid of adjustable pieces 43, 44 belonging to the mould halves 41, 42 of the mould 40.
  • a piece 43 which is arranged moveably in the first mould half 41, a recess 30 is made in the body part 33 for the RFID-tag module 14.
  • a piece 44 which is arranged moveably in the other mould half 42, the base-material thickness LI of the body part 33 is adjusted.
  • the mould halves 41, 42 also move relative to each other.
  • FIG. 3a there can be cut-outs 46 in the opposite sides of the mould halves 41, 42 to create a carrier arrangement 13 for the insert 11.
  • the carriers 26 in the body 33 of the insert 11 of the RFID tag 10 acting as the carrier arrangement 13 permit the positioning and alignment of the insert 11 in the desired location in the cavity of the solid-moulding mould 50, 60 of the jacket 12 of the RFID tag 10.
  • the insert 11 is equipped with a carrier arrangement 13 for supporting it when moulding the case 12 of the RFID tag 10.
  • the insert 11 is placed on these carriers 26 in the mould 50, 60 of the solid casing 12 and, resting on them, the insert 11 remains in place in the desired position during the moulding of the case 12, which is dealt with somewhat later in the description.
  • moulding spaces 47 are formed in the mould 40 to form the carrier arrangement 13 when the mould halves 41, 42 are pressed together.
  • a mould cavity shaped like the body 33 of the insert 11 depicted in Figure 2d is formed between the mould haves 41, 42, in order to form the body part 33 of the insert 11.
  • the adjustable mould construction 40 permits flexible optimization of the frequency band of the RFID tag 10, according to the demands of the point of use.
  • the insert 11 of the RFID tag 10 can be tailored for any RFID frequency range whatever.
  • the RFID tag 10 can then be utilized in systems exploiting various RFID technologies.
  • the mould of the body part 33 can also be fixed. The adjustment of the shape of the body part 33 then takes place with the aid of a mould series, in which there are moulds for each adjustment.
  • the moulding of the body part 33 of the insert 11 can take place with single or multiple-cavity in ection-moulding moulds.
  • Some exemplary moulding material alternatives for demanding environmental conditions are glass-fibre reinforced PPS, PPSU, LCP, or PEEK.
  • the material is PPS composite, such as, for example, glass-fibre reinforced Ryton® plastic.
  • Conventional plastics can also be used, as long as they suit the operating conditions.
  • high injection-moulding pressures can be used. Typically, the injection pressure can be, for example, several hundred bars.
  • the insert 11 of the RFID tag 10 can be manufactured in its own work stage by installing the necessary RFID electronics 14 in the body part 33 of the insert 11.
  • the critical structures can then, if necessary, be reinforced with additional protection, to reduce the risk of their being damaged during the injection moulding of the case 12 of the RFID tag 10.
  • the insert 11 can be tailored in such a way that the sensitivity of the tag 10 to the effect of, for example, metal surfaces and liquid can be minimized, while the reading certainty will still remain sufficiently good.
  • One method to reduce the effect of the environment, applicable to several antenna types, is to use a metal surface on the back side of the RFID antenna structure 34, in such a way that the distance of the metal surface from the antenna structure 34 is suitable.
  • a suitable distance can be determined by altering the dimensions of the body 33 of the insert 11, for which the adjustable mould 40 gives a good possibility.
  • the metal surface can be created, for example, by growing a metal film on the back side of the body 33 of the insert 11 in its own work stage, for example, by vacuum surfacing and/or electrolytic surfacing. Suitable surfacing materials are, for example, aluminium, copper, and gold.
  • a metal-surfaced PI film attached by a heat-resistant adhesive is also suitable for the purpose.
  • Figures 4a - 4c show cross-sections of a first example of a mould 50 for moulding a case 12 around the insert 11, seen from different directions.
  • the material of the two-sided mould construction can be cheap aluminium, or more expensive but more durable steel.
  • the mould halves 51, 52 belonging to the mould 50 are separate, i.e. the mould 50 is open, and in Figure 4b the mould halves 51, 52 are together, i.e. the mould 50 is closed.
  • Figure 4c shows a cross- sectional end view of the mould 50, when the mould 50 is closed .
  • the materials of the body 33 of the insert 11 and the jacket 12 of the RFID tag 10 are made mutually mainly compatible, so that when the melting temperature is exceeded they weld seamlessly to form a tightly closed integral case 12 for the RFID tag 10. This ensures the hermetically protected implementation of the jacket 12, particularly in the manufacturing method shown in Figures 4a - 4c, in which the ends of the carriers 26 of the body 33 of the insert 11 remain outside the moulded surface of the jacket 12 after moulding the case 12.
  • Joining the carriers 26 and the case 12 to form a tight integral case structure can, according to one embodiment, be achieved by locally heating the ends of the carriers 26 and seam of the case 12, after moulding the case 12, over their melting temperature in the finishing stage of the RFID tag 10, so that their temperature exceeds the melting temperature and the ends of the carriers 26 and the case 12 react chemically and form a completely unified hermetically closed case structure.
  • moulding materials suitable for moulding the body 33 of the insert 11 and the jacket 12 of the RFID tag 10 are thermoplastics and composite materials, such as, for example, PEEK, PTFE, PPE, PPS, PSU, PP, PA, PS, and ABS reinforced.
  • the melting temperatures of the various materials vary from below 200 °C to about 400 °C.
  • the stress is also influenced by exposure time to temperature. Because of this, the moulding of the jacket 12 is sought to be carried out at the lowest possible pressure, while keeping the moulding time as short as possible.
  • a case 12 is moulded around the insert 11 using a own two-sided mould 50, which can be of a very simple construction and made of cheap aluminium, without moving parts.
  • the mould includes mould halves 51, 52.
  • the mould 50 can, if necessary be made multi- cavity, to reduce the unit price of manufacture.
  • the insert 11 is attached to one mould half 52 on the carrier protrusions 26 of the insert 11, for which there are grooves 55 or corresponding cut-outs in the mould halves 51, 52.
  • the mould 50 is closed, when the insert 11 is positioned inside the mould cavity 56 as desired. Thanks to the carriers 26 fitted to the grooves 55, the insert 11 is installed in the mould 50 for the duration of moulding, in such a way that a suitable volume remains on all sides around the insert 11, into which the external case 12 is moulded.
  • molten moulding material is injected under pressure into the mould cavity 56 around the insert 11, along feed channels (not shown) .
  • the carriers 26 and the support they give to the structures 52 of the mould 50, the molten material spreads evenly in the moulding around the insert 11, so that after moulding the insert 11 is completely covered by the external case 12, except for the volume between the carriers 16 at the ends of the insert 11 and the contact surfaces of the mould halves 51, 52, forming the RFID tag 10.
  • the mould 50 is opened after the moulding the ends of the carriers 26 come out from the case 12.
  • the ends of the carriers 26 are cut and the exit locations melted together with the case 12, so that the external surface of the RFID tag 10 becomes mainly unified and closed.
  • the position of the insert 11 can, if necessary, be adjusted inside the solid mould 50 and 'thus also the moulded casing layer 12, in order to achieve the desired frequency range.
  • This adjustment possibility is especially useful when the RFID tag 10 is installed in a conductive structure, for example on top of metal, and the conductive surface 15 below the body 33 of the insert 11 is omitted.
  • the distance of the RFID-tag module 14 from the conductive surface affects the tuning of the RFID tag 10 by altering the resonance range of the RFID module 14 and the amplification of the antenna structure. Once the properties of the RFID-tag module 14 are known, the optimal distance from the conductive surface can be determined, for example by adjusting the position of the insert 11 inside the solid mould 50.
  • the optimal distance can be achieved, for example, by machining the depth of the grooves 55 and thus adjusting the distance of the insert 11 of the RFID tag 10 and the functional components in it from the external surface of the case 12 of the RFID tag 10, against which or in the immediate vicinity of which there can come, for example, a metallic surface or other electrically conductive structure in the point of use of the RFID tag 10.
  • the same adjustment is also possible by altering the thickness of the carriers 26.
  • An even more technically developed way to adjust the position of the insert 11 inside the external mould 50 is to equip the mould 50 with separate carrier adjustment pieces, " which are installed in the mould 50 in such a way that by changing the adjustment pieces the carriers 26 are set to a different height in the mould cavity 56.
  • the moveable adjustment pieces 43 and 44 attached to the halves of the mould 40 permit the changing of the position of the insert 11 and especially the position of the RFID-tag module 14 determining the most significant functional properties of the RFID tag 10 and possible conductive surface 15 inside the mould 50.
  • the total thickness LI of the body 33 of the insert and the thickness L of the bottom of the installation location 30 of the tag module 14, as well as the shaping of the carrier parts 46 in the mould 40 determine the distance of the bottom of the body 33 of the insert from the antenna structure 34 of the RFID-tag module 14, which is installed in the installation location 30.
  • the position of the insert 11 inside the mould cavity determines the distance between the bottom 36 of the insert 11 (and possibly the conductive surface 15 integrated in the bottom 36 ( Figure 2d) ) and the bottom of the case 12 of the tag 10.
  • the total distance of the RFID-tag module 14 from the bottom of the tag 10 and the location of the thin conductive surface 15 possibly integrated with the bottom 36 of the body 33 of the insert 11 determine in main the final functional properties of the tag 10 with the selected RFID-tag module 14 in the application.
  • the mould 50 is shaped in a manner suiting its purpose.
  • the external mould 50 is designed to be such that the shape of the RFID tag 10 created after moulding is suitable, for example, for containers 20 used in sterilization ( Figures 11a - 11c) .
  • tongues 25, coming to the edges of the RFID tag 10 to form the moulding spaces 53 are shaped 54 in the mould halves 51, 52, more generally shape locking for the quick-fastening arrangement 29.
  • Figure 7a shows the situation at the end of the moulding stage using the mould 50 shown in Figures 4a - 4c before the detaching of the RFID tag 10 from the mould 50.
  • the case 12 of the RFID tag 10 completely surrounds the insert 11 the moulding mass forming the case 12, having spread entirely into the mould cavity 56. Only the carriers 26 in the insert 11 come slightly out of the case 12.
  • the mould 50 can be opened and the RFID tag 10 transferred to finishing.
  • Figures 5a - 5d show cross-sections of a second example of a mould 60 for moulding a case 12 around the insert 11, seen from different directions, with the mould 60 open and closed.
  • the mould 60 is now equipped with moveable sliding cores 63, so that insert 11 bodies 33 of different sizes can be used in the same mould 60.
  • the insert 11 is attached from the carriers 26 in it to the hold of slides 63 arranged in one mould half 62, which in this case act as a structure 63 of the mould 60, on which the insert 11 is supported.
  • the structure 63 supporting the insert 11 in the mould 60 is moveable.
  • the slides 63 are pushed by drive elements 64 of their operating device towards the mould cavity 67, i.e. towards each other from both ends of the insert 11, when the carriers 26 push into the recesses 68.
  • the mould 60 is closed by pressing the mould halves 61, 62 together, when the insert 11 takes up a position in the mould cavity 67 such that an empty space remains on its upper and lower surfaces and also at the free edges of the slides 63.
  • the amount of empty space remaining above and below the insert 11 determines the height of the slides 63 and the dimensions and locations of the carriers 26 and recesses 68 in the insert 11 and the slides 63.
  • the mutual position of the slides 63 can be adjusted inside the mould cavity 67 by means of the operating elements 64.
  • the slides 63 are loaded at their ends by the same force, so that the force is directed parallel to the axis of the carriers 26 of the insert 11.
  • Molten case material is injected under pressure into the mould cavity 67, so that the molten material pushes the air out of the cavity 67 through the air-exit gaps in the mould 60 (not shown) .
  • the pressure in the mould cavity 67 increases and the slides 63, loaded from outside by the operating element 64, begin to push outwards parallel to the axis of the carriers 26 from both ends of the insert 11, at the same time as the volume of the cavity 67 increases.
  • the slides 63 withdraw, they separate from the carriers 26 and at the same time form empty space at the edges corresponding to them in the insert 11, into which the molten moulding mass can now penetrate and thus again form a case 12 entirely around the insert 11.
  • the slides 63 When the slides 63 have withdrawn sufficiently, the molten moulding material forming the jacket 12 and the ends of the carriers 26 of the insert 11 reach the same level. After this, the slides 63 still move slightly more to achieve the locking position, in which the slides 63 are separate from the carriers 26 and the ends of the insert 11 are completely covered by the molten moulding mass forming the jacket 12.
  • the solid-moulded case structure 12 manufactured in a single stage is a pressure-vapour- tight capsule withstanding mechanical and chemical stress, which is suitable for demanding operating conditions, if the moulding material is selected according the environmental conditions of the application.
  • Figure 7b shows the situation at the end of the moulding stage using the mould 60 shown in Figures 5a - 5d, before the RFID tag 10 is separated from the mould 60.
  • the case 12 of the RFID tag 10 completely surrounds the insert 11, the moulding mass forming the case 12 having spread throughout into the mould cavity.
  • the carriers 26 in the insert 11 remain inside the case 12.
  • the moulding mass has also spread into the space arranged for the carrier elements 26 into the slides 63, which form protruding formations 66 outside the case 12.
  • the mould 60 can be opened and the RFID tag 10 moved to finishing. If necessary, these excess protrusions 66 can be cut ' off in the finishing processing. If necessary, these protrusions 66 can also be left in place. In that case, they can be used in the quick-fastening arrangement based on shape-locking, as shown in Figures 18a - 18e, which is described in greater detail later in the description portion .
  • Figures 6a - 6d show cross-sections of a third example of the mould 60 for moulding the case 12 around the insert 11, seen from different directions, with the mould 50 open and closed.
  • the mould 60 is equipped with moving slide cores 63, so that the same mould 60 can be used to make differently sized bodies 33 for the insert 11.
  • the mould construction is otherwise the same as in Figures 5a - 5d, but the construction of the slide cores 63 and the operating element 64 is different. In this case, the ends of the operating elements 64 can slide through the slide core 63, whereas in the solu- tion of Figures 5a - 5d the ends of the operating element 64 are permanently locked to the slide core 63. ⁇
  • the slide arrangement includes slide cores 63 equipped with recess spaces 68 arranged to move, to be fitted around the carrier arrangement 13 protruding axially from the insert 11, and axial elements 64 fitted inside the slide core 63 arranged to form a bottom for recess spaces 68 against the ends of the carrier arrangement 13.
  • the slide cores 63 and the element 64 are arranged to move independently of each other to alter the volume of the recess space 68 and thus to fill, i.e. eliminate the recess space 68 in the end stage of the moulding .
  • the insert 11 is attached from the carriers 26 in it to the hold of slides 63 attached to one mould half 62, in such a way that the ends of the operating elements 64 settle axially on the ends of the carriers 26 of the insert 11.
  • the slides 63 are pushed by the operating element 64 of their operating devices towards the mould cavity 67, i.e. towards each other, from both ends of the insert 11.
  • the mould 60 is closed by pressing the mould halves 61, 62 together, when the insert is positioned in the mould cavity 67. If necessary, the mutual position of the slides 63 can be adjusted inside the mould cavity 67 by means of the operating element 64.
  • the slides 63 are.
  • the molten casing material is injected under pressure into the mould cavity 67, so that the molten material pushes the air out of the cavity through air-exit gaps in the mould 60. Once the air has exited, the pressure in the mould cavity 67 increases and the slides 63, loaded from outside by the operating element 64, begin to push outwards parallel to the axis of the carriers 26 from both ends of the insert 11, at the same time as the volume of the cavity 67 increases.
  • the solid-moulded case structure 12 manufactured in a single stage is a pressure-vapour- tight capsule withstanding excellently mechanical and chemical stress, which is suitable for demanding operating conditions, if the moulding material is selected according the environmental conditions of the application.
  • Figure 7c shows the situation at the end of the moulding stage using the mould 60 shown in Figures 6a - 6d, before the separation of the RFID tag 10 from the mould 60.
  • the case 12 of the RFID tag 10 completely surrounds the insert 11, when the moulding mass forming the case 12 has completely spread into the mould cavity.
  • the carriers 26 in the insert 11 also remains inside the case 12, due to the structure eliminating the recess space 68 of the slide arrangement 63, 64 in the end stage of the casting.
  • the mould 60 can be opened and the RFID tag 10 transferred to finishing .
  • Figure 8 shows an example of an unfinished RFID tag 10 after solid moulding.
  • the embodiment can, in principle, correspond to an RFID tag manufactured using either mould 50, 60, which is shown in Figures 4a - 4c, 5a - 5d, and 7a and 7b.
  • the pins protruding from the case 12 depict either the ends of the carriers 26 or the protrusions 66 caused in the moulding by the slides 63. Both formations 26, 66 thus relate to the casting of the case 12 of the RFID tag.
  • the single-stage moulding of the case structure 12 minimizes the formation of micro-gaps.
  • Small micro-gaps remains in the case 12 moulded using the mould 50 shown in Figures 4a - 4c, in which the carriers 26 of the insert 11 protrude through the moulded surface of the case 12.
  • the risk of leakage caused by this is generally minimal.
  • the ends of the carrier formations 26 are cut and the stubs remaining are melted locally case-specifically, so that the joint locations of the formations 26 melt into the case material 12 of the RFID tag 10.
  • the RFID tag 10 becomes a completely tight solid structure, which withstands the stresses caused by pressurized liquid, vapour, and gas, and which also withstands well vacuum, high temperatures of more than 200 °C, and repeated temperature cycles, as well as vibration and mechanical and chemical stress.
  • the finished RFID tag 10 is, in principle, a single-material integral structure, inside which there are not, for example, gas or unnecessary tolerances.
  • the material of the carriers 26 of the insert 11 being compatible with the moulding material of the case 12 of the RFID tag 10, in the finishing stage a unified structure can be formed in the area of the carriers 26 and the case 12 moulded around them, when the carrier 26 of the insert 11 is melted together with the case 12. This is helped by the fact that the insert 11 and the case 12 are mainly of the same moulding material.
  • the local thermal energy required for melting can be formed, for example, by an electrically heated resistance, ultrasound, induction heating, or by a laser .
  • the protrusions 66 can be simply cut off, the melting of the stubs being unnecessary.
  • the protrusions 66 can also be utilized in quick fastening, as shown in Figures 18a - 18e.
  • the moulding shown in Figures 6a - 6d no protrusions at all are formed, so that the finishing stage is simpler than in the previous methods.
  • Figures 8 - 10 also show clearly one example of the formations 25 creating a quick-fastening arrangement 29 formed to the case 12, which can be formed in the moulding process of the case 12.
  • the formations 25 are dimensioned so that the FID tag 10 can be attached and locked to its point of use's installation place manually, without tools or separate attachment accessories.
  • a shape-locking quick-fastening arrangement 29 is fitted to the case 12 of the RFID tag 10, for installing the RFID tag 10 in its point of use 20, 20', 16, 16', which can be implemented in several different ways.
  • the external moulded case 12 can be made, for example, by the in ection-moulding technique, which is well suited to mass production. Alternatively it is also possible to use other moulding techniques, of which some examples are 2-component epoxy moulding, or other one or more-stage composite moulding techniques suitable for the purpose.
  • Figure 9 shows an example of a finished RFID tag 10 after finishing.
  • the completely cut ends of the carriers 26 form a unified hermetic structure with the case 12.
  • Figure 10 shows an example of the dimensions of an RFID tag 10, seen from the end of the tag 10.
  • the physical shape of the RFID tag 10 can be tailored to suit a wide range of, for example, ready attachment locations in transportation units, of which some examples are shown in Figures 11a and 12a. It will then be possible to utilize an installation place 21, 22' reserved for some other identifier structure, such as, for example, a series number or bar-code plate, or an identifier or individualization plate or item identifier, which can be standardized in size. In this way, cost savings will be achieved in installation and maintenance. In the best case, existing transportation unit can be utilized completely.
  • the case 12 of the RFID tag 10 can be shaped in such a way that a separate attachment is not required in the installation of a compact RFID tag 10.
  • the RFID tag 10 can be integrated itself into the quick-fastening arrangement 29, for example through its casing.
  • Figure 10 show an example of the dimensional relation of an RFID tag 10 suitable for a transportation unit used in hospitals.
  • the size of the RFID tag 10 can be, for example, about 52 x 34 x 10 mm and its cross-sectional profile hat-shaped as in Figure 10.
  • the dimensions of the attachment tongues 25 of the RFID tag 10 can be, for example, 3.5 mm and 1.5 mm, and their material thickness, for example, 1.65 mm.
  • a tag designed with such dimensions for hospital conditions is suitable for transportation containers, such as Aesculab containers (Figure 11a), Franke baskets (Figure 12a), and Hupfer transport trolleys ( Figure 13a) .
  • Figures 11a - lid show a first example of a point of use for an RFID tag 10, from which can be seen the installation place 21 intended for the tag 10 and the tailored shaping of the case 12 of the tag 10.
  • Figure 11a show schematically one manufacturer's sterilization container 20, which includes a plate-identifier place 21.
  • Figure lib shows the plate-identifier place 21 of the container 20 in greater detail
  • Figure 11c shows the mechanical attachment of an RFID tag 10 to the plate-identifier place 21, which is one application of the RFID tag 10 according to the invention.
  • Figure lid shows the shapings 31 arranged on the backside of the RFID tag 10, which are compatible with the shapings 23 of the identifier place 21. Thanks to the guick-fastening arrangement 29 integrated in itself and fitted to the identifier place 21 of the point of use, the RFID tag 10 is attached firmly and guickly to the container's 20 attachment place 21 intended for a plate identifier, without separate attachments.
  • the attachment of the RFID tag 10 is so firm that it will withstand the stresses of, for example, washing with pressurized wash water and sterilization taking place with hot high-pressure steam, and rapid cooling taking place in a strong vacuum.
  • the RFID tag 10 can also be easily detached manually from the place 21 without tools.
  • edges in the identifier place 21 there are edges in the identifier place 21 according to the embodiment for a card-like or plate-like identifier, " in which there is, for example, a groove 24 in its upper and lower edges for a traditional metal identifier plate or metal card containing a bar code.
  • the quick-fastening arrangement 29 includes tongues 25 fitted to the opposite edges of the RFID tag 10, which can be fitted into the identifier place 21, 22', 18 arranged in the point of use 20, 20', 16, 16' of the RFID tag 10.
  • the tongue on one edge of the RFID tag 10 can be slightly larger than that on the opposite side.
  • the tongues 25 can, due to their dimensioning taking into account the precise dimensions of the RFID tag 10 and the identifier place 21, be squeezed under the edges of the grooves 24 of the identifier place 21.
  • the larger tongue can be set first in the groove 24 of the identifier place 21 and then the smaller tongue can be pressed, using a small force, into the groove of the opposite edge of the identifier place 21. Fitted in place, the grooves 24 hold the tongues 25 inside them and the RFID tag 10 remains firmly in place.
  • the back plate of the case 12 of the RFID tag 10 and/or of the identifier place 21 can have a certain softness, which assists in installation in the form of a slight deformation or bending, which takes place when the RFID tag 10 is squeezed into the identifier " place 21.
  • the detachment of the RFID tag 10 takes place by pulling the RFID tag 10 off the identifier place, when the tongues 25 are released from the grooves 24.
  • detaching the RFID tag 10 it can be pressed, when it is in the identifier place 21, slightly towards the edge on the side with the largest tongue, when the edge on the side of the smaller tongue will be more easily released from the groove.
  • the attach- ment principle of the identifier place 21 of the RFID tag 10 it is also possible to speak of the tag's shape-locking and/or shape-closing attachment/ oining to the identifier place 21.
  • the RFID tag 10 does not require, for example, screws, rivets, or adhesive, which are quite common in conventional attachment solutions.
  • cost savings are achieved, for example, in installation and maintenance situations through the speed of the attaching and detaching of the tag 10, which takes, with all the -work stages, " only " a few ' seconds.
  • the container 20 shown in the embodiment is of aluminium, a solution can be used in the RFID identification, which offers a sufficiently long reading distance from the metal surface.
  • the reading distance should be about 3 m.
  • the RFID tag 10 shown in Figure 2d suits this purpose, as the patch antenna 34 installed on top of the ceramic circuit board 32 withstands both the temperature stress of the operating conditions and the temperatures arising in injection moulding.
  • the RFID chip 35 i.e. integrated circuit can have a pedestal and be packed in a casing. The attachment of the chip 35 to the antenna 34 can be made by soldering withstanding high temperatures. It should be noted, that the RFID tag 10 can be manufactured with numerous other antenna alternatives.
  • the reading distance required can also be achieved, for example, by the solutions of Figures 2b and 2c, by with a circuit board withstanding high temperatures, for example, a circuit board or flexible polyamide membrane, in which the required RFID electronics 14 is integrated.
  • FIGS 12a and 12b show another application for an RFID tag.
  • the RFID tag 10 already presented is attached to the identifier card/plate attachment place 22' on another manufacturer's wire basket 20'.
  • a hinged spring frame 22 bent from wire is arranged in connection with the identifier place 22', which presses the RFID tag 10 into the identifier place 22'.
  • the frame 22 presses the tongues 25 of the RFID tag 10 against the identifier place 22'.
  • the frame 22 is hinged on one side to the identifier place 22'. The detaching of the RFID tag 10 takes place by releasing the spring frame 22 from its attachment.
  • the attachment place 22 ' can also be dimensioned in such a -way that trie spring frame " 22 xs not required at all.
  • the attachment of the RFID tag 10 to the identifier place 22' then takes place by means of a tight fit.
  • the sterilization containers and baskets 20' shown in Figure 11a are generally used, for example, in the sterilization processes in instrument servicing in hospitals. Such load-carriers can also be washed and can be identified also in the various stages of the washing process.
  • FIGS 13a and 13b show one example of a third application for the RFID tag 10.
  • a special mechanical quick-fastening adapter 16 is used, which acts as an adapter between the tag 10 and its point of use 20*.
  • Figure 13a shows an RFID tag 10 attached to a transportation trolley 20* with the aid of an adapter 16.
  • the adapter 16 there can be an individual tag-specific standard attachment mechanism 18 and, in addition, a possible gripping mechanism 17 varied according to the transportation unit 20*.
  • the RFID tag 10 can be attached, with the aid of an attachment mechanism of the adapter, to a round or oval cross-sectional shaped horizontal bar 37 (in this case, diameter about 16 mm) .
  • the attachment adapter 16 can also have such a construe- tion that it lies tightly on the edges of thin surface of different directions ( Figures 14a - 14c) , or to an angular ⁇ typically with a rectangular profile) profile tube ( Figure 14d) or bend.
  • FIG 13b shows an example of a detachably attached quick- fastening adapter 16, available as an accessory for an RFID tag 10, for attaching an RFID tag 10 to its point of use.
  • the adapter 16 includes a place for the RFID tag 10, to which the RFID tag 10 can be detachably attached by shape locking. Gripping elements 70 are fitted to the place 18 for this purpose.
  • the RFID tag 10 can be quickly installed in the quick- fastening adapter 16, in such a way that it is attached firmly to it.
  • the attaching and detaching of the RFID tag 10 to and from the quick-fastening adapter 16 take place manually without tools or separate attachments, such as screw, rivets, or adhesive.
  • the detachable quick-fastening adapter 16 can be transferred to its point of use easily and quickly.
  • Figure 13b The application of Figure 13b is the mechanical quick-fastening adapter of the RFID tag 10 to the transportation trolley 20* shown as an example in Figure 13a.
  • the construction of the adapter 16 is such that it can, for its part, be attached quickly to a predefined location in the transportation unit 20* with the aid of the gripping mechanism 17 in the adapter 16. ' This is particularly beneficial, for example, if it is sensible to use an identifier transferrable to another transportation unit in the RFID monitoring process.
  • the basic component in the quick-fastening adapter 16 is a place 18 of a corresponding type for the RFID tag 10 (bends 24' as the gripping elements 70), as was in the identifier- place embodiment described above.
  • the gripping elements 70 include a frame arrangement 24' formed by bends, into which the quick-fastening arrangement 29 fitted to the edges of the RFID tag 10 can be fitted by shape lock- ing.
  • the grip 17 is hook-like. The attachment is based on the dimensioning of the hook, taking into account the attachment place and also its shaping and flexibility. Thus, in the attachment the hook 17 presses the attachment point and due to that remains firmly in place.
  • Figures 14a - 14d show some examples of a mechanical quick- fastening adapter 16 for the RFID tag 10, for different attachment locations, such as, for example to a transportation trolley or a separately designed tailored attachment place to a transportation unit.
  • Figure 14a shows an example of a horizontal edge-attachment adapter 16,
  • Figure 14b of a vertical edge-attachment -adapter 16 and
  • Figure 14c an angle-model edge-attachment adapter 16.
  • the gripping part 17 of the adapter 16 is bent, for example, from suitable sheet metal or moulded from plastic and it forms the force pressing the edge between it.
  • Figure 14d shows an example of an adapter 16 that can be fitted to an angle-tube bar 19, which is also based on precise dimensioning relative to its attachment place and on a compression effect.
  • Figure 8 shown an unfinished RFID tag 10 manufactured with a mould -50, 60, of which the ends of the formations 66 of the carriers 26 being in the insert 11 and created in the moulding of the case 12 are cut off to make them on the same level as the case 12 of the RFID tag 10.
  • Figure 8 can also show an example of a finished RFID tag 10, in which the cylindrical protrusions 26, 66 used in the moulding of the case 12 or arising as a result of it are left intentionally in place. These protrusions 26, 66 too can be utilized in the quick-fastening arrangement 29 of the RFID tag 10.
  • the quick-fastening ar- rangement 29 will then include gripping elements 26, 66 fitted to the opposite edges of the RFID tag 10.
  • the gripping elements 26, 66 can be fitted to the identifier place 18 arranged in the point of use 16' of the RFID tag 10.
  • the gripping elements 26 can either belong to the carrier arrangement 13 or the gripping elements 66 can be a result of it (for example, through the moulding of the case 12) .
  • the finishing of the RFID tag 10 includes, in this embodiment, the local melting together of the carriers 26 of the RFID tag 10 manufactured with the mould 50 shown in Figures 4a - 4c with the case layer 12 and, in addition, possible a small shortening of the carriers 26, 66 for quick-fastening purposes.
  • Figures 18a - 18e show some examples, in which the protrusions 26, 66 from the ' case 12 of the RFID tag 10 are utilized with the aid of simple gripping elements 70 integrated in the installation place 21, in such a way that an RFID tag 10 according to Figure 8 can be quickly and firmly attached to and detached from the installation place 21.
  • Figures 18a - 18e show some examples of a quick-fastening adapter 16' for an RFID tag 10. It can be flexibly attached to various objects to be monitored by means of RFID technology, such as transportation means generally used in logistics.
  • the adapter 16 ' can be attached to the object to be monitored permanently, for example with screws, rivets, or welding. Alternatively, the adapter 16' can also be easily transferable, when it will be equipped, for example, with the gripping elements 17 shown previously in Figures 13b and 14a - 14d.
  • a quick- fastening adapter 16' which in its basic construction is, for example, a plate-like steel or aluminium structure, in which are integrated gripping elements 70 (180, 181) that are compatible with the protrusions 26, 66.
  • the gripping elements 180, 181 are arranged to be compatible with the carrier elements 26, 66 that are used in the moulding of the case 12 of the RFID tag 10, or have arisen in it.
  • the gripping elements 70 are located on the flat surface of the quick-fastening adapter 16 ' at a distance from each other at opposite ends.
  • the gripping elements 70 can be, in construction, mirror images of each other.
  • the gripping elements 70 are manufactured according to the dimensions of the protrusions 26, 66 of the RFID tag 10, so that the tag 10 can be attached firmly to the installation place 18 arranged for it in the adapter 16 ' .
  • the gripping elements 70 When the RFID tag 10 is pressed into the installation place 18, the gripping elements 70 flex and the tag 10 is able to be locked with the aid of the compression caused by the gripping elements 70.
  • the gripping elements 70 include compression elements 180, to which the quick-fastening arrangement 29 fitted to the edges of the RFID tag 10 can be fitted by shape-locking.
  • the removal of the tag 10 from the installation place 18 shown in Figures 18a - 18c takes place by pulling the tag 10 away from the gripping elements 70.
  • the gripping elements of Figures 18a - 18c can be manufactured, for example, from metal strips that create a compression force, from metal wires 180, or from flexible plastic loops, without, however, being restricted to these examples.
  • Figures 18a - 18d the RFID tag 10 is examined from its end, attached to the adapter 16 ' .
  • Figure 18e shows a top view of the end of the tag 10 attached in Figure 18d.
  • there are two metal wires for a carrier 66 that is, on both sides relative to the carrier.
  • the wires 180 are on the outsides of the carrier 66 and in Figure 18c on the insides.
  • suitably shaped thin metal strips 181 act as the gripping elements 70, which also form a kind of frame arrangement.
  • the strips 181 there are holes 182 arranged according to the dimensions of the tag 10 and the protrusions 26, 66.
  • the strips 181 are located on both sides of the installation place 18. When the tag 10 is set in place, the strips 181 bend and the protrusions 26, 66 of the tag slip inside the holes 182 in the gripping elements 181. The spring force of the strips 181 presses the tag 10 towards the installation base and the tag 10 is locked firmly in place.
  • the strips 181 in detaching the strips 181 must be bent slightly, for example in such a way that the tag 10 is first pushed towards the gripping strip 18 of one side, so that the opposite side of the tag 10 detaches from the gripping strip 181 of the other side.
  • the tag 10 is pulled after this out at an angle, when the other side of the tag 10 also releases before the tag 10 detaches.
  • a similar construction can also be implemented, for example from a spring mechanism bent from metal wire, without, however, being restricted to only these gripping-element examples.
  • the RFID tag 10 is particularly suitable for passive RFID identification in the LF, HF, and UHF frequency ranges, but can be similarly utilized also in semi-passive and active identification in all available frequency ranges, if the necessary electronics and energy source are integrated in the insert 11.
  • an electrically conductive surface 15 can be arranged on the back side 36 of the body part 33 of the insert 11, being the opposite side of the installation side of the RFID-tag module 14 ( Figure 2d) .
  • This can be done in various ways. Some examples of these are a separate conductive plate, an adhesive film, or a surfacing.
  • the size of the insert 11 can be arranged in such a way that it exceeds the projection of the antenna surface 34 of the RFID-tag module 14 with a conductive film 15 of the inner piece 11.
  • the conductive surface 15 can be, for example, aluminium, copper, gold, or silver.
  • Figure 2d show an example for arranging a conductive surface 15 of the back side 36 of the insert 11.
  • the surface 15 can be, for example, an aluminium surfacing (film thickness about 50 ⁇ ) or an adhesive-attached aluminium film (film thickness about 200 pm) .
  • the body part 33, the RFID-tag module 14, and the surfacing 15 form together the insert 11 of the RFID tag 10.
  • the insert 11 is a recess 30, acts as a place for the RFID-tag module 14.
  • a commercial tag module 14 can be set in the installation place 30 made for it in the insert 11, the fit of which is suitable.
  • Some examples of surfacing methods are the printing or brushing of various conductive pastes, etching, or growing, for example, using vacuum surfacing.
  • the conductive membrane 15 improves the reading certainty of the RFID tag 10. Thanks to the conductive membrane 15, the RFID tag 10 will also operate well near non-conductive materials.
  • the insert 11 can also be left unsurfaced. This can be done, for example, if the properties of the point of use are constant and previously precisely known and, for example, the frequency band of the RFID-tag module 14 is sufficiently broad. The insert 11 will then have no conductive surface 15 at all.
  • the distance between the RFID-tag module's 14 antenna 34 and conductive membrane 15 affects the tuning of a narrow-band RF antenna (a typical situation with commercial metal tags). For example, in the case of a patch antenna, when the distance increases, the frequency response moves to a lower frequency.
  • the frequency response peak maximum reading distance for the RFID tag
  • the frequency response peak can then be set to a specific desired frequency. On the European standard frequency band this is in the range 865 - 868 MHz. This is a significant feature in terms of the adjustment of the tag.
  • the distance of the RFID-tag module 14 from the conductive surface 15 to the insert 11 can, if necessary, fine-tune, for example, by placing thin (for example 0.05 mm) adapter plates 38 as required to the bottom of the installation place 30 of the RFID-tag module 14 ( Figure 2d) . This may be necessary, if excessive f equency-band variation appears in a manufacturing batch of commercial tag modules.
  • the material thickness L2 of the body part 33 of the insert 11 at the installation place 30 arranged for the RFID-tag module 14 can be machined directly into the mould half 41 of the mould 40 of the insert 11, when the mould half 41 can be implemented alternatively by means of a simpler structure, without the moving adjustment piece 43 forming the installation place 30 in Figure 3b.
  • the distance between a surfaced and suitably thick bottom of the installation place 30 of the RFID-tag module 14 and the reflector surface 15 locks the frequency response of the totality formed by the RFID-tag module 14 and the body part 33 of the insert 11 in such a way that conductive pieces at difference distances in the vicinity of this totality do not significantly change the location of the resonance frequency in the frequency response. In this way the locking and stabi- lization of the RFID tag 10 to its frequency response is thus achieved .
  • a compact tag 10 is created, which is much more stable than a tag that comprises only an RFID-tag module 14 that is encased or installed inside moulding.
  • the advantages are a reduced affect of the environment and more reliable operation .
  • the qu " ick-fas ' tening arrangement 29 of the RFID t.ag is described above in the case of a moulded case structure.
  • the quick-fastening arrangement 29 scan be equally implemented in different kinds of casing, in which a shell 12 is arranged around the insert 11.
  • Figure 15 shows a second embodiment of the RFID tag 10, in which the idea of a quick-fastening arrangement 29 can be applied.
  • the case 12 of the tag 10 is formed of at least two case pieces 12.1, 12.2, which are joined together when forming the case 12.
  • a shape-locking quick-fastening arrangement 29 is again arranged in the case 12 of the RFID-tag 10, in order to install the RFID tag 10 in its point of use 20, 20', 16, 16'.
  • Figure 16 shows an exploded view of an example of the RFID tag 10 of Figure 15.
  • its components are a front case piece 12.1, a RFID-tag module 14, a possible conductive surface 15, and a rear case piece 12.2.
  • At the edges of the case pieces 12.1, 12.2, at least one opposite edges have corresponding tongue formations 25, more generally elements, as in the moulded embodiments described above, for forming a quick-fastening arrangement 29 for the RFID tag 10.
  • FIG 17 shows a cross-section of the installation of the RFID tag 10 shown in Figure 15 in one identifier place 21.
  • the tongues 25 of the opposite edges of the tag 10 are again squeezed under the frame grooves 24 being in the identifier place 21.
  • the idea of the RFID tag's 10 quick fastening is not limited to only a tag 10 with a solidly moulded case 12, but that it can be equally also applied to a construction of separate case pieces 12.1, 12.2 joined together, for example, by gluing or by ultrasound welding.
  • RFID tags 10 can be used in systems, which include at least one identifiable object 20, 20' and an identifier 10, which can be fitted to the object 20, 20'.
  • the identifier 10 can be any of the RFID identifiers 10 according to a principle presented above.
  • Some examples of the system are systems of moving-objects, for example, in logistics, or systems of static objects, for example, in warehousing and storage.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Aerials (AREA)

Abstract

L'invention concerne une étiquette RFID (10) qui comprend un insert (11) renfermant une électronique RFID (34, 35), une enveloppe (12) étant formée par moulage autour de l'insert. L'insert est pourvu d'un agencement de support (13) permettant de soutenir celui-ci lors du moulage de l'enveloppe. De plus, l'invention concerne un insert destiné à une étiquette RFID, des procédés et des moules pour la fabrication d'une étiquette RFID et d'un insert, un procédé pour accorder une étiquette RFID, un adaptateur à fixation rapide pour une étiquette RFID et des applications d'une étiquette RFID.
PCT/FI2013/051199 2012-12-21 2013-12-23 Étiquette rfid, insert pour une étiquette rfid, procédés et moules de coulée pour la fabrication d'une étiquette rfid et d'un insert, procédés pour accorder une étiquette rfid, adaptateur à fixation rapide pour une étiquette rfid et applications d'une étiquette rfid WO2014096554A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP13863941.4A EP2936398A4 (fr) 2012-12-21 2013-12-23 Étiquette rfid, insert pour une étiquette rfid, procédés et moules de coulée pour la fabrication d'une étiquette rfid et d'un insert, procédés pour accorder une étiquette rfid, adaptateur à fixation rapide pour une étiquette rfid et applications d'une étiquette rfid

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20126372 2012-12-21
FI20126372 2012-12-21

Publications (1)

Publication Number Publication Date
WO2014096554A1 true WO2014096554A1 (fr) 2014-06-26

Family

ID=50977681

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FI2013/051199 WO2014096554A1 (fr) 2012-12-21 2013-12-23 Étiquette rfid, insert pour une étiquette rfid, procédés et moules de coulée pour la fabrication d'une étiquette rfid et d'un insert, procédés pour accorder une étiquette rfid, adaptateur à fixation rapide pour une étiquette rfid et applications d'une étiquette rfid

Country Status (2)

Country Link
EP (1) EP2936398A4 (fr)
WO (1) WO2014096554A1 (fr)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016188918A1 (fr) 2015-05-25 2016-12-01 Sytrax Lda & Comandita Corps d'enfoncement, ensemble de corps d'enfoncement et procédé d'enfoncement d'un corps d'enfoncement
NL2016540B1 (en) * 2016-04-04 2017-10-10 Van Straten Medical B V A combination of a brace and an RFID tag for mounting said RFID tag on surgical or medical equipment
DE202017102618U1 (de) * 2017-05-03 2018-08-06 Mega-Tel Ag/Sa Identifikationsmodul für Gussformen zur Nahrungsmittelerzeugnis-Herstellung
CN109272092A (zh) * 2018-08-31 2019-01-25 重庆西南集成电路设计有限责任公司 一种能检测螺钉松动的uhf rfid标签
CN109404653A (zh) * 2018-12-10 2019-03-01 上海芯智能科技有限公司 用于地下管线定位的rfid标签方向自稳定装置
CN109492739A (zh) * 2017-09-13 2019-03-19 振锋企业股份有限公司 非接触式数据载体
CN113370460A (zh) * 2021-06-24 2021-09-10 莆田市多容光学电子有限公司 一种标签二次注塑方法
EP3961504A4 (fr) * 2019-04-24 2023-02-08 Kyocera Corporation Étiquette d'identification par radiofréquence (rfid)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1052595A1 (fr) 1999-05-14 2000-11-15 Sokymat S.A. Transpondeur et objet moulé par injection et procédé pour leur fabrication
US6166638A (en) * 1998-04-03 2000-12-26 Intermec Ip Corp. RF/ID transponder with squinted beam radiation pattern using dipole-over-ground plane antenna
JP2002037414A (ja) * 2000-07-21 2002-02-06 Mitsubishi Materials Corp Ｒｆｉｄタグによる製品及びその購入者の情報管理方法
EP1583029A1 (fr) 2004-03-31 2005-10-05 Satoh Gosei Co., Ltd. Etiquette d'identification en plastique moulé et son procédé de fabrication
US20070009097A1 (en) * 2005-06-09 2007-01-11 Steven Badger Information carrier
EP2056239A1 (fr) 2007-10-29 2009-05-06 China Steel Corporation Dispositif à étiquette d'identification par fréquence radio pour produits métalliques
US20090273474A1 (en) * 2006-04-03 2009-11-05 Aruze Corp. Radio ic tag

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6166638A (en) * 1998-04-03 2000-12-26 Intermec Ip Corp. RF/ID transponder with squinted beam radiation pattern using dipole-over-ground plane antenna
EP1052595A1 (fr) 1999-05-14 2000-11-15 Sokymat S.A. Transpondeur et objet moulé par injection et procédé pour leur fabrication
US6687131B1 (en) * 1999-05-14 2004-02-03 Sokymat S.A. Transponder and injection-molded part and method for manufacturing same
JP2002037414A (ja) * 2000-07-21 2002-02-06 Mitsubishi Materials Corp Ｒｆｉｄタグによる製品及びその購入者の情報管理方法
EP1583029A1 (fr) 2004-03-31 2005-10-05 Satoh Gosei Co., Ltd. Etiquette d'identification en plastique moulé et son procédé de fabrication
US20070009097A1 (en) * 2005-06-09 2007-01-11 Steven Badger Information carrier
US20090273474A1 (en) * 2006-04-03 2009-11-05 Aruze Corp. Radio ic tag
EP2056239A1 (fr) 2007-10-29 2009-05-06 China Steel Corporation Dispositif à étiquette d'identification par fréquence radio pour produits métalliques

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2936398A4 *

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016188918A1 (fr) 2015-05-25 2016-12-01 Sytrax Lda & Comandita Corps d'enfoncement, ensemble de corps d'enfoncement et procédé d'enfoncement d'un corps d'enfoncement
EP4134869A1 (fr) 2015-05-25 2023-02-15 Wewewe GmbH Corps d'enfoncement, ensemble de corps d'enfoncement et procédé d'enfoncement d'un corps d'enfoncement
US10755160B2 (en) 2015-05-25 2020-08-25 Wewewe Gmbh Insertion body, assembly of insertion bodies and method for inserting an insertion body
NL2016540B1 (en) * 2016-04-04 2017-10-10 Van Straten Medical B V A combination of a brace and an RFID tag for mounting said RFID tag on surgical or medical equipment
DE202017102618U1 (de) * 2017-05-03 2018-08-06 Mega-Tel Ag/Sa Identifikationsmodul für Gussformen zur Nahrungsmittelerzeugnis-Herstellung
CN109492739B (zh) * 2017-09-13 2022-04-01 振锋企业股份有限公司 非接触式数据载体
CN109492739A (zh) * 2017-09-13 2019-03-19 振锋企业股份有限公司 非接触式数据载体
CN109272092A (zh) * 2018-08-31 2019-01-25 重庆西南集成电路设计有限责任公司 一种能检测螺钉松动的uhf rfid标签
CN109404653A (zh) * 2018-12-10 2019-03-01 上海芯智能科技有限公司 用于地下管线定位的rfid标签方向自稳定装置
CN109404653B (zh) * 2018-12-10 2024-03-26 上海一芯智能科技有限公司 用于地下管线定位的rfid标签方向自稳定装置
EP3961504A4 (fr) * 2019-04-24 2023-02-08 Kyocera Corporation Étiquette d'identification par radiofréquence (rfid)
CN113370460A (zh) * 2021-06-24 2021-09-10 莆田市多容光学电子有限公司 一种标签二次注塑方法
CN113370460B (zh) * 2021-06-24 2022-12-23 莆田市多容光学电子有限公司 一种标签二次注塑方法

Also Published As

Publication number Publication date
EP2936398A1 (fr) 2015-10-28
EP2936398A4 (fr) 2016-08-24

Similar Documents

Publication Publication Date Title
EP2936398A1 (fr) Étiquette rfid, insert pour une étiquette rfid, procédés et moules de coulée pour la fabrication d'une étiquette rfid et d'un insert, procédés pour accorder une étiquette rfid, adaptateur à fixation rapide pour une étiquette rfid et applications d'une étiquette rfid
JP7227902B2 (ja) 困難な基板上で機能するように設計されたｒｆｉｄタグ
US20080197042A1 (en) Blister Pack With Radio-Frequency Identification Device, and Method For Manufacturing Same
US20060273180A1 (en) RFID label assembly
EP3001394B1 (fr) Procédé de fabrication d'une étiquette de suivi et antivol combinée
AU3022600A (en) Transponder and injection-moulded part and method for their production
EP2126798A2 (fr) Etiquettes d'identification de radiofrequence microondables
US10268942B2 (en) Packaged electronic module and manufacturing method thereof
KR20160030554A (ko) 무선 ic 태그 부착 패키지 및 무선 ic 태그 부착 패키지의 제조 방법
WO2007070227A2 (fr) Transfert de matrice(s) d’une surface intermédiaire à un substrat
KR100567840B1 (ko) 내열성을 갖는 금속용 무선주파수 인식 태그 및 그 제조방법
KR20130108797A (ko) 타이어용 알에프아이디 태그
CN107257981A (zh) 利用垫片上印制rfid芯片的反应性耦合使印制材料覆层压有防止氧气和湿气侵入的阻挡膜
US8269688B2 (en) Apparatus, method and use for screening the magnetic field of an RFID transponder
KR100567842B1 (ko) 내열성을 갖는 금속용 무선주파수 인식 태그
US20070075835A1 (en) Encapsulated transponder and method for manufacturing the same
CN108027895A (zh) 制造rfid标签组件的方法和rfid标签组件
EP2306371B1 (fr) Procédé de fabrication d'un dispositif RFID protégé
KR101025771B1 (ko) Ｒｆｉｄ 태그 및 이의 제조 방법
JP7323645B2 (ja) 金属性および３次元（３ｄ）物体用の無線周波数識別（ｒｆｉｄ）タグ並びに、その製造および使用方法
KR101427339B1 (ko) 알에프아이디 카드 및 그 제조방법
US20230087368A1 (en) Anti-theft and tracking tag and methods of manufacturing same
EP3115938A1 (fr) Emballage multicouche comprenant une étiquette radiofréquence et procédé de fabrication de celui-ci
JP2023509646A (ja) Ｒｆｉｄタグをリサイクルするためのフィルタリングシステム及びその使用方法
JP5303997B2 (ja) ワイヤアンテナを用いたｒｆｉｄタグインレットの製造方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13863941

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2013863941

Country of ref document: EP