WO2014086152A1 - 一种终端散热装置 - Google Patents

一种终端散热装置 Download PDF

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Publication number
WO2014086152A1
WO2014086152A1 PCT/CN2013/079724 CN2013079724W WO2014086152A1 WO 2014086152 A1 WO2014086152 A1 WO 2014086152A1 CN 2013079724 W CN2013079724 W CN 2013079724W WO 2014086152 A1 WO2014086152 A1 WO 2014086152A1
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WO
WIPO (PCT)
Prior art keywords
heat
terminal
heat sink
air duct
cpu
Prior art date
Application number
PCT/CN2013/079724
Other languages
English (en)
French (fr)
Inventor
麻杨锋
Original Assignee
中兴通讯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Priority to US14/650,013 priority Critical patent/US20150316965A1/en
Priority to EP13859833.9A priority patent/EP2931013A4/en
Publication of WO2014086152A1 publication Critical patent/WO2014086152A1/zh

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Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means

Definitions

  • the present invention relates to the field of communications technologies, and in particular, to a terminal heat sink.
  • a terminal heat sink there are two main ways of dissipating heat generated by a terminal processing circuit: First, the heat is taken out by a metal structural member shell; and the heat is wrapped in the terminal to allow it to slowly dissipate. The first way is good for the stability of the circuit but the user experience is poor. The second way is to use the user experience as the highest demand but at the expense of circuit stability. Therefore, how to further improve the user experience on the basis of ensuring the stability of the terminal circuit has become an urgent problem to be solved.
  • a heat dissipating device for a terminal comprising: a duct and a directional heat conducting strip; the air duct passes through the CPU, and a heat sink is disposed between the CPU and the rear shell One end of the directional heat conducting strip is connected to the heat sink, and the other end of the directional heat conducting strip is connected to the heat sink member.
  • the size of the heat sink is greater than or equal to the size of the CPU.
  • a heat dissipation hole is provided at a connection between the air duct and the outer casing.
  • the air duct is of a type, and the air duct is disposed on one side or both sides of the terminal battery.
  • the heat sink member is disposed within the air duct.
  • the heat sink member comprises one or more of an antenna, a sound chamber and an earphone.
  • the utility model has the following beneficial effects: The utility model provides a terminal heat dissipating device.
  • the device releases the heat inside the terminal through the convection of the air duct by setting the air duct on the CPU, and is arranged between the CPU and the rear shell.
  • There is a heat sink and the heat sink is connected with the directional heat conducting strip, and the heat is transmitted to the heat sink member of the terminal through the directional heat conducting strip, and then the heat sink is used for heat dissipation.
  • the device has a simple structure and can ensure the stability of the terminal circuit on the basis of ensuring the user's experience.
  • FIG. 1 is a schematic diagram of a heat sink of a terminal according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT OF THE INVENTION The preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings in which: FIG. The embodiment of the present invention provides a terminal heat dissipating device. Referring to FIG.
  • the device includes: an air duct 6 disposed on the CPU 2, the air duct 6 is a type, a 1 type, a ⁇ type, an L type, an L type Or, the air duct 6 is surrounded by the periphery of the terminal battery 1, or the air duct 6 is of a type, and the air duct 6 is vertically disposed at one side or both sides of the terminal battery 1. As shown in Fig. 1, because the hot air is rising upward, the cold air entering the lower side of the lateral air passage further promotes the movement of the hot air, so that the heat inside the terminal moves with the flow of air from the upper side. The wind is coming out.
  • a heat sink is disposed between the CPU 2 and the rear case, and the size of the heat sink is greater than or equal to the size of the CPU 2 .
  • the heat sink is connected to one end of the directional heat conducting strip 5, and the other end of the directional heat conducting strip 5 is connected to the heat sink member.
  • the heat sink member includes one or more of an antenna 3, a sound chamber 4, and a headphone.
  • the heat generated by the CPU 2 is conducted to the directional heat conducting strip 5 through the heat sink, and the directional heat conducting strip 5 has the function of transferring heat from one end to the other end, so the heat on the heat sink is transmitted to the heat sink member of the terminal through the directional heat conducting strip 5, The heat is released through the heat sink.
  • a heat dissipation hole is formed at a connection between the air duct 6 and the outer casing, and the heat dissipation hole is used for convection of the air passage 6 to dissipate heat inside the terminal.
  • the embodiment of the present invention provides a terminal heat dissipating device.
  • the device disposes the heat inside the terminal through the convection of the air duct by setting a wind channel on the CPU, and is disposed between the CPU and the rear case.
  • There is a heat sink and the heat sink is connected with the directional heat conducting strip, and the heat is transmitted to the heat sink member of the terminal through the directional heat conducting strip, and then the heat sink is used for heat dissipation.
  • the device has a simple structure and can ensure the stability of the terminal circuit on the basis of ensuring the user's experience.
  • the above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto, and any person skilled in the art can easily think of within the technical scope disclosed by the present invention. Changes or substitutions are intended to be covered by the scope of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Telephone Set Structure (AREA)

Abstract

本实用新型公开了一种终端的散热装置,该装置包括:风道(6)和定向导热条(5);所述风道(6)穿过CPU(2),所述CPU(2)与后壳之间设有散热片;所述定向导热条(5)的一端与所述散热片连接,所述定向导热条(5)的另外一端与散热器件相连接。该装置通过在CPU上设置风道,通过风道的对流将终端内部的热量释放出去,并在CPU与后壳之间设有散热片,散热片与定向导热条连接,通过定向导热条将热量传递到终端的散热器件上,再通过散热器件进行散热。该装置结构简单,能够在保证用户的体验的基础上,又确保终端电路的稳定性。

Description

一种终端散热装置
技术领域 本实用新型涉及通信技术领域, 尤其涉及一种终端散热装置。 背景技术 目前终端处理电路产生的散热主要有两种方式: 一是用金属材质结构件外壳将热 量带出; 另外就是用绝热外壳将热包在终端里面让其慢慢散发。 第一种方式对电路的 稳定性有好处但用户体验很差, 第二种方式是以用户体验为最高需求单但以牺牲电路 稳定性为代价。 所以如何在保证终端电路的稳定性的基础上, 进一步提高用户的体验 成为当前亟待解决的问题。 实用新型内容 鉴于上述的分析, 本实用新型旨在提供一种终端散热装置, 用以在保证终端电路 的稳定性的基础上, 进一步提高用户的体验。 本实用新型主要是通过以下技术方案实现的: 一种终端的散热装置, 该装置包括: 风道和定向导热条; 所述风道穿过 CPU, 所述 CPU与后壳之间设有散热片; 所述定向导热条的一端与所述散热片连接, 所述定向导热条的另外一端与散热器 件相连接。 优选地, 所述散热片的尺寸大于或等于所述 CPU的尺寸。 优选地, 所述风道与所述外壳的连接处设有散热孔。 优选地, 所述风道为]型、 1=型 Ί型、 Γ 型、 L 型或 型, 所述风道设置在终端电 池的外围。 优选地, 所述风道为一型, 所述风道设置在终端电池的一侧或两侧。 优选地, 所述散热器件设置在所述风道内。 优选地, 所述散热器件包括天线、 音腔和耳机中的一个或多个。 本实用新型有益效果如下: 本实用新型提供了一种终端散热装置, 该装置通过在 CPU上设置风道, 通过风道 的对流将终端内部的热量释放出去, 并在 CPU与后壳之间设有散热片, 散热片与定向 导热条连接, 通过定向导热条将热量传递到终端的散热器件上, 再通过散热器件进行 散热。该装置结构简单, 能够在保证用户的体验的基础上, 又确保终端电路的稳定性。 本实用新型的其他特征和优点将在随后的说明书中阐述, 并且, 部分的从说明书 中变得显而易见, 或者通过实施本实用新型而了解。 本实用新型的目的和其他优点可 通过在所写的说明书、 权利要求书、 以及附图中所特别指出的结构来实现和获得。 附图说明 图 1为本实用新型实施例的终端散热装置示意图。 具体实施方式 下面结合附图来具体描述本实用新型的优选实施例, 其中, 附图构成本申请一部 分, 并与本实用新型的实施例一起用于阐释本实用新型的原理。 本实用新型实施例提供了一种终端散热装置, 参见图 1, 该装置包括: 设置在 CPU2上的风道 6, 所述风道 6为]型、 1=型 Ί型、 Γ型、 L型或 型, 所 述风道 6包围在终端电池 1的外围, 或者所述风道 6为一型, 所述风道 6竖直设置在 终端电池 1的一侧或两侧。 如图 1所示, 因为热空气是向上升的, 而下侧的横向风道 进入的冷空气又进一步促进了热空气的运动, 从而使终端内部的热量随着空气的流动 从上侧的横向风道出来。 所述 CPU2与后壳之间设有散热片, 所述散热片的尺寸大于或等于所述 CPU2的 尺寸。 所述散热片与定向导热条 5的一端相连接, 所述定向导热条 5的另外一端与散 热器件相连接。所述散热器件包括天线 3、音腔 4和耳机中的一个或多个。 CPU2产生 的热量通过散热片传导到定向导热条 5上, 而定向导热条 5具有将热量从一端传递到 另一端的功能, 所以散热片上的热量通过定向导热条 5传递到终端的散热器件上, 通 过散热器件将热量释放出去。 所述风道 6与所述外壳的连接处设有散热孔,所述散热孔用于对风道 6形成对流, 将终端内部的热量散放出去。 综上所述, 本实用新型实施例提供了一种终端散热装置, 该装置通过在 CPU上设 置风道, 通过风道的对流将终端内部的热量释放出去, 并在 CPU与后壳之间设有散热 片, 散热片与定向导热条连接, 通过定向导热条将热量传递到终端的散热器件上, 再 通过散热器件进行散热。 该装置结构简单, 能够在保证用户的体验的基础上, 又确保 终端电路的稳定性。 以上所述, 仅为本实用新型较佳的具体实施方式, 但本实用新型的保护范围并不 局限于此, 任何熟悉本技术领域的技术人员在本实用新型揭露的技术范围内, 可轻易 想到的变化或替换, 都应涵盖在本实用新型的保护范围之内。 因此, 本实用新型的保 护范围应该以权利要求书的保护范围为准。

Claims

权 利 要 求 书 、 一种终端的散热装置, 包括: 风道 (6) 和定向导热条 (5 );
所述风道 (6) 穿过 CPU (2), 所述 CPU (2) 与后壳之间设有散热片; 所述定向导热条 (5 ) 的一端与所述散热片连接, 所述定向导热条 (5 ) 的 另外一端与散热器件相连接。 、 根据权利要求 1所述的装置,其中,所述散热片的尺寸大于或等于所述 CPIK2) 的尺寸。 、 根据权利要求 1或 2所述的装置, 其中, 所述风道(6)与所述外壳的连接处设 有散热孔。 、 根据权利要求 1或 2所述的装置, 其中, 所述风道 (6) 为]型、 型 Ί型、 Γ型、 L型或 型, 所述风道 (6) 设置在终端电池 (1 ) 的外围。 、 根据权利要求 1或 2所述的装置, 其中, 所述风道(6)为一型, 所述风道(6) 设置在终端电池 (1 ) 的一侧或两侧。 、 根据权利要求 1或 2所述的装置,其中,所述散热器件设置在所述风道(6)内。 、 根据权利要求 1或 6所述的装置,其中, 所述散热器件包括天线(3 )、音腔(4) 和耳机中的一个或多个。
PCT/CN2013/079724 2012-12-07 2013-07-19 一种终端散热装置 WO2014086152A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US14/650,013 US20150316965A1 (en) 2012-12-07 2013-07-19 Heat radiation apparatus of terminal
EP13859833.9A EP2931013A4 (en) 2012-12-07 2013-07-19 HEAT RADIATION DEVICE OF A FINISHING DEVICE

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2012206692144U CN203040086U (zh) 2012-12-07 2012-12-07 一种终端散热装置
CN201220669214.4 2012-12-07

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WO2014086152A1 true WO2014086152A1 (zh) 2014-06-12

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US (1) US20150316965A1 (zh)
EP (1) EP2931013A4 (zh)
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WO (1) WO2014086152A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203040086U (zh) * 2012-12-07 2013-07-03 中兴通讯股份有限公司 一种终端散热装置
US9426932B2 (en) * 2013-03-13 2016-08-23 Silicon Graphics International Corp. Server with heat pipe cooling
CN206472427U (zh) 2016-09-28 2017-09-05 华为技术有限公司 电子设备散热结构及电子设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090002940A1 (en) * 2007-06-29 2009-01-01 Fujitsu Limited Electronic device
CN201774786U (zh) * 2010-07-13 2011-03-23 上海奥波电子有限公司 一种散热装置
CN201965529U (zh) * 2011-03-14 2011-09-07 上海大学 移动互联网设备散热装置
CN203040086U (zh) * 2012-12-07 2013-07-03 中兴通讯股份有限公司 一种终端散热装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6058009A (en) * 1998-07-14 2000-05-02 Dell Usa, L.P. Computer with improved internal cooling system
US6924978B2 (en) * 2002-12-27 2005-08-02 Intel Corporation Method and system for computer system ventilation
US7027299B2 (en) * 2003-08-19 2006-04-11 Sun Microsystems, Inc. Electronics assembly with arrangement for air cooling
US7957132B2 (en) * 2007-04-16 2011-06-07 Fried Stephen S Efficiently cool data centers and electronic enclosures using loop heat pipes
US8705233B2 (en) * 2008-03-29 2014-04-22 Dell Products L.P. System and method for portable information handling system thermal shield
CN201230438Y (zh) * 2008-07-07 2009-04-29 鸿富锦精密工业(深圳)有限公司 散热装置组合
JP4997215B2 (ja) * 2008-11-19 2012-08-08 株式会社日立製作所 サーバ装置
CN102469742A (zh) * 2010-11-04 2012-05-23 鸿富锦精密工业(深圳)有限公司 电子装置
US9426932B2 (en) * 2013-03-13 2016-08-23 Silicon Graphics International Corp. Server with heat pipe cooling

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090002940A1 (en) * 2007-06-29 2009-01-01 Fujitsu Limited Electronic device
CN201774786U (zh) * 2010-07-13 2011-03-23 上海奥波电子有限公司 一种散热装置
CN201965529U (zh) * 2011-03-14 2011-09-07 上海大学 移动互联网设备散热装置
CN203040086U (zh) * 2012-12-07 2013-07-03 中兴通讯股份有限公司 一种终端散热装置

Also Published As

Publication number Publication date
EP2931013A4 (en) 2016-01-06
CN203040086U (zh) 2013-07-03
EP2931013A1 (en) 2015-10-14
US20150316965A1 (en) 2015-11-05

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