JP2014146283A - Front plate integrated touch panel sensor substrate and display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a front plate integrated touch panel sensor substrate and a display device, enabling suppression of breaking at a connection part connecting a transparent electrode and a wiring part, without making a frame part thin.SOLUTION: A front plate integrated touch panel sensor substrate includes: transparent cover glass 1; a bezel 20 formed on one side of the cover glass 1 and partitions a display area; and a touch panel sensor layer 10 formed on the one side of the cover glass 1. The touch panel sensor layer 10 includes: a first transparent electrode 60 and a second transparent electrode 70 formed on the display area; draw-out wiring 50 formed on the bezel 20; and connection parts 67, 77 connecting the first and second transparent electrodes 60, 70 and the draw-out wiring 50, respectively. A side surface part 20a on an inner peripheral side of the bezel 20 has a plurality of step-like stepped parts arranged from a side of the display area toward the draw-out wiring 50.

Description

  The present invention relates to a front panel integrated touch panel sensor substrate and a display device, and in particular, a front panel capable of suppressing disconnection of a connection portion connecting a transparent electrode and a wiring portion without thinning the frame portion. The present invention relates to an integrated touch panel sensor substrate and a display device.

  The touch panel is a device that enables data input by a user touching a transparent surface on a display screen with a finger or the like and detecting the touched position. In recent years, touch panels have been widely used because they enable direct and intuitive input, and in particular, information input / output is increasingly performed by combining a touch panel with a liquid crystal display or the like.

  Examples of the detection method in the touch panel include a resistance film type, a capacitance type, an ultrasonic type, and an optical type. In particular, a capacitive touch panel has high optical characteristics and is excellent in durability and operating temperature characteristics. Therefore, development is progressing toward high reliability applications such as in-vehicle use. For example, a transparent cover glass is disposed on the user side (that is, the front side) of the capacitive touch panel in order to protect the touch panel sensor substrate. In general, a black light shielding film is provided on the outer periphery of the cover glass (see, for example, Patent Document 1). With this light shielding film, the lead-out wiring of the touch panel sensor substrate is hidden from the user.

JP 2009-69321 A

  By the way, in recent years, a cover glass-integrated touch panel sensor substrate in which a touch panel sensor layer is disposed on one surface of a cover glass is becoming widespread. In the cover glass integrated touch panel sensor substrate, a display area can be defined by arranging a frame portion (bezel) on one surface of the cover glass. It is also possible to form an extraction wiring on the frame portion. In that case, for example, a connection portion made of the same material as the transparent electrode (for example, an ITO film) is formed between the transparent electrode formed in the display region and the extraction wiring formed on the bezel. And lead-out wiring.

Here, when the bezel is white, it is necessary to form the bezel thickly (for example, to a thickness of several tens of μm) in order to conceal the extraction wiring with the bezel. For this reason, there is a problem that a high wall exists between the transparent electrode and the lead-out wiring according to the thickness of the bezel, and disconnection is likely to occur in the connection portion of the high wall.
Therefore, the present invention has been made in view of such circumstances, and it is possible to suppress disconnection of a connection portion connecting a transparent electrode and a wiring portion without thinning the frame portion. An object is to provide a face plate integrated touch panel sensor substrate and a display device.

  In order to solve the above-described problem, a front panel integrated touch panel sensor substrate according to one embodiment of the present invention includes a front panel integrated with a touch panel sensor and a transparent front panel disposed on the front side of the touch panel sensor. A body-type touch panel sensor substrate, which is formed on one surface of the front plate and located on the outer periphery of the display area; and a touch panel sensor layer formed on the one surface side of the front plate, The touch panel sensor layer has a transparent electrode formed in the display area, a wiring part formed on the frame part, and a connection part for connecting the transparent electrode and the wiring part, A plurality of stepped steps are formed on the inner peripheral side surface portion of the frame portion from the display region side toward the formation position of the wiring portion, and the connection portion is formed on the inner peripheral side surface portion. Along Characterized in that it is formed Te. Here, “transparent” means the property of transmitting visible light. The transparency may be colorless and transparent or colored and transparent.

Further, in the above-described front plate integrated touch panel sensor substrate, the frame portion may be composed of two or more colored layers. Here, the “colored layer” means a colored layer, that is, a non-transparent layer.
Further, in the above-described front plate integrated touch panel sensor substrate, the frame portion includes two or more white layers and a light shielding layer formed on the uppermost white layer of the two or more white layers. It is good also as comprised by these. Here, the “light-shielding layer” can be provided by, for example, a black or gray (gray) layer, or can be provided by a layer of a dark color other than gray (for example, dark green, deep brown, etc.). By selecting this color, it is possible to realize a white bezel with a thinner film thickness and higher concealability than white alone.

In the touch panel sensor substrate with an integrated front plate, the colored layer may be formed by a screen printing method.
Further, in the above-described front plate integrated touch panel sensor substrate, a difference in line width between an upper layer and a lower layer contacting in the vertical direction among the two or more colored layers may be 100 μm or more.

In the touch panel sensor substrate with an integrated front plate, the connection portion for connecting the transparent electrode to the wiring portion may be formed in a step shape along the surface of the plurality of step portions. .
The display apparatus which concerns on another aspect of this invention is equipped with said front plate integrated touch-panel sensor board | substrate, It is characterized by the above-mentioned.

  According to one aspect of the present invention, a plurality of stepped step portions from the display region side to the formation position of the wiring portion are provided on the inner peripheral side surface portion of the frame portion, and the wall per step is low. (That is, the level difference is reduced). Thereby, since the connection part which connects a transparent electrode and a wiring part can be formed in uniform thickness along an inner peripheral side surface part, the disconnection of a connection part is suppressed even if it does not make a frame part thin. be able to.

The figure which shows the structural example of the cover glass integrated sensor board | substrate 100 which concerns on 1st Embodiment. The figure which shows an example of the dimension of the bezel 20. FIG. The figure which shows the manufacturing method of the cover glass integrated sensor board | substrate 100. FIG. The figure which shows the structural example of the cover glass integrated sensor board | substrate 200 which concerns on 2nd Embodiment. The figure which shows the structural example of the cover glass integrated sensor board 300 which concerns on 3rd Embodiment. The figure which shows the structural example of the touchscreen display apparatus 400 which concerns on 4th Embodiment.

Embodiments of the present invention will be described below with reference to the drawings. Note that, in each drawing described below, parts having the same configuration are denoted by the same reference numerals, and repeated description thereof is omitted.
<First Embodiment>
(Constitution)
FIGS. 1A and 1B are plan views showing a configuration example of a cover glass integrated projection capacitive touch panel sensor substrate (hereinafter referred to as a cover glass integrated sensor substrate) 100 according to the first embodiment of the present invention. It is sectional drawing which cut | disconnected the figure and this top view with the X1-X'1 line | wire. The cover glass integrated sensor substrate 100 is a sensor substrate in which, for example, a touch panel sensor and a cover glass disposed on the front side of the touch panel sensor are integrated.

  As shown in FIGS. 1A and 1B, a cover glass-integrated sensor substrate 100 includes, for example, a colorless and transparent cover glass 1 and a cover glass 1 formed on one surface side of the cover glass 1. An integrated sensor layer 10, a frame layer (bezel) 20 formed on one surface of the cover glass 1 and positioned on the outer periphery of the display area, and a sensor layer 10 formed on one surface side of the cover glass 1. And a protective layer 75 that covers and protects the bezel 20. The cover glass 1 is a special glass plate (reinforced substrate) such as aluminosilicate glass or chemically tempered soda lime glass.

The projected capacitive touch panel sensor layer (hereinafter referred to as sensor layer) 10 includes, for example, a plurality of first transparent electrodes 60, a plurality of first connection portions 65, and a plurality of second transparent electrodes 70. The plurality of second connection portions 30, the insulating layer 40, the extraction wiring 50, and the connection portions 67 and 77.
The first transparent electrode 60 is formed in the display area, and is arranged so as to form a plurality of rows parallel to the X-axis direction. The second transparent electrode 70 is formed in the display area, and is arranged so as to form a plurality of columns parallel to the Y-axis direction orthogonal to the X-axis direction in plan view. The first connection portion 65 is formed in the display area, and electrically connects the first transparent electrodes 60 adjacent in the X-axis direction. The second connection part 30 is formed in the display area, and electrically connects the second transparent electrodes 70 adjacent in the Y-axis direction. Further, the first transparent electrode 60 and the second transparent electrode 70 are insulated from each other.

  As materials for the first transparent electrode 60 and the second transparent electrode 70, known materials can be suitably used. For example, inorganic conductive materials such as indium tin oxide (ITO) and zinc oxide (ZnO), polyethylene Organic conductive materials such as dioxythiophene / polystyrene sulfonic acid (PEDOT / PSS), polyaniline, and polypyrrole can be used. These materials may be used alone or in combination of two or more. Among these, it is preferable to use ITO in terms of transparency and resistance value.

  The first connection portion 65 is formed simultaneously with the first and second transparent electrodes 60 and 70 using the same transparent conductive material as the first and second transparent electrodes 60 and 70. In other words, when the first and second transparent electrodes 60 and 70 are formed, the first connection portion 65 is also formed at the same time. As a result, a pattern (row) composed of a plurality of first transparent electrodes 60 is formed which is continuous without interruption in the X direction. The second connection portion 30 is formed below the first connection portion 65 with the insulating layer 40 interposed therebetween. The second connection part 30 is made of, for example, the same type of transparent conductive material as the first and second transparent electrodes 60 and 70 and the first connection part 65. Further, the second connection portion 30 is formed before the first and second transparent electrodes 70 and the first connection portion 65 are formed.

The insulating layer 40 is formed between the first connection portion 65 and the second connection portion 30 and insulates between them. The insulating layer 40 is made of, for example, an inorganic film such as a silicon oxide film (SiO ₂ ) or a silicon nitride film (SiNx), or an organic material such as a transparent resin. As the organic material, for example, a UV (ultraviolet) curable coating composition containing a polymerizable group-containing oligomer, a monomer, a photopolymerization initiator, and other additives can be used. The protective layer 75 is also made of an inorganic film similar to the insulating layer 40 or an organic material such as a transparent resin.

  The extraction wiring 50 is a wiring portion for electrically connecting the first transparent electrode 60 and the second transparent electrode 70 to a control circuit (not shown). The lead-out wiring 50 is formed on the bezel 20, and has, for example, a three-layer structure (hereinafter referred to as MAM) of (molybdenum (Mo) / aluminum (Al) / molybdenum (Mo). Mo: 350 ： / Al: 2000Å / Mo: 350Å.

The connection part 67 is formed on the bezel 20 and connects the first transparent electrode 60 to the extraction wiring 50. The connection part 77 is also formed on the bezel 20 and connects the second transparent electrode 70 to the extraction wiring 50.
The bezel 20 includes, for example, a first white layer 21, a second white layer 22 disposed on the first white layer 21, and a light shielding layer 23 disposed on the second white layer 22. It has a layer structure. The first white layer 21, the second white layer 22, and the light shielding layer 23 are colored layers formed by, for example, a screen printing method.

2A and 2B are a plan view showing an example of the dimensions of the bezel 20, and a cross-sectional view obtained by cutting the plan view along line X2-X'2 and expanding the plan view. As shown in FIG. 2A, the shape of the bezel 20 in plan view (that is, the planar shape) is, for example, a rectangular frame shape (that is, a rectangular frame shape), and the display area is partitioned into, for example, a rectangle. With regard to the width of the bezel 20, in a plan view, when the width on the left and right sides of the rectangular frame is W1, the upper width is W2, and the lower width is W3, W1 is, for example, 2500 μm, W2 is, for example, 6000 μm, W3 is, for example, 13000 μm.
In addition, regarding the bezel 20, the difference between the line widths of the first white layer 21 and the second white layer 22 that are in contact with each other in the vertical direction is defined as d1, and the line between the second white layer 22 and the light shielding layer 23 that are in contact with each other in the vertical direction. When the difference in width is d2, d1 is, for example, 120 μm to 140 μm, and d2 is, for example, about 120 μm to 140 μm.

  As shown in FIG. 2B, in the step of forming the bezel 20, the center line of the line width of the first white layer 21, the center line of the line width of the second white layer 22, and the light shielding layer 23 The upper layer is aligned with the lower layer so as to coincide with the center line of the line width, and the layers are sequentially stacked. When this alignment is ideally performed, that is, the center line of the line width of the first white layer 21, the center line of the line width of the second white layer 22, and the center of the line width of the light shielding layer 23. When the lines coincide with each other, the difference in line width on one side of the bezel 20 (that is, the display region side or the opposite outside) is 1/2 · d1 (in the first white layer 21 and the second white layer 22. For example, 60 μm to 70 μm), and the second white layer 22 and the light shielding layer 23 have 1/2 · d2 (for example, 60 μm to 70 μm). In an actual manufacturing site, the center lines may not match due to manufacturing variations.

  As described above, the bezel 20 includes, for example, three colored layers (the first white layer 21, the second white layer 22, and the light shielding layer 23). As shown in FIG. 1B, the stepped three step portions from the display region side toward the formation position of the extraction wiring 50 are formed on the inner peripheral side surface portion 20a of the bezel 20. A connection portion 67 for connecting the first transparent electrode 60 to the extraction wiring 50 and a connection portion 77 for connecting the second transparent electrode 70 to the extraction wiring 50 are formed in a step shape along the surfaces of these three step portions. And is in contact with the extraction wiring 50 on the light shielding layer 23.

(Production method)
Next, a method for manufacturing the cover glass integrated sensor substrate 100 will be described.
3A to 3D are cross-sectional views illustrating a method for manufacturing the cover glass integrated sensor substrate 100 according to the first embodiment of the present invention in the order of steps.

(1) Formation of Bezel As shown in FIG. 3A, first, a cover glass 1 (reinforced substrate) is prepared. The shape of the cover glass 1 is, for example, a rectangle, and the size in plan view is, for example, length: 400 mm, width: 500 mm, and thickness is, for example, 0.7 mm. Then, printing of the bezel 20 is performed on one surface of the cover glass 1 by using, for example, a screen printing method in a multi-sided manner. An example of the conditions of the screen printing method is as follows (1.1) to (1.3).
In addition, the magnitude | size and shape of the cover glass 1 are not limited above. A larger reinforced substrate serving as a single base may be prepared. In this case, after a plurality of bezels 20 and touch panel sensors are collectively formed, the reinforced substrate is divided into individual pieces by a method such as a chemical etching method or a mechanical cutting method.

(1.1) Formation of first white layer As shown in FIG. 3A, the first white layer 21 is formed on one surface of the cover glass 1. The first white layer 21 is formed by screen printing. For example, MRX-Conch 611 White manufactured by Teikoku Ink Manufacturing Co., Ltd. is used as the screen printing white ink used when forming the first white layer 21. Further, on one surface of the cover glass 1, screen printing is performed using a 270 mesh plate having a rectangular frame pattern so that the thickness of the first white layer 21 after drying becomes, for example, 7 μm. Thereafter, the first white layer 21 is dried. The drying condition is, for example, oven drying at 150 ° C. for 30 minutes.

(1.2) Formation of Second White Layer Next, as shown in FIG. 3B, the second white layer 22 is formed on the first white layer 21. The second white layer 22 is formed by screen printing. As described with reference to FIG. 2, the design value of the line width of the second white layer 22 is smaller than the first white layer 21 by a line width difference d1 (for example, 120 μm to 140 μm). Set in advance.

  As the white ink for screen printing used when forming the second white layer 22, for example, MRX-Conch 611 white manufactured by Teikoku Mfg. Co., Ltd. is used as in the case of the first white layer 21. Further, on one surface of the cover glass 1, screen printing is performed using a 270 mesh plate having a rectangular frame pattern so that the thickness of the second white layer 22 after drying becomes, for example, 7 μm. Thereafter, the second white layer 22 is dried. The drying condition is, for example, oven drying at 150 ° C. for 30 minutes.

(1.3) Formation of light shielding layer Next, as shown in FIG. 3C, the light shielding layer 23 is formed on the second white layer 22. The light shielding layer 23 is formed by a screen printing method. As described with reference to FIG. 2, the design value of the line width of the light shielding layer 23 is set in advance so as to be smaller than the second white layer 22 by a line width difference d2 (for example, 120 μm to 140 μm). Keep it.

  For example, gray (MRX-611 White: MRX-912 Black = 50: 50) manufactured by Teikoku Ink Manufacturing Co., Ltd. is used as the screen printing ink (backing ink) used when forming the light shielding layer 23. To do. Further, on one surface of the cover glass 1, screen printing is performed using a 270 mesh plate having a rectangular frame pattern so that the thickness of the light shielding layer 23 after drying is, for example, 7 μm. Thereafter, the light shielding layer 23 is dried. The drying condition is, for example, oven drying at 150 ° C. for 30 minutes.

(2) Formation of sensor layer and protective layer Next, as shown in FIG. 3D, the sensor layer 10 is formed on one surface of the cover glass 1 on which the bezel 20 is formed. The formation method of the sensor layer 10 is as follows.
First, for example, an ITO film is formed on one surface of the cover glass 1. A method for forming the ITO film is, for example, a sputtering method. The thickness of the ITO film after the film formation is, for example, 30 nm, and the sheet resistance value is, for example, 100Ω / □. Next, the ITO film is subjected to patterning using, for example, a photolithography method. Thereby, the 2nd connection part 30 which consists of an ITO film | membrane is formed on one surface of the cover glass 1. FIG.

  Next, an insulating material is formed on one surface of the cover glass 1 on which the second connection portion 30 is formed, and patterning is performed to form an insulating layer 40 that covers the second connection portion 30. . A method for forming the insulating material is not particularly limited. In the case of an inorganic film, for example, a CVD (Chemical Vapor Deposition) method is used. An inorganic film can be formed to a thickness of, for example, 100 nm or more by the CVD method. In the case where an organic film is formed as the insulating layer 40, an organic material such as a transparent resin is applied by spray coating, spin coating, slit die coating, roll coating, bar coating, or the like. By these methods, it is possible to form an organic film so that the film thickness after drying (that is, after curing) is 0.2 μm to 10 μm. As the organic material, for example, NN901 manufactured by JSR Corporation is used. For example, when slit die coating is used, the organic material can be partially applied to one surface of the cover glass 1, and the organic material application step and the patterning process can be performed simultaneously. .

Next, a MAM is formed by sputtering, and patterning is performed on the MAM using an etching method. Thereby, the extraction wiring 50 made of MAM is formed on the bezel 20.
Next, for example, an ITO film is formed on one surface of the cover glass 1. A method for forming the ITO film is, for example, a sputtering method. The thickness of the ITO film after the film formation is, for example, 30 nm, and the sheet resistance value is, for example, 100Ω / □. Then, for example, the ITO film is subjected to patterning using a photolithography method. Thus, the first transparent electrode 60, the second transparent electrode 70, the first connection portion 65, and the connection portions 67 and 77 made of an ITO film are simultaneously formed on one surface of the cover glass 1. Thereafter, a protective layer is formed on one surface of the cover glass 1 by a method similar to the formation of the insulating layer 40.

Through the above steps, the cover glass integrated sensor substrate 100 shown in FIGS. 1A and 1B is completed.
In the first embodiment, the cover glass 1 corresponds to the front plate of the present invention, the first transparent electrode 60 and the second transparent electrode 70 correspond to the transparent electrode of the present invention, and the extraction wiring 50 is the wiring of the present invention. Corresponds to the department. Moreover, the 1st white layer 21, the 2nd white layer 22, and the light shielding layer 23 respond | corresponds to the colored layer of this invention.

(Effect of 1st Embodiment)
The first embodiment of the present invention has the following effects.
(1) On the inner peripheral side surface portion 20a of the bezel 20, a plurality of stepped step portions from the display region side to the formation position of the extraction wiring 50 are formed, and the wall per step is lowered. (That is, the step is relaxed). Thereby, the connection part 67 which connects the 1st transparent electrode 60 and the extraction wiring 50, and the connection part 77 which connects the 2nd transparent electrode 70 and the extraction wiring 50 are followed along the surface of a several level | step-difference part. It can be formed in a stepped shape with a uniform thickness. Therefore, disconnection of the connection portions 67 and 77 can be suppressed without reducing the bezel 20.

(2) The bezel 20 includes a first white layer 21, a second white layer 22, and a light shielding layer 23. The first and second white layers 21 and 22 having higher visible light transmittance than the light shielding layer 23 are disposed below the light shielding layer 23 so that the entire white layer has a thickness. Thereby, it is possible to realize a white bezel with high concealability of the extraction wiring 50 as viewed from the user.

(3) Moreover, the 1st, 2nd white layers 21 and 22 and the light shielding layer 23 are each formed by the screen printing method. By performing screen printing in an overlapping manner, the first and second white layers 21 and 22 and the light shielding layer 23 can be laminated with a thickness of several μm. Further, the second white layer 22 is formed with a line width narrower than that of the first white layer 21, and the light shielding layer 23 is formed with a line width narrower than that of the second white layer 22. Thereby, a plurality of step portions having a wall height (that is, a dimension in the Z-axis direction) of several μm can be formed on the inner peripheral side surface portion 20a of the bezel 20.

(4) The line width difference d1 between the first white layer 21 and the second white layer 22 and the line width difference d2 between the second white layer 22 and the light shielding layer 23 are 120 μm to 140 μm, respectively. is there. Thereby, a plurality of step portions having a horizontal width (that is, a dimension in the X-axis direction or the Y-axis direction) of 60 μm to 70 μm can be formed on the inner peripheral side surface portion 20 a of the bezel 20. When the bezel 20 is formed by the screen printing method, d1 is preferably 100 μm or more in consideration of the alignment accuracy of the second white layer 22 with respect to the first white layer 21 (that is, considering the margin). Preferably it is 120 micrometers or more. Similarly, in consideration of the alignment margin of the light shielding layer 23 with respect to the second white layer 22, d2 may be 100 μm or more, and more preferably 120 μm or more.

(Modification)
(1) In the first embodiment, the case where the first and second white layers 22 and the light shielding layer 23 are each formed to a thickness of 7 μm has been described. However, in the embodiment of the present invention, the thicknesses of the first and second white layers 21 and 22 and the thickness of the light shielding layer 23 are not limited to this.
The thickness of the first white layer 21 is preferably 2 μm or more and 10 μm or less, and more preferably 5 μm or more and 8 μm or less. The thickness of the second white layer 22 is preferably 2 μm or more and 10 μm or less, and more preferably 5 μm or more and 8 μm or less. The thickness of the light shielding layer 23 is preferably 2 μm or more and 10 μm or less, and more preferably 5 μm or more and 8 μm or less.

  The reason is that the concealing property of hiding the lead-out wiring 50 of the bezel 20 is impaired when the thickness of each of the first and second white layers 21 and 22 and the thickness of the light shielding layer 23 are less than the above lower limit values. . Further, when the thickness of each of the first and second white layers 22 and the thickness of the light shielding layer 23 exceeds the above upper limit value, when the cover glass integrated sensor substrate is bonded to a liquid crystal panel (LCD), for example, This is because a hollow portion is easily generated between the two due to the thickness of the bezel.

(2) Further, in the first embodiment, the case where the bezel 20 is configured by the first and second white layers and the gray (gray) layer has been described. That is, the case where the light shielding layer of the present invention is a gray layer is described. However, the light shielding layer of the present invention is not limited to a gray layer, and may be a black layer. Alternatively, the light shielding layer of the present invention may be a dark layer other than gray, for example, a dark layer such as dark green or deep brown. By selecting black, gray (gray), and other dark layers as the light shielding layer, a white bezel with a thin film thickness and higher concealment than only white can be realized.

(3) Moreover, you may comprise the bezel 20 only with a white layer, for example. For example, a third white layer may be arranged instead of the light shielding layer 23. Moreover, you may arrange | position the layer colored in other colors (for example, light colors, such as pink) instead of a white layer. Even with such a configuration, the effects (1) to (4) of the first embodiment are achieved.
(4) In the embodiment of the present invention, the method of forming the bezel is not limited to screen printing. The bezel may be formed by, for example, a photolithography method.

Second Embodiment
In the first embodiment described above, the case where the bezel has a three-layer structure and three stepped steps that are directed to the formation position of the extraction wiring are formed on the inner peripheral side surface thereof has been described. However, the bezel is not limited to a three-layer structure. The bezel has a two-layer structure (for example, a structure including a white layer and a light-shielding layer disposed on the white layer), and two stepped steps toward the formation position of the extraction wiring on the inner peripheral side surface of the bezel. A part may be formed.
Further, the bezel has a structure of four or more layers (for example, a structure of three or more white layers and a light shielding layer disposed thereon), and the position where the extraction wiring is formed on the inner peripheral side surface of the bezel. There may be formed four or more stepped portions that are stepped toward the surface.

(Constitution)
4A and 4B are a plan view showing a configuration example of the cover glass integrated sensor substrate 200 according to the second embodiment of the present invention, and a cross section obtained by cutting the plan view along line X4-X′4. FIG. In the second embodiment, the point different from the first embodiment is the number of laminated colored layers constituting the bezel.

  That is, as shown in FIGS. 4A and 4B, in the second embodiment, the bezel 20 includes a first white layer 21 and a second white layer disposed on the first white layer 21. 22, a third white layer 24 disposed on the second white layer 22, and a light shielding layer 23 disposed on the third white layer 24. The difference between the line widths of the second white layer 22 and the third white layer 24 is, for example, about 120 μm to 140 μm, and the difference between the line widths of the third white layer 24 and the light shielding layer 23 is about 120 μm to 140 μm. As a result, four stepped portions that are stepped toward the formation position of the extraction wiring 50 are formed on the inner peripheral side surface portion 20 a of the bezel 20. Moreover, the formation method and the thickness of the third white layer 24 are the same as those of the first and second white layers 21 and 22, for example.

Specifically, on one surface of the cover glass 1, screen printing is performed using a 270 mesh plate having a rectangular frame pattern so that the thickness of the third white layer 24 after drying becomes, for example, 7 μm. I do. Further, as the white ink for screen printing of the third white layer 24, for example, MRX-Conch 611 white manufactured by Teikoku Ink Manufacturing Co., Ltd. is used. After the third white layer 24 is formed by screen printing, the third white layer 24 is dried. The drying condition is, for example, oven drying at 150 ° C. for 30 minutes. Then, after the third white layer 24 is formed, the light shielding layer 23 is formed. The subsequent steps are the same as in the first embodiment.
In the second embodiment, the first white layer 21, the second white layer 22, the third white layer 24, and the light shielding layer 23 correspond to the colored layer of the present invention.

(Effect of 2nd Embodiment)
The second embodiment has the same effects as the effects (1) to (4) of the first embodiment.
Further, when the total thickness of the bezel 20 (that is, the total thickness of the colored layers) is the same as that in the first embodiment, the wall per step can be further reduced as compared with the first embodiment ( That is, the level difference can be further relaxed.) Thereby, the connection part 67 which connects the 1st transparent electrode 60 and the extraction wiring 50, and the connection part 77 which connects the 2nd transparent electrode 70 and the extraction wiring 50 are followed along the surface of a several level | step-difference part. It can be formed to a more uniform thickness, and disconnection of the connection portions 67 and 77 can be further suppressed.

(Modification)
Also in the second embodiment, the modifications (1) to (4) of the first embodiment may be applied.
In the second embodiment, the case where the thickness of the third white layer 24 is 7 μm has been described. However, in the embodiment of the present invention, the thickness of the third white layer 24 is not limited to this. The thickness of the third white layer 24 is preferably 2 μm or more and 10 μm or less, and more preferably 5 μm or more and 8 μm or less. The total thickness of the white layers constituting the bezel 20 is preferably 4 μm or more and 30 μm or less, more preferably 10 μm or more and 25 μm or less. The reason is the same as that of the modified example (1) of the first embodiment.

<Third Embodiment>
In the first and second embodiments, the structure in which the first connection portion 65 is disposed on the second connection portion 30 via the insulating layer 40 has been described. However, in the embodiment of the present invention, the positional relationship between the first and second connection portions 30 is not limited to this.
(Constitution)
FIGS. 5A and 5B are a plan view showing a configuration example of a cover glass integrated sensor substrate 300 according to the third embodiment of the present invention, and a cross section obtained by cutting the plan view along a line X5-X′5. FIG. The third embodiment is different from the first embodiment in the positional relationship between the first connection portion 65 and the second connection portion 30.

  That is, as shown in FIGS. 5A and 5B, in the cover glass integrated sensor substrate 300, the first connection portion 65 is disposed in the lowermost layer in the sensor layer 10, and the first connection portion 65 is arranged on the first connection portion 65. The second connection part 30 is disposed on the insulating layer 40. This structure is formed by forming the first and second transparent electrodes 70 and the first connection portion 65 at the same time, then forming the insulating layer 40, and then forming the second connection portion 30. be able to. The formation method of each layer and the materials used are the same as in the first embodiment.

(Effect of the third embodiment)
The third embodiment has the same effects as the effects (1) to (4) of the first embodiment.
(Modification)
Also in the third embodiment, the modifications (1) to (4) of the first embodiment may be applied.
Further, the configuration of the second embodiment may be applied to the third embodiment. That is, the bezel 20 may have a structure of two or more layers, for example, a four-layer structure of the first white layer 21, the second white layer 22, the third white layer 24, and the light shielding layer 23. Thereby, 3rd Embodiment has an effect similar to the effect of 2nd Embodiment.

<Fourth embodiment>
The cover glass integrated sensor substrates 100, 200, and 300 according to the first to third embodiments may be combined with a display such as a liquid crystal display (LCD) to constitute a display device.

(Constitution)
FIG. 6 is a cross-sectional view illustrating a configuration example of a touch panel display device 400 according to the fourth embodiment of the present invention. As shown in FIG. 6, the touch panel display device 400 is disposed on, for example, the cover glass integrated sensor substrate 100 and the side (that is, the rear side) of the cover glass integrated sensor substrate 100 having the sensor layer 10 and the bezel 20. LCD80. Although not shown, the LCD 80 is fixed to the cover glass integrated sensor substrate 100 with an adhesive or the like. In the fourth embodiment, the touch panel display device 400 corresponds to the display device of the present invention.

(Effect of 4th Embodiment)
The fourth embodiment has the same effects as the effects (1) to (4) of the first embodiment. Further, in the cover glass integrated sensor substrate 100, disconnection of the connection portions 67 and 77 can be suppressed, which can contribute to improving the reliability of the touch panel display device.
<Others>
The present invention is not limited to the embodiments described above. A design change or the like may be added to each embodiment based on the knowledge of a person skilled in the art, and an aspect in which such a change or the like is added is also included in the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 Cover glass 10 Sensor layer 20 Bezel 20a Inner side surface part 21 1st white layer 22 2nd white layer 23 Light-shielding layer 24 3rd white layer 30 2nd connection part 40 Insulating layer 50 Extraction wiring 60 1st Transparent electrode 65 first connection part 67, 77 connection part 70 second transparent electrode 75 protective layer 100, 200, 300 cover glass integrated sensor substrate 400 touch panel display device

Claims (7)

A touch panel sensor substrate integrated with a touch panel sensor and a transparent front plate disposed on the front side of the touch panel sensor,
A frame portion formed on one surface of the front plate and positioned on the outer periphery of the display area;
A touch panel sensor layer formed on the one surface side of the front plate,
The touch panel sensor layer has a transparent electrode formed in the display area, a wiring part formed on the frame part, and a connection part that connects the transparent electrode and the wiring part,
On the inner peripheral side surface portion of the frame portion, a plurality of stepped step portions from the display region side to the formation position of the wiring portion are formed,
The front panel integrated touch panel sensor substrate, wherein the connection portion is formed along the inner peripheral side surface portion.   The front panel integrated touch panel sensor substrate according to claim 1, wherein the frame portion is constituted by two or more colored layers.   The frame portion is composed of two or more white layers and a light shielding layer formed on the uppermost white layer of the two or more white layers. The front plate integrated touch panel sensor substrate according to claim 1 or 2.   The front plate-integrated touch panel sensor substrate according to claim 2 or 3, wherein the colored layer is formed by a screen printing method.   The front plate according to any one of claims 2 to 4, wherein a difference in line width between an upper layer and a lower layer that are in contact with each other in the vertical direction among the two or more colored layers is 100 µm or more. Integrated touch panel sensor board.   6. The connection part for connecting the transparent electrode to the wiring part is formed in a step shape along the surface of the plurality of step parts. 6. Front panel integrated touch panel sensor board.   A display device comprising the front panel integrated touch panel sensor substrate according to any one of claims 1 to 6.

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