WO2014029146A1 - 有源矩阵式有机电致发光二极管面板的封装结构 - Google Patents

有源矩阵式有机电致发光二极管面板的封装结构 Download PDF

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Publication number
WO2014029146A1
WO2014029146A1 PCT/CN2012/081314 CN2012081314W WO2014029146A1 WO 2014029146 A1 WO2014029146 A1 WO 2014029146A1 CN 2012081314 W CN2012081314 W CN 2012081314W WO 2014029146 A1 WO2014029146 A1 WO 2014029146A1
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Prior art keywords
pixel area
inorganic
organic
substrate
active matrix
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English (en)
French (fr)
Inventor
刘至哲
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US13/699,632 priority Critical patent/US20140054553A1/en
Publication of WO2014029146A1 publication Critical patent/WO2014029146A1/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays

Definitions

  • the present invention relates to the field of organic electroluminescent diodes, and more particularly to a package structure of an active matrix organic electroluminescent diode panel. Background technique
  • OLED Organic Light Emitting Device Display
  • ITO transparent electrode and the metal electrode as the anode and cathode of the device respectively.
  • electrons and holes are injected from the cathode and the anode to the electron and hole transport layers, respectively.
  • the electrons and holes pass through the electrons respectively.
  • the hole transport layer migrates to the light-emitting layer and meets in the light-emitting layer to form excitons and excite the light-emitting molecules, and the latter emits visible light through radiation relaxation. It has the following advantages:
  • the thickness can be less than 1 mm, only 1/3 of the LCD screen, and the weight is also lighter;
  • the response time is one thousandth of the LCD, and there is absolutely no smear in the motion picture
  • An object of the present invention is to provide a package structure of an active matrix organic electroluminescent diode panel, which has excellent package sealing property and adhesion, and is advantageous for large-sized active matrix organic electroluminescent diode panels. achieve.
  • a package structure of an active matrix organic electroluminescent diode panel includes: a substrate, a pixel region on the substrate, a plurality of inorganic packaging materials located outside the pixel region on the substrate, and a pixel region on the substrate a plurality of outer organic binders and a back cover covering the inorganic packaging material and the organic bonding material, wherein the plurality of circular inorganic packaging materials have at least one ring around the pixel region, and at least one of the plurality of organic bonding materials The encapsulation surrounds the pixel region, and the inorganic encapsulant is disposed separately from the organic binder.
  • the inorganic encapsulating material surrounding the pixel region has at least one turn having a width of between 300 and 2000 paintings.
  • the organic backing material surrounding the pixel region is at least one turn having a width of between 500 and 4000 drawings.
  • the inorganic packaging materials are directly contacted or spaced apart, and the organic bonding materials are directly contacted or spaced apart.
  • the inorganic encapsulant and the organic binder are arbitrarily arranged outside the pixel region.
  • the number of turns of the inorganic packaging material surrounding the pixel region outside the pixel region on the substrate is
  • the number of turns of the organic backing material surrounding the pixel region outside the pixel region on the substrate is 1.05.
  • the utility model further comprises an inorganic sealing material which is arranged around the pixel region on the substrate and is enclosed around the pixel region, wherein the organic sealing material is arranged between the two inorganic packaging materials.
  • a ring of organic backing that is non-sealed around the pixel area on the substrate and is disposed between the two organic substrates.
  • the inorganic packaging material is a glass glue.
  • the organic binder is an organic rubber material, and the organic rubber material is an epoxy resin.
  • the invention also provides a package structure of an active matrix organic electroluminescent diode panel, comprising: a substrate, a pixel region on the substrate, a plurality of inorganic packaging materials located outside the pixel region on the substrate, and located outside the pixel region on the substrate a plurality of organic binders, and a back cover covering the inorganic packaging material and the organic bonding material, wherein the plurality of circular inorganic packaging materials have at least one ring enclosed around the pixel region, and at least one of the plurality of organic bonding materials is sealed Surrounding the pixel region, the inorganic packaging material is disposed separately from the organic bonding material; Wherein the inorganic package material enclosed around the pixel region has a width of at least one turn
  • organic connecting material surrounding the pixel region is at least one turn having a width between 500 and 4000 drawings;
  • the inorganic packaging materials are directly contacted or spaced apart, and the organic bonding materials are directly contacted or spaced apart;
  • the inorganic encapsulating material and the organic bonding material are arbitrarily arranged outside the pixel region; wherein the number of turns of the inorganic encapsulating material surrounding the pixel region outside the pixel region on the substrate is 1, and the pixel on the substrate The number of turns of the organic backing material enclosed in the pixel area outside the area is 1;
  • the utility model further comprises an inorganic packaging material which is arranged around the pixel region on the substrate and is enclosed around the pixel region, wherein the organic bonding material is arranged between the two inorganic packaging materials;
  • the inorganic packaging material is a glass glue
  • the organic binder is an organic rubber material, and the organic rubber material is an epoxy resin.
  • the package structure of the active matrix organic electroluminescent diode panel of the present invention increases at least one turn to seal the organic bonding material surrounding the pixel region, thereby solving the problem of poor adhesion when the panel is large-sized
  • the problem of separating the organic and inorganic packaging materials to ensure the respective properties without affecting each other makes the structure have excellent package sealing and adhesion, which is advantageous for the large-scale of the active matrix organic electroluminescent diode panel.
  • FIG. 1 is a schematic structural view of a first preferred embodiment of a package structure of an active matrix organic electroluminescent diode panel according to the present invention
  • FIG. 2 is a schematic structural view of a second preferred embodiment of a package structure of an active matrix organic electroluminescent diode panel according to the present invention.
  • FIG. 3 is a schematic structural view of a package structure of an active matrix organic electroluminescent diode panel according to a third preferred embodiment of the present invention. detailed description
  • the present invention provides a package structure of an active matrix organic electroluminescent diode panel, including: a substrate 20, a pixel region 26 on the substrate 20, and a pixel region 26 on the substrate 20 a plurality of circular inorganic packaging materials 24, a plurality of organic organic materials 22 located outside the pixel region 26 on the substrate 20, and a back cover (not shown) covering the inorganic packaging material 24 and the organic bonding material 22, the plurality of circles At least one loop of the inorganic encapsulating material 24 is enclosed around the pixel region 26, and at least one of the plurality of organic binders 22 is sealed around the pixel region 26, and the inorganic encapsulant 24 is disposed separately from the organic binder 22.
  • the inorganic encapsulating material 24 enclosed around the pixel region 26 has a width of between 300 um and 2000 urn, and the organic sealing material 22 surrounding the pixel region 26 has a width of between 500 um and 4000 mils.
  • the inorganic packaging materials 24 are directly contacted or spaced apart, and the organic bonding materials 22 are directly contacted or spaced apart.
  • the inorganic encapsulant 24 and the organic binder 22 are arbitrarily arranged outside the pixel region 26.
  • the number of turns of the inorganic package 24 surrounding the pixel region 26 outside the pixel region 26 on the substrate 20 is 1
  • the number of turns of the organic bonding material 22 that surrounds the pixel region 26 outside the pixel region 26 on the substrate 20 is one.
  • the ring of inorganic packaging material 24 may be located inside the annular inorganic material 22 or may be located outside the inorganic inorganic material 22 of the ring.
  • the inorganic encapsulating material 24 is a glass paste.
  • the organic bonding material 22 is an organic rubber material. In the preferred embodiment, the organic rubber material is preferably an epoxy resin.
  • an additional inorganic package 24 surrounding the pixel region 26 on the substrate 20 is enclosed around the pixel region 26. , wherein the organic backing material 22 is disposed between the two inorganic packaging materials 24 .
  • an additional organic sealing material located outside the pixel region 26 on the substrate 20 and not surrounding the pixel region 26 is provided. 22, wherein the ring of inorganic packaging material 24 is disposed between two turns of the organic backing material 22.
  • the package structure of the active matrix organic electroluminescent diode panel of the present invention has excellent package sealing property and adhesion, which is advantageous for realizing the large-scale implementation of the active matrix organic electroluminescent diode panel;
  • the package structure is enclosed by a pixel area by adding at least one turn
  • the organic binder of the domain, the organic binder and the inorganic packaging material are separated to ensure the respective properties without affecting each other, thereby solving the problem of poor adhesion of the panel when it is large-sized.

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  • Electroluminescent Light Sources (AREA)

Description

有源矩阵式有机电致发光二极管面板的封装结构 技术领域
本发明涉及有机电致发光二极管领域， 尤其涉及一种有源矩阵式有机 电致发光二极管面板的封装结构。 背景技术
OLED ( Organic Light Emitting Device Display, 有机发光二极管显示 器）是指有机半导体材料和发光材料在电场驱动下， 通过载流子注入和复 合导致发光的现象。 OLED发光原理是用 ITO透明电极和金属电极分别作 为器件的阳极和阴极， 在一定电压驱动下， 电子和空穴分别从阴极和阳极 注入到电子和空穴传输层， 电子和空穴分别经过电子和空穴传输层迁移到 发光层， 并在发光层中相遇， 形成激子并使发光分子激发， 后者经过辐射 弛豫而发出可见光。 其具有以下优点：
1、 厚度可以小于 1毫米， 仅为 LCD屏幕的 1/3 , 并且重量也更轻；
2、 固态机构， 没有液体物质， 因此抗震性能更好， 不怕摔；
3、 几乎没有可视角度的问题， 即使在很大的视角下观看， 画面仍然 不失真；
4、 响应时间是 LCD 的千分之一， 显示运动画面绝对不会有拖影的现 象；
5、 低温特性好， 在零下 40 度时仍能正常显示， 而 LCD 则无法做 到；
6、 制造工艺简单， 成本更低；
7、 发光效率更高， 能耗比 LCD要低；
8、 能够在不同材质的基板上制造， 可以做成能弯曲的柔软显示器。 由过去的研究显示，有源矩阵式有机电致发光二极管 （Active Matrix Organic Light Emitting Device, AMOLED ) 面板的封装对于面板的寿命有 极大的影响， 而由于现今大部分有源矩阵式有机电致发光二极管面板开发 者使用玻璃浆料封装方式， 使得有源矩阵式有机电致发光二极管面板的实 用性与寿命大幅提升。 然而， 因为玻璃胶材质坚硬， 虽然能有效阻隔水氧, 但是其接着性不好， 因此如果想要实现有源矩阵式有机电致发光二极管面 板大尺寸化， 基板与背盖接合的接着性对于玻璃胶会是严苛的考验， 故大 尺寸有源矩阵式有机电致发光二极管面板的封装需要兼顾接着性与阻隔水 氧的能力。 发明内容
本发明的目的在于提供一种有源矩阵式有机电致发光二极管面板的封 装结构， 其兼具优异的封装密闭性和接着性， 有利于有源矩阵式有机电致 发光二极管面板大尺寸化的实现。
为实现上述目的， 一种有源矩阵式有机电致发光二极管面板的封装结 构， 包括： 基板、 位于基板上的画素区域、 位于基板上画素区域外的数圈 无机封装材、 位于基板上画素区域外的数圈有机接着材、 及覆盖在无机封 装材及有机接着材上的背盖， 所述数圈无机封装材中至少有一圈密闭围绕 画素区域， 所述数圈有机接着材中至少有一圈密闭围绕画素区域， 所述无 机封装材与所述有机接着材分离设置。
所述密闭围绕画素区域的无机封装材至少有一圈的宽度介于 300 画〜 2000画之间。
所述密闭围绕画素区域的有机接着材至少有一圈的宽度介于 500 画〜 4000画之间。
所述无机封装材之间直接接触或间隔设置， 所述有机接着材之间直接 接触或间隔设置。
所述无机封装材与所述有机接着材在画素区域以外任意排列。
所述位于基板上画素区域外密闭围绕画素区域的无机封装材的圈数为
1 , 所述位于基板上画素区域外密闭围绕画素区域的有机接着材的圈数为 1„
还包括一圈位于基板上画素区域外密闭围绕画素区域的无机封装材， 该圈有机接着材设于两圈无机封装材之间。
还包括一圈位于基板上画素区域外非密闭围绕画素区域的有机接着 材， 该圈无机封装材设于两圈有机接着材之间。
所述无机封装材为玻璃胶。
所述有机接着材为有机胶材， 所述有机胶材为环氧树脂。
本发明还提供一种有源矩阵式有机电致发光二极管面板的封装结构， 包括： 基板、 位于基板上的画素区域、 位于基板上画素区域外的数圈无机 封装材、 位于基板上画素区域外的数圈有机接着材、 及覆盖在无机封装材 及有机接着材上的背盖， 所述数圈无机封装材中至少有一圈密闭围绕画素 区域， 所述数圈有机接着材中至少有一圈密闭围绕画素区域， 所述无机封 装材与所述有机接着材分离设置； 其中， 所述密闭围绕画素区域的无机封装材至少有一圈的宽度介于
300画〜 2000画之间；
其中， 所述密闭围绕画素区域的有机接着材至少有一圈的宽度介于 500画〜 4000画之间；
其中， 所述无机封装材之间直接接触或间隔设置， 所述有机接着材之 间直接接触或间隔设置；
其中， 所述无机封装材与所述有机接着材在画素区域以外任意排列； 其中， 所述位于基板上画素区域外密闭围绕画素区域的无机封装材的 圈数为 1 , 所述位于基板上画素区域外密闭围绕画素区域的有机接着材的 圈数为 1 ;
还包括一圈位于基板上画素区域外密闭围绕画素区域的无机封装材， 该圈有机接着材设于两圈无机封装材之间；
其中， 所述无机封装材为玻璃胶；
其中， 所述有机接着材为有机胶材， 所述有机胶材为环氧树脂。
本发明的有益效果： 本发明有源矩阵式有机电致发光二极管面板的封 装结构， 其增加了至少有一圈是密闭围绕画素区域的有机接着材， 从而解 决了面板大尺寸化时接着性不佳的问题； 有机接着材和无机封装材分离设 置保证各自性能的同时又互不影响使得该结构兼具优异的封装密闭性和接 着性， 有利于有源矩阵式有机电致发光二极管面板大尺寸化的实现。
为了能更进一步了解本发明的特征以及技术内容， 请参阅以下有关本 发明的详细说明与附图， 然而附图仅提供参考与说明用， 并非用来对本发 明加以限制。 附图说明
下面结合附图， 通过对本发明的具体实施方式详细描述， 将使本发明 的技术方案及其它有益效果显而易见。
附图中，
图 1 为本发明有源矩阵式有机电致发光二极管面板的封装结构的第一 较佳实施例的结构示意图；
图 2为本发明有源矩阵式有机电致发光二极管面板的封装结构的第二 较佳实施例的结构示意图；
图 3 为本发明有源矩阵式有机电致发光二极管面板的封装结构的第三 较佳实施例的结构示意图。 具体实施方式
为更进一步阐述本发明所釆取的技术手段及其效果， 以下结合本发明 的优选实施例及其附图进行详细描述。
请参阅图 1 , 本发明提供一种有源矩阵式有机电致发光二极管面板的 封装结构， 包括： 基板 20、 位于所述基板 20上的画素区域 26、 位于所述 基板 20上画素区域 26外的数圈无机封装材 24、 位于基板 20上画素区域 26外的数圈有机接着材 22、 及覆盖在无机封装材 24及有机接着材 22上 的背盖 （未图示） ， 所述数圈无机封装材 24 中至少有一圈密闭围绕画素 区域 26, 所述数圈有机接着材 22中至少有一圈密闭围绕画素区域 26, 所 述无机封装材 24与所述有机接着材 22分离设置。
所述密闭围绕画素区域 26的无机封装材 24宽度介于 300 um〜2000 urn 之间， 所述密闭围绕画素区域 26的有机接着材 22宽度介于 500 um〜4000 画之间。
所述无机封装材 24之间直接接触或间隔设置， 所述有机接着材 22之 间直接接触或间隔设置。
所述无机封装材 24与所述有机接着材 22在画素区域 26以外任意排 歹l。 在本较佳实施例中， 本发明有源矩阵式有机电致发光二极管面板的封 装结构中， 所述位于基板 20上画素区域 26外密闭围绕画素区域 26的无 机封装材 24的圈数为 1 , 所述位于基板 20上画素区域 26外密闭围绕画素 区域 26的有机接着材 22的圈数为 1。 该圈无机封装材 24可以位于该圈无 机接着材 22的内侧， 也可以位于该圈无机接着材 22的外侧。
所述无机封装材 24为玻璃胶。 所述有机接着材 22为有机胶材， 在本 较佳实施例中， 所述有机胶材优选为环氧树脂。
请参阅图 2, 作为可供选择的第二较佳实施例， 在上述第一较佳实施 例的基础上， 增设一圈位于基板 20上画素区域 26外密闭围绕画素区域 26 的无机封装材 24，， 其中， 该圈有机接着材 22设于两圈无机封装材 24，之 间。
请参阅图 3 , 作为可供选择的第三较佳实施例， 在上述第一较佳实施 例的基础上， 增设一圈位于基板 20上画素区域 26外非密闭围绕画素区域 26的有机接着材 22，， 其中， 该圈无机封装材 24设于两圈有机接着材 22， 之间。
综上所述， 本发明有源矩阵式有机电致发光二极管面板的封装结构兼 具优异的封装密闭性和接着性， 有利于有源矩阵式有机电致发光二极管面 板大尺寸化的实现； 该封装结构通过增加了至少有一圈是密闭围绕画素区 域的有机接着材， 有机接着材和无机封装材分离设置保证各自性能的同时 又互不影响从而解决了面板大尺寸化时接着性不佳的问题。
以上所述， 对于本领域的普通技术人员来说， 可以根据本发明的技术 方案和技术构思作出其他各种相应的改变和变形， 而所有这些改变和变形 都应属于本发明权利要求的保护范围。

Claims

权 利 要 求
1、 一种有源矩阵式有机电致发光二极管面板的封装结构， 包括： 基 板、 位于基板上的画素区域、 位于基板上画素区域外的数圈无机封装材、 位于基板上画素区域外的数圈有机接着材、 及覆盖在无机封装材及有机接 着材上的背盖， 所述数圈无机封装材中至少有一圈密闭围绕画素区域， 所 述数圈有机接着材中至少有一圈密闭围绕画素区域， 所述无机封装材与所 述有机接着材分离设置。
2、 如权利要求 1 所述的有源矩阵式有机电致发光二极管面板的封装 结构， 其中， 所述密闭围绕画素区域的无机封装材至少有一圈的宽度介于
300画〜 2000画之间。
3、 如权利要求 1 所述的有源矩阵式有机电致发光二极管面板的封装 结构， 其中， 所述密闭围绕画素区域的有机接着材至少有一圈的宽度介于 500画〜 4000画之间。
4、 如权利要求 1 所述的有源矩阵式有机电致发光二极管面板的封装 结构， 其中， 所述无机封装材之间直接接触或间隔设置， 所述有机接着材 之间直接接触或间隔设置。
5、 如权利要求 1 所述的有源矩阵式有机电致发光二极管面板的封装 结构， 其中， 所述无机封装材与所述有机接着材在画素区域以外任意排 列。
6、 如权利要求 5 所述的有源矩阵式有机电致发光二极管面板的封装 结构， 其中， 所述位于基板上画素区域外密闭围绕画素区域的无机封装材 的圈数为 1 , 所述位于基板上画素区域外密闭围绕画素区域的有机接着材 的圈数为 1。
7、 如权利要求 6 所述的有源矩阵式有机电致发光二极管面板的封装 结构， 还包括一圈位于基板上画素区域外密闭围绕画素区域的无机封装 材， 该圈有机接着材设于两圈无机封装材之间。
8、 如权利要求 6 所述的有源矩阵式有机电致发光二极管面板的封装 结构， 还包括一圈位于基板上画素区域外非密闭围绕画素区域的有机接着 材， 该圈无机封装材设于两圈有机接着材之间。
9、 如权利要求 1 所述的有源矩阵式有机电致发光二极管面板的封装 结构， 其中， 所述无机封装材为玻璃胶。
10、 如权利要求 1 所述的有源矩阵式有机电致发光二极管面板的封装 结构， 其中， 所述有机接着材为有机胶材， 所述有机胶材为环氧树脂。
11、 一种有源矩阵式有机电致发光二极管面板的封装结构， 包括： 基 板、 位于基板上的画素区域、 位于基板上画素区域外的数圈无机封装材、 位于基板上画素区域外的数圈有机接着材、 及覆盖在无机封装材及有机接 着材上的背盖， 所述数圈无机封装材中至少有一圈密闭围绕画素区域， 所 述数圈有机接着材中至少有一圈密闭围绕画素区域， 所述无机封装材与所 述有机接着材分离设置；
其中， 所述密闭围绕画素区域的无机封装材至少有一圈的宽度介于 300画〜 2000画之间；
其中， 所述密闭围绕画素区域的有机接着材至少有一圈的宽度介于
500画〜 4000画之间；
其中， 所述无机封装材之间直接接触或间隔设置， 所述有机接着材之 间直接接触或间隔设置；
其中， 所述无机封装材与所述有机接着材在画素区域以外任意排列； 其中， 所述位于基板上画素区域外密闭围绕画素区域的无机封装材的 圈数为 1 , 所述位于基板上画素区域外密闭围绕画素区域的有机接着材的 圈数为 1；
还包括一圈位于基板上画素区域外密闭围绕画素区域的无机封装材， 该圈有机接着材设于两圈无机封装材之间；
其中， 所述无机封装材为玻璃胶；
其中， 所述有机接着材为有机胶材， 所述有机胶材为环氧树脂。
PCT/CN2012/081314 2012-08-24 2012-09-13 有源矩阵式有机电致发光二极管面板的封装结构 Ceased WO2014029146A1 (zh)

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WO2011004567A1 (ja) * 2009-07-07 2011-01-13 パナソニック株式会社 有機エレクトロルミネッセンス表示装置及びその製造方法
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