WO2014038263A1 - アルミニウムめっき装置及びこれを用いたアルミニウム膜の製造方法 - Google Patents
アルミニウムめっき装置及びこれを用いたアルミニウム膜の製造方法 Download PDFInfo
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- WO2014038263A1 WO2014038263A1 PCT/JP2013/066294 JP2013066294W WO2014038263A1 WO 2014038263 A1 WO2014038263 A1 WO 2014038263A1 JP 2013066294 W JP2013066294 W JP 2013066294W WO 2014038263 A1 WO2014038263 A1 WO 2014038263A1
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/42—Electroplating: Baths therefor from solutions of light metals
- C25D3/44—Aluminium
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/66—Electroplating: Baths therefor from melts
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/66—Electroplating: Baths therefor from melts
- C25D3/665—Electroplating: Baths therefor from melts from ionic liquids
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/003—Electroplating using gases, e.g. pressure influence
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
- C25D5/44—Aluminium
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0621—In horizontal cells
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0642—Anodes
Definitions
- the present invention relates to an aluminum plating apparatus for electroplating aluminum on the surface of a substrate and an aluminum film manufacturing method using the same.
- Aluminum is passivated by forming a dense oxide film on its surface and exhibits excellent corrosion resistance. For this reason, the surface of a steel strip or the like is subjected to aluminum plating to improve the corrosion resistance.
- the steel strip is continuously fed into the plating tank through the conductor roll, and travels in the anode immersed in the plating solution in the plating tank. At this time, since the steel strip itself is electrically connected so as to act as a cathode, electrolysis occurs between the anode and the steel strip that is the cathode, and aluminum is electrodeposited on the surface of the steel strip. A plating is formed.
- Patent Document 1 Japanese Patent Laid-Open No. 05-222599 (Patent Document 1)).
- a porous body made of aluminum as a metal porous body having a three-dimensional network structure is promising as improving the capacity of the positive electrode of a lithium ion battery.
- a material obtained by applying an active material such as lithium cobaltate to the surface of an aluminum foil by taking advantage of the excellent characteristics of aluminum such as conductivity, corrosion resistance and light weight is used as a positive electrode of a lithium ion battery.
- Patent Document 2 Japanese Patent Laid-Open No. 2012-007233 (Patent Document 2). ) Since the conventional aluminum molten salt bath needs to have a high temperature, there has been a problem that when the aluminum is electroplated on the surface of the resin molded body, the resin cannot withstand the high temperature and dissolves. However, according to the method described in Patent Document 2, organic chloride salts such as 1-ethyl-3-methylimidazolium chloride (EMIC) and 1-butylpyridinium chloride (BPC) and aluminum chloride (AlCl 3 ) are used. By mixing, a liquid aluminum bath is formed at room temperature, and electroplating of aluminum onto the resin molded body becomes possible. In particular, the EMIC-AlCl 3 system has good liquid properties and is useful as an aluminum plating solution.
- EMIC 1-ethyl-3-methylimidazolium chloride
- BPC 1-butylpyridinium chloride
- AlCl 3 aluminum chloride
- the present invention provides an aluminum plating apparatus that can satisfactorily form aluminum plating on the surface of a substrate on which a metal oxide film or the like having low insulation or conductivity is formed. Is an issue.
- the present inventors have found that it is effective to plate aluminum after electrolytically removing the metal surface on which the oxide film is formed in the plating tank, The present invention has been completed. That is, the present invention has the following configuration.
- An aluminum plating apparatus for transporting a substrate into a plating tank and electrodepositing aluminum on the substrate,
- the plating tank is divided into a first electrolysis chamber and a second electrolysis chamber by a partition plate in order from the upstream side where the substrate is conveyed,
- the cathode and the substrate provided in the first electrolysis chamber are electrically connected so that the substrate acts as an anode
- an aluminum plating apparatus in which an anode provided in the second electrolysis chamber and the base are electrically connected so that the base acts as a cathode.
- the aluminum plating apparatus described in (1) performs reverse electrolysis in the first electrolysis chamber, even if a metal oxide film or the like having a low insulating property or low conductivity is formed on the surface of the substrate, this is electrolytically removed.
- aluminum can be electrodeposited satisfactorily.
- the aluminum plating apparatus according to (1) further including a first power supply roller that conveys the substrate simultaneously with applying a potential to the substrate on the upstream side of the inlet of the first electrolysis chamber. According to the invention described in (2) above, it is possible to apply a potential to the substrate in the vicinity of the first electrolysis chamber while transporting the substrate.
- the aluminum plating apparatus according to (1) or (2) further including a second power supply roller that conveys the substrate simultaneously with applying a potential to the substrate on the downstream side of the outlet of the second electrolysis chamber.
- a potential can be applied to the substrate in the vicinity of the second electrolysis chamber while the substrate is being transported.
- the plating tank contains a molten salt bath mainly composed of aluminum chloride.
- a conventional molten salt bath mainly composed of aluminum chloride can be used, and a high-quality aluminum film can be obtained.
- the resin structure which has an aluminum film on the surface of the resin molding which has a three-dimensional network structure can be manufactured continuously.
- An aluminum plating apparatus for transporting the substrate into a plating tank and electrodepositing aluminum on the substrate, wherein the substrate is provided in the plating tank so that the substrate acts as a cathode in the plating tank.
- An aluminum plating apparatus provided with an aluminum plating apparatus in which an anode and the base are electrically connected. According to the invention described in the above (7), when a substrate on which a metal oxide film or the like having low insulating or low conductivity is used is used, a conventional aluminum plating apparatus is installed at the uppermost stream in the substrate transport direction. Can be used.
- the method for producing an aluminum film described in (8) above can form a high-quality aluminum film on the surface of a substrate on which a metal oxide film or the like having low insulation or conductivity is formed. it can.
- an aluminum plating apparatus that can satisfactorily form aluminum plating on the surface of a substrate on which a metal oxide film or the like having low insulation or conductivity is formed.
- An aluminum plating apparatus is an aluminum plating apparatus for transporting a substrate into a plating tank and electrodepositing aluminum on the substrate, wherein the plating tank is sequentially from the upstream side where the substrate is transported.
- the first electrolysis chamber and the second electrolysis chamber are separated by a partition plate, and the first electrolysis chamber is provided in the first electrolysis chamber so that the base body acts as an anode.
- the anode and the substrate are electrically connected to each other, and in the second electrolysis chamber, the anode and the substrate provided in the second electrolysis chamber so that the substrate acts as a cathode. Is an aluminum plating apparatus electrically connected.
- substrate is not specifically limited, A base
- a substrate include a steel strip (steel plate), a porous aluminum body having a three-dimensional network structure, a SUS plate, a Cu or Cu alloy plate, a Zn or Zn alloy plate, and the like.
- the plating bath contains a plating solution, but the plating solution is not particularly limited as long as it is a composition capable of electroplating aluminum. Since aluminum has a large affinity for oxygen and a potential lower than that of hydrogen, it is difficult to perform electroplating with an aqueous plating bath. Therefore, a molten salt bath is used. As the molten salt bath, a bath mainly composed of aluminum chloride can be preferably used.
- an organic molten salt that is a eutectic salt of an organic halide and an aluminum halide, or an inorganic molten salt that is a eutectic salt of an alkali metal halide and an aluminum halide can be used.
- Use of an organic molten salt bath that melts at a relatively low temperature is preferable because plating can be performed without decomposing the resin molded body as a base material.
- the organic halide imidazolium salt, pyridinium salt and the like can be used. Specifically, 1-ethyl-3-methylimidazolium chloride (EMIC) and butylpyridinium chloride (BPC) are preferable. Since the molten salt deteriorates when moisture or oxygen is mixed in the molten salt, the plating is preferably performed in an atmosphere of an inert gas such as nitrogen or argon and in a sealed environment.
- an inert gas such as nitrogen or argon
- a molten salt bath containing nitrogen is preferable.
- a salt that melts at a high temperature is used as the molten salt, it is faster that the resin dissolves or decomposes in the molten salt than the growth of the plating layer. Therefore, the plating layer cannot be formed on the surface of the resin molded body.
- an imidazolium salt bath can be preferably used. The imidazolium salt bath can be used without affecting the resin even at a relatively low temperature.
- the imidazolium salt a salt containing an imidazolium cation having an alkyl group at the 1,3-position is preferably used.
- an aluminum chloride-1-ethyl-3-methylimidazolium chloride (AlCl 3 -EMIC) -based molten salt is used. It is most preferably used because it is highly stable and hardly decomposes. Plating onto foamed urethane resin or foamed melamine resin is possible, and the temperature of the molten salt bath is 10 ° C to 100 ° C, preferably 25 ° C to 45 ° C.
- an inorganic salt bath can be used as the molten salt.
- the inorganic salt bath is typically a two-component or multi-component salt of AlCl 3 -XCl (X: alkali metal).
- X alkali metal
- Such an inorganic salt bath generally has a higher melting temperature than an organic salt bath such as an imidazolium salt bath, but is less restricted by environmental conditions such as moisture and oxygen, and can be put into practical use at a low cost overall. .
- Additives such as xylene, benzene, toluene, 1,10-phenanthroline may be added for the purpose of improving the smoothness and gloss of the aluminum plating film formed on the substrate surface.
- 1,10-phenanthroline can be preferably used.
- the addition amount of such an additive is preferably 0.25 to 7 g / L. By setting it to 0.25 g / L or more, a sufficiently smooth aluminum plating film can be obtained, and by setting it to 7 g / L or less, a decrease in plating efficiency can be suppressed.
- FIG. 1 is a diagram showing an example of the configuration of the aluminum plating apparatus of the present invention.
- a plating tank (102) in which a plating solution is accommodated is divided into a first electrolytic chamber (104) and a second electrolytic chamber (105) by a partition plate (103). It is divided into.
- the substrate (101) is continuously conveyed from the first electrolysis chamber (104) to the second electrolysis chamber (105).
- the partition plate (103) is provided for the purpose of electrically separating the first electrolysis chamber (104) and the second electrolysis chamber (105), and an insulating material can be preferably used.
- an insulating material can be preferably used.
- Teflon (registered trademark) Ceramics, glass, super engineering plastic such as PEEK (polyetheretherketone), heat-resistant vinyl chloride resin, or the like can be used.
- the partition plate (103) is provided with a passage through the base, but the passage is preferably the minimum through which the base can pass.
- the passage of the substrate has a slit shape.
- a cathode (107) is provided in the first electrolysis chamber (104) in which the substrate (101) is first transported, and the substrate (101) acts as an anode in the first electrolysis chamber (104). So that it is electrically connected. As a result, electrolysis occurs between the cathode (107) and the substrate (101), and the metal oxide film formed on the surface of the substrate (101) is removed by electrolysis, so that the metal surface constituting the substrate (101) is removed. Exposed.
- the cathode (107) is not particularly limited, and for example, aluminum, titanium, copper or the like can be preferably used.
- FIG. 1 illustrates the case where two cathodes (107) are provided in the vertical direction of the base body (101), but the number of cathodes (107) is not particularly limited, and one or three or more are provided. It doesn't matter. Further, the position where the cathode (107) is provided is not particularly limited, but it is preferable that the cathode (107) is provided as close as possible to the base (101) because electrolysis occurs efficiently.
- the anode terminal of the power source connected to the cathode (107) and the substrate (101) are connected. That's fine.
- the substrate (101) is connected to the anode on the upstream side in the vicinity of the inlet of the first electrolysis chamber (104) because electrolysis occurs efficiently.
- FIG. 1 shows a case where a first power supply roller (106) is provided upstream of the inlet of the first electrolysis chamber (104) and the first power supply roller (106) is connected to the anode of the power source. ing.
- the substrate (101) is applied with a potential from the first power supply roller (106) while being continuously transported by the first power supply roller (106) and the first transport roller (110). It will act as an anode in the electrolysis chamber (104).
- FIG. 1 shows the case where the first conveying roller (110) is provided on the opposite side of the first power supply roller (106), it is connected to the anode instead of the first conveying roller (110).
- a power feeding roller may be provided.
- the precipitation amount or dissolution amount of aluminum can be adjusted based on the following equation.
- Aluminum precipitation amount / dissolution amount [g] 0.3352 ⁇ I [A] ⁇ t [Hr] (formula)
- I represents a current value
- t represents time
- a constant 0.3352 is a constant peculiar to aluminum
- the substrate is another metal, it is calculated by changing to a constant peculiar to that metal. Good.
- the substrate (101) from which the metal oxide film has been removed as described above is subsequently conveyed to the second electrolysis chamber (105) through a slit provided in the partition plate (103).
- An anode (109) is provided in the second electrolysis chamber (105), and the base (101) is electrically connected so as to act as a cathode in the second electrolysis chamber (105).
- electrolysis occurs between the anode (109) and the substrate (101), and aluminum is electrodeposited on the surface of the substrate (101).
- the anode (109) is not particularly limited, and for example, aluminum, titanium, copper or the like can be preferably used.
- FIG. 1 illustrates the case where two anodes (109) are provided in the vertical direction of the base (101), but the number of anodes (109) is not particularly limited. One or three or more may be used. Further, the position where the anode (109) is provided is not particularly limited, but it is preferable to provide the anode (109) as close to the substrate (101) as possible because electrolysis occurs efficiently.
- the cathode terminal of the power source connected to the anode (109) and the substrate (101) are connected. That's fine.
- the substrate (101) is connected to the cathode on the downstream side in the vicinity of the outlet of the second electrolysis chamber (105) because electrolysis occurs efficiently.
- FIG. 1 shows a case where a second power supply roller (108) is provided on the downstream side of the outlet of the second electrolysis chamber (105), and the second power supply roller (108) is connected to the cathode of the power source. ing.
- the substrate (101) is applied with a potential from the second power supply roller (108) while being continuously transported by the second power supply roller (108) and the second transport roller (111). It comes to act as a cathode in the electrolysis chamber (105).
- FIG. 1 shows the case where the second transport roller (111) is provided on the opposite side of the second power supply roller (108), it is connected to the cathode instead of the second transport roller (111).
- a power feeding roller may be provided.
- the amount of aluminum deposited in the second electrolysis chamber (105) can be calculated by the above formula. Therefore, the current value and time may be adjusted so that desired aluminum is electrodeposited on the surface of the substrate (101). The time can be adjusted by changing the conveyance speed of the substrate (101).
- the aluminum plating apparatus of the present invention it is possible to satisfactorily form aluminum plating on the surface of a substrate on which a metal oxide film or the like having low insulation or conductivity is formed.
- the linear velocity can be increased by using the aluminum plating apparatus of the present invention. Products can be manufactured efficiently.
- the conventional plating tank deepens the plating tank when plating in the gravity direction, and plating when plating in the horizontal direction. It is conceivable to lengthen the anode by elongating the tank. However, in practice, the length of the anode effective for plating is limited. In other words, it is plated at a high current density at a location close to the conductor roll, but is not plated at a location far from the conductor roll. Can not.
- the aluminum plating apparatus of the present invention can remove the oxide film formed on the aluminum surface in the first electrolysis chamber. By providing two or more on the surface, smooth and good-quality aluminum plating can be formed even after the second tank. With such an aluminum plating apparatus in which two or more aluminum plating apparatuses are provided in series in the conveyance direction of the base, it is possible to increase the linear velocity of the base, thereby improving the production efficiency of the product. Furthermore, since the aluminum plating apparatus performs continuous aluminum plating using a plurality of aluminum plating apparatuses, only one additional facility such as a base supply or winding is required, and the amount of capital investment is extremely low. can do.
- the number of aluminum devices provided in series is not particularly limited, and may be appropriately selected according to the purpose, such as the thickness of the aluminum plating film to be formed.
- an aluminum porous body can be efficiently produced by disposing about 2 to 20 pieces.
- a conventional aluminum plating apparatus is installed at the uppermost stream in the substrate transport direction of the aluminum plating apparatus of the present invention. It may be provided.
- a conventional aluminum plating apparatus as shown in FIG. 2, an aluminum plating apparatus for electrodepositing aluminum on a base by passing the base (101) through a plating tank (202), 202) an aluminum plating apparatus in which the anode (209) provided in the plating tank (202) and the substrate (101) are electrically connected so that the substrate (101) acts as a cathode. Can be preferably used.
- the aluminum plating apparatus is an aluminum plating apparatus in which the base is transported in a plating tank to the uppermost stream in the transport direction of the base of the aluminum plating apparatus and aluminum is electrodeposited on the base.
- An aluminum plating apparatus provided with an aluminum plating apparatus in which an anode provided in the plating tank and the base are electrically connected so that the base acts as a cathode in the plating tank It is.
- Example 1 Ten aluminum devices of the present invention shown in FIG. 1 were arranged in series to form an aluminum plating film on the substrate.
- -Substrate- A resin molded body having a three-dimensional network structure in which an aluminum film was formed on the surface by a sputtering method was used as a substrate.
- the resin molding having a three-dimensional network structure a foamed urethane resin molding having a porosity of 95%, the number of pores per one inch (number of cells), a pore diameter of about 550 ⁇ m, a width of 500 mm, and a thickness of 1 mm was used. .
- An aluminum film having a basis weight of 10 g / m 2 was formed on the foamed urethane resin molded body by a sputtering method, and subjected to a conductive treatment. It was confirmed that a 30 nm aluminum oxide film was formed on the aluminum film on the surface of the resin molded body.
- each aluminum device shown in FIG. 1 was prepared and arranged in series. Nitrogen was filled so that the atmosphere between the aluminum plating apparatuses became an inert atmosphere. The rotational speed of the roller was adjusted so that the linear velocity of the substrate to be conveyed was 0.1 to 1.0 m / min.
- the configuration of each aluminum device was as follows.
- molten salt bath In a nitrogen atmosphere, a molten salt bath was prepared by mixing to 33 mol% EMIC-67 mol% AlCl 3 . Further, 1,10-phenanthroline was added so as to be 0.5 g / L. Further, nitrogen was introduced into the plating solution so that an oxide film was not formed while aluminum was electrodeposited.
- Partition plate A partition plate made of Teflon (registered trademark) was disposed in the plating tank, and the plating tank was partitioned into a first electrolysis chamber and a second electrolysis chamber. The partition plate was formed with a slit having a width of 560 mm and a height of 5 mm to serve as a passage for the substrate.
- (First feeding roller) A first feeding roller made of aluminum having the center of the roller connected to the anode terminal of the power source was used.
- (cathode) An aluminum cathode was provided in the first electrolysis chamber. As shown in FIG. 1, the cathodes were arranged at two locations on the upper surface side and the lower surface side of the substrate.
- (First electrolysis chamber) In the first electrolysis chamber, electrolysis occurred between the substrate and the cathode so that the current density was 10 A / dm 2 .
- (Second feeding roller) A second feeding roller made of aluminum having the center of the roller connected to the cathode terminal of the power source was used.
- (anode) An aluminum anode was provided in the second electrolysis chamber. As shown in FIG. 1, the anode was disposed at two locations on the upper surface side and the lower surface side of the substrate.
- (Second electrolysis chamber) In the second electrolysis chamber, electrolysis occurred between the substrate and the anode so that the current density was 5 A / dm 2 .
- the above-mentioned electrified substrate was continuously conveyed to 10 aluminum apparatuses having the above-described configuration, and an aluminum plating film was formed on the substrate surface. As a result, a 10 ⁇ m aluminum film was formed on the substrate surface. Further, the formed plating film was homogeneous and good quality.
- Example 2 As shown in FIG. 2, a conventional aluminum plating apparatus is disposed on the most upstream side with respect to the substrate transport direction.
- Nine aluminum devices of the present invention used in Example 1 were arranged in series on the downstream side to form an aluminum plating film on the substrate.
- -Substrate- A resin molded body having the same three-dimensional network structure as in Example 1 was used.
- the conductive treatment of the resin molding was performed by applying a carbon paint as a conductive paint to the porous resin other surface.
- the component of the carbon paint includes 25% of carbon particles, and includes a resin binder, a penetrating agent, and an antifoaming agent.
- the particle size of carbon black was 0.5 ⁇ m.
- the conventional aluminum plating apparatus disposed on the most upstream side with respect to the substrate transport direction has the same configuration as the second electrolysis chamber in the aluminum plating apparatus used in Example 1. That is, the plating solution, the power supply roller, and the anode were respectively configured in the same manner as the plating solution, the second power supply roller, and the anode of Example 1.
- the second and subsequent aluminum plating apparatuses have the same configuration as the aluminum plating apparatus used in Example 1, and nine such apparatuses are arranged in series.
- Example 1 An aluminum plating film was formed on the substrate surface in the same manner as in Example 1 except that ten conventional aluminum plating apparatuses were arranged in series as the aluminum plating apparatus. As a conventional aluminum plating apparatus, the aluminum plating apparatus arranged on the most upstream side in Example 2 was used. In addition, it was set as the conditions similar to Example 1 also to fill between nitrogen plating apparatuses with nitrogen, and to make it inert atmosphere. When the aluminum plating film formed on the substrate surface was observed, it was deposited in an island shape and was inferior in quality to the film formed using the apparatus of Example 1.
- Example 2 An aluminum plating film was formed on the substrate surface in the same manner as in Example 2 except that ten conventional aluminum plating apparatuses were arranged in series as the aluminum plating apparatus. As a conventional aluminum plating apparatus, the aluminum plating apparatus arranged on the most upstream side in Example 2 was used. In addition, it was set as the conditions similar to Example 2 also to fill between nitrogen plating apparatuses with nitrogen, and to make it inert atmosphere. When the aluminum plating film formed on the substrate surface was observed, it was deposited in an island shape and was inferior in quality to the film formed using the apparatus of Example 2.
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Abstract
Description
鋼帯表面にアルミニウムめっきをするには、まず、コンダクタロールを通じて鋼帯をめっき槽内に連続的に送給し、めっき槽内のめっき液に浸漬された陽極内を走行させる。この時、鋼帯自体は陰極として作用するように電気的に接続されていることから、陽極と陰極である鋼帯との間で電解が起こり、鋼帯の表面にアルミニウムが電着し、アルミニウムめっきが形成される。めっき液内を走行する鋼帯はターンロールによって方向変更され、今度は上向きに走行するが、この場合にも陽極との間でめっきが行われる。アルミニウムめっきが形成された鋼帯はめっき槽を出てからコンダクタロールを経て系外に取り出される(特開平05-222599号公報(特許文献1))。
しかしながら、上記のようにアルミニウムの表面には酸化膜が形成されているため、アルミニウムを電着させようとしても表面に均質に通電させることができず、島状にめっきが形成されてしまうという問題がある。
前記めっき槽は、前記基体が搬送される上流側から順に、第一の電解室と第二の電解室とに仕切り板により分けられており、
前記第一の電解室中では、前記基体が陽極として作用するように、前記第一の電解室中に設けられた陰極と前記基体とが電気的に接続されており、
前記第二の電解室中では、前記基体が陰極として作用するように、前記第二の電解室中に設けられた陽極と前記基体とが電気的に接続されている
アルミニウムめっき装置。
上記(1)に記載のアルミニウムめっき装置は、第一の電解室において逆電解を行うため、基体表面に絶縁性あるいは導電性が低い金属酸化膜等が形成されていてもこれを電解除去することができ、続く第二の電解室において良好にアルミニウムを電着させることができる。
(2)前記第一の電解室の入口の上流側に、前記基体に電位を付与すると同時に基体を搬送する第一の給電ローラを有する上記(1)に記載のアルミニウムめっき装置。
上記(2)に記載の発明によれば、基体を搬送しつつ、第一の電解室近傍で基体に電位を付与することができる。
(3)前記第二の電解室の出口の下流側に、前記基体に電位を付与すると同時に基体を搬送する第二の給電ローラを有する上記(1)又は(2)に記載のアルミニウムめっき装置。
上記(3)に記載の発明によれば、基体を搬送しつつ、第二の電解室近傍で基体に電位を付与することができる。
(4)前記めっき槽に、塩化アルミニウムを主成分とする溶融塩浴が収容されている上記(1)~(3)のいずれか一項に記載のアルミニウムめっき装置。
上記(4)に記載の発明によれば、従来の塩化アルミニウムを主成分とする溶融塩浴を用いることができ、良質なアルミニウム膜を得ることができる。
(5)前記基体が、導電化処理された三次元網目構造を有する樹脂成形体からなるシートである上記(1)~(4)のいずれか一項に記載のアルミニウムめっき装置。
上記(5)に記載の発明によれば、三次元網目構造を有する樹脂成形体の表面にアルミニウム膜を有する樹脂構造体を連続的に製造することができる。
(6)上記(1)~(5)のいずれか一項に記載のアルミニウムめっき装置が、前記基体の搬送方向に直列に2以上設けられているアルミニウムめっき装置。
上記(6)に記載の発明によれば、基体のサプライや巻き取り等の付帯設備が1台分で済み、設備投資額を非常に安価にすることができる。
(7)上記(1)~(6)のいずれか一項に記載のアルミニウムめっき装置の前記基体の搬送方向の最上流に、
めっき槽中に前記基体を搬送させて、前記基体上にアルミニウムを電着させるアルミニウムめっき装置であって、該めっき槽中では前記基体が陰極として作用するように、該めっき槽中に設けられた陽極と前記基体とが電気的に接続されているアルミニウムめっき装置が設けられているアルミニウムめっき装置。
上記(7)に記載の発明によれば、表面に絶縁性あるいは導電性が低い金属酸化膜等が形成されていない基体を用いる場合に、基体の搬送方向の最上流に従来のアルミニウムめっき装置を用いることができる。また、基体のサプライや巻き取り等の付帯設備が1台分で済み、設備投資額を非常に安価にすることができる。
(8)上記(1)~(7)のいずれか一項に記載のアルミニウムめっき装置を用いて基体上にアルミニウムを電着させるアルミニウム膜の製造方法。
上記(8)に記載のアルミニウム膜の製造方法は、表面に絶縁性あるいは導電性が低い金属酸化膜等が形成されている基体であっても、その表面に良質なアルミニウム膜を形成することができる。
溶融塩中に水分や酸素が混入すると溶融塩が劣化するため、めっきは窒素、アルゴン等の不活性ガス雰囲気下で、かつ密閉した環境下で行うことが好ましい。
特に1,10-フェナントロリンを好ましく用いることができる。このような添加剤の添加量は、0.25~7g/Lが好ましい。0.25g/L以上とすることで充分に平滑なアルミニウムめっき膜が得られ、また7g/L以下とすることでめっき効率の低下を抑制することができる。
図1は本発明のアルミニウムめっき装置の構成の一例を表す図である。図1に示すように本発明のアルミニウムめっき装置は、めっき液が収容されるめっき槽(102)が仕切り板(103)によって第一の電解室(104)と第二の電解室(105)とに分けられている。そして、基体(101)は第一の電解室(104)から第二の電解室(105)へと連続的に搬送される。
また、仕切り板(103)には基体の通り口が設けられているが、当該通り口は基体が通ることのできる最小限のものであることが好ましい。例えば、基体の通り口をスリット状にすることが好ましい。
陰極(107)は特に限定される物ではなく、例えば、アルミニウム、チタン、銅等を好ましく用いることができる。
アルミニウム析出量/溶解量[g]
=0.3352×I[A]×t[Hr] (式)
上記式においてIは電流値、tは時間を表し、定数0.3352はアルミニウムに特有の定数であり、基体が他の金属の場合には、その金属に特有の定数に変更して計算すればよい。
陽極(109)は特に限定されるものではなく、例えば、アルミニウム、チタン、銅等を好ましく用いることができる。
また、鋼帯や三次元網目構造を有する樹脂成形体からなるシートのように、長尺の基体にアルミニウムめっきをする場合には、本発明のアルミニウムめっき装置を用いることにより、線速を上げて効率よく製品を製造することができる。
このため、めっき槽を2槽以上で構成して線速を上げることが考えられるが、従来のめっき装置を2槽以上タンデムに配置して連続処理を行ったとしても、アルミニウムのように表面に酸化膜を形成しやすい金属の場合には、前のめっき槽で形成した皮膜上にアルミニウムを上手くめっき出来ないという問題がある。すなわち、めっき槽間でアルミニウムの表面に酸化膜が形成されてしまい、酸化膜があると、アルミニウムが島状に析出してしまい、うまくめっきをすることができない。なお、めっき槽の間をN2等の不活性雰囲気にしたとしても、完全に酸素を除去することはできず酸素がppmオーダーで存在し、この程度の微量の酸素に曝された場合であってもアルミニウムの表面には酸化膜(不働態膜)が形成されてしまう。
すなわち、本発明に係るアルミニウムめっき装置は、前記アルミニウムめっき装置の前記基体の搬送方向の最上流に、めっき槽中に前記基体を搬送させて、前記基体上にアルミニウムを電着させるアルミニウムめっき装置であって、該めっき槽中では前記基体が陰極として作用するように、該めっき槽中に設けられた陽極と前記基体とが電気的に接続されているアルミニウムめっき装置が設けられているアルミニウムめっき装置である。このような、直列に設けられた2番目以降のアルミニウムめっき装置に、逆電解を行う第一の電解室を備える前記本発明のアルミニウムめっき装置を直列的に配置してアルミニウムめっきを行うことにより、基体上に均質で良質なアルミニウムめっきを効率よく形成することが可能となる。また、前記のように、本発明のアルミニウムめっき装置は、基体のサプライや巻き取り等の付帯設備が1台分で済むため、設備投資額を非常に安価にすることができる。
図1に示す本発明のアルミニウム装置を10個直列に配置して基体にアルミニウムめっき膜を形成した。
-基体-
基体としてスパッタリング法により表面にアルミニウム膜を形成した三次元網目構造を有する樹脂成形体を用いた。
三次元網目構造を有する樹脂成形体として、気孔率95%、1インチ当たりの気孔数(セル数)約50個、気孔径約550μm、幅500mm、厚さ1mmの発泡ウレタン樹脂成形体を用いた。当該発泡ウレタン樹脂成形体に、スパッタリング法により目付量10g/m2のアルミニウム膜を形成して導電化処理した。
樹脂成形体表面のアルミニウム膜には30nmの酸化アルミニウム膜が形成されていることが確認された。
図1に示すアルミニウム装置を10個用意して直列に配置した。各アルミニウムめっき装置同士の間が不活性雰囲気になるように窒素を充填した。搬送される基体の線速が0.1~1.0m/minとなるようにローラの回転速度を調整した。各アルミニウム装置の構成は次の通りとした。
窒素雰囲気で、33mol%EMIC-67mol%AlCl3となるように混合して溶融塩浴を作製した。更に1,10-フェナントロリンを0.5g/Lとなるように添加した。
また、めっき液中には窒素を導入して、アルミニウムが電着している最中に酸化膜が形成されないようにした。
(仕切り板)
めっき槽内にテフロン(登録商標)製の仕切り板を配置して、めっき槽を第一の電解室と第二の電解室とに区画した。仕切り板には基体の通り口となる560mm幅×5mm高さのスリットを形成した。
ローラの中心が電源の陽極端子と接続されたアルミニウム製の第一の給電ローラを用いた。
(陰極)
第一の電解室の中にアルミニウム製の陰極を設けた。陰極は図1に示すように基体の上面側と下面側の2箇所に配置した。
(第一の電解室)
第一の電解室において、基体と陰極との間で電解が生じて電流密度が10A/dm2となるようにした。
ローラの中心が電源の陰極端子と接続されたアルミニウム製の第二の給電ローラを用いた。
(陽極)
第二の電解室の中にアルミニウム製の陽極を設けた。陽極は図1に示すように基体の上面側と下面側の2箇所に配置した。
(第二の電解室)
第二の電解室において、基体と陽極との間で電解が生じて電流密度が5A/dm2となるようにした。
図2に示すように、基体の搬送方向に対して最上流側に従来のアルミニウムめっき装置を配置した。そしてその下流側に実施例1で用いた本発明のアルミニウム装置を9個直列に配置して基体にアルミニウムめっき膜を形成した。
-基体-
実施例1と同様の三次元網目構造を有する樹脂成形体を用いた。
樹脂成形体の導電化処理は、導電性塗料としてのカーボン塗料を樹脂多孔他表面に塗布することにより行った。カーボン塗料の成分は、カーボン粒子25%を含み、樹脂バインダー、浸透剤、消泡剤を含む。カーボンブラックの粒径は0.5μmとした。
基体の搬送方向に対して最上流側に配置した従来のアルミニウムめっき装置は、実施例1で用いたアルミニウムめっき装置における第二の電解室と同様の構成とした。即ち、めっき液、給電ローラ、陽極をそれぞれ、実施例1のめっき液、第二の給電ローラ、陽極と同一の構成にした。
2番目以降のアルミニウムめっき装置は、実施例1で用いたアルミニウムめっき装置と同一の構成とし、当該装置を9個直列に配置した。
アルミニウムめっき装置として従来のアルミニウムめっき装置を10個直列に配置して用いた以外は実施例1と全く同様にして基体表面にアルミニウムめっき膜を形成した。従来のアルミニウムめっき装置としては、実施例2で最上流側に配置したアルミニウムめっき装置を用いた。なお、アルミニウムめっき装置同士の間を窒素で満たして不活性雰囲気にすることも実施例1と同様の条件とした。
基体表面に形成されたアルミニウムめっき膜を観察したところ、島状に析出しており、実施例1の装置を用いて形成した膜よりも品質的に劣るものであった。
アルミニウムめっき装置として従来のアルミニウムめっき装置を10個直列に配置して用いた以外は実施例2と全く同様にして基体表面にアルミニウムめっき膜を形成した。従来のアルミニウムめっき装置としては、実施例2で最上流側に配置したアルミニウムめっき装置を用いた。なお、アルミニウムめっき装置同士の間を窒素で満たして不活性雰囲気にすることも実施例2と同様の条件とした。
基体表面に形成されたアルミニウムめっき膜を観察したところ、島状に析出しており、実施例2の装置を用いて形成した膜よりも品質的に劣るものであった。
102 めっき槽
103 仕切り板
104 第一の電解室
105 第二の電解室
106 第一の給電ローラ
107 陰極
108 第二の給電ローラ
109 陽極
110 第二の搬送ローラ
111 第二の搬送ローラ
202 めっき槽
208 給電ローラ
209 陽極
Claims (8)
- めっき槽中に基体を搬送させて、該基体上にアルミニウムを電着させるアルミニウムめっき装置であって、
前記めっき槽は、前記基体が搬送される上流側から順に、第一の電解室と第二の電解室とに仕切り板により分けられており、
前記第一の電解室中では、前記基体が陽極として作用するように、前記第一の電解室中に設けられた陰極と前記基体とが電気的に接続されており、
前記第二の電解室中では、前記基体が陰極として作用するように、前記第二の電解室中に設けられた陽極と前記基体とが電気的に接続されている
アルミニウムめっき装置。 - 前記第一の電解室の入口の上流側に、前記基体に電位を付与すると同時に基体を搬送する第一の給電ローラを有する請求項1に記載のアルミニウムめっき装置。
- 前記第二の電解室の出口の下流側に、前記基体に電位を付与すると同時に基体を搬送する第二の給電ローラを有する請求項1又は2に記載のアルミニウムめっき装置。
- 前記めっき槽に、塩化アルミニウムを主成分とする溶融塩浴が収容されている請求項1~3のいずれか一項に記載のアルミニウムめっき装置。
- 前記基体が、導電化処理された三次元網目構造を有する樹脂成形体からなるシートである請求項1~4のいずれか一項に記載のアルミニウムめっき装置。
- 請求項1~5のいずれか一項に記載のアルミニウムめっき装置が、前記基体の搬送方向に直列に2以上設けられているアルミニウムめっき装置。
- 請求項1~6のいずれか一項に記載のアルミニウムめっき装置の前記基体の搬送方向の最上流に、
めっき槽中に前記基体を搬送させて、前記基体上にアルミニウムを電着させるアルミニウムめっき装置であって、該めっき槽中では前記基体が陰極として作用するように、該めっき槽中に設けられた陽極と前記基体とが電気的に接続されているアルミニウムめっき装置が設けられているアルミニウムめっき装置。 - 請求項1~7のいずれか一項に記載のアルミニウムめっき装置を用いて基体上にアルミニウムを電着させるアルミニウム膜の製造方法。
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JP2004107776A (ja) * | 2002-09-20 | 2004-04-08 | Kansai Engineering:Kk | 線材の電気めっき方法、電気めっき装置、及び電気めっき線材 |
JP2008218777A (ja) * | 2007-03-06 | 2008-09-18 | Bridgestone Corp | 光透過性電磁波シールド材の製造方法 |
JP2012144763A (ja) * | 2011-01-11 | 2012-08-02 | Sumitomo Electric Ind Ltd | アルミニウム構造体の製造方法およびアルミニウム構造体 |
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US20150211143A1 (en) | 2015-07-30 |
JP5880364B2 (ja) | 2016-03-09 |
KR20150046013A (ko) | 2015-04-29 |
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