WO2014030599A1 - Sensor-integrated cover glass - Google Patents

Sensor-integrated cover glass Download PDF

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WO2014030599A1
WO2014030599A1 PCT/JP2013/072019 JP2013072019W WO2014030599A1 WO 2014030599 A1 WO2014030599 A1 WO 2014030599A1 JP 2013072019 W JP2013072019 W JP 2013072019W WO 2014030599 A1 WO2014030599 A1 WO 2014030599A1
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transparent conductive
conductive film
sensor
film
cover glass
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PCT/JP2013/072019
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French (fr)
Japanese (ja)
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玉井　喜芳
文 中川
仁 齊木
直己 上村
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旭硝子株式会社
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Priority to CN201380043790.5A priority Critical patent/CN104583918A/en
Priority to KR20157004438A priority patent/KR20150046047A/en
Priority to JP2014531610A priority patent/JPWO2014030599A1/en
Publication of WO2014030599A1 publication Critical patent/WO2014030599A1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0414—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04105—Pressure sensors for measuring the pressure or force exerted on the touch surface without providing the touch position
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Position Input By Displaying (AREA)
  • Surface Treatment Of Glass (AREA)

Abstract

The present invention relates to a sensor-integrated cover glass having: a glass panel; a first transparent conductive film extending in a first direction, and a second transparent conductive film extending in a different direction from the first direction, the films being formed on one surface of the glass panel; and a base insulating film comprising a transparent organic compound, formed between glass panel, and the first transparent conductive film and the second transparent conductive film.

Description

センサ一体型カバーガラスSensor integrated cover glass
　本発明は、静電容量型のタッチパネル等に利用される、センサ一体型カバーガラスに関する。 The present invention relates to a sensor-integrated cover glass used for a capacitive touch panel or the like.
　スマートフォンやタブレット型コンピュータ等にタッチパネルが利用されている。
　各種のタッチパネルのうち、静電容量型のタッチパネルは、一般的に、センサガラスと呼ばれるガラス基板上に、例えば、ｘ方向およびｙ方向に延在する入力位置検出用の透明導電膜（透明電極）等を形成することで、センサ機能部を形成している。
　一般的な静電容量型タッチパネルは、透明導電膜等が形成されたセンサガラスとカバーガラスと呼ばれるガラスを、接着することで構成される。 Touch panels are used in smartphones and tablet computers.
Among various types of touch panels, a capacitive touch panel is generally a transparent conductive film (transparent electrode) for detecting an input position extending on, for example, an x direction and a y direction on a glass substrate called a sensor glass. Etc. are formed to form the sensor function unit.
A general capacitive touch panel is configured by adhering a sensor glass on which a transparent conductive film or the like is formed and a glass called a cover glass.
　これに対し、静電容量型タッチパネルでは、特許文献１に示されるように、センサガラスを無くして、部品数の低減、および、薄型化や軽量化を計ることも知られている。
　すなわち、この静電容量型タッチパネルは、強化ガラスをカバーガラスとして用い、このカバーガラスに、入力位置検出用の透明導電膜等を形成することで、カバーガラスとセンサ部とを一体型とした構成を有する（センサ一体型カバーガラス）。 On the other hand, as shown in Patent Document 1, it is also known that a capacitive touch panel eliminates the sensor glass to reduce the number of parts, and reduce the thickness and weight.
That is, this capacitive touch panel uses a tempered glass as a cover glass, and the cover glass and the sensor unit are integrated by forming a transparent conductive film for detecting an input position on the cover glass. (Sensor-integrated cover glass).
　強化ガラスとは、表面に、強化層（圧縮応力層）を形成して圧縮応力を働かせることにより、強度を高めたガラスである。
　強化ガラスの製造方法としては、加熱と冷却によるガラスの膨張と収縮を利用して、強化層を形成する物理強化法（風冷強化法）と、ガラス中のアルカリイオンをよりイオン半径の大きな他のアルカリイオンと交換することで、強化層を形成する化学強化法が知られている。
　タッチパネルのカバーガラスなどの薄いガラスでは、一般的に、化学強化法による強化ガラス、いわゆる化学強化ガラスが利用される。 The tempered glass is a glass whose strength is increased by forming a tempered layer (compressive stress layer) on the surface and applying a compressive stress.
The tempered glass is manufactured by a physical tempering method (air-cooling tempering method) that forms a tempered layer using the expansion and contraction of the glass by heating and cooling, as well as alkali ions in the glass with a larger ionic radius. A chemical strengthening method is known in which a reinforcing layer is formed by exchanging with alkali ions.
In thin glass such as a cover glass of a touch panel, tempered glass by a chemical tempering method, so-called chemically tempered glass is generally used.
日本国特開２０１１－１９７７０８号公報Japanese Unexamined Patent Publication No. 2011-197708
　ところで、センサ一体型カバーガラスにおいて、耐久性に優れたタッチパネルを実現するためには、操作を行われるカバーガラスが十分な強度を有することが重要である。
　そのため、センサ一体型カバーガラスでは、カバーガラスと同等もしくはそれ以上の強度を確保することが求められている。 By the way, in the sensor-integrated cover glass, in order to realize a touch panel with excellent durability, it is important that the cover glass to be operated has sufficient strength.
For this reason, the sensor-integrated cover glass is required to have a strength equal to or higher than that of the cover glass.
　本発明の目的は、静電容量型タッチパネルに用いられる、カバーガラスに位置検出用の透明導電膜等を形成してなるセンサ一体型カバーガラスであって、耐久性に優れる静電容量型タッチパネルを実現可能なセンサ一体型カバーガラスを提供することにある。 SUMMARY OF THE INVENTION An object of the present invention is a sensor-integrated cover glass used for a capacitive touch panel, in which a transparent conductive film for position detection, etc. is formed on a cover glass, and the capacitive touch panel having excellent durability. The object is to provide a sensor-integrated cover glass that can be realized.
　本発明の一態様のセンサ一体型カバーガラスは、ガラス板と、前記ガラス板の一方の面に形成され、第１の方向に延在する第１の透明導電膜および前記第１の方向とは異なる方向に延在する第２の透明導電膜と、前記ガラス板と、前記第１の透明導電膜および前記第２の透明導電膜との間に形成される透明な有機化合物からなる下地絶縁膜とを備える。 The sensor-integrated cover glass of one embodiment of the present invention includes a glass plate, a first transparent conductive film formed on one surface of the glass plate, and extending in a first direction, and the first direction. A base insulating film made of a transparent organic compound formed between the second transparent conductive film extending in different directions, the glass plate, the first transparent conductive film, and the second transparent conductive film With.
　本発明のセンサ一体型カバーガラスにおいて、前記第１の透明導電膜と前記第２の透明導電膜とは、一方が他方を覆うように交差する交差部を形成し、前記交差部において前記第１の透明導電膜と前記第２の透明導電膜との間に交差部絶縁膜を有することが好ましい。 In the sensor-integrated cover glass of the present invention, the first transparent conductive film and the second transparent conductive film form an intersection where one of the first transparent conductive film and the second transparent conductive film covers the other, and the first transparent conductive film covers the first transparent conductive film. It is preferable to have an intersection insulating film between the transparent conductive film and the second transparent conductive film.
　本発明のセンサ一体型カバーガラスにおいて、前記下地絶縁膜は、前記ガラス板と、前記第１の透明導電膜および前記第２の透明導電膜との間にのみ形成されていることが好ましい。 In the sensor-integrated cover glass of the present invention, it is preferable that the base insulating film is formed only between the glass plate and the first transparent conductive film and the second transparent conductive film.
　本発明のセンサ一体型カバーガラスにおいて、前記下地絶縁膜は、少なくとも前記第１の透明導電膜および前記第２の透明導電膜の形成された領域において、前記ガラス板を全面的に覆うように形成されていることが好ましい。 In the sensor-integrated cover glass of the present invention, the base insulating film is formed so as to cover the glass plate entirely in at least a region where the first transparent conductive film and the second transparent conductive film are formed. It is preferable that
　また、前記下地絶縁膜は、前記第１の透明導電膜と前記第２の透明導電膜とが交差する前記交差部と前記ガラス板との間には形成されていないことが好ましい。 Further, it is preferable that the base insulating film is not formed between the glass plate and the intersection where the first transparent conductive film and the second transparent conductive film intersect.
　さらに、前記交差部絶縁膜が、前記交差部以外の前記ガラス板と、前記第１の透明導電膜および前記第２の透明導電膜との間まで延在して形成されていることが好ましい。 Furthermore, it is preferable that the intersection insulating film is formed to extend between the glass plate other than the intersection and the first transparent conductive film and the second transparent conductive film.
　上記構成を有する本発明のセンサ一体型カバーガラスは、静電容量型タッチパネルに用いられる、カバーガラスに位置検出用の透明導電膜等を形成してなるセンサ一体型カバーガラスであって、耐久性に優れる静電容量型タッチパネルを実現可能なセンサ一体型カバーガラスを提供することができる。 The sensor-integrated cover glass of the present invention having the above-described configuration is a sensor-integrated cover glass that is used in a capacitive touch panel and is formed by forming a transparent conductive film for position detection on the cover glass, and has durability. It is possible to provide a sensor-integrated cover glass that can realize an excellent capacitive touch panel.
図１（Ａ）～１（Ｄ）は、本発明のセンサ一体型カバーガラスの一例を概念的に示す図で、図１（Ａ）は平面図、図１（Ｂ）は図１（Ａ）のｂ－ｂ線断面、図１（Ｃ）は図１（Ａ）のｃ－ｃ線断面、図１（Ｄ）は端部近傍の断面である。1 (A) to 1 (D) are diagrams conceptually showing an example of the sensor-integrated cover glass of the present invention, FIG. 1 (A) is a plan view, and FIG. 1 (B) is FIG. 1 (A). FIG. 1C is a cross section taken along the line cc of FIG. 1A, and FIG. 1D is a cross section near the end. 図２は、図１（Ａ）～１（Ｄ）に示すセンサ一体型カバーガラスの構成を説明するための平面図である。FIG. 2 is a plan view for explaining the configuration of the sensor-integrated cover glass shown in FIGS. 1 (A) to 1 (D). 図３は、図１（Ａ）～１（Ｄ）に示すセンサ一体型カバーガラスの製造方法の一例を示すフローチャートである。FIG. 3 is a flowchart showing an example of a method for manufacturing the sensor-integrated cover glass shown in FIGS. 1 (A) to 1 (D). 図４（Ａ）～４（Ｃ）は、センサ一体型カバーガラスの別の実施形態を概念的に示す図で、図４（Ａ）は平面図、図４（Ｂ）は図４（Ａ）のｂ－ｂ線断面、図４（Ｃ）は図４（Ａ）のｃ－ｃ線断面である。4 (A) to 4 (C) are diagrams conceptually showing another embodiment of the sensor-integrated cover glass, FIG. 4 (A) is a plan view, and FIG. 4 (B) is FIG. 4 (A). FIG. 4C is a cross-sectional view taken along the line cc of FIG. 4A. 図５（Ａ）及び５（Ｂ）は、本発明の実施例における各サンプルの面強度を測定するための試験方法を概念的に示す図で、図５（Ａ）は平面図、図５（Ｂ）は側面図である。5 (A) and 5 (B) are diagrams conceptually showing a test method for measuring the surface strength of each sample in the example of the present invention. FIG. 5 (A) is a plan view, and FIG. B) is a side view.
　以下、本発明のセンサ一体型カバーガラスについて、添付の図面に示される好適な例を基に、詳細に説明する。 Hereinafter, the sensor-integrated cover glass of the present invention will be described in detail based on a suitable example shown in the accompanying drawings.
　図１（Ａ）～１（Ｄ）に、本発明のセンサ一体型カバーガラスの一例を概念的に示す。
　なお、図１（Ａ）～１（Ｄ）において、図１（Ａ）は、平面図すなわちセンサ一体型カバーガラス１０をガラス板１２の面方向（以下、この方向を、単に面方向とする）と直交する方向から見た際の一部であり、図１（Ｂ）は、図１（Ａ）のｂ－ｂ線断面を、図１（Ｃ）は、図１（Ａ）のｃ－ｃ線断面を、それぞれ示す図である。さらに、図１（Ｄ）は、センサ一体型カバーガラス１０の、ｘ方向の端部近傍のｘ方向の断面を概念的に示す図である。 1A to 1D conceptually show an example of a sensor-integrated cover glass of the present invention.
1A to 1D, FIG. 1A is a plan view, that is, a sensor-integrated cover glass 10 in a surface direction of a glass plate 12 (hereinafter, this direction is simply referred to as a surface direction). FIG. 1B is a cross-sectional view taken along line bb in FIG. 1A, and FIG. 1C is a cross-sectional view taken along line cc in FIG. 1A. It is a figure which shows a line cross section, respectively. Further, FIG. 1D is a diagram conceptually showing a cross section in the x direction of the sensor integrated cover glass 10 in the vicinity of the end portion in the x direction.
　図示例において、センサ一体型カバーガラス１０は、基本的に、ガラス板１２を基板として形成され、第１透明導電膜１４、第２透明導電膜１６および遮光膜１８と、遮光膜１８の上に形成される金属配線２０と、これらを覆ってガラス板１２の上に形成される保護絶縁膜２４とを有して構成される（図１（Ａ）では、保護絶縁膜２４は省略されており、遮光膜１８および金属配線２０は、後述する図２に記載されている）。また、第１透明導電膜１４と第２透明導電膜１６との間に交差部絶縁膜２８が設けられている。 In the illustrated example, the sensor-integrated cover glass 10 is basically formed using the glass plate 12 as a substrate, and is formed on the first transparent conductive film 14, the second transparent conductive film 16, the light shielding film 18, and the light shielding film 18. The metal wiring 20 to be formed and the protective insulating film 24 that covers these and is formed on the glass plate 12 are configured (in FIG. 1A, the protective insulating film 24 is omitted). The light shielding film 18 and the metal wiring 20 are described in FIG. 2 described later). An intersection insulating film 28 is provided between the first transparent conductive film 14 and the second transparent conductive film 16.
　また、本発明のセンサ一体型カバーガラス１０は、ガラス板１２と、第１透明導電膜１４および第２透明導電膜１６との間に、下地絶縁膜２６を有する。
　本発明のセンサ一体型カバーガラスは、図示例の構成に限定はされず、静電容量形タッチパネルを操作する面を構成するガラス板に、センサを構成する透明導電膜等を形成してなる、公知のセンサ一体型カバーガラスの構成が、各種、利用可能である。 The sensor-integrated cover glass 10 of the present invention has a base insulating film 26 between the glass plate 12 and the first transparent conductive film 14 and the second transparent conductive film 16.
The sensor-integrated cover glass of the present invention is not limited to the configuration of the illustrated example, and is formed by forming a transparent conductive film or the like that constitutes the sensor on a glass plate that constitutes a surface on which the capacitive touch panel is operated. Various configurations of known sensor-integrated cover glass can be used.
　本発明のセンサ一体型カバーガラス１０は、静電容量型タッチパネルを構成するものである。図１（Ｂ）に示すように、このセンサ一体型カバーガラス１０においては、ガラス板１２の、第１透明導電膜１４や第２透明導電膜１６等が形成されていない側の表面（主面）１２ａが、操作を行う面となる。以下、ガラス板１２において、操作が行われる面１２ａを操作面１２ａ、第１透明導電膜１４および第２透明導電膜１６等が形成される面をセンサ面１２ｂとする。
　すなわち、センサ一体型カバーガラス１０において、ガラス板１２は、静電容量形タッチパネルの操作面１２ａを構成するカバーガラスとしての機能と、センサとして機能する第１透明導電膜１４および第２透明導電膜１６等が形成されるセンサガラスとしての機能とを、併せ持っている。 The sensor-integrated cover glass 10 of the present invention constitutes a capacitive touch panel. As shown in FIG. 1B, in this sensor-integrated cover glass 10, the surface (main surface) of the glass plate 12 on the side where the first transparent conductive film 14, the second transparent conductive film 16 and the like are not formed. ) 12a is the surface on which the operation is performed. Hereinafter, in the glass plate 12, the surface on which the operation is performed is referred to as the operation surface 12a, and the surface on which the first transparent conductive film 14, the second transparent conductive film 16, and the like are formed is referred to as the sensor surface 12b.
That is, in the sensor-integrated cover glass 10, the glass plate 12 functions as a cover glass that constitutes the operation surface 12a of the capacitive touch panel, and the first transparent conductive film 14 and the second transparent conductive film that function as sensors. 16 has a function as a sensor glass on which 16 or the like is formed.
　センサ一体型カバーガラス１０において、ガラス板１２は、公知のタッチセンサにおいて、操作面を構成するカバーガラスとして利用可能なガラス板が、各種、利用可能である。すなわち、ガラス板１２には、組成、フロート法やフュージョン法などの製造方法などの制限は無い。 In the sensor-integrated cover glass 10, various types of glass plates that can be used as a cover glass constituting an operation surface in a known touch sensor can be used as the glass plate 12. That is, the glass plate 12 is not limited in terms of composition, manufacturing method such as a float method or a fusion method.
　ガラス板１２としては、一例として、前述の化学強化ガラスや物理強化ガラス等の強化ガラス、ソーダライムガラス、無アルカリガラス等が例示される。中でも、アルミノシリケート化学強化ガラス，ソーダライム化学強化ガラス等は、好適に利用される。 Examples of the glass plate 12 include tempered glass such as the above-described chemically tempered glass and physical tempered glass, soda lime glass, alkali-free glass, and the like. Among these, aluminosilicate chemically tempered glass, soda lime chemically tempered glass, and the like are preferably used.
　ガラス板１２の厚さは、公知のタッチセンサに用いられるカバーガラスと同様でよい。なお、ガラス板１２の厚さは、通常、０．３～１．５ｍｍであり、好ましくは、０．５～１．１ｍｍである。 The thickness of the glass plate 12 may be the same as that of a cover glass used for a known touch sensor. The thickness of the glass plate 12 is usually 0.3 to 1.5 mm, preferably 0.5 to 1.1 mm.
　センサ一体型カバーガラス１０は、このようなガラス板１２を基板として、センサ面１２ｂ上に第１透明導電膜１４、第２透明導電膜１６、および、遮光膜１８が形成される。
　また、第１透明導電膜１４および第２透明導電膜１６と、ガラス板１２との間には、下地絶縁膜２６が形成される。この下地絶縁膜２６に関しては、後に詳述する。なお、下地絶縁膜２６と第１透明導電膜１４および第２透明導電膜１６との間に別の膜が設けられていても構わない。例えばＳｉＯ2等の無機膜が設けられていても構わない。 In the sensor-integrated cover glass 10, the first transparent conductive film 14, the second transparent conductive film 16, and the light shielding film 18 are formed on the sensor surface 12b using such a glass plate 12 as a substrate.
A base insulating film 26 is formed between the first transparent conductive film 14 and the second transparent conductive film 16 and the glass plate 12. The underlying insulating film 26 will be described in detail later. Note that another film may be provided between the base insulating film 26 and the first transparent conductive film 14 and the second transparent conductive film 16. For example, an inorganic film such as SiO 2 may be provided.
　センサ一体型カバーガラス１０において、第１透明導電膜１４および第２透明導電膜１６は、入力位置を検出するためのものである（入力位置検出用の透明電極）。すなわち、第１透明導電膜１４および第２透明導電膜１６は、入力位置を検出するセンサを構成するものである。
　以下の説明では、第１透明導電膜１４と第２透明導電膜１６とを区別する必要が無い場合には、両者をまとめて透明導電膜１４および１６とも言う。 In the sensor integrated cover glass 10, the first transparent conductive film 14 and the second transparent conductive film 16 are for detecting an input position (transparent electrode for input position detection). That is, the 1st transparent conductive film 14 and the 2nd transparent conductive film 16 comprise the sensor which detects an input position.
In the following description, when it is not necessary to distinguish the first transparent conductive film 14 and the second transparent conductive film 16, both are collectively referred to as transparent conductive films 14 and 16.
　図示例のセンサ一体型カバーガラス１０において、第１透明導電膜１４は、図中ｘ方向に延在して、このｘ方向と直交するｙ方向に、複数が配列される。他方、第２透明導電膜１６は、図中ｙ方向に延在して、ｘ方向に、複数が配列される。
　図１（Ａ）に示すように、第１透明導電膜１４は、矩形の大面積部（パッド部）１４ａを延在方向すなわちｘ方向に所定間隔で配列して、接続部１４ｂで接続してなる構成を有していても構わない。また、第２透明導電膜１６も、同じく、矩形の大面積部１６ａを延在方向すなわちｙ方向に所定間隔で配列して、接続部１６ｂで接続してなる構成を有していても構わない。
　大面積部１４ａおよび大面積部１６ａは、互いに離間して、ｘ方向およびｙ方向に交互になるように配列され、入力位置検出を向上させるために設けられる。従って、第１透明導電膜１４と第２透明導電膜１６とは、接続部１４ｂと接続部１６ｂとで交差するように形成される。 In the sensor-integrated cover glass 10 of the illustrated example, the first transparent conductive film 14 extends in the x direction in the drawing, and a plurality of first transparent conductive films 14 are arranged in the y direction orthogonal to the x direction. On the other hand, the second transparent conductive film 16 extends in the y direction in the drawing, and a plurality of the second transparent conductive films 16 are arranged in the x direction.
As shown in FIG. 1A, the first transparent conductive film 14 includes rectangular large area portions (pad portions) 14a arranged at predetermined intervals in the extending direction, that is, the x direction, and connected by a connecting portion 14b. You may have the structure which becomes. Similarly, the second transparent conductive film 16 may have a configuration in which rectangular large-area portions 16a are arranged at predetermined intervals in the extending direction, that is, the y direction, and are connected by the connection portions 16b. .
The large area portion 14a and the large area portion 16a are arranged to be spaced apart from each other and alternately arranged in the x direction and the y direction, and are provided to improve input position detection. Accordingly, the first transparent conductive film 14 and the second transparent conductive film 16 are formed so as to intersect at the connection portion 14b and the connection portion 16b.
　図１（Ａ）および１（Ｃ）に示すように、第１透明導電膜１４と第２透明導電膜１６との交差部すなわち接続部１４ｂと接続部１６ｂとの交差部では、第２透明導電膜１６をｘ方向に跨ぐように交差部絶縁膜２８が形成されている。
　また、この交差部においては、第１透明導電膜１４は、この交差部絶縁膜２８の上に、交差部絶縁膜２８および第２透明導電膜１６をｘ方向に跨ぐように形成されている。
　これにより、第１透明導電膜１４と第２透明導電膜１６とを絶縁状態で交差させるジャンパ部（交差部）が形成され、互いに交差して形成される第１透明導電膜１４と第２透明導電膜１６との絶縁状態が保たれる。 As shown in FIGS. 1 (A) and 1 (C), the second transparent conductive film is formed at the intersection of the first transparent conductive film 14 and the second transparent conductive film 16, that is, at the intersection of the connection portion 14b and the connection portion 16b. An intersection insulating film 28 is formed so as to straddle the film 16 in the x direction.
At the intersection, the first transparent conductive film 14 is formed on the intersection insulating film 28 so as to straddle the intersection insulating film 28 and the second transparent conductive film 16 in the x direction.
As a result, a jumper portion (intersection) that intersects the first transparent conductive film 14 and the second transparent conductive film 16 in an insulating state is formed, and the first transparent conductive film 14 and the second transparent film formed to intersect each other. The insulation state with the conductive film 16 is maintained.
　本発明のセンサ一体型カバーガラス１０において、透明導電膜１４および１６の形成材料は、静電容量型のタッチセンサにおいてセンサ部を形成するために用いられる、公知の透明（光透過性を有する）な導電性材料が、各種、利用可能である。
　具体的には、ＩＴＯ（酸化インジウムスズ）、ＩＺＯ（酸化インジウム亜鉛）等が例示される。中でも、ＩＴＯは、好適に利用される。
　透明導電膜１４および１６の厚さは、形成材料等に応じて、適宜、決定すればよい。なお、透明導電膜１４および１６の厚さは、通常、２０～１００ｎｍ程度である。 In the sensor-integrated cover glass 10 of the present invention, the material for forming the transparent conductive films 14 and 16 is a known transparent (having light transmittance) used for forming a sensor portion in a capacitive touch sensor. Various kinds of conductive materials can be used.
Specific examples include ITO (indium tin oxide) and IZO (indium zinc oxide). Among these, ITO is preferably used.
The thickness of the transparent conductive films 14 and 16 may be appropriately determined according to the forming material or the like. The thickness of the transparent conductive films 14 and 16 is usually about 20 to 100 nm.
　交差部絶縁膜２８の形成材料は、公知の透明な絶縁性材料が、各種、利用可能である。具体的には、アクリル系、ポリイミド系等の各種フォトレジスト等が例示される。
　また、交差部絶縁膜２８の厚さは、形成材料等に応じて、適宜、決定すればよい。なお、交差部絶縁膜２８の厚さは、通常、０．８～２．０μｍ程度である。 As the material for forming the crossing insulating film 28, various known transparent insulating materials can be used. Specifically, various photoresists such as acrylic and polyimide are exemplified.
In addition, the thickness of the intersection insulating film 28 may be appropriately determined according to the forming material or the like. Note that the thickness of the intersection insulating film 28 is usually about 0.8 to 2.0 μm.
　図２は、センサ一体型カバーガラス１０の構成を説明するための平面図である。図２において、遮光膜１８は、ガラス板１２のセンサ面外周部に形成される、遮光性を有する絶縁性の膜である。
　遮光膜１８は、センサ一体型カバーガラス１０と組み合わされるディスプレイからの漏れ光の遮光、同ディスプレイを駆動するための配線やＩＣの隠蔽、後述する金属配線２０の隠蔽等のために設けられる。
　遮光膜１８の厚さは、適宜、変更可能である。なお、遮光膜１８の厚さは、通常０．８～２．０μｍ程度である。 FIG. 2 is a plan view for explaining the configuration of the sensor-integrated cover glass 10. In FIG. 2, the light shielding film 18 is an insulating film having a light shielding property formed on the outer peripheral portion of the sensor surface of the glass plate 12.
The light shielding film 18 is provided for shielding light leaked from the display combined with the sensor-integrated cover glass 10, concealing wiring and IC for driving the display, concealing metal wiring 20 described later, and the like.
The thickness of the light shielding film 18 can be changed as appropriate. The thickness of the light shielding film 18 is usually about 0.8 to 2.0 μm.
　なお、本発明のセンサ一体型カバーガラス１０において、遮光膜１８は、好ましい態様として設けられる。 In the sensor-integrated cover glass 10 of the present invention, the light shielding film 18 is provided as a preferred embodiment.
　図２および図１（Ｄ）に示すように、遮光膜１８（遮光膜１８上の下地絶縁膜２６）の上（センサ面１２ｂ）には、金属配線２０が形成される。
　金属配線２０は、第１透明導電膜１４および第２透明導電膜１６の数に応じて、複数が形成されており、個々の金属配線２０は、一端が、第１透明導電膜１４もしくは第２透明導電膜１６に接続される。また、個々の金属配線２０の他端側は、例えば、センサ一体型カバーガラス１０に組み合わされるディスプレイに接続されるフレキシブル配線基板３０に接続される。
　この金属配線２０を有することにより、ＩＴＯ等からなる透明導電膜の導電性の低さを補って、センサからの信号を容易に取り出すことが可能になる。 As shown in FIGS. 2 and 1D, the metal wiring 20 is formed on the light shielding film 18 (the base insulating film 26 on the light shielding film 18) (sensor surface 12b).
A plurality of metal wirings 20 are formed according to the number of the first transparent conductive film 14 and the second transparent conductive film 16, and one end of each metal wiring 20 is the first transparent conductive film 14 or the second transparent conductive film 14. Connected to the transparent conductive film 16. Moreover, the other end side of each metal wiring 20 is connected to the flexible wiring board 30 connected to the display combined with the sensor integrated cover glass 10, for example.
By having the metal wiring 20, it is possible to easily take out a signal from the sensor while compensating for the low conductivity of the transparent conductive film made of ITO or the like.
　本発明のセンサ一体型カバーガラス１０において、金属配線２０は、タッチパネルにおいて、各種の金属材料が利用可能である。
　具体的には、Ｍｏ／Ａｌ／Ｍｏの３層の金属材料（ＭＡＭ）、Ｍｏ－Ｎｂ合金／Ａｌ／Ｍｏ－Ｎｂ合金の３層の金属材料、Ｍｏ－Ｎｂ合金／Ａｌ－Ｎｂ合金／Ｍｏ－Ｎｂ合金の３層の金属材料等が例示される。
　金属配線２０の厚さは、使用する材料の導電性や可能な配線の幅等に応じて、適宜、決定すればよい。なお、金属配線２０の厚さは、通常、０．３～０．５μｍ程度である。
　本発明のセンサ一体型カバーガラスにおいては、この金属配線２０も、好ましい態様として設けられる。 In the sensor-integrated cover glass 10 of the present invention, various metal materials can be used for the metal wiring 20 in the touch panel.
Specifically, a three-layer metal material (MAM) of Mo / Al / Mo, a three-layer metal material of Mo—Nb alloy / Al / Mo—Nb alloy, Mo—Nb alloy / Al—Nb alloy / Mo— Examples of the metal material include three layers of Nb alloy.
What is necessary is just to determine the thickness of the metal wiring 20 suitably according to the electroconductivity of the material to be used, the width | variety of possible wiring, etc. FIG. The thickness of the metal wiring 20 is usually about 0.3 to 0.5 μm.
In the sensor-integrated cover glass of the present invention, this metal wiring 20 is also provided as a preferred embodiment.
　上述した金属配線２０上には保護絶縁膜２４が設けられているが、全てが保護絶縁膜２４に覆われるわけではなく、必要な部分は外部に露出している。例えば、金属配線２０は、ディスプレイ等に接続されるフレキシブル配線基板３０との接続部のみは、保護絶縁膜２４に覆われず、露出している。 Although the protective insulating film 24 is provided on the metal wiring 20 described above, not all of the protective insulating film 24 is covered with the protective insulating film 24, and necessary portions are exposed to the outside. For example, the metal wiring 20 is not covered with the protective insulating film 24 but exposed only at the connection portion with the flexible wiring substrate 30 connected to a display or the like.
　本発明のセンサ一体型カバーガラス１０において、保護絶縁膜２４は、センサ一体型カバーガラスの保護膜を形成するために用いられる、公知の透明な絶縁性材料が、各種、利用可能であり、交差部絶縁膜２８と同様の材料を使用することが出来る。
　また、保護絶縁膜２４の厚さは、形成材料や、ガラス板１２のセンサ面に形成される各種の部位の厚さ等に応じて、これらを覆い、かつ、保護層として十分に作用する厚さを、適宜、設定すればよい。なお、保護絶縁膜２４の厚さは、通常、０．８～２．０μｍである。 In the sensor-integrated cover glass 10 of the present invention, as the protective insulating film 24, various known transparent insulating materials used for forming the protective film of the sensor-integrated cover glass can be used. A material similar to that of the partial insulating film 28 can be used.
Further, the thickness of the protective insulating film 24 is a thickness that sufficiently covers the material and functions as a protective layer according to the forming material, the thickness of various portions formed on the sensor surface of the glass plate 12, and the like. What is necessary is just to set suitably. The thickness of the protective insulating film 24 is usually 0.8 to 2.0 μm.
　前述のように、本発明のセンサ一体型カバーガラス１０において、ガラス板１２と、第１透明導電膜１４および第２透明導電膜１６との間には、下地絶縁膜２６が形成される。なお、図示例では、図１（Ｄ）に示すように、下地絶縁膜２６は、ガラス板１２と透明導電膜１４および１６との間のみならず、遮光膜１８の上まで形成されている。
　下地絶縁膜２６は、本発明の特徴的な部位で、透明で絶縁性を有する、有機化合物からなる膜である。
　本発明のセンサ一体型カバーガラス１０は、この下地絶縁膜２６を有することにより、ガラス板１２の強度を大幅に向上し、耐久性に優れる、スマートフォンやタブレット型コンピュータ等のタッチセンサを実現している。 As described above, in the sensor-integrated cover glass 10 of the present invention, the base insulating film 26 is formed between the glass plate 12 and the first transparent conductive film 14 and the second transparent conductive film 16. In the illustrated example, as shown in FIG. 1D, the base insulating film 26 is formed not only between the glass plate 12 and the transparent conductive films 14 and 16 but also on the light shielding film 18.
The base insulating film 26 is a characteristic part of the present invention, and is a film made of an organic compound that is transparent and has an insulating property.
The sensor-integrated cover glass 10 according to the present invention has the underlying insulating film 26 to significantly improve the strength of the glass plate 12 and realize a touch sensor such as a smartphone or a tablet computer that has excellent durability. Yes.
　すなわち、本発明者は、検討の結果、従来のセンサ一体型カバーガラスでは、ガラス板のセンサ面の面強度が弱いことを見出した。 That is, as a result of investigation, the present inventor has found that the surface strength of the sensor surface of the glass plate is weak in the conventional sensor-integrated cover glass.
　前述のように、センサ一体型カバーガラスが組み込まれた機器の操作は、透明導電膜が形成されている面であるセンサ面とは反対側の、操作面で行われる。すなわち、ガラス板は、操作面側から押圧力を受けるのが通常であり、センサ面には、引張応力がかかる。
　従って、ガラス板において、引張応力がかかるセンサ面の面強度が低いというのは、センサ一体型カバーガラスでは、重大な問題となりうる。 As described above, the operation of the device in which the sensor-integrated cover glass is incorporated is performed on the operation surface on the side opposite to the sensor surface on which the transparent conductive film is formed. That is, the glass plate usually receives a pressing force from the operation surface side, and a tensile stress is applied to the sensor surface.
Therefore, in the glass plate, the low surface strength of the sensor surface to which tensile stress is applied can be a serious problem in the sensor-integrated cover glass.
　本発明は、上記問題に対応するために成されたものであり、センサ一体型カバーガラス１０のセンサ面１２ｂにおいて、ガラス板１２と透明導電膜１４および１６との間に、有機化合物からなり、かつ、透明で絶縁性を有する下地絶縁膜２６を有する。 The present invention is made in order to cope with the above-described problem. In the sensor surface 12b of the sensor-integrated cover glass 10, the glass plate 12 and the transparent conductive films 14 and 16 are made of an organic compound, In addition, the base insulating film 26 is transparent and has an insulating property.
　本発明のセンサ一体型カバーガラス１０において、下地絶縁膜２６の形成材料は、有機化合物からなり、かつ、十分な透明性および絶縁性を有するものであれば、各種の材料が利用可能である。具体的には、透明なエポキシ樹脂、アクリル樹脂、その他光硬化性樹脂や熱硬化性樹樹脂、各種フォトレジスト等が例示される。ここで、十分な透明性とは可視光領域（波長４００ｎｍ～７００ｎｍ）における透過率が８５％以上のことを指す。また、十分な絶縁性とは、抵抗率が１Ｅ１２（Ω／□）以上、より好ましくは１Ｅ１４（Ω／□）以上のことを指す。 In the sensor-integrated cover glass 10 of the present invention, various materials can be used as long as the base insulating film 26 is made of an organic compound and has sufficient transparency and insulation. Specifically, transparent epoxy resin, acrylic resin, other photo-curing resin, thermosetting resin, various photoresists and the like are exemplified. Here, sufficient transparency means that the transmittance in the visible light region (wavelength 400 nm to 700 nm) is 85% or more. In addition, sufficient insulation means that the resistivity is 1E12 (Ω / □) or more, more preferably 1E14 (Ω / □) or more.
　下地絶縁膜２６の厚さは、適宜、設定することができる。本発明者の検討によれば、下地絶縁膜２６の厚さは、０．８～２．０μｍが好ましく、特に、１．０～１．５μｍが好ましい。 The thickness of the base insulating film 26 can be set as appropriate. According to the study of the present inventor, the thickness of the base insulating film 26 is preferably 0.8 to 2.0 μm, and more preferably 1.0 to 1.5 μm.
　図１（Ｄ）に示すように、下地絶縁膜２６は、ガラス板１２と透明導電膜１４および１６との間のみならず、遮光膜１８の上まで形成されている。しかしながら、本発明は、これに限定はされず、下地絶縁膜２６は、遮光膜１８の上には形成せずに、遮光膜１８の内側のみに設けてもよい。 As shown in FIG. 1D, the base insulating film 26 is formed not only between the glass plate 12 and the transparent conductive films 14 and 16 but also on the light shielding film 18. However, the present invention is not limited to this, and the base insulating film 26 may be provided only inside the light shielding film 18 without being formed on the light shielding film 18.
　さらに、図１（Ｃ）及び１（Ｄ）に示すように、下地絶縁膜２６は、センサ面１２ｂの上に全面的に形成されている。しかしながら、本発明は、これに限定はされず、下地絶縁膜２６は、センサ面１２ｂの上の透明導電膜１４および１６が無い部分には形成せずに、透明導電膜１４および１６とガラス板１２との間のみに形成してもよい。すなわち、本発明において、下地絶縁膜２６は、少なくとも、透明導電膜１４および１６と、ガラス板１２との間に形成すればよい。
　なお、このように、下地絶縁膜２６のパターニングを行う必要が有る場合には、下地絶縁膜２６は、フォトレジストで形成するのが好ましい。 Further, as shown in FIGS. 1C and 1D, the base insulating film 26 is entirely formed on the sensor surface 12b. However, the present invention is not limited to this, and the base insulating film 26 is not formed on the portion of the sensor surface 12b where the transparent conductive films 14 and 16 are absent, and the transparent conductive films 14 and 16 and the glass plate are not formed. You may form only between 12. That is, in the present invention, the base insulating film 26 may be formed at least between the transparent conductive films 14 and 16 and the glass plate 12.
Note that, when it is necessary to pattern the base insulating film 26 as described above, the base insulating film 26 is preferably formed of a photoresist.
　以下、図３のフローチャートを参照して、センサ一体型カバーガラス１０の製造方法の一例を説明する。
　なお、本発明のセンサ一体型カバーガラス１０は、この手順で製造するのに限定はされない。例えば、金属配線を透明導電膜の形成後に形成する等、透明導電膜１４および１６とガラス板１２との間に下地絶縁膜２６を形成できれば、公知のセンサ一体型カバーガラスで用いられている各種の手順での製造方法が利用可能である。
　また、各膜の形成方法も、以下に示す例に限定はされず、膜の形成材料等に応じて、公知のセンサ一体型カバーガラスで用いられている各種の方法が利用可能である。 Hereinafter, an example of a method for manufacturing the sensor-integrated cover glass 10 will be described with reference to the flowchart of FIG.
Note that the sensor-integrated cover glass 10 of the present invention is not limited to be manufactured by this procedure. For example, if the base insulating film 26 can be formed between the transparent conductive films 14 and 16 and the glass plate 12, such as forming a metal wiring after the formation of the transparent conductive film, various types used in known sensor-integrated cover glasses. The manufacturing method according to the procedure can be used.
Also, the method for forming each film is not limited to the examples shown below, and various methods used in known sensor-integrated cover glasses can be used depending on the film forming material and the like.
　まず、素材となるガラス板を準備して、このガラス板に化学強化を施して、ガラス板１２を作製する。化学強化は、公知の方法で行えばよい。
　次いで、アクティブエリアＡとなる領域を囲むように（図２参照）、ガラス板１２に遮光膜１８を印刷する。遮光膜１８の印刷は、タッチパネルの製造で利用されている公知の方法によればよい。なお、遮光膜１８の形成は、必要に応じて行えばよいのは、前述のとおりである。 First, the glass plate used as a raw material is prepared, and this glass plate is chemically strengthened to produce the glass plate 12. Chemical strengthening may be performed by a known method.
Next, a light shielding film 18 is printed on the glass plate 12 so as to surround an area to be the active area A (see FIG. 2). The light shielding film 18 may be printed by a known method used in the manufacture of touch panels. As described above, the light shielding film 18 may be formed as necessary.
　次いで、下地絶縁膜２６となる膜を成膜して、必要に応じて、パターニング等を行って下地絶縁膜２６を形成する。
　下地絶縁膜２６の成膜方法には、特に限定はなく、公知の有機化合物からなる膜の成膜方法が、各種、利用可能である。
　また、パターニングを行う際にも、下地絶縁膜２６の形成材料に応じた、公知の方法で行えばよい。 Next, a film to be the base insulating film 26 is formed, and patterning or the like is performed as necessary to form the base insulating film 26.
The method for forming the base insulating film 26 is not particularly limited, and various methods for forming a film made of a known organic compound can be used.
Further, when patterning is performed, a known method corresponding to the material for forming the base insulating film 26 may be used.
　次いで、後に第２透明導電膜１６の一部となる交差部透明導電膜１６ｃとなるＩＴＯ等を下地絶縁膜２６上に全面に成膜し、パターニングを行う。ＩＴＯ等の成膜は、スパッタリング等の公知の方法で行えばよい。パターニングもフォトリソグラフィを利用する方法等の公知の方法で行えばよい。
　次いで、絶縁膜を交差部透明導電膜１６ｃ上に成膜して、交差部透明導電膜１６ｃ以外の領域と交差部透明導電膜１６ｃの一部を露出させるようにパターニングを行い、交差部絶縁膜２８を形成する。成膜方法およびパターニングは、交差部絶縁膜２８の形成材料に応じた公知の方法で行えばよい。 Next, ITO or the like, which will later become a part of the second transparent conductive film 16, which will become the intersection transparent conductive film 16 c, is formed on the entire surface of the base insulating film 26 and patterned. The ITO film may be formed by a known method such as sputtering. Patterning may be performed by a known method such as a method using photolithography.
Next, an insulating film is formed on the intersection transparent conductive film 16c, and patterning is performed so as to expose a region other than the intersection transparent conductive film 16c and a part of the intersection transparent conductive film 16c. 28 is formed. The film forming method and patterning may be performed by a known method according to the material for forming the intersection insulating film 28.
　次いで、第１透明導電膜１４および交差部透明導電膜１６ｃを除く第２透明導電膜１６となるＩＴＯ等を成膜して、パターニングを行うことで、透明センサ配線部分を完成する。先と同様、ＩＴＯ等の成膜は、スパッタリング等の公知の方法で行えばよく、パターニングも、公知の方法で行えばよい。
　さらに、遮光膜１８の上に金属配線２０を形成し、パターニングする。なお、この工程も、必要に応じて行えばよいのは、前述のとおりである。また、本実施形態では、交差部透明導電膜１６ｃと交差部絶縁膜２８を形成する工程の間に実施しているが、これに限らない。 Subsequently, ITO etc. used as the 2nd transparent conductive film 16 except the 1st transparent conductive film 14 and the crossing part transparent conductive film 16c are formed into a film, and a transparent sensor wiring part is completed by performing patterning. Similarly to the above, film formation of ITO or the like may be performed by a known method such as sputtering, and patterning may be performed by a known method.
Further, a metal wiring 20 is formed on the light shielding film 18 and patterned. As described above, this step may be performed as necessary. Moreover, in this embodiment, although implemented during the process of forming the crossing part transparent conductive film 16c and the crossing insulating film 28, it is not restricted to this.
　次いで、ガラス板１２のセンサ面１２ｂを全面的に覆うように、保護絶縁膜２４を成膜し、フレキシブル配線基板３０との接続部などの金属配線２０の必要な部分を露出するように、パターニングを行う。成膜方法およびパターニングは、保護絶縁膜２４の形成材料に応じた公知の方法で行えばよい。 Next, a protective insulating film 24 is formed so as to cover the entire sensor surface 12 b of the glass plate 12, and patterning is performed so that necessary portions of the metal wiring 20 such as a connection portion with the flexible wiring substrate 30 are exposed. I do. The film forming method and patterning may be performed by a known method corresponding to the material for forming the protective insulating film 24.
　次に、図４（Ａ）～４（Ｃ）は、本発明のセンサ一体型カバーガラスの別の実施形態を概念的に示す図である。
　なお、図４（Ａ）は図１（Ａ）と同様の部分の平面図であり、図４（Ｂ）は、図４（Ａ）のｂ－ｂ線断面を、図４（Ｃ）は、図４（Ａ）のｃ－ｃ線断面を、それぞれ示す図である。
　なお、図４（Ａ）～４（Ｃ）に示すセンサ一体型カバーガラス１０ａは、前述のセンサ一体型カバーガラス１０と同じ部材を多数有するので、同じ部材には同じ符号を付し、説明は異なる部位を主に行う。 Next, FIGS. 4 (A) to 4 (C) are views conceptually showing another embodiment of the sensor-integrated cover glass of the present invention.
4A is a plan view of the same portion as FIG. 1A, FIG. 4B is a cross-sectional view taken along the line bb of FIG. 4A, and FIG. FIG. 5 is a view showing a cross section taken along line cc of FIG.
The sensor-integrated cover glass 10a shown in FIGS. 4 (A) to 4 (C) has many of the same members as the sensor-integrated cover glass 10 described above. Do different parts mainly.
　図４（Ａ）～４（Ｃ）に示すセンサ一体型カバーガラス１０ａは、下地絶縁膜２６を有さず、かつ、ジャンパ部を形成するための透明な絶縁膜として、有機化合物を用い、この絶縁膜を、ジャンパ部のみならず、ガラス板１２のセンサ面１２ｂに全面的に形成して、交差部／下地絶縁膜３２とするものである。
　すなわち、センサ一体型カバーガラス１０ａでは、図１（Ａ）及び１（Ｃ）に示すセンサ一体型カバーガラスの交差部絶縁膜２８を形成する際に、有機化合物からなる透明な絶縁膜を、センサ面１２ｂの全面に形成することにより、前述の例の交差部絶縁膜２８と下地絶縁膜２６とを一体化してなる、交差部／下地絶縁膜３２を有する。 The sensor-integrated cover glass 10a shown in FIGS. 4A to 4C does not have the base insulating film 26, and uses an organic compound as a transparent insulating film for forming the jumper portion. The insulating film is formed not only on the jumper portion but also on the entire sensor surface 12b of the glass plate 12 to form the intersection / underlying insulating film 32.
That is, in the sensor-integrated cover glass 10a, when forming the intersection insulating film 28 of the sensor-integrated cover glass shown in FIGS. 1 (A) and 1 (C), a transparent insulating film made of an organic compound is used as the sensor. By forming over the entire surface 12b, the crossing portion / base insulating film 32 is formed by integrating the crossing portion insulating film 28 and the base insulating film 26 of the above-described example.
　具体的には、図４（Ａ）～４（Ｃ）に示すセンサ一体型カバーガラス１０ａは、図３に示すフローチャートにおいて、化学強化および遮光膜１８の印刷を行った後、下地絶縁膜２６の成膜を行わずに、交差部透明導電膜１６ｃの形成および金属配線２０の形成（金属配線エッチング）までの工程を行う。すなわち、本例においては、交差部透明導電膜１６ｃは、ガラス板１２（センサ面１２ｂ）上に、直接、形成される。
　次いで、透明な絶縁膜を全面的に成膜して、エッチング等により交差部透明導電膜１６ｃのｙ方向の両端を露出させて、交差部／下地絶縁膜３２形成する。
　以降は、同様に、交差部透明導電膜１６ｃ以外の透明導電膜１４および１６の形成、および保護絶縁膜２４の形成を行う。 Specifically, the sensor-integrated cover glass 10a shown in FIGS. 4A to 4C is formed after the chemical strengthening and printing of the light shielding film 18 in the flowchart shown in FIG. Without forming the film, the processes from the formation of the crossing transparent conductive film 16c and the formation of the metal wiring 20 (metal wiring etching) are performed. That is, in this example, the intersection transparent conductive film 16c is formed directly on the glass plate 12 (sensor surface 12b).
Next, a transparent insulating film is formed on the entire surface, and both ends in the y direction of the crossing transparent conductive film 16c are exposed by etching or the like to form a crossing / base insulating film 32.
Thereafter, similarly, the transparent conductive films 14 and 16 other than the intersection transparent conductive film 16c and the protective insulating film 24 are formed.
　すなわち、図４（Ａ）～４（Ｃ）に示すセンサ一体型カバーガラス１０ａは、ｘ方向に延在する第１透明導電膜およびｙ方向に延在する第２透明導電膜と、第１透明導電膜と第２透明導電膜との交差部の両導電膜の間、および、前記第１透明導電膜および第２透明導電膜とガラス板との間に設けられる透明な有機化合物からなる交差部／下地絶縁膜を有するものである。
　言い換えると、図１（Ａ）～１（Ｄ）に示すセンサ一体型カバーガラスにおいて、ジャンパ部の透明導電膜の下に下地絶縁膜を有さず、かつ、交差部絶縁膜が、ジャンパ部以外の第１透明導電膜および第２透明導電膜とガラス板との間まで延在して、下地絶縁膜として作用するものである。 That is, the sensor-integrated cover glass 10a shown in FIGS. 4A to 4C includes a first transparent conductive film extending in the x direction, a second transparent conductive film extending in the y direction, and a first transparent conductive film. A crossing portion made of a transparent organic compound provided between the conductive films at the crossing portion of the conductive film and the second transparent conductive film, and between the first transparent conductive film and the second transparent conductive film and the glass plate. / Having a base insulating film.
In other words, the sensor-integrated cover glass shown in FIGS. 1A to 1D does not have a base insulating film under the transparent conductive film of the jumper portion, and the cross-section insulating film is other than the jumper portion. This extends between the first transparent conductive film and the second transparent conductive film and the glass plate, and acts as a base insulating film.
　図１（Ａ）～１（Ｄ）に示されるセンサ一体型カバーガラス１０を製造する際には、下地絶縁膜の形成という工程を追加する必要が有る。これに対し、本実施形態の図４（Ａ）～４（Ｃ）に示すセンサ一体型カバーガラス１０ａは、工程数を増やさず、従来のセンサ一体型カバーガラスと同じ工程数で製造することができる。また、殆どの領域で、透明導電膜とガラス板との間に下地絶縁膜を設けることができるので、ガラス板１２のセンサ面１２ｂの面強度低下の防止効果も十分に得られる。
　一方で、図１（Ａ）～１（Ｄ）に示されるセンサ一体型カバーガラス１０は、ジャンパ部の下にも下地絶縁膜を有するので、ガラス板１２の強度的に、有利である。 When manufacturing the sensor-integrated cover glass 10 shown in FIGS. 1A to 1D, it is necessary to add a process of forming a base insulating film. On the other hand, the sensor-integrated cover glass 10a shown in FIGS. 4A to 4C of this embodiment can be manufactured with the same number of processes as the conventional sensor-integrated cover glass without increasing the number of processes. it can. Further, since the base insulating film can be provided between the transparent conductive film and the glass plate in almost all regions, the effect of preventing the surface strength of the sensor surface 12b of the glass plate 12 from being lowered can be sufficiently obtained.
On the other hand, the sensor-integrated cover glass 10 shown in FIGS. 1 (A) to 1 (D) is advantageous in terms of strength of the glass plate 12 because it has a base insulating film under the jumper portion.
　以上、本発明のセンサ一体型カバーガラスについて詳細に説明したが、本発明は、上述の例に限定はされず、本発明の要旨を逸脱しない範囲において、各種の改良や変更を行ってもよいのは、勿論である。 Although the sensor-integrated cover glass of the present invention has been described in detail above, the present invention is not limited to the above-described example, and various improvements and modifications may be made without departing from the gist of the present invention. Of course.
　次に、本発明を実施例によりさらに詳細に説明するが、本発明はこれらの実施例に何ら限定されない。
　まず、板厚０．７ｍｍのアルミノケイ酸ガラス（アルミノシリケートガラス）を用意した。このガラスを化学強化した後、５０ｍｍ角に切断を行った。
　化学強化条件の依存性を調べるため、化学強化は、異なる２種類の化学強化条件を用いて行った。各化学強化条件で得られたガラス板は、それぞれ、ＣＳ（ｃｏｍｐｒｅｓｓｉｖｅ　ｓｔｒｅｓｓ）が６４７ＭＰａでＤＯＬ（ｄｅｐｔｈ　ｏｆ　ｌａｙｅｒ）が２１μｍ、ＣＳが６３０ＭＰａでＤＯＬ４９μｍであった。
　以下、便宜的に、ＣＳが６４７ＭＰａでＤＯＬが２１μｍのガラス板をガラス板Ａ、ＣＳが６３０ＭＰａでＤＯＬ４９μｍのガラス板をガラス板Ｂとする。 EXAMPLES Next, although an Example demonstrates this invention still in detail, this invention is not limited to these Examples at all.
First, an aluminosilicate glass (aluminosilicate glass) having a thickness of 0.7 mm was prepared. After this glass was chemically strengthened, it was cut into 50 mm squares.
In order to investigate the dependence of chemical strengthening conditions, chemical strengthening was performed using two different types of chemical strengthening conditions. The glass plates obtained under each chemical strengthening condition had a CS (compressive stress) of 647 MPa, a DOL (depth of layer) of 21 μm, and a CS of 630 MPa and a DOL of 49 μm.
Hereinafter, for convenience, a glass plate having a CS of 647 MPa and a DOL of 21 μm is referred to as a glass plate A, and a glass plate having a CS of 630 MPa and a DOL of 49 μm is referred to as a glass plate B.
　続いて、得られたガラス板に、スパッタリング法によりＩＴＯ膜を全面に成膜したサンプルと、スピンコートにより下地絶縁膜を全面に成膜した後、その上に、同様に全面にＩＴＯ膜を成膜したサンプルとを作成した。ここでＩＴＯ膜は１００ｎｍ、下地絶縁膜は１．２μｍの厚さで、それぞれ成膜を行った。また、下地絶縁膜は、アクリル系樹脂を使用した。
　ガラス板ＡにＩＴＯのみを成膜したサンプルを比較例１、ガラス板ＢにＩＴＯのみを成膜したサンプルを比較例２、ガラス板Ａに下地絶縁膜およびＩＴＯを成膜したサンプルを実施例１、および、ガラス板Ｂに下地絶縁膜およびＩＴＯを成膜したサンプルを実施例２、とする。 Subsequently, a sample having an ITO film formed on the entire surface by sputtering and an underlying insulating film formed on the entire surface by spin coating on the obtained glass plate, and then an ITO film was similarly formed on the entire surface. Membrane samples were made. Here, the ITO film was formed to a thickness of 100 nm, and the base insulating film was formed to a thickness of 1.2 μm. In addition, an acrylic resin was used for the base insulating film.
A sample in which only ITO is formed on the glass plate A is Comparative Example 1, a sample in which only ITO is formed on the glass plate B is Comparative Example 2, and a sample in which the base insulating film and ITO are formed on the glass plate A is Example 1. A sample in which a base insulating film and ITO are formed on a glass plate B is referred to as Example 2.
　得られたそれぞれのサンプルに対し、図５（Ａ）及び５（Ｂ）に示すような方法で各サンプルの面強度を測定した。また、同様の面強度の測定を、ガラス板Ａおよびガラス板Ｂについても行った。
　図５（Ａ）及び５（Ｂ）はＢＯＲ（Ｂａｌｌ　ｏｎ　Ｒｉｎｇ）と呼ばれるガラス板の面強度試験方法を概念的に示す図で、図５（Ａ）は平面図、図５（Ｂ）は側面図である。図５（Ａ）及び５（Ｂ）に示すように、リング状の支持部Ｓの上に、中心を一致して、ＩＴＯの形成面を支持部Ｓ側に向けてサンプルＧを載置し、支持部Ｓの中心上からサンプルＧとの接触部が半径５ｍｍの球状の荷重部Ｌを押しつけて荷重をかけることで、各サンプルＧの面強度を測定した。支持部Ｓの直径は３０ｍｍ（支持部Ｓの中心を基準）とした。
　各サンプルおよびガラス板の面強度の測定結果を以下の表１に示す。 For each of the obtained samples, the surface strength of each sample was measured by a method as shown in FIGS. 5 (A) and 5 (B). Moreover, the same surface strength measurement was also performed on the glass plate A and the glass plate B.
5 (A) and 5 (B) are diagrams conceptually showing a surface strength test method of a glass plate called BOR (Ball on Ring), FIG. 5 (A) is a plan view, and FIG. 5 (B) is a side view. FIG. As shown in FIGS. 5 (A) and 5 (B), the sample G is placed on the ring-shaped support portion S so that the centers coincide with each other and the ITO formation surface faces the support portion S side. The surface strength of each sample G was measured by applying a load by pressing a spherical load portion L having a radius of 5 mm from the center of the support portion S. The diameter of the support portion S was 30 mm (referenced to the center of the support portion S).
The measurement results of the surface strength of each sample and glass plate are shown in Table 1 below.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
　表１の比較例１および２、ならびに、ガラス板ＡおよびＢの面強度の測定結果から分かるように、化学強化条件に係わらずガラス板上にＩＴＯを成膜すると、ＩＴＯの成膜面においてガラス板の面強度が低下している。この結果より、従来のセンサ一体型カバーガラスは、センサ面の面強度が弱いことが分かる。
　これに対し、実施例１および２、ならびに、ガラス板ＡおよびＢの面強度の測定結果から、ガラス板上にＩＴＯを成膜したとしても、下地絶縁膜を成膜することで、ガラス板のＩＴＯ成膜面が、ＩＴＯ成膜前の強度と同等の面強度を確保することが出来きることが確認された。すなわち、本発明のセンサ一体型カバーガラスによれば、センサ面の面強度を十分に確保した、耐久性に優れる、スマートフォンやタブレット型コンピュータ等のタッチセンサを実現できる。 As can be seen from Comparative Examples 1 and 2 in Table 1 and the measurement results of the surface strength of the glass plates A and B, when ITO is formed on the glass plate regardless of the chemical strengthening conditions, the glass is formed on the ITO film formation surface. The surface strength of the plate is reduced. From this result, it can be seen that the conventional sensor-integrated cover glass has low surface strength of the sensor surface.
On the other hand, from the measurement results of the surface strengths of Examples 1 and 2 and glass plates A and B, even if ITO was formed on the glass plate, by forming the base insulating film, It was confirmed that the ITO film-forming surface can secure the surface strength equivalent to the strength before the ITO film-forming. That is, according to the sensor-integrated cover glass of the present invention, it is possible to realize a touch sensor such as a smartphone or a tablet computer that has a sufficient sensor surface strength and excellent durability.
　本出願は、２０１２年８月２３日出願の日本国特許出願２０１２－１８３８３２に基づくものであり、その内容はここに参照として取り込まれる。 This application is based on Japanese Patent Application No. 2012-183832 filed on August 23, 2012, the contents of which are incorporated herein by reference.
　１０，１０ａ　センサ一体型カバーガラス
　１２　ガラス板
　１４　第１透明導電膜
　１６　第２透明導電膜
　１８　遮光膜
　２０　金属配線
　２４　保護絶縁膜
　２６　下地絶縁膜
　２８　交差部絶縁膜
　３０　フレキシブル配線基板
　３２　交差部／下地絶縁膜 DESCRIPTION OF SYMBOLS 10,10a Sensor integrated cover glass 12 Glass plate 14 1st transparent conductive film 16 2nd transparent conductive film 18 Light-shielding film 20 Metal wiring 24 Protective insulating film 26 Base insulating film 28 Intersection insulating film 30 Flexible wiring board 32 Intersection / Base insulation film

Claims (6)

  1. 　ガラス板と、
    　前記ガラス板の一方の面に形成され、第１の方向に延在する第１の透明導電膜および前記第１の方向とは異なる方向に延在する第２の透明導電膜と、
    　前記ガラス板と、前記第１の透明導電膜および前記第２の透明導電膜との間に形成される、透明な有機化合物からなる下地絶縁膜と、を備えるセンサ一体型カバーガラス。     A glass plate,
    A first transparent conductive film formed on one surface of the glass plate and extending in a first direction and a second transparent conductive film extending in a direction different from the first direction;
    A sensor-integrated cover glass comprising: the glass plate; and a base insulating film made of a transparent organic compound and formed between the first transparent conductive film and the second transparent conductive film.
  2. 　前記第１の透明導電膜と前記第２の透明導電膜とは、一方が他方を覆うように交差する交差部を形成し、前記交差部において前記第１の透明導電膜と前記第２の透明導電膜との間に交差部絶縁膜を有する請求項１に記載のセンサ一体型カバーガラス。 The first transparent conductive film and the second transparent conductive film form an intersection where one of the first transparent conductive film and the second transparent conductive film covers the other, and the first transparent conductive film and the second transparent conductive film are formed at the intersection. The sensor-integrated cover glass according to claim 1, further comprising a crossing insulating film between the conductive film and the conductive film.
  3. 　前記下地絶縁膜は、前記ガラス板と、前記第１の透明導電膜および前記第２の透明導電膜との間にのみ形成されている請求項１または２に記載のセンサ一体型カバーガラス。 The sensor-integrated cover glass according to claim 1 or 2, wherein the base insulating film is formed only between the glass plate and the first transparent conductive film and the second transparent conductive film.
  4. 　前記下地絶縁膜は、少なくとも前記第１の透明導電膜および前記第２の透明導電膜の形成された領域において、前記ガラス板を全面的に覆うように形成されている請求項１または２に記載のセンサ一体型カバーガラス。 The said base insulating film is formed so that the said glass plate may be covered entirely in the area | region in which the said 1st transparent conductive film and the said 2nd transparent conductive film were formed at least. Sensor integrated cover glass.
  5. 　前記下地絶縁膜は、前記第１の透明導電膜と前記第２の透明導電膜とが交差する前記交差部と前記ガラス板との間には形成されていない請求項２に記載のセンサ一体型カバーガラス。 3. The sensor-integrated type according to claim 2, wherein the base insulating film is not formed between the glass plate and the intersecting portion where the first transparent conductive film and the second transparent conductive film intersect. cover glass.
  6. 　前記交差部絶縁膜が、前記交差部以外の前記ガラス板と、前記第１の透明導電膜および前記第２の透明導電膜との間まで延在して形成されている請求項５に記載のセンサ一体型カバーガラス。 The said crossing part insulating film is extended and formed between the said glass plate other than the said crossing part, and a said 1st transparent conductive film and a said 2nd transparent conductive film. Sensor integrated cover glass.
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