WO2014071793A1 - 触控感应电极结构及其制造方法 - Google Patents

触控感应电极结构及其制造方法 Download PDF

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Publication number
WO2014071793A1
WO2014071793A1 PCT/CN2013/085234 CN2013085234W WO2014071793A1 WO 2014071793 A1 WO2014071793 A1 WO 2014071793A1 CN 2013085234 W CN2013085234 W CN 2013085234W WO 2014071793 A1 WO2014071793 A1 WO 2014071793A1
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WO
WIPO (PCT)
Prior art keywords
sensing electrode
touch sensing
connecting portion
electrode structure
transmission line
Prior art date
Application number
PCT/CN2013/085234
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English (en)
French (fr)
Inventor
张振炘
钟斌
汪福定
费祯君
陈丽娴
Original Assignee
宝宸（厦门）光学科技有限公司
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Publication of WO2014071793A1 publication Critical patent/WO2014071793A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display

Definitions

  • the present invention relates to a touch sensor, and more particularly to a touch sensing electrode structure and a method of manufacturing the touch sensing electrode structure.
  • touch panels can be roughly classified into capacitive, resistive, surface acoustic wave, and infrared inductive touch panels according to the working principle; among them, capacitive touch panels are most widely used.
  • a capacitive touch panel generally includes a substrate, an inductive electrode on the substrate, and a metal signal transmission line located in a peripheral region of the substrate.
  • the sensing electrode is composed of a body portion and a connecting portion connected to the bottom portion of the body portion, wherein the connecting portion has a width smaller than a half width of the bottom portion of the body portion.
  • the signal transmission line is composed of a head and a tail lead, wherein the head of the signal transmission line is a connection portion stacked on the sensing electrode and the two are similar in size.
  • the capacitive touch panel is attached to the electronic component as a touch device for the user to perform a touch operation.
  • the user can easily put the static electricity on the body into the gap during the touch operation and accumulate on the peripheral area of the touch panel.
  • connection of the sensing electrode has a large impedance (about several thousand ohms), and the heat generated by the static electricity is relatively large. Since the width of the connecting portion is less than half the width of the bottom portion of the body portion, the sensing electrode connecting portion is relatively large in area due to other factors (such as length, height, etc.), so that the amount of static electricity distributed over a unit area is relatively large. Further, the heat generated by the sensing electrode connection portion is burned and broken due to difficulty in being exported, and the touch panel is scrapped. Therefore, the capacitive touch panel has poor antistatic capability.
  • the present invention provides a touch sensing electrode structure capable of reducing the amount of static electricity per unit area of the sensing electrode connection portion, thereby reducing the amount of heat generated by static electricity and further improving the antistatic level.
  • the invention provides a touch sensing electrode structure, comprising: a sensing electrode, comprising: a body portion and a connecting portion connected to a bottom portion of the body portion, wherein a width of the connecting portion is greater than or equal to a half width of a bottom portion of the body portion; and a signal transmission line
  • the head includes a tail lead connected to the head, wherein a head of the signal transmission line is a connection portion of the sensing electrode and is electrically connected to the connecting portion.
  • the connecting portion has a rectangular or trapezoidal shape.
  • the width of the connecting portion is equal to a half width of the bottom of the body portion.
  • the connecting portion is located at an intermediate position of the bottom of the body portion.
  • the connecting portion is located at one end of the bottom of the body portion.
  • the head of the signal transmission line completely covers the connection.
  • the width of the connecting portion is equal to the width of the bottom of the body portion.
  • the head of the signal transmission line covers the connection portion of the portion.
  • the head of the signal transmission line is stacked in the middle of the connection.
  • the head of the signal transmission line is stacked on one side of the connection portion.
  • the head of the signal transmission line completely covers the connection.
  • the connecting portion has a first edge adjacent to the bottom of the body portion and a second edge away from the bottom of the body portion, wherein a distance between the first edge and the second edge is 0.02 to 0.4 mm.
  • the signal transmission line material is selected from the group consisting of molybdenum aluminum molybdenum, silver, copper or carbon glue.
  • the touch sensing electrode structure further includes a substrate, and the touch sensing electrode structure is disposed on a substrate.
  • the touch sensing electrode structure further includes a shielding layer, wherein the shielding layer is sandwiched between the substrate and the touch sensing electrode structure.
  • the present invention provides a method for manufacturing a touch sensing electrode structure, comprising the steps of: forming a sensing electrode, the sensing electrode comprising a body portion and a connecting portion connected to a bottom portion of the body portion, wherein a width of the connecting portion is greater than or equal to the body a half of the width of the bottom portion; and a signal transmission line, wherein the signal transmission line includes a head and a tail lead connected to the head, wherein a head of the signal transmission line is a connection portion of the sensing electrode and is connected to the connection portion Electrical connection.
  • the connecting portion is rectangular or trapezoidal.
  • the width of the connecting portion is equal to a half width of the bottom of the body portion.
  • the connecting portion is located at an intermediate position of the bottom of the body portion.
  • the connecting portion is located at one end of the bottom of the body portion.
  • the head of the signal transmission line completely covers the connection.
  • the width of the connecting portion is equal to the width of the bottom of the body portion.
  • the head of the signal transmission line covers half of the area of the connection portion.
  • the head of the signal transmission line is stacked in the middle of the connection.
  • the head of the signal transmission line is stacked on one side of the connection portion.
  • the head of the signal transmission line completely covers the connection.
  • the connecting portion has a first edge adjacent to the bottom of the body portion and a second edge away from the bottom of the body portion, wherein a distance between the first edge and the second edge is 0.02 to 0.4 mm.
  • the signal transmission line material is selected from the group consisting of molybdenum aluminum molybdenum, silver, copper or carbon glue.
  • the method for manufacturing the touch sensing electrode structure further includes: forming the touch sensing electrode structure on a substrate.
  • the method for manufacturing the touch sensing electrode structure further includes: forming a shielding layer, wherein the shielding layer is disposed in the peripheral region and is sandwiched between the substrate and the touch sensing electrode structure.
  • the present invention when the electrostatic level is too high, the amount of static electricity distributed over the unit area is reduced by increasing the width of the connecting portion, thereby reducing the heat generated in the connecting portion of the sensing electrode without being easily burned.
  • the invention can improve the antistatic level of the touch sensing electrode structure.
  • FIG. 1 is a schematic structural view of a touch sensing electrode according to a first preferred embodiment of the present invention
  • Figure 2 is a partial enlarged view of A in Figure 1;
  • Figure 3 is a cross-sectional view taken along line BB' of Figure 2;
  • FIG. 5 is a schematic structural view of a touch sensing electrode according to a second preferred embodiment of the present invention.
  • FIG. 6 is a schematic structural diagram of a touch sensing electrode according to a third preferred embodiment of the present invention.
  • FIG. 7 is a schematic structural view of a touch sensing electrode according to a fourth preferred embodiment of the present invention.
  • FIG. 8 is a schematic structural view of a touch sensing electrode according to a fifth preferred embodiment of the present invention.
  • FIG. 9 is a schematic structural view of a touch sensing electrode according to a sixth preferred embodiment of the present invention.
  • FIG. 10 is a flow chart of a method for fabricating a touch sensing electrode structure according to an embodiment.
  • FIG. 1 is a schematic structural view of a touch panel according to an embodiment of the present invention
  • FIG. 2 is a partial enlarged view of a region A in FIG. 1
  • FIG. 3 is a cross-sectional view taken along line BB' of FIG.
  • the touch panel 100 includes a substrate 40 and a touch sensing electrode structure 10 disposed on the substrate 40 .
  • the substrate 40 is divided into a touch area M1 and a peripheral area M2 surrounding the touch area M1.
  • the substrate 40 can be various transparent or opaque materials, and is not limited to a rigid substrate or a flexible substrate, such as glass, polycarbonate (Polycarbonate, PC), polyethylene terephtalate (PET), polymethylmethacrylate (Polymethylmethacrylate) PMMA), polysulfone (PES) or other cyclic olefin copolymer.
  • the touch sensing electrode structure 10 includes a sensing electrode 20 and a signal transmission line 30.
  • the sensing electrode 20 includes a plurality of first sensing pads 211 distributed along a first direction and a plurality of second sensing pads 212 distributed along a second direction. Two adjacent first sensing pads 211 are connected by wires 23. Two adjacent second sensing pads 212 are respectively disposed on both sides of the wires 23, and are connected to each other by the conductive bridges 24 crossing the wires 23, and the conductive bridges 24 and the wires are held by an insulating layer (not shown) or the like. Electrical insulation between 23. It should be noted that the above embodiments are not intended to limit the present invention.
  • the sensing electrode 20 can be composed of a plurality of electrode axes that are parallel to each other.
  • the sensing pad 211 a having a complete pattern or the sensing pad 211 b having an incomplete pattern may be used.
  • the second sensing pad 212 may also be complete.
  • the patterned sensing pad 212a or the sensing pad 212b having an incomplete pattern. 2 illustrates a sensing pad having an incomplete pattern, wherein the sensing pad of the incomplete pattern, if distributed along a first direction, is an incomplete pattern of sensing pads 211b; if distributed along a second direction,
  • the sensing pad 212b, which is an incomplete pattern is represented by the body portion 21 in either case. If the sensing electrode 20 is composed of a plurality of mutually parallel electrode axes, it is a complete pattern of electrode axes, and there is no so-called complete or incomplete pattern of sensing pads.
  • a connecting portion 22 is connected to the bottom of the main body portion 21, wherein the main body portion 21 is disposed in the touch area M1 of the substrate 40, and the connecting portion 22 can be disposed in the peripheral area M2 of the substrate 40 and adjacent to the body.
  • the bottom of the portion 21 is disposed and electrically connected to the signal transmission line 30.
  • the width of the connecting portion 22 is greater than or equal to half the width of the bottom of the body portion 21.
  • the shape of the connecting portion 22 is substantially rectangular and occupies the entire width of the bottom of the body portion 21.
  • the shape of the connecting portion 22 can be designed according to the actual product application requirements, for example, it can be designed as a trapezoid or any other geometric shape, and the embodiment is not limited thereto.
  • the connecting portion 22 has a first edge adjacent to the bottom of the body portion 21 and a second edge away from the bottom of the body portion, wherein the distance between the first edge and the second edge is 0.02 ⁇ 0.4 mm, The distance is set according to the controller and the touch panel, and is not limited thereto.
  • the material of the sensing electrode 20 may include various transparent conductive materials, for example, indium tin oxide (indium tin oxide, ITO), indium zinc oxide (IZO), cadmium tin oxide (CTO), aluminum oxide zinc (aluminum) Zinc oxide, AZO), indium tin zinc oxide (ITZO), zinc oxide, cadmium Oxide), hafnium oxide (HfO), indium gallium zinc oxide (indium gallium zinc oxide, InGaZnO), indium gallium zinc magnesium oxide (InGaZnMgO), indium gallium oxide (indium) Gallium magnesium oxide, InGaMgO) or indium gallium aluminum oxide (indium gallium aluminum oxide, InGaAlO), but the above materials are not intended to limit the invention.
  • ITO indium tin oxide
  • ITO indium zinc oxide
  • IZO indium zinc oxide
  • CTO aluminum oxide zinc (aluminum) Zinc oxide
  • ITZO indium tin zinc oxide
  • the signal transmission line 30 is disposed in the peripheral region M2 of the substrate 40 and includes a head portion 31 and a tail lead 32 connected to the head portion 31.
  • the head 31 of the signal transmission line 30 is stacked on the connection portion 22 and electrically connected to the connection portion 22 .
  • the head 31 can cover a portion of the connecting portion 22, for example, the head 31 covers a width of more than half of the connecting portion 22.
  • the head 31 is stacked at an intermediate position of the connecting portion 22, but in practice, the positional relationship between the head 31 and the connecting portion 22 is designed according to actual product application requirements, for example, the head 31 may be stacked on the head 31 One side (upper side or lower side) of the connecting portion 22, but the embodiment is not limited thereto.
  • the material of the signal transmission line 30 is a metal such as molybdenum aluminum molybdenum, silver, copper or carbon glue. However, since silver has good conductivity and low impedance in the metal, it is preferable that the signal transmission line 30 is made of silver.
  • the signal transmission line 30 can be formed by a method such as plating or printing, but the present invention is not limited thereto.
  • FIG. 4 is a cross-sectional view of another preferred touch panel.
  • the substrate 40 should be a substrate formed of a transparent material, and the touch region M1 and the peripheral region M2 can be used to define the display region and the non-display region.
  • the substrate 40 of the touch panel is a cover substrate, which can simultaneously carry the touch sensing electrode structure 10 and the protection function.
  • the upper cover substrate further includes a shielding layer 50 , and the shielding layer 50 is sandwiched between Between the substrate 40 and the touch sensing electrode 10, in a preferred embodiment, the shielding layer 50 is formed on the substrate 40 and located in the peripheral region M2 of the substrate 40, wherein in the peripheral region M2, the connecting portion 22 and the signal The transmission lines 30 are all disposed above the shielding layer 50.
  • the shielding layer 50 is usually composed of an opaque material, such as a black resin or a black photoresist material, or a high insulating ink having a low dielectric constant, etc., so that the substrate 40 is opposed to the other side of the touch sensing electrode structure 10
  • the other electronic components such as the signal transmission line 30 and the like of the sensing electrode structure layer can be shielded from being exposed to the user interface, thereby achieving an aesthetic effect.
  • the substrate 40 may be a non-transparent substrate, and the shielding layer 50 may be removed from the touch panel 100.
  • FIG. 5 is a schematic structural view of a touch sensing electrode according to a second preferred embodiment of the present invention.
  • the touch sensing electrode structure 11 is different from the touch sensing electrode structure 10 of the first preferred embodiment in that the head 31 of the signal transmission line 30 completely covers the entire connecting portion 22.
  • FIG. 6 is a schematic structural diagram of a touch sensing electrode according to a third preferred embodiment of the present invention.
  • This embodiment provides a touch sensing electrode structure 12.
  • the touch sensing electrode structure 12 is different from the touch sensing electrode structure 10 of the first preferred embodiment in that the connecting portion 22 is disposed adjacent to the bottom of the body portion 21 and electrically connected to the signal transmission line 30.
  • the width of the connecting portion 22 is half of the width of the bottom portion of the body portion 21.
  • the connecting portion 22 is located at an intermediate position of the bottom of the body portion 21, but in practice, the position of the connecting portion 22 can be designed according to actual product application requirements, for example, the position of the connecting portion 22 can be located at the bottom of the body portion 21.
  • the embodiment is not limited thereto.
  • FIG. 7 is a schematic structural diagram of a touch sensing electrode according to a fourth preferred embodiment of the present invention.
  • the touch sensing electrode structure 13 provided in this embodiment is different from the touch sensing electrode structure 10 of the first preferred embodiment in that the connecting portion 22 is trapezoidal and actually extends from the bottom of the body portion 21. section.
  • the head 31 of the signal transmission line 30 covers more than half of the width of the connecting portion 22.
  • the head 31 is overlapped at the intermediate position of the connecting portion 22, but in practice, the position of the head 31 and the connecting portion 22 are The relationship is designed according to the actual product application requirements.
  • the head 31 may be stacked on one side (upper side or lower side) of the connecting portion 22, but the embodiment is not limited thereto.
  • FIG. 8 is a schematic structural diagram of a touch sensing electrode according to a fifth preferred embodiment of the present invention.
  • the touch sensing electrode structure 14 provided in this embodiment is different from the touch sensing electrode structure 11 of the second preferred embodiment in that the connecting portion 22 is trapezoidal, and the head 31 of the signal transmission line 30 completely covers the entire connecting portion. twenty two.
  • FIG. 9 is a schematic structural diagram of a touch sensing electrode according to a sixth preferred embodiment of the present invention.
  • the touch sensing electrode structure 15 provided in this embodiment is different from the touch sensing electrode structure 12 of the third preferred embodiment in that the connecting portion 22 is trapezoidal, and the head 31 of the signal transmission line 30 completely covers the entire connecting portion. twenty two.
  • the connecting portion 22 is located at an intermediate position of the bottom of the body portion 21, but in practice, the position of the connecting portion 22 can be designed according to actual product application requirements, for example, the position of the connecting portion 22 can be located at the bottom of the body portion 21. At one end, the embodiment is not limited thereto.
  • the signal transmission line 30 connects the static electricity to the connection.
  • the electrostatic transmission path of the portion 22 also increases correspondingly, and the amount of static electricity per unit area of the connecting portion 22 decreases due to an increase in the transmission path. According to Joule's law, the heat generated per unit area of the connecting portion 22 is also correspondingly lowered, thereby improving the antistatic level of the touch sensing electrode structure.
  • a method for fabricating a touch sensing electrode structure includes the following steps:
  • S102 forming a sensing electrode, specifically forming the sensing electrode on a substrate, and forming a transparent conductive film on the substrate by spin coating, electroplating, sputtering, printing, or the like, and then performing a photolithography process.
  • the transparent conductive film is etched into a sensing electrode of a desired electrode pattern.
  • the material of the sensing electrode is, for example, indium tin oxide (indium) Tin oxide, ITO), indium zinc oxide (IZO), cadmium tin oxide (cadmium tin oxide, CTO), aluminum zinc oxide (AZO), indium tin zinc oxide (ITZO), zinc oxide (zinc) Oxide, cadmium oxide, hafnium oxide (HfO), indium gallium zinc Oxide, InGaZnO), indium gallium zinc magnesium oxide (indium gallium zinc magnesium oxide, InGaZnMgO), indium gallium magnesium oxide (InGaMgO) or indium gallium Aluminum oxide, InGaAlO), but the above materials are not intended to limit the invention.
  • the formed sensing electrode includes a plurality of first sensing pads distributed along the first direction and a plurality of second sensing pads distributed along the second direction. Two adjacent first sensing pads are connected by wires, and two adjacent second sensing pads are respectively placed on both sides of the wires to connect with each other across the wire bridges of the wires. It is noted herein that the above embodiments are not intended to limit the invention.
  • the first or second sensing pad may have a full pattern of sensing pads or a sensing pad with an incomplete pattern.
  • the first sensing pad distributed in the first direction or the second sensing pad distributed in the second direction is defined as a body portion.
  • a connecting portion is connected to the bottom of the main body, wherein the main body portion is disposed in the touch area of the substrate, and the connecting portion is located in a peripheral area surrounding the touch area, wherein the connecting portion has a width greater than or equal to a half width of the bottom of the main body portion.
  • the connecting portion has a first edge adjacent to the bottom of the body portion and a second edge away from the bottom of the body portion, wherein the distance between the first edge and the second edge is 0.02 ⁇ 0.4 mm, and the specific distance is Controller and touch panel to set.
  • S104 Form a signal transmission line, wherein the signal transmission line includes a head and a tail lead connected to the head, wherein a head of the signal transmission line is a connection portion of the sensing electrode and is electrically connected to the connection portion.
  • the signal transmission line is printed on the peripheral area of the substrate by printing.
  • the head of the signal transmission line is aligned and printed on the connecting portion to realize a connection portion of the sensing electrode and is electrically connected to the connecting portion.
  • the signal transmission line material is selected from a metal such as molybdenum aluminum molybdenum, silver, copper or carbon glue, and is formed by photolithography or printing, but the invention is not limited thereto. However, since silver has good conductivity and low impedance in the metal, it is preferable that the signal transmission line is made of silver.
  • the method further includes the step S106 of forming a shielding layer between the substrate and the touch sensing electrode layer.
  • the shielding layer can be formed by printing, electroplating or the like.
  • the material selected may be a black resin, a black photoresist material, or a high insulating ink having a low dielectric constant, and the invention is not limited thereto.
  • only the main steps are listed in the method of the embodiment, and other necessary conventional steps will not be described here.
  • width, shape of the connecting portion, the formation area of the signal transmission line, and the relative position of the connecting portion are the same as those described in the preferred embodiment of the present invention, for example:
  • the width of the connecting portion is equal to the width of the bottom portion of the body portion
  • the head portion of the signal transmission line covers the connecting portion of the portion
  • the head portion of the signal transmission line may be stacked in the middle or one side of the connecting portion.
  • the width of the connecting portion is equal to the width of the bottom portion of the body portion, and the head of the signal transmission line completely covers the connecting portion.
  • the width of the connecting portion is equal to half the width of the bottom portion of the body portion, and the head of the signal transmission line completely covers the connecting portion.
  • the connecting portion may be located at an intermediate position at the bottom of the body portion or at one end of the bottom portion of the body portion.
  • the pattern of the connecting portion may be a rectangle or a trapezoid, and other materials or components in the detailed connection relationship between the components, etc., are described in the foregoing embodiments, and are not described herein again.
  • the invention provides a touch sensing electrode structure and a manufacturing method thereof.
  • the electrostatic level is too high, the amount of static electricity distributed over a unit area is reduced by increasing the width of the connecting portion, thereby reducing the connection of the sensing electrode portion.
  • the heat is reduced and is not easily burned. Therefore, the present invention can improve the antistatic level of the touch sensing electrode structure.
  • the width of the connecting portion and the main body portion are the same, the overlapping area of the head portion of the signal transmission line and the connecting portion is the largest, so that the amount of static electricity distributed over the unit area can be greatly reduced, thereby greatly reducing the connection of the sensing electrode.
  • the heat generated here ensures that the touch sensing electrode structure is not easily burned, and the touch sensing electrode structure has the highest antistatic rating.

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Abstract

本发明提供一种触控感应电极结构，包括感应电极，该感应电极包括本体部及与本体部底部连接的连接部，其中该连接部的宽度是大于或等于该本体部底部的一半宽度；以及信号传输线包括头部及与该头部连接的尾部引线，其中该信号传输线的头部是叠设于该感应电极的连接部且与该连接部电性连接。此外，本发明还提供了一种触控感应电极结构的制造方法。本发明在于提供一种能够透过降低感应电极连接部单位面积上的静电量来降低静电产生的热量，进而提高抗静电等级的触控感应电极结构。

Description

触控感应电极结构及其制造方法 技术领域
本发明涉及一种触控传感器，尤指一种触控感应电极结构以及该触控感应电极结构的制造方法。
背景技术
随着科学技术的发展，许多电子产品已由传统的键盘或者鼠标作为输入设备，转变为使用触控面板作为输入设备。现有触控面板根据工作原理可以大致分为：电容式、电阻式、表面声波式以及红外线感应式等触控面板；其中电容式触控面板应用最为广泛。
电容式触控面板通常包括基板、位于基板上的感应电极、位于基板周边区域的金属信号传输线。其中感应电极是由本体部及与本体部底部连接的连接部所组成，其中，连接部的宽度是小于本体部底部的一半宽度。信号传输线是由头部与尾部引线所组成，其中信号传输线的头部是叠设于感应电极的连接部且两者尺寸大小相近。电容式触控面板贴附于电子组件上作为触控装置供用户进行触碰操作。由于触控面板与电子组件之间存在间隙，用户在触碰操作的过程中容易将身上带的静电窜入间隙并累积在触控面板的周边区域上。另，空气中存在大量的静电也会累积在触控面板周边区域上。因此静电对于位于周边区域的电极连接部与信号传输线的影响比较大，而根据焦耳定律Q=I2Rt, 静电经过信号传输线或感应电极时势必会产生热量。由于金属信号传输线的阻抗较小（约为几百奥姆），静电经过金属信号传输线产生热量不足以将导线烧毁。但感应电极的连接部阻抗较大（约为几千奥姆），静电在此处经过产生的热量相对也较大。由于连接部的宽度是小于本体部底部的一半宽度，在其他因素(如长度、高度等)固定下，感应电极连接部因其面积不大，使得其在单位面积上分布的静电量相对很大，进而使感应电极连接部此处所产生的热量因不容易导出而被烧毁形成断路，导致触控面板报废。因此，这种电容式触控面板的防静电能力较差。
发明内容
本发明在于提供一种能够透过降低感应电极连接部单位面积上的静电量来降低静电产生的热量，进而提高抗静电等级的触控感应电极结构。
本发明提供一种触控感应电极结构，包括：感应电极，包括本体部及与本体部底部连接的连接部，其中该连接部的宽度是大于或等于该本体部底部的一半宽度；以及信号传输线包括头部及与该头部连接的尾部引线，其中该信号传输线的头部是叠设于该感应电极的连接部且与该连接部电性连接。该连接部形状为矩形或梯形。
进一步的，该连接部的宽度等于该本体部底部的一半宽度。该连接部位于该本体部底部的中间位置。该连接部位于该本体部底部的一端。该信号传输线的头部完全覆盖该连接部。
进一步，该连接部的宽度等于该本体部底部的宽度。该信号传输线的头部覆盖部分的该连接部。该信号传输线的头部叠设于该连接部的中间。该信号传输线的头部叠设于该连接部的一侧。该信号传输线的头部完全覆盖该连接部。
进一步的，该连接部具有一紧邻该本体部底部的第一边缘与一远离该本体部底部的第二边缘，其中该第一边缘与该第二边缘之间的距离为0.02~0.4mm。
进一步的，该信号传输线材料选自钼铝钼、银、铜或碳胶。
进一步的，该触控感应电极结构更包括一基板，该触控感应电极结构设置于一基板上。
进一步的，该触控感应电极结构更包括一遮蔽层，其中该遮蔽层且夹设于该基板与该触控感应电极结构之间。
本发明提供一种触控感应电极结构的制造方法，包括如下步骤：形成感应电极，该感应电极包括本体部及与本体部底部连接的连接部，其中该连接部的宽度是大于或等于该本体部底部的一半宽度；以及形成信号传输线，其中该信号传输线包括头部及与该头部连接的尾部引线，其中该信号传输线的头部是叠设于该感应电极的连接部且与该连接部电性连接。该连接部为矩形或梯形。
进一步的，该连接部的宽度等于该本体部底部的一半宽度。该连接部位于该本体部底部的中间位置。该连接部位于该本体部底部的一端。该信号传输线的头部完全覆盖该连接部。
进一步的，该连接部的宽度等于该本体部底部的宽度。该信号传输线的头部覆盖部分的该连接部面积的一半。该信号传输线的头部叠设于该连接部的中间。该信号传输线的头部叠设于该连接部的一侧。该信号传输线的头部完全覆盖该连接部。
进一步的，该连接部具有一紧邻该本体部底部的第一边缘与一远离该本体部底部的第二边缘，其中该第一边缘与该第二边缘之间的距离为0.02~0.4mm。
进一步的，该信号传输线材料选自钼铝钼、银、铜或碳胶。
进一步的，该触控感应电极结构的制造方法，更进一步包括：形成该触控感应电极结构于一基板上。
进一步的，该触控感应电极结构的制造方法，进一步更包括：形成一遮蔽层，其中该遮蔽层设于该周边区域内，且夹设于该基板与该该触控感应电极结构之间。
采用本发明，当静电等级过高时，透过增加连接部的宽度来降低其在单位面积上分布的静电量，进而降低感应电极连接部此处产生的热量降低而不容易被烧毁，因此，本发明可以提高触控感应电极结构的抗静电等级。
附图说明
图1是本发明之第一较佳实施例的触控感应电极结构示意图；
图2是图1中A的局部放大图；
图3是图2沿剖面线BB’的剖面图；
图4是另一较佳触控面板的剖面图；
图5是本发明之第二较佳实施例的触控感应电极结构示意图；
图6为本发明之第三较佳实施例的触控感应电极结构示意图；
图7是本发明之第四较佳实施例的触控感应电极结构示意图；
图8是本发明之第五较佳实施例的触控感应电极结构示意图；
图9是本发明之第六较佳实施例的触控感应电极结构示意图；及
图10是一实施例的触控感应电极结构制造方法流程图。
具体实施方式
为使能更进一步了解本发明之特征及技术内容，请参阅以下有关本发明之详细说明与附图，但是此等说明与所附图式仅是用来说明本发明，而非对本发明的权利范围作任何的限制。
请合并参阅图1、图2和图3。其中，图1是本发明一实施例的触控面板结构示意图；图2是图1中A区域的局部放大图；图3是图2沿剖面线BB’的剖面图。该触控面板100包括基板40和设于基板40上的触控感应电极结构10。
基板40划为一触控区域M1以及围绕该触控区域M1的一周边区域M2。基板40可为各种透明或不透明材质，不限于硬质基板或是可挠性基板，例如玻璃、聚碳酸酯（Polycarbonate, PC）、聚对苯二甲酸乙二酯（Polyethylene terephtalate, PET）、聚甲基丙烯酸甲酯（Polymethylmethacrylate, PMMA）、聚砜（Polysulfone, PES）或者其他环烯共聚物（cyclic olefin copolymer）等。
该触控感应电极结构10包括感应电极20与信号传输线30。感应电极20包括复数沿第一方向分布的第一感测垫211与复数沿第二方向分布的第二感测垫212。其中两相邻的第一感测垫211之间以导线23连接。两相邻第二感测垫212分别置于导线23的两侧边，而以横跨导线23的导电桥24连接彼此，并以绝缘层（图中未标示）等方式保持导电桥24与导线23之间的电性绝缘。在此请注意，上述实施方式并非用以限制本发明。在其中一种实施例中，感应电极20可以由复数条相互平行的电极轴组成。
以图1所示的第一感测垫211来看，可以是具有完整图案的感测垫211a或具有不完整图案的感测垫211b，同样的，第二感测垫212也可以是具有完整图案的感测垫212a或具有不完整图案的感测垫212b。图2绘示出具有不完整图案的感测垫，其中此不完整图案的感测垫，若沿第一方向分布，则为不完整图案的感测垫211b；若沿第二方向分布，则为不完整图案的感测垫212b，不论何者，皆以本体部21表示之。若感应电极20是由复数条相互平行的电极轴组成，则皆为完整图案的电极轴，不会有所谓的完整或不完整图案的感测垫之分。
请再次参考图2，在本体部21底部连接有连接部22，其中本体部21设于基板40的触控区域M1内，而连接部22可设于基板40的周边区域M2内且紧邻着本体部21的底部设置并与信号传输线30电性连接。其中，连接部22的宽度大于或等于本体部21底部的一半宽度。于此实施例中，连接部22的形状实质上呈矩形状并占据本体部21底部的整个宽度。但于实务上，连接部22的形状可依据实际产品应用需求而设计，例如可设计为梯形或任何其他几何形状，本实施例并未以此为限。另，连接部22具有一紧邻该本体部21底部的第一边缘与一远离该本体部底部的第二边缘，其中该第一边缘与该第二边缘之间的距离为0.02~0.4mm，具体的距离是根据控制器和触控面板来设定的，在此并不以此为限制。
本实施例中，感应电极20的材料可包含各种透明导电材料，例如，氧化铟锡（indium tin oxide, ITO）、氧化铟锌(indium zinc oxide, IZO)、氧化镉锡(cadmium tin oxide, CTO)、氧化铝锌(aluminum zinc oxide, AZO)、氧化铟锌锡(indium tin zinc oxide, ITZO)、氧化锌(zinc oxide)、氧化镉(cadmium oxide)、氧化铪(hafnium oxide, HfO)、氧化铟镓锌(indium gallium zinc oxide, InGaZnO)、氧化铟镓锌镁(indium gallium zinc magnesium oxide, InGaZnMgO)、氧化铟镓镁(indium gallium magnesium oxide, InGaMgO)或氧化铟镓铝(indium gallium aluminum oxide, InGaAlO)，但上述材料并非用以限制本发明。
信号传输线30设于基板40的周边区域M2内，包括头部31及与头部31连接的尾部引线32。其中，信号传输线30的头部31是叠设于连接部22且与连接部22电性连接。头部31可覆盖部分的连接部22，例如头部31覆盖连接部22一半以上的宽度。于此实施例中，头部31叠设于连接部22的中间位置，但于实务上，头部31与连接部22的位置关系依据实际产品应用需求而设计，例如头部31可以叠设于连接部22的一侧（上侧或者下侧），但本实施例并未以此为限。其中，信号传输线30材料为钼铝钼、银、铜等金属或者碳胶。但由于在金属中银导电性好、阻抗低的优点，故较佳的，信号传输线30由银构成。信号传输线30可以透过电镀或印刷等方法形成，但本发明并不仅以此为限。
请参阅图4，图4是另一较佳触控面板的剖面图。当触控面板应用于显示面板上使用，基板40应为透明材质形成的基板，且触控区域M1与周边区域M2又可以用来定义出显示区域与非显示区域。相对于图3，触控面板的基板40是一上盖基板，可同时具有承载触控感应电极结构10及防护功能，该上盖基板更包含一层遮蔽层50，该遮蔽层50夹设于基板40与触控感应电极10之间，在一较佳实施例中，遮蔽层50是形成在基板40上且位于基板40的周边区域M2，其中，在周边区域M2中，连接部22与信号传输线30皆设置在遮蔽层50之上。遮蔽层50通常由不透明材质所组成，例如黑色树脂、黑色光阻材料，也可以使具有低介电常数的高绝缘油墨等，因此从基板40相对于承载触控感应电极结构10的另一面观之，可遮蔽感应电极结构层的其他电子组件如信号传输线30等，使之不曝露于用户接口中，藉此达到美观效果。若上述触控面板100并非与显示面板结合，基板40可以是非透明基板，且遮蔽层50可以从触控面板100中移除。下文将针对本发明之触控电极结构的不同实施例进行说明，且为简化说明，以下说明主要针对各实施例不同之处进行详述，而不再对相同之处作重复赘述。此外，本发明之各实施例中相同之组件是以相同之标号进行标示，以利于各实施例间相互对照。
请参考5图， 图5是本发明之第二较佳实施例的触控感应电极结构示意图。触控感应电极结构11与上述第一较佳实施例之触控感应电极结构10不同的地方在于，信号传输线30的头部31完全覆盖整个连接部22。
请参考图6，图6是本发明之第三较佳实施例的触控感应电极结构示意图。本实施例提供一触控感应电极结构12。触控感应电极结构12与上述第一较佳实施例之触控感应电极结构10不同的地方在于，连接部22紧邻着本体部21的底部设置并与信号传输线30电性连接。其中，连接部22的宽度为本体部21底部宽度的一半。在本实施例中，连接部22位于本体部21底部的中间位置，但在实务中，连接部22的位置可依据实际产品应用需求而设计，例如连接部22的位置可以位于本体部21底部的一端，本实施例并未以此为限。
视本体部21的形状，连接部22除了可以是矩形之外，还可以是梯形。请参考图7，图7是本发明之第四较佳实施例的触控感应电极结构示意图。本实施例提供之触控感应电极结构13与上述第一较佳实施例之触控感应电极结构10不同之处在于，连接部22是梯形的，实际上就是从本体部21的底部延伸出来的部分。而信号传输线30的头部31覆盖连接部22一半以上的宽度，在本实施例中头部31是叠设于连接部22的中间位置，但于实务上，头部31与连接部22的位置关系依据实际产品应用需求而设计，例如头部31可以叠设与连接部22的一侧（上侧或者下侧），但本实施例并未以此为限。
请参考图8.，图8是本发明之第五较佳实施例的触控感应电极结构示意图。本实施例提供之触控感应电极结构14与上述第二较佳实施例之触控感应电极结构11不同之处在于，连接部22是梯形的，信号传输线30的头部31完全覆盖整个连接部22。
请参考图9，图9是本发明之第六较佳实施例的触控感应电极结构示意图。本实施例提供之触控感应电极结构15与上述第三较佳实施例之触控感应电极结构12不同之处在于，连接部22是梯形的，信号传输线30的头部31完全覆盖整个连接部22。在本实施例中，连接部22位于本体部21底部的中间位置，但在实务中，连接部22的位置可依据实际产品应用需求而设计，例如连接部22的位置可以位于本体部21底部的一端，本实施例并未以此为限。
上述的触控感应电极结构10、11、12、13、14或15，由于信号传输线30的头部31的宽度增大到相应于本体部21底部的一半以上，故信号传输线30将静电流向连接部22的静电传输路径也相应增大，连接部22相对单位面积上的静电量因传输路径的增大而减小。根据焦耳定律，连接部22单位面积上所产生的热量也相对应降低，进而提高触控感应电极结构的抗静电等级。
参考图10，提供一实施例的触控感应电极结构的制造方法，包括如下步骤：
S102：形成一感应电极，具体是形成感应电极于一基板上，可采用旋转涂布、电镀、溅镀、印刷或其他方式先于基板上形成一层透明导电膜，再通过光刻等制程将透明导电膜蚀刻成需要的电极图形的感应电极。感应电极的材料例如是氧化铟锡（indium tin oxide, ITO）、氧化铟锌(indium zinc oxide, IZO)、氧化镉锡(cadmium tin oxide, CTO)、氧化铝锌(aluminum zinc oxide, AZO)、氧化铟锌锡(indium tin zinc oxide, ITZO)、氧化锌(zinc oxide)、氧化镉(cadmium oxide)、氧化铪(hafnium oxide, HfO)、氧化铟镓锌(indium gallium zinc oxide, InGaZnO)、氧化铟镓锌镁(indium gallium zinc magnesium oxide, InGaZnMgO)、氧化铟镓镁(indium gallium magnesium oxide, InGaMgO)或氧化铟镓铝(indium gallium aluminum oxide, InGaAlO)，但上述材料并非用于限制本发明。
所形成的感应电极包括复数沿第一方向分布的第一感测垫与复数沿第二方向分布的第二感测垫。其中两相邻的第一感测垫之间以导线链接，两相邻第二感测垫分别置于导线两侧边而以横跨导线的导线桥连接彼此。在此注意，上述实施方式并非用以限制本发明。第一感测垫或第二感测垫可以具有完整图案的感测垫或具有不完整图案的感测垫。不论是第一方向分布的第一感测垫还是第二方向分布的第二感测垫，皆定义为本体部。本体部底部连接有连接部，其中本体部设于基板的触控区域内，连接部位于围绕于触控区域的周边区域内，其中该连接部的宽度是大于或等于该本体部底部的一半宽度。连接部具有一紧邻该本体部底部的第一边缘与一远离该本体部底部的第二边缘，其中该第一边缘与该第二边缘之间的距离为0.02~0.4mm，具体的距离是根据控制器和触控面板来设定的。
S104：形成一信号传输线，其中信号传输线包括头部及与头部连接的尾部引线，其中信号传输线的头部是叠设于感应电极的连接部且与该连接部电性连接。信号传输线透过印刷方式印刷于基板的周边区域。信号传输线的头部透过对位并印刷于连接部之上，以实现叠设于该感应电极的连接部且与该连接部电性连接。其中，信号传输线材料选自钼铝钼、银、铜等金属或者碳胶，并透过光刻或印刷等方法形成，但本发明并不仅以此为限。但由于在金属中银的导电性较佳、阻抗也较低，故较佳的，信号传输线由银构成。
另，当基板是一同时具有承载与保护触控感应电极层功能的上盖基板时，进一步地包括步骤S106，即形成一遮蔽层夹设于基板与触控感应电极层之间。遮蔽层可以透过印刷、电镀等方式形成，选用的材料可以是黑色树脂、黑色光阻材料，也可以使具有低介电常数的高绝缘油墨，本发明并不以此为限。简要起见，本实施例的方法中仅列出主要步骤，其他必要的常规步骤将不在此赘述。
值得注意的是，连接部的宽度、形状以及信号传输线的形成面积及与连接部的相对位置等，皆与本发明图5~图9较佳实施例所述雷同，例如：
如图2或图7所示，连接部的宽度等于本体部底部的宽度，信号传输线的头部覆盖部分的连接部，且信号传输线的头部可叠设于连接部的中间或一侧。
如图5或图8所示，连接部的宽度等于本体部底部的宽度，信号传输线的头部完全覆盖连接部。
如图6或图9所示，在连接部的宽度等于本体部底部的一半宽度，信号传输线的头部完全覆盖连接部。其中连接部可位于本体部底部的中间位置，或是位于本体部底部的一端。
另，上述连接部的图形可为矩形或梯形，其他关于组件的使用材料或组件间详细的连接关系等，请参前述的实施例说明，在此即不再赘述。
本发明提供一种触控感应电极结构及其制造方法，当静电等级过高时，透过增加连接部的宽度来降低其在单位面积上分布的静电量，进而降低感应电极连接部此处产生的热量降低而不容易被烧毁，因此，本发明可以提高触控感应电极结构的抗静电等级。其中，当连接部与本体部的宽度一致，信号传输线的头部与连接部的搭接面积最大，故能大幅度地降低其在单位面积上分布的静电量，进而大幅度地降低感应电极连接部此处产生的热量而保证触控感应电极结构不容易被烧毁，该触控感应电极结构的抗静电等级最高。
以上所述仅为本发明之较佳实施例而已，并非用以限定本发明之申请专利范围；凡其它未脱离创作所揭示之精神下所完成之等效改变或修饰，均应包含在下述之申请专利范围内。

Claims (24)

  1. 一种触控感应电极结构，包括：
    感应电极，包括本体部及与本体部底部连接的连接部，其中该连接部的宽度是大于或等于该本体部底部的一半宽度；以及
    信号传输线，包括头部及与该头部连接的尾部引线，其中该信号传输线的头部是叠设于该感应电极的连接部且与该连接部电性连接。
  2. 根据权利要求1所述的触控感应电极结构，其特征在于，该连接部形状为矩形或梯形。
  3. 根据权利要求1所述的触控感应电极结构，其特征在于，该连接部的宽度等于该本体部底部的一半宽度。
  4. 根据权利要求3所述的触控感应电极结构，其特征在于，该连接部位于该本体部底部的中间位置。
  5. 根据权利要求3所述的触控感应电极结构，其特征在于，该连接部位于该本体部底部的一端。
  6. 根据权利要求3所述的触控感应电极结构，其特征在于，该信号传输线的头部完全覆盖该连接部。
  7. 根据权利要求1所述的触控感应电极结构，其特征在于，该连接部的宽度等于该本体部底部的宽度。
  8. 根据权利要求7所述的触控感应电极结构，其特征在于，该信号传输线的头部覆盖部分的该连接部。
  9. 根据权利要求8所述的触控感应电极结构，其特征在于，该信号传输线的头部叠设于该连接部的中间。
  10. 根据权利要求8所述的触控感应电极结构，其特征在于，该信号传输线的头部叠设于该连接部的一侧。
  11. 根据权利要求7所述的触控感应电极结构，其特征在于，该信号传输线的头部完全覆盖该连接部。
  12. 根据权利要求1所述的触控感应电极结构，其特征在于，该连接部具有一紧邻该本体部底部的第一边缘与一远离该本体部底部的第二边缘，其中该第一边缘与该第二边缘之间的距离为0.02~0.4mm。
  13. 根据权利要求1所述的触控感应电极结构，其特征在于，该信号传输线材料选自钼铝钼、银、铜或碳胶。
  14. 根据权利要求1所述的触控感应电极结构，其特征在于，该触控感应电极结构设置于一基板上。
  15. 根据权利要求14所述的触控感应电极结构，更包括一遮蔽层，其中该遮蔽层且夹设于该基板与该触控感应电极之间。
  16. 一种触控感应电极结构的制造方法，包括如下步骤：
    形成感应电极，该感应电极包括本体部及与本体部底部连接的连接部，其中该连接部的宽度是大于或等于该本体部底部的一半宽度；以及
    形成信号传输线，其中该信号传输线包括头部及与该头部连接的尾部引线，其中该信号传输线的头部是叠设于该感应电极的连接部且与该连接部电性连接。
  17. 根据权利要求16所述的触控感应电极结构的制造方法，其特征在于，该连接部为矩形或梯形。
  18. 根据权利要求16所述的触控感应电极结构的制造方法，其特征在于，该连接部的宽度等于该本体部底部的一半宽度。
  19. 根据权利要求18所述的触控感应电极结构的制造方法，其特征在于，该连接部位于该本体部底部的中间位置。
  20. 根据权利要求18所述的触控感应电极结构的制造方法，其特征在于，该连接部位于该本体部底部的一端。
  21. 根据权利要求18所述的触控感应电极结构的制造方法，其特征在于，该信号传输线的头部完全覆盖该连接部。
  22. 根据权利要求16所述的触控感应电极结构的制造方法，其特征在于，该连接部的宽度等于该本体部底部的宽度。
  23. 根据权利要求22所述的触控感应电极结构的制造方法，其特征在于，该信号传输线的头部覆盖部分的该连接部。
  24. 根据权利要求23所述的触控感应电极结构的制造方法，其特征在于，该信号传输线的头部叠设于该连接部的中间。
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