WO2014020674A1 - Procédé permettant de produire un module de cellule solaire - Google Patents
Procédé permettant de produire un module de cellule solaire Download PDFInfo
- Publication number
- WO2014020674A1 WO2014020674A1 PCT/JP2012/069389 JP2012069389W WO2014020674A1 WO 2014020674 A1 WO2014020674 A1 WO 2014020674A1 JP 2012069389 W JP2012069389 W JP 2012069389W WO 2014020674 A1 WO2014020674 A1 WO 2014020674A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- solar cell
- temperature
- cell module
- adhesive
- temporary fixing
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 239000000853 adhesive Substances 0.000 claims abstract description 51
- 230000001070 adhesive effect Effects 0.000 claims abstract description 51
- 238000000034 method Methods 0.000 claims abstract description 46
- 238000010438 heat treatment Methods 0.000 claims abstract description 28
- 239000000463 material Substances 0.000 claims abstract description 16
- 238000002788 crimping Methods 0.000 claims description 21
- 239000002245 particle Substances 0.000 claims description 13
- 238000006243 chemical reaction Methods 0.000 abstract description 13
- 229920005989 resin Polymers 0.000 description 13
- 239000011347 resin Substances 0.000 description 13
- 239000000843 powder Substances 0.000 description 10
- 239000010410 layer Substances 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 6
- 229910021417 amorphous silicon Inorganic materials 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000000969 carrier Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
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- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
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- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
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- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
- H01L31/188—Apparatus specially adapted for automatic interconnection of solar cells in a module
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to a method for manufacturing a solar cell module.
- Patent Document 1 as a method for manufacturing a solar cell module, a solar cell is arranged on a mounting table, a resin adhesive is arranged on a connection electrode formed on the light receiving surface side of the solar cell, It is described that the wiring material is disposed on the wiring electrode and the wiring material is crimped to the connection electrode by using a crimping apparatus.
- the pressure bonding apparatus includes a pressure bonding head and a heating unit, and the heating unit heats the pressure bonding head to a temperature higher than a temperature at which the resin adhesive disposed between the connection electrode and the wiring member is cured.
- the method for manufacturing a solar cell module according to the present invention includes arranging a wiring material via an adhesive on the connection electrode of the solar cell, and temporarily fixing by heating at a temporary fixing temperature lower than the curing temperature of the adhesive, After the temporary fixing process, the temperature is maintained at a temporary fixing temperature or lower, and then the crimping tool is pressed with a predetermined pressure against the solar cell on which the wiring material is temporarily fixed, and the adhesive is heated to the curing temperature or higher to be cured.
- the adhesive Since the temporary fixing temperature is lower than the curing temperature, the adhesive is still flexible during crimping. Thereby, even if it receives an impact at the time of pressure bonding, the junction between the solar cell and the connection electrode can be maintained.
- FIG. 1 it is a figure which shows the process which forms the electrode for a connection of a solar cell with the sintered type electrically conductive paste which becomes a network structure by heating.
- FIG. 1 it is a figure which shows a temporary fix
- FIG. 1 it is a figure which shows the process pressed with predetermined
- FIG. 1 it is a time chart about the setting of heating temperature and applied pressure. It is a figure which shows the result of a peeling test when setting temporary fixing temperature to the curing temperature for the comparison. It is a figure which shows the result of a peeling test when using the method of FIG.
- FIG. 1 is a flowchart showing a procedure of a method for manufacturing a solar cell module.
- 2 to 4 are diagrams for explaining each procedure in this flowchart.
- FIG. 5 is a time chart for setting the heating temperature and the applied pressure.
- the solar cell module is obtained by connecting solar cells with a wiring material, a solar cell is prepared in order to manufacture the solar cell module.
- the photoelectric conversion unit 11 is formed (S10).
- FIG. 2 is a diagram showing the solar cell 10, FIG. 2 (a) is a plan view, and FIG. 2 (b) is a side view.
- the solar cell 10 includes a photoelectric conversion unit 11 that generates light-generated carriers of holes and electrons by receiving light such as sunlight.
- the solar cell 10 has, as main surfaces, a light receiving surface that is a surface on which light from the outside of the solar cell 10 is mainly incident and a back surface that is a surface opposite to the light receiving surface, but in the plan view of FIG. The light receiving surface is shown.
- the photoelectric conversion unit 11 includes a substrate made of a semiconductor material such as crystalline silicon (c-Si), gallium arsenide (GaAs), indium phosphide (InP), for example.
- the structure of the photoelectric conversion unit 11 is a pn junction in a broad sense.
- a heterojunction of an n-type single crystal silicon substrate and amorphous silicon can be used.
- a transparent conductive film (TCO) 12 composed of a conductive oxide is stacked, and an i-type amorphous silicon layer and an n-type amorphous silicon layer doped with phosphorus (P) or the like are formed on the back side of the substrate,
- the transparent conductive film 13 can be laminated.
- the photoelectric conversion unit 11 may have a structure other than this as long as it has a function of converting light such as sunlight into electricity.
- a structure including a p-type polycrystalline silicon substrate, an n-type diffusion layer formed on the light-receiving surface side, and an aluminum metal film formed on the back surface side may be used.
- connection electrode 20 on the light receiving surface side is formed on the light receiving surface of the solar cell 10.
- the connection electrode 20 on the light receiving surface side is formed by printing a conductive paste in a predetermined pattern on the surface of the transparent conductive film 12.
- the conductive paste is obtained by mixing conductive particles into a resin using a solvent.
- conductive pastes which can be used properly according to the application.
- a conductive paste in which a conductive filler such as silver (Ag) is dispersed in a binder resin can be used.
- the connection electrode 20 is formed using a sintered conductive paste that becomes a network structure by heating, as an improvement in conductivity (S11).
- the network structure is a structure in which conductive particles are fused to each other. For example, by heating a conductive paste containing conductive particles, the conductive particles can be fused together to form a network structure.
- the network structure is a structure in which 50% or more of conductive particles observed under a microscope are fused to each other.
- the sintered conductive paste that becomes a network structure by heating is obtained by mixing a plurality of spherical powders 21 with a resin such as an epoxy resin using a solvent.
- the spherical powder 21 is a substantially spherical conductive particle.
- the conductive paste is heated, the spherical powders 21 are fused together to form a network structure. Due to this network structure, the conductivity of the connection electrode 20 is improved.
- the connection electrode 20 may contain flakes in addition to the spherical powder 21.
- Flakes refer to conductive particles having a ratio of major axis to thickness of powder particles (major axis / thickness) ⁇ 10 and an average particle diameter of about 2 to 5 ⁇ m or more.
- the flakes can be obtained, for example, by crushing the spherical powder 21 into a flat shape. Since the flakes have an action of dividing the network structure, the flakes have a function of relieving stress caused by fusion.
- the mixing ratio of the spherical powder 21 and the flakes can be determined based on the balance between the improvement of conductivity and stress relaxation.
- a finger electrode is disposed in addition to the bus bar electrode serving as the connection electrode 20. In FIG. 2, the finger electrode is not shown.
- the finger electrode is a thin wire electrode that collects electricity from the entire light receiving surface but is thinned so as to reduce the light shielding property.
- the finger electrode and the bus bar electrode are arranged orthogonally to each other and electrically connected.
- the width of the finger electrode is preferably about 30 ⁇ m to 150 ⁇ m, and the thickness is preferably about 10 ⁇ m to 80 ⁇ m.
- the interval between adjacent finger electrodes is preferably about 0.5 mm to 3 mm.
- the width of the bus bar electrode as the connection electrode 20 is preferably about 50 ⁇ m to 3 mm, and the thickness is preferably about 10 ⁇ m to 160 ⁇ m.
- connection electrode 23 on the back surface side is formed on the surface of the transparent conductive film 13 on the back surface side of the photoelectric conversion unit 11.
- the connection electrode 23 on the back surface side is also formed using a sintered conductive paste containing the spherical powder 21 and having a network structure by heating.
- the connection electrode 23 on the back surface side may further contain flakes in addition to the spherical powder 21.
- the wiring member 25 is disposed on the connection electrode 20 on the light receiving surface side of the solar cell 10 via the adhesive 24, and similarly, the adhesive 26 is applied to the connection electrode 23 on the back surface side of the solar cell 10.
- the wiring member 27 is disposed through the wiring (S12).
- a pressure P 1 that is lightly pressed is applied so that they are not separated from each other, and heated at a temporary fixing temperature ⁇ 1 lower than the curing temperature ⁇ H of the adhesives 24 and 26. Performed (S13).
- the applied pressure P 1 may be a value smaller than the applied pressure P 2 in the pressure-bonding process described later, and may be, for example, about 1/10 of P 2 .
- FIG. 3 is a diagram showing the solar cell module in a temporarily fixed state
- FIG. 3 (a) is a plan view
- FIG. 3 (b) is a side view.
- the wiring members 25 and 27 are thin plates made of a metal conductive material such as copper. Instead of a thin plate, a stranded wire can be used. As the conductive material, in addition to copper, silver, aluminum, nickel, tin, gold, or an alloy thereof can be used.
- the wiring member 25 is preferably arranged so as to cover the connection electrode 20 along the arrangement direction of the connection electrode 20 on the light receiving surface side of the solar cell 10, and the width of the wiring member 25 is set to be the connection electrode 20. It is better to set it to be the same as or slightly thicker. Similarly, the width of the wiring member 27 on the back surface side may be set to be the same as or slightly thicker than the width of the connection electrode 23 on the back surface side.
- FIG. 3A shows the distinction between the end portion and the central portion of the wiring member 25, details of which will be described later.
- the adhesive 24 is disposed between the connection electrode 20 and the wiring member 25 on the light receiving surface side, electrically connects the connection electrode 20 and the wiring member 25, and the light receiving surface side of the solar cell 10 and the wiring member. 25 is used for mechanically fixing.
- the adhesive 26 is disposed between the connection electrode 23 on the back surface side and the wiring material 27, electrically connects the connection electrode 23 and the wiring material 27, and connects the back surface side of the solar cell 10 and the wiring. Used to mechanically fix the material 27.
- thermosetting resin adhesives such as acrylic, highly flexible polyurethane, or epoxy can be used.
- the curing temperature ⁇ H of the adhesives 24 and 26 is selected between about 130 ° C. and 300 ° C. from the heat resistance of the solar cell 10 and the like.
- the adhesives 24 and 26 include conductive particles.
- conductive particles nickel, silver, nickel with gold coating, copper with tin plating, or the like can be used.
- insulating resin adhesives that do not contain conductive particles can also be used. In this case, one or both of the facing surfaces of the wiring members 25 and 27 or the connecting electrodes 20 and 23 are made uneven so that the wiring member 27 and the connecting electrode 20 are connected. Resin is appropriately removed from between the electrodes 23 to establish electrical connection.
- the light receiving surface side is bonded by an adhesive force between the facing surfaces of the wiring member 25 and the connection electrode 20 and an adhesive force by a resin fillet formed on the light receiving surface of the solar cell 10 and the side surface of the wiring member 25.
- adhesion is caused by the adhesive force between the facing surfaces of the wiring member 27 and the connection electrode 23 and the adhesive force by the resin fillet formed on the light receiving surface of the solar cell 10 and the side surface of the wiring member 27. Is done.
- the temporary fixing temperature ⁇ 1 is a temperature at which the adhesives 24 and 26 are dried from the liquid state and easy to handle during the time of being heated, and has not yet started curing and has flexibility. It is preferable to set the temperature.
- the temperature is about 1 ⁇ 2 of the curing temperature ⁇ H.
- the temporary fixing temperature ⁇ 1 is set to about 65 ° C.
- the solar cell 10 and the temporarily fixed wiring members 25 and 27 are maintained at the temporary fixing temperature ⁇ 1 or lower.
- the temporarily fixed solar cell 10 is conveyed to the crimping tool without being heated or pressurized.
- Crimping process relative to the solar cell 10 wiring members 25 and 27 have been tentatively fixed, pressing the bonding tool at a predetermined pressure, it is in the process of curing by heating the adhesive 24, 26 above the curing temperature theta H (S14).
- FIG. 4 is a diagram illustrating a state where the crimping process is performed using the crimping tool.
- the crimping tool includes a lower tool 30 and an upper tool 31 that moves up and down relatively with respect to the lower tool 30.
- the upper tool 31 is lowered with respect to the lower tool 30 and is disposed between the lower tool 30 and the upper tool 31.
- This is a device for applying a predetermined pressure P 2 to the temporarily fixed solar cell.
- the heating parts 32 and 33 are arrange
- a resistance wire heater, a heating lamp, a heating air supply device, or the like can be used.
- the crimping tool is a pressure heating device.
- the heating temperature ⁇ 2 in the pressure-bonding process is set to be equal to or higher than the curing temperature ⁇ H of the adhesives 24 and 26.
- the applied pressure P 2 is preferably 0.1 MPa to 0.2 MPa.
- FIG. 5 is a time chart for setting the heating temperature ⁇ and setting the pressure P when manufacturing the solar cell module.
- pressure P is set to P 1 of the light load to the extent that dab.
- P 1 is set to 0.01 MPa to 0.02 MPa as 1/10 of the applied pressure P 2 in the pressure-bonding process.
- the remaining process for obtaining the solar cell module is performed (S15).
- the solar cell module subjected to the crimping process is positioned between the light-receiving surface side protection member and the back-surface side protection member, and the filler is provided between the light-receiving surface-side protection member and the back surface-side protection member.
- Place. Frames are arranged at the ends of the light receiving surface side protective member and the back surface side protective member.
- a transparent plate or film is used as the protective member on the light receiving surface side.
- a translucent member such as a glass plate, a resin plate, or a resin film can be used.
- the protective member on the back surface side the same protective member as that on the light receiving surface side can be used.
- an opaque plate or film can be used as the protective member on the back side.
- a laminated film such as a resin film having an aluminum foil inside can be used.
- EVA, EEA, PVB, silicone resin, urethane resin, acrylic resin, epoxy resin, or the like can be used.
- the temporary fixing temperature ⁇ 1 is set to be lower than the curing temperature ⁇ H because of the impact at the time of pressurization in the pressure-bonding process for completely curing the adhesives 24 and 26. This is to prevent separation from occurring in the bonding between the electrodes 20 and 23.
- the location where peeling may arise between the solar cell 10 and the wiring material 25 is the 1st between the transparent conductive film 12 on the photoelectric conversion part 11, and the electrode 20 for a connection.
- peeling There are three types of peeling: bonding peeling between the electrodes 20 between the connection electrodes 20 itself, peeling of the second bonding between the connection electrode 20 and the wiring member 25 via the adhesive 24.
- the temporary fixing temperature ⁇ 1 is high and the adhesive 24 is cured, the second bonding becomes stronger than the other bonding.
- connection electrode 20 when a sintered conductive paste having a network structure is used for the connection electrode 20, the strength of the connection electrode 20 itself is strong because the bonding force of the network structure is strong. Therefore, the first joint is relatively weak. For this reason, if the temporary fixing temperature ⁇ 1 is increased and the adhesive 24 is cured, peeling may occur in the first bonding when an impact during pressurization is applied in the pressure-bonding process. Since the first junction is an electrical junction for taking out current from the solar cell 10, if peeling occurs here, the connection electrode 20 itself is strong or the second junction is solid, It becomes meaningless as a battery module. Therefore, prevention of peeling of the first joint is important.
- the temporary fixing temperature ⁇ 1 is lower than the curing temperature ⁇ H of the adhesive 24, the curing of the adhesive 24 does not start and the flexibility is maintained, even if an impact at the time of pressurization is applied in the crimping process
- the adhesive 24 having flexibility can receive the impact. As a result, peeling can be prevented from occurring in the first bonding.
- the temporary fixing temperature at a location where the pressurizing force is higher to a lower temperature it is preferable to set the temporary fixing temperature at a location where the pressurizing force is higher to a lower temperature.
- the temporary fixing temperature at the end of the solar cell 10 is set lower than the temporary fixing temperature at the central portion.
- FIG. 3 shows the positional relationship between the end portion and the center portion, but the end portion is a region on the end face side of the solar cell 10 in the longitudinal direction of the wiring members 25 and 27.
- the end region can be determined in consideration of the contribution of the photogenerated carriers of the solar cell 10 to the current collection. For example, with respect to the total number of finger electrodes, a region having a predetermined number counted from the end face of the solar cell 10 can be set as the end. Or it can be set as the area
- FIG. 7 shows that the adhesive layer 43 after the wiring material is peeled is visible, and the underlying connection electrode layer 44 remains.
- the adhesive can still have flexibility.
- the junction between the solar cell and the connection electrode can be maintained.
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Abstract
Selon la présente invention, dans la procédure de ce procédé permettant de produire un module de cellule solaire, une unité de conversion photoélectrique est formée (S10), une électrode de raccordement est formée à partir d'une pâte conductrice frittée qui est destinée à former une structure de réseau par chauffage (S11), un matériau de câblage est disposé sur l'électrode de raccordement, un adhésif étant agencé entre ces derniers (S12) et le résultat est temporairement uni à une température qui est inférieure à la température de durcissement de l'adhésif (S13). Par la suite, le résultat est pressé avec une force de compression prédéterminée et chauffé au moins à la température de durcissement de l'adhésif (S14). Ensuite, les procédés restants pour former le module de cellule solaire sont effectués (S15). A titre d'exemple, la température de la jonction temporaire peut être de l'ordre de la moitié de la température de durcissement.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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PCT/JP2012/069389 WO2014020674A1 (fr) | 2012-07-31 | 2012-07-31 | Procédé permettant de produire un module de cellule solaire |
JP2014527847A JP5938665B2 (ja) | 2012-07-31 | 2012-07-31 | 太陽電池モジュールの製造方法 |
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PCT/JP2012/069389 WO2014020674A1 (fr) | 2012-07-31 | 2012-07-31 | Procédé permettant de produire un module de cellule solaire |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2019163778A1 (ja) * | 2018-02-21 | 2021-02-12 | 株式会社カネカ | 配線材、並びにそれを用いた太陽電池セル及び太陽電池モジュール |
US11949027B2 (en) | 2022-01-13 | 2024-04-02 | Zhejiang Jinko Solar Co., Ltd. | Solar module |
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WO2009090915A1 (fr) * | 2008-01-17 | 2009-07-23 | Nichia Corporation | Procédé de production d'un matériau conducteur, matériau conducteur obtenu grâce au procédé, dispositif électronique contenant le matériau conducteur, dispositif électroluminescent, et procédé de fabrication d'un dispositif électroluminescent |
WO2012057125A1 (fr) * | 2010-10-26 | 2012-05-03 | 三洋電機株式会社 | Procédé de production d'un module de cellules solaires |
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JP2008106145A (ja) * | 2006-10-25 | 2008-05-08 | Sekisui Chem Co Ltd | 焼結性導電ペースト |
JP2008108569A (ja) * | 2006-10-25 | 2008-05-08 | Sekisui Chem Co Ltd | 焼結性導電ペースト |
JP5820976B2 (ja) * | 2008-07-31 | 2015-11-24 | パナソニックIpマネジメント株式会社 | 太陽電池モジュールの製造方法 |
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WO2009090915A1 (fr) * | 2008-01-17 | 2009-07-23 | Nichia Corporation | Procédé de production d'un matériau conducteur, matériau conducteur obtenu grâce au procédé, dispositif électronique contenant le matériau conducteur, dispositif électroluminescent, et procédé de fabrication d'un dispositif électroluminescent |
WO2012057125A1 (fr) * | 2010-10-26 | 2012-05-03 | 三洋電機株式会社 | Procédé de production d'un module de cellules solaires |
Cited By (3)
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JPWO2019163778A1 (ja) * | 2018-02-21 | 2021-02-12 | 株式会社カネカ | 配線材、並びにそれを用いた太陽電池セル及び太陽電池モジュール |
JP7182597B2 (ja) | 2018-02-21 | 2022-12-02 | 株式会社カネカ | 配線材を用いた太陽電池セル及び太陽電池モジュール |
US11949027B2 (en) | 2022-01-13 | 2024-04-02 | Zhejiang Jinko Solar Co., Ltd. | Solar module |
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JP5938665B2 (ja) | 2016-06-22 |
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