WO2014045850A1 - Lentille pour communication optique et module de communication optique - Google Patents

Lentille pour communication optique et module de communication optique Download PDF

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Publication number
WO2014045850A1
WO2014045850A1 PCT/JP2013/073494 JP2013073494W WO2014045850A1 WO 2014045850 A1 WO2014045850 A1 WO 2014045850A1 JP 2013073494 W JP2013073494 W JP 2013073494W WO 2014045850 A1 WO2014045850 A1 WO 2014045850A1
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WO
WIPO (PCT)
Prior art keywords
lens
optical communication
leg
optical
inner peripheral
Prior art date
Application number
PCT/JP2013/073494
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English (en)
Japanese (ja)
Inventor
義治 正木
雄三 中塚
Original Assignee
コニカミノルタ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by コニカミノルタ株式会社 filed Critical コニカミノルタ株式会社
Priority to JP2014536726A priority Critical patent/JPWO2014045850A1/ja
Priority to CN201380048386.7A priority patent/CN104662462A/zh
Publication of WO2014045850A1 publication Critical patent/WO2014045850A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/023—Mountings, adjusting means, or light-tight connections, for optical elements for lenses permitting adjustment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses

Definitions

  • the present invention relates to a lens for optical communication and an optical communication module which are used for optical communication or the like and couple light from an optical element such as a semiconductor laser to an optical fiber or a light receiving element.
  • a lens for optical coupling is used for efficient optical coupling between a semiconductor laser or light receiving element and an optical fiber.
  • the structure which mainly supports a glass lens with a stainless steel leg part is widely used.
  • a glass lens having an aspheric surface is generally expensive, and there is a problem that a significant cost is incurred due to a process of assembling with a leg portion made of different materials. Therefore, as shown in Patent Document 1, a plastic leg-integrated lens has been developed that enables easy molding of a highly accurate aspherical surface and enables mass production.
  • Patent Document 1 a cylindrical portion for mounting an optical transmission line, a cylindrical portion for mounting a photoelectric element, and a wall portion connecting them are integrally formed, and the lens faces the photoelectric element. It is integrally formed on the wall so as to have a convex surface.
  • a recess is formed so as to surround the lens. Since this recessed part functions as a thinning part, it can reduce that a thin part is pulled by the thick part by shaping
  • JP 2007-183565 A Japanese Patent Application Laid-Open No. 08-286016
  • the cylindrical portion for mounting the optical transmission path, the cylindrical portion for mounting the photoelectric element, and the lens are integrally formed.
  • the lens may be provided on one cylindrical portion.
  • the leg-integrated lens as shown in Patent Document 1 inherently has a light emitting element and a light receiving element disposed therein, it has a cylindrical part (hereinafter referred to as a leg part) having a relatively long length with respect to the diameter. ing.
  • a leg part cylindrical part having a relatively long length with respect to the diameter.
  • the legs are relatively long, the releasability at the time of molding is deteriorated, and there is a risk of causing breakage or deformation at the time of release.
  • the thickness of the leg portion is increased, the interference with the light emitting element and the light receiving element disposed inside, the adjustment margin in the direction perpendicular to the optical axis is reduced, the internal parts due to the protrusion of the adhesive applied to the end face of the leg portion, etc. It is easy to invite contamination. Furthermore, if the base of the leg portion is made thicker due to the draft, the influence of shrinkage during molding tends to affect the lens portion and deteriorate optical performance. On the other hand, if the thickness of the leg is increased or the base of the leg is thickened while the inner diameter of the leg is fixed, the outer diameter of the leg is increased accordingly and interferes with surrounding parts. There is a fear. On the other hand, it is possible to reduce the outer diameter of the leg by making the draft angle by making the tip end side thinner without changing the thickness of the base of the leg. There is a concern that the coating area is reduced and the adhesive strength is lowered.
  • FIG. 9 of Patent Document 2 discloses a leg-integrated lens in which the leg is tapered so that the mold can be easily removed after molding.
  • FIG. 9 of Patent Document 2 is for explaining a problem to be solved in which the laser light reflected from the inner surface becomes stray light noise. Therefore, in Patent Document 2, the leg portion is parallel to the optical axis. It has been proposed to do so. That is, Patent Document 2 does not disclose or suggest a technique capable of effectively suppressing stray light noise while maintaining the tapered shape of the leg.
  • the present invention has been made in view of such problems, and is capable of reducing the size and improving the formability and assembling performance while enabling high-accuracy optical communication. As a result, the cost can be greatly reduced.
  • An object is to provide a communication lens and an optical communication module using the same.
  • the lens for optical communication according to claim 1 is a lens for optical communication that collects a light beam emitted from an optical element or an optical fiber, It is made of a plastic material, and is formed by integrally forming a cylindrical leg portion and a lens portion connected to the leg portion, and the inner peripheral surface of the leg portion is relative to the optical axis of the lens portion.
  • the tapered surface is formed so as to spread from the lens portion toward the lens end surface on the leg portion side, and is a non-mirror surface.
  • the inner peripheral surface of the leg portion is a tapered surface inclined with respect to the optical axis of the lens portion, and the tapered surface extends from the lens portion to the lens end surface on the leg portion side. Since it is formed so as to spread out, it can improve the releasability at the time of molding, and avoids interference with components such as light emitting elements and light receiving elements provided inside the legs, orthogonal to the optical axis Since it is possible to secure a margin for adjusting the alignment by displacement in the direction, it is possible to realize highly accurate optical coupling.
  • the taper angle of the taper surface is increased, the releasability is further improved, but interference with surrounding parts due to an increase in the outer diameter of the lens, or a decrease in strength or adhesion due to a thinner leg portion, etc. There is a risk of inviting. Therefore, in the present invention, the taper angle of the tapered surface is suppressed, and the strength, size reduction, and adhesion of the leg portion are secured, and instead, the inner peripheral surface of the leg portion is made non-mirror surface. In the molding process, the adhesion area between the mold and the plastic material is reduced to improve the mold release. In addition, since the lens part and the leg part are integrally molded and the lens is for optical communication, the optical element is located close to the leg part.
  • non-mirror surface refers to a surface that is not a mirror surface.
  • the mirror surface means a surface having a ten-point average roughness Rz of 0.8 ⁇ m or less in accordance with JIS 0601-1976 (standard for surface roughness).
  • the “optical element” includes both a light emitting element and a light receiving element. If the roughness is less than 0.8 ⁇ m, the stray light noise cannot be suitably suppressed, and the releasability when the lens of the present invention is released from the mold is deteriorated.
  • the taper angle of the inner peripheral surface with respect to the optical axis of the lens portion is 2 ° or more and 40 ° or less.
  • the taper angle is preferably 3 ° or more and 10 ° or less.
  • the optical communication lens according to claim 3 is the invention according to claim 1 or 2, wherein the inner peripheral surface of the leg portion has a ten-point average roughness Rz of 1.0 ⁇ m or more and 50 ⁇ m or less. It is characterized by.
  • the inner peripheral surface of the leg portion When the ten-point average roughness Rz of the inner peripheral surface of the leg portion is 1.0 ⁇ m or more, releasability can be secured and stray light noise of reflected light can be suppressed. On the other hand, when the ten-point average roughness Rz of the inner peripheral surface of the leg portion is 50 ⁇ m or less, it is possible to suppress deterioration in releasability due to the unevenness of the inner peripheral surface being caught on the surface of the mold. More preferably, the inner peripheral surface has a ten-point average roughness Rz of 5.0 ⁇ m or more and 40 ⁇ m or less.
  • the lens for optical communication according to claim 4 is characterized in that, in the invention according to any one of claims 1 to 3, the length of the leg portion is not less than 1 mm and not more than 4 mm.
  • the leg portion is 4 mm or less due to problems such as consistency in replacing existing glass lenses with the lenses of the present invention. It is desirable.
  • the lens for optical communication according to claim 5 is a ratio (L / D) between the length L of the leg portion and the outer diameter D of the lens in the invention according to any one of claims 1 to 4. Is 0.2 or more and 2 or less.
  • the length L of the leg means the distance in the optical axis direction from the farthest from the mounting reference surface to the mounting reference surface, excluding the optical surface, of the lens inner surface.
  • the optical communication lens according to claim 6 is the optical communication lens according to any one of claims 1 to 4, wherein the optical element is an LED (Light Emitting Diode), an LD (Laser Diode), a VCSEL (Vertical Cabinty Surface). It is characterized by being Emitting Laser) and PD (Photo Diode).
  • the optical element is an LED (Light Emitting Diode), an LD (Laser Diode), a VCSEL (Vertical Cabinty Surface). It is characterized by being Emitting Laser) and PD (Photo Diode).
  • An optical communication module is characterized in that the optical communication lens according to any one of claims 1 to 6 is assembled to a substrate that supports an optical element.
  • a lens for optical communication and an optical communication module using the same that can achieve downsizing and improve moldability and assemblability while enabling high-accuracy optical communication, resulting in significant cost reduction. Can be provided.
  • FIG. 1 is a cross-sectional view in the optical axis direction of an optical communication module 10 according to the present embodiment. It is a figure which shows the manufacturing process (a)-(c) of the lens of this embodiment. It is sectional drawing of lens 20 'concerning a comparative example. It is sectional drawing of the lens 20 concerning an Example.
  • FIG. 1 is a cross-sectional view in the optical axis direction of an optical communication module 10 according to the present embodiment.
  • a chip mounting portion 13 is attached to the center of a disk-shaped stem 12 having rod-shaped terminals 11 for feeding power, and a laser chip 15 as a light emitting element is attached to a side surface of the chip mounting portion 13 via a heat sink 14. Yes.
  • the laser chip 15 is connected to the terminal 11 via a wiring (not shown).
  • an LED Light Emitting Diode
  • LD Laser Diode
  • VCSEL Very Cavity Surface Emitting Laser
  • the wavelength used is generally about 1310 ⁇ 15 nm or 1550 ⁇ 15 nm for the single mode, and about 850 ⁇ 15 nm for the multimode.
  • PD Photo Diode
  • the lens 20 is arranged so as to cover the outside of the laser chip 15.
  • the lens 20 is made of plastic, and is integrally formed from a substantially cylindrical leg portion 21 and a lens portion 22 provided at an end portion of the leg portion 21.
  • the lens 20 is attached to the stem (substrate that supports the optical element) 12 by bonding the tip 21b of the leg 21 to the stem 12.
  • the tip 21b of the leg 21 is an attachment reference plane.
  • the stem 12 is usually formed of a ceramic material having a uniform thickness and has a disk shape when viewed from the optical axis direction. It may be polygonal or elliptical. Further, the size of the stem 12 is sufficiently larger than the outer diameter of the holder 30 when viewed from the optical axis direction. In addition, the surface of the stem 12 is plated with gold.
  • the inner peripheral surface 21a of the leg portion 21 is a tapered surface formed so as to spread from the lens portion 22 toward the lens end surface on the leg portion 21 side, and is a rough surface.
  • the taper angle ⁇ with respect to the optical axis of the taper surface is 2 ° or more and 40 °, and is 5 ° here.
  • the ten-point average roughness Rz of the roughened surface is 1.0 ⁇ m or more and 50 ⁇ m or less, and here is 8 ⁇ m.
  • the leg portion 21 and the stem 12 may be joined by welding or the like, but are usually joined by an adhesive.
  • Adhesives include thermosetting adhesives, hot melt adhesives, UV curable adhesives, anaerobic pressure sensitive adhesives, epoxy adhesives, etc., but UV curing has little effect on the lens during bonding. It is preferable to use an adhesive or an epoxy-based adhesive, and it is desirable to use a highly thixotropic adhesive that has a sufficient adhesive force between the metal and resin systems and does not spread liquid. Since the lens 20 having the leg 21 is made of resin and the substrate 12 is usually gold-plated, the bottom surface of the leg 21 is attached by an adhesive without being welded.
  • the total length H in the optical axis direction of the lens 20 according to the embodiment is 3.5 mm, the outer diameter D thereof is 4.7 mm, and the length L of the leg portion 21 in the optical axis direction is 2 mm.
  • the lens can be molded by ordinary injection molding.
  • the resin used for the lens for optical communication is not particularly limited as long as it has a good infrared transmittance.
  • the shape of the lens 20 when viewed from the optical axis direction is preferably a circular shape, but may be a polygonal shape such as a quadrangle or an elliptical shape.
  • the outer size of the lens for optical communication is generally 2 to 6 mm, and the total length in the optical axis direction is 3 to 7 mm.
  • the optical axis in this specification refers to the thickest part or the thinnest part of the lens part 22 or a straight line passing through the center of the lens part 22.
  • the substantially optical axis direction includes the optical axis direction itself.
  • it indicates a direction in which the inclination from the optical axis is 2 degrees or less.
  • a cylindrical stainless steel holder 30 is attached to the outside of the lens 20 in the direction orthogonal to the optical axis so as to be welded to the stem 12 with a gap.
  • a cylindrical sleeve 31 having a smaller diameter is fixed to the tip of the holder 30, and a ferrule 32 into which the optical fiber FB is inserted is inserted therein.
  • the end of the optical fiber FB faces the lens unit 22. ing.
  • the distance between the inner circumference of the holder 30 and the outer circumference of the lens 20 in the optical axis circumferential direction is preferably between 0.002 mm and 0.020 mm. When it is 0.002 mm or more, the holder 30 can be smoothly inserted into the lens 20, and when it is 0.020 mm or less, the holder 30 and the lens 20 can be substantially fitted.
  • the optical communication module 10 of this embodiment When power is supplied through the terminal 11, the laser chip 15 emits light, and the emitted light beam passes through the lens unit 22, is refracted by the refracting surface, and is condensed on the end surface of the optical fiber 32. Will be propagated. Incidentally, the light emitted from the laser chip 15 and incident on the inner peripheral surface 21a of the leg 21 is diffused by the roughened surface, so that it is suppressed from returning to the laser chip 15 and stray light entering the optical fiber FB. , Stray light noise can be suppressed.
  • FIG. 2 is a diagram showing a manufacturing process of the lens of this embodiment.
  • a leg transfer surface Ma is formed from a mold material M by electric discharge machining. More specifically, electric discharge machining is performed on the material M of the mold using the electrode ET having a shape similar to the leg transfer surface Ma after the machining.
  • the corresponding portion of the leg transfer surface Ma can be roughened by forming minute irregularities on the surface of the electrode ET corresponding to the inner peripheral surface 21a of the leg 21. The roughness of the roughened surface can be adjusted by the speed and voltage of the electrode ET.
  • the optical surface transfer surface Mb corresponding to the lens portion 22 is formed by cutting.
  • the mold M1 thus formed and the flat mold M2 are clamped and melted into an internal cavity through a gate (not shown). , PC, etc.). Further, as shown in FIG. 2C, the lens 20 is released after the material is cooled. At this time, since the inner peripheral surface 21a of the leg portion 21 is a tapered surface inclined with respect to the optical axis of the lens portion 22, the releasability at the time of molding can be improved. Moreover, since the corresponding part of the leg transfer surface Ma is an appropriately roughened surface, the mold release property is further improved.
  • the inner peripheral surface 21 a of the leg portion 21 is a tapered surface inclined with respect to the optical axis of the lens portion 22. Interference with the chip mounting portion 13 provided inside 21 can be suppressed. Further, when the lens 20 is bonded to the stem 12, when the centering is performed by performing displacement in the direction perpendicular to the optical axis, interference with the chip mounting portion 13 or the like is prevented even if the adjustment margin is relatively large. Since it can suppress, highly accurate optical coupling is realizable.
  • FIG. 3 is a cross-sectional view of the lens 20 ′ according to the comparative example
  • FIG. 4 is a cross-sectional view of the lens 20 according to the example.
  • a comparative example and an Example differ only in the structure of a leg part.
  • the inner peripheral surface of the leg portion 21 ′ extending in the optical axis direction from the lens portion 22 is parallel to the optical axis.
  • the holding pressure was increased to 1.5 times the basic condition, there was only an effect that the frequency at which the legs were cut slightly decreased.
  • the mold is composed of a lens part that slides back and forth in the optical axis direction and a leg part that is a separate part, and the leg part is released by protruding the mold that constitutes the lens part. .
  • the cycle time was twice as long as the basic conditions. As a result, the fact that only the leg portion 21 ′ remains in the mold has been greatly reduced, but it has not been completely eliminated. Therefore, it has been found that there is a problem that the optical performance of the molded product deteriorates or continuous molding cannot be performed.
  • the leg 21 could be released without being caught when the molded product was taken out by molding under the basic conditions without changing the molding conditions such as extending the cycle time. Further, only the leg portion 21 was cut and it did not remain in the mold, and stable continuous molding was possible.
  • the inner peripheral surface 21a of the leg portion 21 is formed by forming the corresponding mold part by electric discharge machining, and the molding surface is rough and cloudy (the ten-point average roughness Rz is about 8 ⁇ m). .
  • the lens 20 of the example has a larger opening diameter at the tip of the leg than the lens of the comparative example, when the lens 20 was actually attached to the stem provided with the light emitting element / light receiving element, it was applied to the attachment reference surface. Even if the adhesive protrudes to the inside, it does not touch the element or the wiring, so there is no adverse effect due to the adhesive.
  • the lens of the present invention may be used to collect the light emitted from the optical fiber on the light receiving element, and the tapered surface has a stepped portion or R within the scope of the purpose of the present invention. May be.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
  • Lens Barrels (AREA)

Abstract

L'invention se rapporte à une lentille pour communication optique ainsi qu'à un module de communication optique qui utilise cette lentille, ladite lentille présentant une taille réduite et une plus grande aptitude au moulage et à l'assemblage, et permettant ainsi une importante réduction des coûts et une communication optique de haute précision. Puisque la surface périphérique intérieure (21a) d'une partie embranchement (21) est une surface conique inclinée par rapport à l'axe optique d'une partie lentille (22), l'aptitude au démoulage lors du moulage peut être améliorée, l'interférence avec un élément électroluminescent et avec un élément de réception de lumière qui se trouvent dans la partie embranchement peut en outre être évitée, et une tolérance d'ajustement pour l'alignement grâce à un déplacement dans une direction perpendiculaire à l'axe optique peut être garantie, ce qui permet d'obtenir un couplage optique de haute précision. De plus, puisque la partie embranchement est solide et de taille réduite grâce à l'angle de conicité peu important de la surface conique, et sinon, puisque la surface périphérique intérieure (21a) de la partie embranchement (21) est une surface non spéculaire, la zone de contact étroit entre un moule et une matière plastique est limitée au moment du moulage afin d'accroître l'aptitude au démoulage. En outre, puisque la surface périphérique intérieure (21a) de ladite partie embranchement (21) est une surface non spéculaire, l'apparition, en raison de la réflexion interne, d'un bruit dû à une lumière parasite peut être supprimée de manière efficace.
PCT/JP2013/073494 2012-09-19 2013-09-02 Lentille pour communication optique et module de communication optique WO2014045850A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014536726A JPWO2014045850A1 (ja) 2012-09-19 2013-09-02 光通信用のレンズ及び光通信モジュール
CN201380048386.7A CN104662462A (zh) 2012-09-19 2013-09-02 光通信用透镜及光通信模块

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JP2012205417 2012-09-19
JP2012-205417 2012-09-19

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