WO2014034672A1 - Corps de structure de circuit de transmission - Google Patents

Corps de structure de circuit de transmission Download PDF

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Publication number
WO2014034672A1
WO2014034672A1 PCT/JP2013/072889 JP2013072889W WO2014034672A1 WO 2014034672 A1 WO2014034672 A1 WO 2014034672A1 JP 2013072889 W JP2013072889 W JP 2013072889W WO 2014034672 A1 WO2014034672 A1 WO 2014034672A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive fine
transmission circuit
circuit structure
insulating layer
fine particle
Prior art date
Application number
PCT/JP2013/072889
Other languages
English (en)
Japanese (ja)
Inventor
大塚　寛治
秋山　豊
千寿 上田
典史 笹岡
貴史 越智
大野　正人
Original Assignee
学校法人明星学苑
ニッポン高度紙工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 学校法人明星学苑, ニッポン高度紙工業株式会社 filed Critical 学校法人明星学苑
Publication of WO2014034672A1 publication Critical patent/WO2014034672A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/30—Arrangements for providing operation on different wavebands
    • H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
    • H01Q5/314—Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors
    • H01Q5/335—Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors at the feed, e.g. for impedance matching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0723—Shielding provided by an inner layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout

Definitions

  • the present invention relates to a transmission circuit structure having a signal line and a ground pattern.
  • the frequency of the high-speed interface that has been developed exceeds 5 GHz, and in order to use such a high frequency, it is necessary to shorten the rise time of the signal compared to the conventional method. Yes, as the rise time is shortened, the high-frequency component of the signal appears significantly. Therefore, in order to reduce the loss of high-frequency components, it is essential to use copper foil with a low surface roughness and use a resin with a low dielectric constant and dielectric loss tangent.
  • Patent Document 1 Japanese Patent Laid-Open No. 2 0 5 _ 7 6 6 8 ([0 0 0 2])
  • Patent Document 2 Japanese Patent Laid-Open No. 2 0 _ 2 6 6 5 2
  • Patent Document 3 Japanese Patent Laid-Open No. 2 0 0 6-1 2 8 3 2 6 ([0 0 1 0]) Summary of the Invention
  • Typical examples of substrate materials with good high-frequency characteristics include fluororesin substrates and liquid crystal polymer substrates, but they are more expensive than general-purpose glass epoxies.
  • There is also a problem in terms of processing such as low adhesive strength with the foil.
  • a high-frequency wave can be obtained even in a frequency region exceeding 5 GHz without using a low dielectric constant, low dielectric loss tangent resin such as a fluororesin or a liquid crystal polymer.
  • a signal line is formed in contact with one main surface of the insulating layer, and conductive fine particles are dispersed in the organic material in contact with the other main surface of the insulating layer.
  • a ground layer made of a conductive fine particle dispersion film is formed.
  • the ground layer formed with the signal line and the insulating layer interposed therebetween is configured with the conductive fine particle dispersed film.
  • the conduction in the conductive fine particle dispersed film is achieved by a talented junction at the contact portion between the conductive fine particles contained in the film. Even if the conductive fine particles do not contact each other, conduction can be achieved by the tunnel effect or the hot carrier effect. Even when the conductive fine particles are separated from each other, they can be conducted by many types of near-field effects such as a discharge effect due to electric field concentration and a shot effect if the material that disperses the conductive fine particles is a semiconductor. Is assisted. [0 0 1 0]
  • the action of the conductive fine particle dispersion film constituting the ground layer allows the use of a resin having a low dielectric constant and a low dielectric loss tangent such as a fluororesin and a liquid crystal polymer. Signals can be transmitted without loss of high-frequency components even in the frequency range exceeding. For this reason, it is possible to prevent signal loss and signal error. As a result, by using a circuit board provided with this transmission circuit structure, it is possible to achieve high speed as well as high integration and miniaturization of electronic equipment.
  • FIG. 1 is a schematic configuration diagram (plan view) of a transmission circuit structure according to a first embodiment of the present invention.
  • FIG. 2 is a cross-sectional view taken along line AA ′ in FIG.
  • FIG. 3 is a schematic cross-sectional view of a sample transmission circuit structure of a comparative example.
  • FIG. 4 is a diagram showing an input signal of TDR measurement and a reflected signal.
  • FIG. 5 is a diagram showing the time lapse of the voltage of the signal returned to the input side obtained as a result of the TDR measurement.
  • FIG. 6 A diagram showing the relationship between frequency and transmission loss, obtained as a result of S-parameter measurement.
  • FIG. 7 is a diagram showing the relationship between the passage of time and voltage obtained as a result of measuring the rise time of the propagation signal.
  • FIG. 8 is an enlarged view near the rising edge of the signal in FIG.
  • FIG. 9 is an eye pattern of a sample of the transmission circuit structure of the example.
  • FIG. 10 is an eye pattern of a sample of a transmission circuit structure of a comparative example.
  • FIG. 1 1 is a cross-sectional observation photograph of a sample of a transmission circuit structure of an example.
  • FIG. 12 An image obtained by three-dimensionally synthesizing a cross-sectional photograph of a sample of the transmission circuit structure of the example.
  • FIGS. 1 and 2 show a schematic configuration diagram of the transmission circuit structure according to the first embodiment of the present invention.
  • FIG. Figure 1 shows a plan view
  • Figure 2 shows a cross-sectional view at A- in Figure 1.
  • the transmission circuit structure shown in Figs. 1 and 2 is in contact with the upper surface of the interlayer insulating layer 15
  • Line 1 1 (S) and ground pattern 1 2 (G) are formed and in contact with the lower surface of the interlayer insulating layer 15 and containing conductive fine particles in resin ⁇ Ground consisting of conductive fine particle dispersion film dispersed Layer 17 is formed.
  • An insulating layer 1 4 is formed on the signal line 1 1 and the ground pattern 1 2. Under the ground layer 17, an insulating layer 16 is formed.
  • the insulating layer 14, the interlayer insulating layer 15, and the insulating layer 16 are formed of the same insulating material, and become an integrated insulating layer 13. Yes.
  • the signal line 1 1 is formed by patterning a thin film obtained by planarly extending a bulk material into a linear shape.
  • the material constituting the signal line 1 1 is not limited as long as the material has good conductivity.
  • copper (C u), aluminum (AI), gold (A u), silver ( A g) and alloys containing these as the main components are used as the metal foil.
  • a signal line 11 made of copper foil is provided.
  • ground patterns 1 2 are formed on both sides of the signal line 1 1 and apart from the signal line 1 1. That is, the signal line 11 and the ground pattern 12 form the same configuration as a so-called coplanar line.
  • the same potential for example, a ground potential, is applied to the two ground patterns 12.
  • the ground pattern 12 is formed by linearly patterning a thin film obtained by extending a bulk material in a plane.
  • the material constituting the ground pattern 12 is not limited as long as the material has good conductivity.
  • copper (C u), aluminum (AI), gold (A u), silver (A g) and alloys containing these as the main components are used as the metal foil.
  • a ground pattern 12 made of copper foil is provided. I will do it.
  • the ground layer 17 may be configured as a single-layer structure of a conductive fine particle dispersed film as illustrated, or a laminated structure of a conductive fine particle dispersed film and a conductive material such as a copper foil, for example. It may be configured as. When the ground layer has a laminated structure, the conductive fine particle dispersion film is arranged on the signal line and insulating layer side.
  • the conductive fine particles used for the conductive fine particle dispersed film are configured using a material having good conductivity.
  • Such conductive fine particles are composed of gold (Au), silver (Ag), copper (Cu), aluminum (AI), nickel (N ⁇ ), or graphite. These materials may be used alone or as an alloy based on these materials.
  • conductive fine particles may be formed by mixing a plurality of types of particles made of these materials, or particles made of other conductive materials.
  • These conductive fine particles are used in the form of flakes (flakes), spheres, and long particles, and a plurality of types may be used in combination.
  • graphite When graphite is used as the conductive fine particles, disc-shaped graphite particles having a and b surfaces as bottom surfaces are used. These graphite particles are particles in which graphene is laminated in the ab plane direction.
  • the free electron density of copper is 1.3 X 10 23 / cm 3 , but the electron mobility is only 5.1 X 10 1 cm 2 / V-s.
  • the a and b planes of the graph item have a free electron density of only 10 13 / cm 3, but the electron mobility is as high as 1 X 10 4 cm 2 / V ⁇ s and the mean free path is long. . For this reason, the electrical conductivity of the a and b surfaces of the graph items is said to be better than copper.
  • the c-axis direction of the graph item has a large resistance. For this reason, it is desirable to use thin crystalline particles of darafen as conductive fine particles.
  • the shape of conductive fine particles is, for example, 50 Aim or less in the long side direction, 1 O tm or less in the short side direction, and 5 tm in thickness. It is assumed that the following particle shapes are mainly included, and those with spherical shapes of less than l O m, elliptical spheres, and isotropically deformed particles are included.
  • the conductive fine particle-dispersed film is formed by dispersing the conductive fine particles as described above in an organic material and then curing.
  • an organic material for dispersing conductive fine particles As the organic material for dispersing conductive fine particles as described above, a material capable of dispersing conductive fine particles is used.
  • an organic material for example, an epoxy resin, a polyimide resin, a polyimide resin, and a BT (bismaleide ⁇ lyazine) resin can be selected as appropriate from commonly used organic insulating materials. Can be used.
  • the conductive fine particle-dispersed film preferably has an electric resistivity of 5 times or more that of the bulk material of the material constituting the conductive fine particles, more preferably 1 It is about 0 0 0 times.
  • the electrical resistivity of such a conductive fine particle dispersed film can be increased by reducing the film thickness.
  • the conductive fine particle-dispersed film is formed by using a pace rod in which conductive fine particles are dispersed in an organic material diluted with a solvent.
  • a pace rod in which conductive fine particles are dispersed in an organic material diluted with a solvent.
  • the silver paste is obtained by dispersing silver particles in a solution obtained by diluting, for example, an epoxy resin precursor and a curing agent as an organic material, and other additives as necessary.
  • the conductive state is maintained by approaching or partially contacting each other up to a distance where the interaction occurs, and a conductive fine particle dispersed film is obtained.
  • the solvent may be removed from the film in the process of curing or drying the organic material (for example, epoxy resin or polyamide imide resin). is there.
  • the conductive fine particle dispersed film may contain additives such as a dispersant and a cosolvent for improving the dispersibility of the conductive fine particles.
  • the thickness of the ground layer 17 composed of the conductive fine particle dispersed film is determined by the current capacity handled by the transmission circuit structure. If the transmission circuit structure is used for an electronic circuit, the thickness of the signal line 1 1 and the ground pattern 12 is preferably several m to several h.
  • the thickness of the signal line 11 and the ground pattern 12 is several atm to several tens of mm.
  • the insulating layer 13 is preferably made of an organic material that can be diluted in the same solvent as the organic material that forms the conductive fine particle dispersed film.
  • the precursors before drying or curing the respective organic materials constituting the insulating layer 13 and the conductive fine particle dispersed film can be diluted or dissolved in the same solvent. It ’s fine.
  • an insulating layer 13 for example, a material similar to the organic material constituting the conductive fine particle dispersed film is used.
  • an epoxy resin, a polyimide resin, a polyimide resin or the like is used for the insulating layer 13.
  • solvents such as alcohols, ketones and esters.
  • Other specific examples of such solvents that can be diluted or dissolved include N-methylpyrrolidone, alpha-pyrolactone, diglyme, cyclopentanone, and ethyl benzoate.
  • the solvent may be removed in the process of hardening or drying the organic material.
  • the insulating layer 13 is used by adjusting to an appropriate molecular structure and dielectric constant according to the performance required for the transmission circuit structure.
  • the dielectric structure can be improved by improving the molecular structure of polyamide or by dispersing high dielectric constant powder or low dielectric constant powder in the resin. The rate is adjusted.
  • the film thickness of the insulating layer 13 is set so that a predetermined characteristic impedance is obtained in the ground pattern 12 and the ground layer 17.
  • the thickness of the insulating layer 1 3 is set to several m to 200 m. If the transmission circuit structure is used for a transmission cable,
  • the film thickness of 13 is set to several m to several mm.
  • the insulating layer 14, the interlayer insulating layer 15, and the insulating layer 16 are formed of the same insulating material.
  • ground pattern 12 formed with the signal line 11 interposed therebetween may be omitted.
  • the signal line and the ground layer sandwich the interlayer insulating layer.
  • the transmission circuit structure having the above-described configuration is used as a circuit board or a transmission cable. In this case, for example, it may be used by being connected to the substrate extraction electrode, or may be used as a configuration embedded in the connector. Furthermore, this transmission circuit may have the ground layer covered with an inorganic insulating film or an organic insulating film.
  • the transmission circuit structure as described above can be manufactured, for example, as described below.
  • a copper foil is prepared, and an organic insulating film is formed thereon as an insulating layer. At this time, a solution obtained by diluting or dissolving the organic material with a solvent is applied onto the copper foil.
  • an insulating layer is obtained by performing a drying process.
  • the copper foil is patterned to form a signal line 11 and a ground pattern 12 made of the copper foil.
  • a conductive fine particle dispersion film is formed on the insulating layer.
  • a paste in which conductive fine particles are dispersed in a solution in which an organic material is diluted is applied onto the insulating layer.
  • the coated film is dried to obtain a conductive fine particle dispersed film.
  • a step of curing or drying the organic material of the conductive fine particle dispersed film is performed.
  • the insulating layer is cured simultaneously.
  • the heat treatment is performed at a temperature lower than the melting point of the conductive fine particles in the conductive fine particle dispersion film.
  • the organic material constituting the conductive fine particle dispersed film and the organic material constituting the insulating layer are photocurable resins, curing by light irradiation may be performed.
  • the conductive fine particle dispersion film thus obtained serves as a ground layer.
  • the ground layer is configured as a laminated structure of a conductive fine particle dispersed film and a conductive material such as copper foil
  • the upper part of the conductive fine particle dispersed film produced as described above is used.
  • a conductive material such as copper foil is laminated on the substrate.
  • a ground layer having a laminated structure of the conductive fine particle dispersed film on the insulating layer side and the conductive material on the upper side is obtained.
  • the transmission circuit structure is completed.
  • the ground layer 17 is configured using a conductive fine particle dispersed film in which conductive fine particles are dispersed in an organic material.
  • a transmission circuit structure (S 1) having the structure shown in FIGS. 1 and 2 and applying the configuration of the present invention was manufactured.
  • a transmission circuit structure (C 1) to which a conventional configuration was applied in which the structure shown in the sectional view of FIG. 2 was changed to the structure shown in the sectional view of FIG.
  • a ground layer 52 made of copper foil and a connection part 51 made of a conductor layer are formed instead of the conductive fine particle dispersed film shown in FIG.
  • the Cu foil is patterned by etching. As a result, a signal line 11 and a ground pattern 12 made of Cu foil are formed.
  • the length L of the transmission circuit structure was 20 Omm, and the width W of the transmission circuit structure was 20 mm.
  • the width of the signal line 11 is 100 m, and the distance between the signal line 1 1 and the daland pattern 12 is 550 m.
  • connection hole 5 1 is formed by filling the connection hole with a mesh or a conductive pace filling hole.
  • a ground layer 17 made of a conductive fine particle dispersion film is formed inside the connection hole and on the surface of the interlayer insulating film.
  • the shape and material of the conductive fine particles are flaky A 9 (major axis 6.2 m, content 85 wt%).
  • the film thickness of the ground layer 17 made of the conductive fine particle dispersed film is 5 to 1 Om.
  • N_methyl_2_pyrrolidone similar to P A I constituting the interlayer insulating layer 15 is used.
  • a copper (Cu) foil (film thickness: 18 Aim) is bonded to the interlayer insulating layer 15 and the connection portion 51 by thermocompression bonding to form the ground layer 52.
  • a solvent-soluble polyamideimide (PA I) using N-methyl-2-pyrrolidone as a solvent. ) Is applied and dried to form an insulating layer 16 made of PAI.
  • the film thickness of the insulating layer 16 is about 10 Aim.
  • a solvent-soluble polyamideimide (PA) using N _methyl _2 pyrrolidone as a solvent I) is applied and dried to form an insulating layer 14 made of PAI.
  • the thickness of the insulating layer 14 is about 1 O ⁇ m.
  • the dielectric constant ⁇ of the interlayer insulating layer 15 after completion of drying, measured by a cavity resonator perturbation method, and a measurement frequency of 1 GHz was 2.9.
  • TDR Time Domain Ref Lectmetory
  • the signal is returned at the other end 19 of the transmission circuit structure, that is, at the end of the line, so that the signal is returned.
  • the characteristic impedance Z of the circuit of the transmission circuit structure By detecting this reflected signal S ref, the characteristic impedance Z of the circuit of the transmission circuit structure. (The inherent value of the line) and the time 2 t pd required for the electromagnetic energy to travel back and forth on the transmission line.
  • the velocity V of the electromagnetic wave propagating through the transmission line is derived from the dielectric constant ⁇ of the resin of the interlayer insulating layer 15 and the following equation (1).
  • Fig. 5 shows the time lapse of the voltage of the signal returned to the input side as a measurement result.
  • the propagation time of the example was about 21% shorter than that of the comparative example.
  • Fig. 6 shows the relationship between frequency and transmission loss (dB) as a measurement result.
  • the example has less high-frequency component loss than the comparative example.
  • the comparative example has less high-frequency component loss than the comparative example.
  • the rise time of the propagation signal was measured in the transmission circuit structure samples of the example and the comparative example.
  • a clock signal was input from the input side.
  • the clock signal voltage was 1 V
  • the frequency was 1 MHz
  • the pulse rise time Tr was 36 to 44 ps.
  • the output of the signal obtained on the output side was observed with a digital oscilloscope.
  • Figure 7 shows the relationship between time and voltage as a measurement result.
  • Figure 8 shows an enlarged view around the rising edge of the signal.
  • Figure 8 shows the time elapsed between 20% and 80% of the voltage, assuming 0.6 1 6V as 100%.
  • the sample of the example has a shorter rise time of the propagation signal than the sample of the comparative example.
  • the elapsed time of 20% ⁇ 80% is 1 19 p s in the example and 1 63 p s in the comparative example.
  • the rise time of the propagation signal is shortened by about 27% compared to the comparative example.
  • the signal wiring width of the example is 1 000 tm and the width of the signal wiring of the comparative example is 60 m in order to eliminate the influence on the measurement data due to the characteristic impedance mismatch. Measurements were carried out on objects.
  • the size of the ground pattern on both sides is adjusted in response to changes in the signal wiring, and other sizes and external dimensions remain the same, and their characteristic impedances are in the range of 50 ⁇ 10 ⁇ . .
  • one end of the sample was used as the input side, and the other end of the sample was used as the output side.
  • a GS Prop (CP690-01, 6 GHz) was connected to each of the input and output sides.
  • the Anritsu pulse pattern generator MP1761B was connected to the input side through this program, and the Agi Lent digital talent Shiroscope 8686A was connected to the output side.
  • the eye patterns of the observed examples and comparative examples are shown in FIG. 9 and FIG.
  • the sample of the example can confirm the opening of the central portion, whereas the sample of the comparative example shows the opening at all. Absent. In other words, it can be said that the sample of the example has greatly improved the transmission characteristics of the high-speed digital signal compared to the comparative example.
  • the sample of the example has the characteristics that the propagation speed of the signal is fast, the rise of the propagation signal is short, and the transmission characteristic of the high-speed digital signal is good.
  • Figures 11 and 12 show photographs.
  • Fig. 11 is a photograph of the cross section taken from the side
  • Fig. 12 is a three-dimensional composite image of 50 cross-sections taken in steps of about 1 m as in Fig. 11.
  • a conductive fine particle dispersed film in which conductive fine particles are coarsely dispersed is formed.
  • the effective ground coupling of signal line 1 1 in Fig. 2 is much stronger in daland layer 1 7 than daland pattern 1 2. That is, since the spatial distance is narrow, a microstrip line structure in which the ground pattern 12 is omitted can be adopted.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

La présente invention concerne un corps de structure de circuit de transmission. Grâce audit corps de structure de circuit de transmission, sans nécessiter de résine à faible constante diélectrique et à faible tangente diélectrique, telle qu'une résine de fluor ou un polymère à cristaux liquides, une transmission de signal sans perte de composante de haute fréquence, même dans des régions de fréquence au-delà de 5GHz, est possible. Dans ledit corps de structure de circuit de transmission, un circuit de transmission est formé en contact avec une surface d'une couche d'isolation inter-laminaire, et une couche de masse est formée en contact avec une autre surface de la couche d'isolation inter-laminaire, ladite couche de masse comprenant un film à microparticules conductrices dispersées dans lequel des microparticules conductrices sont dispersées dans un matériau organique.
PCT/JP2013/072889 2012-08-31 2013-08-27 Corps de structure de circuit de transmission WO2014034672A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-191061 2012-08-31
JP2012191061 2012-08-31

Publications (1)

Publication Number Publication Date
WO2014034672A1 true WO2014034672A1 (fr) 2014-03-06

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009111658A (ja) * 2007-10-30 2009-05-21 Kyocera Corp 多層配線基板
JP2010239590A (ja) * 2009-03-31 2010-10-21 Ngk Insulators Ltd 分布定数構造部品及びその製造方法
JP2012094843A (ja) * 2010-09-30 2012-05-17 Incorporated Educational Institution Meisei 回路基板、電源構造体、回路基板の製造方法、および電源構造体の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009111658A (ja) * 2007-10-30 2009-05-21 Kyocera Corp 多層配線基板
JP2010239590A (ja) * 2009-03-31 2010-10-21 Ngk Insulators Ltd 分布定数構造部品及びその製造方法
JP2012094843A (ja) * 2010-09-30 2012-05-17 Incorporated Educational Institution Meisei 回路基板、電源構造体、回路基板の製造方法、および電源構造体の製造方法

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