WO2014057752A1

WO2014057752A1 - Light-emitting element and light-emitting device provided with same

Info

Publication number: WO2014057752A1
Application number: PCT/JP2013/074142
Authority: WO
Inventors: 学道重光; 宏之花戸
Original assignee: シャープ株式会社
Priority date: 2012-10-09
Filing date: 2013-09-06
Publication date: 2014-04-17

Abstract

The present invention provides a light-emitting element that is able to efficiently emit a desired light and conduct photocatalysis, and provides a light-emitting device provided with the light-emitting element. The light-emitting element is provided with a LED element (1), a first resin section (2) containing a phosphor, and a cover section (40). A hollow section (3) is provided between the outer surface of the first resin section (2) and the inner surface of the cover section (40). A reflecting film (4) having a wavelength dependency on reflectance is provided on the outer surface of the cover part (40).

Description

LIGHT EMITTING ELEMENT AND LIGHT EMITTING DEVICE HAVING THE SAME

The present invention relates to a light emitting element and a light emitting device including the same. More specifically, the present invention relates to a light emitting element capable of emitting white light adjusted to a desired chromaticity with high light extraction efficiency and a light emitting device including the light emitting element.

White light emitting devices using semiconductor light emitting devices are expected to be applied to the next generation of general lighting and bulbs such as liquid crystal backlights, and tube markets such as fluorescent tubes and cold cathode tubes. Such a white light emitting element is obtained by coating a light emitting diode chip with a resin containing phosphor, etc., and light from a phosphor excited by light from the light emitting diode chip and light from the light emitting diode chip. To obtain white light.

In recent years, with the improvement in performance of individual white light-emitting elements due to the development of technologies such as blue light-emitting diodes and phosphors used in white light-emitting elements, white light-emitting elements that surpass luminous efficiency such as fluorescent lamps and cold cathode tubes are being commercialized. is there.

However, these white light emitting elements still have large chromaticity variations compared to chromaticity variations such as fluorescent lamps and cold cathode fluorescent lamps. Is required. Therefore, various structures for reducing variations in chromaticity have been proposed (Patent Documents 1 to 4).

Patent Document 1 discloses a structure that improves the accuracy of chromaticity by using a plurality of LED chips and making the combination of chromaticity of each LED chip a predetermined combination. However, in this structure, when a module is used, chromaticity variation occurs due to variations in the amount of phosphor of each LED chip.

Therefore, Patent Documents 2 to 4 disclose techniques for color matching in a separate process in a modularized state.

In Patent Document 2, the phosphor layer for chromaticity adjustment containing the second phosphor provided in the outer layer in the light emitting direction than the phosphor-containing resin layer containing the first phosphor. A configuration formed in a dot shape is disclosed, and it is disclosed that the color is finely adjusted by the phosphor layer for chromaticity adjustment.

Patent Document 3 discloses a light-emitting element containing a phosphor and having a light scattering portion formed on at least a part of the surface of a sealing resin portion covering a light-emitting diode chip, and the light scattering portion is disposed therein. Thus, it is disclosed that the efficiency of quantum conversion by a phosphor is improved.

Patent Document 4 has an LED element and a sealing material containing a phosphor in a transparent resin, and the sealing material is disposed in the periphery of the LED element, and the surface of the sealing material An LED light source having a transparent thin film with a refractive index different from the refractive index of the encapsulant is disclosed.

Japanese Patent Publication “Japanese Patent Laid-Open No. 2011-3594 (published on January 6, 2011)” Japanese Patent Publication “Japanese Patent Laid-Open No. 2010-186968 (Released on August 26, 2010)” Japanese Patent Publication “JP 2009-130301 A” (published on June 11, 2009) Japanese Patent Publication “Japanese Patent Laid-Open No. 2010-16029 (published on Jan. 21, 2010)”

However, since the technique disclosed in Patent Document 2 requires a process of forming the chromaticity adjusting phosphor layer in a dot shape, it is difficult to accurately configure the chromaticity adjusting phosphor layer. Therefore, there is a problem that it is difficult to finely adjust the color in practice.

On the other hand, methods disclosed in

Patent Documents

3 and 4 can be used to easily and accurately construct the phosphor layer.

However, in the method disclosed in Patent Document 3, the ratio of the fluorescence emitted from the phosphor being scattered by the light scattering portion and other phosphors, resulting in a loss due to multiple scattering, increases the light extraction efficiency. There is a problem that will decrease.

Also, in the method disclosed in Patent Document 4, the fluorescence emitted from the phosphor is scattered by other phosphors in the resin layer, resulting in multiple scattering in which light diffuses in the phosphor layer, resulting in large light loss. Therefore, there is a problem that the light extraction efficiency decreases.

In addition, the light emitting element has been used mainly in the form of an LED module or the like, and is rarely used by being exposed to the external environment. When considering using the light-emitting element exposed to the external environment, it can be said that it is very useful if the light-emitting element can also exhibit effects such as an antifouling effect and an antifogging effect. However, no proposal has been made for a light-emitting element that exhibits the above effects.

The present invention has been made in view of the above problems, and its purpose is to sufficiently suppress the occurrence of multiple scattering, to emit white light having desired chromaticity characteristics with high light extraction efficiency, and An object of the present invention is to provide a light-emitting element having an excellent photocatalytic action and a light-emitting device including the light-emitting element.

In order to solve the above-mentioned problems, the present inventor has made it possible to finely adjust the chromaticity of emitted light while suppressing the occurrence of multiple scattering with a simple structure and maintaining the light utilization efficiency, and The structure capable of producing a photocatalytic action has been intensively studied.

As a result, the phosphor is contained only in the phosphor-containing resin layer that seals the LED element, so that the phosphor is localized in a region in the vicinity of the LED element, and the phosphor-containing layer is covered via the space. It was found that the above-mentioned problems can be solved by providing a reflective film having a wavelength dependency on the reflectance on the outer surface of the cover part, and the present invention has been completed.

That is, the light-emitting element according to one embodiment of the present invention includes an LED element and a phosphor that absorbs a part of light emitted from the LED element, converts the wavelength, and emits light, and seals the LED element. A first resin portion and a cover portion that seals the first resin portion, and the first resin portion includes a surface of the first resin portion and an inner surface of the cover portion. It is sealed by the cover part through a cavity part which is a space between the two parts, and the cover part is provided with a reflection film having a wavelength dependency on the reflectance on the outer surface.

The light emitting device according to the present invention can sufficiently suppress the occurrence of multiple scattering, and has an effect that a light emitting device having desired chromaticity characteristics can be obtained efficiently and at low cost. Furthermore, effects such as antifouling, antifogging, antibacterial, air purification, and water purification can be achieved by the photocatalytic action of the reflective film.

It is a schematic sectional structure figure of the light emitting element concerning the 1st and 2nd embodiment of the present invention. FIG. 6 is a chromaticity diagram illustrating variation in chromaticity depending on the presence or absence of a reflective film in the light emitting device according to the present invention. It is a schematic sectional drawing of the light emitting element concerning 3rd and 4th embodiment of this invention. It is a schematic diagram which shows the outline of the process of the manufacturing method of a light emitting element. It is a side view which shows the outline of the structure of the light-emitting device concerning one Embodiment of this invention. It is a side view which shows the outline of the structure of the light-emitting device concerning one Embodiment of this invention. It is a general | schematic cross-section figure of a conventionally well-known light emitting element which shows the distribution state of the fluorescent substance in a conventionally well-known light emitting element.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, the same code | symbol is attached | subjected about the member which shows the same function and an effect | action.

A light-emitting element according to the present invention includes a LED element and a phosphor that absorbs part of light emitted from the LED element, converts the wavelength to emit light, and seals the LED element. And a cover portion that seals the first resin portion, and the first resin portion is a space between the surface of the first resin portion and the inner surface of the cover portion. It is sealed by the cover part through a certain hollow part, and the cover part includes a reflection film having a wavelength dependency on the reflectance on the outer surface.

<First Embodiment>
(LED element sealed with phosphor-containing resin layer, light-emitting element having a cavity)
A light emitting device according to a first embodiment of the present invention will be described with reference to FIG. FIG. 1 is a schematic cross-sectional structure diagram of a light emitting device 100 according to a first embodiment and a second embodiment described later.

As shown in FIG. 1, the light emitting element 100 includes an LED element 1, a phosphor-containing resin layer (first resin part) 2, a space (cavity part) 3, a reflective film 4, a substrate 5, and a sealing cover (cover part). 40).

That is, in the first embodiment, in the light emitting device 100 according to the present invention, the phosphor-containing resin layer (first resin portion) 2 is formed on the outer peripheral portion of the LED device 1, and the LED device 1 is sealed. It has stopped. The phosphor-containing resin layer (first resin part) 2 contains the phosphor, but the space (cavity part) 3 outside the phosphor-containing resin layer (first resin part) 2 is the fluorescent substance. It has a configuration that does not contain a body. The “outer peripheral part” means that the LED element 1 is outside in the light emission direction as viewed from the LED element 1.

The LED element 1 is mounted on the mounting surface 6 of the substrate 5 with a silicone resin paste or the like. The substrate 5 is preferably made of a material having a high reflective effect on the mounting surface, and for example, a ceramic substrate is preferably used.

On the substrate 5, a front surface electrode (not shown) for wire bonding is mounted on the mounting surface 6, and a back surface electrode (not shown) for connecting to an external circuit on the back surface (the surface on which the LED element 1 is not mounted). ), And a through hole (not shown) for conducting the front surface electrode and the back surface electrode is provided inside.

The LED element 1 may be any element that can emit blue light (wavelength of 435 nm or more and 480 nm or less). For example, a nitride-based compound semiconductor such as InGaN can be used.

The LED element 1 is mounted (die bonding) on the mounting surface 6 of the substrate 5 and is electrically connected to the surface electrode of the substrate 5 by a wire (not shown) made of, for example, gold. As a result, power is supplied to the LED element 1 from the back electrode of the substrate 5.

A phosphor-containing resin layer (first resin portion) 2 is formed on the outer peripheral portion of the LED element 1. The phosphor-containing resin layer (first resin portion) 2 is a space between the surface of the phosphor-containing resin layer (first resin portion) 2 and the inner surface of the sealing cover (cover portion) 40. It is sealed with a sealing cover (cover part) 40 through the cavity 3. In FIG. 1, a space (hollow part) 3 is surrounded by the surface of the phosphor-containing resin layer (first resin part) 2, the inner surface of the sealing cover (cover part) 40, and the mounting surface 6 of the substrate. This area

The number of the LED elements 1 may be one or plural. When there are a plurality of LED elements 1, a plurality of LED elements 1 may be arranged inside one phosphor-containing resin layer (first resin portion) 2.

Moreover, there are a plurality of phosphor-containing resin layers (first resin portions) 2 in which one or a plurality of LED elements 1 are arranged, and each of the phosphor-containing resin layers (first resin portions) 2 The phosphor-containing resin layer (first resin portion) is formed by the sealing cover (cover portion) 40 so that a space (hollow portion) 3 is formed between the surface and the inner surface of the sealing cover (cover portion) 40. 2 may be sealed, and the reflective film 4 may be formed on the outer surface of the sealing cover (cover portion) 40.

That is, a space (cavity) 3 exists in the outer periphery of each of the plurality of phosphor-containing resin layers (first resin portions) 2, and the sealing cover (cover) covers the space (cavity) 3. 40 may be formed, and the reflective film 4 may be formed so as to cover the outer surface of the sealing cover (cover portion) 40.

The “outer surface” refers to an outer surface in the light emitting direction when viewed from the LED element 1 among the surfaces, and the “inner surface” refers to light viewed from the LED element 1 among the surfaces. The inner surface in the emission direction.

The sealing cover (cover part) 40 is interposed through a cavity 3 that is a space between the surface of the phosphor-containing resin layer (first resin part) 2 and the inner surface of the sealing cover (cover part) 40. Then, the phosphor-containing resin layer (first resin portion) 2 is sealed.

“The phosphor-containing resin layer (first resin portion) 2 is sealed through the cavity 3” means that the surface of the phosphor-containing resin layer (first resin portion) 2 is sealed with a cover (cover). Part) 40 is not in direct contact with the inner surface of the inner surface and is not directly covered by the inner surface. For example, as shown in FIG. 1 and FIGS. 5 and 6 described later, the inner surface of the sealing cover (cover part) 40 The sealing cover (cover part) 40 is arranged so that a space (hollow part) 3 exists between the surface of the phosphor-containing resin layer (first resin part) 2.

That is, the sealing cover (cover part) 40 becomes a lid (lid part) with respect to the space (cavity part) 3 in which the phosphor-containing resin layer (first resin part) 2 exists, and the sealing cover ( It is only necessary that the space (hollow part) 3 can be closed by arranging the cover part 40.

In the light emitting device 100 shown in FIG. 1, the end portion of the sealing cover (cover portion) 40 arranged in this way is fixed to the mounting surface 6 of the substrate, and the phosphor-containing resin layer (first resin portion) 2 is formed. It is sealed.

In the light emitting device 110 shown in FIG. 5, the end portion of the sealing cover (cover portion) 40 is fixed to the mounting member 30, and the phosphor-containing resin layer (first resin portion) 2 is sealed.

In the light emitting device 111 shown in FIG. 6, the end portion of the sealing cover (cover portion) 40 is fixed to the base portion of the plug 33, and the phosphor-containing resin layer (first resin portion) 2 is sealed.

When the number of the LED elements 1 is plural, the LED elements 1 may be arranged at predetermined positions, for example, at equal intervals so as to satisfy a predetermined light emission amount.

The phosphor-containing resin layer (first resin portion) 2 is formed so as to cover the LED element 1 and seals the LED element 1. The phosphor-containing resin layer (first resin portion) 2 is made of a resin containing a phosphor. The resin is preferably a silicone resin because of its excellent translucency, and an epoxy resin, an acrylic resin, or the like can also be used.

The phosphor absorbs part of the light emitted from the LED element 1 (blue light), converts the wavelength, and emits yellow light. Examples of such phosphors include CaAlSiN ₃ : Eu, (Si · Al) ₆ (O · N) ₈ : Eu, BOSE (Ba, O, Sr, Si, Eu), SOSE (Sr, Ba, Si, O, Eu), YAG (Ce activated yttrium aluminum garnet), α sialon ((Ca), Si, Al, O, N, Eu), β sialon (Si, Al, O, N, Eu), etc. It can be used suitably.

The material constituting the sealing cover (cover portion) 40 is preferably a resin material such as polycarbonate or acrylic. Moreover, what mixed the inorganic particle or the polymer with the said resin material, and provided light diffusibility may be used. Furthermore, glass can also be used.

(Regarding adjustment of chromaticity by reflecting film)
The sealing cover (cover portion) 40 includes a reflective film 4 having a wavelength dependency on the reflectance on the outer surface. “Having wavelength dependency in reflectance” means that the reflectance of light having a wavelength in a specific range is stronger than the reflectance of light having a wavelength in the other range. For example, if it reflects blue light more strongly than green light or red light, it can be said that the reflective film has a wavelength dependency of “high reflectance of blue light”.

In the present invention, the reflective film 4 has (1) the reflectance of visible light having a wavelength of 435 nm or more and 480 nm or less is higher than the reflectance of visible light having a wavelength of 500 nm or more and 700 nm or less, or (2) It is preferable that the reflectance of visible light having a wavelength of 500 nm to 700 nm is higher than the reflectance of visible light having a wavelength of 435 nm to 480 nm.

In the case of (1) above, the reflectance of blue light (wavelength 435 nm or more and 480 nm or less) is green light (wavelength 500 nm or more and 560 nm or less), yellow-green light (wavelength 560 nm or more and 580 nm or less), yellow light (wavelength 580 nm or more and 595 nm or less). ), Orange light (wavelength 595 nm or more and 605 nm or less) and red light (wavelength 605 nm or more and 700 nm or less).

Therefore, when the reflective film 4 is not formed, the blue light emitted from the LED element and the yellow light from the phosphor that absorbs part of the light emitted from the LED element and converts the wavelength to emit light. When the mixed light is bluer than the prescribed chromaticity as white light, the reflective film 4 of (1) above may be formed on the outer surface of the sealing cover (cover portion) 40.

Thereby, the blue light transmitted through the reflective film 4 and emitted from the light emitting element 100 is reduced, and the wavelength of the blue light is converted by the phosphor. As a result, since the ratio of yellow light in the emitted light increases, the light emitted from the light emitting element 100 has chromaticity shifted to the yellow side as compared with the emitted light in the case where there is no reflective film 4.

Therefore, it is possible to optimize the chromaticity of the emitted light of the light emitting element 100 in which the emitted light is bluer than the prescribed chromaticity as white light, and the quality of the light emitting element 100 can be improved.

When the reflective film 4 is (2), contrary to the case (1), the reflectance from the green light to the red light is high, and the light from the green light to the red light has a wavelength by the phosphor. Converted. As a result, since the ratio of blue light in the emitted light increases, the light emitted from the light emitting element 100 has a chromaticity shifted to the blue side as compared with the emitted light in the case where there is no reflective film 4. Become.

Therefore, when the reflective film 4 is not formed, the light obtained by mixing the blue light emitted from the LED element and the yellow light from the phosphor is yellower than the prescribed chromaticity as white light. In the case where it is worn, the reflective film 4 of the above (2) is formed on the outer surface of the sealing cover (cover portion) 40. Thereby, the chromaticity of the emitted light of the light emitting element 100 in which the emitted light is yellower than the prescribed chromaticity as white light can be optimized, and the quality of the light emitting element 100 can be improved.

FIG. 2 is a chromaticity diagram for explaining variation in chromaticity depending on the presence or absence of the reflective film 4 in the light emitting device 100 shown in FIG. Here, the light emitting device 100 includes a sealing cover (cover portion) 40, a space (hollow portion) 3, and a phosphor-containing resin layer (first resin portion) 2, and the reflective film 4 is not formed. When the plurality of LED elements 1 are sealed inside the phosphor-containing resin layer (first resin portion) 2, the result of measuring the chromaticity of the emitted light of all the LED elements 1 is shown in FIG. It is assumed that it is shown in (a). The chromaticity can be measured by a conventionally known method using a commonly used chromaticity meter.

As shown in FIG. 2A, the light before forming the reflective film 4 is colored due to the dispersion of the phosphor dispersed in the phosphor-containing resin layer (first resin portion) 2. The degree of variation varies widely.

Here, when it is desired to increase the chromaticity of the emitted light of the light emitting element 100 in both the x direction and the y direction, it is necessary to change the chromaticity in the yellow direction, and therefore, on the surface of the sealing cover (cover portion) 40, When the reflective film (1) is formed as the reflective film 4, blue light is reflected more strongly than green light to red light.

The reflected blue light returns to the phosphor-containing resin layer (first resin portion) 2, undergoes wavelength conversion by the phosphor, and is emitted toward the reflection film 4. If the emitted light is yellow light, the light passes through the reflective film 4 and is emitted to the outside of the light emitting element 100.

On the other hand, when the light that has been subjected to the wavelength conversion and is emitted toward the reflective film 4 is still shifted to blue, the blue light contained in the light is reflected by the reflective film 4, and again the phosphor. Undergoes wavelength conversion. By repeating the above operation by increasing the number of wavelength conversions, light of the desired chromaticity (in this case, yellow light) is finally obtained without causing light loss even with a small amount of phosphor. be able to.

As described above, since the chromaticity is adjusted by forming the reflective film 4, the variation in chromaticity corresponding to the portion of the region A shown in FIG. ), The chromaticity of light emitted from the light emitting element 100 to the outside can be adjusted from the blue side to the yellow side (direction in which the chromaticity increases).

The reflective film 4 is preferably a dielectric film having a photocatalytic action. Since the reflective film 4 is a dielectric film having a photocatalytic action, the light emitting device of the present invention has effects such as an antifouling effect, an antifogging effect, an antibacterial effect, an air cleaning effect, and a water purification effect.

The light emitting device of the present invention exhibits an antifouling effect and an antifogging effect, so that the intensity and brightness of light emitted from the light emitting device can be kept constant, and the usable period of the light emitting device can be lengthened. it can.

In addition, the light emitting device of the present invention has an antibacterial effect, an air purification effect, and a water purification effect, thereby adding a more useful effect to the effect of stably emitting light having a desired chromaticity. It will be. Therefore, the commercial value of the present light emitting element can be further improved.

The dielectric film preferably contains TiO ₂ . TiO ₂ is inexpensive, and a reflective film having a blue light reflectance higher than that of green light to red light can be formed by an inexpensive process such as vapor deposition or sputtering. That is, in addition to the antifouling effect and the like, an effect of preventing light pollution can be achieved by removing light having a short wavelength.

However, not only TiO ₂ but also a dielectric material can be used as the material of the reflective film 4. For example, ZnO, SiO ₂ or the like can be preferably used. The material forming the reflective film 4 may be a composition such as a composition of SiO ₂ and ZnO and / or TiO ₂ .

On the other hand, by designing the reflective film 4 so that the reflectance of light having a long wavelength is high, for example, a reflective film in which the reflectance of green light to red light is higher than that of blue light can be formed. . Thereby, the chromaticity of the light emitted to the outside from the light emitting element 100 can be adjusted from the yellow side to the blue side (direction in which the chromaticity decreases). The adjustment of chromaticity in this case is realized not by the wavelength conversion efficiency by the phosphor but by the loss of the long wavelength component.

The preferred content of the dielectric material in the reflective film 4 varies depending on the physical properties of the dielectric material contained in the reflective film 4, the amount of wavelength component to be adjusted, the wavelength of light incident on the reflective film 4, etc. I can't say.

The wavelength dependency of the reflective film 4 depends on the refractive index of the resin (for example, acrylic resin) constituting the phosphor-containing resin layer (first resin part) 2 and the sealing cover (cover part) 40 and the reflective film 4. It depends on the refractive index. For example, TiO ₂ (refractive index of about 2.5) with respect to acrylic resin (refractive index of about 1.50) increases the reflectance of short-wavelength light in the visible wavelength region compared to long-wavelength light. .

Further, the wavelength dependence of the reflective film 4 also varies depending on the film thickness of the reflective film 4. In other words, the wavelength dependence of the reflective film 4 is influenced by interference involving the refractive index of the resin constituting the sealing cover (cover portion) 40, the refractive index of the reflective film 4, and the film thickness of the reflective film 4. Therefore, it is preferable to perform toning by appropriately determining the refractive index of the reflecting film 4 and the film thickness of the reflecting film 4 according to the toning result to be obtained.

The material for forming the reflective film 4 may be selected as appropriate according to the type of light whose output is desired to be reduced by measuring the chromaticity of the light emitted from the light emitting element 100 when the reflective film 4 is not formed. Good. The reflective film 4 can be formed by depositing a material containing the dielectric material on the outer surface of the sealing cover (cover portion) 40 using a method such as vapor deposition or sputtering.

The reflective film 4 is preferably a single layer film, but is not limited to this and may be a multilayer film. In the case of a multilayer film, it is possible to perform toning with reduced light loss by designing the reflectance of the visible light region to be low and the reflectance of only a limited wavelength region to be high.

(About phosphor concentration)
In the first embodiment, the phosphor-containing resin layer (first resin portion) 2 contains a phosphor, and the space (cavity portion) 3 does not contain a phosphor.

By adopting such a configuration, it is possible to suppress multiple scattering and prevent a decrease in emission efficiency. This will be described below.

FIG. 7 is a schematic cross-sectional structure diagram of a conventionally known light emitting device showing a state of phosphor distribution in the conventionally known light emitting device.

As shown in FIG. 7, in the conventionally known light emitting device 200, the phosphor-containing resin layer 2 'is formed in one layer on the outer peripheral portion of the LED device 1, and contains the phosphor inside. In other words, the LED element is a so-called single-sealed seal that is sealed only by the phosphor-containing resin layer 2 ′.

In the light emitting element 200, when obtaining the emitted light having the same chromaticity as the light emitting element 100 according to the first embodiment, the concentration of the phosphor is such that the phosphor-containing resin layer 2 ′ has a concentration as shown in FIG. It is necessary to make it uniformly diffused at a low concentration inside.

This is because if the amount of the phosphor contained in the phosphor-containing resin layer is approximately the same, the greater the volume of the phosphor-containing resin layer, the more the wavelength of the light reflected by the reflective film 4 is converted by the phosphor. By.

For example, the amount of the phosphor contained in the phosphor-containing resin layer (first resin portion) 2 shown in FIG. 1 and the amount of the phosphor contained in the phosphor-containing resin layer 2 ′ shown in FIG. In the case of the same degree, the volume of the phosphor-containing resin layer 2 ′ is made larger than the volume of the phosphor-containing resin layer (first resin portion) 2 and the number of wavelength conversions by the phosphor is increased, so that FIG. The light emitting element 200 shown can emit outgoing light having the same chromaticity characteristics as the light emitting element 100 shown in FIG.

That is, in the phosphor-containing resin layer 2 ′, the wavelength conversion is made equal by adjusting the concentration of the phosphor according to the volume difference from the phosphor-containing resin layer (first resin portion) 2, and the light emitting element The emitted light having the same chromaticity characteristic as 100 can be emitted.

However, the light emitting element 200 has a lower light extraction efficiency than the light emitting element 100. That is, fluorescence is generally scattered by the phosphor even when wavelength conversion (quantum effect) is not performed. At this time, when the phosphor concentration inside the phosphor-containing resin layer 2 ′ is low as in the light-emitting element 200, the light diffuses inside the phosphor-containing resin layer 2 ′ and goes to the outside of the light-emitting element 200. There is a problem in that the ratio of light that is lost due to multiple scattering before being emitted increases, and the light extraction efficiency decreases.

In FIG. 7, a part of the light a emitted from the LED element 1 is reflected by the reflective film 4 and separated into emitted light c ′ and reflected light b ′. The reflected reflected light b ′ is scattered by the phosphor present in the phosphor-containing resin layer 2 ′, and the phosphor concentration in the phosphor-containing resin layer 2 ′ is low, so that the inside of the phosphor-containing resin layer 2 ′. To diffuse. D 'in FIG. 7 represents light diffused while being scattered by the phosphor. When such diffusion occurs, the light is not easily emitted to the outside of the light emitting element 200.

In the light-emitting element disclosed in Patent Document 4, the phosphor content and the concentration of the phosphor are uniformly diffused at a low concentration in the sealing material disclosed in Patent Document 4 as in the light-emitting element 200. It is a light emitting element in a state. That is, the light-emitting element disclosed in Patent Document 4 has a problem that the loss of light due to multiple scattering is large, similar to the light-emitting element 200.

On the other hand, in the light emitting device 100 according to the first embodiment, the phosphor-containing resin layer (first resin portion) 2 contains a phosphor, and the space (cavity portion) 3 does not contain a phosphor. The phosphor is localized in the vicinity of the LED element 1. That is, the phosphor concentration in the phosphor-containing resin layer (first resin portion) 2 is much higher than the phosphor concentration in the phosphor-containing resin layer 2 ′.

In FIG. 1, a part of the light a emitted from the LED element 1 is reflected by the reflective film 4 and separated into emitted light c and reflected light b. The reflected reflected light b is scattered by the phosphor present in the phosphor-containing resin layer (first resin portion) 2 (wavelength conversion is also performed), but the phosphor-containing resin layer (first resin portion). 2) Since the phosphor concentration inside 2 is high, the inside of the phosphor-containing resin layer (first resin portion) 2 is not diffused.

That is, the wavelength-converted light d is quickly emitted outside the light emitting element 100 without being diffused. Alternatively, part of the light is reflected by the reflective film 4 and undergoes further wavelength conversion by the phosphor. Then, the outgoing light c having the wavelength λ and the light d having the wavelength λ ′ are mixed, and white light having a desired chromaticity can be obtained.

Thus, in the light emitting element 100, since the phosphor is accumulated in the region in the vicinity of the LED element 1, even if the fluorescence is scattered by the phosphor, the phosphor concentration inside the phosphor-containing resin layer 2 ′ is low. Unlike the light emitting element 200 and the light emitting element disclosed in Patent Document 4, light does not diffuse in the phosphor layer.

Therefore, there is an advantage that multiple scattering can be suppressed and light having desired chromaticity characteristics can be emitted outside the light emitting element 100 with high light extraction efficiency.

From the viewpoint of preventing multiple scattering, the concentration of the phosphor in the phosphor-containing resin layer (first resin portion) 2 is preferably as high as possible. This is because the phosphor can be further accumulated in a region in the vicinity of the LED element 1 and light can be prevented from diffusing inside the phosphor-containing resin layer (first resin portion) 2.

<Second Embodiment>
(Light emitting device provided with phosphor-containing resin layer and resin layer not containing phosphor)
A second embodiment of the light emitting device according to the present invention will be described with reference to FIG. 1 as in the first embodiment. FIG. 1 is a schematic cross-sectional structure diagram of a light emitting device 100 according to the first and second embodiments.

The light emitting device 100 according to the second embodiment is the first embodiment, except that a resin layer (second resin portion) 3 that does not contain a phosphor is provided instead of the space (cavity portion) 3. This is the same as the light emitting device 100 according to the above. Since the light emitting device according to the first embodiment uses the space (hollow portion) 3, the manufacturing cost can be made lower than that of the light emitting device according to the second embodiment.

In the second embodiment, in the light emitting device 100 according to the present invention, the resin portion is laminated in two layers on the outer peripheral portion of the LED device 1. And the fluorescent substance containing resin layer (1st resin part) 2 which is one layer inside the said resin part contains the said fluorescent substance, and the fluorescent substance which is the outer one layer among the said resin parts is used. The resin layer (second resin part) 3 that is not contained has a configuration in which the phosphor is not contained. The “outer peripheral part” means that the LED element 1 is outside in the light emission direction as viewed from the LED element 1.

The resin layer (second resin part) 3 not containing the phosphor is formed so as to cover the surface of the phosphor-containing resin layer (first resin part) 2, and the phosphor-containing resin layer (first resin part) 2) is sealed. The surface of the resin layer (second resin portion) 3 not containing phosphor is covered with a sealing cover (cover portion) 40, and the sealing cover (cover portion) 40 is a resin not containing phosphor. The layer (second resin part) 3 is sealed.

The resin constituting the resin layer (second resin portion) 3 not containing a phosphor is preferably a silicone resin because of its excellent translucency, and an epoxy resin or an acrylic resin can also be used.

(Regarding adjustment of chromaticity by reflecting film)
The wavelength dependence of the reflective film 4 in the second embodiment is that the refractive index of the phosphor-containing resin layer (first resin portion) 2 and the resin layer (second resin portion) 3 not containing phosphor are configured. The refractive index of the resin, the refractive index of the resin constituting the sealing cover (cover portion) 40, the refractive index of the reflective film 4, and the thickness of the reflective film 4 are affected by interference. Therefore, it is preferable to perform toning by appropriately determining the refractive index of the reflecting film 4 and the film thickness of the reflecting film 4 according to the toning result to be obtained.

<Third Embodiment>
(Another form of light-emitting element in which the LED element is sealed with a phosphor-containing resin layer and has a hollow portion)
In the first and second embodiments, as shown in FIG. 1, in the light emitting device 100, the phosphor-containing resin layer (first resin portion) 2, the space (cavity portion), or the resin layer (first layer) containing no phosphor. The second resin portion 3, the sealing cover (cover portion) 40, and the reflective film 4 are formed in a hemispherical shape on the mounting surface 6 of the substrate 5. However, the form of the light emitting element is not limited to this. In the third embodiment, a light-emitting element that takes a different form from the first and second embodiments will be described.

FIG. 3 is a schematic cross-sectional structure diagram of a light-emitting element 101 according to the third embodiment of the present invention. In the light emitting element 101, the reflection frame 7 is disposed on the mounting surface 6 of the substrate 5.

The reflective frame 7 is for efficiently irradiating the reflective film 4 with light emitted from the LED element 1 or the phosphor, and a material having a high surface reflectance such as resin, ceramic, or metal material is used. For example, the light beam emitted from the LED element 1 in the lateral direction can be emitted in the direction of the reflective film 4 by being reflected by the reflection frame 7. The reflection frame 7 may be formed on the mounting surface 6 as a separate body from the substrate 5 or may be integrally formed with the substrate 5.

In the light emitting element 101, a phosphor-containing resin layer (first resin part) 2 containing a phosphor is formed on the outer peripheral part of the LED element 1, and a sealing cover (cover part) 40 is located between the upper surfaces of the reflection frame 7. It is arranged across.

A space (hollow portion) 3 is formed between the inner surface of the sealing cover (cover portion) 40 and the surface of the phosphor-containing resin layer (first resin portion) 2 and no phosphor is contained. . That is, the phosphor-containing resin layer (first resin portion) 2 is sealed by the sealing cover (cover portion) 40 through the space (cavity portion) 3. On the surface of the sealing cover (cover portion) 40, a reflective film 4 having a wavelength dependency on the reflectance is formed.

As shown in FIG. 3, a part of the light a emitted from the LED element 1 is reflected by the reflective film 4 and separated into reflected light b and outgoing light c. The reflected light b is wavelength-converted by the phosphor in the phosphor-containing resin layer (first resin portion) 2 and is emitted from the light emitting element 101 as the emitted light d. The light a is partly wavelength-converted by a phosphor after being emitted, and is emitted from the light emitting element 101 as emitted light d ′.

In the light emitting device 101 according to the third embodiment, the phosphor-containing resin layer (first resin part) 2, the space (cavity part) 3, the sealing cover (cover part) 40, and the reflective film 4 have the first shapes. Although different from the light emitting device 100 according to the first embodiment, the reflective film 4 has wavelength dependency on the reflectance as described above, and therefore has an appropriate wavelength according to the chromaticity characteristics when the reflective film 4 is not provided. By selecting the reflective film 4 having the dependency, the light in which the outgoing lights c, d, and d ′ are mixed can be turned into white light having desired chromaticity characteristics.

The phosphor is contained only in the phosphor-containing resin layer (first resin portion) 2. That is, it is localized in a region near the LED element. Therefore, the problem of light loss due to multiple scattering does not occur. Furthermore, since the light emitting element 101 includes the reflective frame 7, white light having a desired chromaticity can be emitted more efficiently.

Furthermore, since the reflective film 4 is provided, the light emitting device 101 according to the third embodiment is antifouling, antifogging based on the photocatalytic action, similarly to the light emitting device 100 according to the first and second embodiments. Effects such as antibacterial, air purification and water purification can be achieved.

<Fourth Embodiment>
(Other forms of light-emitting element including a phosphor-containing resin layer and a resin layer not containing a phosphor)
A fourth embodiment of the light emitting device according to the present invention will be described with reference to FIG. 3 as in the third embodiment. FIG. 3 is a schematic cross-sectional structure diagram of the light emitting device 101 according to the third and fourth embodiments.

The light emitting device 101 according to the fourth embodiment is the third embodiment, except that a resin layer (second resin portion) 3 not containing a phosphor is provided instead of the space (cavity portion) 3. It is the same as the light emitting element 101 concerning.

That is, in the light emitting element 101 according to the fourth embodiment, the resin part is laminated in two layers on the outer peripheral part of the LED element 1, and contains a phosphor on the inner side, that is, on the side close to the LED element 1. A resin layer (first resin portion) 2 is formed and seals the LED element 1. And the resin layer (2nd resin part) 3 which does not contain a fluorescent substance is formed so that the outer surface of the fluorescent substance containing resin layer (1st resin part) 2 may be covered, and fluorescent substance containing resin layer ( 1st resin part) 2 is sealed.

Further, a sealing cover (cover portion) 40 is formed across the surface of the resin layer (second resin portion) 3 not containing the phosphor and the reflection frame 7 and contains the phosphor. A non-resin layer (second resin portion) 3 is sealed, and a reflective film 4 having wavelength dependency on reflectance is formed on the outer surface of the sealing cover (cover portion) 40.

The light emitting element 101 includes a phosphor-containing resin layer (first resin portion) 2, a resin layer (second resin portion) 3 not containing phosphor, a sealing cover (cover portion) 40, and a reflective film 4. Is different from the light emitting device 100 according to the second embodiment, but the reflection film 4 has wavelength dependency on the reflectance as described above, and therefore depends on the chromaticity characteristics when the reflection film 4 is not provided. By selecting the reflective film 4 having an appropriate wavelength dependency, the light in which the outgoing lights c, d, and d ′ are mixed can be converted into white light having desired chromaticity characteristics.

Further, since the concentration of the phosphor is higher in the region near the LED element than the concentration in the region near the reflective film, the problem of light loss due to multiple scattering does not occur. Furthermore, since the light emitting element 101 includes the reflective frame 7, white light having a desired chromaticity can be emitted more efficiently.

Furthermore, since the reflective film 4 is provided, the light emitting device 101 according to the fourth embodiment is similar to the light emitting device 100 according to the first or second embodiment and the light emitting device 101 according to the third embodiment. In addition, effects such as antifouling, antifogging, antibacterial, air purification and water purification based on photocatalytic action can be achieved.

(Manufacturing method of light emitting element)
The light emitting element according to the present invention absorbs a part of light emitted from the LED element 1 on the mounting surface 6 of the substrate 5 so as to cover the LED element 1 mounted on the mounting surface of the substrate 5, for example. A first step of forming a phosphor-containing layer (first resin portion) 2 containing a phosphor that emits light after wavelength conversion; and sealing the LED element 1; the phosphor-containing layer (first resin) A second step of forming the second resin part 3 not containing the phosphor and forming a sealing cover (cover part) 40 on the surface of the second resin part 3; Chromaticity characteristics of light emitted from the LED element 1 through the phosphor-containing layer (first resin portion) 2, the second resin portion 3 not containing the phosphor, and the sealing cover (cover portion) 40. A third step of measuring the outer surface of the sealing cover (cover portion) 40 according to the measured chromaticity characteristics. Includes a fourth step of forming a reflective film 4 having a wavelength dependence to the reflection factor, the.

In the second step, instead of forming the second resin part 3 containing no phosphor, the surface of the phosphor-containing layer (first resin part) 2 and the inside of the sealing cover (cover part) 40 It may be a step of sealing the phosphor-containing layer (first resin portion) 2 with a sealing cover (cover portion) 40 so that a space (hollow portion) 3 is formed between the surface and the surface.

In this case, since there is no second resin portion 3 that does not contain a phosphor, the third step emits from the LED element through the first resin portion and the sealing cover (cover portion) 40. It is preferable to be a step of measuring the chromaticity characteristics of the emitted light.

FIG. 4 is a schematic diagram showing an outline of the steps of the method for manufacturing a light emitting device. FIG. 4A shows a method for manufacturing the light emitting device 100 according to the second embodiment. FIG. 4B shows a method for manufacturing the light emitting device 101 according to the fourth embodiment. FIG. 4C shows a method for manufacturing the light emitting device 100 according to the first embodiment.

First, as shown in FIGS. 4A, 1B, 1B, 1C, and 1C, the LED element 1 is mounted on the mounting surface 6 of the substrate 5, and FIG. (2), (b) (2), (c) As shown in (2), wire bonding is performed using the wire 8 and a conventionally known wire bonding machine 9.

Subsequently, the phosphor-containing resin layer (first resin portion) 2 is covered with the LED element 1 by using the dispenser 10 as shown in FIGS. 4 (a), (3), (c) and (3). The LED element 1 is sealed by coating on the mounting surface 6 as described above. 4B and 3B, the phosphor-containing resin layer (first resin portion) 2 is formed in a recess formed by the mounting surface 6 and the reflection frame 7 so as to cover the LED element 1. The LED element 1 is sealed by pouring.

Furthermore, as shown to (a) (4) of FIG. 4, so that the fluorescent substance containing resin layer (1st resin part) 2 may be covered, the resin layer which does not contain a fluorescent substance using a dispenser (not shown) ( (Second resin part) 3 is formed, and a resin layer (second resin part) 3 not containing a phosphor is covered and molded by a mold 11.

4B and 4B, the resin layer (second resin portion) 3 is formed on the surface of the phosphor-containing resin layer (first resin portion) 2 by using the dispenser 10. That is, in FIGS. 4A, 4B, and 4B, the resin layer (second resin portion) 3 is formed so as to cover the surface of the phosphor-containing resin layer (first resin portion) 2. Is forming.

“Covering the surface of the phosphor-containing resin layer (first resin portion) 2” means a resin layer (second resin portion) not containing a phosphor, as shown in FIGS. 3 including covering the entire surface of the phosphor-containing resin layer (first resin portion) 2, as shown in FIGS. 4B and 4, a resin layer containing no phosphor (second resin) Part) 3 to cover a part of the surface of the phosphor-containing resin layer (first resin part) 2 (only the upper surface).

In (c) and (4) of FIG. 4, there is a space (hollow part) 3 between the surface of the phosphor-containing resin layer (first resin part) 2 and the inner surface of the sealing cover (cover part) 40. The end portion of the sealing cover (cover portion) 40 is fixed to the mounting surface 6 so as to exist. For example, the fixing is performed by adjusting a material (resin material such as polycarbonate or acrylic) constituting the sealing cover (cover portion) 40 to a shape of the sealing cover (cover portion) 40 using a mold. After the portion is fixed to the mounting surface 6, the material can be cured.

When using a resin layer (second resin part) 3 that does not contain a phosphor, as shown in FIGS. 4 (a), (5), and (b) (5), a resin layer that does not contain a phosphor (first) The resin layer (second resin portion) 3 that does not contain a phosphor may be sealed by covering the surface of the second resin portion) 3 with a sealing cover (cover portion) 40.

The sealing cover (cover part) 40 is, for example, applied and cured with a material constituting the sealing cover (cover part) 40 on the surface of the resin layer (second resin part) 3 that does not contain a phosphor. Can be formed.

Next, the light is emitted from the LED element 1 through the phosphor-containing resin layer (first resin portion) 2, the resin layer not containing phosphor (second resin portion) 3, and the sealing cover (cover portion) 40. Or chromaticity characteristics of light emitted through the phosphor-containing resin layer (first resin portion) 2, the space (cavity portion) 3 and the sealing cover (cover portion) 40. taking measurement.

Then, based on the measurement result, the reflective film 4 having the wavelength dependency necessary for obtaining the desired measurement result is selected, and the reflective film 4 is placed on the outer surface of the sealing cover (cover portion) 40, for example. It is formed by forming a film using a method such as vapor deposition or sputtering.

Finally, as shown by arrows in (a), (6), (b), (6), and (c), (5) of FIG. The

light emitting element

100 or 101 can be manufactured by curing the resin portion 2, the resin layer (second resin portion) 3 not containing the phosphor, and the sealing cover (cover portion) 40.

<Fifth Embodiment>
(One form of the light-emitting device provided with the light emitting element concerning this invention)
An embodiment of a light emitting device according to the present invention will be described with reference to FIG. FIG. 5 is a side view schematically showing the structure of the light emitting device 110 according to the embodiment of the present invention.

As shown in FIG. 5, the light emitting device 110 includes an LED element 1, a phosphor-containing resin layer (first resin portion) 2, a resin layer (second resin portion) 3 that does not contain a cavity or phosphor, and a reflection The light emitting element provided with the film | membrane 4, the board | substrate 5, and the sealing cover (cover part) 40, the mounting member 30, the heat sink 31, and the nozzle | cap | die 32 are provided.

In the light emitting device 110 of the present invention, the light emitting element is mounted on the mounting member 30. The light emitting element is mounted on the mounting member 30 so that the back surface of the substrate 5 provided in the light emitting element is in contact with the surface of the mounting member 30. The placement member 30 is connected to the back electrode of the substrate 5 so as to be energized. Further, the end portion of the sealing cover (cover portion) 40 is fixed to the mounting member 30.

The light-emitting device 110 of the present invention is provided with a heat sink 31, and the heat sink 31 has a function of releasing self-generated heat generated from the LED element 1. By providing the heat sink 31 and releasing the self-generated heat, there is an effect of preventing the light emitting efficiency of the LED element from being lowered and shortening the life of the members used in the LED element and the light emitting device.

As the metal material constituting the heat sink 31 provided in the light emitting device 110 of the present invention, aluminum or the like is used.

The light emitting device 110 of the present invention is provided with a base 32. The base 32 is a part for connecting the light emitting device 110 of the present invention and a lighting fixture.

In addition, the light emitting device 110 of the present invention includes the light emitting element of the present invention, and the light emitting element of the present invention includes the reflective film 4.

The reflective film 4 is a dielectric film having a photocatalytic action, and the dielectric film preferably contains TiO ₂ . Since the reflective film 4 provided in the light emitting device of the present invention is a dielectric film having a photocatalytic action, the light emitting device 110 of the present invention has antifouling, antifogging, antibacterial, air purification, water purification, and the like. There is an effect. Furthermore, since the reflective film 4 can remove light having a short wavelength, it has an effect of preventing light pollution.

The light emitting device 110 can be manufactured as follows, for example. That is, the board | substrate 5 is mounted in the mounting member 30, and the LED element 1 is mounted in the mounting surface of a board | substrate. Subsequently, the phosphor-containing resin layer (first resin portion) 2, the cavity portion, or the resin layer not containing phosphor (second resin portion) according to the method described in the section “Method for producing light-emitting element” 3) It can be manufactured by producing the reflective film 4.

The mounting member 30, the heat sink 31, and the base 32 may be integrally formed, or may be connected to each other.

<Sixth Embodiment>
(Another embodiment of a light-emitting device provided with a light-emitting element according to the present invention)
Another embodiment of the light emitting device according to the present invention will be described with reference to FIG. FIG. 6 is a side view schematically showing the structure of the light emitting device 111 according to the embodiment of the present invention.

As shown in FIG. 6, the light emitting device 111 includes an LED element 1, a phosphor-containing resin layer (first resin portion) 2, a cavity portion or a resin layer (second resin portion) 3 that does not contain phosphor, a reflection The light emitting element provided with the film | membrane 4, the board | substrate 5, and the sealing cover (cover part) 40, the mounting member 30, and the plug 33 are provided.

The number of the LED elements 1 provided in the light emitting device 111 may be one or a plurality as shown in FIG.

6 can be manufactured, for example, as follows. That is, two LED elements 1 are mounted on the substrate 5, and these LED elements 1 are phosphor-containing resin layer (first resin part) according to the method described in the section “Method for producing light-emitting element”. Nine items sealed in 2 (hereinafter referred to as resin-encapsulated product A) are placed on the placement member 30 in a row. In addition, you may increase the number of rows | lines further as needed toward the back of the paper surface of FIG.

Next, a plug 33 is attached to the mounting member 30, and the surface of the phosphor-containing resin layer (first resin portion) 2 of the placed resin sealing material A and the inside of the sealing cover (cover portion) 40 The sealing cover (cover part) 40 is fixed to the base of the plug 33 so that the space (cavity part) 3 is between the surface and the phosphor-containing resin layer (first resin part) 2 is sealed. To do.

As described in the section “Method for Manufacturing Light-Emitting Element”, measurement of light chromaticity characteristics, formation of a reflective film, phosphor-containing resin layer (first resin portion) 2, and sealing cover (cover) Part) 40 is cured to obtain the light emitting device 111.

At this time, the light emitting device of the present invention is constituted by the respective resin encapsulated material A, the space (hollow part) 3 and the sealing cover (cover part) 40.

Alternatively, instead of providing the space (hollow part) 3, the phosphor-containing resin layer (first layer) is formed in the recess formed by the plug 33 and the mounting member 30 according to (b) and (4) of FIG. A resin layer (second resin portion) 3 that does not contain a phosphor is injected so as to cover the surface of the resin portion 2, and a resin layer that does not contain a phosphor in accordance with (b) and (5) of FIG. A sealing cover (cover portion) 40 may be formed on the surface of the (second resin portion) 3.

The light emitting element provided in the light emitting device 111 is mounted on the mounting member 30. The light emitting element is mounted on the mounting member 30 so that the back surface of the substrate 5 provided in the light emitting element is in contact with the surface of the mounting member 30. The mounting member 30 is connected to the back electrode 8 (not shown) of the substrate 5 so as to be energized.

The light emitting device 111 of the present invention is provided with a plug 33. The plug 33 is a part for connecting the light emitting device 111 of the present invention and a lighting fixture.

The plug 33 provided in the light emitting device 111 of the present invention may have a function as the reflection frame already described. When the plug 33 functions as a reflection frame, the light emitted from the LED element 1 in the lateral direction is reflected by the plug 33, so that the plug 33 can be emitted in the direction of the reflective film 4. In this case, since the plug 33 functions as a reflection frame, the light emitting device 111 can emit white light having a desired chromaticity more efficiently.

As described in the light emitting device 110, the light emitting device 111 uses a dielectric film having a photocatalytic action as a reflection film, thereby preventing the above-described antifouling, antifogging, antibacterial, air cleaning, and water purification. The effects such as the above can be achieved. Moreover, the effect of removing light of a short wavelength and preventing light pollution can also be exhibited.

As described above, in the light emitting device according to the present invention, since the light emitting element according to the present invention is exposed to the external environment, white light having desired chromaticity characteristics can be emitted with high light extraction efficiency. By using a dielectric film having a photocatalytic action as the reflective film, the above-described various effects can be achieved.

[Summary]
A light-emitting element according to one embodiment of the present invention includes a LED element and a phosphor that absorbs a part of light emitted from the LED element, converts the wavelength, and emits light, and seals the LED element. One resin portion and a cover portion for sealing the first resin portion, and the first resin portion is between the surface of the first resin portion and the inner surface of the cover portion. It is sealed by the cover part through a hollow part which is a space of the above-mentioned space, and the cover part is provided with a reflective film having a wavelength dependency on the reflectance on the outer surface.

Part of the light emitted from the LED element is reflected by the reflective film and undergoes a wavelength conversion process by the phosphor, but the reflective film has a wavelength dependency on the reflectance. It is possible to easily control the reflectivity so as to reduce the reflectivity.

In addition, since the reflection film is provided, light having a desired chromaticity characteristic can be obtained by increasing the number of wavelength conversions by the phosphor even when the amount of the phosphor is reduced. Therefore, since the usage-amount of the said fluorescent substance can be reduced, material cost can be reduced.

Furthermore, the phosphor is contained only in the first resin portion. Therefore, the concentration of the phosphor is not uniform in the region inside the cover part, and the phosphor is localized in the region near the LED element.

On the other hand, when the concentration of the phosphor in the region inside the cover portion is uniform throughout, the light emitted from the LED element reflected by the reflective film is converted into fluorescence by the phosphor. Thereafter, the LED element may travel to the LED element side instead of the light emission direction. That is, the loss of light due to multiple scattering increases.

According to the configuration of the light emitting element according to the present invention, since the phosphor is contained only in the first resin portion, the occurrence of multiple scattering can be sufficiently suppressed.

From the above, the light-emitting element according to the present invention can obtain a light-emitting element having desired chromaticity characteristics efficiently and at low cost.

In the light-emitting element according to one embodiment of the present invention, the reflective film is preferably a dielectric film having a photocatalytic action.

In the light-emitting element according to one embodiment of the present invention, the dielectric film preferably contains TiO ₂ .

According to the above configuration, it can be expected that effects such as antifouling, antifogging, antibacterial, air purification, water purification and the like due to the photocatalytic action of the dielectric film can be obtained. In particular, when the dielectric film contains TiO ₂ , the above effect can be obtained more reliably.

Therefore, not only can the light having the desired chromaticity characteristics be stably emitted, but the light emitting element according to the present invention can be used as a useful light emitting element that also exhibits the above effects by exposing it to the external environment. Can do.

A light-emitting device according to the present invention is a light-emitting device including a light-emitting element, and the light-emitting element absorbs a part of light emitted from the light-emitting element according to the present invention; A first resin part that contains a phosphor that converts and emits light, and that seals the LED element; and a second resin part that seals the first resin part and does not contain the phosphor And a cover part that seals the second resin part, wherein the cover part is a light-emitting element including a reflective film having a wavelength dependency on reflectance on an outer surface.

In the light-emitting device according to one embodiment of the present invention, the reflective film is preferably a dielectric film having a photocatalytic action.

According to the above configuration, as described above, the light emitting element to be used can stably emit light having desired chromaticity characteristics, and the light emitting element is exposed to the external environment. It can function as a device having effects such as antifouling, antifogging, antibacterial, air purification, and water purification. Therefore, a useful light-emitting device with very high added value can be provided.

The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention. Furthermore, a new technical feature can be formed by combining the technical means disclosed in each embodiment.

The present invention can be suitably used in the field related to a light-emitting element in which a light-emitting element and a phosphor are combined. In addition, the light-emitting device including the light-emitting element can be widely used in various electric devices such as a mobile phone.

DESCRIPTION OF SYMBOLS 1 LED element 2 Phosphor containing resin layer (1st resin part)
3 Resin layer not containing phosphor (second resin part)
4 Reflective film 5 Substrate 6 Mounting surface 7 Reflective frame 30 Mounting member 31 Heat sink 32 Base 33 Plug 40 Sealing cover 100 to 101 Light emitting element 110 to 111 Light emitting device

Claims

A first resin portion that contains the LED element, a phosphor that absorbs part of the light emitted from the LED element, converts the wavelength to emit light, and seals the LED element; and the first resin. A cover part for sealing the part,
The first resin part is sealed by the cover part through a hollow part that is a space between the surface of the first resin part and the inner surface of the cover part,
The light emitting element characterized by the said cover part being equipped with the reflective film which has a wavelength dependence in a reflectance on an outer surface.
2. The light emitting device according to claim 1, wherein the reflective film is a dielectric film having a photocatalytic action.
The light emitting device according to claim 2, wherein the dielectric film contains TiO 2 .
A light emitting device including a light emitting element,
The light-emitting element according to claim 1; or
A first resin portion that contains the LED element, a phosphor that absorbs part of the light emitted from the LED element, converts the wavelength to emit light, and seals the LED element; and the first resin. A second resin part that seals the part and does not contain a phosphor, and a cover part that seals the second resin part,
A light-emitting device, wherein the cover part is a light-emitting element including a reflection film having a wavelength dependency on reflectance on an outer surface.
The light-emitting device according to claim 4, wherein the reflective film is a dielectric film having a photocatalytic action.