WO2014030563A1 - レセプタクル及び光伝送モジュール - Google Patents

レセプタクル及び光伝送モジュール Download PDF

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Publication number
WO2014030563A1
WO2014030563A1 PCT/JP2013/071774 JP2013071774W WO2014030563A1 WO 2014030563 A1 WO2014030563 A1 WO 2014030563A1 JP 2013071774 W JP2013071774 W JP 2013071774W WO 2014030563 A1 WO2014030563 A1 WO 2014030563A1
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WO
WIPO (PCT)
Prior art keywords
optical
axis direction
plug
optical fiber
receptacle
Prior art date
Application number
PCT/JP2013/071774
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English (en)
French (fr)
Japanese (ja)
Inventor
裕史 浅井
Original Assignee
株式会社村田製作所
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Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP2014531588A priority Critical patent/JP6070709B2/ja
Publication of WO2014030563A1 publication Critical patent/WO2014030563A1/ja

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4206—Optical features
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02255—Out-coupling of light using beam deflecting elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/42—Arrays of surface emitting lasers
    • H01S5/423—Arrays of surface emitting lasers having a vertical cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • H01S5/18308—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement
    • H01S5/18311—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement using selective oxidation

Definitions

  • the present invention relates to a receptacle and an optical transmission module, and more particularly to a receptacle and an optical transmission module that convert an electrical signal into an optical signal and transmit it.
  • FIG. 17 is a cross-sectional view of the optical module described in Patent Document 1.
  • FIG. 18 is a diagram showing light refraction at the interface between the resin and air.
  • the optical module 500 includes an optical plug 501, a clamp 502 (not shown), a ceramic package 503, and a resin package 504, as shown in FIG.
  • the optical plug 501 is made of resin and supports one end of the optical fiber 506.
  • a condensing lens 511 is provided on one end side of the optical plug 501 in the longitudinal direction.
  • the ceramic package 503 accommodates the optical element 539 inside.
  • the resin package 504 is joined to the ceramic package 503.
  • An optical plug 501 is connected to the resin package 504. Further, the resin package 504 is provided with a reflection lens 548 for optically connecting the optical fiber 506 and the optical element 539.
  • the optical module 500 for example, when the optical element 539 is a light receiving element, the light P501 emitted from the optical fiber 506 is condensed or collimated by the condenser lens 511. Thereafter, the light P 501 is reflected by the reflection lens 548 and transmitted to the optical element 539.
  • the light P501 is refracted when it is emitted from a resin having a relatively high refractive index to air having a relatively low refractive index.
  • the light P501 traveling in the air A500 propagates in the air A500 while spreading more than the light P502 assumed to travel in the resin R500.
  • the longer the distance d that the light P501 travels in the air A500 the longer the spread W501 of the light P501 becomes larger than the spread W502 of the light P502. Therefore, in the optical module 500, since the distance that the light P501 propagates in the air is long, there is a problem that the condensing lens 511 and the reflecting lens 548 for condensing or collimating the light P501 are enlarged.
  • an object of the present invention is to provide a receptacle and an optical transmission module that can reduce the size of a lens or a total reflection surface.
  • a receptacle is a receptacle to which a plug provided at one end of an optical fiber is connected, and an optical element, a positioning member that optically couples the optical fiber core and the optical element, respectively.
  • a total reflection surface for totally reflecting the light toward the optical element or the light emitted from the optical element is provided on the optical path connecting the optical fiber and the optical element. It is characterized by that.
  • An optical transmission module includes the receptacle and a plug provided at one end of the optical fiber, and is present on the optical axis of the optical fiber in the plug and faces the positioning member.
  • a third convex lens is provided.
  • An optical module includes the receptacle and a plug provided at one end of the optical fiber, wherein the optical axis of the optical fiber and the insertion direction of the plug are parallel to each other. To do.
  • the lens or the total reflection surface can be reduced in size.
  • FIG. 1 is an external perspective view of an optical transmission module according to an embodiment of the present invention. It is a disassembled perspective view of the receptacle which concerns on one Embodiment of this invention.
  • 1 is an external perspective view of a mounting board according to an embodiment of the present invention. It is the figure which planarly viewed the light emitting element array which concerns on one Embodiment of this invention from the positive direction side of az axis direction.
  • FIG. 5 is a cross-sectional view taken along the line AA or BB of the light emitting element array illustrated in FIG. 4. It is an external appearance perspective view of the receptacle which excluded the metal cap from the receptacle which concerns on one Embodiment of this invention.
  • FIG. 8 is a diagram in which a mounting board and a plug according to an embodiment of the present invention are added to a cross section taken along the line CC or DD of the positioning member illustrated in FIG. 7. It is an external appearance perspective view of the metal cap which concerns on one Embodiment of this invention.
  • 1 is an external perspective view of a plug according to an embodiment of the present invention. It is the figure which planarly viewed the plug which concerns on one Embodiment of this invention from the negative direction side of az axis direction.
  • FIG. 2 is a cross-sectional view of an optical module described in Patent Document 1.
  • FIG. It is a figure showing the refraction of light in the interface of resin and air.
  • FIG. 1 is an external perspective view of an optical transmission module 10 according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the receptacle 20 according to the embodiment of the present invention.
  • FIG. 3 is an external perspective view in which the metal cap 30 and the positioning member 200 are removed from the receptacle 20 according to the embodiment of the present invention.
  • the vertical direction of the light transmission module 10 is defined as the z-axis direction
  • the direction along the long side of the light transmission module 10 when viewed in plan from the z-axis direction is defined as the x-axis direction.
  • the direction along the short side of the optical transmission module 10 is defined as the y-axis direction.
  • the x axis, the y axis, and the z axis are orthogonal to each other.
  • the optical transmission module 10 includes a receptacle 20 and a plug 40 as shown in FIG.
  • the plug 40 is connected to the receptacle 20.
  • the receptacle 20 includes a metal cap 30, a light receiving element array 50, a light emitting element array 100, a positioning member 200, a mounting substrate 22, and a sealing resin 24, as shown in FIG.
  • the mounting substrate 22 has a rectangular shape when viewed in plan from the z-axis direction. Further, when the optical transmission module 10 is mounted on the circuit board, the surface of the mounting substrate 22 on the negative side in the z-axis direction (hereinafter, the “surface on the negative direction side in the z-axis direction” is referred to as the back surface).
  • a surface mounting electrode E1 (not shown in FIG. 3) is provided in contact with the land of the circuit board.
  • the surface of the mounting substrate 22 on the positive side in the z-axis direction (hereinafter referred to as “the surface on the positive side in the z-axis direction”) is positioned on the negative direction side in the x-axis direction
  • a ground conductor exposed portion E2 in which a part of the ground conductor provided in the mounting substrate 22 is exposed is provided in the vicinity of the angle formed by the side L1 and the side L2 located on the negative side in the y-axis direction. It has been.
  • the ground conductor exposed portion E2 has a rectangular shape having a long side in the x-axis direction when viewed from the positive side in the z-axis direction.
  • the surface of the mounting substrate 22 is provided in the mounting substrate 22 in the vicinity of an angle formed by the side L ⁇ b> 1 positioned on the negative side in the x-axis direction and the side L ⁇ b> 3 positioned on the positive direction side in the y-axis direction.
  • a ground conductor exposed portion E3 in which a part of the ground conductor is exposed is provided.
  • the ground conductor exposed portion E3 has a rectangular shape having a long side in the x-axis direction when viewed from the positive side in the z-axis direction.
  • the light receiving element array 50 and the light emitting element array 100 are provided on the surface of the mounting substrate 22 on the positive side in the x-axis direction.
  • the light receiving element array 50 is an element including a plurality of photodiodes that convert an optical signal into an electric signal.
  • the light emitting element array 100 is an element including a plurality of diodes that convert an electrical signal into an optical signal.
  • the drive circuit 26 is provided on the positive direction side in the x-axis direction with respect to the light receiving element array 50 and the light emitting element array 100 in the positive direction side portion in the x-axis direction on the surface of the mounting substrate 22.
  • the drive circuit 26 is a semiconductor circuit element for driving the light receiving element array 50 and the light emitting element array 100.
  • the drive circuit 26 has a rectangular shape having long sides parallel to the y-axis direction when viewed in plan from the z-axis direction.
  • the drive circuit 26 and the light receiving element array 50 are connected via wire U by wire bonding. Further, the drive circuit 26 and the light emitting element array 100 are connected by wire bonding via the wire U. As a result, the electrical signal from the drive circuit 26 is transmitted to the light emitting element array 100 via the wire U, and the electrical signal from the light receiving element array 50 is transmitted to the drive circuit 26 via the wire U.
  • the sealing resin 24 includes a sealing portion 24a and leg portions 24b to 24e, and is made of a transparent resin such as an epoxy resin.
  • the sealing portion 24 a has a substantially rectangular parallelepiped shape, and is provided in a portion on the positive direction side in the x-axis direction on the surface of the mounting substrate 22.
  • the sealing portion 24 a covers the light receiving element array 50, the light emitting element array 100, and the drive circuit 26.
  • the leg portions 24b and 24c are provided at intervals so as to be arranged in this order from the negative direction side in the x-axis direction to the positive direction side.
  • the leg portions 24b and 24c are rectangular parallelepiped members that protrude toward the side L2 of the mounting substrate 22 from the negative side surface in the y-axis direction of the sealing portion 24a. Further, a space H1 into which a convex portion C3 of a metal cap 30 described later is fitted is provided between the leg portion 24b and the leg portion 24c.
  • the leg portions 24d and 24e are provided at intervals so as to be arranged in this order from the negative direction side to the positive direction side in the x-axis direction.
  • the leg portions 24d and 24e are rectangular parallelepiped members that protrude toward the side L3 of the mounting substrate 22 from the surface on the positive side in the y-axis direction of the sealing portion 24a. Further, a space H2 is provided between the leg portion 24d and the leg portion 24e in which a convex portion C6 of the metal cap 30 described later is fitted.
  • FIG. 4 is a plan view of the light emitting element array 100 according to an embodiment of the present invention as seen from the positive side in the z-axis direction.
  • FIG. 5 is a cross-sectional view taken along line AA or BB of the light emitting element array 100 shown in FIG.
  • the present embodiment only two VCSELs 100A and 100B are described, but the number of VCSELs constituting the light emitting element array 100 of the present invention is not limited to this.
  • the light emitting element array 100 includes two VCSELs 100A and 100B as shown in FIG. That is, the VCSELs 100A and 100B are integrated and arrayed, and the VCSELs 100A and 100B are driven independently. Further, a laser beam B1 is emitted from each VCSEL 100A, 100B toward the positive direction side in the z-axis direction.
  • the two VCSELs 100A and 100B are provided on the surface of a common base substrate 128 as shown in FIG.
  • the base substrate 128 is made of a semi-insulating semiconductor, specifically, a substrate made of GaAs.
  • the base substrate 128 preferably has a resistivity of 1.0 ⁇ 10 7 ⁇ ⁇ cm or more.
  • an N-type semiconductor contact layer 130 is laminated on the surface of the base substrate 128.
  • One N-type semiconductor contact layer 130 is provided for each of the VCSELs 100A and 100B.
  • the N-type semiconductor contact layer 130 of the VCSEL 100A and the N-type semiconductor contact layer 130 of the VCSEL 100B are insulated from each other.
  • the N-type semiconductor contact layer 130 is made of a compound semiconductor having N-type conductivity.
  • an N-type semiconductor multilayer reflective layer (hereinafter referred to as an N-type DBR layer) 132 is laminated. Further, the N-type DBR layer 132 is provided with an arc-shaped groove W when viewed from the positive side in the z-axis direction. The groove W has a substantially half circumference near the center of the VCSELs 100A and 100B on the negative direction side in the x-axis direction. The bottom of the trench W reaches the surface of the N-type semiconductor contact layer 130.
  • the N-type DBR layer 132 is made of AlGaAs and is formed by stacking a plurality of layers having different composition ratios of Al to Ga.
  • the N-type DBR layer 132 functions as a first reflector for generating laser light having a predetermined frequency.
  • the N-type DBR layer 132 may also serve as an N-type semiconductor contact layer. That is, the N-type semiconductor contact layer is not essential.
  • an N-type semiconductor clad layer 134 is laminated on the surface of the N-type DBR layer 132.
  • the N-type semiconductor clad layer 134 is provided at the center of the VCSELs 100A and 100B when viewed in plan from the z-axis direction, and has a circular shape.
  • the N-type semiconductor clad layers 134 are insulated from each other.
  • the N-type semiconductor clad layer 134 is made of AlGaAs.
  • an active layer 136 is provided on the surface of the N-type semiconductor clad layer 134.
  • the active layer 136 is made of GaAs and AlGaAs.
  • the GaAs layer is provided between the AlGaAs layers.
  • the energy band gap of AlGaAs is larger than that of GaAs.
  • the refractive index of GaAs is larger than that of AlGaAs.
  • a P-type semiconductor clad layer 138 is provided on the surface of the active layer 136.
  • the P-type semiconductor cladding layer 138 is made of AlGaAs.
  • An oxidized constricting layer 150 is provided on the surface of the P-type semiconductor clad layer 138 as shown in FIG. When the oxidized constricting layer 150 is viewed in plan from the z-axis direction, a circular hole 152 is provided in the approximate center of the oxidized constricting layer 150.
  • the oxidized constricting layer 150 is made of AlGaAs.
  • a P-type semiconductor multilayer reflective layer (hereinafter referred to as a P-type DBR layer) 140 is provided on the surface of the oxidized constricting layer 150.
  • a part of the P-type DBR layer 140 is also provided in the hole 152 provided in the oxidized constricting layer, and is in contact with the P-type semiconductor clad layer 138.
  • the P-type DBR layer 140 is made of AlGaAs and is formed by laminating a plurality of layers having different Al composition ratios to Ga. Thereby, the P-type DBR layer 140 functions as a second reflector for generating laser light having a predetermined frequency.
  • the reflectance of the P-type DBR layer 140 is slightly lower than that of the N-type DBR layer 132.
  • the semiconductor clad layer is provided so as to sandwich the active layer, but the present invention is not limited to this configuration.
  • a layer having such a thickness as to generate resonance may be provided in the active layer.
  • a P-type semiconductor contact layer 142 is laminated on the surface of the P-type DBR layer 140.
  • the P-type semiconductor contact layer 142 is made of a compound semiconductor having P-type conductivity. Note that the P-type DBR layer may also serve as a P-type semiconductor contact layer. That is, the P-type semiconductor contact layer is not essential.
  • a light emitting region multilayer section 160 is configured.
  • each layer and the composition ratio of Al to Ga are set so as to have one emission spectrum peak wavelength at the center antinode position of the optical standing wave distribution and to arrange a plurality of quantum wells. Is done.
  • the light emitting region multilayer part 160 functions as the light emitting part of the VCSELs 100A and 100B.
  • the oxide constriction layer 150 by providing the oxide constriction layer 150, current can be efficiently injected into the active layer 136, and the VCSELs 100A and 100B with low power consumption can be realized.
  • an anode ring electrode 921 is provided on the surface of the P-type semiconductor contact layer 142.
  • the anode ring electrode 921 has an annular shape when viewed in plan from the z-axis direction. Note that the anode electrode does not necessarily have to be annular, and may be, for example, a C-shape or a rectangular shape with an annular part open.
  • a cathode electrode 911 is provided in the groove W of the N-type DBR layer 132 described above.
  • the cathode electrode 911 is in contact with the N-type semiconductor contact layer 130 as shown in FIG. Thereby, the cathode electrode 911 is electrically connected to the N-type semiconductor contact layer 130.
  • the cathode electrode 911 has an arc shape when viewed in plan from the z-axis direction. The arc is substantially concentric with the ring of the annular anode ring electrode 921.
  • the insulating film 162 is provided so as to cover the surface of the light emitting region multilayer 160 of the VCSELs 100A and 100B except for the portion where the cathode electrode 911 and the anode ring electrode 921 are provided.
  • the material of the insulating film 162 is, for example, silicon nitride.
  • an insulating layer 170 is provided on the positive side of the x-axis direction in the VCSELs 100A and 100B. Further, as shown in FIG. 5, the insulating layer 170 is provided on the insulating film 162 covering the N-type DBR layer 132. As shown in FIG. 4, the insulating layer 170 has a rectangular shape having long sides in the y-axis direction when viewed in plan from the z-axis direction. An example of the material of the insulating layer 170 is polyimide.
  • a cathode pad electrode 912 is provided on a portion of the surface of the insulating layer 170 on the negative side in the y-axis direction.
  • the cathode pad electrode 912 is connected to the cathode electrode 911 via the cathode wiring electrode 913.
  • an anode pad electrode 922 is provided on a portion on the positive side in the y-axis direction on the surface of the insulating layer 170.
  • the anode pad electrode 922 and the cathode pad electrode 912 are provided apart from each other by a predetermined distance.
  • the anode pad electrode 922 is connected to the anode ring electrode 921 through the anode wiring electrode 923.
  • the light emitting element array 100 is provided with grooves 180 for dividing the VCSELs 100A and 100B.
  • the grooves 180 are grooves provided in a lattice shape parallel to the x-axis direction and the y-axis direction when viewed in plan from the z-axis direction.
  • the trench 180 penetrates the insulating film 162, the N-type DBR layer 132, and the N-type semiconductor contact layer 130 in the stacking direction. Further, the bottom of the groove 180 reaches a predetermined depth from the surface of the base substrate 128. As a result, the VCSELs 100A and 100B can be prevented from conducting via the N-type semiconductor contact layer 130.
  • stimulated emission occurs in the active layer 136 by flowing a current (drive signal) from the cathode pad electrode 912 to the anode pad electrode 922. .
  • the light emitted from the active layer by stimulated emission is reflected by the N-type DBR layer 132 and the P-type DBR layer 140 and reciprocates through the active layer. During the reciprocation, the light is amplified by stimulated emission and is emitted as a laser beam to the positive side in the z-axis direction.
  • the N-type semiconductor contact layer 130 of the VCSEL 100A and the N-type semiconductor contact layer 130 of the VCSEL 100B are separated, the occurrence of crosstalk between the drive signal of the VCSEL 100A and the drive signal of the VCSEL 100B is suppressed. .
  • FIG. 6 is an external perspective view of the receptacle 20 according to the embodiment of the present invention (the metal cap 30 is not shown).
  • FIG. 7 is an external perspective view of a positioning member 200 according to an embodiment of the present invention.
  • FIG. 8 is a plan view of the positioning member 200 according to one embodiment of the present invention from the negative direction side in the z-axis direction.
  • FIG. 9 is a view in which the mounting substrate 22 and the plug 40 according to the embodiment of the present invention are added to the cross section taken along the line CC or DD of the positioning member 200 shown in FIG.
  • the positioning member 200 is provided across the mounting substrate 22 and the sealing resin 24 so as to cover the surface of the mounting substrate 22 and substantially the entire sealing resin 24.
  • the positioning member 200 includes a light receiving element positioning member 220 and a light emitting element positioning member 240.
  • the positioning members 220 and 240 are provided so as to be arranged in this order from the negative direction side in the y-axis direction toward the positive direction side.
  • the positioning member 200 is made of, for example, an epoxy or nylon resin.
  • the light receiving element positioning member 220 has a rectangular shape when viewed in plan from the z-axis direction. Further, the positioning member 220 includes a plug guide part 222 and an optical coupling part 224.
  • the plug guide portion 222 constitutes a portion of the positioning member 220 on the negative direction side of the x axis. Further, as shown in FIG. 8, the plug guide portion 222 is a plate-like member having a rectangular shape when viewed in plan from the z-axis direction. Furthermore, the end surface S1 on the positive side in the x-axis direction of the plug guide portion 222 faces the surface on the negative direction side in the x-axis direction of the sealing resin 24 as shown in FIG. Accordingly, the plug guide portion 222 is located on the negative side in the x-axis direction with respect to the sealing resin 24 on the mounting substrate 22.
  • a groove G1 for guiding a plug 40 to be described later is provided substantially parallel to the x-axis at the approximate center in the y-axis direction on the surface of the plug guide portion 222.
  • a portion on the negative direction side in the y-axis direction from the groove G1 is referred to as a flat portion F1
  • a portion on the positive direction side in the y-axis direction from the groove G1 is referred to as a flat portion F2.
  • the height h1 of the groove G1 from the mounting substrate 22 in the z-axis direction is lower than the height h2 of the sealing resin 24 in the z-axis direction.
  • the optical coupling portion 224 constitutes a portion on the positive direction side in the x-axis direction of the positioning member 220 and is placed on the sealing resin 24.
  • the optical coupling part 224 has a main body 226 and an abutting part 228 as shown in FIG.
  • the main body 226 has a rectangular parallelepiped shape.
  • the abutting portion 228 protrudes from the end surface S2 on the negative side in the x-axis direction of the main body 226 along the flat portion F1 of the plug guide portion 222 to the approximate center of the flat portion F1 in the x-axis direction.
  • the optical coupling part 224 is L-shaped when viewed in plan from the z-axis direction.
  • the end surface of the abutting portion 228 on the negative side in the x-axis direction is referred to as an end surface S3.
  • the optical coupling portion 224 is provided with a concave portion D1 and a convex lens 230.
  • the recess D1 is provided in the vicinity of the side on the positive side of the optical coupling portion 224 in the y-axis direction. Further, the concave portion D1 overlaps the light receiving element array 50 when viewed in plan from the z-axis direction. Further, the recess D1 overlaps with the optical axis of the optical fiber 60 connected to the plug 40 described later when viewed in plan from the x-axis direction. Note that the optical axis of the optical fiber 60 is parallel to the x-axis. Moreover, the recessed part D1 has comprised the rectangular shape, when it planarly views from a z-axis direction, as shown in FIG. Furthermore, as shown in FIG. 9, the recess D ⁇ b> 1 has a V shape when viewed in plan from the y-axis direction.
  • the inner peripheral surface on the negative side in the x-axis direction of the recess D1 is a total reflection surface R1.
  • the total reflection surface R1 is parallel to the y-axis as shown in FIG. Furthermore, the total reflection surface R1 is inclined 45 ° counterclockwise with respect to the z-axis direction when viewed in plan from the negative direction side in the y-axis direction. Further, the refractive index of the positioning member 200 is sufficiently larger than that of air. Accordingly, the laser beam B1 emitted from the optical fiber 60 to the positive direction side in the x-axis direction is incident on the optical coupling portion 224, and is totally reflected by the total reflection surface R1 in the negative direction side in the z-axis direction.
  • the total reflection surface R ⁇ b> 1 is provided on the optical path connecting the optical fiber 60 and the light receiving element array 50.
  • the angle formed by the optical axis of the laser beam B1 emitted from the optical fiber 60 and the total reflection surface R1 is 45 °.
  • the angle formed by the optical axis of the laser beam B1 toward the total reflection surface R1 is 45 °. That is, the angle formed by the total reflection surface R1 and the optical axis of the optical fiber 60 is equal to the angle formed by the total reflection surface R1 and the optical axis of the light receiving element array 50.
  • the convex lens 230 (first convex lens) is provided on the surface on the negative direction side in the z-axis direction of the optical coupling portion 224, as shown in FIGS. Further, the convex lens 230 overlaps the light receiving element array 50 when viewed in plan from the z-axis direction. Thereby, the convex lens 230 faces the light receiving element array 50 and is positioned on the optical path of the laser beam B1.
  • the convex lens 230 has a semicircular shape that protrudes toward the negative direction side in the z-axis direction when viewed in a plan view from a direction orthogonal to the z-axis. Accordingly, the laser beam B 1 emitted from the optical fiber 60 is reflected by the total reflection surface R 1, then condensed or collimated by the convex lens 230, and travels toward the light receiving element array 50.
  • the positioning member 240 for the light emitting element has a rectangular shape when seen in a plan view from the z-axis direction. Further, the positioning member 240 includes a plug guide part 242 and an optical coupling part 244.
  • the plug guide portion 242 constitutes a portion of the positioning member 240 on the negative side of the x axis.
  • the plug guide portion 242 is a plate-like member having a rectangular shape when viewed in plan from the z-axis direction.
  • the end surface S4 on the positive direction side in the x-axis direction of the plug guide portion 242 faces the surface on the negative direction side in the x-axis direction of the sealing resin 24 as shown in FIG. That is, the plug guide portion 242 is located on the negative side in the x-axis direction with respect to the sealing resin 24 on the mounting substrate 22.
  • a groove G2 for guiding a plug 40 to be described later is provided substantially parallel to the x-axis at the approximate center in the y-axis direction on the surface of the plug guide portion 242.
  • a portion on the negative side in the y-axis direction from the groove G2 is referred to as a flat portion F3
  • a portion on the positive direction side in the y-axis direction from the groove G2 is referred to as a flat portion F4.
  • the height h3 of the groove G2 from the actually measured substrate 22 in the z-axis direction is lower than the height h2 of the sealing resin 24 in the z-axis direction, as shown in FIG.
  • the optical coupling portion 244 constitutes a portion on the positive direction side in the x-axis direction of the positioning member 240 and is placed on the sealing resin 24.
  • the optical coupling part 244 has a main body 246 and an abutting part 248 as shown in FIG.
  • the main body 246 has a rectangular parallelepiped shape.
  • the abutting portion 248 protrudes from the end surface S5 on the negative side in the x-axis direction of the main body 246 to the approximate center in the x-axis direction of the flat portion F4 along the flat portion F4 of the plug guide portion 242.
  • the optical coupling unit 244 has an L shape when viewed in plan from the z-axis direction.
  • the end surface on the negative direction side in the x-axis direction of the abutting portion 248 is referred to as an end surface S6.
  • the optical coupling portion 244 is provided with a concave portion D2 and a convex lens 250.
  • the recess D2 is provided in the vicinity of the side on the negative direction side in the y-axis direction of the optical coupling portion 244.
  • the recess D2 overlaps the light emitting element array 100 when viewed in plan from the z-axis direction.
  • the recess D2 overlaps with the optical axis of the optical fiber 60 connected to the plug 40 described later when viewed in plan from the x-axis direction.
  • the optical axis of the optical fiber 60 is parallel to the x-axis.
  • the recessed part D2 has comprised the rectangular shape, when it planarly views from a z-axis direction, as shown in FIG.
  • the recess D ⁇ b> 2 has a V shape when viewed in plan from the y-axis direction.
  • the inner peripheral surface on the negative direction side in the x-axis direction of the recess D2 is a total reflection surface R2.
  • the total reflection surface R2 is parallel to the y-axis as shown in FIG. Further, the total reflection surface R2 is inclined 45 ° counterclockwise with respect to the z-axis direction when viewed in plan from the negative direction side in the y-axis direction. Further, the refractive index of the positioning member 200 is sufficiently larger than that of air.
  • the laser beam B2 emitted from the light emitting element array 100 to the positive z-axis direction is incident on the optical coupling unit 244, and is totally reflected by the total reflection surface R2 to the negative x-axis side, thereby causing the plug 40 To the optical fiber 60 via That is, the total reflection surface R ⁇ b> 2 is provided on an optical path connecting the optical fiber 60 and the light emitting element array 100.
  • the angle formed by the optical axis of the laser beam B2 emitted from the light emitting element array 100 and the total reflection surface R2 is 45 °.
  • the angle formed by the optical axis of the laser beam B2 toward the total reflection surface R2 is 45 °. That is, the angle formed by the total reflection surface R2 and the optical axis of the optical fiber 60 is equal to the angle formed by the total reflection surface R2 and the optical axis of the light emitting element array 100.
  • the convex lens 250 (first convex lens) is provided on the back surface of the optical coupling portion 244 as shown in FIGS. Each convex lens 250 overlaps the light emitting element array 100 when viewed in plan from the z-axis direction. As a result, the convex lens 250 faces the light emitting element array 100 and is positioned on the optical path of the laser beam B2. Further, the convex lens 250 has a semicircular shape that protrudes toward the negative side in the z-axis direction when seen in a plan view from a direction orthogonal to the z-axis. Therefore, the laser beam B2 emitted from the light emitting element array 100 is condensed or collimated by the convex lens 250 and travels toward the total reflection surface R2.
  • FIG. 10 is an external perspective view of a metal cap 30 according to an embodiment of the present invention.
  • the metal cap 30 is manufactured by bending a single metal plate (for example, SUS301) into a U-shape. Further, as shown in FIG. 1, the metal cap 30 covers the positioning member 200 from the positive direction side in the z-axis direction, the positive direction side in the y-axis direction, and the negative direction side in the y-axis direction.
  • a single metal plate for example, SUS301
  • the metal cap 30 includes an upper surface 32 and side surfaces 34 and 36 as shown in FIG.
  • the upper surface 32 is a surface orthogonal to the z axis and has a rectangular shape.
  • the side surface 34 is formed by bending the metal cap 30 from the long side of the upper surface 32 on the negative direction side in the y-axis direction to the negative direction side in the z-axis direction.
  • the side surface 36 is formed by bending the metal cap 30 from the long side of the upper surface 32 on the positive direction side in the y-axis direction to the negative direction side in the z-axis direction.
  • engaging portions 32 a and 32 b for fixing the plug 40 to the receptacle 20 are provided on the negative side portion of the upper surface 32 in the x-axis direction.
  • the engaging portions 32a and 32b are provided in this order from the negative direction side in the y-axis direction toward the positive direction side.
  • the engaging portions 32a and 32b are formed by making a U-shaped cut in the upper surface 32. More specifically, each of the engaging portions 32a and 32b has a U-shaped notch that opens in the positive direction of the x axis in the upper surface 32, and a portion surrounded by the U-shaped notch is negative in the z-axis direction. It is formed by bending so as to be recessed in the direction side. Thus, the engaging portions 32a and 32b have a V-shape that protrudes in the negative direction side in the z-axis direction when viewed in plan from the y-axis direction.
  • engaging portions 32c and 32d for fixing the plug 40 to the receptacle 20 are provided on the short side of the upper surface 32 on the negative side in the x-axis direction.
  • the engaging portions 32c and 32d are metal pieces protruding from the upper surface 32 toward the negative direction side in the x-axis direction.
  • the engaging portions 32c and 32d are bent so as to be recessed toward the negative direction side in the z-axis direction at a substantially central position in the x-axis direction in the engaging portions 32c and 32d.
  • the engaging portions 32c and 32d have a V-shape protruding in the negative direction side in the z-axis direction when viewed in plan from the y-axis direction.
  • convex portions C1 to C3 projecting toward the negative direction side in the z-axis direction are formed from the negative direction side in the x-axis direction. They are arranged in this order toward the positive direction.
  • the convex portions C1 to C3 are each fixed to the mounting substrate 22 with an adhesive.
  • the convex portion C1 is connected to the ground conductor exposed portion E2 of the mounting substrate 22.
  • the convex portion C3 is fitted into a space H1 provided between the leg portion 24b and the leg portion 24c of the sealing resin 24. Thereby, the metal cap 30 is positioned with respect to the mounting substrate 22.
  • convex portions C4 to C6 projecting toward the negative direction side in the z-axis direction are formed from the negative direction side in the x-axis direction. They are arranged in this order toward the positive direction.
  • the convex portions C4 to C6 are each fixed to the mounting substrate 22 with an adhesive.
  • the convex portion C4 is connected to the ground conductor exposed portion E3 of the mounting substrate 22.
  • the convex portion C6 is fitted into a space H2 provided between the leg portion 24d and the leg portion 24e of the sealing resin 24. Thereby, the metal cap 30 is positioned with respect to the mounting substrate 22.
  • the metal cap 30 covers the positioning member 200 from the positive direction side in the z-axis direction and from the positive direction side and the negative direction side in the y-axis direction.
  • An opening A3 into which a plug 40 described later is inserted is formed on the negative side of the receptacle 20 in the x-axis direction.
  • FIG. 11 is an external perspective view of a plug according to an embodiment of the present invention.
  • FIG. 12 is a plan view of a plug according to an embodiment of the present invention from the negative side in the z-axis direction.
  • the plug 40 is provided at one end of the optical fiber 60 as shown in FIG.
  • the plug 40 includes a reception side plug 42 and a transmission side plug 46.
  • the plug 40 is made of, for example, an epoxy or nylon resin.
  • the receiving side plug 42 transmits the laser beam B1 from the optical fiber 60.
  • the receiving side plug 42 includes an optical fiber insertion portion 42a and an ear portion 42b.
  • the optical fiber insertion portion 42a constitutes a portion on the positive direction side in the y-axis direction of the reception-side plug 42, and has a rectangular parallelepiped shape extending in the x-axis direction.
  • An opening A1 for inserting the optical fiber 60 is provided in a portion on the negative side in the x-axis direction of the optical fiber insertion portion 42a.
  • the opening A1 is formed by cutting out the upper surface S7 on the positive direction side in the z-axis direction and the end surface S8 on the negative direction side in the x-axis direction of the optical fiber insertion portion 42a.
  • a hole H7 for guiding the core of the inserted optical fiber 60 to the tip of the receiving side plug 42 is provided on the inner peripheral surface of the opening A1 on the positive side in the x-axis direction. Note that the number of holes H7 corresponds to the number of optical fibers 60, and is two in this embodiment.
  • a concave portion D3 for injecting an adhesive for fixing the optical fiber 60 is provided in a portion on the positive side in the x-axis direction of the optical fiber insertion portion 42a.
  • the recess D3 is recessed from the front surface to the back surface of the optical fiber insertion portion 42a.
  • a hole H7 is provided on the inner peripheral surface on the negative direction side in the x-axis direction of the recess D3.
  • the hole H7 is connected to the inner peripheral surface of the opening A1 on the positive direction side in the x-axis direction. Accordingly, the core wire of the optical fiber 60 reaches the recess D3 from the opening A1 through the hole H7.
  • the core wire of the optical fiber 60 that has reached the recess D3 is abutted against the inner peripheral surface (abutment surface) S9 on the positive side in the x-axis direction of the recess D3.
  • the optical fiber 60 is fixed to the receiving side plug 42 by pouring an adhesive made of a transparent resin, for example, an epoxy resin into the opening A1 and the recess D3.
  • a convex lens 44 (fourth convex lens) is provided on the end surface S10 on the positive side in the x-axis direction of the optical fiber insertion portion 42a.
  • the convex lens 44 has a semicircular shape protruding in the positive direction side in the x-axis direction when seen in a plan view from a direction orthogonal to the x-axis direction. Thereby, the laser beam B ⁇ b> 1 emitted from the optical fiber 60 is condensed or collimated by the convex lens 44.
  • the convex lens 44 overlaps the optical axis of the optical fiber 60 when viewed in plan from the x-axis direction. Accordingly, the laser beam B1 is condensed or collimated by the convex lens 44 and proceeds to the total reflection surface R1. The laser beam B1 is reflected by the total reflection surface R1 and transmitted to the light receiving element array 50.
  • a protrusion N1 that engages with the engaging portion 32a of the metal cap 30 is provided on the upper surface S7 of the optical fiber insertion portion 42a.
  • the protrusion N1 is provided between the opening A1 and the recess D3 in the x-axis direction, and extends in the y-axis direction. Further, the protrusion N1 has a triangular shape protruding in the positive direction side in the z-axis direction when viewed in plan from the y-axis direction.
  • a convex portion C7 is provided on the back surface of the optical fiber insertion portion 42a.
  • the convex portion C7 corresponds to the groove G1 of the plug guide portion 222 of the positioning member 220.
  • the convex portion C7 is provided in parallel to the x-axis direction from the end surface S8 toward the end surface S10.
  • the ear portion 42b protrudes from the vicinity of the end portion on the negative direction side in the x-axis direction of the optical fiber insertion portion 42a toward the negative direction side in the y-axis direction.
  • the receiving side plug 42 is L-shaped.
  • edge part 42b functions as a holding part in the case of the insertion / extraction operation
  • a substantially rectangular hollow hole is provided in the approximate center of the ear portion 42b when viewed in plan from the z-axis direction.
  • connection work between the receiving side plug 42 and the receptacle 20 is performed by pushing the convex portion C7 along the groove G1 to the positive side in the x-axis direction. At this time, the end surface S11 on the positive side in the x-axis direction of the ear portion 42b abuts against the end surface S3 of the abutting portion 228 of the positioning member 200 shown in FIG.
  • the receiving side plug 42 is placed on the positioning member 220 by the connection work between the receiving side plug 42 and the receptacle 20. Furthermore, as described above, the optical axis of the optical fiber 60 is parallel to the x-axis direction, and the direction in which the receiving-side plug 42 is pushed into the receptacle 20 is the positive direction side in the x-axis direction. Therefore, the optical axis of the optical fiber 60 and the insertion direction of the receiving side plug 42 are parallel.
  • the engaging portion 32a of the metal cap 30 is engaged with the protrusion N1
  • the engaging portion 32c is formed by the upper surface S7 and the end surface S8 of the receiving side plug 42.
  • the receiving side plug 42 is fixed to the receptacle 20 by engaging with the corner.
  • the transmission side plug 46 transmits the laser beam B2 from the light emitting element array 100.
  • the transmission-side plug 46 includes an optical fiber insertion portion 46a and an ear portion 46b.
  • the optical fiber insertion portion 46a constitutes a portion on the negative direction side of the transmission side plug 46 in the y-axis direction, and has a substantially rectangular parallelepiped shape.
  • An opening A2 for inserting the optical fiber 60 is provided in a portion on the negative direction side in the x-axis direction of the optical fiber insertion portion 46a.
  • the opening A2 is formed by cutting out the upper surface S12 on the positive direction side in the z-axis direction and the end surface S13 on the negative direction side in the x-axis direction of the optical fiber insertion portion 46a. Further, a hole H8 for guiding the core wire of the inserted optical fiber 60 to the tip of the transmission side plug 46 is provided on the inner peripheral surface of the opening A2 on the positive side in the x-axis direction.
  • the number of holes H8 corresponds to the number of the optical fibers 60, and is two in this embodiment.
  • a concave portion D4 for injecting an adhesive for fixing the optical fiber 60 is provided in a portion on the positive side in the x-axis direction of the optical fiber insertion portion 46a.
  • the recess D4 is recessed from the front surface to the back surface of the optical fiber insertion portion 46a.
  • a hole H8 is provided on the inner peripheral surface on the negative direction side in the x-axis direction of the recess D4.
  • the hole H8 is connected to the inner peripheral surface on the positive direction side in the x-axis direction of the opening A2. Accordingly, the core wire of the optical fiber 60 reaches the recess D4 from the opening A2 through the hole H8.
  • the core of the optical fiber 60 that has reached the recess D4 is abutted against the inner peripheral surface (abutment surface) S14 on the positive side in the x-axis direction of the recess D4.
  • the optical fiber 60 is fixed to the transmission side plug 46 by pouring an adhesive made of a transparent resin, for example, an epoxy resin into the opening A2 and the recess D4.
  • a convex lens 48 (fourth convex lens) is provided on the end surface S15 on the positive side in the x-axis direction of the optical fiber insertion portion 46a.
  • the convex lens 48 has a semicircular shape protruding in the positive direction side in the x-axis direction when seen in a plan view from a direction orthogonal to the x-axis. Thereby, the laser beam B2 emitted from the light emitting element array 100 and reflected by the total reflection surface R2 is condensed or collimated by the convex lens 48.
  • the convex lens 48 overlaps the optical axis of the optical fiber 60 when viewed in plan from the x-axis direction. Accordingly, the laser beam B2 condensed or collimated by the convex lens 48 passes through the resin of the optical fiber insertion portion 46a. Then, the laser beam B2 is transmitted to the core of the core of the optical fiber 60 that is abutted against the abutting surface S14.
  • a protrusion N2 that engages with the engaging portion 32b of the metal cap 30 is provided on the upper surface S12 of the optical fiber insertion portion 46a.
  • the protrusion N2 is provided between the opening A2 and the recess D4 in the x-axis direction, and extends in the y-axis direction. Further, the protrusion N2 has a triangular shape protruding in the positive direction side in the z-axis direction when viewed in plan from the y-axis direction.
  • a convex portion C8 is provided on the back surface of the optical fiber insertion portion 46a.
  • the convex portion C8 corresponds to the groove G2 of the plug guide portion 242 of the positioning member 240.
  • the convex portion C8 is provided in parallel to the x-axis direction from the end surface S13 toward the end surface S15.
  • the ear 46b protrudes from the end on the negative direction side in the x-axis direction of the optical fiber insertion portion 46a to the positive direction side in the y-axis direction.
  • the transmission side plug 46 is L-shaped.
  • edge part 46b functions as a holding part in the case of the insertion / extraction operation
  • a substantially rectangular hollow hole is provided in the approximate center of the ear 46b when viewed in plan from the z-axis direction.
  • connection work between the transmission side plug 46 and the receptacle 20 is performed by pushing the convex portion C8 along the groove G2 to the positive side in the x-axis direction. At this time, the end surface S16 on the positive side in the x-axis direction of the ear portion 46b abuts against the end surface S6 of the abutting portion 248 of the positioning member 200 shown in FIG.
  • the transmission side plug 46 is placed on the positioning member 240 by the connection work between the transmission side plug 46 and the receptacle 20. Furthermore, as described above, the optical axis of the optical fiber 60 is parallel to the x-axis direction, and the direction in which the transmission side plug 46 is pushed into the receptacle 20 is the positive direction side in the x-axis direction. Therefore, the optical axis of the optical fiber 60 and the insertion direction of the receiving side plug 46 are parallel.
  • the engaging portion 32b of the metal cap 30 is engaged with the protrusion N2, and the engaging portion 32d is formed by the upper surface S12 and the end surface S13 of the receiving side plug 46.
  • the transmission-side plug 46 is fixed to the receptacle 20.
  • the laser beam B ⁇ b> 1 emitted from the optical fiber 60 toward the positive direction in the x-axis direction passes through the plug 40 and the positioning member 220. Further, the laser beam B 1 is reflected by the total reflection surface R 1 to the negative direction side in the z-axis direction, passes through the sealing resin 24, and is transmitted to the light receiving element 50. Therefore, the positioning member 220 plays a role of optically coupling the core of the optical fiber 60 and the light receiving element array 50.
  • the laser beam B2 emitted from the light emitting element array 100 to the positive direction side in the z-axis direction passes through the sealing resin 24 and the positioning member 240. Further, the laser beam B2 is reflected by the total reflection surface R2 to the negative direction side in the x-axis direction, passes through the plug 40, and is transmitted to the core of the optical fiber 60. Accordingly, the positioning member 240 plays a role of optically coupling the core of the optical fiber 60 and the light emitting element array 100.
  • an N-type semiconductor contact layer 130, an N-type DBR layer 132, an N-type semiconductor clad layer 134, an active layer 136, a P-type semiconductor clad layer 138, a P-type DBR layer 140, and a P-type semiconductor contact are formed on the surface of the base substrate 128.
  • Layer 142 is stacked in this order.
  • the P-type semiconductor contact layer 142, the P-type DBR layer 140, the P-type semiconductor clad layer 138, the active layer 136, and the N-type semiconductor clad layer are excluded except for the portions constituting the light emitting region multilayer portion 160 of each VCSEL 100A, 100B 134 are sequentially etched in a predetermined pattern.
  • etching is performed up to the surface of the N-type DBR layer 132.
  • the N-type semiconductor contact layer 130 is exposed by etching a position in the region where the surface of the N-type DBR layer 132 is exposed and close to the light emitting region multilayer section 160.
  • a cathode electrode 911 is formed in a region where the N-type semiconductor contact layer 130 is exposed.
  • an anode ring electrode 921 is formed on the surface of the P-type semiconductor contact layer 142 of the light emitting region multilayer part 160 that has not been etched.
  • the insulating film 162 is formed on the surface side of the base substrate 128 except for the surfaces of the cathode electrode 911 and the anode ring electrode 921.
  • An insulating layer 170 is formed in a region close to the light emitting region multilayer portion 160 on the surface of the insulating film 162.
  • a cathode pad electrode 912 and an anode pad electrode 922 are formed on the surface of the insulating layer 170.
  • a cathode wiring electrode 913 that connects the cathode electrode 911 and the cathode pad electrode 912 is formed.
  • An anode wiring electrode 923 that connects the anode ring electrode 921 and the anode pad electrode 922 is formed.
  • the light emitting element array 100 is formed by the processes as described above.
  • FIG. 13 is a diagram of a manufacturing process of a receptacle according to an embodiment of the present invention.
  • solder is applied to the surface of a mother substrate 122 (not shown in the drawing) which is an assembly of the mounting substrates 22. More specifically, cream solder is pressed onto the mother substrate 122 on which the metal mask is placed using a squeegee. Then, the solder is printed on the mother substrate 122 by removing the metal mask from the mother substrate 122.
  • the capacitor is placed on the solder of the mother board 122. Thereafter, heat is applied to the mother substrate 122 to solder the capacitor.
  • Ag paste is applied to a predetermined position on the mother substrate 122.
  • the drive circuit 26, the light receiving element array 50, and the light emitting element array 100 are mounted on the coated Ag, and die bonding is performed. Further, the drive circuit 26 and the light receiving element array 50 are connected by wire bonding using Au wires, and the drive circuit 26 and the light emitting element array 100 are connected by wire bonding.
  • the plurality of mounting boards 22 are obtained by cutting the mother board 122 using a dicer.
  • the positioning member 220 is placed on the mounting substrate 22 and the sealing resin 24. More specifically, a UV curable adhesive is applied to the negative region in the x-axis direction on the surface of the sealing portion 24a. After applying the adhesive, as shown in FIG. 13, the position of the center T50 of the light emitting part of the light receiving element array 50 is confirmed by the position recognition camera V1.
  • the mounting machine V2 for placing the positioning member 220 on the sealing resin 24 picks up and picks up the positioning member 220. Then, as shown in FIG. 13, the position of the lens center T230 of the convex lens 230 of the positioning member 220 is confirmed by the position recognition camera V3 in a state where the mounting machine V2 sucks the positioning member 220.
  • the light receiving element array 50 From the position data of the center T50 of the light receiving portion of the light receiving element array 50 confirmed by the position recognition camera V1 and the position data of the lens center T230 of the convex lens 230 of the positioning member 220 confirmed by the position recognition camera V3, the light receiving element array 50. The relative position between the light receiving unit and the convex lens 230 is calculated. Based on the calculated result, the movement amount of the onboard machine V2 is determined.
  • the positioning member 220 is moved by the determined movement amount by the mounting machine V2. Thereby, the lens center T230 of the convex lens 230 and the optical axis of the light receiving element array 50 coincide.
  • the positioning member 240 is mounted on the mounting substrate 22 and the sealing resin 24. More specifically, after a UV curable adhesive is applied to the negative region in the x-axis direction on the surface of the sealing portion 24a, the center of the light receiving portion of the light emitting element array 100 is obtained as shown in FIG. The position of T100 is confirmed by the position recognition camera V4.
  • the mounting machine V5 for mounting the positioning member 240 on the sealing resin 24 picks up and picks up the positioning member 240. Then, as shown in FIG. 13, the position of the lens center T250 of the convex lens 250 of the positioning member 240 is confirmed by the position recognition camera V6 in a state where the mounting machine V5 sucks the positioning member 240.
  • the light emitting element array 100 From the position data of the center T100 of the light emitting part of the light emitting element array 100 confirmed by the position recognition camera V4 and the position data of the lens center T250 of the convex lens 250 of the positioning member 240 confirmed by the position recognition camera V6, the light emitting element array 100. The relative positions of the light emitting part and the convex lens 250 are calculated. Based on the calculated result, the movement amount of the onboard machine V5 is determined.
  • the positioning member 240 is moved by the determined movement amount by the mounting machine V5. Thereby, the lens center T250 of the convex lens 250 and the optical axis of the light emitting element array 100 coincide.
  • the positioning members 220 and 240 are pressed against the mounting substrate 22 and the sealing resin 24 by the mounting machines V2 and V5. Accordingly, when the UV curable adhesive between the positioning members 220 and 240 and the sealing resin 24 is cured, the positioning members 220 and 240 are not displaced and the mounting substrate 22 and the sealing resin are disposed. 24 is fixed.
  • the metal cap 30 is attached to the mounting substrate 22 on which the positioning member 200 is placed. More specifically, it is the surface of the mounting substrate 22 and is a space H1 between the leg portions 24b and 24c, a space H2 between the leg portions 24d and 24e, and the convex portions C2 and C5 of the metal cap 30. Apply a thermosetting adhesive such as an epoxy to the part that contacts. Further, a conductive paste such as Ag is applied to the ground conductor exposed portions E2 and E3 of the mounting substrate 22.
  • the convex portion C3 of the metal cap 30 is fitted into a portion sandwiched between the leg portion 24b and the leg portion 24c of the sealing resin 24 on the mounting substrate 22, that is, the space H1. Further, the convex portion C6 is fitted into a portion sandwiched between the leg portion 24d and the leg portion 24e of the sealing resin 24, that is, the space H2. Thereby, the position of the metal cap 30 with respect to the mounting substrate 22 is determined. Simultaneously with the positioning of the metal cap 30, the convex portions C1 to C6 come into contact with the adhesive and the conductive paste on the mounting substrate 22.
  • the metal cap 30 After fitting the metal cap 30, heat is applied to the mounting substrate 22 to cure the adhesive and the conductive paste. Thereby, the metal cap 30 is fixed to the mounting substrate 22. Note that, by attaching the metal cap 30 to the mounting substrate 22, the convex portions C ⁇ b> 1 and C ⁇ b> 4 of the metal cap 30 come into contact with the ground conductor exposed portions E ⁇ b> 2 and E ⁇ b> 3 of the mounting substrate 22. Thereby, the metal cap 30 is connected to the ground conductor in the mounting substrate 22 and is kept at the ground potential.
  • the receptacle 20 is completed by the process as described above.
  • the optical fiber 60 inserted into the plug 40 is cut into a predetermined length.
  • the coating near the tip of the optical fiber 60 is removed using an optical fiber stripper. After removing the coating in the vicinity of the tip, cleaving is performed to bring out the cleavage plane of the core of the optical fiber 60.
  • a transparent adhesive such as an epoxy resin for fixing the optical fiber 60 is injected into the openings A1 and A2 and the recesses D3 and D4 of the plug 40. Furthermore, it pushes in until the core wire of the optical fiber 60 hits the surfaces S9 and S14 of the plug 40. Then, the optical fiber 60 is fixed to the plug 40 by curing the transparent adhesive.
  • the plug 40 is connected to the receptacle 20. As described above, the plug 40 is connected to the grooves G1 and G2 of the positioning members 220 and 240 along the protrusions C7 and C8 of the plug 40 and the opening provided between the metal cap 30 and the receptacle 20. This is performed by pushing from A3 toward the positive side in the x-axis direction.
  • the optical transmission module 10 is completed through the manufacturing process as described above.
  • the lenses 230 and 240 and the total reflection surfaces R1 and R2 can be reduced in size. More specifically, in the optical module 500, as shown in FIG. 17, the light P501 is emitted to the air from a plug 501 made of resin. The light P501 travels in the air, is reflected by the reflection lens 548, and reaches the optical element 539. On the other hand, in the optical transmission module 10 and the receptacle 20, as shown in FIG. 9, the laser beam B1 emitted from the optical fiber 60 passes through the positioning member 220 made of resin and is reflected by the total reflection surface R1. The laser beam B1 reflected by the total reflection surface R1 further passes through the sealing resin 24 and reaches the light receiving element 50.
  • the optical transmission module 10 and the receptacle 20 since the total reflection surface R1 is provided on the positioning member 220, the vicinity of the total reflection surface R1 is filled with resin. Thereby, most of the optical path connecting the optical fiber 60 and the light receiving element 50 is occupied by the resin. Accordingly, the ratio of the resin in the optical path connecting the optical fiber 60 and the light receiving element 50 in the optical transmission module 10 and the receptacle 20 is higher than the ratio of the resin in the optical path connecting the optical fiber 506 and the optical element 539 in the optical module 500. . Thereby, in the optical transmission module 10 and the receptacle 20, the spread of light due to the laser beam B1 traveling in the air can be suppressed.
  • the convex lens 230 that condenses or collimates the laser beam B1 and the total reflection surface R1 can be reduced in size.
  • the lens 250 and the total reflection surface R2 can be downsized for the same reason.
  • the optical loss of the laser beam B1 is reduced. More specifically, in the optical transmission module 10 and the receptacle 20, the laser beam B1 emitted from the optical fiber 60 passes through the sealing resin 24 in addition to the positioning member 220 made of resin. This further increases the proportion of resin in the optical path of the laser beam B1. As a result, the spread of the laser beam B1 is further suppressed. Accordingly, the intensity of the laser beam B1 incident on the light receiving element 50 is increased, and the optical loss of the laser beam B1 is reduced. For the same reason, the optical loss of the laser beam B2 is also reduced.
  • the insertion direction of the plug 40 into the receptacle 20 is the same x-axis direction as the optical axis of the optical fiber 60.
  • the surface mounting electrode E ⁇ b> 1 is provided on the back surface of the mounting substrate 22.
  • the light transmission module 10 can be surface-mounted without providing a connector for connection to the circuit board on which the light transmission module 10 is mounted. Therefore, the substantial occupied area of the light transmission module 10 on the circuit board on which the light transmission module 10 is mounted can be suppressed.
  • a convex lens 230 is provided on the back surface of the optical coupling portion 224 of the positioning member 220. Accordingly, the laser beam B 1 from the optical fiber 60 passes through the convex lens 230. At this time, even if the optical axis of the laser beam B1 reflected by the total reflection surface R1 is shifted, the laser beam B1 is condensed or collimated by the convex lens 230 and proceeds to the light receiving element array 50. Therefore, according to the receptacle 20 and the optical transmission module 10, the optical loss due to the optical axis shift of the laser beam B1 can be suppressed.
  • a convex lens 250 is provided on the back surface of the optical coupling portion 244 of the positioning member 200. Accordingly, the laser beam B ⁇ b> 2 from the light emitting element array 100 passes through the convex lens 250. At this time, even if the position of the light emitting element array 100 is shifted from the positioning member 240, the laser beam B2 is condensed or collimated by the convex lens 250 and proceeds to the total reflection surface R2. . Therefore, according to the receptacle 20 and the optical transmission module 10, it is possible to suppress optical loss due to the positional deviation of the light emitting element array 100.
  • a convex lens 44 is provided on the end surface S ⁇ b> 10 of the receiving side plug 42. Accordingly, the laser beam B 1 from the optical fiber 60 passes through the convex lens 44. At this time, even if the position of the optical fiber 60 is misaligned with respect to the plug 40, the laser beam B1 is condensed or collimated by the convex lens 44 and proceeds to the total reflection surface R1. Therefore, according to the optical transmission module 10, it is possible to suppress optical loss due to the positional deviation of the optical fiber 60.
  • a convex lens 48 is provided on the end surface S ⁇ b> 15 of the transmission side plug 46. Therefore, the laser beam B2 reflected by the total reflection surface R2 passes through the convex lens 48. At this time, the laser beam B ⁇ b> 2 is condensed or collimated by the convex lens 48 and proceeds to the optical fiber 60. Therefore, according to the optical transmission module 10, it is possible to suppress optical loss due to the optical axis shift of the laser beam B1.
  • FIG. 14 is a cross-sectional view of a conventional receptacle and plug. More specifically, when the entire positioning member 200 is provided on the sealing resin 25 as in the optical transmission module 400 illustrated in FIG. 14, the thickness of the plug 41 in the z-axis direction is reduced. Therefore, the strength of the plug 41 is reduced. Therefore, in the optical transmission module 10, as shown in FIG. 9, the positioning member 200 is provided across the mounting substrate 22 and the sealing resin 24. Further, the plug 40 is positioned on the plug guide portions 222 and 242 of the positioning member 200.
  • the heights h1 and h3 of the grooves G1 and G2 of the plug guide portions 222 and 242 are lower than the height h2 of the sealing resin 24.
  • the optical axis of the optical fiber 60 is located on the positive side in the z-axis direction with respect to the sealing resin 24.
  • the plug 40 can be enlarged in the z-axis direction, it is easier to grip than the plug 41 of the optical transmission module 400. Therefore, in the optical transmission module 10, it is easy to connect the plug 40 to the receptacle 20.
  • an opening A3 is provided between the metal cap 30 and the receptacle 20 in the optical transmission module 10 as shown in FIG.
  • the plug 40 is connected by inserting the plug 40 from the opening A3. Therefore, in the optical transmission module 10, it is not necessary to remove the metal cap 30 when attaching / detaching the plug 40, and the attachment / detachment work of the plug 40 is easy.
  • the metal cap 30 is provided with engaging portions 32a to 32d for fixing the plug 40. Thereby, the position shift with respect to the positioning member 200 of the plug 40 is prevented. As a result, the optical axis shift of the optical fiber 60 is prevented. Therefore, according to the optical transmission module 10, the optical axis shift of the optical fiber 60 can be prevented and the optical loss can be suppressed.
  • the positioning member 200 is attached to the mounting board 22, conventionally, a pin P1 provided on the mounting board 22 as shown in FIG. 15 has been used.
  • the positioning member 200 is fixed to the mounting substrate 22 by inserting the pin P ⁇ b> 1 provided on the mounting substrate 22 into the hole H ⁇ b> 9 provided in the positioning member 200.
  • a positional shift occurs between the light receiving element array 50 and the convex lens 230 of the positioning member 200 due to a positional shift at the time of manufacturing P1 on the mounting substrate 22 or a positional shift at the time of mounting the light receiving element array 50.
  • the positioning member 200 when the positioning member 200 is attached to the mounting substrate 22, the positional relationship between the center T50 of the light emitting part of the light receiving element array 50 and the lens center T230 of the convex lens 230 is determined.
  • the positioning member 200 is placed on the mounting substrate 22 while being confirmed by the position confirmation camera. Therefore, the light receiving element array 50 and the convex lens 230 are directly positioned without going through the pin P1.
  • the occurrence of a positional deviation between the light receiving element array 50 and the convex lens 230 is suppressed. Is done. For the same reason, it is also possible to suppress the positional deviation between the light emitting element array 100 and the convex lens 250.
  • FIG. 16 is a cross-sectional view of an optical transmission module 10 ′ and a receptacle 20 ′ according to a modification.
  • FIG. 1 is used for the external view.
  • the difference between the light transmission module 10 and the light transmission module 10 ′ is that the positioning member 200 is further provided with a convex lens. Since the other points are not different between the optical transmission module 10 and the optical transmission module 10 ', description thereof will be omitted.
  • the same components as those of the light transmission module 10 are denoted by the same reference numerals as those of the light transmission module 10.
  • a convex lens 232 (third convex lens) is provided on the total reflection surface R1 of the positioning member 220. Therefore, the total reflection surface R1 is convex when viewed in plan from the y-axis direction. As a result, the laser beam B 1 emitted from the optical fiber 60 is condensed or collimated by the convex lens 232 and transmitted to the light receiving element array 50. Therefore, according to the optical transmission module 10 ′, optical loss can be further suppressed as compared with the optical transmission module 10.
  • a convex lens 234 (second convex lens) is provided on the surface of the positioning member 220 facing the receiving side plug 42 as shown in FIG.
  • the laser beam B1 emitted from the optical fiber 60 is condensed or collimated by the convex lens 234 and transmitted to the total reflection surface R1. Therefore, according to the optical transmission module 10 ′, optical loss can be further suppressed as compared with the optical transmission module 10.
  • a convex lens 252 (third convex lens) is provided on the total reflection surface R2 of the positioning member 240. Therefore, the total reflection surface R1 is convex when viewed in plan from the y-axis direction. Thereby, the laser beam B ⁇ b> 2 emitted from the light emitting element array 100 is condensed or collimated by the convex lens 252 and transmitted to the optical fiber 60. Therefore, according to the optical transmission module 10 ′, optical loss can be further suppressed as compared with the optical transmission module 10.
  • a convex lens 254 (second convex lens) is provided on the surface of the positioning member 240 facing the transmission side plug 46, as shown in FIG.
  • the laser beam B ⁇ b> 2 reflected by the total reflection surface R ⁇ b> 2 is collected or collimated by the convex lens 254 and transmitted to the optical fiber 60. Therefore, according to the optical transmission module 10 ′, optical loss can be further suppressed as compared with the optical transmission module 10.
  • the receptacle and the optical transmission module according to the present invention are not limited to the optical transmission modules 10 and 10 'according to the above-described embodiment, and can be changed within the scope of the gist thereof.
  • the present invention is useful for the receptacle and the optical transmission module, and is excellent in that the lens or the total reflection surface can be miniaturized.
  • E1 Electrode for surface mounting R1, R2 Total reflection surface 10
  • Optical transmission module 20
  • Receptacle 22
  • Mounting substrate 24
  • Sealing resin 26
  • Drive circuit 30
  • Metal cap 32a to 32d Engaging portion 40
  • Plug 50
  • Light receiving element array 60
  • Optical fiber 100
  • Light emitting element array 100A, 100B
  • VCSEL Very Cavity Surface Emitting Laser
  • Base substrate 160
  • Light emitting region multilayer portion Positioning member 230, 232, 234, 250, 252 and 254
  • Convex lens 911 Cathode electrode 921
  • Anode ring electrode 921

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Optical Couplings Of Light Guides (AREA)
PCT/JP2013/071774 2012-08-23 2013-08-12 レセプタクル及び光伝送モジュール WO2014030563A1 (ja)

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JP2012184391 2012-08-23
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JP2017161578A (ja) * 2016-03-07 2017-09-14 株式会社エンプラス 光レセプタクルおよび光モジュール
JP2017161577A (ja) * 2016-03-07 2017-09-14 株式会社エンプラス 光レセプタクルおよび光モジュール
JP2018537721A (ja) * 2015-12-15 2018-12-20 オプトマインド インコーポレイテッドＯｐｔｏｍｉｎｄ Ｉｎｃ． 光ファイバーケーブル用送受信装置及びその整列方法
US10409015B1 (en) 2015-12-15 2019-09-10 Optomind Inc. Optical receiving device including focusing lens and reflector mounted to housing body and collimating lens mounted to housing cover
JP2019184941A (ja) * 2018-04-16 2019-10-24 日本ルメンタム株式会社 光サブアセンブリ及びその製造方法並びに光モジュール
EP3580820B1 (en) * 2017-02-08 2022-03-30 Princeton Optronics, Inc. Vcsel illuminator package including an optical structure integrated in the encapsulant

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CN110618504A (zh) * 2019-09-24 2019-12-27 武汉光迅科技股份有限公司 一种光模块

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EP3580820B1 (en) * 2017-02-08 2022-03-30 Princeton Optronics, Inc. Vcsel illuminator package including an optical structure integrated in the encapsulant
JP2019184941A (ja) * 2018-04-16 2019-10-24 日本ルメンタム株式会社 光サブアセンブリ及びその製造方法並びに光モジュール
JP7117133B2 (ja) 2018-04-16 2022-08-12 日本ルメンタム株式会社 光サブアセンブリ及びその製造方法並びに光モジュール

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