WO2014049844A1 - 板状体の研磨方法及び板状体の研磨装置 - Google Patents
板状体の研磨方法及び板状体の研磨装置 Download PDFInfo
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- WO2014049844A1 WO2014049844A1 PCT/JP2012/075136 JP2012075136W WO2014049844A1 WO 2014049844 A1 WO2014049844 A1 WO 2014049844A1 JP 2012075136 W JP2012075136 W JP 2012075136W WO 2014049844 A1 WO2014049844 A1 WO 2014049844A1
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- Prior art keywords
- polishing
- flatness
- plate
- polished
- glass plate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
Definitions
- the present invention relates to a plate-like body polishing method and a plate-like body polishing apparatus.
- a float manufacturing method using a forming method called a float method includes a forming step of supplying molten glass to a surface of a molten metal stored in a float bath to form a strip-shaped glass plate, cutting the strip-shaped glass plate into a rectangular glass plate of a predetermined size, and cutting the rectangular The cutting and chamfering process for grinding the peripheral edge of the shaped glass plate, the polishing process for polishing and removing minute irregularities and undulations on the polished surface of the rectangular glass plate with a polishing apparatus, and the polishing were completed.
- the rectangular glass plate is cleaned, and the flatness of the surface to be polished (the surface height distortion due to minute irregularities and waviness existing on the surface of the surface to be polished, and the ratio of the waviness height to the waviness pitch ( (Waviness height / Waviness pitch) defined) is provided.
- a rectangular glass plate is manufactured into a glass plate having a thickness of 0.2 to 1.5 mm suitable for an FPD glass plate and high flatness.
- Patent Document 1 discloses a batch-type polishing apparatus for an FPD glass plate.
- the polishing apparatus of Patent Document 1 includes a film body including an adsorption sheet that adsorbs and holds a glass plate, and a film frame on which the adsorption sheet is stretched.
- a pressurized fluid is supplied between the film body and the carrier to which the film body is attached, and the surface to be polished of the glass plate adsorbed and held by the adsorption sheet is polished by the pressure of the pressurized fluid. While pressing against (polishing tool), the surface to be polished is polished by relatively rotating (spinning and / or revolving) the glass plate and the polishing pad.
- the inspection step it is inspected whether the flatness of the polished surface of the polished glass plate is within the standard value suitable for the glass plate for FPD.
- This flatness inspection is performed using, for example, a known flatness measuring device disclosed in Patent Document 2.
- the flatness measuring apparatus of Patent Document 2 is directed to a light source that irradiates a glass plate with a pattern having periodic brightness and darkness, a light receiving means that receives a pattern transmitted through or reflected from the glass plate, and a light / dark cycle in the light source pattern.
- Flatness measuring means for calculating the flatness of the surface to be polished of the glass plate based on the shift of the light-dark cycle in the received light image.
- the flatness measuring means uses an averaging means for averaging the brightness of the region in the received light image having a size corresponding to the light / dark cycle in the pattern irradiated on the glass plate, and an average signal output by the averaging means.
- processing means for outputting a signal for specifying the deformation location and deformation amount of the surface shape of the glass plate.
- a pattern having periodic brightness and darkness is irradiated onto a glass plate, a pattern transmitted through the glass plate or a reflected pattern is received, and a shift in the brightness cycle in the received light image (glass plate)
- the light and dark of the area in the received light image having a size corresponding to the light and dark period in the pattern irradiated to the glass plate is averaged, and the glass is based on the averaged signal.
- the flatness of the polished surface of the plate is calculated.
- the actual polishing amount is more than the optimum polishing amount that satisfies the standard value flatness for the following reasons. Polishing was performed with a large amount of polishing. In other words, since the flatness of the polished surface of the glass plate before polishing is not uniform for each glass plate, when the glass plate is polished under the same polishing conditions, the flatness of the polished surfaces of all the glass plates is a standard value. This is because there is a fear that it cannot be contained within.
- the flatness of the polished surfaces of all the glass plates is within the standard value. I try to keep it. In other words, when a glass plate having a low flatness is polished under a polishing condition that realizes an optimum polishing amount for a glass plate having a high flatness, the flatness is outside the standard value because the polishing amount is small. Therefore, by polishing not only glass plates with low flatness but also glass plates with high flatness under the polishing conditions that realize the optimum polishing amount for glass plates with low flatness, the polished surfaces of all glass plates The flatness is kept within the standard value.
- the above polishing method has a problem that a glass plate having a high flatness is polished with an amount of polishing more than necessary, so that the polishing time becomes long and the production efficiency of the glass plate is lowered.
- the present invention has been made in view of such problems, and an object of the present invention is to provide a plate-like polishing method and a plate-like polishing apparatus capable of increasing the production efficiency of the plate-like body.
- the present invention includes a flatness measuring step for measuring the flatness of a surface to be polished of a plate-like body, and a polishing step for polishing the surface to be polished of the plate-like body having a measured flatness.
- a polishing step of relatively pressing and rotating the surface to be polished of the plate-like body and the polishing tool to polish the surface to be polished by the polishing tool, and in the flatness measuring step, Provided is a method for polishing a plate-like body, wherein the polishing conditions in the polishing step are changed based on the measured flatness of the surface to be polished of the plate-like body.
- the present invention comprises a flatness measuring means for measuring the flatness of a surface to be polished of a plate-like body, and a polishing means for polishing the surface to be polished of the plate-like body having a measured flatness.
- a polishing means for pressing the polishing surface of the plate-like body and the polishing tool relative to each other and rotating them relatively to polish the polishing surface with the polishing tool, and the flatness measurement means.
- a plate-like body polishing apparatus comprising: control means for changing polishing conditions by the polishing means based on flatness of a surface to be polished of the plate-like body.
- the present invention is directed to a polishing method and a polishing apparatus in which a surface to be polished of a plate-shaped body and a polishing tool are relatively pressed and relatively rotated to polish the surface to be polished of the plate-shaped body with a polishing tool. That is, the present invention is directed to a batch-type polishing method and polishing apparatus for polishing a single plate-like body as disclosed in Patent Document 1 with a single polishing tool. That is, the polishing method and the polishing apparatus of the present invention are, for example, a continuous polishing method and a polishing apparatus disclosed in Japanese Patent Application Laid-Open No. 2007-190657 and International Publication No. 2011 / 0774616A1, etc.
- a plurality of polishing tools are arranged along the conveying direction of the sheet, and the surface to be polished of the plate is gradually polished by the plurality of polishing tools while continuously conveying the plurality of plates at a constant speed.
- the control means calculates an optimum polishing amount corresponding to the flatness for each plate, calculates an optimum polishing condition corresponding to the optimum polishing amount, and sets the polishing condition in the polishing means. Change to the optimum polishing conditions. Therefore, the surface to be polished of the plate-like body is polished under optimum polishing conditions corresponding to the flatness.
- the optimum polishing amount is not only the polishing amount for keeping the flatness within the standard value, but also the peak value (average value) of the flatness distribution of the polished surface after polishing is the conventional polishing amount.
- the polishing amount is set to be closer to the standard value than the peak value of the flatness distribution by the polishing method.
- the polishing conditions in the present invention are typical polishing conditions when the polishing pressure is constant. Since the present invention is a batch type, the polishing time for a plurality of plate-like bodies having different flatnesses can be changed for each plate-like body (feed forward control). On the other hand, in the continuous polishing apparatus, it is difficult to control the polishing time for each of a plurality of plate-like bodies having different flatnesses. That is, the continuous polishing apparatus is an apparatus that conveys a plate-like body at a constant speed, in other words, an apparatus that maintains a constant polishing time.
- the polishing conditions include not only the polishing time but also other polishing conditions such as the polishing pressure of the polishing tool with respect to the surface to be polished of the plate-like body and the relative rotational speed of the polishing tool and the plate-like body. Is preferably changed for each flatness. This is because it is possible to change only the polishing time while keeping the polishing pressure and the rotation speed constant rather than changing the polishing pressure and the rotation speed for each plate-like body, and to construct a control system. This is because it is easy from the viewpoint.
- the polishing time of at least one of the rough polishing tool and the finishing polishing tool may be controlled. For example, when the measured flatness is significantly different from the standard flatness, the polishing time by the rough polishing tool is changed to be longer. In addition, if the measured flatness is extremely small compared to the standard flatness, the polishing time with the rough polishing tool is changed to an extremely short time, and the polishing time with the finish polishing tool is also changed to a short time. To do. That is, based on the measured flatness, it is preferable to change so that the total polishing time by the rough polishing tool and the finishing polishing tool becomes the shortest polishing time.
- One aspect of the polishing method of the present invention includes a flatness re-measurement step of re-measuring flatness of a surface to be polished of the plate-like body polished in the polishing step, after the polishing step. It is preferable to further change the polishing conditions in the polishing step based on the flatness of the polished surface of the plate-like body measured in the degree re-measurement step.
- One aspect of the polishing apparatus of the present invention includes flatness re-measurement means for re-measuring the flatness of the polished surface of the plate-like body polished by the polishing means, and the control means remeasures the flatness It is preferable to further change the polishing conditions by the polishing means based on the flatness of the surface to be polished of the plate-like body measured by the means.
- the polishing conditions such as the polishing time are further changed (feedback control) based on the flatness of the polished surface measured by the flatness re-measurement means. That is, according to one embodiment of the present invention, the polishing time changed based on the flatness of the surface to be polished before polishing is finely adjusted based on the flatness of the surface to be polished after polishing. A small uniform quality plate can be produced.
- the plate-like body in which the flatness of the polished surface after polishing deviates from the standard value, but the frequency of the plate-like body deviating from the standard value is It is preferable to set an optimum polishing amount so as to be within 0.5% or less, preferably 0.3% or less of the entire lot (population).
- the plate-like body that deviates from the standard value is detected by the flatness re-measuring means, but is preferably re-polished by a polishing means whose polishing time is finely adjusted thereafter. Thereby, a plate-like body deviating from the standard value can be contained within the standard value.
- another polishing means is provided after the flatness re-measurement means, and the plate-like body deviated from the standard value by the other polishing means is re-polished,
- the flatness may fall within the standard value. That is, the polishing time by the another polishing means is set by the control means based on the flatness measured by the flatness re-measurement means.
- the polishing step in the polishing step, a plurality of the polishing tools are arranged, and the plate-like body whose flatness is measured in the flatness measuring step is obtained by the plate-like body supplying means. It is preferable to distribute and supply to one of the plurality of polishing tools.
- a plurality of the polishing tools of the polishing means are arranged, and the plate-like body whose flatness is measured by the flatness measuring means is selected from the plurality of polishing tools. It is preferable to provide a plate-like body supply means that distributes and supplies the powder to one polishing tool.
- the operation rate in the polishing process can be increased, and the production efficiency of the plate-like body can be further increased.
- different polishing times are set for each polishing tool in a plurality of polishing tools, and the polishing tool corresponding to the polishing time is set according to the polishing time based on the flatness measured in the flatness measurement step. You may sort a plate-shaped object.
- the plate-like body polishing method and plate-like body polishing apparatus according to the present invention can increase the production efficiency of the plate-like body.
- FIG. 1 is a perspective view showing a main configuration of a plate-like polishing apparatus according to a first embodiment.
- FIG. 2 is a block diagram showing a configuration of the polishing apparatus shown in FIG.
- FIG. 3 is a flowchart showing a manufacturing process of a glass plate for FPD.
- FIG. 4 is a histogram of the flatness of the surface to be polished before polishing a plurality of glass plates in one lot.
- FIG. 5 is a histogram of the flatness of the polished surface after polishing by the conventional polishing method.
- FIG. 6 is a histogram of the flatness of the polished surface after polishing by the polishing method of the embodiment.
- FIG. 7 is a block diagram showing a configuration of a polishing apparatus according to the second embodiment.
- FIG. 1 is a perspective view showing a configuration of a main part of a plate-like polishing apparatus 10 according to a first embodiment.
- FIG. 2 is a block diagram showing a configuration of the polishing apparatus 10 shown in FIG.
- the polishing apparatus 10 of the embodiment has a basic configuration of a batch type polishing apparatus disclosed in Patent Document 1. 1 and FIG. 2 show only the main configuration, and the other configuration of the apparatus is the same as that of the polishing apparatus disclosed in Patent Document 1, and the description thereof is omitted.
- the polishing apparatus 10 polishes, for example, a glass plate (plate-like body) G having a side of 600 mm or more to a thickness necessary for an FPD glass plate, for example, 0.2 mm to 1.5 mm. This is a polishing apparatus for polishing the surface to be polished to the flatness required for the glass plate for FPD.
- the polishing apparatus 10 cuts a strip glass plate (not shown) conveyed from a slow cooling furnace (not shown) of a float forming apparatus (not shown) into a predetermined rectangular glass plate G (see FIG. 1). Then, a cutting / beveling device 12 for grinding the peripheral portion thereof, a flatness measuring device (flatness measuring means: flatness measuring step) 14 for measuring the flatness of the polished surface of the glass plate G, and the glass whose flatness has been measured.
- Glass plate supply device 18 for supplying plate G to polishing unit (polishing means: polishing step) 16, polishing unit 16 for polishing the polished surface of supplied glass plate G, and glass plate G with the polished surface polished
- a flatness re-measuring device (flatness re-measuring means, flatness re-measuring step) 20 for cleaning and re-measuring the flatness of the polished surface, and a controller (control means) 22 are provided.
- the controller 22 has a function of changing the polishing time (polishing conditions) in the polishing unit 16 based on the flatness of the surface to be polished of the glass plate G measured by the flatness measuring device 14, and is measured by the flatness re-measurement device 20. A function of further changing the polishing time (polishing conditions) by the polishing unit 16 based on the flatness of the polished surface of the glass plate G is provided. Note that the control for changing the polishing time of the polishing unit 16 by the controller 22 is essential based on the flatness of the surface to be polished before the polishing performed by the flatness measuring device 14, but the flatness remeasurement is performed. It is not essential to perform based on the flatness of the surface to be polished after polishing performed by the apparatus 20.
- the controller 22 it is preferable for the controller 22 to control the polishing time based on the flatness of the polished surface after polishing because the polishing amount by the polishing unit 16 can be finely adjusted toward the standard value. Since the flatness measuring device 14 and the flatness re-measuring device 20 are the same device and are known devices disclosed in Patent Document 2, the description thereof is omitted here.
- the polishing unit 16 includes a first polishing unit 24 for rough polishing and a second polishing unit 26 for finish polishing.
- polishing is adsorb
- polishing head 28 of the polishing unit 16 Since the polishing head 28 of the first polishing unit 24 and the polishing head 28 of the second polishing unit 26 have the same structure, the same reference numerals are used for description. .
- the polishing head 28 includes a housing-like carrier 30 and a spindle 32 that is vertically connected to the upper surface of the carrier 30.
- the spindle 32 is connected to an output shaft of a motor (not shown) via a speed reduction mechanism, and the carrier 30 is rotated about the axis C1 of the spindle 32 by transmitting the driving force of the motor.
- a revolving mechanism (not shown) is connected to the spindle 32, and revolves around the vertical axis C2 by the driving force of the revolving mechanism.
- a lifting mechanism (not shown) is connected to the spindle 32, and the spindle 32 is lifted and lowered by the driving force of the lifting mechanism.
- the carrier 30 is moved forward and backward relative to the polishing pad (polishing tool) 34 of the first polishing unit 24 and the polishing pad (polishing tool) 36 of the second polishing unit 26.
- the film frame is attached to the lower surface of the carrier 30. Therefore, when the carrier 30 moves forward, the surface to be polished of the glass plate G whose upper surface is sucked and held is brought into contact with the polishing pads 34 and 36 on the lower surface of the suction sheet of the film frame.
- the polishing pad 34 is attached to the upper surface of the polishing surface plate 38, and a rotating shaft of a motor (not shown) is connected to the lower portion of the polishing surface plate 38.
- the polishing pad 36 is attached to the upper surface of the polishing surface plate 40, and a rotating shaft of a motor (not shown) is connected to the lower portion of the polishing surface plate 40. Therefore, by driving the motor, the polishing surface plates 38 and 40 are rotated (rotated and / or revolved) around the axis of the rotating shaft.
- the lower surface of the carrier 30 is provided with a recess (not shown) for forming an air chamber (not shown) with the suction sheet of the film body, and a fluid supply for supplying compressed air to the recess A device (not shown) is connected to the carrier 30 via a rotary joint (not shown).
- a rotary joint (not shown).
- FIG. 3 is a flowchart showing an example of the manufacturing process of the glass plate G for FPD.
- a molten glass is supplied to the surface of the molten metal in the float bath and formed into a band-shaped glass plate (S1), and the band-shaped glass plate is cut into a glass plate G of a predetermined size by the cutting / chamfering device 12.
- the flatness of the surface to be polished of the glass plate G is measured for each glass plate G by the flatness measuring device 14 (S3).
- the controller 22 calculates an optimal polishing amount corresponding to the flatness for each glass plate G, calculates an optimal polishing time corresponding to the optimal polishing amount (S4), and the polishing unit 16 The polishing time is changed to the optimum polishing time (S5).
- the surface to be polished of the glass plate G is polished with an optimal polishing time corresponding to the flatness (S6).
- the controller 22 controls the polishing time of at least one of the first polishing unit 24 and the second polishing unit 26.
- the polishing time by the first polishing unit 24 is changed to be longer.
- the polishing time by the first polishing unit 24 is changed to an extremely short time and the polishing by the second polishing unit 26 is performed. Change the time to a short time. That is, it is preferable to change the total polishing time by the first polishing unit 24 and the second polishing unit 26 based on the measured flatness so as to be the shortest polishing time.
- the production efficiency of the glass sheet G for FPD is increased as compared with the conventional polishing apparatus in which a longer polishing time is set in anticipation of safety.
- the optimum polishing amount is not only the polishing amount for keeping the flatness within the standard value, but also the peak value (average value) of the flatness distribution of the polished surface after polishing is the conventional polishing amount.
- the polishing amount is set to be closer to the standard value than the peak value of the flatness distribution by the polishing method.
- FIG. 4 shows a histogram of the flatness of the surface to be polished before polishing a plurality of glass plates G of one lot measured by the flatness measuring device 14.
- FIG. 5 shows a histogram of the flatness of the polished surface after polishing by the conventional polishing method
- FIG. 6 shows a histogram of the flatness of the polished surface after polishing by the polishing method of the embodiment.
- the horizontal axis indicates flatness ( ⁇ m)
- the vertical axis indicates frequency (%).
- the standard value of the flatness of the polished surface after polishing is 1.0
- the left side shows the frequency within the standard value around the standard value
- the right side around the standard value is The frequency outside the standard value is shown.
- the polishing time becomes longer toward the left side around the standard value, and that the polishing time becomes shorter toward the right side around the standard value.
- the peak value (0.92) of the flatness distribution of the polished surface after polishing is the peak value (0. 0) of the flatness distribution by the conventional polishing method of FIG.
- the optimum polishing amount is set so as to be closer to the standard value than 56).
- the conventional polishing method can improve the flatness to 0.46 to 1.10.
- the conventional polishing method is a method of polishing with a constant polishing time regardless of the level of flatness, the flatness of the polished surface after polishing is as wide as the histogram before polishing shown in FIG. Distributed in range.
- the polishing method of the embodiment calculates the polishing amount and polishing time close to the standard values based on the flatness of the surface to be polished for each glass plate G, and the glass plate G is determined by the polishing time.
- the peak value (0.92) of the flatness distribution of the polished surface as shown in FIG. 6 is close to the standard value (1.0) and distributed in a narrow range. Therefore, according to the polishing method of the embodiment, a uniform quality glass plate G with a small variation in flatness can be manufactured, and the polishing time can be shortened as compared with the conventional polishing method when viewed in units of one lot.
- the polishing time is shortened.
- the flatness of the polished surface of the glass plate before polishing varies.
- the flatness should be kept within the standard value and the flatness should be within the standard value. That is, a glass plate with good flatness is set to be within the limit of the standard value with a small amount of polishing, and a glass plate with poor flatness is set to be within the limit of the standard value with a large amount of polishing. As a result of keeping the flatness of the polished surfaces of all the glass plates within the standard value, variation in flatness is reduced (see FIG. 6).
- the performance of the FPD can be stabilized if the variation in flatness is reduced.
- the FPD is manufactured under a constant manufacturing condition using a glass plate having a small flatness variation, that is, having a certain surface property, the performance of the manufactured FPD is also stabilized.
- polishing time can be shortened compared with the conventional polishing method, and the productivity can be improved.
- the controller 22 in FIG. 2 further changes the polishing time of the polishing unit 16 based on the flatness of the polished surface measured by the flatness re-measurement device 20. (Feedback control). That is, since the polishing time (agreement with the polishing amount) changed based on the flatness of the surface to be polished before polishing by the flatness measuring device 14 is finely adjusted based on the flatness of the surface to be polished after polishing, A uniform quality glass plate G with even smaller variations in flatness can be produced.
- the flatness after polishing of the glass plate G having a certain pre-polishing flatness is slightly different from the standard value
- the flatness is the standard value.
- the another glass plate is polished with a polishing time finely adjusted so that
- a glass plate G whose flatness deviates from the standard value is generated, but the frequency of the glass plate G deviating from the standard value is 0. 0 of the entire lot (population). It is preferable to set an optimum polishing amount so as to be 5% or less, preferably 0.3% or less. In addition, it is possible to effectively shorten the polishing time by setting the polishing time so that the peak value of the flatness distribution is within the range of ⁇ 0.15 to ⁇ 0.05 with respect to the standard value. preferable.
- the glass plate G whose flatness is out of the standard value is detected by the flatness re-measurement device 20, but is preferably then re-polished by the second polishing section 26 whose polishing time is finely adjusted. Thereby, the glass plate G in which the flatness deviates from the standard value can be contained within the standard value.
- the controller 22 sets the polishing time by the another polishing unit based on the flatness measured by the flatness re-measurement device 20.
- FIG. 7 is a block diagram showing the configuration of the polishing apparatus 50 according to the second embodiment.
- the polishing apparatus 50 includes a plurality of (six in FIG. 7) polishing units 52, a polishing unit 54, a polishing unit 56, a polishing unit 58, a polishing unit 60, and a polishing unit 62 in the polishing unit 16. Further, a distribution supply device (plate-shaped body supply means) 64 is installed between the polishing unit 16 and the measurement stage of the flatness measurement device 14. Further, between the polishing unit 16 and the measurement stage of the flatness re-measurement device 20, a transport unit that transports the glass plate G polished by each of the polishing units 52 to 62 to the measurement stage of the flatness re-measurement device 20. 66.
- the polishing apparatus 50 uses the sorting and supplying apparatus 64 to convert the glass plate G whose flatness is measured by the flatness measuring apparatus 14 into one of the six polishing sections 52 to 62, or to polish the glass plate G. It distributes and supplies to one grinding
- the polishing time of the polishing units 52 to 62 is controlled by the controller 22 based on the flatness measured by the flatness measuring device 14. According to the polishing apparatus 50, the operation rate in the polishing unit 16 can be increased, and the production efficiency of the glass sheet G can be further increased.
- the controller 22 simply controls only the polishing time of the polishing units 52 to 62, there may be a plurality of glass plates G that have been polished by the polishing units 52 to 62 at the same time.
- the transport unit 66 transports the polished glass plates G one by one to the measurement stage of the flatness re-measurement device 20, the polishing units 52 to 62 must wait for the polished glass plates G.
- the operating rate of the polishing unit 16 is lowered. Therefore, in the polishing apparatus 50 including a plurality of polishing units 52 to 62, it is necessary to polish so that a plurality of glass plates G that have been polished do not exist at the same time. An example of the polishing method will be described.
- the polishing conditions for keeping the flatness of the polished surface of the glass plate G within the standard value include the polishing pressure of the polishing pad with respect to the polished surface of the glass plate G, the relative relationship between the polishing pad and the glass plate G, in addition to the polishing time.
- the controller 22 determines the polishing pressure, the polishing pressure, so that the polishing end time in the polishing units 52 to 62 is not the same time based on the flatness of the polished surface of each glass plate G measured by the flatness measuring device 14.
- the number of rotations is controlled for each of the polishing units 52 to 62.
- the controller 22 controls the transport unit 66 so that one of the polishing units 52 to 62 that has finished polishing waits for the transport unit 66 in advance.
- a different polishing time is set for each of the polishing units 52 to 62, and the polishing time corresponding to the polishing time based on the flatness measured by the flatness measuring device 14 is handled.
- the glass plate G may be distributed to the polishing parts 52 to 62 to be performed.
- polishing unit 16 including the first polishing unit 24 and the second polishing unit 26 is illustrated, but the polishing unit is composed of one or three or more polishing units. 16 may be used.
- the glass plate for FPD is exemplified as the plate-like body to be polished.
- the present invention is not limited to this, and any glass plate that requires surface polishing may be used. Instead, it may be a metal or resin plate that requires surface polishing.
- G Glass plate, 10 ... Polishing device, 12 ... Cutting and chamfering device, 14 ... Flatness measuring device, 16 ... Polishing unit, 18 ... Glass plate supply device, 20 ... Flatness re-measuring device, 22 ... Controller, 24 ... First polishing section, 26 ... second polishing section, 28 ... polishing head, 30 ... carrier, 32 ... spindle, 34 ... polishing pad, 36 ... polishing pad, 38 ... polishing surface plate, 40 ... polishing surface plate, 50 ... Polishing device, 52, 54, 56, 58, 60, 62 ... Polishing unit, 64 ... Sorting and feeding device, 66 ... Conveying unit
Abstract
Description
つまり、研磨前のガラス板は、ガラス板毎に被研磨面の平坦度が一様でないため、同じ研磨条件でガラス板を研磨した場合、全てのガラス板の被研磨面の平坦度を規格値内に収めることができない恐れがあるからである。そのため、想定される研磨量よりも実際の研磨量を多めに設定して、ガラス板毎に平坦度が一様でなくても、全てのガラス板の被研磨面の平坦度を規格値内に収めるようにしている。
換言すれば、平坦度が高いガラス板に最適な研磨量を実現する研磨条件で、平坦度が低いガラス板を研磨した場合、研磨量が少ないため、平坦度は規格値外となる。したがって、平坦度が低いガラス板に最適な研磨量を実現する研磨条件で、平坦度が低いガラス板だけではなく、平坦度が高いガラス板も研磨することで、全てのガラス板の被研磨面の平坦度を規格値内に収めるようにしている。
しかし、上記研磨方法は、平坦度が高いガラス板を必要以上の研磨量で研磨するため、研磨時間が長くなり、ガラス板の生産効率が低くなるという問題があった。
ここで、実施の形態の研磨装置10の研磨方法と従来の研磨装置の研磨方法とを比較する。
つまり、ある研磨前平坦度を有するガラス板Gの研磨後の平坦度が規格値から僅かに外れた場合、同じ研磨前平坦度を有する別のガラス板を研磨するときは、平坦度が規格値になるように微調整された研磨時間で前記別のガラス板を研磨する。
研磨装置50によれば、研磨部16における稼働率を高めることができ、ガラス板Gの生産効率を更に高めることができる。
そこで、複数台の研磨部52~62を備えた研磨装置50では、研磨終了したガラス板Gが同時刻に複数枚存在しないように研磨する必要がある。
その研磨方法の一例を説明する。
この研磨方法によって、研磨終了したガラス板Gを研磨部52~62で待機させるという問題を解消でき、研磨部16の稼働率が向上する。
Claims (6)
- 板状体の被研磨面の平坦度を測定する平坦度測定工程と、
平坦度が測定された前記板状体の被研磨面を研磨する研磨工程であって、前記板状体の被研磨面と研磨具とを相対的に押し付けるとともに相対的に回転させて、前記研磨具によって前記板状体の被研磨面を研磨する研磨工程と、
を備え、
前記平坦度測定工程において測定された前記板状体の被研磨面の平坦度に基づいて前記研磨工程による研磨条件を変更する板状体の研磨方法。 - 前記研磨工程の後工程に、前記研磨工程で研磨された前記板状体の被研磨面の平坦度を再測定する平坦度再測定工程を備え、
前記平坦度再測定工程において測定された前記板状体の被研磨面の平坦度に基づいて前記研磨工程による研磨条件を更に変更する請求項1に記載の板状体の研磨方法。 - 前記研磨工程において、前記研磨具を複数台配置し、
前記平坦度測定工程において平坦度が測定された前記板状体を、板状体供給手段によって、前記複数台の研磨具のうちの1台の研磨具に振り分けして供給する請求項1又は2に記載の板状体の研磨方法。 - 板状体の被研磨面の平坦度を測定する平坦度測定手段と、
平坦度が測定された前記板状体の被研磨面を研磨する研磨手段であって、前記板状体の被研磨面と研磨具とを相対的に押し付けるとともに相対的に回転させて、前記研磨具によって前記板状体の被研磨面を研磨する研磨手段と、
前記平坦度測定手段によって測定された前記板状体の被研磨面の平坦度に基づいて前記研磨手段による研磨条件を変更する制御手段と、
を備えた板状体の研磨装置。 - 前記研磨手段によって研磨された前記板状体の被研磨面の平坦度を再測定する平坦度再測定手段を備え、
前記制御手段は、前記平坦度再測定手段によって測定された前記板状体の被研磨面の平坦度に基づいて前記研磨手段による研磨条件を更に変更する請求項4に記載の板状体の研磨装置。 - 前記研磨手段の前記研磨具は複数台配置され、
前記平坦度測定手段によって平坦度が測定された前記板状体を、前記複数台の研磨具のうちの1台の研磨具に振り分けして供給する板状体供給手段を備える請求項4又は5に記載の板状体の研磨装置。
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006011434A (ja) * | 2002-03-29 | 2006-01-12 | Hoya Corp | マスクブランク用基板、マスクブランクおよび転写用マスクの製造方法 |
JP2006119624A (ja) * | 2004-09-22 | 2006-05-11 | Hoya Corp | マスクブランクス用基板,マスクブランクス,露光用マスク及び半導体装置,並びにそれらの製造方法 |
JP2008142802A (ja) * | 2006-12-06 | 2008-06-26 | Ohara Inc | 基板の製造方法および基板 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1039988A (zh) * | 1988-07-29 | 1990-02-28 | 谭景春 | 高精度平面度平板的制造 |
JP3074376B2 (ja) * | 1997-02-27 | 2000-08-07 | セイコーインスツルメンツ株式会社 | 端面研磨装置 |
JP3411829B2 (ja) | 1997-07-02 | 2003-06-03 | 旭硝子株式会社 | 表面形状の評価方法および評価装置 |
US6451700B1 (en) * | 2001-04-25 | 2002-09-17 | Advanced Micro Devices, Inc. | Method and apparatus for measuring planarity of a polished layer |
DE10314212B4 (de) * | 2002-03-29 | 2010-06-02 | Hoya Corp. | Verfahren zur Herstellung eines Maskenrohlings, Verfahren zur Herstellung einer Transfermaske |
JP4207153B2 (ja) * | 2002-07-31 | 2009-01-14 | 旭硝子株式会社 | 基板の研磨方法及びその装置 |
JP2004358638A (ja) * | 2003-06-06 | 2004-12-24 | Sumitomo Mitsubishi Silicon Corp | 半導体ウェーハの研磨方法および半導体ウェーハの研磨装置 |
CN1740106A (zh) * | 2004-08-27 | 2006-03-01 | 上海申菲激光光学系统有限公司 | 高精度超薄基片的制备方法 |
CN101456668A (zh) * | 2008-12-30 | 2009-06-17 | 上海申菲激光光学系统有限公司 | 高精度超薄玻璃基片制备工艺 |
JP5526895B2 (ja) * | 2009-04-01 | 2014-06-18 | 信越化学工業株式会社 | 大型合成石英ガラス基板の製造方法 |
-
2012
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006011434A (ja) * | 2002-03-29 | 2006-01-12 | Hoya Corp | マスクブランク用基板、マスクブランクおよび転写用マスクの製造方法 |
JP2006119624A (ja) * | 2004-09-22 | 2006-05-11 | Hoya Corp | マスクブランクス用基板,マスクブランクス,露光用マスク及び半導体装置,並びにそれらの製造方法 |
JP2008142802A (ja) * | 2006-12-06 | 2008-06-26 | Ohara Inc | 基板の製造方法および基板 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017161807A (ja) * | 2016-03-11 | 2017-09-14 | Hoya株式会社 | 基板の製造方法、マスクブランクの製造方法、および転写用マスクの製造方法 |
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