WO2014068937A1 - 半導体モジュール - Google Patents

半導体モジュール Download PDF

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Publication number
WO2014068937A1
WO2014068937A1 PCT/JP2013/006342 JP2013006342W WO2014068937A1 WO 2014068937 A1 WO2014068937 A1 WO 2014068937A1 JP 2013006342 W JP2013006342 W JP 2013006342W WO 2014068937 A1 WO2014068937 A1 WO 2014068937A1
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WIPO (PCT)
Prior art keywords
semiconductor module
bare chip
joint surface
solder
wiring pattern
Prior art date
Application number
PCT/JP2013/006342
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English (en)
French (fr)
Inventor
崇 須永
昇 金子
修 三好
Original Assignee
日本精工株式会社
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Filing date
Publication date
Application filed by 日本精工株式会社 filed Critical 日本精工株式会社
Priority to EP13851001.1A priority Critical patent/EP2916348B1/en
Priority to JP2014526016A priority patent/JP5807721B2/ja
Priority to CN201380003701.4A priority patent/CN103918066B/zh
Priority to US14/435,690 priority patent/US9397030B2/en
Publication of WO2014068937A1 publication Critical patent/WO2014068937A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B62D5/0406—Power-assisted or power-driven steering electrical, e.g. using an electric servo-motor connected to, or forming part of, the steering gear characterised by constructional features, e.g. common housing for motor and gear box including housing for electronic control unit
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Definitions

  • the present invention relates to a semiconductor module such as a power module incorporated in an automobile electrical device.
  • a motor driving unit is provided in a housing that houses an electric motor related to steering of an automobile, and the electronic device is mounted on the motor driving unit.
  • This electronic device is incorporated as a power module in the motor drive unit.
  • the power module is equipped with power elements such as FET (Field Effect Transistor) and IGBT (Insulated Gate Bipolar Transistor) suitable for controlling electric devices driven by a relatively large current such as an electric power steering device. It is configured as a so-called semiconductor module.
  • This type of power module is also referred to as an in-vehicle module because it is mounted on a vehicle.
  • Patent Document 1 a wire is used for electrical wiring for joining a wiring pattern on a metal substrate and a bare chip transistor.
  • the lead component for electrically connecting the semiconductor element mounted on the metal substrate is made larger than the electrode on the semiconductor, and the reliability of the contact portion is ensured.
  • some contact points are used and the contact width is widened.
  • Patent Document 3 for example, there is a case where a rising bent portion is provided or a fuse shape (wave shape) is provided in the middle of the wiring in order to relieve stress of the connector wiring.
  • an object of the present invention is to provide a semiconductor module capable of realizing reduction in manufacturing tact and reduction in manufacturing cost and ensuring the reliability of the joint.
  • an aspect of the semiconductor module according to the present invention includes a metal substrate, an insulating layer formed on the substrate, a plurality of wiring patterns formed on the insulating layer, and the plurality of wiring patterns.
  • a bare chip transistor mounted on one of the wiring patterns via solder, and an electrode formed on the top surface of the bare chip transistor and the other wiring pattern among the plurality of wiring patterns are joined via solder.
  • the copper connector includes a flat plate portion, a first leg portion that is bent so as to fall from one end of the flat plate portion, and is joined to the electrode, and is bent so as to fall from the other end of the flat plate portion.
  • the first leg portion is provided with a narrow portion whose width becomes narrower from an end portion on the side opposite to the bonding surface with the electrode toward an end portion where the bonding surface is formed.
  • the present invention is characterized in that a stress relaxation portion having a shape that relieves stress acting on the joint surface is provided on the joint surface of the first leg with the electrode.
  • the copper connector can absorb the displacement in the vertical, horizontal, front and rear, and twist directions of the copper connector joint that occurs during heating or cooling because the thermal expansion coefficient and thermal contraction ratio are different from those of the substrate. It has a unique shape.
  • the copper connector comprised with a copper plate as a joining member of the electrode of a bare chip transistor, and the wiring pattern on a board
  • these joining can be performed by solder mounting operation. That is, the same equipment is used for the bonding of the bare chip transistor electrode and the wiring pattern on the substrate, and the solder mounting operation performed when mounting the bare chip transistor and other substrate mounting components on the wiring pattern on the substrate. Can be performed simultaneously in the same process. For this reason, the manufacturing tact of the semiconductor module can be shortened, and dedicated equipment for wire bonding is not required, and the manufacturing cost of the semiconductor module can be reduced.
  • the displacement in the vertical and horizontal directions can be absorbed.
  • the displacement in the front-rear direction and the twist direction can be absorbed.
  • the stress relaxation portion is provided on the joint surface of the first leg portion with the electrode, the stress generated in the joint portion can be relaxed. Therefore, when thermal expansion or thermal contraction occurs due to the reflow process or operating heat, the solder joint between the copper connector and the bare chip transistor electrode can be made difficult to peel, and the reliability of the joint can be ensured.
  • a notch is formed in the joint surface
  • the joint surface is formed of a thin plate
  • a chamfered portion is formed at a corner of the joint surface
  • a hole may be formed in the center of the joint surface.
  • a dumbbell-shaped dumbbell portion that relieves stress acting on the joint surface may be formed on each of the first leg portion and the second leg portion.
  • the bare chip transistor electrode and the wiring pattern on the substrate can be joined by a solder mounting operation using a copper connector formed of a copper plate. Bonding to the pattern can be performed simultaneously in the same process as the solder mounting operation performed when the bare chip transistor or other substrate mounting component is mounted on the wiring pattern on the substrate. For this reason, the manufacturing tact of the semiconductor module can be shortened, and dedicated equipment for wire bonding is not required, and the manufacturing cost of the semiconductor module can be reduced. Further, since the copper connector has a bridge shape and the narrow leg portion and the stress relaxation portion are provided on the first leg portion joined to the electrode of the bare chip transistor, the displacement in any direction can be absorbed. Therefore, the thermal deformation of the copper connector in the reflow process can be absorbed, and the reliability of the joint can be ensured. Furthermore, it is possible to prevent the copper connector from being damaged due to temperature changes during product use.
  • FIG. 1 is a diagram showing a basic structure of an electric power steering apparatus in which a semiconductor module according to the present invention is used.
  • the column shaft 2 of the steering handle 1 is connected to a tie rod 6 of a traveling wheel via a reduction gear 3, universal joints 4 ⁇ / b> A and 4 ⁇ / b> B, and a pinion rack mechanism 5.
  • the column shaft 2 is provided with a torque sensor 7 that detects the steering torque of the steering handle 1, and an electric motor 8 that assists the steering force of the steering handle 1 is connected to the column shaft 2 via the reduction gear 3.
  • a torque sensor 7 that detects the steering torque of the steering handle 1
  • an electric motor 8 that assists the steering force of the steering handle 1 is connected to the column shaft 2 via the reduction gear 3.
  • the controller 10 that controls the electric power steering apparatus is supplied with electric power from a battery (not shown), and also receives an ignition key signal IGN (see FIG. 2) via an ignition key (not shown).
  • the controller 10 calculates a steering assist command value serving as an assist (steering assist) command based on the steering torque Ts detected by the torque sensor 7 and the vehicle speed V detected by the vehicle speed sensor 9, and the calculated steering is performed.
  • the current supplied to the electric motor 8 is controlled based on the auxiliary command value.
  • the controller 10 is mainly composed of a microcomputer, and the mechanism and configuration of the control device are as shown in FIG.
  • the steering torque Ts detected by the torque sensor 7 and the vehicle speed V detected by the vehicle speed sensor 9 are input to the control arithmetic unit 11 as a control arithmetic unit, and the current command value calculated by the control arithmetic unit 11 is used as the gate drive circuit 12.
  • the gate drive signal formed by the gate drive circuit 12 based on the current command value or the like is input to a motor drive unit 13 having a FET bridge configuration, and the motor drive unit 13 passes through an emergency stop interrupting device 14 for three phases.
  • An electric motor 8 composed of a brushless motor is driven.
  • Each phase current of the three-phase brushless motor is detected by the current detection circuit 15, and the detected three-phase motor currents ia to ic are input to the control arithmetic unit 11 as feedback currents.
  • a rotation sensor 16 such as a hall sensor is attached to the three-phase brushless motor, and a rotation signal RT from the rotation sensor 16 is input to the rotor position detection circuit 17, and the detected rotation position ⁇ is a control arithmetic unit. 11 is input.
  • the ignition signal IGN from the ignition key is input to the ignition voltage monitor unit 18 and the power supply circuit unit 19, and the power supply voltage Vdd is input from the power supply circuit unit 19 to the control arithmetic unit 11 and a reset signal for stopping the apparatus.
  • RS is input to the control arithmetic unit 11.
  • blocking apparatus 14 is comprised by the relay contacts 141 and 142 which interrupt
  • the circuit configuration of the motor drive unit 13 will be described.
  • the source electrode S of the FETTr1 and the drain electrode D of the FETTr2 are connected in series to constitute a c-phase arm of a three-phase motor, and a current is output through the c-phase output line 91c.
  • the FETTr3 and Tr4 are configured such that the source electrode S of the FETTr3 and the drain electrode D of the FETTr4 are connected in series to form an a-phase arm of a three-phase motor, and a current is output from the a-phase output line 91a.
  • the FETTr5 and Tr6 are configured such that the source electrode S of the FETTr5 and the drain electrode D of the FETTr6 are connected in series to form a b-phase arm of a three-phase motor, and a current is output from the b-phase output line 91b.
  • the controller 10 includes a case 20, a semiconductor module 30 as a power module including the motor driving unit 13, and heat dissipation. Sheet 39, control circuit board 40 including control arithmetic device 11 and gate drive circuit 12, power and signal connector 50, three-phase output connector 60, and cover 70.
  • the case 20 is formed in a substantially rectangular shape, and is provided on the flat-plate-shaped semiconductor module mounting portion 21 for mounting the semiconductor module 30 and the longitudinal end portion of the semiconductor module mounting portion 21.
  • the semiconductor module mounting portion 21 is formed with a plurality of screw holes 21a into which mounting screws 38 for mounting the semiconductor module 30 are screwed.
  • a plurality of mounting posts 24 for mounting the control circuit board 40 are erected on the semiconductor module mounting portion 21 and the power and signal connector mounting portion 22, and the control circuit board 40 is mounted on each mounting post 24.
  • a screw hole 24a into which a mounting screw 41 for mounting is screwed is formed.
  • the three-phase output connector mounting portion 23 is formed with a plurality of screw holes 23a into which mounting screws 61 for attaching the three-phase output connector 60 are screwed.
  • the semiconductor module 30 has the circuit configuration of the motor drive unit 13 described above. As shown in FIG. 4, the substrate 31 has six FETs Tr1 to Tr6, a positive terminal 81a connected to the power supply line 81, and A negative terminal 82a joined to the ground line 82 is mounted. Also, the substrate 31 has an a-phase output terminal 92a joined to the a-phase output line 91a, a b-phase output terminal 92b joined to the b-phase output line 91b, and a c-phase output joined to the c-phase output line 91c. A three-phase output unit 90 including a terminal 92c is mounted. In addition, other board mounting components 37 including a capacitor are mounted on the board 31. Further, the substrate 31 of the semiconductor module 30 is provided with a plurality of through holes 31a through which mounting screws 38 for mounting the semiconductor module 30 are inserted.
  • Each of the FETs Tr1 to Tr6 is composed of a bare chip FET (bare chip transistor) 35.
  • a source electrode S and a gate electrode G are provided on the bare chip FET 35, and a drain (not shown) is provided on the bottom surface of the bare chip FET 35. It has an electrode.
  • the semiconductor module 30 includes a metal substrate 31, and an insulating layer 32 is formed on the substrate 31.
  • the substrate 31 is made of a metal such as aluminum.
  • a plurality of wiring patterns 33a to 33d are formed on the insulating layer 32.
  • Each of the wiring patterns 33a to 33d is made of a metal such as copper or aluminum, or an alloy containing this metal.
  • a bare chip FET 35 constituting each of the FETs Tr1 to Tr6 is mounted on one wiring pattern 33a among the plurality of wiring patterns 33a to 33d via solder 34a.
  • the drain electrode formed on the lower surface of the bare chip FET 35 is joined to the wiring pattern 33a via the solder 34a.
  • the source electrode S of the bare chip FET 35 and the other wiring pattern 33b among the plurality of wiring patterns 33a to 33d are joined by the source electrode copper connector 36a via the solders 34e and 34b, respectively.
  • the source electrode copper connector 36a is formed by punching and bending a copper plate.
  • the source electrode copper connector 36a includes a flat plate portion 36aa, a connection portion 36ab that is bent and extended so as to fall from one end of the flat plate portion 36aa, and is joined to the source electrode S of the bare chip FET 35 via the solder 34e.
  • a connecting portion 36ac is provided which is bent and extended so as to fall from the other end of 36aa and is joined to the wiring pattern 33b via the solder 34b.
  • the gate electrode G of the bare chip FET 35 and the other wiring pattern 33c among the plurality of wiring patterns 33a to 33d are joined by the gate electrode copper connector 36b via solders 34f and 34c, respectively.
  • the gate electrode copper connector 36b is formed by punching and bending a copper plate.
  • the copper connector 36b for the gate electrode includes a flat plate portion 36ba, a connection portion 36bb which is bent and extended so as to fall from one end of the flat plate portion 36ba, and is joined to the gate electrode G of the bare chip FET 35 via the solder 34f.
  • another board mounting component 37 such as a capacitor is mounted on another wiring pattern 33d among the plurality of wiring patterns 33a to 33d formed on the insulating layer 32 via the solder 34d. .
  • the source electrode copper connector 36a has a bridge shape with a flat plate portion 36aa, a connection portion 36ab (first leg portion), and a connection portion 36ac (second leg portion). It has become. More specifically, in the source electrode copper connector 36a, one end of the connecting portion 36ab is connected to one end of the flat plate portion 36aa in the left-right direction (X-axis direction in FIG. 7) via the first bent portion 36ad. The other end of the connecting portion 36ab is formed with an outward joint surface 36af via the second bent portion 36ae. The lower surface of the bonding surface 36af is bonded to the source electrode S of the bare chip FET 35 via the solder 34e.
  • the connecting portion 36ab has a narrow portion 36ag in the vicinity of the joint surface 36af.
  • the narrow portion 36ag has a tapered shape in which the width becomes narrower from the first bent portion 36ad toward the second bent portion 36ae.
  • One end of the connecting portion 36ac is connected to the other end portion in the left-right direction of the flat plate portion 36aa via the third bent portion 36ah, and the other end of the connecting portion 36ac is directed outward via the fourth bent portion 36ai.
  • a joint surface 36aj is formed. The lower surface of the bonding surface 36aj is bonded to the wiring pattern 33b via the solder 34b.
  • the joint surface 36af is provided with a stress relaxation portion 36ak having a shape for relaxing the stress acting on the joint surface 36af.
  • 8 to 11 are diagrams showing examples of the shape of the stress relaxation portion 36ak.
  • the symbol P is a source PAD.
  • the stress relaxation part 36ak shown in FIG. 8 is provided with a slit (cut) in the joint surface 36af.
  • the said slit can divide the front-end
  • the stress relaxation part 36ak As another example of the stress relaxation part 36ak, as shown in FIG. 9, for example, there is one in which the thickness of the joint surface 36af is made thin. Further, as the stress relaxation part 36ak, as shown in FIG. 10, there is one in which a chamfered part is provided at a corner of the tip of the joint surface 36af. Here, the chamfered portion may be a large circle or a C chamfer instead of the R chamfer shown in FIG. Furthermore, as the stress relaxation portion 36ak, there is one in which a hole is provided in the center of the joint surface 36af as shown in FIG.
  • the shape of the source electrode copper connector 36a can be any shape as long as it is a bridge shape capable of joining the source electrode S and the wiring pattern 33b. Further, the shape of the stress relaxation portion 36ak can be any shape as long as it can be joined to the source electrode S. However, since reflow bonding, which will be described later, is performed at the time of solder bonding and the semiconductor module 30 is operated, the heat is generated due to heat generation, so that the thermal stress can be relieved. The same applies to the gate electrode copper connector 36b. As shown in FIG. 3, the semiconductor module 30 configured as described above is attached to the semiconductor module mounting portion 21 of the case 20 by a plurality of mounting screws 38. The substrate 31 of the semiconductor module 30 is formed with a plurality of through holes 31a through which the mounting screws 38 are inserted.
  • the control circuit board 40 constitutes a control circuit including the control arithmetic device 11 and the gate drive circuit 12 by mounting a plurality of electronic components on the board. After the semiconductor module 30 is mounted on the semiconductor module mounting portion 21, the control circuit board 40 has a plurality of standing uprights on the semiconductor module mounting portion 21 and the power and signal connector mounting portion 22 from above the semiconductor module 30. A plurality of mounting screws 41 are mounted on the mounting post 24.
  • the control circuit board 40 has a plurality of through holes 40a through which the mounting screws 41 are inserted.
  • the power and signal connector 50 is used to input a DC power source from a battery (not shown) to the semiconductor module 30 and various signals including signals from the torque sensor 12 and the vehicle speed sensor 9 to the control circuit board 40. Used.
  • the power and signal connector 50 is attached to the power and signal connector mounting portion 22 provided on the semiconductor module mounting portion 21 with a plurality of mounting screws 51.
  • the three-phase output connector 60 is used to output current from the a-phase output terminal 92a, the b-phase output terminal 92b, and the c-phase output terminal 92c.
  • the three-phase output connector 60 is attached to the three-phase output connector mounting portion 23 provided at the end in the width direction of the semiconductor module mounting portion 21 by a plurality of mounting screws 61.
  • the three-phase output connector 60 is formed with a plurality of through holes 60a through which the mounting screws 61 are inserted. Further, the cover 70 covers the case 20 to which the semiconductor module 30, the control circuit board 40, the power and signal connector 50, and the three-phase output connector 60 are attached from above the control circuit board 40. It is attached to cover.
  • FIG. 12A an insulating layer 32 is formed on one main surface of a metal substrate 31 (insulating layer forming step).
  • insulating layer forming step a plurality of wiring patterns 33a to 33d are formed on the insulating layer 32 (wiring pattern forming step).
  • solder paste solders 34a to 34d is applied on the plurality of wiring patterns 33a to 33d, respectively (solder paste applying step). Then, as shown in FIG.
  • one bare chip FET 35 is mounted on the solder paste (solder 33a) applied on one wiring pattern 33a among the plurality of wiring patterns 33a to 33d (bare chip).
  • another board mounting component 37 is mounted on the solder paste (solder 34d) applied on the other wiring pattern 33d.
  • Other bare chip FETs 35 are also mounted on the same or separate wiring pattern as the wiring pattern 33a.
  • solder paste (solder 34e, 34f) is applied on the source electrode S and the gate electrode D formed on the upper surface of the bare chip FET 35 (solder paste applying step).
  • solder paste (solder 34e) applied on the source electrode S of the bare chip FET 35 and the wiring pattern 33a other than the wiring pattern 33a on which the bare chip FET 35 is mounted among the plurality of wiring patterns 33a to 33d.
  • the source electrode copper connector 36a is mounted on the solder paste (solder 34b) applied on the other wiring pattern 33b (source electrode copper connector mounting step).
  • the semiconductor module intermediate assembly is configured.
  • the semiconductor module intermediate assembly constituted by the above steps is put in a reflow furnace (not shown), and the solder 34a between one wiring pattern 33a and the bare chip FET 35 among the plurality of wiring patterns 33a to 33d. Bonding, wiring pattern 33d and other board mounting component 37 via solder 34d, source electrode S formed on the upper surface of bare chip FET 35 and source electrode copper connector 36a via solder 34e
  • the other wiring pattern 33b of the plurality of wiring patterns 33a to 33d is joined to the source electrode copper connector 36a via the solder 34b, the gate electrode G formed on the upper surface of the bare chip FET 35 and the gate electrode copper connector 36b.
  • the semiconductor module 30 is completed.
  • the source electrode copper connector 36a is used to join the source electrode S of the bare chip FET 35 and the wiring pattern 33b on the substrate 31, and the gate electrode G of the bare chip FET 35 and another wiring pattern 33c on the substrate 31 are joined.
  • the copper connector 36b for the gate electrode, these junctions can be performed by solder mounting work. Therefore, the junction between the source electrode S of the bare chip FET 35 and the wiring pattern 33b on the substrate 31 and the gate electrode G of the bare chip FET 35 and the substrate 31 are performed.
  • the other wiring pattern 33c can be joined at the same time in the same process as the solder mounting operation performed when the bare chip FET 35 and other board mounting components 37 are mounted on the wiring patterns 33a and 33d on the board 31. it can. For this reason, the manufacturing tact of the semiconductor module 30 can be shortened, and dedicated equipment for wire bonding is not required, and the manufacturing cost of the semiconductor module 30 can be reduced.
  • the substrate 31 of the semiconductor module 30 aluminum is used for the substrate 31 of the semiconductor module 30, and a copper material is used for the copper connector 36a for the source electrode and the copper connector 36b for the gate electrode.
  • the linear expansion coefficient of aluminum is 23.6 ⁇ 10 ⁇ 6 / ° C.
  • the linear expansion coefficient of copper material is 16.8 ⁇ 10 ⁇ 6 / ° C.
  • the linear expansion coefficient of silicon of the bare chip FET 35 is 2.5 ⁇ . 10 ⁇ 6 / ° C. That is, the substrate 31 is more easily deformed with respect to temperature changes than the copper connectors 36a and 36b.
  • the copper connectors 36a and 36b are formed in a bridge shape, a narrow portion 36ag is provided in the vicinity of the bonding surface 36af with the electrode of the bare chip FET 35, and stress is applied to the bonding surface 36af with the electrode of the bare chip FET 35.
  • a relaxation part 36ak is provided.
  • the copper connectors 36a and 36b can be easily bent. Further, since the narrow portion 36ag is provided in the vicinity of the joint surface 36af, the solder joint between the copper connectors 36a and 36b and the bare chip FET 35 is difficult to peel off when the copper connectors 36a and 36b are bent with the narrow portion 36ag as a base point. Furthermore, the stress in the twisting direction can be relaxed by providing the stress relaxation part 36ak. In particular, when the stress relaxation shape of the copper connectors 36a and 36b is the slit shape shown in FIG. Even easier to follow. Moreover, since the so-called duplex system can be configured by using two contacts, electrical reliability is improved.
  • the tip R shape shown in FIG. 10 has an effect of releasing stress concentration at the corner when subjected to twisting. Furthermore, even in the case of the hole shape shown in FIG. Further, since the solder flows to the upper surface of the joint surface 36af due to the seepage wetting phenomenon and spreads radially, it is difficult for the solder to be peeled off even if it is twisted. Further, the shape of the source electrode copper connector 36a provided with the first dumbbell portion 36al and the second dumbbell portion 36am for relaxing the stress acting on the joint surface 36af and the joint surface 36aj will be described.
  • both or one of the first dumbbell part 36al and the second dumbbell part 36am may be further provided in addition to the stress relaxation part 36ak and the narrow part 36ag, but instead of the stress relaxation part 36ak or the narrow part 36ag. It may be provided. Moreover, you may provide both or one of the 1st dumbbell part 36al and the 2nd dumbbell part 36am, without providing the stress relaxation part 36ak and the narrow part 36ag.
  • the source electrode copper connector 36a has a bridge shape with a flat plate portion 36aa, a connection portion 36ab (first leg portion), and a connection portion 36ac (second leg portion). . More specifically, in the source electrode copper connector 36a, one end of the connection portion 36ab is connected to one end portion in the left-right direction (X-axis direction in FIG. 13) of the flat plate portion 36aa via the first bent portion 36ad. An outward joint surface 36af is formed at the other end of the connecting portion 36ab via the second bent portion 36ae. The lower surface of the bonding surface 36af is bonded to the source electrode of the bare chip FET 35 via the solder 34e.
  • a narrow first dumbbell portion 36al is formed in the vicinity of the joint surface 36af of the connection portion 36ab. More specifically, for example, semicircular arc-shaped notches are provided on both sides in the width direction of the connection portion 36ab so as to face each other, and the first dumbbell portion 36al having a dumbbell shape is formed in the connection portion 36ab. Is formed. One end of the connecting portion 36ac is connected to the other end portion in the left-right direction of the flat plate portion 36aa via the third bent portion 36ah, and the other end of the connecting portion 36ac is directed outward via the fourth bent portion 36ai. A joint surface 36aj is formed. The lower surface of the bonding surface 36aj is bonded to the wiring pattern 33b via the solder 34b.
  • the connecting portion 36ac is formed with a narrow second dumbbell portion 36am near the center. More specifically, for example, semicircular cutouts are provided on both sides in the width direction of the connection portion 36ac so that a second dumbbell portion 36am having a dumbbell shape is formed in the connection portion 36ac. Is formed.
  • the source electrode copper connector 36a With the narrow first dumbbell portion 36al and second dumbbell portion 36am, the source electrode copper connector 36a is easily twisted and easily absorbs displacement.
  • the source electrode copper connector 36a can further absorb deformation in the vertical direction and the horizontal direction by stress relaxation due to the bridge shape.
  • the connecting portion 36ab and the connecting portion 36ac are provided with a bending portion 36an and a bending portion 36ao that relieve stress acting on the joining surface 36af and the joining surface 36aj, instead of the first dumbbell portion 36al and the second dumbbell portion 36am. (See FIG. 14).
  • the shape of the source electrode copper connector 36a provided with the bending portion 36an and the bending portion 36ao will be described below.
  • both or one of the bending portion 36an and the bending portion 36ao may be further provided in addition to the stress relaxation portion 36ak and the narrow portion 36ag, but may be provided instead of the stress relaxation portion 36ak or the narrow portion 36ag. .
  • the source electrode copper connector 36a shown in FIG. 14 has the same basic configuration as the source electrode copper connector 36a shown in FIG. 13, but the shapes of the connecting portion 36ab and the connecting portion 36ac are different, and the source shown in FIG.
  • the connecting portion 36ab and the connecting portion 36ac of the electrode copper connector 36a are provided with a bending portion 36an and a bending portion 36ao which are formed to be bent in a substantially “7” shape.
  • the connecting portion 36ab is connected to one end of the flat plate portion 36aa in the left-right direction (X-axis direction in FIG. 7) and has a wide portion having the same width as the flat plate portion 36aa, and the width direction of the flat plate portion 36aa among the wide portions.
  • the connecting portion 36ab is curved in a generally “7” shape as a whole, and constitutes a curved portion 36an.
  • the connecting portion 36ac is substantially the same as the connecting portion 36ab.
  • the connecting portion 36ac is connected to the other end of the flat plate portion 36aa in the left-right direction (X-axis direction in FIG. 7) and has a wide portion having the same width as the flat plate portion 36aa.
  • the flat plate portion 36aa is composed of an oblique portion extending in an oblique direction from the other end portion in the width direction (Y-axis direction in FIG. 7) toward the center portion in the width direction of the joint surface 36aj.
  • the oblique portion is narrower than the wide portion, and has substantially the same width over the entire length from the wide portion to the joint surface 36aj.
  • the connecting portion 36ac is curved in a substantially “7” shape as a whole, and constitutes a curved portion 36ao. Since the curved portion 36an and the curved portion 36ao perform the same operation as the first dumbbell portion 36al and the second dumbbell portion 36am, the source electrode copper connector 36a of FIG. 14 is easily twisted and easily absorbs displacement. Further, the source electrode copper connector 36a of FIG. 14 can further absorb deformation in the vertical direction and the horizontal direction by stress relaxation due to the bridge shape.
  • the semiconductor module 30 according to the present embodiment is suitable even when the copper connectors 36a and 36b are thermally deformed in the reflow process or when the substrate 31 is expanded or contracted during the electric power steering (EPS) operation. Since the displacement can be absorbed, it is possible to prevent peeling of the solder joint between the copper connectors 36a and 36b and the bare chip FET 35, and to ensure the reliability of electrical connection. Further, the copper connectors 36a and 36b themselves can be prevented from being damaged.
  • EPS electric power steering
  • the bare chip FET 35 is used in the semiconductor module 30, other bare chip transistors such as the bare chip IGBT may be used instead of the bare chip FET 35.
  • the copper connector is used to connect the electrode formed on the top surface of the bare chip transistor and the wiring pattern other than the wiring pattern to which the bare chip transistor is joined among the plurality of wiring patterns. What is necessary is just to join via solder.
  • the bonding of the bare chip transistor electrode and the wiring pattern on the substrate is simultaneously performed in the same process as the solder mounting operation performed when the bare chip transistor or other substrate mounting component is mounted on the wiring pattern on the substrate. be able to.
  • the emitter electrode and the gate electrode formed on the bare chip IGBT are respectively joined to the wiring pattern on the substrate via solder using a copper connector.
  • the emitter of the bare chip IGBT is used.
  • the bonding of the electrode and the wiring pattern on the substrate and the bonding of the gate electrode of the bare chip IGBT and another wiring pattern on the substrate are performed when the bare chip IGBT or other substrate mounting component is mounted on the wiring pattern on the substrate. It can be performed simultaneously in the same process as the solder mounting operation.
  • the copper connector for the gate electrode is a first source electrode copper connector (180 ° in FIG. 4) that is 180 ° straight with respect to the gate electrode copper connector. Tr2 and Tr4) and a second source electrode copper connector (see Tr1, Tr3, and Tr5 in FIG. 4) that is 90 ° perpendicular to the gate electrode copper connector.
  • a first source electrode copper connector 180 ° in FIG. 4
  • Tr2 and Tr4 and a second source electrode copper connector (see Tr1, Tr3, and Tr5 in FIG. 4) that is 90 ° perpendicular to the gate electrode copper connector.
  • one type of copper connector for a gate electrode, and one type of copper connector for a source electrode selected from two types of copper connectors for a first source electrode and a copper connector for a second source electrode Use in combination.
  • the arrangement of the first source electrode copper connector relative to the gate electrode copper connector is preferably 95 to 265 °, and preferably 160 to 200. More preferably, the angle is more preferably 175 to 185 °, and most preferably 180 °.
  • the arrangement of the second source electrode copper connector relative to the gate electrode copper connector is preferably 5 to 175 °, and preferably 70 to 120. More preferably, it is 85 ° to 95 °, and most preferably 90 °.
  • this semiconductor module like the semiconductor module 30 described above, a degree of freedom is provided in the arrangement of the bare chip transistors mounted on the substrate, the degree of freedom in designing the wiring on the substrate is increased, and the semiconductor module on the substrate is increased.
  • the layout can be made compact. Furthermore, it is possible to easily make the length of the path of each phase of the three-phase motor on the substrate the same. As a result, the phase characteristics of the three-phase motor, particularly the impedance characteristics of each phase, can be easily matched, and ripple accuracy such as torque and speed can be improved.

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Abstract

　製造タクトの短縮と製造コストの削減とを実現すると共に、接合部の信頼性を確保することができる半導体モジュールを提供する。半導体モジュール（３０）は、金属製の基板（３１）と、基板（３１）の上に形成された絶縁層（３２）と、絶縁層（３２）上に形成された複数の配線パターン（３３ａ～３３ｄ）と、配線パターン（３３ａ）上に半田（３４ａ）を介して実装されるベアチップトランジスタ（３５）と、ベアチップトランジスタ（３５）の電極（Ｓ，Ｇ）上と配線パターン（３３ｂ，３３ｃ）上とを半田（３４ｂ，３４ｃ）を介して接合する銅コネクタ（３６ａ，３６ｂ）とを備える。銅コネクタ（３６ａ，３６ｂ）はブリッジ形状であり、電極（Ｓ，Ｇ）との接合面（３６ａｆ）近傍に幅狭部（３６ａｇ）を設けると共に、電極（Ｓ，Ｇ）との接合面（３６ａｆ）に応力緩和部（３６ａｋ）を設ける。

Description

半導体モジュール
　本発明は、自動車用電気機器に組み込まれるパワーモジュール等の半導体モジュールに関する。
　昨今、自動車等の車両における種々の電気機器の制御に電子装置が導入されてきた。電子装置が組み込まれた電気機器の一例として電動パワーステアリング装置では、自動車の操舵に係る電動モータが収容される筐体にモータ駆動部が設けられ、このモータ駆動部に電子装置が搭載される。この電子装置は、パワーモジュールとして、モータ駆動部に組み込まれる。
　パワーモジュールは、電動パワーステアリング装置のような比較的大きな電流で駆動される電気機器の制御に適した、例えば、ＦＥＴ（Ｆｉｅｌｄ　Ｅｆｆｅｃｔ　Ｔｒａｎｓｉｓｔｏｒ）、ＩＧＢＴ（Ｉｎｓｕｌａｔｅｄ　Ｇａｔｅ　Ｂｉｐｏｌａｒ　Ｔｒａｎｓｉｓｔｏｒ）等のパワー素子を搭載したいわゆる半導体モジュールとして構成される。この種のパワーモジュールは、車両に搭載されることから車載モジュール（Ｉｎ－ｖｅｈｉｃｌｅ　Ｍｏｄｕｌｅ）とも呼ばれる。
　従来、この種の半導体モジュールとして、例えば、特許文献１に記載の技術がある。この技術は、金属基板上の配線パターンとベアチップトランジスタとを接合する電気的配線にワイヤを使用したものである。
　また、例えば特許文献２に記載の技術のように、金属基板上に実装される半導体素子を電気的に接続するリード部品を、半導体上の電極よりも大きくすると共に、接触部の信頼性の確保のために複数の接点としたり、接点幅を広くしたりするものもある。
　さらに、例えば特許文献３に記載の技術のように、コネクタ配線の応力緩和を行うために、立ち上がり曲げ部を設けたり、配線途中にヒューズ形状（波形状）を設けたりするものもある。
ＪＰ２００４－３３５７２５Ａ ＪＰ２００７－９５９８４Ａ ＪＰ２０００－１２４３９８Ａ
　しかしながら、上記特許文献１に記載の技術にあっては、ワイヤを使用した電気的配線を採用しているため、当該電気的配線をワイヤボンディング装置により実装することが必要となる。すなわち、その他の電子部品の半田実装とは異なり、製造工程を別で行う必要があり、製造タクトが長くなる。また、ワイヤボンディングの専用設備が必要となるため、製造コストが高くなる。
　また、上記特許文献２に記載の技術にあっては、大型の接点としているため、接合面が大きくなりすぎるために、捩れや熱収縮に弱くなる。そのため、接合部の信頼性を確保することが難しい。さらに、上記特許文献３に記載の技術にあっては、配線途中にヒューズ形状を設けているが、ヒューズ形状は成形が困難であり実用性に乏しい。
　そこで、本発明は、製造タクトの短縮と製造コストの削減とを実現すると共に、接合部の信頼性を確保することができる半導体モジュールを提供することを課題としている。
　上記課題を解決するために、本発明に係る半導体モジュールの一態様は以下の通りである。すなわち、本発明に係る半導体モジュールの一態様は、金属製の基板と、該基板の上に形成された絶縁層と、該絶縁層上に形成された複数の配線パターンと、該複数の配線パターンのうち一つの配線パターン上に半田を介して実装されるベアチップトランジスタと、該ベアチップトランジスタの上面に形成された電極上と前記複数の配線パターンのうち他の配線パターン上とを半田を介して接合する、銅板で構成される銅コネクタとを備えている。前記銅コネクタは、平板部と、該平板部の一端から立ち下がるように折り曲げられ前記電極上に接合される第１の脚部と、前記平板部の他端から立ち下がるように折り曲げられ前記他の配線パターン上に接合される第２の脚部とを有してブリッジ形状をなす。更に、前記第１の脚部に、前記電極との接合面とは反対側の端部から前記接合面が形成された端部へ向けて幅が狭くなる幅狭部を設ける。また、前記第１の脚部の前記電極との接合面に、当該接合面に作用する応力を緩和する形状を有する応力緩和部を設けることを特徴としている。
　すなわち、前記銅コネクタは、熱膨張率及び熱収縮率が前記基板とは異なることにより、加熱時もしくは冷却時に生じる銅コネクタ接合部の上下方向、左右方向、前後方向及び捻り方向の変位を吸収可能な形状を有することを特徴としている。このように、ベアチップトランジスタの電極と基板上の配線パターンとの接合部材として、銅板で構成される銅コネクタを用いる形態であるため、これらの接合を半田実装作業で行える。すなわち、ベアチップトランジスタの電極と基板上の配線パターンとの接合と、ベアチップトランジスタやその他の基板実装部品を基板上の配線パターン上に実装する際に行われる半田実装作業とを同一の設備、更には、同一の工程で同時に行うことができる。このため、半導体モジュールの製造タクトを短くすることができると共に、ワイヤボンディングの専用設備が不要になり、半導体モジュールの製造コストを安価にすることができる。
　さらに、銅コネクタをブリッジ形状とすることで、上下左右方向の変位が吸収可能となる。また、銅コネクタのベアチップトランジスタの電極と接合する第１の脚部に幅狭部を設けることで、前後方向及び捻り方向の変位が吸収可能となる。さらにまた、第１の脚部の上記電極との接合面に応力緩和部を設けるので、接合部に生じる応力を緩和することができる。したがって、リフロー工程や作動熱により熱膨張や熱収縮が発生した場合に、銅コネクタとベアチップトランジスタの電極との半田接合を剥がれ難くすることができ、接合部の信頼性を確保することができる。
　また、上記半導体モジュールにおいて、前記応力緩和部として、前記接合面に切り欠き部を形成したり、前記接合面を薄板で形成したり、前記接合面の角部に面取り部を形成したり、前記接合面の中央に孔を形成したりしてもよい。このように、切り欠き部を形成することで、接合部を２つにすることができると共に、各々の接合部の幅をさらに狭くすることができるため、捻りを受けても追従しやすくなる。また、接点が２つになることで所謂２重系を構成できるので、電気的信頼性が向上する。
　また、応力緩和部として薄板形状を採用した場合、板厚が薄いために捩れやすく、変位吸収しやすい。さらに、応力緩和部として先端Ｒ形状を採用した場合、捻りを受けたときの角部への応力集中を逃がす効果がある。さらにまた、応力緩和部として孔を形成した場合、半田が浸透ぬれ現象により接合面の上面に流れて放射状に広がるので、捻りを受けても半田が剥がれ難い。
　また、上記半導体モジュールにおいて、前記第１の脚部と前記第２の脚部にそれぞれ、前記接合面に作用する応力を緩和するダンベル形状のダンベル部を形成してもよい。
　本発明の半導体モジュールでは、ベアチップトランジスタの電極と基板上の配線パターンとの接合を、銅板で構成される銅コネクタを用いることにより、半田実装作業で行えるので、ベアチップトランジスタの電極と基板上の配線パターンとの接合を、ベアチップトランジスタやその他の基板実装部品を基板上の配線パターン上に実装する際に行われる半田実装作業と同一の工程で同時に行うことができる。このため、半導体モジュールの製造タクトを短くすることができると共に、ワイヤボンディングの専用設備が不要になり、半導体モジュールの製造コストを安価にすることができる。
　また、銅コネクタをブリッジ形状とすると共に、ベアチップトランジスタの電極と接合する第１の脚部に幅狭部と応力緩和部とを設けるので、あらゆる方向の変位が吸収可能となる。そのため、リフロー工程での銅コネクタの熱変形を吸収し、接合部の信頼性を確保することができる。さらに、製品使用時における温度変化による銅コネクタの破損を防止することができる。
本発明に係る半導体モジュールが用いられる電動パワーステアリング装置の基本構造を示す図である。 コントローラの制御系を示すブロック図である 半導体モジュールを含むコントローラの分解斜視図である。 半導体モジュールの平面図である。 ベアチップＦＥＴの概略平面図である。 ベアチップＦＥＴの電極と基板上の配線パターンとの接合状態を説明するための模式図である。 銅コネクタの形状を示す斜視図である。 応力緩和部の形状を示す図である。 応力緩和部の形状の別の例を示す図である。 応力緩和部の形状の別の例を示す図である。 応力緩和部の形状の別の例を示す図である。 半導体モジュールの製造方法を説明する図である。 第１の脚部と第２の脚部に形成したダンベル部の例を示す図である。 第１の脚部と第２の脚部に形成した湾曲部の例を示す図である。
　以下、本発明の実施の形態を図面に基づいて説明する。
　図１は、本発明に係る半導体モジュールが用いられる電動パワーステアリング装置の基本構造を示す図である。図１の電動パワーステアリング装置において、操向ハンドル１のコラム軸２は、減速ギア３、ユニバーサルジョイント４Ａ及び４Ｂ、ピニオンラック機構５を経て走行車輪のタイロッド６に連結されている。コラム軸２には、操向ハンドル１の操舵トルクを検出するトルクセンサ７が設けられており、操向ハンドル１の操舵力を補助する電動モータ８が減速ギア３を介してコラム軸２に連結されている。
　電動パワーステアリング装置を制御するコントローラ１０には、バッテリー（図示せず）から電力が供給されるとともに、イグニションキー（図示せず）を経てイグニションキー信号ＩＧＮ（図２参照）が入力される。コントローラ１０は、トルクセンサ７で検出された操舵トルクＴｓと車速センサ９で検出された車速Ｖとに基づいて、アシスト（操舵補助）指令となる操舵補助指令値の演算を行い、演算された操舵補助指令値に基づいて電動モータ８に供給する電流を制御する。コントローラ１０は、主としてマイクロコンピュータで構成されるが、その制御装置の機構及び構成を示すと図２に示すようになる。
　トルクセンサ７で検出された操舵トルクＴｓ及び車速センサ９で検出された車速Ｖは制御演算部としての制御演算装置１１に入力され、制御演算装置１１で演算された電流指令値をゲート駆動回路１２に入力する。電流指令値等に基づいてゲート駆動回路１２で形成されたゲート駆動信号は、ＦＥＴのブリッジ構成で成るモータ駆動部１３に入力され、モータ駆動部１３は非常停止用の遮断装置１４を経て３相ブラシレスモータで構成される電動モータ８を駆動する。３相ブラシレスモータの各相電流は電流検出回路１５で検出され、検出された３相のモータ電流ｉａ～ｉｃは制御演算装置１１にフィードバック電流として入力される。また、３相ブラシレスモータには、ホールセンサ等の回転センサ１６が取り付けられており、回転センサ１６からの回転信号ＲＴがロータ位置検出回路１７に入力され、検出された回転位置θが制御演算装置１１に入力される。
　また、イグニションキーからのイグニション信号ＩＧＮはイグニション電圧モニタ部１８及び電源回路部１９に入力され、電源回路部１９から電源電圧Ｖｄｄが制御演算装置１１に入力されるとともに、装置停止用となるリセット信号ＲＳが制御演算装置１１に入力される。さらに、遮断装置１４は、２相を遮断するリレー接点１４１及び１４２で構成されている。
　また、モータ駆動部１３の回路構成について説明すると、電源ライン８１に対し、直列に接続されたＦＥＴＴｒ１及びＴｒ２、ＦＥＴＴｒ３及びＴｒ４、及びＦＥＴＴｒ５及びＴｒ６が直列に接続されている。そして、電源ライン８１に対して、並列に接続されたＦＥＴＴｒ１及びＴｒ３、ＦＥＴＴｒ５及びＴｒ２、及びＦＥＴＴｒ４及びＴｒ６が接地ライン８２に接続されている。これにより、インバータを構成する。
　ここで、ＦＥＴＴｒ１及びＴｒ２は、ＦＥＴＴｒ１のソース電極ＳとＦＥＴＴｒ２のドレイン電極Ｄとが直列に接続され、３相モータのｃ相アームを構成し、ｃ相出力ライン９１ｃにて電流が出力される。また、ＦＥＴＴｒ３及びＴｒ４は、ＦＥＴＴｒ３のソース電極ＳとＦＥＴＴｒ４のドレイン電極Ｄとが直列に接続され、３相モータのａ相アームを構成し、ａ相出力ライン９１ａにて電流が出力される。更に、ＦＥＴＴｒ５及びＴｒ６は、ＦＥＴＴｒ５のソース電極ＳとＦＥＴＴｒ６のドレイン電極Ｄとが直列に接続され、３相モータのｂ相アームを構成し、ｂ相出力ライン９１ｂにて電流が出力される。
　図３は、図１に示す電動パワーステアリング装置の半導体モジュールを含むコントローラ１０の分解斜視図であり、コントローラ１０は、ケース２０と、モータ駆動部１３を含むパワーモジュールとしての半導体モジュール３０と、放熱用シート３９と、制御演算装置１１及びゲート駆動回路１２を含む制御回路基板４０と、電力及び信号用コネクタ５０と、３相出力用コネクタ６０と、カバー７０とを備えている。
　ここで、ケース２０は、略矩形状に形成され、半導体モジュール３０を載置するための平板状の半導体モジュール載置部２１と、半導体モジュール載置部２１の長手方向端部に設けられた、電力及び信号用コネクタ５０を実装するための電力及び信号用コネクタ実装部２２と、半導体モジュール載置部２１の幅方向端部に設けられた、３相出力用コネクタ６０を実装するための３相出力用コネクタ実装部２３とを備えている。
　そして、半導体モジュール載置部２１には、半導体モジュール３０を取り付けるための取付けねじ３８がねじ込まれる複数のねじ孔２１ａが形成されている。また、半導体モジュール載置部２１及び電力及び信号用コネクタ実装部２２には、制御回路基板４０を取り付けるための複数の取付けポスト２４が立設され、各取付けポスト２４には、制御回路基板４０を取り付けるための取付けねじ４１がねじ込まれるねじ孔２４ａが形成されている。更に、３相出力用コネクタ実装部２３には、３相出力用コネクタ６０を取り付けるための取付けねじ６１がねじ込まれる複数のねじ孔２３ａが形成されている。
　また、半導体モジュール３０は、前述したモータ駆動部１３の回路構成を有し、図４に示すように、基板３１に、６個のＦＥＴＴｒ１～Ｔｒ６、電源ライン８１に接続された正極端子８１ａ、及び接地ライン８２に接合された負極端子８２ａが実装されている。また、基板３１には、ａ相出力ライン９１ａに接合されたａ相出力端子９２ａ、ｂ相出力ライン９１ｂに接合されたｂ相出力端子９２ｂ、及びｃ相出力ライン９１ｃに接合されたｃ相出力端子９２ｃを含む３相出力部９０が実装されている。また、基板３１上には、コンデンサを含むその他の基板実装部品３７が実装されている。更に、半導体モジュール３０の基板３１には、半導体モジュール３０を取り付けるための取付けねじ３８が挿通する複数の貫通孔３１ａが設けられている。
　ここで、この半導体モジュール３０において、６個のＦＥＴＴｒ１～Ｔｒ６の基板３１上への実装について説明する。各ＦＥＴＴｒ１～Ｔｒ６は、ベアチップＦＥＴ（ベアチップトランジスタ）３５で構成され、図５に示すように、ベアチップＦＥＴ３５上にソース電極Ｓとゲート電極Ｇとを備え、また、ベアチップＦＥＴ３５の下面には図示しないドレイン電極を備えている。半導体モジュール３０は、図６に示すように、金属製の基板３１を備え、基板３１の上には、絶縁層３２が形成されている。基板３１は、アルミニウムなどの金属製である。また、この絶縁層３２上には、複数の配線パターン３３ａ～３３ｄが形成されている。各配線パターン３３ａ～３３ｄは、銅やアルミニウムなどの金属、又はこの金属を含む合金で構成される。
　そして、複数の配線パターン３３ａ～３３ｄのうち一つの配線パターン３３ａ上には半田３４ａを介して各ＦＥＴＴｒ１～Ｔｒ６を構成するベアチップＦＥＴ３５が実装されている。ベアチップＦＥＴ３５の下面に形成されたドレイン電極が半田３４ａを介して配線パターン３３ａに接合される。そして、ベアチップＦＥＴ３５のソース電極Ｓ上と複数の配線パターン３３ａ～３３ｄのうち他の配線パターン３３ｂ上とがソース電極用銅コネクタ３６ａでそれぞれ半田３４ｅ，３４ｂを介して接合される。
　ソース電極用銅コネクタ３６ａは、銅板を打抜き及び曲げ加工することによって形成される。ソース電極用銅コネクタ３６ａは、平板部３６ａａと、平板部３６ａａの一端から立ち下がるように折り曲げられて延び、半田３４ｅを介してベアチップＦＥＴ３５のソース電極Ｓに接合される接続部３６ａｂと、平板部３６ａａの他端から立ち下がるように折り曲げられて延び、半田３４ｂを介して配線パターン３３ｂに接合される接続部３６ａｃとを備えている。
　また、ベアチップＦＥＴ３５のゲート電極Ｇ上と複数の配線パターン３３ａ～３３ｄのうち更に他の配線パターン３３ｃ上とがゲート電極用銅コネクタ３６ｂでそれぞれ半田３４ｆ，３４ｃを介して接合される。
　ゲート電極用銅コネクタ３６ｂは、銅板を打抜き及び曲げ加工することによって形成される。ゲート電極用銅コネクタ３６ｂは、平板部３６ｂａと、平板部３６ｂａの一端から立ち下がるように折り曲げられて延び、半田３４ｆを介してベアチップＦＥＴ３５のゲート電極Ｇに接合される接続部３６ｂｂと、平板部３６ｂａの他端から立ち下がるように折り曲げられて延び、半田３４ｃを介して配線パターン３３ｃに接合される接続部３６ｂｃとを備えている。
　また、絶縁層３２上に形成された複数の配線パターン３３ａ～３３ｄのうち更にもう一つ他の配線パターン３３ｄ上には、半田３４ｄを介してコンデンサなどの他の基板実装部品３７が実装される。
　次に、ソース電極用銅コネクタ３６ａの形状について説明する。
　ソース電極用銅コネクタ３６ａは、図７に斜視図を示すように、平板部３６ａａと、接続部３６ａｂ（第１の脚部）と、接続部３６ａｃ（第２の脚部）とでブリッジ形状となっている。より具体的には、ソース電極用銅コネクタ３６ａは、平板部３６ａａの左右方向（図７のＸ軸方向）一端部に、第１屈曲部３６ａｄを介して接続部３６ａｂの一端が接続されており、接続部３６ａｂの他端は、第２屈曲部３６ａｅを介して外向きの接合面３６ａｆが形成されている。この接合面３６ａｆの下面が半田３４ｅを介してベアチップＦＥＴ３５のソース電極Ｓに接合される。
　また、接続部３６ａｂは、接合面３６ａｆ近傍に幅狭部３６ａｇを有する。幅狭部３６ａｇは、第１屈曲部３６ａｄから第２屈曲部３６ａｅに向けて幅が狭くなるテーパ形状となっている。平板部３６ａａの左右方向他端部には、第３屈曲部３６ａｈを介して接続部３６ａｃの一端が接続されており、接続部３６ａｃの他端は、第４屈曲部３６ａｉを介して外向きの接合面３６ａｊが形成されている。この接合面３６ａｊの下面が半田３４ｂを介して配線パターン３３ｂに接合される。
　さらに、接合面３６ａｆには、当該接合面３６ａｆに作用する応力を緩和する形状を有する応力緩和部３６ａｋを設ける。図８～図１１は、応力緩和部３６ａｋの形状の例を示す図である。図８、図９及び図１１において、符号ＰはソースＰＡＤである。図８に示す応力緩和部３６ａｋは、接合面３６ａｆにスリット（切り込み）を設けたものである。なお、当該スリットは、接合面３６ａｆの先端部を２つの面に分けられるものであれば、その形状や大きさは適宜選択可能である。
　応力緩和部３６ａｋの別の例としては、例えば図９に示すように、接合面３６ａｆの板厚を薄くするものもある。また、応力緩和部３６ａｋとしては、図１０に示すように、接合面３６ａｆ先端の角に面取り部を設けるものもある。ここで、面取り部は、図１０に示すＲ面取りに代えて、大きな円でもよく、またＣ面取りでもよい。さらに、応力緩和部３６ａｋとしては、図１１に示すように、接合面３６ａｆの中央に孔を設けるものもある。
　なお、ソース電極用銅コネクタ３６ａの形状は、ソース電極Ｓと配線パターン３３ｂとを接合できるブリッジ形状であれば任意の形状をとることができる。また、応力緩和部３６ａｋの形状についても、ソース電極Ｓと接合できる形状であれば任意の形状をとることができる。但し、半田接合の際に後に述べるリフロー接合を行い、また、半導体モジュール３０が稼働した際に発熱により高温になることから、熱応力を緩和できる形状とする。ゲート電極用銅コネクタ３６ｂについても同様である。このように構成された半導体モジュール３０は、図３に示すように、ケース２０の半導体モジュール載置部２１上に複数の取付けねじ３８により取り付けられる。半導体モジュール３０の基板３１には、取付けねじ３８が挿通する複数の貫通孔３１ａが形成されている。
　なお、半導体モジュール３０を半導体モジュール載置部２１上に取り付けるに際しては、放熱用シート３９を半導体モジュール載置部２１上に取付け、その放熱用シート３９の上から半導体モジュール３０を取り付ける。この放熱用シート３９により、半導体モジュール３０で発生した熱が放熱用シート３９を介してケース２０に放熱される。また、制御回路基板４０は、基板上に複数の電子部品を実装して制御演算装置１１及びゲート駆動回路１２を含む制御回路を構成するものである。制御回路基板４０は、半導体モジュール３０を半導体モジュール載置部２１上に取り付けた後、半導体モジュール３０の上方から半導体モジュール載置部２１及び電力及び信号用コネクタ実装部２２に立設された複数の取付けポスト２４上に複数の取付けねじ４１により取り付けられる。制御回路基板４０には、取付けねじ４１が挿通する複数の貫通孔４０ａが形成されている。
　また、電力及び信号用コネクタ５０は、バッテリー（図示せず）からの直流電源を半導体モジュール３０に、トルクセンサ１２や車速センサ９からの信号を含む各種信号を制御回路基板４０に入力するために用いられる。電力及び信号用コネクタ５０は、半導体モジュール載置部２１に設けられた電力及び信号用コネクタ実装部２２に複数の取付けねじ５１により取り付けられる。
　そして、３相出力用コネクタ６０は、ａ相出力端子９２ａ、ｂ相出力端子９２ｂ、及びｃ相出力端子９２ｃからの電流を出力するために用いられる。３相出用コネクタ６０は、半導体モジュール載置部２１の幅方向端部に設けられた３相出力用コネクタ実装部２３に複数の取付けねじ６１により取り付けられる。３相出力コネクタ６０には、取付けねじ６１が挿通する複数の貫通孔６０ａが形成されている。更に、カバー７０は、半導体モジュール３０、制御回路基板４０、電力及び信号用コネクタ５０、及び３相出力用コネクタ６０が取り付けられたケース２０に対し、制御回路基板４０の上方から当該制御回路基板４０を覆うように取り付けられる。
　次に、半導体モジュール３０の製造方法について図１２を参照して説明する。半導体モジュール３０の製造に際し、先ず、図１２（ａ）に示すように、金属製の基板３１の一方の主面上に絶縁層３２を形成する（絶縁層形成工程）。次いで、絶縁層３２上に複数の配線パターン３３ａ～３３ｄを形成する（配線パターン形成工程）。その後、図１２（ｂ）に示すように、複数の配線パターン３３ａ～３３ｄ上にそれぞれ半田ペースト（半田３４ａ～３４ｄ）を塗布する（半田ペースト塗布工程）。そして、図１２（ｃ）に示すように、複数の配線パターン３３ａ～３３ｄのうち一つの配線パターン３３ａ上に塗布された半田ペースト（半田３３ａ）上にベアチップＦＥＴ３５の一つを搭載するとともに（ベアチップＦＥＴ搭載工程）、他の配線パターン３３ｄ上に塗布された半田ペースト（半田３４ｄ）上にその他の基板実装部品３７を搭載する。その他のベアチップＦＥＴ３５についても、配線パターン３３ａと同一あるいは別個の配線パターン上に搭載する。
　次いで、図１２（ｄ）に示すように、ベアチップＦＥＴ３５の上面に形成されたソース電極Ｓ及びゲート電極Ｄ上に半田ペースト（半田３４ｅ，３４ｆ）を塗布する（半田ペースト塗布工程）。その後、図１２（ｅ）に示すように、ベアチップＦＥＴ３５のソース電極Ｓ上に塗布された半田ペースト（半田３４ｅ）上及び複数の配線パターン３３ａ～３３ｄのうちベアチップＦＥＴ３５が搭載された配線パターン３３ａ以外の他の配線パターン３３ｂ上に塗布された半田ペースト（半田３４ｂ）上に、ソース電極用銅コネクタ３６ａを搭載する（ソース電極用銅コネクタ搭載工程）。
　また、ベアチップＦＥＴ３５のゲート電極Ｇ上に塗布された半田ペースト（半田３４ｆ）上、及び複数の配線パターン３３ａ～３３ｄのうちベアチップＦＥＴ３５が搭載された配線パターン３３ａ及びソース電極用銅コネクタ３６ａが搭載された配線パターン３３ｂ以外の更に他の配線パターン３３ｃ上に塗布された半田ペースト（半田３４ｃ）上に、ゲート電極用銅コネクタ３６ｂを搭載する（ゲート電極用銅コネクタ搭載工程）。これにより、半導体モジュール中間組立体が構成される。
　そして、以上の工程により構成された半導体モジュール中間組立体をリフロー炉（図示せず）に入れて、複数の配線パターン３３ａ～３３ｄのうち一つの配線パターン３３ａとベアチップＦＥＴ３５との半田３４ａを介しての接合、配線パターン３３ｄとその他の基板実装部品３７との半田３４ｄを介しての接合、ベアチップＦＥＴ３５の上面に形成されたソース電極Ｓとソース電極用銅コネクタ３６ａとの半田３４ｅを介しての接合、複数の配線パターン３３ａ～３３ｄのうち他の配線パターン３３ｂとソース電極用銅コネクタ３６ａとの半田３４ｂを介しての接合、ベアチップＦＥＴ３５の上面に形成されたゲート電極Ｇとゲート電極用銅コネクタ３６ｂとの半田３４ｆを介しての接合、及び複数の配線パターン３３ａ～３３ｄのうち更に他の配線パターン３３ｃとゲート電極用銅コネクタ３６ｂとの半田３４ｃを介しての接合を一括して行う（接合工程）。これにより、半導体モジュール３０は完成する。
　ここで、ベアチップＦＥＴ３５のソース電極Ｓと基板３１上の配線パターン３３ｂとの接合にソース電極用銅コネクタ３６ａを用い、ベアチップＦＥＴ３５のゲート電極Ｇと基板３１上の別の配線パターン３３ｃとの接合にゲート電極用銅コネクタ３６ｂを用いることにより、これらの接合を半田実装作業により行えるので、ベアチップＦＥＴ３５のソース電極Ｓと基板３１上の配線パターン３３ｂとの接合及びベアチップＦＥＴ３５のゲート電極Ｇと基板３１上の別の配線パターン３３ｃとの接合を、ベアチップＦＥＴ３５やその他の基板実装部品３７を基板３１上の配線パターン３３ａ，３３ｄ上に実装する際に行われる半田実装作業と同一の工程で同時に行うことができる。このため、半導体モジュール３０の製造タクトを短くすることができるとともに、ワイヤボンディングの専用設備が不要になり、半導体モジュール３０の製造コストを安価にすることができる。
　ところで、半導体モジュール３０の基板３１にはアルミニウムが用いられており、ソース電極用銅コネクタ３６ａ及びゲート電極用銅コネクタ３６ｂには銅材が用いられている。アルミニウムの線膨張係数は２３．６×１０－６／℃であり、銅材の線膨張係数は１６．８×１０－６／℃であり、ベアチップＦＥＴ３５のシリコンの線膨張係数は２．５×１０－６／℃である。すなわち、基板３１の方が、銅コネクタ３６ａ及び３６ｂよりも温度変化に対して変形しやすい。
　そのため、リフロー工程や、電動パワーステアリング（ＥＰＳ）作動中の発熱により高温となると、基板３１及びベアチップＦＥＴ３５と銅コネクタ３６ａ，３６ｂとの膨張率の違いにより、銅コネクタ３６ａ，３６ｂに応力がかかる。このとき、銅コネクタ３６ａ，３６ｂがこの応力を緩和できない構造となっていると、ベアチップＦＥＴ３５との半田接合が剥がれてしまうおそれがある。
　これに対して、本実施形態では、銅コネクタ３６ａ及び３６ｂをブリッジ形状とし、ベアチップＦＥＴ３５の電極との接合面３６ａｆ付近に幅狭部３６ａｇを設けると共に、ベアチップＦＥＴ３５の電極との接合面３６ａｆに応力緩和部３６ａｋを設ける。このように、銅コネクタ３６ａ，３６ｂをブリッジ形状とすることで、上下左右方向（図７のＺ軸方向，Ｘ軸方向）の変位が吸収可能となる。また、幅狭部３６ａｇを設けることで、曲げの基点を細くすることができ、前後方向（図７のＹ軸方向）及び捻り方向の変位が吸収可能となる。
　すなわち、熱膨張、熱収縮により基板３１や銅コネクタ３６ａ，３６ｂに変形が生じた場合であっても、銅コネクタ３６ａ，３６ｂを曲がりやすくすることができる。また、幅狭部３６ａｇを接合面３６ａｆ近傍に設けるので、銅コネクタ３６ａ，３６ｂが幅狭部３６ａｇを基点に曲がったときの、銅コネクタ３６ａ，３６ｂとベアチップＦＥＴ３５との半田接合が剥がれにくい。
　さらに、応力緩和部３６ａｋを設けることで、捻り方向への応力を緩和することができる。特に、銅コネクタ３６ａ，３６ｂの応力緩和形状を、図８に示すスリット形状とした場合、ベアチップＦＥＴ３５との接点が２つになると共に、各々の接合部の幅がさらに狭くなるため、捻りを受けても追従しやすくなる。また、接点が２つになることで所謂２重系を構成できるので、電気的信頼性が向上する。
　また、図９に示す薄板形状とした場合、板厚が薄いために捩れやすく、変位吸収しやすい。図１０に示す先端Ｒ形状とした場合、捻りを受けたときの角部への応力集中を逃がす効果がある。さらに、図１１に示す孔形状とした場合にも、捩りを受けても追従しやすくなる。また、半田が浸透ぬれ現象により接合面３６ａｆの上面に流れて放射状に広がるので、捻りを受けても半田が剥がれ難い。
　またさらに、接合面３６ａｆ及び接合面３６ａｊに作用する応力を緩和する第１ダンベル部３６ａｌ及び第２ダンベル部３６ａｍを設けたソース電極用銅コネクタ３６ａの形状について説明する。なお、第１ダンベル部３６ａｌ及び第２ダンベル部３６ａｍの両方又は一方を、応力緩和部３６ａｋ及び幅狭部３６ａｇに加えて更に設けてもよいが、応力緩和部３６ａｋ又は幅狭部３６ａｇに代えて設けてもよい。また、応力緩和部３６ａｋ及び幅狭部３６ａｇを設けることなく、第１ダンベル部３６ａｌ及び第２ダンベル部３６ａｍの両方又は一方を設けてもよい。
　図１３に示すように、ソース電極用銅コネクタ３６ａは、平板部３６ａａと、接続部３６ａｂ（第１の脚部）と、接続部３６ａｃ（第２の脚部）とでブリッジ形状となっている。より具体的には、ソース電極用銅コネクタ３６ａは、平板部３６ａａの左右方向（図１３のＸ軸方向）の一端部に、第１屈曲部３６ａｄを介して接続部３６ａｂの一端が接続されており、接続部３６ａｂの他端には、第２屈曲部３６ａｅを介して外向きの接合面３６ａｆが形成されている。この接合面３６ａｆの下面が半田３４ｅを介してベアチップＦＥＴ３５のソース電極に接合される。
　接続部３６ａｂの接合面３６ａｆ近傍には、幅狭な第１ダンベル部３６ａｌが形成されている。詳述すると、接続部３６ａｂの幅方向両側部に、例えば半円弧状の切り欠きが対向して設けられていて、この切り欠きにより、接続部３６ａｂにはダンベル形状をなす第１ダンベル部３６ａｌが形成されている。
　平板部３６ａａの左右方向他端部には、第３屈曲部３６ａｈを介して接続部３６ａｃの一端が接続されており、接続部３６ａｃの他端は、第４屈曲部３６ａｉを介して外向きの接合面３６ａｊが形成されている。この接合面３６ａｊの下面が半田３４ｂを介して配線パターン３３ｂに接合される。
　接続部３６ａｃには、そのほぼ中央付近に、幅狭な第２ダンベル部３６ａｍが形成されている。詳述すると、接続部３６ａｃの幅方向両側部に、例えば半円弧状の切り欠きが対向して設けられていて、この切り欠きにより、接続部３６ａｃにはダンベル形状をなす第２ダンベル部３６ａｍが形成されている。
　この幅狭な第１ダンベル部３６ａｌ及び第２ダンベル部３６ａｍにより、ソース電極用銅コネクタ３６ａは、捩れやすく、変位吸収しやすい。第１ダンベル部３６ａｌ及び第２ダンベル部３６ａｍによる応力緩和の効果としては、第１ダンベル部３６ａｌ及び第２ダンベル部３６ａｍが伸び縮みするだけでなく、第１ダンベル部３６ａｌ及び第２ダンベル部３６ａｍの曲部が折れる方向にも変形できるので、板バネの効果が得られる。かつ、ソース電極用銅コネクタ３６ａは、ブリッジ形状による応力緩和によって上下方向、左右方向への変形吸収が更に可能となる。
　なお、接続部３６ａｂ及び接続部３６ａｃには、第１ダンベル部３６ａｌ及び第２ダンベル部３６ａｍの代わりに、接合面３６ａｆ及び接合面３６ａｊに作用する応力を緩和する湾曲部３６ａｎ及び湾曲部３６ａｏを設けてもよい（図１４を参照）。湾曲部３６ａｎ及び湾曲部３６ａｏを設けたソース電極用銅コネクタ３６ａの形状について、以下に説明する。ただし、湾曲部３６ａｎ及び湾曲部３６ａｏの両方または一方を、応力緩和部３６ａｋ及び幅狭部３６ａｇに加えて更に設けてもよいが、応力緩和部３６ａｋ又は幅狭部３６ａｇに代えて設けてもよい。また、応力緩和部３６ａｋ及び幅狭部３６ａｇを設けることなく、湾曲部３６ａｎ及び湾曲部３６ａｏの両方又は一方を設けてもよい。
　図１４に示すソース電極用銅コネクタ３６ａは、図１３に示すソース電極用銅コネクタ３６ａと基本構成は同様であるが、接続部３６ａｂ及び接続部３６ａｃの形状が異なっており、図１４に示すソース電極用銅コネクタ３６ａの接続部３６ａｂ及び接続部３６ａｃには、略“７”の字状に湾曲して形成された湾曲部３６ａｎ及び湾曲部３６ａｏが設けられている。
　詳述すると、接続部３６ａｂは、平板部３６ａａの左右方向（図７のＸ軸方向）一端部に接続され平板部３６ａａと同幅の幅広部と、この幅広部のうち平板部３６ａａの幅方向（図７のＹ軸方向）一端部から、平板部３６ａａの幅方向中央部に位置する接合面３６ａｆに向かって斜め方向に延びる斜め部とで構成されている。また、この斜め部は、幅広部よりも幅狭で、前記幅広部から接合面３６ａｆまでの全長にわたって略同幅である。これにより接続部３６ａｂは、全体として略“７”の字状に湾曲しており、湾曲部３６ａｎを構成している。
　一方、接続部３６ａｃも接続部３６ａｂとほぼ同様であり、平板部３６ａａの左右方向（図７のＸ軸方向）他端部に接続され平板部３６ａａと同幅の幅広部と、この幅広部のうち平板部３６ａａの幅方向（図７のＹ軸方向）他端部から、接合面３６ａｊの幅方向中央部に向かって斜め方向に延びる斜め部とで構成されている。また、この斜め部は、幅広部よりも幅狭で、前記幅広部から接合面３６ａｊまでの全長にわたって略同幅である。これにより接続部３６ａｃは、全体として略“７”の字状に湾曲しており、湾曲部３６ａｏを構成している。
　これら湾曲部３６ａｎ及び湾曲部３６ａｏにより、第１ダンベル部３６ａｌ及び第２ダンベル部３６ａｍと同様の作用が奏されるため、図１４のソース電極用銅コネクタ３６ａは、捩れやすく、変位吸収しやすい。かつ、図１４のソース電極用銅コネクタ３６ａは、ブリッジ形状による応力緩和によって上下方向、左右方向への変形吸収が更に可能となる。
　以上のように、本実施形態の半導体モジュール３０は、銅コネクタ３６ａ及び３６ｂがリフロー工程で熱変形する場合や、電動パワーステアリング（ＥＰＳ）作動中に基板３１が膨張又は収縮する場合でも、適切に変位吸収することができるので、銅コネクタ３６ａ及び３６ｂとベアチップＦＥＴ３５との半田接合の剥がれを防止することができ、電気的接続の信頼性を確保することができる。また、銅コネクタ３６ａ，３６ｂ自身の破損も防止することができる。
　以上、本発明の実施形態について説明してきたが、本発明はこれに限定されずに種々の変更、改良を行うことができる。
　例えば、半導体モジュール３０においてベアチップＦＥＴ３５を用いているが、ベアチップＦＥＴ３５に限らず、ベアチップＩＧＢＴなどの他のベアチップトランジスタを用いてもよい。そして、その他のベアチップトランジスタを用いる場合には、銅コネクタにより、ベアチップトランジスタの上面に形成された電極上と複数の配線パターンのうちベアチップトランジスタが接合された配線パターン以外の他の配線パターン上とを半田を介して接合すればよい。これにより、ベアチップトランジスタの電極と基板上の配線パターンとの接合を、ベアチップトランジスタやその他の基板実装部品を基板上の配線パターン上に実装する際に行われる半田実装作業と同一の工程で同時に行うことができる。
　そして、ベアチップトランジスタとしてベアチップＩＧＢＴを用いる場合、ベアチップＩＧＢＴ上に形成されたエミッタ電極及びゲート電極を、それぞれ、銅コネクタを用いて基板上の配線パターンに半田を介して接合することが好ましい。このように、ベアチップＩＧＢＴを用い、ベアチップＩＧＢＴ上に形成されたエミッタ電極及びゲート電極を、それぞれ、銅コネクタを用いて基板上の配線パターンに半田を介して接合する場合には、ベアチップＩＧＢＴのエミッタ電極と基板上の配線パターンとの接合及びベアチップＩＧＢＴのゲート電極と基板上の別の配線パターンとの接合を、ベアチップＩＧＢＴやその他の基板実装部品を基板上の配線パターン上に実装する際に行われる半田実装作業と同一の工程で同時に行うことができる。
　更に、半導体モジュール３０において、ゲート電極用銅コネクタは１種類であり、ソース電極用銅コネクタは、ゲート電極用銅コネクタに対して１８０°ストレート配置とする第１ソース電極用銅コネクタ（図４のＴｒ２及びＴｒ４を参照）と、ゲート電極用銅コネクタに対して９０°直角配置とする第２ソース電極用銅コネクタ（図４のＴｒ１、Ｔｒ３、及びＴｒ５を参照）との２種類であり、１つのベアチップＦＥＴにおいて、１種類のゲート電極用銅コネクタと、２種類の第１ソース電極用銅コネクタ及び第２ソース電極用銅コネクタのうちから選択されたいずれか一方のソース電極用銅コネクタとを組み合わせて使用するとよい。
　なお、ゲート電極用銅コネクタに対する第１ソース電極用銅コネクタの配置（ゲート電極用銅コネクタと第１ソース電極用銅コネクタのなす角度）は、９５～２６５°とすることが好ましく、１６０～２００°とすることがより好ましく、１７５～１８５°とすることがさらに好ましく、１８０°とすることが最も好ましい。
　また、ゲート電極用銅コネクタに対する第２ソース電極用銅コネクタの配置（ゲート電極用銅コネクタと第２ソース電極用銅コネクタのなす角度）は、５～１７５°とすることが好ましく、７０～１２０°とすることがより好ましく、８５～９５°とすることがさらに好ましく、９０°とすることが最も好ましい。
　この半導体モジュールによれば、前述の半導体モジュール３０と同様に、基板上に実装されるベアチップトランジスタの配置に自由度が生まれ、基板上の配線の設計の自由度が増大し、基板上における半導体モジュールのレイアウトをコンパクトにすることができる。さらに、基板上における３相モータの各相の径路の長さを同一にすることを容易に行うことができる。これにより、３相モータの各相特性、特に各相のインピーダンス特性を容易に一致させることができ、トルクや速度等のリップル精度を向上することが可能になる。
　１…操向ハンドル、２…コラム軸、３…減速ギア、４Ａ，４Ｂ…ユニバーサルジョイント、５…ピニオンラック機構、６…タイロッド、７…トルクセンサ、８…電動モータ、９…車速センサ、１０…コントローラ、１１…制御演算装置、１２…ゲート駆動回路、１３…モータ駆動部、１４…非常停止用の遮断装置、１５…電流検出回路、１６…回転センサ、１７…ロータ位置検出回路、１８…ＩＧＮ電圧モニタ部、１９…電源回路部、２０…ケース、２１…半導体モジュール載置部、２１ａ…ねじ孔、２２…電力及び信号用コネクタ実装部、２３…３相出力用コネクタ実装部、２３ａ…ねじ孔、２４…取付けポスト、２４ａ…ねじ孔、３０…半導体モジュール、３１…基板、３１ａ…貫通孔、３２…絶縁層、３３ａ～３３ｄ…配線パターン、３４ａ～３４ｄ…半田、３５…ベアチップＦＥＴ（ベアチップトランジスタ）、３６ａ…ソース電極用銅コネクタ、３６ａａ…平板部、３６ａｂ…接続部（第１の脚部）、３６ａｃ…接続部（第２の脚部）、３６ａｄ…第１屈曲部、３６ａｅ…第２屈曲部、３６ａｆ…接合面、３６ａｇ…幅狭部、３６ａｈ…第３屈曲部、３６ａｉ…第４屈曲部、３６ａｊ…接合面、３６ａｋ…応力緩和部、３６ａｌ…第１ダンベル部、３６ａｍ…第２ダンベル部、３６ｂ…ゲート電極用銅コネクタ、３６ｂａ…平板部、３６ｂｂ…接続部、３６ｂｃ…接続部、３７…基板実装部品、３８…取付けねじ、３９…放熱用シート、４０…制御回路基板、４０ａ…貫通孔、４１…取付けねじ、５０…電力及び信号用コネクタ、５１…取付けねじ、６０…３相出力用コネクタ、６０ａ…貫通孔、６１…取付けねじ、７０…カバー、８１…電源ライン、８１ａ…正極端子、８２…接地ライン、８２ａ…負極端子、９０…３相出力部、９１ａ…ａ相出力ライン、９１ｂ…ｂ相出力ライン、９１ｃ…ｃ相出力ライン、Ｇ…ゲート電極（電極）、Ｓ…ソース電極（電極）

Claims (6)

  1. 　金属製の基板と、該基板の上に形成された絶縁層と、該絶縁層上に形成された複数の配線パターンと、該複数の配線パターンのうち一つの配線パターン上に半田を介して実装されるベアチップトランジスタと、該ベアチップトランジスタの上面に形成された電極上と前記複数の配線パターンのうち他の配線パターン上とを半田を介して接合する、銅板で構成される銅コネクタとを備え、
    　前記銅コネクタは、平板部と、該平板部の一端から立ち下がるように折り曲げられ前記電極上に接合される第１の脚部と、前記平板部の他端から立ち下がるように折り曲げられ前記他の配線パターン上に接合される第２の脚部とを有してブリッジ形状をなし、
    　前記第１の脚部の前記電極との接合面近傍に、前記第１の脚部の他の部分と比較して幅の狭い幅狭部を設けると共に、前記第１の脚部の前記電極との接合面に、当該接合面に作用する応力を緩和する形状を有する応力緩和部を設けることを特徴とする半導体モジュール。
  2. 　前記応力緩和部として、前記接合面に切り欠き部を形成したことを特徴とする請求項１に記載の半導体モジュール。
  3. 　前記応力緩和部として、前記接合面を薄板で形成したことを特徴とする請求項１又は２に記載の半導体モジュール。
  4. 　前記応力緩和部として、前記接合面の角部に面取り部を形成したことを特徴とする請求項１～３の何れか１項に記載の半導体モジュール。
  5. 　前記応力緩和部として、前記接合面の中央に孔を形成したことを特徴とする請求項１～４の何れか１項に記載の半導体モジュール。
  6. 　前記第１の脚部と前記第２の脚部にそれぞれ、前記接合面に作用する応力を緩和するダンベル形状のダンベル部を形成したことを特徴とする請求項１～５の何れか１項に記載の半導体モジュール。
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WO2016080521A1 (ja) * 2014-11-20 2016-05-26 日本精工株式会社 電子部品搭載用放熱基板
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