WO2014089942A1 - 清洗机摆动喷淋装置及方法 - Google Patents

清洗机摆动喷淋装置及方法 Download PDF

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Publication number
WO2014089942A1
WO2014089942A1 PCT/CN2013/073580 CN2013073580W WO2014089942A1 WO 2014089942 A1 WO2014089942 A1 WO 2014089942A1 CN 2013073580 W CN2013073580 W CN 2013073580W WO 2014089942 A1 WO2014089942 A1 WO 2014089942A1
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Prior art keywords
wafer
nozzle
spray
washing machine
sheet
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PCT/CN2013/073580
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English (en)
French (fr)
Inventor
史彦慧
吴仪
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北京七星华创电子股份有限公司
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Application filed by 北京七星华创电子股份有限公司 filed Critical 北京七星华创电子股份有限公司
Priority to US14/127,975 priority Critical patent/US9744565B2/en
Publication of WO2014089942A1 publication Critical patent/WO2014089942A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/024—Cleaning by means of spray elements moving over the surface to be cleaned
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Definitions

  • the present invention relates to the field of semiconductor industry, and in particular, to a cleaning machine swinging spray device and method for wafer cleaning.
  • the chemical liquid sprayed from the chemical liquid nozzle of the cleaning machine is sprayed perpendicularly onto the surface of the wafer.
  • the copper interconnect wafer for semiconductors has a diameter of 300 mm, and the wafer continues to rotate during the cleaning process, and the line speed between the center position and the edge position is significantly different.
  • the liquid chemical strikes the surface of the wafer in the same vertical direction, the difference between the center position and the edge position of the wafer due to the linear velocity is large, and the collision of the chemical liquid contacting the vertical and downward will produce different reverse splash reactions.
  • the edge position of the wafer is linear, and the backsplash of the vertical liquid flow is relatively large.
  • the technical problem to be solved by the present invention is to provide a washing machine swinging spray device and method capable of performing good cleaning on the center position and the edge position of the wafer.
  • the washer swinging spray device of the present invention comprises a spray arm, a spray head and a driving device, the spray head being connected to the spray arm, the spray head being swung under the control of the drive device.
  • the spray head is hinged with the spray arm to form a first hinge.
  • the driving device is a cylinder, and a piston rod of the cylinder is connected to the nozzle.
  • the piston rod is hinged with the nozzle to form a second hinge.
  • the washing machine swinging spray device further comprises a protective sleeve, wherein the first hinge, the second hinge and the piston rod are placed in the protective sleeve.
  • the method for swinging and spraying according to the washing machine swinging spray device comprises the following steps:
  • the sheet-like object to be cleaned is rotated, and after the nozzle is moved into the center position of the sheet-like object by the spray arm, the nozzle starts to eject the fluid to clean the sheet-like object, and the head and the sheet at this time
  • the object is vertical;
  • the piston rod of the cylinder protrudes from the cylinder under the action of compressed air to oscillate the nozzle, so that the nozzle is inclined until the ejection fluid reaches the edge of the sheet-like object, thereby completing the cleaning of the entire sheet-like object.
  • the sheet-like object is a wafer.
  • the present invention adopts the apparatus and method provided by the above technical solution.
  • the nozzle is vertically sprayed to the surface of the wafer at the center of the wafer, and the chemical liquid is obliquely incident on the surface of the wafer at the edge of the wafer.
  • a large impact force can compensate for the center position of the wafer.
  • the linear velocity is small and the particles are not easily carried away from the liquid in the groove.
  • the edge position of the wafer already has a large linear velocity, and the liquid is obliquely sprayed onto the surface of the wafer without a large impact on the surface, and the chemical liquid can enter the depth of the groove and the particles are carried away with the liquid flow.
  • the use of the washing machine swinging spray device of the invention has a good cleaning effect on the center position and the edge position of the wafer.
  • FIG. 1 is a schematic structural view of a swing spray device of a washing machine of the present invention
  • Figure 2 is a schematic diagram of liquid flow back-splash at the center of the wafer
  • Figure 3 is a schematic diagram of liquid flow back-splash at the edge of the wafer
  • 1 spray arm
  • 2 nozzle
  • 3 cylinder
  • 4 piston rod
  • 5 first hinge
  • 6 second hinge
  • 7 protective sleeve
  • 8 wafer
  • 9 vertical flow
  • 10 inclined flow.
  • connection In the description of the present invention, it should be noted that the terms “installation”, “connected”, and “connected” are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connected, or integrally connected; can be mechanical or electrical; can be directly connected, or indirectly connected through an intermediate medium, can be the internal communication of the two components.
  • Connected, or integrally connected can be mechanical or electrical; can be directly connected, or indirectly connected through an intermediate medium, can be the internal communication of the two components.
  • the specific meaning of the above terms in the present invention can be understood in a specific case by those skilled in the art.
  • the washing machine swinging spray device of the present invention comprises a spray arm 1, a spray head 2 and a driving device, and the spray head 2 is hinged with the spray arm 1 to form a first hinge 5, the spray head 2 Swing under the control of the drive unit.
  • the driving device may be a device that can realize an oscillating motion such as a cylinder, a hydraulic cylinder, a screw rod, and a gear.
  • the drive device is a cylinder 3, and the piston rod 4 of the cylinder 3 is articulated with the spray head 2 to form a second hinge 6 which is connected to compressed air.
  • the washing machine swinging spray device further comprises a protective sleeve 7, and the first hinge portion 5, the second hinge portion 6 and the piston rod 4 are placed in the protective sleeve.
  • the first hinge, the second hinge and the piston rod may be rubbed to generate particles, and the first hinge, the second hinge and the piston rod are placed in the protective sleeve, and the friction generating particles are not easily transferred into the wafer. surface.
  • the method for swinging and spraying according to the washing machine swinging spray device comprises the following steps:
  • the wafer 8 to be cleaned is rotated, and after the nozzle 2 is moved into the center position of the wafer 8 by the spray arm 1, the nozzle 2 starts to eject the fluid to clean the wafer 8, and the nozzle 2 is perpendicular to the wafer 8;
  • the piston rod 4 of the cylinder 3 protrudes from the cylinder 3 under the action of compressed air to oscillate the nozzle 2, so that the nozzle 2 is tilted until the ejection fluid reaches the edge of the wafer 8, thereby completing the cleaning of the entire wafer 8.
  • the liquid medicine is sprayed onto the surface of the wafer 8 at a certain inclination angle, not only does not cause significant back splashing effect, but also wets into the deep groove of the wafer 8, and the photoresist and particles will be inclined.
  • the liquid exits the surface of the wafer.
  • the liquid jet velocity at the center position of the wafer 8 is increased by the larger ejection speed of the nozzle, and on the other hand, the vertical liquid jet is ejected to the wafer having a line speed of almost zero.
  • the surface of 8 is more advantageous for increasing the cleaning of the deep trenches of wafer 8.
  • the washing machine swinging spray device of the present invention can change the direction of the liquid flow, and is more advantageous for cleaning the particles at the edge position of the wafer 8.
  • the spray arm 1 drives the head 2 to quickly enter the center position of the wafer 8, and the head 2 is perpendicular to the surface of the wafer 8 to vertically inject the liquid into the surface of the wafer 8.
  • the head 2 is inclined outwardly by the piston rod 4 of the cylinder 3, and the liquid medicine starts to incline and enter the surface of the wafer 8 and flows outward, and the head 2 reaches the maximum inclination angle at the edge position of the wafer 8.
  • the nozzle 2 above the wafer 8 has finished the radius of one wafer, the nozzle 2 moves toward the center, and the nozzle 2 is gradually changed from the oblique direction to the vertical direction by the cylinder 3.
  • the washing machine swinging spray device of the present invention has a good cleaning effect on the center position and the edge position of the wafer 8.
  • the present invention adopts the apparatus and method provided by the above technical solution.
  • the nozzle is vertically sprayed to the surface of the wafer at the center of the wafer, and the chemical liquid is obliquely incident on the surface of the wafer at the edge of the wafer.
  • a large impact force can compensate for the center position of the wafer.
  • the linear velocity is small and the particles are not easily carried away from the liquid in the groove.
  • the edge position of the wafer already has a large linear velocity, and the liquid is obliquely sprayed onto the surface of the wafer without a large impact on the surface, and the chemical liquid can enter the depth of the groove and the particles are carried away with the liquid flow.
  • the use of the washing machine swinging spray device of the invention has a good cleaning effect on the center position and the edge position of the wafer.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

一种用于晶片清洗的清洗机摆动喷淋装置及方法。清洗机摆动喷淋装置包括喷淋臂（1）、喷头（2）和驱动装置，所述喷头（2）与所述喷淋臂（1）铰接形成第一铰接处（5），所述喷头（2）在驱动装置控制下摆动。所述驱动装置为气缸（3），所述气缸（3）的活塞杆（4）与所述喷头（2）铰接形成第二铰接处（6）。所述喷淋装置及方法使晶片中心位置和边缘位置都有很好的清洗效果。

Description

清洗机摆动喷淋装置及方法
技术领域
本发明涉及半导体工业领域，尤其涉及一种用于晶片清洗的清洗机摆动喷淋装置及方法。
背景技术
目前，清洗机用化学药液喷头喷出的化学药液都是垂直喷射到晶片表面。现在半导体用铜互连晶片直径有300mm，晶片在清洗过程中持续旋转，其中心位置与边缘位置的线速度差距明显。当药液以同样的垂直方向冲击到晶片表面时，晶片中心位置与边缘位置由于线速度的差异巨大，接触到垂直而下的化学药液碰撞会产生不同的反溅反应。晶片的边缘位置线速度大，对垂直药液流的反溅比较大，即便在较小的喷淋臂的运动速度下，外边缘位置沟槽内的溶解光刻胶和颗粒很难被带走。现需要提供技术来解决药液垂直喷射到晶片的边缘位置发生猛烈反溅作用而影响清洗效果的问题。
发明内容
（一） 要解决的技术问题
本发明要解决的技术问题是提供一种能对晶片中心位置与边缘位置进行良好清洗的清洗机摆动喷淋装置及方法。
（二） 技术方案
为达上述目的，本发明的清洗机摆动喷淋装置包括喷淋臂、喷头和驱动装置，所述喷头与所述喷淋臂连接，所述喷头在驱动装置控制下摆动。
优选的，所述喷头与所述喷淋臂铰接形成第一铰接处。
优选的，所述驱动装置为气缸，所述气缸的活塞杆与所述喷头连接。
优选的，所述活塞杆与所述喷头铰接形成第二铰接处。
优选的，所述清洗机摆动喷淋装置还包括保护套，所述第一铰接处、第二铰接处和活塞杆置于保护套内。
根据所述的清洗机摆动喷淋装置进行摆动喷淋的方法，包括以下步骤：
S1.使待清洗的片状物体自转，将喷头在喷淋臂作用下移入所述片状物体中心位置后，喷头开始喷出流体对所述片状物体进行清洗，此时喷头与所述片状物体垂直；
S2.气缸的活塞杆在压缩空气作用下伸出气缸带动喷头摆动，使喷头倾斜至喷出流体到达所述片状物体边缘，从而完成对整个片状物体的清洗。
优选的，所述片状物体为晶片。
（三） 有益效果
本发明采用上述技术方案提供的装置及方法，喷头在晶片中心位置垂直喷射到晶片表面，在晶片边缘位置化学药液倾斜射入晶片表面。较大的冲击力可以补偿晶片的中心位置线速度小颗粒不易从沟槽内被药液带走的问题。晶片边缘位置已经有很大的线速度，液体倾斜喷射到晶片表面不会在表面发生大的冲击，化学药液可以进入到沟槽深处颗粒随着液流被带走。采用本发明的清洗机摆动喷淋装置使晶片中心位置和边缘位置都有很好的清洗效果。
附图说明
图1是本发明清洗机摆动喷淋装置的结构示意图；
图2是晶片中心位置液流反溅示意图；
图3是晶片边缘位置液流反溅示意图；
图中，1：喷淋臂；2：喷头；3：气缸；4：活塞杆；5：第一铰接处；6：第二铰接处；7：保护套；8：晶片；9：垂直液流；10：倾斜液流。
具体实施方式
下面结合附图和实施例对本发明清洗机摆动喷淋装置作进一步详细说明。以下实施例用于说明本发明，但不用来限制本发明的范围。
在本发明的描述中，需要说明的是，术语“中心”、“纵向”、“横向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。此外，术语“第一”、“第二”、“第三”仅用于描述目的，而不能理解为指示或暗示相对重要性。
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本发明中的具体含义。
此外，在本发明的描述中，除非另有说明，“多个”的含义是两个或两个以上。
如图1所示，本发明的清洗机摆动喷淋装置包括喷淋臂1、喷头2和驱动装置，所述喷头2与所述喷淋臂1铰接形成第一铰接处5，所述喷头2在驱动装置控制下摆动。所述驱动装置可为气缸、液压缸、丝杆和齿轮等可以实现摆动运动的装置。
其中，所述驱动装置为气缸3，所述气缸3的活塞杆4与所述喷头2铰接形成第二铰接处6，所述气缸3与压缩空气连接。
其中，所述清洗机摆动喷淋装置还包括保护套7，所述第一铰接处5、第二铰接处6和活塞杆4置于保护套内。喷头在移动过程中第一铰接处、第二铰接处和活塞杆会发生摩擦易产生颗粒，将第一铰接处、第二铰接处和活塞杆置于保护套内，摩擦产生颗粒不易调入晶片表面。
根据所述的清洗机摆动喷淋装置进行摆动喷淋的方法，包括以下步骤：
S1.使待清洗的晶片8自转，将喷头2在喷淋臂1作用下移入晶片8中心位置后，喷头2开始喷出流体对晶片8进行清洗，此时喷头2与晶片8垂直；
S2.气缸3的活塞杆4在压缩空气作用下伸出气缸3带动喷头2摆动，使喷头2倾斜至喷出流体到达晶片8边缘，从而完成对整个晶片8的清洗。
在晶片8的边缘位置，药液以一定的倾斜角度喷射到晶片8表面，不仅不会产生明显的反溅作用而且会浸润到晶片8的沟槽深层，光刻胶与颗粒将随着倾斜的液流离开晶片表面。在靠近晶片8的中心位置由于线速度较小，一方面依靠喷头较大的喷射速度提高晶片8的中心位置的液流速度，另一方面，垂直的液流喷射到线速度几乎为零的晶片8表面更有利于增加对晶片8的深层沟道进行清洗。因为缺乏向外的液流驱动，靠近晶片8的中心位置较大的垂直冲击力更有利于颗粒和光刻胶溶解液的清洗。本发明的清洗机摆动喷淋装置，可以改变液流的方向，更有利于清洁晶片8的边缘位置的颗粒。
工艺开始后喷淋臂1带动喷头2快速进入晶片8的中心位置，喷头2垂直于晶片8的表面使药液垂直射入到晶片8的表面。喷头2在气缸3的活塞杆4带动下向外倾斜，药液开始倾斜射入晶片8的表面并向外流动，并在晶片8的边缘位置喷头2达到最大倾斜角度。晶片8上方的喷头2走完一个晶片半径后，喷头2往中心移动，喷头2在气缸3带动下由倾斜方向渐变为垂直方向。随着晶片8线速度的不同，液体入射角度不同，药液在线速度较大的晶片8的边缘位置以最大倾斜角度入射时，晶片8表面的反溅小，而且容易产生气泡，液流方向向外，更容易带走溶解的光刻胶以及各种固体颗粒。本发明的清洗机摆动喷淋装置使晶片8的中心位置和边缘位置都有很好的清洗效果。
以上实施方式仅用于说明本发明，而并非对本发明的限制，有关技术领域的普通技术人员，在不脱离本发明的精神和范围的情况下，还可以做出各种变化和变型，因此所有等同的技术方案也属于本发明的范畴。
工业实用性
本发明采用上述技术方案提供的装置及方法，喷头在晶片中心位置垂直喷射到晶片表面，在晶片边缘位置化学药液倾斜射入晶片表面。较大的冲击力可以补偿晶片的中心位置线速度小颗粒不易从沟槽内被药液带走的问题。晶片边缘位置已经有很大的线速度，液体倾斜喷射到晶片表面不会在表面发生大的冲击，化学药液可以进入到沟槽深处颗粒随着液流被带走。采用本发明的清洗机摆动喷淋装置使晶片中心位置和边缘位置都有很好的清洗效果。

Claims (1)

  1. 权 利 要 求 书
    1、一种清洗机摆动喷淋装置，其特征在于，所述清洗机摆动喷淋装置包括喷淋臂（1）、喷头（2）和驱动装置，所述喷头（2）与所述喷淋臂（1）连接，所述喷头（2）在驱动装置控制下摆动。
    2、根据权利要求1所述的清洗机摆动喷淋装置，其特征在于，所述喷头（2）与所述喷淋臂（1）铰接形成第一铰接处（5）。
    3、根据权利要求1或2所述的清洗机摆动喷淋装置，其特征在于，所述驱动装置为气缸（3），所述气缸（3）的活塞杆（4）与所述喷头（2）连接。
    4、根据权利要求3所述的清洗机摆动喷淋装置，其特征在于，所述活塞杆（4）与所述喷头（2）铰接形成第二铰接处（6）。
    5、根据权利要求4所述的清洗机摆动喷淋装置，其特征在于，所述清洗机摆动喷淋装置还包括保护套（7），所述第一铰接处（5）、第二铰接处（6）和活塞杆（4）置于保护套内。
    6、根据权利要求1-5任一项所述的清洗机摆动喷淋装置进行摆动喷淋的方法，其特征在于，包括以下步骤：
    S1.使待清洗的片状物体自转，将喷头（2）在喷淋臂（1）作用下移入所述片状物体中心位置后，喷头（2）开始喷出流体对所述片状物体进行清洗，此时喷头（2）与所述片状物体垂直；
    S2.气缸（3）的活塞杆（4）在压缩空气作用下伸出气缸（3）带动喷头（2）摆动，使喷头（2）倾斜至喷出流体到达所述片状物体边缘，从而完成对整个片状物体的清洗。
    7、根据权利要求6所述的清洗机摆动喷淋装置进行摆动喷淋的方法，其特征在于，所述片状物体为晶片（8）。
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