WO2014072484A1 - Structure de support et dispositif d'éclairage équipé de ladite structure de support - Google Patents

Structure de support et dispositif d'éclairage équipé de ladite structure de support Download PDF

Info

Publication number
WO2014072484A1
WO2014072484A1 PCT/EP2013/073437 EP2013073437W WO2014072484A1 WO 2014072484 A1 WO2014072484 A1 WO 2014072484A1 EP 2013073437 W EP2013073437 W EP 2013073437W WO 2014072484 A1 WO2014072484 A1 WO 2014072484A1
Authority
WO
WIPO (PCT)
Prior art keywords
holding structure
plate
pressing member
pressing
shaped component
Prior art date
Application number
PCT/EP2013/073437
Other languages
English (en)
Inventor
Pengfei AN
Yabin Luo
Yuan Lu
Zesheng Ye
Original Assignee
Osram Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Gmbh filed Critical Osram Gmbh
Publication of WO2014072484A1 publication Critical patent/WO2014072484A1/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/004—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a holding structure for an illuminating device. Further, the present invention relates to an illuminating device with the above type of holding structure.
  • An LED is used as a light source in more and more fields with the development of the LED illuminating technology.
  • an LED chip is arranged on a circuit board, and since the LED chip is very sensitive to the temperature, a too high temperature will affect the luminous efficiency of the LED chip, and even shorten the lifetime of the LED chip.
  • a circuit board on which the LED chip is supported is mounted on the heat sink, and the circuit board, especially a region of the circuit board in which the LED chip is mounted, needs to be brought into close contact with the heat sink so as to reduce a ther ⁇ mal resistance in a heat conductive path.
  • the circuit board is generally fastened on the heat sink by screws.
  • the circuit board or a surface of the heat sink on which the circuit board is supported cannot be absolutely flat.
  • a gap may occur in each of regions be- tween the circuit board and the supporting surface other than a region fastened by the screws, which greatly increases the thermal resistance in the heat conductive path.
  • the circuit board is adhered to the heat sink by a potting adhesive at a circumferential edge of the circuit board.
  • the solution also fails to completely avoid the occurrence of a gap between the circuit board and the supporting surface.
  • the solution causes the illuminating device not to have a good appearance.
  • the heat sink is formed with a buckle structure for holding the circuit board. During the assembly, the circuit board is pushed by using its edge from a side of the heat sink into the buckle structure.
  • the solution can only ensure a reliable connection between the circuit board and the heat sink, and a gap between the circuit board and the supporting surface of the heat sink cannot be avoided at all.
  • a double sided tape is attached to a bottom surface of the circuit board, and then the circuit board is adhered to the supporting surface of the heat sink.
  • the double sided tape is poor in thermal conductance and is high in cost. Summary of the invention
  • the present invention provides a holding structure for an illuminating device.
  • the holding structure can reliably fix a plate-shaped component of the illuminating device, and allows the plate-shaped com- ponent to be brought in close contact with another structure of the holding structure so that a gap between the plate- shaped component and the another structure of the holding structure is as small as possible to reduce a thermal resis ⁇ tance in a heat conductive path between the plate-shape com- ponent and the another structure.
  • the present inven ⁇ tion provides an illuminating device with the above type of holding structure.
  • a first objective of the present invention is achieved by a holding structure for an illuminating device comprising a plate-shaped component, the holding structure comprising a base formed with an assembling surface on which the plate- shaped component is supported, wherein the holding structure further comprises at least one pressing member, the pressing member is snapped to the base, and the plate-shaped component is sandwiched between the base and the pressing member.
  • a distance from a surface of the press ⁇ ing member facing to the plate-shaped component to the assem ⁇ bling surface is at most equal to a thickness of the plate- shaped component.
  • the plate-shaped component is tightly pressed against the assembling surface of the base to avoid the occurrence of a gap between the plate-shaped component, especially a region of the plate-shaped component that corre ⁇ sponds to the pressing member, and the assembling surface of the base, thereby greatly decreasing a thermal resistance in a heat conductive path between them.
  • the pressing member comprises a pressing segment and locking segments formed on two opposed sides of the pressing segment, wherein the pressing segment abuts against the plate-shaped component, and the locking segments are locked to the base. Since the locking segments are formed on both sides of the pressing segment, it can be ensured that the pressing segment can be pressed with a uniform force against the plate-shaped component so as to avoid removal of contact of the plate- shaped component with the assembling surface of the base in its region corresponding to the pressing segment. It is preferred that an opening passing from one side to the other side of the pressing segment is formed in the pressing segment. The opening is first designed to expose an elec ⁇ tronic element on the plate-shaped component, and further can reduce a material of the pressing member to a certain extent so as to reduce the cost of the product.
  • the pressing segment is designed to have a flat plate shape.
  • the plate-shaped pressing segment in ⁇ creases a contact area with the plate-shaped component to en- sure that a region between the plate-shaped component and the assembling surface of the base in which no gap occurs is as large as possible.
  • a plurality of grooves are formed on a side of the pressing segment facing to the plate-shaped component, wherein a pressing surface against which the plate-shaped component is pressed is formed between the grooves.
  • the base further comprises fixing arms which extend on two opposed lateral sides of the assembling surface beyond the assembling surface and to which the locking segments are locked.
  • the fixing arms ex- tending on the assembled two opposed sides of the base just sandwich the pressing member therebetween at a position where they are assembled, and allow the locking segments to be just locked to the fixing arms.
  • each of the fixing arms comprises a stopping portion formed at a free end of the fixing arm to prevent the locking segment from being removed from the snap ⁇ ping connection with the fixing arm.
  • the fixing arms form two inverted L-shapes at both sides of the assembling surface of the base, and the two fixing arms face each other by a side of the respective L-shape.
  • the base further comprises at least two position limiting ribs formed on the assembling surface, wherein the plate-shaped component is arranged in a region defined by the position limiting ribs, and the posi- tion limiting ribs block sliding of the plate-shaped compo ⁇ nent with respect to the assembling surface.
  • a distance be ⁇ tween the two position limiting ribs is just equal to a length or width of the plate-shaped component so that the plate-shaped component can be just arranged in the region be- tween the two position limiting ribs to advantageously pre ⁇ vent sliding of the plate-shaped component towards directions of the position limiting ribs.
  • the pressing member is made of an elastic PC material or resin material.
  • the press- ing member is required to have elasticity especially in the locking segment thereof, thus during the assembly, the lock ⁇ ing segment can be elastically deformed when being pressed against one side of the stopping portion of the fixing arm so that the locking segment is allowed to pass across the stop- ping portion and be locked to the other side of the stopping portion after restored to its original state.
  • the base is designed as a heat sink.
  • an illuminating device comprising a light emitting assembly and the above type of holding structure.
  • the light emitting as ⁇ sembly of the illuminating device can be reliably held by the holding structure, and heat emitted by the light emitting as ⁇ sembly can be well transferred to the holding structure and then dissipated to surroundings.
  • the light emitting assembly comprises a circuit board designed as the plate-shaped component, and a plurality of LED chips arranged on the cir ⁇ cuit board.
  • the LED chip has the advantages of long lifetime, high luminous efficiency, environmental-friendliness and en ⁇ ergy saving.
  • the pressing member of the holding structure is pressed at a position between two LED chips against the cir ⁇ cuit board. More preferably, the pressing member of the hold- ing structure is pressed at a position of the LED chip against the circuit board, wherein the LED chip is exposed from an opening of a pressing member of the pressing member.
  • seamless heat conductive contact between the circuit board and a heat sink which is the base of the holding struc- ture can be ensured at the position of the LED chip where heat is the most concentrated, and thereby the heat dissipa ⁇ tion capability is greatly improved.
  • Fig. 1 is a sectional view of a holding structure in an as ⁇ Translatd state according to the present invention
  • Fig. 2 is a sectional view of a holding structure in an unas ⁇ Translatd state according to the present invention
  • Fig. 3 is a schematic diagram of a pressing member of the holding structure according to the present invention.
  • Fig. 4 is a schematic diagram of a base of the holding struc- ture according to the present invention.
  • Fig. 5 is a schematic diagram of a partial region of an illu ⁇ minating device according to the present invention.
  • Fig. 1 illustrates a sectional view of a holding structure 100 in an assembled state according to the present invention.
  • the holding structure 100 comprises a base 1 formed with an assembling surface 11 on which a plate-shaped component 2 is supported, wherein the holding structure 100 further comprises at least one pressing member 3, the pressing member 3 is snapped to the base 1, and the plate-shaped component 2 is sandwiched between the base 1 and the pressing member 3.
  • a dis ⁇ tance from a surface of the pressing member 3 facing to the plate-shaped component 2 to the assembling surface 11 is at most equal to a thickness of the plate-shaped component 2.
  • the plate-shaped component 2 is tightly pressed against the assembling surface 11 of the base 1 to avoid the occur ⁇ rence of a gap between the plate-shaped component 2, espe ⁇ cially a region of the plate-shaped component 2 that corre ⁇ sponds to the pressing member 3, and the assembling surface 11 of the base 1, thereby greatly decreasing a thermal resis- tance in a heat conductive path between them.
  • the base 1 is designed as a heat sink
  • the plate-shaped component 2 is a circuit board of a light emitting assembly of an illuminating device on which a plurality of LED chips 21 are generally arranged.
  • Fig. 2 is a sectional view of the holding structure 100 in an unassembled state according to the present invention. As is clear from the figure, the pressing member 3 has not been mounted to the base 1.
  • the pressing member 3 is pressed downwards in a direction repre- sented by an arrow in the figure so that the pressing member 3 is locked to the base 1, and the pressing member 3 can ap ⁇ ply a uniform pressing force to the plate-shaped component 2 in an assembled state since the pressing member 3 is locked to the base 1 at both sides thereof.
  • Fig. 3 is a schematic diagram of the pressing member 3 of the holding structure 100 according to the present invention.
  • the pressing member 3 comprises a pressing segment 31 and locking segments 32 formed on two opposed sides of the pressing segment 31, wherein the press ⁇ ing segment 31 abuts against the plate-shaped component 2, and the locking segments 32 are locked to the base 1.
  • the locking segments 32 first extend downwards from two lateral sides of the pressing segment 31 and then extend toward both sides of the pressing segment 31, i.e., extend in directions away from the pressing segment 31. It can be seen from the figure that an opening 311 passing from one side to the other side of the pressing segment 31 is formed in the pressing segment 31.
  • a plurality of grooves 312 are formed on a side of the pressing segment 31 facing to the plate-shaped component 2, wherein a pressing surface against which the plate-shaped component 2 is pressed is formed between the grooves.
  • the pressing member 3 is made of an elastic PC material or resin material.
  • the pressing member 3 is required to have elasticity especially in the locking segment 32 thereof so that it can be elasti- cally deformed during the assembly (referring to Fig. 2) .
  • Fig. 4 is a schematic diagram of the base 1 of the holding structure 100 according to the present invention.
  • the base 1 further comprises fixing arms 12 which extend on two opposed lateral sides of the as ⁇ sembling surface 11 beyond the assembling surface 11 and to which the locking segments 32 are locked.
  • each of the fixing arms 12 comprises a stopping portion 121 formed at a free end of the fixing arm 12.
  • the fixing arms 12 form two inverted L-shapes at both sides of the assembling surface 11 of the base 1, and the two fixing arms face each other by a side of the respective L-shape.
  • the stopping por ⁇ tion 121 prevents the locking segment 32 from being removed from the snapping connection with the fixing arm 12.
  • the base 1 further comprises at least two position limiting ribs 13 formed on the assembling surface 11, wherein the plate-shaped component 2 is arranged in a region defined by the position limiting ribs 13, and the position limiting ribs 13 block sliding of the plate-shaped component 2 with respect to the assembling surface 11.
  • FIG. 5 is a schematic diagram of a partial region of an illu ⁇ minating device 200 according to the present invention.
  • the pressing member 3 is pressed at a position of an LED chip 21 against the plate- shaped component 2 which is a circuit board, wherein the LED chip 21 is exposed from the opening 311 of the pressing segment 31 of the pressing member 3.
  • the pressing member 3 may be pressed at a position between two LED chips 2 against the circuit board 2.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

L'invention concerne une structure de support (100) destinée à un dispositif d'éclairage comportant un composant en forme de plaque (2), laquelle structure de support (100) comprend un socle (1) muni d'une surface d'assemblage (11) sur laquelle est soutenu le composant en forme de plaque (2), et comprend en outre au moins un organe de compression (3), ledit organe de compression (3) étant fixé par encliquetage sur le socle (1), et le composant en forme de plaque (2) étant intercalé entre le socle (1) et l'organe de compression (3). L'invention se rapporte également à un dispositif d'éclairage (200) équipé de la structure de support précitée (100).
PCT/EP2013/073437 2012-11-09 2013-11-08 Structure de support et dispositif d'éclairage équipé de ladite structure de support WO2014072484A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201210448253.6 2012-11-09
CN201210448253.6A CN103807817A (zh) 2012-11-09 2012-11-09 保持结构和具有该保持结构的照明装置

Publications (1)

Publication Number Publication Date
WO2014072484A1 true WO2014072484A1 (fr) 2014-05-15

Family

ID=49585370

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2013/073437 WO2014072484A1 (fr) 2012-11-09 2013-11-08 Structure de support et dispositif d'éclairage équipé de ladite structure de support

Country Status (2)

Country Link
CN (1) CN103807817A (fr)
WO (1) WO2014072484A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202015104043U1 (de) * 2014-12-08 2016-03-09 Tridonic Gmbh & Co Kg Befestigungsbrücke zur Befestigung von LED-Modulen an Befestigungsschienen
DE102016124556A1 (de) * 2016-12-15 2018-06-21 Osram Gmbh Leuchte mit Tragschiene und Befestigungselement für eine Platine
DE102017102063A1 (de) 2017-02-02 2018-08-02 Siteco Beleuchtungstechnik Gmbh Werkzeugloses Montagesystem für eine LED-Baugruppe in einer Leuchte höherer Schutzart
CN110005976A (zh) * 2018-11-16 2019-07-12 咏铨洁能科技有限公司 掀盖型灯具
FR3081673A1 (fr) * 2018-05-22 2019-11-29 Alstom Transport Technologies Ensemble comprenant au moins un composant electronique, un support et un dispositif de fixation
US10618935B2 (en) 2015-11-03 2020-04-14 Industrial Technology Research Institute Antibody-drug conjugate (ADC) and method for forming the same

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106313886B (zh) * 2016-10-12 2019-05-17 上海舜哲机电科技有限公司 一种led柔版印刷固化设备
CN106313885B (zh) * 2016-10-12 2019-05-17 上海舜哲机电科技有限公司 一种led胶版印刷固化设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202006017583U1 (de) * 2006-11-17 2008-03-27 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Beleuchtungsvorrichtung
DE102010031312A1 (de) * 2010-07-14 2012-01-19 Osram Ag Befestigungselement, Leuchtmodul und Leuchtvorrichtung
DE102010031190A1 (de) * 2010-07-09 2012-02-09 Trilux Gmbh & Co. Kg Leuchtkörper mit LEDs
DE102010041471A1 (de) * 2010-09-27 2012-03-29 Zumtobel Lighting Gmbh Leuchtmodulanordnung mit einer LED auf einer Platine
US20120175655A1 (en) * 2011-01-06 2012-07-12 Lextar Electronics Corporation Light emitting diode cup lamp

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202006017583U1 (de) * 2006-11-17 2008-03-27 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Beleuchtungsvorrichtung
DE102010031190A1 (de) * 2010-07-09 2012-02-09 Trilux Gmbh & Co. Kg Leuchtkörper mit LEDs
DE102010031312A1 (de) * 2010-07-14 2012-01-19 Osram Ag Befestigungselement, Leuchtmodul und Leuchtvorrichtung
DE102010041471A1 (de) * 2010-09-27 2012-03-29 Zumtobel Lighting Gmbh Leuchtmodulanordnung mit einer LED auf einer Platine
US20120175655A1 (en) * 2011-01-06 2012-07-12 Lextar Electronics Corporation Light emitting diode cup lamp

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202015104043U1 (de) * 2014-12-08 2016-03-09 Tridonic Gmbh & Co Kg Befestigungsbrücke zur Befestigung von LED-Modulen an Befestigungsschienen
EP3032170A1 (fr) * 2014-12-08 2016-06-15 Tridonic Jennersdorf GmbH Dispositif de fixation destine a fixer des modules a del sur des rails de fixation
US10618935B2 (en) 2015-11-03 2020-04-14 Industrial Technology Research Institute Antibody-drug conjugate (ADC) and method for forming the same
DE102016124556A1 (de) * 2016-12-15 2018-06-21 Osram Gmbh Leuchte mit Tragschiene und Befestigungselement für eine Platine
EP3339724A1 (fr) * 2016-12-15 2018-06-27 Siteco Beleuchtungstechnik GmbH Éclairage à rail de support et élément de fixation pour une platine
DE102017102063A1 (de) 2017-02-02 2018-08-02 Siteco Beleuchtungstechnik Gmbh Werkzeugloses Montagesystem für eine LED-Baugruppe in einer Leuchte höherer Schutzart
FR3081673A1 (fr) * 2018-05-22 2019-11-29 Alstom Transport Technologies Ensemble comprenant au moins un composant electronique, un support et un dispositif de fixation
CN110005976A (zh) * 2018-11-16 2019-07-12 咏铨洁能科技有限公司 掀盖型灯具

Also Published As

Publication number Publication date
CN103807817A (zh) 2014-05-21

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