WO2014082539A1 - 贴合治具及其使用方法 - Google Patents

贴合治具及其使用方法 Download PDF

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Publication number
WO2014082539A1
WO2014082539A1 PCT/CN2013/087478 CN2013087478W WO2014082539A1 WO 2014082539 A1 WO2014082539 A1 WO 2014082539A1 CN 2013087478 W CN2013087478 W CN 2013087478W WO 2014082539 A1 WO2014082539 A1 WO 2014082539A1
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WO
WIPO (PCT)
Prior art keywords
workpiece
opening
fitting jig
jig according
bonding
Prior art date
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PCT/CN2013/087478
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English (en)
French (fr)
Inventor
王志峰
苏友强
刘壮
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宸鸿科技(厦门)有限公司
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Publication of WO2014082539A1 publication Critical patent/WO2014082539A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • B32B37/0053—Constructional details of laminating machines comprising rollers; Constructional features of the rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833—Positioning, e.g. registration or centering
    • B32B38/1841—Positioning, e.g. registration or centering during laying up
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives

Definitions

  • the present invention generally relates to a jig, and more particularly to a conforming jig and method of use thereof.
  • a jig is a tool used to assist in controlling the position of a workpiece or part or guiding its movement. By controlling the position or motion of the workpiece or part, the jig can be accurately, safely and quickly repeated. The efficiency of the manufacturing steps of a certain part in the process is widely used in the processing industry or the assembly industry.
  • the jig will present a variety of types with its different application fields and customization requirements, such as mechanical processing fixtures, stamping fixtures, heat treatment fixtures, welding fixtures, or assembly fixtures, etc. They are all common types of fixtures in the industry. For some types, the fixture can also be considered a fixture, and there is no significant difference in functionality between the two.
  • the fixture is also used in the assembly field of today's smart phones.
  • the touch substrate (sensor) Glass) generally first with the outer protective glass cover (cover After the alignment and bonding, the touch panel will be assembled integrally with the inner liquid crystal panel, the circuit board, and the casing.
  • a special bonding fixture is generally used in the industry to accurately contact the touch substrate with the glass cover.
  • FIG. 1 is a perspective view showing a conventional fitting jig in a general smart phone assembly.
  • the conventional bonding fixture 100 used in the assembly of a smart phone has a block-shaped seat body shape, and has a bearing area 101 at the center for placing a touch substrate to be attached.
  • a plurality of raised limiting portions 103 are formed around the carrying area platform 101. The corners shown in the picture, It can limit the position of the touch substrate placed on the carrying area 101.
  • a portion of the outer portion of each of the limiting portions 103 is formed with a step portion 105 for restricting the position of the cover glass when it is close to the portion where the touch substrate is bonded.
  • the conventional bonding jig 100 allows the glass cover to be accurately attached to the touch substrate.
  • the conventional fitting jig 100 can achieve an accurate fitting effect, the conventional fitting jig 100 in practice can cause a lot of process problems, and the problem will be explained later in FIG.
  • FIG. 2 there is shown a cross-sectional view of the conventional bonding jig 100 during the actual bonding, which is made by taking the line A-A' in FIG. 1 as a cross line.
  • the relative position and distance between the glass cover, the touch substrate, the limiting portion, and the step portion can be clearly indicated.
  • the glass cover 107 and the touch substrate 109 are adhered to each other by a bonding glue 111 (such as a water-repellent glue), and the adhesive 111 is applied to the bonding surface via a free overflow. Wetting and diffusion.
  • a bonding glue 111 such as a water-repellent glue
  • the peripheral edge 109a of the touch substrate 109 can be very close to the limiting portion 103. And even contact with it.
  • the glass cover 107 is attached to the touch substrate 109 from above the bonding fixture 100. When approaching the touch substrate 109, the glass cover 107 passes through the step of the bonding fixture 100. The outer wall 105a limits its position so that the glass cover 107 can be accurately aligned with the underlying touch substrate 109 and uniformly adhered.
  • the bonding surface of the glass cover 107 is located at a level close to the height of the stepped platform 105b, and there is a slight gap between the glass cover 107 and the touch substrate 109, so that the adhesive film 111 naturally passes through the capillary phenomenon, and naturally spreads, wets and spreads. .
  • the present invention proposes a novel design of a fitting fixture, which discards the conventional techniques in which two pieces of the fitting workpiece are limited by the limit.
  • the part or limit feature is used to fix the position, and the novel single-piece limit design is used for the fit.
  • the bonding glue does not cause capillary phenomenon due to the workpiece being too close to the bonding fixture, which may cause problems such as excessive glue overflow.
  • the fitting fixture comprises a body having an opening in the center and a plurality of side walls surrounding the opening; a loading platform suspended in the opening of the seat body, the bearing
  • the table is configured to carry a first workpiece.
  • the circumference of the first workpiece may exceed the circumference of the carrier and be spaced apart from the sidewall, and at least one limiting portion is disposed on the base to limit one.
  • the position of the second workpiece entering the opening from the outside is such that the second workpiece can be accurately fitted to the first workpiece carried on the stage.
  • a method for using a fitting jig comprising the steps of providing a fitting jig comprising a seat having a central opening and a suspension a centrally open loading platform of the base body and at least one limiting portion disposed on the base body, wherein the limiting portion is configured to limit a position of the workpiece from the outside into the opening; and a first workpiece is disposed on the loading platform So that the circumference of the first workpiece extends beyond the circumference of the loading platform and is spaced apart from the sidewall surrounding the opening; the second workpiece passes through the limit of the limiting portion, so that the second workpiece can be accurately carried The first workpiece on the stage is attached.
  • Figure 1 is a perspective view showing a conventional fitting fixture used in the assembly of a general smart phone
  • Figure 2 is a cross-sectional view showing the conventional fitting jig in Figure 1 during actual bonding
  • FIG. 3 is a perspective view of a fitting jig in accordance with a preferred embodiment of the present invention.
  • FIG. 4 is a top plan view showing a first workpiece carried on a carrier of the bonding fixture in FIG. 3 according to a preferred embodiment of the present invention
  • Figure 5 is a top plan view showing a second workpiece in a preferred embodiment of the present invention being subjected to a conforming fixture limit during lamination;
  • Fig. 6 is a cross-sectional view showing the fitting jig in Fig. 3 during actual bonding.
  • the main body of the fitting jig 200 is a body 201 which is in the form of a frame.
  • the base 201 has an opening 203 in the middle thereof and a plurality of side walls 204 surrounding the opening.
  • a loading platform 205 is suspended in the opening 203 of the base 201.
  • the base 201 further includes a support member that connects the carrier 205.
  • the carrier 205 can be suspended in the opening 203 by the support member 207 and can be spaced apart from the sidewall 204 of the surrounding opening 203.
  • the number, location and shape of the side walls 204 can be adjusted depending on the workpiece being attached.
  • the carrying platform 205 is configured to carry a first workpiece, such as a touch substrate in a smart phone (sensor) Glass) parts.
  • the height of the bearing surface of the carrying platform 205 is higher than the height of the supporting member 207, so as to prevent the adhesive glue from sticking to the supporting member 207 when the bonding is performed.
  • a plurality of limiting portions 209 are formed on the base 201 surrounding the carrying platform 205. As shown in the figure, the four corners disposed on the outside of the carrying platform 205 or the four corners of the base 201 are higher than the carrying base 205, so that a second workpiece is firstly received when approaching the carrying platform 205.
  • the limit of the limiting portion 209 is positioned at a predetermined bonding position.
  • the fitting jig 200 can also be formed with a groove 210 for facilitating the clamping of the attached workpiece by the clamp.
  • FIG. 4 a top view of a first workpiece 211 carried on a carrier 205 of the bonding fixture 200 in FIG. 3 is illustrated in accordance with a preferred embodiment of the present invention.
  • a first workpiece 211 is placed on the carrier 205.
  • the circumference of the first workpiece 211 carried by the carrier 205 may exceed the circumference of the carrier 205, thus ensuring that even if the adhesive applied to the first workpiece 211 during the bonding process overflows, The carrier 205 under the first workpiece 211 is contaminated.
  • the first workpiece 211 and the carrying platform 205 are both in a rectangular shape.
  • the first workpiece 211 and the carrier 205 may have other shapes, such as a circular shape or even an irregular shape, depending on the design of the workpiece to be attached.
  • the opening 203 of the bonding fixture 200 is sized such that when the first workpiece 211 is placed on the carrier 205, the circumference of the first workpiece 211 and the sidewall 204 of the surrounding opening 203 By a certain distance, it will be ensured that the first workpiece 211 will not be too close to the side wall 204 of the seat 201 during the bonding process, resulting in wet adhesion of the adhesive to the seat 201.
  • the first workpiece 211 is spaced apart from the limiting portion 209 by a certain distance.
  • the bonding fixture 200 may further include a plurality of movable positioning members (or positioning claws) 213 disposed around the carrying platform 205.
  • the position of the first workpiece 211 to be carried on the carrier 205 is located.
  • the positioning member 213 can move in the X direction and the Y direction to push the first workpiece 211 placed on the stage 205 to move the first workpiece 211 to a predetermined bonding position.
  • the positioning member 213 can move the first workpiece 211 by suction, thereby achieving the purpose of positioning the first workpiece 211.
  • the movable positioning member (or positioning claw) 213 may also be disposed away from the limiting portion 209 to prevent the overflow portion from being contaminated to the positioning member or the limiting portion as is conventionally known.
  • the bearing surface of the loading platform 205 can be provided with a plurality of air holes 214. After the first workpiece 211 is positioned by the positioning member 213, the first workpiece 211 can be fixed on the loading platform 205 via the air hole 214 by vacuum adsorption. The bonding is incorrect due to the movement of the first workpiece 211 during the bonding.
  • the carrier 205 can have a certain adhesiveness, and the first workpiece 211 can be fixed in an adhesive manner.
  • a magnetic attraction device can be added under the loading platform 205 to fix the first workpiece 211 to the carrier 205 by magnetic attraction.
  • FIG. 5 illustrates a top view of a second workpiece 215 being restrained by the conforming jig 200 during the bonding process in the preferred embodiment of the present invention.
  • the second workpiece 215 to be bonded to the first workpiece 211 on the carrying platform 205 such as the glass cover component in the smart phone (cover) Glass
  • the dispensing step is first performed on a press machine (not shown) to uniformly wet the bonding glue on the bonding surface of the second workpiece 215.
  • the press machine feeds the second workpiece 215 from the upper side of the bonding jig 200 into the opening 203 of the bonding jig 200.
  • the second workpiece 215 passes through a plurality of limiting portions 209 provided on the base 201 around the opening 203 above the carrying platform 205.
  • the area of the second workpiece 215 is larger than the area 211 of the first workpiece.
  • the area of the touch substrate in the smart phone is smaller than the protective glass cover of the outer layer, which is only approximately The screen display area of the shielding layer is not formed on the cover glass.
  • each of the limiting portions 209 of the fitting jig 200 may be a recess having a specific contour shape, the shape of which will correspond to the peripheral contour of the second workpiece 215 to be constrained. .
  • the second workpiece 215 passing through the opening 203 can be accurately restricted to a predetermined bonding position, and the position is not aligned with the first workpiece 211. Offset due to uneven force.
  • FIG. 6 there is shown a cross-sectional view of the bonding jig 200 during actual bonding in accordance with a preferred embodiment of the present invention.
  • the cross-sectional view is taken as line B-B' in Figure 5
  • the line is made to clearly show the relative position and distance between the first workpiece 211, the second workpiece 215, the carrier 205, and the limiting portion 209.
  • the first workpiece 211 is fixed to the carrier 205 with its periphery exceeding the circumference of the carrier 205.
  • the specific surface of the bonding surface of the second workpiece 215 is covered with a bonding glue 217.
  • the second workpiece 215 enters the opening 203 from above the bonding fixture 200 and is limited by the limiting portion 209.
  • the conforming area of the second workpiece 215 can be accurately aligned and conformed to the first workpiece 211. It can be clearly seen from FIG. 6 that among the two workpieces of the first workpiece 211 and the second workpiece 215, only the second workpiece 215 having a larger area is limited by the limiting portion 209 and is close to the bonding fixture 200. Or contact. Since the first workpiece 211 having a small area is not limited by the stopper portion 209 of the bonding jig 200, the periphery thereof does not come close to or contact with the bonding jig 200 (except for the carrying table 205).
  • the present invention also provides a method for using the bonding fixture, the method comprising the steps of providing a bonding fixture as shown in FIG. 3, the bonding fixture
  • the base 201 includes a central opening 203, a mounting base 205 suspended from the central opening 203 of the base 201, and at least one limiting portion 209 disposed on the base 201.
  • the limiting portion 209 is used for the limiting portion 209. Limiting the position of the workpiece from the outside into the opening 203 (other components of the fitting jig and corresponding descriptions have been disclosed in the above embodiments, and will not be described herein again), and a first workpiece 211 is placed on the sticker.
  • the mounting table 205 of the fixture (as shown in FIG. 4) is such that the circumference of the first workpiece 211 extends beyond the circumference of the carrier 205 and is spaced apart from the side wall surrounding the opening 203 of the stage, and finally The second workpiece 215 is constrained by the limiting portions (as shown in FIGS. 5 and 6), thereby enabling the second workpiece 215 to accurately match the first workpiece 211 carried on the loading platform. fit.
  • the bonding glue may be formed on the first workpiece 211 in advance or formed on the second workpiece 215 in advance.
  • the method of using the fitting jig of the present invention further comprises using a movable positioning member to position the first workpiece on the stage.
  • the method for using the bonding fixture of the present invention further comprises fixing the first workpiece to the loading platform by vacuum adsorption or adhesion, or fixing the first workpiece to the loading platform by magnetic adsorption. .
  • the bonding glue between the first workpiece and the second workpiece does not contact the bonding fixture even if the glue is overflowed, so that the contamination caused by excessive overflow can be prevented, and the water can be avoided. Glue is wasted, or the amount of glue and the thickness of the fit are unstable.

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  • Automatic Assembly (AREA)
  • Telephone Set Structure (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

本发明揭露了一种贴合治具，其包含一座体，其中央具有一开口及具有环绕该开口的复数个侧壁；一承载台，其悬设在该座体的开口中，该承载台用以承载一第一工件，承载时该第一工件的周缘会超出该承载台的周缘且与该侧壁间隔一定距离、以及至少一限位部设在该座体上，用以限制一从外部进入该开口的第二工件的位置，使得第二工件可以准确地与承载在该承载台上的该第一工件贴合。本发明同时提供一种该治具的使用方法。采用本发明的治具进行贴合，可防止过度溢胶所造成的污染情形发生。

Description

贴合治具及其使用方法 技术领域
本发明大体上关于一种治具，更具体言之，其系关于一种贴合治具及其使用方法。
背景技术
治具(jig)是一种用来协助控制工件或机件位置或引导其动作的一种工具，藉由控制工件或机件的位置或动作，治具可起到准确、安全、快速地重复工序中某部位的制作步骤的功效，故其在加工业或组装业中被广泛地应用。治具会随着其不同的应用领域与客制化需求而呈现多种的型态，举凡机械加工治具、冲压治具、热处理治具、焊接治具、或是装配治具等, 都是业界常见的治具类型。就某些型态而言，治具亦可被视为是一种工装夹具(fixture)，两者在功能上并无显著的不同。
治具同样也被应用在现今的智慧型手机的组装领域中，在此应用中，触控基板(sensor glass)一般会先与外侧的保护性玻璃盖板(cover glass)进行对位与贴合，之后触控面板才会与内侧的液晶面板、电路板、以及机壳等部件进行整体的组装。就上述触控基板与玻璃盖板的贴合步骤而言，目前业界通常是利用一特制的贴合治具来使触控基板能准确地与玻璃盖板贴合。
下文中将透过第1图与第2图来说明上述贴合步骤的细节。首先，第1图绘示出一般智慧型手机组装中习用的贴合治具的立体图。如第1图所示，一般智慧型手机组装中习用的贴合治具100系呈块板状的座体态样，其中央有一承载区域101用以放置要进行贴合的触控基板。承载区域平台101的四周形成有多个凸起的限位部103, 如图中所示的角落部位, 其可限制放置在承载区域101上的触控基板的位置。同时，在各限位部103外侧的部位则形成有阶梯部105，其系用来限制玻璃盖板在接近于触控基板贴合的部位时的位置。透过上述限位部103与阶梯部105的配置设计，习用的贴合治具100得以使玻璃盖板与触控基板准确地贴合。然而，尽管上述习用的贴合治具100可以达成准确贴合的功效，在实作中习用的贴合治具100会产生不少的制程问题，后续将以第2图来解说此问题。
现在请参照第2图，其绘示出上述习用的贴合治具100在实际贴合期间的截面图，此截面图系以第1图中的线A-A’为截线所作成，其可清楚地表示出玻璃盖板、触控基板、限位部以及阶梯部之间的相对位置与距离。如第2图所示，玻璃盖板107与触控基板109之间系藉由贴合胶111(如一水胶)来相互贴合，贴合胶111会经由自由溢胶的方式在贴合面上润湿扩散。在习知技术中，由于触控基板109是利用贴合治具的限位部103来达到固定位置的效果，故可以从图中看到触控基板109的周缘109a会非常接近限位部103，甚至与之接触。另一方面，玻璃盖板107系从贴合治具100上方往下与触控基板109进行贴合，在接近触控基板109时，玻璃盖板107会透过贴合治具100的阶梯部外壁105a来限制其位置，使得玻璃盖板107能与下方的触控基板109精确对位并均匀贴合。最后玻璃盖板107的贴合面系位于接近阶梯部平台105b的高度水平，其与触控基板109之间会有微小的间隙让贴合胶111透过毛细现象自然地溢胶、润湿扩散。
从第2图中可以清楚地看到，由于习知贴合治具100的限位部103与阶梯部105的紧邻式一体设计，使得触控基板109的部分周缘以及玻璃盖板107的贴合面在贴合时会很靠近阶梯部105的角落部位105c，如以虚线所圈出的区域所示，如此将会使贴合胶111因为毛细现象而润湿扩散到贴合治具100上。此过度溢胶的现象会对治具造成污染，而影响到后续其他触控基板以及玻璃盖板的贴合作业。故此，目前业界仍需改良现今智慧型手机组装中习用的贴合治具的设计，以期能解决上述诸多先前技术固有的问题。
发明内容
有鉴于前述习知技术的作法容易导致过度溢胶的问题，本发明特以提出了一种新颖的贴合治具设计，其舍弃了一般习知技术中两件贴合工件都藉由限位部或限位特征来固定位置的作法，而采用新颖的单工件式限位设计来进行贴合。如此，贴合胶就不会因为工件与贴合治具过于接近而引起毛细现象，进而导致过度溢胶等问题。
根据本发明的一实施例，其贴合治具包含一座体，其中央具有一开口及具有环绕该开口的复数个侧壁；一承载台，其悬设在该座体的开口中，该承载台用以承载一第一工件，承载时该第一工件的周缘会超出该承载台的周缘且与该侧壁间隔一定距离、以及至少一限位部设在该座体上，用以限制一从外部进入该开口的第二工件的位置，使得第二工件可以准确地与承载在该承载台上的该第一工件贴合。
根据本发明的另一实施例，其提出了一种贴合治具的使用方法，其步骤包含提供一贴合治具，该贴合治具包含一具有中央开口的座体、一悬设在该座体中央开口的承载台以及至少一设在该座体上的限位部，其中该限位部用以限制工件从外部进入该开口的位置；将一第一工件设置在该承载台上，使得该第一工件的周缘超出该承载台的周缘且与环绕该开口的侧壁间隔一定距离；使一第二工件经过该限位部的限位，使得该第二工件可以准确地与承载在该承载台上的该第一工件贴合。
无疑地，本发明的这类目的与其他目的在阅者读过下文以多种图示与绘图来描述的较佳实施例细节说明后将变得更为显见。
附图说明
本说明书含有附图并于文中构成了本说明书的一部分，俾使阅者对本发明实施例有进一步的了解。该些图示系描绘了本发明一些实施例并连同本文描述一起说明了其原理。在该些图示中：
第1图绘示出一般智慧型手机组装中习用的贴合治具的立体图；
第2图绘示出第1图中习用的贴合治具在实际贴合期间的截面图；
第3图绘示出根据本发明较佳实施例中一贴合治具的立体图；
第4图绘示出根据本发明较佳实施例中一第一工件承载在第3图中贴合治具的承载台上的顶视图；
第5图绘示出本发明较佳实施例中一第二工件在贴合期间受到贴合治具限位的顶视图；以及
第6图绘示出第3图中贴合治具在实际贴合期间的截面图。
须注意本说明书中的所有图示皆为图例性质。为了清楚与方便图示说明之故，图示中的各部件在尺寸与比例上可能会被夸大或缩小地呈现。图中相同的参考符号一般而言会用来标示修改后或不同实施例中对应或类似的特征。
具体实施方式
在下文的细节描述中，元件符号会标示在随附的图示中成为其中的一部份，并且以可实行该实施例的特例描述方式来表示。这类实施例会说明足够的细节俾使该领域的一般技艺人士得以具以实施。阅者须了解到本发明中亦可利用其他的实施例或是在不悖离所述实施例的前提下作出结构性、逻辑性、及电性上的改变。因此，下文的细节描述将不欲被视为是一种限定，反之，其中所包含的实施例将由随附的申请专利范围来加以界定。
首先请参照第3图，其绘示出根据本发明较佳实施例中一贴合治具200的立体图。如第3图所示，贴合治具200的主体是一座体201，其呈框架态样。座体201的中间具有一开口203及具有环绕该开口的复数个侧壁204，一承载台205系悬设在座体201的开口203中。座体201更包含一连接承载台205的支撑件，承载台205可藉由支撑件207悬设在开口203中，且可与环绕开口203的侧壁204间隔一定距离。侧壁204的数量、位置和形状可根据所贴合的工件作调整。承载台205系设来承载一第一工件，如智慧型手机中的触控基板(sensor glass)部件。在本实施例中，承载台205的承载面高度高于该支撑件207的高度，以避免贴合时贴合胶溢胶沾粘到支撑件207。
承载台205周遭的座体201上则形成有多个限位部209, 如图中所示分设在承载台205外侧的四个角落或是分设在座体201的四个角落处，其高度会高于承载台205，使得一第二工件在接近承载台205时会先受到此些限位部209的限位，以定位在预定的贴合位置上。贴合治具200上还可形成有凹槽210，方便用夹具夹取贴合后的工件。
现在请参照第4图，其绘示出根据本发明较佳实施例中一第一工件211承载在第3图中贴合治具200的承载台205上的顶视图。如第4图所示，一第一工件211系放置在承载台205上。在较佳的情况下，承载台205所承载的第一工件211的周缘会超出承载台205的周缘，如此将可确保贴合期间涂布在第一工件211上的贴合胶即便溢出也不会沾污到第一工件211下方的承载台205。在本发明实施例中，第一工件211与承载台205都呈矩形态样。然在其他实施例中，第一工件211与承载台205亦可为其他形状，如圆形，甚或是不规则形，端视所欲贴合的工件设计而定。再者，在本发明实施例中，贴合治具200的开口203大小系设计成当第一工件211放置在承载台205上时，第一工件211的周缘会与环绕开口203的侧壁204间隔一定的距离，如此将可确保贴合期间第一工件211不会与座体201的侧壁204过于接近而导致贴合胶润湿沾染到座体201。同样地，为避免贴合胶润湿沾染到限位部209，第一工件211会与限位部209之间间隔一定距离。
复参照第4图，在本发明较佳实施例中，贴合治具200上还可具有多个可移动式的定位件（或定位爪）213，定位件213设置在承载台205四周，用来定位所欲承载的第一工件211在承载台205上的位置。例如定位件213可进行X方向与Y方向的移动来推动放置在承载台205上的第一工件211，以将第一工件211移动到预定的贴合位置上。在另一实施例中，定位件213可通过吸附方式移动第一工件211，进而达到定位第一工件211的目的。另，可移动式的定位件（或定位爪）213也可以是远离限位部209而设置，以避免溢胶部分会如习知般的紧邻式设计而污染到定位件或限位部。
再者，承载台205的承载面上可设有多个气孔214，在以定位件213定位第一工件211后，第一工件211可经由气孔214以真空吸附方式固定在承载台205上，避免贴合时因第一工件211的移动而造成贴合不正确。在另一实施例中，承载台205可具有一定的黏着性，进而可以黏着方式固定第一工件211。在另一实施例中，当第一工件211为具有磁性的物质时，可于承载台205下方增加一磁力吸附装置，通过磁力吸附的方式将第一工件211固定于承载台205上。
接着请参照第5图，其绘示出本发明较佳实施例中一第二工件215在贴合期间受到贴合治具200限位的顶视图。在本发明实施例中，预定要与承载台205上的第一工件211进行贴合的第二工件215，如智慧型手机中的玻璃盖板部件(cover glass), 会先在压合机台(未示于图中)上进行点胶步骤，将贴合胶先均匀润湿散布在第二工件215的贴合面上。在贴合期间，压合机台会将第二工件215从贴合治具200的上方送入贴合治具200的开口203中。在此步骤，第二工件215会经过承载台205上方开口203四周座体201上所设的多个限位部209。在本发明实施例中，第二工件215的面积会大于第一工件的面积211，举例言之，智慧型手机中的触控基板面积会小于外层的保护性玻璃盖板，约略仅占该玻璃盖板上未形成有遮蔽层的萤幕显示区域而已。如第3图与第5图所示，贴合治具200的每一限位部209可为具有特定轮廓形状的凹部，其形状将会对应到所欲限位的第二工件215的周缘轮廓。如此，在多个限位部209的共同作用下，经过开口203的第二工件215将可被精确地限制在预定的贴合位置上，且在与第一工件211的贴合时位置不会因受力不均而偏移。
现在请参照第6图，其绘示出根据本发明较佳实施例中贴合治具200在实际贴合期间的截面图，此截面图系以第5图中的线B-B’为截线所作成，其可清楚表示出第一工件211、第二工件215、承载台205、以及限位部209之间的相对位置与距离。如第6图所示，第一工件211系固定在承载台205上，其周缘超出承载台205的周缘。第二工件215贴合面的特定区域上布有贴合胶217，在贴合期间，第二工件215会从贴合治具200上方进入开口203中，并受到限位部209的限位，使得第二工件215的贴合区域能精确地与第一工件211对准并贴合。从第6图中可以清楚地看出，第一工件211与第二工件215两工件中，只有面积较大的第二工件215会受到限位部209的限位而与贴合治具200接近或接触。面积较小的第一工件211因为不是利用贴合治具200的限位部209来限位，故其周缘不会与贴合治具200接近或接触(承载台205除外)。
根据上述本发明实施例所提出的贴合治具200，本发明亦提出了该贴合治具的使用方法，其步骤包含先提供一如第3图的贴合治具，该贴合治具包含一具有中央开口203的座体201、一悬设在该座体201中央开口203的承载台205以及至少一设在该座体201上的限位部209，其中该限位部209用以限制工件从外部进入该开口203的位置(该贴合治具的其他元件与相对应说明，已于上述实施例中揭露，在此不再赘述)，再将一第一工件211设置在该贴合治具的承载台205上(如第4图所示)，使得该第一工件211的周缘超出该承载台205的周缘且与环绕该承载台开口203的侧壁间隔一定距离，最后使一第二工件215经过该些限位部而被限位(如第5图与第6图所示)，因而使该第二工件215可以准确地与承载在该承载台上的该第一工件211贴合。贴合过程中，贴合胶可预先形成于第一工件211上，或者预先形成于第二工件215上。
本发明提出的该贴合治具的使用方法更包含使用一可移动的定位件来定位该第一工件设置在该承载台上的位置。本发明提出的该贴合治具的使用方法更包含利用真空吸附方式或粘着方式将该第一工件固定在该承载台上，或是利用磁力吸附方式将该第一工件固定在该承载台上。
透过本发明的设计，第一工件与第二工件之间的贴合胶即便溢胶也不会接触到贴合治具，故可防止过度溢胶所造成的污染情形发生，亦可避免水胶浪费，或是点胶量及贴合厚度不稳定等问题。
以上所述仅为本发明的较佳实施例，凡依本发明申请专利范围所做的均等变化与修饰，皆应属本发明的涵盖范围。

Claims (16)

  1. 一种贴合治具，其特征在于，包含：
    一座体，其中央具有一开口及具有环绕该开口的复数个侧壁；
    一承载台，其悬设在该座体的开口中，该承载台用以承载一第一工件，承载时该第一工件的周缘会超出该承载台的周缘且与该侧壁间隔一定距离；以及
    至少一限位部，设在该座体上用以限制一从外部进入该开口的第二工件的位置，使得该第二工件可以准确地与承载在该承载台上的该第一工件贴合。
  2. 根据权利要求1所述的贴合治具，其特征在于，该贴合治具更包含可移动的定位件，该定位件设置在该承载台四周且（或）远离该至少一限位部而设置，用来定位所欲承载的该第一工件在该承载台上的位置。
  3. 根据权利要求1所述的贴合治具，其特征在于，该座体更包括一连接该承载台的支撑件，该承载台藉由该支撑件悬设在该座体的开口中。
  4. 根据权利要求1所述的贴合治具，其特征在于，该承载台系以真空吸附方式或黏着方式固定该第一工件。
  5. 根据权利要求1所述的贴合治具，其特征在于，该第一工件具有磁性，且该第一工件通过磁力吸附的方式固定于该承载台上。
  6. 根据权利要求1所述的贴合治具，其特征在于，该承载台的承载面高度高于该支撑件的高度。
  7. 根据权利要求1所述的贴合治具，其特征在于，该限位部的高度高于该承载台。
  8. 根据权利要求1所述的贴合治具，其特征在于，该限位部分设在该座体的四个角落处且与该第一工件间隔一定距离。
  9. 根据权利要求1所述的贴合治具，其特征在于，该限位部为具有特定轮廓形状的凹部，其形状对应到所欲限位的该第二工件的周缘轮廓。
  10. 根据权利要求1所述的贴合治具，其特征在于，该第二工件的面积大于该第一工件的面积。
  11. 根据权利要求1所述的贴合治具，其特征在于，该第一工件是触控基板。
  12. 根据权利要求1所述的贴合治具，其特征在于，该第二工件是玻璃盖板。
  13. 一种贴合治具的使用方法，其特征在于，步骤包含：
    提供一贴合治具，该贴合治具包含一具有中央开口的座体、一悬设在该座体中央开口的承载台以及至少一设在该座体上的限位部，其中该限位部用以限制工件从外部进入该开口的位置；
    将一第一工件设置在该承载台上，使得该第一工件的周缘超出该承载台的周缘且与环绕该开口的侧壁间隔一定距离；以及
    使一第二工件经过该限位部的限位，使得该第二工件可以准确地与承载在该承载台上的该第一工件贴合。
  14. 根据权利要求13所述的贴合治具的使用方法，其特征在于，更包含使用一可移动的定位件来定位该第一工件设置在该承载台上的位置。
  15. 根据权利要求14所述的贴合治具的使用方法，其特征在于，更包含利用真空吸附方式或粘着方式将该第一工件固定在该承载台上。
  16. 根据权利要求14所述的贴合治具的使用方法，其特征在于，更包含利用磁力吸附方式将该第一工件固定在该承载台上。
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