WO2014008683A1 - 液晶基板切割装置及其刀头监控方法 - Google Patents

液晶基板切割装置及其刀头监控方法 Download PDF

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Publication number
WO2014008683A1
WO2014008683A1 PCT/CN2012/079162 CN2012079162W WO2014008683A1 WO 2014008683 A1 WO2014008683 A1 WO 2014008683A1 CN 2012079162 W CN2012079162 W CN 2012079162W WO 2014008683 A1 WO2014008683 A1 WO 2014008683A1
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Prior art keywords
cutting
liquid crystal
cutter head
cutter
same
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French (fr)
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黄海波
洪宗义
邓鸿韬
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US13/634,877 priority Critical patent/US20140013906A1/en
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs

Definitions

  • the present invention relates to the field of liquid crystal substrates, and in particular to a liquid crystal substrate cutting device and a method for monitoring the same.
  • Liquid crystal display (Liquid Crystal Display, LCD) has been widely used in various electronic products.
  • One important component in liquid crystal displays is liquid crystal panels.
  • the liquid crystal panel is composed of two transparent substrates (thin film transistor substrate and color filter substrate) and liquid crystals interposed between the substrates. In the process of the liquid crystal panel, it is necessary to cut a large liquid crystal substrate including a plurality of liquid crystal panels into a plurality of independent liquid crystal panels having appropriate sizes by using a cutter head, and the cutting precision is very strict in the cutting process.
  • the cutting precision data of the eight cutting edges of each liquid crystal panel are respectively combined into eight different charts, so as to cut the cutting precision and the knife of each cutting edge of the liquid crystal panel.
  • the cutting characteristics of the head are monitored.
  • the defects of the above monitoring methods mainly include: since the same cutting edge of different liquid crystal panels is cut by different cutter heads, the monitoring of the cutting characteristics of the cutter head is easy to produce errors; the cutting precision data of the cutting edge of the liquid crystal panel appears. When an abnormality occurs, it is difficult to confirm the corresponding cutter head.
  • the technical problem to be solved by the present invention is to provide a liquid crystal substrate cutting device and a tool head monitoring method thereof, which can solve the problem that the monitoring of the cutting characteristics of the cutting head in the prior art is easy to generate errors and the cutting accuracy data is abnormal, and it is difficult to confirm the corresponding The problem with the cutter head.
  • a technical solution adopted by the present invention is to provide a method for monitoring a tool head of a liquid crystal substrate cutting device, comprising: cutting a liquid crystal substrate into a plurality of liquid crystal panels by using a plurality of cutter heads; The cutting precision data is respectively detected by different cutting edges; the cutting precision data of the liquid crystal panel cut by the same cutting head is summarized; and the cutting characteristics of the cutting head are monitored according to the average value, the maximum value and/or the minimum value of the combined cutting precision data.
  • the step of summarizing the cutting accuracy data of the liquid crystal panel cut by the same cutter head includes: summarizing the cutting precision data of the liquid crystal panel of the same liquid crystal substrate cut by the same cutter head.
  • the step of cutting the liquid crystal substrate into a plurality of liquid crystal panels by using a plurality of cutter heads comprises: respectively assigning corresponding cutter head numbers to the plurality of cutter heads; and assembling the cutting precision data of the liquid crystal panels cut by the same cutter head This includes associating the cutting accuracy data with the corresponding cutter head number and summarizing the cutting accuracy data associated with the same cutter number.
  • the step of cutting the liquid crystal substrate into a plurality of liquid crystal panels by using a plurality of cutter heads comprises: cutting the liquid crystal substrate into a plurality of liquid crystal panels by using a plurality of cutter heads through a plurality of cutting processes; and cutting the liquid crystal panels of the same cutter head
  • the step of summarizing the cutting accuracy data includes: summarizing the cutting precision data of the liquid crystal panel cut in the same cutting process of the same cutting head.
  • the step of cutting the liquid crystal substrate into a plurality of liquid crystal panels by using a plurality of cutter heads comprises: respectively assigning corresponding cutter head numbers to the plurality of cutter heads, and respectively assigning corresponding cutting numbers for the multiple cutting processes;
  • the step of summarizing the cutting accuracy data of the cut liquid crystal panel includes associating the cutting precision data with the corresponding cutter head number and the cutting number of the corresponding cutting process, and numbering the same cutter head and the same cutting number
  • the associated cutting accuracy data is summarized.
  • another technical solution adopted by the present invention is to provide a method for monitoring a cutter head of a liquid crystal substrate cutting device, comprising the steps of: cutting a liquid crystal substrate into a plurality of liquid crystal panels by using a plurality of cutter heads; detecting liquid crystal Cutting precision data of the panel; summarizing the cutting precision data of the liquid crystal panel cut by the same cutter head; monitoring the cutting characteristics of the cutter head according to the combined cutting precision data.
  • the step of monitoring the cutting characteristics of the cutter head according to the summarized cutting accuracy data comprises: monitoring the cutting characteristics of the cutter head according to the average value, the maximum value and/or the minimum value of the summarized cutting precision data.
  • the step of detecting the cutting accuracy data of the liquid crystal panel includes: respectively detecting cutting precision data for different cutting edges of the same liquid crystal panel.
  • the step of summarizing the cutting accuracy data of the liquid crystal panel cut by the same cutter head includes: summarizing the cutting precision data of the liquid crystal panel of the same liquid crystal substrate cut by the same cutter head.
  • the step of cutting the liquid crystal substrate into a plurality of liquid crystal panels by using a plurality of cutter heads comprises: respectively assigning corresponding cutter head numbers to the plurality of cutter heads; and summarizing cutting precision data of the liquid crystal panels cut by the same cutter head
  • the steps include: associating the cutting accuracy data with the cutter head number of the corresponding cutter head, and summarizing the cutting accuracy data associated with the same cutter head number.
  • the step of cutting the liquid crystal substrate into a plurality of liquid crystal panels by using the plurality of cutter heads comprises: cutting the liquid crystal substrate into a plurality of liquid crystal panels by using the plurality of cutter heads through multiple cutting processes; and cutting the liquid crystal panels on the same cutter head
  • the step of summarizing the cutting accuracy data includes: summarizing the cutting precision data of the liquid crystal panel cut in the same cutting process of the same cutting head.
  • the step of cutting the liquid crystal substrate into a plurality of liquid crystal panels by using a plurality of cutter heads comprises: respectively assigning corresponding cutter head numbers to the plurality of cutter heads, and respectively assigning corresponding cutting numbers for the multiple cutting processes;
  • the step of summarizing the cutting precision data of the liquid crystal panel cut by the cutter head includes: associating the cutting precision data with the cutter head number of the corresponding cutter head and the cutting number corresponding to the cutting process, and numbering the same cutter head and the same cutting number
  • the associated cutting accuracy data is summarized.
  • a liquid crystal substrate cutting device comprising: a plurality of cutter heads for cutting a liquid crystal substrate into a plurality of liquid crystal panels; and detecting means for detecting liquid crystal The cutting precision data of the panel; the processing device is used for summarizing the cutting precision data of the liquid crystal panel cut by the same cutter head, and monitoring the cutting characteristics of the cutter head according to the summarized cutting precision data.
  • the plurality of cutter heads are respectively assigned corresponding cutter head numbers
  • the processing device associates the cutting precision data with the cutter head number of the corresponding cutter head, and summarizes the cutting precision data associated with the same cutter head number.
  • the plurality of cutter heads cut the liquid crystal substrate into a plurality of liquid crystal panels by a plurality of cutting processes, wherein the plurality of cutter heads are respectively assigned corresponding cutter head numbers, and the plurality of cutting processes are respectively assigned corresponding cutting numbers, and the processing is respectively performed.
  • the cutter associates the cutting accuracy data with the cutter head number of the corresponding cutter head and the cut number corresponding to the cutting process, and summarizes the same cutter head number and the cutting accuracy data associated with the same cut number.
  • the invention has the beneficial effects that the invention can establish the corresponding relationship between the cutter head and the cutting precision data, and summarize the cutting precision data corresponding to the same cutter head, so that the cutting characteristics of the cutter head can be accurately monitored in real time, and When the cutting characteristics are abnormal, confirm the corresponding cutter head in time.
  • FIG. 1 is a flow chart of a method for monitoring a tool head of a liquid crystal substrate cutting device of the present invention
  • FIG. 2 is a schematic view showing the structure of a liquid crystal substrate cutting device of the present invention.
  • Fig. 1 is a flow chart showing a method of monitoring a cutter head of a liquid crystal substrate cutting device of the present invention. As shown in FIG. 1, the tool head monitoring method includes the following steps:
  • Step S101 cutting a liquid crystal substrate into a plurality of liquid crystal panels by using a plurality of cutter heads;
  • corresponding cutter head numbers are respectively assigned to the plurality of cutter heads before the cutting process.
  • corresponding cutting numbers are further respectively assigned to the plurality of cutting processes.
  • a corresponding liquid crystal substrate number and a liquid crystal panel number may be assigned to the liquid crystal substrate and the liquid crystal panel, respectively.
  • Step S102 detecting cutting precision data of the liquid crystal panel
  • step S102 after the cutting process is completed, the cutting accuracy data of the different cutting edges of the same liquid crystal panel, that is, the cutting precision data of the different cutting edges of each of the plurality of liquid crystal panels, are detected and recorded.
  • Step S103 summarizing cutting precision data of the liquid crystal panel cut by the same cutter head
  • step S103 first, the cutting accuracy data of each liquid crystal panel is summarized, and each cutting accuracy data is associated with the cutter number of the corresponding cutter head. Then, the cutting accuracy data associated with the same cutter number is summarized.
  • the cutting precision data is respectively associated with the cutter head number of the corresponding cutter head and the cutting number of the corresponding cutting process. And the cutting accuracy data associated with the same cutting head number and the same cutting number are summarized, thereby collecting the cutting precision data of the liquid crystal panel cut in the same cutting process of the same cutting head.
  • the cutting accuracy data may be associated with the liquid crystal substrate number of the corresponding liquid crystal substrate and the liquid crystal panel number of the corresponding liquid crystal panel, thereby cutting precision data of each liquid crystal panel of the same liquid crystal substrate cut by the same cutting head.
  • Step S104 Monitor the cutting characteristics of the cutter head based on the summarized cutting accuracy data.
  • the cutting characteristics of the cutter head can be monitored based on the average value, the maximum value, and/or the minimum value of the summarized cutting accuracy data.
  • the cutting characteristics of the cutter head can be monitored based on the average and maximum values of the combined cutting accuracy data, and the cutting characteristics of the cutter head can be monitored based on the average and minimum values of the combined cutting accuracy data.
  • the liquid crystal substrate cutting apparatus includes a plurality of cutter heads 210, a detecting device 220, and a processing device 230.
  • the plurality of cutter heads 210 are used to cut the liquid crystal substrate 200 into a plurality of liquid crystal panels 201.
  • the detecting device 220 is for detecting cutting accuracy data of the liquid crystal panel 201.
  • the processing device 230 is connected to the detecting device 220 for summarizing the cutting accuracy data of the liquid crystal panel 201 cut by the same cutter head 210, and monitoring the cutting characteristics of the cutter head 210 based on the summarized cutting accuracy data. Further, the processing device 230 is also coupled to the plurality of cutter heads 210 to control the cutting process of the cutter head 210 and to receive feedback data from the cutter head 210.
  • the working principle of the liquid crystal substrate cutting device is that the corresponding cutter head numbers are respectively assigned to the plurality of cutter heads 210 before the cutting process.
  • corresponding cutting numbers are respectively assigned to the respective cutting processes.
  • the detecting device 220 detects the cutting accuracy data of the different cutting edges of the respective liquid crystal panels 201.
  • the processing device 230 summarizes the cutting accuracy data, associates each cutting accuracy data with the tool bit number of the corresponding tool bit 210, and then summarizes the cutting accuracy data associated with the same tool bit number.
  • the processing device 230 cuts the respective cutting accuracy data and the bit number of the corresponding cutter head 210 and the corresponding cutting process.
  • the numbers are associated and the same cutting head number and the cutting accuracy data associated with the same cutting number are summarized.
  • the processing device 230 monitors the cutting characteristics of the cutter head 210 based on the summarized cutting accuracy data. For example, the cutting characteristics of the cutter head 210 are monitored based on the average, maximum, and/or minimum values of the summarized cutting accuracy data.
  • the cutting characteristics of the cutter head 210 may be monitored based on the average value, the maximum value, and the minimum value of the summarized cutting accuracy data.
  • the cutting characteristics of the cutter head 210 may also be monitored based on the average and maximum values of the combined cutting accuracy data, and the cutting of the cutter head 210 may be monitored based on the average and minimum values of the summarized cutting accuracy data. characteristic.
  • the present invention establishes a correspondence between the cutter head and the cutting accuracy data, and summarizes the cutting precision data corresponding to the same cutter head, thereby accurately monitoring the cutting characteristics of the cutter head in real time, and in cutting characteristics. When an abnormality occurs, confirm the corresponding cutter head in time.

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Description

液晶基板切割装置及其刀头监控方法
【技术领域】
本发明涉及液晶基板领域，具体而言涉及一种液晶基板切割装置及其刀头监控方法。
【背景技术】
液晶显示器（Liquid Crystal Display，LCD）已被广泛应用于各种电子产品中，液晶显示器中的一个重要元件是液晶面板。液晶面板是由两片透明基板（薄膜晶体管基板和彩色滤光片基板）以及被封装于基板之间的液晶所构成。在液晶面板的制程中，需要利用刀头将包含有多个液晶面板的大型液晶基板切割成多个具有适当尺寸的独立的液晶面板，在切割过程中对于切割精度的要求十分严格。
现有技术中，在液晶面板切割精度的监控过程中，分别将各液晶面板的八个切割边缘的切割精度数据汇总成八个不同的图表，以对液晶面板的各切割边缘的切割精度以及刀头的切割特性进行监控。
然而，上述监控方法存在的缺陷主要有：由于不同液晶面板的同一切割边缘由不同的刀头切割完成，导致对于刀头的切割特性的监控易产生误差；液晶面板的切割边缘的切割精度数据出现异常时，不易确认对应的刀头。
综上所述，有必要提供一种液晶基板切割装置及其刀头监控方法，以解决上述缺陷。
【发明内容】
本发明主要解决的技术问题是提供一种液晶基板切割装置及其刀头监控方法，以解决现有技术存在的刀头的切割特性的监控易产生误差以及切割精度数据出现异常时不易确认对应的刀头的问题。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种液晶基板切割装置的刀头监控方法，包括：利用多个刀头将液晶基板切割成多个液晶面板；针对同一液晶面板的不同切割边缘分别检测切割精度数据；对同一刀头所切割的液晶面板的切割精度数据进行汇总；根据汇总后的切割精度数据的平均值、最大值和/或最小值监控刀头的切割特性。
其中，对同一刀头所切割的液晶面板的切割精度数据进行汇总的步骤包括：对同一刀头所切割的同一液晶基板的液晶面板的切割精度数据进行汇总。
其中，利用多个刀头将液晶基板切割成多个液晶面板的步骤包括：为多个刀头分别分配对应的刀头编号；对同一刀头所切割的液晶面板的切割精度数据进行汇总的步骤包括：将切割精度数据与对应的刀头的刀头编号进行关联，并对同一刀头编号所关联的切割精度数据进行汇总。
其中，利用多个刀头将液晶基板切割成多个液晶面板的步骤包括：利用多个刀头通过多次切割过程将液晶基板切割成多个液晶面板；对同一刀头所切割的液晶面板的切割精度数据进行汇总的步骤包括：对同一刀头的同一切割过程中所切割的液晶面板的切割精度数据进行汇总。
其中，利用多个刀头将液晶基板切割成多个液晶面板的步骤包括：为多个刀头分别分配对应的刀头编号，并为多次切割过程分别分配对应的切割编号；对同一刀头所切割的液晶面板的切割精度数据进行汇总的步骤包括：将切割精度数据与对应的刀头的刀头编号和对应的切割过程的切割编号进行关联，并对同一刀头编号以及同一切割编号所关联的切割精度数据进行汇总。
为解决上述技术问题，本发明采用的另一个技术方案是：提供一种液晶基板切割装置的刀头监控方法，包括以下步骤：利用多个刀头将液晶基板切割成多个液晶面板；检测液晶面板的切割精度数据；对同一刀头所切割的液晶面板的切割精度数据进行汇总；根据汇总后的切割精度数据监控刀头的切割特性。
其中，根据汇总后的切割精度数据监控刀头的切割特性的步骤包括：根据汇总后的切割精度数据的平均值、最大值和/或最小值监控刀头的切割特性。
其中，检测液晶面板的切割精度数据的步骤包括：针对同一液晶面板的不同切割边缘分别检测切割精度数据。
其中，对同一刀头所切割的液晶面板的切割精度数据进行汇总的步骤包括：对同一刀头所切割的同一液晶基板的液晶面板的切割精度数据进行汇总。
其中，利用多个刀头将液晶基板切割成多个液晶面板的步骤包括：为该多个刀头分别分配对应的刀头编号；对同一刀头所切割的液晶面板的切割精度数据进行汇总的步骤包括：将切割精度数据与对应刀头的刀头编号进行关联，并对同一刀头编号所关联的切割精度数据进行汇总。
其中，利用多个刀头将液晶基板切割成多个液晶面板的步骤包括：利用该多个刀头通过多次切割过程将液晶基板切割成多个液晶面板；对同一刀头所切割的液晶面板的切割精度数据进行汇总的步骤包括：对同一刀头的同一切割过程中所切割的液晶面板的切割精度数据进行汇总。
其中，利用多个刀头将液晶基板切割成多个液晶面板的步骤包括：为该多个刀头分别分配对应的刀头编号，并为该多次切割过程分别分配对应的切割编号；对同一刀头所切割的液晶面板的切割精度数据进行汇总的步骤包括：将切割精度数据与对应刀头的刀头编号和对应切割过程的切割编号进行关联，并对同一刀头编号以及同一切割编号所关联的切割精度数据进行汇总。
为解决上述技术问题，本发明采用的另一个技术方案是：提供一种液晶基板切割装置，包括：多个刀头，用于将液晶基板切割成多个液晶面板；检测装置，用于检测液晶面板的切割精度数据；处理装置，用于对同一刀头所切割的液晶面板的切割精度数据进行汇总，并根据汇总后的切割精度数据监控刀头的切割特性。
其中，该多个刀头分别分配有对应的刀头编号，处理装置将切割精度数据与对应刀头的刀头编号进行关联，并对同一刀头编号所关联的切割精度数据进行汇总。
其中，该多个刀头通过多次切割过程将液晶基板切割成多个液晶面板，该多个刀头分别分配有对应的刀头编号，该多次切割过程分别分配有对应的切割编号，处理器将切割精度数据与对应刀头的刀头编号和对应切割过程的切割编号进行关联，并对同一刀头编号以及同一切割编号所关联的切割精度数据进行汇总。
本发明的有益效果是：本发明通过将刀头与切割精度数据之间建立对应关系，并对同一刀头所对应的切割精度数据进行汇总，能够实时精确地监控刀头的切割特性，并在切割特性出现异常时，及时确认对应的刀头。
【附图说明】
图1是本发明液晶基板切割装置的刀头监控方法的流程图；
图2是本发明液晶基板切割装置的结构示意图。
【具体实施方式】
下面结合附图和实施例对本发明进行详细说明。
图1是本发明液晶基板切割装置的刀头监控方法的流程图。如图1所示，该刀头监控方法包括以下步骤：
步骤S101：利用多个刀头将液晶基板切割成多个液晶面板；
在步骤S101中，在切割制程之前，为该多个刀头分别分配对应的刀头编号。优选地，在需要利用上述刀头通过多次切割过程将液晶基板切割成多个液晶面板时，进一步为该多次切割过程分别分配对应的切割编号。进一步优选地，可以为液晶基板和液晶面板分别分配对应的液晶基板编号和液晶面板编号。
步骤S102：检测液晶面板的切割精度数据；
在步骤S102中，在切割制程完成后，检测并记录同一液晶面板的不同切割边缘的切割精度数据，即多个液晶面板中每一个液晶面板的不同切割边缘的切割精度数据。
步骤S103：对同一刀头所切割的液晶面板的切割精度数据进行汇总；
在步骤S103中，首先，对各液晶面板的切割精度数据进行汇总，并将各切割精度数据分别与对应刀头的刀头编号进行关联。然后，对同一刀头编号所关联的切割精度数据进行汇总。优选地，在需要利用上述多个刀头通过多次切割过程将液晶基板切割成多个液晶面板时，将各切割精度数据分别与对应刀头的刀头编号和对应切割过程的切割编号进行关联，并对同一刀头编号以及同一切割编号所关联的切割精度数据进行汇总，由此对同一刀头的同一切割过程中所切割的液晶面板的切割精度数据进行汇总。进一步优选地，还可以将各切割精度数据与对应液晶基板的液晶基板编号以及对应液晶面板的液晶面板编号进行关联，由此对同一刀头所切割的同一液晶基板的各液晶面板的切割精度数据进行汇总。
步骤S104：根据汇总后的切割精度数据监控刀头的切割特性。
在步骤S104中，可根据汇总后的切割精度数据的平均值、最大值和/或最小值监控刀头的切割特性。例如，可以根据汇总后的切割精度数据的平均值和最大值监控刀头的切割特性，还可以根据汇总后的切割精度数据的平均值和最小值监控刀头的切割特性。当上述汇总结果中的一个或一个以上大于预设阈值时，则认为刀头的切割特性已无法满足切割精度需求，需要对对应的刀头进行调整或更换。
图2是本发明液晶基板切割装置的结构示意图。如图2所示，液晶基板切割装置包括：多个刀头210、检测装置220以及处理装置230。
其中，该多个刀头210用于将液晶基板200切割成多个液晶面板201。检测装置220用于检测液晶面板201的切割精度数据。处理装置230与检测装置220连接，用于对同一刀头210所切割的液晶面板201的切割精度数据进行汇总，并根据汇总后的切割精度数据监控刀头210的切割特性。进一步，处理装置230还与该多个刀头210连接，以控制刀头210的切割过程以及接收刀头210的反馈数据。
本发明实施例的液晶基板切割装置的工作原理为：在切割制程前，为该多个刀头210分别分配对应的刀头编号。优选地，当需要利用该多个刀头210通过多次切割过程将液晶基板200切割成多个液晶面板201时，为各切割过程分别分配对应的切割编号。在切割制程完成后，检测装置220检测各液晶面板201的不同切割边缘的切割精度数据。处理装置230对切割精度数据进行汇总，并将各切割精度数据与对应刀头210的刀头编号进行关联，然后对同一刀头编号所关联的切割精度数据进行汇总。当需要利用该多个刀头210通过多次切割过程将液晶基板200切割成多个液晶面板201时，处理装置230将各切割精度数据与对应刀头210的刀头编号以及对应切割过程的切割编号进行关联，并对同一刀头编号以及同一切割编号所关联的切割精度数据进行汇总。
最后，处理装置230根据汇总后的切割精度数据监控刀头210的切割特性。例如，根据汇总后的切割精度数据的平均值、最大值和/或最小值监控刀头210的切割特性。
在本实施例中，优选根据汇总后的切割精度数据的平均值、最大值和最小值监控刀头210的切割特性。在其它实施例中，也可以根据汇总后的切割精度数据的平均值和最大值监控刀头210的切割特性，还可以根据汇总后的切割精度数据的平均值和最小值监控刀头210的切割特性。当上述汇总结果中的一个或一个以上大于预设阈值时，则认为刀头210的切割特性已无法满足切割精度需求，需要对对应的刀头210进行调整或更换。
综上所述，本发明通过将刀头与切割精度数据之间建立对应关系，并对同一刀头所对应的切割精度数据进行汇总，能够实时精确地监控刀头的切割特性，并在切割特性出现异常时，及时确认对应的刀头。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (15)

  1. 一种液晶基板切割装置的刀头监控方法，其中，包括：
    利用多个刀头将液晶基板切割成多个液晶面板；
    针对同一所述液晶面板的不同切割边缘分别检测所述切割精度数据；
    对同一所述刀头所切割的所述液晶面板的所述切割精度数据进行汇总；
    根据汇总后的所述切割精度数据的平均值、最大值和/或最小值监控所述刀头的所述切割特性。
  2. 根据权利要求1所述的刀头监控方法，其中，所述对同一所述刀头所切割的所述液晶面板的所述切割精度数据进行汇总的步骤包括：对同一所述刀头所切割的同一所述液晶基板的所述液晶面板的所述切割精度数据进行汇总。
  3. 根据权利要求1所述的刀头监控方法，其中，所述利用多个刀头将液晶基板切割成多个液晶面板的步骤包括：为所述多个刀头分别分配对应的刀头编号；所述对同一所述刀头所切割的所述液晶面板的所述切割精度数据进行汇总的步骤包括：将所述切割精度数据与对应的所述刀头的所述刀头编号进行关联，并对同一所述刀头编号所关联的所述切割精度数据进行汇总。
  4. 根据权利要求1所述的刀头监控方法，其中，所述利用多个刀头将液晶基板切割成多个液晶面板的步骤包括：利用所述多个刀头通过多次切割过程将所述液晶基板切割成多个所述液晶面板；对同一所述刀头所切割的所述液晶面板的所述切割精度数据进行汇总的步骤包括：对同一所述刀头的同一切割过程中所切割的所述液晶面板的所述切割精度数据进行汇总。
  5. 根据权利要求4所述的刀头监控方法，其中，所述利用多个刀头将液晶基板切割成多个液晶面板的步骤包括：为所述多个刀头分别分配对应的刀头编号，并为所述多次切割过程分别分配对应的切割编号；所述对同一所述刀头所切割的所述液晶面板的所述切割精度数据进行汇总的步骤包括：将所述切割精度数据与对应的所述刀头的所述刀头编号和对应的所述切割过程的所述切割编号进行关联，并对同一所述刀头编号以及同一所述切割编号所关联的切割精度数据进行汇总。
  6. 一种液晶基板切割装置的刀头监控方法，其中，包括：
    利用多个刀头将液晶基板切割成多个液晶面板；
    检测所述液晶面板的切割精度数据；
    对同一所述刀头所切割的所述液晶面板的所述切割精度数据进行汇总；
    根据汇总后的所述切割精度数据监控所述刀头的切割特性。
  7. 根据权利要求6所述的刀头监控方法，其中，所述根据汇总后的所述切割精度数据监控所述刀头的切割特性的步骤包括：根据汇总后的所述切割精度数据的平均值、最大值和/或最小值监控所述刀头的所述切割特性。
  8. 根据权利要求6所述的刀头监控方法，其中，所述检测所述液晶面板的切割精度数据的步骤包括：针对同一所述液晶面板的不同切割边缘分别检测所述切割精度数据。
  9. 根据权利要求6所述的刀头监控方法，其中，所述对同一所述刀头所切割的所述液晶面板的所述切割精度数据进行汇总的步骤包括：对同一所述刀头所切割的同一所述液晶基板的所述液晶面板的所述切割精度数据进行汇总。
  10. 根据权利要求6所述的刀头监控方法，其中，所述利用多个刀头将液晶基板切割成多个液晶面板的步骤包括：为所述多个刀头分别分配对应的刀头编号；所述对同一所述刀头所切割的所述液晶面板的所述切割精度数据进行汇总的步骤包括：将所述切割精度数据与对应的所述刀头的所述刀头编号进行关联，并对同一所述刀头编号所关联的所述切割精度数据进行汇总。
  11. 根据权利要求6所述的刀头监控方法，其中，所述利用多个刀头将液晶基板切割成多个液晶面板的步骤包括：利用所述多个刀头通过多次切割过程将所述液晶基板切割成多个所述液晶面板；对同一所述刀头所切割的所述液晶面板的所述切割精度数据进行汇总的步骤包括：对同一所述刀头的同一切割过程中所切割的所述液晶面板的所述切割精度数据进行汇总。
  12. 根据权利要求11所述的刀头监控方法，其中，所述利用多个刀头将液晶基板切割成多个液晶面板的步骤包括：为所述多个刀头分别分配对应的刀头编号，并为所述多次切割过程分别分配对应的切割编号；所述对同一所述刀头所切割的所述液晶面板的所述切割精度数据进行汇总的步骤包括：将所述切割精度数据与对应的所述刀头的所述刀头编号和对应的所述切割过程的所述切割编号进行关联，并对同一所述刀头编号以及同一所述切割编号所关联的切割精度数据进行汇总。
  13. 一种液晶基板切割装置，其中，包括：
    多个刀头，用于将液晶基板切割成多个液晶面板；
    检测装置，用于检测所述液晶面板的切割精度数据；
    处理装置，用于对同一所述刀头所切割的所述液晶面板的所述切割精度数据进行汇总，并根据汇总后的所述切割精度数据监控所述刀头的切割特性。
  14. 根据权利要求13所述的液晶基板切割装置，其中，所述多个刀头分别分配有对应的刀头编号，所述处理装置将所述切割精度数据与对应的所述刀头的所述刀头编号进行关联，并对同一所述刀头编号所关联的切割精度数据进行汇总。
  15. 根据权利要求13所述的液晶基板切割装置，其中，所述多个刀头通过多次切割过程将所述液晶基板切割成多个所述液晶面板，所述多个刀头分别分配有对应的刀头编号，所述多次切割过程分别分配有对应的切割编号，所述处理器将所述切割精度数据与对应的所述刀头的所述刀头编号和对应的所述切割过程的所述切割编号进行关联，并对同一所述刀头编号以及同一所述切割编号所关联的所述切割精度数据进行汇总。
PCT/CN2012/079162 2012-07-11 2012-07-26 液晶基板切割装置及其刀头监控方法 Ceased WO2014008683A1 (zh)

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